MOCVD (Metal Organic Chemical Vapor Deposition) automatic loading and unloading method and equipment

Abstract

The invention provides an MOCVD (Metal Organic Chemical Vapor Deposition) automatic wafer loading and unloading method and equipment, and the MOCVD automatic wafer loading and unloading equipment comprises a glove box, a vacuum transfer box, and a clamping plug storage mechanism, a wafer positioning mechanism, a graphite disc positioning mechanism, a graphite disc transmission mechanism and a carrying mechanism which are arranged in the glove box, the MOCVD automatic wafer loading and unloading method comprises the steps of graphite disc loading, plug loading, wafer positioning, wafer loading, wafer unloading and the like, a third U-shaped fork formed by sleeving a first U-shaped fork with a tooth fork sleeve is used for carrying a graphite disc, and graphite disc loading is achieved; a clamping jaw mechanism formed by the first U-shaped fork and the second U-shaped fork is used for carrying the clamping plugs, and clamping plug feeding is achieved. The tray mechanism formed by the first U-shaped fork and the second U-shaped fork which are flush with each other and the Bernoulli suction cup are used for carrying wafers, wafer positioning and wafer feeding are achieved, and wafer discharging is completed through reverse operation. According to the invention, automatic pick-and-place, positioning and transfer of materials such as wafers, graphite plates and clamping plugs are realized, the production efficiency and the product yield are improved, and the cost is reduced.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor automation technology, and specifically relates to an automatic loading and unloading method and equipment for MOCVD. Background Technology

[0002] In the semiconductor manufacturing field, metal-organic chemical vapor deposition (MOCVD) equipment is the core equipment in the epitaxial wafer growth process, and its operational efficiency and stability directly affect product yield and production costs. Currently, MOCVD machine operations mainly rely on manual labor for tasks such as loading and unloading wafers, changing graphite disks, and handling wafers. These operations are complex, involve numerous steps, and require a high level of skill from the operators. During manual wafer handling, improper operation can easily lead to chip fragmentation or contamination, thus affecting product quality. Consequently, the stability and consistency of the MOCVD production process are significantly constrained by human factors.

[0003] To address the aforementioned issues, existing technologies include adding automated wafer loading and unloading equipment to the outside of the MOCVD machine. The aim is to replace traditional manual labor with automated equipment, thereby improving operational efficiency, ensuring product yield, and reducing labor costs. However, existing MOCVD machines cannot achieve full automation; operators still need to reach into the glove box to perform operations. For example, patent CN116145113B discloses an MOCVD wafer integration loading and unloading device. The step of placing the cassette into the storage unit requires manual operation, which affects processing efficiency. Furthermore, the loading unit used in this patent for handling various materials employs a multi-degree-of-freedom robotic arm. The large size and complex movement trajectory of the robotic arm require greater clearance, increasing the overall size of the equipment and the risk of motion interference. Therefore, how to achieve automated wafer loading and unloading while reducing system complexity and improving equipment reliability and compatibility has become a pressing technical problem to be solved. Summary of the Invention

[0004] The purpose of this invention is to provide an automated MOCVD wafer loading and unloading method and equipment, which integrates multiple automated functional modules to realize the automatic picking, placement, positioning and transfer of materials such as wafers, graphite disks and cassettes, thereby improving production efficiency and product yield, and reducing overall costs.

[0005] To achieve the above objectives, the solution of the present invention is as follows: to provide an automatic MOCVD wafer loading and unloading method, which uses an automatic MOCVD wafer loading and unloading device for wafer loading and unloading. The automatic MOCVD wafer loading and unloading device includes a glove box and a vacuum transfer box, as well as a chuck storage mechanism, a wafer positioning mechanism, a graphite disk positioning mechanism, a graphite disk transfer mechanism and a handling mechanism disposed inside the glove box. The glove box is connected to the MOCVD equipment, the vacuum transfer box is connected to the glove box, and the vacuum transfer box is equipped with a transfer mechanism for transporting cartridges and graphite disks. The cartridge storage mechanism is used to store multiple cartridges. The handling mechanism includes a three-axis robotic arm and a first U-shaped fork, a second U-shaped fork, and a Bernoulli suction cup mounted on the three-axis robotic arm. The first U-shaped fork is raised and lowered above the second U-shaped fork, and when the first U-shaped fork is lowered to be horizontal with the second U-shaped fork, the first U-shaped fork is located between the two arms of the second U-shaped fork. The Bernoulli suction cup is used to adsorb the wafer. A toothed fork sleeve is provided below the three-axis robotic arm. The toothed fork sleeve is larger than the second U-shaped fork and can be detachably fitted onto the second U-shaped fork. The MOCVD automatic loading and unloading method includes the following steps: S1. Graphite disk loading: The transfer mechanism conveys the graphite disk into the glove box. The three-axis robotic arm drives the second U-shaped fork to put on the toothed fork sleeve to form the third U-shaped fork. The first U-shaped fork descends to press the toothed fork sleeve. Then, the three-axis robotic arm drives the third U-shaped fork to transport the graphite disk on the transfer mechanism to the graphite disk positioning mechanism. The graphite disk positioning mechanism rotates and positions the graphite disk. Then, the first U-shaped fork rises and resets. The three-axis robotic arm drives the second U-shaped fork to remove the toothed fork sleeve. S2, Plug feeding: The transfer mechanism conveys the plug into the glove box. The three-axis robotic arm drives the first U-shaped fork and the second U-shaped fork to insert into the upper and lower parts of the top wall of the plug respectively. Then the first U-shaped fork descends and cooperates with the second U-shaped fork to clamp the plug. Then the plug is transported to the plug storage mechanism. S3. Wafer positioning: The first U-shaped fork descends to form a tray mechanism between the two arms of the second U-shaped fork. The three-axis robotic arm drives the tray mechanism to insert into the slot at the slot storage mechanism to support and transport the wafer to the wafer positioning mechanism. The wafer positioning mechanism rotates and positions the wafer. S4. Wafer loading: The three-axis robotic arm drives the Bernoulli chuck to move the wafer on the wafer positioning mechanism to the graphite disk of the graphite disk positioning mechanism, and then the graphite disk transfer mechanism transfers the graphite disk to the MOCVD equipment. S5. Wafer loading: After the wafer deposition and growth are completed, the graphite disk transfer mechanism will transfer the graphite disk to the graphite disk positioning mechanism. The three-axis robotic arm will drive the Bernoulli chuck to transport the wafers on the graphite disk to the wafer positioning mechanism in sequence. Then, the first U-shaped fork and the second U-shaped fork will be driven to transport the wafers to the cassettes of the cassette storage mechanism. The cassettes will then be transported to the transfer mechanism, which will then transfer the cassettes to the vacuum transfer box.

[0006] Furthermore, the transfer mechanism includes a slide rail and a transfer platform. The slide rail is disposed inside the vacuum transfer box, and the transfer platform is used to load a plug or graphite disk. The transfer platform is slidably disposed on the slide rail. The three-axis robotic arm is also provided with a claw mechanism for pushing and pulling the transfer platform. In steps S1, S2 and S5, the three-axis robotic arm drives the claw mechanism to engage the side of the transfer platform, and then pushes and pulls the transfer platform to slide between the glove box and the vacuum transfer box.

[0007] Furthermore, the left side of the vacuum transfer box is connected to the glove box, and the left side of the vacuum transfer box and any other side are respectively provided with a second automatic door and a third automatic door; in steps S1 and S2, the third automatic door opens automatically first, and a material handling robot puts the graphite disk or plug into the vacuum transfer box, then the third automatic door closes, then the second automatic door opens, and the three-axis robotic arm drives the gripper to move the transfer platform into the glove box, and finally the second automatic door closes; in step S5, the operation of removing the plug from the vacuum transfer box is the reverse of steps S1 and S2.

[0008] Furthermore, the transfer platform is equipped with a fixture box for loading plugs and graphite disks. The top of the fixture box is equipped with a fixture cover plate, and the top of the fixture cover plate is equipped with an opening handle. The glove box is also equipped with a fixture opening mechanism, which includes a first lifting robotic arm and an opening gripper mounted on the first lifting robotic arm. In steps S1 and S2, after the transfer platform transfers the fixture box into the glove box, the first lifting robotic arm drives the opening gripper to descend. The opening gripper clamps the opening handle and then rises to open the fixture box. After the subsequent handling components remove the plugs or graphite disks from the fixture box, the opening gripper drives the fixture cover plate to descend and reset. The transfer platform then transfers the fixture box back to the vacuum transfer box.

[0009] Furthermore, the graphite disk transfer mechanism includes a dual-axis robotic arm and a fourth U-shaped fork. The fourth U-shaped fork is mounted on the dual-axis robotic arm. In steps S4 and S5, the dual-axis robotic arm drives the fourth U-shaped fork to grasp and transfer the graphite disk between the graphite disk positioning mechanism and the MOCVD equipment.

[0010] Furthermore, the cassette is also used to stack multiple wafers, the wafer positioning mechanism is also used to rotate and position the wafers, and the tray mechanism formed by the first U-shaped fork and the second U-shaped fork is also used to support and transport the wafers. The method of transporting the wafers to the wafer positioning mechanism is the same as that of the wafers. The three-axis robotic arm is also equipped with a vacuum chuck for adsorbing the wafers. The three-axis robotic arm drives the vacuum chuck to transport the wafers on the wafer positioning mechanism to the graphite disk. In step S4, after all the wafers are loaded onto the graphite disk, if there is still space on the graphite disk, the wafers are loaded onto the graphite disk. Then, in step S5, the wafers are unloaded first, and then the wafers are unloaded. Except for the three-axis robotic arm driving the vacuum chuck to realize the transport of the wafers between the wafer positioning mechanism and the graphite disk, the other loading and unloading steps of the wafers are the same as those of the wafers.

[0011] Furthermore, the three-axis robotic arm is also equipped with a vision component and a dust removal component. In step S4, before moving the wafers from the wafer positioning mechanism to the graphite disk on the graphite disk positioning mechanism, the vision component is used to detect whether the wafers and the graphite disk have rotated into position. In step S5, after all the wafers on the graphite disk are removed, the three-axis robotic arm drives the dust removal component to move above the graphite disk to remove dust from the graphite disk.

[0012] This application also provides an automatic MOCVD wafer loading and unloading device, including a glove box and a vacuum transfer box, as well as a chuck storage mechanism, a wafer positioning mechanism, a graphite disk positioning mechanism, a graphite disk transfer mechanism and a handling mechanism disposed inside the glove box; The glove box is connected to the MOCVD equipment, and the vacuum transfer box is connected to the glove box. The vacuum transfer box is equipped with a transfer mechanism for transporting the cartridges and graphite disks, so as to realize the transfer of the cartridges and graphite disks between the glove box and the vacuum transfer box. The cartridge storage mechanism is used to store multiple cartridges, and multiple wafers are stacked inside the cartridges; The wafer positioning mechanism and the graphite disk positioning mechanism are used to rotate and position the wafer and the graphite disk, respectively. The handling mechanism includes a three-axis robotic arm and a first U-shaped fork, a second U-shaped fork, and a Bernoulli suction cup mounted on the three-axis robotic arm. The first U-shaped fork is elliptical and positioned above the second U-shaped fork. When the first U-shaped fork descends to near the second U-shaped fork, the first U-shaped fork and the second U-shaped fork form a gripper mechanism to clamp the top wall of the plug, enabling the transfer of the plug between the transfer mechanism and the plug storage mechanism. When the first U-shaped fork descends to be horizontal with the second U-shaped fork, the first U-shaped fork forms a tray mechanism between the two arms of the second U-shaped fork, used to support and transport the wafer, enabling the transfer of the wafer between the plug storage mechanism and the wafer positioning mechanism. The Bernoulli suction cup is used to adsorb the wafer, enabling the transfer of the wafer between the wafer positioning mechanism and the graphite disk positioning mechanism. The glove box is also equipped with a toothed fork sleeve. The toothed fork sleeve is larger than the second U-shaped fork and can be detachably fitted onto the second U-shaped fork. The three-axis robotic arm drives the second U-shaped fork to be fitted with the toothed fork sleeve for transporting the graphite disk, thereby realizing the transfer of the graphite disk between the transfer mechanism and the graphite disk positioning mechanism. After the toothed fork sleeve is fitted onto the second U-shaped fork, the first U-shaped fork descends to press the toothed fork sleeve. The graphite disk transfer mechanism is used to move the graphite disk and realize the transfer of the graphite disk between the graphite disk positioning mechanism and the MOCVD equipment.

[0013] Furthermore, the three-axis robotic arm includes an X-axis robotic arm, a first Y-axis robotic arm, a second Y-axis robotic arm, and a first Z-axis robotic arm. The first Y-axis robotic arm and the second Y-axis robotic arm are located on the left and right sides of the glove box's inner bottom plate, respectively. The two ends of the X-axis robotic arm are slidably mounted on the first Y-axis robotic arm and the second Y-axis robotic arm, respectively. The first Z-axis robotic arm is slidably mounted on the X-axis robotic arm. The first U-shaped fork, the second U-shaped fork, and the Bernoulli suction cup are mounted on the first Z-axis robotic arm. The wafer positioning mechanism and the graphite disk positioning mechanism are located between the first Y-axis robotic arm and the second Y-axis robotic arm. The graphite disk transfer mechanism is located below the second Y-axis robotic arm. The cartridge storage mechanism is located on the rear side of the glove box's inner bottom plate. A first automatic door is provided at the connection between the glove box and the MOCVD equipment. The first automatic door is located below the cartridge storage mechanism. The vacuum transfer box is located on the right side of the glove box.

[0014] Furthermore, the cassette is also used to stack multiple wafers, and the wafer positioning mechanism is also used to rotate and position the wafers. The tray mechanism formed by the first U-shaped fork and the second U-shaped fork is also used to support and transport the wafers, realizing the transfer of the wafers between the cassette storage mechanism and the wafer positioning mechanism. The three-axis robotic arm is also equipped with a vacuum suction cup, a vision component, and a dust removal component. The vacuum suction cup is used to transport the wafers, realizing the transfer of the wafers between the wafer positioning mechanism and the graphite disk positioning mechanism. The vision component is used to detect and position the wafers, wafers, and graphite disks, and the dust removal component is used to remove dust from the graphite disks.

[0015] Furthermore, the first U-shaped fork and the second U-shaped fork are located on the rear side of the Z-axis robotic arm, the Bernoulli suction cup is located below the second U-shaped fork, the vacuum suction cup is located on the right side of the second U-shaped fork, the vision component is located on the left side of the second U-shaped fork, and the dust removal component is located on the right side of the Z-axis robotic arm.

[0016] Furthermore, the fork sleeve includes two support arms and a connecting part connecting one end of the two support arms. A pressure groove is provided in the middle of the connecting part, and the first U-shaped fork descends into the pressure groove to press the fork sleeve.

[0017] Furthermore, the wafer positioning mechanism and the graphite disk positioning mechanism have the same structure, both including a second lifting robotic arm, a rotating platform, and positioning grippers. The rotating platform and positioning grippers are both mounted on the second lifting robotic arm. The positioning grippers include a first gripper and a second gripper. The first gripper and the second gripper are open and closed on the outer periphery of the rotating platform, and each of the first gripper and the second gripper is provided with two positioning posts. After the rotating platform drives the graphite disk or wafer to rotate into position, the first gripper and the second gripper merge so that the four positioning posts hold the wafer and the graphite disk in place.

[0018] After adopting the above solution, the beneficial effects of the present invention are as follows: 1. This application integrates multiple automated functional modules to complete the automatic picking, placement, positioning and transfer of materials such as wafers, graphite disks and cassettes. In particular, the handling mechanism integrates the handling functions of wafers, graphite disks and cassettes, realizing the automation of all loading and unloading material processes without human intervention, which greatly improves efficiency and product yield, and reduces labor costs.

[0019] 2. This application uses the cooperation of the first U-shaped fork and the second U-shaped fork to realize the handling of the jammer and the wafer. Then, according to the structure of the tooth fork sleeve being detachably fitted onto the second U-shaped fork, the graphite disk is handled. There is no need to set up another U-shaped fork to increase the space occupied by the handling mechanism, and there is no need to set up a separate drive mechanism to drive it, which improves the integration and reliability of the handling mechanism.

[0020] 3. This application uses a three-axis robotic arm to drive the first U-shaped fork and the second U-shaped fork to realize the handling of various materials. The three-axis robotic arm has high precision, good stability, convenient function integration, high space utilization, controllable cost, and simple control, which can reduce system complexity and improve the reliability and compatibility of the equipment. Attached Figure Description

[0021] Figure 1 This is a perspective view of the overall structure of the present invention; Figure 2 This is a top view of the internal structure of the glove box of the present invention; Figure 3 The three-dimensional representation of the internal structure of the glove box of the present invention Figure 1 ; Figure 4 The three-dimensional representation of the internal structure of the glove box of the present invention Figure 2 ; Figure 5 For the present invention Figure 4 Enlarged view of section A in the image; Figure 6 The three-dimensional representation of the internal structure of the glove box of the present invention Figure 3 ; Figure 7 This is a perspective view of the conveying mechanism of the present invention; Figure 8 The three-dimensional representation of the first Z-axis robotic arm of the present invention Figure 1 ; Figure 9 The three-dimensional representation of the first Z-axis robotic arm of the present invention Figure 2 ; Figure 10 The three-dimensional representation of the first Z-axis robotic arm of the present invention Figure 3 ; Figure 11 This is a perspective view of the fixture opening mechanism of the present invention; Figure 12 This is a perspective view of the graphite disk transmission mechanism of the present invention; Figure 13 This is a perspective view of the graphite disk positioning mechanism of the present invention; Figure 14 This is a perspective view of the wafer positioning mechanism of the present invention; Figure 15 This is a perspective view of the cartridge storage mechanism of the present invention; Figure 16 This is a flowchart of the method of the present invention.

[0022] Label Explanation: 1. Glove box; 11. Glove operating port; 12. First automatic door; 2. Vacuum transfer box; 21. Transfer mechanism; 211. Slide rail; 212. Transfer platform; 22. Second automatic door; 23. Third automatic door; 24. Fixture box; 25. Fixture cover; 251. Opening handle; 3. Plug storage mechanism; 31. Plug; 4. Wafer positioning mechanism; 41. Second lifting robotic arm; 42. Rotating platform; 43. Positioning gripper; 431. First gripper; 432. Second gripper; 433. Positioning column; 5. Graphite disk positioning mechanism; 6. Graphite disk transfer mechanism; 61. Dual-axis robotic arm ; 611, Third Y-axis robotic arm; 612, Second Z-axis robotic arm; 62, Fourth U-shaped fork; 7, Handling mechanism; 71, Three-axis robotic arm; 711, X-axis robotic arm; 712, First Y-axis robotic arm; 713, Second Y-axis robotic arm; 714, First Z-axis robotic arm; 72, First U-shaped fork; 73, Second U-shaped fork; 74, Tooth fork sleeve; 741, Connecting part; 742, Pressure groove; 75, Bernoulli suction cup; 76, Vacuum suction cup; 77, Vision component; 78, Dust removal component; 79, Claw mechanism; 8, Cover opening mechanism; 81, First lifting robotic arm; 82, Cover opening gripper. Detailed Implementation

[0023] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application. Figure 2 and Figure 3 As shown, the X-axis, Y-axis, and Z-axis directions described in this application are the left-right direction, the front-back direction, and the up-down direction, respectively.

[0024] like Figures 1-15 As shown, this application provides an automatic MOCVD wafer loading and unloading device, including a glove box 1 and a vacuum transfer box 2, as well as a chuck storage mechanism 3, a wafer positioning mechanism 4, a graphite disk positioning mechanism 5, a graphite disk transfer mechanism 6 and a handling mechanism 7 disposed inside the glove box 1.

[0025] Key references Figure 1 The glove box 1 is connected to the MOCVD equipment (not shown in the figure). In the prior art, the outer wall of the glove box 1 is provided with a glove operation port 11, which is equipped with a glove that extends into the glove box 1, allowing the operator to reach into the glove to perform various material handling operations within the glove box 1. Finally, the unprocessed substrate wafer is loaded onto the graphite disk and then placed into the reaction chamber inside the MOCVD equipment for deposition and growth to form a chip wafer. Then, the chip wafer is unloaded from the graphite disk, completing the wafer loading and unloading operation. Therefore, the existing MOCVD automatic wafer loading and unloading machine cannot automate all material handling operations within the glove box 1 and requires manual intervention. In response, the MOCVD automatic wafer loading and unloading machine provided in this application achieves fully automated material handling operations within the glove box 1.

[0026] Key references Figure 3 and Figure 15 The cartridge storage mechanism 3 is a shelf structure on which multiple cartridges 31 can be arranged. The cartridge 31 is a cabinet structure with a top wall, and its interior is used to stack multiple wafers. According to process requirements, the interior of the cartridge 31 can also be used to stack multiple auxiliary wafers. Since multiple circular slots for placing wafers are set on the graphite disk, if the number of wafers is not enough to fill all the circular slots, auxiliary wafers need to be added to fill them. The auxiliary wafers are made of the same material and have the same size as the wafers.

[0027] Key references Figures 2-5The vacuum transfer box 2 is connected to the glove box 1. The vacuum transfer box 2 is equipped with a transfer mechanism 21 for transporting materials such as the plug 31 and the graphite disk, so as to realize the transfer of the plug 31 and the graphite disk between the glove box 1 and the vacuum transfer box 2. Specifically, the vacuum transfer box 2 is located on the right side of the glove box 1 and is connected to the glove box 1, that is, the left side of the vacuum transfer box 2 is connected to the glove box 1. The left side of the vacuum transfer box 2 is provided with a second automatic door 22. When the second automatic door 22 is opened, the glove box 1 and the vacuum transfer box 2 are connected, and the transfer mechanism 21 can transfer the stopper 31 and the graphite disk into the glove box 1. The second automatic door 22 is preferably set as a lifting door, and the lifting and lowering switch of the second automatic door 22 can be controlled by a cylinder or an electric lifting mechanism. In addition to the left side, the vacuum transfer box 2 is also provided with a third automatic door 23 with the same structure as the second automatic door 22 on any other side. The third automatic door 23 is preferably set on the front side. After the third automatic door 23 is opened, a material handling robot places the material on the transfer mechanism 21 in the vacuum transfer box 2, or takes the material on the transfer mechanism 21 out of the vacuum transfer box 2.

[0028] Key references Figures 4-5 The transfer mechanism 21 includes a slide rail 211 and a transfer platform 212. The slide rail 211 is disposed inside the vacuum transfer box 2. The transfer platform 212 is slidably disposed on the slide rail 211 and can move between the glove box 1 and the vacuum transfer box 2. The transfer platform 212 is used to load materials such as the stopper 31 and the graphite disk to realize the transfer of materials between the vacuum transfer box 2 and the glove box 1.

[0029] In a preferred embodiment, to ensure the cleanliness of the materials, a jig box 24 is placed on the transfer platform 212 to load the materials. The jig box 24 has a jig cover 25 on its top, and a cover-opening handle 251 on the top of the cover 25. The glove box 1 also has a jig opening mechanism 8, which can be located on the rear side of the glove box 1, on the stopper storage mechanism 3, and between the stopper 31 and the vacuum transfer box 2. Figure 11 As shown, the opening mechanism 8 includes a first lifting mechanical arm 81 and an opening gripper 82 mounted on the first lifting mechanical arm 81. The opening gripper 82 is used to hold the opening handle 251. When the transfer platform 212 transfers the fixture box 24 into the glove box 1, the first lifting mechanical arm 81 is located behind the transfer platform 212, and the opening gripper 82 is located above the fixture cover plate 25. The first lifting mechanical arm 81 drives the opening gripper 82 to descend. After the opening gripper 82 clamps the opening handle 251, it rises to open the fixture box 24. Then, the conveying mechanism 7 can unload the material inside the fixture box 24 to realize the subsequent loading action. The closing operation after unloading is the opposite of the opening operation.

[0030] Key references Figures 6-10The conveying mechanism 7 includes a three-axis robotic arm 71 and a first U-shaped fork 72 and a second U-shaped fork 73 mounted on the three-axis robotic arm 71. The first U-shaped fork 72 is raised and lowered above the second U-shaped fork 73. The second U-shaped fork 72 is fixedly mounted on the three-axis robotic arm 71. The second U-shaped fork 73 is larger than the first U-shaped fork 72, specifically, the length of the second U-shaped fork 73 is greater than the length of the first U-shaped fork 72, and the distance between the two arms of the second U-shaped fork 73 is greater than the width of the first U-shaped fork 72. The first U-shaped fork 72 can be lowered between the two arms of the second U-shaped fork 73. When the first U-shaped fork 72 descends close to the second U-shaped fork 73, the first U-shaped fork 72 and the second U-shaped fork 73 form a gripper mechanism, which can be used to clamp the top wall of the plug 31. That is, the three-axis robotic arm 71 drives the first U-shaped fork 72 and the second U-shaped fork 73 to be inserted above and below the top wall of the plug 31, respectively. Then, the first U-shaped fork 72 descends to cooperate with the second U-shaped fork 73 to clamp the plug 31, and vice versa, it can release the plug 31, so that the plug 31 can be transferred between the transfer platform 212 and the plug storage machine. In addition to the transfer between the components 3, the first U-shaped fork 72 can also be lowered to the level of the second U-shaped fork 73. At this time, the first U-shaped fork 72 is located between the two arms of the second U-shaped fork 73 to form a tray mechanism, which can be inserted between adjacent wafers or wafers inside the cassette 31 to support the wafers and wafers, realizing the transfer of wafers and wafers between the cassette storage mechanism 3 and the wafer positioning mechanism 4. The upper surface of the second U-shaped fork 73 is provided with a suction cup for adsorbing wafers and wafers, which can prevent wafers and wafers from falling off.

[0031] Furthermore, since the graphite disk is larger than the wafer, the graphite disk cannot be moved using the second U-shaped fork 73. This application provides a toothed fork sleeve 74, which is larger than the second U-shaped fork 73, to move the graphite disk. The toothed fork sleeve 74 is U-shaped, and its length, width, and height are all greater than the second U-shaped fork 73. The toothed fork sleeve 74 can be detachably fitted onto the second U-shaped fork 73. When the graphite disk is not being moved, the toothed fork sleeve 74 is placed below the three-axis robotic arm 71. When the graphite disk needs to be moved, the three-axis robotic arm 71 drives the second U-shaped fork 73 to move until it fits onto the toothed fork sleeve 74 to form a third U-shaped fork. Then, the first U-shaped fork 72 descends to press against the toothed fork sleeve 74 to prevent the toothed fork sleeve 74 from detaching. At this point, it can be used to move the graphite disk. Because the side walls of the fork sleeve 74 extend downwards and are higher than the second U-shaped fork 73, the second U-shaped fork 73 can easily be inserted between the two side walls of the fork sleeve 74, thus fitting the fork sleeve 74. The three-axis robotic arm 71 then drives the second U-shaped fork 73 to move horizontally and vertically to fit the fork sleeve 74. This design eliminates the need for an additional U-shaped fork, which would increase the space occupied by the handling mechanism 7, and also eliminates the need for a separate drive mechanism, improving the integration and reliability of the handling mechanism 7.

[0032] Preferably, the toothed fork sleeve 74 includes two support arms and a connecting portion 741 connecting one end of the two support arms. A pressure groove 742 is provided in the middle of the connecting portion 741. The first U-shaped fork 72 descends into the pressure groove 742 to press the toothed fork sleeve 74. The first U-shaped fork 72 is horizontal with the toothed fork sleeve 74 and will not affect the handling of the graphite disk.

[0033] Specifically, the three-axis robotic arm 71 is also equipped with a Bernoulli chuck 75 and a vacuum chuck 76. The Bernoulli chuck 75 is used to adsorb wafers, realizing the transfer of wafers between the wafer positioning mechanism 4 and the graphite disk positioning mechanism 5. Using the Bernoulli chuck 75 to adsorb wafers will not damage the wafers and can keep the wafers clean. The vacuum chuck 76 is used to adsorb co-wafers, realizing the transfer of co-wafers between the wafer positioning mechanism 4 and the graphite disk positioning mechanism 5. Since there is no need to avoid damage to co-wafers and keep them clean, a regular vacuum chuck 76 can be used to adsorb co-wafers.

[0034] In addition, the three-axis robotic arm 71 is also equipped with a vision component 77 and a dust removal component 78. The vision component 77 is used to detect and position the wafer, the wafer, and the graphite disk, that is, to detect whether the wafer, the wafer, and the graphite disk on the wafer positioning mechanism 4 and the graphite disk positioning mechanism 5 have rotated into place. The dust removal component 78 is used to remove dust from the graphite disk. After the wafer is unloaded, there will be dust on the surface of the graphite disk, which needs to be removed by the dust removal component to facilitate subsequent use. The dust removal component 78 can be a vacuum cleaner structure.

[0035] Preferably, since the vacuum transfer box 2 needs to be evacuated to clean the materials, it is difficult to set up a drive mechanism inside to drive the transfer platform 212 to move. Therefore, a claw mechanism 79 can be set on the three-axis robotic arm 71. After the second automatic transfer door is opened, the three-axis robotic arm 71 drives the claw mechanism 79 to engage the side of the transfer platform 212. Then, the transfer platform 212 can be pushed and pulled to slide along the X-axis direction to realize the transfer of materials between the glove box 1 and the vacuum transfer box 2.

[0036] Key references Figures 2-4 and Figure 9The three-axis robotic arm 71 preferably adopts a gantry-type three-axis linear lead screw module, including an X-axis robotic arm 711, a first Y-axis robotic arm 712, a second Y-axis robotic arm 713, and a first Z-axis robotic arm 714. The first Y-axis robotic arm 712 and the second Y-axis robotic arm 713 are located on the left and right sides of the bottom plate inside the glove box 1, respectively. The two ends of the X-axis robotic arm 711 are respectively mounted on the first Y-axis robotic arm 712 and the second Y-axis robotic arm 713. The first Z-axis robotic arm 714 is mounted on the X-axis robotic arm 711. The first U-shaped fork 72 and the second U-shaped fork 714 are also mounted on the X-axis robotic arm 711. 3. A lifting robotic arm is set on the rear side of the first Z-axis robotic arm 714 to drive the first U-shaped fork 72. The Bernoulli suction cup 75 is set below the second U-shaped fork 73. The vacuum suction cup 76 and the claw mechanism 79 are set on the right side of the second U-shaped fork 73. The vision component 77 is set on the left side of the second U-shaped fork 73. The dust removal component 78 is set on the right side of the first Z-axis robotic arm 714. The toothed fork sleeve 74 can be placed below the first Z-axis robotic arm 714 for easy installation when disassembled. The above structural design realizes the integration of the handling components.

[0037] Furthermore, the wafer positioning mechanism 4 and the graphite disk positioning mechanism 5 are arranged side by side between the first Y-axis robotic arm 712 and the second Y-axis robotic arm 713. The cartridge storage mechanism 3 is located on the rear side of the bottom plate inside the glove box 1. A first automatic door 12 is provided at the connection between the glove box 1 and the MOCVD equipment. The first automatic door 12 is located below the cartridge storage mechanism 3, and the structure of the first automatic door 12 is the same as that of the second automatic door 22. The vacuum transfer box 2 is located on the right side of the glove box 1. The graphite disk transfer mechanism 6 is located below the second Y-axis robotic arm 713. The graphite disk transfer mechanism 6 includes... The system includes a dual-axis robotic arm 61 and a fourth U-shaped fork 62. The dual-axis robotic arm 61 comprises a third Y-axis robotic arm 611 and a second Z-axis robotic arm 612. The third Y-axis robotic arm 611 is positioned below the second Y-axis robotic arm 613, close to the graphite disk positioning mechanism 5. The second Z-axis robotic arm 612 is mounted on the third Y-axis robotic arm 611. The fourth U-shaped fork 62 is mounted on the second Z-axis robotic arm 612 and can support and transport the graphite disk. The dual-axis robotic arm 61 drives the fourth U-shaped fork 62 to move vertically and horizontally, enabling the transfer of the graphite disk between the graphite disk positioning mechanism 5 and the MOCVD equipment. This structural design integrates all components, allowing the application to use a three-axis robotic arm 71 as the drive source for the transport components. This facilitates functional integration, high space utilization, controllable cost, and simple control, reducing system complexity and improving equipment reliability and compatibility.

[0038] Key references Figure 13 and Figure 14The wafer positioning mechanism 4 and the graphite disk positioning mechanism 5 have the same structure, both including a second lifting robotic arm 41, a rotating platform 42, and positioning grippers 43. The rotating platform 42 and positioning grippers 43 are both mounted on the second lifting robotic arm 41, and the height of the rotating platform 42 is adjustable. The positioning gripper 43 includes a first gripper 431 and a second gripper 432, which are openable and closable on the outer periphery of the rotating platform 42. Both the first gripper 431 and the second gripper 432 have two positioning posts 433. After the rotating platform 42 rotates the graphite disk or wafer into position, the first gripper 431 and the second gripper 432 merge to lock the wafer and graphite disk in place using the four positioning posts 433, thus achieving the positioning of the wafer and graphite disk. In addition, a gap is left between the positioning post 433 and the rotating platform 42 to facilitate the insertion of the support arm of the second U-shaped fork 73 or the third U-shaped fork to lift the wafer or graphite disk. When handling the wafer, the support arms of the first U-shaped fork 72 and the second U-shaped fork 73 are inserted between the positioning post 433 and the rotating platform 42.

[0039] The movement of the above components is controlled by a control system. The opening and closing of the first automatic door 12, the second automatic door 22 and the third automatic door 23 can be controlled by an operation button or by the program of the control system.

[0040] like Figure 16 As shown, this application also provides an automatic MOCVD wafer loading and unloading method, which uses the aforementioned automatic MOCVD wafer loading and unloading equipment to perform wafer loading and unloading operations, specifically including the following steps: S1. Graphite Disc Loading: First, the third automatic door 23 opens, and the material handling robot places the fixture box 24 containing the graphite disc into the vacuum transfer box 2. The third automatic door 23 closes, and the vacuum transfer box 2 is evacuated for cleaning. Then, the second automatic door 22 opens, and the three-axis robotic arm 71 drives the gripper mechanism 79 to engage the left side of the transfer platform 212, pulling the transfer platform 212 to the left into the glove box 1. The opening gripper 82 descends to grip the fixture cover plate 25 and then rises to open the fixture box 24. Next, the three-axis robotic arm 71 drives the second U-shaped fork 73 to engage the upper toothed fork sleeve 74 to form the first... The three U-shaped forks work together. The first U-shaped fork 72 descends to the groove 742 on the toothed fork sleeve 74 to press the toothed fork sleeve 74. Then, the three-axis robotic arm 71 drives the third U-shaped fork to lift the graphite disk on the transfer mechanism 21 and transport it to the graphite disk positioning mechanism 5. The graphite disk positioning mechanism 5 rotates and positions the graphite disk. Then, the first U-shaped fork 72 rises and resets. The three-axis robotic arm 71 drives the second U-shaped fork 73 to remove the toothed fork sleeve 74. The opening gripper 82 lowers and resets the fixture cover plate 25. The three-axis robotic arm 71 then drives the chuck mechanism 79 to push the transfer platform 212 back into the vacuum transfer box 2.

[0041] S2, Loading of Casing 31: The material handling robot then places the jig box 24 containing the casing 31 into the vacuum transfer box 2. The transfer mechanism 21 transfers the jig box 24 to the glove box 1. The steps are the same as in S1. Then, the three-axis robotic arm 71 drives the first U-shaped fork 72 and the second U-shaped fork 73 to insert into the upper and lower parts of the top wall of the casing 31, respectively. Then, the first U-shaped fork 72 descends and cooperates with the second U-shaped fork 73 to clamp the casing 31. Then, the casing 31 is transported to the casing storage mechanism 3. S3. Wafer positioning: After the cassette 31 is placed, the first U-shaped fork 72 descends between the two arms of the second U-shaped fork 73 to form a tray mechanism. The three-axis robotic arm 71 drives the tray mechanism to insert into the cassette 31 at the cassette storage mechanism 3, supporting and transporting the wafer. Then, the wafer is transported sequentially to the wafer positioning mechanism 4, and the wafer positioning mechanism 4 rotates and positions the wafer. S4. Wafer loading: The three-axis robotic arm 71 drives the Bernoulli chuck 75 to transport the wafer on the wafer positioning mechanism 4 to the graphite disk of the graphite disk positioning mechanism 5. Then the first automatic door 12 opens, the graphite disk transfer mechanism 6 transfers the graphite disk to the MOCVD equipment and then resets. The first automatic door 12 closes, and the wafer begins to deposit and grow inside the MOCVD equipment. S5. Wafer unloading: After the wafer deposition and growth are completed, the first automatic door 12 opens, and the graphite disk transfer mechanism 6 transfers the graphite disk inside the MOCVD equipment to the graphite disk positioning mechanism 5. Then, the three-axis robotic arm 71 drives the Bernoulli suction cup 75 to sequentially transport the wafers on the graphite disk to the wafer positioning mechanism 4. Then, the first U-shaped fork 72 and the second U-shaped fork 73 are driven to transport the wafers to the cassette 31 of the cassette storage mechanism 3. The cassette 31 is then transported to the transfer mechanism 21, which transfers the cassette 31 to the vacuum transfer box 2. Finally, the material handling robot takes out the cassette 31 from the vacuum transfer box 2, completing the wafer unloading action.

[0042] Furthermore, in step S4, before loading the wafers from the wafer positioning mechanism 4 onto the graphite disk of the graphite disk positioning mechanism 5, the vision component 77 must first detect whether the wafers and the graphite disk have rotated into position. After they have rotated into position, the wafers are loaded. In step S5, after all the wafers on the graphite disk are removed, the three-axis robotic arm 71 drives the dust removal component 78 to move above the graphite disk to remove dust from the graphite disk for subsequent use. If the graphite disk needs to be replaced, the three-axis robotic arm 71 drives the second U-shaped fork 73 to engage the toothed fork sleeve 74 to transport the graphite disk to the transfer mechanism 21, which then transfers it to the vacuum transfer box 2. After the operator removes the graphite disk from the vacuum transfer box 2, the operation of step S1 is repeated to place the new graphite disk into the graphite disk positioning mechanism 5.

[0043] It should be noted that in step S4, if all the wafers in the storage mechanism can fill the graphite disk, there is no need to place the wafers to accompany them, and the subsequent steps can continue. If there are still empty spaces on the graphite disk after all the wafers have been moved to it, then wafers to accompany them need to be added. First, the wafers need to be transferred to the wafer positioning mechanism 4 in sequence. This step is the same as step S3, and is carried out by the first U-shaped fork 72 and the second U-shaped fork 73. Then, the three-axis robotic arm 71 drives the vacuum chuck 76 to move the wafers to the graphite disk. Then, in step S5, after the wafers are unloaded, the wafers are unloaded. The unloading steps for the wafers are the same as for the wafers. The only difference is that the wafers are moved from the graphite disk to the wafer positioning mechanism 4 by the three-axis robotic arm 71 driving the vacuum chuck 76.

[0044] Therefore, the entire operation process of this application is automated, requiring no operator intervention, which improves production efficiency and product yield, and greatly reduces labor costs.

[0045] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0046] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An automatic MOCVD wafer loading and unloading method, characterized in that: An automated MOCVD wafer loading and unloading device is used for wafer loading and unloading. The automated MOCVD wafer loading and unloading device includes a glove box and a vacuum transfer box, as well as a chuck storage mechanism, a wafer positioning mechanism, a graphite disk positioning mechanism, a graphite disk transfer mechanism, and a handling mechanism disposed inside the glove box. The glove box is connected to the MOCVD equipment, the vacuum transfer box is connected to the glove box, and the vacuum transfer box is equipped with a transfer mechanism for transporting cartridges and graphite disks. The cartridge storage mechanism is used to store multiple cartridges. The handling mechanism includes a three-axis robotic arm and a first U-shaped fork, a second U-shaped fork, and a Bernoulli suction cup mounted on the three-axis robotic arm. The first U-shaped fork is raised and lowered above the second U-shaped fork, and when the first U-shaped fork is lowered to be horizontal with the second U-shaped fork, the first U-shaped fork is located between the two arms of the second U-shaped fork. The Bernoulli suction cup is used to adsorb the wafer. A toothed fork sleeve is provided below the three-axis robotic arm. The toothed fork sleeve is larger than the second U-shaped fork and can be detachably fitted onto the second U-shaped fork. The MOCVD automatic loading and unloading method includes the following steps: S1. Graphite disk loading: The transfer mechanism conveys the graphite disk into the glove box. The three-axis robotic arm drives the second U-shaped fork to put on the toothed fork sleeve to form the third U-shaped fork. The first U-shaped fork descends to press the toothed fork sleeve. Then, the three-axis robotic arm drives the third U-shaped fork to transport the graphite disk on the transfer mechanism to the graphite disk positioning mechanism. The graphite disk positioning mechanism rotates and positions the graphite disk. Then, the first U-shaped fork rises and resets. The three-axis robotic arm drives the second U-shaped fork to remove the toothed fork sleeve. S2, Plug feeding: The transfer mechanism conveys the plug into the glove box. The three-axis robotic arm drives the first U-shaped fork and the second U-shaped fork to insert into the upper and lower parts of the top wall of the plug respectively. Then the first U-shaped fork descends and cooperates with the second U-shaped fork to clamp the plug. Then the plug is transported to the plug storage mechanism. S3. Wafer positioning: The first U-shaped fork descends to form a tray mechanism between the two arms of the second U-shaped fork. The three-axis robotic arm drives the tray mechanism to insert into the slot at the slot storage mechanism to support and transport the wafer to the wafer positioning mechanism. The wafer positioning mechanism rotates and positions the wafer. S4. Wafer loading: The three-axis robotic arm drives the Bernoulli chuck to move the wafer on the wafer positioning mechanism to the graphite disk of the graphite disk positioning mechanism, and then the graphite disk transfer mechanism transfers the graphite disk to the MOCVD equipment. S5. Wafer loading: After the wafer deposition and growth are completed, the graphite disk transfer mechanism will transfer the graphite disk to the graphite disk positioning mechanism. The three-axis robotic arm will drive the Bernoulli chuck to transport the wafers on the graphite disk to the wafer positioning mechanism in sequence. Then, the first U-shaped fork and the second U-shaped fork will be driven to transport the wafers to the cassettes of the cassette storage mechanism. The cassettes will then be transported to the transfer mechanism, which will then transfer the cassettes to the vacuum transfer box.

2. The MOCVD automatic wafer loading and unloading method as described in claim 1, characterized in that: The transfer mechanism includes a slide rail and a transfer platform. The slide rail is located inside the vacuum transfer box, and the transfer platform is used to load a plug or graphite disk. The transfer platform is slidably mounted on the slide rail. The three-axis robotic arm is also equipped with a claw mechanism for pushing and pulling the transfer platform. In steps S1, S2 and S5, the three-axis robotic arm drives the claw mechanism to engage the side of the transfer platform, and then pushes and pulls the transfer platform to slide between the glove box and the vacuum transfer box.

3. The MOCVD automatic wafer loading and unloading method as described in claim 2, characterized in that: The left side of the vacuum transfer box is connected to the glove box, and the left side of the vacuum transfer box and any other side are respectively provided with a second automatic door and a third automatic door; in steps S1 and S2, the third automatic door opens automatically first, and a material handling robot puts the graphite disk or plug into the vacuum transfer box, then the third automatic door closes, then the second automatic door opens, and the three-axis robotic arm drives the gripper to move the transfer platform into the glove box, and finally the second automatic door closes; in step S5, the operation of removing the plug from the vacuum transfer box is the reverse of steps S1 and S2.

4. The MOCVD automatic wafer loading and unloading method as described in claim 2, characterized in that: The transfer platform is equipped with a fixture box for loading plugs and graphite disks. The top of the fixture box is equipped with a fixture cover plate, and the top of the fixture cover plate is equipped with an opening handle. The glove box is also equipped with a fixture opening mechanism, which includes a first lifting robotic arm and an opening gripper mounted on the first lifting robotic arm. In steps S1 and S2, after the transfer platform transports the fixture box into the glove box, the first lifting robotic arm drives the opening gripper to descend. The opening gripper clamps the opening handle and then rises to open the fixture box. After the subsequent handling components remove the plugs or graphite disks from the fixture box, the opening gripper drives the fixture cover plate to descend and reset. The transfer platform then transports the fixture box back to the vacuum transfer box.

5. The MOCVD automatic wafer loading and unloading method as described in claim 1, characterized in that: The graphite disk transfer mechanism includes a dual-axis robotic arm and a fourth U-shaped fork. The fourth U-shaped fork is mounted on the dual-axis robotic arm. In steps S4 and S5, the dual-axis robotic arm drives the fourth U-shaped fork to grasp and transfer the graphite disk between the graphite disk positioning mechanism and the MOCVD equipment.

6. The MOCVD automatic wafer loading and unloading method as described in claim 1, characterized in that: The cassette is also used to stack multiple wafers, and the wafer positioning mechanism is also used to rotate and position the wafers. The tray mechanism formed by the first U-shaped fork and the second U-shaped fork is also used to support and transport the wafers. The method of transporting the wafers to the wafer positioning mechanism is the same as that of the wafers. The three-axis robotic arm is also equipped with a vacuum chuck for adsorbing the wafers. The three-axis robotic arm drives the vacuum chuck to transport the wafers on the wafer positioning mechanism to the graphite disk. In step S4, after all the wafers are loaded onto the graphite disk, if there is still space on the graphite disk, the wafers are loaded onto the graphite disk. Then, in step S5, the wafers are unloaded first, and then the wafers are unloaded. Except for the three-axis robotic arm driving the vacuum chuck to transport the wafers between the wafer positioning mechanism and the graphite disk, the other loading and unloading steps of the wafers are the same as those of the wafers.

7. The MOCVD automatic wafer loading and unloading method as described in claim 1, characterized in that: The three-axis robotic arm is also equipped with a vision component and a dust removal component. In step S4, before moving the wafer on the wafer positioning mechanism to the graphite disk on the graphite disk positioning mechanism, the vision component is used to detect whether the wafer and the graphite disk have rotated into place. In step S5, after all the wafers on the graphite disk are removed, the three-axis robotic arm drives the dust removal component to move above the graphite disk to remove dust from the graphite disk.

8. An automated MOCVD wafer loading and unloading device, characterized in that: It includes a glove box and a vacuum transfer box, as well as a clip storage mechanism, a wafer positioning mechanism, a graphite disk positioning mechanism, a graphite disk transfer mechanism, and a handling mechanism located inside the glove box; The glove box is connected to the MOCVD equipment, and the vacuum transfer box is connected to the glove box. The vacuum transfer box is equipped with a transfer mechanism for transporting the cartridges and graphite disks, so as to realize the transfer of the cartridges and graphite disks between the glove box and the vacuum transfer box. The cartridge storage mechanism is used to store multiple cartridges, and multiple wafers are stacked inside the cartridges; The wafer positioning mechanism and the graphite disk positioning mechanism are used to rotate and position the wafer and the graphite disk, respectively. The handling mechanism includes a three-axis robotic arm and a first U-shaped fork, a second U-shaped fork, and a Bernoulli suction cup mounted on the three-axis robotic arm. The first U-shaped fork is elliptical and positioned above the second U-shaped fork. When the first U-shaped fork descends to near the second U-shaped fork, the first U-shaped fork and the second U-shaped fork form a gripper mechanism to clamp the top wall of the plug, enabling the transfer of the plug between the transfer mechanism and the plug storage mechanism. When the first U-shaped fork descends to be horizontal with the second U-shaped fork, the first U-shaped fork forms a tray mechanism between the two arms of the second U-shaped fork, used to support and transport the wafer, enabling the transfer of the wafer between the plug storage mechanism and the wafer positioning mechanism. The Bernoulli suction cup is used to adsorb the wafer, enabling the transfer of the wafer between the wafer positioning mechanism and the graphite disk positioning mechanism. The glove box is also equipped with a toothed fork sleeve. The toothed fork sleeve is larger than the second U-shaped fork and can be detachably fitted onto the second U-shaped fork. The three-axis robotic arm drives the second U-shaped fork to be fitted with the toothed fork sleeve for transporting the graphite disk, thereby realizing the transfer of the graphite disk between the transfer mechanism and the graphite disk positioning mechanism. After the toothed fork sleeve is fitted onto the second U-shaped fork, the first U-shaped fork descends to press the toothed fork sleeve. The graphite disk transfer mechanism is used to move the graphite disk and realize the transfer of the graphite disk between the graphite disk positioning mechanism and the MOCVD equipment.

9. The MOCVD automatic loading and unloading equipment as described in claim 8, characterized in that: The three-axis robotic arm includes an X-axis robotic arm, a first Y-axis robotic arm, a second Y-axis robotic arm, and a first Z-axis robotic arm. The first Y-axis robotic arm and the second Y-axis robotic arm are located on the left and right sides of the glove box's inner bottom plate, respectively. The two ends of the X-axis robotic arm are slidably mounted on the first Y-axis robotic arm and the second Y-axis robotic arm, respectively. The first Z-axis robotic arm is slidably mounted on the X-axis robotic arm. The first U-shaped fork, the second U-shaped fork, and the Bernoulli suction cup are mounted on the first Z-axis robotic arm. The wafer positioning mechanism and the graphite disk positioning mechanism are located between the first Y-axis robotic arm and the second Y-axis robotic arm. The graphite disk transfer mechanism is located below the second Y-axis robotic arm. The cartridge storage mechanism is located on the rear side of the glove box's inner bottom plate. A first automatic door is provided at the connection between the glove box and the MOCVD equipment. The first automatic door is located below the cartridge storage mechanism. The vacuum transfer box is located on the right side of the glove box.

10. An automated MOCVD wafer loading and unloading device as described in claim 9, characterized in that: The cassette is also used to stack multiple wafers, and the wafer positioning mechanism is also used to rotate and position the wafers. The tray mechanism formed by the first U-shaped fork and the second U-shaped fork is also used to support and transport the wafers, realizing the transfer of the wafers between the cassette storage mechanism and the wafer positioning mechanism. The three-axis robotic arm is also equipped with a vacuum suction cup, a vision component, and a dust removal component. The vacuum suction cup is used to transport the wafers, realizing the transfer of the wafers between the wafer positioning mechanism and the graphite disk positioning mechanism. The vision component is used to detect and position the wafers, wafers, and graphite disks, and the dust removal component is used to remove dust from the graphite disks.

11. The MOCVD automatic wafer loading and unloading equipment as described in claim 10, characterized in that: The first U-shaped fork and the second U-shaped fork are located on the rear side of the Z-axis robotic arm. The Bernoulli suction cup is located below the second U-shaped fork. The vacuum suction cup is located on the right side of the second U-shaped fork. The vision component is located on the left side of the second U-shaped fork. The dust removal component is located on the right side of the Z-axis robotic arm.

12. The MOCVD automatic wafer loading and unloading equipment as described in claim 8, characterized in that: The fork sleeve includes two arms and a connecting part connecting one end of the two arms. A pressure groove is provided in the middle of the connecting part, and the first U-shaped fork descends into the pressure groove to press the fork sleeve.

13. The MOCVD automatic loading and unloading equipment as described in claim 8, characterized in that: The wafer positioning mechanism and the graphite disk positioning mechanism have the same structure, both including a second lifting robotic arm, a rotating platform, and positioning grippers. The rotating platform and positioning grippers are both mounted on the second lifting robotic arm. The positioning grippers include a first gripper and a second gripper. The first gripper and the second gripper are open and closed on the outer periphery of the rotating platform, and each of the first gripper and the second gripper is provided with two positioning posts. After the rotating platform drives the graphite disk or wafer to rotate into position, the first gripper and the second gripper merge so that the four positioning posts hold the wafer and the graphite disk in place.

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