Method and device for selecting mounting position of laser component analyzer, medium and equipment

Abstract

The invention discloses an installation position selection method and device of a laser component analyzer, a medium and equipment. The method comprises the following steps: acquiring chute parameters of a fire grate chute and installable area parameters in a preset range of the fire grate chute; according to the installable area parameters, determining distance parameters between the center of an opening window for installing a laser component analyzer in the installable area and the center of the bottom of the inner side of a chute body of the fire grate chute; and determining a target installation area according to the distance parameter and the chute parameter, and selecting the installation position of the laser component analyzer from the target installation area. The installation position of the laser component analyzer selected by the method can effectively avoid working condition interference in actual use, improve the detection precision and the validity of detection data, and ensure the application feasibility.

Description

Technical Field

[0001] This invention relates to the field of metallurgical technology, and in particular to a method, apparatus, medium, and equipment for selecting the installation location of a laser component analyzer. Background Technology

[0002] Material composition is a core parameter for process control and an evaluation indicator for product quality in industries such as metallurgy. Composition detection plays a crucial role in various technical and economic indicators, including the degree of smelting, product quality, and metal recovery rate. Real-time online detection is one of the key bottlenecks in the intelligent upgrading of smelting processes. Currently, material composition detection in smelting processes mostly relies on manual sampling combined with offline laboratory testing, which suffers from insufficient real-time performance, reliability, guidance, and safety. This hinders real-time monitoring, precise control, and process improvement of material composition, and fails to support the intelligent upgrading of corresponding process nodes.

[0003] Laser-induced breakdown spectroscopy (LIBS)-based component analyzers can detect the composition of process materials. They are characterized by being non-sampling, non-contact, and radiation-free, facilitating closed-loop control based on real-time component analysis to guide process regulation. This enables precise process control, optimizes process flow efficiency, and supports intelligent infrastructure development. However, the installation location of laser component analyzers is typically determined by technicians' visual observation and past experience, which leads to a high dependence on experience and hinders widespread application. Summary of the Invention

[0004] This invention aims to at least partially solve one of the technical problems in related technologies. Therefore, one objective of this invention is to propose a method for selecting the installation location of a laser component analyzer, avoiding operational interference during actual use, improving detection accuracy and the validity of detection data, and ensuring application feasibility.

[0005] The second objective of this invention is to provide a device for selecting the installation location of a laser component analyzer.

[0006] A third objective of this invention is to provide a computer-readable storage medium.

[0007] The fourth objective of this invention is to provide an electronic device.

[0008] To achieve the above objectives, a first aspect of the present invention provides a method for selecting the installation location of a laser component analyzer. The method includes: acquiring chute parameters of a grate chute and installation area parameters within a preset range of the grate chute; determining a distance parameter between the center of the opening window of the laser component analyzer to be installed within the installation area and the center of the bottom inner side of the grate chute body, based on the installation area parameters; determining a target installation area based on the distance parameter and the chute parameters, and selecting the installation location of the laser component analyzer from the target installation area.

[0009] According to the method for selecting the installation location of the laser component analyzer according to an embodiment of the present invention, by obtaining the chute parameters of the grate chute and the installation area parameters of the production environment in which it is located, the installation location of the laser component analyzer is selected based on the distance parameters between the center of the opening window of the laser component analyzer installed in the installation area and the center of the bottom of the inner side of the grate chute, and the chute parameters, thereby avoiding interference from the working conditions during actual use, improving the detection accuracy and the validity of the detection data, and ensuring the feasibility of application.

[0010] In addition, the method for selecting the installation location of the laser component analyzer according to the above embodiments of the present invention may also have the following additional technical features:

[0011] According to an embodiment of the present invention, before obtaining the chute parameters and the installable area parameters within a preset range of the grate chute, the method further includes: determining that, under preset purging conditions, the dust concentration within a preset space of the grate chute is less than a preset concentration threshold; determining that the molten liquid surface fluctuation inside the grate chute is less than or equal to a preset surface fluctuation threshold; determining that the degree of crusting on the molten liquid surface inside the grate chute is less than or equal to a preset crusting threshold; determining that the vibration within the preset space of the grate chute is less than a preset vibration threshold; and determining that the electromagnetic interference within the preset space of the grate chute is less than a preset interference threshold.

[0012] According to one embodiment of the present invention, the chute parameters include the chute opening depth and the chute opening width; the installable area parameters include the area length, the area width, and the area height; the distance parameters include vertical distance and horizontal distance; and determining the target installation area based on the distance parameters and the chute parameters includes: determining a vertical distance and a horizontal distance whose ratio of the vertical distance to the horizontal distance satisfies a preset relationship, wherein the preset relationship is determined by the chute opening depth and the chute opening width; the vertical distance and the horizontal distance are respectively the vertical distance and the horizontal distance between the center of the opening window of the laser component analyzer installed within the area width and the area height corresponding to the area length and the center of the bottom of the inner side of the grate chute; and the area width and area height corresponding to the vertical distance and horizontal distance satisfying the preset relationship are recorded as the target installation area.

[0013] According to one embodiment of the present invention, the expression for the preset relationship is:

[0014]

[0015] Where h represents the vertical distance, l represents the horizontal distance, d represents the depth of the groove opening, and w represents the width of the groove opening.

[0016] According to one embodiment of the present invention, the method further includes: determining the installation locations of the control analysis cabinet, control box, signal processing equipment and remote control terminal based on the installation location of the laser component analyzer.

[0017] According to one embodiment of the present invention, the control analysis cabinet corresponds one-to-one with the laser component analyzer. The control analysis cabinet is located on one side of the laser component analyzer. The laser component analyzer is connected to the control analysis cabinet. The control analysis cabinet is connected to the control box. The control box is connected to the remote control terminal through the signal processing equipment.

[0018] According to one embodiment of the present invention, the control and analysis cabinet corresponds to a plurality of laser component analyzers, the plurality of laser component analyzers are connected to a first end of the control box, the control and analysis cabinet is connected to a second end of the control box, and a third end of the control box is connected to a remote control terminal via the signal processing equipment.

[0019] To achieve the above objectives, a second aspect of the present invention provides an installation location selection device for a laser component analyzer. The device includes: an acquisition module for acquiring chute parameters and installable area parameters within a preset range of the grate chute; a calculation module for determining, based on the installable area parameters, a distance parameter between the center of the opening window of the laser component analyzer installed within the installable area and the center of the bottom inner side of the grate chute; and a selection module for determining a target installation area based on the distance parameter and the chute parameters, and selecting the installation location of the laser component analyzer from the target installation area.

[0020] To achieve the above objectives, a third aspect of the present invention provides a computer-readable storage medium having a computer program stored thereon, wherein when the computer program is executed by a processor, it implements the method for selecting the installation location of a laser component analyzer as proposed in the first aspect of the present invention.

[0021] To achieve the above objectives, a fourth aspect of the present invention provides an electronic device, including a memory and a processor, wherein the memory stores a computer program, and when the computer program is executed by the processor, it implements the installation location selection method for a laser component analyzer as proposed in the first aspect of the present invention.

[0022] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0023] Figure 1 This is a flowchart of a method for selecting the installation location of a laser component analyzer according to an embodiment of the present invention;

[0024] Figure 2 This is a flowchart of an installation location selection method according to a specific embodiment of the present invention;

[0025] Figure 3 This is a flowchart illustrating the determination of a target installation area according to an embodiment of the present invention;

[0026] Figure 4 This is a schematic diagram showing the horizontal and vertical distances between a laser component analyzer and a grate chute according to an embodiment of the present invention;

[0027] Figure 5 This is a schematic diagram of the installation of a laser component analyzer according to a specific embodiment of the present invention;

[0028] Figure 6 This is an installation diagram of a laser component analyzer according to another specific embodiment of the present invention;

[0029] Figure 7This is a schematic diagram of an online grate melt detection system according to an embodiment of the present invention;

[0030] Figure 8 This is a schematic diagram of the installation location selection device for the laser component analyzer according to an embodiment of the present invention;

[0031] Figure 9 This is a structural block diagram of an electronic device according to an embodiment of the present invention. Detailed Implementation

[0032] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0033] The following description, in conjunction with the accompanying drawings and specific embodiments, details the method, apparatus, medium, and equipment for selecting the installation location of the laser component analyzer according to embodiments of the present invention.

[0034] Figure 1 This is a flowchart illustrating a method for selecting the installation location of a laser component analyzer according to an embodiment of the present invention. Figure 1 As shown, the methods for selecting the installation location of the laser component analyzer may include:

[0035] S101, Obtain the grate chute parameters and the installable area parameters within the preset range of the grate chute;

[0036] S102, Determine the distance parameter between the center of the opening window of the laser component analyzer and the grate chute within the installable area based on the installable area parameters;

[0037] S103. Based on the distance parameters and chute parameters, determine the target installation area and select the installation location of the laser component analyzer from the target installation area.

[0038] The laser component analyzer in this embodiment of the invention is used for online detection of high-temperature molten material in a grate, and the component of the molten material in the grate is analyzed using the installed laser component analyzer.

[0039] Specifically, a site survey of the grate chute production area can be conducted to measure the chute opening depth and width, thus obtaining the chute parameters. The length, width, and height of the installable area within a preset distance range on both sides of the grate chute can also be measured to obtain the installable area parameters within that preset range. For example, the length, width, and height of the installable area within a 3-meter range on both sides of the grate chute can be measured.

[0040] The distance between the center of the viewing window of the laser component analyzer and the center of the bottom inner side of the grate chute within the installable area is determined based on the installable area parameters. When selecting the installation location of the laser component analyzer, to ensure that the laser emitted by the analyzer at the selected location always illuminates the surface of the flowing molten metal in the grate chute, a target installation area is determined based on the distance and chute parameters, and the installation location of the laser component analyzer is selected from within this target area.

[0041] In this embodiment of the invention, the installation location of the laser component analyzer is determined based on the chute parameters and the parameters of the installable area found during the site survey of the grate chute, ensuring the feasibility of application and the actual detection effect.

[0042] In one embodiment of the present invention, such as Figure 2 As shown, before obtaining the grate chute parameters and the installable area parameters within the preset range of the grate chute, the method for selecting the installation location of the laser component analyzer may also include:

[0043] Under preset purging conditions, the dust concentration within the preset space range of the grate chute is determined to be less than the preset concentration threshold.

[0044] Ensure that the fluctuation of the molten liquid level inside the grate chute is less than or equal to a preset liquid level fluctuation threshold.

[0045] The degree of crusting on the molten liquid surface inside the grate chute is determined to be less than or equal to the preset crusting threshold.

[0046] The vibration within the preset space range of the grate chute is determined to be less than the preset vibration threshold.

[0047] The electromagnetic interference within the preset space range of the grate chute is determined to be less than the preset interference threshold.

[0048] Before selecting the installation location for the laser component analyzer, it is necessary to survey the production environment conditions of the grate chute. Since laser component analyzers used for online detection of melt in the grate are usually installed above the melt chute, in order to meet the environmental requirements of the laser component analyzer and ensure its detection effect, the concentration of flue gas dust, vibration level, and electromagnetic interference around the grate chute must be monitored, as well as the degree of surface fluctuation and surface crusting of the molten melt flowing inside the grate chute must be monitored.

[0049] In an embodiment of the present invention, the preset space range may be the space range of the production environment where the grate chute is located.

[0050] It is feasible to apply a certain purging intensity (preset purging conditions) to the production environment space where the grate chute is located, and use a dust meter to test the dust concentration in the production environment where the grate chute is located, and determine whether the measured dust concentration is less than a preset concentration threshold. It should be noted that the preset concentration threshold is the limit value for dust affecting the spectral acquisition of the laser component analyzer.

[0051] If feasible, a rangefinder can be used to test the fluctuation value of the molten liquid surface flowing inside the grate chute, and to determine whether the measured molten liquid surface fluctuation value is less than the preset liquid surface fluctuation threshold.

[0052] It is feasible to use a camera to capture images of the molten liquid surface flowing inside the grate chute, perform image processing on the molten liquid surface area in the image, calculate the ratio of the scab area to the total surface area based on the processed image, obtain the scab degree value of the molten liquid surface, and determine whether the scab degree of the molten liquid surface is less than or equal to a preset scab threshold.

[0053] If feasible, an environmental vibration analyzer can be used to measure the vibration value of the production environment where the grate chute is located, and determine whether the measured vibration value is less than the preset vibration threshold.

[0054] If feasible, an electromagnetic radiation measuring instrument can be used to measure the electromagnetic interference value of the production environment where the grate chute is located, and to determine whether the measured electromagnetic interference value is less than the preset interference threshold.

[0055] If all conditions are met, the on-site parameter survey can proceed. If any condition is not met, the non-compliance item will be displayed, allowing for improvements to the production environment conditions of the grate chute based on the survey results. On-site parameter surveys will only proceed once the production environment conditions of the grate chute meet the requirements.

[0056] Before surveying the parameters of the grate chute and the pre-set installation area within the grate chute, the production environment conditions of the grate chute should be surveyed to avoid interference from the actual operating conditions when using the laser component analyzer, thereby improving the detection accuracy and validity of the detection data.

[0057] In one embodiment of the present invention, such as Figure 3 As shown, the chute parameters include the chute opening depth and chute opening width; the installable area parameters include the area length, area width, and area height; and the distance parameters include vertical and horizontal distances. Based on the distance parameters and chute parameters, the target installation area is determined, which may include:

[0058] S201, determine the vertical distance and horizontal distance that satisfy the preset relationship, wherein the preset relationship is determined by the opening depth and opening width of the tank body, and the vertical distance and horizontal distance are respectively the vertical distance and horizontal distance between the center of the opening window of the laser component analyzer installed in the area width and area height corresponding to the area length and the center of the bottom inside the grate chute.

[0059] S202, the area width and area height corresponding to the vertical and horizontal distances that satisfy the preset relationship are recorded as the target installation area.

[0060] It should be noted that the optical path of the laser component analyzer must be focused on the surface of the melt. In addition to ensuring the optical path is not obstructed by the chute side plates, it is also necessary to ensure the optical path is not obstructed by the chute cover plate to guarantee the actual detection effect. Therefore, when determining the vertical and horizontal distances between the center of the laser component analyzer's opening window and the grate chute within the installable area based on the installation area parameters, the length region corresponding to the grate chute without chute cover plate obstruction is selected. Based on the width and height of each length region, the vertical and horizontal distances between the center of the laser component analyzer's opening window and the center of the bottom inner side of the grate chute are calculated.

[0061] Specifically, the ratio of vertical distance to corresponding horizontal distance within the installable area is calculated, and the ratio that satisfies the preset relationship is determined. Based on the ratio that satisfies the preset relationship, the vertical and horizontal distances that satisfy the preset relationship are determined. The area width and area height corresponding to the vertical and horizontal distances that satisfy the preset relationship within the installable area are recorded as the target installation area.

[0062] When installing a laser component analyzer, the installation method can be determined based on the region length, region width, and region height parameters of the installable area.

[0063] If the height of the target installation area exceeds a preset threshold or there are no fixed objects within the width of the target installation area, the laser component analyzer can be installed by setting up a mounting bracket in the target installation area. For example, such as... Figure 5 As shown, a mounting bracket can be set in the target installation area, i.e., one side of the grate chute, and the laser component analyzer can be mounted on the mounting bracket.

[0064] If the height of the target installation area does not exceed a preset threshold, or if there are fixed objects within the width of the target installation area, the laser component analyzer can be installed on the fixed objects in the target installation area. For example, such as... Figure 6 As shown, a bracket can be installed on a fixed object at the top of the grate chute in the target installation area, and the laser component analyzer can be mounted on the bracket.

[0065] It should be noted that the embodiments of the present invention do not limit the installation method of the laser component analyzer.

[0066] In one embodiment of the present invention, the expression for the preset relationship is:

[0067]

[0068] Where h represents the vertical distance, l represents the horizontal distance, d represents the depth of the tank opening, and w represents the width of the tank opening.

[0069] Specifically, such as Figure 4 As shown, to ensure that the installed laser composition analyzer can irradiate the molten liquid flowing inside the grate chute regardless of the change in the flow rate of the molten liquid, the center O of the bottom inside the grate chute is selected as the origin, and the highest point inside is selected as points A and B respectively. The center of the opening window of the detection probe of the laser composition analyzer is point E.

[0070] To ensure that the detection probe of the laser composition analyzer can collect the plasma radiation light of the industrial grate melt in the industrial grate trough at different industrial grate melt levels, the installation area of ​​the laser composition analyzer should be within ∠AOB.

[0071] Therefore, it is necessary to satisfy Right now Where h represents the vertical distance between point E and point O, l represents the horizontal distance between point E and point O, d represents the vertical distance between point A (B) and point O, and w represents the horizontal distance between point A and point B.

[0072] In this embodiment of the invention, the ratio between the vertical distance and the horizontal distance between the center of the opening window of the laser component analyzer and the center of the bottom of the inner side of the grate chute must satisfy the above relationship so that the detection probe of the laser component analyzer can collect the plasma radiation light of the grate melt in the grate chute at different melt liquid level heights.

[0073] In one embodiment of the present invention, the method for selecting the installation location of the laser component analyzer further includes:

[0074] The installation locations of the control and analysis cabinet, control box, signal processing equipment, and remote control terminal are determined based on the installation location of the laser component analyzer.

[0075] It should be noted that the grate melt online detection system consists of a laser composition analyzer 1, a control and analysis cabinet 2, a control box 3, a signal processing device 4, and a remote control terminal 5.

[0076] Specifically, to achieve compositional analysis of the melt flowing in the grate chute, after determining the installation location of the laser composition analyzer 1, the installation locations of the control analysis cabinet 2, control box 3, signal processing equipment 4, and remote control terminal 5 can be determined based on the installation location of the laser composition analyzer 1. When installing the instruments and equipment, they can be installed in the following order: laser composition analyzer 1, control analysis cabinet 2, control box 3, signal processing equipment 4, and remote control terminal 5.

[0077] Laser component analyzer 1 is installed at the production site, responsible for emitting laser light, exciting the surface of the molten sample, and receiving the spectrum. Control and analysis cabinet 2 supplies power to and controls the laser component analyzer 1. Control box 3 allows for local operation and control, while remote control terminal 5 allows for remote operation and control via signal processing equipment. Remote control terminal 5 can be installed in the central control room. When connecting laser component analyzer 1, control and analysis cabinet 2, control box 3, signal processing equipment 4, and remote control terminal 5, the distance between the production site and the central control room can be measured to determine if the dimensions meet the requirements for equipment installation, use, and maintenance.

[0078] It should be noted that during installation preparation, the construction and installation site should be inspected to ensure that the work area, reserved pipelines, and safe electricity use all meet the construction and installation requirements, and to ensure that all obstacles that may affect the construction and installation site have been removed in advance.

[0079] In one embodiment of the present invention, such as Figure 7 As shown, the control and analysis cabinet corresponds one-to-one with the laser component analyzer. The control and analysis cabinet is located on one side of the laser component analyzer. The laser component analyzer is connected to the control and analysis cabinet. The control and analysis cabinet is connected to the control box. The control box is connected to the remote control terminal through signal processing equipment.

[0080] Specifically, the control and analysis cabinet 2 can be installed near the laser component analyzer 1 in the production site, in a 1:1 ratio with the laser component analyzer 1. When the control and analysis cabinet 2 and the laser component analyzer 1 are combined in a 1:1 ratio, the laser component analyzer 2 is connected to the control and analysis cabinet 2, and the control and analysis cabinet 2 is connected to the control box 3.

[0081] In one embodiment of the present invention, such as Figure 7 As shown, the control and analysis cabinet corresponds to multiple laser component analyzers, the multiple laser component analyzers are connected to the first end of the control box, the control and analysis cabinet is connected to the second end of the control box, and the third end of the control box is connected to a remote control terminal via signal processing equipment.

[0082] Specifically, the control and analysis cabinet 2 is installed in the central control room or other location, and is combined with the laser component analyzer 1 in a ratio of 1:1 to N. The laser component analyzer 1 is installed at the production site, and the control box 3 can be used for local operation and control. The laser component analyzer 1 is connected to the control box 3, and the control and analysis cabinet 2 is installed in the central control room or other location and is connected to the control box 3.

[0083] The method for selecting the installation location of the laser component analyzer in this invention involves acquiring the parameters of the grate chute and the parameters of the installable area in the production environment. Based on the distance between the center of the opening window of the laser component analyzer within the installable area and the center of the bottom inner side of the grate chute, along with the chute parameters, the installation location of the laser component analyzer is selected. This method avoids interference from operating conditions, and in terms of performance, both the detection accuracy and the validity of the detection data meet the requirements for the installation location of the laser component analyzer. This invention, by detecting the application conditions required for the laser component analyzer and determining its installation location, avoids interference from operating conditions during actual use, improves detection accuracy and the validity of detection data, and ensures application feasibility.

[0084] This invention provides a device for selecting the installation location of a laser component analyzer.

[0085] Figure 8 This is a schematic diagram of the installation location selection device for the laser component analyzer according to an embodiment of the present invention. Figure 8 As shown, the installation location selection device 100 for the laser component analyzer includes an acquisition module 10, a calculation module 20, and a selection module 30.

[0086] The acquisition module 10 is used to acquire the chute parameters and the installation area parameters within the preset range of the grate chute; the calculation module 20 is used to determine the distance parameters between the center of the opening window of the laser component analyzer installed within the installation area and the center of the bottom of the grate chute body, based on the installation area parameters; and the selection module 30 is used to select the distance parameters between the center of the opening window of the laser component analyzer installed within the installation area and the grate chute parameters, based on the installation area parameters and the chute parameters.

[0087] It should be noted that other specific embodiments of the laser component analyzer installation location selection device provided in the embodiments of the present invention can be found in other specific embodiments of the laser component analyzer installation location selection method in the above embodiments of the present invention.

[0088] The laser component analyzer installation location selection device of this invention selects the installation location of the laser component analyzer by acquiring the chute parameters and the installation area parameters of the production environment in which it is located. Based on the distance between the center of the opening window of the laser component analyzer within the installation area and the center of the bottom inner side of the chute, and the chute parameters, the device avoids operational interference. In terms of performance, the detection accuracy and data validity both meet the installation location requirements of the laser component analyzer. This invention, by detecting the application conditions required for the laser component analyzer and determining its installation location, avoids operational interference during actual use, improves detection accuracy and data validity, and ensures application feasibility.

[0089] This invention provides a computer-readable storage medium.

[0090] In this embodiment, a computer program is stored on a computer-readable storage medium. When the computer program is executed by a processor, it implements the installation location selection method for the laser component analyzer as described above.

[0091] This invention provides an electronic device.

[0092] In this embodiment, the electronic device may include a memory and a processor. The memory stores a computer program, and when the computer program is executed by the processor, it implements the installation location selection method for the laser component analyzer as described above.

[0093] Figure 9 This is a structural block diagram of an electronic device according to an embodiment of the present invention.

[0094] like Figure 9 As shown, the electronic device 500 includes a processor 501 and a memory 503. The processor 501 and the memory 503 are connected, for example, via a bus 502. Optionally, the electronic device 500 may also include a transceiver 504. It should be noted that in practical applications, the transceiver 504 is not limited to one type, and the structure of this electronic device 500 does not constitute a limitation on the embodiments of the present invention.

[0095] Processor 501 may be a CPU (Central Processing Unit), a general-purpose processor, a DSP (Digital Signal Processor), an ASIC (Application Specific Integrated Circuit), a FPGA (Field Programmable Gate Array), or other programmable logic devices, transistor logic devices, hardware components, or any combination thereof. It may implement or execute the various exemplary logic blocks, modules, and circuits described in connection with this disclosure. Processor 501 may also be a combination that implements computational functions, such as a combination of one or more microprocessors, a combination of a DSP and a microprocessor, etc.

[0096] Bus 502 may include a pathway for transmitting information between the aforementioned components. Bus 502 may be a PCI (Peripheral Component Interconnect) bus or an EISA (Extended Industry Standard Architecture) bus, etc. Bus 502 can be divided into address bus, data bus, control bus, etc. For ease of representation, Figure 9 The bus is represented by a single thick line, but this does not mean that there is only one bus or one type of bus.

[0097] The memory 503 stores a computer program corresponding to the installation location selection method of the laser component analyzer in the above embodiments of the present invention. This computer program is controlled and executed by the processor 501. The processor 501 executes the computer program stored in the memory 503 to implement the content shown in the foregoing method embodiments. Figure 9 The electronic device 500 shown is merely an example and should not be construed as limiting the functionality and scope of use of the embodiments of the present invention.

[0098] The computer-readable storage medium and electronic device of this invention utilize the above-described method for selecting the installation location of a laser component analyzer to detect the application requirements of the laser component analyzer and determine the installation location of the laser component analyzer, thereby avoiding interference from actual operating conditions, improving detection accuracy and the validity of detection data, and ensuring application feasibility.

[0099] It should be noted that the logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as a sequenced list of executable instructions for implementing logical functions, and can be embodied in any computer-readable medium for use by, or in conjunction with, an instruction execution system, apparatus, or device (such as a computer-based system, a processor-included system, or other system that can fetch and execute instructions from, an instruction execution system, apparatus, or device). For the purposes of this specification, "computer-readable medium" can be any means that can contain, store, communicate, propagate, or transmit programs for use by, or in conjunction with, an instruction execution system, apparatus, or device. More specific examples (a non-exhaustive list) of computer-readable media include: an electrical connection having one or more wires (electronic device), a portable computer disk drive (magnetic device), random access memory (RAM), read-only memory (ROM), erasable and editable read-only memory (EPROM or flash memory), fiber optic devices, and portable optical disc read-only memory (CDROM). Alternatively, the computer-readable medium may be paper or other suitable media on which the program can be printed, since the program can be obtained electronically, for example, by optically scanning the paper or other medium, followed by editing, interpreting, or otherwise processing as necessary, and then stored in a computer memory.

[0100] It should be understood that various parts of the present invention can be implemented in hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented in software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, it can be implemented using any one or a combination of the following techniques known in the art: discrete logic circuits having logic gates for implementing logical functions on data signals, application-specific integrated circuits (ASICs) having suitable combinational logic gates, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), etc.

[0101] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0102] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0103] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0104] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0105] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0106] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A method for selecting the installation location of a laser component analyzer, characterized in that, The method includes: Obtain the grate chute parameters and the installable area parameters within the preset range of the grate chute; The distance parameter between the center of the opening window of the laser component analyzer installed within the installable area and the center of the bottom inside the grate chute is determined based on the installable area parameters. Based on the distance parameters and the chute parameters, the target installation area is determined, and the installation location of the laser component analyzer is selected from the target installation area.

2. The method for selecting the installation location of the laser component analyzer according to claim 1, characterized in that, Before obtaining the grate chute parameters and the installable area parameters within the preset range of the grate chute, the method further includes: Under preset purging conditions, the dust concentration in the preset space of the grate chute is less than a preset concentration threshold. The fluctuation of the molten liquid level inside the grate chute is determined to be less than or equal to a preset liquid level fluctuation threshold. The degree of crusting on the molten liquid surface inside the grate chute is determined to be less than or equal to a preset crusting threshold. The vibration within the preset spatial range of the grate chute is determined to be less than a preset vibration threshold. The electromagnetic interference within the preset spatial range of the grate chute is determined to be less than a preset interference threshold.

3. The method for selecting the installation location of the laser component analyzer according to claim 1, characterized in that, The chute parameters include the chute opening depth and the chute opening width; the installable area parameters include the area length, the area width, and the area height; the distance parameters include the vertical distance and the horizontal distance; and determining the target installation area based on the distance parameters and the chute parameters includes: The vertical distance and the horizontal distance are determined to satisfy a preset relationship, wherein the preset relationship is determined by the opening depth and the opening width of the trough, and the vertical distance and the horizontal distance are respectively the vertical distance and the horizontal distance between the center of the opening window of the laser component analyzer installed in the region width and the region height corresponding to the region length and the center of the bottom inside the trough of the grate chute. The area width and area height corresponding to the vertical and horizontal distances that satisfy the preset relationship are recorded as the target installation area.

4. The method for selecting the installation location of the laser component analyzer according to claim 3, characterized in that, The expression for the preset relationship is: Where h represents the vertical distance, l represents the horizontal distance, d represents the depth of the groove opening, and w represents the width of the groove opening.

5. The method for selecting the installation location of the laser component analyzer according to claim 1, characterized in that, The method further includes: The installation locations of the control and analysis cabinet, control box, signal processing equipment, and remote control terminal are determined based on the installation location of the laser component analyzer.

6. The method for selecting the installation location of the laser component analyzer according to claim 5, characterized in that, The control and analysis cabinet corresponds one-to-one with the laser component analyzer. The control and analysis cabinet is located on one side of the laser component analyzer. The laser component analyzer is connected to the control and analysis cabinet. The control and analysis cabinet is connected to the control box. The control box is connected to the remote control terminal through the signal processing equipment.

7. The method for selecting the installation location of the laser component analyzer according to claim 5, characterized in that, The control and analysis cabinet corresponds to multiple laser component analyzers, the multiple laser component analyzers are connected to the first end of the control box, the control and analysis cabinet is connected to the second end of the control box, and the third end of the control box is connected to the remote control terminal through the signal processing equipment.

8. A device for selecting the installation location of a laser component analyzer, characterized in that, The device includes: The acquisition module is used to acquire the grate chute parameters and the installable area parameters within a preset range of the grate chute. The calculation module is used to determine the distance parameter between the center of the opening window of the laser component analyzer installed in the installable area and the center of the bottom inside the grate chute, based on the installable area parameters. The selection module is used to determine the target installation area based on the distance parameter and the chute parameter, and select the installation position of the laser component analyzer from the target installation area.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the method for selecting the installation location of the laser component analyzer as described in any one of claims 1-7.

10. An electronic device, comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the computer program is executed by the processor, it implements the method for selecting the installation location of the laser component analyzer as described in any one of claims 1-7.

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