Visual integrated force control feedback working head and chip mounting and testing method

Abstract

The invention relates to a visual integrated force control feedback working head and a chip mounting and testing method.The working head comprises a working head assembly, the working head assembly comprises a first base, the bottom of the first base is fixedly connected with the top of a second base through a first guiding shaft and a magnetic shaft, and a base connecting piece is arranged between the first base and the second base; the base connecting piece is in sliding sleeve connection with the first guide shaft and the magnetic shaft through a first guide shaft sleeve and a magnetic sleeve, the bottom of the base connecting piece penetrates through the second base and then is connected with the modular end effector, a force sensor is installed on one side of the top of the base connecting piece, and a second guide shaft is arranged at the input end of the force sensor. The second guide shaft is slidably connected with the first base through a second guide shaft sleeve, the bottom of the second guide shaft abuts against the force sensor through a limiting piece, and an elastic piece sleeved with the second guide shaft is arranged between the limiting piece and the second guide shaft sleeve. According to the invention, through deep integration and real-time closed loop of vision and force control, the intelligence and adaptive ability of operation are improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor packaging technology, and in particular to a visual integrated force control feedback working head, chip mounting and testing method. Background Technology

[0002] In semiconductor manufacturing, chip mounting and testing are two core processes. Chip mounting, especially in advanced packaging such as memory chip stacking, requires extremely high precision in placement, as the chip's marking points and the substrate's marking points are at the micrometer level. Even slight misalignment can render the chip unusable. The uniformity and accuracy of the mounting force are also crucial; excessive force can crush the chip, while uneven force leads to unreliable interconnects. Wafer testing requires precise contact between the probes of a probe card and the chip's pads, which can be tens of micrometers in size. Excessive contact force can scratch the pads, while insufficient force results in unstable test signals.

[0003] Currently, most existing technologies employ a simple "visual positioning followed by pick-up and placement" switching mode. This lack of high-precision real-time visual guidance and feedback makes it unable to handle complex positional deviations and achieve precise alignment; it also lacks integrated force control. It cannot sense and control the microscopic mechanical state after contact, and cannot achieve the smooth, adaptive, high-precision operation like "human eye guidance or finger touch," exhibiting significant shortcomings.

[0004] Therefore, there is an urgent need for an intelligent working head that can simulate human "hand-eye coordination" to achieve high-precision real-time feedback, while also deeply integrating and coordinating high-sensitivity micro-force control in real time to improve the yield and reliability of semiconductor manufacturing. Summary of the Invention

[0005] Therefore, it is necessary to provide a working head with visualized integrated force control feedback to overcome the defects mentioned in the background art.

[0006] A visual integrated force control feedback working head includes a working head assembly. The working head assembly includes a first base, the bottom of which is fixedly connected to the top of a second base via a first guide shaft and a magnetic shaft. A base connector is provided between the first base and the second base. The base connector is slidably sleeved with the first guide shaft and the magnetic shaft via a first guide shaft sleeve and a magnetic sleeve, respectively. The bottom of the base connector is sleeved on the second base and then connected to a modular end effector. A force sensor is installed on one side of its top. The input end of the force sensor is provided with a second guide shaft. The second guide shaft is slidably connected to the first base via a second guide shaft sleeve. Its bottom abuts against the force sensor via a sensor fixing member. An elastic member that sleeves the second guide shaft is provided between the sensor fixing member and the second guide shaft sleeve. A visual monitoring component is disposed above the working head assembly. It includes a lens, a camera at one end of the lens, and a light source connected to the lens on one side. The camera, lens, hollow rotary motor, and working head assembly are coaxially arranged to provide real-time direct view of the working point of the modular end effector. Its optical path passes through the central through hole of the working head assembly, establishing a coaxial direct-view optical path from the image acquisition end to the working point, forming a full-process visual monitoring channel for the working process.

[0007] As a preferred embodiment of the visual integrated force control feedback working head in this invention, it also includes a precision motion component, which includes a Z-axis translation mechanism and an XY-axis displacement stage. The Z-axis translation mechanism is disposed on one side of the working head component and its bottom is connected to the working head component. The XY-axis displacement stage is disposed below the working head component and is used to place and move the wafer.

[0008] As a preferred embodiment of the visual integrated force control feedback working head in this invention, the Z-axis translation mechanism includes a Z-axis adapter, a Z-axis fixing component is fixedly connected to one side of the Z-axis adapter, and a lifting Z-axis is installed on the Z-axis fixing component. A motor fixing component is fixedly connected to the bottom of the Z-axis adapter, and a hollow rotary motor is installed on the motor fixing component.

[0009] As a preferred embodiment of the visual integrated force control feedback working head in this invention, it also includes a data fusion and processing unit. The data fusion and processing unit receives image information from the visual monitoring component and force information from the force sensor. It performs real-time fusion processing on the image information and force information through a built-in fusion control algorithm, generates control commands based on the processing results, and connects the output end of the data fusion and processing unit to the precision motion component to form a visual and force feedback closed-loop control system based on real-time working conditions. The working process of the visualization monitoring component includes: real-time monitoring of the alignment status during the movement of the working head component, real-time observation of the contact status during the contact process, and continuous provision of visual feedback during the force control adjustment process, thereby realizing real-time observation and real-time adjustment based on the observation results during the working process.

[0010] As a preferred embodiment of the visual integrated force control feedback working head in this invention, the modular end effector is a chip test card fixing component or a vacuum nozzle fixing component.

[0011] As a preferred embodiment of the visual integrated force control feedback working head in this invention, the first base includes a first hollow connecting part, and the end of the hollow connecting part is provided with a first connecting ring and a second connecting ring. The first connecting ring is connected to the hollow rotary motor, and the second connecting ring is used to fix the first guide shaft, the second guide shaft sleeve and the magnetic shaft.

[0012] As a preferred embodiment of the visual integrated force control feedback working head in this invention, through holes are provided at the corresponding positions of the first connecting ring and the second guide shaft.

[0013] As a preferred embodiment of the visual integrated force control feedback working head in this invention, the base connector includes a second hollow connecting part, which is slidably sleeved in the second base. A third connecting ring is provided on its top. The third connecting ring is connected to the force sensor through a sensor fixing member, and a first guide sleeve and a magnetic sleeve are provided on its top. The bottom of the second hollow connecting part is connected to the modular end effector.

[0014] A chip mounting method for a visual integrated force control feedback head includes the following steps: The visual monitoring component synchronously identifies the marking points on the surface of the chip to be mounted and the reference points on the substrate, calculates the positional deviation, and compensates for it through a precision motion component. The control head assembly moves downward along the z-axis to the pre-attach position, allowing the visualization component to monitor and detect the reference points of the chip and substrate, calculate the position deviation, and compensate for the position in the angle and XY directions through the hollow rotary motor. The chip moves to the mounting position to make contact with the substrate. At this time, the contact force is detected and fed back in real time by a force sensor. Based on the feedback signal from the force sensor, the height in the z-axis direction is dynamically adjusted through a fusion control algorithm to keep the mounting force stable within the set range, thus completing the mounting process.

[0015] A chip testing method with a visual integrated force control feedback head includes the following steps: The location of the chip pads on the wafer and the location of the probes on the chip test board are identified by a visual monitoring component. Position and angle compensation are achieved by using a hollow rotary motor and an XY-axis displacement stage to ensure precise alignment between the probe and the pad. The control head assembly moves downward along the z-axis, so that the probe contacts the chip pads. The contact force is detected and fed back in real time by a force sensor. Based on the feedback signal from the force sensor, the height of the working head assembly in the z-axis direction is dynamically adjusted through a fusion control algorithm to stabilize the contact force within the set range, thereby completing the electrical test.

[0016] The beneficial effects of this invention are: High precision and high reliability: The coaxial vision design reduces optical calibration errors, ensuring that the end effector and vision are on the same straight line, and real-time position correction is performed through a hollow rotary motor; Truly achieving hand-eye coordination: The force control structure composed of magnetic shaft and spring ensures the accuracy of force feedback, reduces the influence of gravity on feedback, effectively avoids pressure overshoot and device damage, and solves the problem of separate or sequential operation of vision and force control through deep integration and real-time closed loop, thereby improving the intelligence and adaptability of operation. Dual-purpose and highly compatible: Through modular design, test cards or nozzles can be quickly replaced, and one system can meet the needs of both chip testing and mounting processes, improving equipment utilization and production efficiency; Compact structure and controllable cost: The overall mechanical design is simple, reducing manufacturing and maintenance costs. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is one of the overall structural diagrams of the working head in the embodiments of this application; Figure 2 This is the second schematic diagram of the overall structure of the working head in the embodiments of this application; Figure 3 for Figure 2 Schematic diagram of the cross-sectional structure at point AA; Figure 4 for Figure 2 Schematic diagram of the cross-sectional structure at point BB; Figure 5 for Figure 4 Enlarged schematic diagram of part of the structure; Figure 6 This is one of the overall structural schematic diagrams of the working head assembly in the embodiments of this application; Figure 7 This is the second schematic diagram of the overall structure of the working head assembly in the embodiments of this application; Figure 8 This is the third schematic diagram of the overall structure of the working head assembly in the embodiments of this application; Figure 9 This is the fourth schematic diagram of the overall structure of the working head assembly in the embodiments of this application; Explanation of reference numerals in the attached figures: 1. Working head assembly; 1.1. First base; 1.2. Second base; 1.3. First guide shaft; 1.4. Magnetic shaft; 1.5. Base connector; 1.6. First guide bushing; 1.7. Magnetic sleeve; 1.8. Force sensor; 1.9. Second guide shaft; 1.10. Second guide bushing; 1.11. Limiting component; 1.12. Elastic component; 1.13. Sensor fixing component; 2. Modular end effector; 3. Precision motion components; 3.1 Z-axis translation mechanism; 3.11 Z-axis adapter; 3.12 Z-axis fixing component; 3.13 Lifting Z-axis; 3.14 Motor fixing component; 3.15 Hollow rotary motor; 3.2 XY-axis displacement stage; 4. Visual monitoring components; 4.1. Lens; 4.2. Fixed structure; 4.3. Camera; 4.4. Light source. Detailed Implementation

[0019] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0020] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0021] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0022] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0023] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0024] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0025] like Figures 1 to 9As shown, this embodiment provides a visual integrated force control feedback working head, including a working head assembly 1. The working head assembly 1 includes a first base 1.1. The bottom of the first base 1.1 is fixed to the top of a second base 1.2 via a first guide shaft 1.3 and a magnetic shaft 1.4. A base connector 1.5 is provided between the first base 1.1 and the second base 1.2. The base connector 1.5 is slidably sleeved with the first guide shaft 1.3 and the magnetic shaft 1.4 via a first guide sleeve 1.6 and a magnetic sleeve 1.7, respectively. The bottom of the base connector 1.5 passes through the second base 1.2 and is connected to a modular end effector 2. A force sensor 1.8 is installed on one side of its top. A second guide shaft 1.9 is provided at the input end of the force sensor 1.8. The second guide shaft 1.9 is slidably connected to the first base 1.1 via a second guide sleeve 1.10. Its bottom abuts against the force sensor 1.8 via a limiting member 1.11. A sleeve between the limiting member 1.11 and the second guide sleeve 1.10 and the second guide shaft 1.9 is provided. The elastic element 1.12 is connected to the visual monitoring component 4, which is located above the working head component 1. Its optical path passes through the central through hole of the working head component 1, establishing a coaxial direct-view optical path from the image acquisition end to the work point, forming a full-process visual monitoring channel for the work process. The data fusion and processing unit receives image information from the visual monitoring component 4 and force information from the force sensor 1.8. It performs real-time fusion processing of the image information and force information through a built-in fusion control algorithm, and generates control commands based on the processing results. The output end of the data fusion and processing unit is connected to the precision motion component 3, forming a visual and force-sensing closed-loop control system based on the real-time working status. The working process of the visual monitoring component 4 includes: real-time monitoring of the alignment status during the movement of the working head component 1, real-time observation of the contact status during the contact process, and continuous provision of visual feedback during the force control adjustment process, realizing real-time observation and real-time adjustment based on the observation results during the working process.

[0026] The precision motion component 3 can precisely position the working head component 1 above the wafer or substrate, allowing it to move above the work area. During this movement, the visualization monitoring component 4 can capture real-time images of the chip pads or substrate markers and automatically identify positional deviations. When the work position is identified, the fusion control algorithm drives the working head component to move directly above the target position. The precise descent of the precision motion component 3 causes the modular end effector 2 at the end of the working head component 1 to approach the work surface. Simultaneously, the precision motion component 3 drives the working head component 1 to rotate, achieving precise angular compensation and accurate alignment between the actuator and the work point. During alignment, the force sensor inside the working head component 1 ensures smooth contact. When the actuator contacts the chip or substrate, the contact force is transmitted to the force sensor 1.8 through the guide shaft, guide sleeve, spring, magnetic shaft 1.4, and magnetic sleeve 1.7. The magnetic force generated by the magnetic shaft 1.4 and magnetic sleeve 1.7 effectively counteracts the weight of the moving parts, enabling the force sensor 1.8 to accurately detect minute contact forces. The fusion control algorithm dynamically adjusts the height of the working head assembly 1 based on the real-time feedback from the force sensor 1.8, keeping the contact force stable within the set range. This effectively prevents chip damage or poor contact caused by pressure overshoot. After force-controlled contact is completed, chip electrical testing or chip mounting can be performed in a stable contact state. This invention, through the precise guidance of the visual monitoring component 4 and the compliant control of the precision motion component 3, achieves extremely high levels of positioning accuracy and contact force control. Furthermore, this integrated design enables an intelligent operating mode that allows for simultaneous observation, perception, and adjustment, greatly improving the accuracy and efficiency of semiconductor wafer testing and chip mounting, resulting in superior performance.

[0027] In one embodiment of the present invention, please refer to Figures 1 to 4 The precision motion assembly 3 includes a Z-axis translation mechanism 3.1 and an XY-axis displacement stage 3.2. The Z-axis translation mechanism 3.1 is located above the working head assembly 1, and its bottom is connected to the working head assembly 1. It is used to drive the working head assembly 1 to move along the Z-axis direction and correct angular deviations through the hollow rotation mechanism 3.15 at the bottom. The XY-axis displacement stage 3.2 is located below the working head assembly 1 and is used to place and move the wafer. The XY-axis displacement stage 3.2 drives the wafer to move along the X-axis and Y-axis directions for position compensation, eliminating translational deviations between the modular end effector 2 and the wafer.

[0028] In one embodiment, see Figures 1 to 4The Z-axis translation mechanism 3.1 includes a Z-axis adapter 3.11. A Z-axis fixing member 3.12 is fixedly connected to one side of the Z-axis adapter 3.11, and a lifting Z-axis 3.13 is installed on the Z-axis fixing member 3.12. The lifting Z-axis 3.13 can drive the Z-axis translation mechanism 3.1 to move along the Z-axis direction. A motor fixing member 3.14 is fixedly connected to the bottom of the Z-axis adapter 3.13, and a hollow rotary motor 3.15 is installed on the motor fixing member 3.14. The hollow rotary motor 3.15 is connected to the working head assembly 1 and can drive the working head assembly 1 to rotate in the plane.

[0029] In one embodiment, see Figures 1 to 4 The visualization monitoring component 4 includes a lens 4.1, which is fixed to the Z-axis adapter 3.11 by a fixing structure. The fixing structure includes a fixing part and a clamping part that cooperate with each other. A camera is provided at one end of the lens 4.1, and the other end abuts against the motor fixing part 3.14. The motor fixing part 3.14 is provided with a shooting hole at the corresponding position of the lens 4.1 for easy shooting. A light source is provided on one side of the lens 4.1 and connected to it. The camera 4.2, lens 4.1, hollow rotary motor 3.15 and working head component 1 are arranged coaxially to directly view the working point of the modular end effector 2 in real time.

[0030] In one embodiment, see Figure 1 , Figure 2 Figure 3 , Figure 6 , Figure 7 and Figure 8 The modular end effector 2 features a quick-change structure, compatible with chip test card mounting brackets or vacuum nozzle mounting brackets. It allows for quick replacement of different specifications of nozzles or test cards without affecting the functions of vision and force sensors. The modular design significantly improves equipment compatibility and production efficiency, and supports rapid switching between multiple product types.

[0031] In one embodiment, see Figures 1 to 9 The first base 1.1 includes a first hollow connecting part with an annular cross-section. A first connecting ring is provided at the top of the hollow connecting part, and a second connecting ring is provided at the bottom. A gap is provided between the first connecting ring and the second connecting ring. The first connecting ring is used to connect with the hollow rotary motor 3.15 to fix the working head assembly 1 on the hollow rotary motor 3.15. The second connecting ring is used to fix one end of the first guide shaft 1.3, one end of the second guide shaft sleeve 1.10 and one end of the magnetic shaft 1.4. The other ends of fixing the first guide shaft 1.3 and the magnetic shaft 1.4 are both connected to the top of the second base 1.2. There are multiple first guide shafts 1.3 and second guide shaft sleeves 1.10, which are symmetrically arranged. The second guide shaft 1.8 is slidably connected to the second connecting ring through the second guide shaft sleeve 1.10.

[0032] In one embodiment, see Figures 1 to 9 A through hole is provided at the corresponding position of the first connecting ring and the second guide shaft 1.9 so that the second guide shaft 1.9 can slide along the Z-axis direction.

[0033] In one embodiment, see Figures 1 to 9 The base connector 1.5 includes a second hollow connecting part, which is slidably fitted inside the second base 1.2 and can slide along the Z-axis. A third connecting ring is provided on the top of the second hollow connecting part. One side of the third connecting ring is connected to the force sensor 1.8 through the sensor fixing part 1.13. A first guide shaft sleeve 1.6 and a magnetic sleeve 1.7 are provided on the top. The first guide shaft 1.6 is slidably fitted inside the first guide shaft sleeve 1.6, and the magnetic shaft 1.4 is slidably fitted inside the magnetic sleeve 1.7. The base connector 1.5 can slide along the Z-axis under the limitation of the first guide shaft 1.6 and the magnetic shaft 1.4. The bottom of the second hollow connecting part is connected to the modular end effector 2.

[0034] The precision motion component 3 can precisely position the working head component 1 above the wafer or substrate, allowing it to move above the work area. During this movement, the visualization positioning component 4 can capture real-time images of the chip pads or substrate markers and automatically identify positional deviations. When the work position is identified, the fusion control algorithm drives the working head component to move directly above the target position. The precise descent of the precision motion component 3 causes the modular end effector 2 at the end of the working head component 1 to approach the work surface. Simultaneously, the precision motion component 3 drives the working head component 1 to rotate, achieving precise angular compensation and accurate alignment between the actuator and the work point. During alignment, the force sensor inside the working head component 1 ensures smooth contact. When the actuator contacts the chip or substrate, the contact force is transmitted to the force sensor 1.8 through the guide shaft, guide sleeve, spring, magnetic shaft 1.4, and magnetic sleeve 1.7. The magnetic force generated by the magnetic shaft 1.4 and magnetic sleeve 1.7 effectively counteracts the weight of the moving parts, enabling the force sensor 1.8 to accurately detect minute contact forces. The integrated control algorithm dynamically adjusts the height of the working head assembly 1 based on the real-time feedback from the force sensor 1.8, keeping the contact force stable within the set range. This effectively prevents chip damage or poor contact caused by pressure overshoot. After force-controlled contact is completed, chip electrical testing or chip mounting can be performed in a stable contact state. The precise guidance of the visual positioning assembly 4 and the compliant control of the precision motion assembly 3 work together to achieve extremely high levels of positioning accuracy and contact force control. Furthermore, this integrated design enables an intelligent operating mode that allows for simultaneous observation, sensing, and adjustment, greatly improving the accuracy and efficiency of semiconductor wafer testing and chip mounting, resulting in superior performance.

[0035] This embodiment provides a chip mounting method for a visual integrated force control feedback working head, comprising the following steps: Replace the chip test card holder with a vacuum nozzle holder, and install the air pipe connector and nozzle, ensuring a secure connection, unobstructed airflow, and proper nozzle installation. The working head assembly 1 moves to the bottom of the equipment above the calibration camera to acquire images of the nozzle. The system calculates the actual position and angle error of the nozzle and records the correction parameters. The working head assembly 1 moves to the top of the wafer expansion assembly on the equipment. The wafer is initially positioned using the visualization monitoring component 4. The system retrieves the actual wafer mapping map and maps the position of each chip to the mapping map. The working head assembly 1 moves to the top of the target chip. After comparing the actual positional deviation between the chip and the nozzle, the system generates position compensation data and performs correction based on the visualization monitoring results. The working head assembly 1 descends along the Z-axis and picks up the chip using the nozzle. The working head assembly 1 carries the chip to the substrate to be mounted, and descends along the Z-axis to a preset height above the substrate. The Z-axis 3.15 moves, driving the visualization monitoring component 4 to automatically focus, simultaneously acquiring images of the reference points on the substrate and the pad points on the chip's surface. Both the reference points on the substrate and the pad points on the chip can be clearly imaged simultaneously. The system then performs real-time position comparison and calculates the deviation compensation value for the mounting position. The working head assembly 1 moves slightly downwards to bring the chip into contact with the substrate. The contact force is transmitted upwards through the suction nozzle to the base connector 1.5, causing the force sensor 1.8 to press against the limiting component 1.12. The limiting component 1.12 compresses the elastic component 1.12, generating a downward reaction force. Simultaneously, the magnetic sleeve 1.7 generates an upward force, offsetting the influence of the working head's own weight on the force sensor 1.8, ensuring that the force detection signal accurately reflects the actual contact force. The force sensor 1.8 monitors the pressure signal in real time and feeds it back to the fusion control algorithm. The fusion control algorithm dynamically adjusts the Z-axis height through a closed-loop control algorithm to stabilize the contact force within the set range, avoiding overshoot or chip damage. Ensure the contact force remains stable within the set range. After confirming that the patch is correctly placed while maintaining stable force control, release the negative pressure in the air path to complete the patch placement process. The entire process is shock-free and the pressure is uniform.

[0036] This embodiment provides a chip testing method for a visual integrated force control feedback working head, including the following steps: Please see Figures 2 to 5The modular end effector 2 uses a chip test card holder to mount and fix the chip test board corresponding to the chip under test on the wafer. After system initialization, the wafer is initially positioned using the visualization monitoring component 4. The actual position of each chip on the wafer is identified, and the precise coordinates of all chips are recorded. The visualization monitoring component 4 positions the probes on the chip test board and accurately records their position coordinates. The working head component 1 descends along the Z-axis to the position of the chip under test. The Z-axis 3.13 drives the visualization monitoring component 4 to autofocus, clearly image the Pad point on the chip, and perform high-precision position calibration. The system compares the positional deviation between the chip Pad point and the test board probes, and performs position compensation in the XY plane using the XY-axis displacement stage 3.2 to eliminate translational deviation. The hollow rotary motor 3.15 drives the working head assembly 1 to rotate, correcting angular deviations and achieving precise alignment between the probe and the pad. After correction, the working head continues to move downwards slightly, causing the probe to contact the chip test point. The contact force is transmitted upwards to the base connector 1.5, causing the force sensor 1.8 to press against the limiting member 1.12. The limiting member 1.12 compresses the elastic member 1.12, generating a downward reaction force. Meanwhile, the magnetic sleeve 1.7 generates an upward force, offsetting the influence of the working head's own weight on the force sensor 1.8, achieving precise force feedback. This ensures that the force sensor 1.8 installed on the base connector 1.5 detects the pressure signal in real time. The force signal is fed back to the fusion control algorithm, which dynamically adjusts the Z-axis height of the working head assembly through a closed-loop control algorithm to ensure that the contact force remains stable within the set range, avoiding overshoot or chip damage. After the force control maintains stable contact, the system applies a test signal to the chip through the chip test board to complete the electrical test and generate the actual wafer mapping diagram. The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0037] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A workhead that visualizes integrated force control feedback, characterized in that, The utility model relates to a chip testing device, including: The work head assembly includes the first base, the bottom of the first base is fixed with the top of the second base through the first guide shaft and the magnetic shaft, the first base and the second base are provided with the base connecting piece, the base connecting piece is sleeved with the first guide shaft and the magnetic shaft through the first guide shaft sleeve and the magnetic sleeve respectively, the bottom of the base connecting piece is sleeved with the second base, and the top of the base connecting piece is connected with the modular end effector, one side of the top of the base connecting piece is provided with the force sensor, the input end of the force sensor is provided with the second guide shaft, the second guide shaft is slidably connected with the first base through the second guide shaft sleeve, the bottom of the second guide shaft is abutted with the force sensor through the limiting piece, and the limiting piece and the second guide shaft sleeve are provided with the elastic piece sleeved with the second guide shaft sleeve; The visual monitoring assembly is arranged above the work head assembly, and includes a lens, one end of the lens is provided with a camera, one side of the lens is provided with a light source communicated with the lens, the camera, the lens, the hollow rotary motor and the work head assembly are coaxially arranged, the working point of the modular end effector is directly observed in real time, the light path of the camera passes through the center through hole of the work head assembly, the coaxial direct vision light path from the image acquisition end to the working point is established, and the whole process visual monitoring channel of the working process is formed.

2. The work head of claim 1, wherein, The precision motion assembly includes a Z-axis translation mechanism and an XY-axis displacement table, the Z-axis translation mechanism is arranged on one side of the work head assembly and connected with the work head assembly at the bottom, and the XY-axis displacement table is arranged below the work head assembly and used for placing and moving a wafer.

3. The work head of claim 2, wherein, The Z-axis translation mechanism includes a Z-axis adapter, one side of the Z-axis adapter is fixedly connected with a Z-axis fixing piece, a lifting Z-axis is installed on the Z-axis fixing piece, the bottom of the Z-axis adapter is fixedly connected with a motor fixing piece, and a hollow rotary motor is installed on the motor fixing piece.

4. The work head of claim 1, wherein, The data fusion and processing unit receives image information from the visual monitoring assembly and force information from the force sensor, performs real-time fusion processing on the image information and the force information through the built-in fusion control algorithm, generates a control instruction based on the processing result, and is connected with the precision motion assembly at the output end to form a visual and force feedback closed-loop control system based on real-time working conditions. The working process of the visual monitoring assembly includes real-time monitoring of the alignment state during the movement of the work head assembly, real-time observation of the contact state during the contact process, and continuous visual feedback during the force control adjustment process, so that real-time observation and real-time adjustment based on the observation result during the working process are realized.

5. The work head of claim 1, wherein, The modular end effector is a chip testing card fixing piece or a vacuum suction nozzle fixing piece.

6. The work head of claim 1, wherein, The first base includes a first hollow connecting part, the end of the first hollow connecting part is provided with a first connecting ring and a second connecting ring, the first connecting ring is connected with the hollow rotary motor, and the second connecting ring is used for fixing the first guide shaft, the second guide shaft sleeve and the magnetic shaft.

7. The work head of claim 6, wherein, The first connecting ring is provided with a through hole at the corresponding position of the second guide shaft.

8. The work head of claim 1, wherein, The base connecting piece comprises a second hollow connecting part which is slidingly sleeved in a second base, a third connecting ring is arranged at the top of the second hollow connecting part, the third connecting ring is connected with a force sensor through a sensor fixing part, and a first guide shaft sleeve and a magnetic sleeve are arranged at the top of the third connecting ring, and the bottom of the second hollow connecting part is connected with a modular end effector.

9. A chip mounting method based on the visualized integrated force control feedback work head according to any one of claims 1 to 8, characterized in that, The method comprises the following steps: Synchronously identifying the mark point on the surface of the chip to be mounted and the reference point on the substrate through the visual monitoring component, calculating the position deviation, and compensating through the precise motion component; Controlling the work head component to move downward along the z-axis to a pre-mounting position, so that the visual component monitors and detects the reference points of the chip and the substrate, calculates the position deviation, and compensates the position in the angle and XY direction through the hollow rotary motor; Moving to the mounting position to make the chip contact the substrate, at this time, the contact force is detected and fed back in real time through the force sensor; Based on the feedback signal of the force sensor, the height in the z-axis direction is dynamically adjusted through the fusion control algorithm, so that the mounting force is stabilized in the set range, and the mounting is completed.

10. A method of testing a chip based on the visualized integrated force control feedback work head according to any one of claims 1 to 8, characterized in that, The method comprises the following steps: Identifying the pad position of the chip on the wafer and the position of the probe on the chip test board through the visual monitoring component; Compensating the position and angle through the hollow rotary motor and the XY axis displacement table to make the probe accurately align with the pad; Controlling the work head component to move downward along the z-axis to make the probe contact the chip pad, and detecting and feeding back the contact force in real time through the force sensor; Based on the feedback signal of the force sensor, the height of the work head component in the z-axis direction is dynamically adjusted through the fusion control algorithm, so that the contact force is stabilized in the set range, and the electrical test is completed.

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