Chip taking and mounting device and die bonding equipment

Abstract

This invention relates to a chip pick-and-place apparatus and a die bonding device. The chip pick-and-place apparatus includes a y-axis moving module, an x-axis moving module, and a z-axis moving module installed sequentially. The y-axis moving module drives the x-axis moving module and the z-axis moving module to move along the y-axis. The x-axis moving module includes a left x-axis transmission assembly and a right x-axis transmission assembly arranged adjacent to each other. The left x-axis guide rail is mounted on the left x-axis transmission seat along the x-axis direction, and the left x-axis transmission block is slidably disposed on the left x-axis guide rail. The right x-axis guide rail is mounted on the right x-axis transmission seat along the x-axis direction, and the right x-axis transmission block is slidably disposed on the right x-axis guide rail. The adjacent ends of the left x-axis transmission seat and the right x-axis transmission seat are staggered and at least partially overlap in the z-axis direction. The left x-axis transmission seat and the right x-axis transmission seat can slide relative to each other in the y-axis direction. The adjacent ends of the left x-axis guide rail and the right x-axis guide rail are staggered and at least partially overlap in the z-axis direction.

Description

Technical Field

[0001] This invention relates to the field of chip pick-and-place technology, and particularly to a chip pick-and-place apparatus and die bonding equipment. Background Technology

[0002] The die bonding process refers to a process in which a chip is bonded to a designated area on a substrate using an adhesive to form a pathway or point pathway, providing conditions for subsequent wire bonding. When performing this process, die bonding equipment usually uses a chip pick-and-place device. The first nozzle of the device can pick up and place the chip from the wafer onto the transfer station, and the second nozzle can remove the chip stored on the transfer station and place it onto the substrate.

[0003] However, the first and second binding heads involve frequent acceleration and deceleration movements during movement, material picking, and placement. The constant changes in acceleration can cause vibration in the device, leading to mutual interference between the material picking and placement processes, poor placement efficiency, and difficulty in meeting the high precision requirements of chip placement. Summary of the Invention

[0004] To address the technical problem of mutual interference between the picking and placing processes in existing chip picking and placing devices, which affects placing efficiency and accuracy, this invention provides a chip picking and placing device and a die bonding equipment.

[0005] The present invention provides a chip pick-and-place device, comprising a y-axis moving module, an x-axis moving module, and a z-axis moving module installed sequentially. The y-axis moving module drives the x-axis moving module and the z-axis moving module to move along the y-axis. The x-axis moving module includes a left x-axis transmission assembly and a right x-axis transmission assembly arranged adjacent to each other. The left x-axis transmission assembly includes a left x-axis transmission seat, a left x-axis guide rail, and a left x-axis transmission block. The left x-axis guide rail is mounted on the left x-axis transmission seat along the x-axis direction, and the left x-axis transmission block is slidably disposed on the left x-axis. The guide rail; the right x-axis transmission assembly includes a right x-axis transmission seat, a right x-axis guide rail, and a right x-axis transmission block. The right x-axis guide rail is mounted on the right x-axis transmission seat along the x-axis direction, and the right x-axis transmission block is slidably disposed on the right x-axis guide rail. The left x-axis transmission seat and the right x-axis transmission seat are staggered at their adjacent ends and at least partially overlap in the z-axis direction. The left x-axis transmission seat and the right x-axis transmission seat can slide relative to each other in the y-axis direction. The left x-axis guide rail and the right x-axis guide rail are staggered at their adjacent ends and at least partially overlap in the z-axis direction.

[0006] The x-axis moving module also includes an x-axis driving component, which is spaced apart from and parallel to the left x-axis transmission component and the right x-axis transmission component;

[0007] The x-axis drive assembly includes an x-axis motor and a motor base. The x-axis motor is mounted on the motor base, and the motor base is connected to the y-axis moving module. The x-axis motor includes an x-axis stator, a left x-axis mover, and a right x-axis mover. The transmission ends of the left x-axis mover and the right x-axis mover are both connected to the x-axis stator, and the working ends of the left x-axis mover and the right x-axis mover are both connected to the z-axis moving module.

[0008] The z-axis movement module includes a left z-axis transmission assembly, a left z-axis drive assembly, a right z-axis transmission assembly, and a right z-axis drive assembly.

[0009] The left Z-axis transmission assembly includes a left Z-axis transmission seat and a first magnetic spring structure. One side of the left Z-axis transmission seat is connected to the left X-axis transmission block, and the other side is connected to the left Z-axis drive assembly. The first magnetic spring structure is disposed on the left Z-axis transmission seat on the side away from the left X-axis transmission block.

[0010] The right Z-axis transmission assembly includes a right Z-axis transmission seat and a second magnetic spring structure. One side of the right Z-axis transmission seat is connected to the right X-axis transmission block, and the other side is connected to the right Z-axis drive assembly. The second magnetic spring structure is disposed on the side of the right Z-axis transmission seat away from the right X-axis transmission block.

[0011] The chip picking and mounting device also includes a left binding head mechanism and a right binding head mechanism;

[0012] The left binding head mechanism is connected to the working end of the left Z-axis transmission block and the first magnetic spring structure respectively. When the left Z-axis transmission block slides relative to the left Z-axis guide rail, the left binding head mechanism moves synchronously. The first magnetic spring structure is used to balance the load of the left Z-axis transmission seat, the left Z-axis drive assembly and the left binding head mechanism.

[0013] The right binding head mechanism is connected to the working end of the right Z-axis transmission block and the second magnetic spring structure respectively. When the right Z-axis transmission block slides relative to the right Z-axis guide rail, the right binding head mechanism moves synchronously. The second magnetic spring structure is used to balance the load of the right Z-axis transmission seat, the right Z-axis drive assembly and the right binding head mechanism.

[0014] Preferably, the left Z-axis drive assembly includes a left Z-axis guide rail and a left Z-axis transmission block. The left Z-axis guide rail is mounted on the left Z-axis transmission seat along the Z-axis direction, and the left Z-axis transmission block is slidably disposed on the left Z-axis guide rail. The working end of the left X-axis mover is connected to the top surface of the left Z-axis transmission seat, and both the left Z-axis guide rail and the left Z-axis transmission block are disposed away from the first magnetic spring structure. The right Z-axis drive assembly includes a right Z-axis guide rail and a right Z-axis transmission block. The right Z-axis guide rail is mounted on the right Z-axis transmission seat along the Z-axis direction, and the right Z-axis transmission block is slidably disposed on the right Z-axis guide rail. The working end of the right X-axis mover is connected to the top surface of the right Z-axis transmission seat, and both the right Z-axis guide rail and the right Z-axis transmission block are disposed away from the second magnetic spring structure.

[0015] Preferably, the left Z-axis drive assembly further includes a left Z-axis motor, which is mounted in the middle of the left Z-axis transmission seat. The left Z-axis motor is used to drive the left Z-axis transmission block to slide relative to the left Z-axis guide rail in the Z-axis direction. There are two left Z-axis guide rails, which are respectively located on both sides of the left Z-axis motor. There are at least two left Z-axis transmission blocks. The right Z-axis drive assembly further includes a right Z-axis motor, which is mounted in the middle of the right Z-axis transmission seat. The right Z-axis motor is used to drive the right Z-axis transmission block to slide relative to the right Z-axis guide rail in the Z-axis direction. There are two right Z-axis guide rails, which are respectively located on both sides of the right Z-axis motor. There are at least two right Z-axis transmission blocks.

[0016] Preferably, the z-axis movement module further includes a z-axis motion assembly, which includes a z-axis motor and a motor housing. The z-axis motor includes a z-axis stator, a left z-axis mover, and a right z-axis mover. The left and right z-axis movers can slide relative to the z-axis stator in the z-axis direction. The z-axis stator is installed inside the motor housing. The transmission ends of the left and right z-axis movers are respectively connected to the z-axis stator. The working ends of the left and right z-axis movers are exposed outside the motor housing. The working end of the left z-axis mover is connected to the top surface of the left binding mechanism, and the working end of the right z-axis mover is connected to the top surface of the right binding mechanism. The motor housing is connected to the y-axis movement module to restrict the relative sliding of the left x-axis transmission seat and the right x-axis transmission seat in the y-axis direction.

[0017] Preferably, the y-axis movement module includes a left y-axis drive assembly, a right y-axis drive assembly, a device base, and a left fixing block and a right fixing block mounted on both sides of the device base. The left y-axis drive assembly and the right y-axis drive assembly are disposed adjacent to each other on the device base between the left fixing block and the right fixing block. The side of the left fixing block and the right fixing block away from the device base is connected to the motor base. The left y-axis drive assembly includes a left y-axis guide rail and a left y-axis motor. The left x-axis transmission seat is slidably disposed on the left y-axis guide rail, and the left y-axis motor can drive the left x-axis transmission seat to slide along the y-axis. The right y-axis drive assembly includes a right y-axis guide rail and a right y-axis motor. The right x-axis transmission seat is slidably disposed on the right y-axis guide rail, and the right y-axis motor can drive the right x-axis transmission seat to slide along the y-axis.

[0018] Preferably, the x-axis movement module further includes an x-axis grating assembly disposed on the left x-axis drive seat and the right x-axis drive seat. The x-axis grating assembly can be used to determine the relative positions between the left x-axis guide rail and the left x-axis drive block, between the right x-axis guide rail and the right x-axis drive block, and / or between the left x-axis drive block and the right x-axis drive block; the z-axis movement module further includes a z-axis grating assembly disposed on the left z-axis drive seat and the right z-axis drive seat. The z-axis grating assembly can be used to determine the relative positions between the left x-axis guide rail and the left x-axis drive block, between the right x-axis guide rail and the right x-axis drive block, and / or between the left x-axis drive block and the right x-axis drive block. The relative positions between the left Z-axis guide rail and the left Z-axis transmission block, between the right Z-axis guide rail and the right Z-axis transmission block, and / or between the left Z-axis transmission block and the right Z-axis transmission block are determined; the Y-axis moving module further includes a Y-axis grating assembly disposed on the device base, the Y-axis grating assembly being used to determine the relative positions between the left Y-axis guide rail and the left X-axis transmission seat, between the right Y-axis guide rail and the right X-axis transmission seat, and / or between the left X-axis transmission seat and the right X-axis transmission seat.

[0019] The present invention also provides a die bonding device, which includes the chip pick-and-place device described above.

[0020] Compared with the prior art, the chip pick-and-place apparatus and die bonding equipment provided by the present invention have the following advantages:

[0021] 1. This invention provides a chip picking and mounting device for picking up chips and mounting them onto a substrate. The chip picking and mounting device includes a Y-axis moving module, an X-axis moving module, and a Z-axis moving module installed sequentially. The Y-axis moving module can drive the X-axis moving module and the Z-axis moving module to move along the Y-axis. The X-axis moving module includes a left X-axis transmission assembly and a right X-axis transmission assembly. The adjacent left and right X-axis transmission assemblies can make the chip picking process and the mounting process independent of each other. The left X-axis guide rail is installed on the left X-axis transmission seat along the X-axis direction, and the left X-axis transmission block is slidably disposed on the left X-axis guide rail. The right X-axis guide rail is installed on the right X-axis transmission seat along the X-axis direction, and the right X-axis transmission block is slidably disposed on the right X-axis guide rail. The left X-axis guide rail and the right X-axis transmission seat are connected to the left X-axis guide rail. The staggered arrangement of adjacent ends of the right x-axis guide rails avoids mutual interference between the chip picking and placement processes, ensuring transmission stability and accuracy. The staggered arrangement of adjacent ends of the left and right x-axis drive seats, along with their relative sliding in the y-axis direction, enhances the movement flexibility of the chip picking and placement device in the xy-plane and expands its coverage area for chip picking and placement. The at least partial overlap in the z-axis direction between adjacent ends of the left and right x-axis drive seats and between adjacent ends of the left and right x-axis guide rails effectively reduces the overall space occupied by the chip picking and placement device in the x-axis direction while ensuring the x-axis transmission stroke, achieving a compact structure and miniaturized design.

[0022] 2. In the chip pick-and-place device provided in this embodiment of the invention, the x-axis drive component and the left x-axis transmission component are spaced apart and arranged in parallel, which can avoid interference between the x-axis drive component and the left x-axis transmission component. The x-axis drive component and the right x-axis transmission component are spaced apart and arranged in parallel, which can also avoid interference between the x-axis drive component and the right x-axis transmission component. The x-axis motor drives the z-axis moving module through the working ends of the left x-axis mover and the right x-axis mover, which improves the transmission stability in the x-axis direction and further ensures the placement accuracy.

[0023] 3. In the chip pick-and-place device provided in this embodiment of the invention, the z-axis moving module is divided into left and right independent transmission and drive components, namely the left z-axis transmission component and the left z-axis drive component, and the right z-axis transmission component and the right z-axis drive component, which can be operated simultaneously or separately, thereby improving the efficiency of the pick-and-place process; the working ends of the left x-axis mover and the right x-axis mover are connected to the z-axis moving module, wherein one side of the left z-axis transmission seat is connected to the left x-axis transmission block and the other side is connected to the left z-axis drive component, and one side of the right z-axis transmission seat is connected to the right x-axis transmission block and the other side is connected to the right z-axis drive component, so that the x-axis moving module can drive the z-axis moving module to move along the x-axis; the first magnetic spring structure and the second magnetic spring structure can balance the load of the z-axis direction transmission, reduce the drive load in the z-axis direction, and improve the movement stability of the z-axis moving module.

[0024] 4. In the chip pick-and-place device provided in this embodiment of the invention, the left Z-axis drive seat, left Z-axis guide rail, and left Z-axis drive block are installed sequentially, and the right Z-axis drive seat, right Z-axis guide rail, and right Z-axis drive block are arranged sequentially, which can ensure the smoothness of linear sliding in the Z-axis direction; the working end of the left X-axis mover is connected to the top surface of the left Z-axis drive seat, and the working end of the right X-axis mover is connected to the top surface of the right Z-axis drive seat. By driving the top surfaces of the left and right Z-axis drive seats through the X-axis motor, the transmission force can be more uniform, improving the linear accuracy of the Z-axis moving module in the X-axis direction; the left Z-axis guide rail and left Z-axis drive block are both located in a first magnetic spring structure, and the right Z-axis guide rail and right Z-axis drive block are both located in a second magnetic spring structure, which can avoid mutual interference between transmission components and ensure the reasonable assembly of the Z-axis moving module.

[0025] 5. In the chip picking and mounting device provided in this embodiment of the invention, the left binding head mechanism is connected to the working end of the first magnetic spring structure, and the right binding head mechanism is connected to the working end of the second magnetic spring structure. By setting the first magnetic spring structure and the second magnetic spring structure, a certain buffer can be provided for the movement of the left binding head mechanism and the right binding head mechanism in the z-axis direction, thereby avoiding the situation where the left binding head mechanism and the right binding head mechanism cause over-pressure damage to the chip during picking and under-pressure during mounting, resulting in poor bonding. It also limits the z-axis movement stroke of the left binding head mechanism and the right binding head mechanism, and further plays a precise guiding role in the chip picking and mounting process in the z-axis direction, avoiding excessive sliding of the left binding head mechanism and the right binding head mechanism in the z-axis direction to protect the chip and the substrate.

[0026] Furthermore, the left binding head mechanism is connected to both the working end of the first magnetic spring structure and the working end of the left Z-axis transmission block. When the left Z-axis transmission block slides relative to the left Z-axis guide rail, the left binding head mechanism moves synchronously. The synergistic effect of the first magnetic spring structure and the left Z-axis transmission block provides guidance for the left binding head mechanism in the Z-axis direction. The right binding head mechanism is connected to both the working end of the second magnetic spring structure and the working end of the right Z-axis transmission block. When the right Z-axis transmission block slides relative to the right Z-axis guide rail, the right binding head mechanism moves synchronously. The synergistic effect of the second magnetic spring structure and the right Z-axis transmission block provides guidance for the right binding head mechanism in the Z-axis direction. This design avoids horizontal offset of the left and right binding head mechanisms during Z-axis movement, preventing them from shaking during movement, thereby improving the placement efficiency and accuracy of the chip pick-and-place device.

[0027] It should be noted that the first magnetic spring structure can drive the left binding head mechanism to elastically reset in the Z-axis direction, balancing the load of the left Z-axis transmission seat, the left Z-axis drive assembly, and the left binding head mechanism. The second magnetic spring structure can drive the right binding head mechanism to elastically reset in the Z-axis direction, balancing the load of the right Z-axis transmission seat, the right Z-axis drive assembly, and the right binding head mechanism. The first and second magnetic spring structures can reduce the influence of the gravity of each component of the chip pick-up and placement device on the picking and placement pressure, ensuring the high precision requirements of the chip placement force.

[0028] 6. In the chip pick-and-place device provided in this embodiment of the invention, as one implementation, the left Z-axis motor is located in the middle of the left Z-axis transmission seat, and two left Z-axis guide rails are respectively located on both sides of the left Z-axis motor. The right Z-axis motor is located in the middle of the right Z-axis transmission seat, and two right Z-axis guide rails are respectively located on both sides of the right Z-axis motor. Through this design, the transmission force of the left and right binding mechanisms in the Z-axis direction can be symmetrical, reducing the influence of off-center load. The left Z-axis motor has one left Z-axis guide rail on each side, and the right Z-axis motor has one right Z-axis guide rail on each side, which can improve the guiding accuracy of the left and right binding mechanisms in the Z-axis direction. The number of left and right Z-axis transmission blocks is at least two. By setting multiple transmission blocks, the load-bearing capacity of the Z-axis moving module can be enhanced, ensuring the operational stability of the left and right binding mechanisms.

[0029] 7. In another embodiment of the chip pick-and-place device provided by this invention, the Z-axis motion assembly includes a Z-axis motor and a motor housing. The Z-axis motor includes a Z-axis stator, a left Z-axis mover, and a right Z-axis mover. The Z-axis stator is located inside the motor housing. The working end of the left Z-axis mover is connected to the top surface of the left binding head mechanism, and the working end of the right Z-axis mover is connected to the top surface of the right binding head mechanism. The left and right Z-axis movers can slide relative to the Z-axis stator in the Z-axis direction, allowing the left and right binding head mechanisms to slide. It can move independently in the z-axis direction; the z-axis stator is installed inside the motor housing, and the top surfaces of the z-axis stator, the left z-axis mover, and the left binding head mechanism are connected in sequence, as are the top surfaces of the z-axis stator, the right z-axis mover, and the right binding head mechanism. Therefore, when the motor housing is connected and fixed to the y-axis moving module, the sliding of the left x-axis drive seat and the right x-axis drive seat in the y-axis direction will be restricted. This design can improve the speed at which the chip picking and mounting device completes the picking and mounting steps, thereby improving the working efficiency of the device.

[0030] 8. In the chip pick-and-place apparatus provided in the embodiments of the present invention, on the one hand, when the left x-axis drive seat and the right x-axis drive seat are restricted to slide relative to each other in the y-axis direction by the z-axis motion component on the z-axis moving module, the left y-axis drive component or the right y-axis drive component can drive the left x-axis drive seat and the right x-axis drive seat individually or jointly; on the other hand, when the left x-axis drive seat and the right x-axis drive seat are driven independently by the left z-axis drive component and the right z-axis drive component respectively, the left x-axis drive seat and the right x-axis drive seat can move independently in the y-axis direction. Through this design, it can adapt to the placement requirements in various application scenarios.

[0031] It should be noted that the left and right y-axis drive components are mounted on the device base and the left and right fixing blocks on both sides, which makes the structure stable and can significantly improve the load-bearing capacity and stability of the y-axis moving module driving the x-axis moving module and z-axis moving module to move along the y-axis.

[0032] 9. In the chip pick-and-place device provided in the embodiments of the present invention, by setting the x-axis grating assembly on the left x-axis transmission seat and the right x-axis transmission seat, setting the y-axis grating assembly on the device base, and setting the z-axis grating assembly on the left z-axis transmission seat and the right z-axis transmission seat, the relative position of each axis transmission component can be detected in real time, achieving high-precision positioning feedback, significantly improving the positioning accuracy of the independent movement of the x, y, and z axes, and ensuring the accuracy of the chip pick-and-place process.

[0033] Understandably, since the left x-axis guide rail is mounted on the left x-axis drive seat along the x-axis direction, and the left x-axis drive block is slidably mounted on the left x-axis guide rail, and the right x-axis guide rail is mounted on the right x-axis drive seat along the x-axis direction, and the right x-axis drive block is slidably mounted on the right x-axis guide rail, and the left x-axis guide rail is stationary relative to the left x-axis drive block, and the right x-axis guide rail is stationary relative to the right x-axis drive block, the x-axis grating assembly can be used to determine the position of the left x-axis drive block, the position of the right x-axis drive block, and / or the relative position between the left x-axis drive block and the right x-axis drive block; similarly... It is known that the left y-axis guide rail is stationary relative to the left x-axis drive seat, and the right y-axis guide rail is stationary relative to the right x-axis drive seat. The y-axis grating assembly can be used to determine the position of the left x-axis drive seat, the position of the right x-axis drive seat, and / or the relative position between the left x-axis drive seat and the right x-axis drive seat. The left z-axis guide rail is stationary relative to the left z-axis drive block, and the right z-axis guide rail is stationary relative to the right z-axis drive block. Therefore, the z-axis grating assembly can be used to determine the position of the left z-axis drive block, the position of the right z-axis drive block, and / or the relative position between the left z-axis drive block and the right z-axis drive block.

[0034] 10. This embodiment of the invention also provides a die bonding apparatus, including the chip pick-and-place device described above. It should be noted that this die bonding apparatus has the same beneficial effects as the chip pick-and-place device described above, and will not be elaborated upon here. Attached Figure Description

[0035] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0036] Figure 1 This is a schematic diagram of the overall structure of the chip picking and mounting device according to an embodiment of the present invention.

[0037] Figure 2 The overall structure of the chip picking and mounting device in this embodiment of the invention explodes. Figure 1 .

[0038] Figure 3 This is a schematic diagram of the structure of the left x-axis drive seat and the right x-axis drive seat of the chip picking and mounting device according to an embodiment of the present invention.

[0039] Figure 4 The overall structure of the chip picking and mounting device in this embodiment of the invention explodes. Figure 2 .

[0040] Figure 5 This is a cross-sectional view of the chip pick-and-place apparatus according to an embodiment of the present invention. Figure 1 .

[0041] Figure 6 This is a cross-sectional view of the chip pick-and-place apparatus according to an embodiment of the present invention. Figure 2 .

[0042] Figure 7 This is a schematic diagram of the overall framework of the die bonding device according to an embodiment of the present invention.

[0043] Explanation of reference numerals in the attached diagram:

[0044] 10. Chip pick-and-place device; 20. Die bonding equipment;

[0045] 1. X-axis moving module; 11. Left X-axis transmission assembly; 111. Left X-axis transmission seat; 112. Left X-axis guide rail; 113. Left X-axis transmission block; 12. Right X-axis transmission assembly; 121. Right X-axis transmission seat; 122. Right X-axis guide rail; 123. Right X-axis transmission block; 13. X-axis drive assembly; 131. X-axis motor; 1311. X-axis stator; 1312. Left X-axis mover; 1313. Right X-axis mover; 132. Motor base; 14. X-axis grating assembly;

[0046] 2. Y-axis moving module; 21. Left Y-axis drive assembly; 211. Left Y-axis guide rail; 212. Left Y-axis motor; 22. Right Y-axis drive assembly; 221. Right Y-axis guide rail; 222. Right Y-axis motor; 23. Device base; 24. Left fixing block; 25. Right fixing block; 26. Y-axis grating assembly;

[0047] 3. Z-axis moving module; 31. Left Z-axis transmission assembly; 311. Left Z-axis transmission seat; 312. First magnetic spring structure; 3121. First magnetic shaft; 3122. First magnetic sleeve; 32. Left Z-axis drive assembly; 321. Left Z-axis guide rail; 322. Left Z-axis transmission block; 323. Left Z-axis motor; 33. Right Z-axis transmission assembly; 331. Right Z-axis transmission seat; 332. Second magnetic spring structure; 3321. Second magnetic shaft; 3322. Second magnetic sleeve; 34. Right Z-axis drive assembly; 341. Right Z-axis guide rail; 342. Right Z-axis transmission block; 343. Right Z-axis motor; 35. Z-axis motion assembly; 351. Z-axis motor; 3511. Z-axis stator; 3512. Left Z-axis mover; 3513. Right Z-axis mover; 352. Motor housing; 36. Z-axis grating assembly;

[0048] 4. Left head binding mechanism; 5. Right head binding mechanism. Detailed Implementation

[0049] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. In the embodiments provided by this invention, it should be understood that "B corresponding to A" means that B is associated with A, and B can be determined based on A. However, it should also be understood that determining B based on A does not mean determining B solely based on A; B can also be determined based on A and / or other information. It should be understood that "an embodiment" or "one embodiment" mentioned throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of the invention. Therefore, "in one embodiment" or "in one embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Those skilled in the art should also understand that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily essential to the invention. In the various embodiments of this invention, it should be understood that the sequence number of the above processes does not necessarily imply a necessary order of execution; the execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this invention. The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, or they may sometimes be executed in reverse order, depending on the functions involved. It is particularly important to note that each block in a block diagram and / or flowchart, and combinations of blocks in block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0050] Please see Figure 1 , Figure 2 and Figure 3This invention provides a chip pick-and-place device 10 for picking up chips and placing them onto a substrate. The chip pick-and-place device 10 includes a y-axis moving module 2, an x-axis moving module 1, and a z-axis moving module 3 installed sequentially. The y-axis moving module 2 drives the x-axis moving module 1 and the z-axis moving module 3 to move along the y-axis. The x-axis moving module 1 includes a left x-axis transmission assembly 11 and a right x-axis transmission assembly 12 arranged adjacent to each other. The left x-axis transmission assembly 11 includes a left x-axis transmission seat 111, a left x-axis guide rail 112, and a left x-axis transmission block 113. The left x-axis guide rail 112 is installed on the left x-axis transmission seat 111 along the x-axis direction, and the left x-axis transmission block 113 is slidable. The left x-axis drive assembly 12 is mounted on the left x-axis guide rail 112. The right x-axis drive assembly 12 includes a right x-axis drive seat 121, a right x-axis guide rail 122, and a right x-axis drive block 123. The right x-axis guide rail 122 is mounted on the right x-axis drive seat 121 along the x-axis direction, and the right x-axis drive block 123 is slidably mounted on the right x-axis guide rail 122. The left x-axis drive seat 111 and the right x-axis drive seat 121 are staggered at their adjacent ends and at least partially overlap in the z-axis direction. The left x-axis drive seat 111 and the right x-axis drive seat 121 can slide relative to each other in the y-axis direction. The left x-axis guide rail 112 and the right x-axis guide rail 122 are staggered at their adjacent ends and at least partially overlap in the z-axis direction.

[0051] The chip pick-and-place apparatus 10 provided by this invention can be used for picking up, transferring, and placing chips in the automated placement process of the semiconductor industry. The chip pick-and-place apparatus 10 has a left binding head mechanism 4 and a right binding head mechanism 5. The nozzle of the right binding head mechanism 5 can pick up and place chips from the wafer onto the transfer station, while the nozzle of the left binding head mechanism 4 can remove chips stored on the transfer station and place them onto the substrate. The chip pick-and-place apparatus 10 is applied in applications requiring high-precision chip placement. When picking up and adsorbing chips, it can expose the features that need to be identified. During chip placement, it enables real-time alignment and placement of the chip's upper surface and the identification points at the placement position.

[0052] Specifically, the device comprises a y-axis moving module 2, an x-axis moving module 1, and a z-axis moving module 3. The y-axis moving module 2 serves as the support base for the chip pick-and-place device 10 and can drive the x-axis moving module 1 and the z-axis moving module 3 to move as a whole along the y-axis. The x-axis moving module 1 is mounted above the y-axis moving module 2 and can drive the z-axis moving module 3 to move along the x-axis. The z-axis moving module 3 is mounted on the side of the x-axis moving module 1 and can drive the left binding head mechanism 4 and the right binding head mechanism 5 on the chip pick-and-place device 10 to move independently along the z-axis. The working ends of the left binding head mechanism 4 and the right binding head mechanism 5 have interchangeable vacuum nozzles of the same specifications, which are used to pick up different types of chips. The vacuum nozzles are responsible for picking up and adsorbing chips and completing chip placement.

[0053] Understandably, the left x-axis drive assembly 11 and the right x-axis drive assembly 12 are arranged adjacent to each other, which can realize that the chip picking process and the placement process are independent of each other. The left x-axis drive assembly 11 includes a left x-axis drive seat 111, a left x-axis guide rail 112 and a left x-axis drive block 113 connected in sequence. The left x-axis guide rail 112 is installed on the left x-axis drive seat 111 along the x-axis direction. The left x-axis drive block 113 is slidably disposed on the left x-axis guide rail 112. The left x-axis guide rail 112 is installed on the side of the left x-axis drive seat 111. The left x-axis drive block 113 slides on the left x-axis guide rail 112 to drive the z-axis moving module 3 to move along the x-axis.

[0054] Similarly, the right x-axis transmission assembly 12 includes a right x-axis transmission seat 121, a right x-axis guide rail 122, and a right x-axis transmission block 123 connected in sequence. The right x-axis guide rail 122 is mounted on the right x-axis transmission seat 121 along the x-axis direction. The right x-axis transmission block 123 is slidably disposed on the right x-axis guide rail 122. The right x-axis guide rail 122 is mounted on the side of the right x-axis transmission seat 121. The right x-axis transmission block 123 slides on the right x-axis guide rail 122 to drive the z-axis moving module 3 to move along the x-axis. The left x-axis guide rail 112 and the right x-axis guide rail 122 are staggered at their adjacent ends. That is, the sliding of the left x-axis transmission block 113 and the right x-axis transmission block 123 is independent of each other. This can avoid the chip picking process and the placement process from affecting each other, improve the accuracy of the picking and placement process, and ensure the transmission stability of the left x-axis transmission assembly 11 and the right x-axis transmission assembly 12 driving the double binding head respectively, thus meeting the high-precision requirements of chip placement. In this embodiment of the invention, the left x-axis guide rail 112 and the right x-axis guide rail 122 are disposed on the same side of the left x-axis transmission seat 111 and the right x-axis transmission seat 121, and the left x-axis guide rail 112 and the right x-axis guide rail 122 are parallel to each other; the left x-axis guide rail 112 and the right x-axis guide rail 122 adopt high rigidity guide rails to improve the overall rigidity and stability of the chip picking and mounting device 10.

[0055] It should be noted that the adjacent ends of the left x-axis drive seat 111 and the right x-axis drive seat 121 are staggered, and the left x-axis drive seat 111 and the right x-axis drive seat 121 can slide relative to each other in the y-axis direction. This design can improve the movement flexibility of the chip picking and placing device 10 in the xy plane and expand the coverage area of ​​the chip picking and placing device 10. The adjacent ends of the left x-axis drive seat 111 and the right x-axis drive seat 121, and the adjacent ends of the left x-axis guide rail 112 and the right x-axis guide rail 122 have at least partial overlap in the z-axis direction, realizing the overlap of the left binding head mechanism 4 and the right binding head mechanism 5 in the x-axis. Under the premise of ensuring the x-axis transmission stroke, the overall space occupied by the chip picking and placing device 10 in the x-axis direction can be effectively reduced, realizing the compact structure design and the miniaturized device design.

[0056] In some embodiments, the number of left x-axis guide rails 112 is at least two, and the number of right x-axis guide rails 122 is at least two, to ensure the stable operation of the left binding head mechanism 4 and the right binding head mechanism 5; in the embodiments of the present invention, the number of left x-axis guide rails 112 is two, and the number of right x-axis guide rails 122 is two, wherein the left x-axis guide rails 112 and the right x-axis guide rails 122 are arranged crosswise, with one right x-axis guide rail 122 between two left x-axis guide rails 112 and one left x-axis guide rail 112 between two right x-axis guide rails 122.

[0057] Furthermore, the x-axis movement module 1 also includes an x-axis drive assembly 13, which is spaced apart from and parallel to the left x-axis transmission assembly 11 and the right x-axis transmission assembly 12. The x-axis drive assembly 13 includes an x-axis motor 131 and a motor base 132. The x-axis motor 131 is mounted on the motor base 132, which is connected to the y-axis movement module 2. The x-axis motor 131 includes an x-axis stator 1311, a left x-axis mover 1312, and a right x-axis mover 1313. The transmission ends of the left x-axis mover 1312 and the right x-axis mover 1313 are both connected to the x-axis stator 1311, and the working ends of the left x-axis mover 1312 and the right x-axis mover 1313 are both connected to the z-axis movement module 3.

[0058] In the chip pick-and-place apparatus 10 provided in this embodiment of the invention, the x-axis drive assembly 13 can provide the driving force for the z-axis moving module 3 to move along the x-axis, and the left x-axis transmission assembly 11 and the right x-axis transmission assembly 12 can provide guidance for the z-axis moving module 3 to move along the x-axis. The x-axis drive assembly 13 and the left x-axis transmission assembly 11 are spaced apart and parallel to each other, and the x-axis drive assembly 13 and the right x-axis transmission assembly 12 are spaced apart and parallel to each other, which can avoid interference between the x-axis drive assembly 13 and the left x-axis transmission assembly 11, and between the x-axis drive assembly 13 and the right x-axis transmission assembly 12.

[0059] Understandably, the motor base 132 is used to fix the x-axis motor 131, which can prevent the x-axis motor 131 from resonating during operation and affecting the mounting accuracy. The x-axis motor 131 drives the z-axis moving module 3 through the working ends of the left x-axis mover 1312 and the right x-axis mover 1313, which can improve the transmission stability in the x-axis direction and further ensure the mounting accuracy. The x-axis motor 131 in this embodiment of the invention is a carbon fiber linear motor, which has the advantages of light load, high acceleration and high precision.

[0060] Please see Figure 1 and Figure 2The z-axis moving module 3 includes a left z-axis transmission assembly 31, a left z-axis drive assembly 32, a right z-axis transmission assembly 33, and a right z-axis drive assembly 34. The left z-axis transmission assembly 31 includes a left z-axis transmission seat 311 and a first magnetic spring structure 312. One side of the left z-axis transmission seat 311 is connected to the left x-axis transmission block 113, and the other side is connected to the left z-axis drive assembly 32. The first magnetic spring structure 312 is disposed on the side of the left z-axis transmission seat 311 away from the left x-axis transmission block 113.

[0061] Similarly, the right z-axis transmission assembly 33 includes a right z-axis transmission seat 331 and a second magnetic spring structure 332. One side of the right z-axis transmission seat 331 is connected to the right x-axis transmission block 123, and the other side is connected to the right z-axis drive assembly 34. The second magnetic spring structure 332 is disposed on the side of the right z-axis transmission seat 331 away from the right x-axis transmission block 123.

[0062] In the chip picking and mounting device 10 provided in this embodiment of the invention, the z-axis moving module 3 is divided into left and right independent transmission components and drive components, namely the left z-axis transmission component 31 and the left z-axis drive component 32, the right z-axis transmission component 33 and the right z-axis drive component 34, which can realize simultaneous or separate operation, thereby improving the efficiency of the picking process and the mounting process.

[0063] Understandably, the working ends of the left x-axis mover 1312 and the right x-axis mover 1313 are connected to the z-axis moving module 3. One side of the left z-axis transmission seat 311 is connected to the left x-axis transmission block 113, and the other side is connected to the left z-axis drive assembly 32. One side of the right z-axis transmission seat 331 is connected to the right x-axis transmission block 123, and the other side is connected to the right z-axis drive assembly 34, so that the x-axis moving module 1 can drive the z-axis moving module 3 to move along the x-axis. In this embodiment of the invention, the left x-axis transmission block 113 can slide relative to the left x-axis guide rail 112, and the right x-axis transmission block 123 can slide relative to the right x-axis guide rail 122. The left x-axis mover 1312 can drive the left z-axis transmission seat 311 to move along the x-axis, and the right x-axis mover 1313 can drive the right z-axis transmission seat 331 to move along the x-axis.

[0064] It should be noted that the first magnetic spring structure 312 is located on the left z-axis transmission seat 311 on the side away from the left x-axis transmission block 113, and the second magnetic spring structure 332 is located on the right z-axis transmission seat 331 on the side away from the right x-axis transmission block 123. The first magnetic spring structure 312 and the second magnetic spring structure 332 can balance the load of the z-axis transmission, reduce the driving load in the z-axis direction, and improve the smoothness of the movement of the z-axis moving module 3.

[0065] Please continue reading. Figure 1 and Figure 2The left z-axis drive assembly 32 includes a left z-axis guide rail 321 and a left z-axis transmission block 322. The left z-axis guide rail 321 is mounted on the left z-axis transmission seat 311 along the z-axis direction, and the left z-axis transmission block 322 is slidably disposed on the left z-axis guide rail 321. The working end of the left x-axis mover 1312 is connected to the top surface of the left z-axis transmission seat 311. The left z-axis guide rail 321 and the left z-axis transmission block 322 are both disposed away from the first magnetic spring structure 312.

[0066] Similarly, the right z-axis drive assembly 34 includes a right z-axis guide rail 341 and a right z-axis transmission block 342. The right z-axis guide rail 341 is mounted on the right z-axis transmission seat 331 along the z-axis direction, and the right z-axis transmission block 342 is slidably disposed on the right z-axis guide rail 341. The working end of the right x-axis mover 1313 is connected to the top surface of the right z-axis transmission seat 331. The right z-axis guide rail 341 and the right z-axis transmission block 342 are both disposed away from the second magnetic spring structure 332.

[0067] In the chip pick-and-place device 10 provided in this embodiment of the invention, the left Z-axis drive seat 311, the left Z-axis guide rail 321 and the left Z-axis drive block 322 are installed in sequence, and the right Z-axis drive seat 331, the right Z-axis guide rail 341 and the right Z-axis drive block 342 are arranged in sequence, which can ensure the smoothness of linear sliding in the Z-axis direction; and the left Z-axis guide rail 321 and the right Z-axis guide rail 341 are high-rigidity guide rails, which can improve the overall rigidity and stability of the chip pick-and-place device 10.

[0068] Understandably, the working end of the left x-axis mover 1312 is connected to the top surface of the left z-axis transmission seat 311, and the working end of the right x-axis mover 1313 is connected to the top surface of the right z-axis transmission seat 331. By driving the top surfaces of the left z-axis transmission seat 311 and the right z-axis transmission seat 331 through the x-axis motor 131, the transmission force can be more even, and the linear accuracy of the z-axis moving module 3 in the x-axis direction can be improved.

[0069] It should be noted that the left Z-axis guide rail 321 and the left Z-axis transmission block 322 are both located away from the first magnetic spring structure 312, and the right Z-axis guide rail 341 and the right Z-axis transmission block 342 are both located away from the second magnetic spring structure 332. This can avoid mutual interference between transmission components and ensure the reasonable assembly of each component of the Z-axis moving module 3.

[0070] Please continue reading. Figure 1 and Figure 2The chip pick-and-place device 10 also includes a left binding head mechanism 4 and a right binding head mechanism 5. The left binding head mechanism 4 is connected to the working end of the left Z-axis transmission block 322 and the first magnetic spring structure 312 respectively. When the left Z-axis transmission block 322 slides relative to the left Z-axis guide rail 321, the left binding head mechanism 4 moves synchronously. The first magnetic spring structure 312 is used to balance the load of the left Z-axis transmission seat 311, the left Z-axis drive assembly 32 and the left binding head mechanism 4.

[0071] Similarly, the right binding mechanism 5 is connected to the working ends of the right z-axis transmission block 342 and the second magnetic spring structure 332 respectively. When the right z-axis transmission block 342 slides relative to the right z-axis guide rail 341, the right binding mechanism 5 moves synchronously. The second magnetic spring structure 332 is used to balance the load of the right z-axis transmission seat 331, the right z-axis drive assembly 34 and the right binding mechanism 5.

[0072] In the chip picking and mounting device 10 provided in this embodiment of the invention, the left binding head mechanism 4 is connected to the working end of the first magnetic spring structure 312, and the right binding head mechanism 5 is connected to the working end of the second magnetic spring structure 332. By setting the first magnetic spring structure 312 and the second magnetic spring structure 332, a certain buffer can be provided for the movement of the left binding head mechanism 4 and the right binding head mechanism 5 in the z-axis direction, thereby avoiding the situation where the left binding head mechanism 4 and the right binding head mechanism 5 are damaged by overpressure when picking up the chip, or the situation where the chip is poorly mounted due to underpressure when mounting.

[0073] Understandably, by setting the first magnetic spring structure 312 and restricting the left z-axis transmission block 322 to slide on the left z-axis guide rail 321, the z-axis movement stroke of the left binding mechanism 4 can be limited. By setting the second magnetic spring structure 332 and restricting the right z-axis transmission block 342 to slide on the right z-axis guide rail 341, the z-axis movement stroke of the right binding mechanism 5 can be limited. Through this design, the chip picking and mounting process in the z-axis direction can be further precisely guided, avoiding excessive sliding of the left binding mechanism 4 and the right binding mechanism 5 in the z-axis direction, thereby protecting the chip and the substrate.

[0074] It should be noted that the left binding mechanism 4 is connected to the working end of the first magnetic spring structure 312 and also to the working end of the left z-axis transmission block 322. When the left z-axis transmission block 322 slides relative to the left z-axis guide rail 321, the left binding mechanism 4 moves synchronously. The synergistic effect of the first magnetic spring structure 312 and the left z-axis transmission block 322 can provide guidance for the left binding mechanism 4 in the z-axis direction. The right binding mechanism 5 is connected to the working end of the second magnetic spring structure 332 and also to the working end of the right z-axis transmission block 342. When the right z-axis transmission block 342 slides relative to the right z-axis guide rail 341, the right binding mechanism 5 moves synchronously. The synergistic effect of the second magnetic spring structure 332 and the right z-axis transmission block 342 can provide guidance for the right binding mechanism 5 in the z-axis direction. Through the above design, the horizontal offset of the left binding head mechanism 4 and the right binding head mechanism 5 during the movement in the z-axis direction can be avoided, and the shaking of the left binding head mechanism 4 and the right binding head mechanism 5 during the movement can be prevented, thereby improving the placement efficiency and placement accuracy of the chip picking and placing device 10.

[0075] The first magnetic spring structure 312 and the second magnetic spring structure 332 in this embodiment of the invention are constant force springs, which are completely passive devices. They can output energy without any external energy supply, including power supply, air pressure, hydraulic pressure and heat energy. The first magnetic spring structure 312 includes a first magnetic shaft 3121 and a first magnetic sleeve 3122 connected together. The first magnetic shaft 3121 is located in the z-axis direction of the left z-axis transmission seat 311, and both ends of the first magnetic shaft 3121 are fixedly installed on the left z-axis transmission seat 311. One end of the first magnetic sleeve 3122 is slidably sleeved on the first magnetic shaft 3121, and the other end is connected to the left binding head mechanism 4. The second magnetic spring structure 332 includes a second magnetic shaft 3321 and a second magnetic sleeve 3322 connected together. The second magnetic shaft 3321 is located in the z-axis direction of the right z-axis transmission seat 331, and both ends of the second magnetic shaft 3321 are fixedly installed on the right z-axis transmission seat 331. One end of the second magnetic sleeve 3322 is slidably sleeved on the second magnetic shaft 3321, and the other end is connected to the right binding head mechanism 5. The present invention, by setting the first magnetic spring structure 312 and the second magnetic spring structure 332, can prevent the left binding head mechanism 4 and / or the right binding head mechanism 5 from falling rapidly due to their own gravity when the chip picking and mounting device 10 suddenly loses power, thus avoiding damage to the equipment and workpiece.

[0076] Furthermore, the first magnetic spring structure 312 of this embodiment can drive the left binding head mechanism 4 to elastically reset in the z-axis direction, balancing the load of the left z-axis transmission seat 311, the left z-axis drive assembly 32, and the left binding head mechanism 4; similarly, the second magnetic spring structure 332 can drive the right binding head mechanism 5 to elastically reset in the z-axis direction, balancing the load of the right z-axis transmission seat 331, the right z-axis drive assembly 34, and the right binding head mechanism 5. By setting the first magnetic spring structure 312 and the second magnetic spring structure 332, the influence of the self-weight of each component of the chip picking and placing device 10 on the picking and placing downward pressure can be reduced, ensuring the high precision requirements of the chip placing force.

[0077] Please continue reading. Figure 1 and Figure 2 As an optional implementation, the left z-axis drive assembly 32 further includes a left z-axis motor 323, which is mounted in the middle of the left z-axis transmission seat 311. The left z-axis motor 323 is used to drive the left z-axis transmission block 322 to slide relative to the left z-axis guide rail 321 in the z-axis direction. There are two left z-axis guide rails 321, which are respectively located on both sides of the left z-axis motor 323, and there are at least two left z-axis transmission blocks 322.

[0078] Similarly, the right z-axis drive assembly 34 also includes a right z-axis motor 343, which is mounted in the middle of the right z-axis transmission seat 331. The right z-axis motor 343 is used to drive the right z-axis transmission block 342 to slide relative to the right z-axis guide rail 341 in the z-axis direction. There are two right z-axis guide rails 341, which are respectively located on both sides of the right z-axis motor 343. There are at least two right z-axis transmission blocks 342.

[0079] In the chip pick-and-place device 10 provided in this embodiment of the invention, the left Z-axis motor 323 is located in the middle of the left Z-axis transmission seat 311, and two left Z-axis guide rails 321 are respectively located on both sides of the left Z-axis motor 323. The right Z-axis motor 343 is located in the middle of the right Z-axis transmission seat 331, and two right Z-axis guide rails 341 are respectively located on both sides of the right Z-axis motor 343. Through this design, the transmission force of the left binding head mechanism 4 and the right binding head mechanism 5 in the Z-axis direction can be symmetrical, reducing the influence of off-center load.

[0080] Understandably, a left Z-axis guide rail 321 is provided on each side of the left Z-axis motor 323, and a right Z-axis guide rail 341 is provided on each side of the right Z-axis motor 343. This can improve the guiding accuracy of the left binding mechanism 4 and the right binding mechanism 5 moving along the Z-axis direction. The number of left Z-axis transmission blocks 322 and right Z-axis transmission blocks 342 is at least two. By setting multiple transmission blocks, the load-bearing capacity of the Z-axis moving module 3 can be enhanced, ensuring the operational stability of the left binding mechanism 4 and the right binding mechanism 5.

[0081] In this embodiment of the invention, the left Z-axis motor 323 and the left Z-axis guide rail 321 are disposed on the side of the left Z-axis transmission seat 311 opposite to the left X-axis transmission block 113, and the first magnetic spring structure 312, the left Z-axis motor 323 and the left Z-axis guide rail 321 are disposed on the same side; the right Z-axis motor 343 and the right Z-axis guide rail 341 are disposed on the side of the right Z-axis transmission seat 331 opposite to the right X-axis transmission block 123, and the second magnetic spring structure 332, the right Z-axis motor 343 and the right Z-axis guide rail 341 are disposed on the same side; both the left Z-axis motor 323 and the right Z-axis motor 343 are linear motors.

[0082] Please see Figure 4 , Figure 5 and Figure 6 As another optional implementation, the z-axis moving module 3 also includes a z-axis motion component 35, which includes a z-axis motor 351 and a motor housing 352. The z-axis motor 351 includes a z-axis stator 3511, a left z-axis mover 3512 and a right z-axis mover 3513, and the left z-axis mover 3512 and the right z-axis mover 3513 can slide relative to the z-axis stator 3511 in the z-axis direction.

[0083] Furthermore, the z-axis stator 3511 is installed inside the motor housing 352. The transmission ends of the left z-axis mover 3512 and the right z-axis mover 3513 are connected to the z-axis stator 3511 respectively. The working ends of the left z-axis mover 3512 and the right z-axis mover 3513 are exposed outside the motor housing 352. The working end of the left z-axis mover 3512 is connected to the top surface of the left binding mechanism 4, and the working end of the right z-axis mover 3513 is connected to the top surface of the right binding mechanism 5. The motor housing 352 is connected to the y-axis moving module 2 to restrict the relative sliding of the left x-axis transmission seat 111 and the right x-axis transmission seat 121 in the y-axis direction.

[0084] In the chip pick-and-place device 10 provided in this embodiment of the invention, the z-axis motion component 35 includes a z-axis motor 351 and a motor housing 352. The z-axis motor 351 includes a z-axis stator 3511, a left z-axis mover 3512 and a right z-axis mover 3513. The z-axis stator 3511 is located inside the motor housing 352. The working end of the left z-axis mover 3512 is connected to the top surface of the left binding head mechanism 4, and the working end of the right z-axis mover 3513 is connected to the top surface of the right binding head mechanism 5. The left z-axis mover 3512 and the right z-axis mover 3513 can slide relative to the z-axis stator 3511 in the z-axis direction, so that the left binding head mechanism 4 and the right binding head mechanism 5 can move independently in the z-axis direction.

[0085] Understandably, the z-axis stator 3511 is installed inside the motor housing 352, and the top surfaces of the z-axis stator 3511, the left z-axis mover 3512, and the left binding mechanism 4 are sequentially connected. Therefore, when the motor housing 352 is connected and fixed to the y-axis moving module 2, the independent sliding of the left x-axis drive seat 111 in the y-axis direction is restricted. Similarly, the top surfaces of the z-axis stator 3511, the right z-axis mover 3513, and the right binding mechanism 5 are sequentially connected, and when the motor housing 352 is connected and fixed to the y-axis moving module 2, the independent sliding of the right x-axis drive seat 121 in the y-axis direction is restricted. Through the above design, restricting the sliding of the left x-axis drive seat 111 and the right x-axis drive seat 121 in the y-axis direction can improve the speed and accuracy of the chip picking and mounting device 10 in completing the picking and mounting steps, thereby improving the working efficiency of the device.

[0086] Please see Figure 1 , Figure 2 and Figure 4 The y-axis moving module 2 includes a left y-axis drive assembly 21, a right y-axis drive assembly 22, a device base 23, and a left fixing block 24 and a right fixing block 25 installed on both sides of the device base 23. The left y-axis drive assembly 21 and the right y-axis drive assembly 22 are disposed adjacently on the device base 23 between the left fixing block 24 and the right fixing block 25. The side of the left fixing block 24 and the right fixing block 25 away from the device base 23 is connected to the motor base 132.

[0087] Furthermore, the left y-axis drive assembly 21 includes a left y-axis guide rail 211 and a left y-axis motor 212, and the left x-axis transmission seat 111 is slidably disposed on the left y-axis guide rail 211. The left y-axis motor 212 can drive the left x-axis transmission seat 111 to slide along the y-axis. The right y-axis drive assembly 22 includes a right y-axis guide rail 221 and a right y-axis motor 222, and the right x-axis transmission seat 121 is slidably disposed on the right y-axis guide rail 221. The right y-axis motor 222 can drive the right x-axis transmission seat 121 to slide along the y-axis.

[0088] In the chip pick-and-place apparatus 10 provided in this embodiment of the invention, on the one hand, when the left x-axis drive seat 111 and the right x-axis drive seat 121 are restricted to slide relative to each other in the y-axis direction by the z-axis motion component 35 on the z-axis moving module 3, the left y-axis drive component 21 or the right y-axis drive component 22 can drive the left x-axis drive seat 111 and the right x-axis drive seat 121 individually or jointly; on the other hand, when the left x-axis drive seat 111 and the right x-axis drive seat 121 are driven independently by the left z-axis drive component 32 and the right z-axis drive component 34 respectively, the left x-axis drive seat 111 and the right x-axis drive seat 121 can move independently in the y-axis direction. Through this design, it can adapt to the placement requirements in various application scenarios.

[0089] It should be noted that the left y-axis drive assembly 21 and the right y-axis drive assembly 22 are mounted on the device base 23 and the left fixing block 24 and right fixing block 25 on both sides. The structure is stable and can significantly improve the load-bearing capacity and motion stability of the y-axis moving module 2 driving the x-axis moving module 1 and the z-axis moving module 3 to move along the y-axis.

[0090] In this embodiment of the invention, both the left y-axis motor 212 and the right y-axis motor 222 are voice coil motors; the left y-axis guide rail 211 and the right y-axis guide rail 221 are arranged in the y-axis direction, the left x-axis transmission seat 111 can slide relative to the left y-axis guide rail 211 under the drive of the left y-axis motor 212, and the right x-axis transmission seat 121 can slide relative to the right y-axis guide rail 221 under the drive of the right y-axis motor 222.

[0091] In some embodiments, the left y-axis guide rail 211 and the right y-axis guide rail 221 are parallel to each other. There are four left y-axis guide rails 211, two of which are located on one side of the left y-axis motor 212, and the other two are located on the other side of the left y-axis motor 212; there are two right y-axis guide rails 221, one of which is located on one side of the right y-axis motor 222 and adjacent to the left y-axis guide rail 211, and the other is located on the other side of the right y-axis motor 222. The number of guide rails on both sides of the left y-axis motor 212 and the right y-axis motor 222 is the same, which can further improve the stability of the y-axis transmission. It is understood that the left y-axis guide rail 211 allows for the y-axis movement of the left binding head mechanism 4, and the right y-axis guide rail 221 allows for the y-axis movement of the right binding head mechanism 5. In this embodiment of the invention, the right binding head mechanism 5 is used to pick up and place the chip from the wafer onto the transfer station to complete the picking process, while the left binding head mechanism 4 is used to remove the chip stored on the transfer station and mount it onto the substrate to complete the mounting process. The left binding head mechanism 4 has higher precision requirements, so the number of left y-axis guide rails 211 is greater than that of right y-axis guide rails 221, which can save on usage costs and appropriately reduce the subsequent maintenance costs of the chip picking and mounting device 10.

[0092] In some embodiments, the left x-axis drive seat 111 is provided with a first opening to avoid the left y-axis motor 212. The first opening is located on the side away from the left x-axis guide rail 112 and the left x-axis drive block 113. Similarly, the right x-axis drive seat 121 is provided with a second opening to avoid the right y-axis motor 222. The second opening is located on the side away from the right x-axis guide rail 122 and the right x-axis drive block 123. Through this design, the overall space occupied by the chip picking and mounting device 10 in the y-axis and z-axis directions can be effectively reduced while ensuring the y-axis drive, thereby achieving a compact structure design and a miniaturized device design.

[0093] Please continue reading. Figure 1 , Figure 2 and Figure 4The x-axis movement module 1 also includes an x-axis grating assembly 14 disposed on the left x-axis drive seat 111 and the right x-axis drive seat 121. The x-axis grating assembly 14 can be used to determine the relative positions between the left x-axis guide rail 112 and the left x-axis drive block 113, between the right x-axis guide rail 122 and the right x-axis drive block 123, and / or between the left x-axis drive block 113 and the right x-axis drive block 123. The z-axis movement module 3 also includes a z-axis grating assembly 36 disposed on the left z-axis drive seat 311 and the right z-axis drive seat 331. The z-axis grating assembly 36 can be used to determine the relative positions between the left x-axis guide rail 112 and the left x-axis drive block 113, the right x-axis drive rail 122 and the right x-axis drive block 123, and / or between the left x-axis drive block 113 and the right x-axis drive block 123. The relative positions between the z-axis guide rail 321 and the left z-axis transmission block 322, between the right z-axis guide rail 341 and the right z-axis transmission block 342, and / or between the left z-axis transmission block 322 and the right z-axis transmission block 342; the y-axis moving module 2 also includes a y-axis grating assembly 26 disposed on the device base 23, which can be used to determine the relative positions between the left y-axis guide rail 211 and the left x-axis transmission seat 111, between the right y-axis guide rail 221 and the right x-axis transmission seat 121, and / or between the left x-axis transmission seat 111 and the right x-axis transmission seat 121.

[0094] In the chip pick-and-place apparatus 10 provided in this embodiment of the invention, by placing the x-axis grating assembly 14 on the left x-axis drive seat 111 and the right x-axis drive seat 121, placing the y-axis grating assembly 26 on the device base 23, and placing the z-axis grating assembly 36 on the left z-axis drive seat 311 and the right z-axis drive seat 331, the relative positions of the drive components of each axis can be detected in real time, achieving high-precision positioning feedback, significantly improving the positioning accuracy of the independent movement of the x, y, and z axes, and ensuring the accuracy of the chip pick-and-place process.

[0095] Understandably, since the left x-axis guide rail 112 is mounted on the left x-axis drive seat 111 along the x-axis direction, the left x-axis drive block 113 is slidably disposed on the left x-axis guide rail 112, the right x-axis guide rail 122 is mounted on the right x-axis drive seat 121 along the x-axis direction, and the right x-axis drive block 123 is slidably disposed on the right x-axis guide rail 122, the left x-axis guide rail 112 is stationary relative to the left x-axis drive block 113, and the right x-axis guide rail 122 is stationary relative to the right x-axis drive block 123, the x-axis grating assembly 14 can be used to determine the position of the left x-axis drive block 113, the position of the right x-axis drive block 123, and / or the relative position between the left x-axis drive block 113 and the right x-axis drive block 123.

[0096] Similarly, the left y-axis guide rail 211 is stationary relative to the left x-axis drive seat 111, and the right y-axis guide rail 221 is stationary relative to the right x-axis drive seat 121. The y-axis grating assembly 26 can be used to determine the position of the left x-axis drive seat 111, the position of the right x-axis drive seat 121, and / or the relative position between the left x-axis drive seat 111 and the right x-axis drive seat 121. The left z-axis guide rail 321 is stationary relative to the left z-axis drive block 322, and the right z-axis guide rail 341 is stationary relative to the right z-axis drive block 342. Therefore, the z-axis grating assembly 36 can be used to determine the position of the left z-axis drive block 322, the position of the right z-axis drive block 342, and / or the relative position between the left z-axis drive block 322 and the right z-axis drive block 342.

[0097] In some embodiments, the number of gratings in the x-axis grating assembly 14, the y-axis grating assembly 26, and the z-axis grating assembly 36 are all two. The gratings of the x-axis grating assembly 14 are located between the left x-axis drive block 113 and the left x-axis drive seat 111, and between the right x-axis drive block 123 and the right x-axis drive seat 121, respectively. The gratings of the y-axis grating assembly 26 are located between the left y-axis guide rail 211 and the left y-axis motor 212, and between the right y-axis guide rail 221 and the right y-axis motor 222, respectively. The gratings of the z-axis grating assembly 36 are located at the top of the left z-axis guide rail 321 and the top of the right z-axis guide rail 341, respectively.

[0098] Please see Figure 1 and Figure 7 This invention also provides a die bonding apparatus 20, which includes the aforementioned chip pick-and-place device 10. It should be noted that the die bonding apparatus 20 has the same beneficial effects as the aforementioned chip pick-and-place device 10, and will not be described in detail here.

[0099] The foregoing provides a detailed description of a chip pick-and-place apparatus and die-bonding equipment disclosed in the embodiments of the present invention. Specific examples are used to illustrate the principles and implementation methods of the present invention. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of the present invention. Furthermore, those skilled in the art will recognize that, based on the ideas of the present invention, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of the present invention. Any modifications, equivalent substitutions, and improvements made within the principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A chip pick-and-place device, characterized in that, It includes a y-axis moving module, an x-axis moving module and a z-axis moving module installed in sequence, wherein the y-axis moving module drives the x-axis moving module and the z-axis moving module to move along the y-axis; The x-axis moving module includes a left x-axis transmission assembly and a right x-axis transmission assembly arranged adjacent to each other. The left x-axis transmission assembly includes a left x-axis transmission seat, a left x-axis guide rail, and a left x-axis transmission block. The left x-axis guide rail is mounted on the left x-axis transmission seat along the x-axis direction, and the left x-axis transmission block is slidably disposed on the left x-axis guide rail. The right x-axis transmission assembly includes a right x-axis transmission seat, a right x-axis guide rail, and a right x-axis transmission block. The right x-axis guide rail is mounted on the right x-axis transmission seat along the x-axis direction, and the right x-axis transmission block is slidably disposed on the right x-axis guide rail. The left x-axis drive seat and the right x-axis drive seat are staggered at their adjacent ends and at least partially overlap in the z-axis direction. The left x-axis drive seat and the right x-axis drive seat can slide relative to each other in the y-axis direction. The left x-axis guide rail and the right x-axis guide rail are staggered at their adjacent ends and at least partially overlap in the z-axis direction. The x-axis moving module also includes an x-axis driving component, which is spaced apart from and parallel to the left x-axis transmission component and the right x-axis transmission component; The x-axis drive assembly includes an x-axis motor and a motor base. The x-axis motor is mounted on the motor base, and the motor base is connected to the y-axis moving module. The x-axis motor includes an x-axis stator, a left x-axis mover, and a right x-axis mover. The transmission ends of the left x-axis mover and the right x-axis mover are both connected to the x-axis stator, and the working ends of the left x-axis mover and the right x-axis mover are both connected to the z-axis moving module. The z-axis movement module includes a left z-axis transmission assembly, a left z-axis drive assembly, a right z-axis transmission assembly, and a right z-axis drive assembly. The left Z-axis transmission assembly includes a left Z-axis transmission seat and a first magnetic spring structure. One side of the left Z-axis transmission seat is connected to the left X-axis transmission block, and the other side is connected to the left Z-axis drive assembly. The first magnetic spring structure is disposed on the left Z-axis transmission seat on the side away from the left X-axis transmission block. The right Z-axis transmission assembly includes a right Z-axis transmission seat and a second magnetic spring structure. One side of the right Z-axis transmission seat is connected to the right X-axis transmission block, and the other side is connected to the right Z-axis drive assembly. The second magnetic spring structure is disposed on the side of the right Z-axis transmission seat away from the right X-axis transmission block. The chip picking and mounting device also includes a left binding head mechanism and a right binding head mechanism; The left binding head mechanism is connected to the working end of the left Z-axis transmission block and the first magnetic spring structure respectively. When the left Z-axis transmission block slides relative to the left Z-axis guide rail, the left binding head mechanism moves synchronously. The first magnetic spring structure is used to balance the load of the left Z-axis transmission seat, the left Z-axis drive assembly and the left binding head mechanism. The right binding head mechanism is connected to the working end of the right Z-axis transmission block and the second magnetic spring structure respectively. When the right Z-axis transmission block slides relative to the right Z-axis guide rail, the right binding head mechanism moves synchronously. The second magnetic spring structure is used to balance the load of the right Z-axis transmission seat, the right Z-axis drive assembly and the right binding head mechanism.

2. The chip pick-and-place apparatus as described in claim 1, characterized in that: The left Z-axis drive assembly includes a left Z-axis guide rail and a left Z-axis transmission block. The left Z-axis guide rail is mounted on the left Z-axis transmission seat along the Z-axis direction, and the left Z-axis transmission block is slidably disposed on the left Z-axis guide rail. The working end of the left X-axis mover is connected to the top surface of the left Z-axis transmission seat. Both the left Z-axis guide rail and the left Z-axis transmission block are disposed away from the first magnetic spring structure. The right Z-axis drive assembly includes a right Z-axis guide rail and a right Z-axis transmission block. The right Z-axis guide rail is mounted on the right Z-axis transmission seat along the Z-axis direction, and the right Z-axis transmission block is slidably disposed on the right Z-axis guide rail. The working end of the right X-axis mover is connected to the top surface of the right Z-axis transmission seat. Both the right Z-axis guide rail and the right Z-axis transmission block are disposed away from the second magnetic spring structure.

3. The chip pick-and-place apparatus as described in claim 1, characterized in that: The left Z-axis drive assembly also includes a left Z-axis motor, which is mounted in the middle of the left Z-axis transmission seat. The left Z-axis motor is used to drive the left Z-axis transmission block to slide relative to the left Z-axis guide rail in the Z-axis direction. There are two left Z-axis guide rails, which are respectively located on both sides of the left Z-axis motor. There are at least two left Z-axis transmission blocks. The right Z-axis drive assembly also includes a right Z-axis motor, which is installed in the middle of the right Z-axis transmission seat. The right Z-axis motor is used to drive the right Z-axis transmission block to slide relative to the right Z-axis guide rail in the Z-axis direction. There are two right Z-axis guide rails, which are respectively located on both sides of the right Z-axis motor. There are at least two right Z-axis transmission blocks.

4. The chip pick-and-place apparatus as described in claim 1, characterized in that: The z-axis moving module further includes a z-axis motion component, which includes a z-axis motor and a motor housing. The z-axis motor includes a z-axis stator, a left z-axis mover, and a right z-axis mover. The left z-axis mover and the right z-axis mover can slide relative to the z-axis stator in the z-axis direction. The Z-axis stator is installed inside the motor housing. The transmission ends of the left Z-axis mover and the right Z-axis mover are respectively connected to the Z-axis stator. The working ends of the left Z-axis mover and the right Z-axis mover are exposed outside the motor housing. The working end of the left Z-axis mover is connected to the top surface of the left binding head mechanism, and the working end of the right Z-axis mover is connected to the top surface of the right binding head mechanism. The motor housing is connected to the y-axis moving module to restrict the left x-axis drive seat and the right x-axis drive seat from sliding relative to each other in the y-axis direction.

5. The chip pick-and-place apparatus as described in claim 3 or 4, characterized in that: The y-axis moving module includes a left y-axis drive assembly, a right y-axis drive assembly, a device base, and a left fixing block and a right fixing block installed on both sides of the device base. The left y-axis drive assembly and the right y-axis drive assembly are disposed adjacent to each other on the device base between the left fixing block and the right fixing block. The side of the left fixing block and the right fixing block away from the device base is connected to the motor base. The left y-axis drive assembly includes a left y-axis guide rail and a left y-axis motor. The left x-axis transmission seat is slidably disposed on the left y-axis guide rail, and the left y-axis motor can drive the left x-axis transmission seat to slide along the y-axis. The right y-axis drive assembly includes a right y-axis guide rail and a right y-axis motor. The right x-axis transmission seat is slidably disposed on the right y-axis guide rail, and the right y-axis motor can drive the right x-axis transmission seat to slide along the y-axis.

6. The chip pick-and-place apparatus as described in claim 5, characterized in that: The x-axis moving module also includes an x-axis grating assembly disposed on the left x-axis drive seat and the right x-axis drive seat. The x-axis grating assembly can be used to determine the relative positions between the left x-axis guide rail and the left x-axis drive block, between the right x-axis guide rail and the right x-axis drive block, and / or between the left x-axis drive block and the right x-axis drive block. The z-axis moving module also includes a z-axis grating assembly disposed on the left z-axis drive seat and the right z-axis drive seat. The z-axis grating assembly can be used to determine the relative positions between the left z-axis guide rail and the left z-axis drive block, between the right z-axis guide rail and the right z-axis drive block, and / or between the left z-axis drive block and the right z-axis drive block. The y-axis moving module also includes a y-axis grating assembly disposed on the base of the device. The y-axis grating assembly can be used to determine the relative positions between the left y-axis guide rail and the left x-axis drive seat, between the right y-axis guide rail and the right x-axis drive seat, and / or between the left x-axis drive seat and the right x-axis drive seat.

7. A die bonding apparatus, characterized in that, The die bonding equipment includes the chip pick-and-place device according to any one of claims 1-6.

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