Electronic device and manufacturing method thereof

Abstract

The invention provides an electronic device and a manufacturing method thereof. The electronic device comprises a flexible substrate, a circuit layer, a first electronic unit and a second electronic unit. The flexible substrate comprises a main part and a bending part, and the bending part is connected with the main part. The circuit layer is arranged on the flexible substrate and comprises a first connecting pad and a second connecting pad, the first connecting pad is arranged on the main part, and the second connecting pad is arranged on the bending part. The first electronic unit is connected to the first connecting pad, the second electronic unit is connected to the second connecting pad, and the area of the second connecting pad is different from that of the first connecting pad.

Description

Technical Field

[0001] This invention relates to an electronic device and a method for manufacturing the same, particularly to an electronic device having electronic units disposed on a curved portion, and to a method for manufacturing the same electronic device. Background Technology

[0002] With the evolution and development of electronic devices, they have become indispensable items in modern society. For example, the display device in an electronic device can have a display function to provide information transmission and / or image display.

[0003] When electronic devices are flexible and their periphery is bent, it is necessary to consider whether the bending will affect the reliability of the device. For example, electronic components mounted on the bent portion may detach due to the bending, thus affecting the reliability of the electronic device. Therefore, designing high-quality, highly reliable, and flexible electronic devices has become an important focus today. Summary of the Invention

[0004] The purpose of this invention is to provide an electronic device and a method for manufacturing the same.

[0005] This invention provides an electronic device comprising a flexible substrate, a circuit layer, a first electronic unit, and a second electronic unit. The flexible substrate includes a main portion and a curved portion, the curved portion being connected to the main portion. The circuit layer is disposed on the flexible substrate and includes a first pad and a second pad, the first pad being disposed on the main portion and the second pad being disposed on the curved portion. The first electronic unit is bonded to the first pad, and the second electronic unit is bonded to the second pad, the area of ​​the second pad being different from the area of ​​the first pad.

[0006] The present invention also provides an electronic device comprising a flexible substrate, a circuit layer, a first electronic unit, a second electronic unit, a third electronic unit, and a fourth electronic unit. The flexible substrate includes a main portion and a curved portion, the curved portion being connected to the main portion. The circuit layer is disposed on the flexible substrate and includes a first pad, a second pad, a third pad, a fourth pad, a fifth pad, a sixth pad, a seventh pad, and an eighth pad, wherein the first pad, second pad, third pad, and fourth pad are disposed on the main portion, and the fifth pad, sixth pad, seventh pad, and eighth pad are disposed on the curved portion. The first electronic unit is coupled to the first and second pads, the second electronic unit is coupled to the third and fourth pads, the third electronic unit is coupled to the fifth and sixth pads, and the fourth electronic unit is coupled to the seventh and eighth pads. A first axis passes through a first center of the first and second pads and a second center of the third and fourth pads, and a second axis passes through a third center of the fifth and sixth pads and a fourth center of the seventh and eighth pads; the first axis is not parallel to the second axis.

[0007] The present invention also provides a method for manufacturing an electronic device, comprising the following steps: providing a flexible substrate, wherein the flexible substrate includes a first portion and a second portion; forming a circuit layer on the flexible substrate, wherein the circuit layer includes a plurality of first pads and a plurality of second pads, the first pads being disposed on the first portion and the second pads being disposed on the second portion; patterning the second portion to form a plurality of trenches; transferring a plurality of first electronic units to the first pads through at least one first transfer process; transferring a plurality of second electronic units to the second pads through at least one second transfer process; and bending the second portion relative to the first portion. The number of first electronic units transferred in one of the first transfer processes is different from the number of second electronic units transferred in one of the second transfer processes. Attached Figure Description

[0008] Figure 1 This is a schematic diagram of a flexible substrate for an electronic device according to an embodiment of the present invention.

[0009] Figure 2 This is a top view of the flexible substrate and pads of the electronic device according to the first embodiment of the present invention.

[0010] Figure 3 This is a cross-sectional schematic diagram of the electronic device according to the first embodiment of the present invention.

[0011] Figure 4 This is a top view of the flexible substrate and pads of the electronic device according to the second embodiment of the present invention.

[0012] Figure 5 This is a top view of the flexible substrate and pads of the electronic device according to the third embodiment of the present invention.

[0013] Figure 6 This is a top view of the flexible substrate and pads of the electronic device according to the fourth embodiment of the present invention.

[0014] Figure 7 This is a cross-sectional schematic diagram of an electronic device according to the fifth embodiment of the present invention.

[0015] Figure 8 This is a top view of the flexible substrate and pads of the electronic device according to the sixth embodiment of the present invention.

[0016] Figure 9 This is a top view of the flexible substrate and pads of the electronic device according to the seventh embodiment of the present invention.

[0017] Figure 10 This is a top view schematic diagram of various designs of the curved portion pad of the electronic device according to the seventh embodiment of the present invention.

[0018] Figure 11 This is a top view of the flexible substrate and pads of the electronic device according to the eighth embodiment of the present invention.

[0019] Figure 12 This is a top view of the flexible substrate and pads of the electronic device according to the ninth embodiment of the present invention.

[0020] Figure 13 This is a cross-sectional schematic diagram of an electronic device according to the tenth embodiment of the present invention.

[0021] Figure 14 This is a top view schematic diagram of various designs of the flexible substrate, pads, and curved portions of the electronic device according to the eleventh embodiment of the present invention.

[0022] Figure 15 This is a top view schematic diagram of the flexible substrate and pads of the electronic device according to the twelfth embodiment of the present invention.

[0023] Figure 16 This is a cross-sectional schematic diagram of various designs of the curved portion electronic unit of the electronic device according to the twelfth embodiment of the present invention.

[0024] Figure 17 This is a flowchart illustrating a method for manufacturing an electronic device according to an embodiment of the present invention.

[0025] Figures 18 to 21 This is a schematic diagram of each step in a method for manufacturing an electronic device according to an embodiment of the present invention.

[0026] Figure 22 This is a top view schematic diagram of various designs of the transfer substrate of the present invention.

[0027] Figure 23 This is a top view schematic diagram of the electronic device according to the thirteenth embodiment of the present invention.

[0028] Explanation of reference numerals: 110 - Flexible substrate; 112 - Main portion; 114 - Bending portion; 114a - Corner area; 114b - Edge area; 114D1 - First design; 114D2 - Second design; 114i - Island portion; 114n - Bridging portion; 120 - Electronic unit; 122 - Main electronic unit; 122a, 122b, 122c, 124a - Light-emitting element; 122m, 124m - Molding layer; 122s, 124s - Circuit structure; 122s1, 122s2, 124s1, 124s2 - Circuit connection pads; 122sb, 124sb - Circuit board; 124 - Bending portion electronic unit; 124b - Infrared light-emitting element; 124D1, 124D2 124D3, TD1, TD2 - Structure; 124e - Sensor; 130 - Circuit layer; 142, 144 - Light-shielding layer; 150 - Color conversion layer; 160 - Functional layer; 170 - Cover layer; 180 - Sensing structure; 182 - Sensing element; 184 - Insulating structure; AL - Light-emitting layer; AN1 - First axis; AN2 - Second axis; AN3 - Third axis; AN4 - Fourth axis; AN5 - Fifth axis; BD - Pad; BDb, BDb1, BDb2, BDb3, BDb4 - Bend pad; BDm, BDm1, BDm2, BDm3, BDm4 - Main part pad; BTr1 - First redundant pad; BTr2 - Second redundant pad; BDt - Additional pad; BL1 BL2, BL3 - Light-shielding layers; BS - Bonding material; BSB - Lower substrate; CL1, CL2, CL3, CL4, CL5, CL6 - Conductive layers; CN1, CN2 - Channel layers; CP - Die-cutting process; CS1 - First circuit; CS2 - Second circuit; CSB - Carrier substrate; CT1 - First center; CT2 - Second center; CT3 - Third center; CT4 - Fourth center; CV - Bending cap; D1, D2 - Drains; Db1, Db2, Dm - Distance; E1, E2 - Electrodes; ED, ED1, ED2, ED3, ED4, ED5, ED6, ED7, ED8, ED9, ED10, ED11, ED12, ED13 - Electronic devices; ESM1 ESM2, SM1, SM2 - Semiconductor layers; EV1 - First raised portion; EV2 - Second raised portion; G1, G2_1, G2_2 - Gates; GRb - Bending portion pad assembly; GRb1 - First bending portion pad assembly; GRb2 - Second bending portion pad assembly; GRm - Main portion pad assembly; GRm1 - First main portion pad assembly; GRm2 - Second main portion pad assembly; IN1, IN2, IN3, IN4, IN5, IN6, IN7, IN8, IN9, INX1, INX2, INX3, PL1, PL2, PL3 - Insulating layers; LC1 - First light converging structure; LC2 - Second light converging structure; LS - Light blocking layer; OP - Opening; OPS1 - First substrate opening;OPS2 - Second substrate opening; OS1, OS2 - Opening structure; PDL - Pixel definition layer; PN1 - First design pattern; PN2 - Second design pattern; PN3 - Third design pattern; PXm, PXb - Pixel; RG, RT - Region; RU - Repeating unit; S1, S2 - Source; ST1, ST2, ST3, ST4, ST5, ST6, ST6a, ST6b, ST6c - Step; SW1 - First switching element; SW2 - Second switching element; T1, T2 - Thickness; TL - Trench; TRP1 - First transfer process; TRP2 - Second transfer process; TSB1 - First transfer substrate; TSB2 - Second transfer substrate; TU1, TU2 - Transfer unit; X, Y, Z - Direction. Detailed Implementation

[0029] The present invention can be understood by referring to the following detailed description in conjunction with the accompanying drawings. It should be noted that, for ease of understanding and for the sake of brevity, many of the accompanying drawings depict only a portion of the electronic device, and specific elements in the drawings are not drawn to scale. Furthermore, the number and size of the elements in the drawings are for illustrative purposes only and are not intended to limit the scope of the present invention.

[0030] Throughout this specification and the appended claims, certain terms are used to refer to specific elements. Those skilled in the art will understand that electronic device manufacturers may use different names to refer to the same elements. This invention is not intended to distinguish between elements that have the same function but different names.

[0031] In the specification and claims of this invention, the terms "comprising," "containing," and "having" are open-ended terms and should therefore be interpreted as "containing but not limited to...". Thus, when the terms "comprising," "containing," and / or "having" are used in the description of this invention, they specify the presence of the corresponding features, areas, steps, operations, and / or components, but do not exclude the presence of one or more of the corresponding features, areas, steps, operations, and / or components.

[0032] The directional terms used in this invention, such as "up," "down," "front," "back," "left," and "right," are merely for reference to the accompanying drawings. Therefore, the directional terms used are illustrative and not intended to limit the invention. In the accompanying drawings, each figure illustrates general features of the methods, structures, and / or materials used in specific embodiments. However, these figures should not be construed as defining or limiting the scope or nature covered by these embodiments. For example, for clarity, the relative dimensions, thicknesses, and positions of various film layers, regions, and / or structures may be reduced or enlarged.

[0033] When a component (e.g., a membrane or region) is referred to as "on another component," it can be directly on that component, or there may be other components between them. Conversely, when a component is referred to as "directly on another component," there are no components between them. Furthermore, when a component is referred to as "on another component," the two are vertically related, and this component can be above or below the other component, depending on the orientation of the device.

[0034] It should be understood that when a component or membrane is referred to as being "connected to" another component or membrane, it can be directly connected to this other component or membrane, or there can be an interposed component or membrane between them. When a component is referred to as being "directly connected to" another component or membrane, there is no interposed component or membrane between them. Additionally, when a component is referred to as being "coupled to another component (or a variant thereof)," it can be directly connected to this other component, or indirectly connected (e.g., electrically connected) to this other component through one or more components.

[0035] It should be understood that in the specification and claims, the term "horizontal direction" refers to a direction parallel to a horizontal plane; the term "horizontal plane" refers to a surface parallel to directions X and Y in the drawings; and the term "vertical direction" refers to a direction parallel to direction Z in the drawings, where directions X, Y, and Z are perpendicular to each other. In the specification and claims, the term "top view" refers to the result of viewing along the vertical direction. In the specification and claims, the term "section" refers to the result of cutting the structure along the vertical direction and viewing it from a horizontal direction.

[0036] It should be understood that in the specification and claims of this invention, the term "overlap" means that two components overlap in the direction Z, and unless otherwise specified, the term "overlap" includes partial overlap or complete overlap.

[0037] The terms “approximate” or “same” are generally interpreted as being within ±20% of a given value, or within ±10%, ±5%, ±3%, ±2%, ±1%, or ±0.5% of a given value.

[0038] The ordinal numbers used in the specification and claims of this invention, such as "first," "second," etc., to modify elements, do not in themselves imply or represent any prior ordinal number of that element (or those elements), nor do they represent the order of one element with another, or the order of manufacturing methods. The use of these ordinal numbers is solely to clearly distinguish one named element from another element with the same name. The claims and specification may not use the same terminology; therefore, a first element in the specification may be a second element in the claims.

[0039] It should be understood that the features described below can be replaced, recombined, or mixed in several different embodiments to complete other embodiments without departing from the spirit of the invention. Features between embodiments can be arbitrarily mixed and combined as long as they do not violate the spirit of the invention or conflict with it.

[0040] In this invention, the electronic device may include a display device, a light-emitting device, an antenna device, a sensing device, a splicing device, or any combination thereof, but is not limited thereto. The display device may be a non-self-emissive display or a self-emissive display, and may be a color display or a monochrome display, depending on requirements. The antenna device may be a liquid crystal type antenna device or a non-liquid crystal type antenna device; the sensing device may be a sensing device for capacitance, light, heat, or ultrasound; and the splicing device may be a display splicing device or an antenna splicing device, but is not limited thereto. The electronic units in the electronic device may include passive and active components, such as capacitors, resistors, inductors, diodes, switching elements (e.g., transistors), integrated circuits, etc. The diode may include a light-emitting diode (LED) or a photodiode. The light-emitting diode may include, for example, an organic light-emitting diode (OLED), a mini LED, a micro LED, or a quantum dot LED, but is not limited thereto. Transistors may include, for example, top-gate thin-film transistors, bottom-gate thin-film transistors, or dual-gate thin-film transistors, but are not limited thereto. Electronic devices may also include, as needed, fluorescent materials, phosphorescent materials, quantum dot (QD) materials, or other suitable materials, but are not limited thereto. Electronic devices may have peripheral systems such as drive systems, control systems, light source systems, etc., to support the devices and components within the electronic device.

[0041] It should be noted that the present invention is described using an electronic device with display function and flexibility as an example.

[0042] Please refer to Figure 1 , Figure 1 This is a schematic diagram of a flexible substrate for an electronic device according to an embodiment of the present invention. Figure 1 As shown, the electronic device ED includes a flexible substrate 110, wherein the flexible substrate 110 may comprise any suitable rigid and / or flexible material. In some embodiments, when the flexible substrate 110 comprises a rigid material, the rigid material can be made flexible by reducing the thickness of the rigid material and / or by forming openings in the rigid material. For example, the flexible substrate 110 may comprise glass, quartz, ceramic, sapphire, polymers (such as polyimide (PI), polyethylene terephthalate (PET), poly(methyl methacrylate), PMMA)), other suitable materials, or combinations thereof.

[0043] In this invention, the flexible substrate 110 can be bent at desired locations to achieve the shape required by the electronic device ED. Figure 1 In this flexible substrate 110, a main portion (or first portion) 112 and a bent portion (or second portion) 114 may be included. The bent portion 114 is connected to the main portion 112. The main portion 112 may be unbent or slightly bent, and the bent portion 114 has a larger curvature relative to the main portion 112. The normal direction of the main portion 112 of the flexible substrate 110 may be parallel to the Z direction. In some embodiments (e.g.) Figure 1 As shown), the main portion 112 may be a non-bent region, and the curved portion 114 may surround the main portion 112 and bend substantially in the negative direction of direction Z (e.g., in...). Figure 1 In this case, the flexible substrate 110 bends downwards at its periphery. For example, the bent portion 114 may include a plurality of corner regions 114a and optionally include a plurality of edge regions 114b, wherein the corner regions 114a connect to the corners of the main portion 112, and the edge regions 114b connect to the edges of the main portion 112 extending in the horizontal direction. The corner regions 114a connect two edge regions 114b in different horizontal directions, and the edge regions 114b may connect between two corner regions 114a, but are not limited thereto. For example, the Gaussian curvature of the edge region 114b may be 0, approximating a cylindrical side surface, and the Gaussian curvature of the corner region 114a may not be equal to 0 (e.g., the Gaussian curvature of the corner region 114a may be greater than 0, approximating a spherical surface), but are not limited thereto.

[0044] In this invention, since the main portion 112 and the curved portion 114 of the flexible substrate 110 have different curvatures, the electronic units of the electronic device ED can be designed differently in the arrangement of the main portion 112 and the curved portion 114, so that the electronic units can be well arranged in the main portion 112 and the curved portion 114 with different curvatures, thereby reducing the possibility of the electronic units falling off in the curved portion 114 and improving the reliability of the electronic device ED.

[0045] Please refer to Figure 2 and Figure 3 , Figure 2 This is a top view schematic diagram of the flexible substrate and pads of the electronic device according to the first embodiment of the present invention. Figure 3 This is a cross-sectional schematic diagram of an electronic device according to a first embodiment of the present invention, wherein... Figure 2 The diagram shows the flexible substrate 110 before bending (i.e., the flexible substrate 110 is in a flattened state), and Figure 2 Only a portion of the main part 112 and the corner area 114a of the curved part 114 are shown. (See diagram below.) Figure 2 As shown, the flexible substrate 110 of the electronic device ED1 may have a suitable patterned design (e.g., openings, slits) so that the bent portion 114 can be bent into a desired shape as needed. In some embodiments (e.g. Figure 2 As shown), the corner region 114a of the bent portion 114 of the flexible substrate 110 may have multiple first substrate openings OPS1, so that the corner region 114a can be reliably bent into a spherical surface and the area of ​​overlap between the corner regions 114a due to secondary bending is reduced (or avoided). For example (such as...) Figure 2 As shown), the first substrate opening OPS1 can be a long, narrow opening extending horizontally (e.g., a long, triangular opening), and the extending direction of the first substrate opening OPS1 may not be parallel to directions X and Y, but is not limited thereto. For example (e.g.) Figure 2 As shown), the first substrate opening OPS1 can extend substantially from the edge (corner) of the flexible substrate 110 to the edge (corner) of the main portion 112 of the flexible substrate 110, and the extension directions of the first substrate opening OPS1 can be the same or different from each other, but are not limited thereto.

[0046] like Figure 3As shown, the electronic device ED1 may include a plurality of electronic units 120 disposed on a flexible substrate 110, wherein the electronic units 120 may be any suitable electronic components. In some embodiments, the electronic units 120 may be light-emitting units, such as light-emitting diodes (e.g., organic light-emitting diodes, sub-millimeter light-emitting diodes, micro light-emitting diodes, or quantum dot light-emitting diodes), integrated light-emitting chips (e.g., an integrated light-emitting chip may include multiple light-emitting elements), but are not limited thereto. In some embodiments, the electronic units 120 may be disposed on the flexible substrate 110 through a bonding process, but are not limited thereto. For example (in Figure 3 In the present invention, the electronic unit 120 may be a light-emitting unit disposed on the flexible substrate 110 through a bonding process, but is not limited thereto. Since the electronic device ED1 of the present invention has a display function, the electronic unit 120 of the electronic device ED1 may be a light-emitting unit for displaying an image.

[0047] In this invention, the electronic unit 120, which serves as the light-emitting unit, can be designed according to requirements. For example, in Figure 3 In this embodiment, electronic unit 120 may include electrode E1, electrode E2, semiconductor layer ESM1, semiconductor layer ESM2, and light-emitting layer AL. Electrode E1 may be electrically connected to semiconductor layer ESM1, electrode E2 may be electrically connected to semiconductor layer ESM2, and light-emitting layer AL may be disposed between semiconductor layers ESM1 and ESM2, but is not limited thereto. For example, semiconductor layer ESM1 may be a P-type semiconductor layer, semiconductor layer ESM2 may be an N-type semiconductor layer, and light-emitting layer AL may be a multiple quantum well (MQW), but is not limited thereto. Furthermore, electrodes E1 and E2 may serve as structures in electronic unit 120 for electrically connecting other electronic components, and electrodes E1 and E2 may be electrically connected to other electronic components through any suitable method (e.g., bonding process). For example, electrodes E1 and E2 may be pins of electronic unit 120, but are not limited thereto. Additionally, in some embodiments (e.g., ... Figure 3 As shown), electrodes E1 and E2 may be located on the same side of electronic unit 120 (i.e., electrodes E1 and E2 are on the same side relative to semiconductor layer ESM2), making electronic unit 120 a flip-chip light-emitting unit, but not limited thereto.

[0048] In this invention, the electronic unit 120, serving as a light-emitting unit, can generate light of the same or different colors. For example, the electronic unit 120 can generate light of different colors (e.g., red, green, and blue light) to enable the electronic device ED1 to display a color image, but this is not a limitation. For example, the electronic unit 120 can generate light of the same color (e.g., white light) to enable the electronic device ED1 to display a monochrome image, but this is not a limitation. For example, the electronic unit 120 can generate light of the same color (e.g., ultraviolet or blue light), and these lights can be converted into other colors by a color conversion structure (e.g., color conversion layer 150) to enable the electronic device ED1 to display a color image, but this is not a limitation.

[0049] In this invention, the multiple electronic units 120 can be divided into multiple main electronic units 122 (or first electronic units) and multiple curved electronic units 124 (or second electronic units) according to the arrangement position of the electronic units 120. The main electronic units 122 can be disposed on the main portion 112 of the flexible substrate 110, and the curved electronic units 124 can be disposed on the curved portion 114 of the flexible substrate 110. The curved electronic units 124 can be disposed between the two first substrate openings OPS1.

[0050] like Figure 3 As shown, the electronic device ED1 may include a circuit layer 130 disposed between the flexible substrate 110 and the electronic unit 120 (e.g., a light-emitting unit). In this invention, the circuit layer 130 may include at least one conductive layer, at least one insulating layer, at least one semiconductor layer, other desired film layers, or combinations thereof, to include electronic components and circuits within the circuit layer 130. Examples of materials for the conductive layer include metals, transparent conductive materials (e.g., indium tin oxide (ITO), indium zinc oxide (IZO), etc.), other suitable conductive materials, or combinations thereof. Examples of materials for the insulating layer include inorganic insulating materials (e.g., silicon oxide (SiO2)). x ), silicon nitride (SiN) y ), silicon oxynitride (SiO) x N y Organic insulating materials (e.g., photosensitive resins), other suitable insulating materials or combinations thereof, and examples of materials for the semiconductor layer may include, but are not limited to, polysilicon, amorphous silicon, metal-oxide semiconductor, other suitable semiconductor materials or combinations thereof.

[0051] In this invention, the number and stacking order of the conductive layers, insulating layers, and semiconductor layers in circuit layer 130 can be adjusted according to the required type of electronic components and circuit design. For example, in Figure 3 In this circuit layer 130, insulating layer IN1, insulating layer IN2, semiconductor layer SM1, insulating layer IN3, conductive layer CL1, insulating layer IN4, conductive layer CL2, insulating layer IN5, conductive layer CL3, insulating layer IN6, semiconductor layer SM2, insulating layer IN7, conductive layer CL4, insulating layer IN8, conductive layer CL5, insulating layer IN9, and conductive layer CL6 may be stacked sequentially, but are not limited thereto. It should be noted that insulating layer IN1 may be a buffer layer to allow other film layers in circuit layer 130 to be better disposed on flexible substrate 110.

[0052] In some embodiments (such as) Figure 3 As shown), circuit layer 130 may include a first switching element SW1 (e.g., a top-gate thin-film transistor), wherein the gate G1 of the first switching element SW1 may be included in conductive layer CL1, the source S1 and drain D1 of the first switching element SW1 may be included in conductive layer CL3, and the channel layer CN1 of the first switching element SW1 may be included in semiconductor layer SM1, but is not limited thereto. For example, in Figure 3 In this circuit, the first switching element SW1 may be electrically connected to the electronic unit 120 (e.g., a light-emitting unit), but is not limited thereto. Additionally, the circuit layer 130 may further include a light-blocking layer LS disposed between the flexible substrate 110 and the insulating layer IN1, and overlapping the channel layer CN1 of the first switching element SW1, to reduce the possibility of the channel layer CN1 being illuminated by light. For example, the light-blocking layer LS may include metal, photoresist, ink, resin, pigment, other suitable light-blocking materials, or combinations thereof, but is not limited thereto.

[0053] In some embodiments (such as) Figure 3 As shown, circuit layer 130 may include a second switching element SW2 (e.g., a dual-gate thin-film transistor), wherein the gates G2_1 and G2_2 of the second switching element SW2 may be contained in conductive layers CL2 and CL4, respectively; the source S2 and drain D2 of the second switching element SW2 may be contained in conductive layer CL5; and the channel layer CN2 of the second switching element SW2 may be contained in semiconductor layer SM2, but is not limited thereto. Furthermore, the gate G2_1 formed by conductive layer CL2 may have the effect of reducing the possibility of the channel layer being illuminated by light.

[0054] In this invention, the circuit layer 130 may include a plurality of pads BD, wherein the pads BD are included in the topmost conductive layer of the circuit layer 130 for bonding electronic components (e.g., electronic unit 120, driver circuit chip, etc.) disposed on the circuit layer 130, such that electronic components (e.g., switching elements) in the circuit layer 130 can be electrically connected to electronic components (e.g., electronic unit 120, driver circuit chip, etc.) disposed on the circuit layer 130 via the pads BD to form the desired circuit. For example, in Figure 3 In this circuit, the pad BD can be a structure within the conductive layer CL6, and the first switching element SW1 (e.g., a drain) in the circuit layer 130 can be electrically connected to the pad BD through the connection structure in the conductive layers CL4 and CL5, thereby electrically connecting to the electronic unit 120 (e.g., a light-emitting unit), but is not limited thereto. Furthermore, the pad BD can be polygonal (e.g., rectangular), have curved edges (e.g., circular, elliptical, or polygonal with curved bevels), or other suitable shapes in top view. For example, in... Figure 2 In the top view, the shape of the pad BD can be rectangular, but it is not limited to this.

[0055] In this invention, multiple pads BD can be distinguished into multiple main pads BDm and multiple curved pads BDb according to their placement positions (although the main pads BDm and curved pads BDb are drawn with different backgrounds in the top view, the main pads BDm and curved pads BDb can be formed from the same conductive layer). The main pads BDm can be disposed on the main portion 112 of the flexible substrate 110 and electrically connected to a first circuit CS1 (e.g., the first circuit CS1 may include switching elements, drive circuit chips, and / or other electronic components). The curved pads BDb can be disposed on the curved portion 114 of the flexible substrate 110 and electrically connected to a second circuit CS2 (e.g., the second circuit CS2 may include switching elements, drive circuit chips, and / or other electronic components). Figure 3 In the process, the main electronic unit 122 can be bonded to the main pad BDm via a connector BS (e.g., solder), and the curved electronic unit 124 can be bonded to the curved pad BDb via the connector BS. Furthermore, since... Figure 3 The electronic unit 120 shown is a flip-chip type light-emitting unit. Therefore, the two electrodes of the main part electronic unit 122 can be respectively bonded to two main part pads BDm (hereinafter, the two main part pads BDm corresponding to the same main part electronic unit 122 can be referred to as the main part pad group GRm), and the two electrodes of the curved part electronic unit 124 can be respectively bonded to two curved part pads BDb (hereinafter, the two curved part pads BDb corresponding to the same curved part electronic unit 124 can be referred to as the curved part pad group GRb), but are not limited thereto. Furthermore, in Figure 2In the process, the bending portion pad BDb can be disposed between the two first substrate openings OPS1, so that the bending portion electronic unit 124 can be disposed between the two first substrate openings OPS1, but is not limited thereto.

[0056] In this invention, the design considerations for the main part pad BDm and the main part electronic unit 122 differ from those for the curved part pad BDb and the curved part electronic unit 124. The design of the main part pad BDm and the main part electronic unit 122 is based on the display quality of the main part 112, while the design of the curved part pad BDb and the curved part electronic unit 124 is based on the display quality of the curved part 114 and the likelihood of the curved part electronic unit 124 detaching. In some embodiments, the curved part pad BDb is positioned to avoid the area with the maximum curvature in the curved part 114 of the flexible substrate 110, thereby reducing the bending stress on the curved part pad BDb and the curved part electronic unit 124 bonded to it. This reduces the likelihood of the curved part electronic unit 124 detaching from the flexible substrate 110, thereby improving the reliability of the electronic device ED1. For example, the location where the bending pad BDb is set may be a region with a relatively small bending curvature in the bending portion 114 of the flexible substrate 110, but is not limited thereto.

[0057] In some embodiments (such as) Figure 2 As shown, because the design considerations of the main part pad BDm and the main part electronic unit 122 are different from those of the curved part pad BDb and the curved part electronic unit 124, the relationship between two adjacent main part pad groups GRm is different from the relationship between two adjacent curved part pad groups GRb. In two adjacent first main part pad groups GRm1 and second main part pad groups GRm2 (i.e., the two main part pad groups GRm that are closest to each other), the first shaft AN1 passes through the first center CT1 of the first main part pad group GRm1 (i.e., the first center CT1 caused by the two main part pads BDm1 and BDm2 in the first main part pad group GRm1) and the second center CT2 of the second main part pad group GRm2 (the second center CT2 caused by the two main part pads BDm3 and BDm4 in the second main part pad group GRm2). In two adjacent first curved pad groups GRb1 and second curved pad groups GRb2 (i.e., the two curved pad groups GRb closest to each other), the second shaft AN2 passes through the third center CT3 of the first curved pad group GRb1 (i.e., the third center CT3 formed by the two curved pads BDb1 and BDb2 in the first curved pad group GRb1) and the fourth center CT4 of the second curved pad group GRb2 (the fourth center CT4 formed by the two curved pads BDb3 and BDb4 in the second curved pad group GRb2). Figure 2 In this configuration, the first axis AN1 is not parallel to the second axis AN2, such that the relationship between two adjacent first main part pad groups GRm1 and second main part pad groups GRm2 differs from the relationship between two adjacent first curved part pad groups GRb1 and second curved part pad groups GRb2. For example, the acute angle or right angle between the first axis AN1 and the second axis AN2 can be greater than or equal to 5 degrees and less than or equal to 90 degrees, but is not limited thereto. It should be noted that the center of the main part pad group GRm is the geometric center of the smallest outline (e.g., smallest quadrilateral) of the two main part pads BDm that cover this main part pad group GRm when the flexible substrate 110 is in a flattened state, and the center of the curved part pad group GRb is the geometric center of the smallest outline (e.g., smallest quadrilateral) of the two curved part pads BDb that cover this curved part pad group GRb when the flexible substrate 110 is in a flattened state.

[0058] Because the first axis AN1 and the second axis AN2 are not parallel to each other, the arrangement of the main part pad BDm and the curved part pad BDb is different. In some embodiments (e.g.) Figure 2 As shown), multiple main component pads BDm (or multiple main component pad groups GRm) can be arranged into multiple rows extending in the X direction and multiple columns extending in the Y direction, such that the first axis AN1 can be parallel to either the X direction or the Y direction (in the X direction or the Y direction). Figure 2 In this configuration, the first main part pad group GRm1 and the second main part pad group GRm2 are adjacent in the Y direction, such that the first axis AN1 is parallel to the Y direction, but this is not a limitation. In some embodiments (e.g. Figure 2 As shown), the arrangement direction of the bent pads BDb in a bent pad group GRb can be substantially perpendicular to the extending direction of the first substrate opening OPS1, while multiple bent pad groups GRb can be substantially arranged along the extending direction of the first substrate opening OPS1, such that the second axis AN2 is not parallel to the first axis AN1, but this is not a limitation. For example, in Figure 2 In this context, the second axis AN2 may be substantially parallel to the extension direction of the first substrate opening OPS1, but is not limited thereto.

[0059] In some embodiments (such as) Figure 2 As shown), the main joint pad BDm and the curved joint pad BDb can have a rotational relationship. For example, in Figure 2 In this context, the edges of the main component pad BDm can be parallel to directions X and Y, respectively, and the edges of the curved component pad BDb can be substantially parallel to the extension direction of the first substrate opening OPS1 and perpendicular to the extension direction of the first substrate opening OPS1, respectively, but are not limited thereto. In another viewpoint, in... Figure 2In this arrangement, the third axis AN3 can pass through the two centers of the two main part pads BDm1 and BDm2 in the first main part pad group GRm1, and the fourth axis AN4 can pass through the two centers of the two curved part pads BDb1 and BDb2 in the first curved part pad group GRb1. The third axis AN3 may not be parallel to the fourth axis AN4, but this is not a limitation. This arrangement can increase the number and density of curved part pads BDb in the curved part 114, thereby increasing the number and density of curved part electronic units 124 in the curved part 114 (e.g., improving the display quality of the curved part 114). It should be noted that the center of the main part pad BDm is the geometric center when the flexible substrate 110 is in a flattened state, and the center of the curved part pad BDb is the geometric center when the flexible substrate 110 is in a flattened state.

[0060] In this invention, the distance between the two main part pads BDm (i.e., two adjacent main part pads BDm) in the main part pad group GRm and the distance between the two curved part pads BDb (i.e., two adjacent curved part pads BDb) in the curved part pad group GRb can be designed according to requirements. The distance between the two pads BD is the shortest distance between the two pads BD, and the measurement direction of this distance is parallel to the line connecting the centers of the two pads BD. In this invention, the distance between the two main part pads BDm in the main part pad group GRm and the distance between the two curved part pads BDb in the curved part pad group GRb can be the same or different from each other. For example, in... Figure 2 In the main part pad group GRm, the distance Dm between the two main part pads BDm can be smaller than the distance Db1 or Db2 between the two curved part pads BDb in the curved part pad group GRb, but is not limited thereto. This distance design allows the curved part pads BDb to be positioned to avoid the area with the maximum curvature in the curved portion 114 of the flexible substrate 110.

[0061] Furthermore, the distance between two bend pads BDb in different bend pad groups GRb can be the same or different from each other. For example, in Figure 2 In this case, since the space available for the curved pads BDb decreases as they approach the edge of the flexible substrate 110, when the distance between the first curved pad group GRb1 and the edge of the flexible substrate 110 is greater than the distance between the second curved pad group GRb2 and the edge of the flexible substrate 110, the distance Db1 between the two curved pads BDb1 and BDb2 in the first curved pad group GRb1 can be greater than the distance Db2 between the two curved pads BDb3 and BDb4 in the second curved pad group GRb2, but is not limited thereto.

[0062] In this invention, the area (size) of the electronic unit 120 and the area (size) of the pad BD can be designed according to requirements, and the area (size) of the electronic unit 120 may or may not be related to the area (size) of the pad BD. In this invention, the area (size) of the main part electronic unit 122 may be the same as or different from the area (size) of the curved part electronic unit 124, and the area (size) of the main part pad BDm may be the same as or different from the area (size) of the curved part pad BDb. For example, in Figure 2 and Figure 3 In this design, the area of ​​the main electronic unit 122 can be smaller than the area of ​​the curved electronic unit 124 (i.e., a smaller main electronic unit 122 results in a higher resolution of the display screen corresponding to the main part 112, while a larger curved electronic unit 124 improves the bonding yield), and the area of ​​the main pad BDm can be the same as the area of ​​the curved pad BDb, but is not limited thereto. For example (not shown), the area of ​​the main electronic unit 122 can be the same as the area of ​​the curved electronic unit 124, and the area of ​​the main pad BDm can be the same as the area of ​​the curved pad BDb, but is not limited thereto. It should be noted that the area (size) of the electronic unit 120 and the area (size) of the pad BD are measured when the flexible substrate 110 is in a flattened state.

[0063] In this invention, the electronic device ED1 may also include other desired film layers and / or components. In some embodiments (such as...) Figure 3 As shown, the electronic device ED1 may also optionally include a pixel definition layer (PDL) disposed on the circuit layer 130 and positioned between the two electronic units 120 in a top view, thus separating the electronic units 120. For example, the pixel definition layer (PDL) may include an insulating material (e.g., an organic or inorganic insulating material), other suitable materials, or combinations thereof, but is not limited thereto.

[0064] In some embodiments (such as) Figure 3 As shown, the electronic device ED1 may also optionally include insulating layers PL1, PL2, and PL3 disposed on the electronic unit 120 and the circuit layer 130, stacked sequentially on top of each other. For example, insulating layer PL1 may cover and / or enclose electronic unit 120 to protect electronic unit 120, and insulating layers PL2 and PL3 may be planarization layers to provide flat surfaces, but are not limited thereto. For example, insulating layers PL1, PL2, and PL3 may each include insulating materials (e.g., organic insulating materials or inorganic insulating materials), but are not limited thereto.

[0065] In some embodiments (such as) Figure 3As shown), the electronic device ED1 may also optionally include light-shielding layers 142 and 144 disposed on the electronic unit 120 and the circuit layer 130 to shield some components and improve the quality of the electronic device ED1 (e.g., light-shielding layers 142 and 144 can shield areas with poor display effects to improve the display quality of the electronic device ED1). Figure 3 In the above view, the light-blocking layers 142 and 144 may be located between the two electronic units 120 to separate the electronic units 120. For example, the light-blocking layers 142 and 144 may include metal, photoresist, ink, resin, pigment, other suitable light-blocking materials, or combinations thereof, but are not limited thereto.

[0066] In some embodiments (such as) Figure 3 As shown), the electronic device ED1 may also optionally include a color conversion layer 150 disposed on the electronic unit 120 and the circuit layer 130, for adjusting the color of the light generated by the electronic unit 120. Figure 3 In this configuration, the color conversion layer 150 may overlap the electronic unit 120 in the Z direction. For example, the color conversion layer 150 may include a color filter, a fluorescent material, a phosphorescent material, a quantum dot (QD) material, other suitable materials, or combinations thereof.

[0067] In some embodiments (such as) Figure 3 As shown, the electronic device ED1 may also optionally include a cover layer 170 and a functional layer 160 disposed on the electronic unit 120 and the circuit layer 130, wherein the functional layer 160 provides any suitable function. For example, the cover layer 170 may include glass, quartz, ceramic, sapphire, polymers (e.g., polyimide (PI), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA)), other suitable materials, or combinations thereof. For example, the functional layer 160 may provide anti-reflective effects (e.g., the functional layer 160 includes an anti-reflective layer), adhesive effects (e.g., the functional layer 160 includes an adhesive layer), or other suitable functions.

[0068] In some embodiments (such as) Figure 3 As shown, the electronic device ED1 may also optionally include a sensing structure 180 disposed on the electronic unit 120 and the circuit layer 130 (e.g., the sensing structure 180 is disposed between the electronic unit 120 and the cover layer 170) for performing desired sensing. For example, the sensing structure 180 can be used for touch sensing, fingerprint sensing, light sensing, other desired sensing, or combinations thereof. For example, the sensing structure 180 may include a sensing element 182 (e.g., a sensing electrode) and an insulating structure 184, wherein the sensing element 182 has a sensing function, but is not limited thereto.

[0069] The electronic device of the present invention is not limited to the above embodiments. Other embodiments will continue to be disclosed below. However, in order to simplify the description and highlight the differences between the embodiments and the above embodiments, the same reference numerals are used to refer to the same elements in the present invention, and repeated parts will not be described again.

[0070] Please refer to Figure 4 , Figure 4 This is a top view schematic diagram of the flexible substrate and pads of the electronic device according to the second embodiment of the present invention, wherein... Figure 4 The diagram shows the flexible substrate 110 before bending (i.e., the flexible substrate 110 is in a flattened state), and Figure 4 Only a portion of the main part 112 and the corner area 114a of the curved part 114 are shown. (See diagram below.) Figure 4 As shown, the difference between this embodiment and the first embodiment lies in the design of the curved portion pad BDb of the electronic device ED2. Figure 4 In this configuration, the main joint pad BDm and the curved joint pad BDb may not have a rotational relationship. For example, in... Figure 4 In this context, since the pad BD can be rectangular in top view, the edges of the main pad BDm can be parallel to directions X and Y respectively, and the edges of the curved pad BDb can also be parallel to directions X and Y respectively, but are not limited thereto. In another viewpoint, the third axis AN3 passing through the two centers of the two main pads BDm1 and BDm2 in the first main pad group GRm1 can be parallel to the fourth axis AN4 passing through the two centers of the two curved pads BDb1 and BDb2 in the first curved pad group GRb1.

[0071] It should be noted that, although in Figure 4 The third axis AN3 is parallel to the fourth axis AN4. However, since the multiple main part pad groups GRm (or multiple main part pads BDm) are still arranged in the X and Y directions, and the multiple curved part pad groups GRb can be arranged substantially along the extension direction of the first substrate opening OPS1, the first axis AN1 passing through the first center CT1 of the first main part pad group GRm1 and the second center CT2 of the second main part pad group GRm2 is still not parallel to the second axis AN2 passing through the third center CT3 of the first curved part pad group GRb1 and the fourth center CT4 of the second curved part pad group GRb2.

[0072] Please refer to Figure 5 , Figure 5 This is a top view schematic diagram of the flexible substrate and pads of the electronic device according to the third embodiment of the present invention, wherein... Figure 5 The diagram shows the flexible substrate 110 before bending (i.e., the flexible substrate 110 is in a flattened state), and Figure 5 Only a portion of the main part 112 and the corner area 114a of the curved part 114 are shown. (See diagram below.) Figure 5As shown, the difference between this embodiment and the first embodiment lies in the design of the curved portion pad BDb of the electronic device ED3. Figure 5 In a curved joint pad group GRb, the arrangement direction of the curved joint pads BDb may differ from the arrangement direction of the curved joint pads BDb in another curved joint pad group GRb. For example, in Figure 5 In this configuration, the fourth axis AN4 passes through the two centers of the two curved pads BDb1 and BDb2 in the first curved pad group GRb1, and the fifth axis AN5 passes through the two centers of the two curved pads BDb3 and BDb4 in the second curved pad group GRb2. The fourth axis AN4 may not be parallel to the fifth axis AN5, but this is not a limitation. In other words, the curved pads BDb of the electronic device ED3 can have multiple arrangements.

[0073] Please refer to Figure 6 , Figure 6 This is a top view schematic diagram of the flexible substrate and pads of the electronic device according to the fourth embodiment of the present invention, wherein... Figure 6 The diagram shows the flexible substrate 110 before bending (i.e., the flexible substrate 110 is in a flattened state), and Figure 6 Only a portion of the main part 112 and the corner area 114a of the curved part 114 are shown. (See diagram below.) Figure 6 As shown, the difference between this embodiment and the first embodiment lies in the design of the pad BD of the electronic device ED4. Figure 6 In this configuration, a primary pad group GRm may include four primary pads BDm1, BDm2, BDm3, and BDm4, and three primary electronic units 122 may correspond to one primary pad group GRm. One primary electronic unit 122 may be bonded to primary pads BDm1 and BDm4, another primary electronic unit 122 may be bonded to primary pads BDm2 and BDm4, and yet another primary electronic unit 122 may be bonded to primary pads BDm3 and BDm4 (i.e., the three primary electronic units 122 may share primary pad BDm4), and the area of ​​primary pad BDm4 may be larger than the areas of primary pads BDm1, BDm2, and BDm3. For example, primary pad BDm4 may be bonded to an electrode in primary electronic unit 122 that is electrically connected to an N-type semiconductor layer, and primary pads BDm1, BDm2, and BDm3 may be bonded to electrodes in primary electronic unit 122 that are electrically connected to a P-type semiconductor layer, but this is not a limitation. For example, main component pads BDm1, BDm2, and BDm3 can be disposed on one side of the main component pad BDm4, but are not limited thereto. With this design, the required mounting area of ​​the main component pads BDm can be reduced, thereby increasing the density of the main component electronic unit 122 and / or reducing the size of the electronic device ED4.

[0074] On the other hand, such as Figure 6As shown, the multiple curved electronic units 124 do not share the curved pad BDb, and the area of ​​the main pad BDm4 can be larger than the area of ​​the curved pad BDb, so that the curved pad BDb can avoid the area with the maximum curvature in the curved portion 114 of the flexible substrate 110.

[0075] In some embodiments, when the three electronic units 120 are used to generate red, green, and blue light respectively, the pixels of the main portion 112 may include three main electronic units 122 corresponding to the same main pad group GRm (these three main electronic units 122 are used to generate red, green, and blue light respectively), and the pixels of the curved portion 114 may include three adjacent curved electronic units 124 that generate red, green, and blue light respectively (i.e., the pixels of the curved portion 114 include three adjacent curved pad groups GRb). In this case, the number of main pads BDm in the pixels of the main portion 112 (e.g., four) may be less than the number of curved pads BDb in the pixels of the curved portion 114 (e.g., six).

[0076] Please refer to Figure 7 , Figure 7 This is a cross-sectional schematic diagram of an electronic device according to a fifth embodiment of the present invention. Figure 7 As shown, the difference between this embodiment and the first embodiment lies in the design of the electronic unit 120 of the electronic device ED5. Figure 7 In the main electronic unit 122, an integrated light-emitting chip may be included, which has light-emitting elements 122a, 122b, and 122c capable of generating red, green, and blue light respectively. Figure 7 In this design, light-emitting elements 122a, 122b, and 122c are disposed within the molding layer 122m of the integrated light-emitting chip, such that the pixels of the main portion 112 may include this integrated light-emitting chip. Conversely, the curved portion electronic units 124 each generate red, green, or blue light, such that the pixels of the curved portion 114 may include three adjacent curved portion electronic units 124 that generate red, green, and blue light respectively. Since the pixels of the curved portion 114 use three separate curved portion electronic units 124, the curved portion pad BDb and the curved portion electronic units 124 conveniently avoid the region with the maximum curvature in the curved portion 114 of the flexible substrate 110.

[0077] In this invention, the light-emitting areas of the light-emitting elements 122a, 122b, and 122c in the integrated light-emitting chip can be designed according to requirements. In some embodiments, the light-emitting areas of the light-emitting elements 122a, 122b, and 122c in the integrated light-emitting chip can be the same as or different from each other. For example, the light-emitting area of ​​the light-emitting element 122a that generates red light can be larger than the light-emitting area of ​​the light-emitting element 122b that generates green light and the light-emitting area of ​​the light-emitting element 122c that generates blue light, but this is not a limitation. In some embodiments, the light-emitting areas of the light-emitting elements 122a, 122b, and 122c in the integrated light-emitting chip can be the same as or different from the light-emitting area of ​​the curved portion electronic unit 124. For example, the light-emitting areas of the light-emitting elements 122a, 122b, and 122c in the integrated light-emitting chip can be smaller than the light-emitting areas of the curved portion electronic unit 124 that generates red, green, and blue light, respectively, but this is not a limitation.

[0078] Additionally, when the main electronic unit 122 includes an integrated light-emitting chip, the main electronic unit 122 may also optionally include a circuit structure 122s, wherein the integrated light-emitting chip is bonded to a circuit connection pad 122s1 in the circuit structure 122s via a bonding member BS, and the circuit connection pad 122s2 of the circuit structure 122s is bonded to a main component pad BDm via the bonding member BS. The circuit connection pads 122s1 and 122s2 can be disposed on a circuit board 122sb. Due to the presence of the circuit structure 122s, some pins of the integrated light-emitting chip can be electrically connected to the same main component pad BDm, reducing the number of main component pads BDm. Furthermore, even if the design of the main component pad BDm in the main component pad group GRm changes, the integrated light-emitting chip in the main electronic unit 122 can still be electrically connected to the corresponding main component pad BDm via the circuit structure 122s. For example, when the main electronic unit 122 including the integrated light-emitting chip is applied in… Figure 6 When the main component pad group GRm is shown (i.e., the main component pad group GRm includes four main component pads BDm1, BDm2, BDm3, and BDm4, and the light-emitting elements 122a, 122b, and 122c of the integrated light-emitting chip need to share the main component pad BDm4), the design of the circuit structure 122s can make the light-emitting element 122a that generates red light electrically connected to the main component pads BDm1 and BDm4, the light-emitting element 122b that generates green light electrically connected to the main component pads BDm2 and BDm4, and the light-emitting element 122c that generates blue light electrically connected to the main component pads BDm3 and BDm4, but it is not limited to this.

[0079] Additionally, in some embodiments (not shown), the curved portion electronic unit 124 may also include an integrated light-emitting chip with light-emitting elements capable of generating red, green, and blue light respectively, such that the pixels of the curved portion 114 may include this integrated light-emitting chip. In some embodiments (not shown), when the curved portion electronic unit 124 includes an integrated light-emitting chip, the pins of the integrated light-emitting chip of the curved portion electronic unit 124 may not share the curved portion pad BDb (e.g., Figure 6 (The design of the bending pad BDb in the bending portion) Therefore, the number of pins of the integrated light-emitting chip of the bending portion electronic unit 124 can be the same as the number of corresponding bending pads BDb, so that the bending pads BDb can avoid the area with the maximum bending curvature in the bending portion 114 of the flexible substrate 110.

[0080] Please refer to Figure 8 , Figure 8 This is a top view schematic diagram of the flexible substrate and pads of the electronic device according to the sixth embodiment of the present invention, wherein... Figure 8 The diagram shows the flexible substrate 110 before bending (i.e., the flexible substrate 110 is in a flattened state), and Figure 8 Only a portion of the main part 112 and the corner area 114a of the curved part 114 are shown. It should be noted that... Figure 8 The electronic unit 120 of the illustrated electronic device ED6 is exemplified by a vertical light-emitting unit (i.e., the semiconductor layer of the electronic unit 120 is located between two electrodes in the Z direction), which makes... Figure 8 The pad BD shown corresponds to the electronic unit 120, which is a vertical light-emitting unit.

[0081] like Figure 8 As shown, the difference between this embodiment and the first embodiment lies in the design of the pad BD of the electronic device ED6. Figure 8 In this context, the area (size) of the main part pad BDm may differ from the area (size) of the curved part pad BDb. That is, the ratio of the area (size) of the main part pad BDm to the area (size) of the curved part pad BDb is not equal to 1. For example, the area of ​​the main part pad BDm may be smaller than the area of ​​the curved part pad BDb, such that the ratio of the area of ​​the main part pad BDm to the area of ​​the curved part pad BDb may be less than 1, but this is not a limitation. For example, the ratio of the area of ​​the main part pad BDm to the area of ​​the curved part pad BDb may be greater than or equal to 0.3 and less than 1, but this is not a limitation.

[0082] Furthermore, the area (size) of the electronic unit 120 can be designed according to requirements, and the area (size) of the electronic unit 120 may or may not be related to the area (size) of the pad BD. In some embodiments (e.g.) Figure 8As shown, the area of ​​the main part pad BDm may be smaller than the area of ​​the curved part pad BDb, and the area of ​​the main part electronic unit 122 may be the same as or different from the area of ​​the curved part electronic unit 124. For example, the area of ​​the main part pad BDm may be smaller than the area of ​​the curved part pad BDb, and the area of ​​the main part electronic unit 122 may be smaller than the area of ​​the curved part electronic unit 124, but this is not a limitation.

[0083] Please refer to Figure 9 and Figure 10 , Figure 9 This is a top view schematic diagram of the flexible substrate and pads of the electronic device according to the seventh embodiment of the present invention. Figure 10 This is a top view schematic diagram of various designs of the curved portion pad of the electronic device according to the seventh embodiment of the present invention, wherein... Figure 9 The diagram shows the flexible substrate 110 before bending (i.e., the flexible substrate 110 is in a flattened state), and Figure 9 Only a portion of the main part 112 and the corner area 114a of the curved part 114 are shown. (See diagram below.) Figure 9 As shown, this embodiment and the sixth embodiment ( Figure 8 The difference lies in the design of the curved pad BDb in the electronic device ED7. Figure 9 and Figure 10 In this configuration, the bend pad BDb may include multiple openings OP to relieve stress (e.g., stress caused by the bending of the bend portion 114). For example, in Figure 9 In the process, each curved portion of the pad BDb may include multiple openings OP (e.g., Figure 9 BDb bend joint pads are used Figure 10 The first design pattern PN1), but not limited to this.

[0084] For example, in Figure 10 In the first design pattern PN1 of the curved portion pad BDb, the outer contour of the curved portion pad BDb is rectangular, and the opening OP of the curved portion pad BDb can be L-shaped, wherein the openings OP can be arranged in a ring, but are not limited thereto. For example, in Figure 10 In the second design pattern PN2 of the curved pad BDb, the outer contour of the curved pad BDb is a rectangle with curved (e.g., arc) chamfers, and the opening OP of the curved pad BDb may have multiple curved edges, wherein the openings OP may be arranged in a ring, but are not limited thereto. For example, in Figure 10 In the third design pattern PN3 of the curved pad BDb, the outer contour of the curved pad BDb is a rectangle with a curved (e.g., arc) chamfer, and the opening OP of the curved pad BDb can be elliptical, wherein the opening OP can be arranged in multiple columns, but is not limited thereto.

[0085] Please refer to Figure 11, Figure 11 This is a top view schematic diagram of the flexible substrate and pads of the electronic device according to the eighth embodiment of the present invention, wherein... Figure 11 The diagram shows the flexible substrate 110 before bending (i.e., the flexible substrate 110 is in a flattened state), and Figure 11 Only a portion of the main part 112 and the corner area 114a of the curved part 114 are shown. (See diagram below.) Figure 11 As shown, this embodiment and the sixth embodiment ( Figure 8 The difference lies in that the pads BD of the electronic device ED8 also include multiple first redundant pads BTr1 and multiple second redundant pads BTr2. The first redundant pads BTr1 are disposed on the main portion 112 of the flexible substrate 110 and electrically connected to the first circuit CS1 (i.e., both the main portion pads BDm and the first redundant pads BTr1 are electrically connected to the first circuit CS1, see reference). Figure 13 The second redundant pad BDr2 is disposed on the bent portion 114 of the flexible substrate 110 and electrically connected to the second circuit CS2 (that is, both the bent portion pad BDb and the second redundant pad BDr2 are electrically connected to the second circuit CS2, see reference). Figure 13 ).exist Figure 11 In this configuration, the first redundant pad BDr1 may be adjacent to the main pad BDm, and the second redundant pad BDr2 may be adjacent to the curved pad BDb. For example, the main pad BDm may be disposed between two first redundant pads BDr1, and the curved pad BDb may be disposed between two second redundant pads BDr2, but this is not a limitation.

[0086] In this invention, when the main electronic unit 122 disposed on the main part pad BDm does not meet requirements (e.g., appearance defects, color deviation, etc.) or cannot operate normally (e.g., positional misalignment, poor bonding), the main part repair electronic unit for repairing the main part 112 can be disposed on the adjacent first redundant pad BDr1 to achieve a repair effect. Similarly, when the curved part electronic unit 124 disposed on the curved part pad BDb does not meet requirements (e.g., appearance defects, color deviation, etc.) or cannot operate normally (e.g., positional misalignment, poor bonding), the curved part repair electronic unit for repairing the curved part 114 can be disposed on the adjacent second redundant pad BDr2 to achieve a repair effect. In addition, the first redundant pad BDr1 and the second redundant pad BDr2 can also serve as alignment marks in the manufacturing process of the electronic device ED8 (e.g., the transfer process of the electronic unit 120).

[0087] In this invention, the number of first redundant pads BTr1 and the number of second redundant pads BTr2 can be designed according to requirements, and the ratio of the number of first redundant pads BTr1 to the number of main part pads BDm and the ratio of the number of second redundant pads BTr2 to the number of curved part pads BDb can be designed according to requirements. For example, in Figure 11 In the main portion 112, when the pixel PXm includes three main electronic units 122 (these three main electronic units 122 are used to generate red light, green light and blue light respectively), the pixel PXm of the main portion 112 may include three main pads BDm and six first redundant pads BTr1. When the pixel PXb of the curved portion 114 includes three curved electronic units 124 (these three curved electronic units 124 are used to generate red light, green light and blue light respectively), the pixel PXb of the curved portion 114 may include three curved pads BDb and six second redundant pads BTr2, such that the ratio of the number of first redundant pads BTr1 to the number of main pads BDm may be the same as the ratio of the number of second redundant pads BTr2 to the number of curved pads BDb, and the number of first redundant pads BTr1 in a pixel PXm of the main portion 112 is the same as the number of second redundant pads BTr2 in a pixel PXb of the curved portion 114, but is not limited thereto.

[0088] In this invention, the area (size) of the first redundant pad BTr1 and the area (size) of the second redundant pad BTr2 can be designed according to requirements, such that the area of ​​the first redundant pad BTr1 may be the same as or different from the area of ​​the second redundant pad BTr2. For example, in Figure 11 In this process, the area of ​​the main part pad BDm can be smaller than the area of ​​the curved part pad BDb, the area of ​​the first redundant pad BTr1 can be the same as the area of ​​the main part pad BDm, and the area of ​​the second redundant pad BTr2 can be the same as the area of ​​the curved part pad BDb. Therefore, the area of ​​the first redundant pad BTr1 can be smaller than the area of ​​the second redundant pad BTr2, but this is not a limitation.

[0089] Additionally, the first redundant pad BDr1 and the second redundant pad BDr2 may have different shapes in top view. In some embodiments, the second redundant pad BDr2 may also include multiple openings to relieve stress (e.g., stress caused by bending of the bent portion 114). For example, the pattern design of the second redundant pad BDr2 may also refer to... Figure 10 The first design pattern PN1, the second design pattern PN2, and the third design pattern PN3 shown will not be described again here.

[0090] Please refer to Figure 12 , Figure 12This is a top view schematic diagram of the flexible substrate and pads of the electronic device according to the ninth embodiment of the present invention, wherein... Figure 12 The diagram shows the flexible substrate 110 before bending (i.e., the flexible substrate 110 is in a flattened state), and Figure 12 Only a portion of the main part 112 and the corner area 114a of the curved part 114 are shown. (See diagram below.) Figure 12 As shown, this embodiment and the eighth embodiment ( Figure 11 The difference lies in the number of first redundant pads BTr1 and the number of second redundant pads BTr2 in the electronic device ED9. For example, in Figure 12 In the main portion 112, when the pixel PXm includes three main electronic units 122 (these three main electronic units 122 are used to generate red light, green light and blue light respectively), the pixel PXm of the main portion 112 may include three main pads BDm and three first redundant pads BTr1. When the pixel PXb of the curved portion 114 includes three curved electronic units 124 (these three curved electronic units 124 are used to generate red light, green light and blue light respectively), the pixel PXb of the curved portion 114 may include three curved pads BDb and six second redundant pads BTr2, such that the ratio of the number of second redundant pads BTr2 to the number of curved pads BDb may be greater than the ratio of the number of first redundant pads BTr1 to the number of main pads BDm, and the number of second redundant pads BTr2 in a pixel PXb of the curved portion 114 may be greater than the number of first redundant pads BTr1 in a pixel PXm of the main portion 112, but is not limited thereto.

[0091] Please refer to Figure 13 , Figure 13 This is a cross-sectional schematic diagram of an electronic device according to the tenth embodiment of the present invention. Figure 13 As shown, this embodiment and the eighth embodiment ( Figure 11 The difference lies in the design of the first redundant pad BTr1 and the second redundant pad BTr2 of the electronic device ED10. Figure 13 In this process, the upper surfaces of the first redundant pad BDr1 and the second redundant pad BDr2 are higher in the Z direction than the upper surfaces of the main pad BDm and the curved pad BDb. Therefore, during the repair process of the electronic device ED10, in which the main repair electronic unit is bonded to the first redundant pad BDr1 and / or the curved repair electronic unit is bonded to the second redundant pad BDr2, the possibility of damage to the main electronic unit 122 and the curved electronic unit 124 during the repair process can be reduced (e.g., reducing or avoiding pressure damage to the main electronic unit 122 and the curved electronic unit 124). In some embodiments (e.g.) Figure 13As shown), relative to the main part pad BDm and the curved part pad BDb, the first redundant pad BTr1 and the second redundant pad BTr2 can be raised in cross-section by the first raised part EV1 and the second raised part EV2, respectively, containing insulating material. For example, in Figure 13 In this design, the first raised portion EV1 and the second raised portion EV2 can belong to the pixel definition layer PDL, so that the pixel definition layer PDL can raise the first redundant pad BTR1 and the second redundant pad BTR2. The first raised portion EV1 can be located between the first redundant pad BTR1 and the insulating layer IN9, and the second raised portion EV2 can be located between the second redundant pad BTR2 and the insulating layer IN9. The pixel definition layer PDL is not located between the main part pad BDm and the insulating layer IN9, nor is it located between the curved part pad BDb and the insulating layer IN9 (e.g., the main part pad BDm and the curved part pad BDb directly contact the insulating layer IN9), but it is not limited thereto.

[0092] Furthermore, the thickness T1 of the first raised portion EV1 and the thickness T2 of the second raised portion EV2 can be the same or different from each other as needed. For example, in Figure 13 In this process, the thickness T1 of the first raised part EV1 may be less than the thickness T2 of the second raised part EV2, but is not limited thereto.

[0093] Please refer to Figure 14 , Figure 14 This is a top view schematic diagram illustrating various designs of the flexible substrate, pads, and curved portions of the electronic device according to the eleventh embodiment of the present invention, wherein... Figure 14 The diagram shows the flexible substrate 110 before bending (i.e., the flexible substrate 110 is in a flattened state), and Figure 14 Only a portion of the main part 112 and the corner area 114a of the curved part 114 are shown, while the first design 114D1 and the second design 114D2 of the curved part 114 are enlarged views of area RG. Figure 14 As shown, this embodiment and the eighth embodiment ( Figure 11 The difference lies in that the bent portion 114 of the flexible substrate 110 of the electronic device ED11 also has other patterned designs. In some embodiments, the patterned design of the bent portion 114 may, for example, increase the flexibility and / or stretchability of the bent portion 114 of the flexible substrate 110. Figure 14 In this case, the bent portion 114 of the flexible substrate 110 may further include a plurality of second substrate openings OPS2, such that the bent portion 114 of the flexible substrate 110 may have a plurality of island portions 114i and a plurality of bridging portions 114n, and the island portions 114i and the bridging portions 114n may be connected to each other. For example, in Figure 14In this configuration, multiple island portions 114i are separated from each other through a second substrate opening OPS2. Each island portion 114i can be connected to four bridging portions 114n, and the bridging portions 114n can be connected between two island portions 114i, but are not limited thereto. For example, Figure 14 The first design 114D1 and the second design 114D2 of the curved portion 114 shown both depict a substrate unit, and a substrate unit includes four island portions 114i and twelve bridging portions 114n connected to each other, but is not limited thereto.

[0094] In this invention, the shapes of the island portion 114i and the bridging portion 114n can be designed according to requirements, and the arrangement of the island portion 114i and the bridging portion 114n can be designed according to requirements. In some embodiments, the shapes of the island portion 114i and the bridging portion 114n can be polygonal (e.g., rectangular), shapes with curved edges (e.g., circular, elliptical), or other suitable shapes. For example, in Figure 14 In the process, the island portion 114i may be quadrilateral, while the bridging portion 114n may be a strip structure, but is not limited thereto. It should be noted that in some embodiments, the edge at the connection between the bridging portion 114n and the island portion 114i may be a curved edge (e.g., an arc) to improve the yield of the bent portion 114 of the flexible substrate 110 during stretching and / or deformation, but is not limited thereto.

[0095] In this invention, the second substrate opening OPS2 can have a suitable shape and be arranged in a suitable manner. For example, in Figure 14 In this design, the second substrate opening OPS2 can be an H-shaped opening, but is not limited to this. For example, in... Figure 14 In this process, two adjacent second substrate openings OPS2 can have a 90-degree rotational relationship, but are not limited to this.

[0096] Since the flexible substrate 110 has an island portion 114i and a bridging portion 114n in the bent portion 114, when the flexible substrate 110 is stretched and / or deformed by an external force, the island portion 114i can rotate and the bridging portion 114n can deform, but this is not the limitation.

[0097] exist Figure 14 In the first design 114D1 of the curved portion 114 shown, the curved portion pad BDb and the second redundant pad BTr2 can be disposed on the island portion 114i, so that the curved portion electronic unit 124 and the curved portion repair electronic unit can be disposed on the island portion 114i, but are not limited thereto. Figure 14In the second design 114D2 of the bent portion 114 shown, the bent portion pad BDb can be disposed on the island portion 114i so that the bent portion electronic unit 124 can be disposed on the island portion 114i, and the second redundant pad BDr2 can be disposed on the island portion 114i and the bridging portion 114n so that the bent portion repair electronic unit can be disposed on the island portion 114i and the bridging portion 114n, but is not limited thereto.

[0098] Please refer to Figure 15 and Figure 16 , Figure 15 This is a top view schematic diagram of the flexible substrate and pads of the electronic device according to the twelfth embodiment of the present invention. Figure 16 This is a cross-sectional schematic diagram of various designs for the curved portion electronic unit of the electronic device according to the twelfth embodiment of the present invention, wherein... Figure 15 The diagram shows the flexible substrate 110 before bending (i.e., the flexible substrate 110 is in a flattened state), and Figure 15 Only a portion of the main part 112 and the corner area 114a of the curved part 114 are shown. (See diagram below.) Figure 15 As shown, this embodiment and the sixth embodiment ( Figure 8 The difference lies in the design of the BD pad of the ED12 electronic device. Figure 15 In this configuration, the area (size) of the main part pad BDm can be larger than the area (size) of the curved part pad BDb, such that the ratio of the area (size) of the main part pad BDm to the area (size) of the curved part pad BDb can be greater than 1, but is not limited thereto. For example, the ratio of the area of ​​the main part pad BDm to the area of ​​the curved part pad BDb can be greater than 1 and less than 4, but is not limited thereto.

[0099] Furthermore, the area (size) of the electronic unit 120 can be designed according to requirements, and the area (size) of the electronic unit 120 may or may not be related to the area (size) of the pad BD. In some embodiments (e.g.) Figure 15 As shown, the area of ​​the main part pad BDm can be larger than the area of ​​the curved part pad BDb, and the area of ​​the main part electronic unit 122 can be the same as or different from the area of ​​the curved part electronic unit 124. For example, the area of ​​the main part pad BDm can be larger than the area of ​​the curved part pad BDb, and the area of ​​the main part electronic unit 122 (e.g., light-emitting area) can be larger than the area of ​​the curved part electronic unit 124 (e.g., light-emitting area), but is not limited thereto.

[0100] like Figure 15 and Figure 16 As shown, since the area of ​​the curved portion pad BDb is smaller than the area of ​​the curved portion electronic unit 124 (e.g., the light-emitting area), additional electronic components can be selectively provided on the curved portion 114 of the flexible substrate 110. For example, in Figure 16In structure 124D1, the electronic device ED12 may optionally include a sensor 124e disposed on the curved portion 114 for performing desired sensing. For example, the sensor 124e may be used for light sensing, other desired sensing, or a combination thereof. For example, in Figure 16 In structure 124D1, sensor 124e can be a light sensor and includes multiple semiconductor layers, but is not limited thereto. For example, in Figure 16 In structure 124D1, the curved portion electronic unit 124 can be an integrated chip, and the integrated chip can include a sensor 124e and a light-emitting element 124a (in Figure 16 In this embodiment, sensor 124e and light-emitting element 124a are disposed in the molding layer 124m of the integrated chip, but are not limited thereto. In some embodiments (e.g., Figure 16 As shown in structure 124D1), to improve the light sensing effect of sensor 124e, a first light converging structure LC1 for concentrating light can be provided on sensor 124e. The first light converging structure LC1 is formed by forming perforations in multiple insulating layers INX1, INX2, INX3 and multiple light-shielding layers BL1, BL2, BL3. The multiple insulating layers INX1, INX2, INX3 and the multiple light-shielding layers BL1, BL2, BL3 are alternately stacked in the Z direction. The light-shielding layers BL1, BL2, BL3 can prevent light with a large incident angle from entering sensor 124e, thereby reducing the noise sensed by sensor 124e. Figure 16 In structure 124D1, since the first light converging structure LC1 passes through multiple light shielding layers BL1, BL2, and BL3, the light converging effect of the first light converging structure LC1 is improved. Furthermore, to prevent these insulating layers INX1, INX2, and INX3 from affecting the light emission of the light-emitting element 124a, an opening structure OS1 can be provided on the light-emitting element 124a. The opening structure OS1 can be formed by forming perforations in the multiple insulating layers INX1, INX2, and INX3.

[0101] For example, in Figure 16 In the structure 124D2, the electronic device ED12 may also optionally include an infrared light emitting element 124b for generating infrared light. For example, in Figure 16 In structure 124D2, the curved portion electronic unit 124 can be an integrated chip, and the integrated chip can include a sensor 124e, a light-emitting element 124a, and an infrared light-emitting element 124b (in... Figure 16 In this configuration, sensor 124e, light-emitting element 124a, and infrared light-emitting element 124b are disposed within the molding layer 124m of the integrated chip, and the infrared light-emitting element 124b may have an opening structure OS2, but is not limited thereto. For example, in Figure 16 In structure 124D3, to improve the light sensing effect of sensor 124e, a second light-converging structure LC2 for concentrating light can be provided on sensor 124e. For example, the first light-converging structure LC1 and the second light-converging structure LC2 can overlap in the Z direction, but are not limited thereto. For example, the second light-converging structure LC2 can be a lens (e.g., a convex lens), but is not limited thereto.

[0102] exist Figure 15 In this design, the pad BD may also include multiple additional pads BDt disposed on the bent portion 114 of the flexible substrate 110 for electrically connecting and providing signals to other additional electronic components such as the sensor 124e and the infrared light emitter 124b. For example, in Figure 15 In this context, the additional pad BDt may be adjacent to the bend pad BDb, but is not limited to this.

[0103] For example, if the curved electronic unit 124 includes an integrated chip (such as...) Figure 16 The structures 124D1, 124D2, and 124D3 shown include additional electronic components such as a sensor 124e and an infrared light emitter 124b. The curved portion electronic unit 124 may also optionally include a circuit structure 124s, wherein the integrated chip can be bonded to the circuit connection pad 124s1 in the circuit structure 124s via a connector BS. The circuit connection pad 124s2 of the circuit structure 124s can be bonded to the curved portion pad BDb and the additional pad BDt via the connector BS. The circuit connection pads 124s1 and 124s2 may be disposed on the circuit board 124sb, but are not limited thereto. Due to the presence of the circuit structure 124s, some pins of the integrated chip can be electrically connected to the same pad BD on the curved portion 114, thereby reducing the number of pads BD. Furthermore, even if the design of the pads BD on the curved portion 114 is changed, the integrated chip in the curved portion electronic unit 124 can still be electrically connected to the corresponding pad BD via the circuit structure 124s.

[0104] For example (not shown), if the curved portion electronic unit 124 includes an integrated chip and additional electronic components such as sensor 124e and infrared light emitter 124b, the curved portion electronic unit 124 can also be directly bonded to the curved portion pad BDb and the additional pad BDt, but is not limited thereto. For example (not shown), if the additional electronic components such as sensor 124e and infrared light emitter 124b are separate from the curved portion electronic unit 124, the additional electronic components such as sensor 124e and infrared light emitter 124b can be directly bonded to the additional pad BDt, but is not limited thereto.

[0105] Please refer to Figures 17 to 22 , Figure 17 This is a flowchart of a method for manufacturing an electronic device according to an embodiment of the present invention. Figures 18 to 21 This is a schematic diagram of each step in a method for manufacturing an electronic device according to an embodiment of the present invention. Figures 18 to 20 This is a top view. Figure 21 (This is a cross-sectional view) Figure 22 This is a top view schematic diagram of various designs of the transfer substrate of the present invention. It should be noted that the manufacturing method of the present invention is not limited to the following text and the accompanying drawings. In some embodiments, any other suitable steps may be added before or after one of the existing steps of the manufacturing method, and / or some steps may be performed simultaneously or separately. In some embodiments, the process sequence of the manufacturing method may be changed as needed. It should be noted that the manufacturing method of the present invention can manufacture multiple electronic devices (EDs).

[0106] In the following manufacturing methods, the formation process of the film and / or structure may include, for example, atomic layer deposition (ALD), chemical vapor deposition (CVD), physical vapor deposition (PVD), coating processes, other suitable processes, or combinations thereof. In the following manufacturing methods, the patterning process may include, for example, photolithography, etching processes, any other suitable processes, or combinations thereof, wherein the etching process may be a wet etching process, a dry etching process, any other suitable etching process, or combinations thereof.

[0107] like Figure 17 and Figure 18 As shown, in step ST1 of the method for manufacturing an electronic device ED, a carrier substrate CSB is provided, and a flexible substrate 110 is formed on the carrier substrate CSB (i.e., a flexible substrate 110 is provided), wherein the flexible substrate 110 includes a main portion 112 (or a first portion) and a bent portion 114 (or a second portion). In some embodiments, the carrier substrate CSB may be a rigid substrate and may include a corresponding material. For example, the carrier substrate CSB may include glass, quartz, ceramic, sapphire, polymer, other suitable materials, or combinations thereof. For example, the flexible substrate 110 may be formed by a coating process, but is not limited thereto.

[0108] like Figure 17 and Figure 18As shown, in step ST2 of the method for manufacturing an electronic device ED, a circuit layer 130 is formed on a flexible substrate 110 to form electronic components (e.g., switching elements, pads BD, etc.) in the circuit layer 130. Optionally, a pixel definition layer PDL may also be formed on the circuit layer 130. Since the manufacturing method of the present invention can manufacture multiple electronic devices ED, the formation of the circuit layer 130 can define multiple repeating units RU, and the number of repeating units RU is the same as the number of electronic devices ED to be manufactured.

[0109] like Figure 17 and Figure 18 As shown, in step ST3 of the manufacturing method of electronic device ED, the curved portion 114 of flexible substrate 110 is patterned by a patterning process to form a plurality of trenches TL, wherein the trenches TL may be located within the repeating unit RU, the trenches TL penetrate the flexible substrate 110, and correspond to the first substrate opening OPS1 and / or the second substrate opening OPS2 located in the curved portion 114 of the flexible substrate 110.

[0110] like Figure 17 and Figure 19 As shown, in step ST4 of the method for manufacturing an electronic device ED, a plurality of electronic units 120 are transferred to the pads BD of the circuit layer 130 by a transfer process, and the electronic units 120 are bonded to the pads BD (i.e., the transfer process includes a bonding process), wherein the number of electronic units 120 transferred by the transfer process and the type of transfer process can be designed according to requirements. In some embodiments, a single transfer process can transfer multiple electronic units 120. For example, in Figure 17 In this process, the step of patterning the bent portion 114 of the flexible substrate 110 can be performed before the step of transferring the electronic unit 120, but is not limited thereto. For example, the transfer process can be a fluid transfer process. For example, the transfer process can be a stamp transfer process, but is not limited thereto. For example, the transfer process can be a laser transfer process, in which a laser beam is used as the energy required for the transfer process (e.g., the electronic unit 120 to be transferred is transferred to the pad BD of the circuit layer 130 after being irradiated by the laser beam), but is not limited thereto.

[0111] In some embodiments (such as) Figure 19 and Figure 22As shown), multiple main electronic units 122 (or first electronic units) on the first transfer substrate TSB1 can be transferred to the main contact pads BDm of the circuit layer 130 through at least one first transfer process TRP1, and multiple curved electronic units 124 (or second electronic units) on the second transfer substrate TSB2 can be transferred to the curved contact pads BDb of the circuit layer 130 through at least one second transfer process TRP2. Figure 19 In this diagram, four regions RT represent the bent portion 114 after the completion of the second transfer process TRP2. That is, the main electronic unit 122 and the bent electronic unit 124 can be transferred to the pads BD of the circuit layer 130 through different transfer processes. For example (e.g.) Figure 19 As shown), the first transfer process TRP1 is performed before the second transfer process TRP2 (that is, the step of transferring the main part electronic unit 122 is performed before the step of transferring the curved part electronic unit 124), but is not limited thereto.

[0112] In this invention, the number of main electronic units 122 transferred in a first transfer process TRP1 and the number of curved electronic units 124 transferred in a second transfer process TRP2 can be designed according to requirements. Figure 22 In this process, a first transfer process TRP1 can transfer multiple main electronic units 122 included in transfer unit TU1 (i.e., the number of main electronic units 122 transferred in the first transfer process TRP1 can be the same as the number of main electronic units 122 included in transfer unit TU1), and a second transfer process TRP2 can transfer multiple curved electronic units 124 included in transfer unit TU2 (i.e., the number of curved electronic units 124 transferred in the second transfer process TRP2 can be the same as the number of curved electronic units 124 included in transfer unit TU2). In some embodiments, the number of main electronic units 122 transferred by the first transfer process TRP1 may be different from the number of curved electronic units 124 transferred by the second transfer process TRP2. For example (e.g.) Figure 22 As shown, the number of main electronic units 122 transferred in one first transfer process TRP1 (e.g., 18 main electronic units 122) can be greater than the number of curved electronic units 124 transferred in one second transfer process TRP2 (e.g., 6 curved electronic units 124), but is not limited thereto. It should be noted that since the electronic device ED bends and / or stretches the curved portion 114 of the flexible substrate 110, the density of curved electronic units 124 on the curved portion 114 of the flexible substrate 110 can be different from (e.g., lower than) the density of curved electronic units 124 on the second transfer substrate TSB2.

[0113] In addition, when there is a rotational relationship between the main part pad BDm and the curved part pad BDb (e.g.) Figure 2 In the illustrated embodiment, the main electronic unit 122 and the curved electronic unit 124 should have a rotational relationship, so that the second transfer process TRP2 needs to take this rotational relationship into account when transferring the curved electronic unit 124. For example, some process devices in the second transfer process TRP2 need to be rotated relative to the first transfer process TRP1 to ensure the required rotational relationship between the main electronic unit 122 and the curved electronic unit 124.

[0114] exist Figure 22 In this process, the arrangement of the electronic units 120 on the transfer substrate can be designed according to requirements. For example (e.g., Figure 22 The structure of the first transfer substrate TSB1 and the second transfer substrate TSB2 (TD1) allows the density of the main electronic units 122 on the first transfer substrate TSB1 to be different from (e.g., greater than) the density of the curved electronic units 124 on the second transfer substrate TSB2. In this case, a first transfer process TRP1 can directly transfer all the main electronic units 122 in a region, and a second transfer process TRP2 can directly transfer all the curved electronic units 124 in a region, but this is not a limitation. For example (e.g., Figure 22 The structure of the first transfer substrate TSB1 and the second transfer substrate TSB2 (TD2) is such that the density of the main part electronic units 122 on the first transfer substrate TSB1 can be the same as the density of the curved part electronic units 124 on the second transfer substrate TSB2. In this case, a first transfer process TRP1 can directly transfer all the main part electronic units 122 in a region, and a second transfer process TRP2 can transfer several non-adjacent curved part electronic units 124, but is not limited thereto.

[0115] like Figure 17 and Figure 20 As shown, in step ST5 of the manufacturing method of the electronic device ED, the flexible substrate 110 is cut by a cutting process CP, wherein the cutting process CP can cut along the edge of the repeating unit RU. Figure 20 The cutting path (represented by thick lines) enables subsequent processes to separate repeating units RU. In this invention, the cutting process CP can be performed in any suitable manner.

[0116] Furthermore, some substrate openings of the flexible substrate 110 can also be selectively cut using this cutting process CP. For example, the first substrate opening OPS1 of the flexible substrate 110 can be selectively cut using this cutting process CP, but is not limited thereto.

[0117] like Figure 17, Figure 20 and Figure 21 As shown, in step ST6 of the method for manufacturing an electronic device ED, the bent portion 114 of the flexible substrate 110 is bent relative to the main portion 112 of the flexible substrate 110 so that the flexible substrate 110 (i.e., the electronic device ED) achieves the desired shape.

[0118] like Figure 17 and Figure 20 As shown, step ST6 further includes removing the carrier substrate CSB in step ST6a. In some embodiments, the flexible substrate 110 can be separated (e.g., peeled) from the carrier substrate CSB by a separation process. That is, the repeating unit RU is separated from the carrier substrate CSB according to the cut path created by the cutting process CP. In this invention, the separation process can be performed in any suitable manner. It should be noted that after removing the carrier substrate CSB, since the groove TL in the bent portion 114 penetrates the flexible substrate 110, the groove TL will form a first substrate opening OPS1 and / or a second substrate opening OPS2.

[0119] like Figure 17 , Figure 20 and Figure 21 As shown, step ST6 further includes step ST6b, in which the lower substrate BSB is attached to the first side of the flexible substrate 110 away from the circuit layer 130 (i.e., the flexible substrate 110 is between the lower substrate BSB and the circuit layer 130), wherein the rigidity of the lower substrate BSB may be greater than the rigidity of the flexible substrate 110, so that the lower substrate BSB can provide a supporting effect for the flexible substrate 110 and provide higher mechanical strength. In some embodiments, although the rigidity of the lower substrate BSB may be greater than the rigidity of the flexible substrate 110, the lower substrate BSB may still be flexible. For example, the lower substrate BSB may include a flexible material, such as a polymer (e.g., polyimide (PI), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA)), other suitable flexible materials, or combinations thereof.

[0120] like Figure 17 and Figure 21As shown, step ST6 further includes step ST6c, where the second side of the flexible substrate 110, relative to the first side, is attached to the curved cover CV (i.e., the flexible substrate 110 is between the lower substrate BSB and the curved cover CV). In some embodiments, the shape of the curved cover CV may correspond to the shape required by the electronic device ED. Therefore, after the flexible substrate 110 is attached to the curved cover CV, the curved portion 114 of the flexible substrate 110 is appropriately bent and / or stretched based on the shape of the curved cover CV, so that the flexible substrate 110 (i.e., the electronic device ED) achieves the required shape, and the manufacturing of the electronic device ED is completed. For example, the curved cover CV may include any suitable rigid material. Therefore, the curved portion 114 of the flexible substrate 110 can be appropriately bent and / or stretched based on the shape of the curved cover CV, and the curved cover CV can protect the flexible substrate 110 and the structure located between the curved cover CV and the flexible substrate 110, but is not limited thereto.

[0121] Figure 23 This is a top view schematic diagram of an electronic device according to the thirteenth embodiment of the present invention. Figure 23 As shown, the difference between this embodiment and the first embodiment lies in the design of the main electronic unit 122 of the electronic device ED13. Figure 23 In this embodiment, the main electronic unit 122 can be an electronic component disposed on the flexible substrate 110 without a transfer process (bonding process). For example, the main electronic unit 122 can be an organic light-emitting diode, and the main electronic unit 122 can be formed by a deposition process (e.g., evaporation process), but is not limited thereto. Therefore, the formation method (e.g., deposition process) of the main electronic unit 122 can be different from the formation method (e.g., transfer process) of the curved portion electronic unit 124. In some embodiments, the main electronic unit 122 can be formed in the step of forming the circuit layer 130 (i.e., Figure 17 It is formed in step ST2), but not limited to this.

[0122] Accordingly, in this embodiment, the pads BD of the circuit layer 130 may include bent portion pads BDb but not main portion pads, and may optionally include second redundant pads BDr2.

[0123] In summary, in the electronic device of the present invention, the detachment and / or damage of the bending electronic unit is reduced by the appropriate design of the pads located on the bending portion of the flexible substrate and the bending electronic unit, thereby improving the reliability of the electronic device.

[0124] While embodiments and advantages of the present invention have been provided above, it should be understood that any person skilled in the art can make modifications, substitutions, and refinements without departing from the spirit and scope of the invention. Furthermore, the scope of protection of the present invention is not limited to the processes, machines, manufacturing, material composition, apparatus, methods, and steps described in the specific embodiments of the specification. Any process, machine, manufacturing, material composition, apparatus, method, and step developed in the present invention can be understood from the disclosure of the present invention, whether currently developed or in the future, and can be used according to the present invention as long as substantially the same function can be implemented or substantially the same result can be obtained in the embodiments described herein. Therefore, the scope of protection of the present invention includes the aforementioned processes, machines, manufacturing, material composition, apparatus, methods, and steps. In addition, each claim constitutes an individual embodiment, and the scope of protection of the present invention also includes combinations of the various claims and embodiments. The scope of protection of the present invention shall be determined by the appended claims.

[0125] The above description is merely an embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention can have various modifications and variations. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An electronic device, characterized in that, include: A flexible substrate includes a main portion and a curved portion, the curved portion being connected to the main portion; A circuit layer is disposed on the flexible substrate and includes a first pad and a second pad, the first pad being disposed on the main portion and the second pad being disposed on the curved portion; A first electronic unit is attached to the first pad; as well as A second electronic unit is attached to the second pad; The area of ​​the second pad is different from the area of ​​the first pad.

2. The electronic device as claimed in claim 1, characterized in that, The ratio of the area of ​​the first pad to the area of ​​the second pad is not equal to 1.

3. The electronic device as claimed in claim 1, characterized in that, The circuit layer further includes a first circuit and a second circuit, wherein the first circuit is electrically connected to the first pad and the second circuit is electrically connected to the second pad.

4. The electronic device as claimed in claim 3, characterized in that, It also includes a first redundant pad and a second redundant pad, the first redundant pad being disposed on the main portion and electrically connected to the first circuit, the second redundant pad being disposed on the curved portion and electrically connected to the second circuit, wherein the area of ​​the second redundant pad is different from the area of ​​the first redundant pad.

5. The electronic device as claimed in claim 3, characterized in that, It also includes at least one first redundant pad and at least two second redundant pads, wherein the at least one first redundant pad is disposed on the main portion and electrically connected to the first circuit, and the at least two second redundant pads are disposed on the curved portion and electrically connected to the second circuit, wherein the number of the at least two second redundant pads is greater than the number of the at least one first redundant pad.

6. The electronic device as claimed in claim 1, characterized in that, The curved portion includes a corner area, on which the second pad is disposed.

7. The electronic device as claimed in claim 1, characterized in that, The second pad includes multiple openings.

8. The electronic device as claimed in claim 1, characterized in that, The area of ​​the second electronic unit is different from the area of ​​the first electronic unit.

9. An electronic device, characterized in that, include: A flexible substrate includes a main portion and a curved portion, the curved portion being connected to the main portion; A circuit layer is disposed on the flexible substrate and includes a first pad, a second pad, a third pad, a fourth pad, a fifth pad, a sixth pad, a seventh pad, and an eighth pad, wherein the first pad, the second pad, the third pad, and the fourth pad are disposed on the main portion, and the fifth pad, the sixth pad, the seventh pad, and the eighth pad are disposed on the curved portion; A first electronic unit is coupled to the first pad and the second pad; A second electronic unit is coupled to the third pad and the fourth pad; A third electronic unit is coupled to the fifth pad and the sixth pad; as well as A fourth electronic unit is attached to the seventh pad and the eighth pad; A first axis passes through a first center of the first and second pads and a second center of the third and fourth pads, and a second axis passes through a third center of the fifth and sixth pads and a fourth center of the seventh and eighth pads. The first axis is not parallel to the second axis.

10. The electronic device as claimed in claim 9, characterized in that, The angle between the first axis and the second axis is greater than or equal to 5 degrees and less than or equal to 90 degrees.

11. The electronic device as claimed in claim 9, characterized in that, The area of ​​the third electronic unit is different from the area of ​​the first electronic unit.

12. The electronic device as claimed in claim 9, characterized in that, Each of the fifth, sixth, seventh, and eighth pads includes multiple openings.

13. The electronic device as claimed in claim 9, characterized in that, A third axis passes through the center of the first pad and the center of the second pad, and a fourth axis passes through the center of the fifth pad and the center of the sixth pad, with the third axis being parallel to the fourth axis.

14. The electronic device as claimed in claim 9, characterized in that, The distance between the first pad and the second pad is different from the distance between the fifth pad and the sixth pad.

15. The electronic device as claimed in claim 9, characterized in that, The distance between the fifth and sixth pads is different from the distance between the seventh and eighth pads.

16. A method for manufacturing an electronic device, characterized in that, Includes the following steps: A flexible substrate is provided, wherein the flexible substrate includes a first portion and a second portion; A circuit layer is formed on the flexible substrate, wherein the circuit layer includes a plurality of first pads and a plurality of second pads, the plurality of first pads being disposed on the first portion and the plurality of second pads being disposed on the second portion; The second part is patterned to form multiple grooves; A plurality of first electronic units are transferred to the plurality of first pads through at least one first transfer process; A plurality of second electronic units are transferred to the plurality of second pads through at least one second transfer process; as well as The second part is bent relative to the first part; The number of the first electronic units transferred in one of the at least one first transfer processes is different from the number of the second electronic units transferred in one of the at least one second transfer processes.

17. The manufacturing method as described in claim 16, characterized in that, The step of transferring the plurality of first electronic units is performed before the step of transferring the plurality of second electronic units.

18. The manufacturing method as described in claim 16, characterized in that, The step of patterning the second part is performed before the step of transferring the plurality of first electronic units.

19. The manufacturing method as described in claim 16, characterized in that, The step of providing the flexible substrate includes: Provide a carrier substrate; and The flexible substrate is formed on the carrier substrate.

20. The manufacturing method as described in claim 19, characterized in that, The steps for bending the second part include: Remove the carrier substrate; The following substrate is attached to a first side of the flexible substrate away from the circuit layer; and A second side of the flexible substrate is attached to a curved cover, wherein the second side is relative to the first side.

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