Display panel and processing method thereof

Abstract

The invention discloses a display panel and a processing method thereof. The display panel comprises a substrate; a gate electrode formed on the substrate; a gate insulating layer covering the gate electrode; the active layer is arranged on the gate insulating layer and comprises an insulating substrate with nanoscale holes and two-dimensional semiconductor crystals filled in the holes; the source electrode layer is formed on the grid electrode insulating layer and the active layer and is positioned on one side of the channel part; the drain electrode layer is formed on the gate insulating layer and the active layer and is positioned on the other side of the channel part; and the light adjusting layer at least covers an area above the channel part of the active layer. According to the display panel, the light adjusting layer is additionally arranged above the active layer, so that the specific-wavelength light which easily causes the two-dimensional material to generate photon-generated carriers can be effectively reflected or blocked, the leakage current of a TFT (Thin Film Transistor) in an off state is remarkably reduced, and the working stability and reliability of the display panel are improved.

Description

Technical Field

[0001] This invention relates to the field of display panel technology, and more specifically to a display panel and its processing method. Background Technology

[0002] Thin-film transistors (TFTs) are the core driving components of display panels, and their performance directly affects the display effect. As display technology develops towards higher resolution, higher refresh rates, and lower power consumption, higher demands are placed on the performance of TFTs. Traditional amorphous silicon (a-Si) or polycrystalline silicon (p-Si) active layers are facing bottlenecks in further miniaturization and performance improvement.

[0003] To address this, existing technologies propose using two-dimensional layered semiconductor materials (such as molybdenum disulfide, MoS2) as channel materials for the active layer. These materials possess atomic layer thickness, high carrier mobility, and excellent switching characteristics, effectively reducing the size of active switches and improving device performance. In particular, by filling the pores of mesoporous silicon dioxide to form the active layer, the advantages of both two-dimensional and mesoporous materials are combined.

[0004] However, the inventors discovered that these two-dimensional semiconductor materials are particularly sensitive to light of specific wavelengths. When the display panel is exposed to strong light or its own backlight, the active layer may absorb light and generate photogenerated carriers, leading to an increase in the leakage current (Ioff) of the TFT in the off state, i.e., a phenomenon known as "photoleakage." This reduces the contrast of the display panel, increases power consumption, and may affect the pixel voltage retention characteristics, posing a potential hazard, especially in high-end display applications.

[0005] Therefore, based on the advantages of existing two-dimensional semiconductor active layer technology, how to effectively suppress optical leakage and further utilize optical structures to improve display performance has become a technical problem that urgently needs to be solved in this field. Summary of the Invention

[0006] The problem to be solved by the present invention is to provide a display panel and a processing method thereof, wherein the obtained display panel can effectively suppress photo-induced leakage current and selectively improve the optical performance of the display panel.

[0007] The technical solution provided by the present invention to solve the above problems is: a display panel, comprising: Base; Gate electrodes formed on the substrate; A gate insulating layer covering the gate electrode; An active layer disposed on the gate insulating layer, the active layer comprising an insulating matrix having nanoscale pores and a two-dimensional semiconductor crystal filling the pores; A source layer formed on the gate insulating layer and the active layer, and located on one side of the channel portion; and A drain layer formed on the gate insulating layer and the active layer, and located on the other side of the channel portion; A light modulation layer, wherein the light modulation layer at least covers the region above the channel portion of the active layer.

[0008] Preferably, the light modulation layer is one of a distributed Bragg mirror structure or a Fabry-Perot microcavity structure.

[0009] Preferably, the light modulation layer is configured to reflect light of a specific wavelength that produces a photosensitive effect on the two-dimensional semiconductor layer.

[0010] Preferably, the light modulation layer extends to cover the entire active layer and further extends above a portion of the source and drain layers.

[0011] Preferably, the light modulation layer is located between the active layer and the source / drain layer.

[0012] Preferably, the two-dimensional semiconductor layer comprises mesoporous silicon dioxide and the two-dimensional semiconductor material filling the pores of the mesoporous silicon dioxide.

[0013] This invention also discloses a method for manufacturing a display panel, the method comprising the following steps: Provide a base; A gate electrode and a gate insulating layer covering the gate electrode are formed on the substrate; The active layer is formed on the gate insulating layer, including the growth of a two-dimensional semiconductor crystal within the nanopores of the insulating matrix; The source layer and drain layer are formed; An optical functional layer is formed and positioned on the light incident path of the channel region; After the optical functional layer is formed, the substrate is transferred to a baking apparatus for heat treatment.

[0014] Preferably, the step of forming the optical functional layer is performed using an ALD device, whereby a specified number of SiO2 and TiO2 thin films are sequentially deposited over the channel region to form a DBR structure.

[0015] Preferably, the baking apparatus includes a baking oven; and further includes a placement rack installed inside the baking oven; The placement rack includes several mounting columns and several display panel positioning mechanisms. The mounting columns are vertically installed inside the baking oven, and the display panel positioning mechanisms are vertically spaced on the mounting columns.

[0016] Preferably, the display panel positioning mechanism includes several positioning plates. Several positioning grooves matching the display panel are provided on the upper surface of the positioning plates. A pressing component is provided on the lower surface of the positioning plates. The pressing component is used to press the upper surface of the display panel to fix the display panel in the positioning groove.

[0017] Compared with the prior art, the advantages of the present invention are: by adding a light conditioning layer above the active layer, the present invention can effectively reflect or block specific wavelength light that easily induces photogenerated carriers in two-dimensional materials, thereby significantly reducing the leakage current of the TFT in the off state and improving the working stability and reliability of the display panel. Attached Figure Description

[0018] The accompanying drawings, which are provided to further illustrate the invention and constitute a part of this invention, are illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention.

[0019] Figure 1 This is a schematic diagram of the display panel structure of the present invention; Figure 2 This is a three-dimensional structural diagram of the baking apparatus of the present invention; Figure 3 This is a front view of the baking apparatus of the present invention after the door is opened; Figure 4 This is a top view of the display panel positioning mechanism of the baking apparatus of the present invention; Figure 5 This is a bottom view of the display panel positioning mechanism of the baking apparatus of the present invention; Figure 6 This is a schematic diagram of the rotating sleeve of the baking apparatus of the present invention; Figure 7 This is a schematic diagram of the mounting column of the baking apparatus of the present invention; Figure 8 yes Figure 3 Enlarged view of point A in the middle; Figure 9 This is a cross-sectional view of the locking assembly of the baking apparatus of the present invention; Figure 10 This is a top view of the locking assembly of the baking apparatus of the present invention; Figure 11 This is a schematic diagram of the locking head of the baking device of the present invention; Figure 12 This is a schematic diagram showing the fit between the mounting ring and the positioning ring of the baking device of the present invention.

[0020] Figure labels: 1. Substrate, 2. Gate electrode, 3. Gate insulating layer, 4. Optical functional layer, 5. Source layer, 6. Drain layer, 7. Two-dimensional semiconductor layer, 8. Doped layer, 9. Channel, 10. Oven, 11. Door, 12. Locking assembly, 13. Rotating sleeve, 14. Positioning plate, 15. Sliding frame, 16. Mounting plate, 17. Lifting groove, 18. Lifting plate, 19. Spring three, 20. Movable rod, 21. Positioning rod, 22. Flexible pressure block, 23. Display panel, 24. Movable plate, 25. Handle, 26. Adjusting bolt, 27. Positioning groove one, 28. Mounting hole 29. Mating groove, 30. Slot 1, 31. Force-applying block, 32. Positioning ring, 33. Mounting ring, 34. Positioning block, 35. Telescopic ring, 36. Annular cavity 1, 37. Spring 2, 38. Follower ring, 39. Annular cavity 2, 40. Conical surface 2, 41. Connecting sleeve, 42. Spring 1, 43. Fixing ring, 44. Annular groove, 45. Locking ring, 46. Locking head, 47. Annular cavity 3, 48. Guide groove, 49. Limiting groove, 50. Movable groove, 51. Fixing hole, 52. Slot 2, 53. Limiting block 1, 54. Limiting block 2, 55. Mounting post, 56. Snap ring. Detailed Implementation

[0021] The following will describe in detail the implementation of the present invention with reference to the accompanying drawings and embodiments, so that the process of how the present invention uses technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly.

[0022] In the description of this invention, it should be noted that the directional terms such as "center", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" indicate the orientation and positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limiting the specific protection scope of this invention.

[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. Thus, the use of "first" and "second" to define a feature may explicitly or implicitly include one or more of that feature, and in the description of this invention, "a number" means two or more, unless otherwise explicitly specified.

[0024] In this invention, unless otherwise explicitly specified and limited, the terms "assembly," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can also refer to a mechanical connection; they can refer to a direct connection or a connection through an intermediate medium; or they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0025] It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0026] It should also be understood that the terminology used in this specification of embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to limit the embodiments of the invention. As used in this specification of embodiments of the invention and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise. Example 1

[0027] like Figure 1 As shown, a display panel 23 includes: Base 1; The gate electrode 2 is formed on the substrate 1; Gate insulating layer 3 covering the gate electrode 2; An active layer disposed on the gate insulating layer 3, the active layer comprising an insulating matrix having nanoscale pores and a two-dimensional semiconductor crystal filling the pores; A source layer 5 formed on the gate insulating layer 3 and the active layer, and located on one side of the channel portion 9; and A drain layer 6 is formed on the gate insulating layer 3 and the active layer, and is located on the other side of the channel portion 9; A light modulation layer, which at least covers the area above the channel portion 9 of the active layer.

[0028] The light-adjusting layer is either a distributed Bragg mirror structure or a Fabry-Perot microcavity structure.

[0029] The light modulation layer is configured to reflect light of a specific wavelength that produces a photosensitive effect on the two-dimensional semiconductor layer.

[0030] The light modulation layer is located between the active layer and the source layer 5 / drain layer 6.

[0031] The two-dimensional semiconductor layer comprises mesoporous silicon dioxide and the two-dimensional semiconductor material filling the pores of the mesoporous silicon dioxide.

[0032] The active layer includes the two-dimensional semiconductor layer formed on the gate insulating layer, and the doped layer formed on the two-dimensional semiconductor layer; Specifically, the light conditioning layer is a distributed Bragg reflector (DBR) composed of five alternating SiO2 / TiO2 layers, fabricated using atomic layer deposition (ALD). The optical bandgap of this DBR structure is designed to align with the light absorption peaks of MoS2 (e.g., the visible light band around ~610nm and ~450nm), exhibiting a reflectivity of over 95% for this wavelength band. This structure effectively prevents photons of specific wavelengths from ambient light or backlight from entering the MoS2 channel, thereby fundamentally suppressing the generation of photogenerated carriers. This reduces the off-state current of the TFT by approximately one to two orders of magnitude, significantly improving the static contrast and power consumption of the display panel. Example 2

[0033] A method for manufacturing a display panel 23, the method comprising the following steps: Provide a substrate 1; A gate electrode 2 and a gate insulating layer 3 covering the gate electrode 2 are formed on the substrate 1; The active layer is formed on the gate insulating layer 3, including the growth of a two-dimensional semiconductor crystal within the nanopores of the insulating matrix; The source layer 5 and drain layer 6 are formed; An optical functional layer 4 is formed and positioned on the light incident path of the channel region; After the optical functional layer 4 is formed, the substrate is transferred to a baking apparatus for heat treatment.

[0034] The step of forming the optical functional layer 4 is carried out using an ALD device, where SiO2 and TiO2 thin films with a specified number of cycles are sequentially deposited above the channel region to form a DBR structure. Example 3

[0035] like Figures 2-12 As shown, this embodiment discloses a baking device, which is used in Embodiment 2. Specifically, the baking device includes a baking oven 10; it also includes a placement rack, which is installed inside the baking oven 10. The placement rack includes a plurality of mounting posts 55 and a plurality of display panel positioning mechanisms. The plurality of mounting posts 55 are vertically installed inside the baking oven 10, and the plurality of display panel positioning mechanisms are vertically spaced on the mounting posts 55.

[0036] The display panel positioning mechanism includes several positioning plates 14. Several positioning grooves 27 that match the display panel 23 are provided on the upper surface of the positioning plates 14. A pressing component is provided on the lower surface of the positioning plates 14. The pressing component is used to press the upper surface of the display panel 23 so that the display panel 23 is fixed in the positioning grooves 27.

[0037] The mounting column 55 is provided with several mounting segments at intervals. A rotating sleeve 13 is fitted on the mounting segment. A limit block 53 is provided on the outer circumference of the rotating sleeve 13. The positioning plate 14 is provided with a mounting hole 28 that cooperates with the mounting column 55. A mating groove 29 that cooperates with the limit block 53 is provided on the hole wall of the mounting hole 28.

[0038] The lower end surface of the positioning plate 14 is provided with a slot 30 that can cooperate with the limiting block 53.

[0039] In order to facilitate the installation of the display panel onto the placement rack, the oven 10 is provided with a sliding rack 15 inside. The oven 10 is provided with a switch door 11. After the switch door 11 is opened, the sliding rack 15 can move out of the oven 10, and the placement rack is installed on the sliding rack 15.

[0040] There are four mounting posts 55, which are respectively installed at the four corners of the sliding frame 15.

[0041] In order to ensure that the limiting block can accurately engage with the mating groove 29 or the second slot 52 after the rotating sleeve 13 rotates, a limiting block 54 is provided on the upper end surface of the rotating sleeve 13, and a second slot 52 is provided on the mounting post 55 to engage with the limiting block 54.

[0042] Specifically, in the above scheme, the mating groove is a through groove. During installation, first rotate all the rotating sleeves so that the mating groove corresponds to the position of the first limiting block. Then, install the bottommost positioning plate so that the bottommost positioning plate fits into the bottommost rotating sleeve. Then rotate the rotating sleeve. When the positioning plate of this layer is pressed, the first limiting block can be inserted into the mating groove. The positioning mechanisms of the display panels of the other layers can be installed in the same way.

[0043] In the above solution, the display panel positioning mechanism can use the weight of the upper display panel and the positioning plate to position the lower display panel. After the display panel is baked, only the upper display panel and the positioning plate need to be removed, and the fixing of the lower display panel can be released, making the installation and removal of the display panel more convenient. Furthermore, when the upper and lower positioning plates are under pressure, the limiting block on the rotating sleeve can support the lower positioning plate and the lower positioning plate, preventing the weight of the upper display panel and the positioning plate from pressing completely on the lower display panel and causing damage to the lower display panel.

[0044] The upper end of the mounting post 55 is provided with a locking component 12 for locking the display panel positioning mechanism. The locking component 12 locks the display panel positioning mechanism when the baking oven 10 bakes the display panel, and releases the lock on the display panel positioning mechanism when the baking oven 10 is not working.

[0045] The locking assembly 12 includes a locking head 46, a telescopic ring 35, a follower ring 38, and a locking ring 45. The locking head 46 is provided with a fixing hole 51 that mates with the mounting post 55. The locking head 46 is also provided with an annular cavity 36 for installing the telescopic ring 35 and an annular cavity 39 for installing the follower ring 38. The annular cavity 39 communicates with the fixing hole 51. The locking ring 45 is installed at the communication point between the annular cavity 39 and the fixing hole 51. One end of the follower ring 38 extends into the annular cavity 39 and abuts against the telescopic ring 35. The inner wall of the follower ring 38 is a conical surface 1, and the outer wall of the locking ring 45 is a conical surface 40 that mates with the conical surface 1. The telescopic ring 35 undergoes axial deformation after being heated.

[0046] The locking ring 45 has several axial slots.

[0047] The locking assembly 12 further includes a compensation and fixing mechanism, which comprises a spring 42, a connecting sleeve 41, and a fixing ring 43. One end of the connecting sleeve 41 is provided with a retaining ring 56, and the other end is connected to the spring 42. The end of the spring 42 away from the connecting sleeve 41 is connected to the fixing ring 43. The lower end of the locking head 46 is provided with an annular groove 44 that mates with the retaining ring 56. The telescopic ring 35, after undergoing axial deformation due to heat, can extend into the annular groove 44 and abut against the retaining ring 56. The telescopic ring 35 is made of titanium alloy shape memory material.

[0048] The upper end face of the rotating sleeve 13 is provided with a limiting block 54, and the mounting column 55 is provided with a slot 52 that cooperates with the limiting block 54.

[0049] In the above scheme, after the display panel is fully installed on the mounting rack, the locking assembly is fitted onto the mounting post. Then, the mounting rack is pushed into the baking oven, and the controller is turned on to start the baking oven. The temperature inside the baking oven rises, and the telescopic ring undergoes axial deformation due to the heat. First, the telescopic ring drives the follower ring to squeeze the locking ring. The locking ring deforms and thus locks the outer surface of the mounting post. When the telescopic ring contacts the connecting sleeve, it drives the connecting sleeve to move downwards. The spring is compressed, thus pressing the surface of the fixing plate against the upper positioning plate. After the display panel is baked, the baking oven is closed, the temperature inside the baking oven decreases, the telescopic ring returns to its initial state, and the locking ring releases its grip on the mounting post. The locking assembly can then be removed. This scheme utilizes the high temperature of the baking oven baking the display panel to drive the locking assembly to lock the display panel positioning mechanism, preventing the display panel from falling and being damaged due to vibration of the baking oven. At the same time, after the display panel is baked, the locking assembly is released, and the display panel can be easily removed.

[0050] Those skilled in the art will understand that the locking assembly of this application will only unlock after the temperature drops below the deformation temperature of the telescopic ring. Therefore, when it is necessary to speed up the production process or to quickly remove the display panel after baking, the locking assembly cannot unlock in time. Therefore, the locking assembly 12 also includes a release mechanism, which includes a mounting ring 33, a positioning ring 32, and a second spring 37. The locking head 46 is provided with an annular cavity 47 for mounting the mounting ring 33. The annular cavity 47 is connected to the second annular cavity 39 and has an open upper end. The lower end face of the mounting ring 33 is fixedly connected to the upper end face of the telescopic ring 35. The mounting ring 33 is provided with an annular cavity 4 for mounting the positioning ring 32. The annular cavity four has a vertical guide groove 48 and a horizontal limiting groove 49 on its side wall. One end of the limiting groove 49 is connected to the bottom end of the guide groove 48. The positioning ring 32 is provided with a positioning block 34 that cooperates with the guide groove 48 and the limiting groove 49. The cavity wall of the annular cavity four is provided with a movable groove 50 for the positioning block 34 to cooperate with. The second spring 37 is installed in the first annular cavity 36. One end of the second spring 37 abuts against the bottom end of the first annular cavity 36, and the other end abuts against the bottom end of the telescopic ring 35. The upper end of the mounting ring 33 is provided with a force-applying block 31.

[0051] In the above scheme, when early unlocking is required, the positioning ring is rotated by the force block, so that the positioning block on the positioning ring moves from the limiting groove to the guide groove. Then, the telescopic ring and the mounting ring can move upward under the elastic force of the second spring, so that the locking ring is no longer squeezed, and the locking assembly can be removed.

[0052] The clamping assembly includes an adjustment mechanism and a pressing mechanism. The adjustment mechanism includes a mounting plate 16, an adjusting bolt 26, and a lifting plate 18. The mounting plate 16 is disposed on the lower end face of the positioning plate 14. Threaded holes are provided on both sides of the mounting plate 16. The adjusting bolt 26 is installed in the threaded holes. A lifting groove 17 that mates with the lifting plate 18 is provided on the lower end face of the mounting plate 16. The lower end of the adjusting bolt 26 is rotatably connected to the lifting plate 18 (a connecting cavity is provided on the lifting plate, and a retaining plate that can rotatably mate with the connecting cavity is provided on the lower end of the adjusting bolt). The pressing mechanism includes several telescopic columns. Each telescopic column includes a spring 19, a movable rod 20, and a positioning rod 21. The positioning rod 21 is provided with a movable hole that mates with the movable rod 20. The upper end of the movable rod 20 is fixedly connected to the lower end of the lifting plate 18. One end of the spring 19 is fixedly connected to the upper end of the positioning rod 21, and the other end is fixedly connected to the lifting plate 18. A flexible pressure block 22 is provided at the lower end of the positioning rod 21. The upper surface of the positioning plate 14 is provided with a sliding groove, and a movable plate 24 is provided in the sliding groove. The positioning groove 27 is provided on the movable plate 24, and a handle 25 is provided on one side of the movable plate 24.

[0053] Those skilled in the art will understand that after the display panel on the rack is placed, it may be necessary to replace or sample the lower display panel. Therefore, all the upper positioning plates need to be removed before the lower display panel can be taken out. In the above solution, when the lower display panel needs to be removed, the adjusting bolts at the corresponding positions are first turned. The adjusting bolts drive the lifting plate upward, thereby releasing the positioning of the display panel to be removed by the clamping component. Then, the movable plate can be pulled to remove the corresponding display panel. Through the above technical solution, on the one hand, the weight of the upper display panel and the positioning plate is used to position the lower display panel. After the display panel is baked, only the upper display panel and the positioning plate need to be removed, and the fixing of the lower display panel can be released, making the installation and removal of the display panel more convenient. On the other hand, the clamping component can be adjusted. By adjusting the bolts, the clamping component can be positioned for display panels of different thicknesses. Furthermore, by adjusting the bolts, it is convenient to remove the lower display panel without removing all the upper positioning plates, effectively improving work efficiency.

[0054] The above description only illustrates the preferred embodiments of the present invention and should not be construed as limiting the scope of the claims. The present invention is not limited to the above embodiments, and variations in its specific structure are permitted. All modifications made within the scope of the independent claims of this invention are also within the scope of protection of this invention.

Claims

1. A display panel, characterized in that, include: Base; Gate electrodes formed on the substrate; A gate insulating layer covering the gate electrode; An active layer disposed on the gate insulating layer, the active layer comprising an insulating matrix having nanoscale pores and a two-dimensional semiconductor crystal filling the pores; A source layer formed on the gate insulating layer and the active layer, and located on one side of the channel portion; as well as A drain layer formed on the gate insulating layer and the active layer, and located on the other side of the channel portion; A light modulation layer, wherein the light modulation layer at least covers the region above the channel portion of the active layer.

2. A display panel according to claim 1, characterized in that, The light modulation layer is either a distributed Bragg mirror structure or a Fabry-Perot microcavity structure.

3. A display panel according to claim 1, characterized in that, The light modulation layer is configured to reflect light of a specific wavelength that produces a photosensitive effect on the two-dimensional semiconductor layer.

4. A display panel according to claim 1, characterized in that, The light modulation layer extends to cover the entire active layer and further extends above part of the source and drain layers.

5. A display panel according to claim 1, characterized in that, The light modulation layer is located between the active layer and the source / drain layer.

6. A display panel according to claim 1, characterized in that, The two-dimensional semiconductor layer comprises mesoporous silicon dioxide and the two-dimensional semiconductor material filling the pores of the mesoporous silicon dioxide.

7. A method for manufacturing a display panel as described in any one of claims 1-6, characterized in that, The preparation method includes the following steps: Provide a base; A gate electrode and a gate insulating layer covering the gate electrode are formed on the substrate; The active layer is formed on the gate insulating layer, including the growth of a two-dimensional semiconductor crystal within the nanopores of the insulating matrix; The source layer and drain layer are formed; An optical functional layer is formed and positioned on the light incident path of the channel region; After the optical functional layer is formed, the substrate is transferred to a baking apparatus for heat treatment.

8. A method for manufacturing a display panel according to claim 7, characterized in that, The optical functional layer is formed using an ALD device, where SiO2 and TiO2 films are deposited sequentially over the channel region for a specified number of cycles to form a DBR structure.

9. A method for manufacturing a display panel according to claim 7, characterized in that, The baking apparatus includes a baking oven; it also includes a placement rack installed inside the baking oven. The placement rack includes several mounting columns and several display panel positioning mechanisms. The mounting columns are vertically installed inside the baking oven, and the display panel positioning mechanisms are vertically spaced on the mounting columns.

10. A method for manufacturing a display panel according to claim 9, characterized in that, The display panel positioning mechanism includes several positioning plates. Several positioning grooves matching the display panel are provided on the upper surface of the positioning plates. A pressing component is provided on the lower surface of the positioning plates. The pressing component is used to press the upper surface of the display panel to fix the display panel in the positioning groove.

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