Resin composition and application thereof

Abstract

The invention provides a resin composition and application thereof, and the resin composition comprises the following components by weight: 10-80 parts of alicyclic epoxy resin; 10-50 parts by weight of a curing agent; 1-200 parts by weight of a filler; the filler is a filler subjected to surface treatment by adopting a silane coupling agent as shown in a structural formula (1), in the structural formula (1), R is C1-C5 alkyl, and m is an integer of 1-5; molecular-level sufficient infiltration of the alicyclic epoxy resin on the surface of the filler is achieved, good combination is formed between the epoxy resin and the filler, the cavity defect causing electric field concentration is eliminated, and the voltage resistance and insulation reliability of a curing system are improved; and moreover, stable chemical bonding and stress transfer from the filler to the epoxy resin are realized, the stress can be efficiently transferred and dispersed, an interface is prevented from being damaged or falling off under thermal-mechanical stress, and the voltage resistance and insulation reliability of a curing system are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic materials, in particular to a resin composition and application thereof. BACKGROUND

[0002] With the rapid popularization of new energy electric vehicles (EV), the performance and reliability requirements of charging infrastructure are increasingly improved. As the core equipment of electric energy supply, the safety of charging piles is directly related to the stability of vehicles, users and power grids. In the design of the circuit board of the charging pile, insulation monitoring and safety protection are the key links to ensure the reliability and safety of the system. Since the charging pile often works in a high-voltage AC / DC environment (such as AC 220V / 380V or DC 400V or above), its circuit board must have excellent insulation voltage resistance performance to effectively prevent safety hazards caused by leakage, short circuit, arc breakdown or insulation failure.

[0003] At present, epoxy resin is widely used as the basic insulating material of copper-clad plate due to its good mechanical strength, electrical insulation, bonding performance and processing performance. In high-voltage application scenarios, traditional bisphenol A type epoxy resin and phenolic epoxy resin have long dominated due to their balanced comprehensive performance. However, such epoxy resins have low heat resistance and high water absorption, which can easily cause delamination degradation in high temperature and high humidity environments; in addition, the content of impurities such as ions in the epoxy resin is high, which further limits its applicability in high voltage environments. SUMMARY

[0004] The present application relates to the technical field of electronic materials, in particular to a resin composition and application thereof.

[0005] To achieve the above-mentioned application purposes, the present application adopts the following technical solutions: a resin composition, by weight, the resin composition comprises: cycloaliphatic epoxy resin: 10-80 parts by weight; curing agent: 10-50 parts by weight; filler: 1-200 parts by weight; The filler is a filler treated with a silane coupling agent represented by structural formula (1), Structural formula (1), wherein R is an alkyl group with 1-5 carbon atoms, and m is an integer from 1 to 5.

[0006] As a further improvement of the present application, the cycloaliphatic epoxy resin is selected from at least one of the compounds represented by structural formula (2), the compounds represented by structural formula (3) and the compounds represented by structural formula (4): Structural formula (2); Structural formula (3); Structural Formula (4), wherein m in Structural Formula (4) is an integer from 1 to 10.

[0007] As a further improvement of the present application, the content of chloride ions in the alicyclic epoxy resin is less than 40 ppm.

[0008] As a further improvement of the present application, the total content of chloride ions in the alicyclic epoxy resin and the curing agent is less than 20 ppm.

[0009] As a further improvement of the present application, the curing agent is selected from at least one of amine compounds, acid anhydride compounds, phenol compounds, active ester compounds, dicyanamide, cyanate compounds, and benzoxazine compounds.

[0010] As a further improvement of the present application, the curing agent contains at least acid anhydride compounds.

[0011] As a further improvement of the present application, the filler includes boehmite or / and magnesium oxide.

[0012] As a further improvement of the present application, the resin composition further contains 1-30 parts by weight of an aromatic epoxy resin.

[0013] As a further improvement of the present application, the aromatic epoxy resin is selected from at least one of phenol novolac type epoxy resin, trifunctional phenol type epoxy resin, tetrafunctional phenol type epoxy resin, naphthalene type epoxy resin, anthracene type epoxy resin, phenolphthalein type epoxy resin, phenoxy type epoxy resin, fluorene type epoxy resin, biphenyl type epoxy resin, and dicyclopentadiene type epoxy resin.

[0014] To achieve the above-mentioned object, the present application further provides an application of the above-mentioned resin composition in semi-cured sheet, laminated board, insulating film, insulating board, high-frequency high-speed copper-clad board, circuit substrate and electronic device.

[0015] Advantages: Compared with the prior art, the present application has the following advantages: The resin composition in the present application realizes the full molecular infiltration of the alicyclic epoxy resin to the surface of the filler by adding the filler treated by the alicyclic silane coupling agent to the alicyclic epoxy resin system, forms a good combination between the epoxy resin and the filler, effectively eliminates the air in the voids of the accumulated filler, and the voids between the fillers are easy to be filled with the resin and not easy to form cavities, fundamentally eliminates the cavity defects leading to the electric field concentration, improves the voltage resistance and insulation reliability of the cured system; and realizes the stable chemical bonding and stress transfer from the filler to the epoxy resin, can efficiently transfer and disperse the stress, prevents the interface from being damaged or peeled off under thermal-mechanical stress, that is, the interface between the filler and the epoxy resin is not easy to be damaged or peeled off, thereby improving the voltage resistance and insulation reliability of the cured system. Detailed Implementation

[0016] The following describes specific implementation methods of the embodiments of the present invention. It should be noted that those skilled in the art can make several improvements and modifications without departing from the principles of the embodiments of the present invention, and these improvements and modifications are also considered to be within the protection scope of the embodiments of the present invention.

[0017] In this specification, "comprising" or "containing" means that, in addition to the components described, the resin composition may contain other components that can impart different properties to the resin composition.

[0018] This invention provides a resin composition, which, by weight, comprises: Alicyclic epoxy resin: 10-80 parts by weight; Hardener: 10-50 parts by weight; Filler: 1-200 parts by weight; The filler is a filler surface-treated with the silane coupling agent shown in structural formula (1). Structural formula (1), where R is a C1-C5 alkyl group and m is an integer from 1 to 5.

[0019] The resin composition of this invention incorporates a filler surface-treated with an alicyclic silane coupling agent into an alicyclic epoxy resin system. Because the alicyclic structure at the organic end of the alicyclic silane coupling agent has a highly similar molecular polarity and configuration to that of the alicyclic epoxy resin, based on the principle of "like dissolves like," the wettability of the alicyclic epoxy resin on the filler surface is significantly improved. This achieves complete molecular-level wetting of the filler surface by the alicyclic epoxy resin, forming a better bond between the epoxy resin and the filler. This effectively eliminates air in the filler packing voids, and the voids between the fillers are easily filled with resin without forming cavities. This fundamentally eliminates void defects that lead to electric field concentration, improving the voltage resistance and insulation reliability of the cured system. Furthermore, the inorganic end of the silane coupling agent forms a strong Si-OM covalent bond with the hydroxyl groups on the filler surface through silanol groups. Combined with the organic end of the silane coupling agent, it embeds into the cured epoxy network through physical entanglement and synergistic reaction, achieving stable chemical bonding and stress transfer from the filler to the epoxy resin. It also forms a strong and tough bond with the alicyclic epoxy resin. This robust interfacial phase can efficiently transfer and disperse stress, preventing the interface from being damaged or detached under thermo-mechanical stress. That is, the interface between the filler and the epoxy resin is not easily damaged or detached, thereby improving the voltage resistance and insulation reliability of the cured system. Moreover, by inhibiting the migration of interfacial charge carriers, it fundamentally blocks the development path of leakage current and electrical dendrites.

[0020] The resin composition of this invention exhibits superior comprehensive performance through the synergistic effect of the aforementioned mechanisms: Firstly, it possesses excellent electrical insulation properties, including significantly improved dielectric strength (voltage withstand capability) and long-term insulation reliability, meeting the requirements of high-voltage applications; secondly, it demonstrates excellent thermo-mechanical properties, such as a high glass transition temperature (Tg), a low coefficient of thermal expansion (CTE), and enhanced toughness and flexural strength, ensuring the dimensional stability and structural integrity of the substrate under lead-free soldering and harsh environments. Therefore, this resin composition is an ideal material for manufacturing high-end PCB substrates for next-generation 5G communications, advanced computing, and IC packaging.

[0021] Specifically, after the resin composition of the present invention is cured, the resulting cured product / cured system can be used as a key insulating material to prepare intermediate materials including but not limited to prepreg, laminate, insulating film, insulating board, etc., and is ultimately widely used in high-frequency and high-speed copper-clad laminates, circuit boards and various electronic devices.

[0022] In one specific embodiment, the silane coupling agent represented by structural formula (1) may be Shin-Etsu Chemical's KBE-303 or KBM-303 or Ark Chemical's AC-68. Of course, it is not limited thereto.

[0023] Furthermore, this application does not impose any particular limitations on the surface treatment method for the filler. For example, surface treatment can be performed by methods such as impregnation or spraying to ensure that the silane coupling agent is in full contact with the filler surface to form better chemical bonds.

[0024] In a preferred embodiment, the filler comprises boehmite and / or magnesium oxide. When boehmite and / or magnesium oxide are used, the resulting cured product exhibits higher voltage resistance compared to the cured product formed from commonly used silica.

[0025] In a preferred embodiment, the metal ion content in the filler is less than 10 ppm. This further improves the insulation reliability of the final cured product and suppresses the decline in heat resistance and voltage withstand capability in high-temperature, high-humidity, and high-pressure environments.

[0026] Specifically, the metal ions are Na, K, Fe, and other metal ions.

[0027] In some optional embodiments, the filler, in addition to the boehmite and magnesium oxide mentioned above, also includes 5-60 parts by weight of other fillers. That is, 1-200 parts by weight of the filler contains 5-60 parts by weight of other fillers besides boehmite and magnesium oxide. This is to further reduce the thermal conductivity and CTE value of the final cured product.

[0028] Specifically, the other fillers are selected from at least one of silicon dioxide, aluminum nitride, boron nitride, silicon carbide, silicon nitride, titanium dioxide, aluminum oxide, aluminum hydroxide, magnesium hydroxide, calcium carbonate, zinc oxide, zirconium oxide, mica, boehmite, calcined talc, talc powder, and calcined kaolin.

[0029] Other fillers are also preferably surface-treated with alicyclic epoxy silane coupling agents.

[0030] In a preferred embodiment, the alicyclic epoxy resin is selected from at least one of the compounds shown in structural formula (2), structural formula (3), and structural formula (4): Structural formula (2); Structural formula (3); Structural formula (4), where m in structural formula (4) is an integer from 1 to 10. These alicyclic epoxy resins themselves have excellent voltage resistance, thus enabling the final cured product to have voltage resistance.

[0031] In a preferred embodiment, the total chloride ion content in the alicyclic epoxy resin and the curing agent is less than 20 ppm. The resin composition of this invention further limits the total chloride ion content in the alicyclic epoxy resin and the curing agent to less than 20 ppm, i.e., strictly controlling the chloride ion content. This chemically eliminates the active ion source that leads to electrochemical migration, effectively preventing ion migration phenomena that may occur under high temperature, high humidity, and DC electric field conditions, and eliminating the risk of insulation degradation or short circuits caused by the formation of conductive filaments. At the same time, it significantly reduces the conductivity of the cured material in humid environments, and ensures that the cured material maintains extremely high insulation resistance and dielectric strength under high temperature, high humidity, and continuous DC electric field conditions. It also avoids the corrosion of the metal layer and insulation layer by chloride ions, thereby effectively improving the insulation reliability of the substrate in high temperature / high humidity / high voltage environments, and further improving the heat resistance and peel strength after high temperature treatment. It avoids adverse phenomena such as board explosion and delamination when the voltage in the substrate rises. In other words, it improves the voltage resistance, insulation reliability, heat resistance, and water absorption of the epoxy resin curing system, comprehensively improving the long-term service life and reliability of the substrate under harsh high-voltage conditions, making it suitable for use in safety equipment fields such as charging piles in high-voltage environments.

[0032] Furthermore, the chloride ion content was detected by the standard GB / T 4618.1-2008 method.

[0033] Specifically, the total chloride ion content in the alicyclic epoxy resin and the curing agent is calculated according to the following formula: Total chloride ion content = (A × α) + (B × β) / (A + B); where A is the weight of the alicyclic epoxy resin, α is the chloride ion content of the alicyclic epoxy resin (ppm), B is the weight of the curing agent (g), and β is the chloride ion content in the curing agent (ppm).

[0034] Furthermore, the chloride ion content in the alicyclic epoxy resin is less than 40 ppm. This avoids a decrease in the substrate's voltage resistance, heat resistance, and weather resistance under high voltage environments. Moreover, by controlling the chloride ion content in the alicyclic epoxy resin to be less than 40 ppm, the total chloride ion content in the alicyclic epoxy resin and the curing agent is ensured to be less than 20 ppm from the raw material stage. Tests have shown that when the chloride ion content in the alicyclic epoxy resin exceeds 40 ppm or the total chloride ion content in the alicyclic epoxy resin and the curing agent exceeds 20 ppm, the substrate's voltage resistance, heat resistance, and weather resistance significantly decrease under high voltage environments.

[0035] In a preferred embodiment, the chloride ion content in the alicyclic epoxy resin is less than 20 ppm. This further improves the voltage resistance, insulation reliability, and heat resistance of the epoxy resin curing system.

[0036] In some optional embodiments, the curing agent is selected from at least one of amine compounds, acid anhydride compounds, phenolic resins, reactive ester compounds, dicyandiamide, cyanate ester compounds, and benzoxazine compounds.

[0037] Specifically, the amine compound is selected from at least one of unsubstituted phenylenediamine, methylphenylenediamine, dimethylphenylenediamine, trimethylphenylenediamine, tetramethylphenylenediamine, diaminopyridine, diaminodiphenylmethane, diaminobenzophenone, diaminodiphenyl ether, diaminodiphenyl sulfone, diaminobiphenyl, diaminodiphenyl sulfone, diaminodiphenyl sulfone, diaminodiphenyl sulfone, diaminodiphenyl sulfone, diaminodiphenyl sulfone, diaminodiphenyl sulfone, diaminodiphenyl naphthalene, diaminodiphenyl fluorene, and diaminoanthraquinone.

[0038] The acid anhydride compound is a maleic anhydride compound.

[0039] The benzoxazine compound is selected from at least one of allyl-containing benzoxazine resins, bisphenol A type benzoxazine resins, bisphenol F type benzoxazine resins, diamine type benzoxazine resins, phenolphthalein type benzoxazine resins, dicyclopentadiene type benzoxazine resins, or bisphenol fluorene type benzoxazine resins.

[0040] The cyanate compound is selected from at least one of bisphenol A cyanate resin, bisphenol F cyanate resin, bisphenol M cyanate, dicyclopentadiene cyanate resin, or phenolic phenolic cyanate resin.

[0041] In a preferred embodiment, the curing agent contains at least an acid anhydride compound. In a specific embodiment, the curing agent may contain only an acid anhydride compound. In another specific embodiment, the curing agent contains a composition of an acid anhydride compound and other compounds, including but not limited to amine compounds, phenolic resins, reactive ester compounds, dicyandiamide, cyanate ester compounds, and benzoxazine compounds. The acid anhydride compound can react with epoxy groups to form ester groups, thereby increasing the number of ester groups in the final cured product and further improving the voltage resistance of the cured product.

[0042] In a further preferred embodiment, the curing agent contains a styrene-maleic anhydride compound.

[0043] In one specific embodiment, the resin composition further contains 1-30 parts by weight of aromatic epoxy resin, which can effectively inhibit the decrease in heat resistance of the cured product and reduce the water absorption rate of the cured product, so that the cured product exhibits better long-term reliability under harsh environments such as high temperature and high humidity, greatly expanding its application prospects in fields such as electronic packaging and high-performance composite materials.

[0044] Specifically, the aromatic epoxy resin is at least one of phenolic epoxy resin, trifunctional phenolic epoxy resin, tetrafunctional phenolic epoxy resin, naphthalene epoxy resin, anthracene epoxy resin, phenolphthalein epoxy resin, phenoxy epoxy resin, fluorene epoxy resin, biphenyl epoxy resin, and dicyclopentadiene epoxy resin.

[0045] In a preferred embodiment, the aromatic epoxy resin is selected from naphthalene-type epoxy resins or biphenyl-type epoxy resins. When used in combination with high heat-resistant biphenyl-type or naphthalene-type epoxy resins, it can suppress the decrease in the heat resistance of the overall cured product and maintain high voltage resistance.

[0046] In one optional embodiment, the resin composition further comprises 0.01-5 parts by weight of a catalyst. Specifically, the catalyst may be selected from any one or a combination of at least two of imidazole compounds, organophosphorus compounds, and tertiary amines. The imidazole compounds include any one or a combination of at least two of 2-methylimidazole, 2-methyl-4-ethylimidazole, 2-undecylimidazole, 2-phenylimidazole, and 1-cyanoethyl-2-ethyl-4-methylimidazole. The organophosphorus compounds include tributylphosphine and / or triphenylphosphine. The tertiary amine includes benzyldimethylamine.

[0047] In some optional embodiments, the resin composition further includes 5-50 parts by weight of a flame retardant. Without significantly affecting the original dielectric and mechanical properties of the resin system, the fire safety level of the cured product is significantly improved through the synergistic mechanism of the flame retardant. This provides crucial safety assurance for the final substrate and other components operating in high-voltage, high-current environments such as charging piles, greatly reducing the risk of fires caused by electrical faults.

[0048] Specifically, the flame retardant is selected from at least one of bromine-based flame retardants, phosphorus-based flame retardants, nitrogen-based flame retardants, organosilicon flame retardants, and organometallic salt flame retardants.

[0049] In one optional embodiment, the brominated flame retardant is selected from at least one of decabromodiphenyl ether, decabromodiphenyl ethane, brominated styrene, and tetrabromophthalamide. The phosphorus-based flame retardant is selected from condensed phosphate esters, phosphoric acid, hypophosphite, phosphorus oxide, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, and 10-(2,5-dihydroxyphenyl)-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide. (m is an integer from 1 to 5) 10-Phenyl-9,10-dihydro-9-oxa-10-phosphenanthrene-10-oxide, tris(2,6-dimethylphenyl)phosphine, phosphazene, modified phosphazene. Wherein, the DOPO group is... .

[0050] In a preferred embodiment, the flame retardant is selected from at least one of condensed phosphate esters, hypophosphites, or bisDOPO compounds, wherein the bisDOPO compounds are the aforementioned compounds containing two DOPO groups.

[0051] In one alternative embodiment, the resin composition further includes 0.1-10 parts by weight of dye.

[0052] Specifically, the dye may be a fluorescent dye or a black dye. The fluorescent dye may be a pyrazoline compound, and the black dye may be at least one of the following: liquid or powdered carbon black, pyridine complexes, azo complexes, quinone compounds, zirconium nitride, titanium oxide, titanium nitride, black talc, cobalt-chromium-chromium metal oxides, azazine, or phthalocyanine.

[0053] The present invention also provides an application of the above-mentioned resin composition in a prepreg, that is, the present invention also provides a prepreg comprising a reinforcing material and the above-mentioned resin composition wrapped around the surface of the reinforcing material.

[0054] The reinforcing material is selected from at least one of natural fibers, organic synthetic fibers, organic fabrics, and inorganic fabrics.

[0055] Preferably, the reinforcing material is glass fiber cloth, and the glass fiber cloth preferably uses open fiber cloth or flat cloth. More preferably, the glass fiber cloth is E glass fiber cloth, S glass fiber cloth or Q glass fiber cloth.

[0056] Specifically, when the reinforcing material is glass fiber cloth, the glass fiber cloth generally needs to undergo chemical treatment to improve the interfacial bonding between the resin composition and the glass fiber cloth. The main method of chemical treatment is coupling agent treatment, and the coupling agent used is preferably an alicyclic epoxy silane coupling agent to provide good interfacial bonding.

[0057] The method for preparing the prepreg is as follows: The aforementioned resin composition was dissolved in a solvent to prepare a gel solution; The reinforcing material is immersed in the above-mentioned adhesive solution to coat the reinforcing material. Then, the immersed reinforcing material is taken out, heated and dried to obtain the semi-cured sheet.

[0058] In one specific embodiment, the impregnated reinforcing material is baked at 100°C to 180°C for 1 min to 15 min, and the semi-cured sheet is obtained after drying.

[0059] Specifically, the solvent may be selected from at least one of acetone, butanone, toluene, methyl isobutyl ketone, N,N-dimethylformamide, N,N-dimethylacetamide, ethylene glycol methyl ether, propylene glycol methyl ether, benzene, toluene, xylene, and cyclohexane.

[0060] The amount of solvent added is not specifically limited in this invention. The amount of solvent added is selected by those skilled in the art based on their experience, as long as the resulting adhesive solution reaches a suitable viscosity for use.

[0061] The present invention also provides a laminate and a high-frequency, high-speed copper-clad laminate, comprising at least one of the aforementioned prepreg sheets and a metal foil. The metal foil is disposed on at least one surface of the prepreg sheet or a composite sheet formed by stacking multiple prepreg sheets.

[0062] In the embodiment where the laminate / high-frequency high-speed copper clad laminate includes at least two of the above-mentioned prepreg sheets, the at least two prepreg sheets are stacked and bonded together by heating and pressurizing to form a composite sheet, and then metal foil is bonded to one or both sides of the composite sheet by heating and pressurizing to form the laminate / high-frequency high-speed copper clad laminate.

[0063] Specifically, the preparation steps of the laminate / high-frequency high-speed copper clad laminate are as follows: a metal foil is applied to one or both sides of a prepreg, or at least two prepregs are stacked to form a composite sheet, and then a metal foil is applied to one or both sides of the composite sheet, and hot-pressed to obtain the laminate / high-frequency high-speed copper clad laminate.

[0064] The pressing conditions for the above-mentioned laminate / high-frequency high-speed copper clad laminate are: pressing at a pressure of 0.2 to 2 MPa and a temperature of 150°C to 250°C for 2 to 4 hours.

[0065] Specifically, the number of the prepreg sheets can be determined by the required thickness of the laminate, and one or more sheets can be used.

[0066] The metal foil can be copper foil or aluminum foil, and its material is not limited. The thickness of the metal foil is also not particularly limited; for example, 5μm, 8μm, 12μm, 18μm, 35μm, or 70μm are all acceptable.

[0067] The present invention also provides an insulating board comprising at least one of the aforementioned prepreg sheets.

[0068] The present invention also provides an insulating film comprising a carrier film and the aforementioned resin composition coated thereon. This insulating film maintains excellent mechanical strength and electrical insulation properties even after long-term thermal aging, and its thermal index (TI) is significantly improved compared to conventional systems, thereby enhancing its service life and operational reliability in high-temperature environments.

[0069] Specifically, the insulating film is prepared by the following method: the aforementioned resin composition is dissolved in a solvent to form an adhesive solution, which is then coated onto a carrier film. After the carrier film coated with the adhesive solution is heated and dried, the insulating film is obtained.

[0070] In one specific embodiment, the carrier film coated with the adhesive is baked at 100°C to 160°C for 3 to 10 minutes, and the insulating film is obtained after drying.

[0071] The solvent is selected from at least one of acetone, butanone, toluene, methyl isobutyl ketone, N,N-dimethylformamide, N,N-dimethylacetamide, ethylene glycol methyl ether, propylene glycol methyl ether, benzene, toluene, xylene, and cyclohexane.

[0072] The carrier film is selected from at least one of PET film, PP film, PE film, and PVC film.

[0073] The present invention also provides a circuit board, the circuit board comprising one or more of the aforementioned prepreg, laminate, insulating board, and insulating film.

[0074] The present invention also provides an electronic device, which includes the aforementioned circuit board. The circuit board has high heat resistance, excellent voltage resistance, and high insulation reliability, which together ensure that the electronic device can withstand long-term electrical, thermal and environmental stress impacts in high-voltage application scenarios such as charging piles, thereby providing the terminal product with higher operational safety, longer service life and more stable power load capacity.

[0075] The present invention will be described in detail below with reference to specific embodiments; of course, it should be understood that the embodiments in the present invention are not limited to these embodiments.

[0076] Examples 1-4 and Comparative Examples 1-3: The components and contents of the resin compositions of Examples 1-4 and Comparative Examples 1-3 are shown in Table 1 below: Table 1: Ingredients of the Resin Composition

[0077] Specifically, the information on each component involved in Table 1 above is shown in Table 2 below: Table 2

[0078] The prepregs corresponding to Examples 1-4 and Comparative Examples 1-3 were prepared using conventional methods, specifically as follows: Dilute the components and their corresponding contents in Table 1 with an appropriate amount of solvent to prepare a glue solution with a solid content of 60wt%. E-glass fiber cloth was sequentially immersed in the adhesive solutions obtained in Examples 1-4 and Comparative Examples 1-3. After immersion, it was removed and placed in a 160°C forced-air drying oven for 3-6 minutes to prepare a semi-cured sheet.

[0079] Preparation of sample laminates for performance evaluation: (1) Preparation of laminate The prepregs prepared in Examples 1-4 and Comparative Examples 1-3 were cut to 300×300mm respectively. Then, an electrolytic copper foil was placed on each side of the prepreg, and they were stacked into a certain structure. They were then pressed in a vacuum hot press to obtain a laminate / copper clad laminate.

[0080] Performance evaluation methods: (1) PS (peel strength): The peel strength between the metal capping layer and the prepreg was tested according to the "post-thermal stress" test conditions in IPC-TM-650 2.4.8. (2) Soldering heat resistance: A 50×50mm sample with copper on both sides was immersed in solder at 288℃, and the time for the sample to separate into air bubbles was recorded; (3) Glass transition temperature (Tg): DSC instrument was used, and the heating rate was 10℃ / min; (4) Withstand voltage test: AC20kV 500V / s 60s 5mA, 2×106 120um 1 / 1(RTF), 85℃ / 85%RH treatment for 1000h, holding voltage 8000V; (5) PCT (high pressure cooking test) 2 atm, 121℃: 6H, immersion time in solder at 288℃ is greater than 30min; (6) Water absorption rate (%) after 6H of PCT: The water absorption rate after PCT cooking is calculated according to the method of IPC-TM-6502.6.2.1; (7) Volume resistivity: IPC-TM-650, C-96 / 35 / 90; (8) Substantive defects: The standard method specified in IPC-TM-650 is used to test whether there are defects such as voids, dried flowers, white lines, etc. in the substrate by visual inspection or slicing.

[0081] The properties of the laminates obtained using the prepregs in Examples 1-4 and Comparative Examples 1-3 are shown in Table 3 below.

[0082] Table 3

[0083] Example 1 and Comparative Example 1 were compared in parallel. The resin composition of Example 1 used filler surface-treated with a silane treatment agent of structural formula (1), while Comparative Example 1 used filler surface-treated with an aminosilane coupling agent. Comparing the performance of the laminates prepared by the two examples, it can be seen that, compared to Comparative Example 1, the laminate prepared from the resin composition of Example 1 has higher peel strength, higher heat resistance, excellent voltage resistance, better damp heat resistance reliability, lower water absorption, and better electrical insulation performance. The laminate prepared from the resin composition of Example 1 is more stable and has better insulation under high temperature and high humidity conditions. Furthermore, the internal quality of the laminate prepared from the resin composition of Example 1 is also better, ensuring the density of the final cured structure and the reliability of long-term use.

[0084] A parallel comparison was made between Example 1 and Comparative Example 3. In Example 1, the chloride ion content of the epoxy resin was less than 20 ppm, and the total chloride ion content was 8.9 ppm, less than 20 ppm. In Comparative Example 3, the chloride ion content of one type of epoxy resin was 55 ppm, greater than 40 ppm, and the total chloride ion content was 22.1 ppm, greater than 20 ppm. The performance comparison shows that, compared to Comparative Example 3, the laminate prepared from the resin composition of Example 1 has superior voltage resistance, superior damp heat resistance, lower water absorption, and superior electrical insulation properties. The laminate prepared from the resin composition of Example 1 is more stable and has better insulation properties under high temperature and high humidity environments.

[0085] Example 4 and Comparative Example 2 were compared in parallel. The resin composition in Example 4 used a filler surface-treated with a silane treatment agent of structural formula (1), while Comparative Example 2 used a filler surface-treated with an aminosilane coupling agent. Comparing the performance of the laminates prepared by the two, it can be seen that, compared to Comparative Example 2, the laminate prepared with the resin composition of Example 4 has higher peel strength, higher heat resistance, excellent voltage resistance, better damp heat resistance reliability, lower water absorption, and better electrical insulation performance. The laminate prepared with the resin composition of Example 4 is more stable in high temperature and high humidity environments and has better insulation. Furthermore, the internal quality of the laminate prepared with the resin composition of Example 4 is also better, ensuring the density of the final cured structure and the reliability of long-term use.

[0086] As can be seen, the resin composition of this invention, by adding fillers surface-treated with alicyclic silane coupling agents to the alicyclic epoxy resin system, achieves full molecular-level wetting of the filler surface by the alicyclic epoxy resin, forming a good bond between the epoxy resin and the filler. This effectively eliminates air in the gaps between the fillers, and the gaps between the fillers are easily filled with resin and do not easily form voids, fundamentally eliminating void defects that lead to electric field concentration, and improving the voltage resistance and insulation reliability of the cured system. Furthermore, it achieves stable chemical bonding and stress transfer from the filler to the epoxy resin, which can efficiently transfer and disperse stress, preventing the interface from being damaged or detached under thermo-mechanical stress. That is, the interface between the filler and the epoxy resin is not easily damaged or detached, thereby improving the voltage resistance and insulation reliability of the cured system.

[0087] It should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0088] The detailed descriptions listed above are merely specific descriptions of feasible embodiments of the present invention, and are not intended to limit the scope of protection of the present invention. All equivalent embodiments or modifications made without departing from the spirit of the present invention should be included within the scope of protection of the present invention.

Claims

1. A resin composition, characterized by comprising: The resin composition comprises, by weight: an alicyclic epoxy resin: 10 to 80 parts by weight; a curing agent: 10 to 50 parts by weight; a filler: 1 to 200 parts by weight; the filler is a filler treated with a silane coupling agent represented by Structural Formula (1), Formula (1), wherein R is a C1-C5 alkyl group and m is an integer from 1 to 5.

2. The resin composition according to claim 1, characterized by the alicyclic epoxy resin is selected from at least one of a compound represented by Structural Formula (2), a compound represented by Structural Formula (3), and a compound represented by Structural Formula (4): Structure (2); Formula (3); Formula (4), wherein m in Formula (4) is an integer from 1 to 10.

3. The resin composition according to claim 1, characterized by the alicyclic epoxy resin has a chloride ion content of less than 40 ppm.

4. The resin composition according to claim 1, characterized by the total chloride ion content in the alicyclic epoxy resin and the curing agent is less than 20 ppm.

5. The resin composition according to claim 1, characterized by the curing agent is selected from at least one of an amine compound, an acid anhydride compound, a phenol compound, an active ester compound, a dicyandiamide, a cyanate compound, and a benzoxazine compound.

6. The resin composition according to claim 5, characterized by the curing agent contains at least an acid anhydride compound.

7. The resin composition according to claim 1, characterized by the filler includes boehmite or / and magnesium oxide.

8. The resin composition according to any one of claims 1 to 7, characterized by the resin composition further contains 1 to 30 parts by weight of an aromatic epoxy resin.

9. The resin composition according to claim 8, characterized by the aromatic epoxy resin is selected from at least one of a phenol novolac type epoxy resin, a trifunctional phenol type epoxy resin, a tetrafunctional phenol type epoxy resin, a naphthalene type epoxy resin, an anthracene type epoxy resin, a phenolphthalein type epoxy resin, a phenoxy type epoxy resin, a fluorene type epoxy resin, a biphenyl type epoxy resin, and a dicyclopentadiene type epoxy resin.

10. Use of the resin composition according to any one of claims 1 to 9 in a prepreg, a laminate, an insulating film, an insulating board, a high-frequency high-speed copper clad laminate, a circuit substrate, and an electronic device.

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