Electronic device

Abstract

An electronic device according to an embodiment of the present invention includes: a display panel including a first non-folding area, a second non-folding area, and a folding area defined between the first non-folding area and the second non-folding area; and a support plate disposed below the display panel and defining a plurality of openings overlapping the folding region. The support plate includes: a first layer including a plurality of first fibers, each of the plurality of first fibers extending in a first direction and arranged side by side in a second direction orthogonal to the first direction; and a second layer that is disposed at an upper portion or a lower portion of the first layer and includes a plurality of second fibers, each of the plurality of second fibers extending in the second direction and arranged side by side in the first direction. The first layer comprises a first surface in contact with the second layer and a second surface opposite to the first surface, and a plurality of concave patterns are defined on the second surface.

Description

Technical Field

[0001] This invention relates to electronic devices that include folded regions. Background Technology

[0002] Electronic devices used to provide images to users, such as smartphones, digital cameras, laptops, navigation systems, and smart TVs, include display devices for displaying images. The display device generates images and provides them to the user through a displayed screen.

[0003] Recently, with the development of display device technology, various forms of display devices have been developed. For example, various display devices that can be deformed, folded, or rolled in a curved manner have been developed. Flexible electronic devices may include a flexible display panel and a support plate disposed below the display panel. Multiple openings can be defined in the support plate. However, problems may occur within the support plate when openings with a grid pattern are defined. Summary of the Invention

[0004] The purpose of this invention is to provide an electronic device that is easy to fold while improving manufacturing efficiency.

[0005] An electronic device according to an embodiment of the present invention includes: a display panel including a first non-foldable region, a second non-foldable region, and a foldable region defined between the first non-foldable region and the second non-foldable region; and a support plate disposed below the display panel and defining a plurality of openings overlapping the foldable region. The support plate includes: a first layer including a plurality of first fibers, each of the plurality of first fibers extending along a first direction and arranged side-by-side in a second direction orthogonal to the first direction; and a second layer disposed above or below the first layer and including a plurality of second fibers, each of the plurality of second fibers extending along the second direction and arranged side-by-side in the first direction. The first layer includes a first surface in contact with the second layer and a second surface opposite to the first surface, and a plurality of recessed patterns are defined on the second surface.

[0006] The plurality of recessed patterns may overlap with the folded area.

[0007] The plurality of recessed patterns can be arranged side by side in the first direction.

[0008] The first layer may include a first portion adjacent to the second layer and a second portion separated from the second layer in cross section by the first portion, each of the plurality of recessed patterns penetrating the second portion to expose one side of the first portion.

[0009] The plurality of opening portions can include a plurality of first opening portions defined in the first layer, and a plurality of second opening portions defined in the second layer, each of the plurality of second opening portions corresponding to each of the plurality of first opening portions.

[0010] Each of the plurality of recessed patterns can extend from each of the plurality of first opening portions in the second direction.

[0011] The support plate can include a first non-folded portion overlapping the first non-folded area, a second non-folded portion overlapping the second non-folded area, and a folded portion overlapping the folded area.

[0012] The folded portion can include a first area in which the plurality of recessed patterns are defined, and a second area adjacent to the first area in which the plurality of first opening portions are defined.

[0013] An upper surface of the electronic device can include a display area in which an image is displayed, and a non-display area surrounding the display area and overlapping an edge of the electronic device, the first area overlapping a portion of the non-display area.

[0014] An upper surface of the electronic device can include a display area in which an image is displayed, and a non-display area surrounding the display area and overlapping an edge of the electronic device, the first area overlapping a portion of the display area.

[0015] The second layer can be directly disposed on an upper portion of the first layer, the plurality of recessed patterns being defined in a first lower surface of the first layer.

[0016] The support plate can further include a lower layer disposed below the first layer and including a plurality of third fibers, each of the plurality of third fibers extending in the second direction and arranged side by side in the first direction, a plurality of lower holes corresponding to each of the plurality of recessed patterns being defined in the lower layer.

[0017] The second layer can be directly disposed on a lower portion of the first layer, the plurality of recessed patterns being defined in a first upper surface of the first layer.

[0018] The support plate can further include an upper layer disposed above the first layer and including a plurality of fourth fibers, each of the plurality of fourth fibers extending in the second direction and arranged side by side in the first direction, a plurality of upper holes corresponding to each of the plurality of recessed patterns being defined in the upper layer.

[0019] The plurality of first fibers may include a plurality of first-1 fibers and a plurality of first-2 fibers disposed on the plurality of first-1 fibers, each of the plurality of first-2 fibers being arranged correspondingly to each of the plurality of first-1 fibers.

[0020] The plurality of second fibers may include a plurality of second-1 fibers and a plurality of second-2 fibers disposed on the plurality of second-1 fibers, each of the plurality of second-2 fibers being arranged correspondingly to each of the plurality of second-1 fibers.

[0021] The electronic device may further include an upper adhesive layer disposed between the display panel and the support plate.

[0022] The electronic device may further include a cover layer that overlaps with the opening and is disposed on the lower surface of the support plate.

[0023] The folded area can be folded around the folding axis or left unfolded.

[0024] The folding axis can be parallel to the second direction.

[0025] Invention Effects

[0026] An embodiment of the present invention provides an electronic device that, by including a support plate having a first layer and a second layer, can maintain folding reliability and improve process efficiency when manufacturing the electronic device. Attached Figure Description

[0027] Figure 1 This is a perspective view of an electronic device according to an embodiment of the present invention.

[0028] Figure 2A and Figure 2B It is shown Figure 1 The diagram shows the folded state of the electronic device.

[0029] Figure 3 yes Figure 1 An exploded perspective view of the electronic device shown.

[0030] Figure 4 This is a block diagram of an electronic device according to an embodiment of the present invention.

[0031] Figure 5 This is a cross-sectional view of a display module according to an embodiment of the present invention.

[0032] Figure 6 This is a cross-sectional view of a display panel according to an embodiment of the present invention.

[0033] Figure 7 This is a top view of a display panel according to an embodiment of the present invention.

[0034] Figure 8 This is a cross-sectional view of an electronic panel according to an embodiment of the present invention.

[0035] Figure 9A and Figure 9B This is a cross-sectional view of a display device according to an embodiment of the present invention.

[0036] Figure 10 as well as Figure 12 This is a perspective view of a support plate according to an embodiment of the present invention.

[0037] Figure 11 This is an enlarged perspective view of a support plate according to an embodiment of the present invention.

[0038] Figures 13A-13D This is a cross-sectional view of a support plate according to an embodiment of the present invention.

[0039] Figure 14A This is an enlarged perspective view of the support plate according to another embodiment of the present invention.

[0040] Figure 14B and Figure 14C This is a cross-sectional view of a support plate according to another embodiment of the present invention.

[0041] Figure 15A This is an enlarged perspective view of the support plate according to another embodiment of the present invention.

[0042] Figure 15B This is a cross-sectional view of a support plate according to another embodiment of the present invention.

[0043] Explanation of reference numerals in the attached figures

[0044] ED: Electronic device; PLT: Support plate; PLT1: First non-folding section; PLT2: Second non-folding section; PLF: Folding section; FA: Folding area; NFA1: First non-folding area; NFA2: Second non-folding area; DP: Display panel; SS1: First layer; SS2: Second layer; RP1: First fiber; RP2: Second fiber; SP: Recessed pattern; OP: Opening. Detailed Implementation

[0045] By attaching Figure 1 The advantages, features, and methods of implementing the present invention can be clearly understood by referring to the detailed embodiments described below. However, the present invention is not limited to the embodiments disclosed below, but is implemented in various different forms. These embodiments are provided to fully disclose the invention and to fully inform those skilled in the art of its scope, which is defined only by the scope of the appended claims. Throughout the entire specification, the same reference numerals denote the same constituent elements.

[0046] Elements or layers referred to as "on" or "above" another element or layer include cases where they are directly on top of another element or where other layers or elements are disposed between them. On the other hand, elements referred to as "directly on" or "directly above" indicate that no other elements or layers are disposed between them. "And / or" includes each of the mentioned items individually and all combinations of more than one.

[0047] The spatially relative terms "below," "below," "lower," "above," and "upper," etc., may be used, as shown in the figures, to easily describe the relationship between one element or component and other elements or components. Spatially relative terms should be understood to include terms that include the directions shown in the figures plus the different directions of the elements during use or operation. Throughout the specification, the same reference numerals denote the same components.

[0048] Although terms such as "first," "second," etc., are used to describe various elements, constituent elements, and / or sections, these elements, constituent elements, and / or sections are not limited by these terms. These terms are used only to distinguish one element, constituent element, or section from other elements, constituent elements, or sections. Therefore, the first element, first constituent element, or first section mentioned below may also be a second element, second constituent element, or second section within the technical concept of this invention.

[0049] The embodiments described in this specification will be illustrated with reference to top and cross-sectional views, which are intended as schematic diagrams of the invention. Therefore, the form of the schematic diagrams may be varied due to manufacturing techniques and / or permissible errors. Thus, the embodiments of the invention are not limited to the specific forms illustrated, but also include variations in form resulting from manufacturing processes. Therefore, the areas illustrated in the drawings are schematic in nature, and the forms shown are intended to illustrate specific shapes of areas of elements, and are not intended to limit the scope of the invention.

[0050] Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

[0051] Figure 1 This is a perspective view of an electronic device according to an embodiment of the present invention. Figure 2A and Figure 2B It is shown Figure 1 The diagram shows the folded state of the electronic device.

[0052] Reference Figure 1In embodiments of the present invention, the electronic device ED can be rectangular in shape, having a short side extending along a first direction DR1 and a long side extending along a second direction DR2 intersecting the first direction DR1. However, it is not limited to this; the electronic device ED can have various shapes such as circular and polygonal. The electronic device ED can be flexible.

[0053] Hereinafter, the direction that substantially intersects the plane defined by the first direction DR1 and the second direction DR2 is defined as the third direction DR3. Furthermore, in this specification, "when viewed on the plane" can be defined as the state of being viewed on the third direction DR3.

[0054] The electronic device ED may include a folded region FA and multiple non-folded regions NFA1 and NFA2. The non-folded regions NFA1 and NFA2 may include a first non-folded region NFA1 and a second non-folded region NFA2. The folded region FA may be disposed between the first non-folded region NFA1 and the second non-folded region NFA2. The folded region FA, the first non-folded region NFA1, and the second non-folded region NFA2 may be arranged in a first direction DR1.

[0055] By way of example, although a folded region FA and two non-folded regions NFA1 and NFA2 are shown in the figure, the number of folded regions FA and non-folded regions NFA1 and NFA2 is not limited thereto. For example, an electronic device ED may include more than two non-folded regions and multiple folded regions arranged between the non-folded regions.

[0056] The upper surface of the electronic device ED can be defined by a display surface DS, which can have a plane defined by a first direction DR1 and a second direction DR2. The image IM generated in the electronic device ED can be provided to the user through the display surface DS.

[0057] The display surface DS may include a display area DA and a non-display area NDA surrounding the display area DA. The display area DA may display an image, while the non-display area NDA may not display an image. The non-display area NDA may surround the display area DA and define the border of the electronic device ED printed with specified colors.

[0058] Reference Figure 2A and Figure 2BThe electronic device ED can be a foldable (foldable) electronic device ED, either foldable or non-foldable. For example, the electronic device ED is folded by bending the folding region FA with reference to a folding axis FX parallel to the second direction DR2. The folding axis FX can be defined as a long axis parallel to the long side of the electronic device ED. When the electronic device ED is folded, the first non-folding region NFA1 and the second non-folding region NFA2 face each other, and the electronic device ED can be in-folded so that the display surface DS is not exposed to the outside. However, embodiments of the present invention are not limited thereto. For example, as Figure 2B As shown, the electronic device ED can be out-folded around the folding axis FX, so that the display surface DS is exposed to the outside. Furthermore, although not shown, the electronic device ED can also be folded inwards and outwards simultaneously.

[0059] Figure 3 yes Figure 1 An exploded perspective view of the electronic device shown.

[0060] Reference Figure 3 The electronic device ED may include: a display device DD, an electronic module EM, a power module PSM, and a housing EDC. Although not illustrated, the electronic device ED may also include a mechanism (e.g., a hinge) for controlling the folding action of the display device DD.

[0061] The display device DD can generate images and sense external input. The display device DD may include a window module WM and a display module DM. The window module WM provides the front surface of the electronic device ED. The window module WM can be configured on the display module DM and protect the display module DM. The window module WM allows light generated in the display module DM to be transmitted and provided to the user.

[0062] The display module DM may include a display panel DP. Although in Figure 3 The diagram only shows the display panel DP in the stacked structure of the display module DM, but in reality, the display module DM may also include multiple components disposed above and below the display panel DP. The detailed stacked structure of the display module DM will be described in detail below. The display panel DP may include components related to the electronic device ED. Figure 1 The display area DA and the non-display area NDA correspond to the display area DA and the non-display area NDA.

[0063] The display module DM may include a data driver unit DDV disposed on the non-display area NDA of the display panel DP. The data driver unit DDV may be directly fabricated as a circuit chip and mounted on the non-display area NDA. However, it is not limited to this; the data driver unit DDV may be mounted on a flexible circuit board connected to the display panel DP.

[0064] The electronic module EM and the power supply module PSM can be configured below the display device DD. Although not shown, the electronic module EM and the power supply module PSM can be connected to each other via an additional flexible circuit board. The electronic module EM can control the operation of the display device DD. The power supply module PSM can supply power to the electronic module EM.

[0065] The housing EDC can house the display device DD, the electronic module EM, and the power module PSM. The housing EDC can include two first housings EDC1 and a second housing EDC2 for folding the display device DD. The first housings EDC1 and the second housing EDC2 can extend in a second direction DR2 and be arranged in a first direction DR1.

[0066] Although not illustrated, the electronic device ED may also include a hinge structure for connecting the first housing EDC1 and the second housing EDC2. The housing EDC may be combined with the window module WM. The housing EDC can protect the display device DD, the electronic module EM, and the power module PSM.

[0067] Figure 4 This is a block diagram of an electronic device according to an embodiment of the present invention.

[0068] Reference Figure 4 The electronic device ED outputs various information through the display module 14 within the operating system. When the processor 11 runs the application program stored in the memory 12, the display module 14 provides the application information to the user through the display panel 14-1. Additionally, Figure 4 The display module 14 can refer to the aforementioned display module DM, and the display panel 14-1 refers to the aforementioned display panel DP.

[0069] The processor 11 acquires external input via the input module 13 or the sensor module 16-1 and runs the application corresponding to the external input. For example, if the user selects the camera icon displayed on the display panel 14-1, the processor 11 acquires user input via the input sensor 16-12 and activates the camera module 17-1. The processor 11 then transmits image data corresponding to the captured image acquired by the camera module 17-1 to the display module 14. The display module 14 can then display the image corresponding to the captured image via the display panel 14-1.

[0070] As another example, when personal information authentication is performed in the display module 14, the fingerprint sensor 16-11 acquires the entered fingerprint information as input data. The processor 11 compares the input data acquired by the fingerprint sensor 16-11 with the authentication data stored in the memory 12, and runs the application based on the comparison result. The display module 14 can display the information executed according to the logic of the application through the display panel 14-1.

[0071] As another example, when the music stream icon displayed on the display module 14 is selected, the processor 11 acquires user input through the input sensors 16-12 and activates the music stream application stored in the memory 12. When a music run command is entered in the music stream application, the processor 11 activates the audio output module 16-3 to provide the user with audio information that corresponds to the music run command.

[0072] The above provides a brief explanation of the operation of the electronic device ED. The following section provides a detailed explanation of the structure of the electronic device ED. In the structure of the electronic device ED described below, some parts may be integrated into a single structure, or a single structure may be provided as two or more separate structures.

[0073] Reference Figure 4 The electronic device ED can communicate with an external electronic device OD via a network (e.g., a short-range wireless communication network or a long-range wireless communication network). According to one embodiment, the electronic device ED may include: a processor 11, a memory 12, an input module 13, a display module 14, a power module 15, a built-in module 16, and an external module 17. According to one embodiment, at least one of the above-described components of the electronic device ED may be omitted, or more than one other component may be added. According to one embodiment, some of the above-described components (e.g., sensor module 16-1, antenna module 16-2, or audio output module 16-3) may be integrated into another component (e.g., display module 14).

[0074] The processor 11 can control at least one other component (e.g., hardware or software component) of the electronic device ED connected to the processor 11 by running software, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operation, the processor 11 can store instructions or data received from other components (e.g., input module 13, sensor module 16-1, or communication module 17-3) into volatile memory 12-1, process the instructions or data stored in volatile memory 12-1, and store the result data into non-volatile memory 12-2.

[0075] Processor 11 may include a main processor 11-1 and an auxiliary processor 11-2. The main processor 11-1 may include one or more of a central processing unit (CPU) and an application processor (AP). The main processor 11-1 may also include one or more of a graphics processing unit (GPU), a communication processor (CP), and an image signal processor (ISP). The main processor 11-1 may also include a neural network processing unit (NPU). The neural network processing unit is a processor specialized for processing artificial intelligence models, which can be generated through machine learning. The artificial intelligence model may include multiple layers of artificial neural networks. Artificial neural networks can be one of the following: deep neural networks (DNN), convolutional neural networks (CNN), recurrent neural networks (RNN), restricted Boltzmann machines (RBM), deep belief networks (DBN), bidirectional recurrent deep neural networks (BRDNN), deep Q-networks, or combinations of two or more of these, but are not limited to the examples mentioned above. In addition to hardware architecture, artificial intelligence models may additionally or alternatively include software architecture. They can be implemented using the aforementioned processing unit and a structure integrating at least two of the processors into one (e.g., a single chip), or in a structure that is independent of each other (e.g., multiple chips).

[0076] The auxiliary processor 11-2 may include a controller 11-21. The controller 11-21 may include interface conversion circuitry and timing control circuitry. The controller 11-21 can receive image signals from the main processor 11-1, convert the image signal data format in a manner compatible with the interface specifications of the display module 14, and output the image data. The controller 11-21 can output various control signals required for driving the display module 14.

[0077] The auxiliary processor 11-2 may also include a data conversion circuit 11-22, a gamma calibration circuit 11-23, a rendering circuit 11-24, etc. The data conversion circuit 11-22 can receive image data from the controller 11-21 and compensate the image data according to the characteristics of the electronic device ED or user settings, so that the image can be displayed at the required brightness, or convert the image data to reduce power consumption or compensate for image retention, etc. The gamma calibration circuit 11-23 can convert image data or gamma reference voltage, etc., so that the image displayed on the electronic device ED has the required gamma characteristics. The rendering circuit 11-24 can receive image data from the controller 11-21 and render the image data taking into account the pixel arrangement of the display panel 14-1 used in the electronic device ED, etc. At least one of the data conversion circuit 11-22, gamma calibration circuit 11-23, and rendering circuit 11-24 can be integrated into other components (e.g., the main processor 11-1 or the controller 11-21). At least one of the data conversion circuits 11-22, gamma calibration circuits 11-23, and rendering circuits 11-24 can also be integrated into the data driver 14-3 described later.

[0078] The memory 12 may store various types of data used by at least one component of the electronic device ED (e.g., processor 11 or sensor module 16-1), as well as input or output data related to the instructions associated therewith. The memory 12 may include one or more of volatile memory 12-1 and non-volatile memory 12-2.

[0079] The input module 13 can receive instructions or data from the components of the electronic device ED (e.g., processor 11, sensor module 16-1, or audio output module 16-3) from outside the electronic device ED (e.g., a user or external electronic device OD).

[0080] Input module 13 may include a first input module 13-1 for user input of commands or data and a second input module 13-2 for input of commands or data to an external electronic device OD. The first input module 13-1 may include a microphone, mouse, keyboard, buttons (e.g., keypads), or pen (e.g., a passive or active pen). The second input module 13-2 may support a specified protocol enabling connection to the external electronic device OD via wired or wireless means. According to one embodiment, the second input module 13-2 may include a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface. The second input module 13-2 may include a connector enabling physical connection to the external electronic device OD, such as an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0081] Display module 14 provides information to the user visually. Display module 14 may include: display panel 14-1, scan driver 14-2, and data driver 14-3. Display module 14 may also include a chassis and bracket for protecting display panel 14-1.

[0082] The display panel 14-1 may include a liquid crystal display panel, an organic light-emitting display panel, or an inorganic light-emitting display panel; there is no particular limitation on the type of display panel 14-1. The display panel 14-1 may be rigid or flexible, capable of being rolled or folded. The display module 14 may also include supports, brackets, or heat dissipation components for supporting the display panel 14-1. A detailed description of the display panel 14-1 will follow. Figure 3 This will be discussed later.

[0083] The scan driver 14-2 can be mounted as a driver chip on the display panel 14-1. Furthermore, the scan driver 14-2 can be integrated into the display panel 14-1. For example, the scan driver 14-2 may include an amorphous silicon TFT gate driver circuit (ASG), a low-temperature polycrystalline silicon (LTPS) TFT gate driver circuit, or an oxide semiconductor TFT gate driver circuit (OSG) built into the display panel 14-1. The scan driver 14-2 receives control signals from the controller 11-21 and outputs scan signals to the display panel 14-1 in response to the control signals.

[0084] The display panel 14-1 may also include a light-emitting driver. The light-emitting driver outputs a light-emitting control signal to the display panel 14-1 in response to a control signal received from the controller 11-21. The light-emitting driver may be formed separately from the scan driver 14-2, or it may be integrated into the scan driver 14-2.

[0085] The data driver 14-3 receives a control signal from the controller 11-21 and, in response to the control signal, converts the image data into an analog voltage (e.g., a data voltage) and then outputs the data voltage to the display panel 14-1.

[0086] The data driver 14-3 can be integrated into other components (e.g., controller 11-21). The functions of the interface conversion circuit and timing control circuit of the controller 11-21 described above can also be integrated into the data driver 14-3.

[0087] The display module 14 may also include a light-emitting driver and a voltage generating circuit. The voltage generating circuit can output various voltages required to drive the display panel 14-1.

[0088] Power module 15 supplies power to the components of the electronic device ED. Power module 15 may include a battery with a rechargeable power supply voltage. The battery may include a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. Power module 15 may include a power management integrated circuit (PMIC). The PMIC provides optimized power to each of the modules described above and later. Power module 15 may include a wireless power transceiver component electrically connected to the battery. The wireless power transceiver component may include multiple antenna radiators in the form of coils.

[0089] The electronic device ED may also include a built-in module 16 and an external module 17. The built-in module 16 may include a sensor module 16-1, an antenna module 16-2, and an audio output module 16-3. The external module 17 may include a camera module 17-1, an illumination module 17-2, and a communication module 17-3.

[0090] Sensor module 16-1 can sense input based on the user's body or input based on the pen in the first input module 13-1, and generate an electrical signal or data value corresponding to the input. Sensor module 16-1 may include one or more of fingerprint sensor 16-11, input sensor 16-12, and digitizer 16-13.

[0091] The fingerprint sensor 16-11 can generate data values ​​corresponding to the user's fingerprint. The fingerprint sensor 16-11 can include either optical or capacitive fingerprint sensors.

[0092] Input sensor 16-12 can generate data values ​​corresponding to coordinate information based on user body input or pen input. Input sensor 16-12 generates data values ​​based on capacitance changes based on the input. Input sensor 16-12 can sense input based on a passive pen or transmit and receive data with an active pen.

[0093] Input sensors 16-12 can also measure biometric signals such as blood pressure, water content, or body fat. For example, if a user places a part of their body in contact with the sensor layer or detection panel and does not move it for a certain period of time, input sensors 16-12 can sense biometric signals based on changes in the electric field of the body part and output the information required by the user to the display module 14.

[0094] The graphics tablet 16-13 can generate data values ​​corresponding to coordinate information based on pen input. The graphics tablet 16-13 generates data values ​​using electromagnetic changes based on the input. The graphics tablet 16-13 can sense input based on a passive pen or transmit and receive data with an active pen.

[0095] At least one of the fingerprint sensor 16-11, the input sensor 16-12, and the digitizer 16-13 can also be implemented by an input sensing layer formed on the display panel 14-1 through a continuous process. The fingerprint sensor 16-11, the input sensor 16-12, and the digitizer 16-13 can be disposed on the upper side of the display panel 14-1, and one of the fingerprint sensor 16-11, the input sensor 16-12, and the digitizer 16-13, for example, the digitizer 16-13, can be disposed on the lower side of the display panel 14-1.

[0096] Two or more of the fingerprint sensor 16-11, input sensor 16-12, and digitizer 16-13 can be integrated into a single detection panel using the same process. In the case of integration into a single detection panel, the detection panel can be configured on the display panel 14-1 and the window module WM (see reference) configured on the upper side of the display panel 14-1. Figure 3 Between ) . According to one embodiment, the detection panel can also be configured in the window module WM (refer to Figure 3 On the device, there are no particular restrictions on the position of the detection panel. Although, as will be discussed later... Figure 5 The detection panel is shown as a window module WM (refer to) configured on the upper side of the display panel 14-1. Figure 3 The input detection unit ISP between () is used, but the embodiments are not limited to this.

[0097] At least one of the fingerprint sensor 16-11, the input sensor 16-12, and the digitizer 16-13 can be integrated into the display panel 14-1. That is, at least one of the fingerprint sensor 16-11, the input sensor 16-12, and the digitizer 16-13 can be formed simultaneously by the process of forming the elements (e.g., light-emitting elements, transistors, etc.) included in the display panel 14-1.

[0098] In addition, sensor module 16-1 can generate electrical signals or data values ​​corresponding to the internal or external states of electronic device ED. Sensor module 16-1 may also include, for example, a posture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0099] Antenna module 16-2 may include one or more antennas for transmitting or receiving signals or power to or from external sources. According to one embodiment, communication module 17-3 may transmit signals to or receive signals from external electronic devices via an antenna suitable for a communication method. The antenna pattern of antenna module 16-2 may also be integrated into a structural element of display module 14 (e.g., display panel 14-1) or input sensor 16-12, etc.

[0100] The audio output module 16-3 is a device for outputting audio signals to the external device ED. For example, it may include a speaker used for general purposes such as multimedia playback or recording playback, and a receiver for telephone listening. According to one embodiment, the receiver may be integrally formed with the speaker or formed separately. The audio output pattern of the audio output module 16-3 may also be integrated into the display module 14.

[0101] Camera module 17-1 can capture both still and moving images. According to one embodiment, camera module 17-1 may include one or more lenses, image sensors, or image signal processors. Camera module 17-1 may also include an infrared camera capable of measuring the presence or absence of a user, the user's position, the user's line of sight, etc.

[0102] The lighting module 17-2 can provide light. The lighting module 17-2 may include a light-emitting diode or a xenon lamp. The lighting module 17-2 can operate in conjunction with the camera module 17-1 or operate independently.

[0103] Communication module 17-3 can support the establishment of wired or wireless communication channels between electronic device ED and external electronic device OD, and the execution of communication based on the established communication channels. Communication module 17-3 may include one or all of the following: wireless communication modules such as cellular communication modules, short-range wireless communication modules, or global navigation satellite system (GNSS) communication modules; and wired communication modules such as local area network (LAN) communication modules or power line communication modules. Communication module 17-3 can communicate with external electronic device OD through short-range communication networks such as Bluetooth, WiFi Direct, or infrared data association (IrDA), or long-range communication networks such as cellular networks, the Internet, or computer networks (e.g., LAN or WAN). The various types of communication modules 17-3 described above can be implemented by a single chip or by separate chips.

[0104] Input module 13, sensor module 16-1, camera module 17-1, etc. can be linked with processor 11 and used to control the operation of display module 14.

[0105] The processor 11 outputs instructions or data to the display module 14, audio output module 16-3, camera module 17-1, or lighting module 17-2 based on the input data received from the input module 13. For example, the processor 11 can generate image data corresponding to input data received via a mouse or active pen and output it to the display module 14, or generate instruction data corresponding to the input data and output it to the camera module 17-1 or lighting module 17-2. If no input data is received from the input module 13 within a specified period, the processor 11 can switch the operating mode of the electronic device ED to a low-power mode or a sleep mode, thereby reducing the power consumed by the electronic device ED.

[0106] The processor 11 outputs instructions or data to the display module 14, the audio output module 16-3, the camera module 17-1, or the lighting module 17-2 based on the detection data received from the sensor module 16-1. For example, the processor 11 can compare the authentication data applied by the fingerprint sensor 16-11 with the authentication data stored in the memory 12, and run the application based on the comparison result. The processor 11 can run instructions or output corresponding image data to the display module 14 based on the detection data sensed by the input sensor 16-12 or the digitizer 16-13. If the sensor module 16-1 includes a temperature sensor, the processor 11 can also receive temperature data related to the temperature measured from the sensor module 16-1, and perform brightness calibration, etc., for the image data based on the temperature data.

[0107] The processor 11 can receive measurement data related to the presence or absence of a user, the user's position, and the user's line of sight from the camera module 17-1. The processor 11 can also perform brightness calibration and other functions on the image data based on the measurement data. For example, the processor 11, which determines the presence or absence of a user based on input from the camera module 17-1, can output image data that has undergone brightness calibration via the data conversion circuit 11-22 or the gamma calibration circuit 11-23 to the display module 14.

[0108] Some of the constituent elements can be connected to peripheral devices via communication methods (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), mobile industry processor interface (MIPI), or Ultrapath interconnect (UPI) link) and exchange signals (e.g., instructions or data) with each other. The processor 11 can communicate with the display module 14 through an agreed interface, for example, using one of the above-described communication methods, but is not limited to the above-described communication methods.

[0109] Figure 5 This is a cross-sectional view of a display module according to an embodiment of the present invention.

[0110] Reference Figure 5 The display module DM may include: a display panel DP, an input detection unit ISP disposed on the display panel DP, an anti-reflective layer RPL disposed on the input detection unit ISP, and a panel protective layer PPL disposed below the display panel DP. The display panel DP may be a flexible display panel. For example, the display panel DP may include a flexible substrate and multiple components disposed on the flexible substrate.

[0111] In one embodiment of the present invention, the display panel DP can be a light-emitting display panel, but there are no particular limitations. For example, the display panel DP can be an organic light-emitting display panel or an inorganic light-emitting display panel. The light-emitting layer of an organic light-emitting display panel may include organic light-emitting materials. The light-emitting layer of an inorganic light-emitting display panel may include quantum dots and quantum rods, etc. Hereinafter, the display panel DP will be described as an organic light-emitting display panel.

[0112] The input detection unit (ISP) may include multiple sensor units (not shown) that sense external inputs using capacitive methods. The input detection unit (ISP) may be formed directly on the display panel (DP) during the manufacturing of the display module (DM).

[0113] An anti-reflective layer (RPL) can be disposed on the input detection unit (ISP). The RPL can be formed directly on the ISP during the manufacturing of the display module (DM). The RPL can be defined as an external light anti-reflective film. The RPL reduces the reflectivity of external light incident from above the display module (DM) towards the display panel (DP).

[0114] As an example, the input detection unit ISP can be directly formed on the display panel DP, and the anti-reflective layer RPL can be directly formed on the input detection unit ISP, but the embodiments of the present invention are not limited thereto. For example, the input detection unit ISP can be manufactured separately and attached to the display panel DP using an adhesive layer, and the anti-reflective layer RPL can be manufactured separately and attached to the input detection unit ISP using an adhesive layer.

[0115] The display panel (DP), input detection unit (ISP), and anti-reflective layer (RPL) can be defined as an electronic panel (EP).

[0116] A panel protective layer (PPL) can be disposed below the display panel (DP). The PPL protects the lower part of the display panel (DP). The PPL can include a flexible plastic material. For example, the PPL can include polyethylene terephthalate (PET).

[0117] Figure 6 This is a cross-sectional view of a display panel according to an embodiment of the present invention. Figure 6 The image shows a cross-section of the display panel DP as seen from the second direction DR2.

[0118] Reference Figure 6 The display panel DP may include: a substrate SUB, a circuit element layer DP-CL disposed on the substrate SUB, a display element layer DP-OLED disposed on the circuit element layer DP-CL, and a thin film encapsulation layer TFE disposed on the display element layer DP-OLED.

[0119] The substrate SUB may include a display area DA and a non-display area NDA surrounding the display area DA. The substrate SUB may include a flexible plastic material such as glass or polyimide. The display element layer DP-OLED may be disposed on the display area DA.

[0120] Multiple pixels can be configured in both the DP-CL (Distributed Circuit Layer) and DP-OLED (Display OLED) layers. Each pixel may include a transistor configured in the DP-CL and a light-emitting element configured in the DP-OLED and connected to the transistor. The pixel configuration will be discussed later. Figure 8 A detailed explanation will be provided in the following section.

[0121] The thin-film encapsulation layer TFE can be configured on the circuit element layer DP-CL in a manner that covers the display element layer DP-OLED. The thin-film encapsulation layer TFE can protect the pixels from moisture, oxygen, and external foreign substances.

[0122] Figure 7 This is a top view of a display panel according to an embodiment of the present invention.

[0123] ReferenceFigure 7 The display module DM may include: display panel DP, scan driver unit SDV, data driver unit DDV, and light emission driver unit EDV.

[0124] The display panel DP may include: a first non-curved region AA1, a second non-curved region AA2, and a curved region BA between the first non-curved region AA1 and the second non-curved region AA2. The curved region BA may extend in a second direction DR2, and the first non-curved region AA1, the curved region BA, and the second non-curved region AA2 may be arranged in a first direction DR1.

[0125] The first non-curved region AA1 may include the display region DA and the non-display region NDA surrounding the display region DA. The non-display region NDA may surround the display region DA. The display region DA may be the area where an image is displayed, and the non-display region NDA may be the area where no image is displayed. The second non-curved region AA2 and the curved region BA may be areas where no image is displayed.

[0126] When viewed from the second direction DR2, the first non-curved region AA1 may include: a first non-folded region NFA1, a second non-folded region NFA2, and a folded region FA between the first non-folded region NFA1 and the second non-folded region NFA2.

[0127] The display panel DP may include: multiple pixels PX, multiple scan lines SL1-SLm, multiple data lines DL1-DLn, multiple light-emitting lines EL1-ELm, first and second control lines CSL1 and CSL2, power line PL, multiple connection lines CNL, and multiple pads PD. m and n are natural numbers. Pixels PX can be configured in the display area DA and connected to scan lines SL1-SLm, data lines DL1-DLn, and light-emitting lines EL1-ELm.

[0128] The scan driver unit (SDV) and the light-emitting driver unit (EDV) can be disposed in the non-display area NDA. The scan driver unit (SDV) and the light-emitting driver unit (EDV) can be disposed on opposite sides of the non-display area NDA in the second direction DR2, respectively, to the first non-curved area AA1. The data driver unit (DDV) can be disposed in the second non-curved area AA2. The data driver unit (DDV) can be directly fabricated as an integrated circuit chip and mounted on the second non-curved area AA2.

[0129] Scan lines SL1 to SLm can extend in the second direction DR2 and connect to the scan drive unit SDV. Data lines DL1 to DLn can extend in the first direction DR1, pass through the bending region BA, and connect to the data drive unit DDV. Light emission lines EL1 to Elm can extend in the second direction DR2 and connect to the light emission drive unit EDV.

[0130] The power line PL can extend in the first direction DR1 and be disposed in the non-display area NDA. The power line PL can be disposed between the display area DA and the light-emitting driver unit EDV, but is not limited thereto. The power line PL can also be disposed between the display area DA and the scan driver unit SDV.

[0131] The power line PL can extend through the curved region BA and into the second non-curved region AA2. When viewed from a plane, the power line PL can extend towards the lower end of the second non-curved region AA2. The power line PL can receive a drive voltage.

[0132] The connecting line CNL can extend in the second direction DR2 and be arranged on the first direction DR1. The connecting line CNL can be connected to the power line PL and the pixel PX. A driving voltage can be applied to the pixel PX through the interconnected power line PL and connecting line CNL.

[0133] The first control line CSL1 can be connected to the scan driver unit SDV, and extends through the curved region BA towards the lower end of the second non-curved region AA2. The second control line CSL2 can be connected to the light emission driver unit EDV, and extends through the curved region BA towards the lower end of the second non-curved region AA2. The data driver unit DDV can be disposed between the first control line CSL1 and the second control line CSL2.

[0134] When viewed from a planar perspective, the pad PD can be configured adjacent to the lower end of the second non-bent region AA2. The data drive unit DDV, power line PL, first control line CSL1, and second control line CSL2 can be connected to the pad PD.

[0135] Data lines DL1 to DLn can be connected to their corresponding pads PD via the data driver unit DDV. For example, data lines DL1 to DLn can be connected to the data driver unit DDV, and the data driver unit DDV can be connected to the pads PD corresponding to data lines DL1 to DLn respectively.

[0136] Although not illustrated, the pad PD can be connected to a printed circuit board (PCB), on which a timing controller and a voltage generation unit are mounted. The timing controller can be manufactured as an integrated circuit chip and mounted on the PCB. The timing controller and the voltage generation unit can be connected to the pad PD via the PCB.

[0137] The timing controller can control the operation of the scan drive unit (SDV), the data drive unit (DDV), and the light emission drive unit (EDV). The timing controller can generate scan control signals, data control signals, and light emission control signals in response to control signals received from an external source. The voltage generation unit can generate drive voltages.

[0138] The scan control signal can be provided to the scan driver unit SDV via the first control line CSL1. The light emission control signal can be provided to the light emission driver unit EDV via the second control line CSL2. The data control signal can be provided to the data driver unit DDV. The timing controller can receive image signals from the outside, convert the data format of the image signals in a manner compatible with the interface specifications of the data driver unit DDV, and provide them to the data driver unit DDV.

[0139] The scan drive unit SDV can generate multiple scan signals in response to the scan control signal. The scan signals can be applied to pixels PX via scan lines SL1 to SLm. The scan signals can be applied to pixels PX sequentially.

[0140] The data driving unit (DDV) can generate multiple data voltages corresponding to the image signal in response to a data control signal. These data voltages can be applied to the pixel PX via data lines DL1 to DLn. The light emission driving unit (EDV) can generate multiple light emission signals in response to a light emission control signal. These light emission signals can be applied to the pixel PX via light emission lines EL1 to Elm.

[0141] A pixel (PX) can receive a data voltage in response to a scan signal. A pixel (PX) can emit light of a brightness corresponding to the data voltage in response to a light emission signal, thereby displaying an image. The emission time of a pixel (PX) can be controlled by the light emission signal.

[0142] Figure 8 This is a cross-sectional view of an electronic panel according to an embodiment of the present invention. Figure 8 The example shows the relationship with Figure 7 The cross-section of the electronic panel EP corresponding to a certain pixel is shown.

[0143] Reference Figure 8 A pixel (PX) may include a transistor (TR) and a light-emitting element (OLED). The light-emitting element (OLED) may include: a first electrode (AE) (or anode), a second electrode (CE) (or cathode), a hole control layer (HCL), an electron control layer (ECL), and a light-emitting layer (EML).

[0144] The transistor TR and the light-emitting element OLED can be configured on the substrate SUB. Although the illustrative map shows a transistor TR, in practice, the pixel PX may include multiple transistors for driving the light-emitting element OLED and at least one capacitor.

[0145] The display area DA can include a light-emitting area PA corresponding to each pixel PX and a non-light-emitting area NPA surrounding the light-emitting area PA. The light-emitting element OLED can be configured in the light-emitting area PA.

[0146] A buffer layer BFL is disposed on the substrate SUB. The buffer layer BFL can be an inorganic layer. A semiconductor pattern can be disposed on the buffer layer BFL. The semiconductor pattern can include polycrystalline silicon, amorphous silicon, or metal oxide.

[0147] Semiconductor patterns can be doped using N-type or P-type dopants. A semiconductor pattern can include highly doped and lightly doped regions. The highly doped regions have higher conductivity than the lightly doped regions and can essentially function as the source and drain electrodes of a transistor (TR). The lightly doped regions can essentially function as the active (or channel) of a transistor.

[0148] The source (S), active electrode (A), and drain (D) of transistor TR can be formed from a semiconductor pattern. A first insulating layer (INS1) can be disposed on the semiconductor pattern. The gate (G) of transistor TR can be disposed on the first insulating layer (INS1). A second insulating layer (INS2) can be disposed on the gate (G). A third insulating layer (INS3) can be disposed on the second insulating layer (INS2).

[0149] The connecting electrode CNE may include a first connecting electrode CNE1 and a second connecting electrode CNE2 to connect the transistor TR and the light-emitting element OLED. The first connecting electrode CNE1 may be disposed on the third insulating layer INS3 and connected to the drain electrode D through the first contact hole CH1 defined in the first to third insulating layers INS1 to INS3.

[0150] A fourth insulating layer INS4 can be disposed on the first connecting electrode CNE1. A fifth insulating layer INS5 can be disposed on the fourth insulating layer INS4. A second connecting electrode CNE2 can be disposed on the fifth insulating layer INS5. The second connecting electrode CNE2 can be connected to the first connecting electrode CNE1 through the second contact hole CH2 defined in the fourth and fifth insulating layers INS4 and INS5.

[0151] A sixth insulating layer INS6 may be disposed on the second connecting electrode CNE2. The layer from the buffer layer BFL to the sixth insulating layer INS6 can be defined as the circuit element layer DP-CL. The first insulating layer INS1 to the sixth insulating layer INS6 can be inorganic or organic layers.

[0152] A first electrode AE ​​can be disposed on the sixth insulating layer INS6. The first electrode AE ​​can be connected to the second connecting electrode CNE2 through the third contact hole CH3 defined in the sixth insulating layer INS6. A pixel definition film PDL defining an opening PX_OP can be disposed on the first electrode AE ​​and the sixth insulating layer INS6. The opening PX_OP is used to expose a specified portion of the first electrode AE.

[0153] The hole control layer (HCL) can be disposed on the first electrode (AE) and the pixel definition film (PDL). The hole control layer (HCL) may include a hole transport layer and a hole injection layer.

[0154] The emissive layer EML can be configured on the hole control layer HCL. The emissive layer EML can be configured in the region corresponding to the opening PX_OP. The emissive layer EML can contain organic and / or inorganic materials. The emissive layer EML can generate one of red, green, and blue light.

[0155] An electron control layer (ECL) can be configured on the light-emitting layer (EML) and the hole control layer (HCL). The ECL may include an electron transport layer and an electron injection layer. The HCL and the ECL can be configured together in the light-emitting region (PA) and the non-light-emitting region (NPA).

[0156] The second electrode CE can be disposed on the electronic control layer ECL. The second electrode CE can also be disposed together on the pixel PX. The layer with the light-emitting element OLED can be defined as the display element layer DP-OLED.

[0157] The thin-film encapsulation layer TFE can be disposed on the second electrode CE and cover the pixel PX. The thin-film encapsulation layer TFE may include: a first encapsulation layer EN1 disposed on the second electrode CE, a second encapsulation layer EN2 disposed on the first encapsulation layer EN1, and a third encapsulation layer EN3 disposed on the second encapsulation layer EN2.

[0158] The first and third encapsulation layers EN1 and EN3 may include inorganic insulating layers and protect the pixel PX from moisture / oxygen. The second encapsulation layer EN2 may include organic insulating layers and protect the pixel PX from foreign matter such as dust particles.

[0159] A first voltage is applied to the first electrode AE ​​via transistor TR, and a second voltage with a lower level than the first voltage can be applied to the second electrode CE. Holes and electrons injected into the light-emitting layer EML recombine to form excitons, and as the excitons migrate to the ground state, the light-emitting element OLED can emit light.

[0160] An input detection unit (ISP) can be configured on the thin-film encapsulation layer TFE. The input detection unit (ISP) can be directly fabricated on the upper surface of the thin-film encapsulation layer TFE.

[0161] A substrate layer (BSL) may be disposed on the thin-film encapsulation layer (TFE). The substrate layer (BSL) may include an inorganic insulating layer. One or more inorganic insulating layers may be provided as substrate layers (BSLs) on the thin-film encapsulation layer (TFE).

[0162] The input detection unit (ISP) may include a first conductive pattern CTL1 and a second conductive pattern CTL2 disposed on the first conductive pattern CTL1. The first conductive pattern CTL1 may be disposed on a substrate layer (BSL). An insulating layer (TINS) may be disposed on the substrate layer (BSL) to cover the first conductive pattern CTL1. The insulating layer (TINS) may include an inorganic insulating layer or an organic insulating layer. The second conductive pattern CTL2 may be disposed on the insulating layer (TINS).

[0163] The first conductive pattern CTL1 and the second conductive pattern CTL2 may overlap with the non-light-emitting region NPA. Although not illustrated, the first conductive pattern CTL1 and the second conductive pattern CTL2 may be disposed on the non-light-emitting region NPA between the light-emitting regions PA and have a mesh shape.

[0164] The first conductive pattern CTL1 and the second conductive pattern CTL2 can form the sensor of the aforementioned input detection unit ISP. For example, the first conductive pattern CTL1 and the second conductive pattern CTL2, which are in the shape of a grid, can be separated from each other in a defined area to form the sensor. A portion of the second conductive pattern CTL2 can be connected to the first conductive pattern CTL1.

[0165] An anti-reflective layer RPL can be disposed on the second conductive pattern CTL2. The anti-reflective layer RPL may include a black matrix BM and multiple color filters CF. The black matrix BM may overlap with the non-emitting region NPA, and the color filters CF may overlap with the emitting region PA respectively.

[0166] The black matrix BM can be configured on the insulating layer TINS ​​in a manner that covers the second conductive pattern CTL2. An opening B_OP can be defined within the black matrix BM, overlapping the light-emitting region PA and the opening PX_OP. The black matrix BM can absorb and block light. The width of the opening B_OP can be greater than the width of the opening PX_OP.

[0167] A color filter CF can be disposed on the first insulating layer TINS ​​and the black matrix BM. The color filter CF can also be disposed on the opening B_OP. A planarization insulating layer PINS can be disposed on the color filter CF. The planarization insulating layer PINS provides a flat upper surface.

[0168] In cases where external light traveling towards the display panel DP is reflected by the display panel DP and then presented to the user, the user can perceive the external light, similar to a mirror. To prevent this, an anti-reflective layer RPL can, exemplarily, include multiple color filters CF that display the same color as the pixels PX of the display panel DP. The color filters CF can filter the external light to the same color as the pixels PX. In this case, the external light can be prevented from being perceived by the user.

[0169] However, embodiments of the present invention are not limited thereto; the antireflective layer RPL may include a polarizing film to reduce the reflectivity of external light. The polarizing film may be manufactured separately and attached to the input detection unit ISP using an adhesive layer. The polarizing film may include a phase retarder and / or a polarizer.

[0170] Figure 9A and Figure 9B This is a cross-sectional view of a display device according to an embodiment of the present invention. Figure 9A Showing with Figure 7 The cross section of the display device DD corresponding to the section line I-I' shown. Figure 9B Show Figure 9A The cross-section of the display device DD is shown in the bent state of the bending region BA. Additionally, due to... Figure 9A The folded axis FX shown Figure 2A The folding axis FX is the same, and its description will be omitted or simplified.

[0171] The display device DD may include: a display unit DSP, a window module WM disposed on the display unit DSP, a support plate PLT disposed below the display unit DSP, and a cover layer TPU. The support plate PLT can support the display module DM. The window module WM may include: a window WIN, a window protective layer WP, a hard coating HC, and a first adhesive layer AL1 and a second adhesive layer AL2.

[0172] The display module (DSP) may include: an electronic panel (EP), an impact-absorbing layer (ISL), a panel protective layer (PPL), a barrier layer (BRL), and third to sixth adhesive layers (AL3 to AL6). The impact-absorbing layer (ISL), electronic panel (EP), panel protective layer (PPL), third adhesive layer (AL3), and fourth adhesive layer (AL4) can be defined as the display module (DM). The composition of the electronic panel (EP) and panel protective layer (PPL) has been described previously. Figure 5 The details are explained in detail in the document, so the explanation will be omitted here.

[0173] An impact absorbing layer (ISL) can be disposed on an electronic panel EP. The impact absorbing layer (ISL) can absorb external impacts applied to the electronic panel EP from above the display device DD to protect the electronic panel EP. The impact absorbing layer (ISL) can be manufactured in the form of a stretched film.

[0174] The impact absorbing layer (ISL) can include a flexible plastic material. A flexible plastic material can be defined as a synthetic resin film. For example, the impact absorbing layer (ISL) can contain a flexible plastic material such as polyimide or polyethylene terephthalate.

[0175] The window (WIN) can be disposed on the shock-absorbing layer (ISL). The window (WIN) can protect the electronic panel (EP) from external scratches. The window (WIN) can be optically transparent. The window (WIN) can include glass. However, it is not limited to this; the window (WIN) can include a synthetic resin film.

[0176] The window (WIN) can have a multi-layer or single-layer structure. For example, the window (WIN) may include multiple synthetic resin films bonded together using an adhesive, or it may include a glass substrate and synthetic resin films bonded together using an adhesive.

[0177] A window protective layer WP can be configured on a window WIN. The window protective layer WP may include a flexible plastic material such as polyimide or polyethylene terephthalate. A hard coating HC can be configured on the upper surface of the window protective layer WP.

[0178] The printed layer PIT can be configured on the lower surface of the window protector layer WP. The printed layer PIT can be black, but the color of the printed layer PIT is not limited to this. The printed layer PIT can be adjacent to the border of the window protector layer WP.

[0179] A barrier layer (BRL) can be positioned beneath the panel protective layer (PPL). The BRL enhances resistance to compressive forces from external pressure. Therefore, the BRL helps prevent deformation of the electronic panel (EP). The BRL can comprise flexible plastic materials such as polyimide or polyethylene terephthalate.

[0180] The blocking layer (BRL) can have a color that absorbs light. For example, the blocking layer (BRL) can be black. In such cases, when the display module (DM) is viewed from above, the components disposed below the blocking layer (BRL) may not be visible.

[0181] The first adhesive layer AL1 can be disposed between the window protection layer WP and the window WIN. Under the action of the first adhesive layer AL1, the window protection layer WP and the window WIN can adhere to each other. The first adhesive layer AL1 can cover the printed layer PIT.

[0182] The second adhesive layer AL2 can be disposed between the window WIN and the shock-absorbing layer ISL. Under the action of the second adhesive layer AL2, the window WIN and the shock-absorbing layer ISL can adhere to each other.

[0183] The third adhesive layer AL3 can be disposed between the shock absorbing layer ISL and the electronic panel EP. Under the action of the third adhesive layer AL3, the shock absorbing layer ISL and the electronic panel EP can be bonded to each other.

[0184] A fourth adhesive layer AL4 can be disposed between the electronic panel EP and the panel protective layer PPL. The electronic panel EP and the panel protective layer PPL can be bonded to each other using the fourth adhesive layer AL4.

[0185] A fifth adhesive layer AL5 may be disposed between the panel protective layer PPL and the barrier layer BRL. The panel protective layer PPL and the barrier layer BRL can be bonded to each other using the fifth adhesive layer AL5.

[0186] A sixth adhesive layer AL6 may be disposed between the barrier layer BRL and the support plate PLT. Specifically, the support plate PLT may be disposed below the barrier layer BRL, and the sixth adhesive layer AL6 may be disposed between the barrier layer BRL and the support plate PLT. The sixth adhesive layer AL6 may overlap with the first and second non-folded regions NFA1 and NFA2 and the folded region FA. The barrier layer BRL and the support plate PLT may be bonded to each other using the sixth adhesive layer AL6. Hereinafter, the sixth adhesive layer AL6 may be defined as the upper adhesive layer AL6. The sixth adhesive layer AL6 may be disposed on the upper surface PLT-U of the support plate PLT.

[0187] The first to sixth adhesive layers AL1, AL2, AL3, AL4, AL5, and AL6 may include transparent adhesives such as pressure-reducing adhesive (PSA) or optically clear adhesive (OCA), but the type of adhesive is not limited to these.

[0188] The thickness of the panel protective layer PPL can be less than the thickness of the window protective layer WP, and the thickness of the barrier layer BRL can be less than the thickness of the panel protective layer PPL. The thickness of the electronic panel EP can be less than the thickness of the barrier layer BRL, and equal to the thickness of the window WIN. The thickness of the shock absorbing layer ISL can be less than the thickness of the electronic panel EP.

[0189] The thickness of the first adhesive layer AL1 can be equal to the thickness of the barrier layer BRL. The thickness of each of the second adhesive layer AL2 and the third adhesive layer AL3 can be equal to the thickness of the panel protective layer PPL. The thickness of the fourth adhesive layer AL4 can be equal to the thickness of the fifth adhesive layer AL5.

[0190] The thickness of each of the fourth adhesive layer AL4 and the fifth adhesive layer AL5 can be less than the thickness of the electronic panel EP, but greater than the thickness of the shock absorbing layer ISL. The thickness of the sixth adhesive layer AL6 can be less than the thickness of the shock absorbing layer ISL. The thickness of the hard coating HC can be less than the thickness of the sixth adhesive layer AL6.

[0191] The electronic panel EP, shock-absorbing layer ISL, panel protective layer PPL, and third and fourth adhesive layers AL3 and AL4 can have the same width. The window protective layer WP and the first adhesive layer AL1 can have the same width. The barrier layer BRL and the fifth and sixth adhesive layers AL5 and AL6 can have the same width.

[0192] The widths of the electronic panel EP, the shock-absorbing layer ISL, the panel protective layer PPL, and the third and fourth adhesive layers AL3 and AL4 can be greater than the widths of the window protective layer WP and the first adhesive layer AL1. The borders of the electronic panel EP, the shock-absorbing layer ISL, the panel protective layer PPL, and the third and fourth adhesive layers AL3 and AL4 can be positioned further outward than the borders of the window protective layer WP and the first adhesive layer AL1.

[0193] The width of the window WIN and the second adhesive layer AL2 can be smaller than the width of the window protective layer WP and the first adhesive layer AL1. The width of the second adhesive layer AL2 can be smaller than the width of the window WIN. The border of the window WIN can be positioned further inward than the borders of the window protective layer WP and the first adhesive layer AL1. The border of the second adhesive layer AL2 can be positioned further inward than the border of the window WIN.

[0194] The width of the barrier layer BRL and the fifth and sixth adhesive layers AL5 and AL6 can be smaller than the width of the window protection layer WP and the first adhesive layer AL1. The borders of the barrier layer BRL and the fifth and sixth adhesive layers AL5 and AL6 can be positioned further inward than the borders of the window protection layer WP and the first adhesive layer AL1.

[0195] The support plate PLT can be configured below and support the display unit DSP. The support plate PLT can also be configured below and support the electronic panel EP. The width of the support plate PLT can be substantially the same as the width of the electronic panel EP. The support plate PLT can have greater rigidity than the display unit DSP.

[0196] The support plate (PLT) can contain non-metallic materials. For example, the support plate (PLT) can include a reinforcing fiber composite material. The reinforcing fiber composite material can be carbon fiber reinforced plastic (CFRP) or glass fiber reinforced plastic (GFRP).

[0197] The support plate PLT can incorporate reinforcing fiber composite materials to achieve lightweighting. By incorporating reinforcing fiber composite materials, the support plate PLT can achieve a similar level of modulus and strength to a metal support plate while maintaining a lighter weight compared to a metal support plate. Furthermore, by incorporating reinforcing fiber composite materials, the support plate PLT can be more easily shaped compared to a metal support plate. For example, the support plate PLT incorporating reinforcing fiber composite materials can be more easily processed using laser technology or microblasting. However, this is merely illustrative and not limited to these examples; the support plate PLT may also incorporate metallic materials.

[0198] The support plate PLT may include: a first non-folding portion PLT1, a folding portion PLF, and a second non-folding portion PLT2. The first non-folding portion PLT1 may overlap with a first non-folding region NFA1. The folding portion PLF may overlap with a folding region FA. The second non-folding portion PLT2 may overlap with a second non-folding region NFA2.

[0199] Multiple openings OP can be defined in the folded portion PLF. The openings OP can be formed by extending a portion of the support plate PLT along the third direction DR3. When viewed from the second direction DR2, the openings OP can be arranged spaced apart from each other in the first direction DR1. The openings OP can be formed using the aforementioned laser process or micro-blowing process.

[0200] By defining an opening OP in the portion of the support plate PLT that overlaps with the folding region FA, the flexibility of the portion of the support plate PLT overlapping the folding region FA can be improved. As a result, the support plate PLT can be folded around the folding region FA.

[0201] The TPU cover layer can be disposed on the lower surface PLT-L of the support plate PLT. The TPU cover layer can also be disposed on the lower surface of the folded portion PLF. The TPU cover layer can overlap with the opening OP. The TPU cover layer can cover the opening OP below the folded portion PLF. The width of the portion forming the opening OP can be the same as the width of the TPU cover layer. The TPU cover layer can prevent moisture and foreign substances from entering the opening OP.

[0202] Although not illustrated, the display device DD may also include a digitizing board, a shielding layer, and a heat dissipation layer disposed below the support plate PLT.

[0203] Reference Figure 9BThe panel protective layer PPL and the fourth adhesive layer AL4 may not be disposed below the bending region BA. The panel protective layer PPL and the fourth adhesive layer AL4 may be disposed below the second non-bending region AA2 of the electronic panel EP. The data drive unit DDV may be disposed below the second non-bending region AA2 of the electronic panel EP.

[0204] The printed circuit board (PCB) can be connected to the second non-bent area AA2 of the electronic panel EP. The PCB can be connected to one side of the second non-bent area AA2. The bent area BA is bent, so the second non-bent area AA2 can be positioned below the first non-bent area AA1. Therefore, the data drive unit DDV and the PCB can be positioned below the first non-bent area AA1.

[0205] Figure 10 and Figure 12 This is a perspective view of a support plate according to an embodiment of the present invention. Figure 11 This is an enlarged perspective view of a support plate according to an embodiment of the present invention. Figures 13A-13D This is a cross-sectional view of a support plate according to an embodiment of the present invention.

[0206] Figure 10 and Figure 12 Show Figure 9A and Figure 9B The diagram shows a three-dimensional view of the support plate PLT. Figure 12 The laminated structure of fibers RP1 and RP2 constituting the support plate PLT is shown in more detail below. For ease of explanation, Figure 12 The opening OP is omitted in the middle (refer to) Figure 10 A diagram illustrating the specific constituent elements of (etc.). Figure 11 It is aimed at Figure 10 An enlarged 3D view of the WW' region shown. Figure 13A and Figure 13B Show respectively with Figure 11 The cross section of the support plate PLT corresponding to the Ⅱ-Ⅱ' section line shown. Figure 13A The laminated structure of fibers RP1 and RP2 constituting the support plate PLT is shown in more detail below. Figure 13B The layered structure of the first part S1 and the second part S2 constituting the support plate PLT is shown in more detail. Figure 13C Showing with Figure 11 The cross section of the support plate PLT corresponding to the Ⅲ-Ⅲ' section line shown. Figure 13D A cross-section of the support plate PLT-1 according to another embodiment of the present invention is shown.

[0207] Reference Figure 10 and Figure 11When viewed in a planar view, the support plate PLT can have a rectangular shape, having a short side extending along the first direction DR1 and a long side extending along the second direction DR2. However, this is only illustrative, and the shape of the support plate PLT can vary.

[0208] The support plate PLT may include: a first non-folding portion PLT1, a folding portion PLF, and a second non-folding portion PLT2. The folding portion PLF may be disposed between the first non-folding portion PLT1 and the second non-folding portion PLT2. The first non-folding portion PLT1, the folding portion PLF, and the second non-folding portion PLT2 may be arranged in a first direction DR1. The first non-folding portion PLT1 and the second non-folding portion PLT2 may be respectively connected to... Figure 7 and Figure 9A The first non-folded region NFA1 and the second non-folded region NFA2 shown overlap. The folded portion PLF can be with... Figure 7 and Figure 9A The folded regions FA shown overlap.

[0209] As an example, each of the first non-folding portion PLT1 and the second non-folding portion PLT2 may have a quadrilateral shape parallel to the plane defined by the first direction DR1 and the second direction DR2. However, this is not a limitation, and the shapes of the first non-folding portion PLT1 and the second non-folding portion PLT2 may vary.

[0210] A grid pattern can be defined in the folded section PLF. For example, multiple openings OP can be defined in the folded section PLF. The openings OP can be arranged according to a prescribed rule. The openings OP can be arranged in a grid pattern, thereby forming a grid pattern in the folded section PLF.

[0211] The openings OP can be arranged in both the first direction DR1 and the second direction DR2. When viewed in a plane, adjacent openings OP in the first direction DR1 can be staggered. The openings OP can extend further in the second direction DR2 than in the first direction DR1. That is, the openings OP can extend in a direction parallel to the folding axis FX.

[0212] Although not shown, the folded portion PLF may include a plurality of branches extending along a first direction DR1 and a plurality of support portions extending along a second direction DR2. The support portions may be disposed between adjacent openings OP in the first direction DR1. The branches may be disposed between adjacent openings OP in the second direction DR2. The branches may connect adjacent support portions in the first direction DR1.

[0213] The folded portion PLF may include a first region A1 and a second region A2 adjacent to the first region A1. The first region A1 may refer to a region defining a plurality of recessed patterns SP, and the second region A2 may refer to a region defining a plurality of openings OP. The plurality of recessed patterns SP may be defined in the first region, and the plurality of openings OP may be defined in the second region.

[0214] Reference Figure 11 and Figure 13A The support plate PLT may include multiple fibers RP1, RP2 stacked on the third-direction DR3. The support plate PLT includes carbon fiber reinforced plastic (CFRP) or glass fiber reinforced plastic (GFRP). In this specification, fibers RP1, RP2 may refer to carbon fiber reinforced plastic (CFRP) or glass fiber reinforced plastic (GFRP).

[0215] The support plate PLT may include a first layer SS1 and a second layer SS2 disposed on the first layer SS1. The first layer SS1 includes a plurality of first fibers RP1, and the second layer SS2 includes a plurality of second fibers RP2.

[0216] The first fiber RP1 can extend along the first direction DR1, and a plurality of first fibers RP1 are arranged side by side along the second direction DR2. In contrast, the second fiber RP2 can extend along the second direction, and a plurality of second fibers RP2 are arranged side by side along the first direction DR1. For example, the second fiber RP2 can extend along the folding axis FX (see reference). Figure 10 It extends in the parallel second direction DR2.

[0217] Reference Figure 11 , Figure 13A as well as Figure 13B The plurality of first fibers RP1 may include a plurality of first-1 fibers RP1-1 and a plurality of first-2 fibers RP1-2. The plurality of first-2 fibers RP1-2 may be disposed on the plurality of first-1 fibers RP1-1. The first-2 fibers RP1-2 may be arranged correspondingly to the first-1 fibers RP1-1. The plurality of second fibers RP2 may include a plurality of second-1 fibers RP2-1 and a plurality of second-2 fibers RP2-2. The plurality of second-2 fibers RP2-2 may be disposed on the plurality of second-1 fibers RP2-1. The second-2 fibers RP2-2 may be arranged correspondingly to the second-1 fibers RP2-1. However, this is merely an illustrative representation of the structure in which the first fibers RP1 and second fibers RP2 are stacked in multiple layers in the first layer SS1 and the second layer SS2; the first fibers RP1 and second fibers RP2 may be stacked in three or more layers.

[0218] The first layer SS1 can refer to a layer with multiple recessed patterns SP defined thereon. The first layer SS1 includes a first surface in contact with the second layer SS2 and a second surface opposite to the first surface, on which multiple recessed patterns SP are defined. The recessed patterns SP can be recessed from the second surface toward the first surface. For example, the support plate PLT can have the following structure: the second layer SS2 is directly disposed on the first layer SS1, and the first upper surface TS of the first layer SS1 contacts the second layer SS2, and multiple recessed patterns SP are defined on the first lower surface BS of the first layer SS1. The multiple recessed patterns SP can be recessed from the first lower surface BS of the first layer SS1 toward the second layer SS2. The recessed patterns SP can be formed by penetrating the first-1 fiber RP1-1 in the third direction DR3 and causing a portion of the first-2 fiber RP1-2 to be recessed toward the second layer SS2. However, the embodiment is not limited to this; unlike the illustration, the recessed patterns SP can be formed by causing a portion of the first-1 fiber RP1-1 to be recessed toward the second layer SS2 in the third direction DR3, but not defining a pattern on the first-2 fiber RP1-2. Alternatively, if the first layer SS1 is a structure in which multiple first fibers RP1 are stacked in n layers (n being an integer greater than or equal to 3), the multiple first fibers RP1 may include fibers 1-1 to 1-n (RP1-1 to RP1-n, not shown). In this case, the recessed pattern SP may be a pattern formed by recessing a portion of the first fiber RP1-1 toward the second layer SS2 on the third direction DR3, but not defined on the first 2 to 1-n fibers (RP1-2 to RP1-n, not shown). Alternatively, it may be formed by penetrating the first 1 to the first (n-1) fibers (RP1-1 to RP1-(n-1), not shown) and recessing a portion of the first (n) fiber RP1-n (not shown) toward the second layer SS2, but the embodiment is not limited to this.

[0219] The first layer SS1 may include a first portion S1 and a second portion S2. The first portion S1 may be the portion adjacent to the second layer SS2 in a third direction DR3. The second portion S2 may be the portion separated from the second layer SS2 in cross section by the first portion S1. The recessed pattern SP may penetrate the second portion S2 to expose one side of the first portion S1. The recessed pattern SP may not be defined on the first portion S1. For example, the support plate PLT may have the following structure: the first portion S1 is disposed on the second portion S2, the second layer SS2 is disposed on the first layer SS1, and the recessed pattern SP penetrates the second portion S2 to expose the lower surface of the first portion S1. The second portion S2 may include a portion of the first-1 fiber RP1-1 and the first-2 fiber RP1-2, and the first portion S1 may include another portion of the first-2 fiber RP1-2, but the embodiment is not limited thereto.

[0220] ReferenceFigure 11 , Figure 13A as well as Figure 13C The support plate PLT may include a first region A1 and a second region A2 adjacent to the first region A1. In one embodiment, the folding portion PLF (see reference) Figure 10 The region A1 may include a first region A1 and a second region A2. The first region A1 may refer to an area defining multiple recessed patterns SP, and the second region A2 may refer to an area defining multiple openings OP. The first region A1 may be related to the non-display region NDA (see reference). Figure 1 The first region A1 may overlap with part of the electronic device ED (see reference). Figure 1 The borders of the ) are defined adjacent to each other.

[0221] The opening OP may include a first opening OP1 defined in the first layer SS1 and a second opening OP2 defined in the second layer SS2. A recessed pattern SP may be formed corresponding to the first opening OP1. The recessed pattern SP may be configured to extend from the first opening OP1 along a first horizontal direction, and multiple recessed patterns SP may be arranged side-by-side along a second horizontal direction that intersects the first horizontal direction in a plane. For example, the recessed pattern SP may be configured to extend from the first opening OP1 along a second direction DR2, and multiple recessed patterns SP may be arranged side-by-side along the first direction DR1. However, this is not a limitation; it may also be configured, as needed, that multiple recessed patterns SP are arranged side-by-side along the second direction DR2, and that the recessed patterns SP extend from the first opening OP1 along the first direction DR1.

[0222] Additionally, a recessed pattern SP may be undefined in the second layer SS2 overlapping with the first region A1 and in a portion of the first layer SS1. In the first portion S1 of the first layer SS1 overlapping with the first region A1 (refer to...) Figure 13B The second layer SS2, which overlaps with the first region A1, may not have a defined recessed pattern SP. Even if the second layer SS2 without a defined recessed pattern SP is included in the fold PLF (see reference...) Figure 10 As the second layer SS2 extends in the direction of its extension (DR2) and folds along the axis FX (see reference). Figure 10 Parallel and having a relatively small modulus value when folded, it can have a certain level of folding ease. Alternatively, the first portion S1 of the first layer SS1 overlapping the first region A1 (refer to...) Figure 13B The first fiber RP1 included in the first layer A1 and a portion of the second fiber RP2 included in the second layer SS2 overlapping with the first region A1 can also be in a cut shape. With the inclusion of the first fiber RP1 and the second fiber RP2 in a cut shape, a certain level of folding ease can be achieved.

[0223] Reference Figure 13D The support plate PLT-1 may include: a first layer SS1, a second layer SS2 disposed on the upper part of the first layer SS1, and a lower layer DSL disposed on the lower part of the first layer SS1.

[0224] The lower layer DSL may include a plurality of third fibers RP3. The third fibers RP3 may extend along a second direction DR2, and the plurality of third fibers RP3 may be arranged side-by-side along a first direction DR1. The plurality of third fibers RP3 may be arranged in the same direction as the plurality of second fibers RP2, and in a direction orthogonal to the plurality of first fibers RP1 in a plane. The plurality of third fibers RP3 may include a plurality of third-first fibers RP3-1 and a plurality of third-second fibers RP3-2. The plurality of third-second fibers RP3-2 may be disposed on the plurality of third-first fibers RP3-1. The third-second fibers RP3-2 may be arranged correspondingly to the third-first fibers RP3-1.

[0225] Multiple recessed patterns SP can be defined on the first lower surface BS of the first layer SS1, and multiple lower holes HH1 corresponding to the recessed patterns SP are defined on the lower layer DSL. The lower holes HH1 can be shaped to connect with the recessed patterns SP in cross-section. However, this is only to illustrate the structure of the support plate PLT-1 with three or more layers SS1, SS2, DSL stacked together. The support plate PLT-1 can also include a structure with four or more layers stacked together. When the support plate PLT-1 has a structure with three or more layers stacked together, the arrangement directions between adjacent layers can be orthogonal in the plane.

[0226] Figure 14A This is an enlarged perspective view of the support plate according to another embodiment of the present invention. Figure 14B and Figure 14C This is a cross-sectional view of a support plate according to another embodiment of the present invention.

[0227] Figure 14A Showing with Figure 12 An enlarged perspective view of the support plate PLTa according to another embodiment of the present invention. Figure 14B Showing with Figure 14A The cross section of the support plate PLTa corresponding to the section line Ⅳ-Ⅳ' shown. Figure 14C A cross-section of the support plate PLTa-1 according to another embodiment of the present invention is shown. Additionally, regarding... Figures 10-13D For structures that are identical to those already described, detailed explanations will be omitted.

[0228] Reference Figure 14A and Figure 14BThe support plate PLTa may include a first layer SS1a and a second layer SS2a disposed on the first layer SS1a. The first layer SS1a includes a plurality of first fibers RP1a, and the second layer SS2a includes a plurality of second fibers RP2a. The plurality of first fibers RP1a may include a plurality of first-1 fibers RP1a-1 and a plurality of first-2 fibers RP1a-2, and the plurality of second fibers RP2a may include a plurality of second-1 fibers RP2a-1 and a plurality of second-2 fibers RP2a-2.

[0229] The support plate PLTa can have the following structure: the second layer SS2a is directly disposed below the first layer SS1a, the first lower surface BS of the first layer SS1a is in contact with the second layer SS2a, and multiple recessed patterns SP are defined on the first upper surface TS of the first layer SS1a. The multiple recessed patterns SP can be recessed from the first upper surface TS of the first layer SS1a toward the second layer SS2a.

[0230] Reference Figure 14C The support plate PLTa-1 may include: a first layer SS1a, a second layer SS2a disposed below the first layer SS1a, and an upper layer US disposed above the first layer SS1a.

[0231] The upper layer US may include a plurality of fourth fibers RP4. The fourth fibers RP4 may extend along a second direction DR2, and the plurality of fourth fibers RP4 may be arranged side-by-side along a first direction DR1. The plurality of fourth fibers RP4 may be arranged in the same direction as the plurality of second fibers RP2a, and in a direction orthogonal to the plurality of first fibers RP1a in a plane. The plurality of fourth fibers RP4 may include a plurality of fourth-first fibers RP4-1 and a plurality of fourth-second fibers RP4-2. The plurality of fourth-second fibers RP4-2 may be disposed on the plurality of fourth-first fibers RP4-1. The fourth-second fibers RP4-2 may be arranged correspondingly to the fourth-first fibers RP4-1.

[0232] Multiple recessed patterns SP can be defined on the first upper surface TS of the first layer SS1a, and multiple upper holes HH2 corresponding to the multiple recessed patterns SP are defined on the upper layer US. The upper holes HH2 can be in a form that connects to the recessed patterns SP in cross-section. Although not shown, the support plate PLTa-1 can also include a structure consisting of four or more layers stacked together, in which case the arrangement directions between adjacent layers can be orthogonal in the plane.

[0233] Figure 15A This is an enlarged perspective view of the support plate according to another embodiment of the present invention. Figure 15B This is a cross-sectional view of a support plate according to another embodiment of the present invention. Additionally, regarding... Figures 10-13D For structures that are identical to those already described, detailed explanations will be omitted.

[0234] Figure 15A Showing with Figure 12 An enlarged perspective view of the support plate PLTb according to another embodiment of the present invention. Figure 15B Showing with Figure 15A The cross section of the support plate PLTb corresponding to the V-V' section line shown.

[0235] Reference Figure 15A and Figure 15B The support plate PLTb may include a first layer SS1b and a second layer SS2b disposed on the first layer SS1b. The first layer SS1b includes a plurality of first fibers RP1b, and the second layer SS2b includes a plurality of second fibers RP2b. The plurality of first fibers RP1b may include a plurality of first-1 fibers RP1b-1 and a plurality of first-2 fibers RP1b-2, and the plurality of second fibers RP2b may include a plurality of second-1 fibers RP2b-1 and a plurality of second-2 fibers RP2b-2.

[0236] The support plate PLTb may include a first region A1 and a second region A2 adjacent to the first region A1. In the support plate PLTb, the first region A1 may be adjacent to the display region DA (see reference). Figure 1 Part of it overlaps. Figure 15A With the aforementioned Figure 11 In contrast, in the support plate PLTb, the first region A1 is not connected to the electronic device ED (see reference). Figure 1 Instead of being adjacent to the border of the electronic device ED (see reference), it can be defined as being adjacent to the border of the electronic device ED (see reference). Figure 1 The central part is adjacent to ).

[0237] An electronic device according to an embodiment of the present invention includes a support plate comprising a first layer and a second layer. The first layer includes a plurality of first fibers and defines a recessed pattern, while the second layer includes a plurality of second fibers and does not define a recessed pattern. The electronic device according to an embodiment of the present invention includes an opening overlapping a folded region. The manufacturing process of the electronic device according to an embodiment of the present invention may include a step of deforming the grid pattern of the opening. However, in the electronic device according to an embodiment of the present invention, since the second layer does not define a recessed pattern, the second layer can function as a bridging portion connecting the first and second non-folded portions. Therefore, the electronic device according to an embodiment of the present invention can maintain folding reliability, and the step of installing an additional bridging portion can be omitted in the manufacturing process of the electronic device, thereby reducing cutting marks on the device and improving process efficiency.

[0238] While the foregoing description has been based on embodiments, it will be understood by those skilled in the art that various modifications and alterations can be made to the present invention without departing from the spirit and scope of the invention as set forth in the appended claims. Furthermore, the embodiments disclosed herein are not intended to limit the technical concept of the invention, and all technical concepts within the scope of the appended claims should be understood to fall within the scope of the invention.

Claims

1.An electronic device comprising: wherein, comprises: a display panel including a first non-folded area, a second non-folded area, and a folded area defined between the first non-folded area and the second non-folded area; and a support plate disposed below the display panel and defined with a plurality of opening portions overlapping the folded area, the support plate comprises: a first layer including a plurality of first fibers each extending in a first direction and arranged side by side in a second direction orthogonal to the first direction; and a second layer disposed on or under the first layer and including a plurality of second fibers each extending in the second direction and arranged side by side in the first direction, the first layer includes a first face in contact with the second layer and a second face opposite to the first face, a plurality of recess patterns are defined in the second face. 2.The electronic device of claim 1, wherein, the plurality of recess patterns overlap the folded area. 3.The electronic device of claim 1, wherein, the plurality of recess patterns are arranged side by side in the first direction. 4.The electronic device of claim 1, wherein, the first layer includes a first portion adjacent to the second layer and a second portion spaced apart from each other in a cross-section of the second layer across the first portion, each of the plurality of recess patterns penetrates the second portion to expose one face of the first portion. 5.The electronic device of claim 1, wherein, the plurality of opening portions include: a plurality of first opening portions defined in the first layer; and a plurality of second opening portions defined in the second layer, each of the plurality of second opening portions corresponding to each of the plurality of first opening portions. 6.The electronic device of claim 5, wherein, each of the plurality of recess patterns extends in the second direction from each of the plurality of first opening portions. 7.The electronic device of claim 1, wherein, the support plate includes: a first non-folded portion overlapping the first non-folded area; a second non-folded portion overlapping the second non-folded area; and a folded portion overlapping the folded area. 8.The electronic device of claim 7, wherein, the folded portion includes a first area and a second area adjacent to the first area, the plurality of recess patterns are defined in the first area, the plurality of first opening portions are defined in the second area. 9.The electronic device of claim 8, wherein, an upper surface of the electronic device includes a display area displaying an image and a non-display area surrounding the display area and overlapping an edge of the electronic device, the first area overlaps a portion of the non-display area. 10.The electronic device of claim 8, wherein, an upper surface of the electronic device includes a display area displaying an image and a non-display area surrounding the display area and overlapping an edge of the electronic device, the first area overlaps a portion of the display area. 11.The electronic device of claim 1, wherein, the second layer is disposed directly on an upper portion of the first layer, the plurality of recess patterns are defined on a first lower surface of the first layer. 12.The electronic device of claim 11, wherein, the support plate further includes: a lower layer disposed below the first layer and including a plurality of third fibers each extending in the second direction and arranged side by side in the first direction, a plurality of lower holes corresponding to each of the plurality of recess patterns are defined in the lower layer. 13.The electronic device of claim 1, wherein, the second layer is disposed directly on a lower portion of the first layer, the plurality of recess patterns are defined on a first upper surface of the first layer. 14.The electronic device of claim 13, wherein, the support plate further includes: an upper layer disposed above the first layer and including a plurality of fourth fibers each extending in the second direction and arranged side by side in the first direction, a plurality of upper holes corresponding to each of the plurality of recess patterns are defined in the upper layer. 15.The electronic device of claim 1, wherein, the plurality of first fibers include a plurality of 1-1 fibers and a plurality of 1-2 fibers disposed on the plurality of 1-1 fibers, each of the plurality of 1-2 fibers is arranged corresponding to each of the plurality of 1-1 fibers. 16.The electronic device of claim 1, wherein, the plurality of second fibers include a plurality of 2-1 fibers and a plurality of 2-2 fibers disposed on the plurality of 2-1 fibers, each of the plurality of 2-2 fibers is arranged corresponding to each of the plurality of 2-1 fibers. 17.The electronic device of claim 1, further comprising: an upper adhesive layer disposed between the display panel and the support plate. 18.The electronic device of claim 1, further comprising: a cover layer overlapping the opening portion and disposed on a lower surface of the support plate. 19.The electronic device of claim 1, wherein: the folding area is folded or not folded with a folding axis as a center. 20.The electronic device of claim 19, wherein: the folding axis is parallel to the second direction. ​ ​

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