Alignment method based on wafer before and after recombination

Abstract

The invention discloses an alignment method before and after wafer recombination, which comprises the following steps: S1, traversing all crystal grains of a corresponding wafer, and storing coordinates and test results of the crystal grains into a data mapping unit, the data mapping unit comprises first data and second data, the coordinate of each crystal grain is used as the first data, and the coordinate of each crystal grain is used as the second data; the test result of the crystal grain is used as second data. And S2, obtaining related data of the wafer before and after the to-be-assembled crystal grains are assembled. And S3, analyzing the related data of the wafer into third data. And S4, aligning the crystal grain position on the wafer according to the first data, the second data and the third data. The problem of lack of relevance between wafer test data and original wafer Map after recombination is solved, and automatic and high-precision reverse mapping and standardized output are realized.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor manufacturing and testing, and particularly relates to a method, system, intelligent device and storage medium for alignment before and after wafer reorganization. BACKGROUND

[0002] In the wafer reorganization process (such as Fan-Out packaging), the physical position of the chip is decoupled from the original wafer Map (Micro-Assembly Process) due to rearrangement. CP (Chip Probe) testing is an electrical test performed on each chip by a probe during wafer processing. The test content may include whether the current, voltage, logic function, etc. of the chip meets the design specification. The CP test Map is a mapping diagram generated based on the test results of each die. It usually records the coordinates of each die and its corresponding test results (such as whether it is qualified, test value, etc.). However, this test map is usually static and cannot fully reflect the dynamic defect distribution pattern in the manufacturing process, such as the location, shape and distribution of defects (such as edge ring defects, local aggregation, etc.). It is difficult to locate the root cause of process anomalies (such as lithography or etching equipment failure).

[0003] The prior art relies on manual matching of the coordinate mapping relationship of the wafer before and after reorganization, which is time-consuming and prone to errors, especially in the context of multiple wafer merging and reorganization (such as integrating dies of different Wafer IDs to a new wafer), which is time-consuming and has higher labor costs, and the accuracy is more difficult to grasp. In addition, existing data analysis tools (such as JMP, Excel) cannot directly support the unstructured data after reorganization, and additional data conversion interfaces need to be developed. In short, it is impossible to achieve automatic, high-precision reverse mapping and standardized output. SUMMARY

[0004] To solve the above-mentioned defects, the technical problem solved by the present application is to provide a method and system for alignment before and after wafer reorganization, which solves the problem of the lack of correlation between the test data of the reorganized wafer and the original wafer Map, and achieves automatic, high-precision reverse mapping and standardized output.

[0005] The first aspect of the present application provides a method for alignment before and after wafer reorganization, comprising S1: traversing all dies of a corresponding wafer, and storing the coordinates and test results of the dies in a data mapping unit, the data mapping unit comprising first data and second data, wherein the coordinates of each die are taken as the first data, and the test results of the dies are taken as the second data.

[0006] S2: Obtain relevant data before and after the wafer to be assembled. S3: Parse the relevant data of the wafer into third data. S4: Align the die positions on the wafer according to the first, second, and third data.

[0007] According to an embodiment of the present invention, the relevant data of the wafer to be assembled before and after assembly in S2 include: a unique wafer identifier, a spatial coordinate correspondence, and a grain arrangement rule. The spatial coordinate correspondence includes the correspondence between the original wafer coordinates and the reassembled wafer coordinates.

[0008] According to one embodiment of the present invention, the relevant data of the wafer parsed in step S3 is third data, including: Extract the correspondence between the original wafer coordinates and the reconstructed wafer coordinates, and store the correspondence in the data mapping unit as third data.

[0009] According to an embodiment of the present invention, step S4, which aligns the die positions on the wafer based on the first data, the second data, and the third data, includes: determining the mapping relationship between the first data, the second data, and the third data based on the mapping relationship of the data mapping unit; outputting fourth data based on the mapping relationship between the first data, the second data, and the third data; and determining the die positions of the wafer based on the fourth data.

[0010] According to one embodiment of the present invention, the grain arrangement rule includes: the arrangement order, spacing and orientation of the grains.

[0011] According to one embodiment of the present invention, the output fourth data includes: a two-dimensional thermal map of the original wafer, a distribution of the classification codes for the grain test results, and a yield rate statistical chart.

[0012] A second aspect of the present invention provides a wafer alignment system before and after wafer reassembly, comprising: a first acquisition module, configured to traverse all dies of a corresponding wafer and store the coordinates and test results of the dies in a data mapping unit, wherein the data mapping unit includes first data and second data, wherein the coordinates of each die are used as the first data and the test results of the die are used as the second data.

[0013] The second acquisition module is used to acquire relevant data of the wafer before and after the assembly of the dies to be assembled. The parsing module is used to parse the relevant data of the wafer into third data. The alignment module is used to align the die positions on the wafer according to the first data, the second data, and the third data.

[0014] According to one embodiment of the present invention, the relevant data of the wafer includes: a unique wafer identifier, a spatial coordinate correspondence, and a grain arrangement rule, wherein the spatial coordinate correspondence includes the correspondence between the original wafer coordinates and the reconstructed wafer coordinates.

[0015] According to one embodiment of the present invention, the parsing module includes: an extraction unit for extracting the correspondence between the original wafer coordinates and the reconstructed wafer coordinates; and a storage unit for storing the mapping relationship between the original wafer coordinates and the reconstructed wafer coordinates as third data.

[0016] According to an embodiment of the present invention, the alignment module includes: a mapping unit, configured to determine the mapping relationship between the first data, the second data, and the third data based on the mapping relationship of the data mapping unit; and an output unit, configured to output fourth data based on the first data and the mapping relationship between the first data, the second data, and the third data.

[0017] Alignment unit, used to determine the grain position of the wafer based on the fourth data.

[0018] According to one embodiment of the present invention, the grain arrangement rule includes: the arrangement order, spacing and orientation of the grains.

[0019] According to one embodiment of the present invention, the output fourth data includes: a two-dimensional thermal map of the original wafer, a distribution of the classification codes for the grain test results, and a yield rate statistical chart.

[0020] A third aspect of the present invention provides an intelligent device, comprising: a transmitter, a receiver, a memory, and a processor. The memory stores computer instructions; the processor executes the computer instructions stored in the memory to implement the aforementioned alignment method before and after wafer reassembly.

[0021] A fourth aspect of the present invention provides a storage medium comprising: a readable storage medium and computer instructions, wherein the computer instructions are stored in the readable storage medium; the computer instructions are used to implement the above-described alignment method before and after wafer reassembly.

[0022] The beneficial effects provided by this invention are as follows: First, by restoring the defect distribution pattern of the original MAP (such as edge ring defects), process anomalies in the manufacturing process (such as lithography machine alignment deviations) can be accurately located; second, the influence of the recombination process on the manufacturing process can be separated, the grain screening rules can be optimized, and the risk of later failure caused by original defects can be reduced; third, automated processing replaces manual matching, reducing processing time from hours to minutes, and interactive operation is provided through the interface, which greatly improves work efficiency; finally, the output is a standard TXT file and Excel chart, which can be seamlessly integrated with existing data analysis tools (such as JMP and Excel), reducing manual processing costs. Attached Figure Description

[0023] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0024] Figure 1 This is a flowchart of the alignment method before and after wafer reassembly disclosed in an embodiment of the present invention; Figure 2 This is a schematic diagram of the coordinate mapping before and after wafer reassembly as disclosed in an embodiment of the present invention; Figure 3 This is a fourth data yield statistics chart in the alignment method before and after wafer reassembly disclosed in an embodiment of the present invention; Figure 4 This is a block diagram of the alignment system before and after wafer reassembly disclosed in an embodiment of the present invention.

[0025] The accompanying drawings have illustrated specific embodiments of this disclosure, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concepts of this disclosure to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0026] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0027] A raw wafer map is a complete information diagram of wafer yield and chip location generated before subsequent processing such as wafer dicing, reassembly, and packaging. It is one of the important data points in the wafer fabrication stage.

[0028] A wafer map (also called a wafer map or die map) is a two-dimensional matrix diagram that represents the position and status of all chips (dies) on a wafer.

[0029] A raw wafer map typically includes: chip coordinates, the XY coordinates of each die on the wafer; good / bad markings, indicating whether the chip at that location is qualified (usually G / B or I / O); chip ID, the serial number or identification code (such as a traceability code) of each chip; test results, data from various electrical or functional tests; and wafer ID, information such as wafer number and batch number.

[0030] CP testing is performed on each chip on the wafer before it is cut into individual dies using test probes to check whether the chip functions properly.

[0031] CP test data includes: chip coordinates (X / Y), the physical location of each chip on the wafer; pass / fail markings, indicating whether the chip has passed the test; electrical parameter values, such as chip current, voltage, timing, switching speed, and other performance data; error codes / failure modes, such as short circuit, open circuit, parameter drift, and leakage; chip ID, uniquely identifying each chip for easy tracking; and test time / machine / batch information for production traceability.

[0032] This invention provides a method for alignment before and after wafer reassembly, such as... Figure 1 As shown, it includes: S1: Traverse all the dies of the corresponding wafer, and store the coordinates of the dies and the test results into the data mapping unit. The data mapping unit includes first data and second data, wherein the coordinates of each die are used as the first data and the test results of the die are used as the second data.

[0033] This system is developed based on the VB.NET language and the WinForm framework, and adopts a modular design, including the following core modules: The data parsing module contains user-defined CP test result files (TXT format) with fields: Wafer ID, X, Y, BIN value, and Pass / Fail. Specifically, Wafer ID represents the wafer number or ID corresponding to the test data. Each wafer has a unique identifier during manufacturing for tracking. X and Y represent chip coordinates, typically with the wafer center or a reference point as the origin. X represents the horizontal coordinate; Y represents the vertical coordinate. These coordinates help locate the specific position of each chip on the wafer. The BIN value represents the test classification code, which categorizes the chip based on the test results. For example, BIN 1 usually indicates a pass. Other BIN values ​​(such as Bin2, Bin3, etc.) may indicate different types or reasons for failure. This classification is used for subsequent sorting and packaging. Pass / Fail indicates whether the test passed or failed. Pass means the test was passed and the chip can be used for subsequent packaging; Fail means the test failed and the chip may be scrapped or require further analysis.

[0034] Specifically, for example, Wafer001, 10, 15, 1, Pass means that the chip with wafer number Wafer001 located at position X=10, Y=15 has a test result of Bin 1, which is considered a pass.

[0035] S2: Obtain relevant data of the wafer before and after the assembly of the die to be assembled.

[0036] The packaging plant provides reassembly process data (CSV / TXT format), which records the wafer ID, spatial coordinate correspondence, and die arrangement rules of the wafer before and after reassembly.

[0037] Here, Wafer ID refers to a unique identifier for a wafer, used to distinguish different wafers. In the semiconductor manufacturing process, each wafer is assigned a unique ID to track and manage its production, testing, processing, and packaging.

[0038] Identifying different wafers manufactured within the same batch facilitates quality control, testing, and tracking during manufacturing and packaging. It also helps identify and track the origin and related information of each wafer during wafer reassembly.

[0039] Spatial coordinate correspondence refers to the coordinate mapping between the original wafer (wafer before manufacturing) and the reassembled wafer (or the position of the reassembled die). The position of each die on the original wafer is recorded as coordinates (such as X and Y coordinates). After reassembly, the dies are repositioned or stacked to form new coordinate positions. The position change of each die during the reassembly process facilitates tracking the position of each die after reassembly, ensuring that the dies can be accurately placed in the new packaging carrier or stacking position.

[0040] This correspondence ensures that each die of the original wafer is correctly aligned with the target location during wafer stacking or other types of packaging.

[0041] Suppose a grain is located at (X1, Y1) on the original wafer and at (X2, Y2) after recombination. Then (X1, Y1) and (X2, Y2) are spatial coordinate correspondences.

[0042] Die arrangement rules refer to the rules or patterns governing how dies (chips) are arranged on a wafer or within a package carrier. This includes the arrangement of dies on the wafer (e.g., row-column arrangement, polar coordinate arrangement, etc.) and the layout rules after reassembly or during stacking. Ensuring dies are placed and mated according to specific arrangements optimizes package density, heat dissipation, electrical connections, etc. Examples include row-column arrangements, circular arrangements, or random arrangements.

[0043] The above Wafer ID, spatial coordinate correspondence, and die arrangement rules constitute the basic data for the wafer reassembly process, ensuring the precise positioning and effective assembly of each die, thereby guaranteeing the quality and reliability of the final product.

[0044] Automatically verify data integrity and extract coordinate mapping tables of wafers before and after recombination.

[0045] The specific code implementation is as follows: Store the CP test results into a dictionary (coordinates as keys, test results as values). Dim CP_All_Dies As New Dictionary(Of COOR, RESULT) For Each Die In CP_MAPs(CP_Wafer_ID).All_Dies CP_All_Dies.Add(Die.Key, Die.Value) Next This means storing the CP (test) results in a dictionary, where the coordinates (COOR) of each grain are used as the key and the test result (RESULT) of the grain is used as the value. This allows for easy lookup of the corresponding test result by the grain's coordinates.

[0046] Specifically, CP_All_Dies is a dictionary variable used to store the test results of all chips. COOR is the type of the dictionary key, representing the coordinates of the chip, including X and Y coordinate information. RESULT is the type of the dictionary value, representing the test result of each chip, indicating whether the test passed or failed, or other custom types.

[0047] For Each Die In CP_MAPs(CP_Wafer_ID).All_Dies: This is a loop that iterates through each die. CP_MAPs is a dictionary or set, CP_Wafer_ID is the ID of the current wafer, and All_Dies is the set of all dies associated with that wafer ID.

[0048] Die.Key is the current chip's coordinates (COOR), representing an object composed of X and Y coordinates. Die.Value is the chip's test result (RESULT), which may indicate a pass or fail, or more detailed test results (such as the Bin value).

[0049] CP_All_Dies.Add(Die.Key, Die.Value): Adds the current chip coordinates as the key and the test result as the value to the dictionary CP_All_Dies.

[0050] Quickly find the test results for each chip using coordinates, and efficiently store and access the coordinates and test results for each chip using a dictionary.

[0051] The coordinate mapping module obtains the coordinate mapping relationship before and after reassembly by parsing the packaging plant logs, such as... Figure 2 As shown, the dictionary is used to quickly look up the CP test results corresponding to the original wafer coordinates. Affine transformation: supports coordinate transformations in complex reconfiguration scenarios such as translation and rotation. The transformation formula is as follows: (1) in, and These represent the coordinates in the original coordinate system; and These represent the coordinates in the reconstructed coordinate system, and the coordinate system after transformation or adjustment.

[0052] a, b, d, and e are linear transformation coefficients in coordinate transformation, describing the linear relationship between coordinates. They transform the reconstructed coordinate system back to the original coordinate system through operations such as scaling, selection, or tilting. c and f are offsets, representing the translation between the coordinate systems, i.e., the displacement between the original and reconstructed coordinate systems.

[0053] S3: The relevant data of the wafer is analyzed as third data.

[0054] The code implementation is as follows: Parse the coordinate mapping before and after reorganization based on the ASM logs. Dim FAB_COORD = New COOR With {.X = Integer.Parse(firstCoordinateX),.Y = Integer.Parse(firstCoordinateY)} Dim CP_COORD = New COOR With {.X = Integer.Parse(secondCoordinateX),.Y = Integer.Parse(secondCoordinateY)} If CP_All_Dies.ContainsKey(CP_COORD) Then My_Die_Result_List.Add(New Die_Info With { .Fab_Die_Coord = FAB_COORD, .CP_Die_Coord = CP_COORD, .Sbin = CP_All_Dies(CP_COORD).SBIN, .Hbin = CP_All_Dies(CP_COORD).HBIN, .PF = CP_All_Dies(CP_COORD).PF }) End If This represents the resolution and mapping of the die coordinates before and after reassembly, and maps them to the reassembled die coordinates based on the coordinate information in the ASM (Automated Production Management) log.

[0055] Specifically, define and initialize the coordinate object.

[0056] FAB_COORD: Represents the coordinates of the original (or early) die, obtained from the log using firstCoordinateX and firstCoordinateY. These coordinates are used to indicate the die's position on the wafer before reassembly.

[0057] CP_COORD: Represents the coordinates of the reassembled grain, obtained from the log using secondCoordinateX and secondCoordinateY. These coordinates indicate the new position of the grain after reassembly.

[0058] The code searches for information about the recombined grains. It checks if the CP_All_Dies set contains an element with the key CP_COORD (the recombined coordinates), indicating whether a grain exists at that coordinate. If the grain exists, subsequent operations extract and process its information.

[0059] Create a new die information object and add it to the results list. Fab_Die_Coord: The coordinates of the original die (FAB_COORD), i.e., its position on the wafer. CP_Die_Coord: The coordinates of the reassembled die (CP_COORD), i.e., the position where the die is placed. Sbin, Hbin, PF: This information is extracted from CP_All_Dies (CP_COORD) and includes other die-related parameters (such as quality assignment, test results, etc.).

[0060] During wafer reassembly, metadata (such as quality and classification) of the relevant grains is associated and recorded based on the original grain coordinates (FAB_COORD) and the reassembled grain coordinates (CP_COORD). Finally, this mapped grain information is added to the results list (My_Die_Result_List) for subsequent analysis or processing.

[0061] The coordinates are parsed and the corresponding coordinate information is checked in the CP_All_Dies dictionary. If it exists, the relevant information (including the coordinates and other data obtained from the dictionary) is encapsulated into a new Die_Info object and added to the My_Die_Result_List.

[0062] If the reorganization process uses a fixed template (inbound row and column offset), the mapping relationship can be directly obtained by looking up the table.

[0063] Supports high-concurrency mapping requirements under multi-wafer merging and reorganization; improves system response speed to meet production line automation requirements; supports precise mapping control at the Lot and Wafer levels.

[0064] In complex scenarios where multiple original wafers are merged and recombined into a new wafer, the system can accurately reconstruct the original wafer to which each die belongs and its coordinates based on the input Wafer ID and location information, solving the problem of "multi-source die mapping chaos" that traditional methods cannot handle.

[0065] The multi-source die attribution determination algorithm expands the system's applicability; it supports die source tracing, facilitating subsequent yield analysis and defect tracking; and it provides a data foundation for heterogeneous integration in advanced packaging.

[0066] Automatically adapts to the coordinate definition standards of different manufacturers; improves the consistency and compatibility of data output; the system has a built-in coordinate system transformation engine that can automatically identify the coordinate origin direction used by different packaging devices (such as upper left, lower right, etc.) and output a unified standard Cartesian coordinate system through quadrant flipping, mirror transformation and other methods to avoid mapping errors caused by inconsistencies in coordinate systems.

[0067] Output module: TXT file generation: Outputs a standard file of the original wafer map, containing the fields: original WaferID, X, Y, BIN value, Pass / Fail.

[0068] Excel visualization: Call the VB.NET Excel operation library (such as Microsoft.Office.Interop.Excel) to generate a two-dimensional heatmap, and mark the defect distribution and yield statistics.

[0069] The code implementation is as follows: Export as a standard TXT file Dim Map_str As New Text.StringBuilder For each Die in All_Dies Map_str.Append(Format_Wmap(Die.Key.X, Die.Key.Y, Die.Value.SBIN,Die.Value.HBIN, Die.Value.SITE, If(Die.Value.PF = True, 0, 1))&vbCrLf) Next File.WriteAllText(Output_File, Map_str.ToString) First, a string builder is created: `Map_str`, a `StringBuilder` object used for efficiently building and modifying strings. `StringBuilder` is more efficient than directly using string concatenation, especially when concatenating strings within loops.

[0070] Then, iterate through the All_Dies collection, which is a dictionary named All_Dies. Each Die is an element in the collection, and usually a Die contains a key-value pair, where Die.Key and Die.Value represent the key and value of each entry, respectively.

[0071] Furthermore, formatting and adding to the string builder. Format_Wmap is a custom formatting function used to process data such as Die.Key.X, Die.Key.Y, Die.Value.SBIN, Die.Value.HBIN, Die.Value.SITE, and Die.Value.PF according to a certain format and return a string.

[0072] Die.Key.X and Die.Key.Y represent coordinate information. Die.Value.SBIN, Die.Value.HBIN, and Die.Value.SITE are properties associated with each Die. Die.Value.PF is a boolean value that is converted to 0 or 1 (a boolean value is converted to an integer) by the conditional expression If(Die.Value.PF = True, 0, 1).

[0073] vbCrLf is a constant representing the carriage return and newline character, used to add newlines between strings.

[0074] File.WriteAllText is a method for writing the entire text to a specified file. It writes the complete string generated by Map_str.ToString (i.e., all the concatenated data) to the specified file path Output_File.

[0075] Specifically, it iterates through each element in the All_Dies collection, formats the relevant data of each element using the Format_Wmap function, concatenates them into a string, and outputs the final result to a standard TXT file.

[0076] The `Format_Wmap` function outputs the data of each die according to a specified format, including coordinates, parameters, boolean values, etc. The final generated TXT file will contain this formatted data, with each line representing information about one die.

[0077] Specifically, the recombined CP test results are stored in a dictionary (e.g., Dictionary(Of COOR,RESULT)) using coordinates as keys. The mapping relationship between the coordinates before and after recombination is analyzed using the recombination logs (e.g., ASM logs) provided by the packaging plant, and the test results of the original wafer are quickly restored.

[0078] The specific code snippet is as follows, demonstrating a fast dictionary lookup implementation: If CP_All_Dies.ContainsKey(CP_COORD) Then My_Die_Result_List.Add(New Die_Info With { .Fab_Die_Coord = FAB_COORD, .CP_Die_Coord = CP_COORD, .Sbin = CP_All_Dies(CP_COORD).SBIN, .Hbin = CP_All_Dies(CP_COORD).HBIN, .PF = CP_All_Dies(CP_COORD).PF }) End If Specifically, CP_All_Dies is a dictionary or similar data structure, and the ContainsKey(CP_COORD) method checks if the key CP_COORD (i.e., a coordinate value) exists in the dictionary. If the dictionary contains this coordinate as a key, the following code is executed.

[0079] Adds an element to the My_Die_Result_List, a list that stores objects of type Die_Info. The Add method adds a new Die_Info object to this list.

[0080] Construct a Die_Info object. New Die_Info With {...} creates a new Die_Info object and uses initializers (With syntax) to set the object's various properties.

[0081] Fab_Die_Coord = FAB_COORD: Sets the Fab_Die_Coord property of the Die_Info object to the FAB_COORD coordinates. FAB_COORD is a coordinate value predefined in the code.

[0082] CP_Die_Coord = CP_COORD: Sets the CP_Die_Coord property of the Die_Info object to the CP_COORD coordinates. CP_COORD is the coordinate value calculated or defined before the conditional statement is evaluated.

[0083] `Sbin = CP_All_Dies(CP_COORD).SBIN`: This function searches for the corresponding value in the `CP_All_Dies` dictionary using `CP_COORD` and retrieves the `SBIN` attribute. `CP_All_Dies` is a dictionary that stores data associated with coordinates (`CP_COORD`) (possibly objects of type `Die_Info`), and `SBIN` is one of its data fields.

[0084] Hbin = CP_All_Dies(CP_COORD).HBIN: Similarly, retrieve the HBIN attribute from CP_All_Dies(CP_COORD).

[0085] PF = CP_All_Dies(CP_COORD).PF: Retrieves the PF attribute from CP_All_Dies(CP_COORD). PF may be a boolean value or other data types.

[0086] The termination condition is that if the CP_All_Dies dictionary contains the key CP_COORD (i.e., coordinates), then the above code will be executed, and the Die_Info object will be added to the My_Die_Result_List.

[0087] Specifically, it checks whether the dictionary CP_All_Dies contains a specific coordinate CP_COORD. If it does, a new Die_Info object is created, and various information related to that coordinate (such as coordinate value, SBIN, HBIN, PF) is populated into the object. Then, the object is added to the My_Die_Result_List.

[0088] The packaging plant logs can be automatically parsed, supporting ASM logs. It can parse ASM log files (Besi format), automatically identify the die mapping relationship, and complete the mapping between FabWafer and CP Waferd in combination with the user configuration file (Lot matching file).

[0089] The specific implementation code is as follows: ASM log parsing function Function Read_ASM_Log() As Boolean ... End Function The `Function Read_ASM_Log() As Boolean` is a function defined in VB.NET. Its name indicates that it reads ASM format log files. The function returns a boolean value, typically indicating whether the log read operation was successful. The specific implementation is defined in the function body.

[0090] The grain arrangement rules include the grain arrangement order, spacing, and orientation.

[0091] Dynamic coordinate transformation algorithm: affine transformation and quadrant flipping: A general mapping model based on affine transformation is proposed, which is compatible with different recombination rules (such as grain rotation) and improves the adaptability of the algorithm.

[0092] Code reference: 'Direction transformation implementation' Function Rotate_Wafer_Map(Dies As Dictionary(Of COOR, RESULT),Rotate_Degree As Integer) As Dictionary(Of COOR, RESULT) ... End Function The function `Dies As Dictionary(Of COOR, RESULT)` takes a dictionary as its first argument. The keys are of type `COOR`, and the values ​​are of type `RESULT`. `COOR` is likely a structure or class representing coordinates (e.g., positions on a wafer). `RESULT` represents the results associated with each coordinate, containing some data or measurements.

[0093] `otate_Degree As Integer`: This is the second parameter of the function, representing the rotation angle, passed in as an integer. For example, it could be 90, 180, 270, etc.

[0094] Rotating coordinate graphs typically involves geometric transformations. Specifically, rotating a point (x, y) can be achieved using the following formula (assuming the origin (0, 0) is the center of rotation): Rotate 90 degrees: (x', y') = (-y, x) Rotate 180 degrees: (x', y') = (-x, -y) Rotate 270 degrees: (x', y') = (y, -x) Rotate 360 ​​degrees: (x', y') = (x, y) (unchanged) These formulas can be flexibly adjusted according to the rotation angle, and may involve some matrix transformations or more complex calculations. The specific implementation depends on the value of Rotate_Degree.

[0095] The function Rotate_Wafer_Map is a function that takes a wafer coordinate map (a dictionary of dictionaries) and a rotation angle (Rotate_Degree) as input. It returns a new dictionary that stores the rotated coordinates and their corresponding results by performing a geometric rotation transformation on each coordinate.

[0096] The `As Dictionary(Of COOR, RESULT)` function returns a dictionary with keys of type `COOR` and values ​​of type `RESULT`. The return value is a rotated wafer coordinate graph.

[0097] Regarding affine transformation and quadrant flipping, a general mapping model based on affine transformation is proposed, which is compatible with different recombination rules (such as grain rotation) and improves the adaptability of the algorithm.

[0098] This dynamic coordinate transformation algorithm supports multi-angle rotation (0° / 90° / 180° / 270°) and quadrant flipping, adapting to various wafer reassembly processes. It dynamically calculates boundaries based on the maximum / minimum X / Y coordinates, avoiding mapping offsets caused by a fixed origin.

[0099] The rotation function supports parameterized configuration, allowing users to set the rotation angle and origin offset via an interface, thereby adapting to various advanced packaging technologies such as Fan-Out WLP and RDL.

[0100] The quadrant flipping function can automatically identify the coordinate system direction based on the packaging plant logs and perform the corresponding up / down or left / right flipping operation.

[0101] The results output module generates a standard file of the original wafer map, containing the fields: original WaferID, X, Y, BIN value, and Pass / Fail.

[0102] Excel visualization: This involves using VB.NET's Excel manipulation library (such as Microsoft.Office.Interop.Excel) to generate a two-dimensional heatmap, annotating defect distribution and yield statistics. For example... Figure 3 As shown.

[0103] Code implementation: Export as a standard TXT file Dim Map_str As New Text.StringBuilder For each Die in All_Dies Map_str.Append(Format_Wmap(Die.Key.X, Die.Key.Y, Die.Value.SBIN,Die.Value.HBIN, Die.Value.SITE, If(Die.Value.PF = True, 0, 1))&vbCrLf) Next File.WriteAllText(Output_File, Map_str.ToString) A second aspect of the present invention provides an alignment system 40 for wafer reassembly, such as... Figure 4 As shown, it includes: a first acquisition module 401, used to traverse all dies of the corresponding wafer, and store the coordinates of the dies and the test results into a data mapping unit. The data mapping unit includes first data and second data, wherein the coordinates of each die are used as the first data, and the test results of the die are used as the second data.

[0104] The second acquisition module 402 is used to acquire relevant data of the wafer before and after the assembly of the die to be assembled. The parsing module 403 is used to parse the relevant data of the wafer into third data. The alignment module 404 is used to align the die positions on the wafer according to the first data, the second data, and the third data.

[0105] According to one embodiment of the present invention, the relevant data of the wafer includes: a unique wafer identifier, a spatial coordinate correspondence, and a grain arrangement rule, wherein the spatial coordinate correspondence includes the correspondence between the original wafer coordinates and the reconstructed wafer coordinates.

[0106] According to one embodiment of the present invention, the parsing module includes: an extraction unit for extracting the correspondence between the original wafer coordinates and the reconstructed wafer coordinates; and a storage unit for storing the mapping relationship between the original wafer coordinates and the reconstructed wafer coordinates as third data.

[0107] According to an embodiment of the present invention, the alignment module includes: a mapping unit, configured to determine the mapping relationship between the first data, the second data, and the third data based on the mapping relationship of the data mapping unit; and an output unit, configured to output fourth data based on the first data and the mapping relationship between the first data, the second data, and the third data.

[0108] Alignment unit, used to determine the grain position of the wafer based on the fourth data.

[0109] According to one embodiment of the present invention, the grain arrangement rule includes: the arrangement order, spacing and orientation of the grains.

[0110] According to one embodiment of the present invention, the output fourth data includes: a two-dimensional thermal map of the original wafer, a distribution of the classification codes for the grain test results, and a yield rate statistical chart.

[0111] A third aspect of the present invention provides an intelligent device, comprising: a transmitter, a receiver, a memory, and a processor. The memory stores computer instructions; the processor executes the computer instructions stored in the memory to implement the aforementioned alignment method before and after wafer reassembly.

[0112] A fourth aspect of the present invention provides a storage medium comprising: a readable storage medium and computer instructions, wherein the computer instructions are stored in the readable storage medium; the computer instructions are used to implement the above-described alignment method before and after wafer reassembly. The beneficial effects provided by this invention are as follows: First, by restoring the defect distribution pattern of the original map (such as edge ring defects), process anomalies in the manufacturing process (such as lithography machine alignment deviations) can be accurately located; second, the influence of the recombination process and the manufacturing process is separated, the grain screening rules are optimized, and the risk of later failure caused by original defects is reduced; third, automated processing replaces manual matching, reducing processing time from hours to minutes, and interactive operation is provided through a WinForm interface, greatly improving efficiency; finally, data is output in standard TXT files and Excel charts, seamlessly connecting with existing data analysis tools (such as JMP and Excel), reducing manual processing costs.

[0113] Obviously, the above specific implementation examples are merely illustrative of the application of this method and not intended to limit the implementation. Those skilled in the art can make other variations and modifications based on the above description to study other related issues. Therefore, the scope of protection of this invention should be limited to the scope of the claims.

[0114] Those skilled in the art will understand that all or part of the steps of the above method embodiments can be implemented by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When the program is executed, it performs the steps of the above method embodiments. The aforementioned storage medium includes various media that can store program code, such as ROM, RAM, magnetic disk, or optical disk.

[0115] The electronic devices and other embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0116] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus necessary general-purpose hardware platforms, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solutions, in essence or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods described in the various embodiments or some parts of the embodiments.

[0117] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present invention, and are not intended to limit them. Although the embodiments of the present invention have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

[0118] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This invention is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0119] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A method for alignment before and after wafer reassembly, characterized in that, The method includes: S1: Traverse all the dies of the corresponding wafer, and store the coordinates and test results of the dies into the data mapping unit. The data mapping unit includes first data and second data, wherein the coordinates of each die are used as the first data and the test results of the die are used as the second data. S2: Obtain relevant data on the wafer before and after assembly; S3: The relevant data of the wafer is analyzed as third data; S4: Align the grain positions on the wafer according to the first data, the second data, and the third data.

2. The method according to claim 1, characterized in that, The relevant data of the wafer to be assembled before and after assembly in S2 include: wafer unique identifier, spatial coordinate correspondence and grain arrangement rules, wherein the spatial coordinate correspondence includes the correspondence between the original wafer coordinates and the reassembled wafer coordinates.

3. The method according to claim 2, characterized in that, The relevant data of the wafer parsed in S3 is third data, including: Extract the correspondence between the original wafer coordinates and the reconstructed wafer coordinates, and store the correspondence in the data mapping unit as third data.

4. The method according to claim 3, characterized in that, The step S4, which aligns the grain positions on the wafer based on the first data, the second data, and the third data, includes: Based on the mapping relationship of the data mapping unit, determine the mapping relationship between the first data, the second data, and the third data; based on the mapping relationship between the first data, the second data, and the third data, output the fourth data; and based on the fourth data, determine the die position of the wafer.

5. The method according to claim 2, characterized in that, The grain arrangement rules include the grain arrangement order, spacing, and orientation.

6. The method according to claim 4, characterized in that, The output of the fourth data includes: a two-dimensional thermal map of the original wafer, a distribution of the classification codes for the grain test results, and a yield rate statistical chart.

7. A wafer alignment system before and after reassembly, characterized in that, The system includes: The first acquisition module is used to traverse all the dies of the corresponding wafer and store the coordinates and test results of the dies into the data mapping unit. The data mapping unit includes first data and second data, wherein the coordinates of each die are used as the first data and the test results of the die are used as the second data. The second acquisition module is used to acquire relevant data of the wafer to be assembled before and after assembly. The parsing module is used to parse the relevant data of the wafer into third data; The alignment module is used to align the positions of the grains on the wafer according to the first data, the second data, and the third data.

8. The system according to claim 7, characterized in that... The alignment module includes: A mapping unit is used to determine the mapping relationship between the first data, the second data, and the third data according to the mapping relationship of the data mapping unit; The output unit is used to output fourth data based on the first data and the mapping relationship between the first data, the second data, and the third data; Alignment unit, used to determine the grain position of the wafer based on the fourth data.

9. A smart device, characterized in that, include: Transmitter, receiver, memory, and processor; The memory is used to store computer instructions; The processor is used to execute the computer instructions stored in the memory to implement the alignment method before and after wafer reassembly as described in any one of claims 1 to 6.

10. A storage medium, characterized in that, include: A readable storage medium and computer instructions, wherein the computer instructions are stored in the readable storage medium; The computer instructions are used to implement the alignment method before and after wafer reassembly as described in any one of claims 1 to 6.

Images