Light shielding member

Abstract

A light shielding member (1) is provided with: a metal core layer (2); and a low reflection layer (4) covering the core layer (2). The area of the core layer (2) in plan view is 85% or less with respect to the area of the light shielding member (1) in plan view. And the 5-degree specular reflectance of the low-reflection layer (4) is lower than that of the core layer (2).

Description

Technical Field

[0001] This invention relates to light-shielding components. Background Technology

[0002] Previously, as a light-shielding component, there are known light-shielding components that have an optical multilayer film on the surface of a substrate (for example, see Patent Document 1 below).

[0003] The substrate contains resin. The optical multilayer film consists of a light-absorbing layer and a dielectric layer. The light-absorbing layer and the dielectric layer contain metal or metal oxide.

[0004] Existing technical documents Patent documents Patent Document 1: International Publication Publication No. 2021 / 193652 Summary of the Invention

[0005] The problem that the invention aims to solve On the other hand, there is a need for further weight reduction in light-shielding components.

[0006] This invention provides a lightweight and excellent light-shielding component.

[0007] Technical solutions for solving the problem The present invention [1] is a light-shielding component comprising: a metal core layer; and a low-reflection layer covering the core layer, wherein the area of ​​the core layer when viewed from above is less than 85% of the area of ​​the light-shielding component when viewed from above, and the 5° specular reflectance of the low-reflection layer is lower than the 5° specular reflectance of the core layer.

[0008] This structure allows for the lightweighting of the light-shielding components.

[0009] The present invention [2] includes the light-shielding member described in [1] above, wherein the outer shape of the core layer is dissimilar to the outer shape of the light-shielding member.

[0010] This structure allows for reliable lightweighting of the shading components and enables free design of their shape.

[0011] The present invention [3] includes the light-shielding member described in [1] or [2] above, wherein the light-shielding member has a through hole extending through the thickness direction. When viewed from the thickness direction, the core layer has a peripheral portion of a through hole, which is disposed around the through hole.

[0012] This structure can improve the mechanical strength of the area surrounding the through hole.

[0013] The present invention [4] includes the light-shielding member described above [3], wherein the core layer has a main skeleton portion that extends from the periphery of the through hole to the opposite side of the through hole relative to the periphery of the through hole.

[0014] With this structure, the mechanical strength can be improved through the main frame.

[0015] The present invention [5] includes the light-shielding member described above [4], wherein the core layer has a sub-skeleton portion that extends from the main skeleton portion in a direction that intersects the direction in which the main skeleton portion extends.

[0016] Based on this structure, the mechanical strength can be improved through the sub-frame.

[0017] The present invention [6] includes the light-shielding member described above [5], wherein a plurality of the sub-frame portions are arranged at intervals in the direction in which the main frame portion extends.

[0018] Based on this structure, the mechanical strength can be further improved through the sub-frame.

[0019] The present invention [7] includes the light-shielding member described above [3], wherein the core layer has a plurality of core-substrate through holes extending through the thickness direction.

[0020] This structure allows for a reliable reduction in the weight of the light-shielding components.

[0021] The present invention [8] includes the light-shielding member described above [7], wherein a plurality of the core-sub-holes are regularly arranged.

[0022] This structure enables lightweighting and suppresses irregular reductions in mechanical strength.

[0023] The present invention [9] includes any one of [1] to [8] above, wherein the light-shielding member further comprises a resin layer disposed between the core layer and the low-reflection layer.

[0024] This structure improves durability.

[0025] Invention Effects The light-shielding component according to the present invention can achieve lightweight design. Attached Figure Description

[0026] Figure 1 This is a top view of a light-shielding member as an embodiment of the present invention.

[0027] Figure 2 yes Figure 1 The AA section view of the light-shielding component shown.

[0028] Figure 3 yes Figure 1 A top view of the core layer in the light-shielding component shown.

[0029] Figure 4 express Figure 1 One embodiment of the manufacturing method of the light-shielding component shown. Figure 4 (A) indicates the first step in preparing the resin layer. Figure 4 (B) indicates the process of forming a seed layer on one side of the resin layer in the thickness direction during the second process. Figure 4 (C) indicates the process of configuring the core layer on one side of the seed layer in the thickness direction in the second process. Figure 4 (D) indicates the third process of coating the core layer with a resin layer. Figure 4 (E) indicates the process of coating the resin layer with a metal layer in the fourth process. Figure 4 (F) indicates the process of coating the resin layer with a low-reflection layer through a metal layer in the fourth process.

[0030] Figure 5 This illustrates a modified example of the light-shielding component of the present invention. Figure 5 (A) represents the first variant. Figure 5 (B) represents the second variation. Figure 5 (C) represents the third variation. Figure 5 (D) represents the fourth variation. Figure 5 (E) represents the fifth variation. Figure 5 F represents the sixth variation.

[0031] Figure 6 express Figure 1 A variation of the manufacturing method of the light-shielding component shown. Figure 6 (A) indicates the process of preparing a substrate containing a core layer in the first process. Figure 6 (B) indicates the process of preparing the core layer by etching away the substrate in the first process. Figure 6 (C) indicates the sixth process of coating the core layer with a resin layer. Figure 6 (D) indicates the seventh step of using a low-reflection layer to coat the resin layer.

[0032] Figure 7 This is a top view of a modified example of the light-shielding member of the present invention (a light-shielding member having a guide groove). Figure 7 (A) indicates a light-shielding component with a guide groove. Figure 7 (B) indicates that the core layer has a light-shielding component around the through hole and around the guide groove. Detailed Implementation

[0033] 1. Implementation Method Reference Figure 1 as well as Figure 2 An embodiment of the light-shielding member of the present invention will be described.

[0034] exist Figure 1 In the diagram, the vertical direction on the paper represents the minor axis. The upper part of the paper represents one side of the minor axis. The lower part of the paper represents the other side of the minor axis. Additionally, the horizontal direction on the paper represents the major axis, which is orthogonal to the minor axis. Specifically, refer to the directional arrows in each diagram.

[0035] like Figure 1 As shown, the light-shielding member 1 has an approximately elliptical shape when viewed from above.

[0036] like Figure 2 As shown, the light-shielding member 1 has a first main surface 11, a second main surface 12, an outer peripheral surface 13, and a through hole 14.

[0037] The first principal surface 11 is a flat surface.

[0038] The second main surface 12 is disposed opposite the first main surface 11 on the other side of the first main surface 11 in the thickness direction, spaced apart from it. The second main surface 12 is parallel to the first main surface 11. The second main surface 12 is a flat surface.

[0039] It should be noted that a flat surface refers to a surface that appears flat, such as allowing for minute bumps and undulations of less than 15 μm (the same applies below).

[0040] The outer peripheral surface 13 is continuous with the peripheral edge of the first main surface 11 and the peripheral edge of the second main surface 12. The outer peripheral surface 13 extends along the thickness direction. The outer peripheral surface 13 is a flat surface.

[0041] The through hole 14 extends through the thickness of the light-shielding member 1. By inserting a fixing member (not shown) through the through hole 14, the light-shielding member 1 can be rotated about the fixing member as a central axis. By rotating the light-shielding member 1, it is possible to adopt a light-shielding posture or a light-entry posture relative to the light-shielding object (not shown).

[0042] The through hole 14 has an inner circumferential surface 15.

[0043] The through hole 14 is a circular hole. If the through hole 14 is a circular hole, the rotational flexibility can be improved. The inner diameter of the through hole 14 is, for example, 50 μm to 1000 μm, preferably 100 μm to 500 μm.

[0044] The light-blocking component 1 at least blocks visible light.

[0045] The visible light transmittance (JIS 7375) of the light-shielding member 1 in the thickness direction is, for example, 1.0% or less, preferably 0.01% or less, and more preferably 0%.

[0046] The visible light specular reflectance of the first main surface 11, the second main surface 12, the outer peripheral surface 13, and the inner peripheral surface 15 of the light-shielding member 1 at 5° is, for example, 1.0% or less, preferably 0.5% or less, and also, for example, 0% or more.

[0047] It should be noted that the above-mentioned specular reflectance is determined by the average reflectance of visible light with wavelengths of 500nm to 600nm.

[0048] The flexural modulus of light-shielding member 1 (JIS 7171) is, for example, 10 GPa to 250 GPa, preferably 50 GPa to 200 GPa.

[0049] The thickness T of the light-shielding member 1 is, for example, 10 μm to 150 μm, preferably 20 μm to 100 μm, and more preferably 30 μm to 90 μm.

[0050] In detail, the thickness T of the light-shielding member 1 is, for example, 10 μm or more, preferably 20 μm or more, more preferably 30 μm or more, and also, for example, 150 μm or less, preferably 100 μm or less, more preferably 90 μm or less.

[0051] The length of the major axis of the light-shielding member 1 is, for example, 1.0 μm to 30.0 μm, preferably 3.0 μm to 10.0 μm.

[0052] The length of the short axis of the light-shielding member 1 is, for example, 0.5 μm to 15.0 μm, preferably 1.0 μm to 7.0 μm.

[0053] The light-shielding component 1 has a core layer 2, a resin layer 3, and a low-reflection layer 4.

[0054] <Core Layer> like Figure 2 and Figure 3 As shown, the core layer 2 is disposed approximately at the center of the light-shielding member 1 in the thickness direction. The core layer 2 extends in an orthogonal direction. The core layer 2 has a generally key-shaped appearance when viewed from above.

[0055] The core layer 2 has a first main surface 21, a second main surface 22, an outer peripheral surface 23, and a main through hole 24.

[0056] The first main surface 21 of the core is a flat surface.

[0057] The second main surface 22 of the core is disposed opposite to the first main surface 21 on the other side of the core in the thickness direction, spaced apart from it. The second main surface 22 of the core is parallel to the first main surface 21 of the core. The second main surface 22 of the core is a flat surface.

[0058] The outer peripheral surface 23 of the core is continuous with the peripheral edge of the first main surface 21 of the core and the peripheral edge of the second main surface 22 of the core. The outer peripheral surface 23 of the core is a flat surface.

[0059] Viewed from the thickness direction of the light-shielding member 1, the core main through hole 24 includes the through hole 14 and the resin through hole 34 (described later), and extends through the member in the thickness direction. The core main through hole 24 has a similar shape to the through hole 14. The core main through hole 24 and the through hole 14 share a common center.

[0060] The core main through hole 24 has a core inner circumferential surface 25.

[0061] The inner diameter of the core through hole 24 is, for example, 50 μm to 1000 μm, preferably 100 μm to 500 μm.

[0062] The ratio of the inner diameter of the through hole 14 to the inner diameter of the core main through hole 24 is, for example, 0.5 to 1.0, preferably 0.8 to 1.0.

[0063] In addition, such as Figure 3 As shown, when viewed from the thickness direction, the core layer 2 includes: a through-hole peripheral portion 26 disposed around the through-hole 14; and a main frame portion 27A extending from the through-hole peripheral portion 26 toward the opposite side of the through-hole 14 (the side in the long axis direction of the light-shielding member 1).

[0064] The peripheral portion 26 of the through hole has a generally annular shape when viewed from above. In detail, the peripheral portion 26 of the through hole shares a center with the through hole 14 and has a similar shape to the through hole 14.

[0065] The mechanical strength of the periphery 26 of the through hole can be improved. In particular, when the light-shielding member 1 is rotated about the fixed member as a central axis by inserting the fixing member (not shown) through the through hole 14, mechanical strength is required around the through hole 14. On the other hand, by improving the mechanical strength of the periphery 26 of the through hole, the mechanical strength around the through hole 14 can be improved.

[0066] The peripheral portion 26 of the through hole has an inner diameter larger than that of the through hole 14.

[0067] The inner diameter of the peripheral portion 26 of the through hole is the same as the inner diameter of the core main through hole 24.

[0068] The ratio of the inner diameter of the through hole 14 to the inner diameter of the peripheral portion 26 of the through hole is, for example, 0.5 to 1.0, preferably 0.8 to 1.0.

[0069] The main frame part 27 has a roughly rectangular shape (straight line shape) when viewed from above.

[0070] The length of the main frame portion 27 in the long axis direction is, for example, 1 mm to 28 mm, preferably 3 mm to 8 mm.

[0071] The outer shape of the core layer 2 is composed of the outer shape of the periphery 26 of the through hole (roughly ring-shaped when viewed from above) and the outer shape of the main frame 27 (roughly rectangular when viewed from above). That is, the outer shape of the core layer 2 is dissimilar to the outer shape of the light-shielding member 1 (roughly elliptical when viewed from above).

[0072] If the shape of the core layer 2 is dissimilar to the shape of the light-shielding member 1, the light-shielding member 1 can be reliably made lighter, and the shape of the light-shielding member 1 can be freely designed.

[0073] In addition, the area of ​​the core layer 2 when viewed from above is 85% or less, preferably 60% or less, more preferably 40% or less, and for example, more than 2%.

[0074] If the area of ​​the core layer 2 when viewed from above is below the aforementioned upper limit relative to the area of ​​the light-shielding member 1 when viewed from above, then the lightweighting is excellent.

[0075] If the area of ​​the core layer 2 when viewed from above exceeds the above-mentioned upper limit relative to the area of ​​the light-shielding member 1 when viewed from above, then the lightweighting is insufficient.

[0076] Furthermore, if the area of ​​the core layer 2 when viewed from above is above the aforementioned lower limit relative to the area of ​​the light-shielding member 1 when viewed from above, the mechanical strength can be improved.

[0077] The thickness T1 of the core layer 2 is, for example, 5 μm to 70 μm, preferably 10 μm to 30 μm.

[0078] In detail, from the viewpoint of improving rigidity, the thickness T1 of the core layer 2 is, for example, 5 μm or more, preferably 10 μm or more, and also, for example, 70 μm or less, preferably 30 μm or less.

[0079] When the thickness T of the light-shielding member 1 is set to 100%, the thickness T1 of the core layer 2 is, for example, 10% to 99%, preferably 15% to 97%.

[0080] In detail, when the thickness T of the light-shielding member 1 is set to 100%, from the viewpoint of improving rigidity, the thickness T1 of the core layer 2 is, for example, 10% or more, preferably 15% or more. In addition, from the viewpoint of lightweighting, the thickness T1 of the core layer 2 is, for example, 99% or less, preferably 97% or less.

[0081] The core layer 2 is made of metal. Examples of materials suitable for the core layer 2 include copper, copper alloys, stainless steel, aluminum, titanium, nickel, tantalum, and magnesium. Copper and stainless steel are preferred materials for the core layer 2.

[0082] The visible light specular reflectance of core layer 2 at 5° is, for example, 10% to 80%.

[0083] <Resin Layer> The resin layer 3 is disposed between the core layer 2 and the low-reflection layer 4.

[0084] The resin layer 3 has an elliptical shape when viewed from above, and has a similar shape to the light-shielding member 1.

[0085] The resin layer 3 covers the core layer 2. The resin layer 3 covers the first main surface 21, the second main surface 22, the outer peripheral surface 23, and the inner peripheral surface 25 of the core. The resin layer 3 improves durability.

[0086] The resin layer 3 has a first resin main surface 31, a second resin main surface 32, a resin outer peripheral surface 33, and a resin through hole 34.

[0087] The first main surface 31 of the resin is a flat surface. The first main surface 31 of the resin covers the first main surface 21 of the core.

[0088] The second resin main surface 32 is disposed opposite the first resin main surface 31 on the other side of its thickness direction, spaced apart from it. The second resin main surface 32 is parallel to the first resin main surface 31. The second resin main surface 32 is a flat surface. The second resin main surface 32 covers the second core main surface 22.

[0089] The resin outer peripheral surface 33 is continuous with the peripheral edge of the resin first main surface 31 and the peripheral edge of the resin second main surface 32. The resin outer peripheral surface 33 has a similar shape to the outer peripheral surface 13. The resin outer peripheral surface 33 covers the core outer peripheral surface 23.

[0090] Viewed from the thickness direction of the light-shielding member 1, the resin through-hole 34 includes the through-hole 14 and is contained within the core main through-hole 24, and extends through the core in the thickness direction. The resin through-hole 34 has a similar shape to the through-hole 14. The resin through-hole 34 and the through-hole 14 share a common center.

[0091] The resin through hole 34 has a resin inner circumferential surface 35. The resin inner circumferential surface 35 covers the core inner circumferential surface 25.

[0092] The thickness T2 of the resin layer 3 is, for example, 3 μm to 50 μm, preferably 5 μm to 20 μm.

[0093] In detail, from the viewpoint of improving durability, the thickness T2 of the resin layer 3 is, for example, 3 μm or more, preferably 5 μm or more, and also, for example, 500 μm or less, preferably 20 μm or less.

[0094] The thickness T2 of the resin layer 3 is thinner than the thickness T1 of the core layer 2. When the thickness T1 of the core layer 2 is set to 100%, the thickness T2 of the resin layer 3 is, for example, 40% to 90%, preferably 50% to 70%.

[0095] When the thickness T of the light-shielding member 1 is set to 100%, the thickness T2 of the resin layer 3 is, for example, 5% to 40%, preferably 10% to 30%.

[0096] In detail, when the thickness T of the light-shielding member 1 is set to 100%, from the viewpoint of improving durability, the thickness T2 of the resin layer 3 is, for example, 5% or more, preferably 10% or more, and also, for example, 40% or less, preferably 30% or less.

[0097] Resins can be used as the material for resin layer 3. Examples of resins include acrylic resins, epoxy resins, polyimides (e.g., photosensitive polyimides), and silicone resins. Polyimides are preferred as resins. That is, it is preferable that resin layer 3 contains polyimide. If resin layer 3 contains polyimide, it has excellent dimensional accuracy.

[0098] The visible light specular reflectance of resin layer 3 at 5° is, for example, 5% to 20%.

[0099] <Low-reflection layer> The low-reflection layer 4 covers the core layer 2 and the resin layer 3. Specifically, the low-reflection layer 4 covers the first resin main surface 31, the second resin main surface 32, the outer resin peripheral surface 33, and the inner resin peripheral surface 35.

[0100] In detail, as described above, the light-shielding member 1 has a first main surface 11, a second main surface 12, an outer peripheral surface 13, and a through hole 14 having an inner peripheral surface 15. That is, the low-reflection layer 4 has a first main surface 11, a second main surface 12, an outer peripheral surface 13, and an inner peripheral surface 15. The first main surface 11 is covered with a resin first main surface 31. The second main surface 12 is covered with a resin second main surface 32. The outer peripheral surface 13 is covered with a resin outer peripheral surface 33. The inner peripheral surface 15 is covered with a resin inner peripheral surface 35.

[0101] The 5° specular reflectance of the low-reflection layer 4 is lower than that of the core layer 2. The 5° specular reflectance of the low-reflection layer 4 is, for example, 1.0% or less, preferably 0.5% or less, and for example, 0% or more.

[0102] The thickness T3 of the low-reflection layer 4 is, for example, 0.01 μm to 30 μm, preferably 0.05 μm to 20 μm.

[0103] In detail, from the viewpoint of improving light-shielding performance, the thickness T3 of the low-reflection layer 4 is, for example, 0.01 μm or more, preferably 0.05 μm or more, for example, 30 μm or less, and preferably 20 μm or less.

[0104] When the thickness T1 of the core layer 2 is set to 100%, the thickness T3 of the low-reflection layer 4 is, for example, 0.1% to 150%, preferably 0.3% to 140%.

[0105] When the thickness T of the light-shielding member 1 is set to 100%, the thickness T3 of the low-reflection layer 4 is, for example, 0.05% to 40%, preferably 0.1% to 30%.

[0106] In detail, when the thickness T of the light-shielding member 1 is set to 100%, from the viewpoint of improving light-shielding performance, the thickness T3 of the low-reflection layer 4 is, for example, 0.05% or more, preferably 0.1% or more. In addition, from the viewpoint of lightweighting, the thickness T3 of the low-reflection layer 4 is, for example, 40% or less, preferably 30% or less.

[0107] The surface roughness Ra of the low-reflection layer 4 (arithmetic mean surface roughness according to JIS B 0601-2001) is, for example, 1.0 nm to 15000 nm, preferably 100 nm to 5000 nm.

[0108] Materials that can be used as the low-reflection layer 4 include, for example, resin compositions, metals and their oxides.

[0109] The resin composition contains resin, pigment, and filler. That is, when the material of the low-reflection layer 4 is a resin composition, the low-reflection layer 4 contains resin, pigment, and filler.

[0110] Examples of resins include acrylic resins, epoxy resins, polyimides, and polyamides. Acrylic resins are preferred as resins.

[0111] In the resin composition, the resin content is, for example, 20% to 80% by mass, preferably 30% to 70% by mass.

[0112] Examples of pigments include black pigments and gray pigments. Black pigments are preferred. Examples of black pigments include black dyes and black pigments. Examples of black dyes include carbon black and titanium-based pigments. Examples of black dyes include mixtures of dyes such as phthalocyanine blue, phthalocyanine green, monoazo yellow, diazo yellow, benzimidazolone yellow, quinacridone red, monoazo red, polyazo red, and perylene red. Black pigments are more preferred. Carbon black is even more preferred.

[0113] In the resin composition, the pigment content is, for example, 0.1% to 20% by mass, preferably 0.5% to 10% by mass.

[0114] In addition, the proportion of pigment relative to 100 parts by weight of resin is, for example, 1 to 50 parts by weight, preferably 5 to 30 parts by weight.

[0115] Examples of filler materials include acrylic microgels and silica. Acrylic microgels are preferred as filler materials.

[0116] The average particle size of the filler material is determined by laser diffraction scattering method, and is, for example, 1.0 μm or more, preferably 5.0 μm or more, and also, for example, 20.0 μm or less.

[0117] In the resin composition, the content of the filler material is, for example, 1% to 50% by mass, preferably 5% to 30% by mass.

[0118] The proportion of filler material relative to 100 parts by weight of resin is, for example, 5 to 50 parts by weight, preferably 10 to 40 parts by weight.

[0119] Furthermore, as detailed later, in the fourth process, when the low-reflection layer 4 is configured by electrodeposition coating, the low-reflection layer 4 contains the material of the metal layer M3.

[0120] Examples of metals and their oxides include titanium, nickel, chromium, niobium, and their oxides.

[0121] <Manufacturing Method of Light-Shielding Components> Reference Figure 4 (A) to (F) describe one embodiment of the manufacturing method of the light-shielding component.

[0122] The manufacturing method of the light-shielding component 1 includes: a first step of preparing a resin layer 3; a second step of placing a core layer 2 on one side of the resin layer 3 in the thickness direction; a third step of covering the core layer 2 with the resin layer 3; and a fourth step of covering the resin layer 3 with a low-reflection layer 4.

[0123] [First Process] In the first process, such as Figure 4 As shown in (A), resin layer 3 is prepared. Specifically, in order to prepare resin layer 3, firstly, substrate M1 is prepared.

[0124] The substrate M1 contains a metal that can be removed by etching. Examples of materials used for the substrate M1 include stainless steel.

[0125] Next, a resin layer 3 is deposited on one side of the substrate M1 in the thickness direction. Then, if the material of the resin layer 3 is a photosensitive resin, a solution of the resin layer 3 material (varnish) is applied to one side of the substrate M1 in the thickness direction to obtain a coating film. The coating film is then exposed and developed. Thus, a resin layer 3 is deposited on one side of the substrate M1 in the thickness direction. Alternatively, if the material of the resin layer 3 is not a photosensitive resin (in the case of a non-photosensitive resin), the resin layer 3 is deposited by printing a solution of the resin layer 3 material (varnish).

[0126] [Second Process] In the second process, such as Figure 4 As shown in (B), a core layer 2 is disposed on one side of the resin layer 3 in the thickness direction. Specifically, a seed layer M2 is first formed on one side of the resin layer 3 in the thickness direction by sputtering. Examples of materials for the seed layer M2 include chromium, copper, nickel, titanium, and alloys thereof. It should be noted that the seed layer M2 can be a single layer or multiple layers.

[0127] Next, as Figure 4 As shown in (C), firstly, a partially open resist R is disposed on one side of the substrate M1 in the thickness direction to form the core layer 2. On one side of the seed layer M2 exposed from the resist R in the thickness direction, the core layer 2 is disposed by electrolytic plating. According to the plating method, the core layer 2 can be reliably disposed.

[0128] [Third Process] In the third process, such as Figure 4 As shown in (D), the core layer 2 is coated with resin layer 3. Specifically, the first main surface 21, the second main surface 22, the outer peripheral surface 23, and the inner peripheral surface 25 of the core are coated with resin layer 3. The method of coating the first main surface 21, the second main surface 22, the outer peripheral surface 23, and the inner peripheral surface 25 of the core with resin layer 3 is the same as the first step described above.

[0129] Subsequently, substrate M1 is removed by etching. It should be noted that... Figure 4 In (D), the core layer 2 and the seed layer M2 are integrated to form the core layer 2.

[0130] [Fourth Process] In the fourth process, such as Figure 4 As shown in (E), a low-reflection layer 4 is used to cover the resin layer 3. Specifically, the low-reflection layer 4 covers the first resin main surface 31, the second resin main surface 32, the outer resin peripheral surface 33, and the inner resin peripheral surface 35.

[0131] As a method of using a low-reflection layer 4 to cover the first main surface 31, the second main surface 32, the outer peripheral surface 33, and the inner peripheral surface 35 of the resin, examples include electrodeposition coating, physical vapor deposition, and plating (e.g., electrolytic plating).

[0132] When the material of the low-reflection layer 4 is a resin composition, electrodeposition coating is the preferred coating method described above. Furthermore, when the material of the low-reflection layer 4 is a metal or its oxide, physical vapor deposition is the preferred coating method described above.

[0133] In the electrodeposition coating method, firstly, a metal layer M3 is used to coat the resin layer 3. Specifically, the metal layer M3 coats the first main surface 31, the second main surface 32, the outer peripheral surface 33, and the inner peripheral surface 35 of the resin.

[0134] Materials that can be used as the metal layer M3 include, for example, chromium, nickel, titanium, copper, nickel-chromium, tungsten, cobalt, and their alloys.

[0135] The materials of the metal layer M3 can be used alone or in combination with two or more materials.

[0136] Methods for coating the metal layer M3 include, for example, physical vapor deposition and electroless plating.

[0137] Examples of physical vapor deposition methods include vacuum vapor deposition, sputtering, and ion plating. Sputtering is a preferred physical vapor deposition method.

[0138] The metal layer M3 has a thickness of, for example, 1 nm to 1000 nm, preferably 10 nm to 500 nm. If the thickness of the metal layer M3 is above or above the lower limit mentioned above, the adhesion between the resin layer 3 and the low-reflection layer 4 can be improved.

[0139] The metal layer M3 can also be set to a single layer or multiple layers.

[0140] Next, as Figure 4 As shown in (F), the resin layer 3 is coated with a low-reflection layer 4 through a metal layer M3 using an electrodeposition coating method. Specifically, the first main surface 31, the second main surface 32, the outer peripheral surface 33, and the inner peripheral surface 35 of the resin are coated with the low-reflection layer 4 through the metal layer M3. It should be noted that in... Figure 4 In (F), a metal layer M3 is included and shown as a low-reflection layer 4.

[0141] By following the above steps, light-shielding component 1 is manufactured.

[0142] In addition, in the physical vapor deposition method (preferably sputtering method), the material of the low-reflection layer 4 is used as the vapor deposition source to form the low-reflection layer 4 covering the resin layer 3.

[0143] By following the above steps, light-shielding component 1 is manufactured.

[0144] 2. Effects In the light-shielding member 1, the area of ​​the core layer 2 when viewed from above is less than 85% of the area of ​​the light-shielding member 1 when viewed from above. Therefore, lightweighting can be achieved.

[0145] 3. Variations In the modified examples, the same reference numerals are used to mark the same components and processes as in the first embodiment, and detailed descriptions are omitted. Furthermore, unless otherwise specified, the modified examples can achieve the same effects as the first embodiment. Moreover, the first embodiment and the modified examples can be appropriately combined.

[0146] (First variation of the light-shielding component) In the above description, the core layer 2 has a through-hole periphery portion 26 and a main frame portion 27A, but as Figure 5 As shown in (A), the core layer 2 may also include a sub-framework portion 28A, which extends from the main framework portion 27A in a direction (minor axis direction) intersecting the direction in which the main framework portion 27A extends. Specifically, the sub-framework portion 28A extends from the main framework portion 27A to one side in the minor axis direction and to the other side in the minor axis direction.

[0147] According to the sub-frame part 28A, mechanical strength can be improved.

[0148] (Second variation of the light-shielding component) like Figure 5 As shown in (B), multiple sub-frame portions 28A may be arranged at intervals in the direction in which the main frame portion 27A extends.

[0149] This structure allows for further improvement in mechanical strength.

[0150] (Third variation of the light-shielding component) like Figure 5 As shown in (C), the core layer 2 may also include: a main skeleton portion 27B, which extends from the peripheral portion 26 of the through hole to the opposite side of the through hole 14 (the other side of the long axis direction of the light-shielding member 1 (i.e., the opposite side of the main skeleton portion 27A)); a sub-skeleton portion 28B, which extends from the main skeleton portion 27B in a direction intersecting the direction of extension of the main skeleton portion 27B (one side of the short axis direction and the other side of the short axis direction); and a main skeleton portion 27C, which extends from the peripheral portion 26 of the through hole to the opposite side of the through hole 14 (one side of the short axis direction and the other side of the short axis direction of the light-shielding member 1) relative to the peripheral portion 26 of the through hole.

[0151] This structure allows for further improvement in mechanical strength.

[0152] (Fourth variation of the light-shielding component) like Figure 5 As shown in (D), the core layer 2 may also include a frame portion 29, which is continuous with the ends of the main skeleton portion 27A, the main skeleton portion 27B, the main skeleton portion 27C, the sub-skeleton portion 28A, and the sub-skeleton portion 28B. The frame portion 29 has a generally elliptical ring shape when viewed from above.

[0153] Based on this structure, the mechanical strength can be further improved.

[0154] (Fifth variation of the light-shielding component) like Figure 5 As shown in (E), the core layer 2 can have a similar shape to the light-shielding member 1 and has a plurality of core-sub-through holes 30 extending in the thickness direction.

[0155] The core-part through hole 30 enables the light-shielding component 1 to be lightweight.

[0156] The inner diameter of the core auxiliary through hole 30 is smaller than that of the core main through hole 24.

[0157] The inner diameter of the core through hole 30 is, for example, 1 μm to 500 μm, preferably 10 μm to 100 μm.

[0158] The ratio of the inner diameter of the main through hole 24 to the inner diameter of the secondary through hole 30 is, for example, 0.01 to 0.5, preferably 0.01 to 0.1.

[0159] The number of core through holes 30 is not limited, for example, from 10 to 1,000,000.

[0160] The configuration of the core through hole 30 is not particularly limited, but it is preferred to be configured regularly (e.g., in a straight line or in an interlaced pattern).

[0161] This structure enables lightweighting and suppresses irregular reductions in mechanical strength.

[0162] (Sixth variation of the light-shielding component) In the above description, the core layer 2 has a through-hole periphery portion 26 and a main frame portion 27A, but as Figure 5 As shown in (F), the core layer 2 may also not have the main skeleton part 27A, but only the periphery part 26 of the through hole.

[0163] Based on this structure, further lightweighting can be achieved.

[0164] (A variation of the manufacturing method for a light-shielding component) Reference Figure 6 Examples of variations in the manufacturing method of the light-shielding component are described in (A) to (D).

[0165] The manufacturing method of the light-shielding component 1 includes: a fifth step, preparing a core layer 2; a sixth step, covering the core layer 2 with a resin layer 3; and a seventh step, covering the resin layer 3 with a low-reflection layer 4.

[0166] [Fifth Process] In the fifth process, such as Figure 6As shown in (A), core layer 2 is prepared. To prepare core layer 2, firstly, a substrate M made of the material described above for core layer 2 is prepared. Next, as... Figure 6 As shown in (B), the substrate M is etched to prepare the core layer 2. Specifically, the portion forming the core layer 2 is covered with an etching resist, and the substrate M exposed from the etching resist is removed by etching. Thus, the core layer 2 is prepared.

[0167] [Sixth Process] In the sixth process, such as Figure 6 As shown in (C), the core layer 2 is coated with resin layer 3. Specifically, the first main surface 21, the second main surface 22, the outer peripheral surface 23, and the inner peripheral surface 25 of the core are coated with resin layer 3. The method of coating the core layer 2 with resin layer 3 is the same as the first step described above.

[0168] [Seventh Process] In the seventh process, such as Figure 6 As shown in (D), the resin layer 3 is coated with a low-reflection layer 4. Specifically, the resin first main surface 31, the resin second main surface 32, the resin outer peripheral surface 33, and the resin inner peripheral surface 35 are coated with the low-reflection layer 4. The method of coating the resin layer 3 with the low-reflection layer 4 is the same as the fourth step described above.

[0169] By following the above steps, light-shielding component 1 is manufactured.

[0170] In addition, in the above description, the core layer 2 is prepared by etching the substrate M made of the material of the core layer 2. However, it is also possible to prepare the core layer 2 by placing the core layer 2 on the substrate M and then removing the substrate M by etching, based on the same steps as the second process described above.

[0171] like Figure 7 As shown in (A), the light-shielding member 1 can also have a guide groove 40 extending through the thickness direction. The guide groove 40 is a through hole extending through the thickness direction. The guide groove 40 ensures accurate rotation of the light-shielding member 1. The shape of the guide groove 40 is appropriately selected based on the rotation direction of the light-shielding member 1. Figure 7 In this configuration, the guide groove 40 is disposed separately from the through hole 14 along its long axis. The guide groove 40 has a top-view arc shape that shares the center of the through hole 14.

[0172] In addition, such as Figure 7 As shown in (B), when the light-shielding member 1 has a guide groove 40, when viewed from the thickness direction, the core layer 2 can also have a through-hole peripheral portion 26 disposed around the through-hole 14 and a guide groove peripheral portion 41 disposed around the guide groove 40 (a through-hole peripheral portion disposed around the through-hole). The guide groove peripheral portion 41 has a top-view arc shape that shares the center of the through-hole 14.

[0173] The mechanical strength of the guide groove periphery 41 can be improved. In particular, mechanical strength is required around the guide groove 40 when the rotation of the light-shielding member 1 is ensured by the guide groove 40. On the other hand, by improving the mechanical strength of the guide groove periphery 41, the mechanical strength around the guide groove 40 can be improved.

[0174] It should be noted that, in Figure 7 In (B), the core layer 2 has a through hole periphery 26 and a guide groove periphery 41, but it may also have only one of the through hole periphery 26 and the guide groove periphery 41.

[0175] In the above description, the light-shielding member 1 is composed of a core layer 2, a resin layer 3, and a low-reflection layer 4, but the structure of the light-shielding member 1 is not limited to the above embodiment. The light-shielding member 1 may also include components other than the core layer 2, the resin layer 3, and the low-reflection layer 4. For example, the light-shielding member 1 may have a sealing layer disposed between the core layer 2 and the resin layer 3 and / or between the resin layer 3 and the low-reflection layer 4.

[0176] Furthermore, in the above description, resin layer 3 covers the first main surface 21, the second main surface 22, the outer peripheral surface 23, and the inner peripheral surface 25 of the core, and low-reflection layer 4 covers the first main surface 31, the second main surface 32, the outer peripheral surface 33, and the inner peripheral surface 35 of the resin. However, it is sufficient that at least resin layer 3 covers the first main surface 21, the second main surface 22, and the outer peripheral surface 23 of the core, and low-reflection layer 4 covers the first main surface 31, the second main surface 32, and the outer peripheral surface 33 of the resin. In other words, it is permissible for resin layer 3 to cover the inner peripheral surface 25 of the core and low-reflection layer 4 not to cover the inner peripheral surface 35 of the core; alternatively, it is permissible for resin layer 3 not to cover the inner peripheral surface 25 of the core and low-reflection layer 4 to cover the inner peripheral surface 25 of the core; or it is permissible for neither resin layer 3 nor low-reflection layer 4 to cover the inner peripheral surface 25 of the core.

[0177] Alternatively, the light-shielding component 1 may not have a resin layer 3 and may instead consist of a core layer 2 and a low-reflection layer 4.

[0178] Furthermore, in the above description, the light-shielding member 1 has a generally elliptical shape when viewed from above, but the shape of the light-shielding member 1 is not particularly limited and can be appropriately changed according to its use and purpose.

[0179] It should be noted that the above-described invention is provided as an illustrative embodiment of the present invention, but this is merely illustrative and should not be interpreted as limiting. Modifications of the invention that are obvious to those skilled in the art are included within the scope of protection of the technical solutions described below.

[0180] Industrial availability The light-shielding component of the present invention can be used, for example, to block visible light.

[0181] Symbol Explanation 1: Light-shielding components 2: Core layer 3: Resin layer 4: Low-reflection layer 14: Through hole 26: Peripheral area of ​​the through hole 27A, 27B, 27C: Main skeleton section 28A, 28B: Subskeletal Structure 30: Core-to-substrate through hole.

Claims

1. A light-shielding member comprising: a core layer made of metal; and a low-reflection layer that covers the core layer, an area of the core layer in plan view is 85% or less relative to an area of the light-shielding member in plan view, a 5° specular reflectance of the low-reflection layer is lower than a 5° specular reflectance of the core layer.

2. The light shielding member according to claim 1, wherein an outer shape of the core layer is a non-similar shape relative to an outer shape of the light-shielding member.

3. The light shielding member according to claim 1, wherein the light-shielding member has a through-hole that penetrates in the thickness direction, the core layer has a through-hole peripheral portion that is disposed around the through-hole when viewed in the thickness direction.

4. The light shielding member according to claim 3, wherein the core layer has a main skeleton portion that extends from the through-hole peripheral portion to an opposite side of the through-hole relative to the through-hole peripheral portion.

5. The light shielding member according to claim 4, wherein the core layer has a sub-skeleton portion that extends from the main skeleton portion in a direction that crosses a direction in which the main skeleton portion extends.

6. The light shielding member according to claim 5, wherein the sub-skeleton portion is disposed at intervals in the direction in which the main skeleton portion extends.

7. The light shielding member according to claim 3, wherein the core layer has a plurality of core sub-through-holes that penetrate in the thickness direction.

8. The light shielding member according to claim 7, wherein the plurality of core sub-through-holes are regularly disposed.

9. The light shielding member according to any one of claims 1 to 8, wherein the light-shielding member further has a resin layer that is disposed between the core layer and the low-reflection layer.

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