Semiconductor element storage device

Abstract

The invention discloses semiconductor element storage equipment, which is used for accommodating a plurality of exposed semiconductor elements and comprises a cabin body, a chip storage rotating tower, a material taking module and a processing module. The cabin body is a hollow structure, and the interior of the cabin body is at least divided into a storage area, a transfer area and a processing area. The wafer storage turret is pivoted in the storage area and is used for storing the plurality of exposed semiconductor elements. The material taking module is arranged in the transfer area and used for selectively clamping one of the exposed semiconductor elements from the storage area or the processing area. The processing module is arranged in the processing area and is used for detecting one of the exposed semiconductor elements clamped into the processing area by the material taking module.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor device storage technology, specifically a semiconductor device storage device that can save storage space, increase the storage capacity of the semiconductor device, and reduce the contamination of semiconductor devices during storage. Background Technology

[0002] Semiconductor components are used not only in everyday consumer products like smartphones, automobiles, and networks, but also, with the development of 5G communication, AI technology, and the Internet of Things (IoT), have become a key foundation for many technology industries, enriching and facilitating people's lives. Driven by technological advancements, the line diameter of semiconductor circuit patterns has evolved from the micrometer level to the nanometer level. To address the contamination caused by tiny particles such as dust in the environment and harmful gases released during manufacturing processes on semiconductor components (such as photomasks, wafers, LCD panels, and filters), contamination control measures during storage, transportation, and manufacturing have become increasingly stringent.

[0003] In semiconductor manufacturing plants, maintaining cleanliness during the manufacturing process is primarily achieved through the design of cleanrooms. However, due to the large size of cleanrooms, particles and harmful gases generated by various devices can interfere with each other due to airflow circulation. Therefore, it is difficult to effectively control the cleanliness of a typical cleanroom, or it may require significantly increasing the cost of filtration equipment to maintain cleanliness. Consequently, semiconductor components stored and transported within cleanrooms require the use of a separate container with an independent clean environment. Taking photomasks, used to transfer circuit patterns onto the wafer surface through lithography, as an example, due to the aforementioned miniaturization of semiconductor components, contamination of the photomask can cause distortion or deformation of the circuit patterns on the wafer surface. To maintain the quality of photomasks during manufacturing processes, they are typically stored in a SEMI-standard photomask transport pod (RSP). This pod is then placed into a semiconductor device storage unit (Stocker) to reduce the adhesion of harmful contaminants such as particles, chemicals, or free gas molecules to the photomask surface, which can cause defects. However, this approach significantly increases the space required for each storage location, and also necessitates improvements in the operating space and load-bearing capacity of the robotic arm. Furthermore, to maintain a clean environment within each photomask transport pod, an inflation tray and inflation system are usually designed for each storage location in the semiconductor device storage unit to fill the pod with clean gas. This complicates the structure of the semiconductor device storage unit, increases its manufacturing and maintenance costs, increases its footprint, and directly reduces its storage capacity.

[0004] In other words, existing semiconductor device storage equipment has problems such as complex structure and large footprint due to its storage space being a device container for accommodating semiconductor devices. This not only reduces the storage capacity of the semiconductor device storage equipment, but also makes it difficult to maintain the cleanliness inside the semiconductor device storage equipment, making it unsuitable for direct storage of semiconductor devices. Therefore, how to solve the aforementioned problems is the solution that this invention seeks to explore.

[0005] In view of the above-mentioned shortcomings and drawbacks, the inventor of this case believed that it was necessary to make corrections. Therefore, based on years of experience in related technologies and product design and manufacturing, and adhering to the concept of good design, the inventor studied and improved the above-mentioned shortcomings. After continuous efforts in trial production, the inventor finally successfully developed a semiconductor component storage device to overcome the troubles and inconveniences caused by the direct use of existing semiconductor component storage devices as storage containers. Summary of the Invention

[0006] Therefore, the main objective of this invention is to provide a semiconductor device storage device that can greatly simplify the storage structure, effectively save storage space and equipment footprint, further improve the flexibility of factory space application, and thereby reduce the manufacturing and maintenance costs of the semiconductor device storage device.

[0007] Furthermore, another major objective of the present invention is to provide a semiconductor device storage device that can improve the cleanliness of the interior of the semiconductor device storage device, thereby enabling it to be used for direct storage of semiconductor devices without contamination, thereby increasing the storage capacity of the semiconductor device storage device.

[0008] Furthermore, the main objective of this invention is to provide a semiconductor device storage device that can reduce the sources of contamination in the storage area of ​​the semiconductor device and can be used to directly store semiconductor devices to avoid contamination of the semiconductor devices.

[0009] Based on this, the present invention mainly achieves the aforementioned objectives and performance through the following technical means: The present invention provides a semiconductor device storage apparatus for storing multiple semiconductor devices. This semiconductor device storage apparatus, used to store multiple exposed semiconductor devices, includes a housing, a wafer storage turret, a material handling module, and a process module. The housing is a hollow structure, internally divided into at least a storage area, a transfer area, and a process area. The wafer storage turret is pivotally located in the storage area to store the multiple exposed semiconductor devices. The material handling module is located in the transfer area to selectively pick up one of the multiple exposed semiconductor devices from the storage area or the process area. The process module is located in the process area to detect when the material handling module picks up one of the multiple exposed semiconductor devices that has entered the process area.

[0010] Preferably, the turret has multiple storage bins arranged at equal angles around its perimeter, with the multiple storage bins being equidistantly arranged from top to bottom on each storage bin. The drive module consists of a driven gear located at the bottom of the turret and a drive assembly that can mesh with each other. The drive assembly has a motor component connected to the control unit, allowing the motor component to drive the driven gear through a reduction gear. The drive assembly further has a manual crank for manually operating the turret by actuating a gear disc to drive the driven gear.

[0011] Preferably, the material handling module is provided with a vertical rail group in the transfer area, and a first horizontal rail group that can be selectively moved up and down is provided on the vertical rail group, and a second horizontal rail group that can be selectively moved left and right is provided on the first horizontal rail group, and the arm group is provided on the second horizontal rail group, so that the arm group can be selectively moved up and down, left and right or forward and backward.

[0012] Preferably, the cabin is provided with at least one pair of first filter units corresponding to the storage area, wherein the at least one first filter unit can deliver clean gas to the storage area, and the cabin is provided with at least one pair of second filter units corresponding to the transfer area, wherein the at least one second filter unit can deliver clean gas to the transfer area, such that the instantaneous internal wind pressure of the transfer area is less than that of the storage area and greater than that of the receiving area.

[0013] Preferably, the transfer area and the storage area have a feeding channel, and the feeding channel is provided with at least one door that can be selectively opened and closed.

[0014] Preferably, the receiving and discharging area has a material inlet on the cabin body that connects the receiving and discharging area to the outside, and the material inlet is provided with a gate that can be selectively opened and closed. The receiving and discharging area and the transfer area form a first passage, and the first passage is provided with a first gate that can be selectively opened and closed.

[0015] Preferably, the interior of the cabin is divided into a process area adjacent to the transfer area, and the process area is provided with a process module connected to the control unit for performing corresponding process actions on the multiple semiconductor elements.

[0016] Preferably, the process area is provided with a detection module connected to the control unit. The detection module has a movable stage for placing the photomask, and the detection module has at least one linear image scanner for detecting defects on the surface of the photomask above and below the movable stage. In addition, the detection module includes an area image scanner for detecting defects in a circuit pattern of the photomask. Furthermore, the detection module also includes a particle removal device.

[0017] Preferably, the cabin is provided with at least one third filtration unit corresponding to multiple process areas, wherein the at least one third filtration unit can deliver clean gas to the process area, so that the instantaneous internal air pressure of the process area is greater than that of the process area and less than that of the storage area.

[0018] Preferably, the process area and the transfer area form a second opening, and the second opening is provided with a second gate that can be selectively opened and closed, so that the gripping part of the arm assembly of the material picking module extends into the second opening.

[0019] To further understand the structure, features and other objectives of the present invention, preferred embodiments of the present invention are described below in detail with reference to the accompanying drawings, so that those skilled in the art can implement the invention. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the external appearance of the storage device of the present invention.

[0021] Figure 2 This is a schematic diagram of the storage device of the present invention, used to illustrate the device configuration and its relative relationships.

[0022] Figure 3 This is a top view schematic diagram of the storage device of the present invention, used to illustrate the internal structure of the storage area of ​​the cabin and its corresponding relationships.

[0023] Figure 4 This is a schematic diagram of the internal structure of the storage area of ​​the storage device of the present invention, to illustrate the state of the storage area and its relative relationships.

[0024] Figure 5 This is a schematic diagram of the appearance of the storage turret in the storage device of the present invention, to illustrate the composition of the storage turret and its relative relationships.

[0025] Figure 6 This is an enlarged schematic diagram of the bottom of the storage turret in the storage device of the present invention, to illustrate the composition and relative relationships of the drive module of the storage turret.

[0026] Figure 7 This is an enlarged schematic diagram of the top of the storage turret in the storage device of the present invention, to illustrate the composition and relative relationship of the storage baskets of the storage turret.

[0027] Figure 8 This is a schematic diagram of the internal structure of the compartment in the storage device of the present invention, used to illustrate the internal structure of the storage area of ​​the compartment.

[0028] Figure 9 This is a schematic diagram of the internal structure of the compartment in the storage device of the present invention from another perspective, illustrating the internal structure of the transfer area and the process area of ​​the compartment.

[0029] Figure 10 This is a schematic diagram of the first operation of the storage turret in the storage device of the present invention, illustrating the state of the material handling module in the transfer area transferring semiconductor elements relative to the receiving and conveying area.

[0030] Figure 11 This is a schematic diagram of the second operation of the storage turret in the storage device of the present invention, illustrating the state of the material picking module in the transfer area transferring semiconductor elements relative to the receiving area.

[0031] Figure 12 This is a schematic diagram of the third operation of the wafer storage turret in the storage device of the present invention, illustrating the state of the material handling module in the transfer area transferring semiconductor elements relative to the process area.

[0032] Explanation of reference numerals in the attached drawings: 100-Semiconductor component storage equipment; 10-Bucket; 101-Top plate; 102-Bottom plate; 103-Side plate; 105-Block; 200-Receiving area; 300-Transfer area; 400-Receiving and conveying area; 403-Wire mesh plate; 404-Fourth return air space; 500-Process area; 600-Maintenance area; 20-Wafer storage turret; 21-Drive module; 22-Passive gear; 23-Drive group; 231-Horse Components; 232-Reduction gear; 235-Manual crank; 238-Manual gear; 236-Gear disc; 24-Storage basket; 25-Storage location; 26-First filter unit; 27-Screen plate; 28-First return air space; 29-First return air duct; 201-Environmental detection element; 30-Material handling module; 31-Vertical rail assembly; 321-First horizontal rail assembly; 322-Second horizontal rail assembly; 33-Arm assembly; 330-Gripping component; 34 - Second filtration unit; 35- Mesh plate; 36- Second return air space; 37- Second return air duct; 38- Second environmental detection element; 301- Feeding channel; 302- Door panel; 40- Inlet / outlet port; 41- Feed inlet; 42- Gate; 43- Box opening mechanism; 44- First opening; 45- First gate; 46- Container temporary storage area; 50- Detection module; 51- Moving platform; 52- Linear image scanner; 53- Area image scanner; 54- Particle removal device; 55- Third filtration unit; 56- Mesh plate; 57- Third return air space; 58- Third return air duct; 59- Third environmental detection element; 501- Second opening; 502- Second gate; 60- Electrical component module; 62- External maintenance door; 65- Mesh plate; 66- Fifth return air space; 80- Control unit; 81- Server; 85- Display interface; A- Photomask; B- Component container. Detailed Implementation

[0033] This invention provides a semiconductor device storage device. In the accompanying drawings illustrating specific embodiments and components of the semiconductor device storage device, all references to front and back, left and right, top and bottom, upper and lower, and horizontal and vertical are for convenience of description only and are not intended to limit the invention or restrict the components to any position or spatial orientation. The dimensions specified in the drawings and specification may be varied according to the design and requirements of specific embodiments of the invention without departing from its scope, and are therefore not limited to this structure for patent purposes.

[0034] The semiconductor component storage device of the present invention is used to store multiple semiconductor components. Please refer to [reference needed]. Figure 1 , Figure 2 and Figure 3 As shown, the present invention takes a semiconductor component storage device 100 for storing multiple photomasks A as its main embodiment. The semiconductor component storage device 100 is composed of a chamber 10, which is a hollow structure with a top plate 101, a bottom plate 102, and multiple side plates 103 surrounding the top plate 101 and the bottom plate 102. The interior of the chamber 10 is divided into at least one independent space for a storage area 200, a transfer area 300, a receiving and sending area 400, and a process area 500 by multiple partitions 105. The transfer area 300 can be selectively connected to the storage area 200, the receiving and sending area 400, and the process area 500. Furthermore, a control unit 80 is provided on the chamber 10, which includes at least one server 81 and at least one display interface 85.

[0035] like Figure 2 , Figure 3 As shown, a wafer storage turret 20 is pivotally mounted between the top plate 101 and the bottom plate 102 of the compartment 10 in the storage area 200, and the wafer storage turret 20 has a drive module 21 connected to the control unit 80. The drive module 21 consists of a driven gear 22 pivotally mounted at the bottom of the wafer storage turret 20 and a drive assembly 23 that can mesh with each other. [Please also refer to...] Figure 4 and Figure 5 As shown, the drive assembly 23 actuates the driven gear 22, causing the semiconductor storage turret 20 to rotate in place, thereby forming a semiconductor component storage device structure that reduces the equipment footprint and increases storage capacity. The drive assembly 23 can be located on a side of the partition 105 of the storage area 200 opposite to the storage area 200, for example, in the maintenance area 600, to reduce the number of components that may generate particulate matter within the storage area 200. For example... Figure 5 , Figure 6As shown, the drive assembly 23 has a motor element 231 connected to the control unit 80, allowing the motor element 231 to actuate a drive gear 236 via a reduction gear 232 to drive the driven gear 22. The drive assembly 23 further includes a manual crank 235 that actuates the reduction gear 232, allowing the manual crank 235 to actuate the reduction gear 232 via a manual gear 238, which then drives the driven gear 22 via the drive gear 236. This ensures that the wafer storage turret 20 can still be manually operated even in the event of a malfunction of the control unit 80 or the motor element 231, thus ensuring safety. Furthermore, the wafer storage turret 20 has multiple equally spaced storage bins 24 (e.g., ...) around its perimeter. Figure 7 As shown in the diagram, each storage basket 24 has multiple storage compartments 25 arranged equidistantly from top to bottom, for storing and placing corresponding semiconductor components, such as exposed photomasks A. Figure 4 , Figure 8 As shown, the cabin 10 is equipped with at least one first filter unit 26 connected to the control unit 80 (e.g. Figure 1 As shown, the first filter unit 26 delivers clean gas to the storage area 200, and the storage area 200 is provided with a mesh plate 27 at intervals above the bottom plate 102, so that a first return air space 28 is formed between the mesh plate 27 and the bottom plate 102. The first return air space 28 has at least one return air channel connected to the first filter unit 26, wherein the at least one return air channel is defined as the first return air channel 29. This allows the clean gas delivered by the first filter unit 26 into the storage area 200 to enter the first return air space 28 through the mesh plate 27 after passing through the storage turret 20, and then flow back to the first filter unit 26 through the first return air channel 29 to filter particles or harmful substances before re-entering the storage area 200 for internal circulation, thereby saving the amount of clean gas used. Furthermore, the storage area 200 is equipped with at least one first environmental detection element 201 connected to the control unit 80. The first environmental detection element 201 can be selected from temperature and humidity detectors, particulate detectors and / or harmful gas detectors, so as to monitor the real-time environmental conditions in the storage area 200.

[0036] And refer to Figure 2 , Figure 3 and Figure 9 As disclosed, the transfer area 300 and the storage area 200 are adjacent and connected, and a feeding channel 301 is formed on the partition 105 between the transfer area 300 and the storage area 200. The feeding channel 301 corresponds to a storage basket 24 of the storage turret 20 in the aforementioned storage area 200, and the partition 105 is provided with at least one door 302 that can selectively open and close the feeding channel 301 and is connected to the control unit 80 (e.g., Figure 2 , Figure 11As shown, when at least one door panel 302 is selectively opened, the feed channel 301 of the transfer area 300 can be used to receive and transport the plurality of photomasks A relative to the receiving area 200. Furthermore, the transfer area 300 is equipped with a material-grabbing module 30 connected to the control unit 80. The material-grabbing module 30 can grasp a photomask A, allowing the photomask A to be transported from the transfer area 300 relative to the receiving area 400 (as shown). Figure 10 [As shown] or storage area 200 [e.g.] Figure 11 Move between [as shown], and as Figure 3 , Figure 12 As shown, the material handling module 30 has a vertical rail assembly 31 inside the housing 10, and the material handling module 30 has a first horizontal rail assembly 321 on the vertical rail assembly 31 that can selectively move vertically. The first horizontal rail assembly 321 has a second horizontal rail assembly 322 that can selectively move horizontally. The second horizontal rail assembly 322 has an arm assembly 33 that can selectively move forward and backward, allowing the arm assembly 33 of the material handling module 30 to move vertically, horizontally, and forward and backward relative to the storage turret 20 of the storage area 200. Furthermore, the end of the arm assembly 33 has a gripping member 330 that can selectively rotate horizontally and extend linearly, allowing the material handling module 30 to use the gripping member 330 of the arm assembly 33 to grip or place a photomask A. For example... Figure 9 As shown, the cabin 10 is equipped with at least one second filter unit 34 connected to the control unit 80 (e.g., Figure 1 As shown, the second filtration unit 34 delivers clean gas to the transfer zone 300, and the air pressure of the second filtration unit 34 in the transfer zone 300 is lower than the air pressure of the first filtration unit 26 in the aforementioned storage zone 200. A mesh plate 35 is spaced above the base plate 102 in the transfer zone 300, forming a second return air space 36 between the mesh plate 35 and the base plate 102. The second return air space 36 is connected to the second filtration unit 34 via at least one return air channel, defined as the second return air channel 37. This allows the clean gas delivered by the second filtration unit 34 into the transfer zone 300, after passing through the material handling module 30, to enter the second return air space 36 via the mesh plate 35, and then flow back to the second filtration unit 34 via the second return air channel 37 to filter particles or harmful substances before re-entering the transfer zone 300 for internal circulation. Furthermore, the transfer area 300 is equipped with at least one second environmental detection element 38 connected to the control unit 80. The second environmental detection element 38 can be selected from temperature and humidity detectors, particulate detectors and / or harmful gas detectors, and can be used to monitor the real-time environmental conditions within the transfer area 300.

[0037] The receiving and delivery area 400 is adjacent to and connected to the transfer area 300. The receiving and delivery area 400 is provided with an inlet / outlet port 40 connected to the control unit 80. The inlet / outlet port 40 forms a material inlet 41 on the side plate 103 connected to the outside of the housing 10. The side plate 103 is provided with a gate 42 that can selectively open and close the material inlet 41. When the gate 42 is open, the material inlet 41 can be used to receive and deliver the component containers B of the multiple photomasks A. The inlet / outlet port 40 is provided with a corresponding opening mechanism 43 for the component containers B. The inlet / outlet port 40 and the opening mechanism 43 are selected from the inlet / outlet port and opening mechanism of the typical SEMI standard photomask transfer box (RSP) for receiving, delivering and opening / closing the component containers B. Furthermore, a first opening 44 is formed on the partition 105 between the receiving area 400 and the transfer area 300, and the partition 105 is provided with a first gate 45 that can selectively open and close the first opening 44, so that when the component container B is opened, the material handling module 30 in the transfer area 300 can selectively send or remove the photomask A into or out of the receiving area 400. The receiving area 400 is provided with at least one container temporary storage area 46 on the side of the inlet / outlet port 40 (e.g., Figure 1 [As shown], a component container B is provided for temporarily placing the multiple photomasks A for receiving and transporting. According to some embodiments, a mesh plate 403 is spaced above the base plate 102 in the receiving and transport area 400, forming a fourth return air space 404 between the mesh plate 403 and the base plate 102. This fourth return air space 404 can also communicate with the aforementioned second return air space 36, allowing the gas in the fourth return air space 404 to return to the aforementioned second filter unit 34 for filtration via the second return air space 36 and the second return air channel 37. Furthermore, the air pressure inside the receiving and transport area 400 is lower than that in the aforementioned transfer area 300, preventing air or particles from entering the transfer area 300.

[0038] According to certain embodiments, such as Figure 2 , Figure 3 and Figure 9As shown, the interior of the cabin 10 is further divided into at least one process area 500 by multiple partitions 105. These process areas 500 are adjacent and selectively connected to the transfer area 300. Each process area 500 contains a process module connected to the control unit 80. In this embodiment, the process module can be a detection module 50. The detection module 50 has a movable platform 51 for placing a photomask A, and at least one image scanner 52 is provided above and below the movable platform 51 to detect defects on the upper and lower surfaces or circuit patterns of the photomask A, thus confirming whether the cleanliness of the photomask A entering and leaving the storage area 200 is sufficient for processing or return to the factory for cleaning. Furthermore, the detection module 50 includes a particle removal device 54, which removes particles from the surface of the photomask A in a non-contact manner through oscillating high-pressure air blowing and vacuum suction. Additionally, the cabin 10 has at least one third filter unit 55 connected to the control unit 80 on its top plate 101. Figure 1 As shown, a third filtration unit 55 is used to deliver clean gas to the process area 500, and the air pressure of the third filtration unit 55 in the process area 500 is greater than the air pressure of the second filtration unit 34 in the aforementioned transfer area 300. Furthermore, the air pressure of the third filtration unit 55 in the process area 500 is less than the air pressure of the first filtration unit 26 in the storage area 200. A mesh plate 56 is provided at intervals above the bottom plate 102 in the process area 500, so that a third return air space 57 is formed between the mesh plate 56 in the process area 500 and the bottom plate 102. The third return air space 57 is located in the process area 500. The process zone 500 is equipped with at least one return air duct connected to the third filter unit 55, which is defined as the third return air duct 58. This allows the clean air supplied by the third filter unit 55 into the process zone 500 to pass through the detection module 50, enter the third return air space 57 via the mesh plate 56, and then flow back to the third filter unit 55 through the third return air duct 58 to filter particles or harmful substances before re-entering the process zone 500 for recirculation. Furthermore, the process zone 500 is equipped with at least one third environmental detection element 59 connected to the control unit 80 (e.g., ...). Figure 3 As shown, the third environmental detection element 59 can be selected from a temperature and humidity detector, a particulate detector, and / or a hazardous gas detector. It can be used to monitor the real-time environmental conditions within the transfer area 300. A second opening 501 is formed on the partition 105 between the process area 500 and the transfer area 300, which can be selectively closed by at least one second gate 502 connected to the control unit 80. When the second gate 502 is opened, the gripping member 330 of the arm assembly 33 of the aforementioned material handling module 30 extends through the second opening 501 (e.g., ...). Figure 12 As shown, photomask A can move between the transfer area 300 and the process area 500, so that the aforementioned detection module 50 can grasp or place photomask A.

[0039] Furthermore, according to certain embodiments, such as Figure 3 , Figure 9 As shown, the interior of the chamber 10 is further divided into at least one maintenance area 600 by multiple partitions 105. The at least one maintenance area 600 is adjacent to the storage area 200 or the transfer area 300 and can be selectively connected. The drive group 23 of the storage turret 20 of the aforementioned storage area 200 is located in one of the maintenance areas 600. In another maintenance area 600 of the at least one maintenance area 600, there is an electrical component module 60 that connects the control unit 80 and the aforementioned storage turret 20, material handling module 30, material inlet / outlet port 40 and detection module 50, so as to use the electrical component module 60 to control the electronic control components of the semiconductor component storage device 100. The process area 500 has an external maintenance door 62 located on one side panel 103 of the cabin 10, which allows maintenance personnel to enter and exit the process area 500. The maintenance area 600 has an internal maintenance door on the partition 105 of the adjacent storage area 200 or transfer area 300, so that maintenance personnel can selectively open the internal maintenance door to enter the corresponding storage area 200 for maintenance when the aforementioned external maintenance door 62 is closed. The at least one maintenance area 600 has a mesh plate 65 spaced above the bottom plate 102, so that a fifth return air space 66 is formed between the mesh plate 65 and the bottom plate 102 to reduce the accumulation of particulate matter and other pollutants inside the at least one maintenance area 600.

[0040] Through the aforementioned structural design, such as Figure 1 , Figure 2 and Figure 3 As shown, the semiconductor component storage device 100 uses the control unit 80 to actuate the first filter unit 26 of the receiving area 200, the second filter unit 34 of the transfer area 300, and the third filter unit 55 of the process area 500 to respectively deliver clean gas into the corresponding receiving area 200, transfer area 300, and process area 500. This ensures that the internal air pressure of the receiving area 200 is greater than that of the transfer area 300, and the internal air pressure of the process area 500 is greater than that of the transfer area 300. Furthermore, the internal air pressure of the transfer area 300 is greater than that of the receiving area 400 and the environment where the semiconductor component storage device 100 is located, so that the gas... Gas can only flow from the receiving area 200 to the transfer area 300 and from the process area 500 to the transfer area 300. Gas in the transfer area 300 can flow to the receiving and conveying area 400, effectively preventing particles or harmful gas ions from entering the transfer area 300 from the receiving and conveying area 400. Furthermore, it can prevent particles or harmful gas ions from entering the receiving area 200 or the process area 500 from the transfer area 300, thus ensuring the cleanliness of the receiving area 200 and the process area 500. The wafer storage turret 20 in the receiving area 200 can directly receive the multiple photomask A bare wafers without the need for a separate component container B.

[0041] like Figure 2 , Figure 3 and Figure 10As shown, in operation, when storing photomask A, the semiconductor component storage device 100 opens the gate 42 of the material inlet 41 of the receiving area 400 to allow the component container B containing photomask A to be placed on the inlet / outlet port 40. After the gate 42 is closed, the opening mechanism 43 of the inlet / outlet port 40 can open and close the component container B, so that the photomask A of the component container B aligns with the first opening 44. Then, the first gate 45 of the first opening 44 is opened (e.g., ...). Figure 9 As shown, the arm assembly 33 in the material handling module 30 can be moved to the corresponding first opening 44, and the gripping member 330 of the arm assembly 33 extends to grasp the photomask A and enter the transfer area 300. At the same time, the storage turret 20 in the storage area 200 can be rotated by its drive assembly 23, so that the storage basket 24 of the storage position 25 in the storage turret 20 where the photomask A is to be placed corresponds to the feeding channel 301 of the transfer area 300 [as shown]. Figure 11 [As shown], then the relative door 302 of the feeding channel 301 is opened, so that the material picking module 30 can move the arm assembly 33 to raise and lower the relative storage position 25 of the corresponding storage basket 24, and extend the gripper 330 with the photomask A on the arm assembly 33 into the storage area 200, and then place the photomask A on the corresponding storage position 25. Finally, the arm assembly 33 of the material picking module 30 is retracted to the transfer area 300 to reset, and the door 302 of the feeding channel 301 is closed again to complete the storage of the photomask A.

[0042] Conversely, when the semiconductor device storage device 100 retrieves photomask A, it does so as... Figure 3 , Figure 11 As shown, the storage basket 24 of the corresponding storage position 25 of the storage turret 20 is rotated to the feeding channel 301, and the arm assembly 33 of the picking module 30 is raised and lowered to the height of the storage basket 24 relative to the storage position 25. Then, the relative door 302 of the feeding channel 301 is opened, and the gripping part 330 of the arm assembly 33 is inserted into the storage area 200 to grab the photomask A of the relative storage position 25. The gripping part 330 with the photomask A is then returned to the transfer area 300, and the door 302 of the feeding channel 301 is closed. Then, the first gate 45 of the first port 44 is opened, so that the gripper 330 of the arm assembly 33 of the material handling module 30 can place the photomask A into the component container B, and the gripper 330 of the arm assembly 33 is retracted to the transfer area 300 and the first gate 45 is closed at the same time. The box opening mechanism 43 of the inlet / outlet port 40 can close the component container B, so that the photomask A can be stored in the component container B, and the staff can open the gate 42 of the material port 41 to take out the component container B containing the photomask A.

[0043] According to certain embodiments, such as Figure 2 , Figure 3 and Figure 12As shown, when the semiconductor component storage device 100 has a process area 500 and a detection module 50 disposed inside the process area 500, when the gripper 330 of the arm assembly 33 of the material handling module 30 holds the photomask A, the second gate 502 connecting the second port 501 of the process area 500 can be opened first (e.g., ...). Figure 9 As shown, the arm assembly 33 of the material handling module 30 can move to the corresponding second port 501, and the gripper 330 of the arm assembly 33 places the photomask A on the moving platform 51 of the detection module 50. Then, the arm assembly 33 of the material handling module 30 retracts to the transfer area 300 and closes the second gate 502. The detection module 50 can then use the moving platform 51 to move the photomask A to perform surface inspection of the photomask A using the linear image scanner 52 and the area image scanner 53. If necessary, a particle removal device 54 can be used for further processing. After removing particles from the surface of photomask A, the moving stage 51 moves photomask A to the second port 501 and opens the second gate 502, allowing the arm assembly 33 of the picking module 30 to extend into the process area 500 through the second port 501. The arm assembly 33 uses its gripping member 330 to grab photomask A and returns it to the transfer area 300, while closing the second gate 502. Finally, the arm assembly 33 of the picking module 30 transfers photomask A to the storage area 200 or the receiving and sending area 400 in the aforementioned manner.

[0044] Based on the above description, the semiconductor device storage device 100 of the present invention utilizes a design that includes a wafer storage turret 20 in the storage area 200, a material picking module 30 in the transfer area 300, and an inlet / outlet port 40 in the receiving / delivery area 400. This design enables the automated transfer of the photomask A using the arm assembly 33 of the material picking module 30, allowing the photomask A to move between the storage area 200, the transfer area 300, and the receiving / delivery area 400. This allows for automated storage of semiconductor devices. Furthermore, the semiconductor device storage device 100 can... By controlling the air pressure in the storage area 200 to be greater than that in the transfer area 300, and the internal air pressure in the transfer area 300 to be greater than that in the receiving and sending area 400, gas can continuously flow from the storage area 200 to the transfer area 300 and from the transfer area 300 to the receiving and sending area 400. This ensures the cleanliness of the storage area 200 of the semiconductor component storage device 100, which is used to directly store semiconductor components, thereby reducing the footprint of the semiconductor component storage device 100 and increasing its storage capacity.

[0045] In summary, it can be understood that this invention is an invention with excellent creativity. In addition to effectively solving the problems faced by the prior art, it greatly improves the efficacy. Moreover, no identical or similar products or public uses have been found in the same technical field, and it also has the effect of improving efficacy.

Claims

1. A semiconductor device storage apparatus for storing a plurality of bare semiconductor devices, characterized by comprising: The semiconductor element storage device comprises: a cabin, which is a hollow structure, and is internally divided into a storage area, a transfer area and a processing area; a wafer storage turret, which is pivotally arranged in the storage area and used for storing the plurality of exposed semiconductor elements; a material taking module, which is arranged in the transfer area and used for selectively clamping one of the plurality of exposed semiconductor elements from the storage area or the processing area; and a processing module, which is arranged in the processing area and used for detecting the one of the plurality of exposed semiconductor elements clamped by the material taking module into the processing area.

2. The semiconductor device storage apparatus according to claim 1, characterized by The wafer storage turret has a plurality of storage baskets, which are arranged at equal angles between each other, each of the storage baskets has a plurality of storage positions, which are arranged at equal distances from top to bottom, and used for storing each of the exposed semiconductor elements.

3. The semiconductor device storage apparatus according to claim 1, wherein Further comprising a driving module, which is arranged at the bottom of the wafer storage turret and used for driving the wafer storage turret to rotate in place.

4. The semiconductor device storage apparatus according to claim 3, characterized by The driving module has a driven gear and a driving set capable of meshing with each other, the driving set has a motor element and a manual crank, the motor element is used for driving the driven gear to drive the wafer storage turret, and the manual crank is used for manually driving the driven gear to drive the wafer storage turret.

5. The semiconductor device storage apparatus according to claim 1, wherein The material taking module has a vertical rail set, the vertical rail set has a first horizontal rail set capable of being selectively displaced upward and downward, a second horizontal rail set capable of being selectively displaced leftward and rightward, and an arm set, the second horizontal rail set is arranged on the first horizontal rail set, and the arm set is arranged on the second horizontal rail set, so that the arm set can be selectively displaced upward and downward, leftward and rightward, or forward and backward.

6. The semiconductor device storage apparatus according to claim 1, wherein Further comprising a first filtering unit arranged on the cabin corresponding to the storage area and used for sending clean gas to the storage area.

7. The semiconductor device storage apparatus according to claim 6, wherein Further comprising a second filtering unit arranged on the cabin corresponding to the transfer area and used for sending clean gas to the transfer area, so that the instantaneous air pressure inside the transfer area is less than that of the storage area.

8. The semiconductor device storage apparatus according to claim 1, wherein The processing module has a linear image scanner, which is used for detecting surface or circuit pattern defects of one of the plurality of exposed semiconductor elements.

9. The semiconductor device storage apparatus according to claim 1, wherein The processing module has a particle removing device, which is used for removing surface particles of one of the plurality of exposed semiconductor elements in a non-contact manner.

10. The semiconductor device storage apparatus according to claim 7, wherein Further comprising a third filtering unit arranged on the cabin corresponding to the processing area and used for sending clean gas to the processing area, so that the instantaneous air pressure inside the processing area is greater than that of the transfer area and less than that of the storage area.

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