Atmospheric large-panel semiconductor detector

Abstract

The invention provides an atmospheric large-panel semiconductor detector, and relates to the field of semiconductor detectors. The device comprises a bottom plate, a shielding box, a front panel and a back plate are arranged on the bottom plate, and the front panel and the back plate are detachably connected with the two ends of the shielding box respectively; the front panel is also provided with a plurality of front-end modules. The shielding box is internally provided with a rear-end electronic assembly. The front-end module penetrates through the front panel through a cable to be connected with the rear-end electronic assembly, and the rear-end electronic assembly penetrates through the backboard through a cable to be connected with an external data acquisition system. The atmospheric large-panel semiconductor detector provided by the invention can collect signals with a higher scattering angle, thereby improving the ultimate resolution of structural analysis of a coherent diffraction experiment.

Description

Technical Field

[0001] This invention relates to the field of semiconductor detectors, and in particular to an atmospheric large-panel semiconductor detector. Background Technology

[0002] Surface detectors are a term used to describe commonly used two-dimensional detectors on advanced light source large-scale scientific platforms (such as synchrotron radiation sources (SR) and X-ray free-electron lasers (XFEL)). Detectors using similar naming conventions include point detectors (i.e., zero-dimensional detectors, such as photodiodes and silicon drift chambers) and line detectors (i.e., one-dimensional detectors, such as silicon microstrip detectors). Currently, surface detectors widely used in advanced light sources, unless otherwise specified, generally refer to pixel array detectors (PADs). These are high-granularity semiconductor detectors that can achieve the segmentation of detector sensitive cells, the extraction of detector signals, and high-speed signal processing and transmission within a spacing of hundreds of micrometers or even micrometers. They possess excellent performance characteristics such as high spatial resolution (intrinsic resolution ≤ 10 µm), fast time response (signal scale ≤ 10 ns), and strong radiation resistance.

[0003] Scientific experiments on advanced light source large-scale scientific platforms can be broadly categorized into three types: imaging, scattering, and spectroscopy. Today, PADs have become indispensable main detectors for scattering and imaging experiments, and are also commonly used detectors for grating- or crystal-based spectroscopic experiments. In specific scientific applications, PADs are key core equipment for many cutting-edge scientific research areas, including the control and observation of small molecule chemical reactions, the study of biomolecular structures and dynamic molecular imaging, the dynamics, structure, and function of biological assembly in near-realistic environments, and atomic-scale time resolution of biomolecules. In particular, when combined with fully coherent, high-repetition-rate X-ray free-electron lasers (XFELs), PADs can help achieve atomic-level spatial resolution and femtosecond-level time resolution for single molecules / particles, enabling dynamic three-dimensional imaging and structural analysis at the molecular level. Furthermore, when combined with pump lasers, PADs can facilitate real-time observation of chemical reactions at the atomic scale, study the energy and charge transfer patterns at the femtosecond level, and perform instantaneous structural imaging.

[0004] These novel, cutting-edge scientific experiments generally require detectors to have: on the one hand, sufficiently high spatial resolution (on the order of 100 µm) to accurately measure the position of the diffraction spot; and on the other hand, a sufficiently large detection area (tens of centimeters). 2To obtain large-angle diffraction data, the area detector needs both small pixel size to achieve high spatial resolution and a large number of pixels to achieve a large detection area. Theoretically, to reduce the detection dead zone, the detection panel of the area detector should ideally be entirely filled with a pixel array. However, due to limitations in integrated circuit fabrication and packaging processes, the detection panel cannot be fabricated from a single wafer. A tile-like method is generally used to obtain a large detection area. These "tiles" are called front end modules (FEMs). To reduce the tile dead zone, the area of ​​the front end module should be as large as possible.

[0005] A single front-end module, coupled with a back-end readout system, mechanics, and DAQ software, can form the most commonly used single-module detector. These detectors are widely used in scattering and diffraction experiments in light sources and laboratories. To obtain better imaging resolution, scientists have developed more complex experimental methods, such as coherent diffraction imaging and serial crystallography, which place larger demands on the detector panel. Taking coherent diffraction imaging as an example, its diffraction signal is mainly divided into a high count rate region from the detector center (low spatial frequency) to a low count rate region from the detector edge (high spatial frequency), exhibiting exponential decay from the center to the edge. The completeness of the low spatial frequency diffraction signal acquisition determines whether three-dimensional reconstruction of the diffraction pattern can be achieved, while the intensity and signal-to-noise ratio (single-photon sensitivity) of the high spatial frequency diffraction signal determine the imaging resolution of the detector system. Detectors with large arrays and large panels can acquire signals at higher scattering angles, thereby improving the ultimate resolution of structural analysis in coherent diffraction experiments. Of course, the requirements of scientific experiments for the detector panel are not only related to the experimental method but also directly related to the sample type, sample size, and distance from the sample to the detector.

[0006] In summary, there is an urgent need for an atmospheric, large-panel semiconductor detector. Summary of the Invention

[0007] To address the aforementioned issues, this invention provides an atmospheric large-panel semiconductor detector capable of acquiring signals with higher scattering angles, thereby improving the ultimate resolution of structural analysis in coherent diffraction experiments.

[0008] The atmospheric large-panel semiconductor detector provided by the present invention includes a base plate, on which a shielding box, a front panel, and a back panel are provided. The front panel and the back panel are detachably connected to both ends of the shielding box. The front panel is also provided with a plurality of front-end modules, and the shielding box is also provided with a rear-end electronic component. The front-end modules are connected to the rear-end electronic component through cables passing through the front panel, and the rear-end electronic component is connected to an external data acquisition system through cables passing through the back panel.

[0009] In one feasible embodiment of the present invention, the frame refresh rate of the atmospheric large-panel semiconductor detector is ≥1kHz, and the dynamic range is ≥10. 4 Ph. / pixel / pulse @ 12keV, with single-photon sensitivity, S / N≥5 @12keV, pixel size ≤200µm×200µm, number of pixels ≥1 million, sensitive area ≥10cm×10cm, quantum efficiency ≥80% @12keV, and response energy range of 6keV~20keV.

[0010] In one feasible embodiment of the present invention, the front panel is provided with a plurality of positioning holes, the number of positioning holes being the same as the number of front-end modules, and the cable of each front-end module passing through its respective positioning hole and connecting to the back-end electronic components.

[0011] In one feasible embodiment of the present invention, the front panel is further provided with a cooling pipe, which is arranged around all the positioning holes; the bottom plate is provided with a coolant inlet pipe and a coolant outlet pipe, which are aligned with and connected to the inlet and outlet ends of the cooling pipe, respectively.

[0012] In one feasible embodiment of the present invention, the cooling pipeline includes several interconnected circumferential cooling sections, each of which is arranged around a positioning hole.

[0013] In one feasible embodiment of the present invention, the base plate is provided with a plurality of bottom ventilation arrays, the bottom ventilation arrays including a plurality of bottom ventilation holes arranged in sequence; the top of the shielding box is provided with a plurality of top ventilation arrays, the top ventilation arrays including a plurality of top ventilation holes arranged in sequence.

[0014] In one feasible embodiment of the present invention, a plurality of reinforcing ribs are provided between the front panel and the back panel, and each of the reinforcing ribs is located outside the shielding box.

[0015] In one feasible embodiment of the present invention, a protective block is further provided on the front panel, and a shielding plate is detachably provided on the protective block; and / or, a foot pad is further provided at the bottom of the base plate; and / or, a base frame detachably provided at the bottom of the base plate.

[0016] The front-end module of the atmospheric large-panel semiconductor detector provided by this invention is fabricated using a front-end module manufacturing process, which includes the following steps: Step 1): Connect the sensor and ASIC to form a ChipAssembly; Step 2): Secure the Holder to the Mounting Block; Step 3): Install the MountingBlock with the Holder fixed on it onto the positioning and pressurizing fixture, then fix the positioning and pressurizing fixture onto the dispensing machine, and use the dispensing machine to dispense adhesive onto the surface of the Holder. Step 4): Use a tool to place the WireBonding Board onto the Holder's adhesive and apply even pressure to the surface of the WireBonding Board with a torque wrench; then, dry the WireBonding Board and allow it to cool naturally to room temperature. Step 5): Apply adhesive to the MountingBlock surface from Step 4) using a dispensing machine; Step 6): Place the ChipAssembly from Step 1) onto the surface of the WireBondingBoard with glue applied in Step 5) using a pick-and-place machine; Step 7): Dry the Mounting Block from Step 6) and allow it to cool naturally to room temperature; Step 8): Use a wire bonding machine to bond the Mounting Block from Step 7); Step 9): Use the tool to remove the Holder from the MountingBlock, thus completing the front-end module production.

[0017] The present invention also provides a method for assembling an atmospheric large-panel semiconductor detector, comprising the following steps: Step 1) Assemble the front panel and back panel onto the bottom panel; Step 2) Align the front-end modules with the corresponding positioning holes and assemble them onto the front panel in sequence; Step 3) Assemble the back-end electronics components and place them on the base plate; Step 4) Connect the front-end module and the back-end electronics components with cables, and connect the various cables leading out from the back-end electronics components to the backplane. Step 5) Place the shielding box on the bottom plate so that the back-end electronic components are located inside it; Step 6) Install other accessories.

[0018] The atmospheric large-panel semiconductor detector provided by this invention has the following beneficial effects: 1) The working end of the atmospheric large-panel semiconductor detector designed in this invention, namely the detector panel, is composed of multiple front-end modules sequentially spliced ​​together. The size of a single front-end module is approximately 10.6cm × 3cm. Furthermore, according to the needs of different scientific experiments, a specified number of front-end modules can be spliced ​​together to achieve the required size of the detector panel. A typical design consists of four front-end modules spliced ​​together to form a megapixel-level detector with a pixel count of 1024 × 1024 and a detector panel size > 10cm × 10cm.

[0019] 2) The front-end modules in this invention are spliced ​​with high precision, and the mechanical error of the splicing is less than 1 pixel (i.e., ≤100 µm). All front-end modules can operate independently and can work simultaneously under the control of timing and trigger signals to achieve accurate measurement of large panels. At the same time, if a front-end module is damaged or its performance degrades due to irradiation damage, it can be easily replaced independently.

[0020] 3) The back-end electronics components in this invention adopt a standardized design and can use an MTCA chassis, which simplifies power supply and heat dissipation, while also ensuring the compactness of the overall detector design. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0022] Figure 2 This is a schematic diagram of the overall structure after the shielding box is removed in this invention.

[0023] Figure 3 This is a schematic diagram of the front panel structure in this invention.

[0024] Figure 4 This is a cross-sectional view of the front panel in this invention.

[0025] Figure 5 This is a cross-sectional view of the base plate in this invention.

[0026] Figure 6 This is a schematic diagram of the front-end module in this invention.

[0027] Figure 7 This is a process flow diagram for the front-end module in this invention.

[0028] Figure 8 This is a schematic diagram of the adhesive on the Holder surface in the front-end module of this invention.

[0029] Figure 9 This is a schematic diagram of the rectangular adhesive application on the MountingBlock surface in this invention.

[0030] Figure Labels Base plate 1 Coolant inlet pipe 11 Coolant outlet pipe 12 Bottom ventilation array 13 Foot pad 14 Frame 15 Shielding box 2 Top ventilation array 21 Front panel 3 Positioning hole 31 Cooling pipe 32 32.1 Surround cooling section Backplate 4 Front-end module 5 Backend Electronics Components 6 Reinforcing rib 7 Protection Block 8 Shielding plate 81 Detailed Implementation

[0031] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. In the description of the present invention, it should be noted that the terms "left side", "right side", "upper side", "lower side", "above", "below", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0032] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0033] Furthermore, in the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0034] This invention provides an atmospheric large-panel semiconductor detector, see reference. Figure 1 The atmospheric large-panel semiconductor detector includes a base plate 1, on which a shielding box 2, a front panel 3, and a back plate 4 are mounted. The front panel 3 and the back plate 4 are detachably connected to both ends of the shielding box 2. Specifically, the front end face of the front panel 3 is flush with the front end face of the base plate 1, and the rear end face of the back plate 4 is flush with the rear end face of the base plate 1. The shielding box 2 is located between the front panel 3 and the back plate 4. The shielding box 2 can be integrally molded and spatially divided into three shielding surfaces: two side surfaces and one top surface. The space formed by the six surfaces of the base plate 1, the shielding box 2, the front panel 3, and the back plate 4 constitutes the inner cavity of the atmospheric large-panel semiconductor detector. (See reference...) Figure 2 The front panel 3 is further equipped with several front-end modules 5, and the shielding box 2 contains a rear-end electronics component 6. The front-end modules 5 are connected to the rear-end electronics component 6 via cables passing through the front panel 3, and the rear-end electronics component 6 is connected to an external data acquisition system via cables passing through the back panel 4. Specifically, the front-end modules 5 and the rear-end electronics component 6 are the two core components of the atmospheric large-panel semiconductor detector. The front-end modules 5 receive X-ray photon and electron signals, and the rear-end electronics component 6 processes the signals fed back by the front-end modules 5. The two complement each other and are indispensable.

[0035] Regarding front-end module 5: See [link / reference] Figure 2 The front-end modules 5 are typically arranged longitudinally on the front panel 3, and the working ends of the front-end modules 5 are kept flush, meaning that the working end faces of the front-end modules 5 are all on the same surface. Furthermore, the splicing accuracy between adjacent front-end modules 5 is ≤100 µm, and each front-end module 5 is rectangular. The larger rectangle formed by multiple front-end modules 5 constitutes the working end of the large-panel semiconductor detector. For illustration, the front-end modules 5 are spliced ​​using external tooling. In one feasible splicing method, the front panel 3 has various holes, namely pin positioning holes, mounting holes, and tooling holes. When splicing the front-end modules 5, first, two positioning rods are passed through the tooling holes, and then the positioning rods are connected to the front-end modules 5; then, the front-end modules 5 are pulled along the positioning rods onto the front panel 3, and the front-end modules 5 are precisely positioned onto the front panel 3 by driving pins into the pin positioning holes; then, the front-end modules 5 are securely installed onto the front panel 3 through the mounting holes; finally, the positioning rods are removed from the tooling holes. This allows the front-end module 5 to be installed onto the front panel 3 with high precision, and ensures that the splicing accuracy between modules 5 is ≤100 µm.

[0036] Regarding the back-end electronic component 6: The back-end electronic component 6 may include various electronic devices such as power supplies, processing chips, readout boards, and interfaces of various types. Alternatively, the back-end electronic component 6 may directly use a commercially available MTCA chassis. The advantage of the MTCA chassis is that it integrates numerous electronic devices, including power supplies, processing chips, and readout boards, and specifies the interface types and signal transmission protocols for each electronic device, such as standard power standards, mechanical standards, and electrical standards. When using the MTCA chassis as the back-end electronic component 6 in this invention, the signal integration technology used is existing technology and will not be elaborated here. For illustration, using an MTCA chassis simplifies power supply and heat dissipation, while also ensuring the compactness of the overall detector design. Specifically, the base plate 1 has a straight groove, the width of which matches the width of the MTCA chassis. When installing the back-end electronic component 6, the back-end electronic component 6 is placed in the straight groove. The length of the straight groove typically allows the MTCA chassis to slide appropriately along the groove, thus providing sufficient operating space when installing and connecting various cables. In addition, the back panel 4 is equipped with two fixing plates. After the cable is plugged in, the two side walls of the MTCA chassis can be connected to the two fixing plates by screws. At the same time, the bottom of the MTCA chassis can be connected to the base plate 1 by screws.

[0037] In one specific embodiment, in conjunction with reference to Figure 3 and Figure 4 The front panel 3 has a plurality of positioning holes 31, the number of which is the same as the number of front-end modules 5. The cable of each front-end module 5 passes through its respective positioning hole 31 and connects to the rear-end electronic component 6. Preferably, the positioning holes 31 are arranged sequentially along the longitudinal direction of the front panel 3 so that the front-end modules 5 can also be arranged sequentially along the longitudinal direction of the front panel 3.

[0038] In the atmospheric large-panel semiconductor detector provided in this embodiment of the invention, the front-end module 5 and the back-end electronic components 6 are connected by a high-density cable. The back of the front-end module 5 is designed with a high-density cable adapter that matches the high-density cable. When the front-end module 5 is working, its ASIC chip releases a large amount of heat. Furthermore, because the splicing accuracy between the front-end modules 5 is ≤100 µm, the high-density cable adapters are arranged very tightly, which makes it easy for heat to accumulate on the front panel 3. Therefore, to solve the heat problem of the front-end module 5 during operation, this invention designs a unique water-cooling method, see reference [link to relevant documentation]. Figure 4The front panel 3 is also provided with a cooling pipe 32, which surrounds all the positioning holes 31. The base plate 1 is provided with a coolant inlet pipe 11 and a coolant outlet pipe 12, which are aligned with and connected to the inlet and outlet ends of the cooling pipe 32, respectively. Specifically, the coolant inlet pipe 11 and the coolant outlet pipe 12 both extend from the rear end face of the base plate 1, and the rear end face of the base plate 1 is provided with an adapter for connecting the coolant inlet pipe 11 and the coolant outlet pipe 12. The adapter can be connected to a coolant circulation pump via a hose to achieve coolant circulation. As an explanation, the gap between adjacent front-end modules 5 is usually very small. Therefore, when the front-end module 5 is working, its heat is easily accumulated in a local area of ​​the front panel 3, usually at the center of the front panel 3. Excessive heat accumulation can not only cause a significant decrease in the working efficiency of the front-end module 5, but may even cause irreversible physical damage to the front-end module 5. Therefore, it is necessary to dissipate heat from the front-end module 5, and the cooling pipe 32 can perfectly meet this requirement. The cooling pipe 32 effectively disperses the heat concentrated in a local area of ​​the front panel 3 in a surrounding manner, allowing the front-end module 5 to be in a suitable working environment. It is particularly important to note that in conventional cooling designs, the cooling pipes are usually disconnected when disassembling the body being cooled. Therefore, it is necessary to completely drain the coolant before disassembly or assembly; otherwise, the coolant will leak from the disconnection point of the cooling pipes during disassembly or assembly. The cooling pipe 32, coolant inlet pipe 11, and coolant outlet pipe 12 designed in this invention exist independently of the body being cooled, that is, independently of the front-end module 5, and therefore the above-mentioned problem does not exist. Specifically, when disassembling or assembling the front-end module 5 or the back-end electronic components 6, the disassembly or assembly between the front panel 3 and the base plate 1 is not involved. Therefore, it is not necessary to specifically extract the coolant from the cooling pipe 32, the coolant inlet pipe 11 and the coolant outlet pipe 12, and the coolant leakage during disassembly or assembly can be completely prevented, thus ensuring the safety and reliability of the atmospheric large panel semiconductor detector.

[0039] Further reading Figure 4 The cooling pipe 32 includes several interconnected, surrounding cooling sections 32.1, each of which surrounds a positioning hole 31. Specifically, the distance between the surrounding cooling section 32.1 and the edge of the positioning hole 31 is short, effectively preventing heat from dissipating outward. It should be emphasized that, based on the cooling pipe 32, the surrounding cooling section 32.1 provides heat dissipation for each high-density cable adapter, further dispersing the heat accumulated on the front panel 3.

[0040] In one specific embodiment, see Figure 5The base plate 1 is provided with a plurality of bottom ventilation arrays 13, each including a plurality of bottom ventilation holes arranged in sequence; the top of the shielding box 2 is provided with a plurality of top ventilation arrays 21, each including a plurality of top ventilation holes arranged in sequence. Specifically, the back-end electronics component 6 typically includes a fan, so when the fan is working, the bottom ventilation arrays 13 and top ventilation arrays 21 can effectively disperse heat to the outside of the atmospheric large-panel semiconductor detector by thermal convection.

[0041] In one specific embodiment, in conjunction with reference to Figure 1 and Figure 2 Several reinforcing ribs 7 are provided between the front panel 3 and the back plate 4, each of which is located outside the shielding box 2. Specifically, a total of three reinforcing ribs 7 are provided between the front panel 3 and the back plate 4. One reinforcing rib 7 is provided between the top of the front panel 3 and the top of the back plate 4, and the remaining two reinforcing ribs 7 are provided between the two sides of the front panel 3 and the two sides of the back plate 4, respectively. The reinforcing ribs 7 can be connected to the front panel 3 and the back plate 4 using screws. Furthermore, a handle is provided on the reinforcing rib 7 between the top of the front panel 3 and the top of the back plate 4, which allows relevant experimental personnel to easily move the atmospheric large-panel semiconductor detector.

[0042] In one specific embodiment, see Figure 1 The front panel 3 is also provided with a protective block 8, and a shielding plate 81 is detachably provided on the protective block 8. The shielding plate 81 can block the front module 5, so that the front module 5 is not exposed to light when it is not in operation, thereby protecting the front module 5.

[0043] In one specific embodiment, in conjunction with reference to Figure 1 and Figure 2 The bottom of the base plate 1 is also provided with foot pads 14. Specifically, the bottom of the base plate 1 is also provided with a base frame 15 that is detachable from the base plate 1. Specifically, the base frame 15 can be connected to the base plate 1 with screws. Both the foot pads 14 and the base frame 15 are used to support the base plate 1 and suspend it in the air, so that the rear electronic components 6 can make full use of heat convection for heat dissipation.

[0044] In this invention, the front-end module 5 is a core component, and its importance is self-evident. Therefore, this invention also provides a manufacturing process for the front-end module 5, and the structure of the front-end module 5 can be found in [reference needed]. Figure 6 For the manufacturing process of front-end module 5, please refer to [link / reference]. Figure 7 It includes the following steps: Step 1): Connect the Sensor and ASIC to form a ChipAssembly. For illustration, the Sensor is a sensor chip that converts incident photon signals into electrical signals. The ASIC is an electronics front-end readout chip that further amplifies, filters, shapes, and digitizes the electrical signals. The ChipAssembly is a chip module that packages the Sensor and ASIC together.

[0045] Step 2): Secure the Holder to the Mounting Block. For illustration, the Holder is a mechanical support that provides support and also functions as a heat-conducting module for heat dissipation. The Mounting Block is the operating fixture for the front-end module; see another patent of this applicant for details, patent title: A PCB Precision Positioning and Pressurization Device and Its Usage Method, patent application number: 202410706453X.

[0046] Step 3): Install the Mounting Block with the Holder fixed onto the positioning and pressurizing fixture, then fix the positioning and pressurizing fixture onto the dispensing machine, and use the dispensing machine to dispense adhesive onto the Holder surface. (Refer to...) Figure 8 For illustrative purposes, the positioning and pressurizing fixture is detailed in another patent of the applicant, entitled "A Precise Positioning and Pressurizing Device for PCB and Its Usage Method," application number: 202410706453X. The purpose of applying adhesive to the holder surface is twofold.

[0047] The primary objective is to securely attach the WireBonding Board to the Holder. Since the WireBonding Board has a large connector at its center, the center of the Holder needs to be recessed to accommodate it. Additionally, the Holder has recesses designed to accommodate components such as low-dropout linear regulators (LDOs), resistors, or filter capacitors on the back of the WireBonding Board. Therefore, the actual area available for adhesive on the Holder surface is limited, and the large connectors typically have a high pin count, requiring significant force when plugging and unplugging cables. Therefore, a sufficiently strong adhesive must be selected to ensure that the WireBonding Board, once attached to the Holder, will not loosen due to frequent cable insertion and removal.

[0048] The second objective is to achieve good thermal conductivity. Heat from the heat-generating components on the ASIC and Wire Bonding Board is dissipated through the holder. Therefore, an adhesive with high thermal conductivity is required.

[0049] Step 4): Place the WireBondingBoard on the glue of the Holder using a tooling fixture, and apply uniform pressure on the surface of the WireBondingBoard with a torque wrench; then, dry the WireBondingBoard and wait for it to cool naturally to room temperature. For illustration, the WireBondingBoard is a wire bonding board, which realizes connecting the signals of the ASIC to the electronics backend readout board through leads and high-density adapters. There are no components on the front side of the WireBondingBoard, only wire bonding pads corresponding to the ASIC pads, and pads for introducing high voltage to the Sensor. There are multiple components and a large connector on the back side of the WireBondingBoard. The components include low dropout linear regulators (LDOs), resistors, or filter capacitors, etc.

[0050] Step 5): Use a dispensing machine to dispense glue on the surface of the MountingBlock in Step 4). For illustration, two points need to be noted for the glue dispensing in this step. The first point is that the glue coverage area is large enough to fully contact the ASIC chip to improve the heat dissipation effect. The second point is that the glue thickness is large enough to adjust and buffer the warpage of the WireBondingBoard and the chip, reducing the stress on the flip chip bonding. Therefore, the "return" shaped glue application is finally selected instead of the conventional "rice" shaped glue application. The glue area should cover the ASIC size as much as possible without overflowing into the splicing seam of the ASIC. Refer to Figure 9 .

[0051] Step 6): Place the ChipAssembly in Step 1) on the surface of the WireBondingBoard with glue dispensed in Step 5) through a chip mounter. For illustration, the chip mounter is described in another patent of the applicant, with the patent title: A wafer-level semiconductor device chip mounting device, and the patent application number: 2024110246406.

[0052] Step 7): Dry the MountingBlock in Step 6) and wait for it to cool naturally to room temperature; Step 8): Use a wire bonding machine to bond wires to the MountingBlock in Step 7); Step 9): Use a tooling fixture to remove the Holder from the MountingBlock, and至此, the production of the front-end module 5 is completed.

[0053] In the process flow of manufacturing the front-end module provided by the present invention, Step 1) further includes any one of the following technical features: 1) Perform quality screening on the Sensor and record it in the front-end module database. Preferably, the screening standard for the Sensor is that the breakdown voltage of the current collection ring ≥ 200V.

[0054] 2) Perform quality screening on ASICs and enter the data into the front-end module database. Preferably, the screening criterion for ASICs is that the number of bad pixels is ≤50.

[0055] 3) Perform quality screening on ChipAssembles and enter them into the front-end module database. For the best quality, perform visual screening on ChipAssembles. The screening criterion for ChipAssembly is that the number of short-circuited pixel rows and columns is ≤5.

[0056] 4) The sensor pixel size is ≤200μm×200μm, preferably 200μm×200μm; the number of sensors is ≥65536, preferably 65536; and the actual effective area of ​​the sensor is ≥106mm×28mm, preferably 106mm×28mm. Note that to reduce the stitching dead zone, the sensor design should be as large as possible; typically, only 5 sensors can be placed on an 8-inch wafer.

[0057] 5) The pixel size of the ASIC is ≤200μm×200μm, preferably 200μm×200μm, the number of pixels of the ASIC is ≥4096, preferably 4096, and the size of the ASIC is ≥12.8mm×14.4mm, preferably 12.8mm×14.4mm.

[0058] 6) The pixels of the sensor and the pixels of the ASIC are electrically interconnected through flip-chip bonding. Because the ASIC is smaller than the sensor, multiple ASICs need to be flip-chip bonded onto the sensor sequentially. Preferably, 2×8 ASICs are flip-chip bonded sequentially. Furthermore, the solder bumps for flip-chip bonding between the sensor and the ASIC are copper pillars with solder caps. The diameter of the solder bumps is 20~40µm, preferably 30µm, and the height is 40~50µm, preferably 47µm. The minimum spacing between adjacent solder bumps is 50~70µm, preferably 60µm.

[0059] In the manufacturing process of the front-end module provided by this invention, step 2) further includes any one of the following technical features: 1) Enter the Holder's number into the front-end module database.

[0060] 2) Use alcohol to perform ultrasonic cleaning on the Holder. Preferably, the ultrasonic frequency is 20~60kHz and the ultrasonic time is 10~20min.

[0061] 3) Use alcohol to perform ultrasonic cleaning on MountingBlock. Preferably, the ultrasonic frequency is 20~60kHz and the ultrasonic time is 10~20min.

[0062] In the manufacturing process of the front-end module provided by this invention, step 4) further includes any one of the following technical features: 1) Place the WireBondingBoard and the positioning and pressurizing fixture together in an oven to dry. Preferably, the oven temperature is 90°C and the drying time is 30 minutes.

[0063] 2) The size of the Holder is the same as that of the WireBondingBoard, with redundancy of ≤100µm on each of the four sides, preferably 100µm.

[0064] 3) The size of the Holder is ≥107.26mm×30.76mm, preferably 107.26mm×30.76mm.

[0065] 4) The holder is made of aluminum.

[0066] 5) Steps are also provided on the two long sides of the Holder.

[0067] 6) Laser engraving is done on the holder to indicate the location and number of each ASIC chip.

[0068] 7) The torque of the torque wrench is ≥5 N*m.

[0069] 8) The bending of the WireBondingBoard is ≤50µm.

[0070] 9) The number of printing plates in the WireBondingBoard is ≥6, preferably 6.

[0071] 10) The size of the WireBondingBoard is ≥107.06mm×30.56mm, preferably 107.06mm×30.56mm. This size is a circuit board with a relatively large aspect ratio.

[0072] In the manufacturing process of the front-end module provided by this invention, step 5) further includes any one of the following technical features: In step 5): the adhesive selected is a non-conductive adhesive with high bonding strength and high thermal conductivity; In step 5): The grooves in the Holder are glued using a zigzag pattern, and the surface of the Holder is glued using a linear pattern.

[0073] In the manufacturing process of the front-end module provided by this invention, step 6) further includes any one of the following technical features: In step 6): The front of the WireBondingBoard is provided with wire bonding pads corresponding to the ASIC pads. Preferably, each ASIC has 111 leads to the wire bonding pads. In step 6): the ASIC leads are gold wires; In step 6): the ASIC and the Wire Bonding Board are bonded together by ultrasonic thermocompression bonding; In step 6): The back of the WireBondingBoard is equipped with a large connector, preferably with 180 pins; In step 6): The back of the WireBondingBoard has the same number of LDOs as the ASIC.

[0074] For illustrative purposes, if step 6) uses the chip mounter described in application number 2024110246406, entitled "A Wafer-Level Semiconductor Device Mounting Apparatus", then the specific mounting process in step 6) is as follows: Powering on: Turn on the compressed air, turn on the power, turn on the computer, and open the operating software.

[0075] Loading: Place the ChipAssembly onto the loading unit using anti-static vacuum tweezers, ensuring that the long and short sides of the ChipAssembly are firmly attached to the first positioning pins. Place the WireBondingBoard (actually a sample module with mechanical support) onto the stage, ensuring that the long and short sides of the WireBondingBoard are firmly attached to the second positioning pins. Turn on the vacuum generator to hold the WireBondingBoard in place.

[0076] Material suction: Move the suction nozzle along the first guide rail (X-axis) above the loading unit; press the suction nozzle down along the second guide rail (Z-axis) to pick up the ChipAssembly on the loading unit. Normally, the suction nozzle is set to stop when it is close to the surface of the ChipAssembly, and then slowly press down on the ChipAssembly to prevent over-pressure and damage to the ChipAssembly.

[0077] Material handling: After the suction nozzle picks up the ChipAssembly and lifts it along the second guide rail (Z-axis), it moves it along the first guide rail (X-axis) to the position of the stage.

[0078] Move the WireBondingBoard: Adjust the position of the stage on the third guide rail (Y-axis) so that the WireBondingBoard is roughly aligned with the ChipAssembly.

[0079] The piston structure of the control cylinder for moving the beam splitter prisms: causes the piston to eject the two beam splitters to the working position and turns on the LED lights at the top and bottom of the two beam splitters.

[0080] Coarse alignment: Observe the positioning marks (marks, one pair at each of the four corners) of ChipAssembly and WireBondingBoard on the monitor. Adjust the position of ChipAssembly and WireBondingBoard using the first guide rail (X-axis), the third guide rail (Y-axis), and the rotating unit (U-axis) so that the reference points of ChipAssembly and WireBondingBoard are aligned at both ends of the same long side, thereby achieving overall alignment of ChipAssembly pads and WireBondingBoard pads.

[0081] Remove the beam splitter: Control the cylinder piston structure, retract the piston, and drive the beam splitter to retract.

[0082] Press down: Press the nozzle down to the position set on the second guide rail (Z-axis) via the software.

[0083] Fine alignment: After coarse alignment of ChipAssembly and WireBondingBoard, turn on the LED lights on the gradient microscope to further observe the images of ChipAssembly and WireBondingBoard on the monitor. Adjust the positions of ChipAssembly and WireBondingBoard using the first guide rail (X-axis), the third guide rail (Y-axis), and the rotating unit (U-axis) to align the positioning marks at the two opposite corners along the long side of ChipAssembly and WireBondingBoard. Confirm the pad alignment, pad spacing, and feasibility of wire bonding to complete the fine alignment.

[0084] Patch Placement: The control module presses the nozzle down along the second guide rail (Z-axis) until the ChipAssembly is firmly attached to the WireBondingBoard. During patch placement, a pressure sensor on the nozzle detects the pressure applied. When the detected pressure is reached, the nozzle automatically stops pressing down to prevent damage to the ChipAssembly.

[0085] Release: After patching is completed, turn off the vacuum generator, remove the sample, and place it in an oven to dry the adhesive.

[0086] In step 7): MountingBlock is placed in an oven to dry. Preferably, the oven temperature is 90°C and the drying time is 30 minutes. In step 8): Both sides of the bottom surface of the MountingBlock are provided with positioning holes that can match the wire bonding clamps used by the wire bonding machine. First, connect the positioning hole on one side of the bottom surface of the MountingBlock to the wire bonding clamp and wire bond half of the ASIC on the MountingBlock. Then, connect the positioning hole on the other side of the bottom surface of the MountingBlock to the wire bonding clamp and wire bond the other half of the ASIC on the MountingBlock. In step 8): After all the ASIC wire bonding on MountingBlock is completed, check the ASIC wire bonding under a microscope.

[0087] In step 9): X-ray testing is performed on the front-end module, and the front-end module is graded in terms of quality. Preferably, the quality screening criteria for the front-end module is that there are no large-area bad spots, and the number of failed pixel rows and columns on a single ASIC is <5.

[0088] The contents of the aforementioned front-end module 5 are all included in the priority document, titled: A semiconductor detector and its manufacturing process, application number: 2024114110068.

[0089] The present invention also provides a method for assembling an atmospheric large-panel semiconductor detector, comprising the following steps: Step 1) Assemble the front panel 3 and back panel 4 onto the base plate 1. Specifically, the front panel 3 has a slot, and the bottom of the slot has screw holes that extend to the bottom of the front panel 3. The base plate 1 has corresponding screw holes. When installing the front panel 3 and the base plate 1, simply screw the screws into the slot in the front panel 3 and the screw holes in the base plate 1. The installation of the back panel 4 and the base plate 1 is similar and will not be described in detail.

[0090] Step 2) Align the front-end module 5 with the corresponding positioning holes 31 and assemble them onto the front panel 3. Specifically, when installing the front-end module 5 onto the front panel 3, a special tooling can be used. After installation, the splicing accuracy should be maintained at ≤100µm. The number of front-end modules 5 can be selected according to requirements, using a front panel 3 corresponding to the number of holes.

[0091] Step 4) Assemble the back-end electronics component 6 and place it on the base plate 1. The back-end electronics component 6 is typically housed in an integrated chassis, such as an MTCA chassis, which can be customized according to specific requirements.

[0092] Step 5) Connect the front-end module 5 and the back-end electronics component 6 with cables, and connect the various cables leading out from the back-end electronics component 6 to the backplane 4. Specifically, the cables can be divided into the following categories according to their functions: power lines, high-voltage lines, optical fibers, trigger signal lines, timing lines, etc. Cables using the same signal transmission protocol and interface can be integrated on the backplane 4 before being connected outwards, which can effectively reduce the complexity of external cables.

[0093] Step 6) Place the shielding box 2 on the base plate 1 so that the rear electronic components 6 are located inside it. Specifically, the base plate 1 has a step. After placing the shielding box 2 on the base plate 1, its outer wall abuts against the inner side wall of the step, and its front and rear ends are clamped by the front panel 3 and the back plate 4 respectively to complete the fixation of the shielding box 2.

[0094] Step 7) Install other accessories. Specifically, other accessories include: shielding plate 81, reinforcing rib 7, handle, etc. In one specific installation method, the shielding plate 81 is first installed onto the protective block 8, then the shielding plate 81 is pressed onto the protective block 8 using a pressure plate, and then the pressure plate and the protective block 8 are fixed with screws, so that the shielding plate 81 is fixedly clamped by the pressure plate and the protective block 8.

[0095] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present invention, and these improvements and substitutions should also be considered within the scope of protection of the present invention.

Claims

1. An atmospheric large-panel semiconductor detector, characterized in that: The large panel semiconductor detector includes a base plate (1), on which a shielding box (2), a front panel (3) and a back plate (4) are provided. The front panel (3) and the back plate (4) are detachably connected to both ends of the shielding box (2). The front panel (3) is also provided with several front-end modules (5), and the shielding box (2) is also provided with a back-end electronic component (6); the front-end module (5) is connected to the back-end electronic component (6) through the front panel (3) by a cable, and the back-end electronic component (6) is connected to the external data acquisition system through the back panel (4) by a cable.

2. The atmospheric large-panel semiconductor detector according to claim 1, characterized in that: The large-panel semiconductor detector has a frame refresh rate ≥1kHz and a dynamic range ≥10. 4 Ph. / pixel / pulse @ 12keV, with single-photon sensitivity, S / N≥5 @12keV, pixel size ≤200µm×200µm, number of pixels ≥1 million, sensitive area ≥10cm×10cm, quantum efficiency ≥80% @12keV, and response energy range of 6keV~20keV.

3. The atmospheric large-panel semiconductor detector according to claim 1, characterized in that: The front panel (3) is provided with a number of positioning holes (31), the number of which is the same as the number of front-end modules (5). The cables of each front-end module (5) pass through their respective positioning holes (31) and are connected to the rear-end electronic components (6).

4. The atmospheric large-panel semiconductor detector according to claim 2, characterized in that: The front panel (3) is also provided with a cooling pipe (32), which surrounds all the positioning holes (31); the base plate (1) is provided with a coolant inlet pipe (11) and a coolant outlet pipe (12), which are aligned with and connected to the inlet and outlet ends of the cooling pipe (32) respectively.

5. The atmospheric large-panel semiconductor detector according to claim 3, characterized in that: The cooling pipe (32) includes several interconnected circumferential cooling sections (32.1), each of which is arranged around a positioning hole (31).

6. The atmospheric large-panel semiconductor detector according to claim 1, characterized in that: The base plate (1) is provided with several bottom ventilation arrays (13), the bottom ventilation arrays (13) include multiple bottom ventilation holes arranged in sequence; the top of the shielding box (2) is provided with several top ventilation arrays (21), the top ventilation arrays (21) include multiple top ventilation holes arranged in sequence.

7. The atmospheric large-panel semiconductor detector according to claim 1, characterized in that: Several reinforcing ribs (7) are provided between the front panel (3) and the back panel (4), and each reinforcing rib (7) is located outside the shielding box (2).

8. The atmospheric large-panel semiconductor detector according to claim 1, characterized in that: The front panel (3) is also provided with a protective block (8), and a shielding plate (81) is detachably provided on the protective block (8); and / or, the bottom of the base plate (1) is also provided with a foot pad (14); and / or, the bottom of the base plate (1) is also provided with a base frame (15) detachable from the base plate (1).

9. The atmospheric large-panel semiconductor detector according to claim 1, characterized in that, The front-end module (5) is prepared using the manufacturing process of the front-end module (5), which includes the following steps: Step 1): Connect the sensor and ASIC to form a ChipAssembly; Step 2): Secure the Holder to the Mounting Block; Step 3): Install the MountingBlock with the Holder fixed on it onto the positioning and pressurizing fixture, then fix the positioning and pressurizing fixture onto the dispensing machine, and use the dispensing machine to dispense adhesive onto the surface of the Holder. Step 4): Use a tool to place the WireBonding Board onto the Holder's adhesive and apply even pressure to the surface of the WireBonding Board with a torque wrench; then, dry the WireBonding Board and allow it to cool naturally to room temperature. Step 5): Apply adhesive to the MountingBlock surface from Step 4) using a dispensing machine; Step 6): Place the ChipAssembly from Step 1) onto the surface of the WireBondingBoard with glue applied in Step 5) using a pick-and-place machine; Step 7): Dry the Mounting Block from Step 6) and allow it to cool naturally to room temperature; Step 8): Use a wire bonding machine to bond the Mounting Block from Step 7); Step 9): Use a tool to remove the Holder from the MountingBlock, thus completing the front-end module (5).

10. A method for assembling an atmospheric large-panel semiconductor detector as described in any one of claims 1 to 8, characterized in that, Includes the following steps: Step 1) Assemble the front panel (3) and back panel (4) onto the base plate (1); Step 2) Align the front-end module (5) with the corresponding positioning hole (31) and install it onto the front panel (3) in sequence; Step 3) Assemble the back-end electronics component (6) and place the back-end electronics component (6) on the base plate (1); Step 4) Connect the front-end module (5) and the back-end electronics component (6) with cables, and connect the various cables leading out from the back-end electronics component (6) to the backplane (4); Step 5) Place the shielding box (2) on the base plate (1) so that the back-end electronic components (6) are located inside it; Step 6) Install other accessories.

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