Capacitor module

Abstract

The embodiment of the invention discloses a capacitor module. The capacitor module comprises a capacitor mounting plate, a capacitor wiring plate and a ceramic capacitor, the capacitor mounting plate is an insulating plate, first through holes distributed in an array mode are formed in the capacitor mounting plate, and a limiting groove is formed in each first through hole and used for mounting one end of a ceramic capacitor; the capacitor wiring board is a metal plate, second through holes distributed corresponding to the first through holes in an array mode are formed in the capacitor wiring board, and a bonding wire groove is formed in one side of each second through hole. The two ends of the ceramic capacitor are sequentially provided with a capacitor mounting plate and a capacitor wiring plate, the ceramic capacitor is fixed in a limiting groove of the capacitor mounting plate through colloid, and wires at the two ends of the ceramic capacitor are welded in wire welding grooves of the capacitor wiring plate at the two ends of the ceramic capacitor respectively. According to the technical scheme provided by the invention, the ceramic capacitors can be quickly assembled in an array form, and the capacitor module has an overcurrent protection function.

Description

Technical Field

[0001] This application relates to the field of electronic device technology, specifically to a capacitor module. Background Technology

[0002] Pulsed plasma electric propulsion is a type of electromagnetic propulsion device that features high specific impulse, low power consumption, simple structure, and light weight.

[0003] When the pulsed plasma electric propulsion system is working, the energy storage capacitor is first charged to the working voltage, which is simultaneously applied to the electrode directly connected to the energy storage capacitor. Under the action of the discharge control circuit, the spark plug is ignited, and the resulting micro-discharge conducts through the electrode plates, causing the energy storage capacitor to discharge. The high-temperature electric arc formed by the discharge along the surface of the propellant ablates the thin layer on the surface of the propellant rod and ionizes it, forming plasma. The rapidly changing alternating electric field between the thruster plates forms a self-induced magnetic field, which, under the combined action of the electromagnetic field, generates a Lorentz force on the charged particles. Under the action of the Lorentz force, the plasma is ejected from the thruster, generating a thrust pulse.

[0004] Therefore, the energy storage capacitor is a key component of a pulsed plasma electric propulsion system. In existing technologies, the energy storage capacitors used in pulsed plasma electric propulsion systems are all oil-immersed capacitors. Oil-immersed capacitors are large in size and heavy in mass. When the electric propulsion system is operating in orbit, oil-immersed capacitors are prone to oil leakage, causing the electric propulsion system to fail. At the same time, oil-immersed capacitors do not have a good assembly method, are difficult to assemble, and do not have overcurrent protection function after assembly. Summary of the Invention

[0005] Therefore, the purpose of this application is to provide a capacitor module that alleviates the defects of oil-immersed capacitors and has the characteristics of easy assembly and overcurrent protection.

[0006] According to some embodiments, a first aspect of this application provides a capacitor module, including: a capacitor mounting plate, a capacitor terminal block, and a ceramic capacitor; the capacitor mounting plate is an insulating plate with an array of first through holes formed thereon, each first through hole having a limiting groove for mounting one end of the ceramic capacitor; the capacitor terminal block is a metal plate with an array of second through holes corresponding to the first through holes formed thereon, and a bonding groove is formed on one side of each second through hole; the capacitor mounting plate and the capacitor terminal block are sequentially disposed at both ends of the ceramic capacitor, the ceramic capacitor is fixed in the limiting groove of the capacitor mounting plate by adhesive, and the wires at both ends of the ceramic capacitor are respectively soldered to the bonding grooves of the capacitor terminal blocks at both ends of the ceramic capacitor.

[0007] In one embodiment, the capacitor mounting plate is a polyimide plate, and the capacitor terminal block is a copper plate.

[0008] In one embodiment, the conductor is an aluminum wire, which is welded to the wire groove by an ultrasonic process.

[0009] The embodiments disclosed herein may have at least the following advantages: ceramic capacitors can be quickly assembled in an array form through the first through hole, the second through hole, and the corresponding slots in the capacitor mounting plate and the capacitor terminal block; the wires at both ends of the ceramic capacitor are respectively soldered into the soldering slots of the capacitor terminal block at both ends of the ceramic capacitor; and the capacitor module has overcurrent protection function through the high-temperature melting characteristics of the wires. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the overall structure of a capacitor module according to an embodiment of this application;

[0011] Figure 2 This is a schematic diagram of a capacitor module capacitor mounting structure according to an embodiment of this application;

[0012] Figure 3 This is a cross-sectional schematic diagram of a capacitor module capacitor mounting structure according to an embodiment of this application;

[0013] Figure 4 This is a schematic diagram of a capacitor module capacitor mounting plate structure according to an embodiment of this application;

[0014] Figure 5 This is a schematic diagram of a capacitor module capacitor terminal block structure according to an embodiment of this application.

[0015] Figure label:

[0016] 1: Capacitor mounting plate; 2: Capacitor terminal block; 3: Ceramic capacitor; 11: First through hole; 12: Limiting groove; 21: Second through hole; 22: Welding groove; 4: Wire. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to specific embodiments and accompanying drawings. It should be understood that these descriptions are merely exemplary and not intended to limit the scope of this application. Furthermore, descriptions of well-known structures and technologies are omitted in the following description to avoid unnecessarily obscuring the concepts of this application.

[0018] The accompanying drawings illustrate layer structure diagrams according to embodiments of this application. These drawings are not necessarily drawn to scale, and some details have been enlarged for clarity, and some details may have been omitted. The shapes of the various regions and layers shown in the drawings, as well as their relative sizes and positional relationships, are merely exemplary and may deviate from reality due to manufacturing tolerances or technical limitations. Furthermore, those skilled in the art can design regions / layers with different shapes, sizes, and relative positions as needed.

[0019] Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application. The application will now be described in more detail with reference to the accompanying drawings. In the various drawings, the same elements are represented by similar reference numerals. For clarity, the various parts in the drawings are not drawn to scale.

[0020] refer to Figure 1 — Figure 5 This application provides a capacitor module comprising: a capacitor mounting plate 1, a capacitor terminal block 2, and a ceramic capacitor 3; the capacitor mounting plate 1 is an insulating plate with arrayed first through holes 11, each first through hole 11 having a limiting groove 12 for mounting one end of the ceramic capacitor 3; the capacitor terminal block 2 is a metal plate with arrayed second through holes 21 corresponding to the first through holes 11, each second through hole 21 having a soldering groove 22 on one side; the ceramic capacitor 3 has the capacitor mounting plate 1 and the capacitor terminal block 2 sequentially disposed at both ends, the ceramic capacitor 3 being fixed in the limiting groove 12 of the capacitor mounting plate 1 by adhesive, and the wires 4 at both ends of the ceramic capacitor 3 being soldered to the soldering grooves 22 of the capacitor terminal block 2 at both ends of the ceramic capacitor 3. (Reference) Figure 3 The wire 4 passes through the first through hole 11 and the second through hole 21 and is then soldered into the wire welding groove 22.

[0021] It should be noted that the capacitor mounting plate 1 provides a basic framework for the capacitor module in this embodiment, on which ceramic capacitors 3 can be configured. The capacitor terminal block 2 provides a parallel medium for the capacitor module in this embodiment, thereby connecting the arrayed ceramic capacitors 3 in parallel to improve the charging and discharging capability of the capacitors. The capacitor mounting plate 1 ensures the insulation between the ceramic capacitors 3 and the capacitor terminal block 2.

[0022] The dimensions of capacitor mounting plate 1 and capacitor terminal block 2 can be customized based on the quantity of ceramic capacitors 3. This method of encapsulating capacitor modules results in small size, compact structure, and high degree of modularity.

[0023] refer to Figure 3 The ceramic capacitor 3 has a capacitor mounting plate 1 and a capacitor terminal block 2 distributed at both ends, one end of which is used to connect to the cathode and the other end is used to connect to the anode.

[0024] In one embodiment, the capacitor mounting plate 1 is a polyimide plate, and the capacitor terminal block 2 is a copper plate. Polyimide is lightweight, reducing the overall weight of the capacitor module. For example, the capacitor mounting plate 1 is a 4mm thick polyimide plate, wherein the depth of the limiting groove 12 is 2mm; the capacitor terminal block 2 is a 2mm thick copper plate structure with a 0.5mm deep recessed solder groove 22 on its surface for wire soldering.

[0025] In one embodiment, the conductor 4 is an aluminum wire, which is ultrasonically welded to the wire bonding groove 22. It should be noted that by ultrasonically welding the aluminum wire conductor 4 to connect the ceramic capacitor 3 and the capacitor terminal block 2 together, the aluminum wire has a relatively thin diameter. If it is subjected to an impact or if the temperature of the aluminum wire rises due to excessive current, it can break on its own, thus acting as a fuse.

[0026] It should be understood that the specific embodiments described above are merely illustrative or explanatory of the principles of this application and do not constitute a limitation thereof. Therefore, any modifications, equivalent substitutions, improvements, etc., made without departing from the spirit and scope of this application should be included within the protection scope of this application. Furthermore, the appended claims are intended to cover all variations and modifications falling within the scope and boundaries of the appended claims, or equivalent forms of such scope and boundaries.

Claims

1. A capacitor module, characterized by The utility model relates to a capacitor mounting plate (1), capacitor wiring board (2) and ceramic capacitor (3) are included: The capacitor mounting plate (1) is insulating plate, is formed with the first through -hole (11) of array distribution on it, is formed with the limiting slot (12) of each first through -hole (11) on it, is used for installing one end of ceramic capacitor (3); The capacitor wiring board (2) is metal plate, is formed with the second through -hole (21) of array distribution with first through -hole (11) corresponding on it, is formed with the welding wire slot (22) of one side of second through -hole (21); The both ends of ceramic capacitor (3) are sequentially provided with capacitor mounting plate (1) and capacitor wiring board (2), and ceramic capacitor (3) is fixed in the limiting slot (12) of capacitor mounting plate (1) through colloid, and the lead wire (4) of both ends of ceramic capacitor (3) is respectively welded in the welding wire slot (22) of capacitor wiring board (2) of both ends of ceramic capacitor (3). The capacitor mounting plate (1) is polyimide plate, and the capacitor wiring board (2) is copper plate.

2. The capacitor module of claim 1, wherein, The lead wire (4) is aluminium wire, which is welded in the welding wire slot (22) through ultrasonic process.

3. The capacitor module of claim 1, wherein, ​

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