Head-mounted display device

Abstract

The invention provides head-mounted display equipment. The head-mounted display equipment comprises a complete machine shell, a mainboard and a heat dissipation module, wherein the mainboard and the heat dissipation module are arranged in the complete machine shell; wherein the heat dissipation module comprises a module shell, a pipeline module fixed in the module shell, and a fan module fixed on the pipeline module; the heat dissipation module is fixed in the whole machine shell, the pipeline module is attached to the main board, and heat dissipation is conducted on the main board through cooperation of the fan module and the pipeline module. According to the invention, effective heat dissipation of the mainboard of the whole machine can be realized, and the appearance of the whole machine is not influenced.

Description

Technical Field

[0001] This invention relates to the field of smart wearable technology, and more specifically, to a head-mounted display device. Background Technology

[0002] Virtual Reality (VR) primarily refers to the generation of a virtual environment using modern high-tech methods centered on computer technology. Users interact naturally with objects in the virtual world through special input / output devices, obtaining the same sensations as in the real world through sight, hearing, and touch. Augmented Reality (AR), on the other hand, simulates and overlays virtual information within the spatial range of the real world, enabling users to perceive sensory experiences that transcend reality. As such technologies continue to develop, the market for head-mounted display devices based on these technologies is becoming increasingly hot.

[0003] Currently, when users use VR / AR electronic products, the products themselves generate a certain amount of heat. If this heat cannot be dissipated in time, it will affect the failure rate of internal components, shorten the product's lifespan, and in severe cases, may even cause system failures and safety hazards. On the other hand, if the heat-generating components are directly cooled, it will affect the product's sealing effect, and external water or moisture can easily enter the device through the product's gaps, which will also cause damage to internal components and affect the lifespan.

[0004] Therefore, improving the heat dissipation capacity of products is a technical problem that urgently needs to be solved. Summary of the Invention

[0005] In view of the above problems, the purpose of this invention is to provide a head-mounted display device to solve the heat dissipation problem of existing devices.

[0006] The head-mounted display device provided by the present invention includes: a main body housing, a main board and a heat dissipation module disposed within the main body housing; wherein, the heat dissipation module includes a module housing, a pipe module fixed within the module housing, and a fan module fixed on the pipe module; the heat dissipation module is fixed within the main body housing such that the pipe module is in contact with the main board, and the fan module and the pipe module cooperate to dissipate heat from the main board.

[0007] In addition, an optional technical solution is that the module housing includes a front module housing and a rear module housing that are sealed together; wherein, a first limiting groove with a C-shaped cross-section is provided on the periphery of the opening side of the rear module housing, and a second limiting groove adapted to the first limiting groove is provided on the periphery of the front module housing; an elastic sealing element is provided in the first limiting groove and / or the second limiting groove, the first limiting groove and the second limiting groove are interlocked and sealed together by the elastic sealing element.

[0008] Alternatively, an optional technical solution is to provide an air inlet at the lower end of the module's rear shell and an air outlet communicating with the air inlet at the upper end of the module's rear shell; and to provide clearance grooves on the entire housing to avoid the air inlet and the air outlet respectively, with the module housing being limited within the clearance grooves at the corresponding positions, and allowing external airflow to circulate within the heat dissipation module through the air inlet and the air outlet.

[0009] In addition, an optional technical solution is that the pipe module includes a T-shaped support, heat dissipation pipes arranged on one side of the support, and a heat dissipation plate fixed on the side of the heat dissipation pipes away from the support; at least one heat dissipation pipe is provided, and all heat dissipation pipes are gathered at the lower end of the support, and the heat dissipation plate is fixed at the gathering point of the support.

[0010] Alternatively, an optional technical solution is to provide a hollow groove on the back cover of the module that is compatible with the bracket; the bracket is sealed and fixed on the back cover of the module, and the heat dissipation pipe and the heat sink are recessed into the hollow groove so that the heat sink is in contact with the chip position of the motherboard.

[0011] Alternatively, an optional technical solution is to provide two fan modules, each fan module including a fixed housing, a fan disposed within the fixed housing, and a heat sink located at the upper end of the fan; the heat sink is fixed to the side of the bracket away from the heat dissipation pipe.

[0012] Alternatively, an optional technical solution is to seal a heat-conducting liquid inside the heat dissipation pipe; the heat-conducting liquid forms a gas after being heated on the heat dissipation plate side and rises to the upper end of the heat dissipation pipe, and the gaseous heat-conducting liquid is cooled to form a liquid on the heat dissipation fin side of the upper end of the bracket and falls to the lower end of the heat dissipation pipe.

[0013] In addition, an optional technical solution is that the heat sink, the module back cover and the bracket are made of at least one of aluminum, copper, iron, alloy and composite thermally conductive materials.

[0014] Alternatively, an optional technical solution is to configure the heat dissipation pipe as a flat shape at the heat dissipation plate, and to weld and fix the heat dissipation plate to the heat dissipation pipe.

[0015] Alternatively, the optional technical solution is that the housing includes a rear housing and a front housing, and the motherboard is fixed to the rear housing.

[0016] Using the aforementioned head-mounted display device, a heat dissipation module is installed inside the overall casing. The heat dissipation module directly dissipates heat by being attached to the device's motherboard through a pipe module. The fan module dissipates heat from the pipe module. This allows for rapid heat dissipation of the main heat-generating device motherboard through the cooperation of the fan module and the pipe module without affecting the device's appearance, and the heat dissipation effect is significant.

[0017] To achieve the foregoing and related objectives, one or more aspects of the invention include the features that will be described in detail below. The following description and accompanying drawings illustrate certain exemplary aspects of the invention. However, these aspects indicate only a few of the various ways in which the principles of the invention can be used. Furthermore, the invention is intended to encompass all such aspects and their equivalents. Attached Figure Description

[0018] Other objects and results of the invention will become more apparent and readily understood with reference to the following description taken in conjunction with the accompanying drawings. In the drawings:

[0019] Figure 1 This is an overall view of a head-mounted display device according to an embodiment of the present invention;

[0020] Figure 2 An exploded view of a head-mounted display device according to an embodiment of the present invention;

[0021] Figure 3 This is an overall view of the heat dissipation module according to an embodiment of the present invention;

[0022] Figure 4 This is an exploded view of a heat dissipation module according to an embodiment of the present invention;

[0023] Figure 5 This is a cross-sectional view of a heat dissipation module according to an embodiment of the present invention;

[0024] Figure 6 This is a cross-sectional view of a head-mounted display device according to an embodiment of the present invention.

[0025] The reference numerals in the accompanying drawings include: 1. Complete housing 11. Complete front housing 12. Complete rear housing 12. Mainboard 13. Heat dissipation module 2. Module front housing 21. Second limiting groove 211. Module rear housing 22. Hollow groove 221. Air outlet 222. Air inlet 223. First limiting groove 224. Fan module 23. Fan 231. Heat sink 232. Pipe module 24. Bracket 241. Heat dissipation pipe 242. Heat dissipation plate 243. Elastic seal 3.

[0026] In all the accompanying drawings, the same reference numerals indicate similar or corresponding features or functions. Detailed Implementation

[0027] In the following description, numerous specific details are set forth for illustrative purposes and to provide a thorough understanding of one or more embodiments. However, it will be apparent that these embodiments may also be implemented without these specific details. In other instances, well-known structures and devices are shown in block diagram form for ease of description of one or more embodiments.

[0028] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0029] It will be understood by those skilled in the art that, unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It should also be understood that terms such as those defined in general dictionaries should be understood to have the same meaning as in the context of the prior art, and should not be interpreted in an idealized or overly formal sense unless defined as herein.

[0030] To provide a detailed description of the head-mounted display device and its usage method according to the present invention, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0031] Figures 1 to 6 The overall schematic structure, exploded schematic structure, and cross-sectional schematic structure of the head-mounted display device and heat dissipation module according to embodiments of the present invention are shown from different angles.

[0032] like Figures 1 to 6As shown in the figure, the head-mounted display device of this invention includes: a housing 1, a motherboard 13 disposed within the housing 1, and a heat dissipation module 2; wherein, the heat dissipation module 2 includes a module housing, a pipe module 24 fixed within the module housing, and a fan module 23 fixed on the pipe module 24; the heat dissipation module 2 is fixed within the housing 1, and the pipe module 24 is in close contact with the motherboard 13, so that the heat generated by the motherboard 13 can be transferred and dissipated in a timely manner through the pipe module 24, and the pipe module 24 can be further cooled and dissipated through the fan module 23, and finally the effective heat dissipation of the motherboard 13 is achieved through the cooperation of the fan module 23 and the pipe module 24.

[0033] The module housing includes a sealed front shell 21 and a rear shell 22. The front shell 21 is a plate-like structure, and the rear shell 22 is a cuboid structure with an opening on one side. The front shell 21 is fixed to the opening side of the rear shell 22, and the two are assembled to form a cavity structure. To ensure the sealing and waterproof effect of the module housing and prevent liquid or moisture from entering the main body housing 1 through the connection point and affecting the performance of the main board 13, a first limiting groove 224 with a C-shaped cross section is provided on the periphery (around the four edges) of the opening side of the rear shell 22. A second limiting groove 211 adapted to the first limiting groove 224 is provided on the periphery of the front shell 21. An elastic sealing element 3 is provided in the first limiting groove 224 and / or the second limiting groove 211. The first limiting groove 224 and the second limiting groove 211 are then interlocked and sealed by the elastic sealing element 3.

[0034] Furthermore, an air inlet 223 is provided at the lower end of the module rear shell 22, and an air outlet 222 communicating with the air inlet 223 is provided at the upper end of the module rear shell 22. A clearance groove is provided on the whole housing 1 to avoid the air inlet 223 and the air outlet 222 respectively. The module housing is limited in the clearance groove at the corresponding position. At this time, the module housing forms an air duct structure that is open at the top and bottom. The external airflow flows in the heat dissipation module 2 through the cooperation of the air inlet 223 and the air outlet 222, while the heat of the motherboard 13 is transferred out through the pipe module 24, the fan module 23 and the air outlet 222, thereby achieving the air duct heat dissipation effect.

[0035] In one specific embodiment of the present invention, the pipe module 24 includes a T-shaped support 241, heat dissipation pipes 242 arranged on one side of the support 241, and a heat dissipation plate 243 fixed on the side of the heat dissipation pipes 242 away from the support 241. At least one heat dissipation pipe 242 is provided, and all heat dissipation pipes 242 are gathered at the lower end of the support 241. The heat dissipation pipes can be independent of each other or interconnected. The heat dissipation plate 243 is fixed at the gathering point of the support 241 to accelerate the heat dissipation effect.

[0036] In addition, to enable the heat generated by the motherboard 13 to be transferred quickly and timely by the pipe module 24, a hollow groove 221 adapted to the bracket 241 can be provided on the back cover 22 of the module. The size of the hollow groove 221 is larger than the size of the heat dissipation pipe 242 and the heat sink 243, but smaller than the size of the bracket 241. This allows the periphery of the bracket 241 to be sealed and fixed to the back cover 22 of the module by sealant or washers and screws. The heat dissipation pipe 242 and the heat sink 243 are recessed into the hollow groove 221. At this time, the heat sink 243 can be directly attached to the chip position of the motherboard 13. The heat generated by the chip is directly transferred to the heat dissipation pipe 242 through the heat sink 243. The heat dissipation pipe 242 and the fan module 23 work together to achieve rapid heat dissipation.

[0037] The fan module 23 can be provided in two forms. Each fan module includes a fixed shell, a fan 231 disposed in the fixed shell, and a heat sink 232 located at the upper end of the fan. The heat sink 232 is fixed on the side of the bracket 241 away from the heat dissipation pipe 242. In the embodiment where two fan modules 23 are provided, the heat sink 232 portions of the two fan modules 23 are respectively fixed at the two ends of the horizontal portion of the bracket 241, while the heat sink 243 is fixed on the vertical portion of the bracket 241 so as to be directly attached to the motherboard 13.

[0038] It should be noted that regardless of whether the heat dissipation pipes 242 are multiple independently distributed or arranged in a single line, a heat-conducting liquid is sealed inside each heat dissipation pipe 242. This heat-conducting liquid can be heated to a gaseous state on the heat sink 243 side and rise to the upper end of the heat dissipation pipe 242 (this end contacts the heat sink 232 of the fan module 23). Additionally, the gaseous heat-conducting liquid is cooled to a liquid state on the heat sink 232 side of the bracket 241 and falls to the lower end of the heat dissipation pipe 242, thereby improving the heat dissipation effect. To further improve the heat dissipation effect of the heat dissipation pipes 242, the heat sink 243 can be welded and fixed to the heat dissipation pipes 242, and the pipe portion at the heat sink 243 can be designed as a flat structure, thereby increasing the contact area between the heat dissipation pipes 242 and the heat sink 243 and accelerating the heat dissipation speed.

[0039] In the head-mounted display device of this invention, in order to improve the heat transfer effect, the heat sink 243, the module back shell 22 and the bracket 241 can be made of at least one of aluminum, copper, iron, alloy and composite thermal conductive materials, thereby accelerating the heat transfer and diffusion.

[0040] Furthermore, the housing 1 may further include a rear housing 12 and a front housing 11. The motherboard 13 and the heat dissipation module 2 are both fixed on the rear housing 12, and the air inlet 223 and air outlet 222 of the heat dissipation module 2 are both higher than the housing 1. At the same time, the junction between the module housing and the housing can be sealed. During the use of the head-mounted display device, the heat will be exhausted through the air outlet 222 because hot gas will rise. When liquid or water vapor passes through the air duct of the module housing, it can enter through the air outlet 222 and flow out through the air inlet 223. Therefore, when the module housing is sealed and waterproof (the front and rear housings of the module are sealed together and the bracket is sealed together with the rear housing of the module), liquid will not only not enter the housing 1 and affect the performance of the motherboard 13, but it can also further accelerate the heat transfer, ultimately achieving the waterproof heat dissipation effect of the head-mounted display device.

[0041] According to the head-mounted display device of the present invention, a heat dissipation module is provided inside the overall housing. The heat dissipation module directly dissipates heat by being attached to the main board of the device through a pipe module. The fan module dissipates heat from the pipe module. Without affecting the appearance of the device, the main board of the device, which mainly generates heat, can be quickly cooled by the cooperation of the fan module and the pipe module. At the same time, due to the sealed structure of the heat dissipation module, an air duct with openings at the top and bottom is formed inside, which not only improves the heat dissipation effect and efficiency, but also achieves the function of sealing and waterproofing.

[0042] The head-mounted display device according to the present invention has been described above by way of example with reference to the accompanying drawings. However, those skilled in the art should understand that various modifications can be made to the head-mounted display device proposed in the present invention without departing from the scope of the invention. Therefore, the scope of protection of the present invention should be determined by the contents of the appended claims.

Claims

1. A head-mounted display device, comprising: The whole machine shell, the mainboard and the heat dissipation module arranged in the whole machine shell; wherein, The heat dissipation module includes a module shell, a pipeline module fixed in the module shell, and a fan module fixed on the pipeline module; The heat dissipation module is fixed in the whole machine shell, and the pipeline module is attached to the mainboard, and the fan module and the pipeline module cooperate to dissipate heat from the mainboard. The module shell includes a module front shell and a module rear shell connected in a sealed manner; wherein, 2. The head-mounted display device of claim 1, wherein, A first limiting groove with a C-shaped cross section is arranged on the circumference of the opening side of the module rear shell, and a second limiting groove matched with the first limiting groove is arranged on the circumference of the module front shell; An elastic sealing member is arranged in the first limiting groove and / or the second limiting groove, and the first limiting groove and the second limiting groove are mutually buckled and sealed by the elastic sealing member.

3. The head-mounted display device according to claim 2, wherein An air inlet is arranged at the lower end of the module rear shell, and an air outlet is arranged at the upper end of the module rear shell and communicated with the air inlet; An avoiding groove is arranged on the whole machine shell to avoid the air inlet and the air outlet, respectively, and the module shell is limited in the avoiding groove at the corresponding position, so that external airflow flows through the air inlet and the air outlet in the heat dissipation module.

4. The head-mounted display device according to claim 2, wherein The pipeline module includes a bracket in a T-shaped distribution, heat dissipation pipelines arranged on one side of the bracket, and a heat dissipation plate fixed on the side of the heat dissipation pipelines away from the bracket; At least one heat dissipation pipeline is arranged, and each heat dissipation pipeline is gathered at the lower end of the bracket, and the heat dissipation plate is fixed at the gathering position of the bracket.

5. The head-mounted display device according to claim 4, wherein A hollow groove matched with the bracket is arranged on the module rear shell; The bracket is sealed and fixed on the module rear shell, and the heat dissipation pipelines and the heat dissipation plate are avoided in the hollow groove, so that the heat dissipation plate is attached to the chip position of the mainboard.

6. The head-mounted display device according to claim 4, wherein Two fan modules are arranged, each including a fixed shell, a fan arranged in the fixed shell, and a heat dissipation fin located at the upper end of the fan; The heat dissipation fin is fixed on the side of the bracket away from the heat dissipation pipeline.

7. The head-mounted display device according to claim 6, wherein Thermal conductive liquid is sealed in the heat dissipation pipeline; The thermal conductive liquid is heated on the side of the heat dissipation plate to form gas, which rises to the upper end of the heat dissipation pipeline, and the gas state of the thermal conductive liquid is cooled on the side of the heat dissipation fin at the upper end of the bracket to form liquid, which falls to the lower end of the heat dissipation pipeline.

8. The head-mounted display device according to claim 4, wherein The materials of the heat dissipation plate, the module rear shell and the bracket include at least one of aluminum, copper, iron, alloy and composite thermal conductive material.

9. The head-mounted display device according to claim 4, wherein ​ The heat dissipation pipe is flat at the heat dissipation plate, and the heat dissipation plate is welded and fixed with the heat dissipation pipe.

10. The head-mounted display device of claim 1, wherein, The whole machine shell comprises a whole machine rear shell and a whole machine front shell, and the mainboard is fixed on the whole machine rear shell.

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