Voltage doubling circuit packaging device based on multi-layer layout

Abstract

The invention provides a voltage doubling circuit packaging device based on a multi-layer layout. When in use, the whole device is soaked in an insulating heat-conducting medium; the packaging device is made of an insulating material and comprises a bottom-layer packaging piece, a middle packaging piece and a top-layer packaging piece which are detachably connected in sequence, and a plurality of first grooves are formed in the top surface of the bottom-layer packaging piece; second grooves corresponding to the first grooves are formed in the bottom face of the middle packaging piece, the second grooves and the first grooves are matched to form capacitor isolation chambers, and the capacitor isolation chambers and the insulating heat-conducting media are matched to isolate the independent capacitors in a suspended mode. A communication bin is arranged on the top surface of the middle packaging part, is used for accommodating diodes among the capacitors and is communicated with each second groove; a convection flow channel is formed in the top-layer packaging piece, penetrates through the peripheral side wall of the top-layer packaging piece and communicates with the communicating bin. Through a three-layer detachable structure and independent capacitor isolation design and in combination with heat conduction oil circulation, the insulativity, the heat dissipation efficiency and the maintenance convenience of the device are remarkably improved.

Description

Technical Field

[0001] This disclosure generally relates to the field of circuit packaging technology, and more specifically to a voltage multiplier circuit packaging device based on a multilayer layout. Background Technology

[0002] X-ray-based non-destructive testing and medical imaging are two core areas of modern X-ray applications. The core component involved, the X-ray tube, requires a stable and reliable high-voltage power supply. The voltage multiplier rectifier circuit, as the core circuit structure generating this high-voltage DC power, directly affects the accuracy, stability, and integration of the detection and imaging processes through its performance and packaging.

[0003] Currently, traditional voltage multiplier circuits are mostly packaged using integral potting or simple planar layout structures. This layout structure results in close electrical distance between adjacent capacitors, which can easily lead to localized cross-breakdown in high electric field environments. At the same time, when the entire module is immersed in thermal oil, the densely packed capacitors can hinder the free flow and heat exchange of the oil, making it difficult to dissipate the heat generated by the capacitors during operation, which can easily lead to localized overheating and thus affect the electrical performance and long-term reliability of the components. Summary of the Invention

[0004] In view of the above-mentioned defects or deficiencies in the prior art, it is desirable to provide a voltage multiplier circuit packaging device based on a multi-layer layout to solve the above problems.

[0005] This application provides a voltage multiplier circuit packaging device based on a multi-layer layout, which is entirely immersed in an insulating and thermally conductive medium during use; the packaging device is made of insulating material and includes a bottom packaging component, an intermediate packaging component, and a top packaging component that are detachably connected in sequence. The top surface of the bottom package has a plurality of first grooves arranged thereon; The bottom surface of the intermediate package has a second groove corresponding to each of the first grooves. The second grooves cooperate with the first grooves to form a capacitor isolation chamber. The capacitor isolation chamber cooperates with an insulating and thermally conductive medium to suspend and isolate the independent capacitors. The top surface of the intermediate package has a connecting compartment for accommodating the diodes between the capacitors. The connecting compartment connects to each of the second grooves. The top-level encapsulation component has a convection channel that penetrates the peripheral sidewall of the top-level encapsulation component and communicates with the connecting compartment.

[0006] According to the technical solution provided in the embodiments of this application, the top surface of the bottom package is further provided with a first through groove, the first through groove extends along the length direction of the bottom package and connects the two ends of the bottom package; the bottom surface of the intermediate package is further provided with a second through groove, the second through groove extends along the length direction of the intermediate package and connects the two ends of the intermediate package; the first through groove and the second through groove cooperate to form an output circuit isolation chamber.

[0007] According to the technical solution provided in the embodiments of this application, a plurality of first grooves are arranged in two groups, and the two groups of first grooves are respectively placed on both sides of the first through groove; a plurality of second grooves are arranged in two groups, and the two groups of second grooves are respectively placed on both sides of the second through groove.

[0008] According to the technical solution provided in the embodiments of this application, the first groove is inclined and the angle between it and the length direction of the bottom package is a set acute angle; the second groove is inclined and the angle between it and the length direction of the intermediate package is a set acute angle.

[0009] According to the technical solution provided in the embodiments of this application, the connecting compartment includes a plurality of diode isolation chambers, which are arranged along the length direction of the intermediate package and coincide with the projection of the second through groove on the top surface of the intermediate package.

[0010] According to the technical solution provided in the embodiments of this application, the communication compartment further includes a pin isolation chamber, which connects two adjacent diode isolation chambers and two adjacent second grooves.

[0011] According to the technical solution provided in the embodiments of this application, the plurality of diode isolation chambers are divided into a plurality of first isolation chambers and a plurality of second isolation chambers, and the first isolation chambers and second isolation chambers are arranged alternately; the two side walls of the first isolation chambers are connected by a reinforcing part.

[0012] According to the technical solution provided in the embodiments of this application, the convection channel includes: Multiple transverse flow channels are arranged along the width direction of the top-level package and penetrate the outer walls of both ends of the top-level package in the length direction. Multiple longitudinal flow channels are arranged along the length direction of the top-layer package and penetrate the outer walls of both ends of the top-layer package in the width direction.

[0013] According to the technical solution provided in the embodiments of this application, the top surface of the top-layer encapsulation component is further provided with a connecting hole, which connects to the convection channel.

[0014] According to the technical solution provided in the embodiments of this application, one end of the top surface of the bottom package is also provided with an embedded load resistor receiving compartment.

[0015] Compared with existing technologies, the advantages of this application are as follows: By employing a three-layer chamber structure consisting of a bottom package, an intermediate package, and a top package that are sequentially detachably connected, and being immersed entirely in an insulating and thermally conductive medium, the multiple first grooves on the top surface of the bottom package and the corresponding second grooves on the bottom surface of the intermediate package form independent capacitor isolation chambers, achieving suspension isolation for each capacitor and physical isolation between adjacent capacitors, effectively reducing the risk of discharge. When the device is immersed in the insulating and thermally conductive medium, the oil fills each chamber, encapsulating the capacitors within the capacitor isolation chambers and providing both insulation and thermal conductivity. Simultaneously, the connecting chamber on the top surface of the intermediate package not only accommodates diodes for component isolation but also connects with the convection channels within the capacitor isolation chambers and the top package, forming a circulating channel for the insulating and thermally conductive medium, utilizing the heated oil convection for efficient heat dissipation. Furthermore, the three-layer detachably connected structure facilitates assembly and maintenance. In summary, this device significantly improves the overall performance of the high-voltage multiplier circuit in terms of miniaturization, insulation reliability, and thermal management. Attached Figure Description

[0016] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings: Figure 1 A schematic diagram of the structure of the voltage multiplier circuit packaging device based on a multi-layer layout provided in Example 1; Figure 2 This is a schematic diagram of the top surface structure of the bottom-layer package. Figure 3 This is a schematic diagram of the top surface structure of the intermediate package component; Figure 4 This is a schematic diagram of the bottom structure of the top-level package. Figure 5 This is a schematic diagram of the voltage multiplier circuit provided in Example 2.

[0017] Reference numerals: 1. Bottom package; 2. Middle package; 3. Top package; 4. First recess; 5. Second recess; 6. Connecting compartment; 7. Convection channel; 8. First through slot; 9. Second through slot; 10. Diode isolation chamber; 11. Lead isolation chamber; 12. First isolation chamber; 13. Second isolation chamber; 14. Reinforcement section; 15. Lateral channel; 16. Longitudinal channel; 17. Connecting hole; 18. Load resistor receiving compartment; 19. Lead groove; 20. First threaded hole; 21. First mounting hole; 22. Second threaded hole; 23. Second mounting hole. Detailed Implementation

[0018] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.

[0019] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0020] Example 1 Please refer to Figures 1-4 This embodiment provides a voltage multiplier circuit packaging device based on a multi-layer layout, which is immersed entirely in an insulating and thermally conductive medium during use; the packaging device is made of insulating material and includes a bottom packaging component 1, an intermediate packaging component 2, and a top packaging component 3 that are detachably connected in sequence. The top surface of the bottom encapsulation component 1 is provided with a plurality of first grooves 4; The bottom surface of the intermediate package 2 is provided with a second groove 5 corresponding to each of the first grooves 4. The second groove 5 and the first groove 4 cooperate to form a capacitor isolation chamber. The capacitor isolation chamber cooperates with the insulating and thermally conductive medium to suspend and isolate the independent capacitors. The top surface of the intermediate package 2 is provided with a connecting chamber 6. The connecting chamber 6 is used to accommodate the diode between the capacitors. The connecting chamber 6 connects each of the second grooves 5. The top-level encapsulation component 3 has a convection channel 7 inside, which penetrates the peripheral sidewall of the top-level encapsulation component 3 and communicates with the connecting chamber 6.

[0021] Specifically, the voltage multiplier circuit packaging device based on a multi-layer layout in this embodiment is preferably applied to the high-voltage power supply system of an X-ray thickness measurement device. During use, the entire device needs to be immersed in an insulating and thermally conductive medium. The insulating and thermally conductive properties of the medium simultaneously achieve circuit insulation protection and efficient heat dissipation. Preferably, the insulating and thermally conductive medium is thermally conductive oil. The device adopts a three-layer modular structure, consisting of a bottom layer package 1, a middle package 2, and a top layer package 3 from bottom to top. All three are integrally molded from high-temperature and high-pressure resistant insulating materials and are connected in a detachable manner for convenient subsequent component assembly, maintenance, and replacement. The choice of insulating material can be based on the moisture-proof and strength requirements of the application field. In this embodiment, the bottom layer package 1, the middle package 2, and the top layer package 3 are all made of modified epoxy resin.

[0022] The bottom package 1 is a cuboid plate with multiple first grooves 4 evenly arranged along its length on its top surface. The shape of each first groove 4 is adapted to the shape of the independent capacitor to be installed. The groove depth ensures that the capacitor can be inserted, and after insertion, there is a gap between the bottom and the wall of the groove to allow space for the flow of the insulating and heat-conducting medium. At the same time, the top surface of the bottom package 1 is also provided with a lead groove 19 extending along its length. This groove is connected to at least one first groove 4 and can accommodate the wire harness connecting the capacitor to the external transformer. This avoids the wire harness from being piled up messily, resulting in insufficient insulation distance, and also protects the wire harness from damage during assembly or use. The top surface of the bottom package 1 is also provided with multiple first threaded holes 20 for connection and fixation with the intermediate package 2.

[0023] The intermediate package 2 is also a cuboid plate with dimensions matching the bottom package 1. Its bottom surface has a second groove 5 at the position of each first groove 4. When the bottom layer and the intermediate package 2 are fitted together, the first groove 4 and the second groove 5 are precisely aligned to form an independent capacitor isolation chamber. Each isolation chamber can only hold one capacitor, achieving physical isolation between adjacent capacitors to reduce the risk of partial discharge under high electric fields. Compared with the traditional method of laying capacitors flat on the circuit board, the packaging structure of this embodiment achieves an effect similar to suspending the capacitor. The gaps around the perimeter can be filled with insulating and thermally conductive medium, taking into account both insulation and thermal conductivity. The top surface of the intermediate package 2 is provided with a connecting chamber 6, which is connected to each second groove 5 through an internal reserved channel. It is used to accommodate the connecting diode between capacitors and to allow the insulating and heat-conducting medium to flow freely between the capacitor isolation chamber and the connecting chamber 6. The intermediate package 2 has multiple first mounting holes 21 at the positions corresponding to the first threaded hole 20 of the bottom layer. During assembly, the bolts are screwed into the first threaded hole 20 through the first mounting hole 21 to fix the bottom layer and the intermediate package 2. The top surface is also provided with multiple second threaded holes 22 for connecting with the top package 3.

[0024] The top-layer package 3 is a cuboid plate that matches the size of the intermediate package 2. It has internal convection channels 7 that penetrate the peripheral sidewalls. When the top layer and intermediate package 2 are attached, the bottom of the convection channels 7 connects to the connecting chamber 6, forming a complete circulating channel for the insulating and heat-conducting medium. Multiple second mounting holes 23 are provided on the top-layer package 3 corresponding to the second threaded hole 22 in the middle. Bolts are passed through the second mounting holes 23 and screwed into the second threaded holes 22 to secure the intermediate and top-layer packages 3. During assembly, the capacitor is first placed in the first groove 4 of the bottom layer. The connection harness between the capacitor and the transformer is then arranged through the lead groove 19. The intermediate package 2 is then snapped on and secured. Subsequently, diodes are installed in the connecting chamber 6 and the circuit connection is completed. Finally, the top-layer package 3 is snapped on and secured. After the entire assembly is completed, it can be immersed in the insulating and heat-conducting medium for use.

[0025] During operation, the capacitor and diode operate in separate, isolated spaces. This physical isolation, combined with the insulating properties of the thermally conductive insulating medium, effectively suppresses partial discharge. The heat generated by the components is transferred to the thermally conductive insulating medium, which then forms natural convection with the external low-temperature medium through convection channel 7. This continuous medium circulation removes internal heat, preventing localized overheating through thermodynamic principles. Furthermore, the detachable structure of the three-layer package allows for easy separation of components during subsequent maintenance or replacement by simply removing the corresponding bolts, resulting in convenient operation and low maintenance costs.

[0026] Furthermore, the top surface of the bottom package 1 is provided with a first through groove 8, which extends along the length direction of the bottom package 1 and connects the two ends of the bottom package 1; the bottom surface of the intermediate package 2 is provided with a second through groove 9, which extends along the length direction of the intermediate package 2 and connects the two ends of the intermediate package 2; the first through groove 8 and the second through groove 9 cooperate to form an output circuit isolation chamber.

[0027] Specifically, such as Figure 2 As shown, the top surface of the bottom package 1 is also provided with a first through groove 8 extending along the length direction of the bottom package 1. The two ends of the first through groove 8 are respectively connected to the outer walls of the two ends along the length direction of the bottom package 1. The width and depth of the groove are set according to the size of the wires, terminals or connectors to be accommodated in the output circuit, ensuring that the relevant components will not cause assembly difficulties due to insufficient space, nor will the structural stability be affected by excessive gaps after being placed. At the same time, the position of the first through groove 8 avoids the communication area between the lead groove 19 and the first groove 4, avoiding interference with the capacitor connection harness, and ensuring that the layout of each component is clear and does not affect each other.

[0028] Correspondingly, such as Figure 3 As shown, the bottom surface of the intermediate package 2 (i.e. the side that is in contact with the bottom package 1) is provided with a second through groove 9 at the position opposite to the first through groove 8. The second through groove 9 also extends along the length direction of the intermediate package 2, and its two ends are connected to the outer walls of the two ends along the length direction of the intermediate package 2. Its width and depth are completely consistent with the first through groove 8, ensuring that after the bottom package 1 and the intermediate package 2 are fixed and attached by bolts, the first through groove 8 and the second through groove 9 can be precisely connected to form a closed output circuit isolation chamber that extends along the length direction of the device.

[0029] The core function of this output circuit isolation chamber is to independently contain and isolate the high-voltage output circuit of the voltage multiplier circuit. It completely separates the output circuit's wires, terminals, and other components from the capacitors in the capacitor isolation chamber and the diodes in the connecting compartment 6, significantly increasing the electrical distance between the high-voltage output circuit and other components. This avoids electromagnetic interference or breakdown risks to core components such as capacitors and diodes during high-voltage output. At the same time, when the entire device is immersed in an insulating and thermally conductive medium, the insulating and thermally conductive medium will fully fill the output circuit isolation chamber. This not only provides insulation protection for the output circuit components but also transfers the heat generated during the operation of the output circuit to the insulating and thermally conductive medium. The heat is then dissipated through the convection channel 7 of the top-layer encapsulation 3, further improving the overall thermal management effect of the device.

[0030] Meanwhile, the two ends of the connecting compartment 6 on the top surface of the intermediate package 2 are also connected to the second through slot 9. This connection design provides a channel for the circuit connection between the capacitor, diode and high voltage output circuit, ensuring that the capacitor and diode can be effectively connected to the high voltage output circuit through the wires in this connecting area, so as to realize the complete circuit function of the voltage multiplier circuit.

[0031] In conventional voltage multiplier circuits, a sampling resistor and sampling point are typically included in the high-voltage output circuit for real-time monitoring of the output current. The size of the output circuit isolation chamber is designed to accommodate the sampling resistor and sampling point, facilitating connection of external devices to the sampling point.

[0032] Furthermore, the plurality of first grooves 4 are arranged in two groups, with the two groups of first grooves 4 respectively placed on both sides of the first through groove 8; the plurality of second grooves 5 are arranged in two groups, with the two groups of second grooves 5 respectively placed on both sides of the second through groove 9.

[0033] Specifically, in the structural design of the bottom-level package 1, such as Figure 2 As shown, the multiple first grooves 4 are not arranged in a single queue, but are divided into two groups according to the position of the first through groove 8. It should be noted that these two groups of first grooves 4 are not relatively independent structures. The capacitors they contain belong to the same voltage multiplier circuit, and the two are connected by a circuit to achieve the voltage multiplication function. The two groups of first grooves 4 are symmetrically arranged on both sides of the first through groove 8. That is, the first through groove 8 extends along the length of the bottom package 1 to form a "center line". One side is the first group of first grooves 4, and the other side is the second group of first grooves 4. The number of grooves in the two groups is the same, and the first grooves 4 in each group are evenly distributed along the length of the bottom package 1. The spacing between two adjacent first grooves 4 is preferably set to 1.2-1.5 times the diameter of the capacitor, which avoids insufficient insulation distance due to too small a spacing and waste of device volume due to too large a spacing.

[0034] Correspondingly, the bottom structure of the intermediate package 2 is also adapted to the grouping layout of the first groove 4 of the bottom package 1, such as... Figure 3 As shown, the multiple second grooves 5 are also divided into two groups, with the two groups of second grooves 5 placed on both sides of the second through groove 9. Since the second through groove 9 needs to precisely align with the first through groove 8 when the intermediate package 2 and the bottom package 1 are fitted together, the second grooves 5 on both sides are not only identical in number to the corresponding first grooves 4 on the bottom side, but also perfectly aligned in position. This ensures that after the bottom package 1 and the intermediate package 2 are fixed with bolts, each first groove 4 can precisely engage with the corresponding second groove 5 to form an independent capacitor isolation chamber, preventing misalignment due to group arrangement. This grouping design, while reducing the length dimension, also increases the physical and electrical distance between the capacitor groups on both sides by using the output circuit isolation chamber formed by the first through groove 8 and the second through groove 9 as a buffer. This effectively reduces the potential problem of local electric field concentration when large-scale capacitors are densely arranged, balancing space compactness and insulation reliability.

[0035] Furthermore, the first groove 4 is inclined and forms a set acute angle with the length direction of the bottom encapsulation 1; the second groove 5 is inclined and forms a set acute angle with the length direction of the intermediate encapsulation 2.

[0036] Specifically, in the structural design of the bottom-level package 1, such as Figure 2 As shown, multiple groups of first grooves 4, grouped and arranged on both sides of the first through slot 8, are all inclined. The extension direction of each first groove 4 forms a set acute angle with the length direction of the bottom package 1. This acute angle is set according to the capacitor size and the wiring requirements of the voltage multiplier circuit, preferably 60°, which ensures that there is still enough suspension space after the capacitor is placed, and maximizes the space optimization effect of the inclined arrangement. At the same time, the first grooves 4 on both sides are symmetrically inclined: the first groove 4 on the left side of the first through slot 8 is inclined towards the first through slot 8; the first groove 4 on the right side is also inclined towards the first through slot 8, so that the two grooves form a "symmetrical inward inclination" layout. This avoids the capacitors on both sides from extending too far outward in the width direction, which would widen the device, and allows the capacitor pins to be closer to the first through slot 8, reserving a more reasonable wiring distance for subsequent connection with the diode in the connecting compartment 6.

[0037] Correspondingly, the second groove 5 on the bottom surface of the intermediate package 2 is also perfectly matched with the inclined design of the first groove 4, such as... Figure 3As shown, the angle between the extension direction of each second groove 5 on both sides of the second through groove 9 and the length direction of the intermediate package 2 is exactly the same as the acute angle of the bottom first groove 4, and the tilt direction is also consistent with the corresponding first groove 4. This precise tilt design ensures that when the bottom package 1 and the intermediate package 2 are attached and fixed, each first groove 4 can be seamlessly engaged with the corresponding second groove 5, forming a capacitor isolation chamber with a complete inner wall and no misalignment. After the capacitor is placed, the gap between the side wall and the inner wall of the groove is uniform, which will not cause the capacitor to shift or shake due to tilting, and also ensures that the insulating and thermally conductive medium fills the gap evenly, giving full play to the insulation and thermal conductivity.

[0038] Furthermore, the connecting compartment 6 includes a plurality of diode isolation chambers 10, which are arranged along the length direction of the intermediate package 2 and coincide with the projection of the second through groove 9 on the top surface of the intermediate package 2.

[0039] Specifically, in the structural design of the intermediate package 2, such as Figure 3 As shown, the connecting chamber 6 is not a single slot, but is divided into multiple independent diode isolation chambers 10. The number of diode isolation chambers 10 perfectly matches the number of diodes required for the voltage multiplier circuit, and all diode isolation chambers 10 are evenly arranged along the length of the intermediate package 2. A certain distance is maintained between adjacent isolation chambers to avoid insufficient insulation distance between diodes due to the isolation chambers being too close, and to prevent waste of space on the top surface of the intermediate package 2 due to excessive spacing. The shape of each diode isolation chamber 10 is adapted to the shape of the diode to be installed, and the sidewall of the slot adopts a rounded transition design to avoid sharp edges scratching the diode leads or insulating shell; at the same time, the bottom of each diode isolation chamber 10 has a reserved channel communicating with the second groove 5 below, ensuring that after the diode is placed in the isolation chamber, it can be connected to the capacitor in the capacitor isolation chamber below through this channel.

[0040] Crucially, the projections of the multiple diode isolation chambers 10 onto the top surface of the intermediate package 2 completely overlap with the second through-slot 9 on the bottom surface of the intermediate package 2. The core purpose of this layout design is to accommodate the grouped arrangement of capacitors, significantly simplifying the connection between capacitors and diodes. As described above, the capacitors are positioned on either side of the first through-slot 8 and the second through-slot 9 via two sets of inclined first grooves 4 and second grooves 5, respectively, while the diode isolation chambers 10 are located precisely between the two sets of capacitors. This layout ensures that the diodes within each diode isolation chamber are close to the capacitors in their corresponding isolation chambers on either side. During connection, no additional lead wires are needed; only short leads are required to achieve circuit connection between the diodes and the capacitors on both sides. This reduces the amount of lead wire used and avoids bending and crossing problems caused by long lead distances, lowering the risk of insufficient insulation distance or increased resistance loss due to messy lead wires. Furthermore, this overlapping projection design also optimizes the flow path of the insulating thermally conductive medium. Since the diode isolation chamber 10 and the output circuit isolation chamber below are vertically aligned, the dielectric can flow directly downwards into the output circuit isolation chamber after flowing into the diode isolation chamber 10 from the top convection channel 7, and then diffuse to the capacitor isolation chambers on both sides, avoiding the oil flow from detours due to spatial misalignment and improving heat dissipation efficiency.

[0041] Furthermore, the connecting compartment 6 also includes a pin isolation chamber 11, which connects two adjacent diode isolation chambers 10 and two adjacent second recesses 5.

[0042] Specifically, in the structural design of the intermediate package 2, such as Figure 3 As shown, the connecting chamber 6 also includes pin isolation chambers 11 located on both sides of the diode isolation chamber 10. The number of pin isolation chambers 11 is equal to the number of diode isolation chambers 10, and each pin isolation chamber 11 has a dual connectivity function: on one hand, it connects to two adjacent diode isolation chambers 10, reserving a path for circuit connection between diodes; on the other hand, it connects to two adjacent second recesses 5. This design stems from the core requirement of voltage multiplier circuits: most diodes need to be connected to two capacitors simultaneously to form a complete voltage multiplier circuit. Therefore, each pin isolation chamber 11 needs to precisely align with two second recesses 5 to ensure that capacitor pins can be easily connected to diode pins through the isolation chamber.

[0043] It should be noted that the structure of the pin isolation chamber 11 is adapted to the inclined characteristics of the second groove 5. Because the second groove 5 is arranged in two groups on both sides of the second through groove 9, and the inclination directions of the two groups of second groove 5 are different, there are slight differences in the groove orientation of the pin isolation chambers 11 on both sides, such as... Figure 3As shown, both can stably connect the two second grooves 5, preventing the capacitor pins from bending due to the tilt of the grooves. At the same time, the groove size of the pin isolation chamber 11 matches the diameter of the lead wire, which can accommodate 2-3 connecting leads while allowing the insulating and heat-conducting medium to be fully filled, thus taking into account both lead wire insulation protection and a small amount of heat dissipation.

[0044] Furthermore, the plurality of diode isolation chambers 10 are divided into a plurality of first isolation chambers 12 and a plurality of second isolation chambers 13, with the first isolation chambers 12 and the second isolation chambers 13 arranged alternately; the two side walls of the first isolation chambers 12 are connected by a reinforcing part 14.

[0045] Specifically, in the structural design of the intermediate package 2, such as Figure 3 As shown, the multiple diode isolation chambers 10 are further subdivided into a first isolation chamber 12 and a second isolation chamber 13. It should be noted that the core functions of the two types of isolation chambers are completely identical, both used to accommodate the same type of diode in the voltage multiplier circuit. The only difference lies in the local structure due to the structural strength requirements of the intermediate package 2. Specifically, the processing of the intermediate package 2 must simultaneously meet the dual requirements of opening a second groove 5 on the bottom surface and opening diode isolation chambers 10 and lead isolation chambers 11 on the top surface. The opening of a large number of grooves results in a large number of hollow areas in the overall structure of the intermediate package 2. If all diode isolation chambers 10 adopt a completely open top design, it is easy to cause local structural weakness in the intermediate package 2. After long-term use or under the influence of thermal cycling of the insulating and heat-conducting medium, sidewall deformation and cracking may occur.

[0046] To address this issue, the design incorporates structural adjustments to some diode isolation chambers 10: The two side walls of the first isolation chamber 12 retain a connection structure at the top surface of the intermediate package 2; this connection constitutes the reinforcement 14. The reinforcement 14 is integrally formed with the intermediate package 2, using the same high-temperature, high-pressure resistant modified epoxy resin. Its height is flush with the top surface of the intermediate package 2, and its width is determined based on the spacing between the isolation chamber side walls, covering only the central area of ​​the top of the first isolation chamber 12. This design neither obstructs the insertion of the diode from the top of the isolation chamber nor affects the communication between the bottom of the isolation chamber and the second recess 5, nor between the side walls and the lead isolation chamber 11. The second isolation chamber 13, however, maintains a completely open top design, and its two side walls do not have reinforcement 14 at the top surface of the intermediate package 2.

[0047] Two types of isolation chambers are arranged alternately along the length of the intermediate package 2. The core purpose of this alternating arrangement is to ensure that the reinforcing parts 14 are evenly distributed on the top surface of the intermediate package 2. Firstly, it avoids excessive concentration of the reinforcing parts 14, which could lead to local space congestion and affect the routing of lead wires or the flow of insulating and heat-conducting media. Secondly, by alternating between the reinforcing and conventional areas, uniform support can be formed for the hollowed-out areas of the intermediate package 2, effectively compensating for the structural strength loss caused by the opening of multiple slots. This ensures that the intermediate package 2 can maintain its shape stability under the tightening force of the mounting bolts and the pressure of the medium, avoiding loosening of the diode and capacitor pin connections due to deformation.

[0048] Furthermore, the convection channel 7 includes: Multiple transverse flow channels 15 are arranged along the width direction of the top-layer encapsulation 3 and penetrate the outer walls of both ends of the top-layer encapsulation 3 in the length direction. Multiple longitudinal flow channels 16 are arranged along the length direction of the top layer encapsulation 3 and penetrate the outer walls of both ends of the top layer encapsulation 3 in the width direction.

[0049] Specifically, in the structural design of the top-level encapsulation component 3, such as Figure 4 As shown, the convection channel 7 is further refined into interconnected transverse channels 15 and longitudinal channels 16. Both are channels opened on the bottom surface of the top-layer encapsulation 3, forming a grid-like channel system covering the entire area of ​​the top-layer encapsulation 3. Among them, multiple transverse channels 15 are evenly arranged along the width direction of the top-layer encapsulation 3. In this embodiment, three channels are set according to the width dimension of the top layer. Each transverse channel 15 horizontally penetrates the outer walls of both ends of the top-layer encapsulation 3 in the length direction, that is, it extends from one end of the length direction of the top-layer encapsulation 3 to the other end. The openings at both ends are directly connected to the external insulating thermally conductive medium environment. The cross-section of the channel is preferably rectangular.

[0050] Multiple longitudinal flow channels 16 are evenly arranged along the length of the top-layer encapsulation 3. In this embodiment, two longitudinal flow channels are provided. Each longitudinal flow channel 16 horizontally penetrates both ends of the outer wall of the top-layer encapsulation 3 in the width direction, that is, it extends from one side of the top-layer encapsulation 3 in the width direction to the other side. It is also connected to the external insulating thermally conductive medium. Its cross-sectional dimensions are consistent with those of the transverse flow channels 15 to ensure that the oil flow velocity is balanced in the transverse and longitudinal directions. The transverse flow channels 15 and the longitudinal flow channels 16 are completely intersecting and connected inside the top-layer encapsulation 3, forming multiple cross-shaped connecting nodes. This grid structure allows the external insulating thermally conductive medium to enter from the flow channel openings in any direction and quickly diffuse to the entire flow channel system through the intersecting nodes, without causing heat dissipation failure due to blockage of the flow channel in one direction.

[0051] Furthermore, the top surface of the top layer encapsulation 3 is also provided with a connecting hole 17, which connects to the convection channel 7.

[0052] Specifically, in the structural design of the top-level encapsulation component 3, such as Figure 4 As shown, the top surface of the top-layer encapsulation 3 has multiple connecting holes 17. All connecting holes 17 penetrate vertically through the thickness direction of the top-layer encapsulation 3, and their bottoms are fully connected to the convection channels 7. The positions of the connecting holes 17 can preferably correspond to the intersection nodes of the transverse channels 15 and the longitudinal channels 16, as these nodes are the core areas where oil flows converge. Opening the connecting holes 17 at these locations maximizes the communication range with the channels. If there are many intersection nodes, a small number of connecting holes 17 can also be added between adjacent nodes. The setting of the connecting holes 17 increases the flow efficiency of the insulating and thermally conductive medium inside and outside the encapsulation device, thereby improving the heat exchange effect.

[0053] Furthermore, the top surface of the bottom package 1 is also provided with an embedded load resistor receiving compartment 18.

[0054] Specifically, since the voltage multiplier circuit requires a load resistor to stabilize the output voltage and protect circuit components during operation, an embedded load resistor receiving chamber 18 is provided at one end of the top surface of the bottom package 1 (preferably the side closer to the circuit output terminal, avoiding the arrangement area of ​​the first groove 4 and the lead groove 19). This receiving chamber is a recessed groove integrally formed with the bottom package 1. The shape, depth, and width of the groove are all set according to the size of the adapted load resistor to ensure that the load resistor can be completely embedded in the groove after being placed, and the top surface does not protrude from the top surface of the bottom package 1, avoiding gaps or compression resistors when it is attached to the intermediate package 2; at the same time, a gap of 1-2mm is reserved between the inner wall of the receiving chamber and the load resistor to reserve space for the filling of heat transfer oil.

[0055] Example 2 This embodiment provides a specific implementation method, which uses the packaging device provided in Embodiment 1 to... Figure 5 The voltage multiplier circuit shown is packaged as follows. Figure 5 As shown, F is the transformer, C1-C N For capacitors, D1-D N For diodes, R W R is the load resistor, R1 is one of the sampling resistors, R N For the other sampling resistors, point A is the positive terminal of the high-voltage output circuit, point B is the negative terminal of the high-voltage output circuit, and point C is a sampling point.

[0056] During packaging, capacitors C1-C N Diodes D1-D are placed sequentially in multiple capacitor isolation chambers. N The load resistor R is placed within multiple diode isolation chambers 10. W The sampling resistor R1 and multiple R are placed in the load resistor housing 18. NThe high-voltage output circuit is located within the output circuit isolation chamber, and the lead wire used for sampling at point C can be led outward from the openings at both ends of the output circuit isolation chamber. In other embodiments, an isolation chamber for accommodating the transformer can also be provided in the encapsulation device.

[0057] The above description is merely a preferred embodiment of this application and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of the invention involved in this application is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the inventive concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features with similar functions disclosed in this application.

Claims

1. A multi-layer layout based voltage doubler circuit packaging apparatus, comprising: When in use, the whole is soaked in the insulating and heat-conducting medium; the packaging device is made of insulating material and comprises a bottom packaging piece (1), a middle packaging piece (2) and a top packaging piece (3) which are detachably connected in sequence, A plurality of first grooves (4) are arranged on the top surface of the bottom packaging piece (1). A second groove (5) corresponding to each first groove (4) is arranged on the bottom surface of the middle packaging piece (2), the second groove (5) and the first groove (4) cooperate to form a capacitor isolation chamber, and the capacitor isolation chamber cooperates with the insulating and heat-conducting medium to suspend and isolate the independent capacitor; a communication bin (6) is arranged on the top surface of the middle packaging piece (2), the communication bin (6) is used for accommodating a diode between capacitors, and the communication bin (6) communicates with each second groove (5). A convection flow channel (7) is arranged in the top packaging piece (3), the convection flow channel (7) penetrates through the side wall of the top packaging piece (3) and communicates with the communication bin (6).

2. The multi-layer layout based voltage doubler circuit packaging device of claim 1, wherein, The top surface of the bottom packaging piece (1) is further provided with a first through groove (8), the first through groove (8) extends along the length direction of the bottom packaging piece (1) and communicates with both ends of the bottom packaging piece (1); the bottom surface of the middle packaging piece (2) is further provided with a second through groove (9), the second through groove (9) extends along the length direction of the middle packaging piece (2) and communicates with both ends of the middle packaging piece (2); the first through groove (8) and the second through groove (9) cooperate to form an output loop isolation chamber.

3. The multi-layer layout based voltage doubler circuit packaging device of claim 2, wherein, The plurality of first grooves (4) are arranged in two groups, and the two groups of first grooves (4) are respectively arranged on both sides of the first through groove (8); the plurality of second grooves (5) are arranged in two groups, and the two groups of second grooves (5) are respectively arranged on both sides of the second through groove (9).

4. The multi-layer layout based voltage doubling circuit packaging device of claim 1, wherein, The first grooves (4) are arranged obliquely, and the included angle between the first grooves (4) and the length direction of the bottom packaging piece (1) is a set acute angle; the second grooves (5) are arranged obliquely, and the included angle between the second grooves (5) and the length direction of the middle packaging piece (2) is a set acute angle.

5. The multi-layer layout based voltage doubling circuit packaging device of claim 2, wherein, The communication bin (6) comprises a plurality of diode isolation chambers (10), the plurality of diode isolation chambers (10) are arranged along the length direction of the middle packaging piece (2) and coincide with the projection of the second through groove (9) on the top surface of the middle packaging piece (2).

6. The multi-layer layout based voltage doubling circuit package device of claim 5, wherein, The communication bin (6) further comprises a pin isolation chamber (11), the pin isolation chamber (11) communicates with two adjacent diode isolation chambers (10) and two adjacent second grooves (5).

7. The multi-layer layout based voltage doubling circuit packaging device of claim 5, wherein The plurality of diode isolation chambers (10) are divided into a plurality of first isolation chambers (12) and a plurality of second isolation chambers (13), the first isolation chambers (12) and the second isolation chambers (13) are alternately arranged; the two side walls of the first isolation chamber (12) are connected by a reinforcing portion (14).

8. The multi-layer layout based voltage doubling circuit package device of claim 1, wherein, The convection flow channel (7) comprises: A plurality of transverse flow channels (15) are arranged along the width direction of the top packaging piece (3) and penetrate through the outer walls of both ends in the length direction of the top packaging piece (3). A plurality of longitudinal flow channels (16) are arranged along the length direction of the top package (3) and pass through the two end walls in the width direction of the top package (3).

9. The multi-layer layout based voltage doubling circuit package device of claim 1, wherein, The top surface of the top package (3) is further provided with a communication hole (17) which communicates with the counterflow flow channel (7).

10. The multi-layer layout based voltage doubling circuit package device of claim 1, wherein, An inner-embedded load resistance accommodating bin (18) is further arranged at one end of the top surface of the bottom package (1).

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