A handler for testing semiconductor devices

Abstract

The application discloses a semiconductor element test sorting machine, and relates to the technical field of semiconductor sorting machines, which comprises an operation table, wherein a feeding mechanism, a voltage withstand test mechanism, an electrical property test mechanism, an image test mechanism and a sorting and material collecting mechanism are sequentially arranged on the operation table; the sorting and material collecting mechanism comprises a test defective product discharging mechanism, an image test defective product collecting mechanism and a good product collecting mechanism; the good product collecting mechanism comprises a plug feeding mechanism and a third material pipe stacking assembly; the third material pipe stacking assembly comprises a base, and a third placing assembly for placing material pipes is installed on the base; and the plug feeding mechanism comprises a plug vibrating disc. Through the arrangement of the sorting and material collecting mechanism, automatic pipe changing and material collecting can be realized during the sorting and material collecting of products, automatic plug setting and material collecting can be realized through the arrangement of a plug setting assembly, automatic sorting without manual intervention is realized, and the problems of traditional manual pipe placing, such as mixed materials, low efficiency and low automation degree, are solved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor sorting machine technology, and more specifically, to a sorting machine for testing semiconductor components. Background Technology

[0002] Semiconductor devices are electronic devices whose conductivity lies between that of a good conductor and an insulator. They utilize the special electrical properties of semiconductor materials to perform specific functions and can be used to generate, control, receive, transform, amplify signals, and perform energy conversion.

[0003] During the production of semiconductor components, defects such as appearance flaws, abnormal electrical performance, and lead cracks may occur. Therefore, it is necessary to conduct inspection and testing on semiconductor components during the production process. The inspection and testing of semiconductor components typically includes withstand voltage testing, electrical testing, and imaging testing. After undergoing the above-mentioned multiple inspections, the semiconductor components that fail the inspection and testing are sorted out by sorting equipment. By sorting, defective products are reduced from entering the market, ensuring that the components leaving the factory are less likely to fail during use, thus guaranteeing the quality of the products leaving the factory.

[0004] Currently, for semiconductor component testing and sorting machines, good products usually need to be manually sealed with plugs after entering the material tube. This results in low sorting and receiving efficiency, easy product loss, and low automation. Summary of the Invention

[0005] To address the aforementioned technical problems, this invention provides a sorting machine for testing semiconductor components.

[0006] The technical solution is as follows:

[0007] A semiconductor component testing sorting machine includes an operating table, on which a feeding mechanism, a withstand voltage testing mechanism, an electrical testing mechanism, an image testing mechanism, and a sorting and receiving mechanism are continuously arranged. The sorting and receiving mechanism includes a defective product discharge mechanism, an image detection defective product receiving mechanism, and a good product receiving mechanism.

[0008] The good product receiving mechanism includes a plug feeding mechanism and a third material tube stacking assembly. The third material tube stacking assembly includes a base, on which a third placement assembly for placing material tubes is installed. The plug feeding mechanism includes a plug vibrating plate, and the outlet end of the plug vibrating plate is provided with a plug feeding track. The output end of the plug feeding track is equipped with a plugging assembly.

[0009] The plugging assembly includes a plug guide rail located below the plug feeding track. The plug guide rail has a sliding cavity for the plug to move. The end of the plug guide rail has an extension corresponding to the end of the material tube in the third placement assembly. A drive arm is slidably mounted on the end of the extension away from the end of the material tube. A third pushing device is mounted on the drive arm. The third pushing device is used to reciprocate to drive the drive arm to move, so as to squeeze the plug located at the extension into the interior of the end of the material tube.

[0010] Furthermore, the plug guide rail has a through groove along its length, and a driving component is slidably installed in the through groove. The driving component has a mating block at one end near the driving arm, and a top block at the other end away from the mating block that mates with the outlet of the plug feeding track. A tension spring is connected between the side wall of the through groove and the bottom wall of the top block. The tension spring is used to provide elastic force to keep the driving component pressed towards the driving arm, so that the top block is always blocking the outlet of the plug feeding track.

[0011] Furthermore, the drive arm sidewall has a drive block that mates with the mating block. The drive block is used to drive the mating block to move toward the plug feeding track, so as to release the top block from blocking the plug feeding track outlet.

[0012] The mating block has a first inclined surface at the side wall corresponding to the drive arm, and the side wall of the drive block has a second inclined surface that mates with the first inclined surface.

[0013] Furthermore, the placement component includes a fixed baffle fixedly disposed near one end of the plugging component and a movable baffle slidably disposed at the base. The inner walls of both the fixed baffle and the movable baffle have a second slot and a first slot. A first placement area and a second placement area for installing the feed pipe are formed between adjacent first slots and adjacent second slots, respectively. A driving device is installed inside the base. The driving device is used to drive the movable baffle to move to adjust the size of the first placement area and the second placement area.

[0014] Furthermore, each of the inner walls of the second slot has an inwardly recessed groove at the bottom, and a limiting component is rotatably installed at the bottom of the inner wall of the groove. The top of the limiting component has a counterweight, and the adjacent limiting components work together to support the material tube after the plugging is completed.

[0015] Furthermore, an opening is provided at the location corresponding to the second placement section of the base, and a first pushing device is installed inside the base to cooperate with the opening. The first pushing device is used to drive the material tube located at the bottom of the second placement section to move upward.

[0016] Furthermore, there is a passage between the bottom of the first placement section and the second placement section, and a second pushing device is installed at the top of the base corresponding to the first slot. A push plate is installed at the telescopic end of the second pushing device. The second pushing device is used to drive the push plate to push the material tube located in the first slot through the passage into the second slot.

[0017] Furthermore, a feeding track connected to the image testing mechanism is installed at the base, and a pressing cylinder and a dispensing cylinder are installed at the feeding track. The pressing cylinder and the dispensing cylinder are used to feed the semiconductor components into the material tube.

[0018] Furthermore, the defective product discharge mechanism is used to collect semiconductor components that fail the withstand voltage test and electrical test. The defective product discharge mechanism includes a first feeding track, and a first air blowing component is provided at the feeding end of the defective product discharge mechanism. A first material tube stacking component is installed at the discharging end of the first air blowing component. The first material tube stacking component includes a first placement component for placing material tubes. The first air blowing component is used to blow semiconductor components into the first feeding track, so that the semiconductor components enter the material tube inside the first placement component through the first feeding track.

[0019] Furthermore, the image inspection defective product receiving mechanism is used to receive semiconductor components that fail the image inspection. The image inspection defective product receiving mechanism includes a second feeding track, and a second air blowing component is provided at the inlet end of the image inspection defective product receiving mechanism. A second material tube stacking component is installed at the outlet end of the second air blowing component. The second material tube stacking component includes a second placement component for placing the material tube. The second air blowing component is used to blow the semiconductor components into the second feeding track, so that the semiconductor components enter the material tube inside the second placement component through the second feeding track.

[0020] Therefore, the beneficial effects of the semiconductor component testing sorting machine of the present invention are as follows:

[0021] By combining the withstand voltage testing mechanism, electrical testing mechanism, imaging testing mechanism, and sorting and receiving mechanism, semiconductor components can be tested for withstand voltage, electrical properties, and imaging characteristics without the need for separate testing. This allows for the automatic sorting of the tested semiconductor components without any manual intervention, improving both sorting efficiency and sorting effectiveness.

[0022] By incorporating a pin straightening mechanism, the bending of semiconductor component pins during production and transport is prevented from occurring. This bending can lead to instability and a lack of reliable electrical connection between the upper and lower test clamps and the semiconductor component pins during electrical testing, causing qualified products to be mistakenly identified as unqualified, increasing the scrap rate. Furthermore, the mechanism can easily cause jamming issues during the loading of semiconductor components into the feed tube and their transport along the track.

[0023] By setting up a sorting and receiving mechanism, automated tube changing and receiving can be achieved during the sorting and receiving process of products. By setting up a blocking component, automatic blocking and receiving can be achieved. The entire process is automated without human intervention, which solves the problems of easy mixing of materials, low efficiency and low degree of automation in traditional manual tube placement. Attached Figure Description

[0024] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0025] Figure 2 This is a three-dimensional structural diagram of the feeding mechanism of the present invention.

[0026] Figure 3 This is a three-dimensional structural diagram of the material distribution turntable of the present invention.

[0027] Figure 4 This is a three-dimensional structural diagram of the feeding turntable of the present invention.

[0028] Figure 5 This is a three-dimensional structural diagram of the pressure resistance testing mechanism of the present invention.

[0029] Figure 6 This is a three-dimensional structural diagram of the transfer track of the present invention.

[0030] Figure 7 This is a three-dimensional structural diagram of the positioning mechanism of the present invention.

[0031] Figure 8 This is a three-dimensional structural diagram of the electrical testing mechanism of the present invention.

[0032] Figure 9 This is a three-dimensional structural diagram of the pin straightening mechanism of the present invention.

[0033] Figure 10 for Figure 9 Enlarged view of section A.

[0034] Figure 11 This is a three-dimensional structural diagram of the straightening component one of the present invention.

[0035] Figure 12 This is a schematic diagram of another working state of the straightening component of the present invention.

[0036] Figure 13 This is a top sectional view of the support platform of the present invention.

[0037] Figure 14 for Figure 13 Enlarged view of section B.

[0038] Figure 15 This is a side sectional view of the support platform of the present invention.

[0039] Figure 16 This is a schematic diagram of the front sectional view of the support platform of the present invention.

[0040] Figure 17 This is a three-dimensional structural diagram of the straightening wheel of the present invention.

[0041] Figure 18 This is a schematic diagram of the good product receiving mechanism of the present invention.

[0042] Figure 19 This is a cross-sectional view of the third feed tube stacking assembly of the present invention.

[0043] Figure 20 This is a cross-sectional view of the second propulsion device of the present invention.

[0044] Figure 21 This is a top view cross-sectional diagram of the first card slot and the first card slot structure of the present invention.

[0045] Figure 22 For the present invention Figure 21 Enlarged view of section C.

[0046] Figure 23 This is a three-dimensional structural diagram of the plugging component of the present invention.

[0047] Figure 24 This is a top cross-sectional view of the plugging component of the present invention.

[0048] Figure 25 This is a side cross-sectional view of the plugging assembly of the present invention.

[0049] Figure 26 This is a schematic diagram of the side cross-sectional structure of the sliding cavity of the present invention.

[0050] Figure 27 This is a three-dimensional structural diagram of the plugging component of the present invention viewed from below.

[0051] The reference numerals in the appendix of this invention are as follows:

[0052] 100. Operating table; 10. Straightening assembly one; 101. Side straightening roller; 102. Adjusting assembly; 1021. Inner cavity; 1022. Slide rod; 1023. Elastic element; 1024. Connecting block; 1025. Vertical plate; 1026. Bottom groove; 110. Material distribution turntable straightening assembly two; 1101. Wheel frame; 1102. Straightening wheel; 111. Material distribution plate; 112. Suction assembly; 120. Feeding turntable; 121. Feeding plate; 122. Product clamp; 200. Feeding mechanism; 210. Storage pipe; 220. Material pipe receiving rack; 230 1. Feeding track; 240. Pushing assembly; 250. Pressing assembly; 300. Pressure resistance testing mechanism; 310. Test electrode one; 320. Test electrode two; 330. Electrode rod; 400. Transfer track; 500. Positioning mechanism; 510. Pushing head; 520. Pressing head; 600. Electrical testing mechanism; 610. Upper test clamp; 620. Lower test clamp; 700. Image testing mechanism; 710. 2D image detection assembly; 720. Bottom surface image detection assembly; 730. 3D image detection assembly; 800. Sorting and receiving mechanism; 81 0. Defective product discharge assembly; 820. Image-detected defective product receiving mechanism; 830. Good product receiving mechanism; 831. Third feeding track; 832. Pressing cylinder; 833. Distributing cylinder; 840. Plunger feeding mechanism; 841. Plunger vibratory feeder; 842. Plunger unloading track; 850. Third material tube stacking assembly; 851. Base; 852. Fixed baffle; 8521. First slot; 8522. Second slot; 8523. Groove; 853. Movable baffle; 854. Drive device; 855. First pushing device; 860. Limit Positioning component; 870, second pushing device; 880, plugging assembly; 881, plug guide rail; 882, slide cavity; 883, driving component; 8831, mating block; 884, top block; 885, driving arm; 8851, driving block; 886, tension spring; 890, third pushing device; 900, pin straightening mechanism; 910, fixed seat; 920, transverse linear drive assembly; 930, support platform; 940, vertical linear drive assembly; 950, fixed rail; 960, slide; 970, straightening pressure roller; 980, connecting plate; 990, fixed plate. Detailed Implementation

[0053] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0054] Example 1

[0055] The embodiments provided by the present invention will be described in detail below:

[0056] Reference Figures 1 to 17 A semiconductor component testing sorting machine includes an operating table 100. The operating table 100 is continuously equipped with a feeding mechanism 200, a withstand voltage testing mechanism 300, an electrical testing mechanism 600, an image testing mechanism 700, and a sorting and receiving mechanism 800. The feeding mechanism 200 is used to feed semiconductor components, the withstand voltage testing mechanism 300 is used to perform withstand voltage tests on the semiconductor components, the electrical testing mechanism 600 is used to perform electrical tests on the semiconductor components, the image testing mechanism 700 is used to perform visual inspection of the semiconductor components, and the sorting and receiving mechanism 800 is used to sort and receive the semiconductor components after they have been inspected by the image testing mechanism 700.

[0057] The sorting and receiving mechanism 800 includes a test defective product discharge mechanism 810, an image inspection defective product receiving mechanism 820, and a good product receiving mechanism 830. The test defective product discharge mechanism 810 is used to receive semiconductor components that fail the withstand voltage test and electrical test. The image inspection defective product receiving mechanism 820 is used to receive semiconductor components that fail the image test. The good product receiving mechanism 830 is used to receive semiconductor components that pass the test.

[0058] It should be noted that by setting up a test defective product sorting mechanism 810, an image inspection defective product receiving mechanism 820, and a good product receiving mechanism 830, automatic sorting and receiving of semiconductor components is achieved. The test defective product sorting mechanism 810 specifically handles components that fail the withstand voltage and electrical tests, the image inspection defective product receiving mechanism 820 handles components that fail the image inspection, and the good product receiving mechanism 830 is responsible for collecting components that pass the tests. This division of labor ensures that components with different defect types are accurately separated, avoiding the quality risks caused by mixed receiving.

[0059] The feeding mechanism 200 includes a material tube receiving rack 220, in which multiple storage material tubes 210 are stacked. The discharge end of the material tube receiving rack 220 is provided with a feeding track 230. The discharge end of the feeding mechanism 200 is provided with a pushing component 240 and a pressing component 250. The pushing component 240 is used to push the semiconductor element located at the discharge end to the picking position, and the pressing component 250 is used to press and position the semiconductor element adjacent to the semiconductor element at the discharge end.

[0060] It should be noted that the pushing component 240 is a movable clamp for placing semiconductor components at the discharge end of the feeding mechanism 200. The clamp can be moved by a cylinder. When the semiconductor component moves to the clamp with the feeding track 230, the clamp is extended and moved to the picking position by driving it. Then, the suction component 112 set on the straightening component 210 of the sorting turntable picks up the product and feeds it. The pressing component 250 is a pressing block that can move vertically. The pressing block can be driven by a cylinder. When the first semiconductor component moves to the clamp, the clamp is driven to move downward to press down the second semiconductor component, so as to avoid the problem of the second semiconductor component slipping during the feeding of the first semiconductor component.

[0061] It should also be noted that a lead-cutting mechanism is provided on the feeding track 230. The lead-cutting mechanism may include a cutter that can move linearly in the vertical direction. The cutter can be driven by a cylinder. During the feeding process of semiconductor components via the feeding mechanism 200, the cutter cuts the leads of the semiconductor components. This allows the lead length of the semiconductor components to be adjusted according to the lead length requirements of different customers. The lead-cutting mechanism may also include two baffle components, both of which are located on the feeding track 230 and on both sides of the cutter. The baffle components may include a cylinder and a baffle plate. When the semiconductor component moves to the working position of the cutter, the cylinder drives the baffle plate to move, so that the two baffle plates are located on both sides of the semiconductor component to perform the baffle function. In addition, the lead-cutting mechanism also includes a positioning component, which may include a cylinder and a positioning plate. When the semiconductor component is in the working position of the cutter, the cylinder drives the positioning plate to abut against the semiconductor component and position the semiconductor component to prevent the semiconductor component from shifting during the lead-cutting process and affecting the lead-cutting process.

[0062] The operating table 100 is also equipped with multiple material sorting turntable straightening components 110 and feeding turntables 120. The material sorting turntable straightening components 110 include multiple suction components 112, which are used to pick up and drop semiconductor components. The feeding turntables 120 include multiple product clamps 122, which are used to clamp and fix semiconductor components. The material sorting turntable straightening components 110 can be used to transport semiconductor components to the test defective product discharge component 810, the image inspection defective product receiving mechanism 820, and the good product receiving mechanism 830. The material sorting turntable straightening components 110 include three sets, and the feeding turntables 120 include two sets. The withstand voltage testing mechanism 300 and the electrical testing mechanism 600 are respectively set at the corresponding workstations of the feeding turntables 120. The feeding end and the discharge end of the feeding turntables 120, which are surrounded by the withstand voltage testing mechanism 300, are each equipped with a set of material sorting turntables. The second set of straightening components 110 includes a set of feeding turntables 120, one of which is used to transport semiconductor components conveyed by the feeding mechanism 200 to the feeding turntable 120. The operating table 100 is also equipped with a transfer track 400. The other set of feeding turntables 110 is used to transport semiconductor components tested by the withstand voltage testing mechanism 300 to the transfer track 400. The discharge end of the transfer track 400 is equipped with a set of feeding turntables 110. The feeding turntables 110 is used to transport semiconductor components conveyed by the transfer track 400 to another set of feeding turntables 120, so that the semiconductor components are tested by the electrical testing mechanism 600 and the image testing mechanism 700. Then, the components are sorted and transported by the feeding turntables 110 to the defective product discharge assembly 810, the image detection defective product receiving mechanism 820, and the good product receiving mechanism 830.

[0063] It should be noted that the material distribution turntable straightening component 2 110 includes an actively rotatable material distribution disc 111. The material distribution disc 111 can be driven to rotate by a motor. Multiple suction components 112 are evenly distributed in the circumferential direction of the material distribution disc 111. The suction components 112 can be suction nozzles that can move linearly up and down. The suction nozzles press down on the semiconductor components to adsorb and fix them, and then rise back to reset. The material distribution disc 111 can be designed with a vacuum integration mechanism for continuous vacuum supply to the suction nozzles. The vacuum integration mechanism is divided into three layers. The first layer rotates with the material distribution disc 111. The second layer is made of graphite material and plays a lubricating role during continuous rotation. The third layer is the fixed end, and the vacuum is connected to this layer.

[0064] It should be noted that the feeding turntable 120 includes a feed tray 121 that can be actively rotated. The feed tray 121 can be driven to rotate by a motor. Multiple product clamps 122 are evenly distributed in the circumferential direction of the feed tray 121. Each product clamp 122 includes an upper lifting mechanism and a clamp that can move on one side. Before the semiconductor component is placed in, the upper lifting mechanism lifts up to open the clamp, and the semiconductor component is placed into the product clamp 122. The upper lifting mechanism then lowers to close the clamp, fixing the semiconductor component in place. The upper lifting mechanism can be composed of a slide cylinder and a cam bearing.

[0065] Understandably, based on the non-conforming classification signals detected during the withstand voltage test, electrical test, and image test, the semiconductor components that fail the withstand voltage test and electrical test are transported to the defective product discharge assembly 810 for collection via the straightening assembly 2 110 of the sorting turntable. Semiconductor components that fail the image test are transported to the image detection defective product receiving mechanism 820 for collection, and semiconductor components that pass the withstand voltage test, electrical test, and image test are transported to the good product receiving mechanism 830 for collection.

[0066] The withstand voltage testing mechanism 300 includes a test electrode 310, a test electrode 320, and an electrode rod 330, all capable of vertical linear movement. Through linear movement, the test electrode 310, test electrode 320, and electrode rod 330 cause the test electrode 310 to press against the semiconductor device, the test electrode 320 to press against the leads of the semiconductor device, and the electrode rod 330 to be inserted into the central hole of the semiconductor device for withstand voltage testing. The electrical testing mechanism 600 includes an upper test clip 610 and a lower test clip 620, with the upper test clip 610... The upper test clip 610 and the lower test clip 620 can move synchronously in opposite directions. The electrical testing mechanism 600 clamps the pins of the semiconductor device for electrical testing through the synchronous and opposite movements of the upper test clip 610 and the lower test clip 620. The image testing mechanism 700 includes a 2D image detection component 710, a bottom surface image detection component 720 and a 3D image detection component 730. The image testing mechanism 700 performs six-sided visual inspection of the semiconductor device through the 2D image detection component 710, the bottom surface image detection component 720 and the 3D image detection component 730.

[0067] It should be noted that during the testing of semiconductor components, semiconductor devices can be tested using specialized testing instruments. The testing instruments will then feed the test results back to the terminal equipment, thereby distinguishing between qualified and defective semiconductor components. After distinguishing between qualified and unqualified semiconductor components, the qualified and unqualified semiconductor components will be sorted and collected.

[0068] The discharge end of the transfer track 400 is also provided with a positioning mechanism 500. The positioning mechanism 500 includes a pusher head 510 that can move horizontally in a straight line and a presser head 520 that can move vertically in a straight line. The positioning mechanism 500 positions the semiconductor components on the product holder 122 through the pusher head 510 and the presser head 520.

[0069] It should be noted that when the semiconductor device is about to undergo electrical testing, both the pusher head 510 and the pressing head 520 can be driven by a cylinder. The pusher head 510 is driven by the cylinder to push the semiconductor device against the product holder 122, and the pressing head 520 is driven by the cylinder to press the semiconductor device, thereby positioning the semiconductor device. The semiconductor device is then clamped and fixed by the product holder 122. The pusher head 510 can be fixed by two guide rods, and springs are installed on the guide rods to buffer the pusher head 510 during pushing to prevent damage to the product.

[0070] Example 2

[0071] Reference Figures 1 to 17 Based on Embodiment 1, in the above technical solution, since the semiconductor components are not transported via a track arrangement during production and conveying, they are usually mixed together. During this process, the leads of the semiconductor components are prone to collision, causing the leads to bend. This bend can lead to the upper test clamp 610 and the lower test clamp 620 failing to make stable contact with the leads of the semiconductor components to form a reliable electrical connection during electrical testing. This can easily lead to qualified products being mistakenly judged as unqualified, increasing the scrap rate. Furthermore, bent leads may temporarily make contact under pressure, resulting in a test passing and unqualified semiconductor components being mistakenly judged as qualified. Even if a semiconductor component with bent and deformed leads is qualified, it will still be detected as qualified during the testing process. However, during sorting and receiving, receiving the semiconductor components into the material tube 210, and conveying them on the track, jamming problems can easily occur. Therefore, this invention proposes a lead straightening mechanism 900 to straighten the leads of semiconductor components during the feeding process.

[0072] The operating table 100 is also equipped with a pin straightening mechanism 900 and a transfer track 400. The pin straightening mechanism 900 is located on one side of the transfer track 400. The pin straightening mechanism 900 includes a fixed base 910 fixedly mounted on the operating table 100. The fixed base 910 is equipped with a horizontal linear drive assembly 920 and a vertical linear drive assembly 940. A support platform 930 is mounted on the output end of the horizontal linear drive assembly 920. The side of the support platform 930 abuts against the side of the transfer track 400. Furthermore, the semiconductor element's pins are located above the support platform 930. A fixed rail 950 is installed at the output end of the vertical linear drive assembly 940. A slide block 960 is slidably mounted on the fixed rail 950, and a straightening pressure roller 970 is rotatably mounted at the bottom of the slide block 960. The straightening pressure roller 970 makes rolling contact with the semiconductor element's pins. A connecting plate 980 is fixedly mounted on one side of the slide block 960, and a fixed plate 990 is fixedly mounted on the support platform 930. The connecting plate 980 is slidably mounted within the fixed plate 990.

[0073] It should be noted that both the horizontal linear drive assembly 920 and the vertical linear drive assembly 940 can be cylinders. First, the horizontal linear drive assembly 920 can drive the support platform 930 to move until it contacts the side of the transfer track 400. At this time, the pins of the semiconductor element are above the support platform 930. Then, the vertical linear drive assembly 940 can drive the straightening roller 970 to move downward, so that the straightening roller 970 contacts the pins of the semiconductor element. Then, the vertical linear drive assembly 940 can drive the support platform 930 to move away from the transfer track 400, so that it can drive the straightening roller 970 to roll on the pin surface through the fixed plate 990, the connecting plate 980 and the slide 960. With the cooperation of the support platform 930, the pins of the semiconductor element can be straightened.

[0074] In the above technical solution, when flat pins are bent, they usually bend upwards. In this case, the pin straightening mechanism 900 can be used to straighten the flat pins by cooperating with the straightening pressure roller 970 above the pin and the support table 930. However, for pins with an approximately square cross-section, the pins not only bend downwards but also bend laterally. Therefore, the present invention also proposes a straightening component 10 for straightening pins with an approximately square cross-section. Specifically, the support table 930 is provided with the straightening component 10, which includes multiple straightening elements. Each straightening element includes two side straightening rollers 101. The two side straightening rollers 101 clamp a pin of the semiconductor element and straighten the pin through linear motion.

[0075] It should be noted that, through the multiple sets of straightening components set on the support platform 930, each set of straightening components includes two side straightening rollers 101. When the support platform 930 and the straightening pressure roller 970 are driven to move away from the transfer track 400 by the image detection defective product receiving mechanism 820, the leads of the semiconductor components can be straightened through the straightening pressure roller 970, the support platform 930 and the two side straightening rollers 101, thus realizing the straightening process of leads that are approximately square.

[0076] It should be further explained that if the pin is initially bent laterally, when the support platform 930 is driven to move closer to the transfer track 400 by the lateral linear drive component 920, a jamming problem may easily occur between the side straightening roller 101 and the pin. To address this, the present invention also proposes an adjustment component 102. Specifically, the support platform 930 is also provided with an adjustment component 102. The adjustment component 102 includes an inner cavity 1021 opened in the support platform 930. Two slide rods 1022 are slidably arranged in the inner cavity 1021. The two side straightening rollers 101 are respectively installed on the corresponding slide rods 1022, and elastic elements 1023 are installed at the ends of the two slide rods 1022. Connecting blocks 1024 are installed on the sides of the two slide rods 1022. Vertical plates 1025 are fixedly installed on the two connecting blocks 1024. A roller frame is installed at the bottom of the slide block 960, and the straightening pressure roller 970 is rotatably arranged in the roller frame. A bottom groove 1026 is provided, and a vertical plate 1025 is slidably disposed in the bottom groove 1026. The elastic element 1023 is a spring. In the initial state, the distance between the two side straightening rollers 101 is greater than the width of the pin. When the drive support table 930 moves towards the transfer track 400, the gap between the two side straightening rollers 101 can be used to avoid the problem of material jamming between the side straightening rollers 101 and the pin. When the support table 930 moves to the designated position, the vertical linear drive assembly 940 drives the straightening pressure roller 970 to move downward. Through the cooperation of the bottom groove 1026 and the vertical plate 1025, the two slide rods 1022 can move closer together, and drive the corresponding side straightening rollers 101 to move closer together, so that the two corresponding side straightening rollers 101 can contact the two sides of the corresponding side straightening roller 101. Then, during the movement of the drive straightening pressure roller 970 and the two side straightening rollers 101, the pin of the semiconductor element can be straightened.

[0077] It should be further explained that when the lead of a semiconductor component is bent at a large angle, such as when the two leads are bent to the point of contact, a jamming problem may still occur when the support platform 930 moves toward the transfer track 400. To address this, a vertical drive cylinder can be installed at the bottom of the lead straightening mechanism 900. The output end of the vertical drive cylinder is fixedly connected to the fixed base 910. In the initial state, the fixed base 910 is driven to move downward, causing the side straightening rollers 101 to move below the lead. Then, the support platform 930 is driven to move toward the transfer track 400 via the horizontal linear drive assembly 920. When the support platform 930 moves to the designated position, the fixed base 910 is driven to move upward and reset via the vertical drive cylinder until the lead is located between the two corresponding side straightening rollers 101 and contacts the top of the support platform 930. At this point, the lead straightening mechanism 900 and the straightening assembly 10 can achieve the straightening of the lead.

[0078] It should also be noted that when a vertical drive cylinder is set, the adjustment component 102 can also have the effect of preventing pin wear caused by the contact between the straightening roller 101 and the pin during the upward movement and reset of the drive fixed seat 910. This is because the distance between the two side straightening rollers 101 is greater than the width of the pin.

[0079] In the above technical solutions, semiconductor device leads are not only flat leads and leads with approximately square cross-sections, but also circular leads. If the circular leads are straightened using the above solutions, during the straightening process, since the circular leads and rollers are always in point or line contact, the contact area is small and the local pressure is high. If the rollers are slightly worn or out of sync during the straightening process, the leads will be pressed with marks, introducing new bends and affecting the finished quality of the semiconductor device. To address this, the present invention also proposes a material distribution turntable straightening assembly 110. Specifically, a wheel frame 1101 is provided on the support platform 930. The support platform 930 includes two wheel frames 1101, which are respectively installed on the support platform 930 and the roller frame. Multiple straightening wheels 1102 are rotatably arranged in both wheel frames 1101. The straightening wheels 1102 are used to center the leads of the semiconductor device.

[0080] It should be noted that the straightening wheel 1102 has a V-shaped groove. The V-shaped groove on the straightening wheel 1102 is used to correct the pin before straightening, so that the pin is adjusted to be perpendicular to the roller before straightening. Then, the pin straightening mechanism 900 and the straightening component 10 are used for further straightening, which ensures the straightening effect of the pin.

[0081] It should also be noted that the straightening wheel 1102 with V-groove can not only straighten the round pins, but also assist in the straightening of the directional pins. The straightening wheel 1102 with V-groove guides the square pins to ensure that the posture is consistent when entering the main straightening area and to ensure the stability of the pins during the straightening process.

[0082] Specifically, the semiconductor components to be tested and sorted are first conveyed by the feeding mechanism 200. The semiconductor components are then conveyed to the corresponding feeding turntable 120 by the corresponding straightening component 110 for withstand voltage testing. The semiconductor components that have passed the withstand voltage test are conveyed to another set of feeding turntables 120 by the corresponding straightening component 110. After electrical testing and image vision inspection, the semiconductor components are sorted by the corresponding straightening component 110. The semiconductor components that fail the test are conveyed to the defective product discharge component 810 and the defective product receiving mechanism 820 for collection, while the semiconductor components that pass the test are conveyed to 830 for collection. Automatic tube changing and receiving are achieved by the tube stacking components set on the defective product discharge component 810, the defective product receiving mechanism 820, and the good product receiving mechanism 830.

[0083] Example 3

[0084] like Figures 18 to 27 As shown, based on embodiments 1-2, the good product receiving mechanism 830 in this embodiment includes a plug feeding mechanism 840 and a third material tube stacking assembly 850. The third material tube stacking assembly 850 includes a base 851, on which a third placement assembly for placing material tubes is installed. The plug feeding mechanism 840 includes a plug vibrating plate 841, and the outlet end of the plug vibrating plate 841 is provided with a plug unloading track 842. The output end of the plug unloading track 842 is equipped with a plugging assembly 880.

[0085] The plugging assembly 880 includes a plug guide rail 881 located below the plug feeding track 842. The plug guide rail 881 has a sliding cavity 882 for lateral movement of the plug. The end of the plug guide rail 881 has an extension corresponding to the end of the material tube in the third placement assembly. A drive arm 885 is slidably mounted on the end of the extension away from the end of the material tube. A third pushing device 890 is mounted on the drive arm 885. The third pushing device 890 is used to reciprocate the drive arm 885 to press the plug located at the extension into the interior of the material tube end. The extension has a vertically movable sliding cavity 882, as seen in… Figure 8 As shown, the extension is perpendicular to the plug guide rail 881 and is connected to it.

[0086] It should be noted that the good product receiving mechanism 830 integrates the plug feeding mechanism 840 and the third material tube stacking assembly 850. The plug feeding mechanism 840 automatically supplies plugs through the plug vibrating plate 841 and the plug feeding track 842, and uses the plugging assembly 880 to automatically squeeze the plugs into the end of the material tube. This process realizes automatic tube sealing after the good product is received, replacing the traditional manual operation of inserting plugs.

[0087] In addition, the drive arm 885 reciprocates along the extension under the drive of the third pusher 890, precisely pressing the plug into the inside of the end of the feed tube, ensuring a tight fit between the plug and the feed tube, and achieving a reliable seal.

[0088] like Figures 20 to 27 As shown, the plug guide rail 881 has a through groove along its length. A drive component 883 is slidably installed in the through groove. The drive component 883 has a mating block 8831 at one end near the drive arm 885. The drive component 883 has a top block 884 at the end away from the mating block 8831, which mates with the outlet of the plug feeding track 842. A tension spring 886 is connected between the side wall of the through groove and the bottom wall of the top block 884. The tension spring 886 is used to provide elastic force to keep the drive component 883 pressed against the drive arm 885, so that the top block 884 is always blocking the outlet of the plug feeding track 842.

[0089] The drive arm 885 has a drive block 8851 on its side wall that cooperates with the mating block 8831. The drive block 8851 is used to drive the mating block 8831 to move towards the plug feeding track 842 so that the top block 884 can release the obstruction of the plug feeding track 842 outlet.

[0090] The mating block 8831 has a first inclined surface at the corresponding side wall of the drive arm 885, and the drive block 8851 has a second inclined surface at the side wall that mates with the first inclined surface.

[0091] It should be noted that under the elastic force of the tension spring 886, the drive component 883 is pulled towards the drive arm 885, so that the top block 884 always blocks the outlet of the plug feeding track like a normally closed "valve", preventing subsequent plugs from falling. When the drive arm 885 is plugging, the top block 884 on the drive component 883 will be pushed open by the drive block 8851 to temporarily move away, allowing one plug to fall, thus avoiding the risk of plugs continuously gushing out from the vibrating plate 841 and accumulating and jamming at the outlet of the plug feeding track 842.

[0092] Specifically, in use, when the third pushing device 890 drives the driving arm 885 to move, the driving arm 885 drives the plug located at the extension to move towards the end of the feed tube until the plug is inserted into the interior of the feed tube end. At the same time, the movement of the driving arm 885 drives the driving block 8851 to move and drive the mating block 8831 to move towards the plug feeding track 842, so that the top block 884 on the driving member 883 is disengaged from the obstruction of the outlet of the plug feeding track 842. At this time, the tension spring 886 is stretched, and a gap appears at the original position of the top block 884. The plug in the plug feeding track 842 falls into the gap for automatic feeding. After the plug is inserted into the interior of the feed tube end, the driving arm 885 resets, causing the driving arm to... 885 releases the pressure on mating block 8831. At this time, tension spring 886 retracts, causing top block 884 to reset and block the outlet of plug feeding track 842 again. At the same time, the newly added plug is pushed inward, pushing the new plug into the extension section for easy plugging operation in the next operation. This completes the automatic plugging process, enabling automatic sorting and receiving of semiconductor components. During the sorting and receiving process, automatic tube changing and receiving are also achieved. In addition, automatic plugging and receiving can be performed during the receiving of qualified semiconductor components. The entire process is automatic sorting without human intervention. Automatic material replenishment is achieved during the plugging process, eliminating the need for manual plugging and replenishment. The degree of automation is high, solving the problems of easy mixing and low efficiency of traditional manual tube placement.

[0093] like Figures 20 to 22 As shown, the placement assembly includes a fixed baffle 852 fixedly disposed near one end of the plugging assembly 880 and a movable baffle 853 slidably disposed at the base 851. The inner walls of both the fixed baffle 852 and the movable baffle 853 have a second slot 8522 and a first slot 8521. A first placement area and a second placement area for installing the feed pipe are respectively formed between adjacent first slots 8521 and adjacent second slots 8522. A driving device 854 is installed inside the base 851. The driving device 854 is used to drive the movable baffle 853 to move to adjust the size of the first and second placement areas. The driving device 854 can be a cylinder or a hydraulic cylinder.

[0094] It should be noted that the movable baffle 853 and the fixed baffle 852 allow users to adjust the size of the first and second placement areas according to different lengths of material tubes, improving the practicality and applicability of the device. When the production line needs to switch to different lengths of material tubes, the size of the first and second placement areas can be quickly adjusted without replacing any hardware, shortening the changeover time and improving production flexibility.

[0095] like Figure 22As shown, the bottom of the inner wall of the second slot 8522 is provided with an inwardly recessed groove 8523. A limiting member 860 is rotatably installed at the bottom of the inner wall of the groove 8523. The top of the limiting member 860 has a counterweight block. The adjacent limiting members 860 are used together to support the material tube after the plugging is completed.

[0096] The base 851 has an opening corresponding to the second placement section. The base 851 is equipped with a first pushing device 855 that cooperates with the opening. The first pushing device 855 is used to drive the material tube located at the bottom of the second placement section to move upward.

[0097] It should be noted that the groove 8523, the limiting component 860, and the counterweight ensure that the limiting component 860 remains in the correct position. Figure 22 In the state shown, during use, after plugging is completed, the first pushing device 855 drives the plugged material tube located at the bottom of the second placement interval to move upward. The upward movement of the plugged material tube pushes the counterweight on the limiting member 860 to rotate inward, making the limiting member 860 flush with the groove 8523. This causes the plugged material tube to move above the limiting member 860. Due to the action of the counterweight on the limiting member 860, the limiting member 860 automatically rotates inward. Figure 22 In the state shown, the first pushing device 855 retracts, thereby causing the limiting member 860 to support the bottom of the plugged material tube. This cycle can be repeated to automatically stack the material tube on the limiting member 860 in the second placement area.

[0098] like Figures 20 to 22 As shown, there is a passage between the bottom of the first placement section and the second placement section. A second pushing device 870 is installed at the top of the base 851 corresponding to the first slot 8521. A push plate is installed at the telescopic end of the second pushing device 870. The second pushing device 870 is used to drive the push plate to push the material tube located in the first slot 8521 through the passage to the second slot 8522.

[0099] A feeding track 831 connected to the image testing mechanism 700 is installed at the base 851. A pressing cylinder 832 and a dispensing cylinder 833 are installed at the feeding track 831. The pressing cylinder 832 and the dispensing cylinder 833 are used to feed semiconductor components into the material tube.

[0100] It should be noted that the width of the push plate is the same as the width of the first placement area, and the second pushing device 870 can be a cylinder or a hydraulic cylinder.

[0101] like Figure 1As shown, the defective product discharge mechanism 810 is used to collect semiconductor components that fail the withstand voltage test and the electrical test. The defective product discharge mechanism 810 includes a first feeding track. The inlet end of the defective product discharge mechanism 810 is provided with a first air blowing component. The outlet end of the first air blowing component is equipped with a first material tube stacking component. The first material tube stacking component includes a first placement component for placing material tubes. The first air blowing component is used to blow semiconductor components into the first feeding track, so that the semiconductor components enter the material tube inside the first placement component through the first feeding track.

[0102] The image inspection defective product receiving mechanism 820 is used to receive semiconductor components that fail the image inspection. The image inspection defective product receiving mechanism 820 includes a second feeding track. The feeding end of the image inspection defective product receiving mechanism 820 is provided with a second blowing assembly. The discharging end of the second blowing assembly is equipped with a second material tube stacking assembly. The second material tube stacking assembly includes a second placement assembly for placing material tubes. The second blowing assembly is used to blow semiconductor components into the second feeding track, so that the semiconductor components enter the material tube inside the second placement assembly through the second feeding track.

[0103] It should be noted that the first tube stacking assembly, the second tube stacking assembly, and the third tube stacking assembly 850 have the same structure. They can all be automatically stacked after the tubes are filled with semiconductor components, without the need for manual tube replacement, and have a high degree of automation.

[0104] The method of using this semiconductor component testing sorting machine includes the following steps:

[0105] Step 1: The semiconductor components to be tested and sorted are conveyed by the feeding mechanism 200 and transferred to the feeding turntable 120 by the straightening component 2 110 at the feeding end of the feeding turntable 120. The semiconductor components are then subjected to a withstand voltage test by the withstand voltage testing mechanism 300.

[0106] Step 2: After the withstand voltage test is completed, the semiconductor component that has passed the withstand voltage test is transported to the transfer track 400 by the straightening assembly 2 110 of the feed turntable 120 at the discharge end. After being transported by the transfer track 400 and the lead straightening mechanism 900 straightens the lead of the semiconductor component, it is then transported to another set of feed turntables 120 by the straightening assembly 2 110 of the feed turntable 120 at the inlet and outlet ends. The semiconductor component is then positioned by the positioning mechanism 500.

[0107] Step 3: Then, the semiconductor device is subjected to electrical testing by the electrical testing mechanism 600. After the electrical testing, a preliminary visual inspection is performed by the 2D image detection component 710. The semiconductor device that has undergone electrical testing and preliminary visual inspection is then attracted to the suction component 112 of the feeding turntable straightening component 110 at the feeding end of another set of feeding turntables 120. It then passes through the bottom image detection component 720 and the 3D image detection component 730 for further visual inspection of the semiconductor device.

[0108] Step 4: The semiconductor components that have undergone withstand voltage testing, electrical testing, and visual image inspection are then sorted and transported to the test defective product discharge assembly 810, the image inspection defective product receiving mechanism 820, and the good product receiving mechanism 830 for collection and automatic stacking. The material tubes filled with qualified semiconductor components are then automatically plugged by the plugging assembly 880.

[0109] This invention can perform withstand voltage tests on the semiconductor component body, rejecting defective products. It also allows for lead trimming to meet different customer requirements for lead length. Following the withstand voltage test, the product undergoes electrical testing and six-sided visual inspection. Automatic sorting is then performed, and the sorting and receiving process can be automated by changing tubes and receiving materials. Furthermore, by setting up a blocking component, automatic blocking and receiving can be achieved. This fully automated sorting process, without human intervention, solves the problems of easy mixing, low efficiency, and low automation associated with traditional manual tube placement.

[0110] It is readily understood that those skilled in the art can combine, split, or reorganize the embodiments provided in this application to obtain other embodiments, all of which do not exceed the protection scope of this application.

[0111] The present invention and its embodiments have been described above illustratively. This description is not restrictive, and the embodiments shown are only part of the embodiments of the present invention. The actual structure is not limited thereto. Therefore, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the spirit of the present invention, they should all fall within the protection scope of the present invention.

Claims

1. A sorting machine for testing semiconductor components, characterized in that, It includes an operating table (100), on which a feeding mechanism (200), a withstand voltage testing mechanism (300), an electrical testing mechanism (600), an image testing mechanism (700), and a sorting and receiving mechanism (800) are continuously provided. The sorting and receiving mechanism (800) includes a defective product discharge mechanism (810), an image detection defective product receiving mechanism (820), and a good product receiving mechanism (830). The good product receiving mechanism (830) includes a plug feeding mechanism (840) and a third tube stacking assembly (850). The third tube stacking assembly (850) includes a base (851) on which a third placement assembly for placing tubes is installed. The plug feeding mechanism (840) includes a plug vibrating plate (841). The outlet end of the plug vibrating plate (841) is provided with a plug unloading track (842). The output end of the plug unloading track (842) is provided with a plugging assembly (880). The plugging assembly (880) includes a plug guide rail (881) located below the plug feeding track (842). The plug guide rail (881) has a sliding cavity (882) for the plug to move. The end of the plug guide rail (881) has an extension corresponding to the end of the material tube in the third placement assembly. A drive arm (885) is slidably mounted on the end of the extension away from the end of the material tube. A third pushing device (890) is mounted on the drive arm (885). The third pushing device (890) is used to reciprocate to drive the drive arm (885) to move, so as to squeeze the plug located at the extension into the interior of the end of the material tube. The operating table (100) is also provided with a pin straightening mechanism (900) and a transfer track (400). The pin straightening mechanism (900) is located on one side of the transfer track (400). The pin straightening mechanism (900) includes a fixed base (910) fixedly mounted on the operating table (100). A horizontal linear drive assembly (920) and a vertical linear drive assembly (940) are provided on the fixed base (910). A support platform (930) is installed at the output end of the horizontal linear drive assembly (920). The side of the support platform (930) abuts against the side of the transfer track (400). The output end of the vertical linear drive assembly (940) is equipped with a fixed rail (950) and the semiconductor element pins are located above the support platform (930). A slide block (960) is slidably arranged on the fixed rail (950), and a straightening pressure roller (970) is rotatably arranged at the bottom of the slide block (960). The straightening pressure roller (970) rolls in contact with the semiconductor element pins. A connecting plate (980) is fixedly arranged on one side of the slide block (960), and a fixed plate (990) is fixedly arranged on the support platform (930). The connecting plate (980) is slidably arranged inside the fixed plate (990). The support platform (930) is provided with a straightening component (10). The straightening component (10) includes multiple straightening parts. One set of straightening parts includes two side straightening rollers (101). The two side straightening rollers (101) clamp a pin of the semiconductor element and straighten the pin by linear motion.

2. A semiconductor component testing sorting machine according to claim 1, characterized in that, The plug guide rail (881) has a through groove along its length. A drive member (883) is slidably installed in the through groove. The drive member (883) has a mating block (8831) at one end near the drive arm (885). The drive member (883) has a top block (884) at the other end away from the mating block (8831) that mates with the outlet of the plug feeding track (842). A tension spring (886) is connected between the side wall of the through groove and the bottom wall of the top block (884). The tension spring (886) is used to provide elastic force to keep the drive member (883) pressed against the drive arm (885) so that the top block (884) is always blocking the outlet of the plug feeding track (842).

3. A semiconductor component testing sorting machine according to claim 2, characterized in that, The drive arm (885) has a drive block (8851) on its side wall that cooperates with the mating block (8831). The drive block (8851) is used to drive the mating block (8831) to move towards the plug feeding track (842) so that the top block (884) can release the obstruction of the plug feeding track (842) outlet. The mating block (8831) and the drive arm (885) have a first inclined surface on their corresponding side walls, and the drive block (8851) has a second inclined surface on its side wall that mates with the first inclined surface.

4. A semiconductor component testing sorting machine according to claim 1, characterized in that, The placement assembly includes a fixed baffle (852) fixedly disposed near one end of the plugging assembly (880) and a movable baffle (853) slidably disposed on the base (851). The inner walls of the fixed baffle (852) and the movable baffle (853) each have a second slot (8522) and a first slot (8521). A first placement area and a second placement area for installing the feed pipe are formed between adjacent first slots (8521) and adjacent second slots (8522), respectively. A driving device (854) is installed inside the base (851). The driving device (854) is used to drive the movable baffle (853) to move to adjust the size of the first placement area and the second placement area.

5. A semiconductor component testing sorting machine according to claim 4, characterized in that, The bottom of the inner wall of the second slot (8522) is provided with an inwardly recessed groove (8523). A limiting member (860) is rotatably installed at the bottom of the inner wall of the groove (8523). The top of the limiting member (860) has a counterweight block. The adjacent limiting members (860) are used together to support the material tube after the plugging is completed.

6. A semiconductor component testing sorting machine according to claim 5, characterized in that, The base (851) has an opening corresponding to the second placement section. The base (851) is equipped with a first pushing device (855) that cooperates with the opening. The first pushing device (855) is used to drive the material tube located at the bottom of the second placement section to move upward.

7. A semiconductor component testing sorting machine according to claim 6, characterized in that, There is a passage between the bottom of the first placement section and the second placement section. A second pushing device (870) is installed at the top of the base (851) corresponding to the first slot (8521). A push plate is installed at the telescopic end of the second pushing device (870). The second pushing device (870) is used to drive the push plate to push the material tube located in the first slot (8521) through the passage to the second slot (8522).

8. A semiconductor component testing sorting machine according to claim 7, characterized in that, A feeding track (831) connected to the image testing mechanism (700) is installed at the base (851). A pressing cylinder (832) and a dispensing cylinder (833) are installed at the feeding track (831). The pressing cylinder (832) and the dispensing cylinder (833) are used to feed semiconductor components into the material tube.

9. A semiconductor component testing sorting machine according to claim 1, characterized in that, The defective product discharge mechanism (810) is used to collect semiconductor components that fail the withstand voltage test and electrical test. The defective product discharge mechanism (810) includes a first feeding track. The feeding end of the defective product discharge mechanism (810) is provided with a first blowing component. The discharging end of the first blowing component is equipped with a first material tube stacking component. The first material tube stacking component includes a first placement component for placing material tubes. The first blowing component is used to blow semiconductor components into the first feeding track, so that the semiconductor components enter the material tube inside the first placement component through the first feeding track.

10. A semiconductor device sorting machine for testing according to claim 1, characterized in that, The image inspection defective product receiving mechanism (820) is used to receive semiconductor components that fail the image inspection. The image inspection defective product receiving mechanism (820) includes a second feeding track. The feeding end of the image inspection defective product receiving mechanism (820) is provided with a second blowing assembly. The discharging end of the second blowing assembly is equipped with a second material tube stacking assembly. The second material tube stacking assembly includes a second placement assembly for placing material tubes. The second blowing assembly is used to blow semiconductor components into the second feeding track, so that the semiconductor components enter the material tube inside the second placement assembly through the second feeding track.

Images