Memory stick automatic plug-in test equipment

Abstract

The application discloses a kind of memory bank automatic plug test equipment, it is related to memory bank test equipment technical field, including test component, including test equipment, the test equipment top is provided with test board, the test board is fixed with memory slot, the test equipment top is fixed with support column, the support column one side is fixed with support plate.The beneficial effects of the present application are that the first spring in the support shell can buffer the pressing force of the plug shell on the memory bank, preventing excessive pressure from damaging the memory bank;The rubber buffer pad on one side of the clamping plate can prevent hard scratches on the memory bank shell during clamping, while improving clamping stability;The limiting disc of the unlocking piece can limit the position of the lever, preventing invalid friction between the lever and the buckle, and reducing the wear rate of the two;The pressure sensor of the adjusting piece can trigger the stop when the buckle is not opened, preventing the memory bank from being pulled out hard, protecting the memory bank gold finger and the buckle structure of the memory slot.

Description

Technical Field

[0001] This invention relates to the field of memory module testing equipment technology, and in particular to an automatic memory module insertion and removal testing device. Background Technology

[0002] In the field of memory module manufacturing and motherboard compatibility testing, insertion and removal durability testing is a core step in verifying the reliability of the connection between memory modules and slots. Existing automatic insertion and removal testing equipment for memory modules mostly uses a rigid drive structure to complete the insertion and removal action. This design has obvious defects: First, the pressure applied during insertion and removal cannot be precisely controlled, which can easily cause hard damage such as wear on the gold fingers of the memory module and bending of the PCB motherboard; Second, the equipment has poor coordination between unlocking the memory slot latches and the insertion and removal action, which can lead to situations where the latches are not fully open before forced insertion or removal, resulting in deformation of the latch springs and damage to the memory module. Summary of the Invention

[0003] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the invention.

[0004] In view of the problems existing in the above and / or existing automatic memory module insertion and removal test equipment, the present invention is proposed.

[0005] Therefore, the problem that this invention aims to solve is that existing automatic memory module insertion and removal testing equipment sometimes forces insertion and removal when the latch is not fully open.

[0006] To solve the above technical problems, the present invention provides the following technical solution: an automatic memory module insertion and removal testing device, comprising a testing component including a testing device, a testing board disposed on the top of the testing device, a memory slot fixed on the testing board, a support column fixed on the top of the testing device, a support plate fixed on one side of the support column, a sliding column fixed inside the support plate, an adjustment plate fixed on the surface of the sliding column, a driving cylinder fixed at the bottom of the adjustment plate, and a memory module disposed below the output end of the driving cylinder;

[0007] An adjustment component, disposed at the output end of the drive cylinder, includes a plug-in component disposed at the output end of the drive cylinder. The plug-in component includes a support shell fixed to the output end of the drive cylinder. A compression shell slides inside the support shell. A first spring is fixed inside the support shell. The other end of the first spring is fixed to the inner wall of the compression shell. A plug-in shell is fixed at the bottom of the compression shell. The memory module is located inside the plug-in shell.

[0008] As a preferred embodiment of the automatic insertion and removal testing device for memory modules described in this invention, the adjustment component further includes a clamping member disposed within the insertion and removal housing, the clamping member including a clamping cylinder fixed within the insertion and removal housing, and a driving block fixed to the output end of the clamping cylinder.

[0009] As a preferred embodiment of the memory module automatic insertion and removal testing device of the present invention, the clamping member further includes a support block fixed to the surface of the insertion and removal shell, a rotating block is rotatably connected inside the support block, a clamping arm is fixed to one side of the rotating block, a clamping plate is fixed to the end of the clamping arm, and a buffer pad is fixed to one side of the clamping plate.

[0010] As a preferred embodiment of the memory module automatic insertion and removal testing device of the present invention, the clamping member further includes a first extrusion wheel rotatably connected inside the clamping arm, the surface of the driving block is provided with an extrusion surface and a retention surface, and a second spring is fixed on one side of the clamping arm.

[0011] In a preferred embodiment of the automatic insertion and removal testing device for memory modules described in this invention, the adjustment component further includes an unlocking component disposed on one side of the insertion and removal housing. The unlocking component includes a support base fixed inside the insertion and removal housing. A rotating rod is rotatably connected inside the support base. A torsion spring is disposed between the rotating rod and the support base. A support sleeve is fixed to the surface of the rotating rod. A lever slides inside the support sleeve. A third spring is fixed inside the lever. The other end of the third spring is fixed to the inner wall of the support sleeve. A lever block is fixed to the end of the lever. A latch is disposed on the memory slot.

[0012] In a preferred embodiment of the automatic memory module insertion and removal testing device of the present invention, the unlocking component further includes a drive rod fixed to the surface of the rotating rod, a support frame fixed to the surface of the sliding column, a limit block fixed to the bottom of the insertion and removal housing, a detection plate rotatably connected inside the insertion and removal housing, a moving plate sliding inside the insertion and removal housing, a reset spring fixed to one side of the moving plate, the other end of the reset spring fixed inside the insertion and removal housing, an insertion plate sliding inside the moving plate, a compression spring fixed inside the insertion plate, the other end of the compression spring fixed inside the moving plate, a limit disk fixed to the surface of the rotating rod, a positioning groove formed on the surface of the limit disk, and the end of the insertion plate being insertable into the positioning groove.

[0013] As a preferred embodiment of the automatic insertion and removal testing device for memory modules according to the present invention, the adjustment component further includes an adjustment member disposed on the insertion and removal shell, the adjustment member including a fixing frame fixed to the surface of the support base, a rotating shaft rotatably connected inside the fixing frame, a swing rod fixed to the end of the rotating shaft, and a detection rod fixed to the end of the swing rod.

[0014] In a preferred embodiment of the automatic memory module insertion and removal testing device of the present invention, the adjusting component further includes a connecting rod fixed to the surface of the swing arm, a lifting rod fixed to the end of the connecting rod, and a sliding groove provided on the surface of the insertion and removal housing, wherein the lifting rod slides within the sliding groove.

[0015] As a preferred embodiment of the memory module automatic insertion and removal testing device of the present invention, the adjusting component further includes a lifting shell that slides within the insertion and removal shell, a fourth spring is fixed inside the lifting shell, the other end of the fourth spring is fixed to the inner wall of the insertion and removal shell, a pressing column is fixed to the top of the lifting shell, and a pressure sensor is fixed inside the insertion and removal shell.

[0016] In a preferred embodiment of the automatic memory module insertion and removal testing device of the present invention, the adjusting component further includes a transmission rod that slides within the insertion and removal housing. A fifth spring is fixed to one side of the transmission rod, and the other end of the fifth spring is fixed to the inner wall of the insertion and removal housing. A second extrusion wheel is rotatably connected to the end of the transmission rod, and the second extrusion wheel is located on one side of the driving block. An insertion rod slides within the other end of the transmission rod, and a sixth spring is fixed within the insertion rod. The other end of the sixth spring is fixed to the inner wall of the transmission rod. An extrusion groove is provided within the lifting housing.

[0017] The beneficial effects of this invention are:

[0018] The first spring inside the support shell can buffer the pressure of the insertion and removal shell on the memory module, preventing excessive pressure from damaging the memory module; the rubber buffer pad on one side of the clamping plate can prevent hard scratches on the memory module shell during clamping, while improving clamping stability.

[0019] The innovative unlocking mechanism features a limiting structure consisting of a detection board, a limiting plate, and an insertion plate. This structure allows for precise locking of the lever position after the memory module is removed. When the memory module is pulled out and placed inside the insertion / removal housing, it presses against the detection board. Through a transmission structure, the insertion plate is inserted into the positioning groove of the limiting plate, limiting the rotation angle of the lever and keeping it in a position where the latch cannot be moved. The core advantage of this design is that when the memory module is reinserted, the latch is in the open state, preventing ineffective friction between the lever and the latch, thus reducing the wear rate between the lever and the latch.

[0020] The adjustment mechanism can forcibly stop the drive cylinder when the latch is not unlocked, completely avoiding component damage caused by forced insertion and removal. If the latch is not successfully unlocked, the supporting action of the detection rod will drive the lifting rod to move upward, so that the extrusion groove in the lifting housing is aligned with the insertion rod. The sixth spring pushes the insertion rod to squeeze the lifting housing, thereby causing the extrusion column to trigger the pressure sensor, and the drive cylinder stops immediately. This design solves the problem of memory module damage caused by forced insertion and removal when the latch is not unlocked in traditional equipment.

[0021] After the unlocking component completes the latch unlocking, the adjusting component monitors the latch status in real time. If unlocking is successful, the driving cylinder performs the insertion and removal action. If unlocking fails, the adjusting component triggers the shutdown protection. After insertion and removal are completed, the limiting structure of the unlocking component locks the lever position, preparing for the next test. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a scene diagram of a test device for automatically inserting and removing memory modules.

[0024] Figure 2 Automatic insertion and removal testing equipment for memory modules Figure 1 Enlarged view of the structure at point B in the middle.

[0025] Figure 3 This is a diagram of the insertion and removal shell structure of an automatic memory module insertion and removal test device.

[0026] Figure 4 This is a side view of the insertion and removal shell of an automatic memory module insertion and removal test device.

[0027] Figure 5 Automatic insertion and removal testing equipment for memory modules Figure 4 Sectional view of the structure at point AA.

[0028] Figure 6 Automatic insertion and removal testing equipment for memory modules Figure 5 Enlarged view of the structure at point C.

[0029] Figure 7 Automatic insertion and removal testing equipment for memory modules Figure 5 Enlarged view of the structure at point D.

[0030] Figure 8 This is a cross-sectional view of the limit disk of an automatic memory module insertion and removal test device.

[0031] Figure 9 Automatic insertion and removal testing equipment for memory modules Figure 8 Enlarged view of the structure at point E in the middle.

[0032] Figure 10 This is a diagram of the lifting housing structure of an automatic memory module insertion and removal test device.

[0033] Figure 11 This is a diagram of the driver block structure for an automatic memory module insertion and removal test device.

[0034] Figure 12 This is a partial cross-sectional view of the insertion and removal shell of an automatic memory module insertion and removal test device.

[0035] In the diagram: Test component 1; Test device 11; Test board 12; Memory slot 13; Support column 14; Support plate 15; Sliding column 16; Adjusting plate 17; Drive cylinder 18; Memory module 19; Adjusting component 2; Insert / remove part 21; Support shell 211; Extrusion shell 212; First spring 213; Insert / remove shell 214; Clamping part 22; Clamping cylinder 221; Drive block 222; Support block 223; Rotating block 224; Clamping arm 225; Clamping plate 226; Buffer pad 227; First extrusion wheel 228; Extrusion surface 222-1; Retention surface 222-2; Second spring 229; Unlocking part 23; Support seat 231; Rotating rod 232; Support sleeve 233; Lever 234; Third spring 2 35; Pulley 236; Buckle 13-1; Drive rod 237; Support frame 238; Limit block 239; Detection plate 2310; Moving plate 2311; Reset spring 2312; Insert plate 2313; Compression spring 2314; Limit plate 2315; Positioning groove 2315-1; Adjusting component 24; Fixing frame 241; Rotating shaft 242; Swing rod 243; Detection rod 244; Connecting rod 245; Lifting rod 246; Slide groove 214-1; Lifting shell 247; Fourth spring 248; Extrusion column 249; Pressure sensor 2410; Transmission rod 2411; Fifth spring 2412; Second extrusion wheel 2415; Insert rod 2413; Sixth spring 2414; Extrusion groove 247-1. Detailed Implementation

[0036] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0037] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0038] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that is mutually exclusive with other embodiments.

[0039] Example 1, referring to Figures 1-5This is the first embodiment of the present invention, which provides an automatic memory module insertion and removal test device. The device includes a test component 1, comprising a test device 11. The test device 11 is prior art and can be a testing device such as an oscilloscope or impedance analyzer, used to test the electrical connection between the memory module and the slot. A test board 12 is mounted on the top of the test device 11. The test board 12 is a circuit board, and a memory slot 13 is fixed on the test board 12. Two support pillars 14 are fixed on the top of the test device 11. A support plate 15 is fixed to one side of each support pillar 14. A sliding column 16 is fixed, and an adjustment plate 17 is fixed on the surface of the sliding column 16. A drive cylinder 18 is fixed at the bottom of the adjustment plate 17. A memory module 19 is disposed below the output end of the drive cylinder 18. By activating the drive cylinder 18, the output end of the drive cylinder 18 can move the memory module 19 closer to the memory slot 13, thereby inserting the memory module 19 into the memory slot 13. At the same time, the memory module 19 can be pulled out of the memory slot 13, thus completing the insertion and removal action of the memory module 19. The electrical connection between the memory module 19 and the memory slot 13 can be monitored by the testing device 11, thereby testing the insertion and removal durability of the memory module 19.

[0040] Adjustment component 2, located at the output end of drive cylinder 18, includes a plug-in component 21 located at the output end of drive cylinder 18. The plug-in component 21 includes a support shell 211 fixed to the output end of drive cylinder 18. A compression shell 212 slides inside the support shell 211. A first spring 213 is fixed inside the support shell 211. The other end of the first spring 213 is fixed to the inner wall of the compression shell 212. The first spring 213 is in a compressed state. A plug-in shell 214 is fixed to the bottom of the compression shell 212. The memory module 19 is located inside the plug-in shell 214.

[0041] The support shell 211 can be moved up and down by the output end of the drive cylinder 18, so that the support shell 211 can be squeezed by the first spring 213, which in turn squeezes the insertion shell 214, thus pressing the memory module 19 inside the insertion shell 214 into the memory slot 13, thereby completing the insertion of the memory module 19. The first spring 213 is designed to prevent the insertion shell 214 from applying too much pressure to the memory module 19, which could cause hard damage to the memory module 19.

[0042] When the memory module 19 needs to be removed, the output end of the drive cylinder 18 can be retracted. At this time, the support shell 211 can drive the pressing shell 212 to move upward, thereby causing the pressing shell 212 to drive the insertion shell 214 to move upward, so that the insertion shell 214 can drive the memory module 19 to be removed from the memory slot 13.

[0043] Example 2, refer to Figures 2-4 , Figure 6 , Figure 8 , Figure 9 , Figure 11 and Figure 12 This is the second embodiment of the present invention, which is based on the previous embodiment.

[0044] Specifically, the adjustment component 2 also includes a clamping member 22 disposed in the plug-in housing 214. The clamping member 22 includes a clamping cylinder 221 fixed in the plug-in housing 214. A driving block 222 is fixed at the output end of the clamping cylinder 221. The driving block 222 slides in the plug-in housing 214 and cannot rotate relative to the plug-in housing 214.

[0045] Activating the clamping cylinder 221 allows the output end of the clamping cylinder 221 to drive the drive block 222 to slide within the insertion and removal housing 214.

[0046] The clamping component 22 also includes a support block 223 fixed to the surface of the plug-in housing 214. A rotating block 224 is rotatably connected inside the support block 223. A clamping arm 225 is fixed to one side of the rotating block 224. A clamping plate 226 is fixed to the end of the clamping arm 225. A buffer pad 227 is fixed to one side of the clamping plate 226. The buffer pad 227 can be made of rubber. The clamping arm 225 can drive the clamping plate 226 and the buffer pad 227 to move closer to the memory module 19, so that the two buffer pads 227 clamp the memory module 19. The buffer pad 227 can prevent hard damage to the memory module 19 when clamping.

[0047] The clamping member 22 also includes a first extrusion wheel 228 rotatably connected inside the clamping arm 225. The surface of the driving block 222 is provided with an extrusion surface 222-1 and a retention surface 222-2. The extrusion surface 222-1 and the retention surface 222-2 are provided on all four sides of the driving block 222.

[0048] A second spring 229 is fixed to one side of the clamping arm 225, and the second spring 229 is in a compressed state.

[0049] In the current illustrated state, the first extrusion roller 228 is located on one side of the extrusion surface 222-1. When the drive block 222 moves, causing the retention surface 222-2 to move to the side of the first extrusion roller 228, the clamping arm 225 can be pushed by the reset force of the second spring 229, causing the clamping arm 225 to swing, thereby causing the first extrusion roller 228 to fall onto the retention surface 222-2. At this time, the two buffer pads 227 move away from the memory module 19, thereby releasing the clamping of the memory module 19.

[0050] Adjustment component 2 also includes an unlocking component 23 disposed on one side of the insertion / removal housing 214. The unlocking component 23 includes a support base 231 fixed inside the insertion / removal housing 214. A rotating rod 232 is rotatably connected inside the support base 231. A torsion spring is disposed between the rotating rod 232 and the support base 231. A support sleeve 233 is fixed to the surface of the rotating rod 232. A lever 234 slides inside the support sleeve 233. A limit is set between the lever 234 and the support sleeve 233 to prevent the lever 234 from rotating relative to the support sleeve 233. A third spring 235 is fixed inside the lever 234. In the normal state shown in Figure 235, the other end of the third spring 235 is fixed to the inner wall of the support sleeve 233, and the end of the lever 234 is fixed with a lever block 236. There are two latches 13-1 on the memory slot 13. The latches 13-1 are existing technology and can lock the memory module 19. When the latches 13-1 are in the open state, the memory module 19 is inserted into the memory slot 13. At this time, pressing the memory module 19 will cause the latches 13-1 to close automatically and lock the memory module 19. The memory module 19 can only be unlocked after the two latches 13-1 are reopened.

[0051] The surface of the lever 236 is provided with an anti-slip friction-enhancing layer, which allows the lever 236 to move the latch 13-1, thereby releasing the latch 13-1 from locking the memory module 19. The third spring 235 allows the lever 234 to adapt to changes in the distance between the insertion and removal shell 214 and the memory slot 13, so that the lever 234 has sufficient supporting force to drive the lever 236 to open the latch 13-1.

[0052] The unlocking component 23 also includes a drive rod 237 fixed to the surface of the rotating rod 232, and a support frame 238 fixed to the surface of the sliding column 16. When the insertion and removal shell 214 moves downward, the drive rod 237 will be blocked by the support frame 238, so that the drive rod 237 drives the rotating rod 232 to rotate, thereby causing the lever 234 to swing, so that the lever 234 drives the lever block 236 to move the buckle 13-1, thereby opening the buckle 13-1.

[0053] The bottom of the insert housing 214 is fixed with a limit block 239. Under the elastic force of the torsion spring between the rotating rod 232 and the support base 231, the lever 234 can swing towards the limit block 239, so that the limit block 239 blocks and limits the position of the support sleeve 233.

[0054] A detection board 2310 is rotatably connected inside the insertion and removal housing 214. When the memory module 19 is inside the insertion and removal housing 214, the memory module 19 can press against the detection board 2310, causing the detection board 2310 to rotate.

[0055] A movable plate 2311 slides inside the plug-in housing 214. A return spring 2312 is fixed on one side of the movable plate 2311, and the other end of the return spring 2312 is fixed inside the plug-in housing 214. The return spring 2312 is currently in a stretched state. An insert plate 2313 slides inside the movable plate 2311. A compression spring 2314 is fixed inside the insert plate 2313, and the other end of the compression spring 2314 is fixed inside the movable plate 2311. A limit plate 2315 is fixed on the surface of the rotating rod 232. A positioning groove 2315-1 is opened on the surface of the limit plate 2315. The end of the insert plate 2313 can be inserted into the positioning groove 2315-1, thereby limiting the angle of the limit plate 2315, thereby limiting the rotation angle of the rotating rod 232, and thus limiting the position of the lever 234.

[0056] When the memory module 19 is removed from the memory slot 13, it will continuously press against the detection board 2310, keeping the lever 234 in the current illustrated state, i.e., the lever 234 cannot move the latch 13-1. When the memory module 19 is reinserted into the memory slot 13, since the latch 13-1 was in the open state when the memory module 19 was removed, there is no need for the lever 236 to open the latch 13-1. This process, through the limiting plate 2315 limiting the position of the lever 234, can avoid the lever 236 from rubbing ineffectively against the latch 13-1, reducing the wear of the lever 236 and the latch 13-1.

[0057] Example 3, referring to Figures 1-12 This is the third embodiment of the present invention, which is based on the first two embodiments.

[0058] Specifically, the adjustment assembly 2 also includes an adjustment component 24 disposed on the plug-in housing 214. The adjustment component 24 includes a fixing frame 241 fixed to the surface of the support base 231. A rotating shaft 242 is rotatably connected inside the fixing frame 241. A swing rod 243 is fixed to the end of the rotating shaft 242. A detection rod 244 is fixed to the end of the swing rod 243. When the buckle 13-1 is closed, the detection rod 244 will fall on the top of the buckle 13-1, thereby detecting whether the buckle 13-1 is closed by the position of the detection rod 244.

[0059] The adjusting component 24 also includes a connecting rod 245 fixed to the surface of the swing rod 243. A lifting rod 246 is fixed to the end of the connecting rod 245. A sliding groove 214-1 is opened on the surface of the plug-in housing 214, and the lifting rod 246 slides in the sliding groove 214-1.

[0060] When the swing arm 243 swings, it can drive the connecting rod 245 to move, thereby causing the connecting rod 245 to drive the lifting rod 246 to move.

[0061] The adjusting component 24 also includes a lifting shell 247 that slides within the insertion shell 214. A fourth spring 248 is fixed inside the lifting shell 247. The fourth spring 248 is currently in a compressed state, and its elastic force is relatively small. The lifting shell 247 can be reset and lowered by the elastic force of the fourth spring 248. The other end of the fourth spring 248 is fixed to the inner wall of the insertion shell 214. A pressing column 249 is fixed to the top of the lifting shell 247. A pressure sensor 2410 is fixed inside the insertion shell 214. When the lifting shell 247 rises and causes the pressing column 249 to press against the pressure sensor 2410, the drive cylinder 18 stops operating and no longer drives the insertion shell 214 to rise. The method of controlling the drive cylinder 18 through the pressure sensor 2410 is existing technology and will not be described in detail here.

[0062] The adjusting component 24 also includes a transmission rod 2411 that slides within the insertion and removal housing 214. A fifth spring 2412 is fixed to one side of the transmission rod 2411, and the other end of the fifth spring 2412 is fixed to the inner wall of the insertion and removal housing 214. The fifth spring 2412 is in a stretched state. A second extrusion wheel 2415 is rotatably connected to the end of the transmission rod 2411. The second extrusion wheel 2415 is located on one side of the drive block 222. In the current state, the second extrusion wheel 2415 is located on one side of the extrusion surface 222-1. An insertion rod 2413 slides within the other end of the transmission rod 2411. A sixth spring 2414 is fixed within the insertion rod 2413. The other end of the sixth spring 2414 is fixed to the inner wall of the transmission rod 2411. The sixth spring 2414 is in a compressed state. An extrusion groove 247-1 is provided within the lifting housing 247. The end of the insertion rod 2413 can extrude the extrusion groove 247-1, thereby enabling the lifting housing 247 to drive the extrusion column 249 to extrude the pressure sensor 2410.

[0063] When the latch 13-1 is in the open state, the top of the latch 13-1 cannot support the detection rod 244, so that the lifting rod 246 is located at the lower end of the slide 214-1. At this time, the lifting shell 247 moves downward under the reset force of the fourth spring 248. At this time, the pressing groove 247-1 is far away from the insertion rod 2413, and the insertion rod 2413 cannot be inserted into the pressing groove 247-1.

[0064] If the latch 13-1 closes at this time, the top of the latch 13-1 will push the detection rod 244, thereby causing the lifting rod 246 to move the lifting shell 247 upward, so that the extrusion groove 247-1 moves to one side of the end of the insertion rod 2413. At this time, under the push of the sixth spring 2414, the insertion rod 2413 can squeeze the extrusion groove 247-1, thereby causing the lifting shell 247 to move upward again. At this time, the lifting shell 247 moves away from the lifting rod 246, and the extrusion column 249 squeezes the pressure sensor 2410.

[0065] When in use, the memory module 19 is placed into the insertion and removal shell 214, and the clamping cylinder 221 is activated, causing the drive block 222 to move downward, thereby causing the extrusion surface 222-1 to press against the first extrusion wheel 228, which in turn causes the clamping arm 225 to swing, driving the clamping plate 226 and the buffer pad 227 to clamp the memory module 19.

[0066] At this time, the other two extrusion surfaces 222-1 can extrude the second extrusion wheel 2415, causing the transmission rod 2411 to drive the end of the insertion rod 2413 to extrude one side of the lifting shell 247.

[0067] At this time, the drive cylinder 18 is activated, causing the output end of the drive cylinder 18 to drive the extrusion shell 212 to move downward. As a result, under the elastic force of the first spring 213, the drive rod 237 is first blocked by the support frame 238, causing the drive rod 237 to drive the rotating rod 232 to rotate, thereby causing the lever 234 to swing. This causes the lever 234 to drive the lever block 236 to move the buckle 13-1, thereby opening the buckle 13-1.

[0068] This allows the memory module 19 to be inserted into the memory slot 13. At this time, the latch 13-1 can close automatically, causing the clamping cylinder 221 to drive the drive block 222 to move upward, causing the first pressing roller 228 to move to the side of the retention surface 222-2, releasing the clamp on the memory module 19. At this time, the drive cylinder 18 drives the insertion and removal shell 214 to move upward.

[0069] The connection between the memory module 19 and the memory slot 13 is tested using test device 11.

[0070] When the memory module 19 needs to be removed, the drive cylinder 18 drives the insertion and removal shell 214 to move downward, so that the unlocking block 236 of the unlocking component 23 opens the latch 13-1. The insertion and removal shell 214 moves downward and fits on the surface of the memory module 19, so that the output end of the clamping cylinder 221 drives the drive block 222 to move downward, thereby clamping the memory module 19 with the clamping plate 226 and the buffer pad 227.

[0071] If the latch 13-1 is not opened, it can support the detection rod 244, so that the lifting rod 246 is located at the upper end of the slide groove 214-1. At this time, the lifting shell 247 is supported by the lifting rod 246, so that the extrusion groove 247-1 moves to the end of the insertion rod 2413. Then, under the push of the sixth spring 2414, the insertion rod 2413 can press the extrusion groove 247-1, so that the lifting shell 247 moves upward again. At this time, the lifting shell 247 moves away from the lifting rod 246, and the extrusion column 249 presses the pressure sensor 2410, so that the drive cylinder 18 cannot move, thus preventing the memory stick 19 from being forcibly pulled out if the latch 13-1 is not opened.

[0072] If the latch 13-1 is successfully opened, the memory module 19 can be successfully pulled out by the insertion and removal case 214. At this time, the memory module 19 will continue to press against the detection board 2310, so that the lever 234 remains in the current state shown in the figure, that is, the lever 234 cannot move the latch 13-1. When the memory module 19 is inserted into the memory slot 13 again, since the latch 13-1 is in the open state, there is no need for the lever 236 to open the latch 13-1. This process, through the limiting plate 2315 limiting the position of the lever 234, can avoid the lever 236 from rubbing against the latch 13-1 ineffectively, and reduce the wear of the lever 236 and the latch 13-1.

[0073] Repeating the above process allows for repeated insertion and removal testing of memory module 19.

[0074] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. An automatic memory module insertion and removal testing device, characterized in that: include, The test component (1) includes a test device (11), a test board (12) is provided on the top of the test device (11), a memory slot (13) is fixed on the test board (12), a support column (14) is fixed on the top of the test device (11), a support plate (15) is fixed on one side of the support column (14), a sliding column (16) is fixed inside the support plate (15), an adjustment plate (17) is fixed on the surface of the sliding column (16), a drive cylinder (18) is fixed at the bottom of the adjustment plate (17), and a memory module (19) is provided below the output end of the drive cylinder (18). Adjustment component (2), located at the output end of the drive cylinder (18), includes a plug-in component (21) located at the output end of the drive cylinder (18). The plug-in component (21) includes a support shell (211) fixed to the output end of the drive cylinder (18). A compression shell (212) slides inside the support shell (211). A first spring (213) is fixed inside the support shell (211). The other end of the first spring (213) is fixed to the inner wall of the compression shell (212). A plug-in shell (214) is fixed at the bottom of the compression shell (212). The memory module (19) is located inside the plug-in shell (214). The adjustment component (2) further includes an unlocking component (23) disposed on one side of the plug-in housing (214). The unlocking component (23) includes a support base (231) fixed inside the plug-in housing (214). A rotating rod (232) is rotatably connected inside the support base (231). A torsion spring is disposed between the rotating rod (232) and the support base (231). A support sleeve (233) is fixed on the surface of the rotating rod (232). A lever (234) slides inside the support sleeve (233). A third spring (235) is fixed inside the lever (234). The other end of the third spring (235) is fixed to the inner wall of the support sleeve (233). A lever block (236) is fixed at the end of the lever (234). A buckle (13-1) is disposed on the memory slot (13). The unlocking component (23) also includes a drive rod (237) fixed to the surface of the rotating rod (232), a support frame (238) fixed to the surface of the sliding column (16), a limit block (239) fixed to the bottom of the insertion shell (214), a detection plate (2310) rotatably connected inside the insertion shell (214), a moving plate (2311) sliding inside the insertion shell (214), a return spring (2312) fixed to one side of the moving plate (2311), and a fixed end of the return spring (2312) fixed to the other side. Inside the plug-in housing (214), a plug plate (2313) slides inside the movable plate (2311), a compression spring (2314) is fixed inside the plug plate (2313), and the other end of the compression spring (2314) is fixed inside the movable plate (2311). A limit plate (2315) is fixed on the surface of the rotating rod (232), and a positioning groove (2315-1) is opened on the surface of the limit plate (2315). The end of the plug plate (2313) can be inserted into the positioning groove (2315-1). The adjustment assembly (2) further includes an adjustment member (24) disposed on the plug-in housing (214). The adjustment member (24) includes a fixing frame (241) fixed to the surface of the support base (231). A rotating shaft (242) is rotatably connected inside the fixing frame (241). A swing rod (243) is fixed to the end of the rotating shaft (242). A detection rod (244) is fixed to the end of the swing rod (243).

2. The memory module automatic insertion and removal testing device as described in claim 1, characterized in that: The adjustment component (2) further includes a clamping member (22) disposed in the plug-in housing (214). The clamping member (22) includes a clamping cylinder (221) fixed in the plug-in housing (214). A drive block (222) is fixed at the output end of the clamping cylinder (221).

3. The memory module automatic insertion and removal testing device as described in claim 2, characterized in that: The clamping member (22) further includes a support block (223) fixed to the surface of the plug-in shell (214). A rotating block (224) is rotatably connected inside the support block (223). A clamping arm (225) is fixed on one side of the rotating block (224). A clamping plate (226) is fixed at the end of the clamping arm (225). A buffer pad (227) is fixed on one side of the clamping plate (226).

4. The memory module automatic insertion and removal testing device as described in claim 3, characterized in that: The clamping member (22) also includes a first extrusion wheel (228) rotatably connected inside the clamping arm (225), the surface of the driving block (222) is provided with an extrusion surface (222-1) and a retention surface (222-2), and a second spring (229) is fixed on one side of the clamping arm (225).

5. The memory module automatic insertion and removal testing device as described in claim 4, characterized in that: The adjusting component (24) also includes a connecting rod (245) fixed to the surface of the swing rod (243), and a lifting rod (246) is fixed to the end of the connecting rod (245). A sliding groove (214-1) is provided on the surface of the plug-in housing (214), and the lifting rod (246) slides in the sliding groove (214-1).

6. The memory module automatic insertion and removal testing device as described in claim 5, characterized in that: The adjusting member (24) further includes a lifting shell (247) that slides within the insertion shell (214). A fourth spring (248) is fixed inside the lifting shell (247), and the other end of the fourth spring (248) is fixed to the inner wall of the insertion shell (214). A pressing column (249) is fixed to the top of the lifting shell (247), and a pressure sensor (2410) is fixed inside the insertion shell (214).

7. The memory module automatic insertion and removal testing device as described in claim 6, characterized in that: The adjusting component (24) further includes a transmission rod (2411) that slides within the insertion housing (214). A fifth spring (2412) is fixed to one side of the transmission rod (2411), and the other end of the fifth spring (2412) is fixed to the inner wall of the insertion housing (214). A second extrusion wheel (2415) is rotatably connected to the end of the transmission rod (2411). The second extrusion wheel (2415) is located on one side of the drive block (222). A plug rod (2413) slides within the other end of the transmission rod (2411). A sixth spring (2414) is fixed within the plug rod (2413), and the other end of the sixth spring (2414) is fixed to the inner wall of the transmission rod (2411). An extrusion groove (247-1) is provided inside the lifting housing (247).

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