Three-dimensional vapor chamber module, server and immersed liquid cooling system

Abstract

The invention discloses a three-dimensional uniform temperature plate module, a server and an immersed liquid cooling system, and the three-dimensional uniform temperature plate module is used for being thermally coupled to a heat source and comprises a first uniform temperature plate, a second uniform temperature plate, at least one first heat pipe and a plurality of boiling assisting structures. The first vapor chamber is provided with a first fluid chamber and is used for being thermally coupled to a heat source. The second uniform temperature plate is provided with a second fluid chamber. The first heat pipe is provided with a first fluid channel, and the first fluid channel is communicated with the first fluid cavity and the second fluid cavity. The boiling assisting structures are arranged on the first temperature equalizing plate and the second temperature equalizing plate respectively.

Description

Technical Field

[0001] This invention relates to a three-dimensional vapor chamber module, a server, and an immersion liquid cooling system. Background Technology

[0002] Currently, the industry commonly uses heat dissipation components with boiling structures to thermally couple to electronic components and immerse them in coolant. This conducts heat generated by the electronic components to the coolant, causing a phase change in the coolant that carries away the heat.

[0003] However, with the advancement of technology, electronic components are becoming increasingly powerful, but this also leads to a significant increase in the heat they generate. Consequently, the heat transfer efficiency of current heat dissipation devices is gradually becoming inadequate for current needs. Therefore, researchers in this field are dedicated to solving the aforementioned problems. Summary of the Invention

[0004] The present invention provides a three-dimensional vapor chamber module, a server, and an immersion liquid cooling system to solve the problem that the heat transfer efficiency of planar vapor chambers is gradually failing to meet the requirements.

[0005] An embodiment of the present invention discloses a three-dimensional vapor chamber module for thermal coupling to a heat source, comprising a first vapor chamber, a second vapor chamber, at least one first heat pipe, and a plurality of boiling-aiding structures. The first vapor chamber has a first fluid chamber and is used for thermal coupling to the heat source. The second vapor chamber has a second fluid chamber. The first heat pipe has a first fluid channel connecting the first fluid chamber and the second fluid chamber. These boiling-aiding structures are respectively disposed on the first and second vapor chambers.

[0006] Another embodiment of the present invention discloses a server comprising a motherboard and a three-dimensional vapor chamber module. The motherboard has a heat source. The three-dimensional vapor chamber module includes a first vapor chamber, a second vapor chamber, at least one first heat pipe, and a plurality of boiling-aiding structures. The first vapor chamber has a first fluid chamber and is thermally coupled to the heat source. The second vapor chamber has a second fluid chamber. The first heat pipe has a first fluid channel connecting the first fluid chamber and the second fluid chamber. These boiling-aiding structures are respectively disposed on the first vapor chamber and the second vapor chamber.

[0007] Another embodiment of the present invention discloses an immersion liquid cooling system comprising a tank and at least one server. The tank is used to contain a coolant. The server is configured to be disposed in the tank and immersed in the coolant. The server includes a carrier, a motherboard, and a three-dimensional vapor chamber module. The motherboard is disposed on the carrier and has a heat source. The three-dimensional vapor chamber module includes a first vapor chamber, a second vapor chamber, at least one first heat pipe, and a plurality of boiling-aiding structures. The first vapor chamber has a first fluid chamber and is thermally coupled to the heat source. The second vapor chamber has a second fluid chamber. The first heat pipe has a first fluid channel communicating between the first fluid chamber and the second fluid chamber. The boiling-aiding structures are respectively disposed on the first and second vapor chambers.

[0008] According to the three-dimensional vapor chamber module, server and immersion liquid cooling system disclosed in the above embodiments, the first fluid chamber of the first vapor chamber and the second fluid chamber of the second vapor chamber are connected through the first fluid channel of the first heat pipe, and the design of these boiling aid structures being respectively disposed on the first vapor chamber and the second vapor chamber can improve the heat transfer efficiency of the vapor chamber to cope with heat sources with higher heat generation.

[0009] The above description of the content of this invention and the following description of the embodiments are used to demonstrate and explain the principles of this invention, and to provide a further explanation of the scope of the patent application of this invention. Attached Figure Description

[0010] Figure 1 This is a cross-sectional view of an immersion liquid cooling system according to some embodiments of the present invention;

[0011] Figure 2 This is a perspective view of a three-dimensional heat spreader module according to some embodiments of the present invention;

[0012] Figure 3 This is a cross-sectional view of a three-dimensional heat exchanger module according to some embodiments of the present invention;

[0013] Figure 4 This is a cross-sectional view of an immersion liquid cooling system according to some embodiments of the present invention;

[0014] Figure 5 This is a cross-sectional view of a three-dimensional heat exchanger module according to some embodiments of the present invention;

[0015] Figure 6 This is a perspective view of a three-dimensional heat spreader module according to some embodiments of the present invention;

[0016] Figure 7 This is a cross-sectional view of a three-dimensional heat exchanger module according to some embodiments of the present invention;

[0017] Figure 8 This is a cross-sectional view of a three-dimensional heat exchanger module according to some embodiments of the present invention.

[0018] Symbol Explanation

[0019] 1,1a: Immersion liquid cooling system

[0020] 10: Tank

[0021] 20: Server

[0022] 21: Bearing component

[0023] 22: Motherboard

[0024] 23, 23a, 23b, 23c, 23d: Three-dimensional heat exchanger module

[0025] 231, 231a, 231b, 231c, 231d: First heat spreader

[0026] 2311, 2311c: First fluid chamber

[0027] 2312: Thermal coupling surface

[0028] 2313, 2313b, 2313d: First heat dissipation surface

[0029] 232, 232a, 232b, 232c, 232d: Second heat exchange plate

[0030] 2321, 2321c: Second fluid chamber

[0031] 2322, 2322b, 2322d: Second heat dissipation surface

[0032] 2323, 2323b, 2323d: Third heat dissipation surface

[0033] 233, 233b, 233c, 233d: First heat pipe

[0034] 2331, 2331c: First fluid channel

[0035] 234, 234b, 234d: Boiling aid structure

[0036] 235, 235c: Capillary structure

[0037] 236c, 236d: Second heat pipe

[0038] 2361c: Second fluid channel

[0039] C: Coolant

[0040] H: Heat source

[0041] L1, L2: Long side

[0042] S1, S2: Short side

[0043] G: Direction of gravity

[0044] P: Channel

[0045] O: Opening

[0046] D: Distance Detailed Implementation

[0047] Please see Figures 1 to 3 , Figure 1 A cross-sectional view of an immersion liquid cooling system 1 according to some embodiments of the present invention is shown. Figure 2 A perspective view of a three-dimensional heat spreader module 23 according to some embodiments of the present invention is shown. Figure 3 A cross-sectional view of a three-dimensional heat spreader module 23 according to some embodiments of the present invention is shown. Figures 1 to 3 The structural features can be applied in other embodiments of the present invention.

[0048] An immersion liquid cooling system 1 includes a tank 10 and at least one server 20. The tank 10 contains a coolant C. The server 20 is configured to be disposed within the tank 10 and immersed in the coolant C. The server 20 includes a carrier 21, a motherboard 22, and a three-dimensional vapor chamber module 23. The motherboard 22 is disposed on the carrier 21 and has a heat source H. The three-dimensional vapor chamber module 23 includes a first vapor chamber 231, a second vapor chamber 232, at least one first heat pipe 233, and a plurality of boiling aid structures 234. The first vapor chamber 231 has a first fluid chamber 2311 and is thermally coupled to the heat source H. The second vapor chamber 232 has a second fluid chamber 2321. The first heat pipe 233 has a first fluid channel 2331 that connects the first fluid chamber 2311 and the second fluid chamber 2321. These boiling aid structures 234 are respectively disposed on the first temperature distribution plate 231 and the second temperature distribution plate 232.

[0049] In some embodiments, the carrier 21 may be a tray or a support frame, but is not limited thereto. In some embodiments, the heat source H of the motherboard 22 may be a central processing unit or a graphics processor, but is not limited thereto.

[0050] In some embodiments, the first vapor chamber 231 has a thermally coupled surface 2312 and a first heat dissipation surface 2313 facing each other, the thermally coupled surface 2312 being used for thermal coupling to the heat source H. The second vapor chamber 232 has a second heat dissipation surface 2322 and a third heat dissipation surface 2323 facing each other. In some embodiments, the number of first heat pipes 233 is multiple. In some embodiments, the first vapor chamber 231 and the second vapor chamber 232 are arranged side by side at intervals through these first heat pipes 233, and the second heat dissipation surface 2322 of the second vapor chamber 232 faces the first heat dissipation surface 2313 of the first vapor chamber 231. That is, the first vapor chamber 231 and the second vapor chamber 232 are configured as a double-layer structure via these first heat pipes 233. In some embodiments, the first heat pipes 233 can be welded to the first vapor chamber 231 and the second vapor chamber 232.

[0051] In some embodiments, the first heat exchanger 231 and the second heat exchanger 232 are rectangular. The first heat exchanger 231 has a long side L1 and a short side S1, and the second heat exchanger 232 has a long side L2 and a short side S2, wherein the short side S1 of the first heat exchanger 231 and the short side S2 of the second heat exchanger 232 are parallel to the direction of gravity G. In one embodiment, a channel P is formed between the first heat exchanger 231 and the second heat exchanger 232, and the channel P has an upward opening O, thereby allowing gas formed between the first heat exchanger 231 and the second heat exchanger 232 to float upward in the channel P and pass through the opening O.

[0052] In some embodiments, the boiling-aiding structures 234 are respectively disposed on at least one of the second heat dissipation surface 2322 and the third heat dissipation surface 2323 and the first heat dissipation surface 2313. In some embodiments, the boiling-aiding structures 234 are respectively disposed on the third heat dissipation surface 2323 and the first heat dissipation surface 2313. In some embodiments, the boiling-aiding structures 234 are also disposed on the second heat dissipation surface 2322. That is, the boiling-aiding structures 234 are respectively disposed on the first heat dissipation surface 2313, the second heat dissipation surface 2322 and the third heat dissipation surface 2323.

[0053] The function of the boiling aid structure 234 is to increase the number of bubble nucleation points, thereby generating more boiling bubbles per unit time, and to increase the contact area with the coolant C. Although Figure 2 and Figure 3 The boiling aid structure 234 shown is simplified to a sheet-like structure, but in fact, the boiling aid structure 234 mentioned in this invention may include at least one of the following: a mesh metal structure, a sheet fin structure, a pinfin structure, or a sintered metal structure.

[0054] In some embodiments, the distance D between the second heat dissipation surface 2322 of the second heat dissipation plate 232 and the first heat dissipation surface 2313 of the first heat dissipation plate 231 is greater than or equal to 5 mm. In some embodiments, the distance D between the second heat dissipation surface 2322 of the second heat dissipation plate 232 and the first heat dissipation surface 2313 of the first heat dissipation plate 231 is less than or equal to 25 mm.

[0055] In some embodiments, the three-dimensional heat spreader module 23 may further include a plurality of capillary structures 235, which are respectively disposed in the first fluid chamber 2311 of the first heat spreader 231, the second fluid chamber 2321 of the second heat spreader 232, and the first fluid channel 2331 of the first heat pipe 233. In some embodiments, the capillary structures 235 of the first fluid chamber 2311 and the second fluid chamber 2321 are connected to each other through the capillary structures 235 of the first fluid channel 2331.

[0056] In the above embodiment, the heat generated by the heat source H is conducted to the first vapor chamber 231, causing the working fluid (not shown) in the first fluid chamber 2311 of the first vapor chamber 231 to vaporize. The gaseous working fluid then flows through the first fluid channel 2331 of the first heat pipe 233 to the second fluid chamber 2321 of the second vapor chamber 232, thus also conducting heat to the first heat pipe 233 and the second vapor chamber 232. The boiling aid structures 234 on the first and second vapor chambers 231 and 232 exchange heat with the coolant C in the tank 10, causing the coolant C near these boiling aid structures 234 to boil and generate bubbles. Then, the gaseous working fluid in the second fluid chamber 2321 of the second vapor chamber 232 condenses back into liquid and flows back to the first fluid chamber 2311 of the first vapor chamber 231 via these capillary structures 235.

[0057] In the above embodiments, the design of connecting the first fluid chamber 2311 of the first heat pipe 233 and the second fluid chamber 2321 of the second heat pipe 232 through the first fluid channel 2331 of the first heat pipe 233, and the design of these boiling aid structures 234 respectively disposed on the first heat pipe 231 and the second heat pipe 232, can improve the heat transfer efficiency of the heat pipe to cope with the heat source H with higher heat output.

[0058] Furthermore, by configuring the first vapor chamber 231 into a double-layer structure via the first heat pipes 233 and the second vapor chamber 232, and by respectively setting the boiling-aiding structures 234 on the first heat dissipation surface 2313, the second heat dissipation surface 2322, and the third heat dissipation surface 2323, the heat transfer efficiency of the vapor chamber can be further improved. Moreover, according to the pool boiling correlation proposed by Rohsenow, the total heat dissipation area is inversely proportional to the superheat, where the superheat is the temperature difference between the surface temperature required for the coolant C to boil and the boiling point of the coolant C. Table 1 presents the superheat of a planar vapor chamber with boiling-aiding structures and the three-dimensional vapor chamber module 23 of the above embodiment, both of which have boiling-aiding structures 234 in both layers.

[0059]

[0060] As can be seen from Table 1, the configuration of the three-dimensional heat spreader module 23 with boiling aid structure 234 in both layers in the above embodiment can reduce superheat and effectively improve heat transfer efficiency.

[0061] On the other hand, since the configuration of the three-dimensional vapor chamber module 23 with boiling-aiding structures 234 in both layers of the above embodiment can reduce the overall surface temperature by 67%, the thermal resistance between the three-dimensional vapor chamber module 23 and the coolant C can be reduced from 0.01℃ to 0.0033℃. Under the condition that the heat source H operates at the same temperature, the planar vapor chamber with boiling-aiding structures can only enable the power of the heat source H to reach 1000W, while the three-dimensional vapor chamber module 23 in the above embodiment can enable the power of the heat source H to reach 1340W, thus improving the performance by about 34%.

[0062] It should be noted that the first heat dissipation surface 2313, the second heat dissipation surface 2322, and the third heat dissipation surface 2323 are not all limited to having a boiling-aiding structure 234. In one embodiment, only one of the second and third heat dissipation surfaces may have a boiling-aiding structure. Furthermore, these boiling-aiding structures are not limited to being disposed on the heat dissipation surfaces of the first and second heat spreaders. In other embodiments, these boiling-aiding structures may be disposed on other surfaces of the first and second heat spreaders.

[0063] In the above embodiments, the configuration in which the distance D between the second heat dissipation surface 2322 of the second heat dissipation plate 232 and the first heat dissipation surface 2313 of the first heat dissipation plate 231 is greater than or equal to 5mm can prevent the first heat dissipation plate 231 and the second heat dissipation plate 232 from being too close together and thus hindering the escape of bubbles.

[0064] In the above embodiments, the configuration of the distance D between the second heat dissipation surface 2322 of the second heat dissipation plate 232 and the first heat dissipation surface 2313 of the first heat dissipation plate 231 is less than or equal to 25mm, which can avoid the distance D between the first heat dissipation plate 231 and the second heat dissipation plate 232 being too large, thus having an adverse effect on the heat transfer efficiency of the three-dimensional heat dissipation plate module 23.

[0065] It should be noted that the distance D between the second heat dissipation surface 2322 of the second heat dissipation plate 232 and the first heat dissipation surface 2313 of the first heat dissipation plate 231 is not limited to the above range, but can be adjusted according to the requirements.

[0066] In the above embodiment, the short side S1 of the first heat spreader 231 and the short side S2 of the second heat spreader 232 are arranged parallel to the direction of gravity G, which can shorten the path of bubble escape, thereby promoting the bubbles to detach from the three-dimensional heat spreader module 23, and at the same time promoting the coolant C to be replenished to the vicinity of the boiling aid structure 234 so as to form new bubbles.

[0067] It should be noted that the short side S1 of the first heat spreader 231 and the short side S2 of the second heat spreader 232 are not limited to being parallel to the direction of gravity G. For example, please refer to [link to example]. Figure 4 , Figure 4 A cross-sectional view of an immersion liquid cooling system 1a according to some embodiments of the present invention is shown. Figure 4 The structural features can be applied in other embodiments of the present invention.

[0068] exist Figure 4 In the embodiment, the long side L1 of the first temperature distribution plate 231a and the long side L2 of the second temperature distribution plate 232a of the three-dimensional temperature distribution plate module 23a are parallel to the direction of gravity G. That is, the first temperature distribution plate 231a and the second temperature distribution plate 232a are arranged with their long sides L1 and L2 parallel to the direction of gravity G.

[0069] Next, please refer to Figure 5 . Figure 5 A cross-sectional view of a three-dimensional heat spreader module 23b according to some embodiments of the present invention is shown. Figure 5 The structural features can be applied in other embodiments of the present invention, such as replacing... Figure 1 and Figure 4 The three-dimensional heat spreader module in the system.

[0070] In some embodiments, a plurality of boiling-aiding structures 234b of the three-dimensional heat spreader module 23b are also disposed on the outer surface of the first heat pipe 233b. That is, these boiling-aiding structures 234b are respectively disposed on the first heat dissipation surface 2313b of the first heat spreader 231b, the second heat dissipation surface 2322b and the third heat dissipation surface 2323b of the second heat spreader 232b and the outer surface of the first heat pipe 233b.

[0071] Next, please refer to Figure 6 . Figure 6 A perspective view of a three-dimensional heat spreader module 23c according to some embodiments of the present invention is shown. Figure 7 A cross-sectional view of a three-dimensional heat spreader module 23c according to some embodiments of the present invention is shown. Figure 6 and Figure 7 The structural features can be applied in other embodiments of the present invention, such as replacing... Figure 1 and Figure 4 The three-dimensional heat spreader module in the system.

[0072] exist Figure 6 and Figure 7 In some embodiments, the three-dimensional vapor chamber module 23c may further include a plurality of second heat pipes 236c. These second heat pipes 236c are disposed on the side of the second vapor chamber 232c away from the first heat pipe 233c. That is, these second heat pipes 236c and these first heat pipes 233c are respectively disposed on opposite sides of the second vapor chamber 232c. Each of these second heat pipes 236c has a second fluid channel 2361c, which connects to the second fluid chamber 2321c of the second vapor chamber 232c. In addition, a plurality of capillary structures 235c of the three-dimensional vapor chamber module 23c are respectively disposed in the first fluid chamber 2311c of the first vapor chamber 231c, the second fluid chamber 2321c of the second vapor chamber 232c, the first fluid channel 2331c of the first heat pipe 233c, and the second fluid channel 2361c of the second heat pipe 236c, and are interconnected with each other.

[0073] Next, please refer to Figure 8 , Figure 8 A cross-sectional view of a three-dimensional heat spreader module 23d according to some embodiments of the present invention is shown. Figure 8 The structural features can be applied in other embodiments of the present invention, such as replacing... Figure 1 and Figure 4 The three-dimensional heat spreader module in the system.

[0074] exist Figure 8 In the embodiment, the multiple boiling-aiding structures 234d of the three-dimensional heat spreader module 23d are not only disposed on the outer surfaces of the first heat dissipation surface 2313d of the first heat spreader 231d, the second heat dissipation surface 2322d of the second heat spreader 2323d, the third heat dissipation surface 2323d of the second heat spreader 232d and these first heat pipes 233d, but also disposed on the outer surfaces of these second heat pipes 236d.

[0075] It should be noted that the outer surfaces of the first heat dissipation surface 2313d, the second heat dissipation surface 2322d, the third heat dissipation surface 2323d, the first heat pipe 233d, and the second heat pipe 236d are not all limited to having a boiling-aiding structure 234d. In one embodiment, the outer surface of the first heat pipe may not have a boiling-aiding structure. In one embodiment, the outer surface of the second heat pipe may not have a boiling-aiding structure. In another embodiment, only one of the second and third heat dissipation surfaces may have a boiling-aiding structure. Furthermore, these boiling-aiding structures are not limited to being disposed on the heat dissipation surfaces of the first and second vapor chambers. In other embodiments, these boiling-aiding structures may be disposed on other surfaces of the first and second vapor chambers.

[0076] In the above embodiments, the first vapor chamber and the second vapor chamber are arranged side-by-side at intervals to form a double-layer structure via a first heat pipe, but this is not a limitation. In other embodiments, the first and second vapor chambers can be arranged in other ways.

[0077] According to the three-dimensional vapor chamber module, server and immersion liquid cooling system disclosed in the above embodiments, the first fluid chamber of the first vapor chamber and the second fluid chamber of the second vapor chamber are connected through the first fluid channel of the first heat pipe, and the design of these boiling aid structures being respectively disposed on the first vapor chamber and the second vapor chamber can improve the heat transfer efficiency of the vapor chamber to cope with heat sources with higher heat generation.

[0078] Furthermore, by configuring the first heat spreader into a double-layer structure via the first heat pipes and the second heat spreader, and by configuring these boiling-aiding structures on the outer surfaces of the first heat dissipation surface, the second heat dissipation surface, the third heat dissipation surface, and the first heat pipe, the heat transfer efficiency of the heat spreader can be further improved.

Claims

1. A three-dimensional heat spreader module for thermal coupling to a heat source, comprising: A first heat exchanger has a first fluid chamber and is used to thermally couple to the heat source; The second heat exchanger has a second fluid chamber; At least one first heat pipe having a first fluid channel connecting the first fluid chamber and the second fluid chamber; as well as Multiple boiling aid structures are respectively disposed on the first temperature-equalizing plate and the second temperature-equalizing plate.

2. The three-dimensional heat exchanger module as claimed in claim 1, wherein the first heat exchanger has a thermal coupling surface and a first heat dissipation surface facing each other, the thermal coupling surface being used for thermal coupling to the heat source, the second heat exchanger has a second heat dissipation surface and a third heat dissipation surface facing each other, and the boiling aid structures are respectively disposed on at least one of the second heat dissipation surface and the third heat dissipation surface and the first heat dissipation surface.

3. The three-dimensional heat spreader module as described in claim 2, wherein the first heat spreader and the second heat spreader are arranged side by side at intervals via the at least one first heat pipe, the second heat dissipation surface of the second heat spreader faces the first heat dissipation surface of the first heat spreader, and the boiling aid structures are respectively disposed on the third heat dissipation surface and the first heat dissipation surface.

4. The three-dimensional heat spreader module as described in claim 3, wherein the boiling aid structures are respectively disposed on the first heat dissipation surface, the second heat dissipation surface and the third heat dissipation surface.

5. The three-dimensional heat spreader module as claimed in claim 4, wherein the boiling aid structures are further disposed on the outer surface of the at least one first heat pipe.

6. The three-dimensional heat dissipation plate module as described in claim 4, wherein the distance between the second heat dissipation surface of the second heat dissipation plate and the first heat dissipation surface of the first heat dissipation plate is greater than or equal to 5 mm.

7. The three-dimensional heat dissipation plate module as described in claim 6, wherein the distance between the second heat dissipation surface of the second heat dissipation plate and the first heat dissipation surface of the first heat dissipation plate is less than or equal to 25 mm.

8. The three-dimensional vapor chamber module as described in claim 3 further includes at least one second heat pipe, the at least one second heat pipe and the at least one first heat pipe being respectively disposed on opposite sides of the second vapor chamber, the at least one second heat pipe having a second fluid channel communicating with the second fluid chamber of the second vapor chamber.

9. The three-dimensional heat spreader module as described in claim 8, wherein the boiling aid structures are respectively disposed on the first heat dissipation surface, the second heat dissipation surface and the third heat dissipation surface, the outer surface of the at least one first heat pipe and the outer surface of the at least one second heat pipe.

10. The three-dimensional heat spreader module as claimed in claim 1 further comprises a plurality of capillary structures, which are respectively disposed in the first fluid chamber of the first heat spreader, the second fluid chamber of the second heat spreader, and the first fluid channel of the at least one first heat pipe.

11. The three-dimensional heat spreader module of claim 10, wherein the capillary structures in the first fluid chamber, the second fluid chamber, and the first fluid channel are interconnected.

12. A server comprising: The motherboard has a heat source; and The three-dimensional heat spreader module includes: A first heat exchanger has a first fluid chamber and is thermally coupled to the heat source. The second heat exchanger has a second fluid chamber; At least one first heat pipe having a first fluid channel connecting the first fluid chamber and the second fluid chamber; as well as Multiple boiling aid structures are respectively disposed on the first temperature-equalizing plate and the second temperature-equalizing plate.

13. The server of claim 12, wherein the first heat exchanger has a thermally coupled surface and a first heat dissipation surface facing each other, the thermally coupled surface being used for thermal coupling to the heat source, the second heat exchanger has a second heat dissipation surface and a third heat dissipation surface facing each other, and the boiling aid structures are respectively disposed on at least one of the second heat dissipation surface and the third heat dissipation surface and the first heat dissipation surface.

14. The server of claim 13, wherein the first heat spreader and the second heat spreader are arranged side by side at intervals via the at least one first heat pipe, the second heat dissipation surface of the second heat spreader faces the first heat dissipation surface of the first heat spreader, and the boiling aid structures are respectively disposed on the third heat dissipation surface and the first heat dissipation surface.

15. The server as claimed in claim 14, wherein the boiling aid structures are respectively disposed on the first heat dissipation surface, the second heat dissipation surface and the third heat dissipation surface.

16. The server of claim 15, wherein the distance between the second heat dissipation surface of the second heat dissipation plate and the first heat dissipation surface of the first heat dissipation plate is greater than or equal to 5 mm.

17. The server of claim 16, wherein the distance between the second heat dissipation surface of the second vapor chamber and the first heat dissipation surface of the first vapor chamber is less than or equal to 25 mm.

18. The server of claim 14, wherein the three-dimensional vapor chamber module further includes at least one second heat pipe, the at least one second heat pipe and the at least one first heat pipe are respectively disposed on opposite sides of the second vapor chamber, the at least one second heat pipe having a second fluid channel communicating with the second fluid chamber of the second vapor chamber.

19. The server of claim 18, wherein the boiling aid structures are respectively disposed on the first heat dissipation surface, the second heat dissipation surface, the third heat dissipation surface, the outer surface of the at least one first heat pipe and the outer surface of the at least one second heat pipe.

20. An immersion liquid cooling system, comprising: The tank is used to hold the coolant; and At least one server, configured to be placed in the tank and submerged in the coolant, the at least one server comprising: Load-bearing components; The motherboard, mounted on the support member, and having a heat source; and The three-dimensional heat spreader module includes: A first heat exchanger has a first fluid chamber and is thermally coupled to the heat source. The second heat exchanger has a second fluid chamber; At least one first heat pipe having a first fluid channel connecting the first fluid chamber and the second fluid chamber; and Multiple boiling aid structures are respectively disposed on the first temperature-equalizing plate and the second temperature-equalizing plate.

21. The immersion liquid cooling system as described in claim 20, wherein, A channel is formed between the first and second heat exchange plates, the channel having an upward opening to allow gas formed between the first and second heat exchange plates to rise within the channel and pass through the opening.

22. The immersion liquid cooling system of claim 20, wherein the first heat exchanger has a thermally coupled surface and a first heat dissipation surface facing away from each other, the thermally coupled surface being used for thermal coupling to the heat source, the second heat exchanger has a second heat dissipation surface and a third heat dissipation surface facing away from each other, and the boiling aid structures are respectively disposed on at least one of the second heat dissipation surface and the third heat dissipation surface and the first heat dissipation surface.

23. The immersion liquid cooling system of claim 22, wherein the first heat spreader and the second heat spreader are arranged side by side at intervals via the at least one first heat pipe, the second heat dissipation surface of the second heat spreader faces the first heat dissipation surface of the first heat spreader, and the boiling aid structures are respectively disposed on the third heat dissipation surface and the first heat dissipation surface.

24. The immersion liquid cooling system as claimed in claim 23, wherein the boiling aid structures are respectively disposed on the first heat dissipation surface, the second heat dissipation surface and the third heat dissipation surface.

25. The immersion liquid cooling system of claim 24, wherein the distance between the second heat dissipation surface of the second heat exchange plate and the first heat dissipation surface of the first heat exchange plate is greater than or equal to 5 mm.

26. The immersion liquid cooling system of claim 25, wherein the distance between the second heat dissipation surface of the second heat exchange plate and the first heat dissipation surface of the first heat exchange plate is less than or equal to 25 mm.

27. The immersion liquid cooling system of claim 20, wherein the first heat exchanger and the second heat exchanger are rectangular and have a long side and a short side, respectively, wherein the short side is parallel to the direction of gravity.

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