Waterproof and dustproof structure of non-contact voltage sensor and control method

Abstract

The invention discloses a waterproof and dustproof structure of a non-contact voltage sensor and a control method. The waterproof and dustproof structure comprises an induction area shell, a circuit area shell and a base, the PCB mainboard is arranged across the induction area shell and the circuit area shell; the circuit area shell comprises a first hydrophobic coating, an epoxy resin anticorrosive coating, a stainless steel shielding layer and a first heating film; the induction area shell comprises a second hydrophobic coating, a PTFE (polytetrafluoroethylene) layer and a second heating film; ventilation devices are symmetrically distributed on the side walls of the two sides of the circuit area shell and the induction area shell; a miniature fan, a temperature sensor, a humidity sensor and a central control unit are arranged in the circuit area shell and the induction area shell, and the central control unit, the fan, the first heating film, the second heating film, the temperature sensor and the humidity sensor form a closed-loop control system. According to the invention, through structural isolation and material layering design of the induction area and the circuit area, it is ensured that electric field signal acquisition is not interfered by shielding.

Description

Technical Field

[0001] This invention relates to the field of non-contact voltage sensor protection technology, and in particular to a waterproof and dustproof structure and control method for a non-contact voltage sensor. Background Technology

[0002] Non-contact voltage sensors are widely used in power system condition monitoring, transmission line anomaly early warning, and partial discharge location, offering the advantage of acquiring electric field signals without direct contact with conductors. These sensors are typically deployed in high-voltage environments and must withstand long-term exposure to complex conditions such as rain and snow erosion, wind and sand impact, mechanical vibration, and strong electromagnetic interference. Existing technologies for non-contact voltage sensors still have many shortcomings in terms of waterproofing, dustproofing, and environmental adaptability control. Patent CN119300276, entitled "A Waterproof and Dustproof Structure and Method for a Multi-Dimensional Force Sensor," proposes using a flexible sealing ring combined with a compression structure to seal the outer shell interface and inlet hole, and improving its corrosion resistance through a coating. While this patent's structure is relatively compact and suitable for complex industrial conditions, its internal structure lacks an intelligent adjustment module and relies primarily on static sealing methods, failing to address temperature and humidity changes and condensation issues. Furthermore, this solution is a mechanical contact structure, neglecting factors such as an electric field transparent window and electromagnetic compatibility design, making it difficult to meet the application requirements of non-contact field strength acquisition devices. Another patent, CN110657825A, entitled "A Waterproof, Corrosion-Resistant, and Dustproof Magnetic Angular Displacement Sensor," proposes using a PBT and TPU composite material shell with multiple sealing rings and coatings inside to achieve good sealing and corrosion resistance. This patent also incorporates a corrugated pipe design at the connection port, enhancing the protection of the cable connection area. Although this structure offers some optimization in terms of temperature and humidity adaptability, it lacks internal airflow channels or active ventilation mechanisms, and it doesn't consider the penetration requirements of electric field signals. Therefore, when used in non-contact voltage sensors, it still suffers from signal interference and response lag. Patent CN112345701A, titled "A Waterproof and Dustproof Gas Sensor," proposes using an ePTFE microporous membrane as a ventilation component. It balances the internal and external air pressure through microporous selective permeation technology and integrates a desiccant within the cavity to suppress condensation. While this approach offers some inspiration for improving structural permeability and waterproofing, the structure lacks a labyrinthine airflow channel or multi-stage filter membrane combination, failing to effectively block the entry of particulate matter and high-humidity air masses. Furthermore, it lacks an intelligent response mechanism for condensation under combined high humidity and low temperature conditions, remaining an overall static and passive structure.

[0003] Meanwhile, existing sensor structures generally lack multi-level environmental response mechanisms, failing to automatically adjust the internal environment when encountering conditions such as high humidity condensation or low temperature icing. Most protective structures rely solely on sealing materials or adhesive injection, making it difficult for internal moisture to escape and easily corroding circuit components. Some structures use metal cladding to increase housing strength, which can easily shield and interfere with the induced electric field, affecting measurement accuracy. Furthermore, internal components such as the PCB board, fan, and heating film lack vibration damping mechanisms, making them susceptible to mechanical shocks or resonance during long-term operation, reducing structural stability and lifespan. Summary of the Invention

[0004] To address the above shortcomings, this invention provides a waterproof and dustproof structure and control method for a non-contact voltage sensor, which integrates multiple structural protections with intelligent response regulation, improving the signal accuracy of the electric field sensing area and the operational reliability of the circuit area. The specific technical solution is as follows: A waterproof and dustproof structure for a non-contact voltage sensor includes a sensing area housing, a circuit area housing, and a base. The sensing area housing and the circuit area housing are mounted on the base, forming the main load-bearing structure of the sensor housing. A PCB motherboard is arranged across the sensing area housing and the circuit area housing. The circuit area housing, from the outside to the inside, includes a first hydrophobic coating, an epoxy resin anti-corrosion coating, a stainless steel shielding layer, and a first heating film. The sensing area housing, from the outside to the inside, includes a second hydrophobic coating, a PTFE polytetrafluoroethylene layer, and a second heating film. Ventilation devices are symmetrically arranged on both side walls of the circuit area housing and the sensing area housing. The circuit area housing and the sensing area housing are equipped with a miniature fan, a temperature sensor, a humidity sensor, and a central control unit. The central control unit, together with the fan, the first heating film, the second heating film, the temperature sensor, and the humidity sensor, forms a closed-loop control system.

[0005] Preferably, the breathable device includes a microporous breathable and waterproof membrane and a first soft filter screen; The microporous breathable and waterproof membrane is embedded in the opening area of ​​the outer shell by heat-press sealing, and the first soft filter is provided at both ends of the microporous breathable and waterproof membrane.

[0006] Preferably, the microporous breathable and waterproof membrane is connected to an airflow channel; the airflow channel is formed by several bent ribs to create an S-shaped folding airflow channel.

[0007] Preferably, an air guide groove is provided at the corner of the rib, and a second soft filter and an adsorption layer are provided on the air guide groove.

[0008] Preferably, the top of the sensing area housing has an arc-shaped structure, and the top of the circuit area housing has a sloping structure.

[0009] Preferably, both the first and second hydrophobic coatings are FAS-17 hydrophobic coatings; and both the first and second heating films are PI flexible films.

[0010] Preferably, the PCB motherboard is fixed to the housing by a support frame, and a silicone pad is provided between the PCB motherboard and the support frame.

[0011] Preferably, the PCB motherboard is covered by flexible polyurethane (PU) sealant across the area of ​​the sensing area housing and the circuit area housing.

[0012] A control method based on the above structure includes the following steps: S1. The ambient temperature and humidity data of the sensing area or circuit area are collected by the temperature and humidity sensor; S2. When the temperature sensor detects a value that exceeds the first threshold for a set duration and the humidity is below the humidity limit threshold, start the micro fan for forced ventilation and heat dissipation. S3. When the humidity sensor detects a value that exceeds the second threshold for a set duration and the temperature is suitable, the flexible PI heating film is activated to heat and dry the internal gas. S4. When both temperature and humidity are below the preset low temperature and low humidity threshold for a set time, it is determined to be an icing condition, and the flexible heating film is activated to continuously heat and perform de-icing operation. S5, the control module records and provides feedback on the start and stop status of the fan and heating film in real time, realizing closed-loop regulation and environmental adaptive control.

[0013] Preferably, the control module determines the stability of the current operating condition based on a multi-period moving average algorithm to prevent accidental triggering of the dehumidification or de-icing process.

[0014] Compared with the prior art, the beneficial effects of the present invention are: 1. In this invention, the structural isolation and material layering design between the sensing area and the circuit area ensure that the electric field signal acquisition is not affected by shielding interference.

[0015] 2. In this invention, the S-shaped airflow channel and dustproof channel are combined with ePTFE breathable membrane and multi-layer soft filter to achieve long-path, multi-stage gas purification and air pressure balance.

[0016] 3. In this invention, the heating film and the fan work together to adapt to various harsh environments such as high humidity, low temperature, and icing.

[0017] 4. In this invention, the combination structure of FR4 rigid-flexible bracket and silicone limiting achieves internal vibration resistance and improves the impact resistance and fatigue life of the device. 5. The materials used for the shell and base in this invention take into account insulation, electromagnetic properties, and weather resistance to meet the requirements for long-term operation in the field; and the structure of this invention has detachable characteristics, which is conducive to later maintenance and replacement. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.

[0019] Figure 1 This is an overall cross-sectional view of the non-contact voltage sensor structure of the present invention; Figure 2 This is a schematic diagram of the material layering structure of the sensing area housing and the circuit area housing of the present invention; Figure 3 This is a schematic diagram of the combination of the breathable device and the airflow channel structure of the present invention; Figure 4 This is a schematic diagram of the PCB board support frame structure of the present invention.

[0020] 1-Sensing area housing, 2-Circuit area housing, 3-Base, 4-Ventilation device, 5-Airflow channel, 6-PCB motherboard, 7-Support frame, 8-Silicone gasket, 9-Miniature fan, 10-Flexible polyurethane (PU) sealant, 11-Second hydrophobic coating, 12-PTFE film layer, 13-Second heating film, 21-First hydrophobic coating, 22-Epoxy resin anti-corrosion coating, 23-304L stainless steel shielding layer, 24-First heating film, 41-ePTFE breathable and waterproof membrane, 42-First soft filter, 51-Air guide groove, 52-Bent rib, 53-Second soft filter, 91-Temperature sensor, 92-Humidity sensor, 93-Central control unit. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0022] In the description of this invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0023] In the description of this invention, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. Where the terms "first," "second," and "third" are used for descriptive purposes and to distinguish technical features, they should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the sequential relationship of the indicated technical features.

[0024] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances. Furthermore, the technical features involved in the different embodiments of this invention described below can be combined with each other as long as they do not conflict with each other.

[0025] Example 1 Please see Figure 1-4 This embodiment discloses a sensor housing including a sensing area housing 1, a circuit area housing 2, and a base 3. The sensing area housing 1 and the circuit area housing 2 are mounted on the base 3 to form the main support structure of the sensor housing. The PCB motherboard 6 is arranged across the sensing area housing 1 and the circuit area housing 2 to support the core circuit and data processing unit. In this embodiment, the circuit area housing 2 and the sensing area housing 1 are respectively adopted with different multilayer composite material systems from the top structure to achieve regional decoupling design of signal transmission and electromagnetic shielding functions.

[0026] like Figure 2As shown, the circuit area housing 2 includes, from the outside to the inside, a first hydrophobic coating 21, an epoxy resin anti-corrosion coating 22, a stainless steel shielding layer 23, and a first heating film 24. The sensing area housing 1 includes, from the outside to the inside, a second hydrophobic coating 11, a PTFE polytetrafluoroethylene layer 12, and a second heating film 13. More specifically, both the first hydrophobic coating 21 and the second hydrophobic coating 11 are FAS-17 hydrophobic coatings, and both the first heating film 24 and the second heating film 13 are PI flexible film layers.

[0027] More specifically, the top of the circuit area housing 2 adopts a four-layer composite structure consisting of a FAS-17 hydrophobic coating 21, an epoxy resin anti-corrosion coating 22, a 304L stainless steel shielding layer 23, and a PI flexible film layer 24 arranged sequentially from the outside to the inside. The FAS-17 coating 21 is also 20μm thick, ensuring that the outer surface of the housing has consistent hydrophobic and anti-fouling properties; the epoxy resin anti-corrosion coating 22 is 100μm thick, which can provide effective chemical protection in high humidity or acid and alkaline environments; the 304L stainless steel shielding layer 23 is the main load-bearing structure in this area, and also has high conductivity and good electromagnetic shielding performance, which can effectively shield the influence of external interference signals on the internal circuit; the PI flexible film layer 24 is located in the innermost layer, which is used to isolate the electrical connection risk between the metal shielding structure and the electronic module, further improving the electrical insulation performance and reliability of the overall structure.

[0028] The top of the sensing area housing 1, from the outside to the inside, includes a FAS-17 hydrophobic coating 11, a PTFE thin film layer 12, and a PI flexible thin film layer 13. The FAS-17 hydrophobic coating 11 is about 20 μm thick, and its optimal arc setting allows raindrops to slide down quickly, effectively reducing the adhesion rate of rainwater and dust on the housing surface and enhancing the housing's anti-pollution and self-cleaning capabilities. The PTFE thin film layer 12 is about 50 μm thick and has excellent dielectric stability and hydrophobicity, ensuring that the electric field signal can pass through the sensing area without interference and enter the sensor's interior. The PI flexible thin film layer 13, as the inner substrate, provides good mechanical support and thermal stability, preventing external forces or temperature fluctuations from affecting the sensitive area.

[0029] Through the aforementioned layered design, this invention achieves high-transmittance, low-interference electric field sensing in the sensing area and high-strength, multi-shielded environmental protection in the circuit area. The synergistic effect of differentiated material functions and structural performance significantly enhances the electrical stability and long-term reliability of the non-contact voltage sensor under complex operating conditions. Continue to participate Figure 3The circuit area housing 2 and the sensing area housing 1 are symmetrically equipped with ventilation devices 4 on both side walls. Each ventilation device 4 includes an ePTFE microporous breathable and waterproof membrane 41 and two layers of first soft filters 42. The ePTFE microporous breathable and waterproof membrane 41 is embedded in the opening area of ​​the housing by heat-press sealing and sealed with a flexible sealing ring. Its unidirectional air permeability reaches 500 ml / min (under a differential pressure of 10 kPa), and its water vapor transmission rate is 800 g / m² / 24h. While maintaining air pressure balance, it blocks water molecules from entering, providing IP67 or higher protection. The two layers of first soft filters 42 are respectively located at both ends of the microporous breathable and waterproof membrane 41, made of polyurethane foam with a density of 45 kg / m³, effectively filtering dust, insect damage, and suspended impurities from the air. An air guide cap structure is provided on the outside of the ventilation device 4 to shield it from direct wind and rain. The air guide cap is connected to the side wall of the housing via double snaps for easy disassembly and maintenance.

[0030] Furthermore, the ventilation path of the ventilation device 4 continues to enter, such as... Figure 3 The internal labyrinthine airflow channel 5 shown adopts an "S"-shaped three-fold reversal design. An air guide groove 51 is pre-reserved within the shell cavity, and multiple layers of bent ribs 52 are provided along the path to form a long-path reversal channel for airflow. Simultaneously, an additional second soft filter 53 and an adsorption layer (such as silica gel granules) are added at the corners to further enhance the solid particle blocking rate and moisture adsorption capacity. The entire ventilation system combines waterproofing, dehumidification, dust removal, and pressure regulation functions, achieving air micro-circulation while effectively ensuring a clean and stable internal cavity environment.

[0031] Continue reading Figure 1 The circuit area housing 2 and the sensing area housing 1 are equipped with a miniature fan 9, a temperature sensor 91, a humidity sensor 92 and a central control unit 93. The central control unit 93, together with the fan 9, the first heating film 24, the second heating film 13, the temperature sensor 91 and the humidity sensor 92, form a closed-loop control system to realize real-time sensing and response adjustment of environmental parameters, thereby improving the operational stability of the device in extreme environments.

[0032] Continue to participate Figure 4To ensure stable installation and vibration damping of the PCB motherboard 6 between the circuit area housing 2 and the sensing area housing 1, a composite support structure with multi-point support and flexible damping is designed in this embodiment. The PCB motherboard 6 spans between the housings and is constructed entirely of high-frequency FR4 substrate, using a 4-layer board wiring method. The electric field acquisition module and the signal amplification module are located in the sensing area housing 1 and the circuit area housing 2, respectively. The two ends of the PCB motherboard 6 are fixed between the base 3 and the inner cavity column of the housing by FR4 material support brackets 7. The FR4 support brackets 7 are 4mm thick, have a low coefficient of thermal expansion, and good heat resistance, maintaining structural stability under changes in temperature and humidity. Silicone gaskets 8 are affixed to the mounting points of the support brackets 7. The silicone hardness is approximately Shore A 40, which can absorb external vibration and shock, preventing loosening of threads or damage to solder joints during long-term operation. The sensor probe is located inside the sensing area housing 1 and is positioned by embedded riveting. Flexible polyurethane (PU) sealant 10 covers the area through which the motherboard traverses, filling the gaps between the housings and forming a sealed structure to prevent air, moisture, and foreign objects from entering through the motherboard channel.

[0033] In the specific implementation of this invention, in order to ensure the stability and reliability of the non-contact voltage sensor in complex outdoor environments, a response control system based on environmental parameter perception was constructed to realize the functions of fan 9 heat dissipation, humidity drying and low-temperature de-icing.

[0034] Example 2 This embodiment discloses a control method based on the above structure. The control method consists of an environment sensing module, an execution module, and a main control unit integrated on a PCB board, and mainly includes the following control steps: S1. Temperature sensor 91 and humidity sensor 92 collect ambient temperature and humidity data of the sensing area or circuit area; details are as follows: System initialization. After the system is powered on, the STM32F103C8T6 main control chip built into the PCB board starts running, initializing peripheral modules such as temperature sensor 91, humidity sensor 92, heating film, and micro fan 9, and begins to read temperature and humidity values ​​in real time at a 5-second interval. The temperature sensor 91 and humidity sensor 92 are model SHT35, with a measurement accuracy of ±0.2°C and a humidity measurement accuracy of ±1.5%RH. They are fixed inside the top of the circuit area housing 2 and the sensing area housing 1, respectively, and communicate with the main control unit via the I²C bus. The data read by the system will be stored in the EEPROM and used for subsequent status judgment and response control.

[0035] S2. When the temperature sensor 91 detects a value that continuously exceeds the first threshold for a set duration, and the humidity is below the humidity limit threshold, the micro fan 9 is activated for forced ventilation and heat dissipation; specifically as follows: Temperature over-limit ventilation response control. When temperature sensor 91 detects that the ambient temperature is continuously greater than or equal to 50.0°C and the humidity value is less than or equal to 60.0%RH, and this state lasts for more than 60 seconds, the main control unit determines that the temperature is too high and immediately outputs a high-level signal to drive one miniature fan 9 on each side of the top of the housing to start. The fan 9 is model DFB401012H, rated voltage 12V, rated power 0.48W, speed 9500rpm, and is fixed to the housing with a 1.5mm thick medical-grade silicone pad 8 for vibration isolation. The ventilation time is set to 180 seconds. During this period, temperature sensor 91 continues to monitor. If the temperature value drops below 45.0°C, the fan 9 will be turned off in advance; otherwise, it will be turned off after running for 180 seconds.

[0036] S3. When the humidity sensor 92 continuously exceeds the second threshold for a set time, and the temperature is suitable, the flexible PI heating film is activated to heat and dry the internal gas; specifically as follows: Forced heating and drying response under high humidity conditions. When the humidity sensor 92 detects a value greater than or equal to 85.0%RH, and the temperature value is between 15.0 and 45.0°C, and this condition lasts for more than 120 seconds, the system determines it to be in a high humidity condition. The control unit simultaneously activates the flexible PI heating film and the micro fan 9. The heating film is model KHL-30120, with a rated power of 6.0W, a voltage of 12V, and a surface temperature rise rate of 2.5°C / min. The heating film is installed at the bottom of the circuit area housing 2, adhered and fixed to the area below the PCB board, and bonded with polyimide high-temperature resistant double-sided adhesive. After the fan 9 and the heating film run simultaneously for 180 seconds, if the humidity value drops below 75.0%RH, the heating film and fan 9 are turned off; if the humidity does not decrease, the ventilation and heating are extended, with a maximum duration not exceeding 480 seconds.

[0037] S4. When both temperature and humidity are below the preset low temperature and low humidity threshold for a set time, it is determined to be an icing condition. The flexible heating film is then activated for continuous heating to perform de-icing operations; details are as follows: The de-icing mode is activated under low temperature and high humidity conditions. When the temperature is below 0.0°C and the humidity is above 90.0%RH for more than 300 seconds, the system determines that it is in a state of icing risk and starts the heating film to continuously heat and enter the de-icing mode, maintaining a heating power of 6.0W. Each heating cycle in the de-icing mode lasts for 600 seconds. Afterward, the system rereads the temperature and humidity values. If the temperature rises to 5.0°C or above and the humidity drops to 80.0%RH or below, the de-icing is considered complete, and the system shuts off the heating film. If the requirements are not met, the system automatically starts the next 600-second de-icing cycle. The maximum continuous heating time for a single de-icing operation is 1800 seconds. If this time is exceeded, the system will forcibly enter the safety protection mode and issue an alarm signal.

[0038] S5, the control module records and provides real-time feedback on the start / stop status of fan 9 and the heating film, achieving closed-loop regulation and adaptive environmental control; details are as follows: Response mode switching and system reset. After each control operation is completed, the system automatically resets the control state to the default monitoring state, all sensors return to real-time acquisition mode, and continue to acquire temperature and humidity data at 5-second intervals to determine whether the conditions for the next response are met. The system automatically updates the sampling data log every 24 hours, performs simple compression, and uploads it to the backend analysis platform to ensure reliable remote status tracking and control.

[0039] It should be noted that, regarding power protection and anomaly handling, the main control unit accumulates the running time and power consumption of each execution unit in real time throughout the entire control process. The maximum continuous running time of the heating film is set not to exceed 1800 seconds / hour, and the maximum cumulative running time of fan 9 is set not to exceed 3600 seconds / hour. Once any device exceeds the operating limit, the system will immediately cut off the corresponding control circuit and send a protection command to the main control system. It can only be restarted after manual or remote intervention in the next cycle.

[0040] In addition, the control module judges the stability of the current operating condition based on a multi-period moving average algorithm to prevent the dehumidification or de-icing process from being triggered erroneously.

[0041] This invention significantly improves the reliability and stability of non-contact voltage sensors in harsh outdoor environments through the synergistic integration of multiple strategies, including layered material structure, electromagnetic wave transmission design, combined protection with a breathable device and labyrinth structure, multi-point support and vibration reduction structure, and intelligent environmental response control. The structure achieves a high level of waterproof and dustproof protection and actively responds to environmental disturbances through control methods, exhibiting strong scene adaptability and suitability for various long-term electric field signal monitoring applications. The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A waterproof and dustproof structure of a non-contact voltage sensor, characterized by comprising: It comprises an induction area shell (1), a circuit area shell (2) and a base (3), the induction area shell (1) and the circuit area shell (2) are installed on the base (3), and a main bearing structure of a sensor shell is formed; a PCB mainboard (6) is arranged across the induction area shell (1) and the circuit area shell (2); The circuit area shell (2) comprises a first hydrophobic coating (21), an epoxy resin anticorrosive coating (22), a stainless steel shielding layer (23) and a first heating film (24) from outside to inside in sequence; The induction area shell (1) comprises a second hydrophobic coating (11), a PTFE polytetrafluoroethylene layer and a second heating film (13) from outside to inside in sequence; The two side walls of the circuit area shell (2) and the induction area shell (1) are symmetrically provided with air permeation devices (4); The circuit area shell (2) and the induction area shell (1) are internally provided with a micro fan (9), a temperature sensor (91), a humidity sensor (92) and a central control unit (93), and the central control unit (93) forms a closed-loop control system with the fan (9), the first heating film (24), the second heating film (13), the temperature sensor (91) and the humidity sensor (92).

2. The waterproof and dustproof structure of a non-contact voltage sensor according to claim 1, wherein The air permeation device (4) comprises a microporous air permeation waterproof film (41) and a first soft filter screen (42); The microporous air permeation waterproof film (41) is embedded in the opening area of the outer shell by a hot-pressing sealing mode, and the two ends of the microporous air permeation waterproof film (41) are provided with the first soft filter screen (42).

3. The waterproof and dustproof structure of a non-contact voltage sensor according to claim 2, characterized in that, The microporous air permeation waterproof film (41) is communicated with an airflow channel (5); The airflow channel (5) forms an S-shaped turning airflow channel (5) through a plurality of bending rib plates (52).

4. The waterproof and dustproof structure of a non-contact voltage sensor according to claim 1, wherein A gas guide groove (51) is formed at the corner of the rib plate (52), and a second soft filter screen (53) and an adsorption layer are arranged on the gas guide groove (51).

5. The waterproof and dustproof structure of a non-contact voltage sensor according to claim 1, wherein The top of the induction area shell (1) is in a circular arc structure, and the top of the circuit area shell (2) is in an inclined surface structure.

6. The waterproof and dustproof structure of a non-contact voltage sensor according to claim 1, wherein The first hydrophobic coating (21) and the second hydrophobic coating (11) are both FAS-17 hydrophobic coatings; the first heating film (24) and the second heating film (13) are both PI flexible films.

7. The waterproof and dustproof structure of a non-contact voltage sensor according to claim 1, wherein The PCB mainboard (6) is fixed on the shell through a support frame (7), and the PCB mainboard (6) is provided with a silica gel gasket (8) between the support frames (7).

8. The waterproof and dustproof structure of a non-contact voltage sensor according to claim 1, wherein The PCB mainboard (6) is covered by a flexible polyurethane PU sealing glue (10) across the induction area shell (1) and the circuit area shell (2) region.

9. A control method based on the structure of any one of claims 1-8, characterized by, The following steps are included: S1, collecting the temperature and humidity data of the induction area or the circuit area by the temperature and humidity sensor (92); S2, when the detection value of the temperature sensor (91) continuously exceeds the first threshold value for a set time length, and the humidity is lower than the humidity threshold value, starting the micro fan (9) to perform forced ventilation and heat dissipation; S3, when the detection value of the humidity sensor (92) continuously exceeds the second threshold value for a set time length, and the temperature is moderate, starting the flexible PI heating film to heat and dry the internal gas. S4, when the temperature and humidity are both lower than the preset low-temperature and low-humidity threshold for a set time, it is judged that the icing condition exists, the flexible heating film is started to continuously heat, and the deicing operation is performed; S5, the control module records and feeds back the fan (9) and the heating film start-stop state in real time, so as to realize closed-loop regulation and environment self-adaptive regulation and control.

10. The control method according to claim 9, characterized by, The control module judges the current working condition stability according to the multi-cycle moving average algorithm, so as to prevent the dehumidification or deicing process from being triggered by mistake.

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