Shell material and preparation method thereof, shell preparation method, shell and electronic equipment

Abstract

The invention relates to a shell material and a preparation method thereof, a shell preparation method, a shell and electronic equipment, the shell material comprises a shell base material and a fiber board, the fiber board is bonded to the shell base material, the fiber board comprises resin and one or more fiber yarn bundles combined with the resin, each fiber yarn bundle comprises a plurality of fibers, and the fibers are bonded to the shell base material. The fibers are arranged in a bundle mode, the diameter of each fiber ranges from 3 micrometers to 10 micrometers, and the diameter of each fiber yarn bundle ranges from 20 micrometers to 90 micrometers. According to the shell material, the preparation method of the shell material, the electronic equipment, the shell of the electronic equipment and the preparation method of the shell, the fiber yarn bundles with the diameter of 20-90 microns, which are obtained by arranging the fibers with the diameter of 3-10 microns in a bundle mode, are combined with the resin to form the fiber plate to reinforce the base material of the shell; therefore, the light weight can be achieved, and meanwhile the falling resistance of the shell material is improved.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and in particular to housing materials and their preparation methods, housing preparation methods, housings and electronic equipment. Background Technology

[0002] To meet consumer demands for product appearance and texture, an increasing number of electronic products are using glass as a structural component. Glass offers a superior texture and high transparency, and when combined with film processing, it creates a rich visual effect; most high-end mobile phones use glass back covers. However, glass has a high density and is brittle, making it difficult to meet consumer demands for lightweight and drop-resistant products. Therefore, there is a significant need to develop new materials that combine the premium feel of glass with lightweight design and drop resistance, offering the rich visual effects of glass.

[0003] In related technologies, there is not much research on new materials for this type of demand, and the main methods used are glass microcrystals and transparent ceramics to increase the drop resistance of glass.

[0004] However, both glass microcrystalline and transparent ceramics significantly increase material and processing costs, and their higher density makes them difficult to lightweight, thus failing to achieve a good balance between lightweight and impact resistance. Summary of the Invention

[0005] This application provides a housing material and its preparation method, a housing preparation method, a housing, and an electronic device, to solve the problem of how to improve drop resistance while achieving lightweight housing material.

[0006] On one hand, this application provides a shell material, comprising:

[0007] Housing substrate;

[0008] A fiberboard is bonded to the housing substrate. The fiberboard includes resin and one or more fiber bundles combined with the resin. The fiber bundles include multiple fibers arranged in a bundle. The diameter of the fibers is 3μm to 10μm, and the diameter of the fiber bundles is 20μm to 90μm.

[0009] In one embodiment, the fiber bundles in the fiberboard are formed into a porous, oriented single-layer structure layer by a close-packing process. The resin fills the pores and forms a resin-cured layer on both sides of the oriented structure layer. The shell substrate is bonded to the resin-cured layer on at least one side of the oriented structure layer. Alternatively, the fiber bundles in the fiberboard are formed into a porous warp-weft woven cross structure layer by one or more composite weaving methods, including warp knitting, weft knitting, and woven fabric. The resin fills the pores and forms a resin-cured layer on both sides of the warp-weft woven cross structure layer. The shell substrate is bonded to the resin-cured layer on at least one side of the warp-weft woven cross structure layer.

[0010] In one embodiment, the housing substrate includes a first plate and a second plate, a cavity is formed between the first plate and the second plate, and the fiber plate is sandwiched between the first plate and the second plate and fills the cavity.

[0011] In one embodiment, at least one edge of the first plate and the second plate is sealed by hot melting.

[0012] In one embodiment, the housing substrate is a glass sheet, ceramic sheet or plastic sheet with a thickness of 0.1 mm to 0.5 mm, and the light transmittance is greater than or equal to 90%.

[0013] In one embodiment, a membrane is sandwiched between the housing substrate and the fiberboard. The membrane is textured and vacuum-bonded to the side of the housing substrate facing the fiberboard. The texture of the membrane is permeable to the housing substrate.

[0014] In one embodiment, the housing substrate is a 2D or 3D molded sheet, and the fiberboard is thermoformed into a 2D or 3D shape that matches the shape of the molded sheet. The fiberboard and the housing substrate are aligned and bonded together by adhesive or the resin in the fiberboard, wherein the adhesive is PSA adhesive, OCA adhesive, UV adhesive or PU adhesive.

[0015] In one embodiment, the fiber bundle includes multiple fibers of different materials and / or different diameters, wherein the fibers are made of glass fiber, ceramic fiber or carbon fiber.

[0016] On the other hand, this application provides a method for preparing a shell material, comprising the following steps:

[0017] To prepare a fiberboard, one or more fiber bundles are combined with resin to form the fiberboard. The fiber bundle includes multiple fibers arranged in a bundle. The diameter of the fibers is 3μm to 10μm, and the diameter of the fiber bundle is 20μm to 90μm.

[0018] The fiberboard is bonded to the shell substrate to obtain the shell material.

[0019] In one embodiment, the step of bonding the fiberboard to the housing substrate includes:

[0020] The fiberboard is stacked with the shell substrate to obtain a laminated composite material;

[0021] The laminated composite material is hot-pressed at a temperature of 80℃~150℃ and a pressure of 1Mpa~35Mpa to bond the resin in the fiberboard to the shell substrate.

[0022] In one embodiment, the step of preparing the fiberboard includes:

[0023] The resin is evenly coated onto the PET film using a coating line.

[0024] One or more fiber bundles are formed into a fiber assembly through a close-packing process or a weaving process, and the fiber assembly is fixed on a PET film coated with resin, so that the fiber bundles are bonded to the resin.

[0025] The PET film is hot-pressed on one side where the fiber bundles are located to evaporate the solvent remaining in the resin and to press the fiber bundles and the resin together to obtain the fiberboard.

[0026] In one embodiment, the step of preparing the fiberboard includes:

[0027] One or more fiber yarn bundles are provided, and the fiber yarn bundles are shaped into a porous warp and weft woven cross structure layer by a weaving process;

[0028] The warp and weft braided cross structure layer is immersed in a resin impregnation tank to ensure that the warp and weft braided cross structure layer is fully impregnated with resin.

[0029] Excess resin is removed by pressing the resin-impregnated warp and weft braided cross-structure layer with a thickness control wheel.

[0030] The warp and weft woven cross structure layer, after removing excess resin, is laid flat and baked at 60℃~80℃ for 5min~20min to dry and form the fiberboard.

[0031] In one embodiment, the resin is a formulated modified resin, and the steps for preparing the modified resin include:

[0032] Provide resin raw materials;

[0033] The resin raw material is dissolved in a solvent, and then additives and surface modifiers are added and stirred evenly at a temperature of 30℃~50℃ to obtain a resin solution.

[0034] First, a dispersant is added to the resin solution and stirred at a speed of 300 r / min to 600 r / min for 5 min to 10 min. Then, the speed is increased to 600 r / min to 1000 r / min and functional organic-inorganic powder is gradually added. Then, the speed is increased to 1000 r / min to 2000 r / min and stirred for 10 min to 30 min to completely disperse the functional organic-inorganic powder in the resin solution to obtain the modified resin.

[0035] In one embodiment, the resin raw material is selected from one or more of epoxy resin, phenolic resin, bismaleimide resin and benzoxazine resin; the solvent is selected from one or more of acetone, toluene and ethyl acetate; the functional organic-inorganic powder is selected from one or more of carbon black, carbon nanotubes, titanium dioxide, glass microspheres and PS microspheres; and the dispersant is selected from Tween 80, Span or sodium dodecyl sulfonate.

[0036] In one embodiment, prior to the step of bonding the fiberboard to the housing substrate, the method further includes a step of preparing the housing substrate:

[0037] A glass sheet is provided, and the glass sheet is thinned by a grinding process and / or a chemical etching process, so that the thickness of the glass sheet is 0.1mm~0.5mm;

[0038] The thinned glass sheet is hot-bent into a 2D or 3D shape.

[0039] Furthermore, this application provides a method for preparing a shell, comprising the following steps:

[0040] A shell material is provided, wherein the shell material is the shell material as described in any of the above embodiments, or the shell material is a shell material prepared by the method described in any of the above embodiments.

[0041] The shell material is cut according to the required shape of the shell;

[0042] The cut shell material is hot-pressed to obtain the shell.

[0043] In another aspect, this application provides a housing, which is prepared using the housing preparation method described above.

[0044] In one embodiment, this application also provides an electronic device including the housing as described above.

[0045] The shell material and its preparation method, shell preparation method, shell and electronic device of this application utilize multiple fibers with a diameter of 3μm to 10μm bundled together to obtain fiber yarn bundles with a diameter of 20μm to 90μm, which are combined with resin to form a fiber board to strengthen the shell substrate. Since the fiber board has a low density, it can achieve both lightweight and improved impact resistance of the shell material. Attached Figure Description

[0046] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0047] Figure 1 A cross-sectional structural diagram of a shell material provided in one embodiment.

[0048] Figure 2 A cross-sectional structural diagram of the shell material provided for another embodiment.

[0049] Figure 3 A cross-sectional structural diagram of the shell material provided for another embodiment.

[0050] Figure 4 A flowchart illustrating a method for preparing a shell material according to one embodiment.

[0051] Figure 5 A flowchart of step S102 in a method for preparing a shell material according to one embodiment.

[0052] Figure 6 A flowchart of step S102 in a method for preparing a shell material provided in another embodiment.

[0053] Figure 7 A flowchart of step S104 in a method for preparing a shell material according to one embodiment.

[0054] Figure 8 A flowchart illustrating the preparation process of the modified resin in a method for preparing a shell material according to one embodiment.

[0055] Figure 9A flowchart illustrating the fabrication process of the shell substrate in a method for preparing a shell material according to one embodiment.

[0056] Explanation of icon numbers:

[0057] 10. Shell substrate; 11. First plate; 12. Second plate; 13. Edge banding; 20. Fiberboard; 30. Diaphragm. Detailed Implementation

[0058] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0059] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0060] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0061] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0062] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0063] See Figure 1 As shown, one embodiment of this application provides a shell material including a shell substrate 10 and a fiberboard 20. The shell substrate 10 can be understood as the main material used to construct the shell, and correspondingly, the fiberboard 20 is used to structurally reinforce the shell substrate 10 to improve the overall impact resistance of the shell material.

[0064] Specifically, the fiberboard 20 is bonded to the shell substrate 10. The fiberboard 20 includes resin and one or more fiber bundles bonded to the resin. Each fiber bundle includes multiple fibers arranged in a bundle. The diameter of the fibers is 3μm to 10μm, for example, the diameter of the fibers is 3μm, 4μm, 5μm, 6μm, 7μm, 8μm, 9μm, or 10μm. The diameter of the fiber bundle is 20μm to 90μm, for example, the diameter of the fiber bundle is 20μm, 25μm, 35μm, 46μm, 70μm, 80μm, 85μm, or 90μm. In this embodiment, the shell substrate 10 is reinforced by using fiber bundles with a diameter of 20μm to 90μm obtained by bonding multiple fibers with a diameter of 3μm to 10μm with resin to form the fiberboard 20. Because the fiberboard 20 has a low density, it can achieve both lightweighting and improved impact resistance of the shell material.

[0065] It should be noted that the fiber bundle includes multiple fibers of different materials and / or diameters, such as glass fiber, ceramic fiber, or carbon fiber. Therefore, different types of fiber bundles can be formed by combining fibers of different diameters or materials. Thus, in the above embodiments, the fiberboard 20 including one or more fiber bundles means that the fiber bundles forming the fiberboard 20 can be of the same or different specifications. When the fiberboard 20 includes one type of fiber bundle, the specifications of the fiber bundles in the fiberboard 20 are consistent; that is, each fiber bundle in the fiberboard 20 includes the same diameter and the same number of fibers. For ease of understanding, taking a fiber bundle including 3 glass fibers and 6 ceramic fibers as an example, then each fiber bundle in the fiberboard 20 includes 3 glass fibers and 6 ceramic fibers. Correspondingly, when the fiberboard 20 includes multiple types of fiber bundles, at least one fiber bundle in the fiberboard 20 is of a different type from the other fiber bundles. This difference in fiber bundle type may be due to differences in the type, number, or diameter of the fibers constituting the fiber bundle.

[0066] In some embodiments, the fiber bundles in the fiberboard 20 are formed into a porous, oriented single-layer structure layer by a close-packing process. Resin fills the pores and forms a resin-cured layer on both sides of the oriented structure layer. The shell substrate 10 is bonded to the resin-cured layer on at least one side of the oriented structure layer.

[0067] In addition to forming a directional single-layer structure through a close-packing process, the fiber bundles in the fiberboard 20 can also be woven into a corresponding woven structure in some embodiments. The woven methods mainly include warp knitting, weft knitting, and woven fabric; different woven methods result in different woven structures. For example, the fiber bundles in the fiberboard 20 can be woven into a porous warp-weft woven cross-structure layer through one or more composite weaving methods of warp knitting, weft knitting, and woven fabric. Resin fills the pores and forms a resin-cured layer on both sides of the warp-weft woven cross-structure layer. The shell substrate 10 is bonded to the resin-cured layer on at least one side of the warp-weft woven cross-structure layer.

[0068] In the above embodiments, regardless of whether the fiber bundles are produced by close packing or weaving, there will be certain holes or gaps between the fiber bundles, i.e., the pores mentioned in this application. When resin is used to combine with the fiber bundles, the resin fills the pores to improve the impact resistance of the fiberboard 20.

[0069] In some embodiments, the shell substrate 10 includes a first plate 11 and a second plate 12, with a cavity formed between the first plate 11 and the second plate 12. A fiberboard 20 is sandwiched between the first plate 11 and the second plate 12 and fills the cavity. This method of sandwiching the fiberboard 20 between the first plate 11 and the second plate 12 improves the overall impact resistance of the shell material.

[0070] Combination Figure 2 and Figure 3 As shown, in some embodiments, at least one edge of the first plate 11 and the second plate 12 is sealed by hot melting to form an edge 13, thereby wrapping the corresponding edge of the fiber plate 20, which helps to improve the overall structural stability of the shell material, reduce the probability of delamination and detachment between the fiber plate 20 and the shell substrate 10, and thus help to improve the overall impact resistance of the shell material.

[0071] In some embodiments, the shell substrate 10 is a glass sheet, ceramic sheet, or plastic sheet with a thickness of 0.1 mm to 0.5 mm and a light transmittance greater than or equal to 90%. Thus, the shell substrate 10 is thin and has good light transmittance, which helps to improve the transparency of the shell material and allows the shell material to maintain a good gloss. In some embodiments, the shell substrate 10 is a glass sheet, ceramic sheet, or plastic sheet with a thickness of 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, or 0.5 mm.

[0072] In some embodiments, a diaphragm 30 is sandwiched between the shell substrate 10 and the fiberboard 20. The diaphragm 30 is textured and vacuum-bonded to the side of the shell substrate facing the fiberboard 20. The texture of the diaphragm 30 is permeable to the shell substrate, allowing the shell material to display a corresponding texture and enriching its appearance. Accordingly, the diaphragm 30 may be colored, thus serving a decorative effect on the shell material after passing through the shell substrate. The material of the diaphragm 30 is not limited here. In some embodiments, the diaphragm 30 may be made of PET (Polyethylene terephthalate), PVC (Polyvinyl chloride), PP (Polypropylene), etc.

[0073] Vacuum bonding can be used to connect the shell substrate 10 and the diaphragm 30. Taking glass sheet as an example, the corresponding texture and color appearance effect are prepared on the diaphragm 30 according to the appearance requirements, and the diaphragm 30 is pre-formed according to the structural shape; the pre-formed diaphragm 30 and the pre-formed glass sheet are vacuum bonded to obtain a glass diaphragm composite structure that meets the appearance design.

[0074] In some embodiments, the shell substrate 10 is a 2D or 3D molded sheet, and the fiberboard 20 is thermoformed into a 2D or 3D shape that matches the shape of the molded sheet. The fiberboard 20 and the shell substrate 10 are aligned and bonded together by adhesive or resin in the fiberboard 20, thereby obtaining a shell material with the corresponding 2D or 3D shape.

[0075] The adhesive can be PSA, OCA, UV, or PU, ensuring both light transmittance and stable connection between the fiberboard 20 and the shell substrate 10. It should be noted that different types of adhesives have different curing methods. For example, OCA adhesive can be cured by thermosetting. UV adhesive, on the other hand, can be cured by baking or UV light. In some embodiments, a pressing method can also be used to bond the fiberboard 20 to the shell substrate 10.

[0076] Combination Figure 4 As shown, another embodiment of this application provides a method for preparing a shell material, comprising the following steps:

[0077] Step S102: Prepare fiberboard 20 by combining one or more fiber bundles with resin to form fiberboard 20. The fiber bundle includes multiple fibers arranged in a bundle. The diameter of the fibers is 3μm to 10μm, and the diameter of the fiber bundle is 20μm to 90μm.

[0078] Step S104: Fiberboard 20 is bonded to shell substrate 10 to obtain shell material.

[0079] Since fiber bundles with diameters of 20μm to 90μm are obtained by bundling multiple fibers with diameters of 3μm to 10μm and then combining them with resin to form fiber sheets 20 to strengthen the shell substrate 10, and since the fiber sheets 20 have a low density, the shell material prepared by this method is not only lightweight and thin, but also has good impact resistance.

[0080] Combination Figure 5 As shown, the steps for preparing the fiberboard 20, namely step S102, include:

[0081] Step S1022: Apply resin evenly to the PET film using a coating line.

[0082] Step S1024: One or more fiber bundles are formed into a fiber combination through a close-packing process or a weaving process, and the fiber combination is fixed on a PET film coated with resin, so that the fiber bundles are bonded to the resin.

[0083] Step S1026: The side of the PET film with fiber bundles is hot-pressed to evaporate the residual solvent in the resin and to press the fiber bundles and resin together to obtain fiberboard 20.

[0084] Combination Figure 6 As shown, in another embodiment, the step of preparing the fiberboard 20, namely step S102, includes:

[0085] Step S102A: Provide one or more fiber bundles and shape the fiber bundles into a porous warp and weft woven cross structure layer through a weaving process.

[0086] Step S102B involves immersing the warp and weft braided cross structure layer into an impregnation tank containing resin, ensuring that the warp and weft braided cross structure layer is fully impregnated with resin.

[0087] In step S102C, the resin-impregnated warp and weft braided cross structure layer is squeezed by a thickness control wheel to remove excess resin.

[0088] In step S102D, the warp and weft woven cross structure layer with excess resin removed is flattened and baked at 60℃~80℃ for 5min~20min to dry and form fiberboard 20.

[0089] This process can obtain a structurally stable warp and weft woven cross-structure layer. It should be noted that the baking temperature in step S102D can be any value between 60℃ and 80℃, and the baking time can be any value between 5 minutes and 20 minutes. For example, the warp and weft woven cross-structure layer can be laid flat and baked at 60℃, 65℃, 70℃, 75℃, or 80℃ for 5 minutes, 9 minutes, 15 minutes, or 20 minutes, respectively.

[0090] Combination Figure 7 As shown, in some embodiments, the step of bonding the fiberboard 20 to the housing substrate 10, i.e., step S104, includes:

[0091] Step S1042: The fiberboard 20 and the shell substrate 10 are stacked to obtain a laminated composite material;

[0092] Step S1044: The laminated composite material is hot-pressed at a hot-pressing temperature of 80℃~150℃ and a hot-pressing pressure of 1Mpa~35Mpa to bond the resin in the fiberboard 20 to the shell substrate 10.

[0093] Step S104 ensures the bonding stability between the fiberboard 20 and the shell substrate 10. The hot-pressing temperature can be 80℃, 90℃, 100℃, 110℃, 120℃, 130℃, 140℃, or 150℃. The hot-pressing pressure can be 1 MPa, 5 MPa, 10 MPa, 15 MPa, 25 MPa, or 35 MPa.

[0094] Combination Figure 8 As shown, in some embodiments, the resin is a formulated modified resin, and the steps for preparing the modified resin include:

[0095] Step S202: Provide resin raw materials.

[0096] Step S204: Dissolve the resin raw material in a solvent, then add the additives and surface modifiers, and stir evenly at a temperature of 30℃~50℃ to obtain a resin solution.

[0097] In step S206, a dispersant is first added to the resin solution and stirred at a speed of 300 r / min to 600 r / min for 5 min to 10 min. Then, the speed is increased to 600 r / min to 1000 r / min and functional organic-inorganic powders are gradually added. Then, the speed is increased to 1000 r / min to 2000 r / min and stirred for 10 min to 30 min to completely disperse the functional organic-inorganic powders into the resin solution to obtain the modified resin.

[0098] Through the above process, the modified resin used to make fiberboard 20 can enhance the mechanical properties of the shell substrate 10, thereby improving the impact resistance of the shell material.

[0099] The resin raw material is selected from one or more of epoxy resin, phenolic resin, bismaleimide resin, and benzoxazine resin; the solvent is selected from one or more of acetone, toluene, and ethyl acetate; the functional organic-inorganic powder is selected from one or more of carbon black, carbon nanotubes, titanium dioxide, glass microspheres, and PS microspheres; the dispersant is selected from Tween 80, Span, or sodium dodecyl sulfonate. It should be noted that polystyrene microspheres (PS microspheres) are polymer microspheres composed of polystyrene. Microspheres refer to small particles with diameters typically ranging from 100 nanometers to several hundred micrometers, possessing a uniform spherical structure.

[0100] Combination Figure 9 As shown, in some embodiments, before the step of bonding the fiberboard 20 to the housing substrate 10, i.e. before step S104, the step of preparing the housing substrate 10 is also included:

[0101] Step S302: Provide a glass sheet and thin it by grinding and / or chemical etching processes to make the thickness of the glass sheet 0.1mm~0.5mm.

[0102] Step S304: The thinned glass sheet is hot-bent into a 2D or 3D shape.

[0103] Specific thinning methods include grinding and polishing: mechanically grinding and polishing the glass with powders such as cerium oxide, zirconium oxide, or silicon oxide to achieve the goal of thinning the glass to the designed thickness (0.5mm~0.1mm). Alternatively, chemical etching: chemically etching the glass with one or a mixture of solutions such as hydrofluoric acid, hydrochloric acid, oxalic acid, or ammonium fluoride (temperature 25℃~40℃, time 20min~60min) to achieve the goal of thinning the glass to the designed thickness (0.5mm~0.1mm).

[0104] Another embodiment of this application provides a shell preparation method, including the following steps:

[0105] A shell material is provided, which is the shell material as described in any of the above embodiments, or the shell material is the shell material prepared by the method described in any of the above embodiments.

[0106] The shell material is cut according to the required shell shape.

[0107] The cut shell material is hot-pressed to obtain the shell.

[0108] Because the shell material can be both lightweight and impact-resistant, the shell structure made of this material has high strength and is conducive to achieving a thinner and lighter design.

[0109] Accordingly, another embodiment of this application provides a housing, which is prepared using the housing preparation method described above.

[0110] Another embodiment of this application provides an electronic device including a housing as described above.

[0111] It should be noted that there are no particular restrictions on the specific type of electronic device; it can be any conventional electronic device, such as, but not limited to, mobile phones, tablets, game consoles, or wearable devices.

[0112] To facilitate understanding of the superior effects of the improved shell material obtained in this application, bending strength tests and drop ball tests are performed below using glass as an example of one of the shell substrates 10 in some embodiments.

[0113] Experimental Data 1: The bending strength (4PB) and impact strength (dropped ball) of the shell substrate 10 were tested and compared with those of samples with different types of glass, samples after glass and diaphragm 30 were bonded together, and samples of glass diaphragm 30 and fiberboard composite.

[0114]

[0115] Test data shows that compared to different types of 0.3mm thick glass, the 30-layer lamination of the diaphragm has virtually no impact on the overall performance. The 0.25mm thick fiber-glass composite product, which uses a specific resin and adhesive, shows significant improvements in both 4PB and drop ball performance, with the key drop ball performance improving by more than 100%. Even when the glass thickness is increased to 0.55mm (the same thickness as 0.3mm glass plus 0.25mm glass fiber), the key drop ball performance still shows a significant improvement, with an increase of more than 50%, and the overall weight is reduced (by about 1g).

[0116] Experimental Data 2: The bending strength (4PB) and impact strength (dropped ball) of the glass diaphragm 30 and different types and thicknesses of fiberboard composite samples were tested and compared.

[0117]

[0118] Test data shows that different types (single or composite laminated) of fiberboard 20 and fiberboard 20 of different thicknesses have differences in 4PB and drop ball performance with glass integrated composite products. The overall performance can be adjusted by different fiber thicknesses and types. Among them, S fiberboard can improve the bending strength of composite materials more than E fiberboard. Increasing the glass fiber thickness can also significantly improve the strength and drop ball performance of composite materials. Aramid or UHPE composite fiberboard can significantly improve the drop ball performance of composite materials.

[0119] Experimental Data 3: The bending strength (4PB) and impact strength (dropped ball) of the new composite samples of the same glass diaphragm 30 and different types of resin prepreg fiberboard were tested and compared.

[0120]

[0121] Test data shows that different types of prepreg fiberboard and glass-integrated composite products exhibit differences in 4PB and drop ball strength. Overall performance can be adjusted by optimizing the prepreg resin. Phenolic resin enhances flexural strength, while bismaleimide resin improves drop ball strength. Adding glass beads to the prepreg resin effectively reduces overall weight. It should be noted that in this application, prepreg resin refers to a treatment method that combines fiber bundles with resin to obtain fiberboard.

[0122] This solution combines high-strength, lightweight composite fibers with glass to create a novel composite material that combines glass texture, rich appearance, lightweight properties, and impact resistance. For example, by not using S-type glass fiber to impart a higher modulus to the glass fiber, while maintaining the fiber thickness, we can increase the 4PB of the fiberboard 20 and glass integrated composite material to about 330 MPa, and simultaneously increase the drop ball height to over 55 cm. By using high-modulus, high-toughness fibers such as Kevlar and ultra-high molecular weight polyethylene to composite and weave with glass fiber, and then laminating them, we can improve the toughness of the fiberboard and increase the drop ball height of the fiberboard 20 and glass integrated composite material to over 60 cm. By adjusting the thickness of the fiber and glass, we can give the overall composite material different mechanical properties: increasing the thickness of the fiberboard 20 to 0.35 mm increases the 4PB of the fiberboard 20 and glass integrated composite material to about 340 MPa, and simultaneously increases the drop ball height to over 65 cm. By adjusting the type or formulation of the preimpregnating resin, we can adjust the performance of the fiberboard 20 and its comprehensive characteristics after being combined with glass: using bismaleimide resin preimpregnation can increase the drop ball height of the fiberboard 20 and glass integrated composite material to over 60 cm, and the addition of glass beads to the preimpregnating resin can reduce the mass of the integrated composite material.

[0123] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0124] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A shell material, characterized by, The application relates to a shell material, comprising: a shell base material; a fiber plate material bonded to the shell base material, the fiber plate material comprising resin and one or more fiber tows combined with the resin, the fiber tows comprising a plurality of fibers, the plurality of fibers being arranged in a bundle, the diameter of the fibers being 3-10 mu m, and the diameter of the fiber tows being 20-90 mu m.

2. The shell material of claim 1, wherein, The fiber tows in the fiber plate material are formed into a directional single-layer arrangement structure layer with pores by a close-packed process, the resin fills the pores and forms resin solidification layers on both side surfaces of the directional arrangement structure layer, and the shell base material is bonded to the resin solidification layer on at least one side surface of the directional arrangement structure layer; alternatively, the fiber tows in the fiber plate material are formed into a warp-weft weaving cross structure layer with pores by one or more of warp knitting, weft knitting and shuttle weaving, the resin fills the pores and forms resin solidification layers on both side surfaces of the warp-weft weaving cross structure layer, and the shell base material is bonded to the resin solidification layer on at least one side surface of the warp-weft weaving cross structure layer.

3. The shell material of claim 2, wherein, The shell base material comprises a first plate material and a second plate material, a cavity is formed between the first plate material and the second plate material, and the fiber plate material is arranged between the first plate material and the second plate material and fills the cavity.

4. The shell material of claim 3, wherein, At least one side edge of the first plate material and the second plate material is formed into an edge by hot melting.

5. The shell material of claim 1, wherein, The shell base material is a glass sheet material, a ceramic sheet material or a plastic sheet material with a thickness of 0.1-0.5 mm and a light transmittance greater than or equal to 90%.

6. The shell material of claim 5, wherein, A diaphragm is arranged between the shell base material and the fiber plate material, the diaphragm is formed with a texture and is vacuum-bonded to one side of the shell base material facing the fiber plate material, and the texture of the diaphragm can pass through the shell base material.

7. The shell material of claim 6, wherein, The shell base material is a 2D or 3D formed sheet material, the fiber plate material is hot-pressed into a 2D or 3D shape matching the shape of the formed sheet material, the fiber plate material is positionally bonded to the shell base material and is bonded by glue or the resin in the fiber plate material, wherein the glue is PSA glue, OCA glue, UV glue or PU glue.

8. The shell material of claim 1, wherein, The fiber tows comprise a plurality of fibers with different materials and / or different diameters, and the materials of the fibers are glass fibers, ceramic fibers or carbon fibers.

9. A method for producing a shell material, characterized by, The application further relates to a method for manufacturing the shell material, comprising the following steps: preparing a fiber plate material, one or more fiber tows are combined with resin to form the fiber plate material, the fiber tows comprise a plurality of fibers, the plurality of fibers are arranged in a bundle, the diameter of the fibers is 3-10 mu m, and the diameter of the fiber tows is 20-90 mu m; bonding the fiber plate material to a shell base material to obtain a shell material.

10. The method of claim 9, wherein, The step of bonding the fiber plate material to the shell base material comprises: stacking the fiber plate material and the shell base material to obtain a laminated composite material; hot-pressing the laminated composite material at a hot-pressing temperature of 80-150 DEG C and a hot-pressing pressure of 1-35 Mpa, so that the resin in the fiber plate material is bonded to the shell base material.

11. The preparation method according to claim 9, characterized in that, The step of preparing the fiber plate material comprises: The resin is uniformly coated on the PET film by using a glue coating line; One or more fiber tows are formed into a fiber assembly by a close-packed process or a weaving process, and the fiber assembly is shaped on the resin-coated PET film, so that the fiber tows are combined with the resin; The side of the PET film provided with the fiber tows is hot-pressed to volatilize the solvent remaining in the resin and to press and shape the fiber tows and the resin into the fiber board.

12. The method of claim 9, wherein, The steps for preparing the fiber board include: One or more fiber tows are provided, and the fiber tows are shaped into a warp-weft woven cross structure layer with pores by a weaving process; The warp-weft woven cross structure layer is immersed into a resin-filled impregnation tank, so that the warp-weft woven cross structure layer is fully impregnated with resin; The warp-weft woven cross structure layer impregnated with resin is extruded by a thickness control wheel to remove excess resin; The warp-weft woven cross structure layer with the removed excess resin is flattened and baked at 60-80°C for 5-20 min to dry and shape into the fiber board.

13. The production method according to claim 11 or 12, characterized by, The resin is a modified resin prepared by adjusting the resin raw material, and the preparation steps of the modified resin include: The resin raw material is dissolved in a solvent, and then additives and a surface modifier are added and uniformly stirred at a temperature of 30-50°C to obtain a resin solution; First, a dispersing agent is added to the resin solution and stirred at a speed of 300-600 r / min for 5-10 min, then the speed is increased to 600-1000 r / min and functional organic-inorganic powder is gradually added, then the speed is increased to 1000-2000 r / min for stirring for 10-30 min, so that the functional organic-inorganic powder is completely dispersed in the resin solution to obtain the modified resin. The resin raw material is selected from one or more of epoxy resin, phenolic resin, bismaleimide resin and benzoxazine resin; the solvent is selected from one or more of acetone, toluene and ethyl acetate; the functional organic-inorganic powder is selected from one or more of carbon black, carbon nanotube, titanium dioxide, glass microbeads and PS microspheres; and the dispersing agent is selected from Tween 80, Span or sodium dodecyl sulfate.

14. The method of claim 13, wherein, Before the step of bonding the fiber board to the shell base material, the step of preparing the shell base material is further included:

15. The preparation method according to claim 9, characterized in that, A glass sheet is provided, and the glass sheet is thinned by a grinding process and / or a chemical etching process, so that the thickness of the glass sheet is 0.1-0.5 mm; The thinned glass sheet is hot-bent and shaped into a 2D or 3D shape. The steps include:

16. A method of producing a shell, characterized by, A shell material is provided, which is the shell material according to any one of claims 1-8, or the shell material prepared by the preparation method of the shell material according to any one of claims 9-15; The shell material is cut according to the shape of the required shell; The cut shell material is hot-pressed and shaped to obtain the shell. ​ 17. A housing characterized by, The shell is prepared by the shell preparation method of claim 16.

18. An electronic device, comprising: The shell of claim 17.

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