Substrate processing apparatus

Abstract

Provided is an apparatus for processing a substrate, the apparatus comprising: a housing having a processing space for processing the substrate therein; and a substrate support for supporting the substrate in the processing space, the substrate support including a first support pin and a second support pin, the upper end of the first support pin being higher than the upper end of the second support pin, the upper end of the first support pin being lower than the upper end of the second support pin, and the upper end of the second support pin being lower than the upper end of the first support pin. The first support pin and the second support pin are arranged so that when the substrate is placed on the first support pin and the second support pin, the substrate is inclined downwards from the center to the edge of the substrate. Accordingly, regardless of manufacturing tolerances, the shape of the substrate supported on the substrate support may be constant, and a pattern linearization phenomenon may be prevented from occurring in an edge region of the substrate.

Description

TECHNICAL FIELD

[0001] The present invention relates to an apparatus for processing a substrate, and more particularly, to an apparatus for processing a substrate by supplying a supercritical fluid to the substrate. BACKGROUND

[0002] To manufacture a semiconductor device, a desired pattern is formed on a substrate through various processes such as photographing, etching, ashing, ion implantation, and thin film deposition. Various processing solutions are used in the various processes, and contaminants and particles are generated during the processes. To solve this problem, a cleaning process for cleaning the contaminants and particles is essentially performed before and after each process.

[0003] Generally, in the cleaning process, the substrate is treated with a chemical and a rinse solution, and then dried. The drying treatment step is a process for drying the rinse solution remaining on the substrate, and the substrate is dried using an organic solvent such as isopropyl alcohol (IPA). However, as a critical dimension (CD) between patterns formed on the substrate becomes increasingly finer, the organic solvent is left in a gap between the patterns, and a supercritical treatment process is performed to remove the organic solvent.

[0004] The supercritical treatment process is a process for replacing a liquid remaining on the substrate with a supercritical fluid and drying the substrate and minimizing a region supporting the substrate. Figure 1 is a plan view schematically showing a substrate supported in a general supercritical treatment apparatus. Referring to Figure 1 , opposite ends of the substrate W are supported by pins 9100. Accordingly, a load of the organic solvent remaining on the substrate W is concentrated toward a central region of the substrate, and a sag phenomenon occurs in the central region of the substrate W. Accordingly, the organic solvent remaining on the substrate W moves from an edge region of the substrate W to the central region, and a pattern lining phenomenon occurs in the edge region. SUMMARY

[0005] The present invention is directed to providing a substrate processing apparatus capable of improving a processing efficiency of a substrate.

[0006] The present invention is also directed to providing a substrate processing apparatus for preventing a pattern lining phenomenon from occurring in an edge region of a substrate.

[0007] The present invention is also directed to providing a substrate processing apparatus for preventing a substrate from being bent downward when the substrate is dried with a supercritical fluid.

[0008] The present invention is also directed to providing a substrate processing apparatus having a constant substrate shape regardless of a manufacturing tolerance when a substrate is supported.

[0009] Effects of the present disclosure are not limited to the above-mentioned effects, and effects not mentioned will be clearly understood by those skilled in the art from the present specification and the accompanying drawings.

[0010] An exemplary embodiment of the present disclosure is an apparatus for processing a substrate, the apparatus comprising: a first body; a second body combined with the first body to provide a processing space for processing a substrate therein, and disposed below the first body; a fluid supply unit for supplying a processing fluid to the processing space; a lifting unit for raising and lowering the first body or the second body so that a relative position of the first body and the second body changes between an open position in which the processing space is open to the outside and a closed position in which the processing space is closed to the outside; a substrate loader mounted in the first body and in which a substrate loaded or unloaded by an external transfer robot at the open position is placed; and a substrate support mounted on the second body and supporting the substrate at the closed position, wherein the substrate support comprises: a support plate; a first support pin and a second support pin mounted on the support plate to protrude upward from an upper surface of the support plate, and the substrate is placed on the first support pin and the second support pin, and a height of an upper end of the first support pin can be higher than a height of an upper end of the second support pin.

[0011] According to an exemplary embodiment of the present disclosure, wherein when viewed from above, the second support pin can be positioned farther from a center of the substrate than the first support pin when the substrate is supported by the substrate support.

[0012] According to an exemplary embodiment of the present disclosure, wherein a plurality of second support pins are provided, and the plurality of second support pins can be arranged to surround the first support pin.

[0013] According to an exemplary embodiment of the present disclosure, wherein the plurality of second support pins can have the same height at upper ends thereof.

[0014] According to an exemplary embodiment of the present disclosure, wherein the first support pin can be disposed to support a center of the substrate.

[0015] According to an exemplary embodiment of the present disclosure, wherein a plurality of second support pins are provided, the plurality of second support pins are disposed to surround the first support pin, and a distance between each of the plurality of second support pins and the first support pin can be set to be the same as each other.

[0016] According to an exemplary embodiment of the present disclosure, wherein a spacing between adjacent second support pins can be set to be the same as each other.

[0017] According to an exemplary embodiment of the present application, wherein the lower supply port for supplying the process fluid to the process space is formed on a bottom surface of the second body, the substrate support further includes a support leg supporting the support plate such that the support plate is located at a height spaced apart from the bottom surface of the second body, and the lower supply port can be formed at a position overlapping the support plate when viewed from above.

[0018] According to an exemplary embodiment of the present application, wherein the first support pin can be mounted on the support plate such that a height of the first support pin is adjustable.

[0019] According to an exemplary embodiment of the present application, wherein a first groove formed with a screw thread is formed in the support plate, and the first support pin can be threadedly coupled to the first groove.

[0020] According to an exemplary embodiment of the present application, wherein the substrate loader includes a plurality of fixed bars fixedly coupled to the first body, a support bar extending from the fixed bars toward an inner side thereof and connecting adjacent ones of the plurality of fixed bars, and a support protrusion formed on an upper surface of the support bar to protrude upward from the upper surface of the support bar, and the support protrusion can be located outside of the second support pins when viewed from above.

[0021] According to an exemplary embodiment of the present application, wherein in the open position, an upper end of the support protrusion is higher than an upper end of each of the first and second support pins, and in the closed position, the upper end of each of the first and second support pins can be positioned higher than the support protrusion.

[0022] According to an exemplary embodiment of the present application, wherein the process fluid can be a supercritical fluid.

[0023] An exemplary embodiment of the present disclosure, an apparatus for processing a substrate, the apparatus comprising: a housing having a process space inside for processing a substrate; and a substrate support for supporting the substrate in the process space, wherein the substrate support can be disposed to support the substrate when the substrate is placed on the substrate support to tilt the substrate downward from a center of the substrate to an edge.

[0024] According to an exemplary embodiment of the present application, wherein the substrate support includes a first support pin and a second support pin, an upper end of the first support pin is disposed higher than an upper end of the second support pin, and when viewed from above, the second support pin can be positioned farther from a center of the substrate than the first support pin when the substrate is supported by the substrate support.

[0025] According to an exemplary embodiment of the present application, wherein the first support pin supports a center of the substrate, a plurality of second support pins are provided, and the plurality of second support pins can be arranged to surround the first support pin.

[0026] According to an exemplary embodiment of the present application, the distance between each of the plurality of second support pins and the first support pin is the same, and the interval between adjacent second support pins can be set to be the same as each other.

[0027] According to an exemplary embodiment of the present application, the plurality of second support pins can have the same height at their upper ends.

[0028] An exemplary embodiment of the present disclosure, an apparatus for processing a substrate, the apparatus comprising: a first body; a second body combined with the first body to provide a processing space for processing a substrate therein, and disposed below the first body; a fluid supply unit for supplying a supercritical fluid to the processing space; a lifting unit for raising and lowering the first body or the second body so that the relative position of the first body and the second body changes between an open position in which the processing space is open to the outside and a closed position in which the processing space is closed to the outside; a substrate loader mounted in the first body and in which a substrate loaded or unloaded by an external transfer robot at the open position is placed; and a substrate support mounted on the second body and supporting the substrate at the closed position, wherein the substrate support comprises: a support plate; a first support pin and a plurality of second support pins mounted on the support plate to protrude upward from an upper surface of the support plate, and a substrate is placed on the first support pin and the plurality of second support pins, the plurality of second support pins having the same height, and an upper end of the first support pin is disposed higher than an upper end of the plurality of second support pins, and the first support pin supports a center of the substrate, the plurality of second support pins are arranged around the first support pin, and the distance between each of the plurality of second support pins and the first support pin is the same, and the interval between adjacent second support pins can be set to be the same as each other.

[0029] According to an exemplary embodiment of the present application, the substrate loader comprises: a plurality of fixed bars fixedly coupled to the first body; a support bar extending from the fixed bars toward an inner side thereof and connecting adjacent ones of the plurality of fixed bars; and a support protrusion formed on an upper surface of the support bar to protrude upward from the upper surface of the support bar, and when viewed from above, the support protrusion is located outside the second support pins, in the open position, an upper end of the support protrusion is positioned higher than upper ends of the first support pin and each of the second support pins, and in the closed position, the upper ends of the first support pin and each of the second support pins are positioned higher than the support protrusion.

[0030] According to an exemplary embodiment of the present application, the substrate processing efficiency can be improved.

[0031] According to an exemplary embodiment of the present invention, patterning in the edge region of the substrate can be prevented.

[0032] According to an exemplary embodiment of the present invention, when drying a substrate with a supercritical fluid, it is possible to prevent the substrate from bending downwards.

[0033] The effects of this disclosure are not limited to those described above, and those skilled in the art will clearly understand any effects not mentioned based on this specification and the accompanying drawings. Attached Figure Description

[0034] Figure 1 This is a schematic diagram showing the state in which a substrate is supported in a typical supercritical chamber.

[0035] Figure 2 This is a schematic top view illustrating a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0036] Figure 3 This is an illustrative representation according to an exemplary embodiment. Figure 2 A diagram of the liquid processing chamber of the substrate processing equipment.

[0037] Figure 4 This is an illustrative representation according to an exemplary embodiment. Figure 2 A diagram of the drying chamber of the substrate processing equipment.

[0038] Figure 5 This is an illustrative representation according to an exemplary embodiment. Figure 4 A diagram of the substrate loader.

[0039] Figures 6-7 This is an illustrative representation according to an exemplary embodiment. Figure 4 A diagram of the substrate support.

[0040] Figure 8 This is a schematic diagram showing the state of the substrate loader loading the substrate when it is in the open position.

[0041] Figure 9 This is a schematic diagram showing the state of the substrate support when the substrate support is in the closed position.

[0042] Figure 10 It is shown schematically. Figure 7 Another example of a substrate support is shown in the figure.

[0043] Figure 11 It is shown schematically. Figure 9 Another example of a substrate support is shown in the figure.

[0044] Figures 12-13 It is shown schematically. Figure 4 A diagram of another example of a drying chamber. Detailed Implementation

[0045] In the following description, exemplary embodiments of the invention will be described more fully with reference to the accompanying drawings, in which exemplary embodiments of the invention are illustrated. However, the invention may be implemented differently and is not limited to the following exemplary embodiments. In the following description of the invention, detailed descriptions of known functions and configurations incorporated herein are omitted to avoid obscuring the subject matter of the invention. Furthermore, the same reference numerals are used throughout the drawings for parts having similar functions and effects.

[0046] Unless expressly stated to the contrary, the word "comprising" will be understood to imply the inclusion of the stated elements, but does not exclude any other elements. It should be understood that the terms "comprising" and "having" are intended to indicate the presence of the features, quantities, operations, constituent elements and components or combinations thereof described in this specification, but do not preclude the possibility of the presence or addition of one or more other features, quantities, operations, constituent elements and components or combinations thereof.

[0047] The singular expressions used herein include plural expressions unless they have a clearly contradictory meaning in the context. Therefore, the shape, size, etc., of elements in the accompanying figures may be exaggerated for clarity.

[0048] Terms such as "first" and "second" are used to describe various component elements, but the component elements are not limited by the terms. The terms are merely used to distinguish one component element from another. For example, without departing from the scope of the invention, a first component element may be referred to as a second component element, and similarly, a second component element may be referred to as a first component element.

[0049] It should be understood that when a component is described as "connected" or "attached" to another component, the component can be directly connected or attached to the other component, but there may also be other components in between. Conversely, when a component is "directly connected" or "directly attached" to another component, it should be understood that there are no intermediate components. Other expressions describing the relationship between components should be interpreted similarly, such as "located between..." and "directly located between..." or "adjacent to..." and "directly adjacent to...".

[0050] All terms used herein, including technical or scientific terms, have the same meaning as commonly understood by those skilled in the art, unless they are defined differently. Terms defined in generally used dictionaries should be interpreted as having meanings that match those meanings in the context of the relevant art, and should not be interpreted as having ideal or overly formal meanings unless they are explicitly defined in this application.

[0051] In the following text, reference will be made to Figures 2-13 Exemplary embodiments of the present invention are described below.

[0052] Figure 2 This is a schematic top view illustrating a substrate processing apparatus according to an exemplary embodiment of the present invention. The substrate processing apparatus 1 includes a transposition module 10 and a processing module 20. According to the exemplary embodiment, the transposition module 10 and the processing module 20 are arranged along one direction. Hereinafter, the direction in which the transposition module 10 and the processing module 20 are arranged is referred to as a first direction 2, and when viewed from above, the direction perpendicular to the first direction 2 is referred to as a second direction 4, and the direction perpendicular to both the first direction 2 and the second direction 4 is referred to as a third direction 6.

[0053] The transposition module 10 transfers the substrate W from the container F containing the substrate W to the processing module 20 that processes the substrate W. The transposition module 10 then receives the substrate W, which has been fully processed in the processing module 20, back into the container F. The longitudinal direction of the transposition module 10 is positioned in the second direction 4. The transposition module 10 includes a loading port 110 and a transposition frame 130.

[0054] A container F containing the substrate W is positioned in the loading port 110. Based on the transposition frame 130, the loading port 110 is located on the side opposite to the processing module 20. Multiple loading ports 110 can be provided. The multiple loading ports 110 can be arranged in a row along the second direction 4. The number of loading ports 110 can be increased or decreased depending on the process efficiency and area requirements of the processing module 20.

[0055] Multiple slots (not shown) are formed in the carrier F to accommodate the substrate W when it is arranged horizontally relative to the ground. The container F can be an airtight container, such as a front-opening unified pod (FOUP). The container F can be placed on the loading port 110 by a conveying device (not shown) (such as an overhead conveyor, overhead transport, or automated guided vehicle) or by an operator.

[0056] The transposition track 131 and the transposition robot 133 are disposed in the transposition frame 130. The transposition track 131 is disposed in the transposition frame 130 along the second direction 4 in its longitudinal direction. The transposition robot 133 can transfer the substrate W. The transposition robot 133 can transfer the substrate W between the transposition module 10 and the buffer unit 210, which will be described later.

[0057] A transposition robot 133 can be mounted on a transposition track 131 and is movable along a second direction 4. The transposition robot 133 includes a hand 133H. A substrate W can be placed on the hand 133H. The hand 133H is configured to move back and forth along a first direction 2. Additionally, the hand 133H can be configured to rotate about a third direction 6 and move along that third direction 6. Multiple hands 133H can be provided. The multiple hands 133H can be spaced apart from each other in the vertical direction. The multiple hands 133H can move forward, backward, and rotate independently of each other.

[0058] Processing module 20 includes a buffer unit 210, a transfer chamber 230, a liquid processing chamber 300, and a drying chamber 2000. The buffer unit 210 provides space for the substrate W loaded into and unloaded from processing module 20 to temporarily reside therein. The transfer chamber 230 provides space for transferring the substrate W between the buffer unit 210 and the liquid processing chamber 300, between the liquid processing chamber 300 and the drying chamber 2000, and between the drying chamber 2000 and the buffer unit 210. The liquid processing chamber 300 performs a liquid processing procedure on the substrate W by supplying liquid to the substrate W. For example, the liquid processing procedure may be a cleaning procedure using a cleaning solution to clean the substrate W. The drying chamber 2000 performs a process for drying any remaining liquid on the liquid-treated substrate W.

[0059] A buffer unit 210 may be disposed between the transposition frame 130 and the transfer chamber 230. The buffer unit 210 may be located at one end of the transfer chamber 230. A slot (not shown) for placing the substrate W is disposed in the buffer unit 210. A plurality of slots (not shown) are spaced apart from each other along a third direction 6. The front and rear of the buffer unit 210 are open. The front is the face facing the transposition module 10, and the rear is the face facing the transfer frame 230. The transposition robot 133 can access the buffer unit 210 through the front, and the transfer robot 233, described below, can access the buffer unit 210 through the rear.

[0060] The transfer chamber 230 can be configured such that its longitudinal direction is a first direction 2. The liquid handling chamber 300 and the drying chamber 2000 can be disposed on one side of the transfer chamber 230 along the first direction 2. The liquid handling chamber 300 disposed on one side can be configured to be closer to the indexing module 10 than the drying chamber 2000 disposed on the same side, based on the first direction 2. The transfer chamber 230, the liquid handling chamber 300, or the transfer chamber 230 and the drying chamber 2000 can be disposed along a second direction 4.

[0061] According to the example, the liquid processing chamber 300 and the drying chamber 2000 can be arranged on opposite sides of the transfer chamber 230, and the liquid processing chamber 300 and the drying chamber 2000 can be arranged on one side of the transfer chamber 230 in an A×C1 and B×C2 arrangement (A, B, C1, and C2 are each natural numbers equal to or greater than 1) along a first direction 2 and a third direction 6. Here, A is the number of liquid processing chambers 300 arranged in a row along the first direction 2, C1 is the number of liquid processing chambers 300 arranged in a row along the third direction 6, B is the number of drying chambers 2000 arranged in a row along the first direction 2, and C2 is the number of drying chambers 2000 arranged in a row along the third direction 6. For example, when four or six liquid processing chambers 300 and drying chambers 2000 are arranged on one side of the transfer chamber 230, the liquid processing chambers 300 and the drying chambers 2000 can be arranged in a 2×2 or 2×3 arrangement, respectively. The number of liquid handling chambers 300 and drying chambers 2000 can be increased or decreased. Unlike the description above, the liquid handling chambers 300 and drying chambers 2000 can be arranged only on one side of the transfer chamber 230, and can be arranged as a single layer on one side or the opposite side of the transfer chamber 230. Furthermore, only liquid handling chambers 300 can be arranged on one side of the transfer chamber 230, and only drying chambers 2000 can be arranged on the other side.

[0062] The transfer chamber 230 includes a guide rail 231 and a transfer robot 233. The guide rail 231 is disposed within the transfer chamber 230 along a first direction 2 in its longitudinal direction. The transfer robot 233 can be disposed on the guide rail 231 so as to be able to move linearly along the first direction 2. The transfer robot 233 transfers the substrate W between the buffer unit 210 and the liquid processing chamber 300, between the liquid processing chamber 300 and the drying chamber 2000, and between the drying chamber 2000 and the buffer unit 210.

[0063] The conveying robot 233 includes a hand 233H on which a substrate W is placed. The hand 233H can be mounted on a guide rail 231 and is movable along a first direction 2. Therefore, the hand 233H can move forward and backward along the guide rail 231. Furthermore, the hand 233H can be configured to rotate about a third direction 6 and move along that third direction 6. Multiple hands 233H can be provided. The multiple hands 233H can be configured to be spaced apart from each other in the vertical direction. The multiple hands 233H can move forward, backward, and rotate independently of each other.

[0064] The liquid processing chamber 300 performs a liquid processing process on the substrate W. For example, the liquid processing chamber 300 may be a chamber that performs a cleaning process to remove process byproducts or the like adhering to the substrate W.

[0065] Figure 3 This is an illustrative representation according to an exemplary embodiment. Figure 2A diagram of the liquid processing chamber of a substrate processing apparatus. The processing chamber includes a housing 310, a processing container 320, a support unit 330, a liquid supply unit 340, a lifting unit 350, an exhaust unit 360, and an airflow supply unit 370.

[0066] The housing 310 has an internal space. The housing 310 is configured as a generally rectangular parallelepiped shape. An opening (not shown) is formed on one side of the housing 310. The opening (not shown) serves as an inlet through which the substrate W is loaded into the internal space or unloaded from the internal space. A processing container 320, a support unit 330, a liquid supply unit 340, and an airflow supply unit 370 are disposed within the housing 310.

[0067] The processing container 320 has a processing space with an open top. The processing container 320 may be bowl-shaped. A substrate W is located in the processing space, and liquid is supplied to the substrate W within the processing space. Various types of liquid can be provided, and they can be supplied to the substrate W sequentially.

[0068] The processing container 320 may include a guide wall 321 and a plurality of recovery tanks 323, 325, and 327. Each of the recovery tanks 323, 325, and 327 is used to separate and recover different liquids from the liquid in the processing substrate W. Each of the recovery tanks 323, 325, and 327 has a recovery space for recovering the liquid used to process the substrate. The guide wall 321 and the recovery tanks 323, 325, and 327 are all arranged in a circular annular shape around the support unit 330. During the liquid processing, the liquid dispersed by the rotation of the substrate W is introduced into the recovery space through the inlets 323a, 325a, and 327a of the respective recovery tanks.

[0069] According to the example, the processing container 320 has a guide wall 321, a first recycling tank 323, a second recycling tank 325, and a third recycling tank 327. The guide wall 321 is arranged in an annular shape surrounding the support unit 330, and the first recycling tank 323 is arranged in an annular shape surrounding the guide wall 321. The second recycling tank 325 is arranged in an annular shape surrounding the first recycling tank 323, and the third recycling tank 327 is arranged in an annular shape surrounding the second recycling tank 325. The space between the first recycling tank 323 and the guide wall 321 serves as a first inlet 323a through which liquid is introduced. The space between the first recycling tank 323 and the second recycling tank 325 serves as a second inlet 325a through which liquid is introduced. The space between the second recycling tank 325 and the third recycling tank 327 serves as a third inlet 327a through which liquid is introduced. The second inlet 325a may be located above the first inlet 323a, and the third inlet 327a may be located above the second inlet 325a.

[0070] The space between the lower end of the guide wall 321 and the first recovery tank 323 serves as a first outlet 323b, through which the flue gas and gas flow generated by the liquid are discharged. The space between the lower end of the first recovery tank 323 and the second recovery tank 325 serves as a second outlet 325b, through which the flue gas and gas flow generated by the liquid are discharged. The space between the lower end of the second recovery tank 325 and the third recovery tank 327 serves as a third outlet 327b, through which the flue gas and gas flow generated by the liquid are discharged. The flue gas and gas flow discharged from the first outlet 323b, the second outlet 325b, and the third outlet 327b are discharged through the exhaust unit 360, which will be described later.

[0071] Recovery lines 323c, 325c, and 327c, extending vertically below the bottom surfaces of recovery tanks 323, 325, and 327, are connected to recovery tanks 323, 325, and 327, respectively. Recovery lines 323c, 325c, and 327c discharge the treatment solution introduced through recovery tanks 323, 325, and 327, respectively. The discharged treatment solution can be reused via an external treatment solution regeneration system (not shown).

[0072] The support unit 330 supports and rotates the substrate W in the processing space. The support unit 330 includes a rotary chuck 331, a support pin 333, a chuck pin 335, a rotation shaft 337, and a driver 339.

[0073] The top surface of the rotary chuck 331 is approximately circular when viewed from above. The top surface of the rotary chuck 331 may be configured to have a diameter larger than that of the substrate W.

[0074] A plurality of support pins 333 are provided. The support pins 333 are disposed on the top surface of the rotary chuck 331. The support pins 333 are disposed on the edge of the top surface of the rotary chuck 331 so as to be spaced apart from each other at a predetermined interval. The support pins 333 protrude upward from the top surface of the rotary chuck 331. The support pins 333 are configured in combination to have an overall annular shape. The support pins 333 support the edge of the back surface of the substrate W such that the substrate W is spaced apart from the top surface of the rotary chuck 331 by a predetermined distance.

[0075] Multiple chuck pins 335 are provided. The chuck pins 335 are positioned further away from the center of the rotary chuck 331 than the support pins 333. The support pins 333 protrude from the top surface of the rotary chuck 331. The chuck pins 335 support a side portion of the substrate W to prevent the substrate W from separating from its correct position in the lateral direction when the substrate W rotates. The chuck pins 335 are configured to be linearly movable between a standby position and a supported position along the radial direction of the rotary chuck 331. For example, the chuck pins 335 can be linearly movable along the radial direction of the substrate W between the standby position and the supported position. The standby position is a position further away from the center of the rotary chuck 331 than the supported position. The chuck pins 335 are in the standby position when the substrate W is loaded into or unloaded from the support unit 330, and in the supported position when processing is performed on the substrate W. In the supported position, the chuck pins 335 are in contact with a side portion of the substrate W.

[0076] A rotating shaft 337 is connected to a rotating chuck 331. The rotating shaft 337 can be connected to the lower surface of the rotating chuck 331. The rotating shaft 337 can be configured such that its longitudinal direction faces the vertical direction. The rotating shaft 337 is configured to rotate by receiving power from a driver 339. Rotating the rotating shaft 337 via the driver 339 causes the rotating chuck 331 to rotate. The driver 339 can change the rotational speed of the rotating shaft 337. The driver 339 can be a motor providing the driving force. However, the invention is not limited thereto, and various modifications and provisiones can be made to existing known devices for providing driving force.

[0077] Liquid supply unit 340 supplies liquid to substrate W. Liquid supply unit 340 supplies liquid to substrate W supported by support unit 330. Multiple liquid supply units 340 are provided, and each unit supplies a different type of liquid. According to an example, liquid supply unit 340 may include a first liquid supply member 341 and a second liquid supply member 343.

[0078] The first liquid supply component 341 includes a support shaft 341a, a support arm 341b, a driver 341c, and a nozzle 341d. The support shaft 341a is located on one side of the processing container 320. The support shaft 341a has a rod-like shape and is oriented longitudinally toward the third direction 6. The support shaft 341a is configured to rotate via the driver 341c. The support arm 341b is connected to the upper end of the support shaft 341a. The support arm 341b extends vertically from the support shaft 341a. The nozzle 341d is fixed and connected to the distal end of the support arm 341b. As the support shaft 341a rotates, the nozzle 341d can swing and move together with the support arm 341b. The nozzle 341d can swing to a process position and a standby position. When viewed from above, the process position is the position where the nozzle 341d faces the substrate W supported by the substrate unit 330, and the standby position is the position where the nozzle 341d leaves the process position.

[0079] The second liquid supply member 343 supplies the second liquid to the substrate W supported by the support unit 330. Since the second liquid supply member 343 has the same shape as the first liquid supply member 341, a detailed description of the second liquid supply member 343 will be omitted below.

[0080] The first and second liquids can be any of chemicals, rinsing solutions, or organic solvents. For example, chemicals may include diluted sulfuric acid (H₂SO₄), diluted sulfonic acid peroxide (P₂O₅), hydrofluoric acid (HF), and ammonium hydroxide (NH₄OH). For example, rinsing solutions may include water or deionized water (DIW). For example, organic solvents may contain alcohols, such as isopropanol (IPA).

[0081] A lifting unit 350 is disposed within the housing 310. The lifting unit 350 adjusts the relative height between the processing container 320 and the support unit 330. The lifting unit 350 can linearly move the processing container 320 in a third direction 6. Contrary to the description, the processing container 320 is fixedly mounted, and the lifting unit 350 can move the support unit 330 in the vertical direction.

[0082] Exhaust unit 360 discharges fumes and gases generated in the processing space. Exhaust unit 360 discharges fumes and gases generated during liquid processing of substrate W. Exhaust unit 360 can be connected to the bottom surface of processing container 320. For example, exhaust unit 360 can be disposed in the space between the rotation axis 337 of rotation unit 330 and the inner wall of processing container 320. Pressure reducing unit (not shown) is disposed in exhaust unit 360. Fumes and gases generated during liquid processing of substrate W are discharged from processing space to the outside of processing space through pressure reducing unit.

[0083] Airflow supply unit 370 supplies airflow to the interior space of housing 310. Airflow supply unit 370 can supply downward airflow to the interior space. Airflow supply unit 370 can be installed in housing 310. Airflow supply unit 370 can be installed on the top plate of housing 310. The gas supplied to the interior space of housing 310 through airflow supply unit 370 forms a downward airflow within the interior space. Gas byproducts generated by the processing within the processing space are discharged to the outside of housing 310 through exhaust pipe 360 ​​via the downward airflow. Airflow supply unit 370 can be provided as a fan filter unit (FFU).

[0084] The drying chamber 2000 performs a process for drying residual liquid on a substrate W that has undergone liquid treatment. The drying chamber 2000 can dry the residual cleaning liquid on the substrate W by supplying a supercritical fluid. For example, the drying chamber 2000 can use supercritical carbon dioxide to perform a drying process to remove residual organic solvents from the substrate W.

[0085] Figure 4 This is an illustrative representation according to an exemplary embodiment. Figure 2 A diagram of the drying chamber of the substrate processing equipment.

[0086] The drying chamber 2000 includes a housing 2100, a heating element 2300, a fluid supply unit 2500, an exhaust unit 2700, a substrate loader 2800, and a substrate support 2900.

[0087] The housing 2100 has a first body 2110 and a second body 2130. The first body 2110 and the second body 2130 are joined together to provide a processing space therein. The first body 2110 is located above the second body 2130. The first body 2110 and the second body 2130 are made of materials capable of withstanding high pressure equal to or higher than the critical pressure of a supercritical fluid and high temperature equal to or higher than the critical temperature of a supercritical fluid.

[0088] The lifting unit 2150 adjusts the relative height between the first body 2110 and the second body 2130. The lifting unit 2150 raises and lowers either the first body 2110 or the second body 2130, causing the relative positions of the first body 2110 and the second body 2130 to change between an open position and a closed position. For example, the position of the first body 2110 is fixed, and the second body 2130 can be raised and lowered by the lifting unit 2150. The open position is when the first body 2110 and the second body 2130 are separated from each other to open the processing space to the outside, and the closed position is when the first body 2110 and the second body 2130 are in close contact with each other to close the processing space to the outside. The lifting unit 2150 may include a cylinder. Alternatively, the lifting unit 2150 may include a motor.

[0089] The heating element 2300 heats the processing fluid supplied to the processing space. The heating element 2300 raises the temperature within the processing space. When the heating element 2300 raises the temperature of the processing space, the processing fluid supplied to the processing space is either converted to a supercritical state or maintained in a supercritical state.

[0090] Additionally, the heating element 2300 may be embedded in the housing 2100. The heating element 2300 may be embedded in at least one of the first body 2110 and the second body 2130. For example, the heating element 2300 may be disposed in each of the first body 2110 and the second body 2130. The heating element 2300 may be a heater.

[0091] The fluid supply unit 2500 supplies processing fluid to the processing space. The fluid supply unit 2500 includes a processing fluid supply source 2510, a main supply line 2530, an upper supply line 2550, and a lower supply line 2570.

[0092] Processing fluid supply source 2510 stores and supplies processing fluid. Processing fluid supply source 2510 includes a reservoir. The processing fluid is supplied to the reservoir in a liquid state. The processing fluid undergoes a phase transition to a supercritical state in the reservoir. Processing fluid supply source 2510 supplies the processing fluid to the processing space through supply lines 2530, 2550, and 2570.

[0093] The main supply line 2530 is connected to the process fluid supply source 2510. The main supply line 2530 branches into an upper supply line 2550 and a lower supply line 2570 to supply process fluid to the process space. An on / off valve 2531, capable of opening and closing its internal flow path, is installed in the main supply line 2530. Components such as heaters, sensors, and filters can be installed in the main supply line 2530.

[0094] An upper supply line 2550 branches off from the main supply line 2530 to supply the processing fluid to the upper end of the processing space. An upper supply port 2110a is located within the first body 2110. The upper supply line 2550 can be connected to the first body 2110 via the upper supply port 2110a. The upper supply port 2110a may be formed at the center of the first body 2110. An on / off valve 2551 capable of opening and closing its internal flow path is installed in the upper supply line 2550.

[0095] A lower supply line 2570 branches off from the main supply line 2530 to supply the processing fluid to the lower end of the processing space. A lower supply port 2130a is provided in the second body 2130. The lower supply line 2570 can be connected to the second body 2130 via the lower supply port 2130a. The lower supply port 2130a may be formed at a point off-center from the center of the first body 2130. An on / off valve 2571 capable of opening and closing its internal flow path is installed in the lower supply line 2570.

[0096] The exhaust unit 2700 discharges residual processing fluid within the processing space to the outside. The exhaust unit 2700 includes an exhaust line 2710 and a pressure reducing pump 2730. An exhaust port 2130b is disposed in the second body 2130. The exhaust port 2310b may be formed at the center of the second body 2130. The exhaust line 2710 can be connected to the second body 2130 through the exhaust port 2130b. An on / off valve 2711 capable of opening and closing its internal flow path is installed in the exhaust line 2710. The pressure reducing pump 2730 may be installed in the exhaust line 2710.

[0097] A substrate loader 2800 is installed in the first body 2110. When the first body 2110 and the second body 2130 are in the open position, the substrate W is loaded into or unloaded from the processing space by the transfer robot 233. The substrate W loaded into the processing space by the transfer robot 233 is supported by the substrate loader 2800. In addition, the substrate W that has been processed is unloaded from the processing space by the transfer robot 233 while being supported by the substrate loader 2800. Figure 5 This is an illustrative representation according to an exemplary embodiment. Figure 4 A diagram of the substrate loader. (Reference) Figure 5 The substrate loader 2800 includes a fixing rod 2810, a support rod 2830, and a support protrusion 2850.

[0098] The fixing rod 2810 can be configured as a rod extending downward from the bottom surface of the first body 2110. Multiple fixing rods 2810 are provided. According to the example, four fixing rods 2810 may be provided.

[0099] A support rod 2830 extends inward from a fixed rod 2810. The support rod 2830 is positioned perpendicular to the fixed rod 2810. The support rod 2830 connects two adjacent fixed rods 2810. The support rod 2830 has an arcuate shape. Multiple support rods 2830 are provided. According to the example, two support rods 2830 may be provided.

[0100] A support protrusion 2850 protrudes upward and extends from the upper surface of the support rod 2830. The upper surface of the support protrusion 2850 directly supports the edge region of the bottom surface of the substrate W. The upper surface of the support protrusion 2850 can be circular. Multiple support protrusions 2850 are provided. By way of example, two support protrusions 2850 can be provided on each support rod 2830.

[0101] A substrate support 2900 is mounted in the second body 2130. In the processing space, the substrate W is processed while supported by the substrate support 2900. When the first body 2110 and the second body 2130 are in the closed position, the substrate W is supported by the substrate support 2900. Figures 6-7 This is an illustrative representation according to an exemplary embodiment. Figure 4 A diagram of the substrate support. (Refer to...) Figure 6 The substrate support 2900 includes a support plate 2910, a leg 2930, a first support pin 2950, ​​and a second support pin 2970.

[0102] A support plate 2910 is disposed in the processing space. When viewed from above, the lower supply port 2130a and the exhaust port 2130b are formed at positions overlapping with the support plate 2910. Therefore, the processing fluid flowing through the lower supply port 2130a flows upward by bypassing the support plate 2910. The support plate 2910 prevents the processing fluid introduced through the lower supply port 2130a from directly impacting the substrate W and damaging it.

[0103] Support legs 2930 support support plate 2910. Support plate 2910 is positioned at a predetermined distance from the bottom surface of second body 2130 via support legs 2930. A plurality of support legs 2930 are provided. Support legs 2930 are arranged along the circumferential direction of support plate 2910. Support legs 2930 are arranged at predetermined distances from each other.

[0104] The first support pin 2950 and the second support pin 2970 are mounted to protrude upwards from the upper surface of the support plate 2910. When the substrate W is processed in the processing space, the bottom surface of the substrate W is directly supported by the first support pin 2950 and the second support pin 2970. The upper end of the first support pin 2950 is higher than the upper end of the second support pin 2970.

[0105] A first support pin 2950 is provided. The first support pin 2950 supports the center of the substrate W.

[0106] A plurality of second support pins 2970 are provided. Each of the second support pins 2970 has the same height at its upper end. The plurality of second support pins 2970 are arranged around a first support pin 2950. The distance between each of the plurality of second support pins 2970 and the first support pin 2950 is set to be the same. The spacing between adjacent support pins of the plurality of second support pins 2970 is set to be the same. That is, the second support pins 2970 are arranged on a virtual circumference centered on the first support pin 2950. According to the example, six second support pins 2970 are provided.

[0107] refer to Figure 7 The first support pin 2950 and the second support pin 2970 respectively have insertion portions 2951 and 2971, annular portions 2953 and 2973, main body portions 2955 and 2975, and contact portions 2957 and 2977.

[0108] Insertion portions 2951 and 2971 are the portions where the first support pin 2950 and the second support pin 2970 connect to the support plate 2910. According to an exemplary embodiment, the first support pin 2950 and the second support pin 2970 can be press-fitted into the support plate 2910 and fixedly installed. Therefore, annular portions 2953 and 2973 can be arranged around the insertion portions 2951 and 2971, such that the first support pin 2950 and the second support pin 2970 can be press-fitted at a designed distance.

[0109] The main body portions 2955 and 2975 extend vertically upward from the insertion portions 2951 and 2971. The main body portions 2955 and 2975 may have a cylindrical shape. The contact portions 2957 and 2977 are the portions that directly contact the substrate W. The contact portions 2957 and 2977 may have a generally conical shape. The end portions of the contact portions 2957 and 2977 may be rounded.

[0110] Figure 8 This is a schematic diagram showing the state of the substrate loader loading the substrate when it is in the open position. Figure 9 This is a schematic diagram showing the state of the substrate support when the substrate support is in the closed position.

[0111] refer to Figure 8 In the open position, the upper end of the support protrusion 2850 is positioned higher than the upper ends of the first support pin 2950 and the second support pin 2970. After liquid processing, the substrate W is transferred to the substrate loader 2800 by the transfer robot 233. That is, when the first body 2110 and the second body 2130 are in the open position, the substrate W loaded into the processing space by the transfer robot 233 is placed on the support protrusion 2850.

[0112] After that, asFigure 9 As shown, the second body 2130 is raised relative to the first body 2110 and is in the closed position. When viewed from above, the support protrusion 2850 is located outside the support plate 2910 and the second support pin 2970, and in the closed position, the upper end of the first support pin 2950 is positioned higher than the upper ends of the second support pin 2970 and the support protrusion 2850.

[0113] Due to the weight of the substrate W and the weight of the liquid film formed on the upper surface of the substrate W, sagging occurs, causing the substrate W to be formed to slope downwards from its center to its edge, and the substrate W is supported by a first support pin 2950 and a second support pin 2970. According to the example, even if sagging of the substrate W occurs in the closed position, the substrate W is supported only by the first support pin 2950 and the second support pin 2970.

[0114] When the upper ends of the first support pin 2950 and the second support pin 2970 are designed to be at the same height, due to manufacturing tolerances, the upper ends of the first support pin 2950 and the second support pin 2970 are not exactly the same. Therefore, it is difficult to predict the shape of the substrate W supported by the substrate support 2900, and patterning can still occur in the edge region of the substrate W. On the other hand, in this invention, since the upper end of the first support pin 2950 is designed to be higher than the upper ends of each of the second support pin 2970 and the support protrusion 2850 in the closed position, even if manufacturing tolerances occur during manufacturing, the upper end of the first support pin 2950 is positioned higher than the upper ends of each of the second support pin 2970 and the support protrusion 2850 in the closed position. Therefore, regardless of manufacturing tolerances, the substrate W can always have a shape that slopes downward from the center to the edge in the closed position. Furthermore, since the liquid film remaining in the edge region of the substrate W does not move to the center region of the substrate W, patterning can be prevented from occurring in the edge region of the substrate W.

[0115] In the above Figure 7 In the exemplary embodiment, the case where the first support pin and the second support pin are press-fitted into the support plate and installed is described as an example. However, the invention is not limited thereto, and the support plate 2910 may be provided with a threaded first groove 3100 and a threaded second groove 3300. The insertion portion 2951 of the first support pin 2950 may be threadedly connected to the first groove 3100, and the insertion portion 2971 of the second support pin 2970 may be threadedly connected to the second groove 3300. Therefore, the height of the first support pin 2950 and the second support pin 2970 can be adjusted relative to the support plate 2910.

[0116] In the above Figure 9In the exemplary embodiment, the case where the substrate support includes a first support pin and a second support pin has been described as an example. However, the invention is not limited thereto, and a third support pin 4100 may also be provided on the substrate support 2900. Multiple third support pins 4100 may be provided. The third support pins 4100 may be arranged around the first support pin 2950. For example, the third support pins 4100 may be arranged on a virtual circumference centered on the first support pin 2950. The height of the upper end of the third support pin 4100 may be lower than the height of the upper end of the second support pin 2970. When the substrate W is supported by the substrate support 2900, the third support pin 4100 may be positioned further away from the center of the substrate W than the second support pin 2970.

[0117] In the above Figure 4 In an exemplary embodiment, the case where the lower supply port and exhaust port are respectively formed in the second body has been described as an example. The invention is not limited thereto, and may also be described as follows: Figure 12 As shown, a port 5100 can be set at the center of the second body 2130, and the lower supply line 2570 and exhaust line 2710 can share a port.

[0118] In the above Figure 4 The exemplary embodiment shown is described using the case where the drying chamber includes a first body and a second body as an example. However, the invention is not limited thereto, and as... Figure 13 As shown, the drying chamber 6000 may include a housing 6100 having a processing space and a substrate support 2900 supporting the substrate in the processing space. The housing 6100 has an opening 6110 through which the substrate can be loaded and unloaded, and a door 6130 that can open and close the opening 6110 may be installed. When the door 6130 opens the opening 6110, the substrate W can be supported by the substrate support 2900 by a transfer robot 233. Subsequently, the door 6130 can close the opening 6110 and supply processing fluid to process the substrate.

[0119] In the exemplary embodiments described above, the case in which the upper ends of the first support pin, the second support pin, and the support protrusion are formed as circles has been illustrated. However, unlike this, the upper ends of each of the first support pin 2950, ​​the second support pin 2970, and the support protrusion 2850 may be provided as flat.

[0120] The foregoing description provides examples of this disclosure. Furthermore, this description provides exemplary embodiments of this disclosure, and the disclosure can be used in various other combinations, variations, and environments. That is, this disclosure can be changed or modified within the scope of the disclosure described herein, within the equivalent scope of the description, and / or within the knowledge or technology of the relevant art. The embodiments illustrate the best state for implementing the spirit of this disclosure and can be varied in various ways for specific areas of application and uses of this disclosure. Therefore, the detailed description of this disclosure is not intended to limit the disclosure to the embodiments. Additionally, the claims should be construed as including other embodiments.

Claims

1. An apparatus for processing a substrate, the apparatus comprising: a first body; a second body which combines with the first body to provide a processing space for processing the substrate therein, and which is disposed below the first body; a fluid supply unit for supplying a processing fluid to the processing space; a lifting unit for raising and lowering the first body or the second body so that the relative positions of the first body and the second body change between an open position in which the processing space is open to the outside and a closed position in which the processing space is closed to the outside; a substrate loader which is installed in the first body and in which a substrate loaded or unloaded by an external transfer robot at the open position is placed; and a substrate support which is installed on the second body and which supports the substrate at the closed position, wherein the substrate support comprises: a support plate; first and second support pins which are installed on the support plate to protrude upward from an upper surface of the support plate, and on which the substrate is placed, and the height of an upper end of the first support pin is higher than the height of an upper end of the second support pin.

2. The apparatus according to claim 1, wherein when viewed from above, the second support pin is positioned farther from the center of the substrate than the first support pin when the substrate is supported by the substrate support.

3. The apparatus according to claim 2, wherein a plurality of second support pins are provided, and the plurality of second support pins are arranged around the first support pin.

4. The apparatus according to claim 3, wherein the plurality of second support pins have the same height at their upper ends.

5. The apparatus according to claim 1, wherein the first support pin is disposed to support the center of the substrate.

6. The apparatus according to claim 5, wherein a plurality of second support pins are provided, the plurality of second support pins are disposed around the first support pin, and the distance between each of the plurality of second support pins and the first support pin is disposed to be the same as each other.

7. The apparatus according to claim 6, wherein the interval between adjacent second support pins is disposed to be the same as each other.

8. The apparatus according to claim 2, wherein a lower supply port for supplying a processing fluid to the processing space is formed on a bottom surface of the second body, the substrate support further comprises a support leg which supports the support plate so that the support plate is located at a height spaced apart from the bottom surface of the second body, and when viewed from above, the lower supply port is formed at a position overlapping the support plate.

9. The apparatus according to claim 1, wherein the first support pin is installed on the support plate so that the height of the first support pin is adjustable.

10. The apparatus according to claim 9, wherein a first groove having a screw thread is formed in the support plate, and a second groove having a screw thread is formed in the first support pin, and a screw is inserted into the first and second grooves so that the height of the first support pin is adjustable. The first support pin is threadedly coupled to the first groove.

11. The apparatus of claim 1, wherein the substrate loader comprises: a plurality of fixed bars fixedly coupled to the first body; a support bar extending from the fixed bars toward an inner side of the fixed bars and connecting adjacent ones of the plurality of fixed bars; and a support protrusion formed on an upper surface of the support bar to protrude upward from the upper surface of the support bar, and when viewed from above, the support protrusion is located outside of the second support pin.

12. The apparatus of claim 11, wherein in the open position, an upper end of the support protrusion is higher than an upper end of each of the first and second support pins, and in the closed position, an upper end of each of the first and second support pins is positioned higher than the support protrusion.

13. The apparatus of claim 1, wherein the processing fluid is a supercritical fluid.

14. An apparatus for processing a substrate, the apparatus comprising: a housing having a processing space inside for processing a substrate; and a substrate support for supporting the substrate in the processing space, wherein the substrate support is arranged to support the substrate when the substrate is placed on the substrate support such that the substrate is tilted downward from a center to an edge of the substrate.

15. The apparatus of claim 14, wherein the substrate support comprises a first support pin and a second support pin, an upper end of the first support pin is arranged higher than an upper end of the second support pin, and when viewed from above, the second support pin is positioned farther from a center of the substrate than the first support pin when the substrate is supported by the substrate support.

16. The apparatus of claim 15, wherein the first support pin supports a center of the substrate, a plurality of second support pins are provided, and the plurality of second support pins are arranged to surround the first support pin.

17. The apparatus of claim 16, wherein a distance between each of the plurality of second support pins and the first support pin is the same, and a spacing between adjacent ones of the second support pins is arranged to be the same as each other.

18. The apparatus of claim 16, wherein the plurality of second support pins have the same height at their upper ends.

19. An apparatus for processing a substrate, the apparatus comprising: a first body; a second body combined with the first body to provide a processing space for processing the substrate therein, and the second body is arranged below the first body; a fluid supply unit for supplying a supercritical fluid to the processing space; a lifting unit for raising and lowering the first body or the second body such that a relative position of the first body and the second body changes between an open position in which the processing space is open to the outside and a closed position in which the processing space is closed to the outside; and a substrate loader for loading the substrate into the processing space. a substrate loader mounted in the first body and in which a substrate loaded or unloaded by an external transfer robot at the open position is placed; and a substrate support mounted on the second body and supporting the substrate at the closed position, wherein the substrate support includes: a support plate; a first support pin and a plurality of second support pins mounted on the support plate to protrude upward from an upper surface of the support plate and on which the substrate is placed, the plurality of second support pins having the same height, and an upper end of the first support pin is disposed higher than upper ends of the plurality of second support pins, and the first support pin supports a center of the substrate, the plurality of second support pins are arranged around the first support pin, and a distance between each of the plurality of second support pins and the first support pin is the same, and a gap between adjacent second support pins is disposed the same as each other. 20.The apparatus of claim 19, wherein the substrate loader includes: a plurality of fixed bars fixedly coupled to the first body; a support bar extending from the fixed bars toward an inner side of the fixed bars and connecting adjacent fixed bars among the plurality of fixed bars; and a support protrusion formed on an upper surface of the support bar to protrude upward from the upper surface of the support bar, and when viewed from above, the support protrusion is located outside the second support pins, at the open position, an upper end of the support protrusion is positioned higher than upper ends of each of the first support pin and the second support pins, and at the closed position, the upper end of each of the first support pin and the second support pins is positioned higher than the support protrusion. ​

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