Solder verification system, method, electronic device, and storage medium

Abstract

The application provides a solder verification system and method, electronic equipment and a storage medium, and relates to the technical field of electronic manufacturing. The system comprises: a nitrogen input module connected with a waste heat recovery module, used for inputting nitrogen into the waste heat recovery module to preliminarily heat the nitrogen and obtain preheated nitrogen; the waste heat recovery module is connected with a heating module, used for secondarily heating the preheated nitrogen to obtain hot nitrogen at a target temperature; a laminar flow nozzle is connected with the heating module, used for uniformly spraying the hot nitrogen onto the surface of a carrier, and heating the solder joint on the carrier by using the hot nitrogen to complete solder verification; an oxygen concentration adjusting module is connected with the heating module, used for detecting the oxygen concentration of a heating area in the heating module during secondary heating, and dynamically adjusting the oxygen flow of the heating area according to the oxygen concentration to maintain the oxygen concentration of the heating area within a preset range. Through the application, the stability and consistency of the solder joint are improved.

Description

Technical Field

[0001] This application relates to the field of electronic manufacturing technology, and in particular to a solder verification system, method, electronic device and storage medium. Background Technology

[0002] In the field of electronics manufacturing, solder verification is a key step in ensuring the soldering quality of electronic components, especially in scenarios with high precision and high reliability requirements.

[0003] Currently, mainstream solder verification methods typically involve directly heating cold nitrogen gas using heating elements to reach a preset target temperature. The heated nitrogen gas is then guided to purge onto a heating plate, using heat convection and conduction to verify the solder joints mounted on a carrier within the heating plate. However, this method has significant limitations: it can cause the actual temperature in the solder joint area to be lower than the preset value, thereby reducing the stability and consistency of the solder joint welding. Summary of the Invention

[0004] This application provides a solder verification system, method, electronic equipment, and storage medium to improve the stability and consistency of solder joint welding.

[0005] In a first aspect, this application provides a solder verification system, comprising:

[0006] Includes: a waste heat recovery module, a heating module, a nitrogen input module, an oxygen concentration adjustment module, and laminar flow nozzles; among which,

[0007] The nitrogen input module is connected to the waste heat recovery module and is used to input nitrogen into the waste heat recovery module for preliminary heating of the nitrogen to obtain preheated nitrogen.

[0008] The waste heat recovery module is connected to the heating module and is used to reheat the preheated nitrogen to obtain hot nitrogen at the target temperature.

[0009] The laminar flow nozzle is connected to the heating module and is used to uniformly spray hot nitrogen gas onto the surface of the carrier. The hot nitrogen gas is used to heat the solder joints on the carrier to complete the solder verification.

[0010] The oxygen concentration regulation module is connected to the heating module and is used to detect the oxygen concentration in the heating area of ​​the heating module during the secondary heating process, and dynamically adjust the oxygen flow rate in the heating area according to the oxygen concentration to maintain the oxygen concentration in the heating area within a preset range.

[0011] In one possible implementation, the waste heat recovery module includes a waste heat recovery unit and a preheating plate; wherein...

[0012] The waste heat recovery unit is connected to the preheating plate for heat exchange.

[0013] The preheating plate is used to transfer the heat obtained from heat exchange to nitrogen through a finned tube heat exchanger to preheat the nitrogen and obtain preheated nitrogen. The finned tube heat exchanger is located on the side wall of the preheating plate.

[0014] In one possible implementation, the heating module is a microtube heater, wherein the power of the microtube heater is dynamically adjusted using a proportional-integral-derivative control algorithm.

[0015] Secondly, this application provides a solder verification method, applicable to the first aspect and / or various possible implementations of the first aspect, the method comprising:

[0016] Preheated nitrogen is obtained by initially heating nitrogen through a waste heat recovery module;

[0017] The preheated nitrogen is reheated by a heating module to obtain hot nitrogen at the target temperature.

[0018] Based on the laminar flow nozzle, hot nitrogen gas is uniformly sprayed onto the surface of the carrier, and the hot nitrogen gas is used to heat the solder joints on the carrier to complete the solder verification.

[0019] During the secondary heating process, the oxygen concentration in the heating zone of the heating module is detected by the oxygen concentration regulation module, and the flow rate of hot nitrogen is dynamically adjusted according to the oxygen concentration to maintain the oxygen concentration in the heating zone within the preset range.

[0020] In one possible implementation, before the nitrogen is initially heated by the waste heat recovery module to obtain preheated nitrogen, the method further includes:

[0021] Based on the vehicle's transfer status, adjust the temperature of the preheating plate and the fan power of the cold plate in the waste heat recovery module to compensate for heat loss during the vehicle transfer process.

[0022] In one possible implementation, adjusting the temperature of the preheating plate and the fan power of the cold plate in the waste heat recovery module according to the transfer status of the vehicle includes:

[0023] Determine if the heating module is activated;

[0024] If the heating module is activated, the preheating plate will be heated to the first set temperature, and the fan power will be reduced;

[0025] If the heating module is not activated, determine whether the vehicle has been transferred to the heating module;

[0026] If the vehicle is transferred to the heating module, the target temperature of the heating module is raised to the second set temperature, and the target temperature of the heating module is maintained at the second set temperature for a set period of time.

[0027] After the set time, the target temperature of the heating module will be restored to the original target temperature.

[0028] In one possible implementation, the carrier is a wireless temperature measurement carrier. Correspondingly, after detecting the oxygen concentration in the heating area of ​​the heating module through the oxygen concentration adjustment module and dynamically adjusting the flow rate of hot nitrogen according to the oxygen concentration, the method further includes:

[0029] A wireless temperature measurement device was used to monitor the temperature of the solder joints and obtain temperature data.

[0030] Based on the temperature data, determine the status information of the solder joint.

[0031] In one possible implementation, after detecting the oxygen concentration in the heating zone of the heating module via the oxygen concentration adjustment module and dynamically adjusting the flow rate of hot nitrogen based on the oxygen concentration, the method further includes:

[0032] Image data of the solder joints are acquired using a high-speed camera;

[0033] Image enhancement is performed on the image data to obtain the enhanced image data;

[0034] Feature extraction is performed on the enhanced image data to obtain the target features;

[0035] The target features are input into the classifier to determine the status information of the solder joint.

[0036] Thirdly, this application provides an electronic device, including: a memory and a processor;

[0037] The memory stores instructions that the computer executes;

[0038] The processor executes computer execution instructions stored in memory, causing the processor to perform the first aspect and / or various possible implementations of the first aspect as described above.

[0039] Fourthly, this application provides a computer-readable storage medium storing computer-executable instructions, which, when executed, are used to implement the first aspect and / or various possible embodiments of the first aspect.

[0040] Fifthly, this application provides a computer program product, including a computer program that, when executed, implements the first aspect and / or various possible implementations of the first aspect.

[0041] This application provides a solder verification system, method, electronic device, and storage medium, relating to the field of electronic manufacturing technology. The system includes: a waste heat recovery module, a heating module, a nitrogen input module, an oxygen concentration adjustment module, and a laminar flow nozzle. The nitrogen input module is connected to the waste heat recovery module to input nitrogen for initial heating, obtaining preheated nitrogen. The waste heat recovery module is connected to the heating module to perform secondary heating of the preheated nitrogen, obtaining hot nitrogen at the target temperature. The laminar flow nozzle is connected to the heating module to uniformly spray hot nitrogen onto the surface of a carrier, using the hot nitrogen to heat the solder joints on the carrier to complete solder verification. The oxygen concentration adjustment module is connected to the heating module to detect the oxygen concentration in the heating area during the secondary heating process and dynamically adjust the oxygen flow rate in the heating area based on the oxygen concentration to maintain the oxygen concentration in the heating area within a preset range. This application achieves staged heating of nitrogen through the coordinated operation of the waste heat recovery module and the heating module. Specifically, nitrogen is first fed into a waste heat recovery module, where it undergoes preliminary heating. This reuse of waste heat reduces energy loss during the nitrogen heating process. Subsequently, the pre-heated nitrogen enters a heating module for secondary heating to the target temperature. This staged heating of nitrogen solves the temperature fluctuation problem caused by nitrogen heat dissipation in traditional single-stage heating. The hot nitrogen at the target temperature is then uniformly sprayed onto the carrier surface through a laminar flow nozzle, creating a uniform nitrogen coverage environment. This hot nitrogen is then used to heat the solder joints on the carrier for solder verification. Directly and uniformly spraying hot nitrogen onto the carrier surface utilizes the impact effect of the gas jet to directly act on the solder joint area, eliminating the intermediate heat-absorbing medium of the heating plate and significantly shortening the thermal resistance path. This allows the heat carried by the hot nitrogen to be delivered directly to the solder joint with minimal or no loss, ensuring that the actual heating temperature of the solder joint area closely approximates the preset target temperature of the hot nitrogen, thereby improving the stability and consistency of the solder joint welding. During the secondary heating process, an oxygen concentration regulation module is used to monitor the oxygen concentration in the heating zone of the heating module in real time, and the oxygen flow rate in the heating zone is adjusted according to the monitoring results to ensure that the oxygen concentration is maintained within the range required by the process. In this way, a closed-loop control of oxygen concentration-temperature-flow rate is formed, which simultaneously meets the technical requirements of low oxygen concentration (oxygen concentration <100ppm) and precise temperature control (±2℃). Attached Figure Description

[0042] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0043] Figure 1 Schematic diagram of the solder verification system provided in the embodiments of this application Figure 1 ;

[0044] Figure 2 A schematic diagram of the staged heating process of nitrogen provided in the embodiments of this application;

[0045] Figure 3 A schematic diagram of the three-temperature zone coordinated control provided in the embodiments of this application;

[0046] Figure 4 This is a schematic diagram of the structure of the wireless temperature measurement vehicle provided in the embodiments of this application;

[0047] Figure 5 This is a flowchart illustrating the process of determining the status information of solder joints according to an embodiment of this application.

[0048] Figure 6 Schematic diagram of the solder verification system provided in the embodiments of this application Figure 2 ;

[0049] Figure 7 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application.

[0050] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0051] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0052] This application provides a solder verification system. The system includes a nitrogen input module connected to a waste heat recovery module for inputting nitrogen into the waste heat recovery module for initial heating to obtain preheated nitrogen. The waste heat recovery module is connected to a heating module for secondary heating of the preheated nitrogen to obtain hot nitrogen at the target temperature. A laminar flow nozzle is connected to the heating module for uniformly spraying hot nitrogen onto the surface of a carrier, using the hot nitrogen to heat the solder joints on the carrier to complete the solder verification. An oxygen concentration adjustment module is connected to the heating module for detecting the oxygen concentration in the heating area during the secondary heating process and dynamically adjusting the oxygen flow rate in the heating area based on the oxygen concentration to maintain the oxygen concentration in the heating area within a preset range.

[0053] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0054] Figure 1 Schematic diagram of the solder verification system provided in the embodiments of this application Figure 1 ,like Figure 1 As shown, the system includes: a waste heat recovery module 101, a heating module 102, a nitrogen input module 103, an oxygen concentration adjustment module 104, and a laminar flow nozzle 105; wherein,

[0055] The nitrogen input module is connected to the waste heat recovery module and is used to input nitrogen into the waste heat recovery module for preliminary heating of the nitrogen to obtain preheated nitrogen.

[0056] The waste heat recovery module is connected to the heating module and is used to reheat the preheated nitrogen to obtain hot nitrogen at the target temperature.

[0057] The laminar flow nozzle is connected to the heating module and is used to uniformly spray hot nitrogen gas onto the surface of the carrier. The hot nitrogen gas is used to heat the solder joints on the carrier to complete the solder verification.

[0058] The oxygen concentration regulation module is connected to the heating module and is used to detect the oxygen concentration in the heating area of ​​the heating module during the secondary heating process, and dynamically adjust the oxygen flow rate in the heating area according to the oxygen concentration to maintain the oxygen concentration in the heating area within a preset range.

[0059] In this embodiment, it can be understood that nitrogen is first input to the waste heat recovery module via the nitrogen input module, where it is preheated to obtain preheated nitrogen. Subsequently, the preheated nitrogen is input to the heating module for secondary heating until the target temperature is reached. The heated nitrogen at the target temperature is then uniformly sprayed onto the surface of the vehicle to form a uniform nitrogen coverage environment.

[0060] Furthermore, existing single-stage nitrogen heating systems suffer from a physical contradiction between the cooling effect of high-flow-rate nitrogen and the ability to maintain thermal equilibrium. Specifically, to achieve oxygen concentrations below 500 ppm, existing single-stage nitrogen heating systems must introduce high-flow-rate nitrogen to rapidly displace the air within the chamber. However, limited by the short heat exchange path and heat exchange efficiency bottleneck of the single-stage electric heating module, it cannot heat the instantaneous high-flow-rate nitrogen to the target process temperature synchronized with the heating plate within an extremely short residence time.

[0061] This leads to a severe cold purge effect: a large amount of insufficiently preheated, relatively low-temperature nitrogen gas directly impacts the heating plate, rapidly removing heat from the plate's surface through intense forced convection heat transfer, causing severe instantaneous temperature loss. Therefore, under the existing architecture, the high-flow-rate medium required to reduce oxygen content and the thermal stability required to maintain temperature control accuracy are mutually exclusive. The system cannot effectively suppress oxygen concentration by simply increasing the flow rate without sacrificing temperature uniformity and stability, which has become a technical bottleneck restricting process improvement.

[0062] To address this issue, in the embodiments of this application, when reheating preheated nitrogen, the oxygen concentration in the heating area of ​​the heating module needs to be detected in real time by an oxygen concentration adjustment module. Based on the detection results, the oxygen flow rate in the heating area is adjusted to ensure that the oxygen concentration is maintained within the range required by the process. This improves the temperature control accuracy and significantly enhances the anti-oxidation capability, providing a stable low-oxygen environment and a precise temperature field for solder verification, thereby improving the reliability and consistency of soldering quality testing.

[0063] In other words, this application's embodiments introduce a secondary heating mechanism to reheat the preheated nitrogen. This process raises the nitrogen to the target temperature before it enters the core heating region, fundamentally changing the thermodynamic role of nitrogen in traditional processes—from a cooling source causing heat loss to an isothermal medium at the same temperature as the environment. This transformation fundamentally eliminates the risk of drastic temperature drops caused by high-flow-rate purging, providing a thermal basis for high-flow-rate displacement.

[0064] Secondly, this embodiment establishes a dynamic feedback mechanism through an oxygen concentration adjustment module. The solder verification system monitors the actual oxygen concentration in the heating area in real time and precisely adjusts the oxygen flow rate in the heating area based on the detection result. This mechanism achieves decoupling optimization of nitrogen flow rate and oxygen concentration control: when the oxygen concentration exceeds the standard, the solder verification system can precisely increase the nitrogen flow rate to enhance the replacement efficiency; and since the secondary heating mechanism has preheated the supplementary nitrogen to the target temperature, the increased flow rate no longer triggers a cold purge effect, and the temperature field of the heating module remains stable. This intelligent control mode of on-demand supply completely breaks the mutual exclusion dilemma of flow rate and temperature in the traditional architecture.

[0065] Furthermore, the two-stage series heating structure significantly extends the effective heat exchange path of nitrogen, increasing the gas-solid contact area and residence time. Compared to the instantaneous throughput of a single-stage heating module, the two-stage heating system employs a segmented heating strategy, allowing nitrogen to undergo initial heating in the waste heat recovery module and achieve precise temperature control in the heating module. This progressive heating not only improves heat exchange efficiency but also ensures that even under extremely high flow rates, nitrogen receives sufficient heat compensation, thus entering the process chamber at a temperature matching that of the heating module.

[0066] Optionally, the connection between the waste heat recovery module and the heating module can be achieved through a heat conduction path, and the oxygen concentration regulation module can be connected to the oxygen outlet of the heating area through a flow regulation valve, thereby forming a closed-loop control of oxygen concentration-temperature-flow.

[0067] In one implementation, the oxygen flow rate can be dynamically adjusted using a laser oxygen sensor, for example, by increasing the oxygen flow rate by 20% when the oxygen concentration in the heating zone is >100ppm.

[0068] This embodiment of the application achieves staged heating of nitrogen through the coordinated operation of a waste heat recovery module and a heating module. Specifically, nitrogen is first input into the waste heat recovery module, where it undergoes preliminary heating. By reusing waste heat, energy loss during the nitrogen heating process is reduced. Subsequently, the pre-heated nitrogen enters the heating module, where it undergoes secondary heating to the target temperature. Staged heating of nitrogen solves the temperature fluctuation problem caused by nitrogen heat dissipation in traditional single-stage heating. Hot nitrogen gas at the target temperature is uniformly sprayed onto the carrier surface through a laminar flow nozzle, forming a uniform nitrogen coverage environment. This hot nitrogen gas is then used to heat the solder joints on the carrier for solder verification. Directly and uniformly spraying hot nitrogen onto the carrier surface utilizes the impact effect of the gas jet to directly act on the solder joint area, eliminating the intermediate heat-absorbing medium of the heating plate. This significantly shortens the thermal resistance path, allowing the heat carried by the hot nitrogen gas to be delivered directly to the solder joint with minimal or no loss. This ensures that the actual heating temperature of the solder joint area closely approximates the preset target temperature of the hot nitrogen, thereby improving the stability and consistency of the solder joint welding. During the secondary heating process, an oxygen concentration regulation module monitors the oxygen concentration in the heating area of ​​the heating module in real time and adjusts the oxygen flow rate in the heating area based on the monitoring results, ensuring that the oxygen concentration is maintained within the process requirements. Through this method, a closed-loop control of oxygen concentration, temperature, and flow rate is formed, simultaneously meeting the technical requirements of low oxygen concentration (oxygen concentration < 100 ppm) and precise temperature control (±2℃).

[0069] Based on the above embodiments, in some examples, the waste heat recovery module includes a waste heat recovery unit and a preheating plate; wherein, the waste heat recovery unit is connected to the preheating plate and is used to exchange heat with the preheating plate; the preheating plate is used to transfer the heat obtained by heat exchange to nitrogen through a finned tube heat exchanger to preheat the nitrogen and obtain preheated nitrogen, wherein the finned tube heat exchanger is disposed on the side wall of the preheating plate.

[0070] Figure 2 This is a schematic diagram of a staged heating process for nitrogen provided in an embodiment of this application. Figure 2As shown, the initial heating of nitrogen requires first exchanging heat (i.e., heat conduction) the waste heat recovered by the waste heat recovery unit with the preheating plate. Then, the heat obtained from the heat exchange in the preheating plate is transferred to the nitrogen through a finned tube heat exchanger to initially heat the nitrogen, resulting in preheated nitrogen. It's worth noting that the sidewall of the preheating plate integrates a finned tube heat exchanger. A finned tube heat exchanger is a device that uses finned tubes to achieve heat exchange between the nitrogen and the heat obtained from the heat exchange in the preheating plate.

[0071] Furthermore, after nitrogen enters the finned tube heat exchanger, it undergoes heat conduction through the heat exchanged between the finned surface and the preheating plate. After absorbing this heat, it enters the subsequent heating module, where it undergoes secondary heating to produce hot nitrogen. Finally, hot nitrogen is output through the hot nitrogen outlet. The finned tube heat exchanger improves waste heat recovery efficiency by increasing the heat exchange area and optimizing the heat conduction path.

[0072] For example, by integrating stainless steel finned tubes into the sidewall of the preheating plate, nitrogen can absorb the residual heat of the preheating plate, causing the preheating plate temperature to drop from 180°C to 150°C.

[0073] This application embodiment utilizes a finned tube heat exchanger to increase the heat transfer area and optimize the heat transfer path, thereby improving the waste heat recovery efficiency, reducing the energy consumption burden of the heating module, further stabilizing the nitrogen heating process, and ensuring the uniformity and stability of the temperature field of the heating module.

[0074] Based on the above embodiments, in some examples, the heating module is a microtubular heater, wherein the power of the microtubular heater is dynamically adjusted using a proportional-integral-derivative control algorithm. A microtubular heater refers to an electric heating element with a slender tubular structure that generates heat through an electric current.

[0075] The miniature tubular heater provides electrical supplementary heating based on preheated nitrogen, and adjusts the heating power in real time using a proportional-integral-derivative (PID) control algorithm. This process dynamically adjusts the current input based on temperature feedback signals to ensure the hot nitrogen temperature remains stable within the target range. The PID algorithm achieves precise temperature control by using a proportional term to quickly respond to temperature deviations, an integral term to eliminate steady-state errors, and a derivative term to suppress temperature overshoot.

[0076] For example, a miniature tubular heater with adjustable power between 0-300W and PID control can heat nitrogen to 230-250°C.

[0077] Furthermore, in some examples, the heating module may be electromagnetic induction heating. This application does not limit the type of heating module.

[0078] This application embodiment achieves dynamic and precise adjustment of hot nitrogen temperature by combining a micro-tube heater with a PID control algorithm, ensuring high temperature stability in the heating zone, thereby improving the reliability and consistency of the solder melting process.

[0079] Based on the above embodiments, this application also provides a solder verification method, applied to the system described in the above embodiments. The method includes: preheating nitrogen gas through a waste heat recovery module to obtain preheated nitrogen gas; reheating the preheated nitrogen gas through a heating module to obtain hot nitrogen gas at a target temperature; uniformly spraying the hot nitrogen gas onto the surface of a carrier using a laminar flow nozzle, and using the hot nitrogen gas to heat the solder joints on the carrier to complete the solder verification; during the secondary heating process, detecting the oxygen concentration in the heating area of ​​the heating module through an oxygen concentration adjustment module, and dynamically adjusting the flow rate of the hot nitrogen gas according to the oxygen concentration to maintain the oxygen concentration in the heating area within a preset range.

[0080] Existing methods use independent cold plate, preheating plate, and heating plate for temperature control. However, during vehicle transfer, this independent temperature control mode leads to large temperature fluctuations (e.g., exceeding ±15°C). To address this issue, this application proposes a temperature zone coordination algorithm, which minimizes temperature fluctuations (less than ±3°C) during vehicle transfer.

[0081] In some examples, before the nitrogen is preheated by the waste heat recovery module to obtain preheated nitrogen, the process also includes: adjusting the temperature of the preheating plate and the fan power of the cold plate in the waste heat recovery module according to the transfer status of the vehicle to compensate for the heat loss during the vehicle transfer process.

[0082] In this embodiment, it can be understood that since the carrier generates heat loss during the transfer process, this embodiment dynamically adjusts the temperature of the preheating plate and the fan power of the cold plate in the waste heat recovery module based on the transfer status of the carrier. The cold plate is used to cool the hot nitrogen output from the heating module.

[0083] Specifically, based on the transfer status of the vehicle, the temperature of the preheating plate and the fan power of the cold plate in the waste heat recovery module are adjusted, including: determining whether the heating module is started; if the heating module is started, the preheating plate is heated to a first set temperature and the fan power is reduced; if the heating module is not started, it is determined whether the vehicle is transferred to the heating module; if the vehicle is transferred to the heating module, the target temperature of the heating module is raised to a second set temperature and the target temperature of the heating module is maintained at the second set temperature for a set time; after the set time, the target temperature of the heating module is restored to the original target temperature.

[0084] Optionally, Figure 3 This is a schematic diagram of the three-temperature zone coordinated control provided in an embodiment of this application. Figure 3As shown, the process first determines whether the heating plate in the heating module is activated. When the heating plate is activated, the preheating plate temperature is raised to the first set temperature and the fan power is reduced, for example, the preheating plate temperature is increased by 5°C and the cold plate fan power is adjusted to 70%. When the heating plate is not activated, the monitoring (MONITOR) is executed. It is determined whether the vehicle has been transferred to the heating plate. If it has not been transferred, the execution of MONITOR is returned. If it has been transferred, the target temperature of the heating plate is increased by 10°C and maintained for 10 seconds. After 10 seconds, the target temperature of the heating plate is restored to the original target temperature, which is the temperature before the target temperature was increased.

[0085] This application embodiment effectively reduces temperature fluctuations during carrier transfer by real-time sensing of the carrier transfer status and dynamic adjustment of temperature zone parameters, thus compensating for carrier transfer adverse reactions. In other words, this application embodiment significantly improves the stability of welding quality through a multi-temperature zone collaborative control strategy.

[0086] Traditional wired temperature measurement carriers face two major problems: first, thermocouple wires are prone to tangling, resulting in a failure rate of over 40%; second, the wiring design of thermocouples hinders carrier transfer efficiency. To address these issues, embodiments of this application improve the carrier. In some embodiments, the carrier is a wireless temperature measurement carrier. Correspondingly, after detecting the oxygen concentration in the heating area of ​​the heating module through the oxygen concentration adjustment module and dynamically adjusting the flow rate of hot nitrogen based on the oxygen concentration, the method further includes: using the wireless temperature measurement carrier to monitor the temperature of the solder joint and obtain temperature data; and determining the status information of the solder joint based on the temperature data.

[0087] The wireless temperature measurement vehicle is a modular temperature measurement vehicle. Figure 4 This is a schematic diagram of the structure of the wireless temperature measurement vehicle provided in an embodiment of this application. Figure 4 As shown, the structure of the wireless temperature measurement vehicle includes a vehicle base, a ceramic insulation layer, an embedded thermocouple structure, a wireless transmission module, and a top cover.

[0088] Furthermore, a thermocouple structure, such as a type K thermocouple, is embedded in the wireless temperature measurement carrier body through a 0.8mm micropore, with its tip 0.5mm from the solder joint. The ceramic insulation layer is 50μm thick. A coating is applied to prevent short circuits. The wireless transmission module uses a 2.4GHz RF chip with a transmission delay of <10ms.

[0089] Furthermore, the structure of the wireless temperature measurement carrier can also consist of a carrier base, a ceramic insulating layer, an infrared temperature sensor, a wireless transmitting module, and a top cover. In this structure, the installation configuration of the wireless temperature measurement carrier needs to be adjusted.

[0090] In this embodiment, it can be understood that by using a wireless temperature measuring device to monitor the temperature of the solder joint in real time, the heat distribution and dynamic evolution characteristics of the solder joint during the forming process or operation process can be captured. The temperature data obtained thereby can objectively reflect the physical connection performance and thermodynamic state inside the solder joint.

[0091] Based on this, the solder joint status is then logically judged according to these real-time temperature data. This allows the judgment process to be directly based on quantitative physical indicators, thereby avoiding the subjective errors and lags caused by traditional manual visual inspection or offline sampling. This enables the immediate identification of abnormal states such as cold solder joints, overheating, embrittlement, or poor connection, significantly improving the automation level and accuracy of solder joint quality monitoring.

[0092] In some embodiments, a non-contact infrared temperature sensor can be used to monitor the temperature of the solder joint; in other embodiments, a contact embedded thermocouple structure can be attached to the area near the solder joint to obtain a more locally representative temperature value.

[0093] Furthermore, the condition of the solder joint is judged based on its temperature data. Specifically, real-time temperature data can be compared with a preset temperature threshold; if the temperature exceeds or falls below the threshold, it is considered abnormal. In other embodiments, the temperature data change curve can be pattern matched with a standard process curve, and the weld joint's pass / fail status can be determined by the feature fit degree. Judging the condition of the solder joint includes not only assessing the welding quality but also determining the degree of aging or fatigue damage under the current current load, thereby achieving full lifecycle condition monitoring of the solder joint.

[0094] It should be noted that the wireless temperature measurement device needs to transmit the acquired temperature data to the processor or other computing device through the wireless transmission module. After receiving the temperature data, the computing device will judge the status of the solder joint based on the temperature data.

[0095] In some examples, the solder verification method provided in this application, after detecting the oxygen concentration in the heating area of ​​the heating module through the oxygen concentration adjustment module and dynamically adjusting the flow rate of hot nitrogen according to the oxygen concentration, further includes: acquiring image data of the solder joint through a high-speed camera; performing image enhancement on the image data to obtain enhanced image data; extracting features from the enhanced image data to obtain target features; and inputting the target features into a classifier to determine the state information of the solder joint.

[0096] The above example provides another way to determine the state of a solder joint by introducing a convolutional neural network to determine the state information of the solder joint. Figure 5This is a flowchart illustrating the process of determining the status information of solder joints, as provided in an embodiment of this application. Figure 5 As shown, image data of the solder joints is first acquired using a high-speed camera. Then, image enhancement is performed on the image data to reduce useless background information that could interfere with subsequent state judgments. Based on this, target features are extracted from the enhanced image data and input into a classifier. The classifier performs multi-scale feature analysis on the target features to obtain the state information of the solder joints. This state information includes whether the solder wetness is greater than 30°C and whether the wet corner collapse height is greater than 0.1 mm. The classifier here is composed of a convolutional neural network.

[0097] It should be noted that the classifier mentioned above can be replaced with an SVM classifier, which needs to be pre-trained.

[0098] The embodiments of this application achieve automated identification of solder joint status through feature extraction and classification algorithms, and significantly reduce the false judgment rate and improve the judgment efficiency and reliability through multi-scale feature analysis.

[0099] The following example illustrates how to utilize the solder verification method provided in this application. The method includes the following steps:

[0100] 1. Staged temperature control nitrogen heating: Nitrogen first enters the finned tube heat exchanger on the side wall of the preheating plate, and is heated to 150°C by the residual heat of the preheating plate; the preheated nitrogen enters the micro tube heater, and the electric heating power is controlled by PID to further heat the nitrogen to 230-250°C.

[0101] 2. Multi-temperature zone coordinated control: When the heating plate is started, the preheating plate temperature automatically increases by 5°C, and the cold plate fan power is adjusted to 70% to reduce the cold plate temperature fluctuation; when the vehicle enters the heating plate, the target temperature of the heating plate is temporarily increased by 10°C (lasting for 10 seconds) to compensate for the heat loss during the vehicle transfer process.

[0102] 3. The AI ​​vision system captures image data of the weld points on the vehicle in real time, and determines the welding status information of the weld points based on the wetting angle and collapse height features. The wireless temperature measurement vehicle transmits temperature data in real time through the 2.4GHz radio frequency module to avoid wiring interference.

[0103] Figure 6 Schematic diagram of the solder verification system provided in the embodiments of this application Figure 2 .like Figure 6As shown, the system includes a temperature control system, a monitoring system, and a nitrogen system. The temperature control system comprises a cold plate-rotating arm-preheating plate-rotating arm-heating plate. The monitoring system includes an AI camera, an AI processor, and a wireless temperature measurement device. The nitrogen system includes a cold nitrogen source, a waste heat recovery unit, an electric heating module, and laminar flow nozzles. The electric heating module and the heating plate together constitute the heating module described in the above embodiment. The AI ​​camera can be a high-speed camera.

[0104] This application's embodiments achieve significant improvements in temperature control accuracy, oxidation prevention capability, judgment efficiency, and maintenance costs. Specifically, the nitrogen heating temperature deviation is reduced from ±15℃ to ±3℃, and the temperature fluctuation during carrier transfer is reduced from ±10℃ to ±2℃, greatly improving temperature control accuracy. Regarding oxidation prevention, the oxygen concentration is stabilized below 50ppm, far lower than the >500ppm of traditional solutions, effectively enhancing the equipment's oxidation prevention capability. In terms of judgment efficiency, the weld point status identification accuracy reaches 95%, significantly better than the 70% achieved manually, and the single experiment time is shortened by 40% (from 30 minutes to 18 minutes), breaking through the judgment efficiency bottleneck. Furthermore, by adopting a wireless temperature measurement carrier, thermocouple loss is reduced by 90%, effectively lowering maintenance costs, and the installation time of the wireless temperature measurement carrier is less than 10 seconds, improving installation efficiency by 10 times compared to existing wired temperature measurement carriers.

[0105] Furthermore, the method provided in this application embodiment has been verified by a prototype. Experimental data shows that at a target temperature of 285°C, when nitrogen is continuously purged at 3.33 L / min, the temperature fluctuation is ≤ ±1.8°C, and the oxygen concentration is stable at 38 ± 7 ppm.

[0106] Figure 7 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Figure 7 As shown, the electronic device 700 provided in this application embodiment may include: a processor 701, and a memory 702 communicatively connected to the processor, wherein:

[0107] The memory stores instructions that the computer executes;

[0108] The processor executes computer execution instructions stored in memory to implement the method described in the foregoing method embodiments.

[0109] It should be understood that processor 701 can be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), etc. A general-purpose processor can be a microprocessor or any conventional processor. The steps of the method disclosed in the application can be directly manifested as execution by a hardware processor, or execution by a combination of hardware and software modules within the processor. Memory 702 may include high-speed random access memory (RAM), and may also include non-volatile memory (NVM), such as at least one disk storage device, or a USB flash drive, external hard drive, read-only memory, disk, or optical disc, etc.

[0110] Optionally, the electronic device 700 may also include a communication interface 703. In specific implementations, if the communication interface 703, memory 702, and processor 701 are implemented independently, they can be interconnected via a bus to complete communication. The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus, etc. Buses can be categorized as address buses, data buses, control buses, etc., but this does not imply that there is only one bus or one type of bus.

[0111] Optionally, in a specific implementation, if the communication interface 703, memory 702, and processor 701 are integrated on a single integrated circuit, then the communication interface 703, memory 702, and processor 701 can communicate through an internal interface.

[0112] This application also provides a computer-readable storage medium storing computer-executable instructions, which, when executed, are used to implement the methods described in any of the foregoing embodiments.

[0113] It is understood that the computer-readable storage medium can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as Static Random Access Memory (SRAM), Electrically Erasable Programmable Read Only Memory (EEPROM), Erasable Programmable Read Only Memory (EPROM), Programmable Read Only Memory (PROM), Read Only Memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk. The readable storage medium can be any available medium accessible to a general-purpose or special-purpose computer.

[0114] An exemplary computer-readable storage medium is coupled to a processor, enabling the processor to read information from and write information to the computer-readable storage medium. Of course, the computer-readable storage medium can also be a component of the processor. The processor and the computer-readable storage medium can reside in an ASIC. Alternatively, the processor and the computer-readable storage medium can exist as discrete components in an electronic device.

[0115] The integrated modules implemented as software functional modules described above can be stored in a computer-readable storage medium. These software functional modules, stored in a computer-readable storage medium, include several instructions to cause an electronic device (which may be a personal computer, server, or network device, etc.) or processor to execute some steps of the methods described in the various embodiments of this application.

[0116] This application also provides a computer program product, including a computer program that, when executed, implements the method described in any of the foregoing embodiments.

[0117] It should be noted that, for the sake of simplicity, the foregoing method embodiments are all described as a series of actions. However, those skilled in the art should understand that this application is not limited to the described order of actions, as some steps may be performed in other orders or simultaneously according to this application. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily essential to this application.

[0118] It should be further noted that although the steps in the flowchart are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowchart may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the sub-steps or stages of other steps.

[0119] In the above embodiments, the descriptions of each embodiment have their own emphasis. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments. The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity, not all possible combinations of the technical features in the above embodiments have been described. However, as long as these combinations of technical features do not contradict each other, they should be considered within the scope of this specification.

[0120] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims.

[0121] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A solder verification system, characterized in that, include: The system includes a cold plate, a waste heat recovery module, a heating module, a nitrogen input module, an oxygen concentration adjustment module, and laminar flow nozzles; among which, The nitrogen input module is connected to the waste heat recovery module and is used to input nitrogen into the waste heat recovery module for preliminary heating of the nitrogen to obtain preheated nitrogen. The waste heat recovery module is connected to the heating module and is used to reheat the preheated nitrogen to obtain hot nitrogen at the target temperature. The laminar flow nozzle is connected to the heating module and is used to uniformly spray the hot nitrogen gas onto the surface of the carrier, and use the hot nitrogen gas to heat the solder joints on the carrier to complete the solder verification. The oxygen concentration adjustment module is connected to the heating module and is used to detect the oxygen concentration in the heating area of ​​the heating module during the secondary heating process, and dynamically adjust the oxygen flow rate in the heating area according to the oxygen concentration to maintain the oxygen concentration in the heating area within a preset range. The solder verification system is configured to adjust the temperature of the preheating plate and the fan power of the cold plate in the waste heat recovery module according to the transfer status of the carrier, in order to compensate for heat loss during the transfer of the carrier. Adjusting the temperature of the preheating plate and the fan power of the cold plate according to the transfer status of the carrier includes: determining whether the heating module is activated; if the heating module is activated, raising the temperature of the preheating plate to a first set temperature and reducing the fan power; if the heating module is not activated, determining whether the carrier has been transferred to the heating module; if the carrier has been transferred to the heating module, raising the target temperature of the heating module to a second set temperature and maintaining the target temperature of the heating module at the second set temperature for a set duration; after the set duration, restoring the target temperature of the heating module to the original target temperature.

2. The system according to claim 1, characterized in that, The waste heat recovery module includes a waste heat recovery unit and a preheating plate; wherein... The waste heat recovery unit is connected to the preheating plate and is used for heat exchange with the preheating plate; The preheating plate is used to transfer the heat obtained through heat exchange to the nitrogen gas through a finned tube heat exchanger to preheat the nitrogen gas and obtain the preheated nitrogen gas. The finned tube heat exchanger is disposed on the side wall of the preheating plate.

3. The system according to claim 1, characterized in that, The heating module is a micro-tube heater, wherein the power of the micro-tube heater is dynamically adjusted using a proportional-integral-derivative control algorithm.

4. A solder verification method, characterized in that, The method, applied to the system as described in any one of claims 1 to 3, comprises: Determine whether the heating module is activated; If the heating module is activated, the preheating plate will be heated to the first set temperature, and the fan power will be reduced; If the heating module is not activated, determine whether the vehicle has been transferred to the heating module; If the vehicle is transferred to the heating module, the target temperature of the heating module is raised to the second set temperature, and the target temperature of the heating module is maintained at the second set temperature for a set period of time. After the set time period, the target temperature of the heating module is restored to the original target temperature; Preheated nitrogen is obtained by initially heating nitrogen through a waste heat recovery module; The preheated nitrogen gas is reheated by a heating module to obtain hot nitrogen gas at the target temperature; Based on the laminar flow nozzle, the hot nitrogen gas is uniformly sprayed onto the surface of the carrier, and the hot nitrogen gas is used to heat the solder joints on the carrier to complete the solder verification. During the secondary heating process, the oxygen concentration in the heating area of ​​the heating module is detected by the oxygen concentration adjustment module, and the flow rate of the hot nitrogen is dynamically adjusted according to the oxygen concentration to maintain the oxygen concentration in the heating area within a preset range.

5. The method according to claim 4, characterized in that, The carrier is a wireless temperature measurement carrier. Correspondingly, after the oxygen concentration in the heating area of ​​the heating module is detected by the oxygen concentration adjustment module, and the flow rate of the hot nitrogen is dynamically adjusted according to the oxygen concentration, the method further includes: The temperature of the solder joint was monitored using a wireless temperature measurement device to obtain temperature data. Based on the temperature data, the status information of the solder joint is determined.

6. The method according to claim 4, characterized in that, After detecting the oxygen concentration in the heating area of ​​the heating module through the oxygen concentration adjustment module and dynamically adjusting the flow rate of the hot nitrogen gas according to the oxygen concentration, the method further includes: Image data of the weld joints are acquired using a high-speed camera; The image data is enhanced to obtain enhanced image data; Feature extraction is performed on the enhanced image data to obtain target features; The target features are input into a classifier to determine the state information of the solder joint.

7. An electronic device, characterized in that, include: Memory, processor; The memory stores computer-executed instructions; The processor executes computer execution instructions stored in the memory, causing the processor to perform the method as described in any one of claims 4-6.

8. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions, which, when executed, are used to implement the method as described in any one of claims 4-6.

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