Spraying disc and electroplating equipment
By setting electroplating solution nozzles and suction ports on the spray plate, combined with an electroplating solution circulation system and a swing mechanism, the problem of uneven electroplating layer caused by uneven electroplating solution is solved, and the uniformity of the electroplating layer is achieved.
Patent Information
- Application Number
- CN202411412503.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-08-26
- Filing Date
- 2024-10-11
- Publication Date
- 2026-03-03
AI Technical Summary
In existing vertical electroplating equipment, the uneven distribution of ions in the electroplating solution leads to uneven electroplating layer on the surface of the workpiece.
Multiple electroplating solution nozzles and suction ports are set on the spray plate. By simultaneously spraying and suctioning the electroplating solution, the concentration of ions in the electroplating solution is improved, and the uniformity of the electroplating layer is ensured by controlling the flow rate.
It achieves uniformity of the electroplating layer on the part to be electroplated, overcomes the influence of gravity, and ensures the uniform distribution of the electroplating layer.
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Figure CN121593142A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of electroplating technology, and more particularly to a spray plate and electroplating equipment. Background Technology
[0002] In existing vertical electroplating equipment, electroplating of the workpiece is usually achieved in the following way: the workpiece is held in a fixture, placed in the electroplating solution in the electroplating tank, and then electroplated on the surface of the workpiece.
[0003] However, in existing vertical electroplating equipment, the ions in the electroplating solution in the electroplating tank are affected by gravity, resulting in uneven ion distribution and concentration differences in the electroplating solution. This leads to uneven electroplating layer on the surface of the workpiece during electroplating. Summary of the Invention
[0004] To address the aforementioned technical problems, this application provides a spray plate and electroplating equipment.
[0005] In a first aspect, this application provides a spray disc, which is provided with a plurality of electroplating liquid nozzles and a plurality of electroplating liquid suction ports; the electroplating liquid nozzles are used to spray electroplating liquid, and the electroplating liquid suction ports are used to draw electroplating liquid.
[0006] In some embodiments of this application, the spray disc is provided with an alternating arrangement of electroplating liquid suction ports and an electroplating liquid spray port group in the vertical direction; the electroplating liquid suction port group includes a plurality of electroplating liquid suction ports arranged at intervals in the horizontal direction; the electroplating liquid spray port group includes a plurality of electroplating liquid spray ports arranged at intervals in the horizontal direction.
[0007] In some embodiments of this application, the spray disc is provided with an alternating group of electroplating liquid suction ports and an electroplating liquid spray port group arranged in a horizontal direction; the electroplating liquid suction port group includes a plurality of electroplating liquid suction ports arranged at intervals in a vertical direction; the electroplating liquid spray port group includes a plurality of electroplating liquid spray ports arranged at intervals in a vertical direction.
[0008] In some embodiments of this application, the spray disc is provided with a plurality of electroplating liquid nozzles and electroplating liquid suction ports arranged alternately in both the horizontal and vertical directions.
[0009] In some embodiments of this application, the spray disc is provided with an electroplating liquid suction port group and an electroplating liquid spray port group arranged alternately in the vertical or horizontal direction; the electroplating liquid suction port group includes a plurality of electroplating liquid suction ports arranged at intervals in the horizontal or vertical direction; the electroplating liquid spray port group includes a plurality of electroplating liquid spray ports arranged at intervals in the horizontal or vertical direction.
[0010] In some embodiments of this application, the size of the electroplating solution suction port may be the same as or different from the size of the electroplating solution spray port.
[0011] In a second aspect, this application provides an electroplating apparatus, including the aforementioned spray plate.
[0012] In some embodiments of this application, a spray tank, an anode plate, a fixture, and an electroplating solution circulation system are also included; the spray tank contains an electroplating solution; the fixture holds the workpiece to be electroplated and places it in the spray tank; the electroplating solution nozzles and suction ports of the spray plate are arranged facing the workpiece to be electroplated; the anode plate is arranged on the side of the spray plate near the workpiece to be electroplated; the anode plate and the spray plate form an anode system; the electroplating solution circulation system is connected to the spray tank and the spray plate to realize the circulation of the electroplating solution.
[0013] In some embodiments of this application, two anode systems are symmetrically spaced apart, with the workpiece to be electroplated disposed between the two anode systems.
[0014] In some embodiments of this application, a swing mechanism is also included, wherein the clamp is connected to the swing mechanism, and the swing mechanism can drive the workpiece to be electroplated to move in the spray tank to achieve a uniform distribution of the electroplating layer on the edge of the workpiece.
[0015] Compared with the prior art, the present invention has the following advantages and beneficial effects: The spray plate of the present application is provided with multiple electroplating liquid nozzles and multiple electroplating liquid suction ports. The electroplating liquid nozzles are used to spray out the electroplating liquid, and the electroplating liquid suction ports are used to draw out the electroplating liquid. By simultaneously spraying out and drawing out the electroplating liquid, the concentration of ions in the electroplating liquid is improved, thereby improving the uniformity of the electroplating layer of the workpiece to be electroplated, and the electroplating layer of the workpiece to be electroplated is uniformly electroplated. At the same time, by controlling the flow rate of the electroplating liquid nozzles and electroplating liquid suction ports, the layout area of the workpiece to be electroplated can be electroplated, so as to further make the electroplating layer of the workpiece to be electroplated uniform.
[0016] It should be understood that the above general description and the following detailed description are merely exemplary and explanatory, and do not limit this document. Attached Figure Description
[0017] The accompanying drawings, which form part of this document, are used to provide a further understanding of the document. The illustrative embodiments and descriptions herein are used to explain the document and do not constitute an undue limitation thereof. In the drawings: Figure 1 This is a schematic diagram of the structure of the spray disc provided in an exemplary embodiment of this application; Figure 2 This is a schematic diagram of the structure of the spray disc provided in an exemplary embodiment of this application; Figure 3 This is a schematic diagram of the structure of the spray disc provided in an exemplary embodiment of this application; Figure 4 This is a schematic diagram of the structure of the spray disc provided in an exemplary embodiment of this application; Figure 5This is a schematic diagram of the structure of the spray disc provided in an exemplary embodiment of this application; Figure 6 This is a schematic diagram of the structure of the spray disc provided in an exemplary embodiment of this application; Figure 7 This is a schematic diagram of the structure of the spray disc provided in an exemplary embodiment of this application; Figure 8 This is a schematic diagram of the structure of an electroplating apparatus (pipes omitted) provided in an exemplary embodiment of this application; Figure 9 This is a schematic diagram of the electroplating equipment (pipes omitted) provided in an exemplary embodiment of this application from another angle; Figure 10 This is a schematic diagram of the electroplating equipment provided in an exemplary embodiment of this application.
[0018] In the picture: 100. Anode system; 101. Electroplating solution suction port; 102. Electroplating solution nozzle; 103. Spray plate; 200. Spray tank; 300. Fixture; 400. Swinging mechanism; 500. Chemical tank; 600. Filter; 700. Spray pump; 800. Circulation pump; 900. Overflow box; 10A. Part to be electroplated. Detailed Implementation
[0019] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be arbitrarily combined with each other.
[0020] In existing vertical electroplating equipment, electroplating of the workpiece is usually achieved in the following way: the workpiece is held in a fixture, placed in the electroplating solution in the electroplating tank, and then electroplated on the surface of the workpiece.
[0021] However, in existing vertical electroplating equipment, the ions in the electroplating solution in the electroplating tank are affected by gravity, resulting in uneven ion distribution and concentration differences in the electroplating solution. This leads to uneven electroplating layer on the surface of the workpiece during electroplating.
[0022] Based on this, an exemplary embodiment of this application provides a spray plate and an electroplating device. The spray plate is provided with multiple electroplating liquid nozzles and multiple electroplating liquid suction ports. The electroplating liquid nozzles are used to spray out the electroplating liquid, and the electroplating liquid suction ports are used to draw out the electroplating liquid. By simultaneously spraying out and drawing out the electroplating liquid, the concentration of ions in the electroplating liquid is improved, thereby improving the uniformity of the electroplating layer on the workpiece to be electroplated, and the workpiece to be electroplated uniformly. At the same time, by controlling the flow rate of the electroplating liquid nozzles and electroplating liquid suction ports, the layout area of the workpiece to be electroplated can be electroplated, so as to further make the electroplating layer on the workpiece to be electroplated uniform.
[0023] Example 1: An exemplary embodiment of this application provides a spray disc, such as Figure 1 As shown, the spray disk 103 is provided with multiple electroplating solution nozzles 102 and multiple electroplating solution suction ports 101, which face the workpiece 10A to be electroplated. To reduce the impact on the electric field, the electroplating solution nozzles 102 and electroplating solution suction ports 101 are made of plastic, preferably PVC. Channels for electroplating solution spraying or recirculation are formed inside the spray disk 103; the electroplating solution nozzles 102 are used to spray the electroplating solution, and the electroplating solution suction ports 101 are used to draw in the electroplating solution. Thus, during the electroplating process of the part to be electroplated 10A, while the electroplating solution nozzle 102 sprays out the electroplating solution, the electroplating solution suction port 101 can simultaneously draw in the electroplating solution. By simultaneously spraying out and drawing in the electroplating solution, the concentration of ions in the electroplating solution is improved, thereby improving the uniformity of the electroplating layer of the part to be electroplated 10A, and the electroplating layer of the part to be electroplated 10A is uniformly electroplated. At the same time, by controlling the flow rate of the electroplating solution nozzle 102 and the electroplating solution suction port 101, local areas of the part to be electroplated 10A can be electroplated to further make the electroplating layer of the part to be electroplated 10A uniform.
[0024] like Figure 1 or Figure 2 As shown, the spray plate 103 is provided with alternating vertically arranged electroplating solution suction port groups and electroplating solution spray port groups; the electroplating solution suction port group includes multiple electroplating solution suction ports 101 spaced apart in the horizontal direction; the electroplating solution spray port group includes multiple electroplating solution spray ports 102 spaced apart in the horizontal direction. Each alternating vertically arranged electroplating solution suction port group and each electroplating solution spray port group can be independently controlled. In this way, the flow rate of electroplating solution drawn by each electroplating solution suction port group and the flow rate of electroplating solution sprayed by each electroplating solution spray port group can be controlled according to the different ion concentrations of the electroplating solution at different positions in the spray tank 200. This ensures that the ion concentration at each position in the entire spray tank 200 is maintained within a certain range to overcome the influence of gravity, thereby making the electroplating layer of the workpiece 10A uniform.
[0025] Example 2: like Figure 3 or Figure 4As shown, the spray plate 103 is provided with an alternating horizontal arrangement of electroplating solution suction ports and electroplating solution spray ports. The electroplating solution suction port group includes multiple electroplating solution suction ports 101 arranged at intervals in the vertical direction; the electroplating solution spray port group includes multiple electroplating solution spray ports 102 arranged at intervals in the vertical direction. The sizes of the electroplating solution spray ports 102 and electroplating solution suction ports 101 can be the same or different. Each electroplating solution suction port 101 and each electroplating solution spray port 102 can be independently controlled. Thus, based on the different ion concentrations of the electroplating solution at different locations in the spray tank 200, the flow rate of the electroplating solution drawn by each electroplating solution suction port 101 and the flow rate of the electroplating solution sprayed by each electroplating solution spray port 102 can be controlled, ensuring that the ion concentration at each location in the entire spray tank 200 remains within a certain range to overcome the influence of gravity, thereby making the electroplating layer of the workpiece 10A uniform.
[0026] Example 3: like Figure 5 As shown, the spray plate 103 is provided with multiple electroplating solution nozzles 102 and electroplating solution suction ports 101 arranged alternately in both horizontal and vertical directions. The sizes of the electroplating solution nozzles 102 and electroplating solution suction ports 101 can be the same or different. Each electroplating solution suction port 101 and each electroplating solution nozzle 102 can be independently controlled. Thus, based on the different ion concentrations of the electroplating solution at different locations in the spray tank 200, the flow rate of the electroplating solution drawn by each electroplating solution suction port 101 and the flow rate of the electroplating solution sprayed by each electroplating solution nozzle 102 can be controlled, ensuring that the ion concentration at each location in the entire spray tank 200 remains within a certain range to overcome the influence of gravity, thereby making the electroplating layer of the workpiece 10A uniform.
[0027] Example 4: like Figure 6 or Figure 7As shown, the spray disk 103 is provided with a vertically staggered arrangement of electroplating solution suction nozzles and electroplating solution nozzles. The electroplating solution suction nozzles include multiple electroplating solution suction nozzles 101 spaced apart in the horizontal direction; the electroplating solution nozzles include multiple electroplating solution nozzles 102 spaced apart in the horizontal direction. The spray disk 103 is provided with a horizontally staggered arrangement of electroplating solution suction nozzles and electroplating solution nozzles. The electroplating solution suction nozzles include multiple vertically spaced electroplating solution suction nozzles 101 spaced apart; the electroplating solution nozzles include multiple vertically spaced electroplating solution nozzles 102 spaced apart. In this case, the sizes of the electroplating solution nozzles 102 and the electroplating solution suction nozzles 101 can be the same or different. Each electroplating solution suction port group and each electroplating solution spray port group can be independently controlled. In this way, the flow rate of electroplating solution drawn by each electroplating solution suction port group and the flow rate of electroplating solution sprayed by each electroplating solution spray port group can be controlled according to the different ion concentrations of the electroplating solution at different locations in the spray tank 200. This ensures that the ion concentration at each location in the entire spray tank 200 is maintained within a certain range to overcome the influence of gravity, thereby making the electroplating layer of the workpiece 10A uniform.
[0028] Example 5: like Figure 1 or Figure 3 As shown, the size of the electroplating solution suction port 101 is the same as the size of the electroplating solution spray port 102. At this time, the flow rate of electroplating solution drawn by each electroplating solution suction port group and the flow rate of electroplating solution sprayed by each electroplating solution spray port group can be controlled according to the different concentrations of electroplating solution at different locations in the spray tank 200. This ensures that the concentration of ions at each location in the entire spray tank 200 is maintained within a certain range to overcome the influence of gravity, thereby making the electroplating layer of the workpiece 10A uniform.
[0029] Example 6: The dimensions of the electroplating solution suction port 101 are different from the dimensions of the electroplating solution spray port 102. For example, as shown... Figure 2 or Figure 4 As shown, the size of the electroplating solution suction port 101 is larger than the size of the electroplating solution spray port 102. In this case, the larger suction port 102 provides a gentler suction of the electroplating solution, while the smaller spray port 102 exerts higher pressure, causing the sprayed electroplating solution to mix more vigorously with the electroplating solution in the spray tank 200. This allows for a more uniform mixing of the sprayed electroplating solution with the electroplating solution in the spray tank 200, resulting in a more uniform ion concentration and improved electroplating uniformity. Figure 7As shown, the size of the electroplating solution suction port 101 is smaller than the size of the electroplating solution spray port 102. At this time, the flow rate of the electroplating solution drawn by each electroplating solution suction port group and the flow rate of the electroplating solution sprayed by each electroplating solution spray port group can be controlled according to the different ion concentrations of the electroplating solution at different locations in the spray tank 200. This ensures that the ion concentration at each location in the entire spray tank 200 remains within a certain range, overcoming the influence of gravity and thus making the electroplating layer of the workpiece 10A uniform.
[0030] Example 7: An exemplary embodiment of this application provides an electroplating apparatus, based on any one of embodiments 1 to 6 described above, such as... Figures 8 to 10 As shown, the electroplating equipment includes: a spray tank 200, an anode plate, a fixture 300, and an electroplating solution circulation system. The spray tank 200 contains the electroplating solution; the anode plate is positioned on the side of the spray plate 103 near the workpiece 10A to be electroplated and is immersed in the electroplating solution. The anode plate and the spray plate 103 form an anode system 100; the anode system 100 is mounted on the spray tank 200, and the spray plate 103 is provided with multiple electroplating solution nozzles 102 and multiple electroplating solution suction ports 101. The multiple electroplating solution nozzles 102 and multiple electroplating solution suction ports 101 penetrate the anode plate and face the workpiece 10A to be electroplated; to reduce the impact on the electric field, the electroplating solution nozzles 102 and electroplating solution suction ports 101 are made of plastic, preferably PVC. A channel for electroplating solution spraying or recirculation is formed inside the spray plate 103. An external pipe and flow control valve are connected to the side of the spray plate 103 away from the anode plate, enabling the electroplating solution nozzle 102 and the electroplating solution suction port 101 to connect with the electroplating solution circulation system and control the spraying and suction flow rates. The electroplating solution nozzle 102 is used to spray the electroplating solution, and the electroplating solution suction port 101 is used to suction the electroplating solution. The clamp 300 holds the workpiece 10A to be electroplated and places it on one side of the anode system 100. The electroplating solution circulation system is connected to the spray tank 200 and the spray plate 103 to achieve electroplating solution circulation. Thus, during the electroplating process of the part to be electroplated 10A, while the electroplating solution nozzle 102 sprays out the electroplating solution, the electroplating solution suction port 101 can simultaneously draw in the electroplating solution. By simultaneously spraying out and drawing in the electroplating solution, the concentration of ions in the electroplating solution is improved, thereby improving the uniformity of the electroplating layer on the part to be electroplated 10A, and achieving uniform electroplating of the part to be electroplated 10A. At the same time, by controlling the flow rate of the electroplating solution nozzle 102 and the electroplating solution suction port 101, local areas of the part to be electroplated 10A can be electroplated to further make the electroplating layer on the part to be electroplated 10A uniform.
[0031] Preferably, in order to monitor the concentration of ions in the electroplating solution in real time, the spray tank 200 is also equipped with sensors that measure conductivity, pressure and flow rate, so as to measure and monitor the conductivity, pressure and flow rate of the electroplating solution sprayed and drawn in in real time. Based on the measurement and monitoring data obtained in real time, the control system can adjust the flow rate of the electroplating solution sprayed and drawn in in real time, so as to further obtain a uniform electroplating layer on the workpiece 10A to be electroplated.
[0032] Continue to refer to Figure 1 and 2 The electroplating solution circulation system of this electroplating equipment includes a chemical tank 500, a filter 600, a circulation pump 800, and a spray pump 700. The electroplating solution in the chemical tank 500, under the action of the spray pump 700, passes through the filter 600 and a connecting pipe into the internal flow channel of the spray plate 103, and is sprayed out through the electroplating solution nozzle 102. The filter 600 purifies the electroplating solution, effectively removing impurities and further improving the quality of the electroplating solution, thereby enhancing the uniformity of the electroplated layer. The circulation pump 800 connects to the internal flow channel of the spray plate 103 through a connecting pipe and draws the electroplating solution into the chemical tank 500 through the electroplating solution suction port 101, realizing the circulation of the electroplating solution. The spray pump 700 is a magnetic levitation pump to provide contactless and pollution-free electroplating solution, while also improving the uniformity of the electroplating solution pumping, further enhancing the uniformity of the electroplated layer.
[0033] The chemical bath 500 provides a larger capacity for electroplating solution, extending the solution replacement cycle and reducing overall equipment downtime. The chemical bath 500 is equipped with heating and cooling modules to control the temperature of the electroplating solution and ensure stable process parameters. Through circulation with the chemical bath 500, the composition and temperature of the electroplating solution are better maintained, improving electroplating quality and ensuring the uniformity of the electroplated layer.
[0034] An overflow tank 900 is also installed on one side of the spray tank 200. The overflow tank 900 is interconnected with the spray tank 200 and the chemical tank 500 to ensure the balance of the electroplating solution level in the spray tank 200. Simultaneously, a liquid level detection sensor is installed in the spray tank 200 to monitor the electroplating solution level in real time. If the liquid level is lower than a preset position, electroplating solution is added to the spray tank 200. By setting up the liquid level detection sensor and the overflow tank 900, the electroplating solution in the spray tank 200 is dynamically balanced and regulated, ensuring that the electroplating solution in the spray tank 200 is maintained within a preset range.
[0035] For example, when electroplating a square substrate, uneven electroplating often occurs at the four corners of the substrate. In order to electroplat the four corners of the substrate evenly, the electroplating equipment also includes a swing mechanism 400. The clamp 300 is connected to the swing mechanism 400. The swing mechanism 400 can drive the workpiece 10A to be electroplated to move in the spray tank 200 to achieve a uniform distribution of the electroplating layer at the edge of the workpiece 10A.
[0036] The swing mechanism 400 includes a vertical motion module mounted on the spray tank 200, a horizontal motion module mounted on the vertical motion module, and a support assembly mounted on the horizontal motion module. A clamp 300 is fixedly mounted on the support assembly. The control system can control the swing path and frequency of the swing mechanism 400 based on the waveform of the current flowing into the spray tank 200, causing the workpiece 10A to be electroplated to move within the spray tank 200, ensuring uniform electroplating at the four corners of the workpiece 10A.
[0037] Example 8: Based on any one of the above embodiments 1 to 6, the electroplating equipment includes two anode systems 100 arranged symmetrically at intervals, the workpiece 10A to be electroplated is arranged between the two anode systems 100, and the spray disks 103 of the two anode systems 100 are arranged facing each other, so that electroplating solution can be sprayed or drawn onto the two sides of the workpiece 10A to be electroplated respectively. At this time, double-sided electroplating can be performed on the substrate.
[0038] The electroplating equipment of this application allows for adjustment of the electroplating solution's process formulation, supporting linear exchange of the electroplating solution. Simultaneously, it can be used in a high-precision segmental anode system for individual units being processed. The distance between the anode and the workpiece to be electroplated (10A) can be adjusted according to the formulation requirements. It supports both DC and reverse pulse electroplating and is suitable for wafers, substrates, IC carriers, FO-PLP, RDL, VF, TGV, HDI, mSAP, etc. For example, it can be used for electroplating 8-inch wafers, as well as for electroplating carriers or substrates of 200×200 mm size.
[0039] In this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that an article or device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such an article or device. Without further limitation, an element defined by the phrase "comprising..." does not exclude the presence of other identical elements in the article or device that includes said element.
[0040] Although preferred embodiments of this application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this application.
[0041] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if these modifications and variations fall within the scope of the claims of this application and their equivalents, the intent of this application also includes these modifications and variations.
Claims
1. A spray disc, characterized in that, The spray plate is equipped with multiple electroplating liquid nozzles and multiple electroplating liquid suction ports; the electroplating liquid nozzles are used to spray electroplating liquid, and the electroplating liquid suction ports are used to draw electroplating liquid.
2. The spray disc according to claim 1, characterized in that, The spray plate is provided with an alternating arrangement of electroplating solution suction ports and electroplating solution spray ports in the vertical direction; the electroplating solution suction port group includes a plurality of electroplating solution suction ports arranged at intervals in the horizontal direction; the electroplating solution spray port group includes a plurality of electroplating solution spray ports arranged at intervals in the horizontal direction.
3. The spray disc according to claim 1, characterized in that, The spray plate is provided with an alternating horizontal arrangement of electroplating solution suction ports and electroplating solution spray ports; the electroplating solution suction port group includes multiple electroplating solution suction ports arranged at intervals in the vertical direction; the electroplating solution spray port group includes multiple electroplating solution spray ports arranged at intervals in the vertical direction.
4. The spray disc according to claim 1, characterized in that, The spray plate is equipped with multiple electroplating solution nozzles and electroplating solution suction ports that are arranged alternately in both the horizontal and vertical directions.
5. The spray disc according to claim 1, characterized in that, The spray plate is provided with electroplating solution suction port groups and electroplating solution spray port groups arranged alternately in the vertical or horizontal direction; the electroplating solution suction port group includes multiple electroplating solution suction ports arranged at intervals in the horizontal or vertical direction; the electroplating solution spray port group includes multiple electroplating solution spray ports arranged at intervals in the horizontal or vertical direction.
6. The spray disc according to claim 1, characterized in that, The size of the electroplating solution suction port may be the same as or different from the size of the electroplating solution spray port.
7. An electroplating device, characterized in that, Includes the spray disc as described in any one of claims 1 to 6.
8. The electroplating equipment according to claim 7, characterized in that, It also includes a spray tank, an anode plate, a fixture, and an electroplating solution circulation system; the spray tank contains electroplating solution; the fixture holds the workpiece to be electroplated and places it in the spray tank; the electroplating solution nozzles and suction ports of the spray plate are arranged facing the workpiece to be electroplated; the anode plate is arranged on the side of the spray plate close to the workpiece to be electroplated; The anode plate and the spray plate form an anode system; the electroplating solution circulation system is connected to the spray tank and the spray plate to realize the circulation of the electroplating solution.
9. The electroplating equipment according to claim 8, characterized in that, It includes two anode systems arranged symmetrically at intervals, with the workpiece to be electroplated disposed between the two anode systems.
10. The electroplating equipment according to claim 8, characterized in that, It also includes a swing mechanism, the clamp is connected to the swing mechanism, the swing mechanism can drive the workpiece to be electroplated to move in the spray tank, so as to achieve a uniform distribution of the electroplating layer on the edge of the workpiece.