LCD flexible circuit board hot-pressing binding equipment facilitating excessive glue cleaning

Abstract

The invention relates to the technical field of circuit board processing equipment, and particularly discloses LCD flexible circuit board hot-pressing binding equipment convenient for excessive glue cleaning, the LCD flexible circuit board hot-pressing binding equipment comprises a bottom ring, the upper surface of the edge of the bottom ring is fixedly connected with a supporting rod, and the top of the supporting rod is fixedly connected with a top ring. The side surface of the circuit board is continuously rubbed with the polishing strip on the moving block through the rotating circuit board, and solidified overflowing glue on the side surface of the circuit board is rubbed and scraped, so that the overflowing glue on the side surface of the circuit board is automatically cleaned after hot pressing is completed, the automation degree of the equipment is greatly improved, and the production efficiency is improved. Meanwhile, the follow-up procedure of manually cleaning excessive glue is removed, the production efficiency is greatly improved, meanwhile, when the driving ring moves to the bottom, the upper heating disc and the lower heating disc can be driven to start synchronous forward and reverse rotation by continuously and intermittently moving the driving disc up and down through hydraulic equipment, and the grinding effect on the circuit board is greatly improved in combination with a grinding strip; and thus, the capability of cleaning the excessive glue is greatly improved.

Description

Technical Field

[0001] This invention relates to the field of circuit board processing equipment technology, specifically to a heat-press bonding device for LCD flexible circuit boards that facilitates the cleaning of excess adhesive. Background Technology

[0002] In the field of LCD flexible circuit board processing, thermosetting bonding is a key process for achieving reliable interlayer connections between circuits. Heating and pressurizing the adhesive cure it, ensuring the conductivity of the circuitry. However, adhesive overflow is difficult to avoid in this process. If cleaning is not timely or thorough, it can easily lead to short circuits and product defects. Therefore, thermosetting bonding equipment with adhesive overflow cleaning capabilities has become an important tool for improving production efficiency and product yield. Its core lies in the synergistic action of the thermosetting and cleaning mechanisms to achieve efficient bonding of circuit boards and automated handling of adhesive overflow, making it suitable for precision processing scenarios in large-scale LCD flexible circuit board manufacturing.

[0003] Existing hot-press bonding equipment for LCD flexible circuit boards has significant limitations in handling excess adhesive. Regarding cleaning efficiency, traditional equipment lacks an automated excess adhesive cleaning mechanism. After hot pressing, manual cleaning of the solidified excess adhesive on the side surface of the circuit board is required, which is not only time-consuming and labor-intensive but also prone to scratching the circuit board due to improper operation, affecting product quality. The cleaning effect is insufficient; manual cleaning cannot guarantee consistency, and residual excess adhesive or debris may cause problems in subsequent processes. Furthermore, it cannot handle the continuous excess adhesive generated during hot pressing. In addition, the hot pressing and cleaning processes of traditional equipment lack coordination, requiring machine shutdown for cleaning operations. This results in poor production continuity and low efficiency. Moreover, some cleaning components of the equipment are prone to accumulating excess adhesive debris, further affecting the cleaning effect and equipment stability, thus hindering the large-scale production of LCD flexible circuit boards. Summary of the Invention

[0004] (a) Technical problems to be solved

[0005] This invention provides a heat-press bonding device for LCD flexible circuit boards that facilitates the cleaning of excess adhesive, thus solving the problems mentioned in the background art.

[0006] (II) Technical Solution

[0007] To achieve the above objectives, the present invention provides the following technical solution: a heat-pressing bonding device for LCD flexible circuit boards that facilitates the cleaning of excess adhesive, comprising a bottom ring, a support rod fixedly connected to the upper edge of the bottom ring, a top ring fixedly connected to the top of the support rod, and further comprising: a heat-pressing mechanism fixedly mounted on the bottom ring and the top ring; and a cleaning mechanism fixedly mounted on the heat-pressing mechanism; wherein the heat-pressing mechanism includes a mounting rod, the mounting rod being arc-shaped, the mounting rod being fixedly connected to the bottom of the top ring via a connecting rod, the mounting rod being fixedly spaced at three intervals around the central axis of the top ring, wherein the three mounting rods are combined to form a ring, a lower heating plate being rotatably connected to the inner surface of the mounting rod, a telescopic rod being elastically slidably connected through the upper edge of the bottom ring, wherein a magnet is provided inside the telescopic rod, a drive plate being fixedly connected to the top of the telescopic rod, wherein a hydraulic device is externally connected to the upper surface of the drive plate, an upper threaded rod being threadedly connected through the middle upper surface of the drive plate, and an upper heating plate being fixedly connected to the bottom of the upper threaded rod.

[0008] According to one embodiment of the present invention, a lower magnet ring is fixedly embedded on the upper surface of the top ring, and a heat insulation plate is fixedly connected to the upper surface of the upper heating plate, with an upper magnet ring rotatably embedded on the top edge of the heat insulation plate.

[0009] According to one embodiment of the present invention, the cleaning mechanism includes a connecting seat, the inner surface of which is fixedly connected to the outer surface of two adjacent mounting rods respectively, a sliding rod is fixedly connected inside the connecting seat, a sliding column is slidably connected to the upper surface of the connecting seat through the sliding rod, a moving block is fixedly sleeved on the top of the sliding column, a grinding strip is fixedly connected to the inner surface of the moving block, and a through hole is pre-reserved on the upper surface of the moving block.

[0010] According to one embodiment of the present invention, a limiting frame is fixedly connected to the bottom surface of the mounting rod. The limiting frame is provided with three fixed intervals around the central axis of the lower heating plate. A plug tube is slidably connected to the limiting frame. Plug rods are elastically slidably inserted into both ends of the plug tube. The plug tube and plug rods are combined to form a ring. An adapter rod is fixedly connected to the plug rod. The end of the adapter rod away from the plug rod is fixedly connected to the bottom of the sliding column.

[0011] According to one embodiment of the present invention, a lower threaded rod is fixedly connected to the lower surface of the middle part of the lower heating plate, and a connecting frame is rotatably connected to the bottom of the lower threaded rod, the connecting frame being fixedly connected to the inner surface of the bottom ring.

[0012] According to one embodiment of the present invention, a collar is fixedly connected to the inner end of the limiting frame, the collar is rotatably sleeved on the top of the lower threaded rod, a limiting rod is fixedly connected to the lower surface of the collar, and the bottom of the limiting rod is fixedly connected to the upper surface of the connecting frame.

[0013] According to one embodiment of the present invention, the outer surface of the threaded rod is connected to a drive ring by a thread, the drive ring is simultaneously slidably connected to the outer surface of the limiting rod, and a connecting rod is fixedly connected to the outer surface of the drive ring, with one end of the connecting rod away from the drive ring fixedly sleeved on the outer surface of the telescopic rod.

[0014] According to one embodiment of the present invention, a first air pressure bladder is fixedly connected to the lower surface of the collar, the first air pressure bladder is sleeved on the outside of the limiting rod, an adsorption ring is fixedly connected to the bottom of the first air pressure bladder, the adsorption ring is magnetically adsorbed onto the upper surface of the drive disk, a positioning ring is fixedly embedded on the outer surface of the limiting rod, the positioning ring is magnetic, and the first air pressure bladder is connected to the internal cavity of the insertion tube through a flexible tube.

[0015] According to one embodiment of the present invention, a gas-gathering box is fixedly embedded in the lower surface of the top ring, and a through hole is opened at the bottom of the gas-gathering box. The gas-gathering box is disposed above the moving block. A lower mounting ring is fixedly connected to the upper surface of the upper magnetic ring, and a second air pressure bladder is fixedly connected to the upper surface of the lower mounting ring. An upper mounting ring is fixedly connected to the top of the second air pressure bladder. An air inlet pipe is fixedly connected to the side surface of the upper mounting ring, and an air outlet pipe is fixedly connected to the side surface of the lower mounting ring. The end of the air outlet pipe away from the lower mounting ring communicates with the internal cavity of the gas-gathering box. A one-way valve is provided at the air inlet pipe and the air outlet pipe, and the air inlet pipe and the air outlet pipe communicate with the internal cavity of the second air pressure bladder. When it is necessary to perform hot pressing on the circular circuit board, the multilayer board material can be coated. After applying the glue, the entire circuit board assembly is placed on the lower heating plate, positioned below the top ring. An external hydraulic device then moves the drive plate downwards towards the top ring. As the drive plate moves downwards, the telescopic rod retracts, simultaneously causing the upper heating plate to move downwards via the upper threaded rod. Finally, the upper heating plate engages with the top ring, meaning the upper and lower magnetic rings attract each other under electromagnetic attraction. This causes the upper heating plate to press against the upper surface of the circuit board assembly. The upper and lower heating plates then heat the assembly, creating a thermo-pressing environment. After holding the pressure for a period, the thermo-pressing process is complete. During the pressure-holding phase, the heating effect of the upper and lower heating plates is gradually reduced, ultimately completing the process of heat-pressing the circuit board. After processing and pressure holding, the brake drive disc moves downward. At this point, the upper heating disc cannot move further downward. Under the pressure, the upper heating disc begins to rotate relative to the upper magnetic ring via the upper threaded rod. Simultaneously, the distance between the drive disc and the upper heating disc begins to decrease. When the upper and lower magnetic rings are attracted, the telescopic rod cannot be further compressed. At this point, the telescopic rod begins to move downward relative to the bottom ring as the drive disc moves downward. This, in turn, drives the drive ring to move downward synchronously via the connecting rod. Under the influence of magnetism, the attraction ring begins to move downward, thus stretching the first airbag and creating a negative pressure state inside. Then, air pressure is drawn from the insertion tube through the hose, forcing a negative pressure state inside the insertion tube. Finally, the annular structure formed by the insertion tube and the insertion rod begins to... The retraction process involves the adapter rod driving the sliding column inward along the slide bar during the retraction of the connector and plug rod. This causes the sliding column to slide inward on the connector, bringing the moving block at the top of the sliding column closer to the circuit board. Ultimately, the grinding strip on the inner surface of the moving block presses against the side surface of the circuit board. As the drive ring continues to move downward, the adsorption ring gradually approaches the positioning ring on the limit rod. Finally, a strong magnetic attraction is formed between the adsorption ring and the positioning ring, and the magnetism between the adsorption ring and the positioning ring is greater than the magnetism between the adsorption ring and the drive ring. As the drive ring moves further downward, the adsorption ring begins to detach from the drive ring. At this point, the moving block remains pressed against the side surface of the circuit board. Simultaneously, the downward movement of the drive ring, under the action of the lower threaded rod, causes the lower heating plate to rotate.At this point, the upper and lower heating plates are rotating synchronously, while the moving block remains relatively fixed.

[0016] (III) Beneficial Effects

[0017] This invention provides a heat-press bonding device for LCD flexible circuit boards that facilitates the cleaning of excess adhesive. It offers the following advantages:

[0018] (I) This LCD flexible circuit board hot-press bonding equipment, which facilitates the cleaning of excess adhesive, uses a rotating circuit board to continuously rub its side surface against a grinding strip on a moving block, scraping away the solidified excess adhesive on the side surface of the circuit board. This achieves automatic cleaning of excess adhesive on the side surface of the circuit board after hot pressing, significantly improving the automation level of the equipment and eliminating the need for subsequent manual cleaning of excess adhesive, thus greatly improving production efficiency. When the drive ring moves to the bottom, it then drives the hydraulic equipment to pull the drive plate upward. At this time, the telescopic rod is in a magnetic attraction state, meaning the telescopic rod cannot move straight. The telescopic rod then extends and retracts, causing the entire telescopic rod to move upwards. This, in turn, drives the drive ring upwards via the connecting rod, causing the lower heating plate to begin rotating in the opposite direction. At this point, the upper heating plate and the heat insulation plate cannot detach and move upwards due to the attraction between the upper and lower magnetic rings. The upper heating plate then begins to rotate in the opposite direction synchronously via the upper threaded rod. When the drive ring reaches the bottom, the hydraulic equipment continuously moves the drive plate up and down intermittently, causing the upper and lower heating plates to rotate synchronously in both directions. Combined with the grinding strip, this significantly improves the grinding effect on the circuit board and greatly enhances the ability to clean up excess adhesive.

[0019] (II) This LCD flexible circuit board hot-press bonding equipment, which facilitates the cleaning of excess adhesive, means that when the drive ring moves to the top, the drive plate also moves to the top. This means that the drive plate can no longer move upward relative to the upper heating plate, and it begins to pull the upper magnetic ring on the heat insulation plate away from the lower magnetic ring. Finally, it begins to pull the upper heating plate upward to reset. At this time, the telescopic rod also resets with the bottom ring and cannot be pulled upward as a whole. This means that the telescopic ring also begins to expand under the driving force, and then begins to drive the whole equipment to reset. The processed circuit board can then be taken out through the cavity on the top ring. At the same time, the hot-pressing process of the next circuit board can be carried out directly. This greatly improves the working continuity of the equipment, improves the hot-pressing efficiency of the circuit board, and avoids the problem of low production efficiency caused by frequent manual intervention in existing equipment.

[0020] (III) This LCD flexible circuit board hot-press bonding equipment, which facilitates the cleaning of excess adhesive, allows the drive plate to gradually approach the upper mounting ring as it gets closer to the upper heating plate, eventually squeezing the upper mounting ring. The upper mounting ring then squeezes the second air chamber, initiating the air pressure inside the second air chamber through the air outlet pipe to the air collection box. Finally, the air is blown outwards through the through-hole at the bottom of the air collection box to the contact area between the grinding strip and the circuit board, cleaning the excess adhesive debris from the grinding strip. This prevents excess adhesive debris from lingering at the grinding strip and causing scratches on the side surface of the circuit board, significantly improving the protection of the circuit board. As the drive plate intermittently moves up and down, driving the circuit board to rotate in both directions, the second air chamber is continuously squeezed and reset under its own elasticity. Simultaneously, during reset, air pressure is filled into the second air chamber through the air inlet pipe, achieving automatic pressure balance filling and further improving the automation level of the equipment, reducing manual intervention. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0022] Figure 2 This is a schematic diagram of the drive disk and its connection structure of the present invention;

[0023] Figure 3 This is a schematic diagram of the heating plate and its connection structure of the present invention;

[0024] Figure 4 This is a schematic diagram of the heat insulation plate and its connection structure of the present invention;

[0025] Figure 5 This is a schematic diagram of the insertion tube and its connection structure of the present invention;

[0026] Figure 6 This is a schematic diagram of the driving ring and its connection structure of the present invention;

[0027] Figure 7 This is a schematic diagram of the limiting rod and its connecting structure of the present invention;

[0028] Figure 8 This is a schematic diagram of the structure of the movable block of the present invention.

[0029] In the diagram: 1. Bottom ring; 2. Support rod; 3. Top ring; 4. Hot pressing mechanism; 41. Mounting rod; 42. Lower heating plate; 43. Telescopic rod; 44. Drive plate; 45. Upper threaded rod; 46. Upper heating plate; 47. Lower magnetic ring; 48. Heat insulation plate; 49. Upper magnetic ring; 5. Cleaning mechanism; 51. Connecting seat; 52. Slide rod; 53. Sliding column; 54. Moving block; 55. Grinding strip; 56. Limiting bracket; 57. 58. Connecting pipe; 59. Connecting rod; 510. Threaded rod; 511. Connecting frame; 512. Collar; 513. Limiting rod; 514. Drive ring; 515. Connecting rod; 516. No. 1 air pressure bag; 517. Adsorption ring; 518. Positioning ring; 519. Air collection box; 520. Lower mounting ring; 521. No. 2 air pressure bag; 522. Upper mounting ring; 523. Air inlet pipe; 524. Air outlet pipe. Detailed Implementation

[0030] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] First embodiment: as follows Figures 1 to 8 As shown, the present invention provides a technical solution: a heat-press bonding device for LCD flexible circuit boards that facilitates the cleaning of excess adhesive, comprising a bottom ring 1, a support rod 2 fixedly connected to the upper surface of the edge of the bottom ring 1, and a top ring 3 fixedly connected to the top of the support rod 2, and further comprising:

[0032] Hot pressing mechanism 4 is fixedly installed on bottom ring 1 and top ring 3;

[0033] Cleaning mechanism 5 is fixedly installed on hot pressing mechanism 4;

[0034] The hot pressing mechanism 4 includes a mounting rod 41, which is arc-shaped and fixedly connected to the bottom of the top ring 3 via a connecting rod. The mounting rod 41 is fixedly spaced at three intervals around the central axis of the top ring 3, and the three mounting rods 41 are combined to form a ring. The inner surface of the mounting rod 41 is rotatably connected to a lower heating plate 42. The upper edge of the bottom ring 1 is elastically slidably connected to a telescopic rod 43, which contains a magnet. The top of the telescopic rod 43 is fixedly connected to a drive plate 44, and the upper surface of the drive plate 44 is externally connected to a hydraulic device. The upper surface of the middle part of the drive plate 44 is threadedly connected to an upper threaded rod 45, and the bottom of the upper threaded rod 45 is fixedly connected to an upper heating plate 46.

[0035] The upper surface of the top ring 3 is fixedly inlaid with a lower magnet ring 47, and the upper surface of the upper heating plate 46 is fixedly connected with a heat insulation plate 48. The top edge of the heat insulation plate 48 is rotatably inlaid with an upper magnet ring 49.

[0036] Second embodiment: as follows Figures 1 to 8 As shown, the cleaning mechanism 5 includes a connecting seat 51. The inner surface of the connecting seat 51 is fixedly connected to the outer surface of two adjacent mounting rods 41. A sliding rod 52 is fixedly connected inside the connecting seat 51. A sliding column 53 is slidably connected to the upper surface of the connecting seat 51 through the sliding rod 52. A moving block 54 is fixedly sleeved on the top of the sliding column 53. A grinding strip 55 is fixedly connected to the inner surface of the moving block 54. A through hole is reserved through the upper surface of the moving block 54.

[0037] The bottom surface of the mounting rod 41 is fixedly connected to a limiting frame 56. The limiting frame 56 is fixedly spaced at three intervals around the central axis of the lower heating plate 42. A plug tube 57 is slidably connected to the limiting frame 56. Plug rods 58 are elastically slidably inserted into both ends of the plug tube 57. The plug tube 57 and the plug rods 58 are combined to form a ring. An adapter rod 59 is fixedly connected to the plug rod 58. The end of the adapter rod 59 away from the plug rod 58 is fixedly connected to the bottom of the sliding column 53.

[0038] A lower threaded rod 510 is fixedly connected to the lower surface of the middle part of the lower heating plate 42. A connecting bracket 511 is rotatably connected to the bottom of the lower threaded rod 510. The connecting bracket 511 is fixedly connected to the inner surface of the bottom ring 1.

[0039] The inner end of the limiting frame 56 is fixedly connected to a collar 512, which is rotatably sleeved on the top of the lower threaded rod 510. The lower surface of the collar 512 is fixedly connected to a limiting rod 513, and the bottom of the limiting rod 513 is fixedly connected to the upper surface of the connecting frame 511.

[0040] The outer surface of the threaded rod 510 is connected to a drive ring 514 by a thread. The drive ring 514 is also slidably connected to the outer surface of the limit rod 513. The outer surface of the drive ring 514 is fixedly connected to a connecting rod 515. The end of the connecting rod 515 away from the drive ring 514 is fixedly sleeved on the outer surface of the telescopic rod 43.

[0041] A first air pressure bag 516 is fixedly connected to the lower surface of the collar 512. The first air pressure bag 516 is sleeved on the outside of the limiting rod 513. An adsorption ring 517 is fixedly connected to the bottom of the first air pressure bag 516. The adsorption ring 517 is magnetically adsorbed onto the upper surface of the drive disk 44. A positioning ring 518 is fixedly embedded on the outer surface of the limiting rod 513. The positioning ring 518 is magnetic. The first air pressure bag 516 is connected to the internal cavity of the insertion tube 57 through a hose.

[0042] A gas-gathering box 519 is fixedly embedded on the lower surface of the top ring 3. A through hole is opened at the bottom of the gas-gathering box 519. The gas-gathering box 519 is positioned above the moving block 54. A lower mounting ring 520 is fixedly connected to the upper surface of the upper magnetic ring 49. A second air pressure bag 521 is fixedly connected to the upper surface of the lower mounting ring 520. An upper mounting ring 522 is fixedly connected to the top of the second air pressure bag 521. An air inlet pipe 523 is fixedly connected to the side surface of the upper mounting ring 522. An air outlet pipe 524 is fixedly connected to the side surface of the lower mounting ring 520. The end of the air outlet pipe 524 away from the lower mounting ring 520 is connected to the internal cavity of the gas-gathering box 519. A one-way valve is provided at the air inlet pipe 523 and the air outlet pipe 524. The air inlet pipe 523 and the air outlet pipe 524 are connected to the internal cavity of the second air pressure bag 521.

[0043] During operation, when hot pressing of a circular circuit board is required, the multi-layer board is coated with glue and placed on the lower heating plate 42. At this time, the circuit board assembly is below the top ring 3. Then, an external hydraulic device causes the drive plate 44 to move down closer to the top ring 3. As the drive plate 44 moves down, the telescopic rod 43 begins to retract, and the upper threaded rod 45 drives the upper heating plate 46 to move down synchronously. Finally, the upper heating plate 46 begins to engage with the top ring 3, that is, the upper magnetic ring 49 and the lower magnetic ring 47 begin to attract each other under the action of electromagnetism, so that the upper heating plate 46 begins to press the upper surface of the circuit board assembly. At this time, the upper heating plate 46 and the lower heating plate 42 begin to heat the circuit board assembly, thus forming a hot pressing environment. Then, through... After a period of pressure holding, the hot pressing operation of the circuit board is completed. During the pressure holding stage, the heating effect of the upper heating plate 46 and the lower heating plate 42 is gradually disconnected, ultimately completing the processing of the circuit board. After the pressure holding is completed, the brake drive plate 44 moves downward. At this point, the upper heating plate 46 cannot move further downward; that is, under the pressure, the upper heating plate 46 begins to rotate relative to the upper magnetic ring 49 via the upper threaded rod 45. Simultaneously, the distance between the drive plate 44 and the upper heating plate 46 begins to decrease. When the upper magnetic ring 49 and the lower magnetic ring 47 are attracted, the telescopic rod 43 cannot be further compressed. At this point, the telescopic rod 43 begins to move downward relative to the bottom ring 1 as the drive plate 44 moves downward, thereby driving the drive ring 514 to move downward synchronously via the connecting rod 515. Under the influence of magnetism, the adsorption ring 517 begins to move downwards, thus stretching the first air pressure bag 516 and creating a negative pressure state inside. This causes air pressure to be drawn from the connector 57 through the hose, forcing a negative pressure state within the connector 57. Ultimately, the annular structure formed by the connector 57 and the connector rod 58 begins to contract. As the connector 57 and connector rod 58 contract, the sliding column 53 is driven inwards along the slide rod 52 via the adapter rod 59. The sliding column 53 slides inwards on the connecting seat 51, causing the moving block 54 at the top of the sliding column 53 to approach the circuit board. Finally, the grinding strip 55 on the inner surface of the moving block 54 presses against the side surface of the circuit board. At this time, as the drive ring 514 continues to move downwards, the adsorption ring 517 gradually approaches the limit. The positioning ring 518 on the positioning rod 513 eventually forms a strong magnetic attraction between the adsorption ring 517 and the positioning ring 518. The magnetism between the adsorption ring 517 and the positioning ring 518 is greater than that between the adsorption ring 517 and the driving ring 514. As the driving ring 514 moves further down, the adsorption ring 517 begins to detach from the adsorption of the driving ring 514. At this time, the moving block 54 is always pressed against the side surface of the circuit board. At the same time, when the driving ring 514 moves down, it will drive the lower heating plate 42 to start rotating under the action of the lower threaded rod 510. That is, at this time, the upper heating plate 46 and the lower heating plate 42 are in a state of synchronous rotation, while the moving block 54 is relatively fixed. The rotating circuit board causes its side surface to continuously rub against the grinding strip 55 on the moving block 54.The solidified adhesive on the side surface of the circuit board is scraped off by friction, thus automatically cleaning the adhesive on the side surface of the circuit board after hot pressing, which greatly improves the automation level of this equipment and eliminates the subsequent manual cleaning of adhesive, significantly improving production efficiency. When the drive ring 514 moves to the bottom, it drives the hydraulic equipment to pull the drive plate 44 upward. At this time, the inside of the telescopic rod 43 is in a magnetic attraction state, that is, the telescopic rod 43 cannot directly extend or retract. As a result, the telescopic rod 43 moves upward as a whole, and begins to drive the drive ring 514 upward through the connecting rod 515, so that the lower heating plate 42 begins to rotate in the opposite direction. At this time, the upper heating plate 46 and the heat insulation plate 48 cannot detach and move upward due to the attraction of the upper magnetic ring 49 and the lower magnetic ring 47. The threaded rod 45 drives the upper heating plate 46 to rotate synchronously in opposite directions. When the drive ring 514 moves to the bottom, the hydraulic device continuously moves the drive plate 44 up and down intermittently, causing the upper heating plate 46 and the lower heating plate 42 to rotate synchronously in both directions. Combined with the grinding strip 55, this significantly improves the grinding effect on the circuit board, thereby greatly improving the ability to clean excess adhesive. When the drive ring 514 moves to the top, it means that the drive plate 44 has also moved to the top, meaning that the drive plate 44 can no longer move upwards relative to the upper heating plate 46. This causes the upper magnetic ring 49 on the heat insulation plate 48 to disengage from the lower magnetic ring 47, ultimately pulling the upper heating plate 46 upwards to reset. At this time, the telescopic rod 43 also engages with the bottom ring. When the device between points 1 and 3 cannot be pulled upwards as a whole, the telescopic ring also begins to expand under the pull, thus driving the entire device to reset. The completed circuit board can then be removed through the cavity on the top ring 3, and the next circuit board can be directly hot-pressed. This significantly improves the continuity of the device's operation and the hot-pressing efficiency of the circuit boards, avoiding the low production efficiency caused by frequent manual intervention in existing equipment. When the drive plate 44 is relatively close to the upper heating plate 46, it gradually approaches the upper mounting ring 522 and eventually squeezes the upper mounting ring 522. Then, the upper mounting ring 522 squeezes the second air pressure bladder 521, thus beginning to depressurize the air inside the second air pressure bladder 521. The air is conveyed through the outlet pipe 524 to the air collection box 519, and finally blown outward through the through hole at the bottom of the air collection box 519 at the contact area between the grinding strip 55 and the circuit board. This removes and cleans the excess glue debris produced by the grinding strip 55, preventing the excess glue debris from remaining on the grinding strip 55 for a long time and causing scratches on the side surface of the circuit board, thus greatly improving the protection of the circuit board. When the drive plate 44 moves up and down intermittently to drive the circuit board to rotate forward and backward, the second air pressure bladder 521 is also continuously squeezed and reset under its own elasticity. At the same time, air pressure is filled into the second air pressure bladder 521 through the air inlet pipe 523 during reset, thereby realizing the automatic pressure balance filling of the second air pressure bladder 521, further improving the automation level of this equipment and reducing manual intervention.

[0044] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0045] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A heat-press bonding device for LCD flexible circuit boards that facilitates the cleaning of excess adhesive, comprising a bottom ring (1), characterized in that: A support rod (2) is fixedly connected to the upper edge of the bottom ring (1), and a top ring (3) is fixedly connected to the top of the support rod (2). The structure also includes: A hot pressing mechanism (4) is fixedly installed on the bottom ring (1) and the top ring (3); Cleaning mechanism (5), which is fixedly installed on hot pressing mechanism (4); The hot pressing mechanism (4) includes a mounting rod (41), which is arc-shaped and is fixedly connected to the bottom of the top ring (3) by a connecting rod. The mounting rod (41) is fixedly spaced at three intervals around the central axis of the top ring (3), and the three mounting rods (41) are combined to form a ring. The inner surface of the mounting rod (41) is rotatably connected to a lower heating plate (42). The upper edge of the bottom ring (1) is elastically slidably connected to a telescopic rod (43), which is provided with a magnet inside. The top of the telescopic rod (43) is fixedly connected to a drive plate (44), and the upper surface of the drive plate (44) is externally connected to a hydraulic device. The upper surface of the middle part of the drive plate (44) is threadedly connected to an upper threaded rod (45), and the bottom of the upper threaded rod (45) is fixedly connected to an upper heating plate (46).

2. The LCD flexible circuit board hot-press bonding equipment for easy cleaning of excess adhesive as described in claim 1, characterized in that: The upper surface of the top ring (3) is fixedly inlaid with a lower magnet ring (47), the upper surface of the upper heating plate (46) is fixedly connected with a heat insulation plate (48), and the top edge of the heat insulation plate (48) is rotatably inlaid with an upper magnet ring (49).

3. The LCD flexible circuit board hot-press bonding equipment for easy cleaning of excess adhesive as described in claim 2, characterized in that: The cleaning mechanism (5) includes a connecting seat (51), the inner surface of which is fixedly connected to the outer surface of two adjacent mounting rods (41), a sliding rod (52) is fixedly connected inside the connecting seat (51), a sliding column (53) is slidably connected to the upper surface of the connecting seat (51) through the sliding rod (52), a moving block (54) is fixedly sleeved on the top of the sliding column (53), a grinding strip (55) is fixedly connected to the inner surface of the moving block (54), and a through hole is reserved on the upper surface of the moving block (54).

4. The LCD flexible circuit board hot-press bonding equipment for easy cleaning of excess adhesive according to claim 3, characterized in that: The bottom surface of the mounting rod (41) is fixedly connected to a limiting frame (56). The limiting frame (56) is fixedly spaced at three intervals around the central axis of the lower heating plate (42). A plug tube (57) is slidably connected to the limiting frame (56). A plug rod (58) is elastically slidably inserted into both ends of the plug tube (57). The plug tube (57) and the plug rod (58) are combined to form a ring. A transition rod (59) is fixedly connected to the plug rod (58). The end of the transition rod (59) away from the plug rod (58) is fixedly connected to the bottom of the sliding column (53).

5. The LCD flexible circuit board hot-press bonding equipment for easy cleaning of excess adhesive according to claim 4, characterized in that: A lower threaded rod (510) is fixedly connected to the lower surface of the middle part of the lower heating plate (42), and a connecting frame (511) is rotatably connected to the bottom of the lower threaded rod (510). The connecting frame (511) is fixedly connected to the inner surface of the bottom ring (1).

6. The LCD flexible circuit board hot-press bonding equipment for easy cleaning of excess adhesive as described in claim 5, characterized in that: The inner end of the limiting frame (56) is fixedly connected to a collar (512), which is rotatably sleeved on the top of the lower threaded rod (510). The lower surface of the collar (512) is fixedly connected to a limiting rod (513), and the bottom of the limiting rod (513) is fixedly connected to the upper surface of the connecting frame (511).

7. The LCD flexible circuit board hot-press bonding equipment for easy cleaning of excess adhesive according to claim 6, characterized in that: The outer surface of the threaded rod (510) is connected to a drive ring (514) by a thread. The drive ring (514) is also slidably connected to the outer surface of the limiting rod (513). A connecting rod (515) is fixedly connected to the outer surface of the drive ring (514). The end of the connecting rod (515) away from the drive ring (514) is fixedly sleeved on the outer surface of the telescopic rod (43).

8. The LCD flexible circuit board hot-press bonding equipment for easy cleaning of excess adhesive according to claim 7, characterized in that: A first air pressure bag (516) is fixedly connected to the lower surface of the collar (512). The first air pressure bag (516) is sleeved on the outside of the limiting rod (513). An adsorption ring (517) is fixedly connected to the bottom of the first air pressure bag (516). The adsorption ring (517) is magnetically adsorbed onto the upper surface of the drive disk (44). A positioning ring (518) is fixedly embedded on the outer surface of the limiting rod (513). The positioning ring (518) is magnetic. The first air pressure bag (516) is connected to the internal cavity of the insertion tube (57) through a hose.

9. The LCD flexible circuit board hot-press bonding equipment for easy cleaning of excess adhesive according to claim 8, characterized in that: A gas-gathering box (519) is fixedly embedded on the lower surface of the top ring (3). A through hole is provided at the bottom of the gas-gathering box (519). The gas-gathering box (519) is positioned above the moving block (54). A lower mounting ring (520) is fixedly connected to the upper surface of the upper magnet ring (49). A second air pressure bag (521) is fixedly connected to the upper surface of the lower mounting ring (520). An upper mounting ring (522) is fixedly connected to the top of the second air pressure bag (521). An air inlet pipe (523) is fixedly connected to the side surface of the upper mounting ring (522), and an air outlet pipe (524) is fixedly connected to the side surface of the lower mounting ring (520). The end of the air outlet pipe (524) away from the lower mounting ring (520) is connected to the internal cavity of the air-gathering box (519). One-way valves are provided at the air inlet pipe (523) and the air outlet pipe (524), and the air inlet pipe (523) and the air outlet pipe (524) are connected to the internal cavity of the second air pressure bag (521).

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