Electronic device and heat dissipation assembly

Abstract

The invention relates to an electronic device and a heat dissipation assembly. The electronic device comprises a machine shell and a heat dissipation assembly. The radiating assembly comprises a first circuit board, a second circuit board, at least one heat source and a radiator. The first circuit board and the second circuit board are arranged in the housing in a layered manner. The first circuit board is provided with at least one heat conduction part. The at least one heat source is arranged on the second circuit board. The at least one heat source is located between the second circuit board and the first circuit board. The radiator is arranged in the machine shell and comprises a heat conduction base and a fin part. The fin part is connected to one side of the heat conduction base. The heat-conducting base and the at least one heat source are respectively thermally coupled to two opposite sides of the at least one heat-conducting part. According to the electronic device and the heat dissipation assembly, the chips arranged on the upper layer circuit board and the lower layer circuit board can be subjected to heat dissipation, and the line configuration and the structural strength of the circuit boards cannot be affected.

Description

Technical Field

[0001] This application relates to an electronic device and a heat dissipation assembly, particularly an electronic device and a heat dissipation assembly having a multilayer circuit board. Background Technology

[0002] Modern society is in an era of rapid development in information technology, and most users rely on servers to complete various tasks. Taking vehicle servers as an example, their functions can be enhanced through automotive electronics technology to improve the in-vehicle environment and user experience. For instance, using servers for in-vehicle infotainment (IVI) systems to connect various in-vehicle devices or wearable devices has gradually become mainstream.

[0003] Server chassis typically contain upper and lower circuit boards, each housing chips such as the CPU. Since these chips generate heat during operation, manufacturers install heat sinks to dissipate it. Generally, manufacturers install independent heat sinks on each circuit board, utilize the chassis for cooling, or create openings on the upper circuit board to utilize these openings and their associated heat sinks to cool the chips on the lower circuit board. However, installing independent heat sinks on each circuit board increases costs, and the limited space within the chassis already accommodates the upper and lower circuit boards, making it difficult to install additional heat sinks. Furthermore, the chassis's cooling efficiency is low, and its structural design may hinder chip cooling. Additionally, creating openings on the upper circuit board reduces the available space for circuit board routing, and the increased opening area to accommodate heat sinks can compromise the structural strength of the upper circuit board. Therefore, how to dissipate heat from the chips located on the upper and lower circuit boards within the confined space of the casing without affecting the circuit layout and structural strength of the circuit boards is one of the problems that R&D personnel should solve. Summary of the Invention

[0004] Therefore, it is necessary to provide an electronic device and heat dissipation component to address the above problems, so as to dissipate heat from chips disposed on upper and lower circuit boards within the narrow space of the housing, without affecting the circuit configuration and structural strength of the circuit board.

[0005] The technical solution is as follows:

[0006] On one hand, this application provides an electronic device, including:

[0007] A casing; and

[0008] A heat dissipation assembly, the heat dissipation assembly comprising:

[0009] A first circuit board, a second circuit board, and at least one heat source are provided. The first circuit board and the second circuit board are disposed in layers within the housing. The first circuit board has at least one heat-conducting part. The at least one heat source is disposed on the second circuit board and is located between the second circuit board and the first circuit board.

[0010] The heat dissipation assembly further includes a heat sink disposed inside the casing and includes a heat-conducting base and a fin portion. The fin portion is connected to one side of the heat-conducting base, and the heat-conducting base and the at least one heat source are respectively thermally coupled to opposite sides of the at least one heat-conducting portion.

[0011] The technical solution will be further explained below:

[0012] In one embodiment, the heat sink further includes at least one heat-conducting column connected to the side of the heat-conducting base away from the fin portion and thermally coupled to the side of the at least one heat-conducting portion away from the at least one heat source.

[0013] In one embodiment, it further includes at least one first thermal pad, the opposite sides of which are thermally coupled to the at least one heat source and the at least one thermally conductive part, respectively.

[0014] In one embodiment, it further includes at least one second thermal pad, the opposite sides of which are thermally coupled to the at least one thermally conductive portion and the at least one thermally conductive pillar, respectively.

[0015] In one embodiment, the at least one heat-conducting part is bare copper.

[0016] On the other hand, this application also provides a heat dissipation assembly for mounting in a housing, the heat dissipation assembly comprising:

[0017] A first circuit board, a second circuit board, and at least one heat source are provided. The first circuit board and the second circuit board are arranged in layers within the housing. The first circuit board has at least one heat-conducting part. The at least one heat source is disposed on the second circuit board and is located between the second circuit board and the first circuit board.

[0018] The heat dissipation assembly further includes a heat sink, which is disposed inside the casing. The heat sink includes a heat-conducting base and a fin portion. The fin portion is connected to one side of the heat-conducting base, and the heat-conducting base and the at least one heat source are respectively thermally coupled to opposite sides of the at least one heat-conducting portion.

[0019] In one embodiment, the heat sink further includes at least one heat-conducting column connected to the side of the heat-conducting base away from the fin portion and thermally coupled to the side of the at least one heat-conducting portion away from the at least one heat source.

[0020] In one embodiment, it further includes at least one first thermal pad, the opposite sides of which are thermally coupled to the at least one heat source and the at least one thermally conductive part, respectively.

[0021] In one embodiment, it further includes at least one second thermal pad, the opposite sides of which are thermally coupled to the at least one thermally conductive portion and the at least one thermally conductive pillar, respectively.

[0022] In one embodiment, the at least one heat-conducting part is bare copper.

[0023] In the aforementioned electronic device and heat dissipation assembly, since the first circuit board has a heat-conducting part, the heat generated by the heat source is transferred from the second circuit board to the heat sink via the heat-conducting part of the first circuit board. Furthermore, the heat sink is located on the same side of both the first and second circuit boards. Therefore, there is no need to add another heat sink to the second circuit board, nor is it necessary to dissipate heat through the casing. Furthermore, there is no need to provide openings or reserve assembly space on the first circuit board for the heat sink to pass through and dissipate heat from the heat source on the second circuit board. This improves the utilization rate of the circuit configuration on the first circuit board. In this way, heat sources located on both the first and second circuit boards can be dissipated within the small space of the casing without affecting the circuit configuration or structural strength of the first circuit board. Attached Figure Description

[0024] Figure 1 This is a three-dimensional structural schematic diagram of an electronic device in one embodiment.

[0025] Figure 2 for Figure 1 A magnified exploded view of the electronic device in the diagram.

[0026] Figure 3 for Figure 1 A partially enlarged cross-sectional view of the electronic device in the diagram.

[0027] Explanation of reference numerals in the attached figures:

[0028] 10. Electronic device; 11. Housing; 12. Heat dissipation assembly; 121. First circuit board; 1211. Heat-conducting part; 122. Second circuit board; 123. Heat source; 124. Heat sink; 1241. Heat-conducting base; 1242. Fin part; 1243. Heat-conducting pillar; 13. First thermal pad; 14. Second thermal pad. Detailed Implementation

[0029] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0030] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0031] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0032] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0033] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0034] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0035] Please see Figures 1 to 3 . Figure 1 This is a three-dimensional schematic diagram of an electronic device in one embodiment. Figure 2 for Figure 1 A partially enlarged exploded view of the electronic device. Figure 3 for Figure 1 A partially enlarged cross-sectional schematic diagram of the electronic device.

[0036] The electronic device 10 in this embodiment is, for example, the main unit of an in-vehicle infotainment (IVI) system, but is not limited thereto. The electronic device 10 includes a housing 11, a heat dissipation assembly 12, a plurality of first thermal pads 13, and a plurality of second thermal pads 14. The heat dissipation assembly 12 includes a first circuit board 121, a second circuit board 122, a plurality of heat sources 123, and a heat sink 124. The first circuit board 121 and the second circuit board 122 are arranged in layers within the housing 11. For example, the first circuit board 121 is, for example, the upper circuit board, and the second circuit board 122 is, for example, the lower circuit board. That is, the first circuit board 121 and the second circuit board 122 are, for example, vertically stacked. Furthermore, the first circuit board 121 is stacked on top of the second circuit board 122, for example, via a support post or an electrical connector. The size of the first circuit board 121 is, for example, larger than the size of the second circuit board 122. These heat sources 123 are, for example, chips such as CPUs, and are disposed on the second circuit board 122, and these heat sources 123 are located between the second circuit board 122 and the first circuit board 121.

[0037] The heat sink 124 is disposed inside the casing 11 and includes a heat-conducting base 1241, a fin portion 1242, and a plurality of heat-conducting pillars 1243. The fin portion 1242 is connected to one side of the heat-conducting base 1241. The heat-conducting pillars 1243 are connected to the side of the heat-conducting base 1241 away from the fin portion 1242.

[0038] The first circuit board 121 has a plurality of heat-conducting portions 1211. These heat-conducting portions 1211 are, for example, bare copper. Specifically, the first circuit board 121 is formed, for example, by alternating stacks of multiple copper foils and multiple fiberglass boards, with a solder resist layer formed on the surface of the outermost copper foil. Here, these heat-conducting portions 1211 refer to the areas on the surface of the outermost copper foil where no solder resist layer is provided; that is, these heat-conducting portions 1211 are the parts of the copper foil exposed to the outside. Furthermore, the first circuit board 121 has a plurality of vias. These vias penetrate the copper foils and the fiberglass boards, and the copper foils are connected through these vias.

[0039] The first thermal pads 13 are thermally coupled to the heat sources 123 and the thermally conductive parts 1211 on opposite sides, respectively. The second thermal pads 14 are thermally coupled to the thermally conductive parts 1211 and the thermally conductive pillars 1243 on opposite sides, respectively. In this way, the heat generated by the heat sources 123 is transferred to the bottom copper foil of the thermally conductive parts 1211 through the first thermal pads 13, and then transferred from the bottom copper foil of the thermally conductive parts 1211 to the top copper foil of the thermally conductive parts 1211 through the through holes, and finally transferred to the heat sink 124 for heat dissipation through the second thermal pads 14.

[0040] In this embodiment, since the first circuit board 121 is provided with a heat-conducting part 1211, such as bare copper, and the heat generated by the heat source 123 is transferred from the second circuit board 122 to the heat sink 124 through the heat-conducting part 1211 of the first circuit board 121 via the first heat-conducting pad 13 and the second heat-conducting pad 14, the heat dissipation component 12 uses the copper foil of the first circuit board 121 itself to transfer heat from the heat source 123 to the heat sink 124. Since the heat sink 124 is located on the same side of the first circuit board 121 and the second circuit board 122, there is no need to add another heat sink to the second circuit board 122, nor is it necessary to dissipate heat from the heat source 123 through the housing 11. Furthermore, there is no need to set openings and reserve assembly space in the first circuit board 121 for the heat sink 124 to pass through the openings to dissipate heat from the heat source 123 located on the second circuit board 122. This can improve the utilization rate of the circuit configuration on the first circuit board 121. In this way, the heat source 123 located on the first circuit board 121 and the second circuit board 122 can be dissipated within the small space of the casing 11 without affecting the circuit configuration and structural strength of the first circuit board 121.

[0041] In this embodiment, the first circuit board 121 and the second circuit board 122 are stacked vertically, but this is not a limitation. In other embodiments, the first circuit board and the second circuit board may also be stacked horizontally.

[0042] In this embodiment, the number of heat sources 123, heat-conducting parts 1211, heat-conducting pillars 1243, first heat-conducting pads 13, and second heat-conducting pads 14 are each multiple, but are not limited thereto. In other embodiments, the number of heat sources, heat-conducting parts, heat-conducting pillars, first heat-conducting pads, and second heat-conducting pads may each be only a single one.

[0043] In this embodiment, the heat sink 124 is provided with a plurality of heat-conducting pillars 1243, and these heat-conducting pillars 1243 are thermally coupled to these heat-conducting parts 1211 respectively, but this is not a limitation. In other embodiments, the heat sink may not be provided with a plurality of heat-conducting pillars, but may be directly thermally coupled to these heat-conducting parts through the heat-conducting base of the heat sink 124.

[0044] In this embodiment, the electronic device 10 is provided with a plurality of first thermal pads 13 and a plurality of second thermal pads 14. The opposite sides of the first thermal pads 13 are thermally coupled to the heat sources 123 and the heat-conducting parts 1211, respectively, and the opposite sides of the second thermal pads 14 are thermally coupled to the heat-conducting parts 1211 and the heat-conducting pillars 1243, respectively, but this is not a limitation. In other embodiments, the electronic device may not be provided with a plurality of first thermal pads and a plurality of second thermal pads, but the heat generated by these heat sources may be transferred to the heat sink in other ways.

[0045] In the electronic device and heat dissipation assembly described in the above embodiments, since the first circuit board has a thermally conductive portion, such as bare copper, and the heat generated by the heat source is transferred from the second circuit board to the heat sink via the thermally conductive portion of the first circuit board through the first thermal pad and the second thermal pad, the heat dissipation assembly uses the copper foil of the first circuit board itself to transfer heat from the heat source to the heat sink. Furthermore, since the heat sink is located on the same side of the first and second circuit boards, there is no need to add another heat sink to the second circuit board, nor is it necessary to use a housing to dissipate heat from the heat source. There is also no need to provide openings or reserve assembly space on the first circuit board for the heat sink to pass through and dissipate heat from the heat source on the second circuit board. This improves the utilization rate of the circuit configuration on the first circuit board. In this way, heat from the heat source on both the first and second circuit boards can be dissipated within the small space of the housing without affecting the circuit configuration or structural strength of the first circuit board.

[0046] In one embodiment of the present invention, the electronic device of the present invention can be applied to in-vehicle devices, such as servers for in-vehicle computers or in-vehicle infotainment (IVI) systems, etc.; it can also be applied to 5G servers, cloud servers or vehicle networking servers.

[0047] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0048] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. An electronic device, characterized by comprising: Comprising: a casing; and a heat dissipation assembly, the heat dissipation assembly comprising: a first circuit board, a second circuit board and at least one heat source, the first circuit board and the second circuit board are arranged in layers in the casing, the first circuit board has at least one heat conduction part, the at least one heat source is arranged on the second circuit board, and the at least one heat source is located between the second circuit board and the first circuit board; the heat dissipation assembly further comprises a heat sink, the heat sink is arranged in the casing and comprises a heat conduction base and a fin part, the fin part is connected to one side of the heat conduction base, and the heat conduction base and the at least one heat source are respectively thermally coupled to opposite sides of the at least one heat conduction part. The heat sink further comprises at least one heat conduction column, the at least one heat conduction column is connected to one side of the heat conduction base away from the fin part, and is thermally coupled to one side of the at least one heat conduction part away from the at least one heat source. 2.The electronic device of claim 1, wherein, Further comprising at least one first heat conduction pad, opposite sides of the at least one first heat conduction pad are respectively thermally coupled to the at least one heat source and the at least one heat conduction part. 3.The electronic device of claim 2, wherein, Further comprising at least one second heat conduction pad, opposite sides of the at least one second heat conduction pad are respectively thermally coupled to the at least one heat conduction part and the at least one heat conduction column. 4.The electronic device of claim 3, wherein, The at least one heat conduction part is bare copper. 5.The electronic device of claim 1, wherein, The heat dissipation assembly comprises:

6. A heat dissipating assembly for being disposed in a housing, characterized by, a first circuit board, a second circuit board and at least one heat source, the first circuit board and the second circuit board are arranged in layers in the casing, the first circuit board has at least one heat conduction part, the at least one heat source is arranged on the second circuit board, and the at least one heat source is located between the second circuit board and the first circuit board; the heat dissipation assembly further comprises a heat sink, the heat sink is arranged in the casing and comprises a heat conduction base and a fin part, the fin part is connected to one side of the heat conduction base, and the heat conduction base and the at least one heat source are respectively thermally coupled to opposite sides of the at least one heat conduction part. The heat sink further comprises at least one heat conduction column, the at least one heat conduction column is connected to one side of the heat conduction base away from the fin part, and is thermally coupled to one side of the at least one heat conduction part away from the at least one heat source.

7. The heat dissipating assembly of claim 6, wherein, Further comprising at least one first heat conduction pad, opposite sides of the at least one first heat conduction pad are respectively thermally coupled to the at least one heat source and the at least one heat conduction part.

8. The heat dissipating assembly of claim 7, wherein, Further comprising at least one second heat conduction pad, opposite sides of the at least one second heat conduction pad are respectively thermally coupled to the at least one heat conduction part and the at least one heat conduction column.

9. The heat dissipating assembly of claim 8, wherein, The at least one heat conduction part is bare copper.

10. The heat dissipating assembly of claim 6, wherein, ​

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