Immersed liquid-cooled heat exchange equipment for core heating electronic component of charging pile

Abstract

The invention belongs to the technical field of immersed liquid cooling, and particularly relates to immersed liquid cooling heat exchange equipment for a core heating electronic component of a charging pile, the immersed liquid cooling heat exchange equipment comprises a liquid cooling partition plate, a main body unit is arranged on one side, close to gravity, of the liquid cooling partition plate, and an adjusting unit is arranged in the middle area of the liquid cooling partition plate; liquid cooling units are uniformly arranged on one side, close to the main body unit, of the adjusting unit; according to the invention, through the diameter difference between the stroke gear and the speed reduction gear, a non-synchronous distance adjusting mechanism of the fins on the two sides and the fins in the middle is constructed, and a staggered multi-stage distribution heat dissipation structure is formed, that is, when heating centers are continuously accumulated in a central area under different powers and a heat stagnation area is formed, the middle fins rapidly reduce the distance, are densely distributed and strengthen heat dissipation of core hot spots; when the heating center diffuses towards the two sides, the fins on the two sides are synchronously encrypted, the middle fins are properly spaced, and local heat accumulation is avoided.

Description

Technical Field

[0001] This invention belongs to the field of immersion liquid cooling technology, specifically relating to an immersion liquid cooling heat exchange device for core heat-generating electronic components of charging piles. Background Technology

[0002] IGBT modules / MOSFETs and other semiconductor devices are core heat-generating components in the power module inside the charging pile. They are the hot spots with the highest risk of thermal runaway. Furthermore, the flow channels between adjacent modules are prone to local temperature rise of the coolant due to heat accumulation, which can cause the aforementioned coolant flow rate to decrease or the heat transfer coefficient to drop, forming a thermal hysteresis zone. IGBT modules / MOSFETs and other semiconductor device modules can not only use immersion liquid cooling, but have also been commercially applied in many fields such as high-power power supply systems, high-power charging piles, energy storage systems, and special application power supply systems. At the same time, compared with traditional cold plate liquid cooling, air cooling or external heat dissipation, immersion liquid cooling has significant advantages in heat dissipation efficiency, temperature uniformity and safety, and is particularly suitable for high power density and extremely high safety requirements in application scenarios. In traditional liquid cooling methods, semiconductor devices such as IGBT modules and MOSFETs generally use fixed fins (without adjustable angle, area, or gap) inside the coolant for heat dissipation support. Although fixed fins are the current mainstream and lowest-cost traditional heat dissipation method, they have a fundamental design flaw. When semiconductor devices such as IGBTs are working, the heat center dynamically shifts with the load. The fixed fin gap design is based on static heat distribution and cannot be dynamically adapted to the load heat dissipation adjustment of the IGBT. In fact, under low load, it creates an abnormal distribution environment where the edges are higher than the center, which further amplifies the aforementioned thermal hysteresis zone. Furthermore, under different power operating environments, the fixed fins and coolant of the aforementioned IGBT modules / MOSFETs and other semiconductor device modules cannot dynamically adapt to the dynamic thermal load characteristics of the semiconductor devices. Specifically, this manifests as: mismatch between heat transfer capacity and thermal load magnitude, imbalance between fluid field and thermal field coupling, and failure of temperature uniformity control. In other words, the aforementioned heat dissipation technology lacks the dynamic adjustment capability to adapt to demand and cannot adjust the heat exchange area, fluid turbulence intensity, and temperature distribution according to changes in semiconductor power. Summary of the Invention

[0003] To solve the above problems, the present invention adopts the following technical solution: an immersion liquid-cooled heat exchange device for the core heat-generating electronic components of a charging pile, including a liquid-cooled partition plate, a main body unit arranged on the side of the liquid-cooled partition plate near gravity, an adjustment unit arranged in the middle area of ​​the liquid-cooled partition plate, and liquid-cooled units evenly arranged on the side of the adjustment unit near the main body unit. The liquid cooling unit includes: The heat dissipation chambers are arranged in an array and evenly distributed in the space near the gravity side of the liquid cooling partition plate. The guide plate is snapped onto the end face of the heat dissipation chamber near the center line of the liquid cooling partition plate; The limit stick is snapped onto the inner wall of the heat dissipation chamber and is directly opposite to the guide plate; The multi-layer brackets are arranged in pairs and are respectively snapped onto one end of the horizontal section of the heat dissipation chamber inner wall, and are distributed symmetrically opposite each other. The spring seat is installed in the middle of the horizontal section of the multi-layer bracket in a through-type sliding snap-fit ​​configuration; The shock absorber tube is snapped together between the two opposing spring seats. Angle pressure valve is plugged in and installed at the middle position of the end of the shock-absorbing tube away from the centerline of the heat dissipation chamber. The spring plunger is coaxially arranged with the shock absorber tube and is slidably snapped together with the shock absorber tube. Angle spade is snapped onto the end of the spring plunger furthest from the angle valve.

[0004] Preferably, an electrode plate is embedded and snapped onto the end of the spring seat away from the shock absorber tube. An electrode cap, which is snapped onto the side of the electrode plate away from the spring seat and horizontally connected to the heat dissipation chamber, is provided. A toothed plate is snapped onto one end face of the corner shovel, and the outer wall of the toothed plate has grooves with different pipe diameters. An air chamber is snapped onto the end of the toothed plate near the angle valve, and the toothed plate has the same cross-sectional shape as the corner shovel. In addition, the end of the toothed plate away from the angle valve is chamfered. An air valve is snapped onto the outer wall of the air chamber. A fastening plate is snapped onto the middle position of the end face of the shock absorber tube away from the liquid cooling partition plate, and an air pump is snapped onto the end face of the fastening plate away from the shock absorber tube.

[0005] Preferably, a sealing ring is rotatably installed at the middle position of the inner wall of the horizontal section of the heat dissipation chamber, a retaining plate is snapped onto the end face of the sealing ring near the center line of the heat dissipation chamber, a conical leaking ring is snapped onto the middle position of the inner wall of the sealing ring, a drain valve is evenly inserted into the outer wall of the sealing ring, and elastic rubber beads are rotatably installed on the inner wall of the sealing ring.

[0006] Preferably, a linkage gear is snapped onto the outer wall of the sealing ring near one end of the liquid-cooled partition plate. A driven rack meshes with the linkage gear. A rack support plate, which is snapped onto the outer wall of the driven rack and is also snapped onto the inner wall of the heat dissipation chamber, is slidably snapped onto the outer wall of the driven rack. An angle steel seat is snapped onto the middle position of the end face of the rack away from the rack support plate. Bridging columns are snapped onto the end face of the angle steel seat away from the guide plate in an array. Multiple concave panels are snapped onto the end face of the bridging columns in the same group away from the angle steel seat. Telescopic support columns, which are snapped onto the inner wall of the heat dissipation chamber, are evenly snapped onto the end face of the multiple concave panels away from the guide plate. The telescopic support columns are closer to the gravity side. Lead columns are evenly arranged along the length of the end face of the multiple concave panels near the telescopic support columns. The lead columns are rotatably fitted with the multiple concave panels, and there are at least two sets of them. In addition, a spiral groove is opened on the outer wall of the lead column. A T-section column is snapped onto the end of the lead column away from the multiple concave panels.

[0007] Preferably, a long connecting plate is snapped onto the inner wall of the vertical section of the heat dissipation chamber away from the guide plate, and the long connecting plate is opposite to the gravity side. A lead rod corresponding to the lead column is snapped onto the end of the long connecting plate near the multi-segment concave panel, and the lead rod cooperates with the spiral groove on the outer wall of the lead column. A toothed pulley is snapped onto the outer wall of the T-segment column near the lead column, and toothed belts are installed in mesh with each other. The number and position of the toothed belts correspond one-to-one with those of the heat dissipation chamber. Segmented fins are snapped onto the end of the T-segment column away from the lead column, and the cross-section of the segmented fins decreases in a gradient. Wave grooves are evenly opened on the end face of the segmented fins. A convection port is opened in the middle of the vertical section of the heat dissipation chamber away from the guide plate. A sealing plate is snapped onto the inner wall of the heat dissipation chamber in the middle of the convection port, and the sealing plate is slidably snapped onto the T-segment column. In addition, the sealing plate does not contact the toothed pulley.

[0008] Preferably, the main body unit includes: Two insulating liners are symmetrically snapped onto the end face of the liquid-cooled partition plate near the gravity side. The compensation plate is positioned opposite the insulating compensation plate on the side closest to gravity. The buffer damping rods are symmetrically snapped onto the opposite sides of the insulating liner and the compensation high-level plate; An angle plate is snapped onto the other end of the two buffer damping rods in the same group; An insulating box is installed between an insulating liner and a compensation high-level plate, and the insulating box is snap-fitted together with the corner plate. The bottom pane is snap-fitted into the middle of the bottom wall of the insulating box. Semiconductor devices are snap-fitted into the center of the grid in the bottom pane; The module cover is snapped onto the end of the insulating box near the liquid-cooled partition plate, and the outer wall of the module cover and the outer wall of the insulating box are both uniformly provided with guide grooves.

[0009] Preferably, the adjustment unit includes: The module mounting plate is snapped onto the middle position of the end face of the liquid-cooled partition plate near the gravity side. The coolant guide plate is snap-fitted onto the end of the module mounting plate away from the liquid cooling partition plate; in addition, the coolant guide plate is slidably snap-fitted onto the guide plate. Ears are respectively snapped onto the opposite ends of the module mounting plate and the coolant guide plate, and there are at least three sets; The corner post is rotatably fitted into the middle position of the ear seat; The lead screw is snapped between two opposing corner posts; in addition, the outer wall of the lead screw is provided with a serpentine groove for sliding snap-fit ​​assembly with the same limiting ball rod. The serpentine grooves at both ends of the lead screw are symmetrically arranged, and the spacing between adjacent serpentine grooves is not equal. The pitch of the serpentine groove in the middle area of ​​the lead screw is greater than that on both sides, and it is gradient. The stroke gear is snapped onto the outer wall of the corner post near one end of the module mounting plate; The travel rack is slidably snapped onto the outer wall of the module mounting plate near the liquid cooling partition plate, and the travel rack meshes with the travel gear. The speed reduction gears are symmetrically arranged on both sides of the travel gear, and the speed reduction gears mesh with the travel rack.

[0010] Preferably, each of the four corners of the liquid-cooled partition plate is fitted with a frame, and the four frames are fitted together to form a cabinet. The cabinet door is fitted to the open end of the cabinet. A top cover is fitted to the side of the cabinet away from gravity, and a load-bearing base plate is fitted to the side of the cabinet closer to gravity. The inner wall of the load-bearing base plate is fitted to the compensation height plate. Heat dissipation windows are fitted to the vertical sections on both sides of the cabinet.

[0011] Preferably, the lead angle of the snake groove on the outer wall of the lead screw is consistent with the starting working angle of the corner shovel, and the cross-sectional area of ​​the corner shovel is consistent with the cross-sectional area of ​​the snake groove, and the sealing ring at the end away from the center line of the lead screw is snapped together with the lead screw.

[0012] The targeted dynamic heat dissipation method for the core heat dissipation components inside the power module employs the aforementioned immersion liquid-cooled heat exchange equipment used for the core heat-generating electronic components of the charging pile to implement dynamic heat dissipation. The specific steps are as follows: S1: First, by using the diameter difference between the stroke gear and the reduction gear, the meshing degree between the two and the stroke rack is processed differentially. The differential environment of the speed of the lead screws on both sides and the lead screw in the middle area is dynamically adjusted to ensure that the spacing between the fins on both sides and the middle fins is always adjusted asynchronously. This achieves an alternating multi-level heat dissipation support environment for the fins on both sides and the middle area, improves the fin distribution pattern and shape, and specifically addresses the heat dissipation requirements under different loads. S2: Then, by controlling the rotational synchronization between the sealing ring and the lead screw, the linkage gear and the driven rack are controlled to produce a certain degree of meshing. After that, under the control of the driven rack, the angle steel plate synchronously drives the bridging column to squeeze the multi-section concave panel to move away from the module mounting plate to a certain depth. During this process, relative motion occurs between the lead groove and the lead ball column, causing the lead groove to synchronously control the T-section column to rotate by a predetermined angle. At this time, the segmented fins make dynamic adaptive adjustments to the corresponding angles under the synchronous action of the T-section column. Meanwhile, under the combined action of the lead ball column, the segmented fins are synchronously controlled to move along the axis of the T-section column away from the module mounting plate, thereby dynamically changing the relative contact area between the segmented fins and the external coolant. S3: Finally, by synchronizing the movement between the toothed pulley and the toothed belt, the multiple segmented fins of the array are adjusted equally. In specific implementation, the diameter of the toothed pulley between adjacent "fin groups" or the pitch of the lead groove on the outer wall of the lead ball column in the corresponding area of ​​the "fin group" can be changed accordingly. This further increases the adjustment mode and shape (relative rotation angle difference) of different groups of fins in the same area, and further dynamically adapts to the thermal environment of the external load.

[0013] The present invention has the following beneficial effects: 1. This invention utilizes the diameter difference between the stroke gear and the reduction gear to construct a step-by-step spacing adjustment mechanism for the side and middle fins, forming an interlaced multi-level heat dissipation structure. Specifically, when the heat center continuously accumulates in the central area under different power conditions and forms a heat stagnation zone, the middle fins rapidly reduce their spacing and become densely distributed to enhance the heat dissipation of the core hot spot; when the heat center diffuses to both sides, the fins on both sides are simultaneously densified, and the spacing of the middle fins is appropriately increased to avoid local heat accumulation. In addition, the aforementioned dynamic tracking and adjustment mode of fin spacing allows the coolant flow channel to be reconstructed in real time as the hot spot migrates, the flow channel in the high heat generation area becomes narrower and the turbulence intensity is increased, completely solving the uncontrollable problems such as reduced flow velocity and decreased heat transfer coefficient caused by heat accumulation in the fixed flow channel, and systematically eliminating the thermal stagnation zone. 0. This invention achieves precise control of the heat exchange contact area by driving the segmented fins to translate and rotate along the axis of the T-segment column through the relative motion between the lead groove and the lead ball column. At the same time, the coordinated adjustment between the contact area and the fin angle allows the heat transfer capacity to be dynamically adapted over a wide range. This ensures that at high power, the fins are fully extended and the contact area is maximized to match the surge in heat load; at low power, the fins contract and the contact area is reduced to avoid overcooling that could cause the temperature of the aforementioned semiconductor devices to deviate from the optimal operating range. 1. The segmented fins of this invention can adaptively adjust their angle under the drive of the T-segment column. At high power, the fins are arranged in a forward-tilted manner, which breaks the laminar boundary layer, enhances fluid disturbance, improves the turbulence between the fins and the coolant, and significantly improves the heat transfer coefficient. At low power, the fins are arranged in a co-current manner, which reduces flow resistance, avoids vortex dead zones, and significantly improves the uniformity of coolant flow. 2. This invention achieves different relative rotation angles of different groups of fins in the same area by changing the diameter of the toothed pulley or the pitch of the lead groove. It precisely allocates heat dissipation resources to address the heat dissipation differences in different areas of the semiconductor device, optimizes the uniformity of the temperature across the entire area, and avoids problems such as fatigue of packaging materials and cracking of solder layers caused by sudden temperature rises or drops, thus significantly improving the service life of the aforementioned semiconductor devices. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0015] Figure 2 This is an appendix to the present invention. Figure 1 A 3D view of the internal structure of the central cabinet.

[0016] Figure 3 This is a three-dimensional view of a partial structure of the main unit in this invention.

[0017] Figure 4 This is a three-dimensional structural diagram of the adjustment unit and liquid cooling unit in this invention.

[0018] Figure 5 This is an appendix to the present invention. Figure 4 Top view of the structure.

[0019] Figure 6 This is a three-dimensional structural diagram of the liquid cooling unit in this invention.

[0020] Figure 7 This is a plan view of a partial internal structure of the heat dissipation chamber in this invention.

[0021] Figure 8 This is an appendix to the present invention. Figure 7 Partial plan view of the structure.

[0022] Figure 9 This is a three-dimensional view of the shock-absorbing tube and its internal cross-section of the present invention.

[0023] Figure 10 This is a three-dimensional view of the corner shovel and its partial structure in this invention.

[0024] Figure 11 This is an appendix to the present invention. Figure 6 Plan view of the cross-section of the middle structure.

[0025] Figure 12This is a plan view of the internal structure of the heat dissipation chamber of the present invention from another perspective.

[0026] Figure 13 This is an appendix to the present invention. Figure 12 A magnified schematic diagram of the local structure at point A in the middle.

[0027] Figure 14 This is a plan view of the cross-section of the sealing ring and its partial structure of the present invention.

[0028] The diagram is labeled as follows: 1. Liquid-cooled partition plate; 2. Main unit; 3. Adjustment unit; 4. Liquid-cooled unit; 11. Frame; 12. Cabinet body; 13. Cabinet door; 14. Top cover; 15. Load-bearing base plate; 16. Ventilation window plate; 21. Insulating liner; 22. Compensating high-level plate; 23. Buffer damping rod; 24. Corner plate; 25. Insulating enclosure; 26. Bottom window pane; 27. Semiconductor device; 28. Module top cover; 31. Module mounting plate; 32. Coolant guide plate; 33. Ear seat; 34. Angle post; 35. Lead screw; 36. Serpentine groove; 37. Stroke gear; 38. Stroke rack; 39. Reduction gear; 41. Heat dissipation chamber; 42. Guide plate; 43. Limiting ball rod; 44. Multi-layer bracket; 45. Spring seat; 46. Shock absorber tube; 47. Angle pressure valve; 48. Spring plunger; 49. Angle shovel; 411. Electrode plate; 412. Electrode cap; 413. Toothed plate; 414. Air chamber; 415. Air valve; 416. Fastening plate; 417. Air pump; 421. Sealing ring; 422. Enclosure plate; 423. Conical leak ring; 424. Drain valve; 425. Elastic bead; 431. Linkage gear; 432. Driven rack; 433. Rack support plate; 434. Angle steel seat; 435. Bridging column; 436. Multi-section concave panel; 437. Telescopic support; 438. Lead column; 439. T-section column; 441. Extension plate; 442. Lead push rod; 443. Toothed pulley; 444. Toothed belt; 445. Segmented fins; 446. Band groove; 447. Convection port; 448. Sealing plate. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0030] It should be noted that the terms "vertical," "horizontal," "left," "right," and similar expressions used in this article are for illustrative purposes only and do not represent the only possible implementation.

[0031] The specific implementation of the present invention will be described in detail below with reference to specific embodiments.

[0032] Reference Figure 2 , Figure 4 and Figure 6 It is known that the immersion liquid-cooled heat exchange equipment for the core heat-generating electronic components of the charging pile includes a liquid-cooled partition plate, a main body unit is provided on the side of the liquid-cooled partition plate near gravity, an adjustment unit is provided in the middle area of ​​the liquid-cooled partition plate, and liquid-cooled units are evenly arranged on the side of the adjustment unit near the main body unit. Reference Figure 1 and Figure 2 It is known that the four corners of the liquid-cooled partition plate are all snapped with a frame, and the four frames are snapped together to install a cabinet. The cabinet door is installed at the open end of the cabinet. The top cover is snapped with the side of the cabinet away from the gravity, and the load-bearing base plate is snapped with the side of the cabinet close to the gravity. The inner wall of the load-bearing base plate is snapped with the compensation high plate. Heat dissipation windows are snapped with the vertical sections on both sides of the cabinet. Reference Figure 2 and Figure 3 It can be seen that the main unit includes: two insulating liners, which are symmetrically snapped onto the end face of the liquid-cooled partition plate near the gravity side; a compensation high-level plate, which is set opposite to the insulating compensation plate near the gravity side; buffer damping rods, which are symmetrically snapped onto the opposite faces of the insulating liners and the compensation high-level plate; and corner plates, which are snapped onto the other ends of the two buffer damping rods in the same group. An insulating enclosure is positioned between an insulating liner and a compensation high-position plate, and is snap-fitted to the corner plate; a bottom window is snap-fitted to the middle of the bottom wall of the insulating enclosure; semiconductor devices are snap-fitted to the middle of the grid in the bottom window; a module cover is snap-fitted to the end of the insulating enclosure near the liquid-cooled partition plate, and guide grooves are evenly provided on the outer wall of the module cover and the outer wall of the insulating enclosure.

[0033] Prerequisites: Immersion mineral oil liquid cooling system adapted to charging pile power modules (mineral oil: petroleum fractionation product, mainly a mixture of saturated alkanes, inexpensive, with good insulation, suitable for large-scale energy storage projects). Simplified liquid cooling technology steps for semiconductor devices: S1: The heat generated by the semiconductor device (IGBT / MOSFET) during operation is directly transferred to the surrounding immersed mineral oil (the mineral oil is in direct contact with the device surface, eliminating the contact thermal resistance of the traditional cold plate). S2: The flow channels on the module cover and the outer wall of the insulating box guide the heated mineral oil (after absorbing heat) to flow along the channels, avoiding local heat accumulation and the formation of "heat stagnation zones"; S3: The liquid cooling unit generates convective heat exchange with the aforementioned mineral oil through its corresponding internal functional components (first absorbing the heat of the hot oil, and then transferring the heat to other cold oils - the coolant is circulating repeatedly), thus cooling the hot oil into cold oil. S4: The cooled oil circulates through the oil flow inside the cabinet (partially relying on gravity or an auxiliary pump, not shown in the figure, and for mineral oil coolant, it can be sealed by a liquid-cooled sealed chamber in the actual implementation), and flows back to the area around the semiconductor device, continuously carrying away the newly generated heat and achieving dynamic cooling. Buffer damping rod: Adapted to the outdoor vibration environment of charging piles, it absorbs the working vibration of the charging pile (e.g., the impact of plugging and unplugging the charging gun or parking the vehicle), avoids cracking of the package solder joints of semiconductor devices or loosening of the pins, and improves the life of the devices. Protection level assurance: The relatively sealed space, consisting of a frame, liquid-cooled partition, cabinet door, top cover, and load-bearing base plate, provides a relatively stable closed environment for mineral oil immersion.

[0034] Reference Figure 2 , Figure 4 and Figure 5 It is understood that the adjustment unit includes: a module mounting plate, which is snapped onto the middle position of the end face of the liquid-cooled partition plate near the gravity side; a coolant guide plate, which is snapped onto the end of the module mounting plate away from the liquid-cooled partition plate; in addition, the coolant guide plate and the guide plate are slidably snapped together; lugs, which are snapped onto the opposite ends of the module mounting plate and the coolant guide plate, and there are at least three sets; corner posts, which are rotatably fitted onto the middle position of the lugs; and a lead screw, which is snapped onto the two opposite corner posts. In addition, the outer wall of the lead screw is provided with a serpentine groove for sliding engagement with the limit ball joint. The serpentine grooves at both ends of the lead screw are symmetrically arranged, and the spacing between adjacent serpentine grooves is not equal. The pitch of the serpentine groove in the middle area of ​​the lead screw is greater than that on both sides, and it changes in a gradient. The stroke gear is engaged with the outer wall of the corner column near one end of the module mounting plate. The stroke rack is slidably engaged with the outer wall of the module mounting plate near the liquid cooling partition plate, and the stroke rack meshes with the stroke gear. The deceleration gear is symmetrically arranged on both sides of the stroke gear, and the deceleration gear meshes with the stroke rack.

[0035] Adjustment schemes for the overall liquid cooling unit under different operating power conditions: Pre-construction environment: Because the heat dissipation path in the middle area is longer than that in the two sides, the overall temperature of the semiconductor device module is higher in the middle than on the sides, which easily leads to heat accumulation. Let's take temperature rise as an example (and under different power levels): First, the corner column in the middle area (near the liquid-cooled partition plate) rotates at a predetermined angle under the drive of an external motor (the long-term operational stability of the corner column is improved by the lugs). (The actual rotation angle can be controlled by the external temperature sensor and the PLC control system to ultimately control the drive motor to rotate at a predetermined preset angle.) After that, the lead screw rotates synchronously. The external motor is not shown, but it can be stably installed using a liquid-cooled partition plate. Next, the liquid cooling unit contains a "component—limiting ball joint" that works in conjunction with the snake groove. This causes the liquid cooling unit bodies, which are evenly distributed on the outer wall of the screw, to move to different degrees after being guided by the snake groove when the screw rotates to a predetermined angle. (The snake grooves at both ends of the screw are symmetrically distributed and rotate in opposite directions, ensuring that the liquid cooling unit moves as a whole towards the center of the aforementioned semiconductor device in the current state, allowing for a relatively denser layout of the fins in the core hot spot area, reducing the spacing, and improving heat dissipation capacity. In addition, the pitch of the snake groove on one side is not equidistant; specifically, the pitch is set to decrease linearly from the middle to the outer side, thereby improving the faster response rate of the liquid cooling unit body in the middle area at the same rotation angle.) At this point, the unified scheduling of the adjacent spacing of each liquid cooling unit in the vertical direction (referencing the direction of gravity) is completed; Finally, by synchronizing the movement of the travel gear and the travel rack, the travel rack is engaged in real time. Subsequently, the travel rack moves in a predetermined direction under the support and guidance of the module mounting plate. During this process, it simultaneously engages the deceleration gear. Due to the difference between the diameter of the deceleration gear and the travel gear (in specific implementation, the diameter of the deceleration gear can be larger or smaller than the travel gear), the rotation angle of the lead screws on both sides differs from that in the middle position. This further increases the arrangement of each liquid cooling unit body in the direction of gravity, improves the liquid cooling unit's adaptability to different external heat dissipation environments, and increases the depth and breadth of heat dissipation.

[0036] Reference Figure 6 , Figure 7 , Figure 9 and Figure 10It is known that the liquid cooling unit includes: a heat dissipation chamber, which is uniformly arranged in an array in the space near the gravity side of the liquid cooling partition plate; a guide plate, which is snapped onto the end face of the heat dissipation chamber near the center line of the liquid cooling partition plate; a limiting ball rod, which is snapped onto the inner wall of the heat dissipation chamber and is distributed opposite to the guide plate; a multi-layer bracket, two in a group, which are snapped onto one end of the inner wall of the horizontal section of the heat dissipation chamber and are distributed symmetrically opposite to each other; a spring seat, which is slidably snapped onto the middle position of the horizontal section of the multi-layer bracket; a shock-absorbing tube, which is snapped onto the two opposite spring seats; an angle pressure valve, which is inserted into the middle position of the end of the shock-absorbing tube away from the center line of the heat dissipation chamber; a spring plunger, which is coaxially arranged with the shock-absorbing tube and slidably snapped onto the shock-absorbing tube; and an angle shovel, which is snapped onto the end of the spring plunger away from the angle pressure valve. Reference Figure 9 , Figure 10 and Figure 11 It is known that an electrode plate is embedded and snapped at the axial center of the end of the spring seat away from the shock absorber tube. An electrode cap is snapped and installed on the side of the electrode plate away from the spring seat, which is horizontally connected to the heat dissipation chamber. A nail tooth plate is snapped and installed on one end face of the corner shovel, and the outer wall of the nail tooth plate has a column groove with different pipe diameters. An air chamber is snapped and installed on the end of the nail tooth plate near the angle pressure valve. The nail tooth plate has the same cross-sectional shape as the corner shovel. In addition, the end of the nail tooth plate away from the angle pressure valve is chamfered. An air valve is snapped and installed on the outer wall of the air chamber. A fastening plate is snapped and installed at the middle position of the end face of the shock absorber tube away from the liquid cooling partition plate. An air pump is snapped and installed on the end face of the fastening plate away from the shock absorber tube. Reference Figure 7 and Figure 8 It can be seen that a sealing ring is rotatably installed in the middle of the horizontal section of the heat dissipation chamber. A sealing plate is snapped onto the end face of the sealing ring near the center line of the heat dissipation chamber. A conical leaking ring is snapped onto the middle of the inner wall of the sealing ring. Drain valves are evenly inserted into the outer wall of the sealing ring. Elastic rubber beads are rotatably installed on the inner wall of the sealing ring. Reference Figure 6 and Figure 7 It can be seen that a linkage gear is snapped onto the outer wall of the sealing ring near the liquid-cooled partition plate. A driven rack meshes with the linkage gear. A rack support plate is slidably snapped onto the outer wall of the driven rack and snapped onto the inner wall of the heat dissipation chamber. An angle steel seat is snapped onto the middle position of the end face of the rack away from the rack support plate. A bridging column is snapped onto the end face of the angle steel seat away from the guide plate in an array. Reference Figure 7 , Figure 12 , Figure 13 and Figure 14It can be seen that the bridging columns in the same group are connected to multiple concave panels at the end away from the angle steel seat. The concave panels are evenly connected to telescopic support columns that are connected to the inner wall of the heat dissipation chamber. The telescopic support columns are close to the gravity side. The concave panels are evenly provided with guide columns along their length direction at the end face of the concave panels close to the telescopic support columns. The guide columns are rotatably fitted with the concave panels, and there are at least two sets. In addition, the outer wall of the guide column is provided with a spiral groove. The end of the guide column away from the concave panels is connected to a T-section column. Reference Figure 6 , Figure 12 , Figure 13 and Figure 14 It can be seen that a long connecting plate is snapped onto the inner wall of the vertical section away from the guide plate of the heat dissipation chamber, and the long connecting plate is away from the gravity side. A lead push rod corresponding to the lead column is snapped onto the end of the long connecting plate near the multi-section concave panel, and the lead push rod is engaged with the spiral groove on the outer wall of the lead column. A toothed pulley is snapped onto the outer wall of the T-section column near the lead column, and a toothed belt is installed by meshing between the toothed pulleys. The number and position of the toothed belts correspond one-to-one with the heat dissipation chamber. The T-section column is fitted with segmented fins at the end away from the lead column, and the cross-section of the segmented fins decreases in a gradient. The end face of the segmented fins is uniformly provided with band grooves. A convection port is provided in the middle of the vertical section on the side of the heat dissipation chamber away from the guide plate. A sealing plate is installed in the middle of the convection port and is fitted with the inner wall of the heat dissipation chamber. The sealing plate is slidably fitted with the T-section column. In addition, the sealing plate does not contact the toothed pulley. The lead angle of the snake groove on the outer wall of the lead screw is consistent with the starting working angle of the corner shovel, and the cross-sectional area of ​​the corner shovel is consistent with the cross-sectional area of ​​the snake groove. The sealing ring at the end away from the center line of the lead screw is snapped together with the lead screw.

[0037] The dynamic and targeted adjustment process of segmented fins in terms of angle and length under different thermal environments: First, under the guidance of the snake groove (lead screw), the limit ball rod synchronously controls the heat dissipation chamber to drive the liquid cooling unit body to move to a predetermined depth (in specific implementation, it can be determined by the snake groove pitch and the lead screw's own rotation angle, that is, by using two variables, the specific movement scheme of the liquid cooling unit body can be increased, thus improving diversity). Next, under the synchronous action of the sealing ring (at the end near the module mounting plate), the linkage gear and the driven rack produce a predetermined depth of meshing motion, causing the driven rack to synchronously control the angle steel seat to drive the bridging column to move away from the guide plate under the support and guidance of the rack support plate (and the depth of movement is determined by the degree of meshing between the linkage gear and the driven rack). At the same time, under the squeezing force of the bridging column, the multi-section concave panel moves stably to a predetermined depth away from the guide plate (in this process, the telescopic column provides stable support point guidance, and at the same time, through its own telescopic flexibility, it provides adaptive support for the repeated movement of the multi-section concave panel). In specific implementation, there is a certain space margin between the multi-section concave panel and the sealing plate, that is, to ensure the movement space of the multi-section concave panel, and at the same time to provide stable assembly space for the T-section column and the toothed pulley. Ultimately, as the lead column moves along with the multi-section concave panel, relative motion occurs between it and the lead push rod. This causes the lead push rod, under the stable support of the extension plate, to force the lead column to rotate at a certain angle (the rotation angle is determined by the depth of the lead column's movement and the pitch of the lead groove on the outer wall of the lead column). Subsequently, under the combined action of the lead column and the stable support of the sealing plate, the T-section column drives the segmented fins to tilt at a predetermined angle, thereby changing the relative contact area between the segmented fins and the external coolant. (At the same time, the segmented fins move a predetermined depth away from the guide plate. That is, when its own angle is adjusted, its body extends a predetermined length outward from the heat dissipation chamber, realizing a dual adjustment mechanism of angle and length, further changing the contact area between the segmented fins and the external coolant.) The advantages of the aforementioned segmented fin optimization design are: replacing the static heat exchange structure with an adaptive heat exchange mode, and addressing the causes of thermal hysteresis zones from multiple dimensions such as heat exchange area, flow field characteristics, and liquid flow guidance. This can significantly improve heat dissipation efficiency and achieve dynamic adaptation to heat load and optimization of temperature uniformity. The core advantages of wave grooves are: optimizing the structural topology of the surface through which the coolant flows, creating four basic environments: increased heat exchange area, enhanced turbulence intensity, extended residence time, and uniform temperature distribution, thereby further determining the effective heat exchange area; Cleaning steps for mineral oil impurities inside the snake groove: By utilizing the motion correlation between the multi-layer support and the heat dissipation chamber, the shovel generates a relative scraping motion with the inner wall of the snake groove simultaneously when the heat dissipation chamber moves along the direction of gravity (i.e. when the distance between adjacent heat dissipation chambers is adjusted). In practice, gas can be continuously pumped into the air chamber by an air pump (the air valve and the air pump can be connected by an external hose). Then, the aforementioned gas fluid passes through the spiked plate and the column grooves on its surface (and the column groove diameters are different, which enhances the degree of turbulence, improves the cleaning effect, and at the same time reduces the adhesion rate of impurities to the corner shovel when the corner shovel removes impurities in the snake groove, ensuring the cleanliness of the corner shovel itself). By releasing the rigid connection between the shock absorber tube and the multi-layer support through the spring seat, the freedom of movement of the shock absorber tube is released. This ensures that there is a certain relative force between the shovel and the snake groove, while avoiding excessive rigid contact between the two, thereby improving their service life. At the same time, the timely contact between the electrode plate and the electrode cap can accurately determine whether there is wear affecting the accuracy of the snake groove lead angle or inner wall. The process of relatively blocking the external mineral oil from the heat dissipation chamber: By utilizing the synchronicity of movement between the sealing ring and the heat dissipation chamber, relative movement is generated between the sealing ring and the lead screw. During this process, the impurities and oil on the outer wall of the lead screw are guided to the area enclosed by the sealing ring and the enclosure plate through the conical leakage ring. Then, they are centrally treated through the drain valve (in specific implementation, the aforementioned waste oil can be centrally collected and treated by an external pump). The elastic beads can relatively block the movement of external mineral oil into the heat dissipation chamber in real time.

[0038] The working principle of the immersion liquid-cooled heat exchange device for the core heat-generating electronic components of charging piles provided by this invention is as follows: First step: Firstly, by using the diameter difference between the stroke gear and the reduction gear, the meshing degree between the two and the stroke rack is differentially processed, and the differential environment of the rotational speed of the lead screws on both sides and the lead screw in the middle area is dynamically adjusted to ensure that the spacing between the fins on both sides and the middle fins is always adjusted asynchronously, so as to realize the alternating multi-level heat dissipation support environment of the fins on both sides and the middle area, improve the fin distribution pattern and shape, and specifically address the heat dissipation requirements under different loads; Step 2: Next, by controlling the rotational synchronization between the sealing ring and the lead screw, the linkage gear and the driven rack are controlled to produce a certain degree of meshing. After that, under the control of the driven rack, the angle steel plate synchronously drives the bridging column to squeeze the multi-section concave panel to move away from the module mounting plate to a certain depth. During this process, relative motion occurs between the lead groove and the lead ball column, causing the lead groove to synchronously control the T-section column to rotate by a predetermined angle. At this time, the segmented fins make dynamic adaptive adjustments to the corresponding angles under the synchronous action of the T-section column. Meanwhile, under the combined action of the lead ball column, the segmented fins are synchronously controlled to move along the axis of the T-section column away from the module mounting plate, thereby dynamically changing the relative contact area between the segmented fins and the external coolant. The third step: Finally, by synchronizing the movement between the toothed pulley and the toothed belt, the multiple segmented fins of the array are adjusted equally. In practice, the diameter of the toothed pulley between adjacent "fin groups" or the pitch of the lead groove on the outer wall of the lead ball column in the corresponding area of ​​the "fin group" can be changed accordingly. This further increases the adjustment mode and shape (relative rotation angle difference) of different groups of fins in the same area, and further dynamically adapts to the thermal environment of the external load.

[0039] The circuits and controls involved in this invention are all existing technologies and will not be described in detail here.

[0040] The above are merely embodiments of the present invention and do not limit the scope of the patent. Any equivalent structural or procedural transformations made based on the description and drawings of the present invention, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of the present invention.

Claims

1. An immersion liquid-cooled heat exchange device for core heat-generating electronic components of a charging pile, comprising a liquid-cooled partition plate (1), characterized in that: The liquid-cooled partition plate (1) has a main body unit (2) on the side close to gravity, and an adjustment unit (3) is provided in the middle area of ​​the liquid-cooled partition plate (1). Liquid-cooled units (4) are evenly arranged on the side of the adjustment unit (3) close to the main body unit (2). The liquid cooling unit (4) includes: The heat dissipation chambers (41) are arranged in an array and uniformly in the space near the gravity side of the liquid cooling partition plate (1); The guide plate (42) is snapped onto the end face of the heat dissipation chamber (41) near the center line of the liquid cooling partition plate (1); The limiting ball rod (43) is snapped onto the inner wall of the heat dissipation chamber (41) and is directly opposite to the guide plate (42); Multi-layer brackets (44), two in a group, are respectively snapped and installed on one end of the horizontal section of the heat dissipation chamber (41) and are symmetrically distributed opposite each other; The spring seat (45) is installed in the middle of the horizontal section of the multi-layer bracket (44) in a through-type sliding snap-fit. The shock absorber tube (46) is snapped between the two opposing spring seats (45); Angle valve (47) is plugged into and installed at the middle position of one end of the shock absorber tube (46) away from the center line of the heat dissipation chamber (41); The spring plunger (48) is coaxially arranged with the damping tube (46) and is slidably snapped together with the damping tube (46); Angle shovel (49) is snapped onto the end of the spring plunger (48) away from the angle valve (47).

2. The immersion liquid-cooled heat exchange device for the core heating electronic components of a charging pile according to claim 1, characterized in that: An electrode plate (411) is embedded and snapped onto the end of the spring seat (45) away from the shock absorber tube (46). An electrode cap (412) is snapped onto the side of the electrode plate (411) away from the spring seat (45) and is horizontally connected to the heat dissipation chamber (41). A toothed plate (413) is snapped onto one end face of the angle shovel (49), and the outer wall of the toothed plate (413) has grooves with different pipe diameters. The toothed plate (413) is located near the angle valve (47). An air chamber is installed by snap-fit, and the cross-sectional shape of the spiked plate (413) is the same as that of the angle shovel (49). In addition, the end of the spiked plate (413) away from the angle pressure valve (47) is chamfered. An air valve (415) is installed by snap-fit ​​on the outer wall of the air chamber. A fastening plate (416) is installed at the middle position of the end face of the shock-absorbing tube (46) away from the liquid cooling partition plate (1). An air pump (417) is installed by snap-fit ​​on the end face of the fastening plate (416) away from the shock-absorbing tube (46).

3. The immersion liquid-cooled heat exchange device for the core heating electronic components of a charging pile according to claim 1, characterized in that: A sealing ring (421) is rotatably installed at the middle position of the inner wall of the horizontal section of the heat dissipation chamber (41). A retaining plate (422) is snapped onto the end face of the sealing ring (421) near the center line of the heat dissipation chamber (41). A conical leaking ring (423) is snapped onto the middle position of the inner wall of the sealing ring (421). A drain valve (424) is evenly inserted into the outer wall of the sealing ring (421). An elastic rubber bead (425) is rotatably installed on the inner wall of the sealing ring (421).

4. The immersion liquid-cooled heat exchange device for the core heating electronic components of a charging pile according to claim 3, characterized in that: A linkage gear (431) is snapped onto the outer wall of the sealing ring (421) near one end of the liquid-cooled partition plate (1). A driven rack (432) meshes with the linkage gear (431). A rack support plate (433) is snapped onto the outer wall of the driven rack (432) and snapped onto the inner wall of the heat dissipation chamber (41). An angle steel seat (434) is snapped onto the middle position of the end face of the rack away from the rack support plate (433). A bridging column (435) is snapped onto the end face of the angle steel seat (434) away from the guide plate (42) in an array. The ends of the bridging columns (435) in the same group away from the angle steel seat (434) are snapped onto the same end. A multi-segment concave panel (436) is provided with telescopic support columns (437) that are evenly snapped onto the side of the multi-segment concave panel (436) away from the guide plate (42). The telescopic support columns (437) are close to the gravity side. Guide columns (438) are evenly arranged along the length direction on the side of the multi-segment concave panel (436) close to the telescopic support columns (437). The guide columns (438) are rotatably fitted with the multi-segment concave panel (436), and there are at least two sets. In addition, a spiral groove is opened on the outer wall of the guide column (438). A T-segment column (439) is snapped onto the end of the guide column (438) away from the multi-segment concave panel (436).

5. The immersion liquid-cooled heat exchange device for the core heating electronic components of a charging pile according to claim 4, characterized in that: A long connecting plate (441) is snapped onto the inner wall of the vertical section of the heat dissipation chamber (41) away from the guide plate (42), and the long connecting plate (441) is away from the gravity side. A lead push rod (442) corresponding to the lead post (438) is snapped onto the end of the long connecting plate (441) near the multi-section concave panel (436), and the lead push rod (442) is engaged with the spiral groove on the outer wall of the lead post (438). A toothed pulley (443) is snapped onto the outer wall of the T-section column (439) near the lead post (438), and a toothed belt (444) is installed between the toothed pulleys (443) and the heat dissipation chamber (41). The quantity and position are all one-to-one. The T-section column (439) is attached to the end away from the lead column (438) with segmented fins (445) and the cross-section of the segmented fins (445) decreases in a gradient. The end face of the segmenter fins is uniformly provided with band grooves (446). The convection port (447) is provided in the middle of the vertical section on the side away from the guide plate (42) of the heat dissipation chamber (41). A sealing plate (448) is provided in the middle of the convection port (447) and is attached to the inner wall of the heat dissipation chamber (41). The sealing plate (448) and the T-section column (439) are slidably attached together. In addition, the sealing plate (448) and the toothed pulley (443) do not contact each other.

6. The immersion liquid-cooled heat exchange device for the core heating electronic components of a charging pile according to claim 1, characterized in that: The main body unit (2) includes: Insulating liner (21), two in number, are symmetrically snapped onto the end face of the liquid-cooled partition plate (1) near the gravity side; The compensation high-level plate (22) is set opposite to the side of the insulating compensation plate near the gravity; The buffer damping rod (23) is symmetrically snapped onto the opposite sides of the insulating liner (21) and the compensation high plate (22); An angle plate (24) is snapped onto the other end of the two buffer damping rods (23) in the same group; An insulating box (25) is set between an insulating liner (21) and a compensation high plate (22), and the insulating box (25) is snapped together with the corner plate (24); The bottom window pane (26) is snapped into place at the middle of the bottom wall of the insulating box (25); Semiconductor device (27) is snapped into the middle of the grid in the bottom pane (26); The module cover (28) is snapped onto one end of the insulating box (25) near the liquid cooling partition plate (1), and the outer wall of the module cover (28) and the outer wall of the insulating box (25) are both uniformly provided with guide grooves.

7. The immersion liquid-cooled heat exchange device for the core heating electronic components of a charging pile according to claim 1, characterized in that: The adjustment unit (3) includes: The module mounting plate (31) is snapped onto the middle position of the end face of the liquid cooling partition plate (1) near the gravity side; The coolant guide plate (32) is snapped onto the end of the module mounting plate (31) away from the liquid cooling partition plate (1); in addition, the coolant guide plate (32) is slidably snapped onto the guide plate (42); Ears (33) are respectively snapped onto the opposite ends of the module mounting plate (31) and the coolant guide plate (32), and there are at least three sets; The corner post (34) is rotatably fitted in the middle position of the ear seat (33); The lead screw (35) is snapped between two opposing corner posts (34); in addition, the outer wall of the lead screw (35) is provided with a serpentine groove (36) that is slidably snapped together with the limit ball rod (43). The serpentine grooves (36) at both ends of the lead screw (35) are arranged symmetrically, and the spacing between adjacent serpentine grooves (36) is not equal. The pitch of the serpentine groove (36) in the middle area of ​​the lead screw (35) is greater than that on both sides, and it is gradient. The stroke gear (37) is snapped onto the outer wall of the corner post (34) near one end of the module mounting plate (31); The stroke rack (38) is slidably snapped onto the outer wall of the module mounting plate (31) near the liquid cooling partition plate (1), and the stroke rack (38) meshes with the stroke gear (37); The speed reduction gear (39) is symmetrically arranged on both sides of the travel gear (37), and the speed reduction gear (39) meshes with the travel rack (38).

8. The immersion liquid-cooled heat exchange device for the core heating electronic components of a charging pile according to claim 1, characterized in that: The liquid-cooled partition plate (1) is fitted with a frame (11) at each of its four corners. The four frames (11) are fitted together to form a cabinet (12). The cabinet (12) is fitted with a cabinet door (13) at its open end. The cabinet (12) is fitted with a top cover plate (14) on the side away from gravity. The cabinet (12) is fitted with a load-bearing base plate (15) on the side closer to gravity. The inner wall of the load-bearing base plate (15) is fitted with a compensation high plate (22). The vertical sections on both sides of the cabinet (12) are fitted with heat dissipation windows (16).

9. The immersion liquid-cooled heat exchange device for the core heating electronic components of a charging pile according to claim 7, characterized in that: The lead angle of the snake groove (36) on the outer wall of the lead screw (35) is consistent with the starting working angle of the shovel (49), and the cross-sectional area of ​​the shovel (49) is consistent with the cross-sectional area of ​​the snake groove (36). The sealing ring (421) at the end away from the center line of the lead screw (35) is snapped together with the lead screw (35).

Images