Radio frequency power supply control method and semiconductor process equipment

Abstract

The invention provides a radio frequency power supply control method and semiconductor process equipment, and is applied to the technical field of semiconductor process equipment. Calculating active loss of the matcher and the coupling coil group according to the obtained current and predetermined resistance values corresponding to the matcher and each coil, obtaining current operation power output to the plasma by the coupling coil group according to the current output power and the active loss, and adjusting the output power of the radio frequency power supply. According to the method, the active loss calculated based on the matcher, the resistance value corresponding to each coil in the coupling coil group and the current current is more accurate, and the accuracy of adjusting the output power of the radio frequency power supply based on the active loss is further improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor process equipment technology, specifically to a radio frequency power supply control method and semiconductor process equipment. Background Technology

[0002] Inductively coupled plasma (ICP) etching machines are widely used semiconductor process equipment in recent years. In the upper electrode RF circuit of an ICP etching machine, the RF power is provided by an RF power supply. The RF current reaches the coupling coil group after passing through a matching circuit. The high-frequency RF current generates a high-frequency electromagnetic field through the coupling coil group, thereby exciting the gas to produce plasma.

[0003] In practical applications of ICP etching machines, hardware such as the matching unit and coupling coil assembly generate active power losses, which in turn affect the actual radio frequency power used to generate plasma. In practical applications, the active power losses of the matching unit and coupling coil assembly are difficult to measure directly and must be determined through calculation.

[0004] Related technologies calculate active power loss by treating the matching unit and coupling coil group as a whole. However, the inventors have found that since the coupling coil group includes at least two coils and the current ratio of each coil is different under different process formulations, the actual active power loss generated by each coil in the coupling coil group is not the same under different process formulations. In other words, the active power loss calculated by treating the matching unit and coupling coil group as a whole is not accurate. Adjusting the output power of the RF power supply based on the active power loss calculation results is also inaccurate, which will affect the consistency of process results between different process chambers and make it difficult to meet the process requirements in practical applications. Summary of the Invention

[0005] In view of this, this application aims to provide a radio frequency power supply control method and semiconductor process equipment, which accurately calculates the active power loss of the matching unit and the coupling coil group, and then accurately adjusts the output power of the radio frequency power supply to meet process requirements.

[0006] In a first aspect, this application provides a radio frequency (RF) power supply control method applied to semiconductor process equipment. The semiconductor process equipment includes a process chamber, an RF power supply, a matching unit, and a coupling coil group. The coupling coil group includes at least two coils, and the matching unit is connected to each of the coils. The method includes:

[0007] Obtain the current output power of the radio frequency power supply, the current flowing through the matching unit, and the current of each coil;

[0008] Based on the current current and the predetermined resistance values ​​of the matching device and each coil, calculate the active power loss of the matching device and the coupling coil group;

[0009] Based on the current output power and the active power loss, the current operating power output to the plasma by the coupling coil group is obtained;

[0010] If the power deviation between the current operating power and the preset operating power is not within the preset deviation range, adjust the output power of the radio frequency power supply until the power deviation is within the preset deviation range.

[0011] In one possible implementation, the coupling coil group includes a first coil and a second coil disposed outside the first coil;

[0012] The process of obtaining the current current corresponding to the matching unit and each of the coils includes:

[0013] The current of the target component is collected, and the target component includes any two of the matching device, the first coil, and the second coil;

[0014] Based on the current current of the target component, determine the current of another component other than the target component among the matching device, the first coil, and the second coil.

[0015] In one possible implementation, the active power loss of the matching device and the coupled coil group is calculated based on the current current and the predetermined resistance values ​​of the matching device and each of the coils, including:

[0016] Calculate the ratio of the current current of the first coil to the current current of the matching circuit to obtain the first current ratio;

[0017] The active power loss of the matching device and the coupling coil group is calculated according to the following formula:

[0018]

[0019] Among them, P lost This represents the active power loss of the matching device and the coupling coil group;

[0020] I1 represents the current of the first coil;

[0021] I r This indicates the first current ratio;

[0022] R1 represents the resistance value of the first coil;

[0023] R2 represents the resistance value of the second coil;

[0024] Rm represents the resistance value of the matching circuit.

[0025] In one possible implementation, the active power loss of the matching device and the coupled coil group is calculated based on the current current and the predetermined resistance values ​​of the matching device and each of the coils, including:

[0026] Calculate the ratio of the current current of the second coil to the current current of the matching circuit to obtain the second current ratio;

[0027] The active power loss of the matching device and the coupling coil group is calculated according to the following formula:

[0028]

[0029] Among them, P lost This represents the active power loss of the matching device and the coupling coil group;

[0030] I2 represents the current of the second coil;

[0031] I k This indicates the second current ratio;

[0032] R1 represents the resistance value of the first coil;

[0033] R2 represents the resistance value of the second coil;

[0034] Rm represents the resistance value of the matching circuit.

[0035] In one possible implementation, the process of obtaining the matching unit and the current current corresponding to each of the coils includes:

[0036] Collect the current of the first coil;

[0037] Based on the current current of the first coil and the first preset current ratio, the current of the matching device and the current of the second coil are determined respectively.

[0038] Wherein, the first preset current ratio is the ratio of the preset current of the first coil to the preset current of the matching device;

[0039] Based on the current and the predetermined resistance values ​​of the matching device and each coil, the active power loss of the matching device and the coupled coil group is calculated, including:

[0040] The active power loss of the matching device and the coupling coil group is calculated according to the following formula:

[0041]

[0042] Among them, P lost This represents the active power loss of the matching device and the coupling coil group;

[0043] I1 represents the current of the first coil;

[0044] I r 'Indicates the first preset current ratio;

[0045] R1 represents the resistance value of the first coil;

[0046] R2 represents the resistance value of the second coil;

[0047] Rm represents the resistance value of the matching circuit.

[0048] In one possible implementation, the process of obtaining the matching unit and the current current corresponding to each of the coils includes:

[0049] Collect the current of the second coil;

[0050] Based on the current current of the second coil and the second preset current ratio, the current of the matching device and the current of the first coil are determined respectively.

[0051] Wherein, the second preset current ratio is the ratio of the preset current of the second coil to the preset current of the matching device;

[0052] Based on the current and the predetermined resistance values ​​of the matching device and each coil, the active power loss of the matching device and the coupled coil group is calculated, including:

[0053] The active power loss of the matching device and the coupling coil group is calculated according to the following formula:

[0054]

[0055] Among them, P lost This represents the active power loss of the matching device and the coupling coil group;

[0056] I2 represents the current of the second coil;

[0057] I k 'Indicates the second preset current ratio;

[0058] R1 represents the resistance value of the first coil;

[0059] R2 represents the resistance value of the second coil;

[0060] Rm represents the resistance value of the matching circuit.

[0061] In one possible implementation, the process of determining the matching unit and the resistance value corresponding to each of the coils includes:

[0062] Multiple test samples are obtained, including the matching power and the test current ratio of the matching device.

[0063] In the absence of plasma in the process chamber, the test results of the semiconductor process equipment running according to each of the test samples are determined, and the test results include the test current of the matching device and each of the coils;

[0064] For each of the test results, an active power loss calculation formula is created for the matching device and each of the coils, wherein the active power loss calculation formula is used to characterize the calculation method of the active power loss of the matching device and each of the coils, and the resistance value of the matching device and each of the coils is used as an unknown quantity in the active power loss calculation formula.

[0065] The resistance values ​​of the matching device and each of the coils are determined based on the active power loss calculation formulas.

[0066] In one possible implementation, determining the resistance values ​​of the matching device and each of the coils based on the active power loss calculation formulas includes:

[0067] The active power loss calculation formulas are converted into fitting matrices based on the least squares method, and the fitting matrices use the resistance values ​​of the matching device and each coil as unknowns.

[0068] The fitting matrix is ​​solved using Gaussian elimination to obtain the resistance values ​​of the matched circuit and each coil.

[0069] In one possible implementation, the radio frequency power supply control method provided in the first aspect of this application further includes: determining the operating state of the radio frequency power supply based on the active power loss of the matching unit and the coupling coil group.

[0070] Secondly, this application provides a semiconductor process apparatus, comprising: a controller, at least two process chambers, each of which is equipped with a radio frequency power supply, a matching unit, and a coupling coil assembly, wherein...

[0071] The coupling coil group includes at least two coils;

[0072] The output terminal of the radio frequency power supply is connected to the input terminal of the matching unit;

[0073] The output of the matching unit is connected to each coil in the coupling coil group;

[0074] The controller is connected to the radio frequency power supply of each of the process chambers and collects the current current of each coil in the coupling coil group configured in each process chamber.

[0075] The controller is used to execute the RF power supply control method as described in any of the first aspects of this application to control the RF power supply of each of the process chambers respectively.

[0076] Based on the above, the radio frequency power supply control method provided in this application is applied to semiconductor process equipment. The semiconductor process equipment includes a process chamber, a radio frequency power supply, a matching unit, and a coupling coil group. The coupling coil group includes at least two coils, and the matching unit is connected to each coil. After obtaining the current output power of the radio frequency power supply, the current flowing through the matching unit, and the current current of each coil, the active power loss of the matching unit and the coupling coil group is calculated based on the current current and the predetermined resistance values ​​of the matching unit and each coil. Furthermore, based on the current output power and the active power loss, the current operating power output to the plasma by the coupling coil group is obtained. If the power deviation between the obtained current operating power and the preset operating power is not within the preset deviation range, the output power of the radio frequency power supply is adjusted until the power deviation is within the preset deviation range. This method calculates active power loss based on the matching unit and the resistance values ​​and current current of each coil within the coupling coil group. In particular, for the coupling coil group, compared to related technologies that calculate active power loss as a whole, this method calculates active power loss based on the resistance value and current current of each coil. This avoids the influence of the current ratio between the coils in the coupling coil group adjusted by the etching semiconductor process equipment on the calculation results, thereby ensuring the accuracy and reliability of the calculation results. This improves the accuracy of adjusting the RF power supply output power based on active power loss, helps to improve the consistency of process results between different process chambers, and meets the process requirements in practical applications. Attached Figure Description

[0077] To more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0078] Figure 1 This is an equivalent circuit diagram of an upper electrode radio frequency circuit in related technologies.

[0079] Figure 2 This is a structural block diagram of a semiconductor process equipment provided in this application.

[0080] Figure 3 This is a flowchart of a radio frequency power supply control method provided in this application.

[0081] Figure 4 This is an equivalent circuit diagram of an upper electrode radio frequency circuit provided in this application.

[0082] Figure 5 This is an equivalent circuit diagram of another upper electrode RF circuit provided in this application.

[0083] Figure 6 This is a schematic diagram of a coil current deviation provided in this application.

[0084] Figure 7 This is a flowchart of a method for determining equivalent circuit parameters provided in this application. Detailed Implementation

[0085] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0086] As mentioned earlier, ICP etching machines have advantages such as high plasma density, good uniformity, and minimal damage to workpieces, making them widely used semiconductor process equipment in recent years. Typically, the sequentially connected RF power supply, matching circuit, and coupling coil group are defined as the upper electrode RF circuit of the semiconductor process equipment. The RF power is provided by the RF power supply, and the RF current, after passing through the matching circuit, reaches the coupling coil group. The high-frequency RF current generates a high-frequency electromagnetic field through the coupling coil group, thereby exciting the gas to produce plasma.

[0087] In the actual application of ICP etching machines, hardware such as matching units and coupling coil groups consume the RF power output of the RF power supply, i.e., generating active power loss. This causes the actual RF power used to generate plasma to be inconsistent with the process formula, affecting parameters such as plasma density in the process chamber. Therefore, accurately calculating the active power loss generated by the matching unit and coupling coil group during the operation of the ICP etching machine, and then adjusting the RF power output of the RF power supply, is a prerequisite for ensuring the consistency of process results between different process chambers.

[0088] To calculate the active power losses generated by the matching unit and coupling coil assembly during ICP etching, related technologies are provided, such as... Figure 1 The equivalent circuit diagram shown, combined with Figure 1 As shown, the multiple coils in the matching coil group are treated as a whole and are equivalent to capacitor C1, capacitor C2, resistor R0 and inductor L1. Among them, resistor R0 generates active power loss that consumes radio frequency power.

[0089] It should be noted that in practical applications, the RF power supply can be connected to the matching unit via a connecting cable. The connecting cable is usually configured with a common impedance of 50Ω. Although there may be some deviation in practical applications, the active power loss generated by the connecting cable can be directly measured, and the RF power fed into the matching unit front end can be ensured to meet the process requirements through calibration. Therefore, in the following content, for the convenience of explaining the RF power supply control method provided in this application, the active power loss generated by the connecting cable will be ignored, and it is assumed that the output power of the RF power supply will not generate any active power loss during the transmission to the input of the matching unit.

[0090] based on Figure 1 The equivalent circuit diagram shown assumes the output power of the RF power supply is Pin and the input current of the acquisition matching circuit is I. Then, R0 = Pin / I. 2 Based on this, related technologies calculate the equivalent resistance value of the matching unit and the coupling coil group as a whole. In subsequent practical applications, the active power loss of the matching unit and the coupling coil group is calculated based on the calculated R0. However, the inventors, in combination with the actual application process of radio frequency power supply and different process requirements, found that the coupling coil group can include an inner coil and an outer coil. When the two coils share different currents, the active power loss of the coupling coil group is not the same. In other words, the active power loss calculated based on R0 is not accurate. This results in different power reaching the plasma, affecting parameters such as plasma density, and thus causing inconsistencies in process results between different process chambers.

[0091] Therefore, it is evident that the active power loss calculated by treating the matching unit and coupling coil group as a whole is inaccurate, and adjusting the output power of the RF power supply based on the active power loss calculation results is also inaccurate and difficult to meet process requirements.

[0092] To address the aforementioned problems, this application provides a semiconductor process apparatus, see [link to relevant documentation]. Figure 2 As shown, the semiconductor process equipment provided in this application may include an RF power supply 10, a connecting cable 20, a matching unit 30, a coupling coil group 40, a process chamber 50, and a controller. Figure 2 (Not shown in the image), wherein the coupling coil group 40 includes at least two coils, for example, it may include an inner coil and an outer coil, the outer coil being arranged around the inner coil ( Figure 2 (Seen in two coils).

[0093] Specifically, the output terminal of the RF power supply 10 is connected to one end of the connecting cable 20, and the other end of the connecting cable 20 is connected to the input terminal of the matching unit 30. The output terminal of the matching unit 30 is connected to each coil in the coupling coil group 40. As an optional implementation, the coupling coil group 40 is located outside the process chamber 50. The RF power is ultimately converted into a high-frequency electromagnetic field through the coupling coil group 40, thereby exciting the gas to generate plasma. The controller is connected to the RF power supply 10 and collects the current of the matching unit 30 and each coil in the coupling coil group 40 to execute the RF power supply control method provided in subsequent embodiments of this application.

[0094] The RF power supply control method provided in this application calculates active power loss based on the resistance value and current of each coil in the matching coil group and the coupling coil group. In particular, for the coupling coil group, compared with the related technology that calculates active power loss based on the coupling coil group as a whole, this method calculates active power loss based on the resistance value and current of each coil. This can avoid the influence of the current ratio between the coils in the coupling coil group adjusted by the etching semiconductor process equipment on the calculation results, thereby ensuring the accuracy and reliability of the calculation results. This improves the accuracy of adjusting the RF power supply output power based on active power loss, helps to improve the consistency of process results between different process chambers, and meets the process requirements in practical applications.

[0095] Based on the above, see Figure 3 The radio frequency power supply control method provided in this application may include the following steps.

[0096] S100: Obtain the current output power of the RF power supply, the current flowing through the matching circuit, and the current of each coil.

[0097] In the practical application of semiconductor process equipment, its operation configuration information comes from the process recipe. The process recipe includes at least the preset operating power of the plasma and the preset current ratio of each coil in the coupling coil group. Of course, the process recipe also records other information related to the process, which will not be listed here. For details, please refer to the relevant technologies.

[0098] Based on the above, the preset operating power recorded in the aforementioned process formula is used as the initial power of the RF power supply. At the initial stage of power-up of the equipment, the RF power supply is controlled to output the preset operating power. In subsequent operations, the output power of the RF power supply is controlled according to the control method provided in this application. Based on this, the current output power of the RF power supply mentioned in this embodiment is the power output by the RF power supply at the current moment.

[0099] The specific process for obtaining the current current of the matched coil and each coil in the coupling coil group can be implemented as follows.

[0100] As described, the output current of the RF power supply enters the matching circuit, and the output of the matching circuit is connected to each coil in the coupling coil group, outputting RF current to each coil. Based on this, and Figure 4 The equivalent circuit diagram shown indicates that the RF current output by the matching unit should be equal to the sum of the RF currents of each coil in the coupling coil group.

[0101] Furthermore, in Figure 4 The capacitors C1-C5 shown correspond to the physical capacitors in the matching coil. At least one of these capacitors is an adjustable capacitor. By adjusting the capacitance value, the current entering each coil in the coupling coil group can be changed, i.e., the current ratio between the coils can be changed. Therefore, with a fixed RF output current from the matching coil, the current in each coil can be adjusted as needed. Correspondingly, in the actual application of semiconductor process equipment, the process recipe limits the RF power required by the RF power supply according to process requirements, which is equivalent to limiting the RF power input to the matching coil or limiting the RF current output from the matching coil to the coupling coil group. At the same time, the process recipe also limits the current ratio of each coil within the coupling coil group, i.e., provides a preset current ratio. Before the semiconductor process equipment officially processes the wafer, the adjustable capacitors in the matching coil are adjusted according to the preset current ratio until the deviation between the current ratio input to the coils and the preset current ratio is within a preset deviation range.

[0102] The inventors discovered that, given a fixed output RF current from the matching coil, different current ratios result in different actual currents in each coil within the coupling coil group. Consequently, the active power loss generated by each coil also varies. Therefore, the aforementioned RF power supply control method considers the coupling coil group as a whole, utilizing R0 = Pin / I... 2 Solving for the equivalent resistance and obtaining R0 serves as the basis for subsequent calculations of the active power loss of the matching circuit and the coupling coil group. Since the active power loss generated by each coil is different under different current ratios, the loss pin of the matching circuit and the coupling coil group will also be different. Related technologies ignore this fact. The R0 calculated based on the active power loss under a specific current ratio is only accurate under that specific current ratio. Once the current ratio is adjusted, the active power loss calculated using the obtained R0 will no longer be accurate.

[0103] Based on the above, it can be understood that the active power loss of the matching device and each coil in the coupling coil group is only related to its own resistance value and current. Therefore, in order to accurately calculate the active power loss of the matching device and the coupling coil group, after obtaining the resistance values ​​of the matching device and each coil through the aforementioned steps, this step further determines the current current of each coil in the matching device and the coupling coil group.

[0104] In one alternative implementation, current acquisition devices can be installed in the matching coil and each coil to acquire the current of the matching coil and each coil. It is understood that this requires installing current acquisition devices at both the matching coil and each coil, which can lead to higher hardware costs when the coupled coil group includes multiple coils.

[0105] In another alternative implementation, the coupling coil group includes a first coil and a second coil. In this application scenario, any two of the matching transformer, the first coil, and the second coil can be used as the target component. In practical applications, it is only necessary to acquire the current of the target component and then combine it with... Figure 4 The circuit topology shown and the current distribution relationship between the three components are used to calculate the current of the matching unit, the first coil, and the other components in the second coil besides the target component, based on the current current of the target component.

[0106] For example, if the target components are the first coil and the second coil, then the current current of the matching device is equal to the sum of the current currents of the first coil and the second coil. Or, if the target components are the matching device and the first coil, then the current current of the second coil is equal to the difference between the current currents of the matching device and the first coil. Or, if the target components are the matching device and the second coil, then the current current of the first coil is the difference between the current currents of the matching device and the second coil.

[0107] It is understood that in this embodiment, since only the current of the target component needs to be collected, the number of current acquisition devices is small, and the overall hardware cost is reduced compared to the aforementioned embodiments.

[0108] It should be noted that in practical applications, the current current of the matching device and each coil in the coupling coil group can also be collected by other means to calculate the active power loss of the corresponding components. These will not be listed here, but they are also within the scope of protection of this application as long as they do not exceed the core concept of this application.

[0109] S110. Calculate the active power loss of the matching device and the coupled coil group based on the current current, the pre-determined matching device, and the resistance value of each coil.

[0110] First, obtain the pre-determined matching unit and the resistance value corresponding to each coil.

[0111] To accurately calculate the active power loss of the matching unit and the coupling coil group, the RF power supply control method provided in this application obtains the resistance values ​​of the matching unit and the coupling coil group respectively. As mentioned above, the coupling coil group includes at least two coils, therefore, each coil within the coupling coil group also has its own resistance value. In the RF power supply control method provided in this application, the active power loss generated by each coil within the matching unit and the coupling coil group is only related to its own resistance value and the current flowing through it, and is not affected by any other components.

[0112] Based on the above premises, taking a coupling coil group including a first coil and a second coil disposed outside the first coil as an example, this application provides as follows: Figure 4 The equivalent circuit diagram shown is compared to Figure 1 The equivalent circuit diagram shown in this application differs from the equivalent circuit in the RF power supply and connecting cable sections. Figure 1 To maintain consistency with the above, a more detailed modeling and network description of the matched unit and coupling coil group is provided.

[0113] In one possible implementation, the matcher employs a dual-output network, upon which a construction can be based. Figure 4 The circuit topology shown is L-shaped. Specifically, at point A, it is divided into two parallel branches. One branch is grounded through capacitor C1, and the other branch reaches point B after passing through capacitor C2, inductor Lm, and resistor Rm in sequence. At point B, it is again divided into two parallel branches. One branch (the loop from point B to point E) is connected to the first coil, where I1 represents the current flowing through the first coil, R1 is the equivalent internal resistance of the first coil, and L1 is the equivalent inductance of the first coil. The other branch (the loop from point B to point F) is connected to the second coil, where I2 represents the current flowing through the second coil, R2 is the equivalent internal resistance of the second coil, and L2 is the equivalent inductance of the second coil.

[0114] Because the equivalent series resistance of capacitors is very small under radio frequency operating conditions, their heat generation and active power loss can be ignored. Based on this, Rm in the matching circuit, R1 in the first coil, and R2 in the second coil are the main components that generate active power loss and are also key parameters in the power loss calculation process. As for the active power loss of other components, it can be ignored.

[0115] It is understandable that when a coupled coil group includes two or more coils, each coil can adopt the following... Figure 4 The equivalent circuit diagram shown represents the equivalent circuit of any coil, and the equivalent resistance in each coil is connected to the corresponding equivalent capacitance in the matching circuit. Examples will not be elaborated here.

[0116] It should be noted that, Figure 4The equivalent circuit diagram shown is obtained under the condition that there is no plasma in the process chamber of the semiconductor process equipment. The main reason is that when plasma is present in the process chamber, inductive coupling occurs between the coupling coil group and the plasma. In this case, the following will be obtained: Figure 5 The equivalent circuit diagram shown is in Figure 4 Based on the above, it also includes the equivalent circuit corresponding to the plasma, such as the inductors Lp1 and Zp1 corresponding to the first coil, and the inductors Lp2 and Zp2 corresponding to the second coil. Since the impedance of the plasma cannot be directly measured, it can only be obtained when there is no plasma in the process chamber. Figure 4 The equivalent circuit shown.

[0117] It should also be noted that, as a preferred implementation, the resistance values ​​of the matching converter and each coil in the coupling coil group involved in calculating power loss are predetermined. During this step, the resistance values ​​of the matching converter and each coil in the coupling coil group can be directly obtained. This setup improves the execution efficiency of the RF power supply control method and helps improve the control accuracy of semiconductor process equipment. Alternatively, as another optional implementation, the resistance values ​​of the matching converter and each coil in the coupling coil group can be obtained during this step. Considering only the ultimate goal of calculating active power loss, this is also a feasible approach. Obviously, this method will increase the execution time to some extent. The specific calculation process for the resistance values ​​of the matching converter and each coil in the equivalent circuit will be discussed later and will not be detailed here.

[0118] After obtaining the resistance values ​​of the matching device and each coil, the active power loss of the matching device and the coupled coil group can be calculated.

[0119] As an optional implementation method, this application first provides a general method for calculating active power loss. Specifically, the active power loss of the matching device and the coupling coil group can be calculated according to the following formula.

[0120]

[0121] Among them, P lost This indicates the active power loss of the matching unit and the coupling coil group;

[0122] I1-I n This represents the current from the first coil to the nth coil in the coupled coil group, where n ≥ 2;

[0123] I m Indicates the current of the matching circuit;

[0124] R1-Rn represent the resistance values ​​of the first coil to the nth coil in the coupled coil group;

[0125] Rm represents the matching resistor value.

[0126] Considering that the coupling coil group of current ICP etching machines typically only includes two coils, namely a first coil and a second coil disposed outside the first coil, this application provides two methods for calculating the active power loss of the matching unit and the coupling coil group in this scenario. Of course, the general calculation method provided in the foregoing embodiments is also applicable to this scenario, and will not be repeated here.

[0127] In one possible implementation, the current currents of the first coil and the second coil are collected (or the current currents of the first coil and the matching circuit are collected), and the ratio of the current current of the first coil to the current current of the matching circuit is calculated according to the following formula to obtain the first current ratio.

[0128]

[0129] Where I1 represents the current of the first coil;

[0130] I2 represents the current current of the second coil, and I1 + I2 is the current current of the matching circuit.

[0131] I r This indicates the first current ratio.

[0132] According to the above formula (2), the current current of the second coil and the current current of the matching device can be characterized by the current current of the first coil and the first current ratio. Based on this, the active power loss of the matching device and the coupling coil group can be calculated according to the following formula.

[0133]

[0134] Wherein, R1 represents the resistance value of the first coil;

[0135] R2 represents the resistance value of the second coil.

[0136] In another possible implementation, the current of the first coil and the second coil are collected (or the current of the second coil and the matching circuit can be collected), and the ratio of the current current of the second coil to the current current of the matching circuit is calculated according to the following formula to obtain the second current ratio.

[0137]

[0138] Among them, I k This indicates the second current ratio.

[0139] According to the above formula (4), the current current of the first coil and the current current of the matching device can be characterized by the current current of the second coil and the second current ratio. Based on this, the active power loss of the matching device and the coupling coil group can be calculated according to the following formula.

[0140]

[0141] It is understandable that in practical applications, due to the differences in the performance parameters of components, the actual current ratio calculated according to the above formula (2) or formula (4) usually deviates from the preset current ratio. The above embodiments calculate the active power loss using the actual calculated current ratio, which is obviously more accurate. However, since multiple currents need to be collected at the same time, the equipment hardware cost is high. Therefore, in application scenarios where the accuracy requirement for active power loss calculation is not very strict, the preset current ratio can be used to calculate the active power loss of the matching unit and the coupling coil group.

[0142] Based on the above premise, taking the coupled coil group including the first coil and the second coil as an example, after obtaining the resistance values ​​of the matching device, the first coil and the second coil, the active power loss of the matching device and the coupled coil group can be calculated in the following way.

[0143] In one optional implementation, the current current of the first coil is collected, and based on the current current of the first coil and a first preset current ratio, the current currents of the matching device and the second coil are determined respectively. Referring to the foregoing, the first preset current ratio is the ratio of the preset current of the first coil to the preset current of the matching device. The preset currents of the first coil and the matching device refer to the matching device current and the first coil current specified in the process formula to meet the current process requirements. Specifically, the quotient of the current current of the first coil and the first preset current ratio is calculated; the result is the current current of the matching device, which is also the sum of the current currents of the first and second coils. The difference between this result and the current current of the first coil is then calculated to obtain the current current of the second coil.

[0144] After obtaining the current current of the second coil and the matching coil, the active power loss of the matching coil and the coupling coil group can be calculated according to the aforementioned formula (1).

[0145] Alternatively, the active power loss of the matching unit and the coupling coil group can be calculated using the following formula:

[0146]

[0147] Among them, I′ r This indicates the first preset current ratio.

[0148] It is understandable that when using formula (6) to calculate active power loss, only the current current of the first coil needs to be collected, which can further save the process of calculating the current current of the second coil and the matching device, and the calculation efficiency is higher.

[0149] In another possible implementation, the current current of the second coil is collected, and based on the current current of the second coil and a second preset current ratio, the current currents of the matching device and the first coil are determined respectively. Referring to the foregoing, the second preset current ratio is the ratio of the preset current of the second coil to the preset current of the matching device. The preset currents of the second coil and the matching device refer to the matching device current and the second coil current specified in the process formula to meet the current process requirements. Specifically, the quotient of the current current of the second coil and the second preset current ratio is calculated; the result is the current current of the matching device, which is also the sum of the current currents of the first and second coils. The difference between this result and the current current of the second coil is then calculated to obtain the current current of the first coil.

[0150] After obtaining the current current of the first coil and the matching coil, the active power loss of the matching coil and the coupling coil group can be calculated according to the aforementioned formula (1).

[0151] Alternatively, the active power loss of the matching unit and the coupling coil group can be calculated using the following formula:

[0152]

[0153] Among them, I′ k This indicates the second preset current ratio.

[0154] It is understandable that when using formula (7) to calculate active power loss, only the current current of the first coil needs to be collected, which can further save the process of calculating the current current of the first coil and the matching device, and the calculation efficiency is higher.

[0155] In practical applications, the active power loss of the matching unit and the coupling coil group can be calculated according to any of the calculation methods provided in the aforementioned embodiments, based on actual needs.

[0156] S120. Based on the current output power and active power loss, obtain the current operating power of the coupling coil group output to the plasma.

[0157] Having completed the aforementioned steps, we have obtained the current output power of the RF power supply, the active power loss of the matching circuit and the coupling coil group, combined with... Figure 4 As can be seen from the equivalent circuit topology shown, the difference between the output power of the RF power supply and the calculated active power loss is the current operating power of the coupling coil group output to the plasma.

[0158] Understandably, considering the active power loss of the connecting cables, the difference between the output power of the RF power supply and the active power loss of the connecting cables, matching circuit, and coupling coil group can also be used to obtain the current operating power of the coupling coil group output to the plasma.

[0159] S130. If the power deviation between the current operating power and the preset operating power is not within the preset deviation range, adjust the output power of the RF power supply until the power deviation is within the preset deviation range.

[0160] The difference between the current operating power and the preset operating power recorded in the process recipe is calculated to obtain the corresponding power deviation. Then, it is further determined whether the power deviation is within the preset deviation range. If the power deviation is not within the preset deviation range, the output power of the RF power supply is adjusted until the power deviation is within the preset deviation range. Conversely, if the power deviation is within the preset deviation range, the semiconductor process equipment can continue to be controlled according to the current operating parameters.

[0161] In one alternative implementation, the preset deviation range can be set based on the preset operating power in the process recipe; for example, the preset deviation range can be set to [0, P]. set [×1%], where P set This refers to the preset operating power. Of course, a preset deviation range can also be set according to actual control requirements and the control precision of semiconductor process equipment. This application does not limit the specific value of the preset deviation range.

[0162] In summary, this method calculates active power loss based on the matching unit and the resistance values ​​and current current of each coil within the coupling coil group. Especially for the coupling coil group, compared to related technologies that calculate active power loss as a whole, this method calculates active power loss based on the resistance values ​​and current current of each coil. This avoids the influence of adjusting the current ratio between coils within the coupling coil group in the semiconductor etching process equipment on the calculation results, thus ensuring the accuracy and reliability of the calculation results. Consequently, the power compensation effect based on active power loss is better, and the control precision is higher. When all process chambers in the same semiconductor process equipment use the power compensation method provided in this application for power compensation control, precise control of the actual operating power in each process chamber can be achieved, ensuring consistency between the chambers.

[0163] Taking a semiconductor process equipment used in engineering applications as an example, this equipment includes three process chambers: α, β, and γ. When executing the same process formula, without power compensation, the etching rates of the three process chambers will show significant differences, as shown in Table 1. Clearly, the active power loss of different process chambers is different. Under the conditions of process A and process B, the actual RF power reaching the plasma differs significantly. Therefore, without power compensation, the consistency of the process results is approximately ±4%.

[0164] Table 1 Etching rates under no power compensation conditions

[0165]

[0166]

[0167] After adopting the power compensation method provided in this application, the same process formula was executed again in the three process chambers α, β, and γ, and the etching rates of each process chamber are shown in Table 2. Due to the more accurate calculation and compensation of active power loss, the actual RF power applied to the plasma is significantly increased compared to the case without power compensation, with the etching rate increasing by 15%-40%. Simultaneously, after power compensation, the RF power reaching the plasma in different process chambers is within a preset deviation range, eliminating the influence of differences in active power loss between different process chambers, and improving the consistency of process results to ±0.4%. Therefore, the power compensation method provided by this invention has significant practical effects in engineering applications and is of great importance for improving the process consistency between different chambers.

[0168] Table 2 Etching rates under power compensation conditions

[0169]

[0170] The following examples, using specific engineering applications, verify the accuracy of the active power loss calculation method for the matched converter and coupling coil group provided in this application from different perspectives.

[0171] In one verification method, when there is no plasma in the process chamber, the output power of the RF power supply (i.e., the RF power fed into the matching coil) is entirely consumed by the matching coil and the coupling coil group. In this case, the output power P0 of the RF power supply and the active power P consumed by the matching coil and the coupling coil group are... lost Since they are equal, formula (5) can be transformed to obtain the following formula for calculating the current of the second coil.

[0172]

[0173] Based on the predetermined resistance values ​​of the first coil, the second coil, and the matching circuit, the output power P0 of the RF power supply and the second current ratio I are adjusted. k The current of the second coil can be calculated based on formula (8). At the same time, the actual current of the second coil under different test conditions can be collected by a current acquisition device. By comparing the current deviation between the calculated current of the second coil and the actual current of the second coil collected, the feasibility of this method can be verified.

[0174] See Figure 6 , Figure 6 The diagram shows the correspondence between different test currents and the aforementioned current deviations. The horizontal axis represents the actual current collected in the second coil, divided into five ranges: 0-10A, 10-20A, 20-30A, 30-40A, and 40-50A. The vertical axis represents the current deviation between the second coil current calculated according to formula (8) and the actual current of the second coil under the corresponding test conditions. Multiple tests were conducted under different conditions within each current range. Each test yielded a corresponding current deviation, and the average current deviation was statistically analyzed. Figure 6 (represented by circles), maximum value and minimum value ( Figure 6 (Indicated by error bars), combined with Figure 6 As shown, the current deviation under different test adjustments is basically within ±0.3A, which is comparable to the measurement accuracy of the current acquisition device. Therefore, the RF power supply control method provided in this application is reliable.

[0175] In another verification method, the resistance values ​​of the first coil, the second coil, and the matching coil are predetermined, and then the active power loss of the matching coil and the coupling coil group is calculated based on formula (5).

[0176] Accordingly, for the aforementioned related technologies, if the matching transformer and the coupling coil group are considered as a whole, and the corresponding resistance value is denoted as R0, then the following formula is given:

[0177]

[0178] Assuming that the calculation results of the RF power supply control method provided in this application are equal to the calculation results of related technologies, then:

[0179]

[0180] At a specific second current ratio, for example, taking I... k0 When R = 0.5, R0 can be calculated using the following formula:

[0181]

[0182] Accordingly, the active power loss of the matched coil group calculated according to formula (11) is:

[0183]

[0184] Based on the above formulas (5) and (12), in the second current ratio I k0 Under the condition of 0.5, for the test equipment, the measured value of R0 is 0.125Ω, while the equivalent resistance obtained by this method is R2 = 0.2Ω, R1 = 0.1Ω, and Rm = 0.05Ω.

[0185] Based on the above premises, tests were conducted under process formulation A, and the second current ratio I... k =0.35, the current current of the second coil I2 = 16A, and the power loss calculated using the two schemes are P respectively. l ' ost =261W, P lost =244W, the error of the aforementioned related technologies reaches +7%.

[0186] The test was conducted under process condition B, and the second current ratio was I. k =0.65, the current of the second coil is I2 = 30A. Since the current at the output of the matching circuit is almost the same as under process condition A, and the value of R0 remains unchanged, the active power loss of the matching circuit and the coupling coil group calculated using relevant techniques is also basically unchanged. At this time, the power loss calculated using the two schemes are P l ' ost =266W, P lost =313W. It can be seen that the error of the related technology reaches -15%. The calculation results of the RF power supply control method provided in this application are more accurate and have higher engineering applicability.

[0187] Based on the above, it is clear that the RF power supply control methods provided in the various embodiments of this application all rely on predetermined matching transformers and the resistance values ​​of each coil in the coupling coil group. Therefore, this application provides an equivalent circuit parameter determination method for determining the resistance values ​​of each coil in the matching transformer and coupling coil group, specifically including... Figure 7 The steps are shown below.

[0188] S200: Obtain multiple test samples.

[0189] The equivalent circuit parameter determination method provided in this embodiment requires determining the resistance value of the matching device and the resistance value of each coil based on the test results of multiple test samples. Furthermore, each test sample includes the test power of the matching device and the test current ratio.

[0190] In one possible implementation, multiple matching circuit test powers P0(i) can be given, where i represents the test power of the i-th matching circuit, and correspondingly, multiple test current ratios I are given. k (j), where j represents the j-th test current ratio. By combining these test conditions, i×j test samples can be obtained, each test sample including a matched circuit test power P0(i) and a test current ratio Ik(j).

[0191] For example, given 5 matched circuit test powers P0(1)-P0(5) and 5 test current ratios I k (1)-I k (5). First, using the matching power P0(1) as a reference, compare it with the test current ratio I. k (1)-I k (5) Combining these, we can obtain 5 test samples: (P0(1), I k (1)), (P0(1), I k (2)), (P0(1), I k (3)), (P0(1), I k (4)) and (P0(1), I k (5)) and so on, all test samples can be obtained.

[0192] S210. In the absence of plasma in the process chamber of the semiconductor process equipment, determine the test results of the semiconductor process equipment when running according to each test sample.

[0193] As mentioned earlier, in the absence of plasma within the process chamber of semiconductor process equipment, the output power of the RF power supply is entirely consumed by the matching circuit and coupling coil group; that is, the output power P0 is equal to the active power loss P of the matching circuit and coupling coil group. lost The current of each coil in the coupling coil group can be collected, and the corresponding current ratio can be calculated. In other words, only the resistance values ​​of the matching unit and each coil in the coupling coil group are unknown.

[0194] Following the previous example, when the coupled coil group includes a first coil and a second coil, it can be constructed as follows: Figure 4 The equivalent circuit diagram shown is provided, where Rm, R1, and R2 are the parameters that need to be solved.

[0195] Based on the test samples obtained from S200, the semiconductor process equipment is controlled to operate according to each test sample, and the test results corresponding to each test sample can be collected. The test results include the test current of the matching unit and each coil.

[0196] S220. For each test result, create a matching converter and an active power loss calculation formula for each coil.

[0197] Taking the coupled coil group including the first coil and the second coil as an example, the test result of any test sample includes the test current of the first coil and the test current of the second coil. The test current ratio corresponding to each test sample can be calculated by referring to the aforementioned formula (4).

[0198] Furthermore, referring to the aforementioned formula (5), for each test structure, the active power loss calculation formula of the matching device and each coil as shown in formula (13) can be created. The active power loss calculation formula characterizes the calculation method of the active power loss of the matching device and each coil, and the resistance value of the matching device and each coil is used as the unknown quantity in the active power loss calculation formula.

[0199]

[0200] Among them, P lost (x) represents the active power loss corresponding to the x-th test sample;

[0201] I2(i,j) represents (P0(i), I k (j) Test sample control semiconductor process equipment operation to collect the test current of the second coil.

[0202] It is understandable that each test sample can obtain the active power loss calculation formula as shown in formula (13). In any active power loss calculation formula, the resistance values ​​of the matching device and each coil are used as unknowns in the corresponding active power loss calculation formula.

[0203] S230, determine the resistance values ​​of the matching unit and each coil based on the active power loss calculation formula.

[0204] In one alternative implementation, the resistance values ​​of the matching device and each coil are used as unknowns in the corresponding active power loss calculation formula. The active power loss calculation formula is converted into a fitting matrix based on the least squares method. Of course, the resulting fitting matrix also uses the resistance values ​​of the matching device and each coil as unknowns.

[0205] Specifically, we can define the residual in the least squares method as ε(i,j), then we have:

[0206]

[0207] The following condition is satisfied when the sum of squares of the residuals is minimized:

[0208]

[0209]

[0210]

[0211] Simplifying the above formulas, we can obtain the following fitting matrix:

[0212]

[0213] The fitting matrix (18) is solved based on the Gaussian elimination method, and the coefficient matrix a is... i,j By converting it into an upper triangular matrix, the values ​​of the undetermined parameters Rm, R1, and R2 can be solved, thus obtaining the resistance values ​​of the matching circuit and each coil.

[0214] Of course, other methods can be used to determine the resistance values ​​of the matching coil and each coil in the coupling coil group, which will not be detailed here. As long as they do not exceed the core idea of ​​this application, they also fall within the scope of protection of this application.

[0215] Furthermore, this application also provides a semiconductor process apparatus, including a controller and at least two process chambers, each of which is equipped with an RF power supply, a matching unit, and a coupling coil assembly, wherein...

[0216] The coupling coil group includes at least two coils;

[0217] The output of the RF power supply is connected to the input of the matching circuit.

[0218] The output of the matching unit is connected to each coil in the coil group respectively;

[0219] The controller is connected to the RF power supply of each process chamber and collects the current current of each coil in the matching coil group configured in each process chamber.

[0220] The controller is used to execute the RF power supply control method provided in any of the foregoing embodiments to control the RF power supply of each process chamber respectively.

[0221] In some embodiments, this embodiment also provides a computer-readable storage medium, such as a floppy disk, optical disk, hard disk, flash memory, USB flash drive, SD (Secure Digital Memory Card), MMC (Multimedia Card), etc., in which one or more instructions for implementing the above steps are stored. When these one or more instructions are executed by one or more processors, the processors cause the processors to execute the radio frequency power control method or radio frequency power control method described above. For specific implementation details, please refer to the foregoing description; further elaboration is not provided here.

[0222] In addition to the methods and devices described above, embodiments of this application may also be computer program products, which include computer program instructions that, when executed by a processor, cause the processor to perform the steps in the behavior tree visualization processing methods according to various embodiments of this application as described above.

[0223] Computer program products can be written in any combination of one or more programming languages ​​to perform the operations of the embodiments of this application. The programming languages ​​include object-oriented programming languages ​​such as Java and C++, as well as conventional procedural programming languages ​​such as C or similar languages. The program code can be executed entirely on the user's computing device, partially on the user's computing device, as a standalone software package, partially on the user's computing device and partially on a remote computing device, or entirely on a remote computing device or server.

[0224] Those skilled in the art will understand that the contents disclosed herein can be varied and modified in many ways. For example, the various devices or components described above can be implemented in hardware, or in software, firmware, or a combination of some or all of the three.

[0225] Furthermore, while this disclosure makes various references to certain elements of systems according to embodiments of this disclosure, any number of different elements may be used and operated on clients and / or servers. Elements are merely illustrative, and different aspects of the system and method may use different elements.

[0226] This disclosure uses flowcharts to illustrate the steps of a method according to embodiments of this disclosure. It should be understood that the preceding or following steps are not necessarily performed in exact order. Instead, the steps can be processed in reverse order or simultaneously. Furthermore, other operations can be added to these processes.

[0227] Those skilled in the art will understand that all or part of the steps in the above methods can be implemented by a computer program instructing related hardware, and the program can be stored in a computer-readable storage medium, such as a read-only memory. Optionally, all or part of the steps in the above embodiments can also be implemented using one or more integrated circuits. Accordingly, each module / unit in the above embodiments can be implemented in hardware or as a software functional module. This disclosure is not limited to any particular combination of hardware and software.

[0228] Unless otherwise defined, all terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It should also be understood that terms such as those defined in a common dictionary should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and not as having an idealized or highly formalized meaning, unless expressly defined herein.

[0229] The foregoing description is intended to illustrate the present disclosure and should not be construed as limiting it. While several exemplary embodiments of the present disclosure have been described, those skilled in the art will readily understand that many modifications may be made to the exemplary embodiments without departing from the novel teachings and advantages of the present disclosure. Therefore, all such modifications are intended to be included within the scope of the present disclosure as defined by the claims. It should be understood that the foregoing description is intended to illustrate the present disclosure and should not be construed as limiting it to the specific embodiments disclosed, and modifications to the disclosed embodiments and other embodiments are intended to be included within the scope of the appended claims. The present disclosure is defined by the claims and their equivalents.

Claims

1. A radio frequency power supply control method, characterized in that, An application to semiconductor process equipment, the semiconductor process equipment including a process chamber, an RF power supply, a matching unit, and a coupling coil group, wherein the coupling coil group includes at least two coils, and the matching unit is connected to each of the coils respectively, the method comprising: Obtain the current output power of the radio frequency power supply, the current flowing through the matching unit, and the current of each coil; Based on the current current and the predetermined resistance values ​​of the matching device and each coil, calculate the active power loss of the matching device and the coupling coil group; Based on the current output power and the active power loss, the current operating power output to the plasma by the coupling coil group is obtained; If the power deviation between the current operating power and the preset operating power is not within the preset deviation range, adjust the output power of the radio frequency power supply until the power deviation is within the preset deviation range.

2. The radio frequency power supply control method according to claim 1, characterized in that, The coupling coil group includes a first coil and a second coil disposed outside the first coil; The process of obtaining the current current corresponding to the matching unit and each of the coils includes: The current of the target component is collected, and the target component includes any two of the matching device, the first coil, and the second coil; Based on the current current of the target component, determine the current of another component other than the target component among the matching device, the first coil, and the second coil.

3. The radio frequency power supply control method according to claim 2, characterized in that, Based on the current and the predetermined resistance values ​​of the matching device and each coil, the active power loss of the matching device and the coupled coil group is calculated, including: Calculate the ratio of the current current of the first coil to the current current of the matching circuit to obtain the first current ratio; The active power loss of the matching device and the coupling coil group is calculated according to the following formula: Among them, P lost This represents the active power loss of the matching device and the coupling coil group; I1 represents the current of the first coil; I r This indicates the first current ratio; R1 represents the resistance value of the first coil; R2 represents the resistance value of the second coil; Rm represents the resistance value of the matching circuit.

4. The radio frequency power supply control method according to claim 2, characterized in that, Based on the current and the predetermined resistance values ​​of the matching device and each coil, the active power loss of the matching device and the coupled coil group is calculated, including: Calculate the ratio of the current current of the second coil to the current current of the matching circuit to obtain the second current ratio; The active power loss of the matching device and the coupling coil group is calculated according to the following formula: Among them, P lost This represents the active power loss of the matching device and the coupling coil group; I2 represents the current of the second coil; I k This indicates the second current ratio; R1 represents the resistance value of the first coil; R2 represents the resistance value of the second coil; Rm represents the resistance value of the matching circuit.

5. The radio frequency power supply control method according to claim 2, characterized in that, The process of obtaining the current current corresponding to the matching unit and each of the coils includes: Collect the current of the first coil; Based on the current current of the first coil and the first preset current ratio, the current of the matching device and the current of the second coil are determined respectively. Wherein, the first preset current ratio is the ratio of the preset current of the first coil to the preset current of the matching device; Based on the current and the predetermined resistance values ​​of the matching device and each coil, the active power loss of the matching device and the coupled coil group is calculated, including: The active power loss of the matching device and the coupling coil group is calculated according to the following formula: Among them, P lost This represents the active power loss of the matching device and the coupling coil group; I1 represents the current of the first coil; I r ’ This indicates the first preset current ratio; R1 represents the resistance value of the first coil; R2 represents the resistance value of the second coil; Rm represents the resistance value of the matching circuit.

6. The radio frequency power supply control method according to claim 2, characterized in that, The process of obtaining the current current corresponding to the matching unit and each of the coils includes: Collect the current of the second coil; Based on the current current of the second coil and the second preset current ratio, the current of the matching device and the current of the first coil are determined respectively. Wherein, the second preset current ratio is the ratio of the preset current of the second coil to the preset current of the matching device; Based on the current and the predetermined resistance values ​​of the matching device and each coil, the active power loss of the matching device and the coupled coil group is calculated, including: The active power loss of the matching device and the coupling coil group is calculated according to the following formula: Among them, P lost This represents the active power loss of the matching device and the coupling coil group; I2 represents the current of the second coil; I k ’ This indicates the second preset current ratio; R1 represents the resistance value of the first coil; R2 represents the resistance value of the second coil; Rm represents the resistance value of the matching circuit.

7. The radio frequency power supply control method according to claim 1, characterized in that, The process of determining the matching unit and the resistance value corresponding to each of the coils includes: Multiple test samples are obtained, including the matching power and the test current ratio of the matching device. In the absence of plasma in the process chamber, the test results of the semiconductor process equipment running according to each of the test samples are determined, and the test results include the test current of the matching device and each of the coils; For each of the test results, an active power loss calculation formula is created for the matching device and each of the coils, wherein the active power loss calculation formula is used to characterize the calculation method of the active power loss of the matching device and each of the coils, and the resistance value of the matching device and each of the coils is used as an unknown quantity in the active power loss calculation formula. The resistance values ​​of the matching device and each of the coils are determined based on the active power loss calculation formulas.

8. The radio frequency power supply control method according to claim 7, characterized in that, The resistance values ​​of the matching device and each of the coils are determined based on the active power loss calculation formulas, including: The active power loss calculation formulas are converted into fitting matrices based on the least squares method, and the fitting matrices use the resistance values ​​of the matching device and each coil as unknowns. The fitting matrix is ​​solved using Gaussian elimination to obtain the resistance values ​​of the matched circuit and each coil.

9. The radio frequency power supply control method according to any one of claims 1 to 8, characterized in that, Also includes: The operating state of the RF power supply is determined based on the active power loss of the matching unit and the coupling coil group.

10. A semiconductor process apparatus, characterized in that, include: The system includes a controller and at least two process chambers, each of which is equipped with an RF power supply, a matching unit, and a coupling coil assembly. The coupling coil group includes at least two coils; The output terminal of the radio frequency power supply is connected to the input terminal of the matching unit; The output of the matching unit is connected to each coil in the coupling coil group; The controller is connected to the radio frequency power supply of each of the process chambers and collects the current current of each coil in the coupling coil group configured in each process chamber. The controller is used to execute the radio frequency power supply control method as described in any one of claims 1 to 9, so as to control the radio frequency power supply of each of the process chambers respectively.

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