Electromigration testing device and testing method thereof
By designing an independent detection chamber and an automatic temperature control system, the problem of inconsistent chip electromigration test results was solved, achieving efficient and accurate electromigration testing.
Patent Information
- Application Number
- CN202512038082.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-31
- Publication Date
- 2026-03-03
AI Technical Summary
Existing chip electromigration testing equipment cannot accurately control the testing environment for each chip, resulting in inconsistent test results and affecting the accuracy of electromigration reliability testing.
Design an electromigration testing device that employs multiple independent testing chambers, each equipped with a temperature sensor and an electric push rod to automatically adjust the chip temperature, and ensures the consistency of the testing environment for each chip through cooling fans and barrier structures.
This achieves consistency in the testing environment for each chip, improves the accuracy and efficiency of electromigration testing, reduces manual operation steps, and lowers production costs.
Smart Images
Figure CN121596080A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of chip testing technology, specifically to an electromigration testing device and its testing method. Background Technology
[0002] After the chips are manufactured, they need to undergo electromigration testing to check their electromigration reliability.
[0003] When testing chip reliability via electromigration, a common method is to test the chip at its rated current and recommended operating temperature. This method most directly reflects the chip's electromigration reliability, but it is time-consuming, significantly extending the product development and production cycle. To improve testing efficiency, testing the chip in a high-density current and high-temperature environment can greatly shorten the testing cycle. A common approach is to test individual chips, which provides the most accurate data, but the sample size is too small to accurately reflect the overall lifespan of a batch of products.
[0004] Currently, there are devices capable of testing multiple chips simultaneously. These devices typically place multiple chips into the same high-temperature heating chamber for testing. The advantage of this method is that it can test multiple chips at once. However, during testing, the chips themselves generate heat due to the high-density current applied, and the heat generation varies between different chips. Since the equipment cannot regulate the temperature of individual chips, the actual electromigration failure temperature of each chip is different, resulting in inaccurate lifetime test results.
[0005] To address this, an electromigration testing device and method are proposed to improve the accuracy of chip electromigration reliability testing results. Summary of the Invention
[0006] The purpose of this invention is to provide an electromigration testing device and method. By designing an intelligent sensing system to detect the temperature of each chip during electromigration testing, and automatically cooling the chip when it exceeds the set test temperature without affecting the heating of other chips, the accuracy of electromigration testing for each chip is ensured.
[0007] To achieve the above objectives, the present invention provides the following technical solution: An electromigration testing device and method thereof includes a housing and a test frame. The housing is cylindrical, and a heating source is disposed at the center of the housing. The test frame is coaxially mounted on the housing, and a heating cavity for housing the heating source is disposed at the center of the test frame. The outer circumference of the heating cavity is divided into multiple fan-shaped grooves, which cooperate with the inner wall of the housing to form multiple detection cavities. The side of the fan-shaped grooves near the heating cavity is a heating detection wall. Two guide rails are horizontally fixedly mounted on the heating detection wall, and a sliding test plate for mounting a test circuit board is slidably mounted on the guide rails. The test circuit board is a circuit board on which the chip to be tested is mounted. The sliding test plate has clamps on both sides for holding the test circuit board. The clamps are connected to a power source and supply power to the test circuit board. One clamp is connected to the positive terminal of the circuit, and the other clamp is connected to the negative terminal. When two clamps in the same detection chamber hold a test circuit board together, the test circuit board forms a closed circuit. The top of the test frame is also provided with an adjustment chamber. Each detection chamber has a connection port on its top for connecting to the adjustment chamber. Multiple electric push rods are horizontally arranged inside the adjustment chamber corresponding to multiple detection chambers. Each sliding test plate has a connecting part on its top. The connecting part extends upward into the adjustment chamber and is fixedly connected to the output end of the corresponding electric push rod. An adjustment plate for closing the connection port is horizontally fixed on the connecting part. When the electric push rod extends, the sliding test plate and the adjustment plate move away from the heating detection wall and open the connection port. A cooling fan is also provided inside the adjustment chamber. A temperature measuring component for detecting the temperature of the test circuit board is provided inside each detection chamber.
[0008] By setting up multiple individual detection chambers evenly distributed around the circumference, and using a single heat source to heat each chamber from the center of the circle, the distance between each chamber and the heat source is ensured to be equidistant. Furthermore, the test circuit board is attached to a sliding test plate, which in turn is attached to a heated detection wall. This ensures that each test circuit board is at the same distance from the heat source, contributing to a consistent testing environment for each board. However, during chip testing, various factors such as current fluctuations and varying resistances in the circuit board's conductors can generate additional heat during electromigration testing. This causes the preset values to become variable, ultimately leading to deviations between the tested results and the desired outcomes.
[0009] When the temperature measuring component detects that the temperature of the test circuit board is higher than the set temperature, the temperature measuring component will send a signal to the electric push rod at the top of the corresponding detection chamber. The electric push rod will drive the sliding test plate to move away from the heated detection wall. After the sliding test plate is out of contact with the heated test plate, the temperature cannot be directly transferred to the sliding test plate, and therefore cannot be directly transferred to the test circuit board. This will reduce the temperature of the test circuit board.
[0010] At the same time, as the electric push rod extends halfway, the adjustment plate also moves along with the connecting part, which opens the connection port. At this time, the cooling fan starts in the adjustment chamber, and cold air can enter the inside of the detection chamber, reducing the temperature of the test circuit board inside the detection chamber. When the temperature of the test circuit board drops to the set value, the electric push rod retracts and resets, and the sliding test plate and adjustment plate will also reset.
[0011] When the temperature of the test circuit boards inside multiple test chambers exceeds the set value, multiple connection ports are opened, and the cooling fan can simultaneously enter multiple test chambers to cool different test circuit boards at the same time.
[0012] Preferably, the clamp includes a rotating shaft, a torsion spring, and a clamping plate. The rotating shaft is mounted on a sliding test plate, the clamping plate is rotatably mounted on the rotating shaft, and the torsion spring is disposed on the rotating shaft to keep the clamping plate rotating in the direction of the sliding test plate. The clamping plate is made of elastic metal and gradually thins from the end near the rotating shaft to the end away from the rotating shaft.
[0013] The clip is made of elastic metal and gradually thins at the end away from the pivot. This allows the clip to fit more closely to the test circuit board through elastic deformation, avoiding a small contact area and excessive current density that could cause the temperature at the contact point to rise. This further ensures the stability of the test environment and thus the accuracy of the test results.
[0014] Preferably, each of the detection chambers has two horizontally arranged hooks on its internal heating detection wall. These two hooks correspond to two clamps within the chamber, and are located on either side of the sliding test plate within the chamber, facing each other. A pull plate is fixedly installed on the side of the clamp near the rotating shaft. The bottom of the outer casing also has a recovery chamber for retrieving the test circuit board, and each detection chamber has a discharge port at its bottom for communication with the recovery chamber.
[0015] When the electric push rod extends to its limit position, the pull plate squeezes the hook, causing the clamping piece to rotate away from the sliding test plate. At this point, due to the loss of clamping, the test circuit board will fall from the sliding test plate and eventually fall into the recovery chamber from the discharge port below, achieving automatic unloading and further improving the automation level of the equipment. This automatic unloading does not require additional drive components; it can be achieved with the electric push rod, which helps to save on equipment production costs.
[0016] Preferably, the temperature measuring component includes a connecting rod fixedly mounted on the clamp, the connecting rod being made of elastic insulating material, and a temperature sensor being fixedly mounted at the end of the connecting rod away from the clamp. When the clamp clamps the test circuit board, the temperature sensor abuts against the test circuit board, and the temperature sensor is electrically connected to the electric push rod.
[0017] The elastic connecting rod, mounted on the clamp, ensures that the temperature sensor remains in constant contact with the test circuit board, guaranteeing stable temperature detection. Simultaneously, its placement on the clamp allows it to rotate with the clamp when it rotates to release the test circuit board, preventing the circuit board from constantly pressing against the sliding test plate and falling off. Insulating material helps prevent high-density current from damaging the temperature sensor.
[0018] Preferably, a barrier cavity is provided inside the sidewall between each adjacent detection cavity.
[0019] By setting up an isolation cavity containing air, the temperature transfer rate between detection cavities can be reduced compared to solid conduction. This prevents one detection cavity from affecting other detection cavities when it needs to cool down, further ensuring a uniform and stable environment between the test circuit boards during electromigration testing.
[0020] Preferably, a baffle plate is rotatably installed at the bottom of each discharge port. The baffle plate is used to close the discharge port. The baffle plate is rotatably installed on the side near the center of the outer shell. A sliding groove is provided on the baffle plate. A connecting rod is provided between the baffle plate and the bottom of the sliding test plate. One end of the connecting rod is rotatably installed at the bottom of the sliding test plate, and the other end of the connecting rod is rotatably installed inside the sliding groove and can slide along the direction of the sliding groove.
[0021] The baffle plate is connected to the sliding test plate via a connecting rod. When the electric push rod pushes the sliding test plate away from the heating detection wall, and the pull hook pulls the plate, causing the clamp to open, the baffle plate rotates downward under the action of the connecting rod, opening the discharge port. This allows the test circuit board that falls due to the release of the clamp to fall into the recovery chamber through the discharge port. The control of the baffle plate and the clamp occurs synchronously, resulting in higher synchronization and eliminating the need for other drive components, thus helping to save on production and control costs.
[0022] Preferably, the length of the groove is the same as half of the maximum extension length of the electric push rod.
[0023] By setting the length of the chute, when the electric push rod extends halfway, the connecting rod can slide parallel inside the chute without pressing down on the baffle plate. This prevents the baffle plate from opening downwards and avoids the cold air from the cooling fan entering the detection chamber and then entering the recovery chamber through the discharge port, thus preventing it from affecting other detection chambers.
[0024] An electromigration testing method, comprising the aforementioned electromigration testing apparatus, specifically includes the following steps: S1: Prepare the test circuit board with the chip installed; S2: Two clamps hold the test circuit board and form a closed loop. At the same time, an ammeter is connected in series with the closed circuit where the test circuit board is located to detect the leakage current. S3: Set the heating temperature, start the heating source to begin heating, and supply the set current to the closed circuit where the test circuit board is located; S4: The temperature sensor detects the temperature of the test circuit board and compares it with the set heating temperature; S5: When the temperature of the test circuit board is higher than the set heating temperature, the cooling fan starts, the corresponding electric push rod extends 1 / 2 of its length, the sliding test board separates from the heating detection wall, and the connection port opens to allow cold air to enter the detection chamber to begin cooling. S6: After the temperature of the test circuit board decreases, the electric push rod retracts and the connection is closed. The test circuit board is then re-attached to the temperature rise detection wall to continue the test. S7: After the leakage current reaches the set value, the electric push rod extends to its maximum length, the pull plate squeezes the pull hook, the clamp releases the test circuit board, and at the same time the discharge port opens, and the discarded test circuit board falls into the recycling chamber.
[0025] Using this method, in conjunction with the aforementioned electromigration testing device, the testing environment can be made as similar as possible among the test circuit boards tested in the same batch, allowing the test results to more accurately reflect the electromigration reliability of a batch of chips.
[0026] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. The electromigration testing device designed in this invention sets up an independent detection chamber and detects the temperature of the test circuit board through a temperature measuring component. If the temperature rises abnormally, the extension of the electric push rod can create a distance between the test circuit board and the heated detection wall, reducing the temperature transfer from the heating source to the test circuit board. At the same time, the connection port is opened to allow the cooling fan to enter the detection chamber to further reduce the temperature of the test circuit board to the set temperature, ensuring the accuracy of the electromigration test data.
[0027] 2. The electromigration testing device designed in this invention is also equipped with a hook. The hook, together with an electric push rod, a connecting rod, and a barrier plate, can automatically remove the test circuit board directly from the sliding test plate and send it into the recycling chamber for automatic collection when the electric push rod pushes the sliding test plate. This reduces manual operation steps and improves the ease of use of the equipment.
[0028] 3. The present invention also designs an electromigration testing method. Using the above-mentioned electromigration testing device, the temperature of each test circuit board can be independently controlled, so that the test temperature of each chip tested in the same device is as similar as possible, thereby improving the reliability and accuracy of electromigration test data. Attached Figure Description
[0029] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a bottom-view perspective view of the test fixture in this invention; Figure 3 This is a bottom view of the fan-shaped groove in this invention; Figure 4 This is a schematic diagram of the internal structure of the detection cavity in this invention; Figure 5 This is a schematic diagram showing the state of the electric push rod when it is fully extended in this invention; Figure 6 This is a perspective view of the sliding test plate in this invention; Figure 7 For the present invention Figure 6 Enlarged view of point A in the middle; Figure 8 This is a flowchart of the electromigration testing method in this invention.
[0030] In the diagram: 1. Outer shell; 2. Test frame; 3. Heating source; 4. Heating chamber; 5. Fan-shaped groove; 6. Detection chamber; 7. Heating detection wall; 8. Guide rail; 9. Sliding test plate; 10. Clamp; 101. Rotating shaft; 102. Torsion spring; 103. Clamping piece; 11. Adjustment chamber; 12. Connection port; 13. Electric push rod; 14. Connecting part; 15. Adjustment plate; 16. Cooling fan; 17. Hook; 18. Pull plate; 19. Recycling chamber; 20. Discharge port; 21. Overlapping rod; 22. Temperature sensor; 23. Barrier chamber; 24. Barrier plate; 25. Slide groove; 26. Connecting rod; 27. Loading door plate; 28. Test circuit board; 281. Substrate; 282. Chip; 283. Positive electrode connecting piece; 284. Negative electrode connecting piece. Detailed Implementation
[0031] Please see Figures 1 to 8 This invention provides an electromigration testing device and method, the technical solution of which is as follows: An electromigration testing apparatus, reference Figures 1 to 7 The device includes a housing 1 and a test frame 2. The housing 1 is cylindrical, and a heating source 3 is located at its center. The test frame 2 is coaxially mounted on the housing 1. The test frame 2 has a heating cavity 4 at its center to enclose the heating source 3. The outer circumference of the heating cavity 4 is divided into multiple fan-shaped grooves 5. These multiple fan-shaped grooves 5, together with the inner wall of the housing 1, form multiple detection chambers 6. Each detection chamber 6 is powered independently, and a barrier cavity 23 is provided inside the side wall between each adjacent detection chamber 6. A loading gate plate 27 is rotatably mounted on the housing 1 corresponding to each detection chamber 6. The side of the fan-shaped groove 5 closest to the heating chamber 4 is a temperature rise detection wall 7. Two guide rails 8 are horizontally fixed on the temperature rise detection wall 7. A sliding test plate 9 for mounting the test circuit board 28 is slidably mounted on the guide rails 8. The test circuit board 28 is a circuit board on which the chip 282 to be tested is mounted. The test circuit board 28 includes a substrate 281 and a chip 282. A metal positive electrode connecting piece 283 is provided on one side of the substrate 281. The bottom surface of the chip 282 is sintered and connected to the positive electrode connecting piece 283 by a metal connector. A metal negative electrode connecting piece 284 is also provided on the other side of the substrate 281. The back side of the chip 282 is connected to the negative electrode connecting piece 284 by a flying wire.
[0032] refer to Figure 6 The sliding test plate 9 has clamps 10 on both its left and right sides for holding the test circuit board 28. Each clamp 10 includes a rotating shaft 101, a torsion spring 102, and a clamping plate 103. The rotating shaft 101 is mounted on the sliding test plate 9, and the clamping plate 103 is rotatably mounted on the rotating shaft 101. The torsion spring 102 is located on the rotating shaft 101 to keep the clamping plate 103 rotating towards the sliding test plate 9. The clamping plate 103 is made of elastic metal and gradually thins from the end closer to the rotating shaft 101 to the end farther away from the rotating shaft 101. The clamping plate 103 of one clamp 10 is connected to the positive terminal of the power supply circuit inside the detection cavity 6, and the clamping plate 103 of the other clamp 10 is connected to the negative terminal of the power supply circuit inside the detection cavity 6.
[0033] refer to Figure 1 The test rack 2 is also provided with an adjustment cavity 11 at the top. Each detection cavity 6 has a connection port 12 at the top for connecting to the adjustment cavity 11. Multiple electric push rods 13 are horizontally arranged inside the adjustment cavity 11 corresponding to multiple detection cavities 6. Each sliding test plate 9 is provided with a connecting part 14 at the top. The connecting part 14 extends upward into the adjustment cavity 11 and is fixedly connected to the output end of the corresponding electric push rod 13. An adjustment plate 15 for closing the connection port 12 is horizontally fixed on the connecting part 14. When the electric push rod 13 extends, the sliding test plate 9 and the adjustment plate 15 move away from the heated detection wall 7 and open the connection port 12. A cooling fan 16 is also provided inside the adjustment cavity 11.
[0034] refer to Figure 6 and Figure 7 Each detection chamber 6 is equipped with a temperature measuring component for detecting the temperature of the test circuit board 28. The temperature measuring component includes a connecting rod 21 fixedly installed on the clamp 103. The connecting rod 21 is made of elastic insulating material. A temperature sensor 22 is fixedly installed at the end of the connecting rod 21 away from the clamp 103. When the clamp 10 clamps the test circuit board 28, the temperature sensor 22 abuts against the test circuit board 28. The temperature sensor 22 is electrically connected to the electric push rod 13.
[0035] refer to Figure 3 , Figure 4 , Figure 5 Two hooks 17 are horizontally arranged on the heating detection wall 7 inside each detection chamber 6. The two hooks 17 correspond to the two clamps 10 in the detection chamber 6. The two hooks 17 are located on both sides of the sliding test plate 9 in the detection chamber 6, and the two hooks 17 are arranged opposite each other. A pull plate 18 is fixedly installed on the side of the clamp 103 near the rotating shaft 101. When the electric push rod 13 extends to the limit position, the pull plate 18 squeezes the hooks 17 and causes the clamp 103 to rotate away from the sliding test plate 9. A recycling chamber 19 for recycling the test circuit board 28 is also provided at the bottom of the outer shell 1. A discharge port 20 is provided at the bottom of each detection chamber 6 for communicating with the recycling chamber 19.
[0036] refer to Figure 4 and Figure 5 Each discharge port 20 has a baffle plate 24 rotatably mounted at its bottom. The baffle plate 24 is rotatably mounted on the side closest to the center of the outer shell 1. The baffle plate 24 is provided with a sliding groove 25, the length of which is the same as 1 / 2 of the maximum extension length of the electric push rod 13. A connecting rod 26 is provided between the baffle plate 24 and the bottom of the sliding test plate 9. One end of the connecting rod 26 is rotatably mounted at the bottom of the sliding test plate 9, and the other end of the connecting rod 26 is rotatably mounted inside the sliding groove 25 and can slide along the direction of the sliding groove 25.
[0037] Disconnect the power to the device before use. (Reference) Figure 1 , Figure 2 and Figure 7 Open the loading door 27, place the test circuit board 28 with the chip 282 installed parallel to the sliding test plate 9 into the detection chamber 6, and place the side of the test circuit board 28 where the chip 282 is located towards the side of the loading door 27. Hold the test circuit board 28 with one hand and press the pull plate 18 on the clamp 10 connected to the positive electrode towards the heating detection wall 7 with the other hand to open the clamp 10. Place the test circuit board 28 between the clamp 103 and the sliding test plate 9, align the positive electrode connecting piece 283 on the test circuit board 28 with the clamp 103, and then release the pull plate 18 so that the clamp 103 abuts against the positive electrode connecting piece 283 under the action of the torsion spring 102.
[0038] Subsequently, reference Figure 6 and Figure 7 Slide the test circuit board 28 horizontally to remove it from pressing against the clamp 103 on the other clamp 10. Then, pull the pull plate 18 on the other clamp 10 to open it. Move the test circuit board 28 horizontally again to align the negative terminal connecting piece 284 on the test circuit board 28 with the clamp 103 connected to the negative terminal. Release the clamp 103 so that it abuts against the negative terminal connecting piece 284 on the test circuit board 28. At this time, the temperature sensor 22 abuts against the test circuit board 28 under the action of the connecting rod 21. To facilitate understanding whether the chip 282 has failed due to electromigration, an ammeter can be connected in series in each detection chamber 6 to the closed circuit containing the test circuit board 28 to detect leakage current. The leakage current can be set to 0.5mA or other values.
[0039] refer to Figure 1 After closing the loading door 27, the installation of the test circuit board 28 is complete. Then, simply repeat the above steps to install the test circuit board 28 inside all the detection chambers 6.
[0040] Next, the device is connected to an external power supply, and the required test temperature and test current for chip 282 are set. Heating source 3 begins heating at the set temperature, dissipating heat and transferring it to the heated detection wall 7 inside each detection chamber 6. The heated detection wall 7 then heats up and transfers the temperature to the sliding test plate 9, which in turn transfers the temperature to the test circuit board 28. Simultaneously, a set current is applied to the closed circuit containing the test circuit board 28 within each detection chamber 6, initiating the electromigration test.
[0041] At this time, the temperature sensor 22 inside each detection chamber 6 detects the temperature of the test circuit board 28 inside the detection chamber 6 during the test and compares it with the set heating temperature.
[0042] refer to Figure 1 , Figure 2 , Figure 4 and Figure 5When the temperature of the test circuit board 28 exceeds the set heating temperature, the cooling fan 16 starts, turbulently generating cool air within the regulating chamber 11. Simultaneously, the electric push rod 13 corresponding to the top of the detection chamber 6 containing the test circuit board 28 (which has a temperature higher than the set temperature) starts, extending to half its maximum length. The sliding test plate 9 disengages from the heating detection wall 7, preventing further heat conduction to the test circuit board 28. Furthermore, due to the horizontal displacement of the connecting part 14, the regulating plate 15 connected to the connecting part 14 also moves, opening the connection port 12. Cool air from inside the regulating chamber 11 enters the detection chamber 6 through the connection port 12, beginning to cool the test circuit board 28. At this time, the temperature sensor 22 remains in contact with the test circuit board 28, continuing to monitor its temperature. It should be noted that the connecting rod 26 slides within the slide groove 25 at this time, without pushing aside the barrier plate 24, and the discharge port 20 remains closed.
[0043] When the temperature sensor 22 detects a decrease in the temperature of the test circuit board 28, the electric push rod 13 retracts and resets, and the connection port 12 is closed by the adjustment plate 15. The test circuit board 28 is then reattached to the temperature detection wall 7 and the test continues.
[0044] refer to Figure 4 and Figure 5 When the ammeter in the detection chamber 6 detects that the leakage current has reached the set value, the test is considered complete, and the equipment records the time required for the test in the detection chamber 6. At the same time, the electric push rod 13 extends to its maximum length, the pull plate 18 squeezes the pull hook 17, the clamp 10 rotates to release the test circuit board 28, and the test circuit board 28 falls downward.
[0045] refer to Figure 4 and Figure 5 When the electric push rod 13 extends to half its maximum length, the end of the connecting rod 26 connected to the slide 25 will abut against the end of the slide 25. As the electric push rod 13 continues to extend, the connecting rod 26 will rotate downward under the push of the sliding test plate 9, and will also drive the baffle plate 24 to rotate downward, opening the discharge port 20. The completed test circuit board 28 will then fall from the discharge port 20 into the recovery chamber 19 for automatic collection. Subsequently, the electric push rod 13 retracts and resets, and the baffle plate 24 also resets under the pull of the connecting rod 26, closing the discharge port 20.
[0046] This concludes the description of the entire operation process of the equipment.
[0047] refer to Figure 8 The present invention also provides an electromigration testing method, comprising: S1: Prepare the test circuit board 28 with chip 282 installed; S2: Two clamps 10 clamp the test circuit board 28 and form a closed loop. At the same time, an ammeter is connected in series to the closed circuit where the test circuit board 28 is located to detect the leakage current. S3: Set the heating temperature, start heating source 3 to start heating, and pass the set current into the closed circuit where test circuit board 28 is located; S4: Temperature sensor 22 detects the temperature of test circuit board 28 and compares it with the set heating temperature; S5: When the temperature of the test circuit board 28 is higher than the set heating temperature, the cooling fan 16 starts, the corresponding electric push rod 13 extends 1 / 2 of its length, the sliding test plate 9 disengages from the heating detection wall 7, and the connection port 12 opens to allow cold air to enter the detection chamber 6 to begin cooling. S6: After the temperature of the test circuit board 28 decreases, the electric push rod 13 retracts and the connection port 12 is closed. The test circuit board 28 is then re-attached to the temperature rise detection wall 7 to continue the test. S7: After the leakage current is detected to reach the set value, the electric push rod 13 extends to its maximum length, the pull plate 18 squeezes the pull hook 17, the clamp 10 releases the test circuit board 28, and at the same time the discharge port 20 opens, and the discarded test circuit board 28 falls into the recycling chamber 19.
[0048] The specific embodiment of the present invention has been described in detail above with reference to the accompanying drawings, but the present invention is not limited to the embodiments described above. For those skilled in the art, various changes, modifications, substitutions, and variations made to these embodiments without departing from the principles and ideas of the present invention should still fall within the protection scope of the present invention.
Claims
1. An electromigration testing device, characterized in that, The test includes a housing (1) and a test frame (2). The housing (1) is cylindrical and has a heating source (3) at its center. The test frame (2) is coaxially mounted on the housing (1). The test frame (2) has a heating cavity (4) at its center for housing the heating source (3). The outer circumference of the heating cavity (4) is divided into multiple fan-shaped grooves (5). The multiple fan-shaped grooves (5) cooperate with the inner wall of the housing (1) to form multiple detection cavities (6). The side of the fan-shaped groove (5) closest to the heating cavity (4) is a heating detection wall (7). Two guide rails (8) are horizontally fixed on the heating detection wall (7). A sliding test plate (9) is slidably mounted on the guide rails (8). The left and right sides of the sliding test plate (9) are provided with clamps (10) for holding the test circuit board (28). The top of the test frame (2) is also provided with an adjustment cavity (11). Each of the... Each of the detection chambers (6) has a connection port (12) at the top for connecting to the adjustment chamber (11). The adjustment chamber (11) has multiple electric push rods (13) horizontally arranged corresponding to the multiple detection chambers (6). Each of the sliding test plates (9) has a connection part (14) at the top. The connection part (14) extends upward into the adjustment chamber (11) and is fixedly connected to the output end of the corresponding electric push rod (13). An adjustment plate (15) for closing the connection port (12) is horizontally fixed on the connection part (14). When the electric push rod (13) extends, the sliding test plate (9) and the adjustment plate (15) move away from the heating detection wall (7) and open the connection port (12). A cooling fan (16) is also provided inside the adjustment chamber (11). Each of the detection chambers (6) has a temperature measuring component for detecting the temperature of the test circuit board (28).
2. The electromigration testing apparatus according to claim 1, characterized in that, The clamp (10) includes a rotating shaft (101), a torsion spring (102), and a clamping plate (103). The rotating shaft (101) is mounted on the sliding test plate (9). The clamping plate (103) is rotatably mounted on the rotating shaft (101). The torsion spring (102) is disposed on the rotating shaft (101) to keep the clamping plate (103) rotating in the direction of the sliding test plate (9). The clamping plate (103) is made of elastic metal and gradually becomes thinner from the end near the rotating shaft (101) to the end away from the rotating shaft (101).
3. The electromigration testing device according to claim 2, characterized in that, Two hooks (17) are horizontally arranged on the heating detection wall (7) inside each detection chamber (6). The two hooks (17) correspond to the two clamps (10) in the detection chamber (6). The two hooks (17) are located on both sides of the sliding test plate (9) in the detection chamber (6). The two hooks (17) are arranged opposite each other. A pull plate (18) is fixedly installed on the side of the clamp (103) near the rotating shaft (101). When the electric push rod (13) extends to the limit position, the pull plate (18) squeezes the hooks (17) and makes the clamp (103) rotate away from the sliding test plate (9). The bottom of the outer shell (1) is also provided with a recycling chamber (19) for recycling the test circuit board (28). The bottom of each detection chamber (6) is provided with a discharge port (20) for communicating with the recycling chamber (19).
4. The electromigration testing apparatus according to claim 3, characterized in that, The temperature measuring component includes a connecting rod (21) fixedly installed on the clamp (103). The connecting rod (21) is made of elastic insulating material. A temperature sensor (22) is fixedly installed at one end of the connecting rod (21) away from the clamp (103). When the clamp (10) clamps the test circuit board (28), the temperature sensor (22) abuts against the test circuit board (28). The temperature sensor (22) is electrically connected to the electric push rod (13).
5. The electromigration testing apparatus according to claim 1, characterized in that, Each adjacent detection chamber (6) has a barrier cavity (23) inside its sidewall, which is used to block the temperature transfer between adjacent detection chambers (6).
6. The electromigration testing apparatus according to claim 3, characterized in that, Each discharge port (20) is rotatably mounted with a baffle plate (24) at its bottom. The baffle plate (24) is rotatably mounted on one side near the center of the outer shell (1). The baffle plate (24) is provided with a groove (25). A connecting rod (26) is provided between the baffle plate (24) and the bottom of the sliding test plate (9). One end of the connecting rod (26) is rotatably mounted on the bottom of the sliding test plate (9), and the other end of the connecting rod (26) is rotatably mounted inside the groove (25) and can slide along the direction of the groove (25).
7. The electromigration testing apparatus according to claim 6, characterized in that, The length of the groove (25) is the same as half of the maximum extension length of the electric push rod (13).
8. An electromigration testing method, wherein the electromigration testing method uses the electromigration testing apparatus according to any one of claims 1 to 7, characterized in that, The following steps are included: S1: Prepare the test circuit board (28) with the chip (282) installed. S2: Two clamps (10) clamp the test circuit board (28) and form a closed loop. At the same time, an ammeter is connected in series to the closed circuit where the test circuit board (28) is located to detect the leakage current. S3: Set the heating temperature, start the heating source (3) to start heating, and pass the set current into the closed circuit where the test circuit board (28) is located; S4: Temperature sensor (22) detects the temperature of test circuit board (28) and compares it with the set heating temperature; S5: When the temperature of the test circuit board (28) is higher than the set heating temperature, the cooling fan (16) starts, the corresponding electric push rod (13) extends 1 / 2 of its length, the sliding test plate (9) is separated from the heating detection wall (7), and the connection port (12) opens to allow cold air to enter the detection chamber (6) to start cooling. S6: After the temperature of the test circuit board (28) decreases, the electric push rod (13) retracts and the connection port (12) is closed. The test circuit board (28) is then reattached to the heating detection wall (7) to continue the test. S7: After the leakage current is detected to reach the set value, the electric push rod (13) extends to the maximum length, the pull plate (18) squeezes the pull hook (17), the clamp (10) releases the test circuit board (28), and at the same time the discharge port (20) opens, and the discarded test circuit board (28) falls into the recycling chamber (19).