Electronic device

Abstract

The invention relates to an electronic device. The electronic device comprises a shell and a heat dissipation module. The housing includes an inner surface. The inner surface has a central portion and corner portions, and a region above the central portion is a central region. The heat dissipation module comprises a fan and a first flow guide structure. The fans are located at the corners and provided with air outlets facing the central area. The first flow guide structure is connected with the inner surface and extends in the direction away from the air outlet. The first flow guide structure comprises a starting part and a front end part, and the starting part and the front end part are adjacent to the air outlet. A virtual extension line extends in parallel from the front end part to the air outlet along the extension direction of the starting part. The virtual extension line divides the air outlet into a first air opening part and a second air opening part, and the first air opening part and the second air opening part have different first width and second width respectively. According to the electronic device, the air flow of the air outlet can be segmented by utilizing the first flow guide structure, so that the air flow can be averagely diffused to each area of the inner surface of the shell, and the shell is effectively cooled.

Description

Technical Field

[0001] This application relates to an electronic device, and more particularly to an electronic device for use in a server chassis or computer. Background Technology

[0002] In existing technologies, some heat dissipation designs utilize heat dissipation pillars to conduct heat generated by heat-generating components in servers or computers to the casing for cooling. However, if the casing cannot effectively dissipate heat, these heat-generating components inside the server or computer remain at a relatively high temperature.

[0003] Therefore, in order to improve heat dissipation efficiency, a design that can effectively dissipate heat from the casing is needed. Summary of the Invention

[0004] Therefore, it is necessary to provide an electronic device that can effectively dissipate heat from the casing to address the above-mentioned problems.

[0005] The technical solution is as follows:

[0006] An electronic device comprising:

[0007] A housing includes an inner surface having a central portion and a corner portion, the region above the central portion being a central region; and

[0008] A heat dissipation module, including:

[0009] A fan, located at the corner, has an air outlet facing the central area; and

[0010] A first airflow guiding structure is connected to the inner surface and extends in a direction away from the air outlet. The first airflow guiding structure includes a starting part and a front end part, the starting part and the front end part being adjacent to the air outlet.

[0011] A virtual extension line extends parallel to the extension direction of the starting part from the front end toward the air outlet, and the virtual extension line divides the air outlet into a first air outlet portion and a second air outlet portion, and the first air outlet portion and the second air outlet portion have different first widths and second widths, respectively.

[0012] The technical solution will be further explained below:

[0013] In one embodiment, the fan is a centrifugal fan and includes a central shaft, the central shaft and the second air vent are located on one side of the virtual extension line, the first air vent is located on the other side of the virtual extension line, and the first width is smaller than the second width.

[0014] In one embodiment, the first flow guiding structure extends from the corner toward the center.

[0015] In one embodiment, the first flow guiding structure includes a plurality of turning angles, at least one of which has an angle between 130 degrees and 160 degrees.

[0016] In one embodiment, the first flow guiding structure includes a bifurcation portion, which is a portion of the first flow guiding structure away from the air outlet.

[0017] In one embodiment, the housing and the first flow guiding structure form a single-unit structure.

[0018] In one embodiment, the heat dissipation module further includes:

[0019] A second flow guiding structure and a third flow guiding structure are provided, both of which are connected to the inner surface. The second flow guiding structure and the third flow guiding structure extend at least partially along a first axial direction different from the virtual extension line and are disposed on one side of the first flow guiding structure.

[0020] Wherein, the shortest distance from a front end of the second flow guiding structure adjacent to the air outlet to the air outlet is less than the shortest distance from a front end of the third flow guiding structure adjacent to the air outlet to the air outlet;

[0021] Wherein, in the first axial direction, the shortest distance from the front end of the third flow guide structure to the first flow guide structure is less than the shortest distance from the front end of the second flow guide structure to the first flow guide structure, and in a second axial direction perpendicular to the first axial direction, the shortest distance from the front end of the third flow guide structure to the first flow guide structure is less than the shortest distance from the front end of the second flow guide structure to the first flow guide structure.

[0022] In one embodiment, the second flow guiding structure and the third flow guiding structure are arranged parallel to each other.

[0023] In one embodiment, the second flow guiding structure and the third flow guiding structure have different lengths.

[0024] In one embodiment, the heat dissipation module further includes:

[0025] A fourth flow guiding structure is located on the inner surface, the fourth flow guiding structure extending at least partially along a first axis different from the virtual extension line, and disposed on one side of the first flow guiding structure;

[0026] The fourth flow guiding structure has a turning angle, the angle of which is between 130 degrees and 160 degrees.

[0027] In the aforementioned electronic device, since the fan is located at the corner of the inner surface of the housing and the first airflow guiding structure is distributed on the inner surface of the housing, the electronic device can use the first airflow guiding structure to divide the airflow from the vent so that the airflow can be evenly diffused to various areas of the inner surface of the housing, thereby effectively dissipating heat from the housing. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the structure of an electronic device according to an embodiment of this application.

[0029] Figure 2 This is a schematic diagram of the structure of an electronic device according to an embodiment of this application.

[0030] Figure 3 This is an airflow velocity distribution diagram of an electronic device according to an embodiment of this application.

[0031] Figure 4 for Figure 3 A partial enlarged view of the electronic device shown.

[0032] Figure 5 This is a diagram showing the airflow velocity distribution of an electronic device as a comparative example of this application.

[0033] Figure 6 This is a temperature distribution diagram of an electronic device according to an embodiment of this application.

[0034] Figure 7 Temperature distribution diagram of an electronic device of a comparative example of this application.

[0035] Explanation of reference numerals in the attached figures:

[0036] 10. Electronic device; 100. Heat dissipation module; 110. Housing; 111. Inner surface; 1110. Center section; 1112. Corner section; 120. Fan; 121. Air outlet; 1211. First air outlet section; 1212. Second air outlet section; 123. Virtual extension line; 125. Central axis; 130. First airflow guiding structure; 1301. Starting section; 1303. Bifurcation section; 1305. Front end section; 1307, 1309. End section; 131, 133, 135, 137. Airflow guiding structure; 1311, 13 13, 1315, 1317, Turning angle; 141, 142, 143, 144, 145, 146, 147, 148, Component; d1, First width; d2, Second width; a1, a3, a5, Shortest distance to air outlet; x1, x3, x5, Shortest distance to first guide structure along first axis; y1, y3, y5, Shortest distance to first guide structure along second axis; θ1, θ2, θ3, θ4, Angle; X, First axis; Y, Second axis; M1, M2, M3, Region. Detailed Implementation

[0037] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0038] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0039] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0040] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0041] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0042] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0043] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of an electronic device 10 according to one embodiment. Figure 1In the embodiment, the electronic device 10 includes a heat dissipation module 100 and a housing 110. The housing 110 includes an inner surface 111 having a central portion 1110 and corner portions 1112, with the area above the central portion 1110 being a central region. The heat dissipation module 100 includes a fan 120 and a first airflow guiding structure 130. The fan 120 is located at the corner portion 1112 and has an air outlet 121 facing the central region above the central portion 1110. The first airflow guiding structure 130 connects to the inner surface 111 and extends away from the air outlet 121.

[0044] In some embodiments, the first airflow guiding structure 130 includes a starting portion 1301, a front portion 1305, and a terminal portion 1307. The starting portion 1301 and the front portion 1305 are adjacent to the air outlet 121 of the fan 120. The terminal portion 1307 is away from the air outlet 121 of the fan 120. A virtual extension line 123 extends parallel to the extending direction of the starting portion 1301 from the front portion 1305 of the first airflow guiding structure 130 towards the air outlet 121. This virtual extension line 123 divides the air outlet 121 into a first air outlet portion 1211 and a second air outlet portion 1212, and the first air outlet portion 1211 and the second air outlet portion 1212 have different first widths d1 and second widths d2, respectively. In some embodiments, the first airflow guiding structure 130 may or may not contact the fan 120.

[0045] See Figure 1 As shown, specifically, the fan 120 is located at the upper right corner 1112 of the inner surface 111, and the airflow provided by the air outlet 121 blows to the lower left. The first airflow guiding structure 130 can divide the airflow from the air outlet 121 into two directions, so that the airflow blows to the left side area and the lower area respectively.

[0046] In some embodiments, the fan 120 is a centrifugal fan and includes a central shaft 125. The central shaft 125 and the second air outlet 1212 are located on one side of the virtual extension line 123, and the first air outlet 1211 is located on the other side of the virtual extension line 123, with a first width d1 smaller than a second width d2. Since the air outlet 121 of the centrifugal fan 120 generates a centrifugal effect, the airflow on the outer side is greater than that on the inner side. Therefore, dividing the air outlet 121 into a first width d1 and a second width d2, and making the first width d1 smaller than the second width d2, allows the divided airflow to diffuse evenly to the left and lower regions. Specifically, the ratio of the first width d1 to the second width d2 can be between 0.3 and 0.6, and preferably, the ratio can be 0.4.

[0047] In some embodiments, the first flow guiding structure 130 extends from the corner portion 1112 toward the center portion 1110. Specifically, the first flow guiding structure 130 not only extends toward the center portion 1110, but can also extend from the center portion 1110 in a direction different from or opposite to the corner portion 1112.

[0048] In some embodiments, the first airflow guiding structure 130 includes multiple turning angles. For example, the first airflow guiding structure 130 includes turning angles 1311, 1313, and 1315. Specifically, turning angles 1311, 1313, and 1315 have angles θ1, θ2, and θ3, respectively. Angles θ1, θ2, and θ3 are between 130 degrees and 160 degrees. The obtuse angle design can reduce the wind resistance of the first airflow guiding structure 130, allowing the airflow to smoothly diffuse along the first airflow guiding structure 130 to other areas, thereby improving the overall heat dissipation efficiency.

[0049] In some embodiments, the first flow guiding structure 130 further includes a branch portion 1303, which is a portion of the first flow guiding structure 130 away from the air outlet 121. For example, after extending to the center portion 1110, the starting portion 1301 of the first flow guiding structure 130 may branch and continue to extend in different directions to form the branch portion 1303. For example, the ending portion 1307 may extend, for example, from the center portion 1110 toward the left side region of the inner surface 111; the ending portion 1309 may extend, for example, from the center portion 1110 toward the lower region of the inner surface 111.

[0050] In some embodiments, the first flow guiding structure 130 may be a straight line structure without turning angles, or a broken line structure with multiple turning angles, or a broken line structure with one end forked.

[0051] In some embodiments, the housing 110 and the first flow guiding structure 130 can be integrally formed into a single structure, for example, by using a die casting process.

[0052] In some embodiments, the housing 110 and the first flow-guiding structure 130 may use the same metallic material. Specifically, the metal may be aluminum, magnesium, titanium alloy, aluminum alloy, stainless steel, or a combination thereof with a thermal conductivity between 90 and 200 W / m‧K, but this disclosure is not limited thereto. For example, ADC12 or 6063 aluminum alloy.

[0053] In some embodiments, the heat dissipation module 100 may further include multiple other heat dissipation structures different from the first heat dissipation structure 130. For example, in Figure 1 In the heat dissipation module 100, there are further airflow guiding structures 131, 133, 135, and 137.

[0054] In some embodiments, the flow guiding structures 131, 133, 135 extend at least partially along a first axis X different from the virtual extension line 123 and are disposed on one side of the first flow guiding structure 130. Specifically, the flow guiding structures 131, 133, 135 are disposed in the left region of the first flow guiding structure 130.

[0055] In some embodiments, the shortest distances from the front ends of the flow guiding structures 131, 133, 135 adjacent to the air outlet 121 to the air outlet 121 are a1, a3, and a5 respectively, where a1 < a3 < a5. On the first axis X, the shortest distances from the front ends of the flow guiding structures 131, 133, 135 to the first flow guiding structure 130 are x1, x3, and x5 respectively, and x1 > x3 > x5. On the second axis Y, the shortest distances from the front ends of the flow guiding structures 131, 133, 135 to the first flow guiding structure 130 are y1, y3, and y5 respectively, and y1 > y3 > y5. Among them, the first axis X and the second axis Y are perpendicular to each other.

[0056] For example, the shortest distance a1 from the front end of the flow guiding structure 131 close to the air outlet 121 to the air outlet 121 is less than the shortest distance a3 from the front end of the flow guiding structure 133 close to the air outlet 121 to the air outlet 121. On the first axis X, the shortest distance x3 from the front end of the flow guiding structure 133 to the first flow guiding structure 130 is less than the shortest distance x1 from the front end of the flow guiding structure 131 to the first flow guiding structure 130, and on the second axis Y, the shortest distance y3 from the front end of the flow guiding structure 133 to the first flow guiding structure 130 is less than the shortest distance y1 from the front end of the flow guiding structure 131 to the first flow guiding structure 130.

[0057] The above design is because in the region farther away from the fan 120, the air volume of the air flow will gradually become smaller. Therefore, in order to evenly diffuse the air flow to each region of the inner surface 111, it is designed that the flow guiding structure farther away from the fan 120 is closer to the first flow guiding structure 130 to achieve the effect of grabbing air.

[0058] In some embodiments, the flow guiding structures 131, 133, 135 can be linear structures and arranged parallel to each other. In some embodiments, the flow guiding structures 131, 133, 135 have different lengths.

[0059] In some embodiments, the flow guiding structure 137 is located on the inner surface 111. The flow guiding structure 137 extends at least partially along a first axis X different from the virtual extension line 123 and is disposed on one side of the first flow guiding structure 130. It can be a polyline structure with a turning angle 1317, where the turning angle 1317 has an angle θ4 of 130 degrees to 160 degrees. The flow guiding structure 137 can be arranged parallel to the flow guiding structures 131, 133.

[0060] In some embodiments, the housing 110 may form a monolithic structure with the above-described flow guiding structure, which is the same as the first flow guiding structure 130, and will not be described again here.

[0061] In some implementations, since the heat dissipation module has a fan-shaped design that gradually diffuses from the corners to the center, the distance between the heat dissipation structures is relatively wide, which improves the feasibility and ease of the die-casting process and can achieve the effects of saving costs and improving yield.

[0062] To further illustrate the content of this application, the following embodiments and comparative examples will be used to provide a detailed description.

[0063] The following will conduct heat dissipation tests on the electronic device 10 of the embodiment and the electronic device 10 of the comparative example under the condition of using a simulated computer.

[0064] Please see Figure 2 , Figure 2 This is a schematic diagram of the structure of an electronic device 10 according to an embodiment of this application. Figure 2 In this embodiment, the electronic device 10 is equipped with heating components 141, 142, 143, 144, 145, 146, 147, and 148 at different locations.

[0065] Depend on Figure 2 As can be seen, heating elements 145, 148, 141, 142, 144, and 143 are arranged sequentially along the first airflow guide structure 130 away from the fan 120, and are densely arranged in multiple airflow guide structures in the lower right region of the first airflow guide structure 130. Heating element 147 is located on the airflow guide structure 135 closer to the left side, and heating element 146 is located near the end portion 1307 of the first airflow guide structure 130 (please refer to the accompanying document). Figure 1 ).

[0066] Generally speaking, in electronic devices, the main heat-generating components that are more important and generate a lot of heat are placed closer to the fan, while the secondary heat-generating components that generate less heat are placed further away from the fan.

[0067] The determination of heat dissipation velocity can be performed using thermal simulation software. Thermal simulation is a virtual experiment that allows calculation of the heat dissipation risk of a product under different operating scenarios by inputting a series of information data settings without producing an actual product. This enables the prediction of product heat dissipation in advance, thereby saving R&D time and prototyping costs. Thermal simulation software can include, for example, Flotherm, Ansys Icepak, 6SigmaET, FloEFD, etc., and this application is not limited to these. In the embodiments and comparative examples in this paper, 6SigmaET (Celisus EC Solver) is used as the thermal simulation analysis software to compare the results of temperature distribution and airflow velocity distribution.

[0068] For example, the conditions in a simulated testing environment are set as follows:

[0069] Fan air supply: maximum flow rate 5.4 cfm, maximum static pressure 0.969 inAq (calculated operating point at 5.36cfm / 0.013 inAq).

[0070] Ambient temperature: 85°C. The housing 110 and the flow guiding structure are made of ADC12 material.

[0071] Please see Figure 3 , Figure 3 This is an airflow velocity distribution diagram of an electronic device 10 according to one embodiment. Figure 3 In the figure, the color intensity represents the flow rate as shown by the indicators on the left. For a clear understanding of the embodiments described herein, please refer to the following description. Figure 1 Read the component symbols that are marked.

[0072] Depend on Figure 3 As can be seen, the first airflow guiding structure 130 divides the airflow into two small airflows at the air outlet 121, causing them to disperse to both sides. One small airflow is guided along the upper edge of the first airflow guiding structure 130 to the central region and the left side region of the inner surface 111, and the other small airflow is guided along the lower edge of the first airflow guiding structure 130 to the central region and the lower side region of the inner surface 111.

[0073] exist Figure 3 In this embodiment, since the first airflow guiding structure 130 is located at the air outlet 121, the airflow velocity around the starting part 1301 to the branch part 1303 is at least 7 m / s. Furthermore, the airflow is dispersed on the inner surface 111 by means of airflow guiding structures 131, 133, 135, 137, and other airflow guiding structures. In the design, the airflow guiding structures farther from the fan 120 are closer to the first airflow guiding structure 130 to achieve a wind-catching effect. Figure 3As can be seen, the flow velocity around the flow guiding structures 131, 133, 135, and 137 is between 5 and 7 m / s. Although the flow guiding structure 135 is far from the fan 120, its flow velocity can still reach between 6 and 7 m / s near the front end of the first flow guiding structure 130.

[0074] Please see Figure 4 , Figure 4 It is based on Figure 3 A magnified view of the area enclosed by the dashed line M1. Figure 4 As can be seen, due to the centrifugal effect, the airflow of the centrifugal fan 120 is greater on the outer side than on the inner side. Therefore, the airflow velocity measured at the air outlet 121 is at least 7 m / s on the outer side of the fan 120, while it is only about 2 m / s on the inner side. Therefore, by designing the first airflow guiding structure 130 along the virtual extension line 123, this application makes the virtual extension line 123 divide the air outlet 121 into a first air outlet portion 1211 and a second air outlet portion 1212, and makes the first width d1 of the first air outlet portion 1211 smaller than the second width d2 of the second air outlet portion 1212, so that the airflow at the air outlet 121 can be evenly divided.

[0075] Please see Figure 5 , Figure 5 This is an airflow velocity distribution diagram of an electronic device 10 according to a comparative example of this application. The structural configuration of the electronic device 10 in this comparative example differs from that of the embodiment herein in the position of the fan 120 and the design of the airflow guiding structure. Figure 5 As shown, in this comparative example, the fan 120 is located in the middle right region of the inner surface 111 of the housing 110, and multiple airflow guiding structures are concentrated in the middle region of the inner surface 111. In addition, this comparative example has components 141 to 148 in the same positions as in the embodiment (please refer to the accompanying document). Figure 2 ).

[0076] exist Figure 5 In the inner surface 111, multiple airflow guiding structures are densely arranged in the middle section. These airflow guiding structures extend from the air outlet 121 towards the middle section of the inner surface 111 of the housing 110 along the first axial direction (X). Although the airflow guiding structures near the outer side of the fan 120 and above the air outlet 121 have a flow velocity of at least 7 m / s, because the main airflow guiding structure in the comparative example divides the airflow at the air outlet 121 in a 1:1 ratio, the uneven airflow distribution caused by centrifugal effect is not taken into account. Therefore, the airflow guiding structures near the inner side of the fan 120 and below the air outlet 121 cannot effectively distribute sufficient airflow, thus leading to... Figure 5 For example, region M2 becomes a region with low heat dissipation efficiency where the flow velocity approaches 0 m / s.

[0077] Please see Figure 6 and Figure 7 , Figure 6 This is a temperature distribution diagram of an electronic device 10 according to an embodiment of this application. Figure 7 This is a temperature distribution diagram of an electronic device 10, a comparative example of this application. Figure 6 and Figure 7 In the figure, the color depth indicates the temperature, as shown by the indicator on the left.

[0078] exist Figure 6 In this embodiment, the temperature of most of the electronic device 10 is measured below 112°C, with temperatures ranging from 116°C to 119°C measured only in the region of the first flow guiding structure 130 near the turning angle 1313, and temperatures exceeding 135°C measured in the region of the first flow guiding structure 130 near the end portion 1307 (please refer to the accompanying documentation). Figure 1 and Figure 2 Because the airflow guiding structure of the embodiment has a large area distributed on the inner surface 111 of the housing 110, and the airflow of the fan 120 can be better distributed to all parts through the airflow guiding structure, it has better overall heat dissipation efficiency. In addition, compared to the comparative example (see...), Figure 5 Due to the limited relative positions of the fan 120 and the airflow guiding structure, the heat-generating components 141 to 148 can only be concentrated in the middle area of ​​the inner surface 111, resulting in significant heat accumulation and a substantial reduction in heat dissipation efficiency. In the embodiments of this application, the fan 120 is positioned at the corner 1112 of the inner surface 111, and the airflow guiding structure adopts a fan-shaped concept, extending and diffusing in the central area of ​​the inner surface 111. The heat-generating components 141 to 148 can be flexibly distributed on the inner surface 111 according to actual needs, significantly reducing heat accumulation. Furthermore, since the first airflow guiding structure 130 can divide the airflow at the outlet, the two small airflows can be evenly diffused to various areas of the inner surface 111 through the arrangement of the airflow guiding structure, significantly improving heat dissipation efficiency.

[0079] exist Figure 7 In the comparative example, the electronic device 10 generally measured temperatures between 112°C and 119°C, with temperatures exceeding 135°C in region M3. Because the flow-guiding structure of the comparative example is only distributed in the middle region, good heat dissipation is not achieved in region M3, and the overall heat dissipation efficiency is not as good as that of the embodiment.

[0080] Regarding Figure 6 The embodiments and in Figure 7 In the comparative examples, the measured temperatures and temperature improvement rates of heating elements 141 to 148 are shown in Table 1 below:

[0081] [Table 1]

[0082]

[0083] The formula for calculating the temperature improvement rate is as follows:

[0084] Temperature improvement rate = [(Heating element temperature of comparative example - ambient temperature) - (Heating element temperature of embodiment - ambient temperature) / (Heating element temperature of comparative example - ambient temperature)] × 100%

[0085] In the embodiment, heating components 145 and 148 are located in the region of the first flow guiding structure 130 where the flow velocity is at least 7 m / s. In the comparative example, heating components 145 and 148 are located in the region above the flow guiding structure where the flow velocity is at least 7 m / s. However, compared to the comparative example, the heating components 145 and 148 in the embodiment have temperature improvement rates of 24.29% and 7.11%, respectively. Therefore, although both are located in regions with a flow velocity of at least 7 m / s, the embodiments of this application still have better heat dissipation performance.

[0086] In this embodiment, heating components 141 to 144 are located in the area with multiple airflow guiding structures to the lower right of the first airflow guiding structure 130. In the comparative example, heating components 141 to 144 are located in the area below the airflow guiding structure and close to the fan 120. However, compared to the comparative example, the heating components 141, 142, 143, and 144 in this embodiment have temperature improvement rates of 7.65%, 9.15%, 20.15%, and 23.62%, respectively. Although heating components 143 and 144 are farther from the first airflow guiding structure 130, the overall configuration of the airflow guiding structure allows the airflow from the fan 120 to be diffused more evenly. Therefore, compared to the comparative example where heating components 141 and 143 are located in an area without airflow guiding structures, the heating components 143 and 144 in this embodiment have a more significant temperature improvement.

[0087] In the embodiment, heat-generating components 146 and 147 are located in the left end region of the first airflow guiding structure 130. In the comparative example, they are located in the region of the airflow guiding structure away from the fan 120. However, compared to the comparative example, the heat-generating components 146 and 147 in the embodiment have temperature improvement rates of 17.14% and 3.21%, respectively. Therefore, it can be seen that, even though both are located in the region away from the fan 120 and at the end of the airflow guiding structure, the embodiments of this application still have better heat dissipation efficiency.

[0088] In some embodiments, the electronic device of this application can be used as a server, which can be used for artificial intelligence (AI) computing, edge computing, or as a 5G server, cloud server, or vehicle networking server.

[0089] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0090] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. An electronic device, characterized by comprising: The heat dissipation module comprises: a housing comprising an inner surface, the inner surface having a central portion and a corner portion, a region above the central portion being a central region; and a fan located at the corner portion and having an air outlet facing the central region; and a first flow guide structure connected to the inner surface and extending away from the air outlet, the first flow guide structure comprising a starting portion and a front end portion, the starting portion and the front end portion being adjacent to the air outlet; wherein a virtual extension line is extended from the front end portion towards the air outlet and in parallel with the extension direction of the starting portion, the virtual extension line divides the air outlet into a first air outlet portion and a second air outlet portion, and the first air outlet portion and the second air outlet portion have different first and second widths respectively. The fan is a centrifugal fan and comprises a central shaft, the central shaft and the second air outlet portion being located on one side of the virtual extension line, the first air outlet portion being located on the other side of the virtual extension line, and the first width being smaller than the second width. The first flow guide structure extends from the corner portion to the central portion. 2.The electronic device of claim 1, wherein, The first flow guide structure comprises a plurality of turning angles, at least one of the plurality of turning angles having an angle between 130 degrees and 160 degrees. 3.The electronic device of claim 1, wherein, The first flow guide structure comprises a branch portion, the branch portion being a portion of the first flow guide structure away from the air outlet. 4.The electronic device of claim 1, wherein, The housing and the first flow guide structure form a monolithic structure. 5.The electronic device of claim 1, wherein, The heat dissipation module further comprises: 6.The electronic device of claim 1, wherein, a second flow guide structure and a third flow guide structure, the second flow guide structure and the third flow guide structure being connected to the inner surface, the second flow guide structure and the third flow guide structure extending at least partially along a first axis different from the virtual extension line and being arranged on one side of the first flow guide structure; 7.The electronic device of claim 1, wherein, wherein a shortest distance from a front end portion of the second flow guide structure adjacent to the air outlet to the air outlet is smaller than a shortest distance from a front end portion of the third flow guide structure adjacent to the air outlet to the air outlet; wherein in the first axis, a shortest distance from the front end portion of the third flow guide structure to the first flow guide structure is smaller than a shortest distance from the front end portion of the second flow guide structure to the first flow guide structure, and in a second axis perpendicular to the first axis, a shortest distance from the front end portion of the third flow guide structure to the first flow guide structure is smaller than a shortest distance from the front end portion of the second flow guide structure to the first flow guide structure. The second flow guide structure and the third flow guide structure are arranged in parallel to each other. The second flow guide structure and the third flow guide structure have different lengths. 8.The electronic device of claim 7, wherein, The heat dissipation module further comprises: 9.The electronic device of claim 7, wherein, a fourth flow guide structure located on the inner surface, the fourth flow guide structure extending at least partially along a first axis different from the virtual extension line and being arranged on one side of the first flow guide structure; 10.The electronic device of claim 1, wherein, the fourth flow guide structure having a turning angle, an angle of the turning angle being between 130 degrees and 160 degrees. ​ ​

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