Modularized structure of test rotating plate

Abstract

The invention relates to a test rotating plate modular structure, which is applied to a test packaging machine table, the test packaging machine table comprises an upper mold and a lower mold, and an adapter plate between the upper mold and the lower mold comprises an upper top surface, a lower bottom surface and four side surfaces, the upper top surface is concavely arranged towards the lower bottom surface to form an inner concave part and a blocking part positioned on the peripheral side of the inner concave part; when a test is carried out and the upper die and the lower die are close to each other, a plurality of solder balls of the electronic circuit device between the adapter plate and the upper die enter the inner concave part, and the position, not provided with the solder balls, of the electronic circuit device abuts against the blocking and abutting part, so that the pressure can be dispersed on the supporting plate; therefore, the problem of internal cracking at the contact position of each solder ball and the adapter plate is avoided, and the stability of the electrical test is further maintained.

Description

Technical Field

[0001] This invention discloses a modular test board structure, specifically applied to the fields of circuit boards and wafers. Its main purpose is to protect the integrity of the DRAM and solder balls or the solder balls and the adapter board during testing of the circuit board and wafer, and to maintain stability during testing. Background Technology

[0002] The most important part of high-precision equipment such as circuit boards and wafers is the connection between various electronic components. Taking circuit boards as an example, circuit boards are mainly composed of copper clad laminates (CCL), prepreg (PP sheet), copper foil, solder mask (also known as solder resist film), and character layer. After the various electronic components are installed on the circuit board, they must be joined together by soldering, and the metallic properties of copper foil are used to form a conductive circuit.

[0003] Please see Figure 13 , Figure 14 As shown, POP packaging is an advanced packaging technology that integrates multiple chip components. It is typically used in space-constrained applications, such as mobile phone CPUs. It allows multiple wafers 4 and circuit boards to be stacked together, saving space and improving performance. In POP packaging testing, the most important part is whether the electronic components are correctly soldered. For example, the soldering between the circuit board and the wafer 4 used to test the device under test. However, because the solder balls 6 that the electronic components are in contact with cannot be repeatedly contacted, it becomes a regular replacement of the circuit board and wafer 4, which increases the testing cost. In order to meet the requirements of the circuit board and wafer 4 speed increasing to 10800mbps, the thickness of the adapter board 5 needs to be reduced to 0.8mm or less. Past experience shows that reducing the thickness of the adapter board 5 will cause the pressure to be concentrated on the solder balls 6 on the circuit board and wafer 4 during testing, which may cause internal cracks between the circuit board / wafer 4 and the solder balls 6 or between the solder balls 6 and the adapter board 5, resulting in unstable testing and increased costs. Summary of the Invention

[0004] The main technical problem to be solved by the present invention is to overcome the above-mentioned defects of the prior art and provide a modular test board structure, so that when the circuit board and the wafer are subjected to POP packaging test, internal cracks will not occur between the solder balls on the solder joint and the circuit board or the wafer or between the solder balls and the adapter board, and the electrical connection between the above-mentioned parties will be maintained to maintain the stability of the test.

[0005] The technical solution adopted by this invention to solve its technical problem is: A modular test board structure is applied in a test packaging machine. The test packaging machine includes an upper mold and a lower mold. The adapter plate located between the upper mold and the lower mold includes an upper top surface, a lower bottom surface, and four sides. A recessed portion is formed on the upper top surface facing the lower bottom surface, and a stop portion is located on the periphery of the recessed portion. When testing is performed, as the upper mold and the lower mold approach each other, several solder balls of the electronic circuit device located between the adapter plate and the upper mold enter the recessed portion. The position of the electronic circuit device where there are several solder balls abuts against the stop portion, thereby preventing the solder balls from being directly compressed and breaking.

[0006] A modular test board structure is applied in a test packaging machine. The test packaging machine includes an upper mold and a lower mold. A transition plate is located between the upper mold and the lower mold, and a support plate is stacked on the transition plate. The support plate has several through holes extending from the upper end face to the lower end face. During testing, when the upper mold and the lower mold are close to each other, several solder balls of the electronic circuit device located between the support plate and the upper mold enter the corresponding through holes. The positions of the electronic circuit device without solder balls are abutted against the upper end face of the support plate, thereby preventing the solder balls from being directly pressured and breaking.

[0007] The beneficial effect of this invention is that, during POP packaging testing of circuit boards and wafers, internal cracks will not occur between the solder balls on the solder joints and the circuit board / wafer or between the solder balls and the adapter board, thus maintaining the electrical connection between the above-mentioned components to ensure stability during testing. Attached Figure Description

[0008] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0009] Figure 1 This is a schematic diagram of a planar mechanism in the first embodiment of the present invention, before the test packaging machine and electronic circuit device are brought into close proximity.

[0010] Figure 2A This is an exploded perspective view of the first embodiment of the present invention and the electronic circuit device.

[0011] Figure 2B for Figure 2A Another perspective on the decomposed 3D diagram.

[0012] Figure 3 This is a three-dimensional schematic diagram of the first embodiment of the present invention combined with an electronic circuit device.

[0013] Figure 4 for Figure 3 The diagram shows a cross-sectional view of line segment IV-IV.

[0014] Figure 5This is a schematic diagram of a planar mechanism in the second embodiment of the present invention, before the test packaging machine and electronic circuit device are brought into close proximity.

[0015] Figure 6 This is an exploded perspective view of the second embodiment of the present invention and the electronic circuit device.

[0016] Figure 7 This is a three-dimensional schematic diagram of the second embodiment of the present invention being superimposed with an electronic circuit device.

[0017] Figure 8 for Figure 7 The diagram shows a cross-sectional view of line segment VIII-VIII.

[0018] Figure 9 This is a schematic diagram of a planar mechanism in the third embodiment of the present invention, before the test packaging machine and electronic circuit device are brought into close proximity.

[0019] Figure 10 This is an exploded perspective view of the third embodiment of the present invention, including the electronic circuit device and the adapter board.

[0020] Figure 11 This is a three-dimensional schematic diagram of the operation of the third embodiment of the present invention, which is superimposed with electronic circuit devices and adapter boards.

[0021] Figure 12 for Figure 11 The diagram shows a cross-sectional view of line segment XII-XII.

[0022] Figure 13 A schematic diagram of a planar structure for performing multiple wafer packaging tests on an existing POP packaging machine.

[0023] Figure 14 This is a planar schematic diagram of the point where a chip's solder ball and the adapter plate may break in an existing POP packaging machine.

[0024] Explanation of the labels in the diagram: 100 test packaging machines Upper mold 101 Lower mold 102 Electronic circuit device 200 Tin Ball 201 Test probe 300 Adapter 1 Upper top surface 11 Bottom surface 12 Side 13 Concave part 14 Blocking part 15 Support section 16 partition 17 18 cubicles Transmission component 2 Support plate 3 31 perforations Wafer 4 Adapter board 5 Tin Ball 6 Detailed Implementation

[0025] Please see Figures 1 to 12 As shown, the present invention discloses a modular test board structure applied within a test packaging machine 100. This test packaging machine 100 primarily performs electrical tests on wafers and circuit boards to check whether the electronic components within them are conductive. The test packaging machine 100 includes an upper mold 101 and a lower mold 102. The testing method involves placing the wafer and circuit board (hereinafter referred to as electronic circuit device 200 for illustrative purposes) within the test packaging machine 100. After startup, the upper mold 101 and the lower mold 102 gradually approach and align. The adapter plate 1 located between the upper mold 101 and the lower mold 102 includes an upper top surface 11, a lower bottom surface 12, and four side surfaces 13. 1 is a rectangular plate, with an inner recess 14 formed on the upper top surface 11 facing the lower bottom surface 12, and a stop portion 15 on the periphery of the inner recess 14. When the upper mold 101 and the lower mold 102 are brought close together during testing, several solder balls 201 of the electronic circuit device 200 located between the adapter plate 1 and the upper mold 101 enter the inner recess 14 (the pins of the electronic components in the electronic circuit device 200 are soldered and fixed, and the solder forms a spherical body covering the pins, which is called a solder ball 201). The electronic circuit device 200 at the position where several solder balls 201 are not provided abuts against the stop portion 15, thereby preventing each solder ball 201 from being directly pressed and breaking.

[0026] According to the above description of the present invention, when a user tests the electronic circuit device 200, both the upper mold 101 and the lower mold 102 are equipped with instruments capable of electrical contact testing (called Pogo Pins, also known as spring pins or probes, which are mainly testing tools, commonly used in IC testing. They have elastic properties, providing stable contact force and connection to ensure the accuracy and reliability of the test. This elasticity allows them to connect tightly to the IC pins during testing and maintain consistent performance across multiple tests, thereby improving production efficiency and testing accuracy). Therefore, when the electronic circuit device 200 is placed in the test packaging machine 100, the upper mold 101 and the lower mold 102, when aligned, allow the numerous probes built into the upper mold 101 and the lower mold 102 to directly and indirectly make electrical connections to the solder balls 201 on the electronic circuit device 200, thereby enabling conductivity testing. However, in the current situation, because of the POGOP... The continuous contact of the IN spring with the adapter plate 5 causes pressure to concentrate on the wafer 4 and the solder balls 6 of the circuit board during testing. This can lead to internal cracks between the wafer 4 / circuit board and the solder balls 6, or between the solder balls 6 and the adapter plate 5, resulting in unstable testing. Therefore, the present invention aims to solve the above-mentioned problems. The adapter plate 1 is recessed on one side corresponding to the electronic circuit device 200 to form the recessed portion 14. This allows the portion of the electronic circuit device 200 with solder balls 201 to enter the recessed portion 14, while the portion of the electronic circuit device 200 without solder balls 201 will abut against the stop portion 15. In this way, the solder balls 201 will not be subjected to pressure and breakage, providing additional support and stability, reducing the stress on the solder balls 201, thereby extending the life of the electronic circuit device 200 and reducing replacement costs.

[0027] Based on the above description, other technical features and structures of the present invention will be further described below. Firstly, the present invention has various embodiments in the design of the recessed portion 14 of the adapter plate 1. The common forms of this electronic circuit device 200 are as follows: Figure 2B As shown, the portion with solder balls 201 is shaped like a square, while the portion without solder balls 201 has a central part and an outer part. Therefore, in order to match the type of electronic circuit device 200, the adapter board 1 will have two embodiments. Please see... Figures 1 to 4As shown in the first embodiment, the recessed portion 14 of the adapter plate 1 is further recessed from the upper top surface 11 towards the lower bottom surface 12 to form a groove. Several conductive elements 2 are embedded between the recessed portion 14 and the lower bottom surface 12. During the testing operation of the test packaging machine 100, the adapter plate 1 gradually approaches each test probe 300 and makes electrical contact with each test probe 300 through each conductive element 2. The electronic circuit device 200 gradually approaches the adapter plate 1 and each solder ball 201 enters the recessed portion 14 and makes electrical contact with each conductive element 2. In the parts of the electronic circuit device 200 where there are not several solder balls 201, it will abut against the stop portion 15 of the adapter plate 1. The stop portion 15 is located at the periphery of the electronic circuit device 200. In this way, the solder balls 201 of the electronic circuit device 200 will not be subjected to excessive pressure and break.

[0028] Continuing the above description, the two embodiments mainly rely on the abutment portions 15 around the recessed portion 14 of the adapter plate 1 to support the electronic circuit device 200. Alternatively, a support portion 16 can be formed by protruding from the recessed portion 14 corresponding to the center of the electronic circuit device 200 (without the arrangement of several solder balls 201). The support portion 16 mainly assists the abutment portion 15 in supporting the electronic circuit device 200, thereby reducing the pressure on the electronic circuit device 200 when the upper mold 101 and the lower mold 102 are engaged. Please see... Figure 2A , Figure 2B As shown.

[0029] Please refer to the second embodiment of the present invention (e.g.) Figures 5 to 8 As shown, the first embodiment is that a single recessed space corresponds to all the solder balls 201, while the second embodiment divides the aforementioned single recessed space so that each solder ball 201 can be individually represented. Therefore, the recessed part 14 is further provided with several partitions 17 arranged in a grid pattern, and the partitions 17 are connected to form several compartments 18 corresponding to the position of each solder ball. Each compartment 18 is a spherical space that matches the shape of each solder ball 201. The second embodiment mainly increases the support for the electronic circuit device 200 by setting each partition 17, and can also further disperse the pressure to avoid excessive concentration on the solder balls 201.

[0030] In addition to the recessed portion 14 on the adapter plate 1 as described above, a support plate 3 can also be stacked on the adapter plate 1 if the recessed portion 14 is not present. Please refer to [reference needed]. Figures 9 to 12As shown, the support plate 3 has several through holes 31 extending from the upper end face to the lower end face. During testing, the upper mold 101 and the lower mold 102 approach each other, the adapter plate 1 gradually approaches each test probe 300 and makes electrical contact with each test probe 300 through each conductive element 2, while the electronic circuit device 200 gradually approaches and abuts against the support plate 3, and several solder balls 201 of the electronic circuit device 200 are inserted into the through holes 31 of the support plate 3, so that each solder ball 201... After entering each perforation 31, the part will make electrical contact with each conductive element 2. The electronic circuit device 200, which is not provided with several solder balls 201, is attached to the upper surface of the support plate 3, thereby preventing each solder ball 201 from being directly compressed and breaking. The support plate 3 is a soft board material, which can be made of insulating rubber. It can be seen that the third embodiment of the present invention utilizes the setting of the support plate 3 to disperse the force on each solder ball 201, thereby protecting each solder ball 201 from breaking.

[0031] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present invention shall still fall within the scope of the technical solution of the present invention.

Claims

1. A modular structure for testing turntables, characterized in that, It is used in a test packaging machine, which includes an upper mold and a lower mold. The adapter plate located between the upper mold and the lower mold includes an upper top surface, a lower bottom surface and four sides. A recessed part is formed on the upper top surface facing the lower bottom surface and a stop part is located on the periphery of the recessed part. During testing, when the upper mold and the lower mold approach each other, several solder balls of the electronic circuit device located between the adapter plate and the upper mold enter the recessed part, and the electronic circuit device, where there are not several solder balls, abuts against the stop part, thereby preventing each solder ball from being directly pressed and breaking.

2. The modular test board structure according to claim 1, characterized in that, The recessed portion of the adapter plate is further recessed from the top surface to the bottom surface to form a groove, and several conductive elements are embedded between the recessed portion and the bottom surface. The test packaging machine further includes several test probes. During the operation test of the upper mold and the lower mold, the adapter plate gradually approaches each test probe and makes electrical contact with each test probe through each conductive element. The electronic circuit device gradually approaches the adapter plate and enters the recessed portion with each solder ball and makes electrical contact with each conductive element. In the part where there are not several solder balls, the electronic circuit device will abut against the blocking part of the adapter plate.

3. The modular test board structure according to claim 2, characterized in that, The recessed part is further provided with several partitions arranged in a grid pattern, and the partitions are connected to form several compartments corresponding to the positions of each solder ball.

4. The modular test board structure according to any one of claims 1 to 3, characterized in that, A support portion is further formed at the center of the recessed portion of the adapter plate, which together with the stop portion supports the electronic circuit device.

5. A modular structure for a test turntable, characterized in that, It is used in a test packaging machine, which includes an upper mold and a lower mold. A transition plate is located between the upper mold and the lower mold, and a support plate is stacked on the transition plate. The support plate has several through holes that extend from the upper end face to the lower end face. During testing, when the upper mold and the lower mold approach each other, several solder balls of the electronic circuit device located between the support plate and the upper mold enter the corresponding through holes. The electronic circuit device, where there are not several solder balls, abuts against the upper surface of the support plate, thereby preventing the solder balls from being directly pressed and breaking.

6. The modular test board structure according to claim 5, characterized in that, The support plate is a flexible board made of insulating rubber.

7. The modular test board structure according to claim 5, characterized in that, The adapter plate has several conductive elements embedded inside each of the perforations of the support plate. The test packaging machine further includes several test probes. During the operation test of the upper mold and the lower mold, the adapter plate gradually approaches each test probe and makes electrical contact with each test probe through each conductive element. The electronic circuit device gradually approaches and abuts against the support plate, and several solder balls of the electronic circuit device are inserted into each of the perforations of the support plate, so that each solder ball makes electrical contact with each conductive element after entering each perforation.

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