Radiation shielding

Abstract

An apparatus comprising: an electronic component comprising at least one circuit; and a shielding material coupled to the electronic component, forming a protective shield over or partially surrounding at least one circuit. The protective shield includes one or more layers formed of a composite material. At least one of the layers is disposed on the electronic component to form a protective shield that protects the electronic component from radiation. The composite material includes a polymeric composite material including an arrangement of carbon material to increase the emissivity of the composite material, and / or a thermally conductive coating disposed over the at least one layer facing the electronic component and / or a thermally reflective coating disposed over the at least one layer facing away from the electronic component.

Description

Technical Field

[0001] This application relates to the application of radiation shielding in the aerospace field. Background Technology

[0002] In space, the ionizing radiation environment is significantly different from that on Earth, and entities in space, such as satellites and spacecraft, are exposed to a harsh radiation environment consisting of primary and secondary protons, alpha particles, high-charge and high-energy (HZE) particles, neutrons, electrons, X-rays, and gamma rays. Therefore, electronic components must be protected from ionizing radiation.

[0003] To protect electronic components, there are two conventional solutions: 1) using inherent radiation-hardened components, and 2) using passive shielding. In terms of performance, radiation-hardened components consume more power, are expensive, and lag behind comparable commercial off-the-shelf (COTS) components by at least one generation. However, the use of COTS components in satellites and other space platforms requires shielding against ionizing radiation because they are more susceptible to the harmful effects of the space radiation environment than radiation-hardened components tailored for high reliability in space.

[0004] Based on the above, there is an unmet need for shielding configurations and / or arrangements that address the shortcomings of conventional solutions such as those described above in an attempt to minimize the mass and volume impact required for shielding, for example, COTS components and other components on spacecraft platforms.

[0005] It should be understood that the aspects and embodiments described below are not limited to addressing any or all of the disadvantages of the known methods described above. Summary of the Invention

[0006] This summary is provided to introduce, in a simplified form, some concepts that will be further described in the following detailed description. This summary is not intended to identify key or essential features of the claimed subject matter, nor is it intended to define the scope of the claimed subject matter; variations and alternative features that facilitate the work of this invention and / or achieve substantially similar technical effects should be considered to fall within the scope of the invention disclosed herein.

[0007] This summary is provided to introduce, in a simplified form, some concepts that will be further described in the following detailed description. This summary is not intended to identify key or essential features of the claimed subject matter, nor is it intended to define the scope of the claimed subject matter; variations and alternative features that facilitate the work of this invention and / or achieve substantially similar technical effects should be considered to fall within the scope of the invention disclosed herein.

[0008] This disclosure provides conformal thin (1-20 mm) shielding for electronic components in mixed ionizing radiation fields. The conformal shielding is in direct contact with, or in close contact with / adjacent to, the electronic components of an entity in space (i.e., a spacecraft) to work synergistically with its components to 1) block protons and heavier charged particles, 2) reduce electron radiation, 3) absorb generated slow neutrons and thermal neutrons, and 4) reduce generated bremsstrahlung. The composite material may include the metals or additional compounds described herein.

[0009] In addition to radiation shielding properties, conformal shielding also has optimized directional heat transfer properties, enabling heat transfer from electronic components to the surrounding space while reducing heat transfer from the surrounding space to the electronic components.

[0010] In a first aspect, this disclosure provides an apparatus comprising: an electronic component including at least one circuit; a shielding material coupled to the electronic component to form a protective shield located above or partially surrounding the at least one circuit, wherein the protective shield comprises at least one layer formed of a composite material, wherein the at least one layer is disposed on the electronic component to form the protective shield protecting the electronic component from radiation; wherein the composite material comprises a polymer composite material including an arrangement of carbon material to increase the emissivity of the composite material, and / or wherein the composite material includes a thermally conductive coating disposed above the at least one layer facing the electronic component, and / or the composite material includes a heat-reflective coating disposed above the at least one layer facing away from the electronic component.

[0011] In a second aspect, this disclosure provides an apparatus for radiation shielding, comprising: a shielding material configured to form a protective shield over or partially around at least one circuit located in space, wherein the protective shield comprises at least one layer formed of a composite material, wherein the at least one layer is configured to be disposed on at least one circuit to form a protective shield protecting at least a portion of a circuit from radiation; wherein the composite material comprises a polymer composite material of an arrangement of carbon materials to increase the emissivity of the composite material; and / or wherein the composite material comprises a thermally conductive coating configured to face the at least one circuit and disposed over the at least one layer, and / or a heat-reflective coating configured to face away from electronic components and disposed over the at least one layer.

[0012] In a third aspect, this disclosure provides a method for providing an apparatus as described in another aspect herein, the method comprising: forming a shielding material using one or more of the following: additive manufacturing, compression molding, injection molding, compression molding, 3D compression molding, and thermoforming; and applying the shielding material directly to the surface of an electronic component; or applying the shielding material adjacent to the electronic component.

[0013] In a fourth aspect, this disclosure provides an apparatus comprising: an electronic component including at least one circuit; a shielding material coupled to the electronic component to form a protective shield over or partially surrounding the at least one circuit, wherein the protective shield comprises at least one layer formed of a composite material, wherein the at least one layer is disposed on the electronic component to form the protective shield protecting the electronic component from radiation; wherein the composite material comprises a polymer composite material comprising an arrangement of pure elemental carbon (e.g., carbon black) in the form of carbon fibers and / or colloidal particles to increase emissivity and thermal conductivity; and wherein the composite material comprises a thermally conductive coating disposed over the at least one layer facing the electronic component, and / or a heat-reflective coating disposed over the at least one layer facing away from the electronic component.

[0014] In a fifth aspect, this disclosure provides a system comprising one or more circuits, wherein the system is configured to apply the means as described in another aspect herein to the one or more circuits using a vacuum coating, a high emissivity foil, a paint, or a physical vapor deposition coating.

[0015] The methods for producing shielding materials described herein can be executed by software in a machine-readable form on a tangible storage medium, for example, in the form of a computer program, including computer program code components that, when run on a computer or device used for manufacturing the composite material, are adapted to perform all the steps of any of the methods described herein, and wherein the computer program can be embodied on a computer-readable medium. Examples of tangible (or non-transitory) storage media include disks, thumb drives, memory cards, etc., and do not include propagated signals. The software can be adapted to execute on a parallel or serial processor, such that the method steps can be executed in any suitable order or simultaneously.

[0016] The optional features or options described herein can be suitably combined, as will be apparent to those skilled in the art, and can be combined with various aspects of the invention. Attached Figure Description

[0017] Embodiments of the present invention will be described by way of example with reference to the following figures, wherein:

[0018] Figure 1This is an example of a shielding material disposed on an electronic component according to one aspect of the present invention, the shielding material shielding the electronic component from the effects of a mixed ionizing radiation field;

[0019] Figure 2 This is an example of a shielding material comprising a composite material having at least one layer of polymer composite material according to one aspect of the present invention;

[0020] Figure 3 This is another example of a shielding material comprising multiple functional layers of polymer composite material according to one aspect of the present invention;

[0021] Figure 4 Here are example graphs showing the temperature distribution of a doped shielding material (labeled as a radiator layer) according to one aspect of the invention; and

[0022] Figure 5 This is an example graph showing the thermal conductivity and reflectivity of a shielding material according to one aspect of the present invention.

[0023] Common reference numerals are used throughout the accompanying drawings to indicate similar features. Detailed Implementation

[0024] Embodiments of the invention are described below by way of example only. These examples represent suitable ways of practicing the invention as currently known to the applicant, although they are not the only ways to achieve this. The description illustrates the function of the examples and the sequence of steps for constructing and operating the examples. However, the same or equivalent functions and sequences can be achieved through different examples.

[0025] It is well known that pure aluminum, aluminum alloys, and any other metals and metal alloys are generally unsuitable for shielding commercial off-the-shelf (COTS) electronic components from the effects of space radiation, at least not at the level required for long-duration space missions, because these metals, due to their limited shielding capabilities, cannot completely prevent charged particles from reaching the electronic components.

[0026] It is also known that metals generate a large number of ionizing secondary particles from impact space radiation (projectile fragments) and from the metal itself (target fragments), producing charged particles (protons and heavier ions), neutrons, electrons, X-rays, and gamma rays. This means that behind the shield, assuming a metal (e.g., AI) is used as part of the shield, there will be a new mixed radiation field of protons, alpha particles, high-charge and high-energy (HZE) particles, neutrons, electrons, X-rays, and gamma rays, which is even more damaging to electronic components than the primary radiation field. In particular, target fragments have short-range but high ionization density and will undoubtedly cause severe damage to electronic components located on or within entities in space, such as satellites and spacecraft.

[0027] In this document, an electronic component refers to any electronic device or system having several terminals, or a physical entity that is part of such a device or system for influencing electrons or their associated fields, such as a central processing unit (CPU), graphics processing unit (GPU), random access memory (RAM), solid-state drive (SSD), metal-oxide-semiconductor field-effect transistor (MOSFET), non-volatile memory fast (NVMe) interface, or high-density non-volatile memory (HDNVM). Terminals can be connected to other electrical components to create electronic circuits that include one or more circuits with specific functions. In one example, an electronic component that can be shielded by the device described herein could be a radio wave receiver, also known as a radio tracker. In alternative examples, the electronic component could form part of a complex avionics system.

[0028] To optimize the required mass and volume impact on the electronic components and / or other parts of a shielded space entity (i.e., a small spacecraft platform), a suitable shielding arrangement and its material composition are needed. The shielding should be arranged in a manner that minimizes the mass and volume impact by minimizing the distance between the shielding material and the electronic components, as shown in the data below.

[0029] In one aspect of the invention, the shielding material can be coupled directly or adjacent to the electronic component to form a protective shield over the electronic circuitry of the electronic component. Therefore, this type of shielding is referred to herein as conformal / spot shielding and is described by way of example to synergistically shield the circuitry from uniform and / or mixed ionizing radiation fields generated by charged particles (such as protons, alpha particles, and heavy ions), photons (e.g., X-rays and gamma rays), fast, slow, and thermal secondary neutrons.

[0030] Therefore, in this article, conformal shielding refers to a shielding layer covering the entirety or a large portion of an electronic circuit or a combination of circuits. Point shielding refers to a shielding layer covering a single electronic component or a combination of electronic components. The main difference between the two is that while conformal shielding comprises a uniform layer over a large portion of the entire electronic circuit, point shielding, on the other hand, can cover a single radiation-sensitive component. However, these two are not mutually exclusive, meaning that some types of conformal shielding are also point shielding.

[0031] As can be understood from this invention, the shielding material functions to block electrons, protons, and heavier charged particles, thus allowing for relatively high or as high as possible electromagnetic and nuclear energy deposition, meeting certain criteria of the material's physical properties. Therefore, hydrogen-rich materials offer excellent electron blocking capabilities and excellent nuclear energy deposition.

[0032] Typically, the reduction of electron radiation can be achieved through three main processes: 1) inelastic scattering of atomic electrons, which is highest for hydrogen targets; 2) elastic scattering of atomic nuclei, which is relatively high for high-Z materials; and 3) generation of bremsstrahlung, which consists of photons emitted during changes in electron velocity. Including metal particles in hydrogen-rich complexes will reduce X-ray production while simultaneously attenuating the initial electrons.

[0033] To absorb the generated slow and thermal neutrons, the components with high neutron absorption cross sections described herein can be included in the composite material. To reduce the amount of primary and secondary electrons, low-Z metals (e.g., Al) can be included in the composite material. To reduce generated bremsstrahlung, high-Z metals can be included in the composite material. In addition to radiation shielding properties, the shielding material also has good directional heat transfer properties, enabling heat to be transferred from the electronic components to the surrounding space while reducing heat transfer from the surrounding space to the electronic components themselves.

[0034] Shielding materials can be composite materials. Composite materials can be produced or manufactured in various ways, including but not limited to additive manufacturing, compression molding, injection molding, 3D-compression molding, or thermoforming. This document describes further details regarding the production or methods, and the composite materials produced will be suitable for providing shielding against charged particles such as electrons, protons, alpha particles, and heavy ions; photons such as X-rays and gamma rays; fast, slow, and thermal secondary neutrons, as well as for structural purposes, ballistic protection (micrometeoroids, debris, etc.), including thermal protection and protection against atomic oxygen when used in or above low Earth orbit.

[0035] Composite materials may include polymer composites comprising arrangements of different variants of polyethylene or polypropylene, carbon materials (i.e., short, long, or chopped polymer fibers and / or long or chopped carbon fibers), and / or pure elemental carbon (in colloidal particle form, and / or carbon black), which will increase the emissivity and thermal conductivity of the material. The long or chopped polymers may be a matrix structure or contain a multifunctional layered structure that provides shielding as described herein. For example, shielding may be adapted to minimize the effects of galactic cosmic radiation, particles trapped in radiation belts, and resist solar energy particles and electromagnetic radiation (including X-rays and gamma rays).

[0036] For example, the composite material includes a polypropylene, rather than polyethylene, doped with boron, aluminum, and carbon black for conformal / point shielding. Polypropylene is better because doped polypropylene has a melting temperature of 164-170°C, while doped polyethylene has a melting temperature of about 125-135°C. This makes the composite material containing polypropylene better when it is repositioned to cover electronic components. Carbon black provides very high emissivity and improved conductivity, so that heat will be absorbed very well and transferred to the outer surface of the conformal shield, and then to the surrounding space.

[0037] A multifunctional layered structure refers to a single merged layer or multiple separate layers, where, in one example of a single merged layer, the layers can gradually merge with each other to form a single structure. In another example, a shielding layer refers to two or more layers(s) of a composite material with radiation shielding properties. The combined layers have multiple functions, but in this case, they are used for the single purpose of protecting electronic components in or traveling in space from physical, thermal, chemical, and radiation damage, or by minimizing such damage. For example, these layers can be used to mitigate chemical damage from corrosive atomic oxygen.

[0038] Composite materials may also comprise a polymer matrix or be one or more layers, which may gradually merge together to form a single structure. Composite materials may have two or more layers with radiation shielding properties. These layers are multifunctional and serve a single purpose: to protect electronic components in or traveling in space from physical, thermal, chemical, and radiation damage, or to minimize such damage. For example, these layers can be used to mitigate chemical damage from corrosive atomic oxygen.

[0039] Layers can also be in the form of single layers or multiple gradients, coatings, or sublayers. These layers can gradually merge with each other to form a single-layer structure. These layers can be stacked or arranged on top of each other to form a composite material. Each layer can include structural materials with the same or different optimized mechanical and / or thermal properties.

[0040] Examples of composite materials in a layered structure may include a shielding layer, a metal-containing layer, and any other layers as described below.

[0041] Exemplary shielding layers may be part of a composite material, layer, gradient, or coating with radiation shielding properties, or provide protection against radiation exposure to objects or entities in space. Shielding layers comprise thermoplastic polymers doped with one or more types of chemical compounds, such as ultra-high molecular weight polyethylene (UHMWPE), high-density polyethylene (HDPE), medium-density polyethylene (MDPE), atactic polypropylene (aPP), syndiotactic polypropylene (sPP), and isotactic polypropylene (iPP). The chemical compounds may be boron-based or lithium-based. Chemical compounds may include, but are not limited to, B, BN, BC4, B2O3, LiH, etc. 6 LiH LiBH4、Li 10 BH4, Li2B12H12, Li4BH4(NH2)3, NH3BH3, NH3, Mg(BH4)2. Lithium can be naturally abundant Li or enriched Li. 6 Li, and boron can be naturally abundant B or enriched. 10 B. For the purpose of providing radiation protection, it should be understood that various alternative boron- or lithium-based compositions and their derivatives can be integrated with or are capable of being integrated with thermoplastic polymers as part of a shielding layer. Thermoplastic polymers (i.e., UHMWPE, HDPE, MDPE, or PP) are produced to ensure mechanical strength, and the high hydrogen content of thermoplastic polymers ensures good radiation shielding characteristics or properties relative to high- or high-energy charged particles present in space. Thermoplastic polymers also slow down secondary neutron generation. Boron and / or lithium, particularly 1% to 20%, are used to absorb slow neutrons and thermal neutrons, further improving the quality of the shielding.

[0042] The shielding layer can be, for example, a strong mechanical radiation shield, which is also used to protect against micrometeoroids and orbital debris (MMOD). This layer comprises UHMWPE, HDPE, MDPE, LDEP, or a mixture of the above PE fibers, and / or PP doped with 1 to 20% (i.e., 5%) boron and / or lithium compounds. The boron and / or lithium compounds can be B, BN, BC4, B2O3, LiH, etc. 6 LiH LiBH4、Li 10 BH4, Li2B 12 H 12 Li4BH4(NH2)3, NH3BH3, NH3, Mg(BH4)2. For boron and lithium compounds, lithium can be naturally abundant Li or enriched Li. 6 Li, and boron can be naturally abundant B or enriched. 10 B. The compounds include, but are not limited to, aluminum, aluminum hydroxide, phosphorus, nitrogen, antimony, chlorine, bromine, magnesium, magnesium hydroxide, antimony, tin and zinc, and may include carbon as a fire retardant / flame retardant.

[0043] The shielding layer can also be, for example, a mechanical strong radiation shield. The shielding layer includes UHMWPE, HDPE, MDPE, LDPE, or mixtures of the above PE fibers, or PP doped with 1-20% (i.e., 5%) boron and / or lithium compounds. The boron and / or lithium compounds can be: B, BN, BC4, B2O3, LiH, etc. 6 LiH LiBH4、Li 10 BH4, Li2B12H12, Li4BH4(NH2)3, NH3BH3, NH3, Mg(BH4)2. For boron and lithium compounds, lithium can be naturally abundant Li or enriched Li. 6 Li, boron can be naturally abundant B or enriched. 10 B. Aluminum, aluminum hydroxide, phosphorus, nitrogen, antimony, chlorine, bromine, magnesium, magnesium hydroxide, antimony, tin zinc, and carbon can also be added as flame retardant compounds.

[0044] Structural layers may include, for example, a layer to prevent the presence of atomic oxygen at the LEO, where strong UV radiation decomposes O2 into atomic oxygen. This layer may be made of SiO2 without or filled with 8 to 15% (by volume) of a fluoropolymer, a thin gold or platinum layer, or a silicon-based coating. Structural layers may also include strong micrometeoroids (MMOD), debris, and thermal protection layers. For space vehicles and / or space habitat applications, ceramic materials are made of alumina (Al2O3), boron carbide (B4C), or silicon carbide (SiC), aluminum carbide (Al4C3).

[0045] The metal-containing layer can be, for example, part of a composite material, layer, gradient, or coating. The metal-containing layer can be, for example, a metal layer, a metal oxide layer, metal / metal oxide powder dispersed in a polymer matrix, a metal / metal oxide enriched layer, or a coating of composite metal / metal oxides. The metal-containing layer can include, for example, metals, metal oxides, and their derivatives.

[0046] Metallic layers are adapted to minimize the effects of electrons, X-rays, gamma rays, or radiation from X-rays. Composite materials, layers, gradients, or coatings may include one or more metallic layers. One or more metallic layers are located between or adjacent to the shielding layers of a composite material. Metallic layers may have any thickness between 1 mm and 30 mm (inclusive) and may be stacked on top of each other to form multiple metallic layers as part of a powder form of a metal / metal oxide in a composite material, gradient, coating, or thermoplastic.

[0047] The metal-containing layer may comprise metal / metal oxide powder (having an atomic number (Z) equal to 13, or any value from 22 to 30), metal / metal oxide, or metal / metal oxide dispersed in a polymer matrix to minimize X-ray generation while attenuating initial electrons.

[0048] The oxide powder, metal / metal oxide layer, or metal-containing layer dispersed in the polymer matrix may contain any value of metal / metal oxide with an atomic number (Z) equal to 72 to 79 in order to maximize the attenuation of the generated X-rays.

[0049] The oxide powder, metal / metal oxide, or metal-containing layer dispersed in the polymer matrix may contain metal / metal oxides with atomic numbers (Z) of any value from 13 or from 22 to 30 to block secondary electrons without generating significantly more X-rays.

[0050] Composite materials can be formed using more than one metal-containing layer. An example of multiple metal-containing layers could be a first layer consisting of a metal / metal oxide with an atomic number (Z) of 13 or any value between 22 and 30. The first layer is disposed on a second layer, which consists of a metal / metal oxide with an atomic number (Z) of 72 to 79. A second layer is disposed on a third layer, which consists of a metal / metal oxide with an atomic number (Z) of 13 or any value between 22 and 30. Each of the first, second, and third layers can have a thickness of at least 1 mm, preferably between 1 mm and 30 mm. These layers can be part of a gradient-form thermoplastic material.

[0051] A metal-containing layer (or specifically, a metal / metal oxide layer) or any layer described herein may be incorporated into the thermoplastic polymer of a gradient-embedded composite material or may be part of the thermoplastic polymer of a composite material to induce a radiation shielding effect, as described above. This effect is inherent to the nature of metals / metal oxides with low atomic weights, ranging from 13 or any value between 22 and 30, including 22 and 30. The metal-containing layer serves as a shield for heavier metals with atomic numbers between 72 and 79 (inclusive) and for electrons and photons (emitted by X-rays and gamma rays).

[0052] Layers can gradually merge to form a single structure or polymer matrix. Composite materials also include one or more structural layers. A structural layer is a part of a composite material, layer, gradient, or coating that provides structural support against micrometeoroids and orbital debris (MMOD), or a coating suitable for preventing physical, thermal, corrosive, and radiation damage, where structural support against micrometeoroids and orbital debris (MMOD) or protection against physical damage is required when shielding materials are applied to electronic components on the surface of a spacecraft.

[0053] It is understandable that composite materials may need to possess physical properties that meet certain standards or thresholds to be suitable for use in space or above the Earth's atmosphere, such as above orbits, namely Low Earth Orbit (LEO), Medium Earth Orbit (MEO), Geostationary Orbit (GEO), and deep space, including between the Earth and the Moon and beyond. These properties exhibited by the layers of the composite material are the result of compositions or portions of radiation-resistant materials that combine to form the radiation-resistant composite material.

[0054] For example, these properties include, but are not limited to, structural properties, strength or hardness properties; shielding properties against high-energy charged particles; shielding properties against electromagnetic radiation including X-rays and gamma rays; shielding properties against fast neutrons; shielding properties against slow neutrons and thermal neutrons; micrometeoroid protection on the outer layer; atomic oxygen barrier coating on the outer surface; low density; no release of toxic gases; no relatively low melting point; low flammability (which depends on the material's specific heat, thermal conductivity, decomposition and ignition temperatures, and the heat generated when the material burns (heat of combustion)); vibration resistance; maintaining function and geometry even when exposed to large temperature variations; and thermal conductivity and insulation properties. These properties can be used or selected when providing or manufacturing composite materials. Thus, as an alternative, a multifunctional structure for radiation shielding can also be used as a structural material with optimized performance in protecting objects or entities from physical, thermal, and radiation damage when they are in or traveling in space, or for the construction of habitats on the Moon, asteroids, or planets.

[0055] The composite materials described herein are also intended to provide shielding against galactic cosmic radiation, particles trapped in radiation belts, and high-energy particles and electromagnetic radiation from the sun. Radiation may include, for example, X-rays and gamma rays. Radiation protection or shielding may include resistance to fast, slow, and thermal secondary neutrons. When used at or above near Earth orbit (LEO), the shielding may extend to provide further protection against atomic oxygen.

[0056] Composite materials can provide structural or ballistic protection (e.g., resistance to micrometeoroids, debris, and other objects in space). In other words, composite materials are used to shield entities in space from radiation exposure or are suitable for the space environment, such as spacecraft, and / or as part of the building materials for spacecraft, spacesuits, or space habitats. Furthermore, composite materials can be used as building materials for shielding spacecraft, habitats, spacesuits, or in addition to radiation shielding for habitats, satellites, or any high-altitude vehicles.

[0057] When in close contact with electronic components, the synergistic effect of shielding materials (heat transfer via conduction, combined with high emissivity, appropriate conductivity, and high reflectivity) can be amplified. To absorb heat from electronic devices, high emissivity of composite materials or surfaces facing the electronic devices can be achieved through any one or a combination of the following: 1. incorporation of 1-10% carbon black, 2. coating with a high-emissivity black paint, 3. vacuum coating, 4. physical vapor deposition (PVD), 5. chemical vapor deposition (CVD), 6. high-emissivity foil as described herein.

[0058] It should be understood that when carbon materials (including carbon black and / or carbon fibers, which are in the form of subcrystalline carbon with a high surface area to volume ratio, although lower than that of activated carbon) are used, thermal conductivity increases and mechanical properties are also improved.

[0059] It should also be understood that in order to reflect heat from the surface of the back of the electronic device, a very thin metal layer can be used to achieve high reflectivity, for example, by depositing (PVD, such as sputtering deposition, CVD, electrodeposition, etc.) aluminum in the form of nano or micro particles, or depositing metal sheets, coatings, or multi-surface coatings (MSP) on the surface.

[0060] The combination of contact, high emissivity, and high reflectivity results in good heat transfer from the thermionic device to the relatively cold vacuum in which the device resides, but poor heat transfer from the ambient space in which the device resides to the device itself, as shown by... Figure 5 The data in the figure shows that the arrangement of carbon materials, namely carbon black and / or polymers and / or carbon fibers, effectively increases the electrical conductivity and mechanical properties of the composition.

[0061] Shielding materials can be produced in various ways. For example, the production of shielding materials can begin with providing a material composition to a device. This device can be a 3D printer or a molding apparatus suitable for receiving and processing the material composition. A composite material is generated based on a model using the material. The composite material is then produced using the material. Specifically, materials are combined to form layers of the composite material. Various techniques can be used to combine the materials to form layers, allowing the layers to gradually merge together. Alternatively, imperfections or defects on the composite material are removed based on one or more inputs from the model.

[0062] Furthermore, the composite material can be generated, for example, by incorporating the composition in a 0° warp and 45° to 90° filling direction to produce at least one layer of the composite material, wherein the composition comprises carbon fibers and a thermoplastic polymer. Alternatively, the composition may contain a thermoplastic polymer crosslinked before or after the formation of the composite material.

[0063] More specifically, layers of doped multifunctional composite materials can be 3D printed or molded together, where one or more models of the composite material can be generated prior to printing or molding using appropriate computational or system tools (e.g., computer-aided design software). During the 3D printing or molding process, in one example, an epoxy resin matrix can be used to fill the spaces between thermoplastic polymers (more specifically, UHMWPE, HDPE, MDPE, LDPE, or mixtures of different PE fibers, or any form of PP), and the material can have interwoven carbon and PE fibers laid out or 3D printed in a 0° warp and 45° to 90° infill direction. The composite material is 50 to 100 volume percentages of UHMWPE, HDPE, MDPE, LDPE, or mixtures of PE fibers, or any form of PP, with the remaining volume percentages being an epoxy resin matrix and dopants, and graphite fibers. The same operation can be performed without epoxy resin and graphite fibers.

[0064] Fiber / pore size and orientation can be optimized to achieve maximum material strength and temperature regulation on the material, thereby minimizing structural and morphological changes during mechanical stress and temperature variations.

[0065] Composite materials can also be produced using an extrusion process, where all components (dopants and raw plastic) are melted and formed into a continuous profile. The extrusion process begins by feeding plastic material (microparticles, granules, flakes, or powder) from a hopper into the barrel of an extruder. Mechanical energy generated by rotating the screw and heaters arranged along the barrel gradually melts the material. The molten polymer is then pressed into a die, which shapes the polymer into a filament that hardens during cooling. If the desired homogeneity of the composite material with its components is required, the filament can be granulated and the process repeated. After achieving satisfactory dispersion of all components in the composite material, the filament is transferred to a 3D printer, which prints the desired shape factor. Molding or thermoforming techniques can be used as alternatives to or complements to 3D printing.

[0066] Crosslinking thermoplastic polymers or polyethylene using ionization or UV radiation can improve the mechanical strength and melting temperature of composite materials during the production process. Additional catalysts (i.e., acidic catalysts) can be used to accelerate the reaction during this process.

[0067] The production of composite materials is not limited to the methods and techniques described herein. Further techniques for doping plastics can be applied to produce composite materials under various conditions to provide the various benefits and advantages associated with them.

[0068] The composite material produced by the exemplary method described above will be part of the shielding material and integrated with electronic components, as per [specific method / instruction]. Figure 1 As shown.

[0069] Figure 1 This is an example of black conformal and dot shielding applied to a circuit board (i.e., the Xilinx 7 Evaluation Kit) to protect components comprising one or more circuits from radiated or mixed ionizing radiation fields. The figure shows conformal shielding across the entire board, with thicker dot shielding for more radiation-sensitive components. The shielding material is in direct contact with the electronic components in some areas, while remaining in close proximity in other areas.

[0070] Conformal and point shielding can be directly or adjacent to electronic components (and one or more circuits thereof), and onto the MSP, which may include a thin metal layer, such as aluminum or any other highly reflective metal / compound, deposited or sprayed (sputtered, chemical or physical vapor deposition, electrodeposition, etc.) onto the conformal and point shielding in the form of nanoparticles or microparticles, or deposited on the surface of the MSP as a metal sheet. It should be understood that the metal layer may comprise any one or more types of metals / compounds described herein.

[0071] Conformal and point shielding can be produced using conventional manufacturing methods, including but not limited to additive manufacturing, compression molding, injection molding, 3D compression molding, and thermoforming. It should be understood that these methods can be further customized to provide conformal and point shielding in accordance with any aspect described herein.

[0072] As an example, the conformal and dotted shielding generated and applied to the Xilinx 7 as shown in the figure can be part of a system comprising one or more circuits, wherein the system can be configured to apply conformal and dotted shielding to one or more circuits using, for example, the manufacturing methods described herein, which can be used to generate various types of coatings, such as paint coatings, vacuum coatings, high emissivity foils, and physical vapor deposition coatings. Specifically, the system can be configured to directly displace or place shielding material on the surface of any underlying circuitry in an electronic component or certain area, and / or apply shielding material adjacent to the electronic component or circuitry, wherein the shielding material is applied to the Xilinx 7 or any other circuitry or electronic component using paint coatings, vacuum coatings, high emissivity foils, or physical vapor deposition coatings via an operating system.

[0073] Figure 2 This is another example of different layers 200 of a composite material used for shielding components. The figure illustrates a composite multifunctional material or composite material comprising at least one shielding layer 206 for minimizing damage from effects from travel or residence in space above Earth's orbit. When placed on top of each other, the layers of the composite material can gradually merge into each other to form a single structure or block of the composite material.

[0074] based on Figure 2The materials included may include a first shielding layer 210, at least one metal-containing layer 208 above the first shielding layer 210, and a second shielding layer 206 above the at least one metal-containing layer 208 opposite to the first shielding layer 210. One or more metal-containing layers 208 are sandwiched between the two shielding layers 206, 210. The two shielding layers 206, 210, each and / or combined with other layers of the composite material, provide radiation shielding properties to the composite material.

[0075] These layers can comprise radiation-resistant composite materials that meet a set of mechanical and thermal requirements. These properties include shielding not only HZE particles, but also fast and slow thermal neutrons, by combining boron-based and / or lithium-based compounds with thermoplastic polymers. Therefore, shielding layers 206 and 210 effectively block secondary-generated neutrons and absorb slow and thermal neutrons. Examples of shielding layers 206 and 210 comprising thermoplastic polymers doped with one or more metals or compounds for shielding are provided herein.

[0076] Alternatively, the composite material may form one or more structural layers 202, 204 above the second shielding layer opposite the at least one metal-containing layer. Each structural layer comprises a multifunctional composite material that tends to include or includes antioxidants, heat-resistant materials, and polymer-based materials—multifunctional composite materials used for shielding purposes in addition to radiation shielding.

[0077] Alternatively, structural layers 202 and 204 may further include at least one atomic oxygen barrier layer 202 above at least one micrometeoroid layer 204, wherein the at least one micrometeoroid layer 204 is disposed on a second shielding layer 206 opposite to the at least one metal-containing layer 208. Alternatively, at least one thermal protection layer 212 is disposed below the first shielding layer 210, opposite to the at least one metal-containing layer 208.

[0078] Furthermore, structural layers 202 and 204 may include a thermal protection layer. Alternatively, the thermal protection layer may be disposed on the atomic oxygen barrier layer. Alternatively, the thermal protection layer may be integrated onto the atomic oxygen barrier layer 202 above at least one micrometeoroid layer 204.

[0079] The chemical compounds used for shielding in shielding layers 206 and 210 include at least boron and / or lithium. For example, the composition may contain boron-based or lithium-based compounds, including but not limited to the classes of boron and lithium compounds described herein. Boron-based and lithium-based compounds may be naturally occurring elements or other elements, such as boron-10-enriched B4C. The natural abundance of boron-10 is 19.9 atomic percent, making shielding layers 206 and 210 with boron-10 act as absorbers for backscattered thermal neutrons. This absorption is significantly increased when boron-10-enriched B4C is used instead of natural boron.

[0080] As shown in the figure, a metal-containing layer 208 is sandwiched between two shielding layers 206 and 210. Each metal-containing layer 208 may comprise an elemental metal / metal oxide having an atomic number (Z), optionally 22 to 30 and / or 72 to 79. Alternatively, for at least two metal / metal oxide layers, the atomic number (Z) is 13. Alternatively, the atomic number (Z) is 72 to 79, wherein the at least one metal-containing layer 208 is located between at least two other metal-containing layers 208 having a lower atomic number (Z). Each layer may be, for example, 1 to 30 mm thick, such that when one or more metal-containing layers 208 are introduced, the thickness is at least 1 mm. As described herein, whether the composite material is on a spacecraft or in a spacesuit, the thickness is suitable or appropriate for performing the function used by the composite material.

[0081] As mentioned above and as Figure 2 As shown, the composite material forms a protective shield surrounding the electronic components, i.e. Figure 1 The Xilinx 7 evaluation kit is shown. Electronic components may include at least one circuit, with a protective shield formed over or partially surrounding the at least one circuit.

[0082] The composite material may include at least one layer comprised of multiple merged layers, wherein the at least one layer is disposed on an electronic component to form a protective shield protecting the electronic component from radiation. The at least one layer of the composite material may include a thermally conductive coating. The coating may be disposed on the at least one layer facing the electronic component, and / or a heat-reflective coating may be disposed on the at least one layer facing away from the electronic component. For example, in the case of a multifunctional layered structure as described herein, the at least one layer may be functionally associated with a single merged layer.

[0083] The composite material may also comprise at least two (or more) layers, separated or combined, wherein at least one of the two layers is disposed on the electronic component to form a protective shield protecting the electronic component from radiation. The at least two layers of the composite material include a thermally conductive coating. Figure 2 As shown, the coating can be disposed above the first layer of the at least two layers facing the electronic components, and the heat-reflective coating can be disposed above the second layer of the at least two layers facing away from the electronic components.

[0084] Composite materials may include long or chopped polymers and / or long or chopped carbon fibers, and / or polymer composites of pure elemental carbon in the form of colloidal particles, or referred to herein as carbon materials, made of thermoplastic plastics (e.g., polypropylene compositions). The polymer composite material may further contain or be doped with at least one compound or metal as described herein, such as boron, boron-based compounds, lithium, lithium-based compounds, carbon black, aluminum, aluminum-based compounds, and one or more coating types, each in an amount of 0.1-20% w / w, preferably 0.1-10% w / w, more preferably 0.1-5% w / w.

[0085] Each compound or metal in the polymer composite material can be one of the following: 0.1-1% w / w, 0.1-2% w / w, 0.1-3% w / w, 0.1-4% w / w, 0.1-5% w / w, 0.1-6% w / w, 0.1-7% w / w, 0.1-8% w / w, 0.1-9% w / w, 0.1-10% w / w, 0.1-11% w / w, 0.1-12% w / w, 0.1-13% w / w, 0.1-14% w / w, 0.1-15% w / w, 0. 1-16%w / w, 0.1-17%w / w, 0.1-18%w / w, 0.1-19%w / w, 0.1-20%w / w, 1-2%w / w, 1-5%w / w, 1-10%w / w, 1-20%w / w, 2-5% w / w, 2-10%w / w, 2-15%w / w, 2-20%w / w; 5-10%w / w, 5-15%w / w, 5-20%w / w, 0.1%w / w, 1%w / w, 5%w / w, 10%w / w and 20%w / w. It should be understood that each compound or metal cannot exceed 20-25% w / w.

[0086] Figure 3 This is another example of different layers 300 of a composite multifunctional material used for shielding components. The figure illustrates a composite shielding material as multiple layers. The material includes one or more multifunctional layers, each stacked on top of the other to form a composite shielding material with optimized thermal properties. Alternatively, the multifunctional layers are gradients merged with each other to form a single merged layer. The multiple multifunctional layers include one or more shielding layers 304, each shielding layer 304 disposed between one or more other multifunctional layers selected from structural layers 302, metal-containing layers 306, micrometeoroid layers, and thermal protection layers, as well as different structural layers 302. The multifunctional layers correspond to... Figure 1 and Figure 2 The layer shown.

[0087] In addition to or in place of structural layer 302, the multifunctional layer may further include structural and shielding layers, such as fire barriers, layers for structural and radiation shielding against HZE particles and fast, slow and thermal neutrons, radiation shielding layers against HZE particles and fast neutrons, radiation shielding layers against X-rays and photons, layers for micrometeoroids and thermal protection (wherein such layers may include radiation shielding properties with doped radiation-absorbing compounds), and atomic oxygen barrier coatings / layers.

[0088] Examples of fire barriers or thermal protection layers may include those weighing approximately 20 to 300 g / m². 2 Flexible graphite sheets / layers. Elastic graphite sheets / layers provide excellent chemical resistance, heat resistance and mechanical resistance, thus acting as a protective barrier for the interior of spacecraft.

[0089] Examples of shielding layers could be 3D-printed natural boron or boron-10 (… 10 B) Doped carbon materials, short, long, or chopped polymers and / or long or chopped carbon fibers, which may be made of reinforced ultra-high molecular weight (UHMW) polyethylene, or high-density polyethylene (HDPE), medium-density polyethylene (MDPE), low-density polyethylene (LDPE), or a combination of different PEs, or any form of polypropylene (PP), wherein the composite contains 30 to 95 vol% fiber and 5 to 20 vol% natural boron or 10 B. The remaining volume percentage can be filled with an epoxy resin matrix to fill the spaces between the fibers. PE or PP comprises layers of interwoven carbon and PE fibers laid in a 0° warp and 45° to 90° fill direction. Fiber / pore sizes can be optimized for maximum material strength and temperature regulation of the material to minimize structural and morphological changes during significant temperature variations. The shielding layer may include properties and materials for physically shielding objects within the space.

[0090] Another example of a shielding layer can be ultra-high molecular weight (UHMW) polyethylene, or high-density polyethylene (HDPE), medium-density polyethylene (MDPE), low-density polyethylene (LDPE), or a combination of different PEs, or any form of PP, wherein the composite comprises 65-95% by volume of ultra-high molecular weight (UHMW) polyethylene fibers. The PE or PP comprises fiber layers laid in a 0° warp and 45° to 90° fill direction. Fiber / pore size can be optimized to achieve maximum material strength and temperature regulation on the material to minimize structural and morphological changes during significant temperature variations. Figure 1 One or more metal-containing layers 306 can be added between the relevant layers 2 and 3 to prevent electron, X-ray and gamma radiation.

[0091] Examples of structural layers (also used as radiation shielding, particularly for neutrons) can include, for example, boron carbide, silicon carbide, aluminum carbide, or combinations thereof. Table 2 shows boron carbide coatings (B4C), silicon carbide coatings (as an alternative), or aluminum carbide coatings (as an alternative), taking into account hardness, Young's modulus, compressive strength, density, and optimal selection as thermal neutron shielding. Boron carbide can be made from natural boron or boron-10 enriched boron carbide, which shields thermal neutrons better than natural boron.

[0092] When B4C is used as a coating on a composite layer, thermal testing shows that when the B4C layer is exposed to temperatures of 1,200°C and above, the highest temperature recorded at the bottom of a 12.7 cm thick carbon foam sample does not exceed 40°C. This thermal capability is comparable to that of the high-temperature ceramic tiles used on the Space Shuttle.

[0093] One example could be a combination of open-cell carbon foam and a B4C coating deposited on the outer surface of the carbon foam via plasma deposition. Coal-based carbon foam has a low density (0.268 g / cm³). 3 It possesses low thermal conductivity (0.25 W / mK to 5 W / mK, depending on the cell structure) and the ability to withstand temperatures up to 3,000°C in a non-oxidizing atmosphere or with suitable surface protection. The thermal conductivity of carbon foam is comparable to that of HRSI tiles used on the Space Shuttle. B4C can be deposited on the surface of carbon foam via vacuum plasma spraying (VPS).

[0094] Another example of structural layer 302 could be an atomic oxygen resistant coating to protect other layers of space structures in or above near Earth orbit (LEO) from atomic oxygen. Composite materials may also include such an atomic oxygen resistant coating. For the coating, a B4C (or alternatively, silicon carbide (SiC) or aluminum carbide (Al2O3)) layer would be coated with a very thin layer of silica glass that has been oxidized so that it will not be damaged by atomic oxygen. When the layer is made very thin, it is flexible and does not sacrifice any thermal properties. An alternative coating is a graphite coating, for example, using or immersing the material in a solution of graphite oxide. Other coatings or gradients may be applied as part of or in addition to layer 5 to further protect particles trapped in radiation belts, debris, or micrometeoroids.

[0095] The above about Figures 2 to 3The shielding material described may also include at least one layer configured to protect electronic components from electromagnetic interference (EMI). That is, the shielding material may include at least one layer configured to provide electromagnetic shielding. Electromagnetic interference may also be referred to as radio frequency interference, and therefore the layer providing electromagnetic shielding may also be described as providing shielding against waves in the radio frequency spectrum. One or more layers providing electromagnetic interference shielding may also be referred to as one or more EMI layers. At least one EMI layer is provided to prevent electromagnetic signals from entering sensitive areas of the electronic components. In one example, the shielding material includes a single EMI layer (i.e., only one EMI layer). In another example, the shielding material includes two or more EMI layers. At least one EMI layer may include one or more types of materials. At least one EMI layer may have high electrical conductivity and / or high magnetic permeability. At least one EMI layer may be configured to reflect electromagnetic signals. Alternatively or additionally, at least one EMI layer may be configured to absorb electromagnetic signals.

[0096] At least one EMI layer may comprise at least one of the following material types: metal, carbon, and graphene. Where at least one EMI layer comprises a metal, the layer may be a metal coating, a metal sheet, or a metal strip. In a specific example, the metal of the at least one EMI layer may be copper, silver, aluminum, carbon steel, nickel, zinc, tin, beryllium, and / or alloys of varying amounts of the above metals. Alternatively, the at least one EMI layer may comprise one or more oxides of one of the above metals. In an example, at least one EMI layer is a shielding material 200 excluding... Figure 2 Additional layers beyond layers 202-212 shown. That is, at least one EMI layer can be a separate layer from the layer formed of the composite material, protecting the shield. At least one EMI layer can be located on the surface of the shielding material (i.e., can form an outer layer of the shielding material), or alternatively can form a seal around the periphery of the shielding material. In a particular example, at least one EMI layer can be a gasket. Alternatively, at least one EMI layer can be... Figure 2 One or more of layers 206 and 210 shown. That is, in an alternative example, at least one EMI layer is a shielding material layer formed of composite material.

[0097] At least one EMI layer is Figure 2 In one or more examples of shielding layers 206 and 210 shown, the electromagnetic shielding function of at least one EMI layer is achieved by loading the shielding layer with filler. The filler for at least one shielding layer can be any metal mentioned above regarding EMI layers. The filler can be an alloy containing one or more of the aforementioned metals. The filler can be an oxide of one or more of the aforementioned metals.

[0098] Figure 4A temperature distribution diagram 400 (i.e., with MSP) is shown within a doped shielding material (i.e., with MSP) according to any aspect described herein. The graph in the figure plots temperature (K) versus distance (cm) from the top surface of the shielding material. The top surface of the shielding material receives solar radiation, which is effectively reduced (in intensity) relative to the depth of the shielding material from the surface. The heat Q from solar radiation... s It can be calculated using the following equation: Calories Q rad It also releases heat from the top surface of the shielding material. (Heat Q) rad Calculated using the following equation: Heat Q from electronic components in It is generated and can be measured relative to distance at the bottom layer of the shielding material, as shown in the figure.

[0099] exist Figure 4 The diagram shows and plots different reflectivities p. eff The example curve to be drawn can have the following parameters and values.

[0100] Solar radiation at LEO: 1376.5 W / m 2

[0101] Layer thickness: 5 cm

[0102] • Cross-sectional area: 10 x 10 cm 2

[0103] Heat generated from electronic components: 5W

[0104] Thermal conductivity: 0.5 W / mK

[0105] • Ambient temperature: 3K

[0106]  Transmittance

[0107]  Reflectivity

[0108]  Emissivity .

[0109] It should be understood that the conformal shielding and composite materials described herein provide high emissivity and improved conductivity (see [link to article]). Figure 5 This allows heat to be absorbed and transferred very well to the outer surface of the shield, and then to the surrounding space. Here, the profile of the temperature distribution illustrates the heat transfer to the surrounding space through variations in the conformal shield with different composite materials.

[0110] Regarding temperature distribution, examples of composite materials may include PP doped with Al, BN, or B4C, and carbon black. As shown in the temperature distribution profile, the composite material exhibits increased emissivity and thermal conductivity. A reflective layer can also be applied to the outer surface of the composite material, which can be accomplished through vacuum coating, high-emissivity foil, painting, or physical vapor deposition coating.

[0111] Figure 5 This is an example of graph 500 showing both the thermal conductivity and reflectivity of the shielding material. Graph 502 on the left shows different effective reflectivities and is for 1376.5 W / m exposed on the top / outer surface. 2 The temperature at the lower boundary of the conformal shield, consisting of a heat source (simulating heat from the sun) and a 5 W heat source on the bottom / inner surface (simulating heat from electronic components), is correlated with thermal conductivity. It can be seen that the curves have similar shapes, but the absolute values ​​depend on the reflectivity. It can also be seen that as the thermal conductivity increases from 0 W / mK to 2-3 W / mK, heat transfer increases significantly, thus reducing the temperature at the lower boundary of the conformal shield. However, for even higher thermal conductivity, heat transfer does not increase much with increasing thermal conductivity.

[0112] Chart 504 on the right shows the temperature versus reflectivity at the lower boundary of a shielding material exposed to an arbitrary heat source on its outer surface for different thermal conductivityes. It can be seen that the curves have similar shapes, but the absolute values ​​depend on the reflectivity.

[0113] In one aspect, an apparatus includes: an electronic component comprising at least one circuit; a shielding material coupled to the electronic component to form a protective shield located above or partially surrounding the at least one circuit, wherein the protective shield comprises at least one layer of a composite material / forming a composite material, wherein the at least one layer is disposed on the electronic component to form a protective shield protecting the electronic component from radiation; wherein the composite material comprises a polymer composite material comprising an arrangement of carbon material; and wherein the composite material comprises a thermally conductive coating disposed above the at least one layer facing the electronic component, and / or a heat-reflective coating disposed above the at least one layer facing away from the electronic component.

[0114] On the other hand, there is a radiation shielding device comprising: a shielding material coupled to an electronic component, which forms a protective shield over or partially surrounds at least one circuit of an entity in space, wherein the protective shield comprises at least one layer of composite material / forming a composite material, wherein the at least one layer is disposed on the electronic component to form a protective shield protecting the electronic component from radiation; wherein the composite material comprises short, long, or chopped polymers and / or long or chopped carbon fibers or polymer composites of materials such as carbon black; and wherein the composite material comprises a thermally conductive coating disposed over the at least one layer facing the electronic component, and / or a heat-reflective coating disposed over the at least one layer facing away from the electronic component.

[0115] In another aspect, there is a method for providing an apparatus as described herein, the method comprising: forming a shielding material using one or more of the following: additive manufacturing, compression molding, injection molding, compression molding, 3D compression molding, and thermoforming; and applying the shielding material directly to the surface of an electronic component; or applying the shielding material adjacent to the electronic component.

[0116] In another aspect, there is a system comprising one or more circuits, wherein the system is configured to apply the means described herein to the one or more circuits using a vacuum coating, a high emissivity foil, or a physical vapor deposition coating.

[0117] As will be understood by those skilled in the art, the following optional features may be combined with at least the aspects described above.

[0118] Alternatively, the shielding material is disposed directly on the surface of the electronic component to form direct contact with the electronic component, and / or the shielding material is located near the electronic component to form proximity contact.

[0119] Alternatively, direct contact is formed via a thermally conductive coating on the first layer facing the electronic components.

[0120] Alternatively, proximity contacts are formed via a thermally conductive coating on the first layer facing the electronic components.

[0121] Alternatively, the polymer composite material is made from at least one of the following: hydrogen-rich thermoplastic polymer, high-density polyethylene, medium-density polyethylene, atactic polypropylene, syndiotactic polypropylene, or isotactic polypropylene, or a mixture of two or more of these components.

[0122] Alternatively, the polymer composite material is doped with at least one compound or metal.

[0123] Alternatively, the at least one compound is boron or lithium.

[0124] Alternatively, the at least one metal is a metal or a metal oxide.

[0125] Alternatively, a metal or metal oxide is dispersed in a matrix composition or layered structure, wherein the matrix composition or layered structure is part of a hydrogen-rich thermoplastic polymer, high-density polyethylene, medium-density polyethylene, or any form of polypropylene.

[0126] As an alternative, the metal or metal oxide has an atomic number (Z), where (Z) is 13 or 22 to 30.

[0127] As an alternative, the metal or metal oxide has an atomic number (Z), where (Z) is between 72 and 79.

[0128] As an alternative, the shielding material has a thickness of 30 mm or less.

[0129] As an alternative, the thickness ranges from 1 mm to 30 mm.

[0130] Alternatively, the thermally conductive coating may include a carbon black mixture, a black coating, a type of vacuum coating, a type of high emissivity foil, or a type of physical vapor deposition coating, wherein the thermally conductive coating is applied using a method for applying a type of coating or mixture, vacuum coating, high emissivity foil, or physical vapor deposition coating.

[0131] As an alternative, a carbon black mixture is applied to the polymer composite to form a mixture with high emissivity.

[0132] As an alternative, a carbon black mixture is applied to the arrangement of carbon materials in the composite to form a mixture with high emissivity.

[0133] As an alternative, the carbon black mixture is 0.1-5% w / w to form a mixture with high emissivity and reflectivity.

[0134] As an alternative, a heat-reflective coating is a paint coating or a metal layer deposited onto a composite material as nano or micro particles.

[0135] As an alternative, the coating type is white to minimize emissivity and increase reflectivity.

[0136] As an alternative, the metal layer may include aluminum or another highly reflective metal.

[0137] As an alternative, one or more of the following can be used to produce shielding materials: additive manufacturing, compression molding, injection molding, 3D compression molding, or thermoforming.

[0138] As an alternative, the shielding material is a type of conformal shielding or point shielding.

[0139] Alternatively, the composite material may also contain one or more of the following: boron, boron-based compounds, lithium, lithium-based compounds, carbon black, aluminum, aluminum-based compounds, and one or more coating types.

[0140] Alternatively, one or more of boron, boron-based compounds, lithium, lithium-based compounds, carbon black, aluminum, aluminum-based compounds, and one or more paint types each have 0.1-20% w / w, preferably 0.1-10% w / w, more preferably 0.1-5% w / w.

[0141] As an alternative, one method includes: applying a shielding material directly to the surface of an electronic component; or applying a shielding material adjacent to the electronic component; and wherein the application of the shielding material includes a method for applying a coating, vacuum coating, high emissivity foil, or physical vapor deposition coating on the inner boundary of the shielding material facing the electronic component.

[0142] As an alternative, one method includes: applying a shielding material directly to the surface of an electronic component; or applying a shielding material adjacent to the electronic component; and wherein the application of the shielding material includes a method for applying a coating, vacuum coating, high-reflectivity foil, or physical vapor deposition coating on the outer boundary of the shielding material facing away from the electronic component.

[0143] In different aspects, it is a composite material comprising: a first shielding layer; at least one metal-containing layer above the first shielding layer; and a second shielding layer on the at least one metal-containing layer opposite to the first shielding layer; wherein the first shielding layer and the second shielding layer, each and / or combined with other layers of the composite material, provide radiation shielding properties for the composite material.

[0144] In different aspects, it is a composite material comprising: a first shielding layer; at least one metal / metal oxide layer above the first shielding layer; and a second shielding layer on the at least one metal / metal oxide layer opposite to the first shielding layer; wherein the first shielding layer and the second shielding layer, each and / or combined with other layers of the composite material, provide radiation shielding properties for the composite material.

[0145] In different aspects, there are multiple multifunctional layers, each of which is stacked on top of each other or merged into each other as a gradient to form a composite shielding material with optimized thermal properties; wherein the multiple multifunctional layers include at least two shielding layers, wherein each shielding layer is disposed between at least two other multifunctional layers selected from structural layers, metal / metal oxide layers, micrometeoroid layers and thermal protection layers.

[0146] In a different aspect, a method for providing a composite material includes: generating a model of the composite material in a virtual environment, wherein the model includes a digital representation of the composite material, the composite material comprising: a first shielding layer, at least one metal / metal oxide layer on the first shielding layer, and a second shielding layer on the at least one metal / metal oxide layer; providing a composition of the composite material to a device; generating the composite material based on the model using the composition, wherein the composition is combined to form layers of the composite material; and removing defects or flaws on the composite material based on one or more inputs according to the model.

[0147] In different aspects, the composite material includes: a first layer; a second layer disposed on the first layer; and a third layer disposed on the second layer opposite to the first layer, such that the second layer is disposed between the first layer and the third layer; wherein the first layer includes a structural and radiation shielding layer; wherein the second layer includes a radiation shielding layer; and wherein optionally, the third layer includes micrometeoroids and a thermal protection layer. It should be understood that, according to another aspect, the three layers can be combined into a single layer.

[0148] It should be understood that the above benefits and advantages may relate to one embodiment / aspect or several embodiments / aspects. Embodiments / aspects are not limited to those that solve any or all of the described problems or those that have any or all of the described benefits and advantages. Variations should be considered to be included within the scope of this invention.

[0149] Any reference to 'a' item means one or more of those items. The term "comprising" is used herein to mean including the identified method steps or elements, but such steps or elements are not included in an exclusive list, and a method or apparatus may include additional steps or elements.

[0150] As used herein, the terms “exemplary,” “example,” or “concept” are intended to mean “an illustration or example of something.” Furthermore, with regard to the use of the term “comprising” in the detailed description or claims, such a term is intended to be inclusive in a manner similar to the term “including,” as “comprising” is interpreted when used as a transitional word in the claims.

[0151] The accompanying figures illustrate exemplary methods. While these methods are shown and described as a series of actions performed in a specific order, it should be understood and recognized that these methods are not limited by the order. For example, some actions may occur in a different order than that described herein. Furthermore, one action may occur simultaneously with another. Moreover, in some cases, not all actions may be required to implement the methods described herein.

[0152] The order of steps in the methods described herein is exemplary, but these steps may be performed in any suitable order, or simultaneously where appropriate. Furthermore, steps may be added to or substituted in any method, or individual steps may be removed from any method, without departing from the scope of the subject matter described herein. Aspects of any of the examples above may be combined with aspects of any other example described to form further examples without losing the desired effect.

[0153] It should be understood that the above description of the preferred embodiments is given as an example only, and various modifications can be made by those skilled in the art.

[0154] The foregoing description includes examples of one or more embodiments. It is certainly impossible to describe every conceivable modification and alteration of the described apparatus or method for the purposes of describing the foregoing aspects; however, those skilled in the art will recognize that many further modifications and substitutions of the various aspects are possible. Therefore, the described aspects are intended to cover all such changes, modifications, and variations falling within the scope of the appended claims.

Claims

1. An apparatus comprising: an electronic assembly comprising at least one circuit; a shielding material coupled to the electronic assembly forming a protective shield positioned over or partially surrounding the at least one circuit; wherein the protective shield comprises at least one layer formed of a composite material, wherein the at least one layer is disposed on the electronic assembly to form the protective shield that protects the electronic assembly from radiation; and wherein the composite material comprises a polymer composite comprising a disposition of carbon material to increase the emissivity of the composite material; and / or wherein the composite material comprises a thermally conductive coating disposed over the at least one layer facing the electronic assembly, and / or the composite material comprises a thermally reflective coating disposed over the at least one layer facing away from the electronic assembly.

2. The apparatus of claim 1, wherein, the shielding material is disposed directly on a surface of the electronic assembly forming a direct contact with the electronic assembly, and / or wherein the shielding material is positioned in a vicinity of the electronic assembly forming an adjacent contact.

3. The apparatus of claim 2, wherein, the direct contact is formed via the thermally conductive coating of the at least one layer facing the electronic assembly.

4. The apparatus of claim 2, wherein, the adjacent contact is formed via the thermally conductive coating of the at least one layer facing the electronic assembly.

5. The apparatus of any preceding claim, wherein, the polymer composite is made of at least one of a hydrogen-rich thermoplastic polymer, a high-density polyethylene, a medium-density polyethylene, a random polypropylene, a syndiotactic polypropylene, or an isotactic polypropylene.

6. The apparatus of claim 5, wherein, the polymer composite is doped with at least one compound or metal.

7. The apparatus of claim 6, wherein, the at least one compound is boron or lithium.

8. The apparatus of claim 6, wherein, the at least one metal is a metal or a metal oxide.

9. The apparatus of claim 8, wherein, the metal or the metal oxide is dispersed in a matrix composition or a layered structure, wherein the matrix composition or the layered structure is part of the hydrogen-rich thermoplastic polymer, the high-density polyethylene, the medium-density polyethylene, or any form of polypropylene.

10. The apparatus of claim 8 or 9, wherein, the metal or metal oxide has an atomic number (Z), wherein (Z) is 13 or is between 22 and 30.

11. The apparatus of claim 8 or 9, wherein, the metal or metal oxide has an atomic number (Z), wherein (Z) is between 72 and 79.

12. The apparatus of any preceding claim, wherein, the shielding material has a thickness less than or equal to 20 mm.

13. The apparatus of claim 12, wherein, the thickness is between 1 mm and 20 mm.

14. The apparatus of any preceding claim, wherein, the thermally conductive coating comprises a carbon black mixture, a black paint, a type of vacuum coating, a type of high emissivity foil, or a type of physical vapor deposition coating, wherein the thermally conductive coating is applied using a method for applying a type of paint or mixture, the vacuum coating, the high emissivity foil, or the physical vapor deposition coating.

15. The apparatus of claim 14, wherein, the carbon black is mixed with the composite material to form the carbon black mixture having a high emissivity.

16. The apparatus of claim 14, wherein, the carbon black mixture is applied to the disposition of carbon material of the composite material to form a mixture having a high emissivity.

17. The apparatus of claims 13-16, wherein, the carbon black mixture is between 0.1-5% w / w forming a mixture having a high emissivity and reflectivity.

18. The apparatus of any preceding claim, wherein, the thermally reflective coating is a type of paint coating or a metal layer deposited to the composite material as nano or microparticles.

19. The apparatus of claim 18, wherein, The type of paint coating is white in order to minimize emissivity and increase reflectivity.

20. The apparatus of claim 18, wherein the metal layer comprises aluminum or another highly reflective metal.

21. The apparatus of any preceding claim, wherein, The shielding material is produced using one or more of: additive manufacturing, compression molding, injection molding, compression molding, 3D compression molding, or thermoforming.

22. The apparatus of any preceding claim, wherein, The shielding material is a conformal shield or a point shield.

23. The apparatus of any preceding claim, wherein, The composite material further comprises one or more of: boron, boron-based compounds, lithium, lithium-based compounds, carbon black, aluminum, aluminum-based compounds, and one or more paint types.

24. The apparatus of claim 23, wherein one or more of boron, boron-based compounds, lithium, lithium-based compounds, carbon black, aluminum, aluminum-based compounds, and one or more paint types each has 0.1-20% w / w, preferably 0.1-10% w / w, more preferably 0.1-5% w / w.

25. The apparatus of any preceding claim, wherein, The protective shield further comprises at least one layer configured to protect the electronic component from electromagnetic interference.

26. The apparatus of claim 25, wherein, The at least one layer configured to protect the electronic component from electromagnetic interference is a layer formed from a composite material.

27. The apparatus of claim 25, wherein, The at least one layer configured to protect the electronic component from electromagnetic interference is another layer of the protective shield separate from the layer formed from a composite material.

28. The apparatus of any one of claims 25-27, wherein, The at least one layer configured to protect the electronic component from electromagnetic interference comprises at least one of a metal, carbon, and graphene.

29. An apparatus for radiation shielding, comprising: a shielding material configured to form a protective shield over or partially around at least one circuit of an entity located in a space; wherein the protective shield comprises at least one layer formed from a composite material, wherein the at least one layer is configured to be disposed on the at least one circuit to form the protective shield that protects the at least one circuit from radiation; and wherein the composite material comprises a polymer composite of an arrangement of carbon materials to increase emissivity of the composite material; and / or wherein the composite material comprises a thermally conductive coating configured to be disposed on the at least one layer facing the at least one circuit, and / or the composite material comprises a thermal reflective coating configured to be disposed on the at least one layer facing away from the at least one circuit.

30. A system comprising one or more circuits, wherein, The system is configured to apply the apparatus of claim 26 to the one or more circuits using a vacuum coating, a high emissivity foil, or a physical vapor deposition coating.

31. A method for providing the apparatus of any one of claims 1 to 28, the method comprising: forming a shielding material using one or more of: additive manufacturing, compression molding, injection molding, compression molding, 3D compression molding, and thermoforming; and applying the shielding material directly onto a surface of an electronic component; or applying the shielding material adjacent to an electronic component.

32. A method of applying the apparatus of claim 29, the method comprising: applying the shielding material directly onto a surface of an electronic component; or applying the shielding material adjacent to an electronic component; and wherein the applying a shielding material comprises a method for applying a paint coating, a vacuum coating, a high-emissivity foil, or a physical vapor deposition coating to the electronic component.

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