Radioactive contamination prevention coating and preparation method thereof

By preparing an epoxy resin-based anti-radiation coating, the problems of complex equipment disassembly and personnel irradiation in the existing technology are solved, achieving a highly efficient anti-radiation contamination effect with a long coating life and significant anti-pollution effect.

CN121628513APending Publication Date: 2026-03-10CHINA INST FOR RADIATION PROTECTION
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-11-18
Publication Date
2026-03-10

AI Technical Summary

Technical Problem

Existing technologies require disassembling equipment, have complex structures, increase personnel exposure doses, and lack targeted anti-contamination measures when reducing radioactive contamination.

Method used

Organosilicon-modified epoxy resin was prepared by reacting epoxy resin, monohydroxy polydimethylsiloxane, ethyl acetate and p-toluenesulfonic acid, and then combined with a curing agent to form an anti-radiation contamination coating. The coating consists of a top layer and a bottom layer to enhance adhesion.

Benefits of technology

It effectively reduces the deposition of radioactive materials on the surface of metal pipes, lowers the level of radioactive pollution, and has a long coating life and a high rate of protection against radioactive contamination.

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Abstract

The invention relates to an anti-radioactive contamination coating and a preparation method thereof, and the preparation method of the anti-radioactive contamination coating comprises the following steps: manufacturing a surface layer which is formed by carrying out a reaction on epoxy resin, monohydroxy polydimethylsiloxane, ethyl acetate and p-toluenesulfonic acid to prepare organic silicon modified epoxy resin and curing the organic silicon modified epoxy resin; the weight ratio of the epoxy resin to the ethyl acetate to the monohydroxy polydimethylsiloxane to the p-toluenesulfonic acid is (50-100): (25-125): 25: 1. According to the radioactive contamination prevention coating and the preparation method, deposition of surface radioactive contamination is reduced.
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Description

Technical Field

[0001] This invention relates to the field of anti-radiation coating technology, and in particular to an anti-radiation contamination coating and its preparation method. Background Technology

[0002] Currently, nuclear facilities primarily employ in-service decontamination to reduce radioactive contamination levels. While this method is relatively effective, it presents several technical challenges: ① It requires the disassembly of most equipment, and the decontamination process is lengthy; ② The decontamination areas are structurally complex and difficult to clean; ③ Decontamination increases the radiation dose to personnel; ④ Decontamination waste requires secondary treatment. Current anti-contamination coatings mainly increase surface energy and contact angle, allowing moisture to roll off quickly. However, for radioactive contamination, there is a lack of specific research on reducing radioactive contamination deposition.

[0003] How to obtain anti-radiation contamination coatings has become a technical problem that urgently needs to be solved in the industry. Summary of the Invention

[0004] To address the shortcomings of existing technologies, the present invention aims to provide an anti-radiation contamination coating and its preparation method, thereby reducing the deposition of radioactive contaminants on surfaces.

[0005] To achieve the above objectives, this application provides a method for preparing an anti-radiation contamination coating, comprising: The top layer is made by reacting epoxy resin, monohydroxy polydimethylsiloxane, ethyl acetate and p-toluenesulfonic acid to obtain organosilicon modified epoxy resin, and then curing it. The weight ratio of epoxy resin, ethyl acetate, monohydroxy polydimethylsiloxane, and p-toluenesulfonic acid is 50-100:25-125:25:1.

[0006] Preferably, the epoxy resin is preheated at 80°C for 30-50 minutes, and then reacted with ethyl acetate, monohydroxy polydimethylsiloxane and p-toluenesulfonic acid to obtain organosilicon-modified epoxy resin.

[0007] Preferably, the reaction formula for the organosilicon-modified epoxy resin involving ethyl acetate, monohydroxy polydimethylsiloxane, and p-toluenesulfonic acid is as follows: .

[0008] Preferably, the curing time is not less than 12 hours.

[0009] Preferably, the curing is achieved by adding a curing agent to an organosilicon-modified epoxy resin and curing it, wherein the curing agent is diethylenetriammonium; The weight ratio of epoxy resin to curing agent is 2:1.

[0010] Preferably, it also includes: The base layer is made by mixing and curing epoxy resin, ethyl acetate, and curing agent. The bottom layer is placed between the top layer and the substrate.

[0011] Preferably, the weight ratio of epoxy resin, ethyl acetate and curing agent is 2:4:1.

[0012] Preferably, the curing agent in the bottom layer is diethylenetriammonium.

[0013] Preferably, the curing time of the bottom layer is 8-12 hours.

[0014] To achieve the above objectives, the anti-radiation contamination coating for metal pipes provided in this application is prepared using the aforementioned method for preparing anti-radiation contamination coatings for metal pipes.

[0015] The above technical solution has excellent anti-radioactive contamination performance; after coating the surface of the metal pipe with the anti-radioactive contamination coating of the present application embodiment, the bonding between radioactive substances and the surface is reduced, the deposition of radioactive substances on the surface of the metal pipe is reduced, and thus the level of radioactive contamination inside the metal pipe is reduced; the bottom layer increases the adhesion to the substrate. Other features and advantages of this application will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing this application. Attached Figure Description

[0016] The accompanying drawings are provided to further illustrate the present application and form part of the specification. Together with the embodiments of the present application, they serve to explain the present application but do not constitute a limitation thereof. In the drawings: Figure 1 This is a schematic diagram of the preparation method of the anti-radiation contamination coating according to an embodiment of this application; Figure 2 This is a static contact angle diagram of the anti-radiation contamination coating according to an embodiment of this application. Detailed Implementation

[0017] The preferred embodiments of this application are described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit this application.

[0018] Embodiments of this application will now be described in more detail with reference to the accompanying drawings. While some embodiments of this application are shown in the drawings, it should be understood that this application can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of this application. It should be understood that the drawings and embodiments of this application are for illustrative purposes only and are not intended to limit the scope of protection of this application.

[0019] The term "comprising" and its variations as used herein are open-ended inclusions, meaning "including but not limited to". The term "based on" means "at least partially based on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". Definitions of other terms will be given in the description below.

[0020] It should be noted that the terms "first" and "second" may be used in this application only to distinguish different devices, components or parts, and are not used to define the order of functions performed by these devices, components or parts or their interdependence.

[0021] It should be noted that the terms "one" and "more" used in this application are illustrative rather than restrictive, and those skilled in the art should understand that, unless explicitly stated otherwise in the context, they should be understood as "one or more". "More" should be understood as two or more.

[0022] The method for preparing the anti-radiation contamination coating of this application includes: The top layer is made by reacting epoxy resin, monohydroxy polydimethylsiloxane, ethyl acetate and p-toluenesulfonic acid to obtain organosilicon modified epoxy resin, and then curing it. The weight ratio of epoxy resin, ethyl acetate, monohydroxy polydimethylsiloxane, and p-toluenesulfonic acid is 50-100:25-125:25:1.

[0023] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0024] Example 1 Figure 1 This is a schematic diagram of the preparation method of the anti-radiation contamination coating according to an embodiment of this application. Figure 2 This is a static contact angle diagram of the anti-radiation contamination coating according to an embodiment of this application, such as... Figures 1-2As shown, the method for preparing the anti-radiation contamination coating in this application embodiment is used to prepare an anti-radiation contamination coating for metal pipes, for example, applied to the surface of tools, robots, high-radiation sites, equipment, and metal pipes that may be contaminated with radioactive pollution.

[0025] First, in step 101, a base layer is made, which is a mixture of epoxy resin, ethyl acetate, and curing agent, and then cured.

[0026] In one exemplary embodiment, the substrate selected in this application is stainless steel, such as the types of stainless steel commonly used in nuclear facilities, including 304, 304L, 316 and 316L.

[0027] In one exemplary embodiment, in order to increase the adhesion between the anti-radiation contamination coating and the metal pipe, an underlayer is provided, which is formed by mixing and curing epoxy resin, ethyl acetate and curing agent; for example, epoxy resin, ethyl acetate and curing agent are mixed and stirred evenly and sprayed onto a stainless steel substrate to form the underlayer, and then left to cure.

[0028] In one exemplary embodiment, the curing agent is diethylenetriammonium.

[0029] In one exemplary embodiment, the weight ratio of epoxy resin, ethyl acetate, and curing agent is 2:4:1.

[0030] In one exemplary embodiment, the curing time is 8-12 hours, for example, a curing time of 12 hours is typically chosen.

[0031] Step 102: Prepare the top layer, which is an organosilicon-modified epoxy resin prepared by reacting epoxy resin, monohydroxy polydimethylsiloxane, ethyl acetate and p-toluenesulfonic acid, and then curing it.

[0032] In one exemplary embodiment, the surface layer can be understood as a layer that directly faces the radioactive contamination.

[0033] In one exemplary embodiment, the surface layer is disposed on the upper surface of the bottom layer.

[0034] In one exemplary embodiment, an organosilicon-modified epoxy resin is prepared by reacting epoxy resin, monohydroxy polydimethylsiloxane, ethyl acetate, and a catalyst.

[0035] In one exemplary embodiment, the catalyst is p-toluenesulfonic acid.

[0036] In one exemplary embodiment, the weight ratio of epoxy resin, ethyl acetate, monohydroxy polydimethylsiloxane, and p-toluenesulfonic acid is 50-100:25-125:25:1.

[0037] In one exemplary embodiment, the epoxy resin is a bisphenol A type epoxy resin.

[0038] In one exemplary embodiment, when preparing the silicone-modified epoxy resin, the epoxy resin needs to be preheated at 80°C for 30-50 minutes.

[0039] In one exemplary embodiment, the silicone-modified epoxy resin needs to be reacted at 60°C for 30 minutes.

[0040] In one exemplary embodiment, a curing agent is added to the silicone-modified epoxy resin and stirred until homogeneous. The curing agent is diethylenetriammonium, and the curing time is not less than 12 hours, for example, a curing time of 12 hours is typically selected.

[0041] In one exemplary embodiment, the weight ratio of epoxy resin to curing agent is 2:1.

[0042] In one exemplary embodiment, the reaction of ethyl acetate, monohydroxy polydimethylsiloxane, and p-toluenesulfonic acid with the organosilicon-modified epoxy resin is as follows: .

[0043] In one exemplary embodiment, the anti-radioactive contamination coating prepared by the method of this application embodiment has a coating life of more than one year and an anti-radioactive contamination rate of not less than 71.2%.

[0044] Example 2 In one exemplary embodiment, 20g of epoxy resin, 10g of curing agent, and 40g of ethyl acetate are mixed and stirred until homogeneous. This mixture is then sprayed onto the surface of a substrate and cured at room temperature for 12 hours to obtain the underlayer of an anti-radiation contamination coating.

[0045] In one exemplary embodiment, the curing agent in the substrate is diethylenetriammonium.

[0046] In one exemplary embodiment, 20g of epoxy resin was preheated at 80°C for 40min, and then reacted with 10g of monohydroxy polydimethylsiloxane, 10g of ethyl acetate and 0.4g of catalyst at 60°C for 30min to obtain organosilicon modified epoxy resin.

[0047] In one exemplary embodiment, the catalyst is p-toluenesulfonic acid.

[0048] In one exemplary embodiment, the epoxy resin is a bisphenol A type epoxy resin.

[0049] In one exemplary embodiment, 10g of curing agent is added to the silicone-modified epoxy resin obtained after the reaction, and after stirring evenly, it is sprayed onto the bottom surface and cured at room temperature for 12 hours to obtain an anti-fouling coating top layer.

[0050] In one exemplary embodiment, the curing agent in the surface layer is diethylenetriammonium.

[0051] The anti-radioactive contamination coating prepared in this embodiment has a surface contact angle of 96.9°, a coating life of more than one year, and an anti-radioactive contamination rate of 74.3%.

[0052] Example 3 In one exemplary embodiment, 20g of epoxy resin, 10g of curing agent, and 40g of ethyl acetate are mixed and stirred until homogeneous. This mixture is then sprayed onto the surface of a substrate and cured at room temperature for 12 hours to obtain an anti-fouling coating underlayer.

[0053] In one exemplary embodiment, the curing agent in the substrate is diethylenetriammonium.

[0054] In one exemplary embodiment, 20g of epoxy resin was preheated at 80°C for 40min, and then reacted continuously at 60°C for 30min with 10g of monohydroxy polydimethylsiloxane, 50g of ethyl acetate and 0.4g of p-toluenesulfonic acid catalyst to obtain organosilicon modified epoxy resin.

[0055] In one exemplary embodiment, the catalyst is p-toluenesulfonic acid.

[0056] In one exemplary embodiment, the epoxy resin is a bisphenol A type epoxy resin.

[0057] In one exemplary embodiment, 10g of curing agent is added to the silicone-modified epoxy resin obtained after the reaction, and after stirring evenly, it is sprayed onto the bottom surface and cured at room temperature for 12 hours to obtain an anti-fouling coating top layer.

[0058] In one exemplary embodiment, the curing agent in the surface layer is diethylenetriammonium.

[0059] The anti-radioactive contamination coating prepared in this embodiment has a surface contact angle of 96.8°, a coating life of more than one year, and an anti-radioactive contamination rate of 74.5%.

[0060] Example 4 In one exemplary embodiment, 20g of epoxy resin, 10g of curing agent, and 40g of ethyl acetate are mixed and stirred until homogeneous. This mixture is then sprayed onto the surface of a substrate and cured at room temperature for 12 hours to obtain an anti-fouling coating underlayer.

[0061] In one exemplary embodiment, the curing agent in the substrate is diethylenetriammonium.

[0062] In one exemplary embodiment, 20g of epoxy resin was preheated at 80°C for 40min, and then reacted continuously at 60°C for 30min with 10g of monohydroxy polydimethylsiloxane, 30g of ethyl acetate and 0.4g of p-toluenesulfonic acid catalyst to obtain organosilicon modified epoxy resin.

[0063] In one exemplary embodiment, the catalyst is p-toluenesulfonic acid.

[0064] In one exemplary embodiment, the epoxy resin is a bisphenol A type epoxy resin.

[0065] In one exemplary embodiment, 10g of curing agent is added to the silicone-modified epoxy resin obtained after the reaction, and after stirring evenly, it is sprayed onto the bottom surface and cured at room temperature for 12 hours to obtain an anti-fouling coating top layer.

[0066] In one exemplary embodiment, the curing agent in the surface layer is diethylenetriammonium.

[0067] The anti-radioactive contamination coating prepared in this embodiment has a surface contact angle of 96.8°, a coating life of more than one year, and an anti-radioactive contamination rate of 74.2%.

[0068] Example 5 In one exemplary embodiment, 20g of epoxy resin, 10g of curing agent, and 40g of ethyl acetate are mixed and stirred until homogeneous. This mixture is then sprayed onto the surface of a substrate and cured at room temperature for 12 hours to obtain an anti-fouling coating underlayer.

[0069] In one exemplary embodiment, the curing agent in the substrate is diethylenetriammonium.

[0070] In one exemplary embodiment, 30g of epoxy resin was preheated at 80°C for 40min, and then reacted continuously at 60°C for 30min with 10g of monohydroxy polydimethylsiloxane, 10g of ethyl acetate, and 0.4g of catalyst to obtain organosilicon-modified epoxy resin.

[0071] In one exemplary embodiment, the catalyst is p-toluenesulfonic acid.

[0072] In one exemplary embodiment, the epoxy resin is a bisphenol A type epoxy resin.

[0073] In one exemplary embodiment, 15g of curing agent is added to the silicone-modified epoxy resin obtained after the reaction, and after stirring evenly, it is sprayed onto the bottom surface and cured at room temperature for 12 hours to obtain an anti-fouling coating top layer.

[0074] In one exemplary embodiment, the curing agent in the surface layer is diethylenetriammonium.

[0075] The anti-radioactive contamination coating prepared in this embodiment has a surface contact angle of 92.3°, a coating life of more than one year, and an anti-radioactive contamination rate of 72.5%.

[0076] Example 6 In one exemplary embodiment, 20g of epoxy resin, 10g of curing agent, and 40g of ethyl acetate are mixed and stirred until homogeneous. This mixture is then sprayed onto the surface of a substrate and cured at room temperature for 12 hours to obtain an anti-fouling coating underlayer.

[0077] In one exemplary embodiment, the curing agent in the substrate is diethylenetriammonium.

[0078] In one exemplary embodiment, 30g of epoxy resin was preheated at 80°C for 40min, and then reacted with 10g of monohydroxy polydimethylsiloxane, 50g of ethyl acetate, and 0.4g of p-toluenesulfonic acid catalyst at 60°C for 30min to obtain organosilicon-modified epoxy resin.

[0079] In one exemplary embodiment, the catalyst is p-toluenesulfonic acid.

[0080] In one exemplary embodiment, the epoxy resin is a bisphenol A type epoxy resin.

[0081] In one exemplary embodiment, 15g of curing agent is added to the silicone-modified epoxy resin obtained after the reaction, and after stirring evenly, it is sprayed onto the bottom surface and cured at room temperature for 12 hours to obtain an anti-fouling coating top layer.

[0082] In one exemplary embodiment, the curing agent in the surface layer is diethylenetriammonium.

[0083] The anti-radioactive contamination coating prepared in this embodiment has a surface contact angle of 92.5°, a coating life of more than one year, and an anti-radioactive contamination rate of 72.6%.

[0084] Example 7 In one exemplary embodiment, 20g of epoxy resin, 10g of curing agent, and 40g of ethyl acetate are mixed and stirred until homogeneous. This mixture is then sprayed onto the surface of a substrate and cured at room temperature for 12 hours to obtain an anti-fouling coating underlayer.

[0085] In one exemplary embodiment, the curing agent in the substrate is diethylenetriammonium.

[0086] In one exemplary embodiment, 30g of epoxy resin was preheated at 80°C for 40min, and then reacted continuously at 60°C for 30min with 10g of monohydroxy polydimethylsiloxane, 30g of ethyl acetate and 0.4g of p-toluenesulfonic acid catalyst to obtain organosilicon modified epoxy resin.

[0087] In one exemplary embodiment, the catalyst is p-toluenesulfonic acid.

[0088] In one exemplary embodiment, the epoxy resin is a bisphenol A type epoxy resin.

[0089] In one exemplary embodiment, 15g of curing agent is added to the silicone-modified epoxy resin obtained after the reaction, and after stirring evenly, it is sprayed onto the bottom surface and cured at room temperature for 12 hours to obtain an anti-fouling coating top layer.

[0090] In one exemplary embodiment, the curing agent in the surface layer is diethylenetriammonium.

[0091] The anti-radioactive contamination coating prepared in this embodiment has a surface contact angle of 92.7°, a coating life of more than one year, and an anti-radioactive contamination rate of 73.0%.

[0092] Example 8 In one exemplary embodiment, 20g of epoxy resin, 10g of curing agent, and 40g of ethyl acetate are mixed and stirred until homogeneous. This mixture is then sprayed onto the surface of a substrate and cured at room temperature for 12 hours to obtain an anti-fouling coating underlayer.

[0093] In one exemplary embodiment, the curing agent in the substrate is diethylenetriammonium.

[0094] In one exemplary embodiment, 40g of epoxy resin was preheated at 80°C for 40min, and then reacted with 10g of monohydroxy polydimethylsiloxane, 10g of ethyl acetate, and 0.4g of p-toluenesulfonic acid catalyst at 60°C for 30min to obtain organosilicon-modified epoxy resin.

[0095] In one exemplary embodiment, the catalyst is p-toluenesulfonic acid.

[0096] In one exemplary embodiment, the epoxy resin is a bisphenol A type epoxy resin.

[0097] In one exemplary embodiment, 20g of curing agent is added to the prepared silicone-modified epoxy resin, stirred evenly, and then sprayed onto the bottom surface. After curing at room temperature for 12 hours, an anti-fouling coating top layer is obtained.

[0098] In one exemplary embodiment, the curing agent in the surface layer is diethylenetriammonium.

[0099] The anti-radioactive contamination coating prepared in this embodiment has a surface contact angle of 90.4°, a coating life of more than one year, and an anti-radioactive contamination rate of 71.2%.

[0100] Example 9 In one exemplary embodiment, 20g of epoxy resin, 10g of curing agent, and 40g of ethyl acetate are mixed and stirred until homogeneous. This mixture is then sprayed onto the surface of a substrate and cured at room temperature for 12 hours to obtain an anti-fouling coating underlayer.

[0101] In one exemplary embodiment, the curing agent in the substrate is diethylenetriammonium.

[0102] In one exemplary embodiment, 40g of epoxy resin was preheated at 80°C for 40min, and then reacted with 10g of monohydroxy polydimethylsiloxane, 50g of ethyl acetate, and 0.4g of p-toluenesulfonic acid catalyst at 60°C for 30min to obtain organosilicon-modified epoxy resin.

[0103] In one exemplary embodiment, the catalyst is p-toluenesulfonic acid.

[0104] In one exemplary embodiment, the epoxy resin is a bisphenol A type epoxy resin.

[0105] In one exemplary embodiment, 20g of curing agent is added to the prepared silicone-modified epoxy resin, stirred evenly, and then sprayed onto the bottom surface. After curing at room temperature for 12 hours, an anti-fouling coating top layer is obtained.

[0106] In one exemplary embodiment, the curing agent in the surface layer is diethylenetriammonium.

[0107] The anti-radioactive contamination coating prepared in this embodiment has a surface contact angle of 90.8°, a coating life of more than one year, and an anti-radioactive contamination rate of 71.4%.

[0108] Example 10 In one exemplary embodiment, 20g of epoxy resin, 10g of diethylenetriammonium curing agent, and 40g of ethyl acetate are mixed and stirred until homogeneous. This mixture is then sprayed onto the substrate surface and cured at room temperature for 12 hours to obtain an anti-fouling coating underlayer.

[0109] In one exemplary embodiment, the curing agent in the substrate is diethylenetriammonium.

[0110] In one exemplary embodiment, 40g of epoxy resin was preheated at 80°C for 40min, and then reacted with 10g of monohydroxy polydimethylsiloxane, 30g of ethyl acetate, and 0.4g of p-toluenesulfonic acid catalyst at 60°C for 30min to obtain organosilicon-modified epoxy resin.

[0111] In one exemplary embodiment, the catalyst is p-toluenesulfonic acid.

[0112] In one exemplary embodiment, the epoxy resin is a bisphenol A type epoxy resin.

[0113] In one exemplary embodiment, 20g of curing agent is added to the prepared silicone-modified epoxy resin, stirred evenly, and then sprayed onto the bottom surface. After curing at room temperature for 12 hours, an anti-fouling coating top layer is obtained.

[0114] In one exemplary embodiment, the curing agent in the surface layer is diethylenetriammonium.

[0115] The anti-radioactive contamination coating prepared in this embodiment has a surface contact angle of 90.3°, a coating life of more than one year, and an anti-radioactive contamination rate of 71.2%.

[0116] Example 11 In one exemplary embodiment, the present application provides a radioactive anti-contamination coating for metal pipes, which is prepared using the preparation method of the radioactive anti-contamination coating for metal pipes described in the above embodiments.

[0117] It will be understood by those skilled in the art that the above are merely preferred embodiments of this application and are not intended to limit this application. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A method for producing a contamination-resistant coating, characterized by, The preparation method of the anti-contamination coating comprises the following steps: Preparation of a surface layer, which is prepared by reacting epoxy resin, monohydroxy polydimethylsiloxane, ethyl acetate and p-toluene sulfonic acid, and then curing; The weight ratio of the epoxy resin, the ethyl acetate, the monohydroxy polydimethylsiloxane and the p-toluene sulfonic acid is 50-100:25-125:25:

1.

2. The method of producing a contamination resistant coating according to claim 1, wherein The epoxy resin is preheated at 80℃ for 30-50 minutes, and then reacts with the ethyl acetate, the monohydroxy polydimethylsiloxane and the p-toluene sulfonic acid to prepare the organosilicon modified epoxy resin.

3. The method of producing a contamination resistant coating according to claim 1, wherein The reaction formula of the reaction of the ethyl acetate, the monohydroxy polydimethylsiloxane and the p-toluene sulfonic acid is: 。 4. The method of producing a contamination resistant coating according to claim 1, wherein The curing time is not less than 12 hours.

5. The method of producing a contamination resistant coating according to claim 1, wherein The curing is achieved by adding a curing agent to the organosilicon modified epoxy resin, and the curing agent is diethylene triamine; The weight ratio of the epoxy resin and the curing agent is 2:

1.

6. The method of producing a contamination resistant coating according to claim 1, wherein Further comprising: Preparation of a bottom layer, which is prepared by mixing epoxy resin, ethyl acetate and a curing agent, and then curing; The bottom layer is arranged between the surface layer and a base material.

7. The method of producing a contamination resistant coating according to claim 6, wherein The weight ratio of the epoxy resin, the ethyl acetate and the curing agent is 2:4:

1.

8. The method of producing a contamination resistant coating according to claim 6, wherein The curing agent in the bottom layer is diethylene triamine.

9. The method of producing a contamination resistant coating according to claim 6, wherein The curing time of the bottom layer is 8-12 hours.

10. A metal pipe anti-radioactive contamination coating, characterized by, The anti-contamination coating is prepared by the preparation method of any one of claims 1-9.