Light-cured resin, preparation method of light-cured resin, photosensitive resin composition and application of photosensitive resin composition

Abstract

The invention relates to the technical field of light curing, in particular to light-cured resin and a preparation method thereof as well as a photosensitive resin composition and application thereof, and the light-cured resin is prepared from the following raw materials in parts by weight: 500-700 parts of epoxy resin, 2-4 parts of a catalyst, 2-4 parts of a polymerization inhibitor, 50-100 parts of acrylic acid, 90-150 parts of anhydride, 40-60 parts of a functional aid and 600-900 parts of a solvent. By introducing the specific functional auxiliary agent, the common defects of high curing shrinkage rate, insufficient adhesive force, low light sensitivity, poor chemical resistance and the like in the solder resist dry film are overcome, and the solder resist dry film shows good comprehensive performance.

Description

Technical Field

[0001] This invention relates to the field of photocuring technology, specifically to a photocurable resin and its preparation method, a photosensitive resin composition and its application. Background Technology

[0002] UV-curable resin is the foundation of solder resist dry film performance. It perfectly combines precision patterning capabilities with end-use performance requirements, serving as a bridge between printed circuit board (PCB) manufacturing processes and end-use reliability. The molecular design, synthesis process, and formulation matching of UV-curable resin are the core competitive advantages of solder resist dry film manufacturers. A well-designed UV-curable resin can ensure the electrical reliability and physical durability of PCBs throughout subsequent assembly, testing, and the entire lifecycle; it enables the manufacturing of high-density, fine-line PCBs, a prerequisite for modern electronic miniaturization and high-performance processes; and it can meet increasingly stringent reliability requirements while controlling production costs and adapting to environmental trends such as halogen-free and low-carbon manufacturing.

[0003] The current market requirements for solder resist dry film are as follows: (1) withstands lamination softening temperature of 100-110℃; (2) curing shrinkage rate ≤3.5%; (3) Tg>100℃, CTE<100ppm / k; resistant to cleaning agents, acids and alkalis, and does not discolor, bubble or peel off; (4) high photosensitivity, exposure energy ≤300mJ / cm 2 (5) The solder resist dry film circuit has high resolution and strong adhesion.

[0004] As market demands for the performance of solder resist dry films increase, researchers have begun to adjust the molecular design, synthesis process, and formulation components of photocurable resins to optimize their various properties. For example, Chinese invention patent application CN103109234A provides a photosensitive resin composition that offers superior photosensitive materials in terms of photocuring properties, electroplating resistance, mechanical properties, and heat resistance. However, it does not solve the common defects in solder resist dry films, such as high curing shrinkage, insufficient adhesion, low photosensitivity, and poor chemical resistance. Summary of the Invention

[0005] To address the common defects in dry resist films, such as high curing shrinkage, insufficient adhesion, low photosensitivity, and poor chemical resistance, the first aspect of this invention provides a photocurable resin, which, by weight, comprises: 500-700 parts epoxy resin, 2-4 parts catalyst, 2-4 parts polymerization inhibitor, 50-100 parts acrylic acid, 90-150 parts acid anhydride, 40-60 parts functional additives, and 600-900 parts solvent.

[0006] In some embodiments, the functional additive includes at least one of hydroxyl-containing tertiary amine compounds and nitrogen-containing heterocyclic polyhydroxy compounds.

[0007] In some embodiments, the hydroxyl-containing tertiary amine compound includes one or more of diethanolamine, methyldiethanolamine, and phenylene glycolamine.

[0008] Optionally, the hydroxyl-containing tertiary amine compound includes phenylene glycolamine.

[0009] This invention introduces hydroxyl-containing tertiary amine compounds as functional additives into photocurable resins. The hydroxyl and tertiary amine groups in these additives synergistically interact with photoinitiators to promote rapid free radical generation and accelerate the crosslinking reaction of acrylic acid double bonds. By lowering the activation energy, low-energy rapid curing is achieved, avoiding increased shrinkage or insufficient adhesion caused by incomplete curing.

[0010] In some embodiments, the nitrogen-containing heterocyclic polyhydroxy compound includes at least one of pyridine polyhydroxy compounds and indole polyhydroxy compounds.

[0011] In some embodiments, the pyridine polyhydroxy compound includes at least one of 2,4-dihydroxypyridine, 3,5-dihydroxypyridine, and 2,6-dihydroxypyridine.

[0012] This invention introduces pyridine-based polyhydroxy compounds into a photocurable resin. The basicity of the pyridine ring in the molecular structure of this compound forms coordination bonds with copper ions on the PCB substrate surface, enhancing the interfacial bonding between the resin and the substrate. At the same time, it inhibits electrochemical corrosion by chelating metal ions and reduces undercutting during the development process, thereby improving pattern accuracy and chemical resistance.

[0013] In some embodiments, the indole polyhydroxy compound includes at least one of 1,2-dihydroxyindole and 5,6-dihydroxyindole.

[0014] This invention introduces indole-based polyhydroxy compounds into photocurable resins. The molecular structure of these compounds contains both nitrogen-containing heterocycles and multiple hydroxyl groups. The combined effect of the hydroxyl groups and the heterocycle structure effectively captures free radicals and blocks oxidative chain reactions, preventing resin degradation. Simultaneously, the nitrogen atoms in the heterocycles can chelate metal ions in the substrate, significantly improving chemical resistance and adhesion.

[0015] In some embodiments, the epoxy resin includes one or more of glycidyl ether epoxy resins, glycidyl ester epoxy resins, and glycidyl amine epoxy resins.

[0016] In some embodiments, the glycidyl ether epoxy resin includes at least one of bisphenol A epoxy resin and methylphenolic epoxy resin.

[0017] Optionally, the epoxy resin includes methylphenolic epoxy resin.

[0018] The photocurable resin of this invention contains 500-700 parts of epoxy resin. When the amount of epoxy resin is too high, while it improves heat resistance and hardness, it also increases the brittleness of the resin, making it more prone to cracking, and the developability will deteriorate. When the amount is too low, the heat resistance, hardness and adhesion of the resin will decrease.

[0019] In some embodiments, the catalyst includes at least one of tertiary amine catalysts, quaternary ammonium salt catalysts, and metal complex catalysts.

[0020] In some embodiments, the amine catalyst includes at least one of triphenylphosphine, benzyldimethylamine, and triethylamine.

[0021] In some embodiments, the quaternary ammonium salt catalyst includes at least one of tetrabutylammonium bromide and benzyltriethylammonium chloride.

[0022] In some embodiments, the metal complex catalyst comprises a metal salt of acetylacetone.

[0023] Optionally, the catalyst comprises triphenylphosphine.

[0024] The photocurable resin of this invention contains 2-4 parts of catalyst. If the amount of catalyst is too high, the initial reaction will be violent, resulting in premature gelation and yellowing. If the amount is too low, the reaction rate will be slow, the conversion rate will be low, the epoxy group and carboxyl group will not react completely, and the production efficiency will be reduced.

[0025] In some embodiments, the polymerization inhibitor includes at least one of phenolic polymerization inhibitors, quinone polymerization inhibitors, and non-phenolic and non-quinone polymerization inhibitors.

[0026] In some embodiments, the phenolic polymerization inhibitor includes at least one of hydroquinone, p-hydroxyanisole, and 2,6-di-tert-butyl-p-cresol.

[0027] In some embodiments, the quinone polymerization inhibitor includes at least one of benzoquinone, methylhydroquinone, and tetrachlorobenzoquinone.

[0028] In some embodiments, the non-phenolic and non-quinone polymerization inhibitor includes at least one of cuprous chloride, ferric chloride, sodium tert-butoxide, phenothiazine, and 1,1-diphenyl-2-picrylhydrazine.

[0029] Optionally, the polymerization inhibitor includes methylhydroquinone.

[0030] The photocurable resin of this invention includes 2-4 parts of polymerization inhibitor. When the amount of polymerization inhibitor is too high, it affects the function of the photoinitiator, resulting in a significant decrease in the photocuring speed, which directly affects the hardness, heat resistance and adhesion of the dry film. When the amount is too low, it cannot effectively inhibit the thermal polymerization of monomers, resulting in local gelation or burst polymerization, and poor stability.

[0031] In some embodiments, the anhydride includes one or more of maleic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, tetrahydrophthalic anhydride, maleic anhydride, benzoic anhydride, pyromellitic dianhydride, and trimellitic anhydride.

[0032] Optionally, the acid anhydride includes tetrahydrophthalic anhydride.

[0033] The photocurable resin of this invention includes 100-150 parts of acid anhydride. Increasing the amount of acid anhydride can, to some extent, increase the resin's flexibility, acid value, and hardness, and also has a certain impact on the photopolymerization rate, but it will also increase the resin's viscosity. Strictly controlling the acid anhydride content within the range of 100-150 parts is crucial for balancing the various properties of the photocurable resin.

[0034] In some embodiments, the solvent includes one or more of toluene, methyl ethyl ketone, methanol, ethanol, ethyl acetate, butyl acetate, ethylene glycol methyl ether, ethane, diethyl ether, trichloroethane, acetone, butanone, dichloromethane, dichloroxylene, chloroform, dioxane, propylene glycol methyl ether, and propylene glycol methyl ether acetate. Optionally, the solvent includes propylene glycol methyl ether acetate.

[0035] The photocurable resin of this invention includes 600-900 parts of solvent. Excessive solvent can easily lead to strong resin fluidity, causing problems such as sagging and edge shrinkage, as well as insufficient dry film hardness, stickiness, and reduced adhesion. Insufficient solvent will result in excessively high resin viscosity, uneven coating, and excessively rapid solvent evaporation, causing the dry film to become brittle.

[0036] A second aspect of the present invention provides a method for preparing a photocurable resin, comprising at least the following steps: S1. Heat and stir 90-95wt% solvent and epoxy resin until uniform, then add dropwise a mixed solution of polymerization inhibitor and functional additives and acrylic acid. After the addition is complete, add catalyst and keep the reaction at the temperature for 35-40 hours to obtain mixed solution 1. S2. Add the acid anhydride and the remaining solvent to the mixed solution 1 dropwise to react and obtain the photocurable resin.

[0037] In some embodiments, the temperature of the heating and stirring is 85-90°C.

[0038] In some embodiments, the acrylic acid is added at a temperature of 95-98°C.

[0039] In some embodiments, the temperature of the mixture 2 containing the added anhydride and the remaining solvent is 80-85°C.

[0040] In some embodiments, the reaction time in S2 is 5-8 hours.

[0041] A third aspect of the present invention provides a photosensitive resin composition, wherein the raw materials for preparing the photosensitive resin composition satisfy the following conditions: A. The raw materials for preparation include the above-mentioned photocurable resin, or the photocurable resin prepared according to the above-mentioned preparation method; B. The raw materials for preparation also include film-forming resins, thermosetting adhesive resins, photoinitiators, colorants, fillers, and organic solvents.

[0042] In some embodiments, the film-forming resin includes a modified acrylic resin.

[0043] In some embodiments, the thermosetting adhesive resin includes imidazole and imidazole derivatives.

[0044] In some embodiments, the photoinitiator includes photoinitiator 184.

[0045] In some embodiments, the colorant includes phthalocyanine green.

[0046] In some embodiments, the packing material is an inorganic packing material, which includes barium sulfate.

[0047] In some embodiments, the organic solvent includes propylene glycol methyl ether acetate.

[0048] The fourth aspect of the present invention provides an application of a photosensitive resin composition in the preparation of solder resist dry film.

[0049] Beneficial effects 1. This invention provides a photocurable resin that solves the common defects in solder resist dry films, such as high curing shrinkage, insufficient adhesion, low photosensitivity and poor chemical resistance, by introducing specific functional additives.

[0050] 2. This invention introduces hydroxyl-containing tertiary amine compounds as functional additives into the photocurable resin. The hydroxyl and tertiary amine groups in these additives synergistically interact with the photoinitiator, promoting rapid free radical generation and accelerating the crosslinking reaction of acrylic acid double bonds. By lowering the activation energy, low-energy rapid curing is achieved, avoiding increased shrinkage or insufficient adhesion due to incomplete curing.

[0051] 3. This invention introduces pyridine-based polyhydroxy compounds into the photocurable resin. The basicity of the pyridine ring in the molecular structure of this compound forms coordination bonds with copper ions on the PCB substrate surface, enhancing the interfacial bonding between the resin and the substrate. At the same time, it inhibits electrochemical corrosion by chelating metal ions and reduces undercutting during the development process, thereby improving pattern accuracy and chemical resistance.

[0052] 4. This invention introduces indole-based polyhydroxy compounds into photocurable resins. The molecular structure of these compounds contains both nitrogen-containing heterocycles and multiple hydroxyl groups. The combined effect of the hydroxyl groups and the heterocycle structure effectively captures free radicals and blocks oxidative chain reactions, preventing resin degradation. Simultaneously, the nitrogen atoms in the heterocycles can chelate metal ions in the substrate, significantly improving chemical resistance and adhesion.

[0053] 5. This invention controls the amount of each raw material in the photocurable resin to ensure a balanced performance of the resin. The resulting photocurable resin, when applied to the preparation of solder resist dry film, enables the film to better meet market performance requirements. Its curing shrinkage rate can be strictly controlled to ≤3.5%, effectively avoiding problems such as circuit deformation caused by excessive shrinkage. Furthermore, the solder resist dry film has high photosensitivity, with an exposure energy ≤400mJ / cm², allowing for faster and more accurate formation of the desired pattern during exposure. Detailed Implementation

[0054] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to embodiments. It should be understood that the specific embodiments described herein are only for explaining the invention and are not intended to limit the invention. Experimental methods not specifying specific conditions in the embodiments were performed under conventional conditions or conditions recommended by the manufacturer. Reagents used, unless otherwise specified, are all commercially available products.

[0055] Example 1 The first aspect of this example provides a photocurable resin, which, by weight, comprises the following raw materials: 550 parts epoxy resin, 3.5 parts catalyst, 3.5 parts polymerization inhibitor, 72 parts acrylic acid, 92 parts acid anhydride, 50 parts functional additives, and 635 parts solvent.

[0056] The epoxy resin is methylphenolic epoxy resin, model NPCN-704, from Nan Ya Electronic Materials (Kunshan) Co., Ltd.

[0057] The catalyst is triphenylphosphine.

[0058] The polymerization inhibitor is methylhydroquinone.

[0059] The acid anhydride is tetrahydrophthalic anhydride.

[0060] The functional additive is diethanolamine.

[0061] The solvent is propylene glycol methyl ether acetate.

[0062] The second aspect of this example provides a method for preparing a photocurable resin, comprising the following steps: (1) Add 550 parts of epoxy resin and 583 parts of solvent to a round bottom flask and stir to mix evenly. Set the heating cycle to 90°C until the mixture is completely homogeneous. (2) Mix 3.5 parts of polymerization inhibitor and 50 parts of functional additive evenly, and add them dropwise to (1) through a dropper for 30 min to carry out the reaction; (3) Raise the temperature to 95°C, and after stabilization, add 72 parts of acrylic acid dropwise using a dropper, with the dropping time controlled within 1 hour; (4) Add 3.5 parts of catalyst to (3) to carry out the reaction, and control the reaction time to 36h and the temperature to 95℃; (5) Lower the temperature to 85°C, and after stabilization, add 92 parts of acid anhydride and the remaining solvent dropwise using a dropper. The dropwise addition time is 60 min. After the dropwise addition is completed, react for 6 h. After the reaction is completed, cool down to obtain the photocurable resin.

[0063] The third aspect of this example provides a photosensitive resin composition, wherein, by weight, the raw materials for preparing the photosensitive resin composition include 35 parts of photocurable resin, 35 parts of modified epoxy acrylate resin, 20 parts of imidazole, 10 parts of photoinitiator 184, 5 parts of barium sulfate, 25 parts of filler phthalocyanine green, and 30 parts of propylene glycol methyl ether acetate.

[0064] The fourth aspect of this example provides an application of a photosensitive resin composition in the preparation of solder resist dry films.

[0065] Example 2 The specific implementation method in this example is the same as in Example 1, except that the functional additive is methyldiethanolamine.

[0066] Example 3 The specific implementation method in this example is the same as in Example 1, except that the functional additive is phenylene glycolamine.

[0067] Example 4 The specific implementation method in this example is the same as in Example 2, except that the functional additive is 2,4-dihydroxypyridine.

[0068] Example 5 The specific implementation method in this example is the same as in Example 2, except that the functional additive is 1,2-dihydroxyindole.

[0069] Comparative Example 1 The specific implementation method in this example is the same as in Example 2, except that no functional additives are added.

[0070] The raw materials for preparing the photocurable resin, by weight, include: 600 parts epoxy resin, 3.5 parts catalyst, 3.5 parts polymerization inhibitor, 72 parts acrylic acid, 92 parts acid anhydride, and 635 parts solvent.

[0071] Performance testing 1. Using the photosensitive resin compositions provided in each embodiment and comparative example as samples, the solid content, viscosity, fineness, and curing shrinkage of the photosensitive resin compositions were tested.

[0072] Solid content test method: Weigh 2±0.4g of sample into an aluminum foil tray, dry it in an oven at 145℃ for 30min, then place it in a vacuum dish and let it stand for 20min, then weigh it. The calculation formula is Equation 1: (m2-m0) / m1×100%, where m0 is the mass of the empty tray, m1 is the mass of the sample, and m2 is the total mass of the aluminum foil tray and the remaining resin after baking.

[0073] Viscosity testing method: A rotational viscometer was used for testing.

[0074] Fineness test method: Ensure the sample is uniform and free of sediment, and keep the fineness meter and scraper clean and dry; pour a sufficient amount of sample into the deeper end of the wedge groove of the fineness meter, avoiding the formation of air bubbles; hold the scraper and scrape the sample smoothly towards the shallower end of the groove at a uniform speed and with appropriate pressure within 1-2 seconds; after scraping, observe the surface of the fineness meter plate at a 20-30 degree overhead angle within 3 seconds to find the position where particles gather or scratches begin to appear, and read the corresponding scale.

[0075] Curing shrinkage rate test method: Ensure the sample is uniform and free of air bubbles, and determine the sample density ρ by the water displacement method. 样品 The sample was placed at 1000 mi / cm 2 The resin sample was exposed to UV light of a certain intensity. The density ρsolid of the fully cured resin sample was calculated to obtain the resin's curing shrinkage rate. The calculation formula is Equation 2: Shrinkage rate (%) = (ρsolid)solid / (ρsolid) ... 样品 -ρ 固 ) / ρ 样品 ×100%.

[0076] The test results are shown in Table 1.

[0077] Table 1

[0078] As can be seen from the data in Table 1, the curing shrinkage rate of Examples 1-5 with added functional additives can be strictly controlled to ≤3.5%, with Example 5 having a curing shrinkage rate of less than 3.2%, while the curing shrinkage rate of Comparative Example 1 without added functional additives is greater than 4.5%. This fully demonstrates that the introduction of specific functional additives in this invention has a significant effect on reducing the curing shrinkage rate, and can effectively avoid problems such as circuit deformation caused by excessive shrinkage.

[0079] 2. The photosensitive resin compositions provided in the various embodiments and comparative examples are used to prepare solder resist dry films, wherein the preparation method includes the following steps: (1) Coating: The compounded photosensitive resin composition is uniformly coated onto the carrier film using a doctor blade coating machine. The film is dried in an oven and the film thickness is controlled at 35 μm. A release film is then pressed onto the dry film to prepare a solder resist dry film (DFSR) made of a bottom carrier film, a middle photosensitive layer film and an upper release film. (2) Film application: Peel off the outer release film of the DFSR and use a hot roller laminator to evenly apply the DFSR onto the test substrate; (3) Exposure: Using negative film process, a light source of a certain wavelength and energy is used for exposure in an exposure machine. The exposed area undergoes photocuring reaction and cross-linking is formed between unsaturated functional groups in acid-modified oligomers, photopolymer monomers, etc., to complete the transfer of DFSR circuit.

[0080] (4) Development: After exposure, use 1% Na2CO3 solution to develop at 30°C. Unexposed areas can be developed, retaining the required solder mask lines.

[0081] (5) Post-curing: The developed DFSR is then heat-cured at a certain temperature. Specific process conditions are shown in Table 2. Table 2

[0082] The samples prepared in each embodiment and comparative example were tested for hardness, chemical resistance, photosensitivity, adhesion, and resolution. Hardness testing method: Fix the sample on a horizontal platform and use a set of pencils ranging from soft to hard (4B, 3B, 2B, B, HB, F, H, 2H, 3H, 4H, 5H, 6H) to scratch the dry film surface at a 45-degree angle with a force of approximately 10N. The highest hardness level that does not scratch the film is the hardness of the dry film.

[0083] Chemical resistance test method: At room temperature, add 2-3 drops of dichloromethane solution to the fully exposed test plate and leave it for 45-60 seconds. Wipe the plate with a clean, uncontaminated white lint-free cloth and observe whether the cloth is stained and whether the dry film surface shows signs of dissolution, loss of gloss, or stickiness.

[0084] The photosensitivity test method is as follows: Prepare a Stouffer 21-level negative exposure scale and expose the test plate to different energies. After development under the same development conditions, find the minimum exposure energy at 9.5 photosensitive levels, which corresponds to the photosensitivity of the DFSR. The lower the energy value to reach 9.5 photosensitive levels, the stronger the photosensitivity of the dry film and the faster the curing speed.

[0085] The adhesion test method is as follows: Use a special cross-cutting tool to draw a 1mm × 1mm grid on the film layer, penetrating to the substrate. After cleaning away debris with a soft brush, apply special adhesive tape and press it firmly. Hold one end of the tape and quickly peel it off at a 60-degree angle. Observe the coating peeling at the edges of the grid and rate the grade according to the standard chart (grade 0 is the best, grade 5 is the worst, and grade ≤1 is usually required).

[0086] The resolution test method is as follows: After the sample is coated and exposed, it is developed using a 1% Na2CO3 solution at 30℃. Pre-set film with different line widths and line spacings is used for exposure. After development, the finest image that is clear, completely preserved, and without undercutting is observed under a metallographic microscope, which is the resolution of the DFSR.

[0087] The test results are shown in Table 3.

[0088] Table 3

[0089] As can be seen from the table above, the hardness, chemical resistance, photosensitivity, adhesion, resolution, and other properties of Examples 1-5 of this application are all superior to the comparative examples without any added functional additives.

[0090] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A photocurable resin, characterized by, The raw materials for preparation include, by weight fraction: 500-700 parts of epoxy resin, 2-4 parts of catalyst, 2-4 parts of polymerization inhibitor, 50-100 parts of acrylic acid, 90-150 parts of acid anhydride, 40-60 parts of functional additive, 600-900 parts of solvent.

2. The photocurable resin according to claim 1, characterized in that, The functional additive includes at least one of a tertiary amine compound containing a hydroxyl group and a nitrogen-containing heterocyclic polyhydroxy compound.

3. The photocurable resin according to claim 2, characterized in that, The tertiary amine compound containing a hydroxyl group includes one or more of diethanolamine, methyldiethanolamine, and phenyldiethanolamine.

4. The photocurable resin according to claim 2, characterized by The nitrogen-containing heterocyclic polyhydroxy compound includes at least one of a pyridine polyhydroxy compound and an indole polyhydroxy compound.

5. The light-cured resin of claim 1, wherein, The epoxy resin includes one or more of a glycidyl ether epoxy resin, a glycidyl ester epoxy resin, and a glycidyl amine epoxy resin.

6. The light-cured resin of claim 1, wherein, The catalyst includes at least one of a tertiary amine catalyst, a quaternary ammonium salt catalyst, and a metal complex catalyst.

7. The light-cured resin of claim 1, wherein, The acid anhydride includes one or more of maleic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, tetrahydrophthalic anhydride, fumaric anhydride, benzoic anhydride, pyromellitic dianhydride, and trimellitic anhydride.

8. A method of producing the photocurable resin according to any one of claims 1 to 7, characterized by, At least the following steps are included: S1, after heating and stirring 90-95 wt% of the solvent and the epoxy resin to be uniform, sequentially adding a mixed solution of the polymerization inhibitor and the functional additive and the acrylic acid, and after the addition is completed, adding the catalyst and keeping warm for 35-40 h to obtain a mixed solution 1; S2, adding a mixed solution 2 of acid anhydride and the remaining solvent to the mixed solution 1 to obtain the photocuring resin.

9. A photosensitive resin composition, characterized by comprising: The raw materials for preparation of the photosensitive resin composition satisfy the following conditions: A, the raw materials for preparation include the photocuring resin according to any one of claims 1-7, or the photocuring resin prepared according to the preparation method of claim 8; B, the raw materials for preparation further include a film-forming resin, a thermosetting adhesive resin, a photoinitiator, a colorant, a filler, and an organic solvent.

10. Use of the photosensitive resin composition according to claim 9 in the preparation of a dry film for solder mask.

Images