Semiconductor device and method for manufacturing a semiconductor device

Abstract

A semiconductor component (1) has a housing (5) with a mounting surface (6), a lead frame (2) embedded in the housing (5), which lead frame has at least two electrical contact pads (7, 8), and at least one semiconductor chip (13) arranged in the housing (5) and electrically connected to the contact pads (7, 8). The lead frame (2) has a solder control structure (2) with a recess (11) for receiving a solder material, which recess is accessible at a mounting surface (6) and at least one side wall portion (10) of the housing (5). The contact pads (7, 8) and the solder control structure (9) are formed by separate and non-communicating sections of the lead frame (2).

Description

Technical Field

[0001] This invention relates to a semiconductor device and a method for manufacturing a semiconductor device.

[0002] This patent application claims priority to German patent application DE 10 2023 127 271.3, the disclosure of which is incorporated herein by reference. Background Technology

[0003] Surface-mount optoelectronic devices with solder control structures for accommodating solder material are known from the prior art. In particular, the solder control structures enable the optoelectronic devices to self-orient relative to solder contact pads, such as those on a printed circuit board (PCB).

[0004] The known drawback of optoelectronic devices with solder control structures is that mechanical loads induce stress within the device. This can lead to cracks and fractures within the device housing. Summary of the Invention

[0005] One object of the present invention is to provide an improved semiconductor device and an improved method for manufacturing the semiconductor device. This object is achieved by a semiconductor device having the features of the independent claims and a method for manufacturing the semiconductor device, respectively. Advantageous improvements are set forth in the dependent claims.

[0006] A semiconductor device includes: a housing with a mounting surface; a lead frame embedded in the housing having at least two electrical contact pads; and at least one semiconductor chip disposed in the housing and electrically connected to the contact pads. The lead frame has a solder control structure with recesses for receiving solder material, said recesses being accessible at the mounting surface of the housing and at least one sidewall portion. The contact pads and the solder control structure are formed by separate, non-communicating segments of the lead frame.

[0007] Semiconductor devices can be configured as optoelectronic devices, for example. In this case, the optoelectronic device has at least one optoelectronic semiconductor chip. The optoelectronic semiconductor chip can be configured to emit electromagnetic radiation, for example. In this case, at least one optoelectronic semiconductor chip can be configured as a light-emitting diode (LED) or, for example, as a laser diode.

[0008] Optoelectronic devices can have multiple optoelectronic semiconductor chips. For example, an optoelectronic device can have three light-emitting diodes (LEDs), configured, for example, as RGB LEDs, which are configured to emit red, green, and blue light. In this case, the optoelectronic device can be configured as a pixel element of a display device. However, the optoelectronic device can also be configured, for example, as a LiDAR device (light detection and ranging). In this case, at least one semiconductor chip is configured as a laser diode.

[0009] At least one optoelectronic semiconductor chip can also be used to detect electromagnetic radiation; for example, the optoelectronic semiconductor chip can be configured as a photodiode.

[0010] However, the semiconductor device does not necessarily have to be configured as an optoelectronic device. It can also be configured as an electronic device having at least one electronic semiconductor chip. This electronic semiconductor chip can be configured as any integrated circuit (IC).

[0011] In another embodiment, the semiconductor device may also be configured as a microelectromechanical device (MEMS) having a microelectromechanical semiconductor chip. The MEMS chip may, for example, be configured as a pressure sensor, an accelerometer, or other sensor.

[0012] Semiconductor devices can be configured, for example, as so-called QFN packages (quad flat no leads packages). A QFN package is characterized in that the electrical terminals connected to the contact pads protrude beyond the semiconductor device's housing, but are only accessible or exposed at the sidewalls and / or mounting surfaces of the housing, and are not covered by the housing material. QFN packages offer the advantage of being particularly compact, thus saving space.

[0013] Semiconductor devices are surface-mount devices (SMDs) configured using solder control structures, meaning they can be mounted onto printed circuit boards (PCBs) using solder material for fixation. This is achieved, for example, by applying solder material to solder pads on the PCB. The semiconductor device is then placed on these solder pads, and the solder material is cured. Compared to the solder pads on the PCB, the electrical contact pads of the semiconductor device can also be called chip contact pads. These two chip contact pads are formed by separate leadframe segments to allow electrical contact with the semiconductor chip.

[0014] The concept upon which this semiconductor device is based is to separate the solder control structure from other leadframe components. For this reason, the solder control structure is configured as a separate component of the leadframe from the electrical contact pads. In other words, the solder control structure and the contact pads are not connected to each other. Advantageously, this significantly reduces the concentration of mechanical stress at the solder control structure. In contrast, in known embodiments of surface-mountable semiconductor devices, the electrical contact pads are fixedly connected to the solder control structure. In other words, in known semiconductor devices, the contact pads and the solder control structure are formed through a common and interconnected section of the leadframe.

[0015] Mechanically separating the solder control structure from the rest of the leadframe has several advantages. For example, a housing manufactured by injection molding is mechanically more stable because stress does not concentrate at the solder control structure. This advantageously avoids cracks and fractures in the housing. Since the mechanical requirements for the housing material are lower, it is also worth considering housing materials that are advantageous in aspects other than mechanical stability.

[0016] Solder control structures, being separate from and not electrically connected to the contact pads (thus having no potential), can be referred to as floating ground. This offers the following advantages: multiple semiconductor devices can be placed very close to each other without concern for short circuits. Furthermore, compared to solder control structures that are fixedly connected to the contact pads, the lateral positioning of the solder control structure relative to the mounting surface of the housing allows for greater flexibility.

[0017] In one embodiment, the leadframe has at least two solder control structures, each having a recess for receiving solder material, the recess being accessible at the mounting surface of the housing and at least one sidewall portion. The contact pads and solder control structures are formed by separate, non-communicating segments of the leadframe.

[0018] Advantageously, semiconductor devices, for example, are self-oriented to a desired azimuth orientation when mounted on a circuit board. This orientation is essentially predetermined by the solder contact pads of the circuit board. If a semiconductor device with a solder control structure is oriented offset from the solder contact pads, forces act on the semiconductor device, determined essentially by the interfacial energy at the interfaces between the solder control structure and the solder material, between the solder material and the solder contact pads, and between the solder material and the surrounding environment of the semiconductor device. These interfacial forces induce an effective torque that acts on the housing, thereby orienting the housing until an energy-stable configuration is achieved. This is the case when the solder control structure of the semiconductor device is directly positioned above the solder contact pads of the circuit board.

[0019] In one embodiment, solder control structures are disposed on opposite sidewalls of the housing and / or in corner regions of the housing. Advantageously, by disposing solder control structures on opposite sidewalls of the housing and / or in corner regions of the housing, particularly effective self-orientation of the semiconductor device can be achieved during surface mounting.

[0020] Because at least one solder control structure is mechanically separated from the rest of the leadframe, i.e., from the electrical contact pads or chip contact pads, the risk of the solder control structure being torn off from the housing during the separation of the leadframe composite or housing body composite in the process of manufacturing multiple semiconductor devices increases. This can be advantageously offset by mechanical anchoring. For this reason, in one embodiment, the solder control structure has at least one anchoring portion embedded in the housing.

[0021] In one embodiment, the anchoring portion is beam-shaped and extends from the solder control structure in a direction parallel to the mounting surface. This advantageously ensures reliable anchoring. In another embodiment, the solder control structure has a connecting element that connects to the anchoring portion. In this embodiment, the solder control structure is anchored particularly reliably within the housing.

[0022] In one embodiment, at least one contact pad has an additional solder control structure having an additional recess for receiving solder material, the additional recess being accessible at least at the mounting surface of the housing. Unlike the solder control structure, the additional solder control structure is fixedly connected to the contact pad or chip contact pad. Therefore, the additional solder control structure and the chip contact pad are formed through a common section of the lead frame. The additional recess of the additional solder control structure may also be accessible at at least one sidewall portion of the housing, in addition to the mounting surface. The additional solder control structure can be mechanically fixedly connected to the chip contact pad via a connecting tab of the lead frame. Advantageously, this allows for electrical contact between the chip contact pad connected to the additional solder control structure and the soldering contact pad via solder material disposed between the additional solder control structure and the soldering contact pad.

[0023] In one embodiment, the housing has a cavity. The contact pads are at least partially uncovered by the housing material and exposed at the bottom of the cavity, which is parallel to the mounting surface. The semiconductor chip is disposed at the bottom of the cavity. Advantageously, the cavity can be filled with a potting material. In addition to providing mechanical protection for the semiconductor chip, the potting material can also serve, for example, to modulate electromagnetic radiation. However, the semiconductor device need not be configured as a cavity component. Alternatively, the semiconductor chip can, for example, be completely embedded in the housing material.

[0024] In one embodiment, the solder control structure and / or the additional solder control structure has a metallic coating in the region of the recess or the additional recess. Advantageously, this can improve the wetting characteristics of the solder control structure and / or the additional solder control structure.

[0025] A method for manufacturing a semiconductor device includes the following steps: Embedding a leadframe composite into a housing body composite. The leadframe composite has a plurality of first contact pads, a plurality of second contact pads, and a plurality of solder control structure elements. The first and second contact pads and the solder control structure elements are connected to each other in the leadframe composite via connecting tabs. The solder control structure elements have open portions. Disposing a semiconductor chip at the leadframe composite, wherein each semiconductor chip is electrically connected to the first and second contact pads. Dividing the leadframe composite and the housing body composite into separate semiconductor devices. Each semiconductor chip, the first and second contact pads electrically connected to the semiconductor chip, and each solder control structure are disposed in a common housing, which is formed by dividing the housing body composite. The segmentation is performed in the area of ​​the empty portion and connecting piece of the solder control structure element, thereby cutting the solder control structure element into a solder control structure having a recess for receiving solder material, the recess being accessible at the mounting surface of the housing and at least one sidewall portion, and separating the contact pad and the solder control structure from each other.

[0026] In one embodiment, sacrificial material is placed in the recesses of the solder control structure element before the lead frame composite is embedded into the housing body composite. The sacrificial material remaining in the recesses can be removed after cutting. This protects the solder control structure from being covered by the housing material. Furthermore, the sacrificial material protects the solder control structure during cutting in the recessed areas, thereby preventing, for example, damage to the metal coating.

[0027] In one embodiment, in the leadframe composite, first contact pads are connected to each other via first connecting tabs. Second contact pads are connected to each other via second connecting tabs. The first and second connecting tabs are arranged parallel to each other. Each first contact pad is connected to each second contact pad via a third connecting tab. The third connecting tab is arranged perpendicular to the first and second connecting tabs. Each solder control structure element is disposed between two adjacent first contact pads. The solder control structure elements are connected to each other via fourth connecting tabs. The fourth connecting tabs are arranged parallel to the third connecting tabs. The region of the solder control structure element is divided along the fourth connecting tab and perpendicular to the third connecting tab in the region of the third connecting tab. This creates a solder control structure accessible at the sidewall of the housing.

[0028] In one embodiment, in the leadframe composite, first contact pads are connected to each other via first connecting tabs. Each first contact pad is connected to each second contact pad via a third connecting tab. The third connecting tab is disposed perpendicular to the first connecting tab. Each first and second contact pad is laterally surrounded by four solder control structure elements. The solder control structure elements are connected to each other via fourth and fifth connecting tabs, respectively. The fourth connecting tab is disposed parallel to the third connecting tab. The fifth connecting tab is disposed perpendicular to the third and fourth connecting tabs. The regions of the solder control structure elements are divided along the fourth and fifth connecting tabs and perpendicular to the third connecting tab in the region of the third connecting tab. Thus, a solder control structure accessible at the corner of the housing can be created.

[0029] In one embodiment, in the leadframe composite, first contact pads are connected to each other via first connecting tabs. Second contact pads are connected to each other via second connecting tabs. The first and second connecting tabs are arranged parallel to each other. Each first contact pad is connected to each second contact pad via a third connecting tab. The third connecting tab is arranged perpendicular to the first and second connecting tabs. Each solder control structure element is disposed between two adjacent first contact pads, or between the first and second contact pads and between the third connecting tabs. Each solder control structure element is connected to each first contact pad via a sixth connecting tab, or to each second contact pad via an eighth connecting tab. The sixth connecting tab is arranged parallel to the first and second connecting tabs, and the eighth connecting tab is arranged parallel to the third connecting tab. Each first contact pad is connected to each additional second contact pad via a seventh connecting tab. The seventh connecting tab is arranged transversely to the first and third connecting tabs. The region of the solder control structure element and the regions of the first, second, and seventh connecting tabs are divided perpendicularly to the first and second connecting tabs, and the region of the third connecting tab is divided perpendicularly to the third connecting tab. Advantageously, in this embodiment, less lead frame composite material is present in the region of the split plane, such as in the region of the saw marks. Attached Figure Description

[0030] The features, characteristics, and advantages of the present invention, as well as the ways and means of implementing them, described above will be more clearly and explicitly understood in conjunction with the following description of embodiments, which is elaborated in detail with reference to the accompanying drawings. The drawings show:

[0031] Figure 1 A transparent side view and a bottom view of a semiconductor device according to an exemplary embodiment are shown;

[0032] Figure 2 The self-orientation of a semiconductor device during surface mounting is shown in a top view.

[0033] Figure 3 In contrast, it is shown in a transparent bottom view. Figure 1 Semiconductor devices and components of known semiconductor devices;

[0034] Figure 4 Transparent bottom view showing different embodiments of a semiconductor device with an anchored solder control structure;

[0035] Figure 5 A transparent bottom view of a first lead frame composite for manufacturing semiconductor devices is shown.

[0036] Figure 6 A transparent bottom view of a second lead frame composite for manufacturing semiconductor devices is shown.

[0037] Figure 7 A transparent bottom view of a third lead frame composite used for manufacturing semiconductor devices is shown.

[0038] Figure 8 A transparent bottom view of a fourth lead frame composite used in the manufacture of semiconductor devices is shown. Detailed Implementation

[0039] Figure 1 A transparent side view of a semiconductor device 1 according to an exemplary embodiment is schematically shown on the left, and a transparent bottom view of it is shown on the right.

[0040] Semiconductor device 1 has a lead frame 2. The lead frame 2 is exemplarily made of copper. The lead frame 2 may also be made of other metallic materials. Optionally, the lead frame 2 may have a coating, such as an anti-corrosion coating. The lead frame 2 has an upper side 3 and a lower side 4 opposite to the upper side 3.

[0041] Semiconductor device 1 also has a housing 5. Figure 1 In the image, housing 5 is partially shown transparently to reveal the components located within housing 5. Figure 1 In the view, the housing 5 exemplarily has a rectangular cross-section. However, the housing 5 may also have other geometric cross-sections. The housing 5 is exemplarily made of epoxy resin, but may also be made of, for example, silicone resin or other molding or housing materials. The lead frame 2 is embedded in the housing 5. Embedding the lead frame 2 into the housing 5 can be done, for example, by means of molding methods, such as injection molding, especially by means of film-assisted molding (FAM).

[0042] The housing 5 has a mounting surface 6. The lead frame 2 is embedded in the housing 5 such that the upper side 3 of the lead frame 2 faces away from the mounting surface 6. The lower side 4 of the lead frame 2 is flush with the mounting surface 6, but this is not mandatory.

[0043] The lead frame 2 has at least two electrical contact pads 7 and 8. The semiconductor device 1 also has a semiconductor chip 13. The semiconductor chip 13 is disposed in the housing 5 and is electrically connected to the contact pads 7 and 8. Figure 1 For simplicity, semiconductor chip 13 is not shown. Contact pads 7 and 8 are exemplaryly configured as rectangles with rounded corners. However, contact pads 7 and 8 may also be shaped differently.

[0044] Semiconductor device 1 can, for example, be configured as a cavity component. In this case, housing 5 has a cavity 12. Contact pads 7 and 8 are at least partially not covered by housing material and are exposed at the bottom of cavity 12. The bottom of cavity 12 extends parallel to mounting surface 6 and may be flush with the upper side of lead frame 2, but this is not mandatory. Cavity 12 extends from the upper side 3 of lead frame 2 to the side of housing 5 facing away from mounting surface 6. For simplicity, in Figure 1 Cavity 12 is not shown in the diagram.

[0045] Semiconductor chip 13 is disposed at the bottom of cavity 12. Semiconductor chip 13 may, for example, have a contact surface on its lower side facing contact pads 7 and 8, which is connected to contact pads 7 and 8 of lead frame 2 via solder material, wherein semiconductor chip 13 is disposed on or above the two contact pads 7 and 8. Alternatively, semiconductor chip 13 may have an additional contact surface on its upper side facing away from contact pads 7 and 8, which is connected to contact pads 7 and 8 of lead frame 2 via bonding wires. In another embodiment, semiconductor chip 13 may have a contact surface on its lower side and an additional contact surface on its upper side, disposed on or above the first contact pad 7, and connected to the first contact pad 7 via solder material and to the second contact pad 8 via bonding wires.

[0046] The lead frame 2 exemplarily has two solder control structures 9, each having a recess 11 for receiving solder material, the recess being accessible at the mounting surface 6 of the housing 5 and at least one sidewall portion 10. It may also be sufficient if the lead frame 2 or the semiconductor device 1 has only one solder control structure 9. However, the semiconductor device 1 or its lead frame 2 may also have any number of solder control structures 9.

[0047] For example, the solder control structure 9 is disposed at an opposite side wall portion 10 of the housing 5. Alternatively or additionally, the solder control structure 9 may be disposed in the region of the corner portion 12 of the housing. However, the solder control structure 9 may also be disposed differently, for example, at an adjacent side wall portion 10 of the housing 5.

[0048] Semiconductor device 1 is surface-mountable via solder control structure 9. Figure 2 The self-orientation of semiconductor device 1 during surface mounting is schematically illustrated in a top view. Reference numerals used to date are retained herein. Figure 2 The semiconductor chip 13 disposed in the cavity 12 is shown as an example. However, as already explained, the cavity 12 may be omitted.

[0049] The primary purpose of the solder control structure 9 is usually not to monitor whether the soldering process is performed reliably, but rather to ensure that the semiconductor device 1 can orient itself at the solder contact pad via the solder control structure 9, for example. Figure 2 In the example scenario shown on the left, a semiconductor device 1 has been mounted on a circuit board 14. The circuit board 14 has alignment marks 15. Exemplarily, the circuit board 14 has four alignment marks 15, which are rectangularly arranged and used to indicate the correct position of the semiconductor device 1. However, the solder control structure 9... Figure 2 Not visible in the top view because housing 5 is shown opaquely in the top view. Circuit board 14 also has solder contact pads, which are located in... Figure 2 They are also not visible because they are positioned between the semiconductor device 1 and the circuit board 14. The circuit board 14 suitably has a number of solder contact pads corresponding to the number of solder control structures 9 of the semiconductor device 1.

[0050] The crescent-shaped solder configuration at solder control structure 9 applies force to semiconductor device 1 through the surface tension of the liquid solder material. Thus, during surface mounting, semiconductor device 1 self-orients relative to the solder contact pads on circuit board 14. Self-orientation may include azimuth rotation and / or translation of semiconductor device 1. Figure 2 The right side shows the semiconductor device 1 after it was previously incorrectly positioned on the circuit board 14 (which is shown on the left side), and then oriented accordingly.

[0051] Figure 3 A contrasting schematic illustration Figure 1 A transparent bottom view of the components of a known semiconductor device 1 and a prior art semiconductor device 16. The left side shows the semiconductor device 16 according to the prior art, while the right side shows the components according to... Figure 1 Semiconductor device 1 is an exemplary embodiment of the semiconductor device. The same reference numerals are used for similar elements in known semiconductor devices.

[0052] Unlike the semiconductor device 16 of the present invention, in the semiconductor device 1, the contact pads 7 and 8 and the solder control structure 9 are formed by separate and non-connected sections of the lead frame 2. In the known semiconductor device 16, the solder control structure 16 is fixedly connected to one of the contact pads 7 and 8, or is formed by a common section of the lead frame 2.

[0053] The problem is that under mechanical loads, such as during production when dividing multiple semiconductor devices 1, during operation, during testing, during surface mounting of semiconductor devices 1, etc., and due to thermomechanical stress, such as thermomechanical stress caused by the different coefficients of thermal expansion between the housing 5 and the circuit board 14, mechanical stress distribution may occur. When the solder control structure 9 is fixedly connected to the contact pads 7 and 8, the mechanical stress distribution has stress concentration or accumulation in the area of ​​the solder control structure 9.

[0054] exist Figure 3 This situation is illustrated using stress lines or stress trajectories, which can also be called isochoric lines. In the known semiconductor device 16, this causes stress concentration in the region of the solder control structure 9. This in Figure 3 The dense stress lines in the diagram indicate this. In this way, cracks can form in the housing 5. These cracks are particularly likely to form in the area of ​​the solder control structure 9 and propagate within the housing 5, potentially causing it to rupture. In the current semiconductor device 1, a certain stress flow can be achieved because the solder control structure 9 is not connected to the contact pads 7 and 8 and is implemented as a separate section of the lead frame 2. This prevents excessive stress concentration. Figure 3 For this reason, the stress lines in the current semiconductor device 1 are shown to be sparser than those in the known semiconductor device 16. Therefore, cracks and fractures in the housing 5 can be reduced or prevented.

[0055] Figure 4 A transparent bottom view schematically illustrating different embodiments of a semiconductor device 1 with an anchored solder control structure 9. (See diagram below.) Figure 1 As shown in the image, the housing 5 is transparently displayed, making the contact pads 7 and 8 visible. Figure 4 Semiconductor device 1 and Figure 1 The semiconductor device 1 is similar. Similar or identical elements are given the same reference numerals. The following mainly describes... Figure 4 Semiconductor device 1 and Figure 1 The difference between semiconductor devices 1.

[0056] Semiconductor device 1 in Figure 4The common feature of all three embodiments shown is that they all have solder control structures 9 with anchor portions 17 embedded in the housing 5. Exemplarily, each solder control structure 9 has two anchor portions 17. It may also be sufficient if each solder control structure 9 has only one anchor portion 9. Alternatively, more than two anchor portions 17 may be provided for each solder control structure 9. Again, exemplarily, the anchor portions 17 of the solder control structures 9 of each semiconductor device 1 are configured differently. However, in general, the anchor portions 17 of the semiconductor device 1 for all solder control structures 9 can also be configured in the same manner. Not all solder control structures 9 of the semiconductor device 1 need to have anchor portions 17. However, anchor portions 17 provide the advantage of better connection between the solder control structure 9 and the housing 5. This may be necessary because the mechanical stability of the solder control structure 9 may be reduced due to separation from the contact pads 7, 8.

[0057] Figure 4 A semiconductor device 1 with a solder control structure 9 is shown on the left. An exemplary anchoring portion 17 of the solder control structure is beam-shaped and extends from the solder control structure 9 in a direction parallel to the mounting surface 6. Here, the first anchoring portion 17 of the first solder control structure 9 is tangentially disposed at a corner of the first solder control structure 9, while the second anchoring portion 17 of the second solder control structure 9 extends from a corner of the second solder control structure 9 and substantially parallel to the side wall portion 10 of the housing 5. Therefore, the first anchoring portion 17 is disposed transversely to the second anchoring portion 17. Furthermore, the second anchoring portion 17 is longer than the first anchoring portion 17; however, the second anchoring portion and the first anchoring portion may, for example, be of the same length and have the same orientation.

[0058] exist Figure 4 The semiconductor device 1 shown in the middle of the image exemplarily has a third solder control structure 9 with two third anchoring portions 17 and a fourth solder control structure 9 with a fourth anchoring portion 17. The third anchoring portions 17 are basically configured as the second anchoring portions 17 of the second solder control structure 9 of the semiconductor device 1 shown on the left, but are significantly shorter.

[0059] The fourth anchoring portion 17 of the fourth solder control structure 9 is beam-shaped and is provided parallel to the side wall portion 10 of the housing 5. However, the fourth anchoring portion 17 does not extend directly from the corner or side of the fourth solder control structure 9. Instead, the fourth solder control structure 9 has a connecting element 18 connected to the fourth anchoring portion 17. The connecting element 18 extends exemplarily from the side of the fourth solder control structure 9 and is provided perpendicular to the side of the fourth solder control structure 9 and the fourth anchoring portion 17. Thus, the fourth anchoring portion 17 and the connecting element 18 are T-shaped and embedded or anchored in the housing material, thereby ensuring that the fourth solder control structure 9 is reliably anchored in the housing 5.

[0060] Figure 4 An exemplary semiconductor device 1 is shown on the right, having a fifth solder control structure 9 with two fifth anchor portions 17 and a sixth solder control structure 9 with two sixth anchor portions 17. The sixth anchor portions 17 are substantially configured as the fourth anchor portion 17 of the fourth solder control structure 9 of the semiconductor device 1 shown in the middle; however, the sixth anchor portions do not extend from the side of the sixth solder control structure 9, but rather from the corners of the sixth solder control structure 9, i.e., the anchor portions 17 are arranged laterally to the side 10 of the housing. The fifth anchor portions 17 are configured similarly to the second anchor portions 17, but the fifth anchor portions 17 are additionally curved and have protrusions at their ends. All anchor portions 17 may also extend in a direction perpendicular to the mounting surface 6 of the housing 5.

[0061] The following describes the method steps for manufacturing semiconductor device 1. Figures 5 to 8 Transparent bottom views of lead frame assemblies 19, 20, 21, and 22 for manufacturing multiple semiconductor devices 1 are shown respectively. Here, the housing body assembly or housing 5 is completely transparent. For clarity, Figures 5 to 8 Semiconductor chips are not shown. The reference numerals used so far will be retained below.

[0062] Figures 5 to 8 The diagrams show the states after the execution of the first method step, during which the lead frame composites 19, 20, 21, and 22 have been embedded into the housing body composite. The embedding of the lead frame composites 19, 20, 21, and 22 can be performed, for example, by means of a molding process, such as by means of FAM (Follicular Unit Extraction).

[0063] Figure 5 The first lead frame composite 19 shown is suitable for manufacturing according to Figure 1 The semiconductor device 1. A first leadframe composite 19 has a plurality of first contact pads 7, a plurality of second contact pads 8, and a plurality of solder control structure elements 23. The first and second contact pads 7 and 8 and the solder control structure elements 9 are initially connected to each other in the first leadframe composite 19 via connecting tabs. The solder control structure elements 23 have open portions 24.

[0064] In the second method step, a semiconductor chip is disposed at the first lead frame composite 19. Here, each semiconductor chip is electrically connected to the first and second contact pads 7 and 8. Disposing the semiconductor chip at the first lead frame composite 19 can be performed, for example, after the first lead frame composite 19 is embedded in the housing body composite, such as by disposing the semiconductor chip in the cavity 12 of the housing 5. However, the semiconductor chip can also be disposed at the first lead frame composite 19 before the first lead frame composite 19 is embedded in the housing body composite.

[0065] In the third method step, the first lead frame composite 19 and the housing body composite are separated into individual semiconductor devices 1. Separation can be performed, for example, by sawing. Figures 5 to 8 The diagram shows a dividing plane 25, which extends perpendicularly to either the printed conductor plane or the mounting surface 6 of the housing 5 to be manufactured. The dividing is performed along the dividing plane 25.

[0066] Each of a semiconductor chip, first and second contact pads 7 and 8 electrically connected to the semiconductor chip, and two solder control structures 9 are disposed in a common housing 5 formed by dividing the housing body composite. The division is performed in the area of ​​the gap 24 of the connecting piece and the solder control structure element 23, thereby cutting the solder control structure element 23 into solder control structures 9, which have recesses 11 for receiving solder material. These recesses are accessible at the mounting surface 6 of the housing 5 and at least one sidewall portion 10, and separate the contact pads 7 and 8 and the solder control structures 9 from each other.

[0067] In the first lead frame composite 19, first contact pads 7 are connected to each other via first connecting tabs 26. Second contact pads 8 are connected to each other via second connecting tabs 27. The first and second connecting tabs 26 and 27 are arranged parallel to each other. Each first contact pad 7 is connected to each second contact pad 8 via a third connecting tab 28. Exemplarily, two third connecting tabs 28 connect the first and second contact pads 7 and 8 to each other. The third connecting tabs 28 are arranged perpendicular to the first and second connecting tabs 26 and 27.

[0068] Each solder control structure element 23 is disposed between two adjacent first contact pads 7. The solder control structure elements 23 are connected to each other via fourth connecting pieces 29. The fourth connecting pieces 29 are arranged parallel to the third connecting piece 28 and perpendicular to the first and second connecting pieces 26 and 27, and intersect with the first and second connecting pieces 26 and 27. At the intersection, the fourth connecting piece 29 is fixedly connected to the first and second connecting pieces 26 and 27.

[0069] The division of the first lead frame composite 19 and the housing body composite is made along the fourth connecting piece 29 in the region of the solder control structure element 23 and perpendicular to the third connecting piece 28 in the region of the third connecting piece 28. Therefore, the dividing plane 25 extends in these regions. Here, the fourth connecting piece 29 is completely removed. Since the fourth connecting piece 29 connects the solder control structure element 23 to each other, the solder control structure element 23 is divided in half. For each semiconductor device 1, two opposing solder control structures 9 are formed, each having a recess 11 accessible at the mounting surface 6 and sidewall portion 10 of the housing 5, because each solder control structure element 23 is disposed between two adjacent first contact pads 7.

[0070] The first, second, and third connecting pieces 26, 27, and 28 can be exposed and accessible at the side wall portion 10 of the housing 5 after the separation. Exemplarily, Figure 5 The first lead frame composite 19 is shown to have a smaller thickness, measured perpendicular to the mounting surface, in the regions of the connector tabs 26, 27, 28, 29 than in the regions of the contact pads 7, 8, wherein the contact pads 7, 8 also exemplarily have a smaller thickness in their edge regions than in their remaining regions. Due to the smaller thickness of the connector tabs, segmentation can be simplified.

[0071] Figure 6 An exemplary second leadframe composite 20 is schematically shown, suitable for manufacturing a semiconductor device 1 having a total of four solder control structures 9, each disposed in a corner of the housing. The second leadframe composite 20 is similar to the first leadframe composite 19. The differences between the second leadframe composite 20 and the first leadframe composite 19 are primarily described below. Reference numerals are retained for similar or identical components.

[0072] The second leadframe composite 19 also has a plurality of first contact pads 7, a plurality of second contact pads 8, and a plurality of solder control structural elements 23, which are initially connected to each other via connecting tabs. In the second leadframe composite 20, the first contact pads 7 are connected to each other via first connecting tabs 26. However, the second contact pads 8 are not connected to each other via second connecting tabs 27. Therefore, the second connecting tabs 27 are omitted in the second leadframe composite 20. Each first contact pad 7 and each second contact pad 8 are connected via third connecting tabs 28. Exemplarily, each pair of third connecting tabs 28 connects the first and second contact pads 7 and 8 to each other. The third connecting tabs 28 are arranged perpendicular to the first connecting tabs 26.

[0073] Each pair of first and second contact pads 7 and 8 is laterally surrounded by four solder control structure elements 23. In the second leadframe composite 20, the solder control structure elements 23 are connected to each other via fourth connecting tabs 29, as in the first leadframe composite 19. The fourth connecting tabs 29 are parallel to the third connecting tab 28 and perpendicular to the first connecting tab 26, and intersect with the first connecting tab 26. Additionally, the solder control structures 23 are connected to each other via fifth connecting tabs 30. The fifth connecting tabs 30 are perpendicular to the third and fourth connecting tabs 28 and 29.

[0074] The division of the second lead frame composite 19 and the housing body composite is performed along the fourth and fifth connecting tabs 29 and 30 in the region of the solder control structure element 23, and perpendicular to the third connecting tab 28 in the region of the third connecting tab 28. Here, the fourth and fifth connecting tabs 29 and 30 are also completely removed. Since the fourth and fifth connecting tabs 29 and 30 connect the solder control structure element 23 to each other, the solder control structure element 23 is divided into four parts during the division. For each semiconductor device 1, four solder control structures 9 are formed, each disposed in a corner of the housing, because the fourth and fifth connecting tabs 29 and 30 intersect in the region of the solder control structure element 23. In other words, the dividing plane 25 extends parallel to the fourth and fifth connecting tabs 29 and 30 in this case.

[0075] Figure 7 An exemplary third lead frame composite 21 is schematically shown, which is suitable for manufacturing other semiconductor devices 1. The third lead frame composite 21 is similar to the first lead frame composite 19. The differences between the third lead frame composite 21 and the first lead frame composite 19 are mainly described below. Reference numerals are retained for similar or identical elements.

[0076] The third leadframe composite 21, like the first leadframe composite 19, has first, second, and third connecting tabs 26, 27, and 28. Similarly, a solder control structure element 23 is disposed between two adjacent first contact pads 7. Fourth and fifth connecting tabs 29 and 30 are omitted in the third leadframe composite 21. The solder control structure element 23 is connected to each of the first contact pads 7 via a sixth connecting tab 31. The sixth connecting tab 31 is disposed parallel to the first and second connecting tabs 26 and 27. Each of the first contact pads 7 is connected to each of the additional second contact pads 8 via a seventh connecting tab 32. The seventh connecting tab 32 is disposed laterally to the first and third connecting tabs 26 and 28. Segmentation is performed in the region of the solder control structure element 23, and perpendicular to the first and second connecting tabs 26, 27, and 32 in the regions of the first, second, and seventh connecting tabs 26, 27, and 32, and perpendicular to the third connecting tab 28 in the region of the third connecting tab 28. In this case, the connecting tabs are removed incompletely by segmentation. Thus, in the third lead frame composite 21, less metal is located in the region of the dividing plane 25, thereby simplifying the division.

[0077] Since the solder control structure element 23 is connected to the first contact pad 7 via the sixth connecting piece 31, wherein each solder control structure element 23 is connected to only one first contact pad 7, after the third lead frame composite 21 is split, a solder control structure 9 and an additional solder control structure 33 remain in the semiconductor device 1. The additional solder control structure has an additional recess 34 for receiving solder material, which is accessible at least at the mounting surface 6 of the housing 5.

[0078] The additional solder control structure 33 is fixedly connected to the first contact pad 7. Therefore, even after the third lead frame composite 21 is split, the additional solder control structure 33 and the first contact pad 7 are formed through a common section of the lead frame 2. In addition to the mounting surface 6, another recess 34 of the additional solder control structure 33 is also accessible at the side wall portion 10 of the housing 5. Alternatively, the additional solder control structure 33 may only be accessible at the mounting surface 6. In this case, the sixth connecting piece 31 is omitted because the additional recess 34 is formed directly below the first contact pad 8.

[0079] Figure 8 An exemplary fourth lead frame composite 22 is schematically shown, which is suitable for manufacturing other semiconductor devices 1. The fourth lead frame composite 22 is similar to the third lead frame composite 21. The differences between the fourth lead frame composite 22 and the third lead frame composite 21 are mainly described below. Reference numerals are retained for similar or identical elements.

[0080] Unlike the third leadframe composite 21, in the fourth leadframe composite 22, the solder control structure element 23 is not connected to each of the first contact pads 7 via a sixth connecting piece 31. More precisely, the sixth connecting piece 31 is omitted in the fourth leadframe composite 22. Instead, the solder control structure element 23 is connected to the second contact pad 8 via an eighth connecting piece 35. The eighth connecting piece 31 is arranged parallel to the third connecting piece 28. Furthermore, in addition to the first, second, and third connecting pieces 26, 27, and 28, the fourth leadframe composite 22 also has a seventh connecting piece 32. Thus, in the fourth leadframe composite 22, less of the material of the fourth leadframe composite 22 is located in the region of the dividing plane 25.

[0081] The present invention has been illustrated and described in detail with reference to preferred embodiments. However, the present invention is not limited to the disclosed examples. Rather, those skilled in the art can derive other variations therein without departing from the scope of protection of the present invention.

[0082] List of reference numerals

[0083] 1 Semiconductor Devices

[0084] 2-lead frame

[0085] The upper side of the 3-lead frame

[0086] 4. Lower side of the lead frame

[0087] 5. Shell

[0088] 6. Mounting surfaces of the housing

[0089] 7 First contact pad

[0090] 8 Second contact pad

[0091] 9 Solder control structure

[0092] 10 Side wall portion of the shell

[0093] 11 Recess of solder control structure

[0094] 12 chambers

[0095] 13 Semiconductor Chips

[0096] 14 circuit boards

[0097] 15 Orientation Markers

[0098] 16 Semiconductor devices according to the prior art

[0099] 17 Anchoring Section

[0100] 18 Connecting elements for anchoring

[0101] 19 First lead frame complex

[0102] 20 Second lead frame composite

[0103] 21 Third lead frame composite

[0104] 22 Fourth lead frame composite

[0105] 23 Welding control components

[0106] 24. Reservations for welding control components

[0107] 25-divided plane

[0108] 26 First connecting piece

[0109] 27 Second connecting piece

[0110] 28 Third connecting piece

[0111] 29 Fourth connecting piece

[0112] 30 Fifth connecting piece

[0113] 31 Sixth Connecting Piece

[0114] 32 Seventh Connecting Piece

[0115] 33. Additional solder control structures

[0116] 34. Additional recesses in the additional solder control structure

[0117] 35 Eighth Connecting Piece

Claims

1. A semiconductor device (1) having a housing (5) with a mounting face (6), a lead frame (2) embedded into the housing (5), the lead frame having at least two electrical contact pads (7, 8), and at least one semiconductor chip (13) arranged in the housing (5) and electrically connected to the contact pads (7, 8), wherein the lead frame (2) has a solder control structure (9) having a recess (11) for accommodating a solder material, the recess being accessible at the mounting face (6) and at least one side wall portion (10) of the housing (5), wherein the contact pads (7, 8) and the solder control structure (9) are formed by separate and non-communicating sections of the lead frame (2).

2. The semiconductor device (1) according to claim 1, wherein the lead frame (2) has at least two solder control structures (9) having a recess (11) for accommodating a solder material, the recess being accessible at the mounting face (6) and at least one side wall portion (10) of the housing (5), wherein the contact pads (7, 8) and the solder control structures (9) are formed by separate and non-communicating sections of the lead frame (2).

3. The semiconductor device (1) according to claim 2, wherein the solder control structures (9) are arranged at side wall portions (10) of the housing (5) opposite to each other and / or in the region of a corner of the housing (5).

4. The semiconductor device (1) according to any one of the preceding claims, wherein the solder control structure (9) has at least one anchoring portion (17) embedded in the housing (5).

5. The semiconductor device (1) according to claim 4, wherein the anchoring portion (17) is formed in the manner of a beam and projects from the solder control structure (9) in a direction parallel to the mounting face (6).

6. The semiconductor device (1) according to claim 4 or 5, wherein the solder control structure (9) has a connecting element (18) connected to the anchoring portion (17).

7. The semiconductor device (1) according to any one of the preceding claims, wherein at least one contact pad (7, 8) has a further solder control structure (33) having a further recess (34) for accommodating a solder material, the further recess being accessible at least at the mounting face (6) of the housing (5).

8. The semiconductor device (1) according to any one of the preceding claims, wherein the housing (5) has a cavity (12), wherein the contact pads (7, 8) are at least sectionally uncovered by housing material and are exposed at a bottom of the cavity (12) arranged parallel to the mounting face (6), wherein the semiconductor chip (13) is arranged at the bottom of the cavity (12).

9. A method for producing a semiconductor device (1), the method having the following method steps: ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ - embedding a leadframe composite (19, 20, 21, 22) into a housing body composite, wherein the leadframe composite (19, 20, 21, 22) has a plurality of first contact pads (7), a plurality of second contact pads (8) and a plurality of solder control structure elements (23), wherein the first and second contact pads (7, 8) and the solder control structure elements (23) are connected to each other in the leadframe composite (19, 20, 21, 22) via connecting webs (26, 27, 28, 29, 30, 31, 32, 35), wherein the solder control structure elements (23) have recesses (24), - arranging semiconductor chips (13) at the leadframe composite (19, 20, 21, 22), wherein one semiconductor chip (13) each is electrically connected with a first and a second contact pad (7, 8), - singulating the leadframe composite (19, 20, 21, 22) and the housing body composite into separate semiconductor devices (1), wherein one semiconductor chip (13) each, the first and second contact pads (7, 8) electrically connected with the semiconductor chips (13) and one solder control structure (9) each are arranged in a common housing (5), which is formed by the singulation of the housing body composite, wherein the singulation is carried out in the area of the connecting webs (26, 27, 28, 29, 30, 31, 32, 35) and the recesses (24) of the solder control structure elements (23), whereby the solder control structure elements (23) are cut into solder control structures (9) having recesses (11) for receiving solder material, which are accessible at a mounting face (6) and at least one side wall portion (10) each of the housing (5), and the contact pads (7, 8) and the solder control structures (9) are separated from each other.

10. The method according to claim 9, wherein a sacrificial material is arranged in the recesses (24) of the solder control structure elements (23) before embedding the leadframe composite (19, 20, 21, 22) into the housing body composite.

11. The method according to claim 9 or 10, wherein the first contact pads (7) are connected to each other in the leadframe composite (19) via first connecting webs (26), wherein the second contact pads (8) are connected to each other via second connecting webs (27), wherein the first and second connecting webs (26, 27) are arranged parallel to each other, wherein one first contact pad (7) each is connected with one second contact pad (8) via third connecting webs (28), wherein the third connecting webs (28) are arranged perpendicular to the first and second connecting webs (26, 27), wherein one solder control structure element (23) each is arranged between two adjacent first contact pads (7, 8), wherein the solder control structure elements (23) are connected to each other via fourth connecting webs (29) respectively, wherein the fourth connecting webs (29) are arranged parallel to the first and second connecting webs (26, 27). wherein the fourth connecting piece (29) is arranged parallel to the third connecting piece (28), wherein the solder control structure elements (23) are segmented in the region of the solder control structure elements (23) along the fourth connecting piece (29) and perpendicular to the third connecting piece (28) in the region of the third connecting piece (28).

12. The method according to claim 9 or 10, wherein in the leadframe composite (20) the first contact pads (7) are connected to each other via first connecting pieces (26), wherein each first contact pad (7) is connected with each second contact pad (8) via a third connecting piece (28), wherein the third connecting piece (28) is arranged perpendicular to the first connecting pieces (26), wherein each first and second contact pad (7, 8) is laterally surrounded by four solder control structure elements (23), wherein the solder control structure elements (23) are connected to each other via fourth and fifth connecting pieces (29, 30), respectively, wherein the fourth connecting piece (29) is arranged parallel to the third connecting piece (28), wherein the fifth connecting piece (30) is arranged perpendicular to the third and fourth connecting pieces (28, 29), wherein the solder control structure elements (23) are segmented in the region of the solder control structure elements (23) along the fourth and fifth connecting pieces (29, 30) and perpendicular to the third connecting piece (28) in the region of the third connecting piece (28).

13. The method according to claim 9 or 10, wherein in the leadframe composite (21, 22) the first contact pads (7) are connected to each other via first connecting pieces (26), wherein the second contact pads (8) are connected to each other via second connecting pieces (27), wherein the first and second connecting pieces (26, 27) are arranged parallel to each other, wherein each first contact pad (7) is connected with each second contact pad (8) via a third connecting piece (28), wherein the third connecting piece (28) is arranged perpendicular to the first and second connecting pieces (26, 27), wherein each solder control structure element (23) is arranged between two adjacent first contact pads (7) or between a first and a second contact pad (7, 8) and between the third connecting pieces (28), wherein each solder control structure element (23) is connected with each first contact pad (7) via a sixth connecting piece (31) or with each second contact pad (8) via an eighth connecting piece (35), wherein the sixth connecting piece (31) is arranged parallel to the first and second connecting pieces (26, 27) and the eighth connecting piece (35) is arranged parallel to the third connecting piece (28), wherein each first contact pad (7) is connected with each further second contact pad (8) via a seventh connecting piece (32), wherein the seventh connecting piece (32) is arranged transversely to the first and third connecting pieces (26, 28), wherein the seventh connecting piece (32) is arranged transversely to the first and third connecting pieces (26, 28), wherein the solder control structure element (23) is divided in the region of the solder control structure element (23) and in the region of the first, second and seventh connection tabs (26, 27, 32) perpendicular to the first and second connection tabs (26, 27) and in the region of the third connection tab (28) perpendicular to the third connection tab (28).

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