Double-station chemical mechanical polishing equipment and polishing solution detection method thereof

Abstract

The invention discloses double-station chemical mechanical polishing equipment and a polishing solution detection method thereof, and relates to the technical field of semiconductor machining, the chemical mechanical polishing equipment comprises a polishing disc, a bearing head, a solution supply mechanism and a cleaning mechanism, the polishing disc is located above the polishing disc, and the input end of the bearing head is in transmission connection with a polishing driving assembly; the bearing head bears the workpiece to the polishing disc and polishes the to-be-polished surface of the workpiece; the liquid supply mechanism comprises a main liquid supply pipe and is used for conveying the polishing liquid to the polishing disc; the cleaning mechanism comprises a mechanical arm, a liquid receiving disc and a cleaning assembly, the liquid receiving disc is arranged at the output end of the mechanical arm, the mechanical arm is used for transferring the liquid receiving disc to the position below the bearing head, the cleaning assembly is arranged in the liquid receiving disc and comprises a spray head, and when the bearing head is located at the cleaning position, the opening end face of the liquid receiving disc abuts against the lower end face of the bearing head in a sealed mode. The spray head sprays cleaning liquid towards the surface of the polished workpiece; according to the chemical mechanical polishing equipment, in-situ cleaning of the workpiece is achieved.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor processing technology, specifically relating to a dual-station chemical mechanical polishing device and a method for detecting the polishing fluid. Background Technology

[0002] In recent years, due to the advantages of glass, such as adjustable thermal expansion coefficient, low insertion loss, and high resistivity, through-glass via (TGV) technology, an extension of through-silicon via (TSV) technology, has attracted widespread attention in the industry. By using through-holes to replace traditional inter-chip interconnects with vertical short wires, high integration is achieved while miniaturizing products, significantly improving product performance. As a potential alternative to silicon-based interposers, TGV glass substrates have broad application prospects in fields such as radio frequency devices, microelectromechanical systems (MEMS) packaging, and optoelectronic system integration.

[0003] In the processing of TGV glass substrates, the surface of the glass substrate is treated using Chemical Mechanical Polishing (CMP), which combines chemical reactions and mechanical actions to smooth the surface of the TGV glass substrate. During this process, the polishing slurry reacts with the material on the workpiece surface, while the material is removed through the relative movement between the polishing pad and the workpiece.

[0004] Existing polishing equipment used for ultra-large TGV glass substrates requires a transfer robot to move the substrate into another cleaning device after chemical mechanical polishing. This results in the equipment occupying horizontal space for transfer and loading / unloading, and repeated transfers increase the probability of surface contamination and impacts, thus compromising product processing quality. Ultra-large refers to exceeding the traditional wafer size (6-12 inches). Summary of the Invention

[0005] The purpose of this invention is to provide a simple and reasonably designed dual-station chemical mechanical polishing device and a method for detecting its polishing fluid in order to solve the above-mentioned problems.

[0006] The present invention achieves the above objectives through the following technical solutions: In a first aspect, the present invention provides a chemical mechanical polishing apparatus, comprising: Polishing disc; The bearing head is located above the polishing disc. The input end of the bearing head is connected to a polishing drive assembly. Under the drive of the polishing drive assembly, the bearing head carries the workpiece to the polishing disc and polishes the surface of the workpiece to be polished. The liquid supply mechanism includes a main liquid supply pipe, which is used to deliver polishing liquid to the polishing disc. The cleaning mechanism includes a robotic arm, a liquid receiving tray, and a cleaning assembly. The output end of the robotic arm is equipped with a liquid receiving tray, which is used to move the liquid receiving tray to the underside of the support head. The liquid receiving tray is used to receive the cleaning fluid after cleaning. The cleaning assembly is disposed in the liquid receiving tray and includes a nozzle. When the support head is in the cleaning position, the open end face of the liquid receiving tray is sealed and abuts against the lower end face of the support head, and the nozzle sprays the cleaning fluid toward the polished workpiece surface.

[0007] As a further optimization of the present invention, a first indexing drive assembly is provided at the lower end of the polishing disc. The output end of the first indexing drive assembly is connected to the polishing disc via a transmission connection. The first indexing drive assembly is used to drive the polishing disc to rotate, and the rotation direction of the polishing disc is opposite to the rotation direction of the bearing head.

[0008] As a further optimization of the present invention, multiple nozzles are provided, and the multiple nozzles are installed on a support plate. A liquid supply chamber is opened in the support plate, and the nozzles are connected to the liquid supply chamber. A liquid supply column is fixedly connected to the lower end of the support plate, and the end of the liquid supply column away from the support plate passes through the liquid receiving plate and is connected to the output end of the auxiliary liquid supply pipe.

[0009] As a further optimization of the present invention, the cleaning assembly further includes an immersion assembly, which includes a second indexing drive assembly. The second indexing drive assembly includes a first motor, a drive gear, a driven gear, and a sleeve. The output end of the first motor is driven by the drive gear, which meshes with the driven gear. The driven gear is fixedly connected to the sleeve, and the sleeve is fixedly connected to the liquid supply column.

[0010] As a further optimization of the present invention, the cleaning assembly further includes a first lifting drive component, a turntable, a tray, a tray cover, and a telescopic cylinder. The turntable is located inside the liquid receiving tray. The upper end of the sleeve column is fixedly connected to the turntable. The upper end of the turntable is slidably connected to the tray. The upper end of the tray is fixedly connected to the tray cover. The tray cover has a clearance opening, which is correspondingly set with the nozzle. The straight column part of the nozzle is sleeved with a telescopic cylinder. The telescopic cylinder is located below the tray cover. The lower end of the telescopic cylinder is fixedly connected to a lower fixing block, which is fixedly connected to the straight column part of the nozzle. The upper end of the telescopic cylinder is fixedly connected to an upper fixing block, which is fixedly connected to the tray cover. The first lifting drive component is disposed on the turntable, and the output end of the first lifting drive component is drivenly connected to the tray. When the disc cover moves to its maximum displacement under the drive of the first lifting drive, the nozzle is located in the inner cavity of the telescopic cylinder and is immersed in the cleaning fluid.

[0011] As a further optimization of the present invention, the polishing drive assembly includes a third indexing drive assembly, a lifting drive assembly, and a shifting drive assembly. The output end of the third indexing drive assembly is driven and coupled with the lifting drive assembly, and the output end of the shifting drive assembly is driven and coupled with the lifting drive assembly. The lifting drive assembly includes a second lifting drive component and a drive shaft. The output end of the second lifting drive component is connected to the drive shaft, and the output end of the drive shaft is connected to the bearing head. The second lifting drive component drives the bearing head to perform lifting and adjusting through the drive shaft. The third indexing drive assembly includes a second motor, a pulley drive component, and a drive shaft. The output end of the second motor is driven by the drive wheel of the pulley drive component, the output end of the driven wheel of the pulley drive component is driven by the drive shaft, and the output end of the drive shaft is driven by the second lifting drive component. The displacement drive assembly includes a base, a slider, a guide rail, a moving block, a screw, and a third motor. The second lifting drive component is mounted on the base. The base is fixedly connected to the slider, which is slidably connected to the guide rail. The guide rail is fixedly connected to the platform. The bearing head is located below the platform. The side of the base is fixedly connected to the moving block, which is threadedly connected to the screw. The output end of the third motor is driven by the input end of the screw. An elongated through hole is provided on the platform, and the drive shaft passes through the elongated through hole into the platform. The sliding direction of the slider and the guide rail is consistent with the radial direction of the polishing disc.

[0012] As a further optimization of the present invention, the output end of the main liquid supply pipe is provided with a liquid supply head, which is located above the polishing disc. The side of the conveying section of the main liquid supply pipe is connected to a branch pipe, and a detector is installed on the branch pipe. The detector is used to detect the pH value change of the polishing liquid in real time. The detector includes a pH composite electrode, and the electrode probe of the pH composite electrode is immersed in the polishing liquid in the branch pipe.

[0013] As a further optimization of the present invention, multiple bearing heads are provided, and the multiple bearing heads are distributed circumferentially along the axis of the polishing disk, wherein the bearing heads are correspondingly arranged with the liquid receiving disk.

[0014] As a further optimization of the present invention, a recycling component is provided on the periphery of the polishing disc. The recycling component includes a liquid receiving tank, a first protective plate, and a second protective plate. The first protective plate is located below the edge of the polishing disc and has a U-shaped structure. The second protective plate is fitted inside the first protective plate. The upper end of the second protective plate is fixedly connected to the liquid receiving tank, which is located on the side edge of the polishing disc. The upper end of the inner wall of the opening of the liquid receiving tank is fixedly connected to an anti-splash plate. The lower end of the first protective plate is provided with a second drain pipe, which communicates with the U-shaped groove of the first protective plate.

[0015] Secondly, the present invention also provides a method for detecting polishing fluid in chemical mechanical polishing, applied to the aforementioned chemical mechanical polishing equipment, the method comprising the following steps: Polishing fluid is supplied to the polishing disc through the main supply pipe. At this time, the pH value of the polishing fluid is detected in real time by a detector set on a branch pipe on one side of the main supply pipe. Driven by the polishing drive component, the bearing head carries the workpiece to the polishing pad and polishes the surface of the workpiece to be polished. After polishing, the workpiece is moved to the cleaning position by the drive of the polishing drive component, and the liquid receiving tray is moved to the bottom of the support head by the robotic arm. At this time, the open end face of the liquid receiving tray is sealed and abutted against the lower end face of the support head. Cleaning fluid is sprayed onto the polished surface of the workpiece through a nozzle, and the used cleaning fluid is drained away through a drip tray. After cleaning, the nozzle is intermittently immersed in the cleaning solution inside the telescopic cylinder by extending and retracting the telescopic cylinder corresponding to the nozzle, thus cleaning the surface of the nozzle. The liquid receiving tray is removed by a robotic arm, and the workpiece on the bearing head is removed by a robotic hand.

[0016] The present invention has at least the following beneficial effects: The chemical mechanical polishing equipment provided by the present invention includes a polishing disc, a support head, a liquid supply mechanism, and a cleaning mechanism. The cleaning mechanism includes a robotic arm, a liquid receiving tray, and a cleaning assembly. The support head is used to carry the workpiece to the polishing disc and polish the surface of the workpiece to be polished. The liquid supply mechanism delivers polishing liquid to the polishing disc through the main liquid supply pipe. For the polished workpiece, the polished surface of the workpiece is cleaned by the nozzle in the cleaning assembly. No transfer is required, and the cleaning is carried out directly in situ. The waste liquid after cleaning is received in the liquid receiving tray and will not further contaminate the polishing disc. This reduces the transfer and unloading of workpieces, reduces the probability of product surface contamination and bumps, and ensures product processing quality. Furthermore, the cleaning assembly also includes a first lifting drive, a turntable, a tray, a cover, and a telescopic cylinder. During the cleaning process, driven by the first lifting drive, the nozzle is completely positioned inside the telescopic cylinder by the upward movement of the cover. As the nozzle continuously sprays cleaning fluid, the tilted fluid fills the inner cavity of the telescopic cylinder, immersing the nozzle in the cleaning fluid. The cleaning fluid overflows from the inner cavity of the telescopic cylinder after cleaning, thereby cleaning the surface of the nozzle. Furthermore, the reciprocating drive of the first lifting drive causes the cover to move up and down, thereby alternating between the two states of the nozzle being relatively extended from the cover and entering the inner cavity of the telescopic cylinder. This promotes the rinsing and cleaning of the nozzle surface by the cleaning fluid, preventing cross-contamination of the cleaning fluid when cleaning the next workpiece. In addition, a branch pipe is installed on one side of the main liquid supply pipe, and a detector is installed on the branch pipe. Without sampling, the pH value of the polishing liquid is fed back in real time, thereby controlling the pH value of the polishing liquid within a reasonable range, reducing equipment corrosion and ensuring the polishing quality of workpieces, such as the polished surface of glass substrates. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is the invention Figure 1 A partial structural diagram of the front view; Figure 3 This is a partial cross-sectional view of the cleaning mechanism of the present invention; Figure 4 This is the present invention. Figure 3 A schematic diagram of the front structure; Figure 5 This is the present invention. Figure 4 Enlarged view at point B in the middle; Figure 6 This is the present invention. Figure 5 A partial cross-sectional view of the central nozzle when it is submerged in the telescopic cylinder; Figure 7 This is a schematic diagram of the structure of the bearing head and polishing drive assembly of the present invention; Figure 8 This is the present invention. Figure 2 Enlarged view of point A in the middle; Figure 9 This is a schematic diagram of the structure of the recycling component of the present invention.

[0018] In the diagram: 1. Polishing disc; 11. First indexing drive assembly; 2. Bearing head; 21. Third indexing drive assembly; 211. Second motor; 212. Pulley drive component; 213. Drive shaft; 22. Lifting drive assembly; 221. Second lifting drive component; 222. Base; 223. Drive shaft; 23. Shifting drive assembly; 231. Slider; 232. Guide rail; 233. Moving block; 234. Screw; 235. Third motor; 236. Long strip through hole; 24. Platform; 3. Main liquid supply pipe; 31. Liquid supply head; 32. Detector; 33. Branch pipe; 4. Cleaning mechanism; 41. Robotic arm; 411. Pallet; 42. Liquid receiving tray; 421. First drain pipe; 43. Second indexing drive assembly; 431. First motor; 432. Drive gear; 433. Driven gear; 434. Sleeve column; 435. Turntable; 436. Tray; 44. Cleaning assembly; 441. Nozzle; 442. Support plate; 443. Plate cover; 444. Immersion assembly; 445. First lifting drive component; 446. Liquid supply column; 447. Secondary liquid supply pipe; 448. Upper fixing block; 449. Telescopic cylinder; 410. Lower fixing block; 5. Recycling component; 51. First protective plate; 52. Second protective plate; 53. Liquid receiving tank; 54. Splash shield; 55. Second drain pipe. Detailed Implementation

[0019] The present application will now be described in further detail with reference to the accompanying drawings. It should be noted that the following specific embodiments are only used to further illustrate the present application and should not be construed as limiting the scope of protection of the present application. Those skilled in the art can make some non-essential improvements and adjustments to the present application based on the above application content.

[0020] In one embodiment, such as Figure 1 , Figure 2 and Figure 3 As shown, the present invention provides a dual-station chemical mechanical polishing device, comprising: Polishing disc 1; The bearing head 2 is located above the polishing disk 1. The input end of the bearing head 2 is connected to a polishing drive assembly. Under the drive of the polishing drive assembly, the bearing head 2 carries the workpiece to the polishing disk 1 and polishes the surface of the workpiece to be polished. The liquid supply mechanism includes a main liquid supply pipe 3, which is used to deliver polishing liquid to the polishing disc 1. The cleaning mechanism 4 includes a robotic arm 41, a liquid receiving tray 42, and a cleaning assembly 44. The output end of the robotic arm 41 is equipped with the liquid receiving tray 42, which is used to move the liquid receiving tray 42 to the underside of the support head 2. The liquid receiving tray 42 is used to receive the cleaning fluid after cleaning. The cleaning assembly 44 is disposed in the liquid receiving tray 42 and includes a nozzle 441. When the support head 2 is in the cleaning position, the open end face of the liquid receiving tray 42 is sealed and abutted against the lower end face of the support head 2, and the nozzle 441 sprays the cleaning fluid toward the polished workpiece surface.

[0021] The workpiece, such as a glass substrate, is carried by the bearing head 2. The surface of the workpiece to be polished is polished by the relative movement between the bearing head 2 and the polishing disc 1. After polishing, there is no need to immediately load or unload the workpiece. At this time, the cleaning component 44 can be moved directly to the bottom of the workpiece by the robotic arm 41, and cleaning can be carried out in place. The waste liquid after cleaning is received in the liquid receiving tray 42, which will not further contaminate the polishing disc 1. This reduces the transfer and unloading of workpieces, reduces the probability of product surface contamination and bumps, and ensures product processing quality.

[0022] It should be noted that the input end of the main liquid supply pipe 3 is connected to a first liquid supply pump (not shown in the figure), which pumps the polishing liquid from the storage tank to the main liquid supply pipe 3.

[0023] For example, see [link to relevant documentation]. Figure 1 and Figure 2 The lower end of the polishing disk 1 is provided with a first indexing drive assembly 11. The output end of the first indexing drive assembly 11 is connected to the polishing disk 1 for transmission. The first indexing drive assembly 11 is used to drive the polishing disk 1 to rotate. The rotation direction of the polishing disk 1 is opposite to the rotation direction of the bearing head 2, thereby further improving the relative linear velocity between the bearing head 2 and the polishing disk 1 to ensure polishing efficiency.

[0024] For example, see [link to relevant documentation]. Figure 3 Multiple nozzles 441 are provided and mounted on a support plate 442. A liquid supply chamber is formed within the support plate 442, and the nozzles 441 communicate with this chamber. A liquid supply column 446 is fixedly connected to the lower end of the support plate 442. The end of the liquid supply column 446 away from the support plate 442 passes through a receiving plate 42 and communicates with the output end of a secondary liquid supply pipe 447. This allows cleaning fluid, such as deionized water, to be sprayed at multiple points on the polished surface of the workpiece through the multiple nozzles 441, washing away residual polishing fluid and impurities, thus improving cleaning efficiency. A second liquid supply pump (not shown in the figure) is connected to the input end of the secondary liquid supply pipe 447, pumping the cleaning fluid into the secondary liquid supply pipe 447.

[0025] Among them, such as Figure 3 and Figure 4 As shown, a first drain pipe 421 is provided at the bottom of the liquid receiving tray 42. The first drain pipe 421 is connected to the liquid receiving tray 42 to discharge the cleaning waste liquid outside the liquid receiving tray 42.

[0026] Continue reading Figure 3 , Figure 4The cleaning assembly 44 further includes an immersion assembly 444, which includes a second indexing drive assembly 43. The second indexing drive assembly 43 includes a first motor 431, a drive gear 432, a driven gear 433, and a sleeve 434. The output end of the first motor 431 is connected to the drive gear 432, which meshes with the driven gear 433. The driven gear 433 is fixedly connected to the sleeve 434, which is fixedly connected to the liquid supply column 446. Driven by the first motor 431, the drive gear 432 meshes with the driven gear 433, causing the sleeve 434 to drive the liquid supply column 446 to rotate. This allows the nozzle 441 to rotate around the axis of the sleeve 434, further promoting the uniform spraying of the cleaning fluid onto the polished surface of the workpiece.

[0027] It should be noted that the first motor 431 is mounted on the pallet 411, which is located at the extended end of the robotic arm 41. During the transfer process of the robotic arm 41, the pallet 411 remains in a horizontal state.

[0028] For example, see [link to relevant documentation]. Figure 3 , Figure 4 , Figure 5 The cleaning assembly 44 further includes a first lifting drive 445, a turntable 435, a tray 436, a tray cover 443, and a telescopic cylinder 449. The turntable 435 is located inside the liquid receiving tray 42. The upper end of the sleeve 434 is fixedly connected to the turntable 435. The tray 436 is slidably connected to the upper end of the turntable 435. The tray cover 443 is fixedly connected to the upper end of the tray 436. The tray cover 443 has a clearance opening, which corresponds to the nozzle 441. The telescopic cylinder 449 is sleeved on the straight part of the nozzle 441. 49. The telescopic cylinder 449 is located below the disc cover 443. The lower end of the telescopic cylinder 449 is fixedly connected to the lower fixing block 410, which is fixedly connected to the straight column part of the nozzle 441. The upper end of the telescopic cylinder 449 is fixedly connected to the upper fixing block 448, which is fixedly connected to the disc cover 443. The first lifting drive component 445 is set on the turntable 435. The output end of the first lifting drive component 445 is connected to the tray 436. The first lifting drive component 445 is an electric telescopic cylinder. like Figure 6As shown, when the disc cover 443 moves to its maximum displacement under the drive of the first lifting drive 445, the uppermost position of the nozzle 441 is lower than the bottom wall of the disc cover 443. At this time, the nozzle 441 is completely located in the inner cavity of the telescopic cylinder 449. As the nozzle 441 continuously sprays cleaning fluid, the inclined liquid fills the inner cavity of the telescopic cylinder 449, immersing the nozzle 441 in the cleaning fluid. The cleaning fluid overflows from the inner cavity of the telescopic cylinder 449 after cleaning, thereby cleaning the surface of the nozzle 441. Furthermore, through the reciprocating drive of the first lifting drive 445, the disc cover 443 moves up and down, thereby realizing the alternation of the nozzle 441 in two states: relatively extending out of the disc cover 443 and entering the inner cavity of the telescopic cylinder 449. This promotes the rinsing and cleaning of the nozzle 441 surface by the cleaning fluid, avoiding cross-contamination of the cleaning fluid when cleaning the next workpiece.

[0029] It should be noted that further reading is required. Figure 1 , Figure 2 and Figure 7 The polishing drive assembly includes a third indexing drive assembly 21, a lifting drive assembly 22, and a shifting drive assembly 23. The output end of the third indexing drive assembly 21 is driven and connected to the lifting drive assembly 22, and the output end of the shifting drive assembly 23 is driven and connected to the lifting drive assembly 22. The lifting drive assembly 22 includes a second lifting drive component 221 and a drive shaft 223. The output end of the second lifting drive component 221 is connected to the drive shaft 223, and the output end of the drive shaft 223 is connected to the bearing head 2. The second lifting drive component 221 drives the bearing head 2 to perform lifting and adjustment through the drive shaft 223. The second lifting drive component 221 is an electric telescopic cylinder. The third indexing drive assembly 21 includes a second motor 211, a pulley drive component 212, and a drive shaft 213. The output end of the second motor 211 is connected to the drive wheel of the pulley drive component 212, the output end of the driven wheel of the pulley drive component 212 is connected to the drive shaft 213, and the output end of the drive shaft 213 is connected to the second lifting drive component 221. The displacement drive assembly 23 includes a base 222, a slider 231, a guide rail 232, a moving block 233, a screw 234, and a third motor 235. The second lifting drive component 221 is mounted on the base 222. The base 222 is fixedly connected to the slider 231, and the slider 231 is slidably connected to the guide rail 232. The guide rail 232 is fixedly connected to the platform 24. The bearing head 2 is located below the platform 24. The moving block 233 is fixedly connected to the side of the base 222 and threadedly connected to the screw 234. The output end of the third motor 235 is drivenly connected to the input end of the screw 234. The platform 24 has an elongated through hole 236, and the drive shaft 223 passes through the platform 24 through the elongated through hole 236. The sliding direction of the slider 231 and the guide rail 232 is consistent with the radial direction of the polishing disc 1.

[0030] Driven by the second lifting drive component 221, the bearing head 2 moves down to abut against the polishing disc 1. It should be noted that the second lifting drive component 221 is externally rotatably equipped with a support sleeve, which is fixedly connected to the base 222. Driven by the second motor 211, the pulley drive component 212 drives the second lifting drive component 221 to rotate through the drive shaft 213. The second lifting drive component 221 further drives the drive shaft 223 and the bearing head 2 to rotate synchronously, thereby causing relative movement between the bearing head 2 and the polishing disc 1. At this time, the third motor 235 drives the moving block 233 to move through the screw 234, so that the base 222 moves along the sliding direction of the slider 231 and the guide rail 232, and the workpiece moves along the composite trajectory of the radial and horizontal circumferential directions of the polishing disk 1, thereby improving the polishing efficiency.

[0031] For example, see [link to relevant documentation]. Figure 2 The main liquid supply pipe 3 is provided with a liquid supply head 31 at its output end. The liquid supply head 31 is located above the polishing disc 1. A branch pipe 33 is connected to the side of the conveying section of the main liquid supply pipe 3. A detector 32 is installed on the branch pipe 33. The detector 32 is used to detect the pH value change of the polishing liquid in real time. The detector 32 includes a pH composite electrode. The electrode probe of the pH composite electrode is immersed in the polishing liquid in the branch pipe 33.

[0032] It should be noted that during the polishing process, the pH of the polishing slurry directly determines its chemical corrosivity. Therefore, by setting up a detector 32, which includes a pH composite electrode, and installing the pH composite electrode in the bypass branch of the main supply pipe 3 of the polishing slurry, namely the branch pipe 33 (to avoid the high-speed fluid in the main pipe impacting the electrode and to ensure that the electrode is in continuous contact with fresh polishing slurry), the electrode probe must be completely immersed in the polishing slurry. This is suitable for the continuous production scenario of CMP polishing of glass substrates, without the need for sampling, and provides real-time feedback on the pH value change of the polishing slurry for closed-loop process control. This controls the pH value of the polishing slurry within a reasonable range, reduces equipment corrosion, and ensures the polishing quality of workpieces, such as the polished surface of glass substrates.

[0033] Multiple bearing heads 2 are provided, and the multiple bearing heads 2 are distributed circumferentially along the axis of the polishing disk 1. (Continue reading...) Figure 1 and Figure 2 The diagram simply illustrates the scenario with two bearing heads 2, i.e., a dual-station chemical mechanical polishing process. For example... Figure 1 As shown, the bearing head 2 is correspondingly set with the liquid receiving tray 42, so that under the transfer of the robotic arm 41, multiple liquid receiving trays 42 can receive the corresponding bearing head 2, and multiple workpieces can be cleaned at the same time, thereby improving processing efficiency.

[0034] For example, see [link to relevant documentation]. Figure 2 , Figure 8 and Figure 9 A recycling component 5 is provided around the polishing disc 1. The recycling component 5 includes a liquid receiving tank 53, a first protective plate 51, and a second protective plate 52. The first protective plate 51 is located below the edge of the polishing disc 1 and has a U-shaped structure. The second protective plate 52 is fitted inside the first protective plate 51. The upper end of the second protective plate 52 is fixedly connected to the liquid receiving tank 53, which is located on the side edge of the polishing disc 1. An anti-splash plate 54 is fixedly connected to the upper end of the inner wall of the opening of the liquid receiving tank 53. A second drain pipe 55 is provided at the lower end of the first protective plate 51 and communicates with the U-shaped groove of the first protective plate 51. The waste liquid after polishing flows into the liquid receiving tank 53 through the edge of the polishing disc 1, and further collects in the first protective plate 51. Then, it is discharged through the second drain pipe 55.

[0035] It should be noted that, in use, the polishing liquid is supplied to the polishing disc 1 through the main liquid supply pipe 3. After the workpiece is fixed on the bearing head 2, the bearing head 2 is moved down to the point where the workpiece contacts the polishing disc 1 under the drive of the second lifting drive component 221. Under the drive of the second motor 211 and the first indexing drive component 11, the bearing head 2 and the polishing disc 1 move relative to each other to polish the surface of the workpiece to be polished. During the polishing process, the pH of the polishing solution is monitored in real time by a detector 32 installed on the branch pipe 33 of the main liquid supply pipe 3. The pH value of the polishing solution is controlled within a reasonable range to reduce equipment corrosion and ensure the polishing quality of workpieces, such as the polished surface of glass substrates. After polishing, the bearing head 2 is moved up to the cleaning position by the second lifting drive 221. At this time, there is no need to load or unload the workpiece. With the help of the robotic arm 41, the liquid receiving tray 42 is moved to the bottom of the bearing head 2 and the open end face of the liquid receiving tray 42 is sealed and abutted against the lower end face of the bearing head 2. When the first motor 431 is started, under the meshing transmission of the drive gear 432 and the driven gear 433, the sleeve 434 drives the support plate 442 to rotate through the liquid supply column 446, so that multiple nozzles 441 rotate to spray cleaning liquid onto the surface of the workpiece. The waste liquid flowing down from the cleaning is received by the liquid receiving plate 42 and discharged through the first drain pipe 421. After cleaning, the first motor 431 is stopped, and the first lifting drive 445 is activated, causing the cover 443 to move upward until the uppermost position of the nozzle 441 is lower than the bottom wall of the cover 443. With the continuous supply of cleaning fluid, the cleaning fluid fills the inner cavity of the telescopic cylinder 449, that is, the nozzle 441 is immersed in the cleaning fluid, and the cleaning fluid overflows from the inner cavity of the telescopic cylinder 449 after cleaning, thereby cleaning the surface of the nozzle 441. At this time, the first lifting drive 445 is driven in the opposite direction, causing the cover 443 to move downward, the uppermost end of the nozzle 441 extends out of the cover 443, and the inner cavity of the telescopic cylinder 449 is compressed, further causing the cleaning fluid to overflow. The above actions are repeated to achieve the alternation of the two states of the nozzle 441 being relatively extended out of the cover 443 and entering the inner cavity of the telescopic cylinder 449, thereby promoting the cleaning fluid to rinse and clean the surface of the nozzle 441 and avoiding cross-contamination of the cleaning fluid when the next workpiece is cleaned. After cleaning, the liquid receiving tray 42 is removed by the robotic arm 41, making it easier for the robotic arm to remove the cleaned workpiece.

[0036] In another embodiment, the present invention also provides a method for detecting polishing slurry in dual-station chemical mechanical polishing, the method comprising the following steps: Polishing fluid is supplied to polishing disc 1 through main supply pipe 3. At this time, the pH value change of polishing fluid is detected in real time through detector 32 on branch pipe 33 on one side of main supply pipe 3. Driven by the polishing drive assembly, the bearing head 2 carries the workpiece to the polishing disk 1 and polishes the surface of the workpiece to be polished. After polishing, the workpiece is moved to the cleaning position by the drive of the polishing drive assembly, and the liquid receiving tray 42 is moved to the bottom of the support head 2 by the robotic arm 41. At this time, the open end face of the liquid receiving tray 42 is sealed and abutted against the lower end face of the support head 2. Cleaning fluid is sprayed onto the polished surface of the workpiece through nozzle 441, and the used cleaning fluid is drained away through the liquid receiving tray 42. After cleaning, the nozzle 441 is intermittently immersed in the cleaning solution inside the telescopic cylinder 449 by the extension and retraction of the telescopic cylinder 449 corresponding to the nozzle 441, so as to clean the surface of the nozzle 441. The liquid receiving tray 42 is removed by the robotic arm 41, and the workpiece on the bearing head 2 is removed by the robotic arm.

[0037] This method enables real-time quality monitoring of the polishing slurry, controls the pH value of the polishing slurry within a reasonable range, reduces equipment corrosion, and ensures the polishing quality of workpieces, such as the polished surface of glass substrates.

[0038] The embodiments described above are merely examples of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention.

Claims

1. A chemical mechanical polishing apparatus characterized by comprising: The polishing disc (1) is provided with the first indexing drive assembly (11) at the lower end, the output end of the first indexing drive assembly (11) is in transmission connection with the polishing disc (1), and the first indexing drive assembly (11) is used for driving the polishing disc (1) to rotate. The polishing disc (1) is provided with the first indexing drive assembly (11) at the lower end, the output end of the first indexing drive assembly (11) is in transmission connection with the polishing disc (1), and the first indexing drive assembly (11) is used for driving the polishing disc (1) to rotate. The polishing disc (1) is provided with the first indexing drive assembly (11) at the lower end, the output end of the first indexing drive assembly (11) is in transmission connection with the polishing disc (1), and the first indexing drive assembly (11) is used for driving the polishing disc (1) to rotate. The polishing disc (1) is provided with the first indexing drive assembly (11) at the lower end, the output end of the first indexing drive assembly (11) is in transmission connection with the polishing disc (1), and the first indexing drive assembly (11) is used for driving the polishing disc (1) to rotate. The polishing disc (1) is provided with the first indexing drive assembly (11) at the lower end, the output end of the first indexing drive assembly (11) is in transmission connection with the polishing disc (1), and the first indexing drive assembly (11) is used for driving the polishing disc (1) to rotate.

2. The chemical mechanical polishing apparatus of claim 1, wherein The polishing disc (1) is provided with the first indexing drive assembly (11) at the lower end, the output end of the first indexing drive assembly (11) is in transmission connection with the polishing disc (1), and the first indexing drive assembly (11) is used for driving the polishing disc (1) to rotate.

3. The chemical mechanical polishing apparatus of claim 1, wherein The polishing disc (1) is provided with the first indexing drive assembly (11) at the lower end, the output end of the first indexing drive assembly (11) is in transmission connection with the polishing disc (1), and the first indexing drive assembly (11) is used for driving the polishing disc (1) to rotate.

4. The chemical mechanical polishing apparatus of claim 3 wherein, The polishing disc (1) is provided with the first indexing drive assembly (11) at the lower end, the output end of the first indexing drive assembly (11) is in transmission connection with the polishing disc (1), and the first indexing drive assembly (11) is used for driving the polishing disc (1) to rotate. The polishing disc (1) is provided with the first indexing drive assembly (11) at the lower end, the output end of the first indexing drive assembly (11) is in transmission connection with the polishing disc (1), and the first indexing drive assembly (11) is used for driving the polishing disc (1) to rotate.

5. The chemical mechanical polishing apparatus of claim 4 wherein, The cleaning assembly (44) further comprises a soaking liquid assembly (444), the soaking liquid assembly (444) comprises a first lifting driving element (445), a rotating disc (435), a tray (436), a disc cover (443) and a telescopic cylinder (449), the rotating disc (435) is located in the liquid receiving disc (42), the upper end of the sleeve column (434) is fixedly connected with the rotating disc (435), the upper end of the rotating disc (435) is slidably connected with the tray (436), the upper end of the tray (436) is fixedly connected with the disc cover (443), the disc cover (443) is provided with a clearance opening corresponding to the nozzle (441), the straight column part of the nozzle (441) is sleeved with the telescopic cylinder (449), the telescopic cylinder (449) is located below the disc cover (443), the lower end of the telescopic cylinder (449) is fixedly connected with a lower fixed block (410), the lower fixed block (410) is fixedly connected with the straight column part of the nozzle (441), the upper end of the telescopic cylinder (449) is fixedly connected with an upper fixed block (448), the upper fixed block (448) is fixedly connected with the disc cover (443), the first lifting driving element (445) is arranged on the rotating disc (435), and the output end of the first lifting driving element (445) is transmissionally connected with the tray (436); When the disc cover (443) moves to the maximum displacement under the driving of the first lifting driving element (445), the nozzle (441) is located in the inner cavity of the telescopic cylinder (449), and the nozzle (441) is immersed in the cleaning liquid.

6. The chemical mechanical polishing apparatus of claim 1, wherein The polishing driving assembly comprises a third rotation driving assembly (21), a lifting driving assembly (22) and a displacement driving assembly (23), the output end of the third rotation driving assembly (21) is transmissionally matched with the lifting driving assembly (22), and the output end of the displacement driving assembly (23) is transmissionally matched with the lifting driving assembly (22); The lifting driving assembly (22) comprises a second lifting driving element (221) and a driving shaft (223), the output end of the second lifting driving element (221) is transmissionally connected with the driving shaft (223), the output end of the driving shaft (223) is transmissionally connected with the bearing head (2), and the second lifting driving element (221) drives the bearing head (2) to adjust the lifting through the driving shaft (223); The third rotation driving assembly (21) comprises a second motor (211), a belt wheel transmission element (212) and a transmission shaft (213), the output end of the second motor (211) is transmissionally connected with the driving wheel of the belt wheel transmission element (212), the output end of the driven wheel of the belt wheel transmission element (212) is transmissionally connected with the transmission shaft (213), and the output end of the transmission shaft (213) is transmissionally connected with the second lifting driving element (221); The shift driving assembly (23) comprises a base (222), a sliding block (231), a guide rail (232), a moving block (233), a screw rod (234) and a third motor (235), the second lifting driving part (221) is installed on the base (222), the base (222) is fixedly connected with the sliding block (231), the sliding block (231) is slidably connected with the guide rail (232), the guide rail (232) is fixedly connected on the support table (24), the bearing head (2) is located below the support table (24), the side of the base (222) is fixedly connected with the moving block (233), the moving block (233) is threadedly connected with the screw rod (234), the output end of the third motor (235) is drivingly connected with the input end of the screw rod (234), wherein a long hole (236) is formed in the support table (24), the driving shaft (223) penetrates through the support table (24) through the long hole (236), wherein the sliding direction of the sliding block (231) and the guide rail (232) is consistent with the radial direction of the polishing disc (1).

7. The chemical mechanical polishing apparatus of claim 1 wherein, The output end of the main liquid supply pipe (3) is provided with a liquid supply head (31), the liquid supply head (31) is located above the polishing disc (1), the side of the conveying section of the main liquid supply pipe (3) is connected with a branch pipe (33), the detector (32) is installed on the branch pipe (33), the detector (32) is used for detecting the pH change of the polishing liquid in real time, the detector (32) comprises a pH composite electrode, and the electrode probe of the pH composite electrode is immersed in the polishing liquid in the branch pipe (33).

8. The chemical mechanical polishing apparatus of claim 1 wherein, The bearing head (2) is provided with a plurality of bearing heads (2), and the plurality of bearing heads (2) are distributed in the circumferential direction along the axis of the polishing disc (1), wherein the bearing head (2) is correspondingly provided with the liquid receiving disc (42).

9. The chemical mechanical polishing apparatus of claim 8 wherein, The polishing disc (1) is provided with a recovery assembly (5) on the side, the recovery assembly (5) comprises a liquid receiving groove (53), a first protective plate (51) and a second protective plate (52), the first protective plate (51) is located below the edge of the polishing disc (1), the first protective plate (51) is a U-shaped structure, the second protective plate (52) is sleeved in the first protective plate (51), the upper end of the second protective plate (52) is fixedly connected with the liquid receiving groove (53), the liquid receiving groove (53) is located at the side of the edge of the polishing disc (1), the opening inner wall of the liquid receiving groove (53) is fixedly connected with the splash-proof plate (54) at the upper end, the lower end of the first protective plate (51) is provided with a second liquid discharge pipe (55), and the second liquid discharge pipe (55) is in communication with the U-shaped groove of the first protective plate (51).

10. The method for detecting polishing slurry in chemical mechanical polishing according to claim 9, characterized in that, The chemical mechanical polishing device of any one of claims 1-9 is applied to the method, and the method comprises the following steps: The polishing liquid is conveyed to the polishing disc (1) through the main liquid supply pipe (3), at this time, the pH value change of the polishing liquid is detected in real time through the detector (32) arranged on the branch pipe (33) of the main liquid supply pipe (3); The bearing head (2) carries the workpiece to the polishing disc (1) and polishes the surface to be polished of the workpiece through the driving of the polishing driving assembly. After polishing, the polishing driving assembly drives the carrier head (2) to move up to a cleaning position, and the mechanical arm (41) moves the liquid receiving tray (42) to below the carrier head (2), at this time, the opening end face of the liquid receiving tray (42) is in sealing abutment with the lower end face of the carrier head (2); The polishing surface of the workpiece is sprayed with cleaning liquid through the spray head (441), and the used cleaning liquid is discharged through the liquid receiving tray (42); After cleaning, the extension and retraction of the corresponding extension cylinder (449) of the spray head (441) makes the spray head (441) intermittently immersed in the cleaning liquid in the extension cylinder (449), and the surface of the spray head (441) is cleaned; The mechanical arm (41) moves the liquid receiving tray (42) away, and the mechanical hand takes away the workpiece on the carrier head (2).

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