Fluid-solid-heat coupling joint simulation method, device and equipment and readable storage medium

Abstract

According to the fluid-solid-heat coupling joint simulation method, device and equipment and the readable storage medium, fluid-heat cooperative solution is executed on a one-dimensional fluid network model, fluid key parameters capable of serving as a three-dimensional solid model thermal analysis load and boundary condition basis are output, and accurate input is provided for three-dimensional solid model thermal analysis; the three-dimensional solid model completes thermal analysis based on the input and outputs the solid wall surface temperature, the solid wall surface temperature is reversely fed back to the one-dimensional fluid network model, and a basis is provided for dynamic adjustment of solving parameters of the one-dimensional fluid network model; after one-dimensional fluid network model solving parameters are adjusted based on the feedback solid wall surface temperature, iterative solution is performed on the two models until a calculation result converges, dynamic adaptation of boundary parameters in a fluid-structure interaction state is realized, simulation deviation caused by static boundary hypothesis is avoided, and the simulation precision is improved. The high efficiency of system-level global prediction and the accuracy of detail analysis of local key components are synchronously guaranteed within controllable calculation overhead, and the comprehensive reliability of a thermal coupling simulation result is improved.

Description

Technical Field

[0001] This application relates to the field of automotive engineering, specifically to a fluid-structure-thermal coupling co-simulation method, apparatus, equipment, and readable storage medium. Background Technology

[0002] Currently, the joint simulation technology of one-dimensional fluid network and three-dimensional solid thermal coupling is increasingly widely used in engineering fields such as automobiles, machinery, and electronics. In engineering practice, higher requirements are placed on the efficiency and accuracy of this type of simulation. It is necessary to quickly complete the calculation of global parameters at the system level, and to accurately analyze the local physical field details of key components in order to support the design optimization and performance prediction of complex products.

[0003] In related technologies, the joint simulation technology of one-dimensional fluid network and three-dimensional solid thermal coupling usually constructs a one-dimensional fluid network model and a three-dimensional solid model respectively, and realizes data interaction between the two models through preset fixed boundary conditions, thereby completing the thermal coupling analysis between fluid and solid in engineering scenarios and providing a reference for system thermal performance evaluation.

[0004] However, there are still obvious shortcomings in its application: it adopts the static boundary assumption and cannot adjust the boundary parameters according to the dynamic changes of the fluid-structure interaction state during the simulation, resulting in deviations between the simulation results and the actual working conditions. Summary of the Invention

[0005] This application provides a fluid-structure-thermal coupling co-simulation method, apparatus, device, and readable storage medium, which can solve the technical problem in related technologies that use static boundary assumptions and cannot adjust boundary parameters according to the dynamic changes of the fluid-structure coupling state during the simulation process, resulting in deviations between simulation results and actual working conditions.

[0006] In a first aspect, embodiments of this application provide a method for joint simulation of one-dimensional fluid networks and three-dimensional solid thermal coupling, the method comprising: A fluid-thermal co-solution method is used to solve a one-dimensional fluid network model to obtain key fluid parameters that can serve as the basis for thermal analysis loads and boundary conditions of a three-dimensional solid model. Thermal analysis of a three-dimensional solid model is performed to obtain the solid wall temperature, which is then fed back to a one-dimensional fluid network model. The solution parameters of the one-dimensional fluid network model are adjusted based on the feedback of the solid wall temperature. The one-dimensional fluid network model and the three-dimensional solid model are iteratively solved until the calculation results of the two converge, thus completing the thermal coupling joint simulation of the one-dimensional fluid network and the three-dimensional solid.

[0007] In conjunction with the first aspect, in one implementation, the method of performing a combined fluid-thermal solution on a one-dimensional fluid network model to obtain key fluid parameters that can serve as the basis for thermal analysis loads and boundary conditions of a three-dimensional solid model includes: A pressure correction algorithm and a fluid-thermal coupling algorithm are used to solve the governing equations of a one-dimensional fluid network model in a fluid-thermal synergistic manner. During the solution iteration process, the drag coefficient and heat transfer coefficient are dynamically optimized to obtain the key fluid parameters. The key fluid parameters include the inlet and outlet pressure field distribution, fluid physical property parameters, flow velocity distribution, and flow channel geometric characteristics. The fluid physical property parameters include fluid density and fluid specific heat capacity, and the flow channel geometric characteristics include the hydraulic diameter and the radius of curvature of the flow channel.

[0008] In conjunction with the first aspect, in one implementation, the step of performing thermal analysis on a three-dimensional solid model to obtain the solid wall temperature and feeding it back to a one-dimensional fluid network model includes: The inlet and outlet pressure field distributions in the key fluid parameters are mapped to the corresponding boundary nodes of the three-dimensional solid model to serve as loads for the thermal analysis of the three-dimensional solid model. Based on the fluid properties, velocity distribution, and channel geometry in the key fluid parameters, the local convective heat transfer coefficient and the average fluid temperature are calculated using empirical correlation formulas. The local convective heat transfer coefficient and the average fluid temperature are then transferred to the corresponding boundary of the three-dimensional solid model as boundary conditions for thermal analysis of the three-dimensional solid model. The three-dimensional solid model performs unsteady heat conduction analysis based on the received load and boundary conditions, and calculates the solid wall temperature at the interface between the solid and the fluid. The solid wall temperature is discretized, and the discretized solid wall temperature is fed back to the corresponding node in the one-dimensional fluid network model.

[0009] In conjunction with the first aspect, in one implementation, the step of adjusting the solution parameters of the one-dimensional fluid network model based on the feedback solid wall temperature, and iteratively solving the one-dimensional fluid network model and the three-dimensional solid model until the calculation results of both converge, includes: Based on the actual flow distribution fed back from the three-dimensional solid model by the one-dimensional fluid network model, the actual flow distribution is used as the basis for adjustment to dynamically correct the inlet flow boundary conditions and resolve the inlet and outlet pressure field distributions to complete the adjustment of the solution parameters. First, solve the one-dimensional fluid network model to obtain the updated key fluid parameters, then transfer them to the three-dimensional solid model and solve for the updated solid wall temperature. Finally, feed the updated solid wall temperature back to the one-dimensional fluid network model and repeat the above process. The calculation results are considered convergent when the inlet and outlet pressure field distribution and flow rate distribution of the one-dimensional fluid network model and the solid wall temperature of the three-dimensional solid model all meet the preset error range.

[0010] In conjunction with the first aspect, in one implementation, the step of adjusting the solution parameters of the one-dimensional fluid network model based on the feedback solid wall temperature, and iteratively solving the one-dimensional fluid network model and the three-dimensional solid model until the calculation results of both converge, includes: Based on the actual flow distribution fed back from the three-dimensional solid model by the one-dimensional fluid network model, the actual flow distribution is used as the basis for adjustment to dynamically correct the inlet flow boundary conditions and resolve the inlet and outlet pressure field distributions to complete the adjustment of the solution parameters. Simultaneously solve the governing equations of the one-dimensional fluid network model and the heat conduction equations of the three-dimensional solid model in a unified solver; The calculation results are considered convergent when the inlet and outlet pressure field distribution and flow rate distribution of the one-dimensional fluid network model and the solid wall temperature of the three-dimensional solid model all meet the preset error range.

[0011] In conjunction with the first aspect, in one implementation, before performing a combined fluid-thermal solution on the one-dimensional fluid network model to obtain key fluid parameters that can serve as the basis for thermal analysis loads and boundary conditions of the three-dimensional solid model, the method further includes: Construct a one-dimensional fluid network model and define the pipe parameters and boundary conditions of the one-dimensional fluid network model; the pipe parameters include pipe length, pipe diameter and pipe friction coefficient, and the boundary conditions include inlet flow rate and outlet pressure; A three-dimensional solid model is constructed, including key heat dissipation components that exchange heat with the fluid. These key heat dissipation components include the chip, heat sink fins, chassis shell, and heat sink substrate. The three-dimensional solid model is then finely meshed.

[0012] In conjunction with the first aspect, in one implementation, the fine meshing of the three-dimensional solid model includes: A denser mesh is used for areas with high heat flux density in critical heat dissipation components, while a sparser mesh is used for non-critical areas with low heat flux density.

[0013] Secondly, embodiments of this application provide a co-simulation device for one-dimensional fluid network and three-dimensional solid thermal coupling, the co-simulation device for one-dimensional fluid network and three-dimensional solid thermal coupling includes: The one-dimensional fluid-thermal co-solution module is used to perform fluid-thermal co-solution on a one-dimensional fluid network model to obtain key fluid parameters that can serve as the basis for thermal analysis loads and boundary conditions of a three-dimensional solid model. The coupling data interaction and three-dimensional thermal analysis module is used to perform thermal analysis on the three-dimensional solid model to obtain the solid wall temperature and feed it back to the one-dimensional fluid network model. The iterative optimization and convergence determination module adjusts the solution parameters of the one-dimensional fluid network model based on the feedback solid wall temperature, iteratively solves the one-dimensional fluid network model and the three-dimensional solid model until their calculation results converge, thus completing the thermal coupling joint simulation of the one-dimensional fluid network and the three-dimensional solid. Thirdly, embodiments of this application provide a co-simulation device for one-dimensional fluid network and three-dimensional solid thermal coupling. The co-simulation device includes a processor, a memory, and a co-simulation program for one-dimensional fluid network and three-dimensional solid thermal coupling stored in the memory and executable by the processor. When the co-simulation program for one-dimensional fluid network and three-dimensional solid thermal coupling is executed by the processor, it implements the steps of the co-simulation method for one-dimensional fluid network and three-dimensional solid thermal coupling as described in some of the above embodiments.

[0014] Fourthly, embodiments of this application provide a computer-readable storage medium storing a one-dimensional fluid network and a three-dimensional solid thermal coupling co-simulation program. When the one-dimensional fluid network and three-dimensional solid thermal coupling co-simulation program is executed by a processor, it implements the steps of the one-dimensional fluid network and three-dimensional solid thermal coupling co-simulation method as described in some of the above embodiments.

[0015] The beneficial effects of the technical solutions provided in this application include: By performing fluid-thermal co-solution on a one-dimensional fluid network model, key fluid parameters are output, which can serve as the basis for the thermal analysis loads and boundary conditions of a three-dimensional solid model, providing accurate input for the thermal analysis of the three-dimensional solid model. The three-dimensional solid model completes the thermal analysis based on the above input and outputs the solid wall temperature. This solid wall temperature is then fed back to the one-dimensional fluid network model, providing a basis for the dynamic adjustment of the solution parameters of the one-dimensional fluid network model. After adjusting the solution parameters of the one-dimensional fluid network model based on the feedback solid wall temperature, the two models are iteratively solved until the calculation results converge. This achieves dynamic adaptation of boundary parameters under fluid-structure interaction, avoiding simulation deviations caused by static boundary assumptions. Within a controllable computational overhead, it simultaneously ensures the efficiency of system-level global prediction and the accuracy of detailed analysis of local key components, improving the overall reliability of thermal coupling simulation results and meeting the core requirements of thermal coupling simulation in complex engineering scenarios. Attached Figure Description

[0016] Figure 1 This is a flowchart illustrating an embodiment of the co-simulation method for one-dimensional fluid networks and three-dimensional solid thermal coupling of this application; Figure 2 This is a schematic diagram of the hardware structure of the one-dimensional fluid network and three-dimensional solid thermal coupling co-simulation device involved in the embodiments of this application. Detailed Implementation

[0017] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application.

[0018] Currently, the joint simulation technology of one-dimensional fluid network and three-dimensional solid thermal coupling is increasingly widely used in engineering fields such as automobiles, machinery, and electronics. In engineering practice, higher requirements are placed on the efficiency and accuracy of this type of simulation. It is necessary to quickly complete the calculation of global parameters at the system level, and to accurately analyze the local physical field details of key components in order to support the design optimization and performance prediction of complex products.

[0019] In related technologies, the joint simulation technology of one-dimensional fluid network and three-dimensional solid thermal coupling usually constructs a one-dimensional fluid network model and a three-dimensional solid model respectively, and realizes data interaction between the two models through preset fixed boundary conditions, thereby completing the thermal coupling analysis between fluid and solid in engineering scenarios and providing a reference for system thermal performance evaluation.

[0020] However, there are still obvious shortcomings in its application: it adopts the static boundary assumption and cannot adjust the boundary parameters according to the dynamic changes of the fluid-structure interaction state during the simulation, resulting in deviations between the simulation results and the actual working conditions.

[0021] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0022] In a first aspect, embodiments of this application provide a method for joint simulation of one-dimensional fluid networks and three-dimensional solid thermal coupling.

[0023] In one embodiment, reference is made to Figure 1 , Figure 1 This is a flowchart illustrating the first embodiment of the co-simulation method for one-dimensional fluid networks and three-dimensional solid thermal coupling of this application. Figure 1 As shown, the joint simulation method of one-dimensional fluid network and three-dimensional solid thermal coupling includes: S100: Perform fluid-thermal co-solution on a one-dimensional fluid network model to obtain key fluid parameters that can serve as the basis for thermal analysis loads and boundary conditions of a three-dimensional solid model; S200: Perform thermal analysis on the three-dimensional solid model to obtain the solid wall temperature and feed it back to the one-dimensional fluid network model; S300: Adjust the solution parameters of the one-dimensional fluid network model based on the feedback of the solid wall temperature, and iteratively solve the one-dimensional fluid network model and the three-dimensional solid model until the calculation results of the two converge, thus completing the thermal coupling joint simulation of the one-dimensional fluid network and the three-dimensional solid.

[0024] In this embodiment, by performing a fluid-thermal co-solution on the one-dimensional fluid network model, key fluid parameters are output, which can serve as the basis for the thermal analysis loads and boundary conditions of the three-dimensional solid model, providing accurate input for the thermal analysis of the three-dimensional solid model. The three-dimensional solid model completes the thermal analysis based on the above input and outputs the solid wall temperature. This solid wall temperature is then fed back to the one-dimensional fluid network model, providing a basis for the dynamic adjustment of the solution parameters of the one-dimensional fluid network model. After adjusting the solution parameters of the one-dimensional fluid network model based on the feedback solid wall temperature, the two models are iteratively solved until the calculation results converge. This achieves dynamic adaptation of boundary parameters under fluid-structure interaction, avoids simulation deviations caused by static boundary assumptions, and simultaneously ensures the efficiency of system-level global prediction and the accuracy of detailed analysis of local key components within a controllable computational overhead. This improves the overall reliability of thermal coupling simulation results and meets the core requirements of thermal coupling simulation in complex engineering scenarios.

[0025] Furthermore, in one embodiment, S100 includes the following steps: S101: The pressure correction algorithm and the fluid-heat coupling algorithm are used to solve the control equations of the one-dimensional fluid network model in a fluid-heat coordinated manner. During the solution iteration process, the drag coefficient and heat transfer coefficient are dynamically optimized to obtain the key fluid parameters. The key fluid parameters include the inlet and outlet pressure field distribution, fluid physical property parameters, flow velocity distribution and flow channel geometric characteristics. Fluid physical property parameters include fluid density and fluid specific heat capacity, and flow channel geometric characteristics include the hydraulic diameter and the radius of curvature of the flow channel.

[0026] In this embodiment, when performing a fluid-thermal co-solidification solution on the control equations of the one-dimensional fluid network model, a pressure correction algorithm and a fluid-thermal coupling algorithm are introduced. During the solution iteration process, the drag coefficient and heat transfer coefficient are dynamically optimized to obtain key fluid parameters. The key fluid parameters include the inlet and outlet pressure field distribution, fluid property parameters, flow velocity distribution, and channel geometry. The fluid property parameters include fluid density and specific heat capacity, and the channel geometry includes the hydraulic diameter and radius of curvature of the channel. This provides a data foundation for the accurate determination of the loads and boundary conditions required for the subsequent thermal analysis of the three-dimensional solid model. At the same time, by dynamically optimizing the drag coefficient and heat transfer coefficient, the accuracy of the solution results of the one-dimensional fluid network model is improved, avoiding the solution deviation caused by fixed parameters, and ensuring the fit between the fluid-thermal co-solidification solution results and the actual fluid-structure interaction conditions.

[0027] Furthermore, in one embodiment, step S200 includes the following steps: S201: Map the inlet and outlet pressure field distribution in the key fluid parameters to the corresponding boundary nodes of the three-dimensional solid model, so as to serve as the load for the thermal analysis of the three-dimensional solid model; S202: Based on the fluid properties, velocity distribution and flow channel geometry in the key fluid parameters, the local convective heat transfer coefficient and the average fluid temperature are calculated using empirical correlation formulas. The local convective heat transfer coefficient and the average fluid temperature are then transferred to the corresponding boundary of the three-dimensional solid model as boundary conditions for the thermal analysis of the three-dimensional solid model. S203: The three-dimensional solid model performs unsteady heat conduction analysis based on the received load and boundary conditions, and calculates the solid wall temperature at the interface between the solid and the fluid. S204: Discretize the solid wall temperature and feed the discretized solid wall temperature back to the corresponding node in the one-dimensional fluid network model.

[0028] In this embodiment, the inlet and outlet pressure field distributions in the key fluid parameters are mapped to the corresponding boundary nodes of the three-dimensional solid model as loads for the thermal analysis of the three-dimensional solid model. Based on the fluid properties, velocity distribution, and channel geometry in the key fluid parameters, the local convective heat transfer coefficient and the average fluid temperature are calculated using empirical correlation formulas. These local convective heat transfer coefficients and the average fluid temperature are then transferred to the corresponding boundaries of the three-dimensional solid model as boundary conditions for the thermal analysis of the three-dimensional solid model. The three-dimensional solid model performs unsteady-state heat conduction analysis based on the received loads and boundary conditions, calculating the solid wall temperature at the interface between the solid and fluid. The solid wall temperature is discretized and fed back to the corresponding node of the one-dimensional fluid network model. This provides accurate boundary feedback data for the dynamic adjustment of the solution parameters of the one-dimensional fluid network model, while ensuring the matching of loads and boundary conditions during the thermal analysis of the three-dimensional solid model, and ensuring the consistency between the unsteady-state heat conduction analysis results and the actual fluid-structure interaction heat exchange scenario.

[0029] Furthermore, in one embodiment, step S300 includes the following steps: S301: Based on the one-dimensional fluid network model, the actual flow distribution fed back from the three-dimensional solid model is received. The actual flow distribution is used as the basis for adjustment to dynamically correct the inlet flow boundary conditions and resolve the inlet and outlet pressure field distribution to complete the adjustment of the solution parameters. S302: First, solve the one-dimensional fluid network model to obtain the updated key fluid parameters, then transfer them to the three-dimensional solid model and solve for the updated solid wall temperature. Finally, feed the updated solid wall temperature back to the one-dimensional fluid network model and repeat the above process. S303: When the inlet and outlet pressure field distribution and flow distribution of the one-dimensional fluid network model and the solid wall temperature of the three-dimensional solid model all meet the preset error range, the calculation results are considered to have converged.

[0030] In this embodiment, the one-dimensional fluid network model receives the actual flow distribution from the three-dimensional solid model, uses the actual flow distribution as the basis for adjustment, dynamically corrects the inlet flow boundary conditions, and resolves the inlet and outlet pressure field distributions to complete the adjustment of the solution parameters. Then, the one-dimensional fluid network model is solved to obtain updated key fluid parameters. The updated key fluid parameters are then transferred to the three-dimensional solid model to obtain the updated solid wall temperature. The updated solid wall temperature is then fed back to the one-dimensional fluid network model, and the above process of "parameter adjustment - one-dimensional solution - three-dimensional solution - temperature feedback" is repeated. When the inlet and outlet pressure field distributions and flow distributions of the one-dimensional fluid network model and the solid wall temperature of the three-dimensional solid model all meet the preset error range, the calculation results are determined to be converged. This achieves the orderly connection between parameter adjustment and iterative solution in the fluid-structure interaction simulation process, ensuring the fit between the simulation results and the actual fluid-structure interaction equilibrium state. At the same time, the consistency between the system-level global parameters and the temperature field results of local key components is ensured through iterative iteration and convergence determination.

[0031] Furthermore, in one embodiment, step S300 includes the following steps: S301: Based on the one-dimensional fluid network model, the actual flow distribution fed back from the three-dimensional solid model is received. The actual flow distribution is used as the basis for adjustment to dynamically correct the inlet flow boundary conditions and resolve the inlet and outlet pressure field distribution to complete the adjustment of the solution parameters. S302: Simultaneously solve the governing equations of a one-dimensional fluid network model and the heat conduction equations of a three-dimensional solid model in a unified solver; S303: When the inlet and outlet pressure field distribution and flow distribution of the one-dimensional fluid network model and the solid wall temperature of the three-dimensional solid model all meet the preset error range, the calculation results are considered to have converged.

[0032] In this embodiment, the one-dimensional fluid network model receives the actual flow distribution from the three-dimensional solid model, uses the actual flow distribution as the basis for adjustment, dynamically corrects the inlet flow boundary conditions, and resolves the inlet and outlet pressure field distributions to complete the adjustment of the solution parameters. The control equations of the adjusted one-dimensional fluid network model and the heat conduction equations of the three-dimensional solid model are solved simultaneously in the unified solver to achieve the collaborative solution of fluid flow and solid heat conduction in the fluid-structure interaction system. When the inlet and outlet pressure field distributions and flow distributions of the one-dimensional fluid network model and the solid wall temperature of the three-dimensional solid model all meet the preset error range, the calculation results are determined to converge, ensuring the synchronization and parameter matching of the solution process in the strong fluid-structure interaction scenario, and ensuring the consistency between the simulation results and the actual fluid-structure interaction heat exchange equilibrium state.

[0033] Furthermore, in one embodiment, before S100, there is S000, which includes the following steps: S001: Construct a one-dimensional fluid network model and set the pipe parameters and boundary conditions of the one-dimensional fluid network model; the pipe parameters include pipe length, pipe diameter and pipe friction coefficient, and the boundary conditions include inlet flow rate and outlet pressure; S002: Construct a three-dimensional solid model including key heat dissipation components that exchange heat with the fluid. The key heat dissipation components include the chip, heat sink fins, chassis shell, and heat sink substrate. Then, perform fine meshing on the three-dimensional solid model.

[0034] In this embodiment, a one-dimensional fluid network model is constructed, and the pipe parameters and boundary conditions of the one-dimensional fluid network model are set. The pipe parameters include pipe length, pipe diameter, and pipe friction coefficient, and the boundary conditions include inlet flow rate and outlet pressure. A three-dimensional solid model is constructed, including key heat dissipation components that exchange heat with the fluid. The key heat dissipation components include chips, heat sink fins, chassis shell, and heat sink substrate. The three-dimensional solid model is finely meshed to provide a suitable model foundation for the subsequent fluid-thermal co-solid solution of the one-dimensional fluid network model and the thermal analysis of the three-dimensional solid model. This ensures that the model structure and parameter settings fit the actual fluid-solid heat exchange scenario and guarantees the reliability of data interaction and calculation analysis in the subsequent coupled simulation process.

[0035] Furthermore, in one embodiment, step S002 includes the following steps: S002-1: Use a denser mesh for areas with high heat flux density in critical heat dissipation components, and a sparser mesh for non-critical areas with low heat flux density.

[0036] In this embodiment, a differentiated meshing strategy is adopted for the key heat dissipation components in the 3D solid model: a dense mesh is used for areas with high heat flux density of the key heat dissipation components, while a sparse mesh is used for non-critical areas with low heat flux density of the key heat dissipation components. This approach accurately captures the local thermal gradient changes in areas with high heat flux density while reasonably controlling the overall mesh count of the 3D solid model, balancing the model's computational accuracy and efficiency. This provides a suitable mesh foundation for subsequent unsteady-state heat conduction analysis of the 3D solid model, ensuring the thermal analysis results' ability to resolve details in key areas and the overall efficiency of the computation process.

[0037] In summary, the joint simulation method for one-dimensional fluid network and three-dimensional solid thermal coupling provided in this application embodiment is described in detail below: Through a three-level process of "model construction - coupling interface data exchange - iterative solution", the method achieves efficient calculation of system-level global parameters and accurate analysis of the physical field of local key components, balancing simulation efficiency and accuracy. The specific technical solution is as follows: I. Model Construction (S1): Building an adapted one-dimensional fluid network model and a three-dimensional solid model Model building is the foundation of coupled simulation. Through differentiated software tools and parameter settings, fluid system-level modeling and high-fidelity local modeling of solids are achieved, specifically including: 1.1 Construction of One-Dimensional Fluid Network Model A one-dimensional fluid network simulation system was built using Flownex software. The core of this system is to clearly define the model parameter settings and solution algorithm configuration to ensure efficient calculation of fluid flow and heat exchange characteristics. Parameter setting: Define the structural parameters and boundary conditions of various components in the one-dimensional fluid network. The component structural parameters include pipe length, pipe diameter, and pipe friction coefficient. The boundary conditions include inlet flow rate and outlet pressure, providing initial input for subsequent solutions. Solution Algorithm and Optimization: In the process of solving the one-dimensional fluid network control equations, a pressure correction algorithm and a fluid-thermal coupling calculation method are introduced. By dynamically correcting the drag coefficient and heat transfer coefficient during the solution iteration process, the calculation accuracy and efficiency are balanced, simulation deviations caused by fixed parameters are avoided, and the fluid parameter calculations are ensured to fit the actual working conditions.

[0038] 1.2 Construction of Three-Dimensional Solid Model A three-dimensional solid model was constructed using COMSOL software, focusing on solid structures that exchange heat with fluids. The core objective was to achieve accurate simulation and mesh optimization of the solid's thermal conductivity characteristics. Model coverage: The 3D solid model covers key heat dissipation components that directly exchange heat with fluids, including chips, heat sink fins, chassis shell, and heat sink substrate, ensuring that the model is consistent with the actual heat exchange scenario; Mesh generation strategy: To accurately capture the local thermal gradient changes inside the solid, the three-dimensional solid model is finely meshed. A differentiated meshing strategy is adopted, with a denser mesh for areas with high heat flux density of key heat dissipation components and a sparser mesh for non-critical areas with low heat flux density. This ensures local calculation accuracy while controlling the overall mesh count to reduce computational costs. Theoretical basis of heat conduction: The mathematical model of heat conduction in a three-dimensional solid model is strictly based on Fourier's law, providing theoretical support for the calculation of the heat transfer law inside the solid and ensuring the scientificity and accuracy of the heat conduction analysis results.

[0039] II. Coupling Interface and Data Exchange (S2): Achieving bidirectional data interaction and dynamic adaptation between one-dimensional and three-dimensional models. The coupling interface and data exchange are the core of connecting the one-dimensional fluid model and the three-dimensional solid model. Through a closed loop of "parameter transfer - thermal analysis - feedback correction", the static boundary assumption is broken, and the dynamic response of the fluid-structure interaction state is realized. Specifically, it includes two major directions: "fluid parameter transfer to solid" and "solid parameter feedback to fluid", which are further subdivided into four parts: 2.1 Fluid Parameter Initialization and Pressure Transfer: Providing Load Conditions for Three-Dimensional Solid Thermal Analysis Based on the calculation results of the one-dimensional fluid network, the fluid pressure parameters are transferred to the three-dimensional solid model as the initial load for the three-dimensional thermal analysis. First, based on the solution results of the one-dimensional fluid network, the inlet and outlet volume flow rate boundary conditions are set, and the inlet and outlet pressure field distribution is obtained by solving the one-dimensional fluid network control equations. Through the coupled simulation interface, the above-mentioned inlet and outlet pressure field distributions are mapped in real time to the corresponding boundary nodes of the three-dimensional solid model, and directly used as the initial load conditions for the thermal analysis of the three-dimensional solid model, ensuring that the load input is consistent with the actual fluid flow state.

[0040] 2.2 Calculation and transfer of convective heat transfer characteristics: providing boundary conditions for three-dimensional solid thermal analysis Based on its own computational parameters, a one-dimensional fluid network derives the convective heat transfer parameters required for three-dimensional solid thermal analysis, thereby achieving accurate transfer of heat exchange characteristics. The parameters are calculated based on the following: the fluid properties, velocity distribution and channel geometry features obtained by the one-dimensional fluid network are extracted as input. The fluid properties include fluid density and specific heat capacity, and the velocity distribution and channel geometry features include hydraulic diameter and radius of curvature of the channel. Key parameter calculation: The local convective heat transfer coefficient is calculated using the Dittus-Boelter equation (empirical correlation), and the overall average temperature of the fluid at this location is extracted and used as the heat source term. Parameter transfer method: The calculated local convective heat transfer coefficient and the average fluid temperature are precisely assigned to each node of the corresponding boundary of the three-dimensional solid model as boundary conditions for thermal conduction analysis of the three-dimensional solid model, ensuring that the input parameters of the three-dimensional thermal analysis match the heat exchange characteristics of the fluid.

[0041] 2.3 Feedback Correction from Three-Dimensional to One-Dimensional: Local Wall Temperature Calculation and Feedback After the three-dimensional solid model completes thermal analysis based on the received loads and boundary conditions, key temperature parameters are fed back to the one-dimensional fluid network to provide a basis for parameter correction of the one-dimensional model. After receiving the local convective heat transfer coefficient and the average temperature of the fluid from the one-dimensional fluid network, the three-dimensional solid model performs unsteady-state heat conduction analysis and calculates the local temperature field distribution at the interface between the solid and the fluid (i.e., the solid wall temperature). The solid wall temperature is discretized through a coupling interface, and the discretized temperature data is sent back to the corresponding node of the one-dimensional fluid network as the boundary condition for subsequent convective heat transfer calculations of the one-dimensional fluid network, thus realizing bidirectional interaction of temperature parameters.

[0042] 2.4 Three-dimensional to one-dimensional feedback correction: flow-pressure closed-loop correction After performing thermo-mechanical coupling analysis based on the initial pressure field, the three-dimensional solid model feeds back the actual flow parameters to the one-dimensional fluid network, forming a dynamic correction closed loop of "flow rate-pressure". The three-dimensional solid model is used to calculate the actual flow rate distribution of the fluids involved in heat exchange (i.e., the actual flow rate distribution) through thermo-mechanical coupling analysis. The actual flow distribution is fed back to the one-dimensional fluid network. The one-dimensional fluid network uses the actual flow distribution as the basis for adjustment, dynamically corrects its inlet flow boundary conditions, and re-solves the inlet and outlet pressure field distribution based on the corrected boundary conditions. This process forms a closed-loop iteration of "one-dimensional flow setting → three-dimensional pressure calculation → three-dimensional actual flow feedback → one-dimensional flow and pressure correction" until the flow and pressure results of the one-dimensional fluid network converge to the preset error range, ensuring the dynamic adaptation of fluid-structure interaction parameters.

[0043] III. Iterative Solution Strategy (S3): Two Coupling Modes Adapted to Scenarios with Different Coupling Strengths To address the differences in fluid-structure interaction strength across various engineering scenarios, two iterative solution strategies—sequential coupling and global coupling—are provided to ensure the reliability of simulation results under diverse working conditions. 3.1 Sequential coupling: Suitable for weakly coupled scenarios Sequential coupling employs a "step-by-step solution-result exchange" model, sequentially calculating the fluid and solid fields, and achieving result convergence through iteration. First, solve the one-dimensional fluid network model to obtain key fluid parameters (inlet and outlet pressure field distribution, local convective heat transfer coefficient, average fluid temperature, etc.). By inputting key fluid parameters as loads and boundary conditions into a three-dimensional solid model, the heat conduction equation of the three-dimensional solid model is solved to obtain the solid wall temperature and actual flow distribution. The calculation results of the three-dimensional solid model (solid wall temperature, actual flow distribution) are fed back to the one-dimensional fluid network model to adjust the solution parameters of the one-dimensional model (inlet flow rate, drag coefficient, heat transfer coefficient, etc.). Repeat the above process of "one-dimensional solution → three-dimensional solution → result feedback → parameter adjustment" until the calculation results of the one-dimensional fluid network model and the three-dimensional solid model both meet the preset convergence conditions.

[0044] 3.2 Overall Coupling: Suitable for strongly coupled scenarios The overall coupling is based on the finite volume method, which simultaneously calculates the governing equations of fluid and solid in a unified solver, achieving deep synergy in fluid-structure interaction. The governing equations of the one-dimensional fluid network model (describing fluid flow and heat exchange) and the heat conduction equations of the three-dimensional solid model (describing heat transfer in the solid) are incorporated into the same solution framework and numerically solved simultaneously in a unified solver. During the solution process, fluid-solid boundary parameters (such as solid wall temperature, fluid convection heat transfer coefficient, and actual flow distribution) are interacted in real time through the coupling interface, eliminating the need for step-by-step result transmission and directly realizing the dynamic correlation of fluid-solid parameters; When the inlet and outlet pressure field distribution and flow rate distribution of the one-dimensional fluid network model and the solid wall temperature of the three-dimensional solid model both meet the preset error range, the calculation results are considered to have converged, and the coupled simulation is completed.

[0045] The beneficial effects of the solution provided in the embodiments of this application are as follows: (1) In this method, the one-dimensional system model is responsible for efficiently calculating the global working parameters, while the three-dimensional high-fidelity model is used to accurately analyze the local physical field of the key parts. Through real-time bidirectional data transmission between models, dynamic coupling without static boundary assumptions is achieved, thereby significantly improving the overall reliability of system-level prediction and local detail analysis within a controllable computational overhead. (2) By dynamically correcting the drag coefficient and heat transfer coefficient during the iteration process, the accuracy of numerical simulation is effectively improved, while the computational resource requirements are significantly reduced. (3) In order to accurately capture the local thermal gradient changes inside the solid, the model is meshed. Through this detailed meshing, the heat conduction process in the solid can be simulated more accurately, providing a reliable data basis for subsequent simulation analysis. (4) In terms of heat conduction theory, the model is strictly based on Fourier's law. As the basic law describing heat conduction, Fourier's law provides a solid theoretical support for the mathematical description of heat transfer in solids in the model, ensuring the scientificity and accuracy of the simulation results. Through the above modeling and theoretical settings, the heat exchange process between solid structures and fluids can be analyzed comprehensively and in-depth.

[0046] Ultimately, by establishing clear model building standards, a dynamic coupling data exchange mechanism, and a flexible iterative solution strategy, the problems of accuracy deviation and excessive computational cost caused by traditional static boundary assumptions are solved, achieving efficient and accurate unification of one-dimensional fluid network and three-dimensional solid thermal coupling simulation in complex engineering scenarios.

[0047] Secondly, embodiments of this application also provide a co-simulation device for thermal coupling of a one-dimensional fluid network and a three-dimensional solid. The co-simulation device includes: a one-dimensional fluid-thermal co-solution module, used to perform fluid-thermal co-solution on the one-dimensional fluid network model to obtain key fluid parameters that can serve as the basis for thermal analysis loads and boundary conditions of the three-dimensional solid model; a coupled data interaction and three-dimensional thermal analysis module, used to perform thermal analysis on the three-dimensional solid model to obtain the solid wall temperature and feed it back to the one-dimensional fluid network model; and an iterative optimization and convergence determination module, used to adjust the solution parameters of the one-dimensional fluid network model based on the feedback solid wall temperature, and iteratively solve the one-dimensional fluid network model and the three-dimensional solid model until the calculation results converge, thus completing the co-simulation of thermal coupling between the one-dimensional fluid network and the three-dimensional solid.

[0048] The functions of each module in the above-mentioned one-dimensional fluid network and three-dimensional solid thermal coupling co-simulation device correspond to the steps in the above-mentioned one-dimensional fluid network and three-dimensional solid thermal coupling co-simulation method embodiment, and their functions and implementation processes will not be described in detail here.

[0049] Thirdly, embodiments of this application provide a co-simulation device for one-dimensional fluid network and three-dimensional solid thermal coupling. The co-simulation device for one-dimensional fluid network and three-dimensional solid thermal coupling can be a personal computer (PC), laptop computer, server or other device with data processing capabilities.

[0050] Reference Figure 2 , Figure 2 This is a schematic diagram of the hardware structure of the co-simulation device for one-dimensional fluid networks and three-dimensional solid thermal coupling involved in the embodiments of this application. In the embodiments of this application, the co-simulation device for one-dimensional fluid networks and three-dimensional solid thermal coupling may include a processor, a memory, a communication interface, and a communication bus.

[0051] The communication bus can be of any type and is used to interconnect the processor, memory, and communication interface.

[0052] The communication interface includes input / output (I / O) interfaces, physical interfaces, and logical interfaces used for interconnecting devices within the one-dimensional fluid network and three-dimensional solid thermal coupling co-simulation device, as well as interfaces used for interconnecting the one-dimensional fluid network and three-dimensional solid thermal coupling co-simulation device with other devices (such as other computing devices or user equipment). Physical interfaces can be Ethernet interfaces, fiber optic interfaces, ATM interfaces, etc.; user equipment can be displays, keyboards, etc.

[0053] Memory can be various types of storage media, such as random access memory (RAM), read-only memory (ROM), non-volatile RAM (NVRAM), flash memory, optical storage, hard disk, programmable ROM (PROM), erasable PROM (EPROM), electrically erasable PROM (EEPROM), etc.

[0054] The processor can be a general-purpose processor, which can call a one-dimensional fluid network and three-dimensional solid thermal coupling co-simulation program stored in memory and execute the one-dimensional fluid network and three-dimensional solid thermal coupling co-simulation method provided in the embodiments of this application. For example, the general-purpose processor can be a central processing unit (CPU). The method executed when the one-dimensional fluid network and three-dimensional solid thermal coupling co-simulation program is called can refer to the various embodiments of the one-dimensional fluid network and three-dimensional solid thermal coupling co-simulation method of this application, and will not be repeated here.

[0055] Those skilled in the art will understand that Figure 2 The hardware structure shown does not constitute a limitation of this application and may include more or fewer components than shown, or combine certain components, or have different component arrangements.

[0056] Fourthly, embodiments of this application also provide a readable storage medium.

[0057] This application stores a one-dimensional fluid network and three-dimensional solid thermal coupling co-simulation program on a readable storage medium, wherein when the one-dimensional fluid network and three-dimensional solid thermal coupling co-simulation program is executed by a processor, it implements the steps of the one-dimensional fluid network and three-dimensional solid thermal coupling co-simulation method as described above.

[0058] The method implemented when the one-dimensional fluid network and three-dimensional solid thermal coupling co-simulation program is executed can be referred to in the various embodiments of the one-dimensional fluid network and three-dimensional solid thermal coupling co-simulation method of this application, and will not be repeated here.

[0059] It should be noted that the sequence numbers of the embodiments in this application are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0060] The terms "comprising" and "having," and any variations thereof, in the specification, claims, and accompanying drawings of this application are intended to cover a non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to such process, method, product, or apparatus. The terms "first," "second," and "third," etc., are used to distinguish different objects, etc., and do not indicate a sequence, nor do they limit "first," "second," and "third" to different types.

[0061] In the description of the embodiments of this application, terms such as "exemplary," "for example," or "for instance" are used to indicate examples, illustrations, or explanations. Any embodiment or design described as "exemplary," "for example," or "for instance" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplary," "for example," or "for instance" is intended to present the relevant concepts in a concrete manner.

[0062] In the description of the embodiments of this application, unless otherwise stated, " / " means "or". For example, A / B can mean A or B. The "and / or" in the text is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist simultaneously, and B exists alone. In addition, in the description of the embodiments of this application, "multiple" means two or more.

[0063] In some processes described in the embodiments of this application, multiple operations or steps are included in a specific order. However, it should be understood that these operations or steps may not be executed in the order they appear in the embodiments of this application, or they may be executed in parallel. The sequence number of the operation is only used to distinguish different operations, and the sequence number itself does not represent any execution order. In addition, these processes may include more or fewer operations, and these operations or steps may be executed sequentially or in parallel, and these operations or steps may be combined.

[0064] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) as described above, and includes several instructions to cause a terminal device to execute the methods described in the various embodiments of this application.

[0065] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A method for one-dimensional fluid network and three-dimensional solid thermal coupling co-simulation, characterized in that, The one-dimensional fluid network and three-dimensional solid thermal coupling combined simulation method comprises: performing flow-heat collaborative solving on the one-dimensional fluid network model to obtain fluid key parameters that can be used as the basis of load and boundary conditions for thermal analysis of the three-dimensional solid model; performing thermal analysis on the three-dimensional solid model to obtain solid wall surface temperature and feeding back the solid wall surface temperature to the one-dimensional fluid network model; adjusting solving parameters of the one-dimensional fluid network model according to the fed-back solid wall surface temperature, and iteratively solving the one-dimensional fluid network model and the three-dimensional solid model until the calculation results of the two converge, thereby completing the thermal coupling combined simulation of the one-dimensional fluid network and the three-dimensional solid.

2. The one-dimensional fluid network and three-dimensional solid thermal coupling combined simulation method according to claim 1, wherein the flow-heat collaborative solving on the one-dimensional fluid network model to obtain fluid key parameters that can be used as the basis of load and boundary conditions for thermal analysis of the three-dimensional solid model comprises: performing flow-heat collaborative solving on the control equation group of the one-dimensional fluid network model by using a pressure correction algorithm and a flow-heat coupling algorithm, dynamically optimizing resistance coefficients and heat exchange coefficients in the solving iteration process, and obtaining fluid key parameters; the fluid key parameters comprise inlet and outlet pressure field distribution, fluid physical property parameters, flow velocity distribution and flow channel geometric characteristics; the fluid physical property parameters comprise fluid density and fluid specific heat capacity; and the flow channel geometric characteristics comprise flow channel hydraulic diameter and flow channel curvature radius.

3. The one-dimensional fluid network and three-dimensional solid thermal coupling combined simulation method according to claim 1, wherein the thermal analysis on the three-dimensional solid model to obtain solid wall surface temperature and feeding back the solid wall surface temperature to the one-dimensional fluid network model comprises: mapping the inlet and outlet pressure field distribution in the fluid key parameters to corresponding boundary nodes of the three-dimensional solid model as load for thermal analysis of the three-dimensional solid model; calculating local convective heat exchange coefficients and fluid average temperature according to the fluid physical property parameters, the flow velocity distribution and the flow channel geometric characteristics in the fluid key parameters, and transferring the local convective heat exchange coefficients and the fluid average temperature to corresponding boundaries of the three-dimensional solid model as boundary conditions for thermal analysis of the three-dimensional solid model; performing non-steady-state heat conduction analysis on the three-dimensional solid model based on the received load and boundary conditions, and calculating solid wall surface temperature of the solid and fluid interface wall surface; performing discretization processing on the solid wall surface temperature, and feeding back the discretized solid wall surface temperature to corresponding position nodes of the one-dimensional fluid network model.

4. The one-dimensional fluid network and three-dimensional solid thermal coupling combined simulation method according to claim 1, wherein the adjusting solving parameters of the one-dimensional fluid network model according to the fed-back solid wall surface temperature, and iteratively solving the one-dimensional fluid network model and the three-dimensional solid model until the calculation results of the two converge comprises: based on the one-dimensional fluid network model receiving the actual flow distribution fed back by the three-dimensional solid model, taking the actual flow distribution as the basis for adjustment, dynamically correcting the inlet flow boundary condition, and re-solving the inlet and outlet pressure field distribution, thereby completing the adjustment of the solving parameters. ​ ​ ​ Solve the one-dimensional fluid network model to obtain updated fluid key parameters, and pass the updated fluid key parameters to the three-dimensional solid model to solve and obtain updated solid wall surface temperature, and then feed back the updated solid wall surface temperature to the one-dimensional fluid network model to repeat the above process; When the inlet and outlet pressure field distribution and the flow distribution of the one-dimensional fluid network model and the solid wall surface temperature of the three-dimensional solid model all meet the preset error range, it is determined that the calculation result converges.

5. The one-dimensional fluid network and three-dimensional solid thermal coupling combined simulation method of claim 1, wherein the adjusting the solving parameters of the one-dimensional fluid network model according to the feedback solid wall surface temperature, and iteratively solving the one-dimensional fluid network model and the three-dimensional solid model until the calculation results of the two converge, comprises: receiving the actual flow distribution fed back by the three-dimensional solid model based on the one-dimensional fluid network model, taking the actual flow distribution as the adjustment basis, dynamically correcting the inlet flow boundary condition, and re-solving the inlet and outlet pressure field distribution to complete the adjustment of the solving parameters; solving the control equation set of the one-dimensional fluid network model and the heat conduction equation of the three-dimensional solid model in a unified solver; When the inlet and outlet pressure field distribution and the flow distribution of the one-dimensional fluid network model and the solid wall surface temperature of the three-dimensional solid model all meet the preset error range, it is determined that the calculation result converges.

6. The one-dimensional fluid network and three-dimensional solid thermal coupling combined simulation method of claim 1, wherein before the flow-thermal co-solution of the one-dimensional fluid network model to obtain the fluid key parameters that can be used as the basis of the thermal analysis load and boundary condition of the three-dimensional solid model, the method further comprises: constructing the one-dimensional fluid network model, and setting the pipeline parameters and boundary conditions of the one-dimensional fluid network model; the pipeline parameters include pipeline length, pipeline diameter and pipeline friction coefficient, and the boundary conditions include inlet flow and outlet pressure; constructing the three-dimensional solid model including the heat dissipation key components that exchange heat with the fluid, the heat dissipation key components including a chip, a heat sink fin, a case shell and a heat sink substrate, and performing fine mesh division on the three-dimensional solid model.

7. The one-dimensional fluid network and three-dimensional solid thermal coupling combined simulation method of claim 6, wherein the fine mesh division of the three-dimensional solid model comprises: using dense mesh for the high heat flux density area of the heat dissipation key components, and using sparse mesh for the non-key area with low heat flux density. The one-dimensional fluid network and three-dimensional solid thermal coupling combined simulation device comprises: a one-dimensional flow-thermal co-solution module for co-solving the one-dimensional fluid network model to obtain the fluid key parameters that can be used as the basis of the thermal analysis load and boundary condition of the three-dimensional solid model; a coupling data interaction and three-dimensional thermal analysis module for performing thermal analysis on the three-dimensional solid model to obtain the solid wall surface temperature, and feeding back the solid wall surface temperature to the one-dimensional fluid network model; 8. A device for co-simulation of one-dimensional fluid networks and three-dimensional solids, characterized in that, ​ ​ ​ An iterative optimization and convergence determination module is configured to adjust the solving parameters of the one-dimensional fluid network model according to the feedback of the solid wall temperature, and iteratively solve the one-dimensional fluid network model and the three-dimensional solid model until the calculation results of the two converge, and complete the thermal coupling simulation of the one-dimensional fluid network and the three-dimensional solid.

9. A joint simulation device for one-dimensional fluid networks and three-dimensional solid thermal coupling, characterized in that, The one-dimensional fluid network and three-dimensional solid thermal coupling simulation device comprises a processor, a memory, and a one-dimensional fluid network and three-dimensional solid thermal coupling simulation program stored in the memory and executable by the processor, wherein the one-dimensional fluid network and three-dimensional solid thermal coupling simulation program, when executed by the processor, implements the steps of the one-dimensional fluid network and three-dimensional solid thermal coupling simulation method according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that, The one-dimensional fluid network and three-dimensional solid thermal coupling simulation program is stored in the computer readable storage medium, and when executed by the processor, implements the steps of the one-dimensional fluid network and three-dimensional solid thermal coupling simulation method according to any one of claims 1 to 7.

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