Circuit board assembly and electronic equipment

Abstract

The invention relates to the technical field of terminal equipment, in particular to a circuit board assembly and electronic equipment. The circuit board assembly comprises a first circuit board, a first cover body, a heating part, a first heat conduction piece and a second heat conduction piece, the first cover body is installed on the first circuit board, and a cover body space is formed by the first cover body and the first circuit board; the heating component is installed on the first circuit board and located in the cover body space. The first heat conduction part is installed on the first circuit board, located in the cover body space and spaced from the heating part. The second heat conduction piece is located in the cover body space, the second heat conduction piece makes contact with the first heat conduction piece, and the heating component is embedded in the second heat conduction piece. According to the embodiment of the invention, the junction temperature of the heating component can be effectively reduced at a low cost, the time for the heating component to reach a thermal protection threshold under a high load is prolonged, the leakage current influence caused by the high temperature of the heating component is reduced, and the working stability of the circuit board assembly is improved.

Description

Technical Field

[0001] This application relates to the field of terminal equipment technology, and in particular to a circuit board assembly and an electronic device. Background Technology

[0002] For small electronic devices, heat dissipation of components, especially the processor, is one of the decisive factors in the performance release capability of electronic devices. For example, in heavy-load scenarios such as high-quality games and application startup, if the heat generated by the processor cannot be dissipated in time, the junction temperature of the device will rise rapidly and reach the over-temperature protection point, resulting in thermal throttling. This will manifest as frame drops, stuttering, and other issues affecting the user experience.

[0003] For example, as application scenarios become more complex, the heat flux density of mobile phone components has been increasing year by year. The local heat flux density of the processor at maximum power has approached 100W / cm2 (watts per square centimeter), and the local heat flux density of the power amplifier components of the radio frequency module at maximum transmit power can also reach 200W / cm2. However, due to the weight and thickness limitations of mobile phones, it is difficult for mainstream mobile phones to cool down the internal components through active cooling methods. Therefore, low-cost and effective heat dissipation solutions are needed. Summary of the Invention

[0004] The purpose of this application is to provide a circuit board assembly and an electronic device.

[0005] In a first aspect, embodiments of this application provide a circuit board assembly. The circuit board assembly includes a first circuit board, a first cover, a heating element, a first thermally conductive element, and a second thermally conductive element. The first cover is mounted on the first circuit board and forms a cover space with the first circuit board. The heating element is mounted on the first circuit board and located within the cover space. The first thermally conductive element is fixed to the first circuit board, located within the cover space, and spaced apart from the heating element. The second thermally conductive element is located within the cover space, in contact with the first thermally conductive element, and the heating element is embedded in the second thermally conductive element. The first thermally conductive element is a solid element, and the second thermally conductive element is a gel or liquid element.

[0006] The first circuit board can be roughly rectangular thin plate structure. The first circuit board can be etched with circuits to enable signal transmission between the various components of the circuit board assembly.

[0007] Among them, the heat-generating component can be a device in the circuit board assembly that generates a large amount of heat when the electronic device is working.

[0008] The first cover can be roughly shaped like a cover. The first cover can be fixed to the first circuit board and form a cover space with the first circuit board.

[0009] The first heat-conducting element can be made of a material with good thermal conductivity. The thermal conductivity of the first heat-conducting element is at least stronger than that of air. It is understood that the first heat-conducting element can be made of one or more of the following: metallic materials, non-metallic materials, and phase change materials.

[0010] The second heat-conducting element and the first heat-conducting element are two different components, which facilitates their separate placement within the cover space inside the first cover. The second heat-conducting element can be made of a material with high thermal conductivity.

[0011] In this embodiment, by providing a first heat-conducting element 4, which is located inside the first cover 3 and around the heating element 2, and fixedly connected to the first circuit board 1, a heat dissipation path can be formed from the heating element 2 to the first circuit board 1 to the first heat-conducting element 4. Since the first circuit board 1 is connected to the heating semiconductor (heat source) inside the heating element 2, the first heat-conducting element 4 in this heat dissipation path can dissipate heat from the inside of the heating element 2. In addition, by connecting the heating element 2 and the first heat-conducting element 4 through the second heat-conducting element 5, a heat dissipation path can also be formed from the heating element 2 to the second heat-conducting element 5. The second heat-conducting element 5 in this heat dissipation path can dissipate heat from the surface of the heating element 2.

[0012] Multiple heat dissipation paths are used to target the heat-generating component 2, forming a heat dissipation path from the heat-generating component 2 to its surroundings. The heat dissipation area of ​​the heat dissipation path is large, which helps to make the temperature distribution inside the first cover 3 uniform. The uniform temperature helps to reduce the junction temperature of the heat-generating component 2.

[0013] Furthermore, since the first heat-conducting component 4 and the second heat-conducting component 5 are independent components, it is convenient to place them separately in the cover space, which facilitates the fabrication of the circuit board assembly and the separate placement of their materials. This helps to reduce the thermal resistance of the heat dissipation path, thereby facilitating the rapid dissipation of heat from the heat-generating component 2 and reducing the junction temperature of the heat-generating component 2.

[0014] In addition, the heat dissipation path in this embodiment has almost no impact on the design of the heat-generating component 2, and has a high degree of matching with the design of the heat-generating component 2 in the first circuit board 1, and is low in cost.

[0015] Therefore, this embodiment can effectively reduce the junction temperature of the heating component 2 at a lower cost, extend the time for the heating component 2 to reach the thermal protection threshold under high load, reduce the leakage current caused by the high temperature of the heating component 2, and improve the stability of the circuit board assembly 20 during operation.

[0016] In some embodiments, the material of the first heat-conducting element is a phase change material; or, the material of the first heat-conducting element is a metal; or, the material of the first heat-conducting element is silicon.

[0017] Phase change materials (PCMs) are substances that change their state of matter while maintaining a constant temperature and can provide latent heat. The process by which PCMs transform their physical properties is called a phase change process, during which the PCM absorbs or releases a large amount of latent heat. For example, paraffin wax can be used as the first heat-conducting component. In this case, the first heat-conducting material has a strong ability to store heat; it can absorb and temporarily store surrounding heat, thereby preventing the ambient temperature from rising too quickly and achieving a uniform temperature.

[0018] The metallic material may include, but is not limited to, copper, silver, and their alloys. Furthermore, metallic materials are easy to form. Therefore, the first heat-conducting component can easily be formed into a thin sheet structure and easily mounted on the first circuit board. The first heat-conducting component has strong thermal conductivity, allowing heat from its surroundings to be quickly transferred to it, thus facilitating heat transfer and heat dissipation.

[0019] When the material of the first heat-conducting component is silicon, the first heat-conducting component has good thermal conductivity, and the heat around it can be quickly transferred to the first heat-conducting component; the first heat-conducting component is easy to form a thin sheet structure, and it is easy to design a suitable shape to be installed on the first circuit board; and the first heat-conducting component has high hardness and good rigidity, is not easy to deform, and will not collide with surrounding devices due to deformation, thus having little impact on surrounding devices.

[0020] In some embodiments, the first heat-conducting element includes a heat-conducting block, the area of ​​which is projected in a first direction is greater than half the area of ​​which is projected in the first direction. The first direction is a direction perpendicular to the surface of the first circuit board, and the heat-conducting block and the heat-conducting element are arranged perpendicular to the first direction.

[0021] In this embodiment, the heat-conducting block has a large volume and surface area, and can absorb and store a lot of heat. Therefore, the heat-conducting block can absorb and store the heat generated by the heating component, thereby achieving uniform temperature in the enclosure space, slowing down the heating rate of the heating component, and reducing the junction temperature of the heating component.

[0022] In some embodiments, the first heat conductor includes a plurality of heat sinks arranged at intervals, and a portion of the second heat conductor fills the gaps between adjacent heat sinks.

[0023] For example, the heat sink can be a copper sheet or a silicon sheet. For example, multiple heat sinks can be located around the heat-generating component.

[0024] In this embodiment, the multiple heat sinks have a large surface area, which is beneficial to improving the efficiency of heat transfer, thereby improving the heat dissipation efficiency; and the first circuit board may have a large number of electronic components (such as capacitors), and the heat sinks have a thin thickness, which is beneficial to the reasonable arrangement of electronic components on the first circuit board and has little impact on other electronic components on the first circuit board.

[0025] In some embodiments, the first heat-conducting element includes a heat-conducting block and a plurality of heat sinks. The area of ​​the heat-conducting block projected in a first direction is greater than half the area of ​​the heat-generating component projected in the first direction. The first direction is a direction perpendicular to the surface of the first circuit board. The heat-conducting block and the heat-generating component are arranged perpendicular to the first direction. The material of the heat-conducting block is a phase change material. The plurality of heat sinks are arranged at intervals. A portion of the second heat-conducting element fills the gap between adjacent heat sinks. The material of the heat sinks is metal.

[0026] For example, multiple heat sinks, heat-generating components, and heat-conducting blocks can be arranged in sequence to conduct or absorb the heat dissipated by the heat-generating components on both sides, thereby making full use of the space around the heat-generating components for heat dissipation.

[0027] In this embodiment, the heat sink has strong thermal conductivity, enabling rapid heat conduction and facilitating heat dissipation. The heat-conducting block also conducts heat and has a strong heat-holding capacity, allowing it to absorb and store or dissipate heat, thus preventing heat accumulation in the heat-generating components and facilitating heat dissipation. Therefore, the combination of the heat sink and the heat-conducting block is beneficial for dissipating heat from components in electronic devices with complex heat dissipation conditions, thereby helping to maintain high operating efficiency and a relatively stable operating state for the heat-generating components.

[0028] In some embodiments, the material of the second thermally conductive element includes thermally conductive gel, secondary molding compound, liquid metal, or fluorinated liquid.

[0029] In this design, the material of the second thermally conductive component is thermally conductive gel. The thermally conductive gel can be gel-like and fluid when unformed; it can be solid after forming. Thermally conductive gel is easy to form, convenient to install in circuit board assemblies, and has low cost.

[0030] When assembling circuit board components, the thermal conductive gel can fill the gap between the heat-generating component and the first thermal conductive component by flowing, thereby enabling the first thermal conductive component to make full contact with the heat-generating component, which is beneficial for the heat dissipation of the heat-generating component.

[0031] In this design, the material of the second thermally conductive component is a secondary molding compound. The secondary molding compound can include a matrix and a thermally conductive filler, which can be mixed to form the component. The matrix can be made of resin, and the thermally conductive filler can be metal particles, etc. Because the secondary molding compound can form a single unit with the heating element and the first thermally conductive component, it is easy to install on the first circuit board, thereby simplifying the assembly process of the circuit board assembly.

[0032] In this case, the material of the second heat-conducting component is liquid metal. Liquid metal has good thermal conductivity.

[0033] In this case, the material of the second heat-conducting component is a fluorinated liquid. Fluorinated liquids are non-conductive, liquid at room temperature, and offer high safety and good thermal conductivity.

[0034] In some embodiments, the first heat-conducting element and the first cover are integral structural components, with the first end of the first heat-conducting element contacting the first circuit board and the second end of the first heat-conducting element fixed to the first cover.

[0035] In this embodiment, since the heat-conducting component and the first cover can be an integral structural component, it is convenient to simultaneously fix the heat sink and the first cover to the first circuit board. In this case, the heat sink can be used for circumferential heat dissipation of the heat-generating component and can also support the first cover. Furthermore, the heat sink can directly connect the first cover and the first circuit board, thereby facilitating the direct transfer of heat to the first cover and enabling rapid heat dissipation through the first cover, thus improving heat dissipation efficiency.

[0036] In some embodiments, the first circuit board has pads, a first end of the first thermal conductive element is soldered to the pads, and a second end of the first thermal conductive element is spaced apart from the first cover.

[0037] In this embodiment, the thermal resistance between the first heat-conducting component and the first circuit board is small, and the first heat-conducting component can conduct heat from the first circuit board, which is beneficial for the heat dissipation of the heat-generating component; furthermore, the height of the first cover is greater than the height of the first heat-conducting component, and the height tolerance between the first cover and the first heat-conducting component is easy to control, avoiding collision between the first heat-conducting component and the first cover, and facilitating the installation of the first cover.

[0038] In some embodiments, the circuit board assembly further includes a thermally conductive layer fixed to the surface of the heat-generating component, the thermally conductive layer being made of metal.

[0039] For example, the material of the thermally conductive layer can be aluminum, silver, or other materials. The thermally conductive layer can be formed on the surface of the heat-generating component by coating.

[0040] In this embodiment, a heat-conducting layer with good thermal conductivity is provided on the surface of the heating component. The heat-conducting layer can easily make full contact with the second heat-conducting component, thereby helping to reduce the thermal resistance between the heating component and the second heat-conducting component, and thus improving the heat dissipation efficiency of the heating component.

[0041] In some embodiments, the circuit board assembly further includes a support plate, a first heat transfer element, and a second heat transfer element. The support plate is fixed to the side of the first circuit board facing away from the heating element and forms a receiving space with the first circuit board. The heating element has multiple grounding pins, and the first circuit board has multiple grounding vias. The grounding pins are electrically connected to the grounding vias. The first heat transfer element is located in the receiving space and is fixedly connected to at least part of the grounding vias. The first heat transfer element is a solid element. The second heat transfer element is located in the receiving space and contacts the first heat transfer element and the support plate. The second heat transfer element is a gel element.

[0042] For example, the raised platform can be a second circuit board. Electronic components can be soldered onto the raised platform, and circuits can be etched onto it, allowing signals to be transmitted between the electronic components. The raised platform can serve as a support structure for the electronic components, providing functions such as electrical connection, protection, support, heat dissipation, and assembly. The raised platform can be electrically connected to the first circuit board, and the electronic components on the raised platform can transmit signals with the electronic components on the first circuit board.

[0043] The grounding pin is used to ground the heat-generating components to ensure the stability and reliability of the circuit.

[0044] Grounding vias typically consist of conductive metals, and since metals are thermally conductive, grounding vias are also thermally conductive.

[0045] The second heat transfer element and the first heat transfer element are two different components, which facilitates their separate placement within the receiving space inside the raised plate. The first heat transfer element can be made of a material with good thermal conductivity. The thermal conductivity of the first heat transfer element is at least stronger than that of air.

[0046] In this embodiment, the grounding via has good thermal conductivity. By setting the first heat transfer element and the second heat transfer element, the grounding via, the first heat transfer element, the second heat transfer element and the raised plate form a heat dissipation path. The grounding pin of the heat-generating component is used for heat dissipation, which has almost no impact on the structure of the heat-generating component. In addition, the heat dissipation path utilizes the space on the side of the first circuit board away from the heat-generating component, which is beneficial to increasing the overall heat dissipation area of ​​the circuit board assembly. Furthermore, the grounding pin is directly connected to the integrated circuit inside the heat-generating component, which is beneficial to direct heat dissipation from the inside of the heat-generating component. The heat dissipation path has low thermal resistance and high heat dissipation efficiency, which is beneficial to rapid heat dissipation from the heat-generating component.

[0047] In some embodiments, the first heat transfer element is made of metal; and / or, the second heat transfer element is made of thermally conductive gel.

[0048] In this embodiment, the first heat transfer element is easy to form a reasonable structure for mounting on the first circuit board. The first heat transfer element has strong thermal conductivity, and the heat around it can be quickly transferred to the first heat transfer element, which is beneficial for heat transfer and heat dissipation.

[0049] The second heat transfer element is made of thermally conductive gel. The thermally conductive gel can be gel-like and fluid when unformed; it can also be solid after forming. The thermally conductive gel is easily solidified from a colloid, making it easy to place within an accommodating space.

[0050] In some embodiments, the first heat transfer element includes a plurality of heat dissipation ribs, which are arranged at intervals, and each heat dissipation rib is fixedly connected to at least one grounding pin.

[0051] In this embodiment, the multiple heat dissipation ribs have a large surface area, which is beneficial to improving the efficiency of heat transfer, thereby improving the heat dissipation efficiency; and the first circuit board may have a large number of electronic components (such as capacitors), and the heat dissipation ribs have a thin thickness, which is beneficial to the reasonable arrangement of electronic components on the first circuit board and has little impact on other electronic components on the first circuit board.

[0052] In some implementations, a heat dissipation rib is fixedly connected to a set of grounding vias, the set of grounding vias including multiple grounding vias, and adjacent grounding vias in the set are in contact with each other.

[0053] In this embodiment, adjacent grounding vias are in contact with each other and form a shape that is approximately the same as the contact surface of the heat dissipation ribs. This increases the contact area between the first circuit board and the heat dissipation ribs, thereby reducing the thermal resistance from the grounding vias to the heat dissipation ribs and improving heat conduction efficiency. Additionally, it also improves the reliability of fixing the heat dissipation ribs. It is understood that adjacent grounding vias in a group can merge to form a single grounding area, which can be considered as the fusion of multiple grounding vias.

[0054] In some embodiments, the first circuit board further includes a heat conductor that fills a grounding via, the heat conductor being made of a metal, semiconductor, or graphene.

[0055] In this embodiment, by setting the heat conductor filling the grounding via and the material of the heat conductor, the grounding via has good electrical and thermal conductivity, and the thermal resistance of the grounding via is small.

[0056] In some embodiments, the raised platform has an injection hole and an vent hole, which respectively penetrate the wall panel of the raised platform and connect the accommodating space and the external space of the raised platform.

[0057] In this embodiment, the second heat transfer element can be injected into the receiving space through the injection hole and flow within the injection space, thereby fully contacting the surface of the first heat transfer element. The gas in the receiving space can flow out through the vent hole. Forming the second heat transfer element by injection molding facilitates full contact between the second and first heat transfer elements, and the process is relatively simple.

[0058] In some embodiments, the projection of the line connecting the injection hole and the vent hole intersects with the projection of the heating element in a direction perpendicular to the first circuit board.

[0059] In this embodiment, when the second heat transfer element is injected through the injection hole, the gas in the accommodating space is discharged through the vent hole. The second heat transfer element tends to flow towards the vent hole. Therefore, by setting the positions of the injection hole and the vent hole, it is beneficial to control the distribution of the second heat transfer element in the accommodating space. In this embodiment, the projection of the path from the injection hole to the vent hole coincides with the projection of the heating element, which helps to make the distribution of the second heat transfer element correspond to the heating element, thereby facilitating the heat dissipation of the heating element by the second heat transfer element.

[0060] In some embodiments, in a direction perpendicular to the first circuit board, the projection of the injection hole coincides with the projection of the heating element, and / or, the projection of the vent hole coincides with the projection of the heating element.

[0061] In this embodiment, when the projection of the injection hole coincides with the projection of the heat-generating component, the thermally conductive gel can be injected into the receiving space and correspond to the position of the heat-generating component. This facilitates the thermally conductive gel to be set in correspondence with the CPU and / or GPU of the heat-generating component. Furthermore, it is beneficial to control the amount of thermally conductive gel injected, thereby reducing the weight of the thermally conductive gel and thus reducing the weight of the circuit board assembly.

[0062] When the projection of the vent coincides with the projection of the heat-generating component, the thermally conductive gel can flow to the vent or its vicinity after being injected into the receiving space. This also makes it easier to match the thermally conductive gel with the CPU and / or GPU of the heat-generating component. Furthermore, it helps to control the amount of thermally conductive gel injected, thereby reducing the weight of the thermally conductive gel and consequently reducing the weight of the circuit board assembly.

[0063] In some implementations, the heat-generating component is a system-on-a-chip, a radio frequency chip, or a power management chip; the first cover is a shielding cover.

[0064] In this embodiment, when the heat-generating component is a system-on-a-chip, radio frequency chip, or power management chip, the heat-generating component generally has a shield. Therefore, this embodiment is more suitable for the working environment of these heat-generating components, thus having better adaptability to these heat-generating components and making it easier to achieve a better heat dissipation effect.

[0065] Secondly, embodiments of this application provide an electronic device, which includes a body and a circuit board assembly as provided in any embodiment of the first aspect, the circuit board assembly being fixed to the body.

[0066] In this embodiment, the circuit board assembly has lower cost and better heat dissipation capabilities, making the electronic device work more stably and providing a better user experience.

[0067] Thirdly, embodiments of this application provide a circuit board assembly, which includes a first circuit board, a raised platform, a heating element, a first heat transfer element, and a second heat transfer element. The first circuit board has multiple grounding vias. The raised platform is mounted on the first circuit board and forms a receiving space with the first circuit board. The heating element is mounted on the side of the first circuit board facing away from the raised platform, and the heating element has multiple grounding pins electrically connected to the grounding vias. The first heat transfer element is mounted on the first circuit board and located in the receiving space, and the first heat transfer element is fixedly connected to at least part of the grounding vias. The second heat transfer element is located in the receiving space and contacts the first heat transfer element and the raised platform.

[0068] In this embodiment, the grounding via has good thermal conductivity. By setting the first heat transfer element and the second heat transfer element, the grounding via, the first heat transfer element, the second heat transfer element and the raised plate form a heat dissipation path. The grounding pin of the heat-generating component is used for heat dissipation, which has almost no impact on the structure of the heat-generating component. In addition, the heat dissipation path utilizes the space on the side of the first circuit board away from the heat-generating component, which is beneficial to increasing the overall heat dissipation area of ​​the circuit board assembly. Furthermore, the grounding pin is directly connected to the integrated circuit inside the heat-generating component, which is beneficial to direct heat dissipation from the inside of the heat-generating component. The heat dissipation path has low thermal resistance and high heat dissipation efficiency, which is beneficial to rapid heat dissipation from the heat-generating component.

[0069] In some embodiments, the first heat transfer element is made of metal; and / or, the second heat transfer element is made of thermally conductive gel.

[0070] In this embodiment, the first heat transfer element is easy to form a reasonable structure for mounting on the first circuit board. The first heat transfer element has strong thermal conductivity, and the heat around it can be quickly transferred to the first heat transfer element, which is beneficial for heat transfer and heat dissipation.

[0071] The second heat transfer element is made of thermally conductive gel. The thermally conductive gel can be gel-like and fluid when unformed; it can also be solid after forming. The thermally conductive gel is easily solidified from a colloid, making it easy to place within an accommodating space.

[0072] In some embodiments, the first heat transfer element includes a plurality of heat dissipation ribs, which are arranged at intervals, and each heat dissipation rib is fixedly connected to at least one grounding pin.

[0073] In this embodiment, the multiple heat dissipation ribs have a large surface area, which is beneficial to improving the efficiency of heat transfer, thereby improving the heat dissipation efficiency; and the first circuit board may have a large number of electronic components (such as capacitors), and the heat dissipation ribs have a thin thickness, which is beneficial to the reasonable arrangement of electronic components on the first circuit board and has little impact on other electronic components on the first circuit board.

[0074] In some implementations, a heat dissipation rib is fixedly connected to a set of grounding vias, the set of grounding vias including multiple grounding vias, and adjacent grounding vias in the set are in contact with each other.

[0075] In this embodiment, adjacent grounding vias are in contact with each other and form a shape that is approximately the same as the contact surface of the heat dissipation ribs. This increases the contact area between the first circuit board and the heat dissipation ribs, thereby reducing the thermal resistance from the grounding vias to the heat dissipation ribs and improving heat conduction efficiency. Additionally, it also improves the reliability of fixing the heat dissipation ribs. It is understood that adjacent grounding vias in a group can merge to form a single grounding area, which can be considered as the fusion of multiple grounding vias.

[0076] In some embodiments, the first circuit board further includes a heat conductor that fills a grounding via, the heat conductor being made of a metal, semiconductor, or graphene.

[0077] In this embodiment, by setting the heat conductor filling the grounding via and the material of the heat conductor, the grounding via has good electrical and thermal conductivity, and the thermal resistance of the grounding via is small.

[0078] In some embodiments, the second heat transfer element can be injected into the receiving space through an injection hole and flow within the injection space, thereby fully contacting the surface of the first heat transfer element. Gas within the receiving space can flow out through an outlet hole. Forming the second heat transfer element by injection molding facilitates full contact between the second and first heat transfer elements, and the process is relatively simple.

[0079] In this embodiment, the projection of the line connecting the injection hole and the vent hole intersects with the projection of the heating element in a direction perpendicular to the first circuit board.

[0080] In some embodiments, when the second heat transfer element is injected through the injection hole, the gas in the accommodating space is discharged through the vent hole. The second heat transfer element tends to flow towards the vent hole. Therefore, by setting the positions of the injection hole and the vent hole, it is beneficial to control the distribution of the second heat transfer element in the accommodating space. In this embodiment, the projection of the path from the injection hole to the vent hole coincides with the projection of the heating element, which helps to make the distribution of the second heat transfer element correspond to the heating element, thereby facilitating the heat dissipation of the heating element by the second heat transfer element.

[0081] In this embodiment, in the direction perpendicular to the first circuit board, the projection of the injection hole coincides with the projection of the heating element, and / or, the projection of the vent hole coincides with the projection of the heating element.

[0082] In some implementations, when the projection of the injection hole coincides with the projection of the heat-generating component, the thermally conductive gel can be injected into the receiving space to correspond to the position of the heat-generating component. This facilitates the alignment of the thermally conductive gel with the CPU and / or GPU of the heat-generating component. Furthermore, it helps to control the amount of thermally conductive gel injected, thereby reducing the weight of the thermally conductive gel and consequently reducing the weight of the circuit board assembly.

[0083] When the projection of the vent coincides with the projection of the heat-generating component, the thermally conductive gel can flow to the vent or its vicinity after being injected into the receiving space. This also makes it easier to match the thermally conductive gel with the CPU and / or GPU of the heat-generating component. Furthermore, it helps to control the amount of thermally conductive gel injected, thereby reducing the weight of the thermally conductive gel and consequently reducing the weight of the circuit board assembly.

[0084] Fourthly, embodiments of this application provide an electronic device, which includes a body and a circuit board assembly as provided in any of the embodiments of the third aspect, the circuit board assembly being fixed to the body.

[0085] In this embodiment, the circuit board assembly has lower cost and better heat dissipation capabilities, making the electronic device work more stably and providing a better user experience. Attached Figure Description

[0086] To illustrate the technical solutions in the embodiments or background art of this application, the accompanying drawings used in the embodiments or background art of this application will be described below.

[0087] Figure 1 This is a schematic diagram of the structure of an electronic device provided in this application;

[0088] Figure 2 yes Figure 1 An exploded view of the electronic device shown.

[0089] Figure 3 yes Figure 2 The circuit board assembly shown is a simplified structural diagram of some embodiments.

[0090] Figure 4 yes Figure 3 The schematic diagram of the circuit board assembly shown in some other embodiments is a simplified structural diagram.

[0091] Figure 5 yes Figure 3 The schematic diagram of the circuit board assembly shown in some embodiments is a simplified structural diagram.

[0092] Figure 6 yes Figure 2 The schematic diagram of the circuit board assembly shown in some other embodiments is a simplified structural diagram.

[0093] Figure 7 It is along Figure 6 A partial schematic diagram of a section cut at point AA in some embodiments;

[0094] Figure 8 It is along Figure 6 A partial schematic diagram of some embodiments, cut at point AA;

[0095] Figure 9 yes Figure 2 The schematic diagram of the circuit board assembly shown in some embodiments is a simplified structural diagram.

[0096] Figure 10 yes Figure 9 The diagram shows the structural diagram of the circuit board assembly in some embodiments;

[0097] Figure 11 It is along Figure 10 A sectional view cut at point BB in the middle;

[0098] Figure 12 yes Figure 10 The circuit board assembly shown is an exploded view in some embodiments;

[0099] Figure 13 yes Figure 10 The circuit board assembly shown is an exploded view in some other embodiments. Detailed Implementation

[0100] The embodiments of this application are described below with reference to the accompanying drawings.

[0101] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. "Multiple" refers to at least two.

[0102] The directional terms mentioned in the embodiments of this application, such as "upper", "lower", "inner", "outer", "top", "bottom", "side", etc., are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0103] In the embodiments of this application, the relative positional relationships mentioned, such as parallel, perpendicular, and aligned, are defined in relation to the current technological level, rather than being absolutely strict. Slight deviations are permissible; approximations of parallelism, perpendicularity, or alignment are all acceptable. For example, "A and B are parallel" means that A and B are parallel or approximately parallel, and the angle between A and B can be between 0 and 10 degrees. Similarly, "A and B are perpendicular" means that A and B are perpendicular or approximately perpendicular, and the angle between A and B can be between 80 and 100 degrees.

[0104] In the embodiments of this application, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," "third," and "fourth" may explicitly or implicitly include one or more of that feature.

[0105] Please refer to the following: Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the structure of an electronic device 100 provided in this application. Figure 2 yes Figure 1 An exploded view of the electronic device 100 shown.

[0106] Electronic device 100 may include a body and a circuit board assembly. The circuit board assembly may be installed on the body and may work in conjunction with the body to realize the function of electronic device 100.

[0107] In this embodiment, the electronic device 100 can be a mobile phone, tablet computer, multimedia player, headphones, speaker, laptop computer, in-vehicle equipment, foldable terminal device, television, or wearable device, etc., that has audio playback functionality. Wearable devices can include smart bracelets, smartwatches, smart headsets, smart glasses, etc. Figure 1 The electronic device 100 in the illustrated embodiment is described using a mobile phone as an example. Of course, other types of electronic devices 100 can also adopt a similar structure, which will not be described in detail below.

[0108] In some embodiments, the electronic device 100 may include a mid-frame assembly 10, a circuit board assembly 20, a cover plate 30, and a display screen 40. The cover plate 30, the circuit board assembly 20, the mid-frame assembly 10, and the display screen 40 may be stacked sequentially. The mid-frame assembly 10, the cover plate 30, and the display screen 40 may constitute all or part of the body structure.

[0109] For example, the mid-frame assembly 10 may be generally rectangular in shape, and the shape of the mid-frame assembly 10 may be approximately the same as that of the electronic device 100. The mid-frame assembly 10 may serve as the main structural component of the electronic device 100 to support and mount the various components of the electronic device 100. The mid-frame assembly 10 may form multiple slots or chambers to mount the components of the electronic device 100.

[0110] The middle frame component 10 can be formed by splicing and assembling multiple parts. When the structure of the middle frame component 10 is relatively complex, it is beneficial to simplify the molding of the middle frame component 10.

[0111] The main body material of the mid-frame assembly 10 can be a metal material, such as aluminum alloy, magnesium alloy, stainless steel, titanium alloy, etc. The mid-frame assembly 10 may also have plastic inserts, etc., but this example does not strictly limit this. In some other examples, the main body material of the mid-frame assembly 10 may be plastic.

[0112] For example, the display screen 40 can be fixedly connected to one side of the mid-frame assembly 10. For instance, the display screen 40 can be fixedly connected to the mid-frame assembly 10 by means of adhesive, snap-fit, or other methods.

[0113] The display screen 40 can be electrically connected to the mid-frame assembly 10 to ground the display screen 40, thereby protecting the display screen 40.

[0114] Among them, the display screen 40 can be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode (MLED) display screen, a micro organic light-emitting diode (MOLED) display screen, a quantum dot light-emitting diode (QLED) display screen, a liquid crystal display (LCD) display screen, etc.

[0115] In this embodiment, the display screen 40 can be a flat screen, and its area can occupy most of the area of ​​the mid-frame component 10 to achieve a better display effect. In other embodiments, the display screen 40 can be a curved screen, a foldable screen, or a flexible screen, which can be set according to the needs of the electronic device 100. This embodiment does not impose strict limitations on this.

[0116] For example, the circuit board assembly 20 may be located on the side of the mid-frame assembly 10 facing the display screen 40. The circuit board assembly 20 may be installed in the cavity formed by the mid-frame assembly 10, and the circuit board assembly 20 may be fixed to the mid-frame assembly 10 by screws.

[0117] The circuit board assembly 20 may include a board body 201 and multiple functional modules 202. Some functional modules 202 may be fixed to the side of the board body 201 facing the middle frame assembly 10, some may be fixed to the side facing the cover plate 30, and some may be fixed to the edge of the board body 201. This embodiment does not strictly limit the position of the functional modules 202. The board body 201 may be formed by stacking multiple layers of boards to reduce its area and improve the integration of the circuit board assembly 20. Multiple functional modules 202 may be fixedly connected to and electrically connected to the board body 201. Different functional modules 202 can perform different functions. For example, multiple functional modules 202 include, but are not limited to, system on chip (SOC), antenna module, Bluetooth module, WiFi (Wireless-Fidelity) module, power management module, and screen display and operation module, etc. Functional module 202 may also include microphone interface, earpiece, speaker interface, camera interface, display screen 40 interface, etc. This embodiment does not strictly limit the functional module 202.

[0118] For example, the cover plate 30 can be fixedly connected to the side of the mid-frame assembly 10 facing away from the display screen 40. For instance, the cover plate 30 can be fixedly connected to the mid-frame assembly 10 by means of adhesive, snap-fit, or other methods.

[0119] The middle frame assembly 10 may have a mounting groove (not shown), and the cover plate 30 may be installed in the mounting groove. The cover plate 30 closes the side of the middle frame assembly 10 connected to it, thereby protecting the components between the cover plate 30 and the middle frame assembly 10. The cover plate 30 can be sealed to the middle frame assembly 10 to prevent water, dust, and other impurities from the outside of the electronic device 100 from entering the inside of the electronic device 100, thereby achieving waterproof and dustproof protection for the electronic device 100.

[0120] The cover plate 30 can be roughly rectangular in shape, and the area of ​​the cover plate 30 can be roughly the same as the area of ​​the middle frame assembly 10.

[0121] The material of the cover plate 30 can be glass, ceramic, metal, etc., and this embodiment does not impose strict limitations on it.

[0122] In some embodiments, the electronic device 100 may further include multiple modules (not shown in the figures), which may be housed inside the mid-frame assembly 10. The multiple modules of the electronic device 100 may include, but are not limited to, a battery, a camera module, an earpiece module, a speaker module, a microphone module, a sensor module, etc. This application embodiment does not specifically limit the number, type, or location of the modules of the electronic device 100.

[0123] It should be noted that, Figure 1 and Figure 2 Some components of the electronic device 100 are shown only schematically; the actual shape and size of these components are not subject to change. Figure 1 , Figure 2 As defined in the accompanying drawings below. It should be understood that when the electronic device 100 is in other forms, the electronic device 100 may not include the display screen 40, or the electronic device 100 may include multiple display screens 40.

[0124] It is understandable that, for ease of description, the width direction of electronic device 100 is defined as the X direction, the length direction of electronic device 100 as the Y direction, and the thickness direction of electronic device 100 as the Z direction.

[0125] Please see Figure 3 , Figure 3 yes Figure 2 The circuit board assembly 20 shown is a simplified structural diagram of some embodiments.

[0126] In some embodiments, the circuit board assembly 20 may include a first circuit board 1, a heating element 2, a first cover 3, a first heat-conducting element 4, and a second heat-conducting element 5.

[0127] The first circuit board 1 can be roughly rectangular thin plate structure. Circuitry can be etched onto the first circuit board 1 to enable signal transmission between the components of the circuit board assembly 20. The first circuit board 1 can serve as a support structure for the heat-generating component 2, providing electrical connection, protection, support, heat dissipation, and assembly functions for the heat-generating component 2. It is understood that the first circuit board 1 can be... Figure 2 The first circuit board 1 can be a multi-layer circuit board structure, allowing the circuit board assembly 20 to have a smaller area, thus adapting to miniaturized electronic devices. The thickness direction of the first circuit board 1 can be parallel to the Z-direction.

[0128] The heat-generating component 2 can be a device in the circuit board assembly 20 that generates significant heat during the operation of the electronic device. The heat-generating component 2 is mounted on and electrically connected to the first circuit board 1, enabling it to work collaboratively with other devices. For example, the heat-generating component 2 can be soldered onto the first circuit board 1 and electrically connected to other devices through the circuitry of the first circuit board 1. It is understood that the heat-generating component 2 can be... Figure 2 One of the functional modules.

[0129] For example, the heat-generating component 2 can be a system-on-a-chip (SoC), which can be used for computing, signal processing, etc. An SoC can be the core component of an electronic device. It is understood that an SoC can integrate multiple sub-chips, such as a central processing unit (CPU), a graphics processing unit (GPU), and an image signal processor (ISP). SoCs have high integration and large circuitry, and may generate significant heat during operation. For example, at maximum power, the local heat flux density of a CPU's large core can approach 100 W / cm² (watts per square centimeter).

[0130] For example, the heat-generating component 2 can also be a radio frequency (RF) chip. RF chips in electronic devices (such as mobile phones) are used for communication between the electronic device and the communication network, responsible for functions such as receiving, transmitting, amplifying, demodulating, and modulating wireless signals to realize the wireless communication capability of the electronic device. RF chips operate with high power and may generate significant heat. For instance, at maximum transmit power, the local heat flux density of the power amplifier device of an RF chip can reach 200 W / cm² (watts per square centimeter).

[0131] For example, the heat-generating component 2 could also be a power management chip, which is mainly responsible for managing the phone's power supply, battery charging, battery protection, and other functions. Power management chips also have relatively high operating power and may generate a significant amount of heat during operation.

[0132] It is understood that the heating element 2 can also be other devices that generate a large amount of heat, and this embodiment will not list them all.

[0133] The first cover 3 can be roughly shaped like a cover. The first cover 3 can be fixed to the first circuit board 1 and form a cover space with the first circuit board 1. The first cover 3 can cover the heating element 2, that is, the heating element 2 is located within the cover space.

[0134] Understandably, the first cover 3 can be used to shield the heat-generating component 2 from external interference. For example, the first cover 3 can prevent interference signals by limiting the electromagnetic field on the surface of the heat-generating component 2 (such as a SoC), thereby improving the speed and accuracy of data transmission by the heat-generating component 2, while also preventing the heat-generating component 2 from being affected by external physical and chemical environments.

[0135] For example, the first cover 3 can be sealed to the first circuit board 1, thereby making the cover space a sealed space. However, this is not strictly limited to this; in some other embodiments, the cover space can be non-sealed. For example, the first cover 3 can have a through hole, through which the cover space can communicate with the external space.

[0136] For example, the first cover 3 can be a shielding cover. The first cover 3 can be made of a metallic material. For instance, the first cover 3 can be made of copper, copper alloys, etc., giving it good shielding effect, as well as good mechanical and heat dissipation properties. The first cover 3 can also be made of conductive polymer materials, etc. This embodiment does not strictly limit the material of the first cover 3. In this embodiment, the first cover 3 is a shielding cover, which can shield and protect the heat-generating component 2. When the heat-generating component 2 is a system-on-a-chip, radio frequency chip, or power management chip, the heat-generating component 2 generally has a shielding cover. Therefore, this embodiment is more suitable for the working environment of these heat-generating components 2, thus having better adaptability to these heat-generating components 2 and easily achieving a better heat dissipation effect.

[0137] For example, the first cover 3 can be a thin sheet metal. The first cover 3 can be formed by processes such as bending and stamping. The first cover 3 forms a cover structure and has relatively thin sidewalls so that the first cover 3 has a small mass.

[0138] It is understood that the number of heating elements 2 fixed to the first circuit board 1 can be one or more. When the number of heating elements 2 is one, one heating element 2 can be soldered to the first circuit board 1. When the number of heating elements 2 is multiple, multiple heating elements 2 can be soldered to the first circuit board 1 at intervals. The number of heating elements 2 can be set according to the actual application scenario, and this embodiment does not impose a strict limitation. For example, the circuit board assembly 20 can have one heating element 2, and the heating element 2 is covered by the first cover 3. In other embodiments, the circuit board assembly 20 can have multiple heating elements 2, and the multiple heating elements 2 are soldered to the first circuit board 1, wherein some heating elements 2 are located inside the first cover 3, and other heating elements 2 are located outside the first cover 3; or, all multiple heating elements 2 are located inside the first cover 3.

[0139] The first heat-conducting element 4 can be covered by the first cover 3, meaning the first heat-conducting element 4 is located within the cover space. The first heat-conducting element 4 can be fixed to the first circuit board 1 and located on the same side of the first circuit board 1 as the heating element 2. The first heat-conducting element 4 can be spaced apart from the heating element 2.

[0140] The first heat-conducting element 4 can be made of a material with good thermal conductivity. The thermal conductivity of the first heat-conducting element 4 is at least stronger than that of air.

[0141] For example, the first heat-conducting element 4 can be made of, but is not limited to, metals with good thermal conductivity such as copper, silver, and their alloys. Furthermore, metal materials are easy to form. In this case, the first heat-conducting element 4 can easily be formed into a thin sheet structure, making it easy to mount on the first circuit board 1. The first heat-conducting element 4 has strong thermal conductivity, allowing heat from its surroundings to be quickly transferred to it, thus facilitating heat transfer and heat dissipation.

[0142] For example, the first heat-conducting element 4 can also be made of non-metallic materials. For instance, the first heat-conducting element 4 can be made of silicon. In this case, the first heat-conducting element 4 has good thermal conductivity, and the heat around it can be quickly transferred to the first heat-conducting element 4; the first heat-conducting element 4 is easy to form into a thin sheet structure, and it is easy to design it into a suitable shape and install it on the first circuit board 1; moreover, the first heat-conducting element 4 has high hardness and good rigidity, is not easy to deform, and will not collide with surrounding devices due to deformation, thus having little impact on the surrounding devices.

[0143] For example, the first heat-conducting element 4 can also be a phase change material (PCM). A PCM is a substance that changes its state of matter while remaining at a constant temperature and can provide latent heat. The process by which a PCM changes its physical properties is called a phase change process, during which the PCM absorbs or releases a large amount of latent heat. For example, the first heat-conducting element 4 can be made of paraffin wax. In this case, the first heat-conducting material has a strong ability to store heat; it can absorb and temporarily store surrounding heat, thereby preventing the ambient temperature from rising too quickly and achieving a uniform temperature.

[0144] It is understood that the first heat-conducting element 4 can be made of one or more of metallic materials, non-metallic materials, and phase change materials. This embodiment is not strictly limited. In some other embodiments, the first heat-conducting element 4 can also be made of other materials with good thermal conductivity.

[0145] The first heat-conducting component 4 can be a solid component, so as to facilitate the mounting of the first heat-conducting component 4 onto the first circuit board 1. A solid component refers to a structural component that is formed from solid material and remains solid after forming.

[0146] For example, the first heat-conducting component 4 may include multiple heat sinks 41, which may be arranged at intervals. A portion of the structure of the second heat-conducting component 5 may fill the gaps between adjacent heat sinks 41. The heat sinks 41 may be thin sheet structures. The thickness direction of the heat sinks 41 may be perpendicular to the thickness direction of the first circuit board 1. For example, the thickness direction of the heat sinks 41 may be parallel to the X-direction. For example, the heat sinks 41 may be copper sheets or silicon sheets. For example, the multiple heat sinks 41 may be located around the heat-generating component 2, and the multiple heat sinks 41 may be arranged along the X-direction. In this case, the multiple heat sinks 41 have a large surface area, which is beneficial to improving heat transfer efficiency, thereby improving heat dissipation efficiency; furthermore, the first circuit board 1 may have many electronic components (such as capacitors), and the thin thickness of the heat sinks 41 is beneficial to the reasonable arrangement of the electronic components of the first circuit board 1, with minimal impact on other electronic components of the first circuit board 1.

[0147] The first heat-conducting element 4 can be fixed to the first circuit board 1. The first heat-conducting element 4 can be fixed to the first circuit board 1 by soldering or bonding. For example, the first circuit board 1 can have pads 11, and the first end of the first heat-conducting element 4 can be soldered to the pads 11 of the first circuit board 1, while the second end of the first heat-conducting element 4 can have a gap with the first cover 3. The pads 11 can be formed on the copper-clad layer of the first circuit board 1, and the copper-clad layer has good thermal conductivity. In this case, the thermal resistance between the first heat-conducting element 4 and the first circuit board 1 is small, and the first heat-conducting element 4 can conduct heat from the first circuit board 1, which is beneficial for the heat dissipation of the heat-generating component 2. Furthermore, the height of the first cover 3 is greater than the height of the first heat-conducting element 4, and the height tolerance between the first cover 3 and the first heat-conducting element 4 is easy to control, avoiding collision between the first heat-conducting element 4 and the first cover 3, and facilitating the installation of the first cover 3. For example, when the first heat-conducting element 4 is made of metal or silicon, the first heat-conducting element 4 can be soldered to the first circuit board 1. When the first heat-conducting element 4 is made of a phase change material, the first heat-conducting element 4 can be bonded to the first circuit board 1.

[0148] The second heat-conducting element 5 can be covered by the first cover 3, that is, the second heat-conducting element 5 is located within the cover space. The second heat-conducting element 5 can contact the heating element 2 and the first heat-conducting element 4.

[0149] For example, the second heat-conducting element 5 can be in contact with the heating element 2. The second heat-conducting element 5 can cover most (e.g., more than half) or all of the surface of the heating element 2 exposed on the first circuit board 1. The second heat-conducting element 5 has a certain volume, that is, the heating element 2 can be embedded in the second heat-conducting element 5.

[0150] For example, the second heat-conducting element 5 may be in contact with the first heat-conducting element 4. The second heat-conducting element 5 may cover all or most of the surface of the first heat-conducting element 4 exposed on the first circuit board 1.

[0151] At this time, the second heat-conducting element 5 can absorb the heat from the surface of the heating element 2 and transfer it to the first heat-conducting element 4 or a region further out.

[0152] In addition, the second heat-conducting element 5 can also contact the first cover 3, thereby facilitating the transfer of heat to the first cover 3 and then to the external environment through the first cover 3, thus improving heat dissipation efficiency. At this time, the heat from the heating element 2 can be dissipated through the second heat-conducting element 5, the first cover 3, and then sequentially through the second heat-conducting element 5, the first heat-conducting element 4, and the first cover 3. The heat dissipation path has a large heat dissipation area and low thermal resistance, thereby reducing the rate of temperature rise of the heating element 2 and reducing the peak temperature of the heating element 2.

[0153] For example, the second heat-conducting element 5 can fully fill the cover space and fully contact the heating element 2, the first heat-conducting element 4, and the first cover 3, so that there is no area where air exists within the cover space. In some other embodiments, the second heat-conducting element 5 can fill part of the cover space, and there may be areas where air exists within the cover space.

[0154] The second heat-conducting component 5 can be a colloidal component or a liquid component. A colloidal component refers to a structural component formed from a colloid, which can be solid after molding. A liquid component refers to a component that is liquid at room temperature or during operation. That is, the second heat-conducting component 5 and the first heat-conducting component 4 are two different components, facilitating their separate placement within the cover space inside the first cover 3. The second heat-conducting component 5 can be made of a material with high thermal conductivity. It is understood that the materials of the second heat-conducting component 5 and the first heat-conducting component 4 can be different.

[0155] For example, the second heat-conducting component 5 can be made of thermally conductive gel. The thermally conductive gel can be gel-like and fluid when unformed; it can be solid after forming. Thermally conductive gel is easy to form, convenient to install in the circuit board assembly 20, and has low cost. In this case, when assembling the circuit board assembly 20, after installing the heating component 2 on the first circuit board 1 and the first heat-conducting component 4 on the first circuit board 1, the thermally conductive gel can be applied to the surface and surrounding area of ​​the heating component 2, making the heating component 2 contact with the first heat-conducting component 4. Then, the first cover 3 is placed outside the heating component 2 and the first heat-conducting component 4. The thermally conductive gel can fill the gap between the heating component 2 and the first heat-conducting component 4 through flow, thereby ensuring full contact between the first heat-conducting component 4 and the heating component 2, which is beneficial for the heat dissipation of the heating component 2.

[0156] For example, the second thermally conductive element 5 can be made of a secondary molding compound. The secondary molding compound can include a matrix and a thermally conductive filler, which can be mixed to form the compound. Therefore, the secondary molding compound is a colloidal component. The matrix material can be resin to give the secondary molding compound encapsulation capabilities; the thermally conductive filler can be metal particles, etc., to give the secondary molding compound good thermal conductivity. In this case, when assembling the circuit board assembly 20, the first thermally conductive element 4 and the heat-generating element 2 can be first molded using the secondary molding compound, forming a single component from the heat-generating element 2, the first thermally conductive element 4, and the second thermally conductive element 5. Then, the single component is soldered to the first circuit board 1, and finally, the first cover 3 is placed over the outside of this single component. Because the secondary molding compound can form a single component with the heat-generating element 2 and the first thermally conductive element 4, it is easy to install on the first circuit board 1, thereby simplifying the assembly process of the circuit board assembly 20.

[0157] For example, the second heat-conducting element 5 can be made of liquid metal. For instance, the liquid metal can be a gallium alloy. It is understood that, since the liquid metal is conductive, the electrical connection between the heating element 2 and the first circuit board 1 can be covered with an insulating layer to prevent the liquid metal from causing electrical connections between the pins of the heating element 2. Liquid metal has good thermal conductivity. The first cover 3 can have an injection hole and an exhaust hole (not shown), which can be through holes. When assembling the circuit board assembly 20, the heating element 2, the first heat-conducting element 4, and the first cover 3 can be mounted on the first circuit board 1. Then, the second heat-conducting element 5 is injected into the cover space through the injection hole, and the air in the cover space is discharged through the exhaust hole. After the injection of the second heat-conducting element 5 is completed, the injection hole and the exhaust hole can be sealed by welding or other methods to prevent leakage of the second heat-conducting element 5. Additionally, when the first cover 3 is a shielding cover, the injection hole and the exhaust hole also need to be sealed by welding or other methods to ensure the shielding capability of the shielding cover.

[0158] For example, the second heat-conducting element 5 can also be an insulating liquid with good thermal conductivity. The boiling point of the insulating liquid can be higher than the limiting operating temperature of the heating element 2 to prevent boiling. For instance, the second heat-conducting element 5 can be one or more combinations of inert fluorinated liquid and silicone oil. In this case, the installation method of the second heat-conducting element 5 can refer to the installation method described above when the second heat-conducting element 5 is liquid metal; this example will not repeat it further.

[0159] In some examples, the second heat-conducting component 5 may include one or more materials such as thermally conductive gel, secondary molding compound, liquid metal, and fluorinated liquid. For example, a layer of liquid metal can be coated on the surface of the heating component 2, and thermally conductive gel can be filled in other spaces of the enclosure space to achieve low thermal resistance heat conduction within the enclosure space.

[0160] In this embodiment, by providing a first heat-conducting element 4, which is located inside the first cover 3 and around the heating element 2, and fixedly connected to the first circuit board 1, a heat dissipation path can be formed from the heating element 2 to the first circuit board 1 to the first heat-conducting element 4. Since the first circuit board 1 is connected to the heating semiconductor (heat source) inside the heating element 2, the first heat-conducting element 4 in this heat dissipation path can dissipate heat from the inside of the heating element 2. In addition, by connecting the heating element 2 and the first heat-conducting element 4 through the second heat-conducting element 5, a heat dissipation path can also be formed from the heating element 2 to the second heat-conducting element 5. The second heat-conducting element 5 in this heat dissipation path can dissipate heat from the surface of the heating element 2.

[0161] Multiple heat dissipation paths are used to target the heat-generating component 2, forming a heat dissipation path from the heat-generating component 2 to its surroundings. The heat dissipation area of ​​the heat dissipation path is large, which helps to make the temperature distribution inside the first cover 3 uniform. The uniform temperature helps to reduce the junction temperature of the heat-generating component 2.

[0162] Furthermore, since the first heat-conducting component 4 and the second heat-conducting component 5 are independent components, it is convenient to place them separately in the cover space, thereby facilitating the fabrication of the circuit board assembly 20 and making it convenient to set the materials of the two separately. This helps to reduce the thermal resistance of the heat dissipation path, which in turn helps to quickly dissipate the heat of the heat-generating component 2 and reduce the junction temperature of the heat-generating component 2.

[0163] In addition, the heat dissipation path in this embodiment has almost no impact on the design of the heat-generating component 2, and has a high degree of matching with the design of the heat-generating component 2 in the first circuit board 1, and is low in cost.

[0164] Therefore, this embodiment can effectively reduce the junction temperature of the heating component 2 at a lower cost, extend the time for the heating component 2 to reach the thermal protection threshold under high load, reduce the leakage current caused by the high temperature of the heating component 2, and improve the stability of the circuit board assembly 20 during operation.

[0165] In some embodiments, the circuit board assembly 20 may further include a thermally conductive layer 6. The thermally conductive layer 6 can be fixed to the surface of the heat-generating component 2, and the material of the thermally conductive layer 6 can be metal. The thickness of the thermally conductive layer 6 can be relatively thin. For example, the material of the thermally conductive layer 6 can be aluminum, silver, or other materials. The thermally conductive layer 6 can be formed on the surface of the heat-generating component 2 by plating. For example, the top surface of the heat-generating component 2 facing away from the first circuit board 1 and the side surface connected to the top surface can be plated with the thermally conductive layer 6. In this embodiment, the surface of the heat-generating component 2 is provided with a thermally conductive layer 6 with good thermal conductivity, which facilitates sufficient contact between the thermally conductive layer 6 and the second thermally conductive element 5, thereby reducing the thermal resistance between the heat-generating component 2 and the second thermally conductive element 5, and thus improving the heat dissipation efficiency of the heat-generating component 2.

[0166] Please see Figure 4, Figure 4 yes Figure 3 The schematic diagram of the circuit board assembly 20 shown in some other embodiments is a simplified structural diagram.

[0167] In some embodiments, the first heat-conducting element 4 and the first cover 3 can be an integral structural component. Specifically, the first end of the first heat-conducting element 4 contacts the first circuit board 1, and the second end of the first heat-conducting element 4 is fixed to the first cover 3.

[0168] The first cover 3 can be generally a thin plate, and the first heat-conducting component 4 can include multiple heat sinks 41, which can be arranged at intervals. The multiple heat sinks 41 can be formed inside the first cover 3, and the height of the multiple heat sinks 41 can be the same. For example, the second end of the heat sink 41 can be flush with the port of the first cover 3 used to connect the first circuit board 1. Since the first heat-conducting component 4 and the first cover 3 can be an integral structural component, it is easy to make the ends of the heat sinks 41 flush with the ends of the first cover 3.

[0169] The material of the first heat-conducting element 4 can be the same as that of the first cover 3. For example, the first cover 3 can be made of metal, and the first heat-conducting element 4 can also be made of metal, so that the first heat-conducting element 4 and the first cover 3 can be easily formed into an integral structural component. For example, the heat sink 41 can be welded to the inner wall of the first cover 3. It is understood that the spaces on both sides of the heat sink 41 can be interconnected to facilitate the filling of the second heat-conducting element 5.

[0170] The second heat-conducting element 5 partially fills the gap between adjacent heat sinks 41.

[0171] In this embodiment, when assembling the circuit board assembly 20, the integrated structural component is soldered to the first circuit board 1, thereby facilitating the simultaneous fixing of the heat sink 41 and the first cover 3 to the first circuit board 1. At this time, the heat sink 41 can be used for circumferential heat dissipation of the heat-generating component 2 and can support the first cover 3. Furthermore, the heat sink 41 can directly connect the first cover 3 and the first circuit board 1, thereby facilitating the direct transfer of heat to the first cover 3, which in turn facilitates rapid heat dissipation through the first cover 3, thus improving heat dissipation efficiency.

[0172] Please see Figure 5 , Figure 5 yes Figure 3 The schematic diagram of the circuit board assembly 20 in some other embodiments is shown.

[0173] In some embodiments, the first heat-conducting element 4 may include a heat-conducting block 42.

[0174] The heat-conducting block 42 can be roughly rectangular in shape, but is not strictly limited to this.

[0175] The heat-conducting block 42 can have a large volume. For example, the projected area of ​​the heat-conducting block 42 in the first direction is greater than half the projected area of ​​the heating element 2 in the first direction. The first direction is perpendicular to the surface of the first circuit board 1, that is, the first direction can be parallel to the Z-direction. The heat-conducting block 42 and the heating element 2 are arranged in a direction perpendicular to the first direction. For example, the heat-conducting block 42 and the heating element 2 are arranged in the X-direction.

[0176] For example, the projected area of ​​the heat-conducting block 42 in the first direction can be greater than 80% of the projected area of ​​the heating element 2 in the first direction. By defining the relationship between the projected areas of the heat-conducting block 42 and the heating element 2, the heat-conducting block 42 can have a larger area within the limited space of the enclosure, thereby facilitating a larger volume for the heat-conducting block 42. Furthermore, the height of the heat-conducting block 42 can be close to the height of the heating element 2, further enabling a larger volume for the heat-conducting block 42.

[0177] In some other embodiments, the heat-conducting block 42 may also have a smaller volume. For example, the area of ​​the heat-conducting block 42 projected in the first direction may be less than half the area of ​​the heat-generating component 2 projected in the first direction.

[0178] In this embodiment, the heat-conducting block 42 has a large volume and surface area, and can absorb and store a lot of heat. Therefore, the heat-conducting block 42 can absorb and store the heat generated by the heating component, thereby achieving uniform temperature in the enclosure space, slowing down the heating rate of the heating component 2, and reducing the junction temperature of the heating component 2.

[0179] It is understood that in some embodiments, the first heat-conducting element 4 may only include Figure 3 The heat sink 41 in this embodiment. In some embodiments, the first heat conductor 4 may also include only... Figure 5 The heat-conducting block 42 in this embodiment. In some embodiments, the first heat-conducting element 4 may include... Figure 3 Heat sink 41 and in the embodiment Figure 5 The heat-conducting block 42 in the embodiment.

[0180] Please see Figure 6 , Figure 6 yes Figure 2 The schematic diagram of the circuit board assembly 20 shown in some other embodiments is a simplified structural diagram.

[0181] In some embodiments, the circuit board assembly 20 may include a first circuit board 1, a heating element 2, a raised plate 7, a first heat transfer element 8, and a second heat transfer element 9.

[0182] The first circuit board 1 serves as a support structure for the heat-generating component 2, providing electrical connection, protection, support, heat dissipation, and assembly functions. The structure of the first circuit board 1 can be referenced... Figure 3 The relevant descriptions in the embodiments will not be repeated in this embodiment.

[0183] The raised plate 7 can be fixed to the side of the first circuit board 1 facing away from the heating component 2 and form a receiving space with the first circuit board 1.

[0184] For example, the raised platform 7 can be a second circuit board. Electronic components can be soldered onto the raised platform 7, and circuits can be etched onto the raised platform 7, allowing signals to be transmitted between the electronic components. The raised platform 7 can serve as a support structure for the electronic components, providing functions such as electrical connection, protection, support, heat dissipation, and assembly. The raised platform 7 can be electrically connected to the first circuit board 1, and the electronic components on the raised platform 7 can transmit signals with the electronic components on the first circuit board 1.

[0185] The heat-generating component 2 can be a device in the circuit board assembly 20 that generates significant heat during the operation of the electronic device. The heat-generating component 2 is mounted on the first circuit board 1 and electrically connected to the first circuit board 1 so that the heat-generating component 2 can work in conjunction with other devices. For example, the heat-generating component 2 can be soldered onto the circuit of the first circuit board 1 and electrically connected to other devices through the circuit of the first circuit board 1.

[0186] For example, the heat-generating component 2 can be a system-on-a-chip (SOC), an RF chip, or a power management chip, etc. See [reference needed] for details. Figure 3 The relevant descriptions in the embodiments will not be repeated in this example.

[0187] For example, the heating element 2 may have multiple grounding pins 21, and the first circuit board 1 may have multiple grounding vias 12. The grounding pins 21 may be electrically connected to the grounding vias 12. The grounding pins 21 are used for grounding to ensure the stability and reliability of the circuit. One grounding via 12 may be electrically connected to one grounding pin 21, meaning that multiple grounding vias 12 may be connected one-to-one with multiple grounding pins 21, but this is not strictly limited. The arrangement of the grounding vias 12 may correspond to the arrangement of the grounding pins 21 of the heating element 2.

[0188] The grounding via 12 can penetrate the first circuit board 1. The grounding via 12 is generally conductive. One end of the grounding via 12 protrudes from the surface of the first circuit board 1 facing the heating element 2 and is electrically connected to the grounding pin 21 of the heating element 2. The other end of the grounding via 12 protrudes from the surface of the first circuit board 1 facing away from the heating element 2. In some other examples, the grounding via 12 can also be a blind via, with one end connected to the grounding pin 21 of the heating element 2 via a circuit, and the other end protruding from the surface of the first circuit board 1 facing away from the heating element 2.

[0189] The grounding via 12 can be filled with a thermally conductive material (not shown). The thermally conductive material can be a material with good thermal conductivity. For example, the material of the thermally conductive material can be a metal such as copper. Alternatively, the material of the thermally conductive material can be a semiconductor with a high thermal conductivity. Or, the material of the thermally conductive material can be a graphene-based material. In this case, by setting the thermally conductive material filling the grounding via 12 and the material of the thermally conductive material, the grounding via 12 has good electrical and thermal conductivity, resulting in a lower thermal resistance.

[0190] At this time, the heat on the surface of the heating element 2 can be conducted to the grounding via 12 so that the heat can be further transferred to the first heat transfer element 8, thereby absorbing the heat of the heating element 2 and preventing the heat of the heating element 2 from accumulating.

[0191] The first heat transfer element 8 can be located in the receiving space and fixedly connected to at least part of the grounding via 12. That is, the first heat transfer element 8 is installed on the side of the first circuit board 1 facing away from the heating element 2. The first heat transfer element 8 can be soldered to the grounding via 12.

[0192] The first heat transfer element 8 can be made of a material with good thermal conductivity. The thermal conductivity of the first heat transfer element 8 is at least stronger than that of air.

[0193] For example, the first heat transfer element can be a solid component. For instance, the first heat transfer element 8 can be made of, but is not limited to, metals with good thermal conductivity such as copper, silver, and their alloys. In this case, the first heat transfer element 8 can easily be formed into a reasonable structure for placement on the first circuit board 1. The first heat transfer element 8 has strong thermal conductivity, allowing heat from its surroundings to be quickly transferred to it, thus facilitating heat transfer and heat dissipation.

[0194] The first heat transfer element 8 may include multiple heat dissipation ribs 81, which may be arranged at intervals. The heat dissipation ribs 81 may be sheet-like or columnar structures. The thickness direction of the heat dissipation ribs 81 may be perpendicular to the thickness direction of the first circuit board 1. For example, the thickness direction of the heat dissipation ribs 81 may be parallel to the X-direction. For example, the multiple heat dissipation ribs 81 may be located around the periphery of the heat-generating component 2, and their arrangement direction may be the same. Each heat dissipation rib 81 is fixedly connected to at least one grounding pin 21. For example, the heat dissipation rib 81 may be a copper pillar. In this case, the multiple heat dissipation ribs 81 have a large surface area, which is beneficial to improving heat transfer efficiency, thereby improving heat dissipation efficiency; furthermore, the first circuit board 1 may have many electronic components (such as capacitors), and the thin thickness of the heat dissipation ribs 81 is beneficial to the reasonable arrangement of the electronic components of the first circuit board 1, with minimal impact on other electronic components of the first circuit board 1.

[0195] The first heat transfer element 8 can be fixed to the first circuit board 1. For example, the first end of the first heat transfer element 8 can be soldered to the grounding via 12, and the second end of the first heat transfer element 8 can be spaced apart from the raised plate 7. In this case, the thermal resistance between the first heat transfer element 8 and the first circuit board 1 is small, and the first heat transfer element 8 can conduct heat from the grounding via 12 of the first circuit board 1, which is beneficial for the heat dissipation of the heat-generating component 2. Furthermore, the height of the raised plate 7 is greater than the height of the first heat transfer element 8, and the height tolerance between the raised plate 7 and the first heat transfer element 8 is easy to control, preventing collisions between the first heat transfer element 8 and the raised plate 7, and facilitating the installation of the raised plate 7.

[0196] It is understood that the first heat transfer element 8 can correspond to the position where the heat-generating component 2 is mounted on the first circuit board 1. For example, in the direction perpendicular to the first circuit board 1, the projection of the first heat transfer element 8 can coincide with the projection of the heat-generating component 2, so that the heat dissipation path between the heat-generating component 2 and the first heat transfer element 8 is short, thereby facilitating rapid heat dissipation of the heat-generating component 2.

[0197] The second heat transfer element 9 can be located in the accommodating space and in contact with the first heat transfer element 8 and the raised plate 7.

[0198] For example, the second heat transfer element 9 may be in contact with the first heat transfer element 8. The second heat transfer element 9 may cover all or most of the surface of the first heat transfer element 8 exposed on the first circuit board 1.

[0199] In addition, the second heat transfer element 9 can also come into contact with the raised plate 7, thereby facilitating the transfer of heat to the raised plate 7 and then to the external environment through the raised plate 7, thereby improving heat dissipation efficiency.

[0200] At this time, the thermal resistance between the first heat transfer element 8 and the raised plate 7 is small, and the heat of the first heat transfer element 8 can be transferred to the second heat transfer element 9. The second heat transfer element 9 transfers the heat to the raised plate 7, thereby dissipating the heat to the environment.

[0201] The second heat transfer element 9 can be made of a material with high thermal conductivity.

[0202] For example, the second heat transfer element can be a gel-like element. The second heat transfer element 9 can be made of thermally conductive gel. The thermally conductive gel can be gel-like and has fluidity when unformed; the thermally conductive gel can be gel-like after forming. The thermally conductive gel is easy to solidify from a gel, and therefore easy to place within the receiving space.

[0203] For example, the raised platform 7 may have an injection hole 71 and an exhaust hole 72. The injection hole 71 and exhaust hole 72 penetrate the wall panel of the raised platform 7 and connect the receiving space and the external space of the raised platform 7. In this case, the second heat transfer element 9 can be injected into the receiving space through the injection hole 71 and flow within the injection space, thereby fully contacting the surface of the first heat transfer element 8. The gas in the receiving space can flow out through the exhaust hole 72. Forming the second heat transfer element 9 by injection molding facilitates full contact between the second heat transfer element 9 and the first heat transfer element 8, and the process is relatively simple. It is understood that when the second heat transfer element 9 uses thermally conductive gel, since the thermally conductive gel can solidify, the injection hole 71 and exhaust hole 72 do not need to be sealed.

[0204] Furthermore, in a direction perpendicular to the first circuit board 1, the projection of the line connecting the injection hole 71 and the vent 72 intersects with the projection of the heating element 2. At this time, when the second heat transfer element 9 (thermal conductive gel) is injected through the injection hole 71, the gas in the containment space is discharged from the vent 72, and the second heat transfer element 9 (thermal conductive gel) tends to flow towards the vent 72. Therefore, by setting the positions of the injection hole 71 and the vent 72, it is beneficial to control the distribution of the second heat transfer element 9 (thermal conductive gel) in the containment space. In this embodiment, the projection of the path from the injection hole 71 to the vent 72 coincides with the projection of the heating element 2, thereby facilitating the distribution of the second heat transfer element 9 (thermal conductive gel) to correspond with the heating element 2, which in turn facilitates the heat dissipation of the heating element 2 by the second heat transfer element 9 (thermal conductive gel).

[0205] It is understood that the second heat transfer element 9 can fully fill the accommodating space and make full contact with the heating element 2, the first heat transfer element 8, and the raised plate 7. In some other embodiments, the second heat transfer element 9 can fill a portion of the accommodating space.

[0206] In this embodiment, the grounding via 12 has good thermal conductivity. By setting the first heat transfer element 8 and the second heat transfer element 9, the grounding via 12, the first heat transfer element 8, the second heat transfer element 9 and the raised plate 7 form a heat dissipation path, which utilizes the grounding pin 21 of the heat-generating component 2 for heat dissipation. This has almost no impact on the structure of the heat-generating component 2. Furthermore, the heat dissipation path utilizes the space on the side of the first circuit board 1 away from the heat-generating component 2, which is beneficial to increasing the overall heat dissipation area of ​​the circuit board assembly 20. In addition, the grounding pin 21 is directly connected to the integrated circuit inside the heat-generating component 2, which is beneficial to directly dissipate heat from the inside of the heat-generating component 2. The heat dissipation path has low thermal resistance and high heat dissipation efficiency, which is beneficial to the rapid heat dissipation of the heat-generating component 2.

[0207] In some embodiments, the circuit board assembly 20 may further include a second heating element 101. The second heating element 101 may be located in the receiving space.

[0208] The second heating element 101 can be a different device from the heating element 2. The second heating element 101 is located on both sides of the first circuit board 1, respectively, and the two are close together so that they can work together.

[0209] For example, the second heating element 101 can be mounted on the first circuit board 1 and electrically connected to the raised plate 7. The second heat transfer element 9 can cover the second heating element 101, meaning the second heat transfer element 9 connects the first heat transfer element 8 and the second heating element 101. When the second heating element 101 operates, it generates heat, which can be conducted by the second heat transfer element 9 and dissipated through the raised plate 7, thereby achieving heat dissipation for the second heating element 101.

[0210] Please refer to the following: Figure 7 and Figure 8 , Figure 7 It is along Figure 6 A partial schematic diagram of a section cut at point AA in some embodiments. Figure 8 It is along Figure 6 A partial schematic diagram of some embodiments, cut at point AA.

[0211] In some embodiments, a heat dissipation rib 81 (shown by dashed lines in the figure) can be fixedly connected to a group of grounding vias 12. A group of grounding vias 12 may include multiple grounding vias 12, and adjacent grounding vias 12 in a group are in contact with each other.

[0212] The circuit board assembly 20 may have a number of grounding vias 12, either all of which may be divided into multiple groups or only some of which may be divided into multiple groups. Each group of grounding vias 12 may be fixedly connected to a heat dissipation fin 81.

[0213] For example, such as Figure 7 As shown, when the connection between the heat dissipation rib 81 and the first circuit board 1 is approximately elongated, the grounding vias 12 connected to the heat dissipation rib 81 form a group of grounding vias 12. Adjacent grounding vias 12 in this group contact each other and form an elongated shape with a contact surface approximately the same as that of the heat dissipation rib 81. This increases the contact area between the first circuit board 1 and the heat dissipation rib 81, thereby reducing the thermal resistance from the grounding via 12 to the heat dissipation rib 81 and improving heat conduction efficiency. It also improves the reliability of fixing the heat dissipation rib 81. It is understood that adjacent grounding vias 12 in a group can merge to form a unified grounding area, which can be considered as multiple grounding vias 12 merged together. It is understood that grounding vias 12 not connected to the heat dissipation rib 81 can be spaced apart.

[0214] For example, such as Figure 8As shown, when the connection between the heat dissipation rib 81 and the first circuit board 1 is approximately rectangular, the grounding vias 12 connected to the heat dissipation rib 81 form a group of grounding vias 12. Adjacent grounding vias 12 in this group contact each other and form a rectangle with a contact surface approximately the same as that of the heat dissipation rib 81. This increases the contact area between the first circuit board 1 and the heat dissipation rib 81, thereby reducing the thermal resistance from the grounding via 12 to the heat dissipation rib 81 and improving heat conduction efficiency. Additionally, it also improves the reliability of the heat dissipation rib 81's fixation. It is understood that adjacent grounding vias 12 in a group can merge to form a unified grounding area, which can be considered as multiple grounding vias 12 merged together. It is also understood that grounding vias 12 not connected to the heat dissipation rib 81 can be spaced apart.

[0215] Please see Figure 9 , Figure 9 yes Figure 2 The schematic diagram of the circuit board assembly 20 in some other embodiments is shown.

[0216] In some embodiments, the circuit board assembly 20 may include a first circuit board 1, a heating element 2, a first cover 3, a first heat-conducting element 4, and a second heat-conducting element 5.

[0217] The first cover 3 is installed on the first circuit board 1 and forms a cover space with the first circuit board 1; the heating component 2 is installed on the first circuit board 1 and is located in the cover space; the first heat-conducting component 4 is installed on the first circuit board 1, is located in the cover space, and is spaced apart from the heating component 2; the second heat-conducting component 5 is located in the cover space and is in contact with the first heat-conducting component 4, wherein the heating component 2 is embedded in the second heat-conducting component 5.

[0218] The specific configuration of the first circuit board 1, heating element 2, first cover 3, first heat-conducting component 4, second heat-conducting component 5, elevating plate 7, first heat transfer component 8, and second heat transfer component 9 can be found in [reference needed]. Figure 3 Examples and Figure 6 The relevant solutions in the embodiments will not be repeated in this embodiment.

[0219] In this embodiment, by setting a first heat-conducting element 4, the first heat-conducting element 4 is located inside the first cover 3 and around the heating element 2. The heating element and the first heat-conducting element 4 are connected by a second heat-conducting element 5, thereby forming a heat dissipation path from the heating element 2 to its surroundings. The heat dissipation path has a large heat dissipation area, which is conducive to uniform temperature distribution inside the first cover 3. The uniform temperature helps to reduce the junction temperature of the heating element 2. Furthermore, the heat dissipation path has a low thermal resistance, which is conducive to the rapid dissipation of heat from the heating element 2 and helps to reduce the junction temperature of the heating element 2.

[0220] In some embodiments, the circuit board assembly 20 may further include a raised plate 7, a first heat transfer element 8, and a second heat transfer element 9.

[0221] The raised plate 7 is fixed to the side of the first circuit board 1 facing away from the heating element 2 and forms an accommodating space with the first circuit board 1; the heating element 2 has multiple grounding pins 21, the first circuit board 1 has multiple grounding vias 12, and the grounding pins 21 are electrically connected to the grounding vias 12; the first heat transfer element 8 is located in the accommodating space and is fixedly connected to at least part of the grounding vias 12; the second heat transfer element 9 is located in the accommodating space and contacts the first heat transfer element 8 and the raised plate 7.

[0222] In addition, the grounding via 12 has good thermal conductivity. By setting the first heat transfer element 8 and the second heat transfer element 9, the grounding via, the first heat transfer element 8, the second heat transfer element 9 and the raised plate 7 form a heat dissipation path, which utilizes the grounding pin 21 of the heat-generating component 2 for heat dissipation. This has almost no impact on the structure of the heat-generating component 2. Furthermore, the heat dissipation path utilizes the space on the side of the circuit board away from the heat-generating element, which is beneficial to increasing the overall heat dissipation area of ​​the circuit board assembly 20. In addition, the grounding pin 21 is directly connected to the integrated circuit inside the heat-generating component 2, which is beneficial to directly dissipate heat from the inside of the heat-generating component 2. The heat dissipation path has low thermal resistance and high heat dissipation efficiency, which is beneficial to the rapid heat dissipation of the heat-generating component 2.

[0223] Therefore, by utilizing the space on both sides of the first circuit board 1 to dissipate heat from the heat-generating component 2, this embodiment can reduce the junction temperature of the heat-generating component 2, extend the time for the heat-generating component 2 to reach the thermal protection threshold under high load, reduce the leakage current caused by the high temperature of the heat-generating component 2, and improve the stability of the circuit board assembly 20 during operation. Furthermore, this embodiment makes full use of the space on both sides of the first circuit board 1, with almost no increase in thickness, resulting in a compact structure that is beneficial for application in thin electronic devices.

[0224] Please refer to the following: Figures 10 to 12 , Figure 10 yes Figure 9 The circuit board assembly 20 shown is a structural diagram of some embodiments. Figure 11 It is along Figure 10 A sectional view cut at point BB. Figure 12 yes Figure 10 The circuit board assembly 20 shown is an exploded view in some embodiments. Wherein, Figure 10 The diagram includes a schematic diagram of the circuit board assembly 20 from a first perspective and a second perspective, where the second perspective is the first perspective after being flipped.

[0225] In some embodiments, the first heat-conducting element 4 may include a heat-conducting block 42 and a plurality of heat sinks 41. The second heat-conducting element 5 is connected to the heat-generating component 2, the heat sinks 41, the heat-conducting block 42, and the first cover 3.

[0226] Among them, the heat-generating component 2 can be a system-on-a-chip.

[0227] The second heat-conducting component 5 can be made of thermally conductive gel. Thermally conductive gel can easily fill the gaps between components in the cover space, resulting in low thermal resistance; in addition, thermally conductive gel is easy to mold, making the fabrication of the circuit board assembly 20 simpler, and the thermally conductive gel is solid after molding, thus having good reliability.

[0228] The heat sink 41 can be a thin sheet structure, and multiple heat sinks 41 can be arranged at intervals. For example, the height of the heat sink 41 can be less than or equal to the height of the heat-generating component 2, the length of the heat sink 41 can be approximately the same as the heat-generating component 2, and the thickness of the heat sink 41 can be less than or equal to its height. Part of the second heat-conducting element 5 fills the gaps between adjacent heat sinks 41. The heat sink 41 can primarily be used for heat conduction. The heat sink 41 can be made of metal. In this case, the thermal conductivity of the heat sink 41 is higher than that of the second heat-conducting element 5, which is beneficial for transferring heat from the second heat-conducting element 5 to the heat sink 41 of the first heat-conducting element 4, thereby reducing the thermal resistance of the heat dissipation path from the heat-generating component 2 to the second heat-conducting element 5 to the first heat-conducting element 4 and then to the first cover 3.

[0229] The heat-conducting block 42 can be a block structure. For example, the projected area of ​​the heat-conducting block 42 in the direction perpendicular to the first circuit board 1 can be greater than half the projected area of ​​the heating element 2 in the same direction, so that the heat-conducting block 42 has a larger volume. For example, the thickness of the heat-conducting block 42 can be approximately equal to the thickness of the heating element 2. The length and width of the heat-conducting block 42 can be slightly smaller than the length and width of the heating element 2. The heat-conducting block 42 can be made of a phase change material to achieve a larger enthalpy value and store more heat. For example, the heat-conducting block 42 and the heating element 2 are arranged perpendicular to the first direction. For instance, the heat-conducting block 42 can be located in the middle region of one side of the first circuit board 1.

[0230] Multiple heat sinks 41, heating elements 2, and heat-conducting blocks 42 can be arranged sequentially to conduct or absorb the heat dissipated by the heating elements 2 on both sides, thereby making full use of the space around the heating elements 2 for heat dissipation. In other embodiments, the heat sinks 41, heating elements 2, and heat-conducting blocks 42 can also be arranged in other forms, which can be specifically set according to the circuit design of the first circuit board 1.

[0231] At this point, the heat sink 41 has strong thermal conductivity, enabling rapid heat conduction and facilitating heat dissipation; the heat-conducting block 42 also conducts heat and has a strong heat-holding capacity, allowing it to absorb and store or dissipate heat, thus preventing heat accumulation in the heat-generating component 2 and facilitating heat dissipation. Therefore, the cooperation between the heat sink 41 and the heat-conducting block 42 is beneficial for dissipating heat from the heat-generating component 2 in electronic devices with complex heat dissipation conditions, thereby helping the heat-generating component 2 maintain high operating efficiency and a relatively stable operating state.

[0232] The first cover 3 may be a first cover body 3. The first cover body 3 includes a barrier 31 and a top cover 32. For example, the barrier 31 may be a ring structure with a hollow center. For example, the top cover 32 may be a roughly cover structure, and the shape of the top cover 32 may correspond to the outline shape of the arranged heat sink 41, heat-generating component 2, and heat-conducting block 42, so that the top cover 32 can cover the three. The space enclosed by the barrier 31 has a roughly the same shape as the top cover 32.

[0233] In the circuit board assembly 20, the enclosure 31 can be soldered to the first circuit board 1, and the top cover 32 can be mated with the enclosure 31 to form a housing space. The enclosure 31 and the top cover 32 can be sealed together, making the housing space a sealed space as well. The enclosure 31 and the top cover 32 can be made of metal to form a shielding structure, providing shielding protection for the heat-generating component 2.

[0234] Please refer to the following: Figure 10 , Figure 11 and Figure 13 , Figure 13 yes Figure 10 The circuit board assembly 20 shown is an exploded view in some other embodiments.

[0235] In some embodiments, when the circuit board assembly 20 includes a raised plate 7, a first heat transfer element 8, and a second heat transfer element 9, the raised plate 7 may be a second circuit board, and the second circuit board may include a side plate 73 and a top plate 74.

[0236] For example, the side plate 73 may be a circuit board with circuitry, and the side plate 73 may be electrically connected to the first circuit board 1. The side plate 73 may have a generally frame structure. The side plate 73 may have cutout areas, one of which corresponds to the location on the first circuit board 1 where the heating element 2 is mounted.

[0237] For example, the top plate 74 may also be a circuit board with circuitry, and the top plate 74 may be electrically connected to the side plate 73 for electrical connection to the first circuit board 1. Electronic components may be disposed on the side plate 73. The side plate 73 may be generally plate-shaped.

[0238] The side plate 73 is fixed to the first circuit board 1, and the top plate 74 is mated with the side plate 73, thereby enclosing the hollow area of ​​the side plate 73 corresponding to the heating element 2 and forming an accommodating space. At this time, the first heat transfer element 8 and the second heat transfer element 9 can both be located within the accommodating space. It is understood that the other hollow areas of the side plate 73 can be used to install other electronic components of the circuit board assembly 20.

[0239] In some embodiments, the first heat transfer element 8 may be a plurality of heat dissipation ribs 81, and the heat dissipation ribs 81 may be small block structures. The small size of the heat dissipation ribs 81 is advantageous for mounting on a small area on the first circuit board 1. For example, the ratio of the largest to the smallest of the length, width and height dimensions of the heat dissipation ribs 81 may be less than 10.

[0240] Furthermore, the first heat transfer element 8 can be positioned corresponding to the location of the heat-generating component 2 where heat generation is severe. For example, in the direction perpendicular to the first circuit board 1 (Z direction), the first heat transfer element 8 can coincide with the projection of the CPU and / or GPU of the heat-generating component 2. In this case, targeted heat conduction to the area of ​​severe heat generation in the heat-generating component 2 facilitates rapid heat dissipation from this area; it also helps reduce the volume or number of heat dissipation ribs 81 in the first heat transfer element 8. When there are many other electronic components in the storage space, the space available for the first heat transfer element 8 is smaller, which facilitates its placement and also reduces its weight.

[0241] In some embodiments, the second heat transfer element 9 may be positioned corresponding to a location where the heat-generating component 2 experiences severe heat generation. For example, in a direction perpendicular to the first circuit board 1 (Z direction), the first heat transfer element 8 may coincide with the projection of the CPU and / or GPU of the heat-generating component 2. The second heat transfer element 9 may be a thermally conductive gel, which can be injected through an injection hole 71 on the raised plate 7.

[0242] For example, in a direction perpendicular to the first circuit board 1, the projection of the injection hole 71 can coincide with the projection of the heating element 2, and / or the projection of the vent hole 72 can coincide with the projection of the heating element 2. When the projection of the injection hole 71 coincides with the projection of the heating element 2, the thermally conductive gel, after being injected into the receiving space, can correspond to the position of the heating element 2, thereby facilitating the corresponding setting of the thermally conductive gel with the CPU and / or GPU of the heating element 2; and, it is beneficial to control the amount of thermally conductive gel injected, thereby reducing the weight of the thermally conductive gel, and thus reducing the weight of the circuit board assembly 20. When the projection of the vent hole 72 coincides with the projection of the heating element 2, the thermally conductive gel, after being injected into the receiving space, can flow to the vent hole 72 or its vicinity, also facilitating the corresponding setting of the thermally conductive gel with the CPU and / or GPU of the heating element 2; and, it is beneficial to control the amount of thermally conductive gel injected, thereby facilitating the reduction of the weight of the thermally conductive gel, and thus reducing the weight of the circuit board assembly 20.

[0243] In some embodiments, the second heat-generating component 101 can be a power management chip. In this case, the power management chip supplies power to the heat-generating component 2 (system-on-a-chip), and the power management chip dissipates heat through the second heat transfer element 9 that houses the space. In this embodiment, heat dissipation is achieved through the heat dissipation path of the first heat-conducting element 4, the second heat-conducting element 5, and the shielding cover, as well as through the heat dissipation path of the grounding via 12, the first heat transfer element 8, the second heat transfer element 9, and the second circuit board. This has almost no impact on the layout of the heat-generating component 2 and the second heat-generating component 101, resulting in a high degree of architectural matching and good heat dissipation performance, making it highly applicable.

[0244] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of this application can be combined with each other, and any combination of features in different embodiments is also within the protection scope of this application. That is to say, the multiple embodiments described above can also be arbitrarily combined according to actual needs.

[0245] It should be noted that all the above figures are exemplary illustrations of this application and do not represent the actual size of the product. Furthermore, the dimensional proportions between the components in the figures are not intended to limit the actual product of this application.

[0246] The above are merely some embodiments and implementation methods of this application. The scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A circuit board assembly (20), characterized by, The application relates to a circuit board assembly (20) comprising: a first circuit board (1), a first cover (3) mounted on the first circuit board (1) and forming a cover space with the first circuit board (1); a heat generating component (2) mounted on the first circuit board (1) and located in the cover space; a first heat conducting member (4) fixed on the first circuit board (1), located in the cover space and spaced apart from the heat generating component (2); and a second heat conducting member (5) located in the cover space, the second heat conducting member (5) being in contact with the first heat conducting member (4), and the heat generating component (2) being embedded in the second heat conducting member (5), wherein the first heat conducting member (4) is a solid member, and the second heat conducting member (5) is a gel member or a liquid member. The material of the first heat conducting member (4) is a phase change material.

2. The circuit board assembly (20) of claim 1, wherein, Alternatively, the material of the first heat conducting member (4) is metal. Alternatively, the material of the first heat conducting member (4) is silicon. The first heat conducting member (4) comprises a heat conducting block (42), the projection of the heat conducting block (42) in a first direction is greater than half of the projection of the heat generating component (2) in the first direction, the first direction is perpendicular to the surface of the first circuit board (1), and the heat conducting block (42) is arranged in a direction perpendicular to the heat generating component (2).

3. The circuit board assembly (20) according to claim 1 or 2, characterized in that The first heat conducting member (4) comprises a plurality of heat dissipation fins (41), the plurality of heat dissipation fins (41) are arranged at intervals, and part of the second heat conducting member (5) is filled in the intervals between adjacent heat dissipation fins (41).

4. The circuit board assembly (20) according to claim 1 or 2, characterized in that The first heat conducting member (4) comprises a heat conducting block (42) and a plurality of heat dissipation fins (41).

5. The circuit board assembly (20) of claim 1, wherein, The projection of the heat conducting block (42) in a first direction is greater than half of the projection of the heat generating component (2) in the first direction, the first direction is perpendicular to the surface of the first circuit board (1), and the heat conducting block (42) is arranged in a direction perpendicular to the heat generating component (2); and the material of the heat conducting block (42) is a phase change material. The plurality of heat dissipation fins (41) are arranged at intervals, part of the second heat conducting member (5) is filled in the intervals between adjacent heat dissipation fins (41), and the material of the heat dissipation fins (41) is metal. The material of the second heat conducting member (5) comprises heat conducting gel, liquid metal, fluorinated liquid or secondary plastic sealing material, and the secondary plastic sealing material comprises a base body and heat conducting filler.

6. The circuit board assembly (20) of claim 1, wherein, The first heat conducting member (4) and the first cover (3) are integrated structural members, the first end of the first heat conducting member (4) is in contact with the first circuit board (1), and the second end of the first heat conducting member (4) is fixed on the first cover (3).

7. The circuit board assembly (20) according to any one of claims 1 to 6, characterized in that The first circuit board (1) has a solder pad (11), the first end of the first heat conducting member (4) is welded to the solder pad (11), and the second end of the first heat conducting member (4) is spaced apart from the first cover (3).

8. The circuit board assembly (20) according to any one of claims 1 to 6, characterized in that The circuit board assembly (20) further comprises a heat conducting layer (6) fixed on the surface of the heat generating component (2), and the material of the heat conducting layer (6) is metal.

9. The circuit board assembly (20) according to any one of claims 1 to 8, characterized in that ​ 10. The circuit board assembly (20) according to any one of claims 1 to 9, characterized in that The circuit board assembly (20) further comprises a raised plate (7), a first heat transfer member (8) and a second heat transfer member (9), the raised plate (7) is fixed to a side of the first circuit board (1) away from the heat generating component (2) and forms a containing space with the first circuit board (1); The heat generating component (2) has a plurality of grounding pins (21), and the first circuit board (1) has a plurality of grounding vias (12), the grounding pins (21) are electrically connected to the grounding vias (12); The first heat transfer member (8) is located in the containing space and fixedly connected to at least part of the grounding vias (12), and the first heat transfer member (8) is a solid member; The second heat transfer member (9) is located in the containing space and contacts the first heat transfer member (8) and the raised plate (7), and the second heat transfer member (9) is a gel member.

11. The circuit board assembly (20) of claim 10, wherein, The material of the first heat transfer member (8) is metal; And / or, the material of the second heat transfer member (9) is a heat-conducting gel.

12. The circuit board assembly (20) of claim 10 or 11, characterized in that The first heat transfer member (8) comprises a plurality of heat dissipation ribs (81), and the plurality of heat dissipation ribs (81) are arranged at intervals, and one heat dissipation rib (81) is fixedly connected to at least one grounding pin (21).

13. The circuit board assembly (20) of claim 12, wherein, One heat dissipation rib (81) is fixedly connected to a group of grounding vias (12), and one group of the grounding vias (12) comprises a plurality of the grounding vias (12), and adjacent grounding vias (12) in the group contact each other.

14. The circuit board assembly (20) according to any one of claims 10 to 13, characterized in that The first circuit board (1) further comprises a heat-conducting body, the heat-conducting body is filled in the grounding vias (12), and the material of the heat-conducting body comprises metal, semiconductor or graphene.

15. The circuit board assembly (20) according to any one of claims 10 to 13, characterized in that The raised plate (7) has an injection hole (71) and an air outlet hole (72), the injection hole (71) and the air outlet hole (72) respectively penetrate the wall plate of the raised plate (7) and communicate the containing space and the external space of the raised plate (7).

16. The circuit board assembly (20) of claim 15, wherein: In a direction perpendicular to the first circuit board (1), the projection of the line connecting the injection hole (71) and the air outlet hole (72) intersects the projection of the heat generating component (2).

17. The circuit board assembly (20) of claim 16, wherein, In a direction perpendicular to the first circuit board (1), the projection of the injection hole (71) coincides with the projection of the heat generating component (2), and / or the projection of the air outlet hole (72) coincides with the projection of the heat generating component (2).

18. The circuit board assembly (20) according to any one of claims 1 to 17, characterized in that The heat generating component (2) is a system-on-chip, a radio frequency chip or a power management chip; and the first cover (3) is a shielding cover.

19. An electronic device (100), characterized by The electronic device (100) comprises a body and the circuit board assembly (20) as claimed in any one of claims 1 to 18, and the circuit board assembly (20) is fixed to the body.

20. A circuit board assembly (20) characterized by: The circuit board assembly (20) comprises: a first circuit board (1) having a plurality of grounding vias (12); a raised plate (7) mounted on the first circuit board (1) and forming a containing space with the first circuit board (1); a heating component (2) mounted on a side of the first circuit board (1) away from the elevated plate (7), the heating component (2) having a plurality of grounding pins (21) electrically connected to the grounding vias (12); a first heat transfer member (8) mounted on the first circuit board (1) and located in the accommodation space, the first heat transfer member (8) fixedly connected to at least part of the grounding vias (12), the first heat transfer member (8) being a solid member; and a second heat transfer member (9) located in the accommodation space and contacting the first heat transfer member (8) and the elevated plate (7), the second heat transfer member (9) being a gel member.

21. The circuit board assembly (20) of claim 20, characterized by The first heat transfer member (8) is made of metal. And / or, the second heat transfer member (9) is made of heat-conductive gel.

22. The circuit board assembly (20) according to claim 20 or 21, characterized in that The first heat transfer member (8) includes a plurality of heat dissipation ribs (81), and the plurality of heat dissipation ribs (81) are arranged at intervals, and one heat dissipation rib (81) is fixedly connected to at least one grounding pin (21).

23. The circuit board assembly (20) of claim 22, wherein: One heat dissipation rib (81) is fixedly connected to a group of grounding vias (12), and one group of grounding vias (12) includes a plurality of grounding vias (12), and adjacent grounding vias (12) in the group are in contact with each other.

24. The circuit board assembly (20) according to any one of claims 20 to 23, characterized in that The first circuit board (1) further includes a heat-conducting body, and the heat-conducting body is filled in the grounding vias (12), and the heat-conducting body is made of metal, semiconductor or graphene.

25. The circuit board assembly (20) according to any one of claims 20 to 23, characterized in that The elevated plate (7) has an injection hole (71) and an air outlet hole (72), and the injection hole (71) and the air outlet hole (72) respectively penetrate the wall plate of the elevated plate (7) and communicate the accommodation space and the external space of the elevated plate (7).

26. The circuit board assembly (20) of claim 25, wherein: In a direction perpendicular to the first circuit board (1), the projection of the line connecting the injection hole (71) and the air outlet hole (72) intersects the projection of the heating component (2).

27. The circuit board assembly (20) of claim 26, wherein: In a direction perpendicular to the first circuit board (1), the projection of the injection hole (71) coincides with the projection of the heating component (2), and / or the projection of the air outlet hole (72) coincides with the projection of the heating component (2).

28. An electronic device (100), characterized by The electronic device (100) includes a body and a circuit board assembly (20) as claimed in any one of claims 20 to 27, and the circuit board assembly (20) is fixed to the body.

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