Heat dissipation device, electronic assembly, vehicle-mounted intelligent module and vehicle

Abstract

The embodiment of the invention provides a heat dissipation device, an electronic assembly, a vehicle-mounted intelligent module and a vehicle. The heat dissipation device comprises a plurality of liquid cooling modules, and the liquid cooling modules are used for being in heat conduction connection with heating elements. The liquid cooling module is provided with a flow channel, and the flow channel is used for circulating cooling liquid. The plurality of liquid cooling modules are arranged at intervals, and a connecting piece is arranged between every two adjacent liquid cooling modules. The connecting piece has waterproofness, the connecting piece is connected with the side, facing the heating element, of the liquid cooling module, and the connecting piece covers a gap between every two adjacent liquid cooling modules. According to the liquid cooling module, the connecting piece can connect the two adjacent liquid cooling modules into a whole, and when the cooling liquid leaks, the connecting piece can prevent the cooling liquid from flowing to the side where the heating element is located through the gap, so that the risk of short circuit of the heating element is reduced, and the reliability of the electronic assembly and the vehicle is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of heat dissipation, in particular to a heat dissipation device, an electronic assembly, a vehicle-mounted intelligent module and a vehicle. BACKGROUND

[0002] With the gradual maturity of automatic driving technology, the public's acceptance of automatic driving is becoming higher and higher, thereby prompting the rapid development of automatic driving to a higher level. In order to meet the demand of automatic driving for chip computing power, some manufacturers usually integrate multiple chips on a circuit board. The above-mentioned chips will generate heat during operation. If the heat cannot be dissipated in time, the chip may work in a high-temperature environment, thereby affecting the stable operation and service life of the chip.

[0003] In order to dissipate heat for the chip, in one prior art, multiple cold plates are arranged inside the vehicle, and each cold plate is connected with the chip through a heat-conducting material. The cold plate has a flow channel. The low-temperature cooling liquid can exchange heat with the chip after entering the cold plate, thereby dissipating heat for the chip. During use, once the cooling liquid leaks, it is easy to flow to the surface of the circuit board, thereby causing a short circuit of the circuit board, and further affecting the normal operation of the chip, resulting in a fault of the vehicle. SUMMARY

[0004] The present application provides a heat dissipation device, an electronic assembly, a vehicle-mounted intelligent module and a vehicle, which are used to reduce the risk of cooling liquid leaking to the circuit board during heat dissipation for the chip, and improve the reliability of the electronic assembly and the vehicle.

[0005] In a first aspect, the present application provides a heat dissipation device. The heat dissipation device comprises multiple liquid cooling modules, and the liquid cooling modules are used to be in heat-conducting connection with heat-generating elements. Each liquid cooling module has a flow channel, and the flow channel is used to circulate cooling liquid to exchange heat between the cooling liquid and the heat-generating elements. The multiple liquid cooling modules are arranged at intervals, and a connecting piece is arranged between two adjacent liquid cooling modules. The connecting piece is connected to the side of the liquid cooling modules facing the heat-generating elements, and the connecting piece covers the gap between the two adjacent liquid cooling modules. In terms of material, the connecting piece has waterproof property. When the surface of the connecting piece has cooling liquid, the cooling liquid is not easy to penetrate the connecting piece. Optionally, the cooling liquid can be water or other liquid. In terms of structure, the connecting piece has a dense structure and does not have holes itself, thereby playing a blocking role on the cooling liquid. When arranging the connecting piece, the connecting piece extends along the gap between the two adjacent liquid cooling modules, and the length of the connecting piece is not less than the length of the gap. The connecting piece can connect the multiple liquid cooling modules as a whole. When the cooling liquid leaks, the connecting piece can block the cooling liquid from flowing to the side where the heat-generating elements are located through the above-mentioned gap, thereby reducing the risk of short circuit of the heat-generating elements and improving the reliability of the electronic assembly and the vehicle.

[0006] In the specific arrangement of the liquid cooling module, in an optional technical solution, the liquid cooling module comprises a substrate, the substrate is used for heat conduction connection with the heat generating element, and the flow channel is located on the side of the substrate away from the heat generating element. For the two adjacent liquid cooling modules, the two substrates are also arranged adjacent to each other, and the two substrates are directly connected through the connecting piece. The substrates of the plurality of liquid cooling modules included in the heat dissipation device are connected through the connecting piece to form an integral substrate, and the flow channel is located on the side of the integral substrate away from the heat generating element. The integral substrate can form a barrier between the cooling liquid and the heat generating element, thereby blocking the flow of the cooling liquid to the side where the heat generating element is located, thereby reducing the risk of short circuit of the heat generating element and improving the reliability of the electronic assembly and the vehicle.

[0007] In the specific formation of the flow channel of the liquid cooling module, there are various formation methods. For example, in an optional technical solution, the liquid cooling module further comprises a top cover, the top cover is located on the side of the substrate away from the heat generating element, and the top cover and the substrate are snap-fit connected and enclose the flow channel. For another example, in another optional technical solution, the liquid cooling module further comprises a metal pipe, at least part of the metal pipe is located on the surface of the substrate, and the internal passage of the metal pipe forms the flow channel. Of course, in addition to the above two methods, the flow channel can also be formed by other methods, which will not be enumerated one by one in this application.

[0008] In the specific connection of the substrate and the connecting piece, there are various connection methods. For example, the substrate and the connecting piece can be welded, bonded or integrated.

[0009] In the specific arrangement of the substrate, the substrate can be a plate body with uniform thickness, or a plate body with varying thickness. In an optional technical solution, the thickness of the substrate gradually decreases in the direction away from the connecting piece. When installing the substrate, the bottom surface of the substrate can be in a horizontal state, so that the top surface of the substrate is in an inclined state. At this time, the distance from the top surface of the substrate to the plane where the heat generating element is located gradually decreases in the direction away from the connecting piece. When the cooling liquid leaks and flows to the top surface of the substrate, the cooling liquid will flow away from the connecting piece, thereby reducing the accumulation of the cooling liquid at the connecting piece, which is beneficial to the discharge of the leaked cooling liquid.

[0010] In the specific arrangement of the connecting piece, in an optional technical solution, the connecting piece has a first side and a second side arranged in a first direction, wherein the first side is connected with one liquid cooling module, the second side is connected with another liquid cooling module, and the connecting piece has elastic deformation capability in the first direction. That is, the connecting piece can be elongated and shortened in the first direction. The connecting piece can connect two liquid cooling modules with different spacings by deformation, and has strong adaptability.

[0011] As an example, in one possible implementation, the connecting member can be flexible due to the special design of the structure, and thus can be deformed. For example, the connecting member includes a first protruding portion having two first wall surfaces oppositely arranged along the thickness direction of the connecting member, both of which are protruding away from the heat generating element. From the appearance, the first protruding portion described above encloses a first cavity on the side facing the heat generating element. As another example, the connecting member includes a second protruding portion having two second wall surfaces oppositely arranged along the thickness direction of the connecting member, both of which are protruding towards the heat generating element. From the appearance, the second protruding portion described above encloses a second cavity on the side facing away from the heat generating element. As a further example, the connecting member includes both the first protruding portion described above and the second protruding portion described above, and thus is zigzag or wavy. Under the action of extrusion, stretching, or the like, both the first protruding portion described above and the second protruding portion described above can be deformed, so that the size of the connecting member in the first direction changes.

[0012] In another possible implementation, the connecting member can be flexible due to the special design of the material, and thus can be deformed. For example, the connecting member is a component made of a flexible material.

[0013] In order to improve the heat transfer efficiency between the heat generating element and the substrate, in one possible implementation, the surface of the substrate on the side facing the heat generating element is provided with a first heat-conducting protrusion, the thermal conductivity of the first heat-conducting protrusion being greater than or equal to the thermal conductivity of the substrate, and the first heat-conducting protrusion being used for heat-conducting connection with the heat generating element. The first heat-conducting protrusion widens the heat conduction channel, so that heat can be quickly conducted in the plane perpendicular to the thickness direction of the substrate and to a larger range, so that in unit time, the cooling liquid can absorb more heat, and thus the heat exchange efficiency between the cooling liquid and the heat generating element is improved.

[0014] In arranging the plurality of liquid cooling modules, in one possible implementation, the flow channels of the plurality of liquid cooling modules are sequentially communicated through the connecting pipeline. In other words, the plurality of liquid cooling modules are arranged in series. In another possible implementation, the heat dissipation device further includes an inlet liquid main pipe, an outlet liquid main pipe, a plurality of inlet liquid branch pipes, and a plurality of outlet liquid branch pipes; wherein the flow channels of the plurality of liquid cooling modules are respectively communicated through different inlet liquid branch pipes and the inlet liquid main pipe, and the flow channels of the plurality of liquid cooling modules are respectively communicated through different outlet liquid branch pipes and the outlet liquid main pipe. In other words, the plurality of liquid cooling modules are arranged in parallel between the inlet liquid main pipe and the outlet liquid main pipe.

[0015] In a second aspect, the present application also provides an electronic assembly. The electronic assembly comprises a plurality of heat generating elements and the heat dissipation device according to any one of the first aspect, and the heat generating elements and the liquid cooling module in the heat dissipation device are in thermal connection. The liquid cooling module has a flow channel, when the cooling liquid is introduced into the flow channel, the cooling liquid will flow along the flow channel and exchange heat with the heat generating elements, so as to reduce the temperature of the heat generating elements and achieve the purpose of dissipating heat for the heat generating elements. When the cooling liquid leaks, for any two adjacent liquid cooling modules, the connecting piece located between the two can block the cooling liquid from flowing to the side where the heat generating elements are located through the gap between the two, thereby reducing the risk of short circuit of the heat generating elements and improving the reliability of the electronic assembly and the vehicle.

[0016] In an optional technical solution, the electronic assembly further comprises a first shell, and the first shell has an opening. The heat generating elements are located in the first shell, and the plurality of liquid cooling modules included in the heat dissipation device are connected by the connecting pieces to form an integral structure, which is located at the top of the opening and covers the opening.

[0017] In a specific technical solution, among the plurality of liquid cooling modules included in the heat dissipation device, the substrates of the plurality of liquid cooling modules are connected with the connecting pieces to form a first cover plate, the first cover plate is located at the top of the opening, and the first cover plate covers the opening. The area of the orthographic projection of the first cover plate on the plane where the opening is located is greater than or equal to the area of the opening, and after the first cover plate covers the opening, the opening can be completely blocked. The flow channel is located on the side of the first cover plate away from the heat generating elements, and the first cover plate does not have a hole communicating with the inner cavity of the first shell. When the cooling liquid leaks, the first cover plate can form a barrier between the cooling liquid and the heat generating elements, thereby preventing the cooling liquid from flowing into the interior of the first shell, thereby reducing the risk of short circuit of the heat generating elements and improving the reliability of the electronic assembly and the vehicle.

[0018] To further reduce the risk of the cooling liquid entering the first shell, in an optional technical solution, the first cover plate has an extension part, and a normal projection of the extension part on the plane where the opening is located is located on the outer periphery of the normal projection of the first shell on the plane where the opening is located. The extension part forms an annular shape, and the extension part extends to the outside of the first shell. The extension part has a set width, and optionally, the width of the extension part can be 2mm, 2.5mm, 3mm, 3.5mm, 4mm or other numerical values, which will not be enumerated one by one in this application. That is, the outer contour of the extension part and the side wall of the first shell have a set spacing. When the cooling liquid flows to the edge of the extension part, the cooling liquid will drip to the outside of the first shell, thereby reducing the risk of the cooling liquid flowing into the first shell. In another optional technical solution, a sealing member is arranged between the first cover plate and the first shell. The sealing member can block the gap between the first cover plate and the first shell, preventing the cooling liquid from leaking into the first shell through the gap between the two. In specific implementation, one of the above two technical solutions can be used, or both of the above two technical solutions can be used.

[0019] In an optional technical solution, a flexible member is arranged between the substrate covering the edge of the opening and the first shell. The flexible member has elastic deformation capability, and the flexible member can allow the above-mentioned substrate to have a certain amount of floating relative to the first shell, so that the height of the corresponding liquid cooling module from the surface of the first circuit board can be adapted to the thickness of the heat generating element, thereby causing a moderate extrusion between the above-mentioned liquid cooling module and the heat generating element.

[0020] In the specific installation of the liquid cooling module, in an optional technical solution, the electronic assembly further includes a first circuit board located in the first shell. Among them, the heat generating element is electrically connected to the first circuit board, and the liquid cooling module is fixed to the first circuit board by the first fixing member. During installation, the height of each liquid cooling module from the surface of the first circuit board can be adjusted according to the thickness of the heat generating element, so that a moderate extrusion is maintained between each liquid cooling module and the heat generating element. In addition, during installation, the connecting member can be deformed to adapt to the height difference between the two adjacent liquid cooling modules.

[0021] In the specific arrangement of the first fixing member, the first fixing member includes a screw and a spring, the screw connects the liquid cooling module and the first circuit board, and the head of the screw is located on the side of the first circuit board away from the liquid cooling module. The spring is sleeved on the screw, and one end of the spring abuts against the head of the screw, and the other end of the spring abuts against the first circuit board. When the length of the spring changes, the spacing between the liquid cooling module and the surface of the first circuit board will also change, so that the liquid cooling module is in a floating state. During installation, the connecting member can be deformed accordingly with the floating of the liquid cooling module, and finally, each liquid cooling module and the first circuit board have a suitable spacing, thereby maintaining a moderate extrusion with the corresponding heat generating element.

[0022] In order to reduce the risk of deformation of the first circuit board, in an optional technical solution, a first reinforcing plate is arranged on the side of the first circuit board away from the heat-generating element. When the liquid cooling module is fixed, one end of the first fixing member is connected with the liquid cooling module, and the other end of the first fixing member is connected with the first reinforcing plate after penetrating through the first circuit board. The first reinforcing plate is made of hard material, which can support the side of the first circuit board away from the liquid cooling module, prevent the first circuit board from being concave to the bottom of the first shell, and thus reduce the risk of deformation of the first circuit board, and ensure the reliable connection of the first circuit board and the heat-generating element.

[0023] In addition to the heat dissipation device in the first aspect and the electronic assembly in the second aspect, the present application also provides another heat dissipation device and a corresponding electronic assembly, which will be described in detail below.

[0024] In a third aspect, the present application also provides another heat dissipation device. The heat dissipation device comprises a heat dissipation plate and a flow guide pipe, wherein the heat dissipation plate is used for heat conduction connection with a heat-generating element, and the flow guide pipe is used for conveying cooling liquid. The flow guide pipe comprises a first part, and the first part is at least partially located in the heat dissipation plate in the orthographic projection of the plane where the heat dissipation plate is located, and the first part is in heat conduction connection with the heat dissipation plate.

[0025] In the above-mentioned heat dissipation device, the flow guide pipe is a whole pipe, rather than a pipe formed by combining multiple pipes through welding, threaded connection or flange connection. When the cooling liquid flows along the flow guide pipe, since there is no joint inside the flow guide pipe, the risk of leakage of the cooling liquid is low, thereby reducing the risk of short circuit of the circuit board and the heat-generating element, and thus improving the reliability of the electronic assembly and the vehicle.

[0026] In order to improve the heat exchange effect of the cooling liquid and the heat dissipation plate, in an optional technical solution, the first part extends along a curve. Optionally, the first part can extend along a serpentine curve, or can extend along a U-shaped curve. In the above-mentioned technical solution, by making the first part extend along a curve, the length of the first part is increased, and the surface area of the first part is increased, thereby increasing the heat exchange area between the first part and the heat dissipation plate, and thus improving the heat exchange effect of the cooling liquid and the heat dissipation plate.

[0027] In another optional technical solution, the flow guide pipe further comprises a second part, and the second part is located outside the heat dissipation plate. The first part and the above-mentioned second part are different parts of the same flow guide pipe, and the cross-sectional area of the first part is greater than that of the second part. In the above-mentioned technical solution, compared with the second part of the flow guide pipe located outside the heat dissipation plate, by increasing the cross-sectional area of the first part, the surface area of the first part is correspondingly increased, thereby increasing the heat exchange area between the first part and the heat dissipation plate, and thus improving the heat exchange effect of the cooling liquid and the heat dissipation plate.

[0028] In a specific technical solution, the first portion includes a first sub-portion and a second sub-portion, the first sub-portion and the second sub-portion are located between the liquid inlet end and the liquid outlet end of the first portion, and the first sub-portion is close to the liquid inlet end, and the second sub-portion is away from the liquid inlet end. In the direction from the liquid inlet end to the liquid outlet end, the cross-sectional area of the first sub-portion gradually increases, and the cross-sectional area of the second sub-portion gradually decreases.

[0029] In the specific arrangement of the flow guide pipe, the flow guide pipe has flexibility, so that it can be bent. Optionally, the flow guide pipe is a metal pipe that is easy to bend, such as an aluminum pipe.

[0030] In the specific assembly of the flow guide pipe and the heat dissipation plate, in an optional technical solution, the surface of the heat dissipation plate away from the heat generating element has a first groove, and the first portion is located in the first groove. On the one hand, the first groove can increase the heat exchange area between the first portion and the heat dissipation plate, and improve the heat exchange efficiency. On the other hand, the first groove can limit the first portion, and improve the fixing effect of the first portion.

[0031] In an optional technical solution, the flow guide pipe includes a plurality of first portions, and the heat dissipation device includes a plurality of heat dissipation plates. The plurality of first portions are arranged in sequence and connected in series along the extension direction of the flow guide pipe, or in other words, the plurality of first portions are connected in series, wherein each first portion is in thermal conductive connection with a heat dissipation plate.

[0032] In a fourth aspect, the present application also provides another electronic assembly. The electronic assembly includes a second housing, a heat generating element, and the heat dissipation device of any one of the third aspect. The heat generating element and the heat dissipation plate are located in the interior of the second housing, and the heat generating element and the heat dissipation plate are in thermal conductive connection. The flow guide pipe has a first liquid inlet and a first liquid outlet, and the first liquid inlet and the first liquid outlet are located outside the second housing. That is, the connection between the flow guide pipe and the external pipeline is located outside the second housing. In this way, even if the cooling liquid leaks at the connection between the flow guide pipe and the external pipeline, the leaked cooling liquid has less impact on the heat generating element in the interior of the second housing, thereby further reducing the risk of short circuit of the circuit board and the heat generating element, and improving the reliability of the electronic assembly and the vehicle.

[0033] In order to further improve the heat dissipation effect of the heat generating element, in an optional technical solution, the inner wall of the second housing has a second thermal conductive protrusion, and the second thermal conductive protrusion is in thermal conductive connection with the heat dissipation plate. In this way, the heat generating element includes two heat dissipation paths, one of which is: heat generating element-heat dissipation plate-cooling liquid, and the other of which is: heat generating element-heat dissipation plate-second thermal conductive protrusion-second housing. The heat generated by the heat generating element can be conducted outward through the two heat dissipation paths, thereby improving the heat dissipation effect of the heat generating element.

[0034] In a specific technical solution, the second shell has a plurality of heat dissipation fins on the side surface away from the second heat-conductive protrusion. The heat dissipation fins can increase the surface area of the second shell, thereby increasing the heat exchange area between the second shell and the external environment, and further improving the heat dissipation effect of the heat-generating element.

[0035] In the specific arrangement of the second shell, in an optional technical solution, the second shell includes a middle frame, a back shell and a cover plate, the middle frame is located between the back shell and the cover plate, and the middle frame and the back shell form a first accommodating cavity, and the middle frame and the cover plate form a second accommodating cavity. The middle frame can be used to fix some electronic components, and the back shell and the cover plate play a role in waterproofing and dustproofing on both sides of the middle frame.

[0036] In the arrangement of the heat-generating element and the heat dissipation plate in the second shell, the heat-generating element is located in the first accommodating cavity, and the first accommodating cavity is further provided with a second circuit board, and the heat-generating element is electrically connected to the second circuit board. The middle frame has a hollow structure, and the heat dissipation plate is located in the hollow structure, and the heat dissipation plate is connected to the second circuit board through the second fixing member.

[0037] In the specific arrangement of the second fixing member, the second fixing member includes a second screw and a second spring.

[0038] In order to improve the structural strength of the second circuit board, a second reinforcing plate is arranged on the side of the second circuit board away from the heat-generating element. The second reinforcing plate is made of hard material, which can enhance the structural strength of the second circuit board, thereby improving the supporting effect of the second circuit board on the heat dissipation plate. At the same time, the second reinforcing plate also reduces the risk of deformation of the second circuit board, ensuring the connection reliability of the second circuit board and the heat-generating element.

[0039] In an optional technical solution, the electronic assembly further includes a first electronic component fixed to the middle frame. The first electronic component also generates heat during operation. Since the first electronic component is fixed to the middle frame, the heat generated by the first electronic component can be conducted to the middle frame and dissipated outward through the middle frame. In order to improve the heat dissipation effect of the first electronic component, the cover plate has a third heat-conductive protrusion on the side surface facing the middle frame, and the third heat-conductive protrusion is in heat-conductive connection with the middle frame. The third heat-conductive protrusion can conduct the heat generated by the first electronic component to the cover plate, and the cover plate exchanges heat with the external environment, thereby achieving the effect of dissipating heat for the electronic component.

[0040] In the arrangement of the flow guide pipe in the second shell, in an optional technical solution, the flow guide pipe further comprises a third part, the third part is located outside the heat dissipation plate, and the third part is in thermal conductive connection with the second shell. During the flow of the cooling liquid through the third part, the cooling liquid can exchange heat with the second shell. As an example, the third part can be in thermal conductive connection with the middle frame of the second shell. In an application scenario, the temperature of the cooling liquid is low, and the cooling liquid exchanges heat with the middle frame during the flow through the third part, so that the temperature of the middle frame is reduced. The middle frame exchanges heat with the first electronic element again, thereby achieving the effect of heat dissipation for the first electronic element.

[0041] In another optional technical solution, the flow guide pipe further comprises a fourth part, the fourth part is located outside the heat dissipation plate, the fourth part is adjacent to and connected with the first part, and the fourth part is suspended in the second shell. Compared with the third part, the fourth part will not be clamped in the second groove on the surface of the second shell, will not be adhered to the surface of the second shell by the heat-conducting adhesive, or will not be fixed to the second shell by other fixing members. In the scenario where the heat guide pipe has flexibility, the above-mentioned fourth part can be bent and will not be limited by the second shell, so that during the installation of the heat dissipation device, the heat dissipation plate can be adjusted to an appropriate position, so that the heat dissipation plate can not only maintain close contact with the heat generating element to improve the heat conduction efficiency, but also will not cause excessive extrusion to the heat generating element and damage the heat generating element.

[0042] In a fifth aspect, the present application also provides a vehicle-mounted intelligent module. The vehicle-mounted intelligent module comprises a shell and an electronic assembly according to any one of the technical solutions in the second aspect or an electronic assembly according to any one of the technical solutions in the fourth aspect, wherein the electronic assembly is located in the shell. The above electronic assembly contains two different heat dissipation devices. One heat dissipation device fills the gap between the two adjacent liquid cooling modules through the connecting member, thereby blocking the risk of leakage of the cooling liquid from the above gap to the surface of the heat generating element, realizing water and electricity separation, ensuring the normal work of the heat generating element, and improving the reliability of the electronic assembly and the vehicle. Another heat dissipation device uses a heat dissipation plate and a whole flow guide pipe, which reduces the gap and other defects in the heat dissipation device, thereby reducing the risk of leakage of the cooling liquid, and achieving the same effect.

[0043] In a sixth aspect, the present application also provides a vehicle. The vehicle comprises a vehicle frame and the vehicle-mounted intelligent module according to the fifth aspect, and the vehicle-mounted intelligent module is located in the vehicle frame. The vehicle-mounted intelligent module can use two different heat dissipation devices to dissipate heat for the heat generating element, which can reduce the flow of the cooling liquid to the side where the heat generating element is located, thereby reducing the risk of short circuit of the heat generating element and improving the reliability of the vehicle. BRIEF DESCRIPTION OF DRAWINGS

[0044] Figure 1 A structural schematic diagram of a vehicle provided by an embodiment of the present application;

[0045] Figure 2 A structural schematic diagram of a vehicle-mounted intelligent module provided for an embodiment of the present application;

[0046] Figure 3 A structural schematic diagram of an electronic assembly provided for an embodiment of the present application;

[0047] Figure 4 A layout schematic diagram of a liquid cooling module provided for an embodiment of the present application;

[0048] Figure 5 Another layout schematic diagram of a liquid cooling module provided for an embodiment of the present application;

[0049] Figure 6 A structural schematic diagram of a heat dissipation device provided for an embodiment of the present application;

[0050] Figure 7 Another structural schematic diagram of a heat dissipation device provided for an embodiment of the present application;

[0051] Figure 8 Another structural schematic diagram of a heat dissipation device provided for an embodiment of the present application;

[0052] Figure 9 Another structural schematic diagram of a heat dissipation device provided for an embodiment of the present application;

[0053] Figure 10 A structural schematic diagram of a connecting piece provided for an embodiment of the present application;

[0054] Figure 11 Another structural schematic diagram of a connecting piece provided for an embodiment of the present application;

[0055] Figure 12 An application schematic diagram of a connecting piece provided for an embodiment of the present application;

[0056] Figure 13 Another structural schematic diagram of an electronic assembly provided for an embodiment of the present application;

[0057] Figure 14 Another structural schematic diagram of an electronic assembly provided for an embodiment of the present application;

[0058] Figure 15 Another structural schematic diagram of an electronic assembly provided for an embodiment of the present application;

[0059] Figure 16 Another structural schematic diagram of a heat dissipation device provided for an embodiment of the present application;

[0060] Figure 17An assembly schematic diagram of the heat dissipation device and the heat generating element provided for the embodiment of the present application;

[0061] Figure 18 Another structural schematic diagram of the heat dissipation device provided for the embodiment of the present application;

[0062] Figure 19 Another structural schematic diagram of the electronic assembly provided for the embodiment of the present application;

[0063] Figure 20 Another structural schematic diagram of the electronic assembly provided for the embodiment of the present application;

[0064] Figure 21 Another structural schematic diagram of the electronic assembly provided for the embodiment of the present application;

[0065] Figure 22 An arrangement schematic diagram of the flow guide pipe provided for the embodiment of the present application;

[0066] Figure 23 Another arrangement schematic diagram of the flow guide pipe provided for the embodiment of the present application;

[0067] Figure 24 An application schematic diagram of the flow guide pipe provided for the embodiment of the present application.

[0068] Reference signs:

[0069] 1 - intelligent module for vehicle; 2 - vehicle frame;

[0070] 3 - electronic assembly; 4 - shell;

[0071] 5 - heat generating element; 6 - heat dissipation device;

[0072] 7 - liquid cooling module; 7a - first liquid cooling module;

[0073] 7b - second liquid cooling module; 701 - flow channel;

[0074] 71 - base plate; 7101 - first surface;

[0075] 72 - top cover; 73 - first fin;

[0076] 74 - first heat conduction protrusion; 8 - connecting pipeline;

[0077] 9a - liquid inlet main pipe; 9b - liquid outlet main pipe;

[0078] 10a - liquid inlet branch pipe; 10b - liquid outlet branch pipe;

[0079] 11 - connecting piece; 1101 - first side;

[0080] 1102 - second side; 1103 - first protrusion;

[0081] 1104 - second protrusion; 12 - first circuit board;

[0082] 13 - first housing; 14 - first cover plate;

[0083] 1401 - extension; 15 - sealing member;

[0084] 16 - flexible member; 17 - first fixing member;

[0085] 18 - reinforcing plate; 19 - heat dissipation plate;

[0086] 20 - heat conduction pipe; 2001 - liquid inlet;

[0087] 2002 - liquid outlet; 201 - first part;

[0088] 2011 - first subpart; 2012 - second subpart;

[0089] 2013 - intermediate part; 202 - second part;

[0090] 203 - third part; 204 - fourth part;

[0091] 21 - second housing; 211 - middle frame;

[0092] 212 - back shell; 213 - second cover plate;

[0093] 22 - second heat conduction protrusion; 23 - second fin;

[0094] 24 - first electronic element; 25 - third heat conduction protrusion;

[0095] 26 - second circuit board; 27 - second reinforcing plate;

[0096] 28 - second fixing member; 29 - heat conduction adhesive. DETAILED DESCRIPTION

[0097] In order to make the purpose, technical scheme and advantages of the present application more clear, the present application will be further described in detail below with reference to the drawings. However, the example embodiments can be implemented in various forms, and should not be understood as being limited to the embodiments set forth herein. The same reference numerals in the drawings represent the same or similar structures, and thus repeated description thereof will be omitted. The expressions of position and direction described in the embodiments of the present application are described with reference to the drawings, but can be changed as needed, and the changes made are included in the scope of protection of the present application. The drawings of the embodiments of the present application are only used to illustrate the relative positional relationship and do not represent the true proportions.

[0098] It is to be understood that the details set forth herein do not construe a complete description of the application, but rather only a possible embodiment thereof. It will be apparent to those skilled in the art that various modifications can be made to the application as described herein, and embodiments incorporating only so much of the application as are necessary to realize the advantages thereof.

[0099] In order to facilitate the understanding of the technical solutions provided by the embodiments of the present application, the application scenario thereof will be introduced first. With the gradual maturity of automatic driving technology, the public's acceptance of automatic driving is getting higher and higher, thereby promoting the rapid development of automatic driving to a higher level. The rapid development of automatic driving cannot be separated from the improvement of chip computing power, and a large amount of heat is generated in the process of chip operation. If the heat cannot be dissipated in time, the chip may work in a high-temperature environment, thereby affecting the stable operation and service life of the chip.

[0100] In order to dissipate heat for the chip, in one prior art, a cold plate is arranged inside the vehicle, and the cold plate and the chip are connected through a heat-conducting material. The cold plate has a liquid inlet, a liquid outlet, and a liquid cooling flow channel communicating the liquid inlet and the liquid outlet, and the outside of the cold plate is provided with a liquid inlet pipeline and a liquid outlet pipeline, the liquid inlet pipeline is connected with the liquid inlet, and the liquid outlet pipeline is connected with the liquid outlet. The cooling liquid at low temperature enters the cold plate through the liquid inlet pipeline and flows along the liquid cooling flow channel, and the cooling liquid exchanges heat with the chip in the process of flowing through the liquid cooling flow channel, thereby dissipating heat for the chip. The temperature of the cooling liquid increases after exchanging heat with the chip, and is discharged through the liquid outlet pipeline. In the process of use of the above-mentioned cold plate, the cooling liquid is prone to leakage at the connection between the liquid inlet pipeline and the cold plate and at the connection between the liquid outlet pipeline and the cold plate. In addition, from the structure, the cold plate includes a base plate and a cover plate, and the base plate and the cover plate are welded and surround the above-mentioned liquid cooling flow channel. The cooling liquid passes through the weld between the base plate and the cover plate in the process of passing through the liquid cooling flow channel, and may leak at the weld. Once the cooling liquid leaks and flows to the surface of the circuit board carrying the chip, it will cause the circuit board to short circuit, thereby affecting the normal operation of the chip, causing the vehicle to malfunction during driving, and further causing a safety accident.

[0101] Therefore, the embodiments of the present application provide a heat dissipation device, an electronic assembly and a vehicle, which are used to reduce the risk of cooling liquid leaking to the circuit board in the process of dissipating heat for the chip, and improve the reliability of the electronic assembly and the vehicle. The structure of the heat dissipation device and the specific setting mode of the heat dissipation device in the electronic assembly and the vehicle will be described in detail below, so as to facilitate the understanding of the process of dissipating heat for the chip by the heat dissipation device.

[0102] Figure 1 A structural schematic diagram of the vehicle provided by the embodiments of the present application is shown in FIG. 1. Figure 1As shown in the figure, in an embodiment, the vehicle comprises an on-board intelligent module 1 and a vehicle frame 2, and the on-board intelligent module 1 is located in the vehicle frame 2. In the specific arrangement of the on-board intelligent module 1, the on-board intelligent module 1 comprises various types. For example, the on-board intelligent module 1 can be an on-board automatic driving module. For another example, the on-board intelligent module 1 can also be an on-board entertainment module. Different types of on-board intelligent modules 1 have corresponding functions. For example, the on-board intelligent module 1 is an on-board automatic driving module, which has the function of enabling the vehicle to automatically drive.

[0103] Figure 2 A structural diagram of an on-board intelligent module provided in an embodiment of the present application is shown in the figure. Figure 2 As shown in the figure, in an embodiment, the on-board intelligent module 1 comprises an electronic assembly 3 and a shell 4, and the electronic assembly 3 is located in the shell 4. The electronic assembly 3 comprises at least one electronic element, which can realize the function of the on-board intelligent module 1 when running, thereby improving the driving experience of the vehicle.

[0104] Figure 3 A structural diagram of an electronic assembly provided in an embodiment of the present application is shown in the figure. Figure 3 As shown in the figure, in an embodiment, the electronic assembly 3 comprises a plurality of heat generating elements 5. The heat generating elements 5 can be chips or other electronic elements. In addition to the heat generating elements 5, the electronic assembly 3 further comprises a heat dissipation device 6. The heat dissipation device 6 comprises a plurality of liquid cooling modules 7, and each liquid cooling module 7 is in thermal connection with at least one heat generating element 5. The plurality of liquid cooling modules 7 are arranged at intervals, and each liquid cooling module 7 has a flow channel 701 for circulating cooling liquid. The cooling liquid can exchange heat with the heat generating elements 5 during the flow in the flow channel 701, so as to reduce the temperature of the heat generating elements 5, thereby achieving the purpose of dissipating heat for the heat generating elements 5.

[0105] In the arrangement of the above-mentioned plurality of liquid cooling modules 7, various arrangement modes are included. Figure 4 An arrangement diagram of a liquid cooling module provided in an embodiment of the present application is shown in the figure. Figure 4 As shown in the figure, in an embodiment, the flow channels 701 of the plurality of liquid cooling modules 7 contained in the heat dissipation device 6 are sequentially communicated through a connecting pipeline 8. In other words, the above-mentioned plurality of liquid cooling modules 7 are connected in series through the connecting pipeline 8. During the heat dissipation process, the cooling liquid will flow through the above-mentioned plurality of liquid cooling modules 7 in sequence.

[0106] Figure 5 Another arrangement diagram of a liquid cooling module provided in an embodiment of the present application is shown in the figure. Figure 5As shown, in another embodiment, in addition to the liquid cooling module 7, the heat dissipation device 6 further comprises an inlet liquid main pipe 9a, an outlet liquid main pipe 9b, a plurality of inlet liquid branch pipes 10a and a plurality of outlet liquid branch pipes 10b. The flow channels 701 of the plurality of liquid cooling modules 7 comprised in the heat dissipation device 6 are respectively communicated through different inlet liquid branch pipes 10a and the inlet liquid main pipe 9a, and the flow channels 701 of the plurality of liquid cooling modules 7 are respectively communicated through different outlet liquid branch pipes 10b and the outlet liquid main pipe 9b. In other words, the plurality of liquid cooling modules 7 are connected in parallel between the inlet liquid main pipe 9a and the outlet liquid main pipe 9b. During heat dissipation, the cooling liquid in the inlet liquid main pipe 9a is divided into a plurality of substreams, which respectively enter the corresponding liquid cooling modules 7 to individually dissipate heat from the heat generating element 5. In a specific embodiment, the number of liquid cooling modules 7 is the same as the number of inlet liquid branch pipes 10a, and the number of liquid cooling modules 7 is also the same as the number of outlet liquid branch pipes 10b.

[0107] Referring to Figure 3 , Figure 4 and Figure 5 , in some embodiments, between any two adjacent liquid cooling modules 7 comprised in the heat dissipation device 6, a connecting piece 11 is arranged, the connecting piece 11 is connected to the side of the liquid cooling modules 7 facing the heat generating element 5, and the connecting piece 11 covers the gap between the two adjacent liquid cooling modules 7. In terms of material, the connecting piece 11 has waterproof property, and when the surface of the connecting piece 11 is in contact with the cooling liquid, the cooling liquid is not easy to penetrate the connecting piece 11. Optionally, the cooling liquid can be water or other liquid. In terms of structure, the connecting piece 11 has no hole and is relatively dense, so as to block the cooling liquid. The connecting piece 11 extends along the gap between the two adjacent liquid cooling modules 7, the length of the connecting piece 11 is greater than or equal to the length of the gap, and the width of the connecting piece 11 is greater than or equal to the width of the gap. If the stacking direction of the liquid cooling module 7 and the heat generating element 5 is defined as the second direction Y, the orthographic projection of the connecting piece 11 along the second direction Y completely covers the orthographic projection of the gap along the second direction Y. The two sides of the connecting piece 11 are respectively connected to the side of the adjacent liquid cooling modules 7 facing the heat generating element 5, so as to connect the two adjacent liquid cooling modules 7 into a whole. When the cooling liquid leaks, the connecting piece 11 can block the cooling liquid from flowing to the side where the heat generating element 5 is located through the gap, so as to reduce the risk of short circuit of the heat generating element 5 and improve the reliability of the electronic assembly 3 and the vehicle.

[0108] Figure 6 A structural schematic diagram of the heat dissipation device provided in the embodiments of the present application is shown in FIG. 2. Figure 6As shown, in an embodiment, the liquid cooling module 7 comprises a substrate 71, the substrate 71 is used to conductively connect with the heat-generating element 5, and the flow channel 701 of the liquid cooling module 7 is located on the side of the substrate 71 away from the heat-generating element 5. After the cooling liquid is introduced into the liquid cooling module 7, the cooling liquid flows along the flow channel 701 and passes through the surface of the substrate 71, and exchanges heat with the heat-generating element 5 through the substrate 71. For two adjacent liquid cooling modules 7, the two substrates 71 are also adjacent. Optionally, the orthographic projection of the liquid cooling module 7 along the second direction Y is completely coincident with the orthographic projection of the substrate 71 along the second direction Y, and the gap between the two adjacent liquid cooling modules 7 is the gap between the two substrates 71. In an embodiment, the connecting piece 11 is located between the two adjacent substrates 71, and the connecting piece 11 is directly connected with the two adjacent substrates 71 respectively. In the specific implementation of the above embodiment, the connecting piece 11 can be directly connected with the edges of the two adjacent substrates 71 respectively. The substrates 71 of the plurality of liquid cooling modules 7 included in the heat dissipation device 6 form an integral substrate after being connected by the connecting piece 11, the flow channel 701 is located on the side of the integral substrate away from the heat-generating element 5, and the integral substrate can form a barrier between the cooling liquid and the heat-generating element 5, thereby blocking the cooling liquid from flowing to the side where the heat-generating element 5 is located, thereby reducing the risk of short circuit of the heat-generating element 5 and improving the reliability of the electronic assembly 3 and the vehicle.

[0109] In a specific embodiment, the electronic assembly 3 further comprises a first circuit board, and the heat-generating element 5 is electrically connected to the first circuit board. The orthographic projection of the integral substrate along the second direction Y is greater than the orthographic projection of the first circuit board along the second direction Y, so that the cooling liquid flowing from the edge of the integral substrate is not easy to drop onto the surface of the first circuit board, thereby reducing the risk of the cooling liquid dropping onto the surface of the first circuit board, ensuring the normal operation of the heat-generating element 5, and improving the reliability of the electronic assembly 3 and the vehicle.

[0110] In the specific formation of the flow channel 701 of the liquid cooling module 7, there are various ways. For example, Figure 6As shown, in one embodiment, in addition to the substrate 71, the liquid cooling module 7 further comprises a top cover 72, which is located on the side of the substrate 71 away from the heat generating element 5, and the top cover 72 and the substrate 71 are connected by fastening and enclose the flow channel 701. In the specific implementation of the above embodiment, the top cover 72 is convex towards the side away from the substrate 71, thereby forming a convex bump having a cavity. After the top cover 72 and the substrate 71 are fastened, the convex bump and the substrate 71 enclose the flow channel 701. The surface of the convex bump has an inlet and an outlet, which are respectively in communication with the flow channel 701. In one specific embodiment, the area of the projection of the substrate 71 along the second direction Y is greater than the area of the projection of the top cover 72 along the second direction Y. By increasing the area of the substrate 71, the horizontal distance between the edge of the substrate 71 and the heat generating element 5 can be increased, thereby reducing the adverse effects of the cooling liquid remaining on the edge of the substrate 71 on the heat generating element 5, and ensuring the stable operation of the heat generating element 5.

[0111] In another embodiment, in addition to the substrate 71, the liquid cooling module 7 further comprises a metal pipe, at least part of the metal pipe is located on the surface of the substrate 71, and the internal passage of the metal pipe forms the flow channel 701. In order to facilitate processing, the metal pipe can be formed by combining multiple pipe sections, and adjacent two pipe sections can be welded, threadedly connected or connected through flanges.

[0112] Of course, in addition to the above two ways, the flow channel 701 of the liquid cooling module 7 can also be formed by other ways, which will not be listed one by one in this application.

[0113] Please continue to refer to Figure 6 In order to improve the heat exchange efficiency between the substrate 71 and the cooling liquid, in one embodiment, the surface of the substrate 71 has a plurality of first fins 73, which are arranged at intervals in the flow channel 701. The first fins 73 can increase the surface area of the substrate 71, thereby increasing the heat exchange area between the substrate 71 and the cooling liquid, and further improving the heat exchange efficiency between the substrate 71 and the cooling liquid. In addition to arranging the first fins 73 on the surface of the substrate 71, a plurality of convex bumps can also be arranged on the surface of the substrate 71, thereby achieving the above effect.

[0114] Figure 7 Another structural schematic view of the heat dissipation device provided in the embodiments of the present application is shown in Figure 7As shown, in one embodiment, the substrate 71 has a first surface 7101, which faces away from the heating element 5. The first surface 7101 is located between a first end and a second end of the substrate 71, wherein the first end is close to the connector 11 and the second end is away from the connector 11. From the first end to the second end, the distance from the first surface 7101 to the plane where the heating element 5 is located gradually decreases. Or, in other words, along the direction away from the connector 11, the distance from the first surface 7101 to the plane where the heating element 5 is located gradually decreases. That is, the first surface 7101 is inclined. When coolant leaks and flows to the first surface 7101, the coolant will flow along the first surface 7101 from the first end to the second end, thereby moving away from the connector 11, thus reducing the accumulation of coolant at the connector 11 and facilitating the drainage of leaked coolant.

[0115] In one specific embodiment, the heat dissipation device 6 includes a first liquid cooling module 7a and a second liquid cooling module 7b, which are adjacent to each other and each includes the aforementioned substrate 71. When coolant leaks from any of the liquid cooling modules 7 and flows to the first surface 7101 of the corresponding substrate 71, the coolant flows from the first end to the second end and eventually slides off from the second end, thereby reducing coolant accumulation at the connector 11. Optionally, a liquid collection tank is provided at the second end of the substrate 71. The liquid collection tank can collect the coolant and discharge it along a set flow path, thereby preventing coolant sliding off the edge of the substrate 71 from flowing around.

[0116] In order to achieve the aforementioned tilting effect on the first surface 7101, as follows: Figure 7 As shown, in one embodiment, the thickness of the substrate 71 is basically uniform. During installation, the substrate 71 is tilted slightly as a whole, so that the first surface 7101 is also tilted accordingly, and the distance from the first surface 7101 to the plane where the heating element 5 is located gradually decreases in the direction away from the connector 11.

[0117] In addition to adopting Figure 7 In addition to the aforementioned tilting effect, the method shown also includes other methods to give the first surface 7101 the tilting effect. Figure 8 Another schematic diagram of the heat dissipation device provided in the embodiments of this application is shown below. Figure 8 As shown, in another embodiment, the thickness of the substrate 71 gradually decreases along the direction away from the connector 11. Alternatively, the thickness of the substrate 71 gradually decreases from the first end to the second end. During installation, the side of the substrate 71 facing the heating element 5 is kept horizontal, thereby tilting the first surface 7101 and causing the distance from the first surface 7101 to the plane containing the heating element 5 to gradually decrease along the direction away from the connector 11.

[0118] In the specific fabrication of substrate 71, substrate 71 can be made of metal or alloy materials, thereby giving substrate 71 good thermal conductivity. The thickness of substrate 71 can be relatively thin to reduce production costs. Optionally, substrate 71 is a sheet metal part. During the process of heat generated by heating element 5 being conducted to coolant through substrate 71, due to the thinness of substrate 71, the heat conduction channels to the surroundings are narrow, resulting in a slower heat conduction speed and higher local temperatures on substrate 71. When coolant flows over the surface of substrate 71, some areas where coolant flows are at higher temperatures, while some areas are at lower temperatures, thus affecting the heat exchange effect between coolant and substrate 71.

[0119] To improve the above-mentioned situation, this application provides another heat dissipation device 6. Figure 9 This is a schematic diagram of the heat dissipation device, as shown below. Figure 9 As shown, in one embodiment, a first thermally conductive protrusion 74 is provided on the surface of the substrate 71 facing the heating element 5. The thermal conductivity of the first thermally conductive protrusion 74 is greater than or equal to the thermal conductivity of the substrate 71, and the first thermally conductive protrusion 74 is used for thermally conductive connection with the heating element 5. The first thermally conductive protrusion 74 widens the heat conduction channel, allowing heat to be conducted more quickly in a plane perpendicular to the thickness direction of the substrate 71 to all directions and to a larger area, thereby expanding the heat distribution range and improving the uniformity of heat distribution. Thus, when the coolant flows through different areas of the surface of the substrate 71, the coolant can absorb more heat per unit time, thereby improving the heat exchange effect between the coolant and the substrate 71, and further improving the cooling effect of the heating element 5.

[0120] When specifically configuring the first thermally conductive protrusion 74, the orthographic projection of the first thermally conductive protrusion 74 onto the plane of the substrate 71 is greater than or equal to the orthographic projection of the heating element 5 onto the plane of the substrate 71. This provides a larger contact area between the first thermally conductive protrusion 74 and the heating element 5, thereby facilitating further expansion of the heat conduction range and improving the heat exchange effect between the substrate 71 and the coolant. The first thermally conductive protrusion 74 can be an integral structure with the substrate 71, or it can be welded or bonded to the substrate 71. The first thermally conductive protrusion 74 can have various structural forms; for example, it can be a cylindrical structure, a prismatic structure, or an irregularly shaped structure.

[0121] When connecting the substrate 71 and the connector 11, the substrate 71 and the connector 11 can be welded, bonded, or formed as a single unit. In one embodiment, the substrate 71 and the connector 11 are formed as a single unit. That is, the substrate 71 of multiple liquid cooling modules 7 is formed as a single unit. Or, multiple liquid cooling modules 7 share a single substrate 71. This reduces the gaps between the substrate 71 and the connector 11, improves the sealing effect, and further reduces the risk of coolant flowing to the side where the heat-generating element 5 is located.

[0122] Figure 10 A schematic diagram of a connector provided in an embodiment of this application is shown below. Figure 10 As shown, in one embodiment, the connector 11 has a first side 1101 and a second side 1102 arranged along a first direction X, with the first side 1101 and the second side 1102 facing each other. The first side 1101 is connected to an adjacent liquid cooling module 7, and the second side 1102 is connected to another adjacent liquid cooling module 7. The connector 11 has elastic deformation capability along the first direction X. The connector 11 can extend outward, thereby increasing the distance between the first side 1101 and the second side 1102; the connector 11 can also retract inward, thereby decreasing the distance between the first side 1101 and the second side 1102. The connector 11 can connect two liquid cooling modules 7 with different spacings through deformation, exhibiting strong adaptability.

[0123] When specifically configuring the connector 11, the connector 11 can have various structural forms. For example... Figure 10 As shown, in one embodiment, the connector 11 includes a first protrusion 1103, which has two first walls disposed opposite to each other along the thickness direction of the connector 11. Both first walls protrude in a direction away from the heating element 5. From the appearance, the first protrusion 1103 forms a first cavity on the side facing the heating element 5. Figure 11 Another structural schematic diagram of the connector provided in the embodiments of this application is shown below. Figure 11As shown, in one embodiment, the connector 11 includes a second protrusion 1104. The second protrusion 1104 has two second walls disposed opposite to each other along the thickness direction of the connector 11, and both second walls protrude toward the heating element 5. Visually, the second protrusion 1104 forms a second cavity on the side away from the heating element 5. The connector 11 may include only the second protrusion 1104, or it may include both the first protrusion 1103 and the second protrusion 1104, thus exhibiting a serrated or wavy shape. In the above embodiments, the first protrusion 1103 and / or the second protrusion 1104 both constitute folds in the connector 11. Under compression, stretching, or other actions, both the first protrusion 1103 and the second protrusion 1104 can deform, thereby causing a change in the dimensions of the connector 11. For example, under compression, the first protrusion 1103 and the second protrusion 1104 can rise higher, thereby narrowing the connector 11, or in other words, reducing the size of the connector 11 along the first direction X. Under tension, the first protrusion 1103 and the second protrusion 1104 will extend to both sides and gradually become flatter, thereby widening the connector 11, or in other words, increasing the size of the connector 11 along the first direction X.

[0124] It is worth noting that, such as Figure 10 As shown, in this embodiment, the connector 11 includes a first protrusion 1103. The connector 11 has a relatively simple structure, is easy to process, and has low production costs. In addition, the surface of the connector 11 facing away from the heating element 5 is arched and has no recessed areas, which prevents coolant from accumulating in the aforementioned recessed areas. This facilitates the flow of coolant away from the connector 11, thereby allowing the coolant to be discharged or recovered.

[0125] In the specific fabrication of the connector 11, the connector 11 can be made flexible due to the special design of the material, thereby possessing elastic deformation capability. For example, the connector 11 is a component made of a flexible material. Optionally, the flexible material can be rubber. The connector 11 is soft in texture, and in specific applications, the connector 11 can be in an extended state or a wrinkled state. The connector 11 can also be made flexible due to the special design of its structure, thereby allowing it to deform. For example, the connector 11 is in the shape of a thin plate and has wrinkles. Under the action of external force, the connector 11 can be further compressed or extended outward. Optionally, the connector 11 can be formed by bending.

[0126] Figure 12 This is a schematic diagram illustrating an application of the connector provided in an embodiment of this application, such as... Figure 12As shown, in one embodiment, the electronic component 3 includes a first circuit board 12 and a plurality of heating elements 5, which are disposed on the same side of the first circuit board 12. A liquid cooling module 7 and the heating elements 5 are stacked along a second direction Y, and the liquid cooling module 7 is thermally connected to the heating elements 5 through a thermally conductive material. The second direction Y is perpendicular to the plane containing the first circuit board 12. Due to manufacturing tolerances, the thickness of the plurality of heating elements 5 varies. Using the plane containing the first circuit board 12 as a reference plane, when the liquid cooling modules 7 corresponding to the plurality of heating elements 5 are all at the same height, there may be excessive compression between some liquid cooling modules 7 and the heating elements 5, which could lead to the heating elements 5 being damaged; conversely, there may be insufficient compression between some liquid cooling modules 7 and the heating elements 5, resulting in a thicker thermally conductive material between them, affecting the heat conduction effect. Therefore, when installing the liquid cooling module 7, the height of the liquid cooling module 7 from the plane of the first circuit board 12 should be matched with the thickness of the heating element 5, so that each liquid cooling module 7 can maintain close contact with the heating element 5 without causing excessive compression to the heating element 5 and damaging it.

[0127] In specific implementation, for two adjacent liquid cooling modules 7, the connector 11 can adjust the height of these two liquid cooling modules 7 from the plane of the first circuit board 12 by deformation. This ensures that the height of the liquid cooling module 7 from the plane of the first circuit board 12 is adapted to the thickness of the heating element 5, thereby allowing each liquid cooling module 7 to maintain appropriate compression with the corresponding heating element 5. In other words, the connector 11, through deformation, can maintain close contact between the liquid cooling module 7 and the heating element 5, thereby improving heat conduction efficiency, without causing excessive compression of the heating element 5 by the liquid cooling module 7 and damaging the heating element 5.

[0128] The electronic component 3 employing the aforementioned heat dissipation device 6 includes various structural forms. Figure 3 The electronic component shown is one of them. Besides Figure 3 In addition to the structural forms shown, electronic component 3 also includes other structural forms. Figure 13 Another structural schematic diagram of the electronic component provided in the embodiments of this application is shown below. Figure 13As shown, in one embodiment, the electronic component 3 further includes a first housing 13, within which the heating element 5 is located. The first housing 13 serves to protect the heating element 5 from external impacts. For example, the first housing 13 can reduce the adverse effects of dust and moisture from the external environment on the heating element 5; it can also reduce damage to the heating element 5 under conditions of vibration or collision. The first housing 13 has an opening, and the multiple liquid cooling modules 7 included in the heat dissipation device 6 are located at the top of the opening. These multiple liquid cooling modules 7 are connected by the connector 11 to form an integral structure that covers the opening. When coolant leaks, the coolant is less likely to flow into the first housing 13 through the gap between adjacent liquid cooling modules 7 or through the opening, thus reducing the risk of coolant leakage into the first housing 13, ensuring the normal operation of the heating element 5, and improving the reliability of the electronic component 3 and the vehicle.

[0129] Figure 14 Another structural schematic diagram of the electronic component provided in the embodiments of this application is shown below. Figure 14 As shown, in one embodiment, the heat dissipation device 6 includes a plurality of liquid cooling modules 7. The substrate 71 of each liquid cooling module 7 forms a first cover plate 14 under the connection of the connector 11. The first cover plate 14 is located at the top of the opening and covers the opening. The area of ​​the first cover plate 14 projected onto the plane of the opening is greater than or equal to the area of ​​the opening. After the first cover plate 14 covers the opening, it can completely seal the opening. The flow channel 701 is located on the side of the first cover plate 14 away from the heat-generating element 5, and the first cover plate 14 does not have a hole communicating with the inner cavity of the first housing 13. When coolant leaks, the first cover plate 14 can form a barrier between the coolant and the heat-generating element 5, thereby preventing the coolant from flowing into the interior of the first housing 13, thus reducing the risk of short circuit in the heat-generating element 5 and improving the reliability of the electronic components 3 and the vehicle.

[0130] To further reduce the risk of coolant leakage into the first housing 13, such as Figure 14 As shown, in one embodiment, a sealing element 15 is provided between the first cover plate 14 and the first housing 13. The sealing element 15 can seal the gap between the first cover plate 14 and the first housing 13, preventing coolant from leaking into the interior of the first housing 13 through the gap. The sealing element 15 can also prevent dust, moisture, etc. from the external environment from entering the first housing 13, thereby reducing the external influence on the heating element 5 and other electronic components inside the first housing 13. In specific installation of the sealing element 15, the sealing element 15 can be a sealing gasket, sealant, or foam.

[0131] In addition to using seal 15 to further reduce the risk of coolant leakage into the first housing 13, other methods are also included. Please refer to [link / reference needed]. Figure 14 In one embodiment, the first cover plate 14 has an extension 1401, which forms an annular shape and extends beyond the exterior of the first housing 13. Alternatively, the orthographic projection of the extension 1401 onto the plane of the opening surrounds the outer periphery of the orthographic projection of the first housing 13 onto the plane of the opening. Considering the orthographic projections of the entire first cover plate 14 and the first housing 13 onto the plane of the opening, the area of ​​the orthographic projection of the entire first cover plate 14 onto the plane of the opening is larger than the area of ​​the orthographic projection of the first housing 13 onto the plane of the opening, and the orthographic projection of the entire first cover plate 14 onto the plane of the opening completely covers the orthographic projection of the first housing 13 onto the plane of the opening. That is, the circumferential edge of the orthographic projection of the entire first cover plate 14 onto the plane of the opening is located on the outer periphery of the circumferential edge of the orthographic projection of the first housing 13 onto the plane of the opening. In the above embodiment, when coolant flows to the edge of the first cover plate 14, the coolant will drip onto the exterior of the first housing 13, thereby reducing the risk of coolant flowing into the first housing 13.

[0132] Among the multiple liquid cooling modules 7 included in the heat dissipation device 6, the liquid cooling module 7 located at the edge is located above the side wall of the first housing 13. During installation, when adjusting the height of the liquid cooling module 7 from the surface of the first circuit board 12, the liquid cooling module 7 may be restricted by the first housing 13, thus preventing the liquid cooling module 7 from moving to the required height from the surface of the first circuit board 12, thereby affecting the heat exchange effect between the liquid cooling module 7 and the heat-generating element 5.

[0133] To improve the above situation Figure 15 Another schematic diagram of the electronic component structure is shown, such as... Figure 15 As shown, in one embodiment, a flexible member 16 is provided between the substrate 71 of the liquid cooling module 7 located at the edge and the first housing 13. When the flexible member 16 is further compressed, the liquid cooling module 7 can move closer to the first circuit board 12. When the flexible member 16 expands, the liquid cooling module 7 can move away from the first circuit board 12. In other words, the flexible member 16, through deformation, allows the liquid cooling module 7 to have a certain amount of floating relative to the first housing 13, thereby allowing the height of the liquid cooling module 7 from the surface of the first circuit board 12 to match the thickness of the heating element 5, thus creating a moderate compression between the liquid cooling module 7 and the heating element 5. That is, the liquid cooling module 7 can maintain close contact with the heating element 5, thereby improving heat conduction efficiency, without causing excessive compression and damage to the heating element 5.

[0134] In the specific fabrication of the flexible component 16, the flexible component 16 can be made of flexible foam or rubber. As for rubber, it not only gives the flexible component 16 flexibility but also a sealing effect.

[0135] When specifically fixing the liquid cooling module 7, such as Figure 15 As shown, in one embodiment, the liquid cooling module 7 is fixed to the first circuit board 12 by the first fixing member 17. During installation, the height of each liquid cooling module 7 from the plane of the first circuit board 12 can be adapted to the thickness of the heating element 5, thereby maintaining a moderate compression between each liquid cooling module 7 and the heating element 5. Furthermore, during installation, the connector 11 can deform to accommodate the height difference between two adjacent liquid cooling modules 7.

[0136] In one embodiment, the first fixing member 17 includes a screw and a spring. The screw connects the liquid cooling module 7 and the first circuit board 12. The spring is sleeved on the outside of the screw, with one end pressing against the head of the screw and the other end pressing against the first circuit board 12. The longer the spring, the smaller the height of the liquid cooling module 7 from the plane of the first circuit board 12. Conversely, the shorter the spring, the greater the height of the liquid cooling module 7 from the plane of the first circuit board 12. Because the length of the spring is variable, the height of the liquid cooling module 7 from the plane of the first circuit board 12 is variable, thus allowing the liquid cooling module 7 to float. During installation, the connecting member 11 can deform accordingly with the floating of the liquid cooling module 7. Ultimately, each liquid cooling module 7 has a suitable height from the plane of the first circuit board 12, thereby maintaining appropriate compression between it and the corresponding heating element 5.

[0137] In one application scenario, the aforementioned electronic component 3 is used in a vehicle. When the vehicle experiences significant vibration, the liquid cooling module 7 will also frequently vibrate up and down. In this case, the connector 11 will deform along with the vibration of the liquid cooling module 7. However, in this scenario, the connector 11 can still prevent coolant from leaking into the first housing 13 through the gap between two adjacent liquid cooling modules 7, reducing the risk of coolant entering the first housing 13, ensuring the normal operation of the heating element 5, and thus maintaining high reliability for both the electronic component 3 and the vehicle.

[0138] Because the first circuit board 12 bears the weight of the liquid cooling module 7, it is prone to denting towards the bottom of the first housing 13. To mitigate this, as... Figure 15As shown, in one embodiment, a first reinforcing plate 18 is provided on the side of the first circuit board 12 facing away from the heating element 5. When fixing the liquid cooling module 7, one end of the first fixing member 17 is connected to the liquid cooling module 7, and the other end of the first fixing member 17 passes through the first circuit board 12 and is connected to the first reinforcing plate 18. The first reinforcing plate 18 is made of a relatively hard material, which can provide support on the side of the first circuit board 12 facing away from the liquid cooling module 7, preventing the first circuit board 12 from denting towards the bottom of the first housing 13, thereby reducing the risk of deformation of the first circuit board 12 and ensuring a reliable connection between the first circuit board 12 and the heating element 5.

[0139] Please continue to refer to this. Figure 15 In one embodiment, the liquid cooling module 7 includes a substrate 71, which is connected to a first circuit board 12 via a first fastener 17. Furthermore, a connecting boss is provided on the surface of the substrate 71 facing the first circuit board 12, and a screw passes through the first circuit board 12 and is fixed to the connecting boss. The end of the screw is located within the connecting boss and does not protrude from the surface of the substrate 71. That is, the screw does not damage the integrity of the substrate 71 surface and does not create holes on the surface of the substrate 71 that could lead to coolant leakage.

[0140] In the above embodiments, the heat dissipation device 6 fills the gap between two adjacent liquid cooling modules 7 through the connector 11, thereby preventing the risk of coolant leaking from the gap to the surface of the heat-generating element 5, ensuring the normal operation of the heat-generating element 5, and improving the reliability of the electronic components 3 and the vehicle. In addition, other methods can be used to achieve the above effects. For example, when setting up the heat dissipation device 6, the risk of coolant leakage can be reduced by minimizing defects such as gaps in the heat dissipation device 6, thereby achieving the above effects. Specific embodiments will be described in detail below.

[0141] Figure 16 This is another schematic diagram of the heat dissipation device provided in the embodiments of this application. Figure 17 This is a schematic diagram of an assembly of the heat dissipation device and the heat-generating element, as shown below. Figure 16 and Figure 17 As shown, in some embodiments, the heat dissipation device includes a heat sink 19 and a guide pipe 20. The heat sink 19 is used for thermally conductive connection with the heating element 5. In application, the heat sink 19 can be thermally connected to one heating element 5 or to multiple heating elements 5 simultaneously, depending on the actual situation. The guide pipe 20 is used to transport coolant, and at least a portion of the guide pipe 20 is thermally connected to the heat sink 19. During the flow of the coolant through the guide pipe 20, heat exchange occurs between the coolant and the heat sink 19 through the pipe wall of the guide pipe 20, and the heat sink 19 then exchanges heat with the heating element 5, thereby lowering the temperature of the heating element 5 and achieving the purpose of heat dissipation for the heating element 5.

[0142] In specific configurations, the heat sink 19 can have various structural forms. In one embodiment, the heat sink 19 is a single-layer plate-like structure, with the heat guide pipe 20 located on the surface of the heat sink 19 facing away from the heat-generating element 5. In another embodiment, the heat sink 19 includes a first substrate and a second substrate, which are stacked together. The heat guide pipe 20 is located between the first substrate and the second substrate and is thermally connected to both the first substrate and the second substrate. This application uses the heat sink 19 of the first embodiment described above as an example for specific illustration.

[0143] The number of heat sinks 19 can be one or more. In the scenario where there are multiple heat sinks 19, the multiple heat sinks 19 can share a single heat pipe 20, that is, the multiple heat sinks 19 are thermally connected to different parts of the same heat pipe 20. Alternatively, the multiple heat sinks 19 can also be thermally connected to different heat pipes 20.

[0144] In the specific fabrication of the heat sink 19, the heat sink 19 can be made of a metallic material with excellent thermal conductivity. Optionally, the metallic material can be copper or aluminum. Alternatively, the heat sink 19 can also be made of a non-metallic material with excellent thermal conductivity. Optionally, the non-metallic material can be ceramic.

[0145] In the specific thermally conductive connection between the heat sink 19 and the heating element 5, there are multiple connection methods. In one connection method, the heat sink 19 and the heating element 5 are in direct contact, so that the heat generated by the heating element 5 is directly transferred to the heat sink 19. In another connection method, thermally conductive materials such as thermally conductive adhesive or thermally conductive pads are provided between the heat sink 19 and the heating element 5, so that the heat generated by the heating element 5 is indirectly transferred to the heat sink 19 through the thermally conductive materials.

[0146] When specifically setting up the flow guide pipe 20, it is a single, continuous pipe, not a pipe formed by assembling multiple pipe sections together through welding, threaded connections, or flange connections. The flow guide pipe 20 can be a metal pipe, for example, a copper or aluminum pipe. In addition to metal pipes, the flow guide pipe 20 can also be a non-metallic pipe, for example, a plastic pipe.

[0147] In one embodiment, the guide tube 20 is flexible and easily bends and deforms. Optionally, the guide tube 20 can be a plastic flexible tube or an aluminum tube. During installation, the guide tube 20 can be bent and deformed to adapt to the position of the heat sink 19, so that the heat sink 19 can be in close contact with the heating element 5.

[0148] Please continue to refer to this. Figure 16In one embodiment, the guide pipe 20 has an inlet 2001 and an outlet 2002, which are respectively used to connect to an external pipeline. The guide pipe 20 includes a first portion 201 located between the inlet 2001 and the outlet 2002. The orthographic projection of the first portion 201 onto the plane of the heat sink 19 is at least partially located within the heat sink 19, and the first portion 201 and the heat sink 19 are thermally connected. Alternatively, the first portion 201 passes through the heat sink 19, and the wall of the first portion 201 is in contact with the heat sink 19. During the flow of the coolant through the first portion 201, heat exchange occurs between the coolant and the heat sink 19 via the wall of the first portion 201, and the heat sink 19 then exchanges heat with the heating element 5. After the coolant passes through the first portion 201, the temperature of the heating element 5 decreases, and the temperature of the coolant increases, thereby achieving the purpose of dissipating heat from the heating element 5. Since the guide pipe 20 is a single tube without any internal seams, the risk of coolant leakage when flowing through the guide pipe 20 is low, thereby reducing the risk of short circuits in the circuit board and heat-generating element 5, and thus improving the reliability of electronic components and the vehicle.

[0149] When specifically setting the first part 201, the number of first parts 201 can be one or multiple. For example... Figure 16 As shown, in one embodiment, the guide pipe 20 includes a plurality of first portions 201, which are arranged sequentially and connected along the extending direction of the guide pipe 20, so that the coolant can flow through the plurality of first portions 201 sequentially during the flow of the guide pipe 20. Correspondingly, the heat dissipation device also includes a plurality of heat dissipation plates 19, which are arranged at intervals and share the guide pipe 20. Each first portion 201 and a heat dissipation plate 19 are thermally connected.

[0150] The first part 201 can have various structural forms. For example, in one structural form, the first part 201 is a strip structure. The first part 201 can extend along a straight line or along a curve. Optionally, the curve can be a U-shaped curve or a serpentine curve. As another example, in another structural form, the first part 201 can also be a circular, elliptical, or polygonal structure.

[0151] To improve the heat exchange efficiency between the coolant and the heat sink 19, such as Figure 16 As shown, in one embodiment, the first portion 201 is a strip structure, and the first portion 201 extends along a serpentine curve. In the above embodiment, the first portion 201 has a relatively long length and a large surface area, thus the heat exchange area between it and the heat sink 19 is also large, thereby improving the heat exchange effect between the coolant and the heat sink 19.

[0152] Besides increasing the length of the first portion 201 to increase the heat exchange area between the first portion 201 and the heat sink 19, thereby improving the heat exchange effect between the coolant and the heat sink 19, the above-mentioned objective can also be achieved in other ways. For example, compared to other parts of the guide tube 20 located outside the heat sink 19, the cross-sectional area of ​​the first portion 201 can be increased to correspondingly increase the surface area of ​​the first portion 201, thereby increasing the heat exchange area between the first portion 201 and the heat sink 19.

[0153] Figure 18 This is another schematic diagram of the heat dissipation device provided in an embodiment of this application. In this heat dissipation device, the guide pipe 20 improves the heat exchange effect between the coolant and the heat sink 19 by increasing the cross-sectional area of ​​the first portion 201. Specifically, as shown... Figure 18 As shown, in one embodiment, in addition to the first part 201, the guide pipe 20 also includes a second part 202. The second part 202 is located outside the heat sink 19, and the wall of the second part 202 does not contact the heat sink 19. That is, no heat exchange occurs between the second part 202 and the heat sink 19. The first part 201 and the second part 202 are different parts of the same guide pipe 20, and the cross-sectional area of ​​the first part 201 is larger than the cross-sectional area of ​​the second part 202. In a specific embodiment, the guide pipe 20 includes multiple first parts 201 and multiple second parts 202, which are alternately arranged along the extension direction of the guide pipe 20, and each first part 201 has a second part 202 at each end.

[0154] In implementing the above embodiments, the height of the first part 201 and the height of the second part 202 can be equal or approximately equal, and the width of the first part 201 can be greater than the width of the second part 202, thereby making the cross-sectional area of ​​the first part 201 greater than the cross-sectional area of ​​the second part 202. The "height" refers to the dimension of the flow tube 20 in the direction perpendicular to the plane of the heat sink 19, and the "width" refers to the dimension of the flow tube 20 in the direction perpendicular to its own centerline and parallel to the plane of the heat sink 19.

[0155] Please continue to refer to this. Figure 18In one embodiment, the first portion 201 includes a first sub-portion 2011 and a second sub-portion 2012, located at opposite ends of the first portion 201. The first sub-portion 2011 is closer to the inlet 2001, while the second sub-portion 2012 is farther from the inlet 2001. Along the direction from the inlet 2001 to the outlet 2002, the cross-sectional area of ​​the first sub-portion 2011 gradually increases, while the cross-sectional area of ​​the second sub-portion 2012 gradually decreases. The first sub-portion 2011 is located at the inlet end of the first portion 201. After the coolant enters the first sub-portion 2011, the flow area of ​​the coolant gradually increases, and it flows towards the center of the first portion 201. The first sub-portion 2011 acts as a guide at the inlet end of the first portion 201, preventing coolant from stagnating there. The second sub-section 2012 is located at the outlet end of the first section 201. After the coolant enters the second sub-section 2012, the flow area of ​​the coolant gradually decreases, and it eventually flows out of the first section 201. The second sub-section 2012 acts as a guide at the outlet end of the first section 201, making it less likely for the coolant to stagnate at the outlet end of the first section 201. Thus, guided by the first sub-section 2011 and the second sub-section 2012, the coolant can pass smoothly through the first section 201 and is less likely to stagnate there, thereby improving the heat exchange effect between the coolant and the heating element 5.

[0156] In one specific embodiment, along the direction from the inlet 2001 to the outlet 2002, the width of the first sub-part 2011 gradually increases, while the width of the second sub-part 2012 gradually decreases. An intermediate part 2013, with a constant width, is also provided between the first sub-part 2011 and the second sub-part 2012. Visually, the first sub-part 2011, the intermediate part 2013, and the second sub-part 2012 combine to form a polygonal structure.

[0157] There are several assembly methods for assembling the heat pipe 20 and the heat sink 19. In one embodiment, the surface of the heat sink 19 has a first groove, and the first part 201 of the heat pipe 20 is located in the first groove. On the one hand, the first groove can increase the heat exchange area between the first part 201 and the heat sink 19, thereby improving the heat exchange efficiency. On the other hand, the first groove can limit the first part 201, improving the fixing effect of the first part 201. In the specific implementation of the above embodiment, the first part 201 can be directly snapped into the first groove, or thermally conductive adhesive can be applied to the outer wall of the first part 201 and / or the inner wall of the first groove firstly, and then the first part 201 can be placed in the first groove. In another embodiment, the surface of the heat sink 19 is flat, and the first part 201 of the heat pipe 20 is directly bonded to the surface of the heat sink 19 by thermally conductive adhesive.

[0158] When specifically setting the first groove, the shape of the first groove is the same as the shape of the first part 201. For example, as shown... Figure 16 As shown, in one embodiment, the first portion 201 is strip-shaped and extends along a serpentine curve; correspondingly, the first groove is also strip-shaped and extends along a serpentine curve. For example, as... Figure 18 As shown, in another embodiment, the first portion 201 is polygonal, and correspondingly, the first groove is also polygonal.

[0159] Figure 19 Another structural schematic diagram of the electronic component provided in the embodiments of this application is shown below. Figure 19 As shown, in one embodiment, the electronic component 3 further includes a second housing 21, and the heating element 5 is located inside the second housing 21. The second housing 21 serves to protect the heating element 5 from the outside. For example, the second housing 21 can reduce the adverse effects of dust and moisture in the external environment on the heating element 5; and for example, the second housing 21 can also reduce the damage to the heating element 5 in scenarios such as vibration and collision.

[0160] When the aforementioned heat dissipation device 6 is installed on the second housing 21, in one embodiment, the inlet 2001 and outlet 2002 are located outside the second housing 21. That is, the connection between the guide pipe 20 and the external pipeline is located outside the second housing 21. Thus, even if coolant leaks at the connection between the guide pipe 20 and the external pipeline, the leaked coolant has a smaller impact on the heating element 5 inside the second housing 21, thereby further reducing the risk of short circuits in the circuit board and the heating element 5, and improving the reliability of electronic components and the vehicle.

[0161] To further improve the heat dissipation effect of heat-generating element 5, such as Figure 19 As shown, in one embodiment, the inner wall of the second housing 21 has a second thermally conductive protrusion 22, which is thermally connected to the heat sink 19. This allows a portion of the heat generated by the heating element 5 to be transferred to the second housing 21 through the heat sink 19 and the second thermally conductive protrusion 22. The second housing 21 achieves heat dissipation for the heating element 5 by exchanging heat with the external environment. Therefore, in the above embodiment, the heating element 5 includes two heat dissipation paths: one path is: heating element 5 - heat sink 19 - coolant; the other path is: heating element 5 - heat sink 19 - second thermally conductive protrusion 22 - second housing 21. The heat generated by the heating element 5 can be conducted outward through these two heat dissipation paths, thereby improving the heat dissipation effect of the heating element 5.

[0162] When specifically configuring the second heat-conducting protrusion 22, the second heat-conducting protrusion 22 can be an integral structure with the second housing 21. Alternatively, the second heat-conducting protrusion 22 can be welded or bonded to the second housing 21. The second heat-conducting protrusion 22 has good thermal conductivity; optionally, the thermal conductivity of the second heat-conducting protrusion 22 is greater than or equal to the thermal conductivity of the second housing 21. The orthographic projection of the second heat-conducting protrusion 22 onto the plane of the heat sink 19 is greater than or equal to the orthographic projection of the heating element 5 onto the plane of the heat sink 19, thus enabling the second heat-conducting protrusion 22 to conduct the heat generated by the heating element 5 to a larger area. The second heat-conducting protrusion 22 can have various structural forms; for example, the second heat-conducting protrusion 22 can be a cylindrical structure, a prismatic structure, or an irregular shape.

[0163] Please continue to refer to this. Figure 19 In one embodiment, the second housing 21 has a plurality of second fins 23 on the side surface opposite to the second heat-conducting protrusion 22, and the plurality of second fins 23 are arranged at intervals. The second fins 23 can increase the surface area of ​​the second housing 21, thereby increasing the heat exchange area between the second housing 21 and the external environment, and thus improving the heat dissipation effect of the heating element 5.

[0164] When specifically setting the second housing 21, the structure of the second housing 21 includes various forms. Figure 20 Another structural schematic diagram of the electronic component provided in the embodiments of this application is shown below. Figure 20 As shown, in one embodiment, the second housing 21 includes a middle frame 211, a rear housing 212, and a second cover plate 213. The middle frame 211 is located between the rear housing 212 and the second cover plate 213, with the middle frame 211 and the rear housing 212 forming a first receiving cavity, and the middle frame 211 and the second cover plate 213 forming a second receiving cavity. The middle frame 211 can be used to fix some electronic components, while the rear housing 212 and the second cover plate 213 on both sides of the middle frame 211 serve to provide waterproofing and dustproofing.

[0165] When the heating element 5 and the heat dissipation device 6 are arranged in the second housing 21, as follows: Figure 20As shown, in one embodiment, the heating element 5 is located in the first receiving cavity. In addition to the heating element 5, the first receiving cavity also houses a second circuit board 26, to which the heating element 5 is electrically connected. The second circuit board 26 can be fixed to the middle frame 211 or the rear shell 212. The middle frame 211 has a hollow structure, within which a heat sink 19 is located, and the heat sink 19 is connected to the second circuit board 26 via a second fixing member 28. Optionally, the second fixing member 28 includes screws. A guide tube 20 is located in the second receiving cavity, and a portion of the guide tube 20 passes through and contacts the heat sink 19. The inlet 2001 and outlet 2002 of the guide tube 20 extend from the second receiving cavity. Since the guide pipe 20 is a single pipe and the liquid inlet 2001 and liquid outlet 2002 of the guide pipe 20 are located outside the second housing 21, the risk of coolant leakage during the flow of the guide pipe 20 is low. Therefore, when installing the heat sink 19, there is no need to install a seal between the heat sink 19 and the middle frame 211, which simplifies the structure.

[0166] The second circuit board 26 serves as a support below the heat sink 19 and bears the weight of the heat sink 19. During use, the second circuit board 26 is prone to denting downwards, thus deforming. To reduce the risk of deformation of the second circuit board 26, such as... Figure 20 As shown, in one embodiment, a second reinforcing plate 27 is provided on the side of the second circuit board 26 away from the heating element 5. The second reinforcing plate 27 is made of a relatively hard material and can provide support on the side of the second circuit board 26 away from the heat sink 19, preventing the second circuit board 26 from sinking downward, thereby reducing the risk of deformation of the second circuit board 26 and ensuring a reliable connection between the second circuit board 26 and the heating element 5.

[0167] When the second thermally conductive protrusion 22 is provided in the second housing 21 to further improve the heat dissipation effect of the heat-generating element 5, such as Figure 20 As shown, in one embodiment, the second heat-conducting protrusion 22 is located on the side surface of the second cover plate 213 facing the middle frame 211. That is, a portion of the heat generated by the heating element 5 can be transferred to the second cover plate 213 through the heat sink 19 and the second heat-conducting protrusion 22. The second cover plate 213 achieves heat dissipation for the heating element 5 through heat exchange with the external environment. To enhance the heat dissipation capacity of the second cover plate 213, the side surface of the second cover plate 213 facing away from the middle frame 211 also has multiple second fins 23. The second fins 23 increase the surface area of ​​the second cover plate 213, thereby increasing the heat exchange area between the second cover plate 213 and the external environment, and thus improving the heat dissipation effect of the heating element 5.

[0168] In the above embodiments, since the second cover plate 213 has a heat dissipation function, a material with good thermal conductivity can be selected for its fabrication. The second cover plate 213 and the middle frame 211 can be made of the same material or different materials. Similarly, the second cover plate 213 and the rear shell 212 can be made of the same material or different materials.

[0169] As shown above, the middle frame 211 can be used to fix some electronic components, such as the second circuit board 26. In addition to the second circuit board 26, the middle frame 211 can also fix other electronic components. Figure 21 Another structural schematic diagram of the electronic component provided in the embodiments of this application is shown below. Figure 21 As shown, in one embodiment, the electronic component further includes a first electronic element 24, which is fixed to the middle frame 211. Optionally, the first electronic element 24 can be soldered or glued to the middle frame 211, or it can be fixed to the middle frame 211 by screws. Similar to the heating element 5, the first electronic element 24 also generates heat during operation. Since the first electronic element 24 is fixed to the middle frame 211, the heat generated by the first electronic element 24 can be conducted to the middle frame 211 and dissipated outward through the middle frame 211.

[0170] To improve the heat dissipation effect of the first electronic component 24, such as Figure 21 As shown, in one embodiment, the second cover plate 213 has a third thermally conductive protrusion 25 on the side facing the middle frame 211. The third thermally conductive protrusion 25 is thermally connected to the middle frame 211, so that the heat generated by the first electronic component 24 can be conducted to the second cover plate 213 through the middle frame 211 and the third thermally conductive protrusion 25. The second cover plate 213 achieves the effect of heat dissipation for the electronic component by exchanging heat with the external environment.

[0171] When specifically configuring the third thermally conductive protrusion 25, the third thermally conductive protrusion 25 can be an integral structure with the second cover plate 213. Alternatively, the third thermally conductive protrusion 25 can also be welded or bonded to the second cover plate 213. The third thermally conductive protrusion 25 has good thermal conductivity; optionally, the thermal conductivity of the third thermally conductive protrusion 25 is greater than or equal to the thermal conductivity of the second cover plate 213. The third thermally conductive protrusion 25 includes various structural forms; for example, the third thermally conductive protrusion 25 can be cylindrical, prismatic, or irregularly shaped.

[0172] When the guide pipe 20 is arranged in the second housing 21, there are various arrangement methods. Figure 22 This is a schematic diagram of an arrangement of the guide tube provided in an embodiment of this application, such as... Figure 22As shown, in one embodiment, in addition to the first part 201, the guide pipe 20 also includes a third part 203. The third part 203 is located outside the heat sink 19, and the wall of the third part 203 does not contact the heat sink 19. The third part 203 is located inside the second housing 21, and the third part 203 and the second housing 21 are thermally connected. That is, the third part 203 is in contact with the second housing 21, and heat exchange can occur between the third part 203 and the second housing 21.

[0173] Specifically implementing the above embodiments, such as Figure 22 As shown, the third part 203 can be bonded to the surface of the second housing 21 using thermally conductive adhesive 29. Alternatively, the inner wall of the second housing 21 may be provided with a second groove, in which the third part 203 is engaged, or bonded to the second groove using thermally conductive adhesive 29. The second groove can limit the position of the third part 203, improving its fixation.

[0174] In one specific embodiment, the third part 203 is thermally connected to the middle frame 211 of the second housing 21. In one application scenario, the coolant temperature is low, and the coolant exchanges heat with the middle frame 211 during its flow through the third part 203, causing the temperature of the middle frame 211 to decrease. The middle frame 211 then exchanges heat with the first electronic component 24, thereby achieving the effect of heat dissipation for the first electronic component 24. In another application scenario, the coolant temperature is high, and the coolant exchanges heat with the middle frame 211 during its flow through the third part 203, causing its own temperature to decrease. In another specific embodiment, the third part 203 is thermally connected to the cover plate in the second housing 21, allowing the coolant to exchange heat with the cover plate during its flow through the third part 203.

[0175] In the specific configuration of the third part 203, the third part 203 can be directly connected to the first part 201, or the third part 203 and the first part 201 can be indirectly connected by other parts of the guide pipe 20. The third part 203 and the second part 202 described above can be the same pipe section, or the third part 203 and the second part 202 described above contain the same pipe section, or the third part 203 and the second part 202 described above are different pipe sections.

[0176] Figure 23 This is a schematic diagram of another arrangement of the guide tube provided in an embodiment of this application, as shown below. Figure 23As shown, in one embodiment, in addition to the first part 201, the heat pipe 20 also includes a fourth part 204. The fourth part 204 is located outside the heat sink 19, and the wall of the fourth part 204 does not contact the heat sink 19. The fourth part 204 is adjacent to and connected to the first part 201, and the fourth part 204 is suspended within the second housing 21. Compared with the third part 203, the fourth part 204 will not be stuck in the second groove on the surface of the second housing 21, nor will it be bonded to the surface of the second housing 21 by thermally conductive adhesive, or fixed to the second housing 21 by other fasteners. In scenarios where the heat pipe 20 is flexible, the aforementioned fourth part 204 can be bent without being restricted by the second housing 21. Thus, during the installation of the heat dissipation device 6, the heat sink 19 can be adjusted to an appropriate position, so that the heat sink 19 can maintain close contact with the heating element 5 to improve heat conduction efficiency, without causing excessive compression to the heating element 5 and damaging it.

[0177] Figure 24 This is a schematic diagram illustrating an application of the guide tube provided in an embodiment of this application, such as... Figure 24 As shown, in one embodiment, the electronic component 3 includes a second circuit board 26 and a plurality of heating elements 5, which are disposed on the same side of the second circuit board 26. Due to manufacturing tolerances, the thicknesses of the plurality of heating elements 5 are different. The heat dissipation device 6 includes a plurality of heat sinks 19, each heat sink 19 being thermally connected to one or more heating elements 5, and the plurality of heat sinks 19 sharing a single guide tube 20, which is an aluminum tube. The guide tube 20 includes a plurality of first portions 201, each first portion 201 being thermally connected to a heat sink 19, and adjacent first portions 201 being connected by a fourth portion 204. For the heat sinks 19 located at both ends, the first portions 201 of these two heat sinks 19 are also respectively connected to an external pipeline via the fourth portion 204. During the installation of the heat dissipation device, the heat sinks 19 are fixed to the second circuit board 26 by a second fastener 28. For two adjacent heat sinks 19, the fourth portion 204 located between the two heat sinks 19 can be bent, so that the installation height of the two heat sinks 19 is adapted to the thickness of the corresponding heating element 5. In this way, each heat sink 19 can maintain a moderate compression with the corresponding heating element 5. That is to say, each heat sink 19 can maintain close contact with the heating element 5, thereby improving the heat conduction efficiency, without causing excessive compression to the heating element 5 and damaging it.

[0178] In the specific installation of the second fixing member 28, the second fixing member 28 includes a screw and a spring. The screw passes through the heat sink 19 and connects to the circuit board; the spring is sleeved on the outside of the screw, with one end abutting the head of the screw and the other end abutting the heat sink 19. The longer the spring, the smaller the distance between the heat sink 19 and the second circuit board 26. Conversely, the shorter the spring, the larger the distance between the heat sink 19 and the second circuit board 26. Because the length of the spring is variable, the distance between the heat sink 19 and the circuit board is variable, thus allowing the heat sink 19 to float. During installation, the fourth part 204 can deform accordingly with the floating of the heat sink 19, ultimately achieving a suitable distance between each heat sink 19 and the circuit board, thereby maintaining appropriate compression between the heat sink 19 and the corresponding heat-generating element 5.

[0179] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application is also intended to include such modifications and variations.

Claims

1. A heat dissipating device, characterized by, The liquid cooling module is used for heat conduction connection with the heat generating element, and has a flow channel for flowing cooling liquid. The plurality of liquid cooling modules are arranged at intervals, and a connecting piece is arranged between two adjacent liquid cooling modules.

2. The heat dissipating device of claim 1, wherein The liquid cooling module comprises a substrate for heat conduction connection with the heat generating element, and the flow channel is located on the side of the substrate away from the heat generating element. The connecting piece is located between two adjacent substrates, and the connecting piece is directly connected with the two adjacent substrates respectively.

3. The heat dissipating device of claim 2, wherein The substrate and the connecting piece are welded, bonded or integrated.

4. The heat dissipating device according to claim 2 or 3, wherein The thickness of the substrate gradually decreases in the direction away from the connecting piece.

5. The heat dissipating device according to any one of claims 2 to 4, wherein The side of the substrate facing the heat generating element is provided with a first heat conduction protrusion, and the heat conduction coefficient of the first heat conduction protrusion is greater than or equal to the heat conduction coefficient of the substrate.

6. The heat dissipating device according to any one of claims 1 to 5, wherein The connecting piece has a first side and a second side arranged in a first direction, the first side is connected with one of the liquid cooling modules, and the second side is connected with another of the liquid cooling modules. The connecting piece has elastic deformation capacity in the first direction.

7. The heat dissipating device of claim 6, wherein The connecting piece is a component made of flexible material.

8. The heat dissipating device according to any one of claims 1 to 7, wherein The connecting piece comprises a first protruding part having two first wall surfaces oppositely arranged in the thickness direction of the connecting piece, and the two first wall surfaces are protruded in the direction away from the heat generating element. And / or, the connecting piece comprises a second protruding part having two second wall surfaces oppositely arranged in the thickness direction of the connecting piece, and the two second wall surfaces are protruded in the direction close to the heat generating element.

9. The heat dissipating device according to any one of claims 1 to 8, wherein The flow channels of the plurality of liquid cooling modules are sequentially communicated through a connecting pipeline. Alternatively, the heat dissipation device further comprises an inlet liquid main pipe, an outlet liquid main pipe, a plurality of inlet liquid branch pipes and a plurality of outlet liquid branch pipes; the flow channels of the plurality of liquid cooling modules are respectively communicated through different inlet liquid branch pipes and the inlet liquid main pipe, and the flow channels of the plurality of liquid cooling modules are respectively communicated through different outlet liquid branch pipes and the outlet liquid main pipe.

10. An electronic assembly, characterized by The electronic assembly further comprises a first housing having an opening.

11. The electronic assembly of claim 10, wherein, The plurality of heat generating elements are located in the first housing. The liquid cooling module comprises a substrate for heat conduction connection with the heat generating element, and the flow channel is located on the side of the substrate away from the heat generating element; the connecting piece is located between two adjacent substrates, and the connecting piece is directly connected with the two adjacent substrates respectively; the plurality of liquid cooling modules are connected to form a first cover plate, the first cover plate is located at the top of the opening, and the first cover plate covers the opening. ​ 12. The electronic assembly of claim 11, wherein, The first cover plate has an extension part, a normal projection of which on the plane of the opening is located at the outer periphery of a normal projection of the first housing on the plane of the opening.

13. Electronic assembly according to claim 11 or 12, characterized in that A flexible member is arranged between the substrate covering the edge of the opening and the first housing.

14. Electronic assembly according to any one of claims 10 to 13, characterized in that The electronic assembly further comprises a first circuit board, the plurality of heat generating elements are respectively electrically connected to the first circuit board, and the liquid cooling module is connected to the first circuit board through a first fixing member.

15. The electronic assembly of claim 14, wherein, A first reinforcing plate is arranged on a side of the first circuit board away from the heat generating elements, one end of the first fixing member is connected to the liquid cooling module, and the other end of the first fixing member is connected to the first circuit board and the first reinforcing plate.

16. An in-vehicle intelligent module, characterized by, An electronic assembly as claimed in any one of claims 10 to 15 is arranged in a housing.

17. A vehicle characterized by comprising: A vehicle-mounted intelligent module as claimed in claim 16 is arranged in a vehicle frame.

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