Temperature control device and temperature control method

Abstract

The embodiment of the invention discloses a temperature control device and a temperature control method, the temperature control device comprises a shell structure, a heating structure, a first cooling structure and a control module, the heating structure and the first cooling structure are arranged in a test cavity of the shell structure, and the control module is arranged in the shell structure and is in control connection with the heating structure and the first cooling structure. The heating structure comprises a flow guide frame and a plurality of heating modules arranged in an arrayed mode, the flow guide frame and the insertion frame in the testing cavity are buckled to form a plurality of flow guide cavities, and the flow guide cavities and the heating modules are arranged correspondingly. The multiple heating modules are arranged, the heating modules correspond to the flow guide cavities, the temperature of each memory bank can be independently controlled based on the independent channels, and it is guaranteed that the temperature of the memory banks is stable and heat is evenly distributed in the testing process.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor chip, in particular to a temperature control device and a temperature control method. BACKGROUND

[0002] Memory testing is a key link to ensure the quality and reliability of memory, and the temperature of the memory needs to be kept stable in a certain range during the testing process. Since the power consumption of the memory changes sharply during the testing process, the temperature of the memory also changes constantly with the change of the power consumption, so the temperature control device needs to heat and dissipate heat in time to maintain the temperature of the memory stable.

[0003] Generally, the heating of the memory is carried out by the whole heating method, that is, all the areas where the memory is located are uniformly heated. However, since the memory occupies a large area, the heat distribution is quite different under the uniform heating, and it is impossible to simultaneously respond to the different power consumption changes of different memories in the same test. SUMMARY

[0004] Therefore, the purpose of the present application is to provide a temperature control device and a temperature control method, which can control the temperature of each memory based on independent channels, ensure the temperature stability of the memory during the test, and make the heat distribution uniform.

[0005] In a first aspect, the present application provides a temperature control device, comprising: A shell structure, a test cavity is formed in the shell structure, and a plurality of insertion racks are arranged in the test cavity; A heating structure is installed in the test cavity, the heating structure comprises a plurality of heating modules and a flow guide rack, a plurality of the heating modules are arranged at one end of the flow guide rack, the flow guide rack is buckled with a plurality of the insertion racks to form a plurality of flow guide cavities, and each of the flow guide cavities is correspondingly arranged with each of the heating modules; A first cooling structure is installed in the test cavity, and the first cooling structure is located at one end of the flow guide rack away from the heating modules; A control module is arranged in the shell structure, and the control module is in control connection with the heating structure and the first cooling structure.

[0006] Optionally, each of the heating modules comprises a heat sink, a heating element, a heat conduction block and a connecting rack, the heating element is arranged in the heat conduction block, the heat conduction block is connected to the inner side of the connecting rack, and the heat sink is connected to the side of the heat conduction block away from the connecting rack.

[0007] Optionally, each of the heat sinks comprises a plurality of fins, a plurality of the fins are vertically arranged and connected to form a plurality of openings, and a plurality of the openings are open to the flow guide cavities.

[0008] Optionally, a plurality of flow guide partitions are arranged on the flow guide frame, each adjacent two of the flow guide partitions form a flow guide groove, each of the flow guide grooves is arranged corresponding to each of the insertion frames to form the flow guide cavity, and the plurality of openings of each of the heat sinks are open towards the corresponding flow guide groove.

[0009] Optionally, the heat-conducting block comprises a first heat-conducting plate and a second heat-conducting plate connected to each other, one end of the heating element is connected with an electrode lead column, the first heat-conducting plate is protruded to form a protruding portion, a gap is formed between the protruding portion and the second heat-conducting plate, the heating element is arranged in the gap, and the electrode lead column extends out of the gap.

[0010] Optionally, each of the connecting frames is formed in a C shape to surround the heat sink, the heating element and the heat-conducting block, the opening directions of the plurality of connecting frames are the same, and the adjacent connecting frames are connected through a fixing assembly.

[0011] Optionally, the heating structure further comprises a positioning plate, a protection frame and a protection plate, the protection frame and the protection plate are connected and form a containing cavity, the plurality of heating modules are arranged in the containing cavity in a direction perpendicular to the length direction of the heating structure, the plurality of heating modules are connected to each other, the front side of the protection plate is connected with the flow guide frame, the bottom surface of the positioning plate is connected with the heating structure, and one end of the positioning plate is connected with the first cooling structure.

[0012] Optionally, the temperature control device further comprises a plurality of sensors, one of the sensors is arranged in each of the flow guide grooves, and the control module is in control connection with the sensors.

[0013] Optionally, the shell structure comprises a bearing frame, a rotating portion and a movable frame, the rotating portion is connected to one end of the top surface of the bearing frame, the movable frame is rotatably arranged on one side of the rotating portion, the movable frame is combined with the bearing frame to form the test cavity, the plurality of insertion frames are installed on the top surface of the bearing frame, and the heating structure and the first cooling structure are connected to the inner side of the movable frame.

[0014] Optionally, the temperature control device further comprises a second cooling structure, the second cooling structure is connected to one side of the containing cavity which is away from one end of the heating module which is away from the flow guide frame, the air outlet direction of the second cooling structure is the same as that of the first cooling structure, the second cooling structure is connected with the protection plate, and the control module is in control connection with the second cooling structure.

[0015] In the second aspect, an embodiment of the present application provides a temperature control method, comprising: obtaining temperature data of sensors in the plurality of flow guide grooves; calculating power consumption values of the flow guide grooves according to the temperature data. obtaining a power consumption deviation of each of the flow guide grooves according to the power consumption value and a predetermined power consumption calculation; obtaining each of the power consumption deviations, judging whether values of each of the power consumption deviations are consistent, and adjusting the temperature according to a range in which each of the power consumption deviations is located by using a PID control method or a power consumption deviation control method.

[0016] Optionally, the judging whether values of each of the power consumption deviations are consistent and adjusting the temperature according to a range in which each of the power consumption deviations is located by using a PID control method or a power consumption deviation control method comprises: if the values of each of the power consumption deviations are consistent, judging the range in which each of the power consumption deviations is located, and if the power consumption deviation satisfies 0%≤power consumption deviation<10%, controlling the first cooling structure or each of the heating modules to operate by using the PID control method, otherwise, obtaining a power change value according to the power consumption deviation control method, and controlling the first cooling structure or each of the heating modules to change operating power according to the power change value; if the values of each of the power consumption deviations are inconsistent, judging the range in which each of the power consumption deviations is located, and for the power consumption deviation corresponding to each of the flow guide grooves, if the power consumption deviation satisfies 0%≤power consumption deviation<10%, controlling the corresponding heating module to operate by using the PID control method, otherwise, obtaining a power change value according to the power consumption deviation control method, and controlling the corresponding heating module to change operating power according to the power change value.

[0017] Optionally, the power consumption deviation control method comprises: judging the range in which each of the power consumption deviations is located; obtaining an interval coefficient according to the range in which each of the power consumption deviations is located; according to calculating the power change value, wherein, △Q is the power change value, i is the interval coefficient, △P is the power consumption deviation, and △t is a difference between the temperature data and a target temperature; wherein, the obtaining the interval coefficient according to the range in which each of the power consumption deviations is located comprises: if the power consumption deviation satisfies 10%≤power consumption deviation<20%, a first coefficient is used as the interval coefficient; if the power consumption deviation satisfies 20%≤power consumption deviation<30%, a second coefficient is used as the interval coefficient; if the power consumption deviation satisfies 30%≤power consumption deviation, a third coefficient is used as the interval coefficient.

[0018] The embodiment of the present application provides a temperature control device and a temperature control method, wherein the temperature control device comprises a shell structure, a heating structure, a first cooling structure and a control module, the heating structure and the first cooling structure are arranged in a test cavity of the shell structure, and the control module is arranged in the shell structure and is in control connection with the heating structure and the first cooling structure. The heating structure comprises a flow guide frame and a plurality of arranged heating modules, the flow guide frame and an insertion frame in the test cavity are buckled to form a plurality of flow guide cavities, and the flow guide cavities are arranged in correspondence with the heating modules. By arranging a plurality of heating modules and corresponding the heating modules and the flow guide cavities, each memory bank can be individually temperature controlled based on an independent channel, so that the temperature of the memory bank is stable during the test, and heat is uniformly distributed. BRIEF DESCRIPTION OF DRAWINGS

[0019] The above and other objects, features and advantages of the present application will become more apparent from the following description of the embodiments of the present application taken with reference to the accompanying drawings, in which: Figure 1 is a schematic diagram of the overall structure of the temperature control device of one embodiment of the present application; Figure 2 is a schematic diagram of the explosion decomposition of the temperature control device of one embodiment of the present application; Figure 3 is a schematic diagram of the structure in the test cavity of one embodiment of the present application; Figure 4 is an exploded view of the structure in the test cavity of one embodiment of the present application; Figure 5 is a schematic diagram of the structure of the flow guide frame of one embodiment of the present application; Figure 6 is a schematic diagram of the structure of the heating module of one embodiment of the present application; Figure 7 is an exploded view of the heating module of one embodiment of the present application; Figure 8 is a schematic diagram of the structure in the test cavity of one embodiment of the present application when the protection plate is removed; Figure 9 is a schematic diagram of the structure in the test cavity of one embodiment of the present application when the test cavity is opened and closed; Figure 10 is a schematic diagram of the structure of the insertion frame of one embodiment of the present application; Figure 11 is a flow chart of the steps of the temperature control method of one embodiment of the present application; Figure 12 is a flow chart of the steps of the power consumption deviation control method of one embodiment of the present application.

[0020] Explanation of reference signs: 11 - receiving frame; 12 - movable frame; 13 - rotating part; 14 - positioning plate; 15 - inserting frame; 21 - protection frame; 22 - heating module; 220 - heat-conducting block; 221 - connecting frame; 222 - electrode lead column; 223 - heating element; 224 - first heat-conducting plate; 225 - protruding part; 226 - fixing assembly; 227 - second heat-conducting plate; 228 - heat sink; 23 - flow guide frame; 24 - through hole; 25 - sensor; 27 - flow guide partition; 28 - protection plate; 31 - second mounting frame; 32 - second cooling assembly; 5 - first cooling structure; 51 - first mounting frame; 52 - first cooling assembly; 6 - memory bank. DETAILED DESCRIPTION

[0021] The present application is described herein below based on examples, but the present application is not limited to only these examples. In the following detailed description of the present application, some specific details are described in detail. The present application can also be fully understood without the description of these details by those skilled in the art. In order to avoid confusion of the essence of the present application, well-known methods, processes, procedures, elements and circuits are not described in detail.

[0022] In addition, those skilled in the art should understand that the drawings provided herein are for illustrative purposes only and are not necessarily drawn to scale.

[0023] Unless otherwise clearly indicated and limited, the terms "mounting", "connection", "connecting", "fixed", and the like, should be interpreted broadly, for example, can be fixed connection, can also be detachable connection, or integral; can be mechanical connection, can also be electrical connection; can be direct connection, can also be indirect connection through an intermediate medium, can be internal communication of two elements or interaction relationship between two elements, unless otherwise clearly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0024] For ease of description, spatially relative terms such as "inner", "outer", "below", "lower", "bottom", "top", "upper", and the like, can be used herein for describing an element's or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, elements described as "below" or "under" other elements or features would then be oriented "above" the other elements or features. Thus, the example term "below" can encompass both an orientation of above and below. The device can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein should be interpreted accordingly.

[0025] Unless the context clearly requires otherwise, throughout the description, the terms "comprise", "comprising", "include", "including", and the like are to be construed in an inclusive sense, as opposed to an exclusive or exhaustive sense; that is to say, in the sense of "including but not limited to".

[0026] In the description of the present application, it should be understood that the terms "first", "second" and the like are used only for the purpose of description, and cannot be understood as indicating or implying relative importance. In addition, in the description of the present application, unless otherwise stated, the meaning of "a plurality of" is two or more.

[0027] The stress test of the memory stick 6 usually includes normal temperature test and high temperature test. By simulating the normal use environment and the high temperature extreme use environment, the stability of the memory stick 6 working at different environmental temperatures is tested, and the temperature of the test environment needs to be kept stable within a certain range during the test. The normal temperature test is usually a stress test at a normal temperature of about 25℃, and a cooling structure such as a fan is usually used for convective heat transfer test to keep the temperature stable. The high temperature test is usually a stress test at 60℃-70℃, and a heating structure is usually used to adjust the heating power to keep the temperature stable.

[0028] Referring to Figures 1-4 The temperature control device of the embodiment of the present application includes a shell structure, a heating structure, a first cooling structure 5 and a control module. A test cavity is formed in the shell structure to accommodate the memory stick 6 and test related structures. A plurality of insertion racks 15 are arranged in the test cavity, and the insertion racks 15 are used to position the memory stick 6 to be tested. The heating structure and the first cooling structure 5 are both installed in the test cavity. The control module is installed in the shell structure and is separated from the test cavity. The heating structure is used to heat the channel where the memory stick 6 is located, and can increase the temperature to the required high temperature in the high temperature test. The first cooling structure 5 can achieve effective heat exchange to avoid heat accumulation in the channel during normal temperature test. The control module is in control connection with the heating structure and the first cooling structure 5, so as to adjust in time according to the demand and the environmental state in the channel.

[0029] Referring to Figure 2 , Figure 4The heating structure comprises a plurality of heating modules 22 and a flow guide frame 23. The plurality of heating modules 22 are arranged at one end of the flow guide frame 23. The flow guide frame 23 is buckled with the plurality of insertion frames 15 to form a plurality of flow guide cavities. Each flow guide cavity is arranged correspondingly to each heating module 22. The flow guide frame 23 is used to guide the heat generated by the heating module 22 to flow to the corresponding memory bank 6. The height of the flow guide frame 23 is adapted to the size of the memory bank 6, so that the flow guide frame 23 can accommodate the memory bank 6 without contact, effectively utilizing the space while avoiding damage to the memory bank 6. The number of heating modules 22 is the same as the number of insertion frames 15 and flow guide cavities. Each heating module 22 corresponds to one insertion frame 15 and one flow guide cavity, so that each memory bank 6 installed in the insertion frame 15 corresponds to one heating module 22 and can be independently temperature-regulated by the heating module 22.

[0030] Specifically, as shown in Figure 5 , a plurality of flow guide partitions 27 are arranged on the flow guide frame 23. Each adjacent two flow guide partitions 27 form a flow guide groove. When buckled, each flow guide groove is arranged correspondingly to each insertion frame 15 to form a flow guide cavity. The plurality of openings of each heat sink 228 are open to the corresponding flow guide groove. For each flow guide cavity, the flow guide partitions 27 separate it to reduce the influence between adjacent flow guide cavities, facilitating individual control according to the temperature condition in each flow guide cavity. In order to further isolate each memory bank 6, the flow guide frame 23 and the flow guide partitions 27 are usually made of low-thermal-conductivity material that is resistant to high temperature and less likely to deform. According to actual conditions, in order to increase the airtightness of each flow guide cavity when buckled, a material capable of clamping and having elasticity can be arranged between adjacent insertion frames 15 to realize the close combination between the flow guide partitions 27 and the side plates of the flow guide frame 23 and the insertion frames 15 when buckled.

[0031] Referring to Figure 2 , the first cooling structure 5 is installed in the test cavity. The first cooling structure 5 is located at the end of the flow guide frame 23 away from the heating module 22, and is used for heat exchange to maintain the temperature stability in the flow guide cavity. The first cooling structure 5 and the heating module 22 are located at the two ends of the flow guide frame 23, so that the first cooling structure 5 can make the heat generated by the heating module 22 flow through the entire flow guide cavity as much as possible when heat exchanging, to heat the memory bank 6 more uniformly. In some embodiments, specifically, the first cooling structure 5 comprises a first mounting frame 51 and a first cooling assembly 52. The first mounting frame 51 is used to connect with the shell structure, and the first cooling assembly 52 is installed in the first mounting frame 51. The first mounting frame 51 is in communication with the flow guide cavities to form a continuous temperature control channel. Each flow guide cavity forms an independent channel for heat exchange and heating. According to actual conditions, a fan is usually selected as the first cooling assembly 52, which is low in cost and easy to control.

[0032] In some embodiments, referring to Figures 6-7Each heating module 22 comprises a heat sink 228, a heating element 223, a heat conducting block 220 and a connecting frame 221. The heating element 223 is arranged in the heat conducting block 220, the heat conducting block 220 is connected to the inner side of the connecting frame 221, and the heat sink 228 is connected to the side of the heat conducting block 220 away from the connecting frame 221. The heat sink 228 is used to expand the heat exchange area, transfer the heat generated by the heating element 223 to the air in the flow guide cavity, and heat the memory stick 6. The heating element 223 is heated after being powered on, and is insulated from the outside by the heat conducting block 220, and good heat conduction effect is provided. The heat conducted by the heat conducting block 220 is transferred to the heat sink 228, and finally the heating of the flow guide cavity is realized by the heat exchange effect of the first cooling structure 5.

[0033] As shown in Figures 6-7 , the connecting frame 221 can provide a containing space for the heat sink 228, the heating element 223 and the heat conducting block 220, and facilitate the formation of a single heating module 22 to realize the correspondence of each heating module 22 and the position of the flow guide cavity. Specifically, each connecting frame 221 is formed in a C shape to surround the heat sink 228, the heating element 223 and the heat conducting block 220, the opening directions of the plurality of connecting frames 221 are the same, and the adjacent connecting frames 221 are connected by the fixing assembly 226. The same direction connection of the connecting frame 221 can ensure that the heat generated by each heating module 22 can be transferred to the flow guide cavity in the same way.

[0034] As shown in Figure 7 , the fixing assembly 226 is generally formed as a structure with elasticity. In some embodiments, the fixing assembly 226 is a structure composed of two bolts and a spring. The two bolts are arranged in opposite directions, and one of the bolts is screwed into the tail of the other bolt, forming a mounting space for the spring and the assembly to be fixed between the heads of the two bolts. When fixed, for a single heating module 22, the heads of the two bolts are respectively embedded in the outer side of the connecting frame 221 and the outer side of the second heat conducting plate 227 of the heat conducting block 220, and the spring is located between the heat conducting block 220 and the connecting frame 221 of the adjacent heating module 22. By the extrusion of the spring, the heat conducting block 220 tightly wraps the heating element 223, and damage to the heat conducting block 220 caused by rigid connection is avoided. For a plurality of heating modules 22, the fixing structure positions of each heating module 22 are the same and correspond, and the fixing structures of adjacent heating modules 22 abut.

[0035] Referring to Figure 7Each heat sink 228 includes a plurality of curved fins, which are arranged vertically and connected to form a plurality of openings, and the plurality of openings are open to the flow guide cavity. Through the curved arrangement of the plurality of fins, the structural occupation volume is further compressed while the heat dissipation area is increased. Specifically, a plurality of fins are bent, spliced and welded to a metal plate, which is usually used as a substrate, and the top is sealed to ensure that the airflow passes through the middle of the fins and avoid the leakage of the airflow from the top to reduce the efficiency. A material with good thermal conductivity is usually selected as the substrate of the heat sink 228, such as aluminum alloy AL6063 as the substrate material. In order to further reduce the overall heat capacity of the heat sink 228 and improve the heating rate, a thinner substrate can also be selected to form the heat sink 228 to improve the response speed and reduce the energy consumption.

[0036] As shown in Figures 3-4 , Figure 6 , the fins are arranged vertically to adapt to the shape of the flow guide cavity which is elongated in the vertical direction, improving the matching degree between the heating module 22 and the flow guide cavity and avoiding unnecessary space waste. The plurality of openings formed by the fins are open to the flow guide cavity, so that the heat dissipation direction is specifically directed, reducing the heat dissipated in other directions which cannot be utilized, improving the heat exchange efficiency and reducing the heat loss.

[0037] As shown in Figure 7 , the heat conduction block 220 includes a first heat conduction plate 224 and a second heat conduction plate 227 connected to each other, and the heating element 223 has an electrode lead column 222 connected at one end. The first heat conduction plate 224 is protruded to form a protruding portion 225, and a gap is formed between the protruding portion 225 and the second heat conduction plate 227. The heating element 223 is arranged in the gap, and the electrode lead column 222 extends out of the gap. The first heat conduction plate 224 and the second heat conduction plate 227 can completely wrap the part of the heating element 223 generating heat to achieve effective insulation and heat conduction. According to actual conditions, ceramic materials are usually used as the materials of the first heat conduction plate 224, the protruding portion 225 and the second heat conduction plate 227, such as ceramic materials mainly containing aluminum nitride, to improve the safety and stability of the heating module 22 through good thermal conductivity and electrical insulation. The electrode lead column 222 is used to provide a stable current channel for the heating element and is in communication with the external circuit. In order to facilitate wiring and reduce the influence of heating on circuit transmission, according to actual conditions, the electrode lead column 222 is usually arranged on the side of the heating element 223 away from the flow guide frame 23 and extends outward, avoiding the influence of the heating element 223 on the electrode lead column 222 itself and the external circuit structure.

[0038] Referring to Figure 7The heating element 223 of each heating module 22 has an independent electrode lead column 222 to facilitate the regulation of the individual heating module 22 during heating. According to actual conditions, in order to reduce the thermal resistance, a thermally conductive interface material such as thermal silicone grease can be applied between the heat sink 228 and the second thermally conductive plate 227. The arrangement of the thermally conductive interface material can reduce the air gap between the heat sink 228 and the second thermally conductive plate 227, achieving efficient heat conduction. At the same time, the thermally conductive interface material can also buffer part of the mechanical stress.

[0039] In some embodiments, as shown in Figure 8 , Figure 9 The heating structure further includes a positioning plate 14, a protection frame 21, and a protection plate 28. The protection frame 21 and the protection plate 28 are connected and form a containing cavity. A plurality of heating modules 22 are arranged in the containing cavity in a direction perpendicular to the length direction of the heating structure. The plurality of heating modules 22 are connected to each other. The front side of the protection plate 28 is connected to the flow guide frame 23. The bottom surface of the positioning plate 14 is connected to the heating structure. One end of the positioning plate 14 is connected to the first cooling structure 5. In this embodiment, the first cooling structure 5 is arranged on the side away from the heating modules 22, so as to more evenly heat the memory stick and obtain better heat exchange effect. The protection frame 21 and the protection plate 28 are shaped to match the plurality of heating modules 22. The inner surface of the containing cavity is closely attached to the outer surface of the heating modules 22, so as to reduce the space occupation and increase the stability of the heating modules 22. The positioning plate 14 further connects the first mounting frame 51 and the flow guide frame 23, so that they can move synchronously. Specifically, as shown in Figure 2 The positioning plate 14 surrounds the first mounting frame 51. The lower surface of the positioning plate 14 is connected to the top surface of the flow guide frame 23. It should be understood that the above arrangement is only one implementation of this embodiment and is not limiting. According to actual conditions, in order to achieve effective and reliable positioning, a plurality of positioning plates 14 can be added and arranged at different positions as needed. In order to reduce the weight of the positioning plate 14 and avoid its influence on heat dissipation, the positioning plate 14 is usually hollowed out to reduce its influence on the test process.

[0040] As shown in Figure 2 , Figures 8-9 The flow guide cavities are arranged in a direction perpendicular to the length direction of the heating structure. The front side of the protection plate 28 is connected to the flow guide frame 23. By arranging the heating modules 22 in a direction perpendicular to the length direction of the heating structure, the heat generated by the heating modules 22 can be more efficiently transferred into the corresponding flow guide cavities. According to actual conditions, when the thickness of the heating module 22 is greater than the width of the flow guide cavity, the flow guide frame 23 is extended so that the width of the side connected to the protection plate 28 is extended to adapt to the thickness of the heating module 22. As shown in Figure 5 One end of the flow guide frame 23 is extended to form a structure similar to a trapezoid. The flow guide partition plate 27 inside the flow guide frame 23 is also extended and deformed to maintain the same width of each flow guide cavity.

[0041] Referring to Figure 4 To realize the control of the temperature in each flow guide cavity, the temperature control device further comprises a plurality of sensors 25, one sensor 25 is arranged in each flow guide slot, and the control module is in control connection with the sensors 25. According to actual conditions, a through hole 24 is usually opened at a corresponding position of the flow guide frame 23, the sensor 25 is arranged in the flow guide cavity and extends out of the flow guide cavity by a part through the through hole 24, so as to facilitate signal transmission. When testing, the sensor 25 can obtain timely temperature data and transmit the temperature data to the control module. After receiving the temperature data, the control module adjusts the temperature according to the temperature conditions in different flow guide cavities and test requirements.

[0042] In some embodiments, referring to Figures 1-2 、 Figures 8-10 The shell structure comprises a receiving frame 11, a rotating part 13 and a movable frame 12. The rotating part 13 is connected to one end of the top surface of the receiving frame 11, and the movable frame 12 is rotatably arranged on one side of the rotating part 13. The movable frame 12 is covered with the receiving frame 11 to form a test cavity. A plurality of insertion frames 15 are installed on the top surface of the receiving frame 11. The heating structure and the first cooling structure 5 are connected to the inner side of the movable frame 12. The receiving frame 11 can bear and support the heating structure and the first cooling structure 5 for testing. The rotating part 13 is used to open and close the movable frame 12, and enables the insertion frame 15 and the flow guide frame 23 to be buckled and opened before and after testing. Specifically, a rotating shaft is arranged on the rotating part 13, and the rotating shaft penetrates one end of the movable frame 12, so that the movable frame 12 can rotate around the rotating shaft to open and close. When the movable frame 12 is closed, an opening is formed between the rotating part 13 and the movable frame 12, which avoids the movable frame 12 from being stuck and enables the first cooling structure 5 to provide space for heat dissipation, air inlet and outlet. When it is necessary to install the memory stick 6 for testing, the movable frame 12 is opened, and the memory stick 6 is inserted into the insertion frame 15. When it is necessary to test, the movable frame 12 is closed, and the memory stick 6 enters the flow guide cavity formed by the flow guide frame 23 and the insertion frame 15.

[0043] In some embodiments, referring to Figures 2-4The temperature control device further comprises a second cooling structure to form forced convection with the first cooling structure 5 to improve heat exchange and cooling efficiency. The second cooling structure is connected to one side of the heating module 22 away from the flow guide frame 23 in the accommodation cavity, and the air outlet direction of the second cooling structure is the same as that of the first cooling structure 5, that is, a heat exchange system with two cooling structures in series is formed. The second cooling structure is connected to the protection plate 28, and the control module is connected to the second cooling structure. The second cooling structure comprises a second mounting frame 31 and a second cooling assembly 32. The second cooling assembly 32 is the same structure as the first cooling assembly 52, such as using the same type of fan, to avoid inconsistent flow in the channel. The control module is connected to the second cooling assembly 32 and controls the operation of the second cooling assembly 32. The second mounting frame 31 is connected to the protection plate 28 and extends into the accommodation cavity. According to the actual situation, a heightening frame can be additionally provided on the top of the second mounting frame 31 to increase the space for the second cooling assembly 32 to enter and exit air from the side, thereby reducing energy loss caused by poor air inlet and outlet. In this embodiment, the shapes of the protection frame 21 and the protection plate 28 are shaped to match the shapes of the plurality of heating modules 22 and the second mounting frame 31 of the second cooling structure. The inner surface of the accommodation cavity is closely attached to the outer surface of the heating module 22 and the second mounting frame 31 to reduce space occupation and increase the stability of the heating module 22 and the second cooling structure. According to the actual situation, the protection frame 21 also avoids the heightening frame on the top of the second mounting frame 31 and leaves space for it.

[0044] On this basis, the embodiment of the present application proposes a temperature control method for pressure testing of the memory bank 6 through the above-mentioned temperature control device.

[0045] Reference Figure 11 The temperature control method comprises: Step S1: obtaining temperature data of the sensor 25 in the plurality of flow guide grooves.

[0046] Specifically, the sensor 25 is arranged in the flow guide groove. After the movable frame 12 is closed for starting the test, the control module obtains the temperature in the flow guide cavity through the sensor 25 connected thereto to form temperature data, and transmits the temperature data to the control module for processing.

[0047] Step S2: calculating the power consumption value of each flow guide groove according to each temperature data.

[0048] The corresponding power consumption values are obtained through temperature data. Specifically, when the high-temperature test is performed, the power consumption value of the heating module 22 is taken as the power consumption value to be calculated, because the heating module 22 needs to be heated to maintain the temperature. When the normal-temperature test is performed, the power consumption value of the first cooling structure 5 is taken as the power consumption value to be calculated, because the memory bank 6 generates heat and is cooled by the first cooling structure 5. When the second cooling structure is used in series with the first cooling structure 5, the total power consumption value obtained is the same, and the power consumption value allocated to each cooling structure is halved. Therefore, the first cooling structure 5 is taken as an example for illustration. It should be understood that the above is only an example, and in the actual temperature regulation process, the effect of individually adjusting the local high-temperature memory bank 6 under normal temperature can be achieved by simultaneously adjusting the first cooling structure 5 and the heating module 22, for example, increasing the air supply of the first cooling structure 5 and increasing the heating power of the corresponding heating module 22 of the other memory bank 6, so that the temperature of each memory bank 6 in the flow guide cavity is in the same range.

[0049] The power consumption value is calculated according to the specific parameters of the actual corresponding heating module 22 or cooling structure. Specifically, the power value is obtained by P=V×I, and the power consumption value in a short time is obtained by E=P×t through continuous measurement in a short time. Wherein, P is the current power value, V is the voltage value, I is the current value, t is the time length of the short time, and E is the power consumption value. It should be understood that the above scheme is only an example and is not limited. When the power value can be directly obtained, such as when a power measurement component is added, the power value can be directly used for calculation; when the voltage, current and power change at any time, the power value and the power consumption value need to be obtained by integration.

[0050] Step S3: Obtain the power consumption deviation of each flow guide groove according to the power consumption value and the predetermined power consumption.

[0051] According to The power consumption deviation is calculated. According to the actual situation, the power consumption value may be greater than the predetermined power consumption, or may be less than the predetermined power consumption. When the power consumption value is greater than the predetermined power consumption, the operating power of the heating module 22 or the first cooling structure 5 needs to be reduced; when the power consumption value is less than the predetermined power consumption, the operating power of the heating module 22 or the first cooling structure 5 needs to be increased.

[0052] Step S4: Obtain each power consumption deviation, judge whether the values of each power consumption deviation are consistent, and adjust the temperature by using the PID control method or the power consumption deviation control method according to the range of the power consumption deviation.

[0053] After the calculated power consumption deviation is obtained, it is judged whether unified regulation or local independent adjustment is needed according to whether the value of the power consumption deviation is consistent. Meanwhile, the range in which the power consumption deviation is located also determines which method is used for temperature regulation. Therefore, the values of the power consumption deviations need to be compared and judged.

[0054] Step S411: If the values of the power consumption deviations are consistent, it is judged in which range the power consumption deviation is located. If the power consumption deviation satisfies 0%≤power consumption deviation<10%, the first cooling structure 5 or each heating module 22 is controlled to operate by using the PID control method, otherwise, the power change value is obtained according to the power consumption deviation control method, and the first cooling structure 5 or each heating module 22 is controlled to change the operating power according to the power change value.

[0055] When the values of the power consumption deviations are consistent, temperature regulation needs to be performed through the adjustment of the first cooling structure 5 and the collaborative adjustment of the multiple heating modules 22. Since the power consumption deviation reflects the degree of change of power consumption in a short time, for the power consumption deviations in different numerical ranges, different degrees of temperature regulation modes need to be corresponded.

[0056] When the power consumption deviation satisfies 0%≤power consumption deviation<10%, the first cooling structure 5 or each heating module 22 is controlled to operate by using the PID control method. It should be understood that the embodiment is only an example and is not a limitation. According to the actual situation, the judgment range of the power consumption deviation can also be 0%≤power consumption deviation<5% or 0%≤power consumption deviation<20% and the like.

[0057] The PID control method is based on the set target temperature, temperature upper limit, temperature lower limit and temperature difference control value, wherein the target temperature is the temperature that needs to be reached in the test process; the temperature upper limit is the highest temperature that can be reached in the fluctuation range allowed by the target temperature; the temperature lower limit is the lowest temperature that can be reached in the fluctuation range allowed by the target temperature; and the temperature difference control value is the interval between the fluctuation range allowed by the target temperature and the target temperature, i.e. temperature upper limit=target temperature+temperature difference control value, temperature lower limit=target temperature-temperature difference control value.

[0058] Specifically, the PID control method includes: determining the temperature upper limit and the temperature lower limit according to the set target temperature and the temperature difference control value; judging whether the temperature data is greater than the temperature upper limit; if the temperature data is greater than the temperature upper limit, controlling the first cooling structure 5 to increase the power and / or the heating module 22 to decrease the power until the temperature data satisfies temperature lower limit≤temperature data≤target temperature; if the temperature data is less than or equal to the temperature upper limit, judging whether the temperature data is less than the temperature lower limit; If the temperature data < the lower temperature limit, control the first cooling structure 5 to reduce power and / or control the heating module 22 to increase power until the temperature data satisfies: target temperature ≤ temperature data ≤ upper temperature limit; If the temperature data satisfies: lower temperature limit ≤ temperature data ≤ upper temperature limit, maintain the power of the first cooling structure 5 and the heating module 22.

[0059] When the power consumption deviation ≥ 10%, obtain the power change value according to the power consumption deviation control method, and control the first cooling structure 5 or each heating module 22 to change the operating power according to the power change value. Since the power consumption deviation is already large, different coefficients need to be added to obtain the corresponding power change value corresponding to different power consumption deviation ranges.

[0060] Specifically, with reference to Figure 12 , the power consumption deviation control method comprises: Step S421: Determine the range of the power consumption deviation.

[0061] In this embodiment, the different ranges of the power consumption deviation are 10%~20%, 20%~30% and 30% or more. Different coefficients are adjusted corresponding to different ranges. It should be understood that this embodiment is only an example and is not limiting. According to actual conditions, 10%~15% can also be selected as an interval, or 10%~30% can also be selected as an interval, etc.

[0062] Step S422: Obtain the interval coefficient according to the range of the power consumption deviation.

[0063] Specifically, in this embodiment, if the power consumption deviation satisfies: 10%≤ power consumption deviation < 20%, a first coefficient is used as the interval coefficient; If the power consumption deviation satisfies: 20%≤ power consumption deviation < 30%, a second coefficient is used as the interval coefficient; If the power consumption deviation satisfies: 30%≤ power consumption deviation, a third coefficient is used as the interval coefficient.

[0064] According to actual conditions, the first coefficient, the second coefficient and the third coefficient are determined according to the related parameters of the first cooling structure 5 and the related parameters of the heating module 22. For example, different models of the first cooling structure 5 correspond to different air volume adjustment degrees of the fan, so the first coefficient, the second coefficient and the third coefficient need to be determined based on specific components. As the power consumption deviation gradually increases, the value of the interval coefficient also tends to gradually increase.

[0065] Step S423: According to Calculate the power change value, where ΔQ is the power change value, i is the interval coefficient, ΔP is the power consumption deviation, and Δt is the difference between the temperature data and the target temperature.

[0066] According to actual conditions, the power change value can be calculated as an absolute value of the difference, or as a positive or negative value to determine whether the power is increased or decreased. When the power change value is an absolute value, the difference is |target temperature - temperature data|; when the power change value is a positive or negative value, the difference is target temperature - temperature data.

[0067] Step S412: If the values of the power consumption deviations are inconsistent, determine the range of each power consumption deviation. For each power consumption deviation corresponding to a guide slot, if the power consumption deviation satisfies 0%≤power consumption deviation<10%, use the PID control method to control the corresponding heating module 22 to operate, otherwise, obtain the power change value according to the power consumption deviation control method, and control the corresponding heating module 22 to change the operating power according to the power change value.

[0068] When the values of the power consumption deviations are inconsistent, the first cooling structure 5 can only achieve uniform adjustment, so temperature control needs to be achieved through the coordinated adjustment of the first cooling structure 5 and the multiple heating modules 22. Since the power consumption deviation reflects the degree of change in power consumption in a short period of time, for power consumption deviations in different numerical ranges, different degrees of temperature adjustment are required.

[0069] When the power consumption deviation satisfies 0%≤power consumption deviation<10%, the PID control method is used to control the first cooling structure 5 or each heating module 22 to operate. It should be understood that the present embodiment is only an example and is not limiting. According to actual conditions, the range of the power consumption deviation can also be 0%≤power consumption deviation<5% or 0%≤power consumption deviation<20%, etc. The first cooling structure 5 and / or the heating module 22 are controlled according to the aforementioned PID control method. Since independent control is achieved through the heating module 22, when cooling is required, simultaneous cooling through the first cooling structure 5 and partial heating through some of the heating modules 22 is often used to achieve local adjustment.

[0070] When the power consumption deviation is ≥10%, the power change value is obtained according to the power consumption deviation control method, and the first cooling structure 5 or each heating module 22 is controlled to change the operating power according to the power change value. Since the power consumption deviation is already large, different coefficients need to be added to obtain the corresponding power change value for different ranges of power consumption deviations.

[0071] According to the foregoing power consumption deviation control method, the first cooling structure 5 and / or the heating module 22 are controlled and regulated. Since independent control is achieved through the heating module 22, the simultaneous adjustment through the first cooling structure 5 and the partial adjustment of some heating modules 22 are often achieved. For example, when a part of the flow guide cavity corresponds to a power consumption deviation in the interval of 10%≤power consumption deviation<20%, and another part of the flow guide cavity corresponds to a power consumption deviation in the interval of 20%≤power consumption deviation<30%, the power change value of each part is calculated, and the adjustment of the first cooling structure 5 and the adjustment of each heating module 22 are controlled respectively to achieve overall temperature control.

[0072] The embodiment of the present application provides a temperature control device and a temperature control method. The temperature control device comprises a shell structure, a heating structure, a first cooling structure and a control module. The heating structure and the first cooling structure are arranged in a test cavity of the shell structure. The control module is arranged in the shell structure and is in control connection with the heating structure and the first cooling structure. The heating structure comprises a flow guide frame and a plurality of arranged heating modules. The flow guide frame and an insertion frame in the test cavity are buckled to form a plurality of flow guide cavities. The flow guide cavities are arranged correspondingly to the heating modules. By arranging a plurality of heating modules and corresponding the heating modules to the flow guide cavities, each memory bank can be individually controlled based on an independent channel to ensure that the temperature of the memory bank is stable and the heat is uniformly distributed during the test.

[0073] The above only describes the preferred embodiments of the present application and is not used to limit the present application. For those skilled in the art, the present application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A temperature control device, characterized by, The temperature control device comprises: a shell structure, a test cavity is formed in the shell structure, and a plurality of insertion racks are arranged in the test cavity; a heating structure is installed in the test cavity, the heating structure comprises a plurality of heating modules and a flow guide rack, the plurality of heating modules are arranged at one end of the flow guide rack, the flow guide rack is buckled with the plurality of insertion racks to form a plurality of flow guide cavities, and each flow guide cavity is correspondingly arranged with each heating module; a first cooling structure is installed in the test cavity, and the first cooling structure is located at an end of the flow guide rack away from the heating module; a control module is arranged in the shell structure, and the control module is in control connection with the heating structure and the first cooling structure.

2. The temperature control device of claim 1, wherein Each heating module comprises a heat sink, a heating element, a heat conduction block, and a connecting rack, the heating element is arranged in the heat conduction block, the heat conduction block is connected to the inner side of the connecting rack, and the heat sink is connected to the side of the heat conduction block away from the connecting rack.

3. The temperature control device of claim 2, wherein, Each heat sink comprises a plurality of fins, the plurality of fins are vertically arranged and connected to form a plurality of openings, and the plurality of openings are open to the flow guide cavities.

4. The temperature control device of claim 3, wherein A plurality of flow guide partitions are arranged on the flow guide rack, a flow guide groove is formed between each adjacent two flow guide partitions, each flow guide groove is correspondingly arranged with each insertion rack to form the flow guide cavities, and the plurality of openings of each heat sink are open to the corresponding flow guide groove.

5. The temperature control device of claim 2, wherein, The heat conduction block comprises a first heat conduction plate and a second heat conduction plate connected to each other, one end of the heating element is connected with an electrode lead column, the first heat conduction plate is protruded to form a protruding part, a gap is formed between the protruding part and the second heat conduction plate, the heating element is arranged in the gap, and the electrode lead column extends out of the gap.

6. The temperature control device of claim 2, wherein, Each connecting rack is formed in a C shape to surround the heat sink, the heating element, and the heat conduction block, the opening directions of the plurality of connecting racks are the same, and adjacent connecting racks are connected through a fixing assembly.

7. The temperature control device of claim 2, wherein The heating structure further comprises a positioning plate, a protection rack, and a protection plate, the protection rack and the protection plate are connected and form a containing cavity, the plurality of heating modules are arranged in the containing cavity in a direction perpendicular to the length direction of the heating structure, the plurality of heating modules are connected to each other, the front side of the protection plate is connected with the flow guide rack, the bottom surface of the positioning plate is connected with the heating structure, and one end of the positioning plate is connected with the first cooling structure.

8. The temperature control device of claim 4, wherein, The temperature control device further comprises a plurality of sensors, one sensor is arranged in each flow guide groove, and the control module is in control connection with the sensors.

9. The temperature control device of claim 1, wherein, The shell structure comprises a receiving rack, a rotating part, and a movable rack, the rotating part is connected to one end of the top surface of the receiving rack, the movable rack is rotatably arranged on one side of the rotating part, the movable rack is covered with the receiving rack to form the test cavity, the plurality of insertion racks are installed on the top surface of the receiving rack, and the heating structure and the first cooling structure are connected to the inner side of the movable rack.

10. The temperature control device of claim 7, wherein, The temperature control device further comprises a second cooling structure connected to one side of the accommodation cavity at an end of the heating module away from the flow guide frame, the air outlet direction of the second cooling structure is the same as that of the first cooling structure, the second cooling structure is connected to the protection plate, and the control module is in control connection with the second cooling structure.

11. A temperature control method, characterized by, The temperature control method comprises: obtaining temperature data of sensors in the plurality of flow guide grooves; calculating power consumption values of the flow guide grooves according to the temperature data; calculating power consumption deviations of the flow guide grooves according to the power consumption values and predetermined power consumption; obtaining the power consumption deviations, judging whether the values of the power consumption deviations are consistent, and adjusting the temperature according to the range of the power consumption deviations by using a PID control method or a power consumption deviation control method.

12. The temperature control method of claim 11, wherein, The judgment whether the values of the power consumption deviations are consistent and the adjustment of the temperature according to the range of the power consumption deviations by using the PID control method or the power consumption deviation control method comprise: if the values of the power consumption deviations are consistent, judging the range of the power consumption deviations, if the power consumption deviation satisfies 0%≤power consumption deviation<10%, using the PID control method to control the operation of the first cooling structure or each heating module, otherwise, obtaining a power change value according to the power consumption deviation control method, and controlling the first cooling structure or each heating module to change the operation power according to the power change value; if the values of the power consumption deviations are inconsistent, judging the range of the power consumption deviations, for the power consumption deviation corresponding to each flow guide groove, if the power consumption deviation satisfies 0%≤power consumption deviation<10%, using the PID control method to control the operation of the corresponding heating module, otherwise, obtaining a power change value according to the power consumption deviation control method, and controlling the corresponding heating module to change the operation power according to the power change value.

13. The temperature control method of claim 12, wherein, The power consumption deviation control method comprises: judging the range of the power consumption deviation; obtaining an interval coefficient according to the range of the power consumption deviation; According to calculating the power change value, wherein, AQ is the power change value, i is the interval coefficient, AP is the power consumption deviation, and At is the difference between the temperature data and the target temperature; wherein, the obtaining of the interval coefficient according to the range of the power consumption deviation comprises: if the power consumption deviation satisfies 10%≤power consumption deviation<20%, using a first coefficient as the interval coefficient; if the power consumption deviation satisfies 20%≤power consumption deviation<30%, using a second coefficient as the interval coefficient; if the power consumption deviation satisfies 30%≤power consumption deviation, using a third coefficient as the interval coefficient.

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