Light-emitting assembly, preparation method thereof and display substrate

Abstract

The invention discloses a light-emitting assembly, a preparation method thereof and a display substrate, and relates to the technical field of display. The light-emitting assembly comprises a first substrate, a color conversion unit and a first light-emitting unit. The color conversion unit comprises the color conversion part and the dielectric film layer, the color conversion part is arranged to convert the light, and the stability of the light-emitting peak position of the light converted by the color conversion part is high, so that when the light-emitting assembly is applied to the display substrate, it can be guaranteed that the difference of the light-emitting peak position of the light-emitting assembly in the display substrate is small, and the display uniformity of the display substrate is improved. Moreover, the groove is formed in the first substrate, and the dielectric film layer is arranged on the side, close to the first substrate, of the color conversion part, so that light of the second color can selectively penetrate through the dielectric film layer, the light of the first color which is not converted by the color conversion part is reflected, and the light of the first color is absorbed and excited by the color conversion part again. Therefore, the thickness of the color conversion part can be reduced, the material consumption of the color conversion part is reduced, and the cost is saved.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a light-emitting component, its preparation method, and a display substrate. Background Technology

[0002] The display substrate includes a driving backplane and multiple light-emitting components connected to the driving backplane. The driving backplane can provide driving signals to the light-emitting components so that the light-emitting components emit light, thereby realizing the display.

[0003] In some embodiments, the emission peak positions of the multiple light-emitting components included in the display substrate differ significantly, resulting in poor display uniformity of the display substrate. Summary of the Invention

[0004] This application provides a light-emitting component and its fabrication method, as well as a display substrate, which can solve the problem of poor display uniformity of the display substrate. The technical solution is as follows:

[0005] On one hand, a light-emitting component is provided, the light-emitting component comprising:

[0006] A first substrate, wherein a groove is formed on a first surface of the first substrate;

[0007] A color conversion unit, comprising a dielectric film layer and a color conversion part, wherein the dielectric film layer is located on the side of the first substrate having the groove, and at least a portion of the dielectric film layer is bent toward the side of the first substrate, the dielectric film layer is used to reflect light of a first color and transmit light of a second color, wherein the wavelength of light corresponding to the first color is less than the wavelength of light corresponding to the second color.

[0008] The color transfer portion is located on the side of the dielectric film layer away from the first substrate, and the orthographic projection of the color transfer portion on the reference plane and the orthographic projection of the groove on the reference plane overlap. The reference plane is parallel to the second surface of the first substrate, and the second surface and the first surface are two opposite surfaces of the first substrate.

[0009] And a first light-emitting unit, the first light-emitting unit being located on the side of the color-converting unit away from the first substrate, the first light-emitting unit being used to emit light of the first color, and the color-converting unit being used to convert at least a portion of the light of the first color emitted by the first light-emitting unit into light of the second color.

[0010] Optionally, the orthographic projection of the color transfer portion on the reference plane is located within the orthographic projection of the groove on the reference plane, and the area of ​​the orthographic projection of the color transfer portion on the reference plane is smaller than the area of ​​the orthographic projection of the groove on the reference plane.

[0011] Optionally, the surface of the groove is an inwardly concave arc surface relative to the first surface of the first substrate;

[0012] At least a portion of the two side surfaces of the dielectric film layer are concave arc surfaces relative to the first surface of the first substrate.

[0013] Optionally, the dielectric film layer includes a first dielectric layer and a second dielectric layer stacked and alternately arranged, wherein the first dielectric layer and the second dielectric layer have different refractive indices.

[0014] Optionally, the dielectric film layer has a DBR structure.

[0015] Optionally, the dielectric film layer is a long-pass filter layer;

[0016] In the visible light band, the dielectric film reflects blue light and transmits red and green light.

[0017] Optionally, the light-emitting component further includes: a second light-emitting unit, wherein the second light-emitting unit and the first light-emitting unit are spaced apart;

[0018] The second light-emitting unit is used to emit light of the first color. The orthographic projection of the dielectric film layer on the reference plane and the orthographic projection of the light-emitting area of ​​the second light-emitting unit on the reference plane have a non-overlapping area. The light of the first color emitted by the second light-emitting unit is emitted through the non-overlapping area.

[0019] Optionally, the orthographic projection of the light-emitting area of ​​the second light-emitting unit onto the reference plane and the orthographic projection of the groove onto the reference plane do not overlap.

[0020] Optionally, the color conversion unit further includes:

[0021] A limiting dam defines a first accommodating space and a second accommodating space. The first accommodating space corresponds to the luminous area of ​​the first luminous unit, and the second accommodating space corresponds to the luminous area of ​​the second luminous unit. The color conversion part is located within the first accommodating space.

[0022] A transparent portion, which is located within the second accommodating space;

[0023] A light-shielding layer is located on the side of the limiting dam close to the first substrate. The light-shielding layer forms a third accommodating space and a fourth accommodating space. The third accommodating space is correspondingly arranged to the first accommodating space, and the fourth accommodating space is correspondingly arranged to the second accommodating space.

[0024] A first filter portion is located within the fourth accommodating space and is used to transmit light after it has passed through the transparent portion.

[0025] Optionally, the color conversion unit further includes: a first encapsulation layer and a second encapsulation layer;

[0026] The first encapsulation layer is located between the first filter and the light-shielding layer, or,

[0027] The first encapsulation layer is located between the first substrate and the light-shielding layer, and also between the first substrate and the first light-filtering portion, or...

[0028] The first encapsulation layer is located between the first filter portion and the dielectric film layer, or,

[0029] The first encapsulation layer is located between the dielectric film layer and the defining dam, between the dielectric film layer and the color transfer portion, and between the dielectric film layer and the transparent portion;

[0030] The second encapsulation layer is located on the side of the defined dam, the color-transfer portion, and the transparent portion away from the first substrate.

[0031] Optionally, the color conversion unit further includes a second filter, which is located within the third accommodating space, and is used to transmit light after its color has been converted by the color conversion unit.

[0032] Optionally, the color conversion unit further includes: a first encapsulation layer and a second encapsulation layer;

[0033] The first encapsulation layer is located between the second filter portion and the light-shielding layer, and is also located between the first filter portion and the light-shielding layer, or...

[0034] The first encapsulation layer is located between the first substrate and the light-shielding layer, and also between the first substrate and the second light-filtering portion, or between the first substrate and the first light-filtering portion, or...

[0035] The first encapsulation layer is located between the second filter portion and the dielectric film layer, and also between the first filter portion and the dielectric film layer, or...

[0036] The first encapsulation layer is located between the dielectric film layer and the defining dam, between the dielectric film layer and the color transfer portion, and between the dielectric film layer and the transparent portion;

[0037] The second encapsulation layer is located on the side of the defined dam, the color-transfer portion, and the transparent portion away from the first substrate.

[0038] Optionally, at least a portion of the dielectric film layer is located inside the groove.

[0039] Optionally, the first color is blue, and the second color is green or red;

[0040] The light-emitting component includes two first light-emitting units and one second light-emitting unit; the groove includes a first sub-groove and a second sub-groove arranged at intervals.

[0041] The defined dam has two first accommodating spaces. The color conversion part includes a first sub-color conversion part corresponding to one of the two first light-emitting units and a second sub-color conversion part corresponding to the other of the two first light-emitting units. The first sub-color conversion part is located in one of the two first accommodating spaces and is used to convert at least a portion of the blue light emitted by one of the first light-emitting units into green light. The orthographic projection of the first sub-color conversion part on the reference plane and the orthographic projection of the first sub-groove on the reference plane overlap. The second sub-color conversion part is located in the other of the two first accommodating spaces and is used to convert at least a portion of the blue light emitted by the other first light-emitting unit into red light. The orthographic projection of the second sub-color conversion part on the reference plane and the orthographic projection of the second sub-groove on the reference plane overlap.

[0042] The light-shielding layer has two third accommodating spaces. The second filter includes a first sub-filter corresponding to the first sub-color conversion part and a second sub-filter corresponding to the second sub-color conversion part. The first sub-filter is located in one of the two third accommodating spaces and is used to transmit green light converted by the first sub-color conversion part. The second sub-filter is located in the other of the two third accommodating spaces and is used to transmit red light converted by the second sub-color conversion part.

[0043] Optionally, the first filter is a blue filter, and both the first sub-filter and the second sub-filter are yellow filters; or,

[0044] The first filter is a blue filter, the first sub-filter is a green filter, and the second sub-filter is a red filter.

[0045] Optionally, the light-emitting component has two first light-emitting units and one second light-emitting unit, wherein one of the two first light-emitting units is a red light-emitting unit and the other is a green light-emitting unit, and the second light-emitting unit is a blue light-emitting unit;

[0046] The area of ​​the first sub-light-emitting functional layer of the green light-emitting unit projected onto the reference plane is larger than the area of ​​the second sub-light-emitting functional layer of the red light-emitting unit projected onto the reference plane.

[0047] The area of ​​the second sub-light-emitting functional layer of the red light-emitting unit projected onto the reference plane is greater than the area of ​​the third sub-light-emitting functional layer of the blue light-emitting unit projected onto the reference plane.

[0048] On the other hand, a method for fabricating a light-emitting component is provided, the method comprising:

[0049] A first substrate and a color transfer unit located on the first substrate are obtained; a first surface of the first substrate has a groove; the color transfer unit includes a dielectric film layer and a color transfer portion, the dielectric film layer is located on the side of the first substrate with the groove, and at least a portion of the dielectric film layer is bent toward the first substrate; the dielectric film layer is used to reflect light of a first color and transmit light of a second color, the wavelength of the light corresponding to the first color is less than the wavelength of the light corresponding to the second color; the color transfer portion is located on the side of the dielectric film layer away from the first substrate, and the orthographic projection of the color transfer portion on the reference plane and the orthographic projection of the groove on the reference plane overlap; the reference plane is parallel to a second surface of the first substrate, and the second surface and the first surface are two opposite surfaces of the first substrate;

[0050] A second substrate and a first light-emitting unit located on the second substrate are obtained, wherein the first light-emitting unit is used to emit light of the first color;

[0051] The color conversion unit and the first light-emitting unit are aligned and bonded together, such that the first light-emitting unit is located on the side of the color conversion unit away from the first substrate. The color conversion part is used to convert at least a portion of the light of the first color emitted by the first light-emitting unit into light of the second color.

[0052] The second substrate is peeled off from one side of the first light-emitting unit.

[0053] In another aspect, a display substrate is provided, the display substrate comprising: a driving backplate and a plurality of light-emitting components as described above, wherein the light-emitting components are light-emitting chips;

[0054] Multiple light-emitting components are connected to the driving backplane, and an array of multiple light-emitting components is arranged on the driving backplane. The driving backplane provides driving signals to the light-emitting components, and the light-emitting components are used to emit light under the control of the driving signals.

[0055] The beneficial effects of the technical solution provided in this application include at least the following:

[0056] This application provides a light-emitting component and its fabrication method, as well as a display substrate. The light-emitting component includes a first substrate, a color conversion unit, and a first light-emitting unit. The color conversion unit includes a color conversion section and a dielectric film layer. The color conversion section converts light, and the emission peak position of the light converted by the color conversion section is highly stable. Therefore, when the light-emitting component is applied to the display substrate, the difference in emission peak positions of the light-emitting components in the display substrate can be minimized, improving the display uniformity of the display substrate. Furthermore, a dielectric film layer is disposed on the side of the color conversion section near the first substrate, which allows selective transmission of second-color light and reflection of first-color light that has not been converted by the color conversion section, which is then reabsorbed and excited by the color conversion section. This reduces the thickness of the color conversion section, thereby reducing the material usage and saving costs. Simultaneously, grooves are provided on the first substrate, ensuring that light at different angles passes through the dielectric film layer along the same path, guaranteeing that the dielectric film layer performs wavelength selection to the same degree for light at different angles, and improving the reliability of the dielectric film layer's wavelength selection. Attached Figure Description

[0057] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0058] Figure 1 This is a schematic diagram of the structure of a light-emitting component provided in an embodiment of this application;

[0059] Figure 2 This is a schematic diagram of the light emission of a light-emitting component provided in an embodiment of this application;

[0060] Figure 3 This is a schematic diagram of another light-emitting component provided in an embodiment of this application;

[0061] Figure 4 This is a schematic diagram of the structure of another light-emitting component provided in the embodiments of this application;

[0062] Figure 5 This is a schematic diagram of another light-emitting component provided in the embodiments of this application;

[0063] Figure 6 This is a schematic diagram of another light-emitting component provided in the embodiments of this application;

[0064] Figure 7 This is a schematic diagram of another light-emitting component provided in the embodiments of this application;

[0065] Figure 8This is a schematic diagram of another light-emitting component provided in the embodiments of this application;

[0066] Figure 9 This is a schematic diagram of another light-emitting component provided in the embodiments of this application;

[0067] Figure 10 This is a schematic diagram of another light-emitting component provided in the embodiments of this application;

[0068] Figure 11 This is a schematic diagram of another light-emitting component provided in the embodiments of this application;

[0069] Figure 12 This is a schematic diagram of another light-emitting component provided in the embodiments of this application;

[0070] Figure 13 This is a schematic diagram of another light-emitting component provided in the embodiments of this application;

[0071] Figure 14 This is a schematic diagram of another light-emitting component provided in the embodiments of this application;

[0072] Figure 15 This is a top view of a first semiconductor layer provided in an embodiment of this application;

[0073] Figure 16 This is a top view of a first electrode and a second electrode provided in an embodiment of this application;

[0074] Figure 17 This is a flowchart illustrating a method for fabricating a light-emitting component according to an embodiment of this application;

[0075] Figure 18 This is a schematic diagram of the structure of an initial substrate provided in an embodiment of this application;

[0076] Figure 19 This is a schematic diagram of the structure of a first substrate provided in an embodiment of this application;

[0077] Figure 20 This is a schematic diagram of forming a light-shielding layer according to an embodiment of this application;

[0078] Figure 21 This is a schematic diagram of a first filter section and a second filter section provided in an embodiment of this application;

[0079] Figure 22 This is a schematic diagram of forming a first encapsulation layer provided in an embodiment of this application;

[0080] Figure 23 This is a schematic diagram of a dielectric film layer formed according to an embodiment of this application;

[0081] Figure 24 This is a schematic diagram of forming a confined dam according to an embodiment of this application;

[0082] Figure 25 This is a schematic diagram of forming a transparent part according to an embodiment of this application;

[0083] Figure 26 This is a schematic diagram of a color transfer section provided in an embodiment of this application;

[0084] Figure 27 This is a schematic diagram of forming a second encapsulation layer provided in an embodiment of this application;

[0085] Figure 28 This is a schematic diagram of forming a first semiconductor layer, a light-emitting thin film, and a second semiconductor thin film according to an embodiment of this application;

[0086] Figure 29 This is a schematic diagram of forming a light-emitting layer and a second semiconductor layer according to an embodiment of this application;

[0087] Figure 30 This is a schematic diagram of forming a current transport layer and a common electrode according to an embodiment of this application;

[0088] Figure 31 This is a schematic diagram of forming an insulating protective layer according to an embodiment of this application;

[0089] Figure 32 This is a schematic diagram of forming a first electrode and a second electrode according to an embodiment of this application;

[0090] Figure 33 This is a schematic diagram of a bonding second substrate provided in an embodiment of this application;

[0091] Figure 34 This is a schematic diagram of removing a third substrate according to an embodiment of this application;

[0092] Figure 35 This is a schematic diagram of the bonding of a color conversion unit and a light-emitting unit according to an embodiment of this application;

[0093] Figure 36 This is a schematic diagram of removing the second substrate provided in an embodiment of this application;

[0094] Figure 37 This is a schematic diagram of the structure of a display substrate provided in an embodiment of this application. Detailed Implementation

[0095] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0096] Micro light emitting diode (Micro LED) display technology has developed rapidly in recent years, especially its high brightness and high color purity, which are considered to have a significant competitive advantage in products such as large-screen displays, splicing displays and backlights.

[0097] Currently, in the fabrication of this Micro LED display substrate, to achieve color display, the light-emitting components need to be transferred and bonded to the driving backplane. Transfer methods include individual component transfer and batch transfer. To improve transfer accuracy and yield, individual component transfer can be chosen, but the pick-and-place actions are slower, resulting in a slower transfer speed. To increase transfer speed, batch transfer can be chosen, but the yield is lower. Therefore, the choice of transfer process constantly seeks a balance between transfer speed and yield. Furthermore, the Metal-organic Chemical Vapor Deposition (MOCVD) process used in the fabrication of the light-emitting components has uniformity issues during epitaxial growth. Therefore, the emission peak positions of multiple light-emitting components within a single light-emitting component motherboard (typically a 4-inch wafer) exhibit drift problems, for example, a peak position drift range of ±5nm. Consequently, after cutting multiple light-emitting components from the motherboard, these components must be categorized, such as grouping components with roughly the same emission peak position together. In other words, the light-emitting components must be sorted before leaving the factory; otherwise, the emission peak positions of the multiple light-emitting components in the final manufactured display substrate will differ significantly, resulting in poor display uniformity. However, sorting the light-emitting components before they leave the factory adds an extra step, increasing the manufacturing cost.

[0098] Figure 1 This is a schematic diagram of the structure of a light-emitting component provided in an embodiment of this application. (Reference) Figure 1 The light-emitting component 100 includes: a first substrate 101, a color conversion unit 102, and a first light-emitting unit 103.

[0099] refer to Figure 1 The first substrate 101 has a first surface m1 and a second surface m2 facing each other, and the first surface m1 has a groove 101a. The color conversion unit 102 includes a dielectric film layer 1021. The dielectric film layer 1021 is located on the side of the first substrate 101 with the groove 101a, and at least a portion of the dielectric film layer 1021 is bent toward the first substrate 101. The dielectric film layer 1021 is used to reflect light of a first color and transmit light of a second color. The wavelength of light corresponding to the first color is smaller than the wavelength of light corresponding to the second color.

[0100] The bending of at least a portion of the dielectric film layer 1021 toward the first substrate 101 can be used to represent the overlap of the orthographic projection of the dielectric film layer 1021 onto the reference plane C and the orthographic projection of the groove 101a onto the reference plane C. Since the thickness of the portion of the first substrate 101 with the groove 101a is less than the thickness of other portions, the portion of the dielectric film layer 1021 whose orthographic projection onto the first substrate 101 is located at the groove 101a will bend toward the bottom of the groove 101a. The reference plane C is parallel to the second surface m2 of the first substrate 101.

[0101] Furthermore, refer to Figure 1 The color conversion unit 102 further includes a color conversion section 1022. The color conversion section 1022 is located on the side of the dielectric film layer 1021 away from the first substrate 101, and the orthographic projection of the color conversion section 1022 on the reference plane C overlaps with the orthographic projection of the groove 101a on the reference plane C. A first light-emitting unit 103 is located on the side of the color conversion unit 102 away from the first substrate 101. The first light-emitting unit 103 emits light of a first color, and the color conversion section 1022 converts at least a portion of the first-color light emitted by the first light-emitting unit 103 into light of a second color.

[0102] In this embodiment, the color conversion unit 1022 converts the light of the first color emitted by the first light-emitting unit 103, thereby ensuring high stability of the emission peak position of the converted light. Therefore, there is no need to classify the light-emitting components; the light-emitting component 100 can be directly applied to the display substrate. Furthermore, this approach ensures minimal difference in the emission peak positions of the various light-emitting components in the display substrate, effectively improving the display uniformity of the display substrate.

[0103] Typically, the conversion efficiency of the color conversion unit 1022 in converting the first color light emitted by the first light-emitting unit 103 into the second color light is positively correlated with the thickness of the color conversion unit 1022. That is, the thicker the color conversion unit 1022, the higher its light conversion efficiency, and the more second color light emitted by the first light-emitting unit 103 is converted when passing through the color conversion unit 1022; conversely, the thinner the color conversion unit 1022, the lower its light conversion efficiency, and the less second color light emitted by the first light-emitting unit 103 is converted when passing through the color conversion unit 1022.

[0104] To improve the luminous effect of the light-emitting component 100, a thicker color transfer section 1022 is needed to convert the light. However, a thicker color transfer section 1022 results in a higher cost. This embodiment of the application, by providing a dielectric film layer 1021, can improve the efficiency of light conversion while avoiding increased costs.

[0105] Specifically, the dielectric film layer 1021 can select the wavelength of light, enabling it to reflect light of the first color and transmit light of the second color. Therefore, at least a portion of the first-color light emitted by the first light-emitting unit 103 is converted into second-color light by the color conversion unit 1022, allowing the converted second-color light to pass through the dielectric film layer 1021. Furthermore, the first-color light emitted by the first light-emitting unit 103 that is not converted by the color conversion unit 1022 remains the first color. Therefore, the first-color light that is not converted by the color conversion unit 1022 is reflected by the dielectric film layer 1021, and the first-color light reflected by the dielectric film layer 1021 can re-enter the color conversion unit 1022 and be absorbed and converted into second-color light.

[0106] In other words, under the action of the dielectric film layer 1021, the color conversion unit 1022 can convert the light of the first color emitted by the first light-emitting unit 103 multiple times, which can improve the efficiency of the color conversion unit 1022 in converting light, and there is no need to set the thickness of the color conversion unit 1022 to be thick, which can reduce the amount of material used in the color conversion unit 1022 and save costs.

[0107] Furthermore, the selection of light wavelength by the dielectric film 1021 is related to the thickness of the dielectric film 1021. Therefore, by providing a groove 101a on the first surface m1 of the first substrate 101 and bending at least a portion of the dielectric film 1021 toward the first substrate 101, the uniformity of the thickness of the portion of the dielectric film 1021 overlapping with the orthographic projection of the groove 101a can be improved. (Refer to...) Figure 2 This allows light emitted from the color conversion section 1022 to follow the same path as light rays at different angles when passing through the dielectric film layer 1021, ensuring that the cutoff film layer can perform wavelength selection to the same extent for light rays at different angles, thereby improving the reliability of the dielectric film layer 1021 in selecting the wavelength of light.

[0108] In summary, this application provides a light-emitting component, which includes a first substrate, a color conversion unit, and a first light-emitting unit. The color conversion unit includes a color conversion section and a dielectric film layer. The color conversion section converts light, and the emission peak position of the light converted by the color conversion section is highly stable. Therefore, when the light-emitting component is applied to a display substrate, the difference in emission peak positions of the light-emitting components in the display substrate can be minimized, improving the display uniformity of the display substrate. Furthermore, a dielectric film layer is disposed on the side of the color conversion section near the first substrate, which allows selective transmission of second-color light and reflection of first-color light not converted by the color conversion section, which is then reabsorbed and excited by the color conversion section. This reduces the thickness of the color conversion section, thereby reducing the material usage and saving costs. Simultaneously, the grooves provided on the first substrate ensure that light at different angles passes through the dielectric film layer along the same path, guaranteeing that the dielectric film layer performs wavelength selection to the same degree for light at different angles, improving the reliability of the dielectric film layer's wavelength selection.

[0109] In this embodiment, the orthographic projection of the color conversion unit 1022 on the reference plane C is located within the orthographic projection of the groove 101a on the reference plane C, and the area of ​​the orthographic projection of the color conversion unit 1022 on the reference plane C is smaller than the area of ​​the orthographic projection of the groove 101a on the reference plane C. This allows the emitted light from the first light-emitting unit 103 after conversion by the color conversion unit 1022 to exhibit point-emitting characteristics relative to the groove 101a as much as possible. Thus, the light converted by the color conversion unit 1022 can pass through the dielectric film layer 1021 from the point-emitting region at different angles, ensuring that light rays at different angles follow the same path through the dielectric film layer 1021, thereby improving the reliability of the dielectric film layer 1021 in selecting the wavelength of the light.

[0110] refer to Figure 1 As can be seen, the surface of the groove 101a is a concave arc surface relative to the first surface m1 of the first substrate 101. Correspondingly, at least a portion of the two side surfaces of the dielectric film layer 1021 are concave arc surfaces relative to the first surface m1 of the first substrate 101. The dielectric film layer 1021 is formed on the first surface m1 of the first substrate 101, and the groove 101a causes at least a portion of the two side surfaces of the dielectric film layer 1021 to be concave arc surfaces relative to the first surface m1 of the first substrate 101.

[0111] Optionally, the dielectric film layer 1021 may include a first dielectric layer and a second dielectric layer stacked and alternately arranged, wherein the first dielectric layer and the second dielectric layer have different refractive indices. For example, the difference in refractive indices between the first dielectric layer and the second dielectric layer ranges from 0.7 to 1.

[0112] Optionally, the material of one of the first dielectric layer and the second dielectric layer may include silicon oxide (SiOx), and the material of the other dielectric layer may include niobium pentoxide (Nb2O5).

[0113] Optionally, the dielectric film 1021 can be a distributed Bragg reflector (DBR) structure. A DBR structure can be obtained by periodically stacking films with different refractive indices. By designing and controlling the thickness of each layer, the reflected light between the layers can interfere multiple times, creating a characteristic that filters specific wavelengths.

[0114] Optionally, the dielectric film 1021 can be a long-pass filter layer. In the visible light band, the dielectric film 1021 reflects blue light and transmits red and green light. That is, the first color can be blue, and the second color can be red or green.

[0115] Figure 3 This is a schematic diagram of another light-emitting component provided in an embodiment of this application. (Reference) Figure 3 The light-emitting component 100 further includes a second light-emitting unit 104. The second light-emitting unit 104 and the first light-emitting unit 103 are disposed at a distance. The second light-emitting unit 104 is used to emit light of a first color, and the orthographic projection of the dielectric film layer 1021 on the reference plane C and the orthographic projection of the light-emitting area of ​​the second light-emitting unit 104 on the reference plane C have a non-overlapping region. The first-color light emitted by the second light-emitting unit 104 exits through the non-overlapping region.

[0116] In this design, the light of the first color emitted by the second light-emitting unit 104 does not need to be converted by the color conversion unit 1022. Therefore, if the dielectric film layer 1021 covers the light-emitting area of ​​the second light-emitting unit 104, the light of the first color emitted by the second light-emitting unit 104 will be reflected by the dielectric film layer 1021 and cannot be emitted. Therefore, in order to avoid the dielectric film layer 1021 affecting the light emission of the second light-emitting unit 104, the light-emitting areas of the dielectric film layer 1021 and the second light-emitting unit 104 can have non-overlapping areas, so that the light of the first color emitted by the first light-emitting unit 103 can be emitted through the non-overlapping areas.

[0117] Optionally, if the dielectric film layer 1021 is a continuous film layer, the existence of non-overlapping areas between the dielectric film layer 1021 and the light-emitting area of ​​the second light-emitting unit 104 can mean that the dielectric film layer 1021 has an opening, and the orthographic projection of the opening on the reference plane C covers the orthographic projection of the light-emitting area of ​​the second light-emitting unit 104 on the reference plane C, and the light of the first color emitted by the second light-emitting unit 104 can be emitted through the opening.

[0118] In this embodiment, since the viewing angle dependence of the dielectric film layer may cause color shift, and the orthographic projection of the first light-emitting unit 103 on the first substrate 101 and the orthographic projection of the dielectric film layer 1021 on the first substrate 101 overlap, a groove can be provided in the first substrate 101 at the location of the first light-emitting unit 103 to change the light emission morphology. For the second light-emitting unit 104, since the light-emitting areas of the dielectric film layer 1021 and the second light-emitting unit 104 do not overlap, the dielectric film layer 1021 does not require color filtering of the light emitted by the second light-emitting unit 104, and correspondingly, a groove does not need to be provided in the first substrate 101 at the location of the second light-emitting unit 104.

[0119] That is, reference Figure 3 It can be seen that the orthographic projection of the light-emitting area of ​​the second light-emitting unit 104 onto the reference plane C and the orthographic projection of the groove 101a onto the reference plane C do not overlap. In this case, the strength of the first substrate 101 can be avoided due to too many grooves. Alternatively, the orthographic projection of the light-emitting area of ​​the second light-emitting unit 104 onto the reference plane C and the orthographic projection of the groove 101a onto the reference plane C can overlap. This application embodiment does not specifically limit whether a groove is provided in the first substrate 101 at the location of the second light-emitting unit 104.

[0120] In the embodiments of this application, reference is made to Figure 3 The color conversion unit 102 also includes: a limiting dam 1023, a transparent part 1024, a light-shielding layer 1025, a first light-filtering part 1026, and a second light-filtering part 1027.

[0121] The limiting dam 1023 defines a first accommodating space 1023a and a second accommodating space 1023b. The first accommodating space 1023a corresponds to the light-emitting area of ​​the first light-emitting unit 103, and the second accommodating space 1023b corresponds to the light-emitting area of ​​the second light-emitting unit 104. The first accommodating space 1023a corresponding to the light-emitting area of ​​the first light-emitting unit 103 can mean that the light-emitting area of ​​the first light-emitting unit 103 is exposed in the first accommodating space 1023a. The second accommodating space 1023b corresponding to the light-emitting area of ​​the second light-emitting unit 104 can mean that the light-emitting area of ​​the second light-emitting unit 104 is exposed in the second accommodating space 1023b. Optionally, the limiting dam 1023 can be made of resin or photoresist, and its thickness can range from 3 μm to 10 μm.

[0122] Furthermore, the color conversion unit 102 includes a color conversion section 1022 which can be located within the first receiving space 1023a, allowing the first color light emitted by the first light-emitting unit 103 to pass through the color conversion section 1022 and be converted into second color light. The color conversion unit 102 also includes a transparent section 1024 which can be located within the second receiving space 1023b, allowing the first color light emitted by the second light-emitting unit 104 to pass through the transparent section 1024 and then be emitted.

[0123] Optionally, the material of the transparent portion 1024 may include transparent optical adhesive (OC). Additionally, the transparent portion 1024 also includes scattering particles that scatter light. When the blue light emitted from the third sub-light-emitting functional layer Fa3 strikes the transparent portion 1024, the scattering particles scatter the blue light, ensuring a large emission angle and thus a large viewing angle for the display substrate integrating the light-emitting component 100. Optionally, the scattering particles may be at least one of titanium oxide (TiO2) and zinc oxide (ZnO).

[0124] A light-shielding layer 1025 is located on the side of the limiting dam 1023 near the first substrate 101, and the light-shielding layer 1025 constitutes a third receiving space 1025a and a fourth receiving space 1025b. The third receiving space 1025a and the first receiving space 1023a are correspondingly arranged, and the fourth receiving space 1025b and the second receiving space 1023b are correspondingly arranged. The corresponding arrangement of the third receiving space 1025a and the first receiving space 1023a can mean that the orthographic projections of the third receiving space 1025a and the first receiving space 1023a on the reference plane C overlap. The corresponding arrangement of the fourth receiving space 1025b and the second receiving space 1023b can mean that the orthographic projections of the fourth receiving space 1025b and the second receiving space 1023b on the reference plane C overlap.

[0125] The second filter section 1027 may be located within the third receiving space 1025a. The second filter section 1027 is used to transmit light after its color has been converted by the color conversion section 1022. The first filter section 1026 is located within the fourth receiving space 1025b. The first filter section 1026 is used to transmit light after its color has been converted by the transparent section 1024.

[0126] In this embodiment, the first color can be blue, and the second color can be green or red. The light-emitting component may include two first light-emitting units 103 and one second light-emitting unit 104. For example, the blue light emitted by one of the two first light-emitting units 103 is converted into red light after passing through the color conversion section 1022; this first light-emitting unit 103a can be simply referred to as the red light-emitting unit. The blue light emitted by the other of the two first light-emitting units 103 is converted into green light after passing through the color conversion section 1022; this other first light-emitting unit 103b can be simply referred to as the green light-emitting unit. The blue light emitted by the second light-emitting unit 104 can be transmitted through the transparent section 1024; the second light-emitting unit 104 can be simply referred to as the blue light-emitting unit.

[0127] Optionally, the groove 101a may include a first sub-groove 101a1 and a second sub-groove 101a2 spaced apart. For example, the orthographic projection of the luminous area of ​​the red luminous unit onto the reference plane C overlaps with the orthographic projection of the first sub-groove 101a1 onto the reference plane C, and the orthographic projection of the luminous area of ​​the green luminous unit onto the reference plane C overlaps with the orthographic projection of the second sub-groove 101a2 onto the reference plane C.

[0128] Correspondingly, the portion of the dielectric film 1021 at the first sub-groove 101a1 bends towards the bottom of the first sub-groove 101a1, and the portion of the dielectric film 1021 at the second sub-groove 101a2 bends towards the bottom of the second sub-groove 101a2. In this way, for both the green and red light-emitting units, the light emitted by the light-emitting units can be matched with the film thickness of the dielectric film 1021, improving the reliability of the dielectric film 1021 in selecting the wavelength of light.

[0129] refer to Figure 3 The dam 1023 is defined to have two first accommodating spaces 1023a. The color-transfer unit 1022 includes a first sub-color-transfer unit 1022a corresponding to one of the two first light-emitting units 103a, and a second sub-color-transfer unit 1022b corresponding to the other of the two first light-emitting units 103b. Optionally, the first sub-color-transfer unit 1022a can be a red color-transfer unit, for example, the first sub-color-transfer unit 1022a may include red quantum dots. The second sub-color-transfer unit 1022b can be a green color-transfer unit, for example, the second sub-color-transfer unit 1022b may include green quantum dots.

[0130] The first sub-color conversion unit 1022a is located in one of the two first receiving spaces 1023a1, and is used to convert at least a portion of the blue light emitted by one of the first light-emitting units 103a into red light. The orthographic projection of the first sub-color conversion unit 1022a on the reference plane C overlaps with the orthographic projection of the first sub-groove 101a1 on the reference plane C.

[0131] The second sub-color conversion unit 1022b is located in the other first receiving space 1023a2 of the two first receiving spaces 1023a, and is used to convert at least a portion of the blue light emitted by the other first light-emitting unit 103b into green light. The orthographic projection of the second sub-color conversion unit 1022b on the reference plane C overlaps with the orthographic projection of the second sub-groove 101a2 on the reference plane C.

[0132] The light-shielding layer 1025 has two third receiving spaces 1025a. The second filter section 1027 includes a first sub-filter section 1027a corresponding to the first sub-color conversion section 1022a, and a second sub-filter section 1027b corresponding to the second sub-color conversion section 1022b. The first sub-filter section 1027a can be located in one of the two third receiving spaces 1025a1, so that the positions of the first sub-filter section 1027a and the first sub-color conversion section 1022a correspond. The first sub-filter section 1027a is used to transmit red light converted by the first sub-color conversion section 1022a. The second sub-filter 1027b can be located within another third accommodating space 1025a2 of the two third accommodating spaces 1025a, such that the positions of the second sub-filter 1027b and the second sub-color conversion section 1022b correspond. The second sub-filter 1027b is used to transmit green light converted by the second sub-color conversion section 1022b. Optionally, the light-shielding layer 1025 can be a black matrix layer.

[0133] In this embodiment, the first filter 1026 can be a blue filter, such as a blue color block. The blue light emitted by the second light-emitting unit 104 can be emitted from the blue filter after passing through the transparent part 1024.

[0134] refer to Figure 4 Both the first sub-filter 1027a and the second sub-filter 1027b are yellow filters, such as yellow color resists. The blue light emitted by the first light-emitting unit 103 is converted to red light by the first sub-color converter 1022a and can then exit from the yellow filter. The blue light emitted by the first light-emitting unit 103 is converted to green light by the second sub-color converter 1022b and can then exit from the yellow filter.

[0135] Or, refer to Figure 3The first sub-filter 1027a can be a red filter, such as a red color resist. Blue light emitted from the first light-emitting unit 103 is converted to red light by the first sub-color converter 1022a and can then be emitted from the red filter. The second sub-filter 1027b is a green filter, such as a green color resist. Blue light emitted from the first light-emitting unit 103 is converted to green light by the second sub-color converter 1022b and can then be emitted from the green filter.

[0136] It should be noted that, compared to the scheme in which both the first sub-filter 1027a and the second sub-filter 1027b are set as yellow filters, the scheme in which the first sub-filter 1027a is set as a red filter and the second sub-filter 1027b is set as a green filter can save one masking process for the filter.

[0137] In this embodiment, since the fabrication of the dielectric film 1021 itself is subject to fluctuations, the curvature of the dielectric film 1021 is difficult to perfectly match the viewing angle. Therefore, by setting a first sub-filter 1027a and a second sub-filter 1027b, the remaining blue light at the locations of the green and red light-emitting units is shielded, thereby improving the color purity of the light. Of course, referring to... Figure 5 The light-emitting component 100 provided in this application embodiment does not require the design of the first sub-filter 1027a and the second sub-filter 1027b in the second filter portion 1027, and this application embodiment does not limit this. Furthermore, if the light-emitting component 100 does not include the first sub-filter 1027a and the second sub-filter 1027b, two masking processes can be saved.

[0138] In this embodiment, the color conversion unit 102 further includes a first encapsulation layer 1028. (See reference...) Figure 6 and Figure 7 The first encapsulation layer 1028 may be located between the second filter portion 1027 and the light-shielding layer 1025, and also between the first filter portion 1026 and the light-shielding layer 1025. Alternatively, refer to... Figure 8 and Figure 9 The first encapsulation layer 1028 may be located between the first substrate 101 and the light-shielding layer 1025. Alternatively, refer to... Figure 3 and Figure 4 The first encapsulation layer 1028 is located between the second filter portion 1027 and the dielectric film layer 1021, and also between the first filter portion 1026 and the dielectric film layer 1021. Alternatively, refer to... Figure 10 and Figure 11The first encapsulation layer 1028 is located between the dielectric film layer 1021 and the limiting dam 1023, between the dielectric film layer 1021 and the color transfer portion 1022, and between the dielectric film layer 1021 and the transparent portion 1024. That is, the positions of the first encapsulation layer 1028 relative to the light-shielding layer 1025 and the dielectric film layer 1021 can be interchanged, and this embodiment does not specifically limit this.

[0139] Optional, in Figure 3 , Figure 6 , Figure 8 as well as Figure 10 In this design, the first sub-filter 1027a can be a red filter, such as a red color resist. Blue light emitted from the first light-emitting unit 103 is converted to red light by the first sub-color converter 1022a and can then be emitted from the red filter. The second sub-filter 1027b is a green filter, such as a green color resist. Blue light emitted from the first light-emitting unit 103 is converted to green light by the second sub-color converter 1022b and can then be emitted from the green filter.

[0140] exist Figure 4 , Figure 7 , Figure 9 as well as Figure 11 In this configuration, both the first sub-filter 1027a and the second sub-filter 1027b are yellow filters, such as yellow color resists. Blue light emitted from the first light-emitting unit 103 is converted to red light by the first sub-color converter 1022a and can then exit from the yellow filter. Similarly, blue light emitted from the first light-emitting unit 103 is converted to green light by the second sub-color converter 1022b and can then exit from the yellow filter.

[0141] refer to Figure 5 As can be seen, when the color conversion unit 102 includes the first filter section 1026 but does not include the second filter section 1027, the first encapsulation layer 1028 is located between the first filter section 1026 and the dielectric film layer 1021. Alternatively, refer to... Figure 12 In the case where the color conversion unit 102 includes a first filter portion 1026 but does not include a second filter portion 1027, the first encapsulation layer 1028 is located between the first substrate 101 and the light-shielding layer 1025, and also between the first substrate 101 and the first filter portion 1026. Alternatively, refer to... Figure 13 In the case where the color conversion unit 102 includes a first filter portion 1026 but does not include a second filter portion 1027, the first encapsulation layer 1028 is located between the first filter portion 1026 and the light-shielding layer 1025. Alternatively, refer to... Figure 14When the color conversion unit includes a first filter portion 1026 but does not include a second filter portion 1027, the first encapsulation layer 1028 is located between the dielectric film layer 1021 and the limiting dam 1023, between the dielectric film layer 1021 and the color conversion portion 1022, and between the dielectric film layer 1021 and the transparent portion 1024. That is, when the color conversion unit includes a first filter portion 1026 but does not include a second filter portion 1027, the positions of the first encapsulation layer 1028 relative to the first filter portion 1026, the light-shielding layer 1025, and the dielectric film layer 1021 can be interchanged. This application embodiment does not specifically limit this.

[0142] refer to Figures 3 to 14 It can be seen that the color transfer unit 102 also includes a second encapsulation layer 1029, which is located on the side of the limiting dam 1023, the color transfer part 1022 and the transparent part 1024 away from the first substrate 101.

[0143] In this embodiment, the first encapsulation layer 1028 and the second encapsulation layer 1029 are disposed in contact and form a sealed space that encloses and defines the dam 1023, the color transfer portion 1022, and the transparent portion 1024, thereby blocking the color transfer portion 1022 from water and oxygen erosion.

[0144] The first encapsulation layer 1028 and the second encapsulation layer 1029 can be film layers that are continuously distributed at all locations. Furthermore, the second encapsulation layer 1029 is in contact with the first encapsulation layer 1028, so that the cooperation between the first encapsulation layer 1028 and the second encapsulation layer 1029 can completely encapsulate the light-shielding layer 1025, the light-filtering parts (second light-filtering part 1027 and first light-filtering part 1026), the limiting dam 1023, and the color transfer part 1022. Here, the area where the second encapsulation layer 1029 contacts the first encapsulation layer 1028 is distributed around the limiting dam 1023, thereby ensuring a good encapsulation effect on the color transfer part 1022 and the light-filtering part through the cooperation of the first encapsulation layer 1028 and the second encapsulation layer 1029, further improving the reliability of the color transfer part 1022 and the light-filtering part.

[0145] Optionally, the thickness of the first encapsulation layer 1028 can range from 0.3 μm to 1 μm, and the thickness of the second encapsulation layer 1029 can range from 0.3 μm to 5 μm.

[0146] In the embodiments of this application, in the above Figure 10 , Figure 11 as well as Figure 14In this embodiment, the dielectric film layer 1021 includes a filter portion on the side near the first substrate 101, but does not include the first encapsulation layer 1028. In this case, the bending of at least a portion of the dielectric film layer 1021 toward the first substrate 101 can mean that at least a portion of the dielectric film layer 1021 is located inside the groove 101a, and the portion located inside the groove 101a bends toward the first substrate 101 relative to the other portions.

[0147] In the embodiments of this application, reference is made to Figure 3 The area of ​​the second sub-light-emitting functional layer Fa2 of the green light-emitting unit 103b projected onto the reference plane C is larger than the area of ​​the first sub-light-emitting functional layer Fa1 of the red light-emitting unit 103a projected onto the reference plane C. The area of ​​the first sub-light-emitting functional layer Fa1 of the red light-emitting unit 103a projected onto the reference plane C is larger than the area of ​​the third sub-light-emitting functional layer Fa3 of the blue light-emitting unit 104 projected onto the reference plane C.

[0148] Since the light emitted by the blue light-emitting unit 104 does not need to be converted by the color conversion unit 1022 but is emitted directly, its brightness is relatively high, and there is no need to set an excessively large sub-light-emitting functional layer to achieve light emission. Since the light emitted by the green light-emitting unit 103b has a relatively poor conversion efficiency after being converted by the color conversion unit 1022, a larger sub-light-emitting functional layer is required for the green light-emitting unit 103b to balance the brightness of light with other colors.

[0149] In the embodiments of this application, reference is made to Figure 3 As can be seen, the light-emitting component 100 includes a light-emitting unit layer F, which may include a first light-emitting unit 103 and a second light-emitting unit 104. The light-emitting unit layer F includes a first semiconductor layer F1 located on the side of the sub-light-emitting functional layers Fa (Fa1, Fa2, and Fa3) of each light-emitting unit near the first substrate 101. (Reference) Figure 15 The first semiconductor layer F1 includes a first connecting portion F11 corresponding to the sub-light-emitting functional layer Fa, and an auxiliary portion F12 connected to the first connecting portion F11. The first connecting portion F11 is connected to the sub-light-emitting functional layer Fa, and the auxiliary portion F12 and the first connecting portion F11 are integrally formed.

[0150] For example, when the light-emitting component 100 includes a red light-emitting unit 103a, a green light-emitting unit 103b, and a blue light-emitting unit 104, the light-emitting unit layer F includes a first sub-light-emitting functional layer Fa1 of the red light-emitting unit 103a, a second sub-light-emitting functional layer Fa2 of the green light-emitting unit 103b, and a third sub-light-emitting functional layer Fa3 of the blue light-emitting unit 104. Correspondingly, the first semiconductor layer F1 includes three first connection portions F11. Among the three first connection portions F11, the first first connection portion F11a corresponds to the first sub-light-emitting functional layer Fa1, the second first connection portion F11b corresponds to the second sub-light-emitting functional layer Fa2, and the third first connection portion F11c corresponds to the third sub-light-emitting functional layer Fa3.

[0151] In the embodiments of this application, reference is made to Figures 3 to 7 The light-emitting unit layer F also includes: a common electrode F5, an insulating protective layer F6, a first electrode F7, and a second electrode F8.

[0152] The common electrode F5 is located on the side of the first semiconductor layer F1 away from the first substrate 101, and the common electrode F5 and the sub-light-emitting functional layer Fa are spaced apart. The first semiconductor layer F1 also includes a second connection portion F13 corresponding to the common electrode F5, and the second connection portion F13 is connected to the common electrode F5. The second connection portion F13 is integrally formed with the auxiliary portion F12 and the first connection portion F11. (Reference) Figure 15 The first semiconductor layer F1 includes three first connection portions F11, one second connection portion F13, and an auxiliary portion F12.

[0153] An insulating protective layer F6 is located on the side of the sub-light-emitting functional layer Fa and the common electrode F5 away from the first semiconductor layer F1. The insulating protective layer F6 has a first connection hole V1 and a second connection hole V2. The first connection hole V1 is used to expose at least a portion of the common electrode F5, and the second connection hole V2 is used to expose at least a portion of the sub-light-emitting functional layer Fa. Optionally, the insulating protective layer F6 can be a passivation layer (PVX).

[0154] refer to Figures 3 to 7 The insulating protective layer F6 includes a first connecting hole V1 and three second connecting holes V2. The first second connecting hole V2a exposes at least a portion of the first sub-light-emitting functional layer Fa1, the second second connecting hole V2b exposes at least a portion of the second sub-light-emitting functional layer Fa2, and the third second connecting hole V2c exposes at least a portion of the third sub-light-emitting functional layer Fa3.

[0155] The light-emitting unit layer F includes a first electrode F7 electrically connected to a common electrode F5 through a first connection hole V1, and a second electrode F8 electrically connected to a sub-light-emitting functional layer through a second connection hole V2. Here, the first electrode F7 can be disposed in the same layer as the second electrode F8 and made of the same material; that is, the first electrode F7 and the second electrode F8 are formed using the same patterning process.

[0156] Example, reference Figures 3 to 7 The light-emitting unit layer includes a first electrode F7 (which can be called an N electrode) and three second electrodes F8 (which can be called P electrodes). The first second electrode F8a is electrically connected to the first sub-light-emitting functional layer Fa1 through the first second connection hole V2a, the second second electrode F8b is electrically connected to the second sub-light-emitting functional layer Fa2 through the second second connection hole V2b, and the third second electrode F8c is electrically connected to the third sub-light-emitting functional layer Fa3 through the third second connection hole V2c.

[0157] Optionally, the first sub-light-emitting functional layer Fa1 and the second sub-light-emitting functional layer Fa2 can be arranged in one row, and the common electrode F5 and the third sub-light-emitting functional layer Fa3 can be arranged in one row. Alternatively, the first sub-light-emitting functional layer Fa1 and the common electrode F5 can be arranged in one column, and the second sub-light-emitting functional layer Fa2 and the third sub-light-emitting functional layer Fa3 can be arranged in one column. That is, the first sub-light-emitting functional layer Fa1, the second sub-light-emitting functional layer Fa2, the third sub-light-emitting functional layer Fa3, and the common electrode F5 can be arranged in two rows and two columns.

[0158] Accordingly, refer to Figure 16 The first second electrode F8 electrically connected to the first sub-light-emitting functional layer Fa1, and the second second electrode F8 electrically connected to the second sub-light-emitting functional layer Fa2, can be arranged in a row. The first electrode F7 and the third second electrode F8 electrically connected to the third sub-light-emitting functional layer Fa3 can be arranged in a row. The first second electrode F8a electrically connected to the first sub-light-emitting functional layer Fa1 and the first electrode F7 can be arranged in a column, and the second second electrode F8b electrically connected to the second sub-light-emitting functional layer Fa2 and the third second electrode F8c electrically connected to the third sub-light-emitting functional layer Fa3 can be arranged in a column. In this case, for the above... Figures 3 to 14 In other words, Figures 3 to 14 The light-emitting component can be along Figure 16 The cross-sectional view obtained in the AA' direction.

[0159] In this embodiment, the sub-light-emitting functional layer Fa in each light-emitting unit may include a light-emitting layer F2 and a second semiconductor layer F3 stacked along a direction perpendicular to and away from the first substrate 101. That is, the light-emitting layer F2 in the sub-light-emitting functional layer Fa is closer to the first semiconductor layer F1 than the second semiconductor layer F3.

[0160] In this process, the light-emitting layer F2 in the sub-light-emitting functional layer Fa can be connected to the first semiconductor layer F1. Since the first semiconductor layer F1 is located on the light-emitting side of each sub-light-emitting functional layer Fa, and the first semiconductor layer F1 is closer to the first substrate 101 than each sub-light-emitting functional layer Fa, the first semiconductor layer F1 can contact the side of the light-emitting layer F2 in each sub-light-emitting functional layer Fa that is away from the second semiconductor layer F3.

[0161] Optionally, the material of the second semiconductor layer F3 in each sub-light-emitting functional layer Fa may include: p-type doped gallium nitride (P-GaN); the light-emitting layer F2 in each sub-light-emitting functional layer Fa may be a multiple quantum well layer (MQW). For example... Figures 3 to 7 As shown, the first semiconductor layer F1 may include a first sublayer F11 and a second sublayer F12 stacked along a direction perpendicular to and toward the first substrate 101. That is, the second sublayer F12 is closer to the first substrate 101 than the first sublayer F11.

[0162] In this design, the first sub-layer F11 of the first semiconductor layer F1 can be located between the second sub-layer F12 and each of the sub-light-emitting functional layers. That is, the first sub-layer F11 is closer to the light-emitting layer in each of the sub-light-emitting functional layers than the second sub-layer F12. Here, the material of the first sub-layer F11 in the first semiconductor layer F1 can be N-type doped gallium nitride (N-GaN), and the second sub-layer F12 in the first semiconductor layer F1 can be a gallium nitride buffer layer (buffer-GaN).

[0163] In this case, in the light-emitting unit 103, after the first electrode 101 is loaded with a cathode signal, if the second electrode 102 in a certain sub-light-emitting functional layer 103a is loaded with an anode signal, then the light-emitting layer 1033 in this sub-light-emitting functional layer 103a can emit the first light.

[0164] It is understood that the first semiconductor layer F1 can be divided into: an auxiliary part F12, a first connecting part F11 and a second connecting part F13 in the direction parallel to the extension surface of the first substrate 101, and the first semiconductor layer F1 can be divided into: a first sub-layer F11 and a second sub-layer F12 in the direction perpendicular to the extension surface of the first substrate 101.

[0165] In this embodiment, the sub-light-emitting functional layer Fa may further include a current spreading layer F4 located on the side of the second semiconductor layer F3 away from the first substrate 101. One side of the current spreading layer F4 in each sub-light-emitting functional layer Fa may be in contact with the second semiconductor layer F3, and the other side may be electrically connected to the second electrode F8 through the second connection hole V2 in the insulating protective layer F6. Optionally, the material of the current spreading layer F4 is ITO (indium tin oxide). The presence of a current spreading layer F4 in the sub-light-emitting functional layer facilitates hole transport and improves the electrical performance of the light-emitting component.

[0166] Optionally, the thickness of the common electrode F5 can be much greater than the thickness of the current spreading layer F4. For example, the side of the common electrode F5 facing away from the first semiconductor layer F1 can be flush with the side of the current spreading layer F4 facing away from the first semiconductor layer F1. That is, the thickness of the common electrode F5 layer can be equal to the sum of the thicknesses of the current spreading layer F4, the second semiconductor layer F3, and the light-emitting layer F2 in the sub-light-emitting functional layer. In this way, the sides of the second electrode F8 and the first electrode F7 facing away from the first substrate 101 are also flush. Since the second electrode F8 and the first electrode F7 in the light-emitting component 100 need to be die-bonded to the driving backplate when connecting the light-emitting component 100 to the driving backplate, the fact that the sides of the second electrode F8 and the first electrode F7 in the light-emitting component 100 facing away from the first substrate 101 are flush can ensure that the light-emitting component 100 can be stably fixed on the driving backplate.

[0167] refer to Figures 3 to 7 It can also be seen that the light-emitting component 100 further includes a connecting layer 105 located between the color conversion unit 102 and the light-emitting unit layer F. The connecting layer 105 can be OC adhesive, used to connect the color conversion unit 102 and the light-emitting unit layer F.

[0168] In summary, this application provides a light-emitting component, which includes a first substrate, a color conversion unit, and a first light-emitting unit. The color conversion unit includes a color conversion section and a dielectric film layer. The color conversion section converts light, and the emission peak position of the light converted by the color conversion section is highly stable. Therefore, when the light-emitting component is applied to a display substrate, the difference in emission peak positions of the light-emitting components in the display substrate can be minimized, improving the display uniformity of the display substrate. Furthermore, a dielectric film layer is disposed on the side of the color conversion section near the first substrate, which allows selective transmission of second-color light and reflection of first-color light not converted by the color conversion section, which is then reabsorbed and excited by the color conversion section. This reduces the thickness of the color conversion section, thereby reducing the material usage and saving costs. Simultaneously, the grooves provided on the first substrate ensure that light at different angles passes through the dielectric film layer along the same path, guaranteeing that the dielectric film layer performs wavelength selection to the same degree for light at different angles, improving the reliability of the dielectric film layer's wavelength selection.

[0169] Figure 17 This is a flowchart illustrating a method for fabricating a light-emitting component according to an embodiment of this application. (Reference) Figure 17 The method includes:

[0170] Step S101: Obtain the first substrate and the color transfer unit located on the first substrate.

[0171] refer to Figure 1 The first substrate 101 has a groove 101a on its first surface m1. The color transfer unit 102 includes a dielectric film layer 1021 and a color transfer portion 1022. The dielectric film layer 1021 is located on the side of the first substrate 101 with the groove 101a, and at least a portion of the dielectric film layer 1021 is bent towards the first substrate 101. The dielectric film layer 1021 is used to reflect light of a first color and transmit light of a second color. The wavelength of the light corresponding to the first color is shorter than the wavelength of the light corresponding to the second color.

[0172] The color transfer portion 1022 is located on the side of the dielectric film layer 1021 away from the first substrate 101, and the orthographic projection of the color transfer portion 1022 on the reference plane C overlaps with the orthographic projection of the groove 101a on the reference plane C. The reference plane C is parallel to the second surface m2 of the first substrate 101. The second surface m2 and the first surface m1 are two opposite surfaces of the first substrate 101.

[0173] This application embodiment takes the light-emitting component 100, which includes a red light-emitting unit, a green light-emitting unit, and a blue light-emitting unit, as an example to specifically describe step S101.

[0174] Step S1011: Obtain an initial substrate and etch the initial substrate to obtain the first substrate.

[0175] In this embodiment, the initial substrate can be a glass substrate. The obtained initial substrate is etched to obtain a first substrate 101. Combined with... Figure 18 and Figure 19 The first surface m1 of the first substrate 101 may have a groove 101a, and the groove 101a includes a first sub-groove 101a1 and a second sub-groove 101a2. The first sub-groove 101a1 corresponds to the light-emitting area of ​​the red light-emitting unit, and the second sub-groove 101a2 corresponds to the light-emitting area of ​​the green light-emitting unit.

[0176] Step S1012: A light-shielding layer is formed on the side of the first substrate with the groove.

[0177] refer to Figure 20The light-shielding layer 1025 can expose the first sub-groove 101a1 and the second sub-groove 101a2, and can also expose the light-emitting area of ​​the blue light-emitting unit. That is, the light-shielding layer 1025 can have two third accommodating spaces 1025a (1025a1 and 1025a2) and one fourth accommodating space 1025b. Optionally, the light-shielding layer 1025 can be prepared using a photomask.

[0178] Step S1013: A red filter, a green filter, and a blue filter are formed on the side of the first substrate with a groove.

[0179] In the embodiments of this application, the red filter, green filter, and blue filter can all be fabricated using photomasks. For example, the red filter, green filter, and blue filter can each be fabricated using a three-mask process.

[0180] refer to Figure 21 The red filter can be located in one of the two third receiving spaces 1025a1, corresponding to the light-emitting area of ​​the red light-emitting unit. The green filter can be located in the other of the two third receiving spaces 1025a2, corresponding to the light-emitting area of ​​the green light-emitting unit. The blue filter can be located in the fourth receiving space 1025b, corresponding to the light-emitting area of ​​the blue light-emitting unit.

[0181] Step S1014: A first encapsulation layer is formed on the side of the light-shielding layer, the red filter, the green filter and the blue filter away from the first substrate.

[0182] refer to Figure 22 The first encapsulation layer 1028 can be a film structure that is continuously distributed at all locations. The first encapsulation layer 1028 can encapsulate the light-shielding layer 1025, as well as the red filter, green filter, and blue filter. Optionally, the material of the first encapsulation layer 1028 can be an inorganic material, such as at least one of silicon nitride, silicon oxide, and silicon oxynitride.

[0183] Step S1015: A dielectric film layer is formed on the side of the first encapsulation layer away from the first substrate.

[0184] In the embodiments of this application, reference is made to Figure 23The orthographic projection of the dielectric film layer 1021 on the reference plane C overlaps with the orthographic projections of the first sub-groove 101a1 and the second sub-groove 101a2 on the reference plane C. The portion of the orthographic projection of the dielectric film layer 1021 on the reference plane C located at the first sub-groove 101a1 bends towards the bottom of the first sub-groove 101a1. The portion of the orthographic projection of the dielectric film layer 1021 on the reference plane C located at the second sub-groove 101a2 bends towards the bottom of the second sub-groove 101a2.

[0185] Furthermore, the orthographic projection of the dielectric film 1021 onto the reference plane C and the orthographic projection of the emitting region of the blue emitting unit onto the reference plane C have a non-overlapping region. This avoids the dielectric film 1021 affecting the light emission of the blue emitting unit.

[0186] Optionally, the dielectric film layer 1021 may include a first dielectric layer and a second dielectric layer stacked and alternately arranged, wherein the first dielectric layer and the second dielectric layer have different refractive indices. For example, the difference in refractive indices between the first dielectric layer and the second dielectric layer ranges from 0.7 to 1.

[0187] Optionally, the material of one of the first dielectric layer and the second dielectric layer may include silicon oxide (SiOx), and the material of the other dielectric layer may include niobium pentoxide (Nb2O5).

[0188] Optionally, the dielectric film 1021 can be a distributed Bragg reflector (DBR) structure. A DBR structure can be obtained by periodically stacking films with different refractive indices. By designing and controlling the thickness of each layer, the reflected light between the layers can interfere multiple times, creating a characteristic that filters specific wavelengths.

[0189] Optionally, the dielectric film 1021 can be a long-pass filter layer. In the visible light band, the dielectric film 1021 reflects blue light and transmits red and green light. That is, the first color can be blue, and the second color can be red or green.

[0190] In this embodiment, the fabrication process of the dielectric film 1021 includes: forming a whole dielectric film on the side of the first encapsulation layer 1028 away from the first substrate 101; and performing a patterning process on the dielectric film to remove the portion of the dielectric film located at the light-emitting area of ​​the blue light-emitting unit, thereby obtaining the dielectric film 1021. The patterning process includes: photoresist coating, exposure, development, etching, and photoresist removal.

[0191] Step S1016: A limiting dam is formed on the side of the dielectric film layer away from the first substrate.

[0192] refer to Figure 24 The dam 1023 includes two first containment spaces 1023a and one second containment space 1023b. The two first containment spaces 1023a are respectively set with two third containment spaces 1025a, and the second containment space 1023b is set with a fourth containment space 1025b.

[0193] Step S1017: A transparent part is formed in the second containment space of the defined dam, and a color-changing part is shaped in the first containment space.

[0194] refer to Figure 25 A transparent portion 1024 can be formed by filling the second receiving space 1023b with resin material. (See reference) Figure 26 A red color transfer portion (first sub-color transfer portion 1022a) is formed in one of the two first accommodating spaces 1023a using a printing process or a photolithography process, and a green color transfer portion (second sub-color transfer portion 1022b) is formed in the other of the two first accommodating spaces 1023a using a printing process or a photolithography process.

[0195] Optionally, the preparation order of the transparent portion 1024, the red color transfer portion 1022a, and the green color transfer portion 1022b can be interchanged, and this application embodiment does not limit this.

[0196] Step S1018: A second encapsulation layer is formed on the side of the defined dam, transparent portion and color transfer portion away from the first substrate.

[0197] In this embodiment, the second encapsulation layer 1029 can be a film layer structure that is continuously distributed at all locations. (See reference...) Figure 27 The second encapsulation layer 1029 can encapsulate the limiting dam 1023, the color transfer portion 1022, and the transparent portion 1024. The area where the second encapsulation layer 1029 contacts the first encapsulation layer 1028 is distributed around the limiting dam 1023. Thus, through the cooperation of the first encapsulation layer 1028 and the second encapsulation layer 1029, a better encapsulation effect is ensured for the color transfer portion 1022 and the filter portion (the second filter portion 1027 and the first filter portion 1026), further improving the reliability of the color transfer portion 1022 and the filter portion.

[0198] Step S102: Obtain the second substrate and the first light-emitting unit located on the second substrate.

[0199] In this embodiment, the second substrate can be a temporary substrate, as shown in step S104 below where the second substrate is peeled off. The first light-emitting unit 103 can be used to emit light of the first color. Furthermore, a second light-emitting unit 104 located on the second substrate can also be obtained, and the second light-emitting unit 104 is also used to emit light of the first color.

[0200] This application embodiment takes a light-emitting component including two first light-emitting units 103 (a red light-emitting unit and a green light-emitting unit respectively) and a second light-emitting unit 104 (a blue light-emitting unit) as an example to specifically describe step S102.

[0201] Step S2011: Form a first semiconductor layer, a light-emitting thin film, and a second semiconductor thin film on the third substrate.

[0202] In this embodiment, the third substrate can be a sapphire or silicon wafer. (See reference...) Figure 28 The first semiconductor layer F1 (the second sublayer F12 (buffer-GaN) and the first sublayer F11 (N-GaN)), the light-emitting thin film F2a (MQW), and the second semiconductor thin film F3a (P-GaN) can be epitaxially formed on one side of the third substrate. That is, the first semiconductor layer F1, the light-emitting thin film F2a, and the second semiconductor thin film F3a can be sequentially stacked in a direction away from the third substrate.

[0203] Step S2012: Pattern the light-emitting thin film and the second semiconductor thin film to obtain the light-emitting layer and the second semiconductor layer included in the first sub-light-emitting functional layer, the light-emitting layer and the second semiconductor layer included in the second sub-light-emitting functional layer, and the light-emitting layer and the second semiconductor layer included in the third sub-light-emitting functional layer.

[0204] In the embodiments of this application, the process of patterning the light-emitting thin film F2a and the second semiconductor thin film F3a can be referred to as photolithography. (See reference...) Figure 29 The area of ​​the orthographic projection of the second sub-light-emitting functional layer Fa2 onto the third substrate is larger than the area of ​​the orthographic projection of the first sub-light-emitting functional layer Fa1 onto the third substrate. Furthermore, the area of ​​the orthographic projection of the first sub-light-emitting functional layer Fa1 onto the third substrate is larger than the area of ​​the orthographic projection of the third sub-light-emitting functional layer Fa3 onto the third substrate.

[0205] Step S2013: A current transport layer including the sub-light-emitting functional layer is formed on the side of the second semiconductor layer of each sub-light-emitting functional layer away from the third substrate, and a common electrode is formed on the side of the first semiconductor layer away from the third substrate.

[0206] In the embodiments of this application, reference is made to Figure 30 Each sub-light-emitting functional layer includes a current-transmitting layer that is far from the surface of the third substrate and can be flush with the surface of the common electrode F5 that is far from the third substrate.

[0207] Step S2014: An insulating protective layer is formed on the side of each sub-light-emitting functional layer and the common electrode away from the third substrate.

[0208] In this embodiment, the process of forming the insulating protective layer F6 includes: forming an insulating protective film (the material can be an inorganic material); and patterning the insulating protective film to obtain the insulating protective layer F6. The patterning process includes: photoresist coating, exposure, development, etching, and photoresist removal.

[0209] refer to Figure 31 The insulating protective layer F6 includes a first connection hole V1 for exposing the common electrode F5, and a second connection hole V2 for exposing the current transport layer in each sub-light-emitting functional layer. For example, the insulating protective layer F6 includes a first second connection hole V2a for exposing the current transport layer in the first sub-light-emitting functional layer Fa1, a second second connection hole V2b for exposing the current transport layer in the second sub-light-emitting functional layer Fa2, and a third second connection hole V2c for exposing the current transport layer in the third sub-light-emitting functional layer Fa3.

[0210] Step S2015: Form a first electrode and a second electrode on the side of the insulating protective layer away from the third substrate.

[0211] refer to Figure 32 This forms a first electrode F7 and three second electrodes F8. The first electrode F7 is electrically connected to the common electrode F5 through the first connecting hole V1. Of the three second electrodes F8, the first second electrode F8a is electrically connected to the current transport layer in the first sub-light-emitting functional layer Fa1 through the first second connecting hole V2a, the second second electrode F8b is electrically connected to the current transport layer in the second sub-light-emitting functional layer Fa2 through the second second connecting hole V2b, and the third second electrode F8c is electrically connected to the current transport layer in the third sub-light-emitting functional layer Fa3 through the third second connecting hole V2c.

[0212] Step S2016: Bond the second substrate to the side of the first electrode and the second electrode away from the third substrate.

[0213] In the embodiments of this application, reference is made to Figure 33 The second substrate is located on the side of the first electrode F7 and the second electrode F8 away from the third substrate. The second substrate can be a temporary substrate, and temporary bonding adhesive can be used when the second substrate is bonded to one side of the first electrode F7 and the second electrode F8.

[0214] Step S2017: Peel the third substrate from one side of the first semiconductor layer.

[0215] In order to bond the light-emitting units obtained in step S102 to the structure obtained in step S101, the third substrate needs to be peeled off from one side of the first semiconductor layer F1. Therefore, refer to... Figure 34 A second substrate is obtained, along with two first light-emitting units 103 and one second light-emitting unit 104 located on the second substrate.

[0216] Step S103: Align and bond the color conversion unit and the first light-emitting unit so that the first light-emitting unit is located on the side of the color conversion unit away from the first substrate.

[0217] In this embodiment, the light of the first color emitted by the first light-emitting unit 103 can be converted by the color conversion part 1022 in the color conversion unit 102, and then the wavelength of the light can be selected by the dielectric film layer 1021.

[0218] Optional, see reference Figure 35 Taking the light-emitting component 100 as an example, which includes two first light-emitting units 103 (a red light-emitting unit and a green light-emitting unit respectively) and a second light-emitting unit 104 (a blue light-emitting unit), after alignment and bonding, the sub-light-emitting functional layer of the red light-emitting unit can correspond to the position of the red color-transfer part and the red filter part, the sub-light-emitting functional layer of the green light-emitting unit can correspond to the position of the green color-transfer part and the green filter part, and the sub-light-emitting functional layer of the blue light-emitting unit can correspond to the position of the transparent part and the blue filter part.

[0219] Optionally, during the alignment and bonding process, a connecting layer 105 can be used to align and bond the color conversion unit 102 and the light-emitting unit. That is, the connecting layer 105 can be located between the second encapsulation layer 1029 in the color conversion unit 102 and the first semiconductor layer F1 in the light-emitting unit layer.

[0220] It should be noted that before the alignment bonding connection, the structure formed in step S101 and the structure formed in step S102 can be cut (for example, by using laser cutting) to the same size so that alignment bonding can be performed in step S103.

[0221] Step S104: Peel the second substrate from one side of the first light-emitting unit.

[0222] Optional, see reference Figure 36 The second substrate can be peeled off and the temporary bonding adhesive can be removed by ashing.

[0223] Furthermore, after the second substrate is peeled off, the first substrate 101 can be thinned (the thickness of the first substrate 101 after thinning is less than the thickness of the first substrate 101 before thin film treatment) so that the total thickness of the final light-emitting component is thinner, which facilitates the thinning of the display substrate.

[0224] In this embodiment of the application, steps S101 to S105 described above can be used to prepare multiple light-emitting components, i.e., to obtain a light-emitting component motherboard. In this case, in order to obtain the light-emitting components, the light-emitting component motherboard can be cut to obtain multiple independent light-emitting components.

[0225] Optionally, if the light-emitting component includes a red light-emitting unit, a green light-emitting unit, and a blue light-emitting unit, the light-emitting component can be an RGB three-in-one light-emitting chip.

[0226] In summary, this application provides a method for fabricating a light-emitting component. The light-emitting component fabricated by this method includes a first substrate, a color conversion unit, and a first light-emitting unit. The color conversion unit includes a color conversion section and a dielectric film layer. The color conversion section converts light, and the emission peak position of the light converted by the color conversion section is highly stable. Therefore, when the light-emitting component is applied to a display substrate, the difference in emission peak positions of the light-emitting components in the display substrate can be minimized, improving the display uniformity of the display substrate. Furthermore, by setting the dielectric film layer on the side of the color conversion section near the first substrate, second-color light can be selectively transmitted, while first-color light not converted by the color conversion section is reflected, reabsorbed, and excited by the color conversion section. This reduces the thickness of the color conversion section, thereby reducing the material usage and saving costs. Simultaneously, by setting grooves on the first substrate, light at different angles can pass through the dielectric film layer along the same path, ensuring that the dielectric film layer performs wavelength selection to the same degree for light at different angles, improving the reliability of the dielectric film layer's wavelength selection.

[0227] Figure 37 This is a schematic diagram of the structure of a display substrate provided in an embodiment of this application. (Reference) Figure 37 The display substrate 00 includes a driving backplane 200 and a plurality of light-emitting components 100. Optionally, the light-emitting components 100 can be light-emitting chips.

[0228] refer to Figure 36 Multiple light-emitting components 100 are located in the display area 00a of the display substrate 00, and the multiple light-emitting components 100 are arranged in an array on the driving backplate 200. The multiple light-emitting components 100 are connected to the driving backplate 200, and the driving backplate 200 provides driving signals to the light-emitting components 100, which are used to emit light under the control of the driving signals.

[0229] Since the display substrate can have essentially the same technical effects as the light-emitting components described in the previous embodiments, for the sake of brevity, the technical effects of the display substrate will not be described again here.

[0230] The terminology used in the embodiments section of this application is for explaining the embodiments of this application only and is not intended to limit this application. Unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains.

[0231] The terminology used in the embodiments section of this application is for illustrative purposes only and is not intended to limit the application. Unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," "third," and similar terms used in the patent application specification and claims of this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms "a" or "one," and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms "comprising" or "including," and similar terms mean that the elements or objects preceding "comprising" or "including" encompass the elements or objects listed following "comprising" or "including" and their equivalents, and do not exclude other elements or objects. The terms "connected," "linked," and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up," "down," "left," "right," etc., are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0232] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A light-emitting component, characterized in that, The light-emitting component includes: A first substrate, wherein a groove is formed on a first surface of the first substrate; A color conversion unit, comprising a dielectric film layer and a color conversion part, wherein the dielectric film layer is located on the side of the first substrate having the groove, and at least a portion of the dielectric film layer is bent toward the side of the first substrate, the dielectric film layer is used to reflect light of a first color and transmit light of a second color, wherein the wavelength of light corresponding to the first color is less than the wavelength of light corresponding to the second color. The color transfer portion is located on the side of the dielectric film layer away from the first substrate, and the orthographic projection of the color transfer portion on the reference plane and the orthographic projection of the groove on the reference plane overlap. The reference plane is parallel to the second surface of the first substrate, and the second surface and the first surface are two opposite surfaces of the first substrate. And a first light-emitting unit, the first light-emitting unit being located on the side of the color-converting unit away from the first substrate, the first light-emitting unit being used to emit light of the first color, and the color-converting unit being used to convert at least a portion of the light of the first color emitted by the first light-emitting unit into light of the second color.

2. The light-emitting component according to claim 1, characterized in that, The orthographic projection of the color transfer part on the reference plane is located within the orthographic projection of the groove on the reference plane, and the area of ​​the orthographic projection of the color transfer part on the reference plane is smaller than the area of ​​the orthographic projection of the groove on the reference plane.

3. The light-emitting component according to claim 1, characterized in that, The surface of the groove is an inwardly concave arc surface relative to the first surface of the first substrate; At least a portion of the two side surfaces of the dielectric film layer are concave arc surfaces relative to the first surface of the first substrate.

4. The light-emitting component according to claim 3, characterized in that, The dielectric film layer includes a first dielectric layer and a second dielectric layer stacked and alternately arranged, wherein the first dielectric layer and the second dielectric layer have different refractive indices.

5. The light-emitting component according to claim 3, characterized in that, The dielectric film layer has a DBR structure.

6. The light-emitting component according to claim 1, characterized in that, The dielectric film layer is a long-pass filter layer; In the visible light band, the dielectric film reflects blue light and transmits red and green light.

7. The light-emitting component according to claim 1, characterized in that, The light-emitting component further includes: a second light-emitting unit, wherein the second light-emitting unit and the first light-emitting unit are arranged at intervals; The second light-emitting unit is used to emit light of the first color. The orthographic projection of the dielectric film layer on the reference plane and the orthographic projection of the light-emitting area of ​​the second light-emitting unit on the reference plane have a non-overlapping area. The light of the first color emitted by the second light-emitting unit is emitted through the non-overlapping area.

8. The light-emitting component according to claim 7, characterized in that, The orthographic projection of the light-emitting area of ​​the second light-emitting unit onto the reference plane and the orthographic projection of the groove onto the reference plane do not overlap.

9. The light-emitting component according to claim 7, characterized in that, The color conversion unit also includes: A limiting dam defines a first accommodating space and a second accommodating space. The first accommodating space corresponds to the luminous area of ​​the first luminous unit, and the second accommodating space corresponds to the luminous area of ​​the second luminous unit. The color conversion part is located within the first accommodating space. A transparent portion, which is located within the second accommodating space; A light-shielding layer is located on the side of the limiting dam close to the first substrate. The light-shielding layer forms a third accommodating space and a fourth accommodating space. The third accommodating space is correspondingly arranged to the first accommodating space, and the fourth accommodating space is correspondingly arranged to the second accommodating space. A first filter portion is located within the fourth accommodating space and is used to transmit light after it has passed through the transparent portion.

10. The light-emitting component according to claim 9, characterized in that, The color conversion unit further includes: a first encapsulation layer and a second encapsulation layer; The first encapsulation layer is located between the first filter and the light-shielding layer, or, The first encapsulation layer is located between the first substrate and the light-shielding layer, and also between the first substrate and the first light-filtering portion, or... The first encapsulation layer is located between the first filter portion and the dielectric film layer, or, The first encapsulation layer is located between the dielectric film layer and the defining dam, between the dielectric film layer and the color transfer portion, and between the dielectric film layer and the transparent portion; The second encapsulation layer is located on the side of the defined dam, the color-transfer portion, and the transparent portion away from the first substrate.

11. The light-emitting component according to claim 9, characterized in that, The color conversion unit further includes a second filter, which is located within the third accommodating space and is used to transmit light after its color has been converted by the color conversion unit.

12. The light-emitting component according to claim 11, characterized in that, The color conversion unit further includes: a first encapsulation layer and a second encapsulation layer; The first encapsulation layer is located between the second filter portion and the light-shielding layer, and is also located between the first filter portion and the light-shielding layer, or... The first encapsulation layer is located between the first substrate and the light-shielding layer, and also between the first substrate and the second light-filtering portion, or between the first substrate and the first light-filtering portion, or... The first encapsulation layer is located between the second filter portion and the dielectric film layer, and also between the first filter portion and the dielectric film layer, or... The first encapsulation layer is located between the dielectric film layer and the defining dam, between the dielectric film layer and the color transfer portion, and between the dielectric film layer and the transparent portion; The second encapsulation layer is located on the side of the defined dam, the color-transfer portion, and the transparent portion away from the first substrate.

13. The light-emitting component according to claim 12, characterized in that, At least a portion of the dielectric film is located inside the groove.

14. The light-emitting component according to claim 11, characterized in that, The first color is blue, and the second color is either green or red; The light-emitting component includes two first light-emitting units and one second light-emitting unit; the groove includes a first sub-groove and a second sub-groove arranged at intervals. The defined dam has two first accommodating spaces. The color conversion part includes a first sub-color conversion part corresponding to one of the two first light-emitting units and a second sub-color conversion part corresponding to the other of the two first light-emitting units. The first sub-color conversion part is located in one of the two first accommodating spaces and is used to convert at least a portion of the blue light emitted by one of the first light-emitting units into green light. The orthographic projection of the first sub-color conversion part on the reference plane and the orthographic projection of the first sub-groove on the reference plane overlap. The second sub-color conversion part is located in the other of the two first accommodating spaces and is used to convert at least a portion of the blue light emitted by the other first light-emitting unit into red light. The orthographic projection of the second sub-color conversion part on the reference plane and the orthographic projection of the second sub-groove on the reference plane overlap. The light-shielding layer has two third accommodating spaces. The second filter includes a first sub-filter corresponding to the first sub-color conversion part and a second sub-filter corresponding to the second sub-color conversion part. The first sub-filter is located in one of the two third accommodating spaces and is used to transmit green light converted by the first sub-color conversion part. The second sub-filter is located in the other of the two third accommodating spaces and is used to transmit red light converted by the second sub-color conversion part.

15. The light-emitting component according to claim 14, characterized in that, The first filter is a blue filter, and both the first sub-filter and the second sub-filter are yellow filters; or, The first filter is a blue filter, the first sub-filter is a green filter, and the second sub-filter is a red filter.

16. The light-emitting component according to any one of claims 1 to 15, characterized in that, The light-emitting component has two first light-emitting units and one second light-emitting unit. One of the two first light-emitting units is a red light-emitting unit and the other is a green light-emitting unit. The second light-emitting unit is a blue light-emitting unit. The area of ​​the first sub-light-emitting functional layer of the green light-emitting unit projected onto the reference plane is larger than the area of ​​the second sub-light-emitting functional layer of the red light-emitting unit projected onto the reference plane. The area of ​​the second sub-light-emitting functional layer of the red light-emitting unit projected onto the reference plane is greater than the area of ​​the third sub-light-emitting functional layer of the blue light-emitting unit projected onto the reference plane.

17. A method for preparing a light-emitting component, characterized in that, The method includes: A first substrate and a color transfer unit located on the first substrate are obtained; a first surface of the first substrate has a groove; the color transfer unit includes a dielectric film layer and a color transfer portion, the dielectric film layer is located on the side of the first substrate with the groove, and at least a portion of the dielectric film layer is bent toward the first substrate; the dielectric film layer is used to reflect light of a first color and transmit light of a second color, the wavelength of the light corresponding to the first color is less than the wavelength of the light corresponding to the second color; the color transfer portion is located on the side of the dielectric film layer away from the first substrate, and the orthographic projection of the color transfer portion on the reference plane and the orthographic projection of the groove on the reference plane overlap; the reference plane is parallel to a second surface of the first substrate, and the second surface and the first surface are two opposite surfaces of the first substrate; A second substrate and a first light-emitting unit located on the second substrate are obtained, wherein the first light-emitting unit is used to emit light of the first color; The color conversion unit and the first light-emitting unit are aligned and bonded together, such that the first light-emitting unit is located on the side of the color conversion unit away from the first substrate. The color conversion part is used to convert at least a portion of the light of the first color emitted by the first light-emitting unit into light of the second color. The second substrate is peeled off from one side of the first light-emitting unit.

18. A display substrate, characterized in that, The display substrate includes: a driving backplate and a plurality of light-emitting components as described in any one of claims 1 to 16, wherein the light-emitting component is a light-emitting chip; Multiple light-emitting components are connected to the driving backplane, and an array of multiple light-emitting components is arranged on the driving backplane. The driving backplane provides driving signals to the light-emitting components, and the light-emitting components are used to emit light under the control of the driving signals.

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