Power brick, motor controller and vehicle

Abstract

The invention discloses a power brick, a motor controller and a vehicle, and relates to the technical field of vehicles, the power brick comprises a shell, a water cooling plate, a power module core group, a thin film capacitor core package assembly and a driving control circuit board; the water cooling plate is arranged in the shell and divides an inner cavity of the shell into a first accommodating cavity for accommodating the power module core group and the driving control circuit board and a second accommodating cavity for accommodating the thin-film capacitor core package assembly, the first accommodating cavity is positioned on one side, facing the open end of the shell, of the water cooling plate, and the second accommodating cavity is positioned on one side, deviating from the open end, of the water cooling plate; the water-cooling plate is provided with a water-cooling channel, and the shell is provided with a water inlet and a water outlet which are communicated with the water-cooling channel; the drive control circuit board is located on the side, away from the thin-film capacitor core package assembly, of the power module core assembly. The inner cavity of the shell is filled with pouring sealant for coating the power module core group, the thin-film capacitor core package assembly and the driving control circuit board; according to the invention, the requirements of high integration level, low cost and smaller arrangement space of the power brick can be met.

Description

Technical Field

[0001] This invention relates to the field of vehicle technology, and in particular to a power brick, a motor controller, and a vehicle. Background Technology

[0002] In new energy vehicle motor controllers, the power brick is a core component, and its high integration and high power density are the main trends in current technological development. A power brick includes functional components such as a metal housing, power modules, film capacitors, three-phase plastic-coated assemblies, drive circuit boards, and control circuit boards. However, existing power brick technology still has some problems. On the one hand, the power modules, film capacitors, and three-phase plastic-coated assemblies are all independently packaged. Multiple independently packaged components not only occupy a large space volume but also lead to higher overall costs. On the other hand, the above components, including the drive circuit board and control circuit board, must be sequentially installed and fixed into the metal housing, and the components must be connected by bolts. This results in a large number of internal components in the power brick, a complex assembly process, and further increases the overall size. Summary of the Invention

[0003] The main objective of this invention is to propose a power brick, a motor controller, and a vehicle, which aims to achieve high integration, low cost, and smaller layout space requirements for the power brick.

[0004] To achieve the above objectives, the present invention provides a power brick comprising: The shell has an open end; A water-cooled plate is disposed inside the housing, dividing the inner cavity of the housing into a first receiving cavity and a second receiving cavity. The first receiving cavity is located on the side of the water-cooled plate facing the open end, and the second receiving cavity is located on the side of the water-cooled plate away from the open end. The water-cooled plate is provided with a water-cooling channel for coolant flow, and the housing is provided with an inlet and an outlet communicating with the water-cooling channel. The power module core is located within the first receiving cavity; A thin-film capacitor core package assembly is disposed within the second receiving cavity; A drive control circuit board is disposed in the first receiving cavity and located on the side of the power module core assembly away from the thin film capacitor core assembly; The inner cavity of the housing is filled with potting compound, which covers the power module core, the thin-film capacitor core assembly, and the drive control circuit board.

[0005] In one embodiment, the inlet and the outlet are arranged on opposite sides of the housing; and / or The drive control circuit board is equipped with a signal connector that extends out of the housing.

[0006] In one embodiment, the thin-film capacitor core package assembly includes a first DC input copper busbar, a core package assembly, and a DC output copper busbar, wherein the output terminal of the first DC input copper busbar is connected to the input terminal of the core package assembly, and the output terminal of the core package assembly is connected to the input terminal of the DC output copper busbar. The power module core assembly includes a second DC input copper busbar, a power module chip, and an AC output copper busbar. The input terminal of the second DC input copper busbar is connected to the output terminal of the DC output copper busbar, the output terminal of the second DC input copper busbar is connected to the input terminal of the power module chip, the output terminal of the power module chip is connected to the input terminal of the AC output copper busbar, and the power module chip is electrically connected to the drive control circuit board. The core package assembly is used to filter the DC power input to the first DC input copper busbar and output it to the second DC input copper busbar via the DC output copper busbar. The power module chip is used to convert the DC power input from the second DC input copper busbar into AC power, and output it to the external circuit via the AC output copper busbar.

[0007] In one embodiment, the power module chip is disposed on the side of the water-cooled plate facing the open end, the second DC input copper busbar and the AC output copper busbar are respectively arranged at opposite ends of the power module chip, and the end of the AC output copper busbar away from the second DC input copper busbar extends out of the housing.

[0008] In one embodiment, the power module chip is soldered to the side of the water-cooled plate facing the open end; and / or The second DC input copper busbar and the AC output copper busbar are respectively arranged at opposite ends of the power module chip along a first direction. The second DC input copper busbar is opposite to and welded to the DC output copper busbar along a second direction, and the second direction intersects with the first direction; and / or The housing has a positioning groove at the position corresponding to the first receiving cavity, and the opening of the positioning groove faces the open end; the power module core also includes a partition, which is inserted into the positioning groove, and the AC output copper busbar is disposed on the partition.

[0009] In one embodiment, the power module chip further includes a conductive element, one end of which is connected to the power module chip, and the other end extends from the water-cooled plate toward the drive control circuit board and is soldered to the drive control circuit board.

[0010] In one embodiment, the power brick further includes a current detection module disposed on the drive control circuit board; the AC output copper busbar is provided with a detection hole, and at least part of the current detection module passes through the detection hole to detect the current output by the AC output copper busbar and output a current detection signal to the drive control circuit board.

[0011] In one embodiment, the housing includes a housing body and a base plate, the housing body having the open end, the base plate being detachably connected to the side of the housing body away from the open end, and the thin-film capacitor core assembly being mounted on the base plate.

[0012] In one embodiment, the base plate has snap-fit ​​portions on its opposite two side edges, and each snap-fit ​​portion has a snap-fit ​​hole; the shell body has buckles protruding on its opposite two sides, and each buckle engages with the corresponding snap-fit ​​hole to fix the base plate to the shell body.

[0013] The present invention also proposes a motor controller, including the power brick as described above.

[0014] The present invention also proposes a vehicle including the motor controller described above.

[0015] The technical solution of this invention involves setting a water-cooled plate inside the housing and fixing the water-cooled plate within the housing, thus dividing the inner cavity of the housing into a first receiving cavity and a second receiving cavity. The first receiving cavity is located on the side of the water-cooled plate facing the open end of the housing, and the second receiving cavity is located on the side of the water-cooled plate away from the open end. The water-cooled plate has water-cooling channels inside for coolant flow, and the housing has corresponding inlet and outlet ports communicating with these channels, thereby achieving heat dissipation for the power module core assembly and the thin-film capacitor core assembly. Based on this structure, the power module core assembly is arranged in the first receiving cavity, while the thin-film capacitor core assembly is arranged in the second receiving cavity, placing them in chambers on opposite sides of the water-cooled plate. This effectively utilizes the double-sided heat dissipation capability of the water-cooled plate and avoids the space waste associated with traditional independent packaging. Furthermore, the drive control circuit board is placed in the first receiving cavity, located on the side of the power module core assembly away from the thin-film capacitor core assembly, forming a compact functional layout along the axial direction of the housing. After assembling the above components, potting compound is injected into the entire inner cavity through the pre-drilled potting holes on the housing until the potting compound completely covers the power module core, the thin-film capacitor core assembly, and the drive control circuit board. This integrated structural design eliminates the bolted connections and redundant installation space between multiple independently packaged components in traditional solutions. This not only significantly reduces the number of parts and assembly steps but also significantly improves the integration and power density of the power brick. At the same time, the overall potting enhances electrical insulation, mechanical stability, and environmental adaptability, thereby solving the core problems of large size, high cost, and complex assembly caused by the independent packaging of power modules, thin-film capacitors, and three-phase plastic-coated components in existing technologies. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0017] Figure 1 A cross-sectional view of an embodiment of the power brick provided by the present invention; Figure 2 An exploded view of an embodiment of the power brick provided by the present invention; Figure 3 A top view of an embodiment of the power brick provided by the present invention; Figure 4 This is a schematic diagram of a structure of an embodiment of the thin-film capacitor core package assembly provided by the present invention; Figure 5 This is a schematic diagram of a power module chip assembly according to an embodiment of the present invention; Figure 6This is a schematic diagram of another embodiment of the power module core assembly provided by the present invention; Figure 7 A top view of another embodiment of the power brick provided by the present invention; Figure 8 This is a schematic diagram of an embodiment of the drive control circuit board provided by the present invention.

[0018] Explanation of icon numbers: 100. Power bricks; 10. Shell; 101. Open end; 102. Inner cavity; 1021. First receiving cavity; 1022. Second receiving cavity; 103. Water inlet; 104. Water outlet; 105. Positioning groove; 106. Snap-fit ​​hole; 107. Filling hole; 11. Shell body; 12. Base plate; 13. Snap-fit ​​part; 14. Buckle; 20. Water-cooled plate; 201. Water-cooled channel; 30. Power module core assembly; 301. Detection hole; 31. Second DC input copper busbar; 32. Power module chip; 33. AC output copper busbar; 34. Partition; 35. Conductive component; 40. Thin-film capacitor core assembly; 41. First DC input copper busbar; 42. Core assembly; 43. DC output copper busbar; 50. Drive control circuit board; 51. Signal connector; 60. Potting compound; 70. Current detection module; X, first direction; Z, second direction; Y, third direction.

[0019] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0021] In new energy vehicle motor controllers, the power brick is a core component, and its high integration and high power density are the main trends in current technological development. A power brick includes functional components such as a metal housing, power modules, film capacitors, three-phase plastic-coated assemblies, drive circuit boards, and control circuit boards. However, existing power brick technology still has some problems. On the one hand, the power modules, film capacitors, and three-phase plastic-coated assemblies are all independently packaged. Multiple independently packaged components not only occupy a large space volume but also lead to higher overall costs. On the other hand, the above components, including the drive circuit board and control circuit board, must be sequentially installed and fixed into the metal housing, and the components must be connected by bolts. This results in a large number of internal components in the power brick, a complex assembly process, and further increases the overall size.

[0022] Therefore, the present invention proposes a power brick 100, which aims to achieve high integration, low cost and smaller layout space requirements for the power brick 100.

[0023] Please see Figures 1 to 3 In one embodiment of the present invention, the power brick 100 includes: The housing 10 has an open end 101; A water-cooled plate 20 is disposed inside the housing 10, dividing the inner cavity 102 of the housing 10 into a first receiving cavity 1021 and a second receiving cavity 1022. The first receiving cavity 1021 is located on the side of the water-cooled plate 20 facing the open end 101, and the second receiving cavity 1022 is located on the side of the water-cooled plate 20 away from the open end 101. The water-cooled plate 20 is provided with a water-cooling channel 201 for the flow of coolant, and the housing 10 is provided with an inlet 103 and an outlet 104 communicating with the water-cooling channel 201. The power module core 30 is disposed within the first receiving cavity 1021; The thin-film capacitor core package assembly 40 is disposed within the second receiving cavity 1022; The drive control circuit board 50 is disposed in the first receiving cavity 1021 and is located on the side of the power module core assembly 30 away from the thin film capacitor core package assembly 40. The inner cavity 102 of the housing 10 is filled with potting compound 60, which covers the power module core 30, the thin film capacitor core assembly 40, and the drive control circuit board 50.

[0024] In this invention, the power module 100 may include a housing 10, a power module core assembly 30, a thin-film capacitor core package assembly 40, and a drive control circuit board 50. The housing 10 has an inner cavity 102 and an open end 101 communicating with the inner cavity 102. The inner cavity 102 is used to accommodate components such as the power module core assembly 30, the thin-film capacitor core package assembly 40, and the drive control circuit board 50. The open end 101 facilitates the installation of these components into the inner cavity 102 by production personnel. The power module core assembly 30 can be a full-bridge power module core assembly or a half-bridge power module core assembly; the specific type is not limited here. The input terminal of the thin-film capacitor core package assembly 40 is electrically connected to the DC power supply of the motor controller, and its output terminal is connected to the input terminal of the power module core assembly 30. The output terminal of the power module core assembly 30 is electrically connected to the AC load of the motor controller, such as a motor. During the actual operation of the motor controller, the DC power supply outputs DC power to the thin film capacitor core assembly 40. The thin film capacitor core assembly 40 filters the input DC power and outputs it to the power module core assembly 30. The power module core assembly 30 then converts the DC power into AC power and outputs it to the AC load.

[0025] However, as mentioned earlier, in existing technologies, power module cores, thin-film capacitor core assemblies, and drive control circuit boards are typically packaged independently. Each component requires a separate housing and copper base plate, where the copper base plate is used to support and assemble its corresponding electronic components. After assembly, each component is placed inside its respective housing and sealed with potting compound. This design not only results in a bulky overall structure, making it difficult to meet the development requirements of high power density, but also significantly increases material costs and assembly complexity due to the use of multiple housings, base plates, and connectors. Furthermore, the electrical and mechanical connections between components via bolts or terminals further occupy space and reduce system reliability.

[0026] To address this challenge, the power brick 100 of the present invention also includes a water-cooled plate 20, which is disposed within the housing 10 and serves to divide the inner cavity 102 of the housing 10 into a first receiving cavity 1021 and a second receiving cavity 1022. The water-cooled plate 20 can be integrally formed with the housing 10, i.e., during injection molding or die casting, the water-cooled plate 20 is directly integrated into the housing 10 to form an integral structure; alternatively, the water-cooled plate 20 can be separately formed from the housing 10, i.e., fixed inside the housing 10 by welding. The integral forming method helps reduce the number of parts, improves structural rigidity, and avoids increased thermal resistance or sealing risks due to assembly gaps; while the separate forming method facilitates the individual processing, inspection, or replacement of the water-cooled plate 20, especially suitable for scenarios with special requirements regarding the complexity of the water-cooling channel 201 or the thermal conductivity of the material. Both solutions can be flexibly selected according to actual manufacturing processes, cost control, and heat dissipation performance requirements, ensuring reliable heat dissipation of the power brick 100 while also considering production efficiency and maintenance convenience.

[0027] It is important to note that the first receiving cavity 1021 of the housing 10 is located on the side of the water-cooling plate 20 facing the open end 101, while the second receiving cavity 1022 of the housing 10 is located on the side of the water-cooling plate 20 away from the open end 101. The power module core assembly 30 is arranged in the first receiving cavity 1021, the thin-film capacitor core package assembly 40 is arranged in the second receiving cavity 1022, and the drive control circuit board 50 is located in the first receiving cavity 1021 on the side of the power module core assembly 30 away from the thin-film capacitor core package assembly 40. By sharing a single housing 10 and the built-in water-cooling plate 20, the original independent housings 10 and copper base plates 12 of each component can be eliminated, integrating the originally dispersed structure into a single housing 10. The water-cooled plate 20 has a water-cooling channel 201 for coolant circulation inside. The housing 10 has an inlet 103 and an outlet 104 that communicate with the water-cooling channel 201. The inlet 103 and the outlet 104 can be located on the same side of the housing 10, or on two adjacent sides of the housing 10, or even on opposite sides of the housing 10. No specific limitation is made here.

[0028] During the actual operation of the power brick 100, the coolant enters the water cooling channel 201 through the inlet 103. The low temperature characteristics of the coolant are transferred to the first receiving cavity 1021 and the second receiving cavity 1022 through the water cooling plate 20, cooling the power module core group 30 and the drive control circuit board 50 in the first receiving cavity 1021, and cooling the thin film capacitor core package assembly 40 in the second receiving cavity 1022, thereby achieving heat dissipation of the power module core group 30, the thin film capacitor core package assembly 40 and the drive control circuit board 50.

[0029] After the power module core assembly 30, the thin-film capacitor core package assembly 40, and the drive control circuit board 50 are installed, potting compound 60 can be injected into the entire inner cavity 102 through the potting hole 107 reserved in the housing 10, so that the potting compound 60 completely covers the power module core assembly 30, the thin-film capacitor core package assembly 40, and the drive control circuit board 50. In this way, since the power module core assembly 30, the thin-film capacitor core package assembly 40, and the drive control circuit board 50 are fixed and supported by the potting compound 60, each component does not need to be equipped with a separate housing 10 and copper base plate 12. This not only avoids the volume redundancy caused by multiple independent packaging structures and alleviates the problem of the overall structure being large and unable to meet the high power density requirements, but also reduces the increase in material costs and the complexity of the assembly process caused by multiple sets of housings 10, base plates 12, and connectors. At the same time, it eliminates the additional space occupation and potential reliability risks caused by the reliance on bolts or connecting terminals for mechanical and electrical connections between components. Furthermore, since the potting compound 60 is made of a high-molecular composite material with good thermal conductivity, it has a certain heat dissipation capacity. Therefore, the heat generated by the power module core assembly 30, the thin-film capacitor core assembly 40, and the drive control circuit board 50 can be transferred to the water-cooling plate 20 and carried away by the coolant in the water-cooling channel 201, and can also be transferred to the potting compound 60 and conducted to the housing 10. Since the housing 10 is made of metal, which also has good thermal conductivity, heat can be transferred to the external environment through the housing 10, thereby achieving multi-path heat dissipation and improving thermal management efficiency.

[0030] In addition, the potting compound 60 can effectively isolate external dust, moisture and other impurities from entering the inner cavity 102, reducing the adverse effects of the external environment on the power module core group 30, the thin film capacitor core package assembly 40 and the drive control circuit board 50, thereby helping to improve the working stability and service life of each component.

[0031] In summary, the technical solution of the present invention provides a water-cooled plate 20 inside the housing 10 and fixes the water-cooled plate 20 inside the housing 10, thereby dividing the inner cavity 102 of the housing 10 into a first receiving cavity 1021 and a second receiving cavity 1022. The first receiving cavity 1021 is located on the side of the water-cooled plate 20 facing the open end 101 of the housing 10, and the second receiving cavity 1022 is located on the side of the water-cooled plate 20 away from the open end 101. The water-cooled plate 20 is provided with a water-cooling channel 201 for the flow of coolant, and the housing 10 is provided with an inlet 103 and an outlet 104 communicating with the water-cooling channel 201, thereby achieving heat dissipation for the power module core assembly 30 and the thin-film capacitor core assembly 40. Based on this structure, the power module core assembly 30 is arranged in the first receiving cavity 1021, and the thin-film capacitor core package assembly 40 is arranged in the second receiving cavity 1022, so that the two are respectively located in the cavities on both sides of the water-cooling plate 20, effectively utilizing the double-sided heat dissipation capability of the water-cooling plate 20 and avoiding the space waste caused by traditional independent packaging. Furthermore, the drive control circuit board 50 is disposed in the first receiving cavity 1021, located on the side of the power module core assembly 30 opposite to the thin-film capacitor core package assembly 40, forming a compact functional layout along the axial direction of the housing 10. After the above components are assembled, potting compound 60 is injected into the entire inner cavity 102 through the pre-reserved potting hole 107 on the housing 10 until the potting compound 60 completely covers the power module core assembly 30, the thin-film capacitor core package assembly 40, and the drive control circuit board 50. This integrated structural design eliminates the need for bolted connections and redundant installation space between multiple independently packaged components in traditional solutions. This not only significantly reduces the number of parts and assembly steps but also significantly improves the integration and power density of the Power Brick 100. At the same time, the overall potting enhances electrical insulation, mechanical stability, and environmental adaptability, thereby solving the core problems of large size, high cost, and complex assembly caused by the independent packaging of power modules, thin-film capacitors, and three-phase plastic-coated components in existing technologies.

[0032] like Figure 2 As shown, in one embodiment, the housing 10 includes a housing body 11 and a base plate 12. The housing body 11 has an open end 101, and the base plate 12 is detachably connected to the side of the housing body 11 away from the open end 101. The thin film capacitor core package assembly 40 is mounted on the base plate 12.

[0033] In this embodiment, the thin-film capacitor core package assembly 40 is fixed to the detachable base plate 12. This allows for pre-assembly of the thin-film capacitor core package assembly 40 and the base plate 12 as a module during assembly or maintenance, followed by overall installation into the housing body 11. Alternatively, the base plate 12 can be disassembled separately for maintenance or replacement without affecting other components inside the housing 10. Simultaneously, since the base plate 12 is located on the side of the housing 10 away from the open end 101, corresponding to the second receiving cavity 1022, it provides a mounting surface for the thin-film capacitor core package assembly 40, placing it closer to the side of the water-cooling plate 20 away from the open end 101. This facilitates heat conduction to the outside of the housing 10 through the base plate 12 or the potting compound 60. The detachable connection between the base plate 12 and the housing body 11 enhances the assembly flexibility and maintainability of the power brick 100, facilitating the adaptation of different specifications of the thin-film capacitor core package assembly 40 during manufacturing, thereby improving the versatility and production efficiency of the power brick 100.

[0034] like Figure 2 As shown, in one embodiment, the base plate 12 is provided with snap-fit ​​portions 13 on its opposite side edges, and each snap-fit ​​portion 13 is provided with snap-fit ​​holes 106; the shell body 11 is provided with buckles 14 on its opposite sides, and each buckle 14 engages with the corresponding snap-fit ​​hole 106 to fix the base plate 12 to the shell body 11.

[0035] In this embodiment, the base plate 12 has a locking portion 13 on each of its two opposite edges along the first direction X. The locking portion 13 extends from the edge of the base plate 12 along the second direction Z, and each locking portion 13 has a locking hole 106. The shell body 11 has a buckle 14 protruding on each of its two sides along the first direction X. Each buckle 14 engages with a locking hole 106, thereby fixing the base plate 12 to the shell body 11. At the same time, the base plate 12 may also have a locking portion 13 on each of its two opposite edges along the third direction Y. The locking portion 13 also extends from the edge of the base plate 12 along the second direction Z, and each locking portion 13 has a locking hole 106. The shell body 11 has a buckle 14 protruding on each of its two sides along the third direction Y, and each buckle 14 engages with a locking hole 106, thereby further enhancing the connection stability between the base plate 12 and the shell body 11. Thus, by setting the locking structure of the buckle 14 and the locking part 13 in multiple directions, not only can the positioning accuracy and vibration resistance of the base plate 12 be improved, but the base plate 12 can also be effectively prevented from loosening or displacement due to thermal expansion or mechanical impact during the operation of the power brick 100.

[0036] It is understandable that the number of snap-fit ​​parts 13 provided on each side edge of the base plate 12 can be one, two, or even more. For example... Figure 2As shown, in one embodiment, the base plate 12 has a locking portion 13 on each of its two opposite edges along the first direction X, and two locking portions 13 on each of its two opposite edges along the third direction Y, with the locking portions 13 on the same edge spaced apart. Correspondingly, the shell body 11 has a buckle 14 protruding on each of its two sides along the first direction X, and two buckles 14 protruding on each of its two opposite sides along the third direction Y, with the buckles 14 on the same side also spaced apart. Thus, by using a combination of buckles 14 and locking portions 13 with varying numbers in different directions, the locking points can be reasonably distributed according to the structural stress characteristics, while ensuring connection strength and taking into account assembly convenience and manufacturing cost control, further improving the reliability and manufacturability of the overall structure of the power brick 100. This design helps to ensure a firm connection between the base plate 12 and the shell body 11, reduces the risk of loosening due to long-term use or external vibration, simplifies the assembly process of the power brick 100, and improves production efficiency.

[0037] like Figures 1 to 3 As shown, in one embodiment, the drive control circuit board 50 is provided with a signal connector 51, which extends out of the housing 10.

[0038] In this embodiment, the signal connector 51 can be in the form of an onboard connection terminal or a plug-in electrical connector, protruding from the edge area of ​​the drive control circuit board 50 and extending to the outside through the open end 101 of the housing 10. The signal connector 51 is used to realize signal interaction between the drive control circuit board 50 and the control circuit board in the motor controller, so that the power brick 100 can receive control signals from the control circuit board and transmit internal operating signals or detection signals back to the control circuit board. Since the drive control circuit board 50 is located entirely within the first receiving cavity 1021 of the housing 10, and the signal connector 51 extends from the inside of the housing 10 to the outside, it can ensure that the main body of the drive control circuit board 50 is fully covered by the potting compound 60 to obtain good electrical insulation and mechanical protection, and also ensure that the necessary external communication functions are not limited by the overall encapsulation space formed by the housing 10.

[0039] like Figures 1 to 3 As shown, in one embodiment, the inlet 103 and the outlet 104 are arranged on opposite sides of the housing 10.

[0040] In this embodiment, the inlet 103 and outlet 104 can be arranged on opposite sides of the housing 10 along the first direction X, or on opposite sides of the housing 10 along the second direction Z; the specific arrangement is not limited here. Coolant flows from the inlet 103 on one side of the housing 10 into the water-cooling channel 201 within the water-cooling plate 20, and flows along the water-cooling channel 201 through the entire area of ​​the water-cooling plate 20 before exiting from the outlet 104 on the other side of the housing 10, thus forming a cooling path that runs through the water-cooling plate 20. This arrangement helps the coolant achieve a longer flow path and more uniform distribution within the water-cooling channel 201, improving the heat dissipation efficiency of the power module core assembly 30, the thin-film capacitor core assembly 40, and the drive control circuit board 50 within the first and second accommodating cavities 1021 and 1022 on both sides of the water-cooling plate 20.

[0041] Meanwhile, the water inlet 103 and water outlet 104 are located on opposite sides of the housing 10, which also facilitates the arrangement of external cooling pipes in the overall layout of the motor controller, reducing pipe bends and spatial interference, and making equipment integration easier. This relative arrangement also avoids local concentration or rapid short-circuiting of coolant near the inlet of the water-cooling channel 201, helping to maintain sufficient coverage of coolant throughout the entire water-cooling plate 20 area, thereby improving the uniformity and continuity of overall heat exchange, and further supporting the stable operation of the power brick 100 under high power density conditions.

[0042] The number of inlet 103 and outlet 104 can each be one, two, or even more. For example... Figures 1 to 3 As shown, in one embodiment, there are two inlets 103 and two outlets 104. The two inlets 103 can be arranged on one side of the housing 10 along the first direction X, and the two outlets 104 can be arranged on the other side of the housing 10 along the first direction X. Alternatively, one inlet 103 and one outlet 104 can be arranged on one side of the housing 10 along the first direction X, and the other inlet 103 and the other outlet 104 can be arranged on the other side of the housing 10 along the first direction X. Regardless of the arrangement, the inlets 103 and / or outlets 104 on the same side of the housing 10 are arranged opposite each other along the second direction Z.

[0043] It is worth noting that when two inlets 103 are arranged on one side of the housing 10 along the first direction X and two outlets 104 are arranged on the other side of the housing 10 along the first direction X, the coolant can enter from one inlet 103 on one side and flow out from one outlet 104 on the other side, or it can enter from both inlets 103 on one side at the same time and flow out from both outlets 104 on the other side at the same time, depending on the arrangement of the external cooling system of the motor controller.

[0044] When the coolant enters from one inlet 103 on one side and flows out from one outlet 104 on the other side, if the flow path between the inlet 103 and the outlet 104 is from the thin-film capacitor core assembly 40 toward the power module core assembly 30, the power brick 100 can be installed upright at the cooling pipe interface of the motor controller, facilitating the connection between the inlet 103 and the outlet 104 and the external cooling system of the motor controller; if the flow path between the inlet 103 and the outlet 104 is from the power module core assembly 30 toward the thin-film capacitor core assembly 40, the power brick 100 can be installed upside down at the cooling pipe interface of the motor controller, similarly facilitating the connection between the inlet 103 and the outlet 104 and the external cooling system of the motor controller. This bidirectional selectable flow channel configuration can improve the installation flexibility of the power brick 100 in the overall layout, enabling it to adapt to the space constraints of different vehicle models or controller platforms on the cooling pipe routing, reduce pipe bends and assembly interference, and at the same time ensure that the coolant in the water cooling channel 201 always effectively covers the entire area of ​​the water cooling plate 20, maintaining a uniform heat dissipation effect on the power module core 30, the thin film capacitor core assembly 40 and the drive control circuit board 50.

[0045] like Figures 4 to 7 As shown, in one embodiment, the thin-film capacitor core package assembly 40 includes a first DC input copper busbar 41, a core package assembly 42, and a DC output copper busbar 43. The output terminal of the first DC input copper busbar 41 is connected to the input terminal of the core package assembly 42, and the output terminal of the core package assembly 42 is connected to the input terminal of the DC output copper busbar 43. The power module core 30 includes a second DC input copper busbar 31, a power module chip 32, and an AC output copper busbar 33. The input terminal of the second DC input copper busbar 31 is connected to the output terminal of the DC output copper busbar 43, the output terminal of the second DC input copper busbar 31 is connected to the input terminal of the power module chip 32, the output terminal of the power module chip 32 is connected to the input terminal of the AC output copper busbar 33, and the power module chip 32 is electrically connected to the drive control circuit board 50. The core package assembly 42 is used to filter the DC power input to the first DC input copper busbar 41 and output it to the second DC input copper busbar 31 via the DC output copper busbar 43. The power module chip 32 is used to convert the DC power input from the second DC input copper busbar 31 into AC power, and output it to the external circuit via the AC output copper busbar 33.

[0046] In this embodiment, after the external DC power supply of the DC motor controller enters the power brick 100, it is first connected to the thin film capacitor core assembly 40 through the first DC input copper bus 41. After the core assembly 42 completes high-frequency noise suppression and voltage stabilization, it is transmitted to the second DC input copper bus 31 by the DC output copper bus 43, and then supplied to the power module chip 32 for inverter processing. Finally, the AC output copper bus 33 delivers the generated AC power to the motor and other external AC loads.

[0047] Compared to the existing technology where components such as power modules, film capacitors, and drive control circuit boards 50 are independently packaged and rely on cables, terminals, or bolts for electrical connection, in this embodiment, the first DC input copper busbar 41, the DC output copper busbar 43, and the second DC input copper busbar 31, as well as the power module chip 32 and the AC output copper busbar 33, are all electrically connected using an integrally formed or directly welded copper busbar structure. This not only shortens the path of current flowing from the film capacitor core assembly 40 to the power module core assembly 30 and reduces the contact resistance and parasitic inductance caused by the use of discrete connectors, but also reduces the energy loss of DC power during transmission and suppresses voltage overshoot caused by line inductance during the switching process of the power module chip 32, thereby improving the power conversion efficiency.

[0048] like Figure 2 , Figures 5 to 7 As shown, in one embodiment, the power module chip 32 is disposed on the side of the water-cooled plate 20 facing the open end 101, the second DC input copper busbar 31 and the AC output copper busbar 33 are respectively arranged at opposite ends of the power module chip 32, and the end of the AC output copper busbar 33 away from the second DC input copper busbar 31 extends out of the housing 10.

[0049] In this embodiment, this layout allows the power module chip 32 to be positioned close to the water-cooled plate 20, which facilitates the efficient conduction of heat generated during operation through the water-cooled plate 20 and its removal by the coolant, thereby improving the overall heat dissipation effect. Simultaneously, arranging the second DC input copper busbar 31 and the AC output copper busbar 33 at opposite ends of the power module chip 32 along the first direction X helps shorten the path of current flow from the second DC input copper busbar 31 through the power module chip 32 to the AC output copper busbar 33, reducing resistance and inductance effects during transmission and minimizing electromagnetic coupling between the second DC input copper busbar 31 and the AC output copper busbar 33. After being led out from the power module chip 32, the AC output copper busbar 33 extends away from the second DC input copper busbar 31 and passes through the housing 10, facilitating direct connection to external AC loads of the motor controller and avoiding the use of additional adapter terminals or cables.

[0050] like Figure 2 , Figures 5 to 7In one embodiment, the power module chip 32 is soldered to the side of the water-cooled plate 20 facing the open end 101.

[0051] In this embodiment, by directly soldering the power module chip 32 onto the water-cooled plate 20, an efficient heat conduction path can be achieved. This allows the heat generated by the power module chip 32 during operation to be rapidly transferred to the water-cooled plate 20 and promptly carried away by the coolant in the water-cooling channel 201, effectively reducing the operating temperature of the power module chip 32 and contributing to improved operational reliability and lifespan. This direct soldering method avoids the additional materials such as thermal pads, insulating films, or intermediate transition layers commonly used in traditional independent packaging structures, reducing the number of interfaces and corresponding thermal resistance in the heat conduction path, making heat transfer more direct and efficient. Furthermore, the soldered connection enhances the mechanical bonding strength between the power module chip 32 and the water-cooled plate 20, effectively maintaining contact stability under complex conditions such as vibration, impact, or thermal expansion and contraction during vehicle operation, reducing the risk of performance degradation or failure due to loosening or desoldering. Meanwhile, this design eliminates the need for a separate copper base plate 12, mounting bracket, and corresponding fasteners for the power module in traditional solutions, simplifying the overall assembly process, reducing the number of parts and potential failure points, and further improving the integration, structural compactness, and long-term operational reliability of the power brick 100.

[0052] like Figure 2 , Figures 5 to 7 As shown, in one embodiment, the second DC input copper busbar 31 and the AC output copper busbar 33 are respectively arranged at opposite ends of the power module chip 32 along the first direction X. The second DC input copper busbar 31 is opposite to and welded to the DC output copper busbar 43 along the second direction Z. The second direction Z intersects with the first direction X.

[0053] In this embodiment, this layout allows the second DC input copper busbar 31, after being electrically connected to the power module chip 32, to extend along the second direction Z, which intersects the first direction X, and to form a counter-fit with the DC output copper busbar 43 from the thin-film capacitor core assembly 40. This allows for a reliable electrical connection through welding, thereby constructing a low-impedance, low-parasitic-inductance current path. Since the first direction X is used to arrange the positional relationship between the second DC input copper busbar 31 and the AC output copper busbar 33 at both ends of the power module chip 32, and the second direction Z is used to achieve the docking between the second DC input copper busbar 31 and the DC output copper busbar 43, the orthogonal arrangement of the two directions helps to rationally plan the routing of the second DC input copper busbar 31 and the DC output copper busbar 43 within a limited space. This avoids excessive bending or spatial interference between the second DC input copper busbar 31 and the DC output copper busbar 43, improving the overall wiring compactness and electromagnetic compatibility performance. Furthermore, using direct welding instead of traditional bolts, terminals, or cable connections not only reduces the number of additional parts required for connection and lowers assembly complexity, but also improves the mechanical stability and long-term operational reliability of the welded area.

[0054] like Figure 2 , Figures 5 to 7 As shown, in one embodiment, the housing 10 is provided with a positioning groove 105 at the position corresponding to the first receiving cavity 1021, and the groove opening of the positioning groove 105 faces the open end 101; the power module core assembly 30 also includes a partition 34, which is inserted into the positioning groove 105, and the AC output copper busbar 33 is disposed on the partition 34.

[0055] In this embodiment, by providing a positioning groove 105 on the housing 10 and inserting the spacer 34 into the positioning groove 105, not only can a positioning reference be provided for the power module core 30, but also an installation carrier for the AC output copper busbar 33. This allows the AC output copper busbar 33 to extend along a predetermined path and eventually pass through the housing 10, achieving connection with an external AC load. Since the spacer 34 itself has both structural support and positioning functions, there is no need to set up additional brackets, pressure plates, or fasteners to fix the AC output copper busbar 33 or align the power module core 30 during the assembly process. This simplifies the overall assembly process, reduces the number of parts and assembly steps, and correspondingly reduces the potential failure risk caused by loose connections or installation deviations.

[0056] Furthermore, the partition 34 seals the positioning groove 105, forming a complete boundary of the inner cavity 102 together with the housing 10. During the subsequent injection of potting compound 60, this helps prevent the potting compound 60 from overflowing from the positioning groove 105. Simultaneously, after potting, it works synergistically with the housing 10 and the potting compound 60 to enhance the sealing and protection of the internal components. Thus, the presence of the partition 34 also helps protect the power module chip 32 from external environmental factors such as dust and moisture, enhancing the long-term operational stability and reliability of the power module 100 under complex automotive conditions.

[0057] like Figure 2 , Figures 5 to 7 As shown, in one embodiment, the power module core assembly 30 further includes a conductive element 35, one end of which is connected to the power module chip 32, and the other end extends from the water-cooled plate 20 toward the drive control circuit board 50 and is soldered to the drive control circuit board 50.

[0058] In this embodiment, the conductive component 35 can be a pin, which is a thin, elongated metal lead used to transmit electrical signals or control commands between different electrical components. The power module chip 32 and the drive control circuit board 50 are connected via the pin. Thus, the drive control circuit board 50 can send drive signals to the power module chip 32 via the pin, causing the power module chip 32 to control the on / off state of its internal switching devices according to the received drive signals, thereby achieving the conversion from DC to AC. Conversely, the power module chip 32 can also transmit feedback signals such as temperature, current, or fault status to the drive control circuit board 50 via the pin, allowing the drive control circuit board 50 to perform real-time monitoring and protection processing.

[0059] It should be noted that the pins are connected to the drive control circuit board 50 by soldering. This not only ensures a low-impedance electrical connection between the two, but also enhances the mechanical fixing strength. During vehicle operation, it effectively resists the stress caused by vibration and thermal cycling, and avoids control failure or signal interruption due to poor contact, thereby improving the control accuracy and operational stability of the entire power brick 100.

[0060] It is understandable that the power module chip 30 can be either a full-bridge power module chip or a half-bridge power module chip. For example... Figure 5 and Figure 6 As shown, Figure 5 This is a schematic diagram of the power module core 30 using a full-bridge structure. Figure 6This is a schematic diagram of a half-bridge structure for the power module core 30. Whether it's a full-bridge or half-bridge power module core 30, the number of power module chips 32 it contains can be one, two, or even more; correspondingly, the number of the second DC input copper busbar 31 and AC output copper busbar 33 can also be set to one, two, or even more to match the needs of different topologies and power levels. This scalable modular design allows the power brick 100 to flexibly adapt to single-phase or three-phase motor drive systems, meeting different electrical performance requirements while maintaining consistency in structural layout and universality in assembly processes, which is beneficial for platform development and large-scale production.

[0061] In one embodiment, such as Figure 5 and Figure 6 As shown, there are three power module chips 32, which are arranged at intervals along the third direction Y. Correspondingly, there are also three second DC input copper busbars 31 and three AC output copper busbars 33. The three second DC input copper busbars 31 are arranged at intervals along the third direction Y, and the three AC output copper busbars 33 are also arranged at intervals along the third direction Y. The three second DC input copper busbars 31 are located at one end of the three power module chips 32 along the second direction Z, and the three AC output copper busbars 33 are located at the other end of the three power module chips 32 along the second direction Z. This layout allows each power module chip 32 to independently connect to DC power from the thin-film capacitor core assembly 40, and the converted AC power is output through the corresponding AC output copper busbar 33. The three can work in parallel or in tandem to meet higher power output requirements. Simultaneously, the second DC input copper busbar 31 and the AC output copper busbar 33 are arranged sequentially along the third direction Y, which helps to form a clear and orderly conductive path within the housing 10, avoiding electromagnetic coupling or assembly interference caused by space congestion between the second DC input copper busbar 31 or the AC output copper busbar 33. It also facilitates the uniform distribution of heat along the width of the housing 10, improving heat dissipation uniformity and the overall operational stability of the power brick 100. Furthermore, since each power module chip 32 and its corresponding copper busbar are linearly arranged along the third direction Y, it is convenient to use uniform tooling for positioning and welding during manufacturing, improving assembly accuracy and consistency. At the same time, this arrangement also provides good conditions for the uniform filling of the potting compound 60, reducing air bubble retention or flow dead zones, further ensuring the insulation performance and mechanical protection of the components inside the housing 10.

[0062] Similarly, the number of pins can be one, two, or even more. For example... Figure 5 and Figure 6As shown, in one embodiment, each of the three power module chips 32 has multiple pins. These pins can be arranged in multiple rows along the second direction Z or along the third direction Y; the specific arrangement is not limited here, nor is the number of rows limited. This multi-pin arrangement can meet the needs of multi-channel signal transmission between the power module chip 32 and the drive control circuit board 50, including drive signals, status feedback, and protection signals. Simultaneously, the dispersed arrangement reduces the current load and local temperature rise carried by a single pin, improving the stability and reliability of signal transmission. Furthermore, the array structure formed by the multiple pins also helps to enhance the mechanical connection strength between the power module chip 32 and the drive control circuit board 50, further adapting to the environmental challenges brought about by vibration and temperature changes during vehicle operation.

[0063] like Figure 5 , Figure 6 and Figure 8 As shown, in one embodiment, the power brick 100 further includes a current detection module 70, which is disposed on the drive control circuit board 50; the AC output copper busbar 33 is provided with a detection hole 301, and at least part of the current detection module 70 passes through the detection hole 301 to detect the current output by the AC output copper busbar 33 and output a current detection signal to the drive control circuit board 50.

[0064] In this embodiment, the current detection module 70 can employ components such as a Hall sensor or a current sampling resistor. Part of its structure passes through the detection hole 301 on the AC output copper busbar 33, allowing the measured conductor, i.e., the AC output copper busbar 33, to directly pass through the sensing area of ​​the current detection module 70, thereby achieving non-contact or low-intrusion sampling of the output current. This arrangement eliminates the need for additional sampling lines or shunt structures, saving internal space and avoiding the impact of parasitic parameters introduced by additional connections on detection accuracy. Since the current detection module 70 is integrated onto the drive control circuit board 50, the detected current signal can be directly transmitted to the drive control circuit board 50 for processing, used for real-time monitoring of motor phase current, overcurrent protection, closed-loop control, or fault diagnosis. Furthermore, placing the detection hole 301 within the AC output copper busbar 33 itself and integrating the current detection module 70 with the drive control circuit board 50 helps improve the integration of the power brick 100, reduces the need for external wiring and independent sensor brackets, further simplifies the assembly process, and enhances the overall structural compactness and reliability.

[0065] The present invention also proposes a motor controller, which includes a power brick 100. The specific structure of the power brick 100 is as described in the above embodiments. Since the motor controller adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0066] The present invention also proposes a vehicle including a motor controller. The specific structure of the motor controller is as described in the above embodiments. Since the vehicle adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0067] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A power brick, characterized by, The application relates to a power module, comprising: a shell with an open end; a water-cooling plate arranged in the shell and separating an inner cavity of the shell into a first accommodating cavity and a second accommodating cavity, the first accommodating cavity being located on one side of the water-cooling plate facing the open end, and the second accommodating cavity being located on one side of the water-cooling plate away from the open end; the water-cooling plate is provided with a water-cooling channel for cooling liquid flow, and the shell is provided with a water inlet and a water outlet communicating with the water-cooling channel; a power module core group arranged in the first accommodating cavity; a thin-film capacitor core package assembly arranged in the second accommodating cavity; a drive control circuit board arranged in the first accommodating cavity and located on one side of the power module core group away from the thin-film capacitor core package assembly; wherein the inner cavity of the shell is filled with potting glue, and the potting glue covers the power module core group, the thin-film capacitor core package assembly and the drive control circuit board.

2. The power brick of claim 1, wherein, The water inlet and the water outlet are arranged on opposite sides of the shell; and / or The drive control circuit board is provided with a signal connector extending out of the shell.

3. The power brick of claim 1, wherein, The thin-film capacitor core package assembly comprises a first direct-current input copper bar, a core package assembly and a direct-current output copper bar, the output end of the first direct-current input copper bar is connected with the input end of the core package assembly, and the output end of the core package assembly is connected with the input end of the direct-current output copper bar; The power module core group comprises a second direct-current input copper bar, a power module chip and an alternating-current output copper bar, the input end of the second direct-current input copper bar is connected with the output end of the direct-current output copper bar, the output end of the second direct-current input copper bar is connected with the input end of the power module chip, the output end of the power module chip is connected with the input end of the alternating-current output copper bar, and the power module chip is electrically connected with the drive control circuit board; The core package assembly is used for filtering direct-current electricity input by the first direct-current input copper bar and outputting the direct-current electricity to the second direct-current input copper bar through the direct-current output copper bar; The power module chip is used for converting direct-current electricity input by the second direct-current input copper bar into alternating-current electricity and outputting the alternating-current electricity to an external circuit through the alternating-current output copper bar.

4. The power brick of claim 3, wherein, The power module chip is arranged on one side of the water-cooling plate facing the open end, the second direct-current input copper bar and the alternating-current output copper bar are arranged on opposite ends of the power module chip respectively, and one end of the alternating-current output copper bar away from the second direct-current input copper bar extends out of the shell.

5. The power brick of claim 4, wherein, The power module chip is welded on one side of the water-cooling plate facing the open end; and / or The second direct-current input copper bar and the alternating-current output copper bar are arranged on opposite ends of the power module chip along a first direction respectively, the second direct-current input copper bar is opposite to the direct-current output copper bar along a second direction and is welded and connected, and the second direction is arranged intersectingly with the first direction; and / or The shell is provided with a positioning groove at a position corresponding to the first accommodating cavity, and a slot opening of the positioning groove faces the open end; the power module core group further comprises a blocking piece, the blocking piece is inserted into the positioning groove, and the alternating-current output copper bar is arranged on the blocking piece.

6. The power brick of claim 3, wherein, The power module core group further comprises an electrically conductive member, one end of which is connected to the power module chip, and the other end extends from the water-cooled plate towards the driving control circuit board and is welded to the driving control circuit board.

7. The power brick of any of claims 3 to 6, wherein, The power brick further comprises a current detection module arranged on the driving control circuit board; the AC output copper bar is provided with a detection hole, and at least part of the current detection module is arranged in the detection hole, for detecting the current output by the AC output copper bar and outputting a current detection signal to the driving control circuit board.

8. The power brick of claim 1, wherein, The shell comprises a shell body and a bottom plate, the shell body has the open end, and the bottom plate is detachably connected to one side of the shell body away from the open end, and the thin-film capacitor core package assembly is mounted on the bottom plate.

9. The power brick of claim 8, wherein, The bottom plate is provided with a clamping portion on each of the opposite side edges, and each clamping portion is provided with a clamping hole; the shell body is provided with a buckle on each of the opposite sides, and each buckle is clamped and matched with the corresponding clamping hole to fix the bottom plate to the shell body.

10. An electric machine controller characterized by A power brick comprising the power brick as claimed in any one of claims 1 to 9.

11. A vehicle characterized by comprising: A motor controller comprising the motor controller as claimed in claim 10.

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