Grinding and polishing device for metal structural part machining and using method of grinding and polishing device

Abstract

The invention discloses a grinding and polishing device for metal structural part machining and a using method of the grinding and polishing device. The grinding and polishing device comprises a supporting component, a workbench, a first driving component and a second driving component. The support member supports the polishing tool. Abrasive tools will be subsequently described. The support member is rotatably mounted on the first drive member. The table holds an object to be polished. An object to be polished is a part of a mechanical component and is not specially limited, for example, the object can be a component of a vacuum device used in a vacuum device, and the polishing tool can polish a hard anodic oxide film of the object to be polished. In the present embodiment, the coating film formed on the object to be polished is not limited to the hard anodic oxide film. For example, the hardness of the surface of the object to be polished is approximately Hv 350-450. The device has the beneficial effects that the grinding process is mechanized and automatic, so that the time required by grinding processing can be shortened, and the quality of a sealing surface is stabilized.

Description

Technical Field

[0001] One embodiment of the present invention relates to a grinding and polishing apparatus for processing metal structural parts. Background Technology

[0002] In the manufacturing process of various metal parts, polishing and grinding are performed on metal surfaces, typically using rotary cutting tools such as end mills to cut the sealing surface. After cutting the desired groove shape, a small amount of unevenness and cutting chips may remain on the sealing surface. To remove these residues, grinding is required. Grinding of the sealing surface is mostly done manually by operators, but this process is time-consuming, and the surface roughness can vary depending on the operator's experience and skill, leading to inconsistent sealing surface quality. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a grinding and polishing device for processing metal structural parts, which includes a support component for supporting a grinding tool, a worktable for holding the object to be ground, a first drive component for moving the support component and the worktable relative to each other along the shape of the grinding surface, and a second drive component that rotates the support component by rotating one end of the grinding component mounted on the grinding tool in the direction of movement, in sync with the first drive component.

[0004] To achieve the above-mentioned objectives, the present invention employs the following technical solution: A grinding and polishing apparatus for processing metal structural parts includes a support component, a worktable, a first drive component, and a second drive component. The support component supports a grinding tool. The grinding tool will be described later. The support component is rotatably mounted on the first drive component. The worktable holds the object to be ground. The object to be ground is a component of the mechanical part and is not particularly limited; for example, it can be a component of a vacuum device used in a vacuum apparatus. The grinding tool is capable of grinding the hard anodized film on the object to be ground. In this embodiment, the coating formed on the object to be ground is not limited to a hard anodized film. For example, the surface hardness of the object to be ground is approximately Hv350 to 450.

[0005] The first driving component moves the support component relative to the worktable along the shape of the grinding surface of the object being ground. In other words, the first driving component has a mechanism that moves one or both of the support component and the worktable, thereby enabling the grinding tool to move along the shape of the grinding surface. The first driving component includes a first moving component, a first guiding component, a second guiding component, a second moving component, and a third guiding component.

[0006] The first moving member moves the support member in the z-direction. A first guiding member is disposed on the body of the grinding apparatus, extending in the z-direction. The first guiding member guides the movement of the first moving member in the z-direction. For example, the first guiding member may be a guide rail extending in the z-direction, and the first moving member may slide along the first guiding member in the z-direction. The first moving member and the first guiding member constitute a first moving mechanism for moving the support member.

[0007] The second guide member guides the movement of the worktable in the x-direction. The second guide member can be a rectangular platform having a pair of sides along the x-direction and a pair of sides along the y-direction. The worktable is supported on the second guide member in a manner that allows it to slide in the x-direction. For example, the worktable can be configured to clamp the edges of the pair of sides of the second guide member along the x-direction and slide along those edges in the x-direction. The second moving member moves the second guide member supporting the worktable in the y-direction. A third guide member is provided on the body of the grinding apparatus, extending in the y-direction. The third guide member guides the movement of the second guide member 113 in the y-direction. For example, the third guide member can be a guide rail extending in the y-direction, along which the second guide member can slide in the y-direction. The second guide member, the second moving member, and the third guide member can constitute a second moving mechanism for moving the worktable.

[0008] The above describes one example of the configuration of the first driving component, but in this embodiment, the configuration of the first driving component is not limited to the above. For example, the first driving component may further include a moving mechanism that moves the support component in the x-direction and / or y-direction. Furthermore, the first driving component may further include a moving mechanism that moves the worktable in the z-direction.

[0009] The second drive unit rotates the support component of the grinding tool. Furthermore, the second drive unit is synchronized with the first drive unit, ensuring that one end of the grinding component mounted on the grinding tool always faces the direction of movement of the grinding tool along the grinding surface, thereby rotating the support component. However, the grinding apparatus includes multiple motors. These motors, through the first and second drive units, cause the support component and the worktable to move and rotate. The grinding apparatus includes an input operation component and a control component.

[0010] The input operation components include devices such as operation panels, operation buttons, and touch panels, which output signals to the control components based on the input operations. Operators performing grinding operations can control the actions of the first and second drive components of the grinding device through the input operation components. For example, operators can use the input operation components to set or change the start and stop of the grinding process performed by the grinding device, the rotation speed of the support component, and the moving speed and direction of the support component and the worktable. The control component includes a CPU and other processing circuits, as well as a storage component. The control component executes the control program stored in the storage component through the CPU, controlling the actions of the first and second drive components, thereby realizing the grinding function of the grinding device.

[0011] Grinding tool 201A includes a fixture and a first grinding component mounted on the fixture by a grinding component holding component. The first grinding component may be, for example, a grinding brush made of ceramic fiber, nylon, etc. In other words, the first stage of the grinding process is a grinding process performed using a grinding brush. The fixture includes a grinding component holding component, a fixing component, a retainer, and a cover.

[0012] The fixing component is fixed to the support component of the grinding apparatus. The retainer engages with the fixing component. The internal part of the retainer has a hollow receiving component, in which a helical spring is inserted. The spring constant of the helical spring of the grinding tool 201A used in the first stage is 1 N / mm or more and 5 N / mm or less. A floating mechanism is formed by the helical spring inserted into the fixture. The grinding component retaining component is inserted into the receiving component by compressing the helical spring via a washer. At this time, the grinding component retaining component is compressed in a way that the helical spring is not completely tightly fitted. The grinding component retaining component has a hollow component. The first grinding component 305A is detachably installed in the hollow component. The retainer has a pair of holes. A steel ball is inserted into each hole. The cover is disposed on the hole to block the hole in which the steel ball is inserted and is fixed by two retaining rings to prevent the cover from shifting. The shape of the grinding component can be, for example, cylindrical.

[0013] After the grinding process, including the first and second stages, performed by the grinding device, the surface roughness of the grinding surface of the object being ground is preferably: waviness ≤ 0.2 μm, standard deviation of waviness ≤ 0.2 μm, surface roughness ≤ 0.4 μm, and standard deviation of surface roughness ≤ 0.3 μm. The surface roughness of the grinding surface of the object being ground 203 is more preferably ≤ 0.2 μm. Here, among the undulations with different spacing on the grinding surface, the larger undulation is referred to as "waviness". The separation between waviness and the smaller undulation "roughness" can be achieved using the reference length specified in national standards.

[0014] This allows for the mechanization and automation of the grinding process, while simultaneously reducing the grinding time and stabilizing the quality of the sealing surface. Furthermore, it enables the grinding surface to have less waviness and surface roughness than that of a surface ground manually by operators, thereby improving the airtightness of the sealing surface.

[0015] Furthermore, by rotating the support component through the second drive component, a designated end of the second grinding component is always oriented toward the direction of movement of the grinding tool, so that the grinding process can be mechanized and automated even when the grinding surface is not circular.

[0016] The beneficial effect of this invention is that by mechanizing and automating the grinding process, the grinding time can be shortened and the quality of the sealing surface can be stabilized. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of the present invention.

[0018] Figure 2 This is a functional block diagram of the present invention.

[0019] Figure 3 This is a schematic diagram of the grinding tool used in this invention.

[0020] Figure 4 This is an example diagram of the grinding tool of the present invention.

[0021] Figure 5 This is a schematic diagram of an example of a grinding tool used in the grinding apparatus of the present invention.

[0022] Figure 6 This is an exploded view of the grinding tool of the present invention.

[0023] Figure 7 This is a top view of the present invention.

[0024] Figure 8 This is a diagram illustrating the movement path of the second grinding component when grinding a non-circular grinding surface of an object.

[0025] Explanation of reference numerals in the attached figures 10: Grinding device; 101: Support component; 103: Worktable; 105: First driving component; 107: Second driving component; 109: First moving component; 111: First guiding component; 112: First moving mechanism; 113: Second guiding component; 115: Second moving component; 117: Third guiding component; 118: Second moving mechanism; 119: Main body; 121: Input operation component; 122: Control component; 201: Grinding tool; 2 03: Grinding object; 303: Fixture; 305 (305A~305C): Grinding component; 307: Grinding component holding component; 308: Hollow component; 309: Fixing component; 311: Holder; 312: Storage component; 313: Cover; 315: Helical spring; 317: Hole; 319: Steel ball; 321: Snap ring; 701: Sealing surface; 703a~703j: Circular grinding surface; 705a~705c: Non-circular grinding surface. Detailed Implementation

[0026] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings and other figures.

[0027] However, the present invention can be implemented in many different ways and should not be interpreted as limited to the description of the embodiments shown in the following examples. To make the description clearer, the width, thickness, shape, etc., of each component are sometimes represented in a stylized manner relative to the actual form; however, this is merely an example and does not limit the interpretation of the present invention.

[0028] Furthermore, in this specification and accompanying drawings, elements that have the same function as components already described in previous figures are marked with the same symbols, and repeated descriptions may be omitted. Additionally, in this specification and accompanying drawings, identical or similar symbols are used for identical or similar components (with symbols such as A, B, etc. appended only after the numbers), and repeated descriptions may be omitted.

[0029] In this specification, when a component or region is referred to as being "above (or below)" other components or regions, unless otherwise specified, it includes not only cases where the component or region is directly above (or below) other components or regions, but also cases where other constituent elements are sandwiched between other components or regions.

[0030] Furthermore, in this specification, expressions such as "α includes A, B, or C," "α includes any one of A, B, and C," and "α includes one selected from the group consisting of A, B, and C," unless otherwise explicitly stated, do not exclude the possibility that α includes multiple combinations of A to C. Moreover, these expressions do not exclude the possibility that α includes other elements.

[0031] Hereinafter, a grinding apparatus 10 according to an embodiment of the present invention will be described with reference to the accompanying drawings.

[0032] like Figure 1 As shown, the grinding apparatus 10 includes a support member 101, a worktable 103, a first drive member 105, and a second drive member 107. The support member 101 supports the grinding tool 201. The grinding tool 201 will be described later. The support member 101 is rotatably mounted on the first drive member 105. The worktable 103 holds the object to be ground 203. The object to be ground 203 is a component of a mechanical part and is not particularly limited; for example, it can be a component of a vacuum device used in a vacuum apparatus, in which case the object to be ground 203 has a sealing surface of a vacuum container. The sealing surface can be hard anodized. The grinding tool 201 is capable of grinding the hard anodized film on the object to be ground 203. In this embodiment, the coating formed on the object to be ground 203 is not limited to a hard anodized film. For example, the surface hardness of the object to be ground 203 is approximately Hv350 to 450.

[0033] The first drive member 105 moves the support member 101 relative to the worktable 103 along the shape of the grinding surface of the grinding object 203. In other words, the first drive member 105 has a mechanism that moves one or both of the support member 101 and the worktable 103, thereby enabling the grinding tool 201 to move along the shape of the grinding surface. The first drive member 105 includes a first moving member 109, a first guiding member 111, a second guiding member 113, a second moving member 115, and a third guiding member 117.

[0034] The first moving member 109 moves the support member 101 in the z-direction. A first guide member 111 is provided on the body 119 of the grinding apparatus 10, extending in the z-direction. The first guide member 111 guides the movement of the first moving member 109 in the z-direction. For example, the first guide member 111 may be a guide rail extending in the z-direction, and the first moving member 109 may slide along the first guide member 111 in the z-direction. The first moving member 109 and the first guide member 111 constitute a first moving mechanism 112 that moves the support member 101.

[0035] The second guide member 113 guides the movement of the worktable 103 in the x-direction. The second guide member 113 may be a rectangular platform having a pair of sides along the x-direction and a pair of sides along the y-direction. The worktable 103 is supported on the second guide member 113 in a manner that allows it to slide in the x-direction. For example, the worktable 103 may be configured to clamp the edges of the pair of sides of the second guide member 113 along the x-direction and slide along the edges of those sides in the x-direction.

[0036] The second moving member 115 moves the second guide member 113 supporting the worktable 103 in the y-direction. A third guide member 117 is provided on the body 119 of the grinding apparatus 10, extending in the y-direction. The third guide member 117 guides the movement of the second guide member 113 in the y-direction. For example, the third guide member 117 may be a guide rail extending in the y-direction, and the second guide member 113 may slide along the third guide member 117 in the y-direction.

[0037] The second guide component 113, the second moving component 115, and the third guide component 117 can constitute a second moving mechanism 118 for moving the worktable 103.

[0038] The above describes one configuration example of the first drive component 105, but in this embodiment, the configuration of the first drive component 105 is not limited to the above. For example, the first drive component 105 may further include a moving mechanism for moving the support component 101 in the x-direction and / or y-direction. Furthermore, the first drive component 105 may further include a moving mechanism for moving the worktable 103 in the z-direction.

[0039] The second drive member 107 rotates the support member 101 of the grinding tool 201. Furthermore, the second drive member 107 is synchronized with the first drive member 105, ensuring that one end of the grinding element mounted on the grinding tool 201 always faces the grinding tool 201 in the direction of movement along the grinding surface, thereby rotating the support member 101. The grinding apparatus 10 includes multiple motors. These motors, along with the first drive member 105 and the second drive member 107, cause the support member 101 and the worktable 103 to move and rotate.

[0040] like Figure 2 As shown, the grinding apparatus 10 includes an input operation component 121 and a control component 122. The input operation component 121 is a device such as an operation panel, operation buttons, or a touch panel, which outputs signals to the control component 122 based on the input operation. The operator performing the grinding operation can control the actions of the first drive component 105 and the second drive component 107 of the grinding apparatus 10 through the input operation component 121. For example, the operator can use the input operation component 121 to set or change the start and stop of the grinding process performed by the grinding apparatus 10, the rotation speed of the support component 101, and the moving speed and direction of the support component 101 and the worktable. The control component 122 includes a CPU and other arithmetic processing circuits, as well as a storage component. The control component 122 executes the control program stored in the storage component through the CPU to control the actions of the first drive component 105 and the second drive component 107, thereby realizing the grinding function of the grinding apparatus 10.

[0041] Figures 3-5This is a schematic diagram illustrating an example of a grinding tool 201 supported by a support member 101 of the grinding apparatus 10 in this embodiment.

[0042] The grinding process of the grinding object 203 performed by the grinding apparatus 10 in this embodiment includes: a first stage in which the grinding surface is ground by a first grinding member with a first pressing intensity, and a second stage in which the grinding surface is ground by a second grinding member with a second pressing intensity after the first stage. The first grinding member and the second grinding member are grinding members made of different materials. In addition, the first pressing intensity and the second pressing intensity are different from each other. Here, pressing intensity refers to the load applied to the grinding fixture when the grinding member contacts the grinding surface of the grinding object 203 during the grinding process.

[0043] The grinding tool 201A includes a fixture 303 and a first grinding component 305A mounted on the fixture 303 by a grinding component holding component 307. The first grinding component 305A may be, for example, a grinding brush made of ceramic fiber, nylon, or the like. In other words, the first stage of the grinding process is a grinding process performed using a grinding brush.

[0044] like Figure 3 and Figure 6 As shown, the fixture 303 includes a grinding component holding member 307, a fixing member 309, a retainer 311, and a cover 313; the fixing member 309 is fixed to the support member 101 of the grinding apparatus 10. The retainer 311 engages with the fixing member 309. The internal part of the retainer 311 has a hollow storage member 312, in which a coil spring 315 is inserted. The spring coefficient of the coil spring 315 of the grinding tool 201A used in the first stage is 1 N / mm or more and 5 N / mm or less. A floating mechanism is formed by the coil spring 315 inserted into the fixture 303. The grinding component holding member 307 is inserted into and fixed in the storage member 312 of the fixing member 309. The grinding component holding member 307 is inserted into the storage member 312 via a washer 316 to compress the coil spring 315. At this time, the grinding component holding member 307 is compressed in a way that the coil spring 315 is not completely tightly fitted. The grinding component holding component 307 is provided with a hollow component 308. The first grinding component 305A is detachably installed in the hollow component 308.

[0045] The retainer 311 has a pair of holes 317, in which steel balls 319 are inserted; the cover 313 is disposed on the holes 317 to block the holes 317 in which the steel balls 319 are inserted, and is fixed by two snap rings 321 to prevent the cover 313 from shifting.

[0046] Figure 4This is a schematic diagram illustrating an example of a grinding tool 201B used in the second stage of the grinding process. The grinding tool 201B differs in that the material of the second grinding component 305B mounted on the fixture 303 is different from that of the first grinding component 305A, and the coil spring 315 within the fixture 303 has a... Figure 3 and Figure 6 The grinding tool 201A shown has a different spring coefficient than the helical spring 315 inserted into the internal component of the fixture 303. Figure 3 and Figure 6 The grinding tool 201A shown has a substantially the same configuration.

[0047] Figure 4 In the grinding tool 201B shown, the second grinding component 305B is, for example, a sponge abrasive coated with abrasive grains such as alumina, zirconium oxide, or diamond. In other words, the second stage of the grinding process is a grinding process using a sponge abrasive. The shape of the grinding component 305 can be, for example, cylindrical. The spring coefficient of the helical spring 315 inserted into the fixture 303 of the grinding tool 201B is different from the spring coefficient of the helical spring 315 inserted into the fixture 303 of the grinding tool 201A used in the first stage. The spring coefficient of the helical spring 315 inserted into the inner component of the fixture 303 of the grinding tool 201B is greater than 1 N / mm and less than 10 N / mm. The spring coefficient of the helical spring 315 inserted into the inner component of the fixture 303 of the grinding tool 201B is higher than the spring coefficient of the helical spring 315 inserted into the inner component of the fixture 303 of the grinding tool 201A.

[0048] After the first stage of using grinding tool 201A is completed, the worker can remove grinding tool 201A from the support member 101 of the grinding device 10 and install grinding tool 201B onto the support member 101. Alternatively, the worker can disassemble the jig 303 of grinding tool 201A, remove the helical spring 315 with a spring coefficient of 1 N / mm or more and 5 N / mm or less from the grinding tool 201A used in the first stage, and replace it with a helical spring 315 with a spring coefficient greater than 1 N / mm and less than 10 N / mm used in the second stage, thereby producing grinding tool 201B. In this case, while replacing the helical spring 315 of jig 303, the worker can remove the first grinding component 305A mounted on the grinding tool 201A and detachably install the second grinding component 305B.

[0049] Figure 5 This indicates that the second grinding component 305C, mounted on the fixture 303 of the grinding tool 201C, is with... Figure 4This is another example of a second grinding component, different from the second grinding component 305B shown. The grinding tool 201C differs from the second grinding component 305B only in shape, where the second grinding component 305C mounted on the fixture 303 is different in shape. Figure 3 and Figure 6 The grinding tool 201B shown has a substantially similar configuration. The second grinding component 305C of the grinding tool 201C is made of the same material as the second grinding component 305B of the grinding tool 201B. However, the shape of the second grinding component 305C differs from that of the second grinding component 305B; for example, it may be hemispherical.

[0050] After the first stage of using the grinding tool 201A is completed, the personnel performing the grinding process by the grinding device 10 can remove the grinding tool 201A from the support member 101 of the grinding device 10 and install the grinding tool 201C onto the support member 101. Alternatively, the operator can disassemble the jig 303 of the grinding tool 201A, remove the helical spring 315 with a spring coefficient of 1 N / mm or more and 5 N / mm or less from the grinding tool 201A used in the first stage, and replace it with a helical spring 315 with a spring coefficient of greater than 1 N / mm and less than 10 N / mm used in the second stage. At the same time, the first grinding component 305A installed on the grinding tool 201A can be removed, and the second grinding component 305C can be detachably installed, thereby producing the grinding tool 201C.

[0051] Figure 4 The grinding tool 201B shown and Figure 5 The grinding tools 201C shown can all be used in the second stage of the grinding process performed by the grinding device 10. Figure 4 The grinding tool 201B shown is preferably used when the grinding surface of the object 203 being ground is circular. On the other hand, the grinding tool 201C is preferably used when the grinding surface of the object 203 being ground is non-circular.

[0052] Figure 7 This is a top view of an example of the object to be ground 203. The object to be ground 203 is, for example, a component constituting a vacuum container, and is formed of aluminum alloy, stainless steel, etc. The object to be ground 203 has a sealing surface 701. The sealing surface 701 is hard anodized, and the thickness of the hard anodized film can be approximately 30 μm to approximately 100 μm. The sealing surface 701 includes multiple grinding surfaces. Here, a grinding surface refers to the surface on the sealing surface 701 that is ground by the grinding tool 201. The grinding surfaces include circular grinding surfaces 703a to 703j and non-circular grinding surfaces 705a to 705c. When grinding the circular grinding surfaces 703a to 703j, in the second stage, it is preferable to use... Figure 4The grinding tool 201B is shown. In the second stage, the second drive member 107 of the grinding device 10 rotates the support member 101 supporting the grinding tool 201B at a predetermined rotational speed. In other words, the second grinding member 305B of the grinding tool 201B grinds the circular grinding surfaces 703a to 703j while rotating at a predetermined rotational speed. When grinding the non-circular grinding surfaces 705a to 705c, it is preferable to use [a specific grinding method] in the second stage. Figure 5 The grinding tool 201C is shown. The second drive member 107 of the grinding device 10 is aligned with the shape of the grinding surfaces 705a to 705c, so that a predetermined end of the second grinding member 305C mounted on the grinding tool 201C always faces the direction of movement of the grinding tool 201C, thereby rotating the support member 101.

[0053] Figure 8 This is a diagram illustrating the movement path of the second grinding component 305C mounted on the grinding tool 201C when grinding a non-circular surface. Figure 8 In the middle, a non-circular grinding surface is shown. Figure 7 The non-circular grinding surface 705b is shown. Furthermore, the direction of movement of the grinding tool 201C is indicated by a dashed arrow. (See attached image.) Figure 8 As shown, in the second stage, the second drive component 107, along the shape of the grinding surface 705b, ensures that a designated end 801a of the second grinding component 305C always faces the moving direction of the grinding tool 201C, thereby rotating the support component 101. After the grinding process, including the first and second stages, performed by the grinding apparatus 10, the surface roughness of the grinding surface of the grinding object 203 is preferably: waviness ≤ 0.2 μm, standard deviation of waviness ≤ 0.2 μm, surface roughness ≤ 0.4 μm, and standard deviation of surface roughness ≤ 0.3 μm. The surface roughness of the grinding surface of the grinding object 203 is more preferably ≤ 0.2 μm. Here, among the undulations with different spacing provided on the grinding surface, the larger undulation is referred to as "waviness". The separation between waviness and the smaller undulation "roughness" can be achieved using the reference length specified in national standards.

[0054] In this embodiment, the grinding process performed by the grinding device 10 includes: a first stage in which the grinding surface is ground by the first grinding member 305A with a first pressing intensity, and a second stage in which the grinding surface is ground by the second grinding member 305B or the second grinding member 305C with a second pressing intensity after the first stage. Since the spring coefficient of the helical spring 315 inserted in the fixture 303 of the grinding tool 201A equipped with the first grinding member 305A is different from the spring coefficient of the helical spring 315 inserted in the fixture 303 of the grinding tools 201B and 201C equipped with the second grinding members 305B and 305C, the pressing intensity applied to the grinding tools 201A and 201B and 201C can be changed in the first stage of the grinding process using a grinding brush and in the second stage of the grinding process using a sponge abrasive containing abrasive particles. Specifically, the second pressing intensity can be higher than the first pressing intensity.

[0055] This allows for the mechanization and automation of the grinding process, while simultaneously reducing the grinding time and stabilizing the quality of the sealing surface. Furthermore, it enables the grinding surface to have less waviness and surface roughness than that of a surface ground manually by operators, thereby improving the airtightness of the sealing surface.

[0056] Furthermore, by rotating the support member 101 through the second drive member 107, a designated end of the second grinding member 305C is always oriented toward the moving direction of the grinding tool 201C, so that the grinding process can be mechanized and automated even when the grinding surface is not circular. Example

[0057] Example 1

[0058] As the object to be ground, an aluminum alloy A6061 with dimensions of φ360mm × t40mm was prepared, and its surface was subjected to hard anodizing treatment to form a hard anodized film with a thickness of 80μm. The grinding surface of the object to be ground is... Figure 7 The grinding surface of the object 203 shown is the same. As a grinding device, a robot manufactured by FANUC Corporation is used, and a floating retainer (FH-ST12-SL10) manufactured by XEBEC Corporation is used as a jig for the grinding tool.

[0059] In the first stage of the grinding process performed by the grinding device, a grinding tool (hereinafter referred to as the first grinding tool) is manufactured as follows: a helical spring (WL10-35, spring constant: 1N / mm) manufactured by Misumi is inserted into the inner part of the fixture, and a grinding brush (A11-EB06M) manufactured by XEBEC, with a grinding brush length adjusted to 12mm, is mounted on the fixture. Furthermore, in the second stage of the grinding process performed by the grinding device, when grinding a circular grinding surface, a grinding tool (hereinafter referred to as the second grinding tool A) is manufactured as follows: a helical spring (WT10-35, spring constant: 2N / mm) manufactured by Misumi is inserted into the inner part of the fixture, and a 3M sponge abrasive (super fine) is cut into a cylindrical shape with a diameter of 21mm and a thickness of 5mm and mounted on the fixture. Furthermore, when grinding non-circular surfaces in the second stage of the grinding process performed by the grinding device, a grinding tool (hereinafter referred to as the second grinding tool B) is manufactured as follows: a helical spring (WT10-35, spring coefficient: 2N / mm) manufactured by Misumi is inserted into the fixture, a sponge abrasive (super fine) manufactured by 3M is cut into a width of 6mm and a length of 40mm, and the front end is machined into a hemispherical shape with a diameter of 5mm, and then installed on the fixture.

[0060] Grinding process for round grinding surfaces (Phase 1) In the first stage of the grinding process, the 10 circular grinding surfaces of the object being ground (refer to...) Figure 7 The grinding surfaces 703a to 703j shown are ground at a radius of 7.5mm, with the first grinding tool rotating at 5000 rpm and feeding at 2000 mm / min, moving from vertical Z: 2.0mm to Z-1.0mm. After grinding in a 7.5mm radius arc for 5 revolutions, the tool is offset by 1.75mm and ground in a spiral path for 5 revolutions. Then, for the 10 circular grinding surfaces of the object being ground, the rotation speed of the first grinding tool is changed to 8000 rpm, with a feed at 2000 mm / min. The tool is then moved from vertical Z2.0 to Z-1.0 at a radius of 7.5mm, ground in a 7.5mm radius arc for 5 revolutions, offset by 1.75mm and ground in a spiral path for 5 revolutions.

[0061] (Phase Two) In the second stage of the grinding process, for the 10 circular grinding surfaces of the object being ground, the second grinding tool A is lowered to a vertical Z: -3.0mm, and grinding is performed for 10 seconds at a rotation speed of 30rpm for the second grinding tool A as one cycle, and a total of 2 cycles are performed.

[0062] [Grinding process for non-circular grinding surfaces] (Phase 1) In the first stage of the grinding process, for the three non-circular grinding surfaces of the object being ground (refer to...), Figure 7 For the grinding surfaces 705a to 705c shown, the rotational speed of the first grinding tool is set to 5000 rpm and the feed rate is set to 2000 mm / min. The first grinding tool is lowered to a vertical Z: -1.0 mm. Grinding surfaces 705a and 705b for 10 revolutions each, and grinding surface 705c for 5 revolutions, which constitutes one cycle. Two cycles are performed on each of the grinding surfaces 705a, 705b, and 705c. Then, the rotational speed of the first grinding tool is changed to 8000 rpm, and the first grinding tool is lowered to a vertical Z: -0.5 mm. Grinding surfaces 705a and 705b for 20 revolutions each, and grinding surface 705c for 10 revolutions, which constitutes one cycle. Two cycles are performed on each of the grinding surfaces 705a, 705b, and 705c.

[0063] (Phase Two) In the second stage of the grinding process, for the three non-circular grinding surfaces of the object being ground (refer to...), Figure 7 The feed speed of the R component of the second grinding tool B is set to 2000 mm / min and the feed speed of the linear component is set to 4000 mm / min. The second grinding tool B is lowered to a vertical Z: -1.0 mm. Grinding surfaces 705a and 705b for 20 revolutions and grinding surface 705c for 10 revolutions is one cycle. A total of 6 cycles are executed.

[0064] Comparative Example 1 First, the same grinding object as in Example 1 was used as the grinding object. Similar to Example 1, the grinding surface of the grinding object and... Figure 7 The grinding surfaces of the object to be ground 203 shown are identical. Next, ten circular grinding surfaces (see reference) that expose the object to be ground are pasted onto the sealing surface (701) of the object to be ground. Figure 7 The grinding surfaces shown are 703a to 703j) and 3 non-circular grinding surfaces (see reference). Figure 7The mask seals of the polished surfaces 705a to 705c shown are then applied. A protective film for reinforcement is further attached to the mask seals. Polishing paste (manufactured by Kyodo Yushi Co., Ltd.) is then applied to each polished surface 703a to 703j and 705a to 705c, and then manually polished for 1.5 hours using a sponge polishing compound (fine) manufactured by 3M. Next, each polished surface 703a to 703j and 705a to 705c is manually polished for 1.5 hours using a sponge polishing compound (super fine) manufactured by 3M. Afterward, each polished surface 703a to 703j and 705a to 705c is wiped with a cleaning cloth soaked in NEIX cleaning solution 2, and the mask seals are peeled off from the polished surfaces (701).

[0065] The surface roughness (Ra) and processing time of the ground surface after the grinding process of Example 1 are shown in Table 1. Furthermore, the surface roughness (Ra) and processing time of the ground surface after the grinding process of Comparative Example 1 are shown in Table 2.

[0066] Table 1 Surface roughness (Ra) Grinding surface Numerical value (μm) 703a 0.250 703b 0.215 703c 0.219 703d 0.230 703e 0.222 703f 0.220 703g 0.199 703h 0.184 703i 0.211 703j 0.180 705a 0.131 705b 0.209 705c 0.233 Average surface roughness (Ra) 0.208 Surface roughness (Ra) standard deviation 0.030 Homework time 40 minutes Table 2 Surface roughness (Ra) Grinding surface Numerical value (μm) 703a 0.221 703b 0.241 703c 0.283 703d 0.211 703e 0.264 703f 0.168 703g 0.200 703h 0.341 703i 0.252 703j 0.228 705a 0.347 705b 0.384 705c 0.357 Average surface roughness (Ra) 0.269 Surface roughness (Ra) standard deviation 0.068 Homework time 180 minutes As can be seen from the comparison between Example 1 and Comparative Example 1 above, grinding performed by the grinding apparatus involved in this embodiment can achieve better or approximately the same results than manual grinding while significantly shortening the grinding process time. Furthermore, compared to Comparative Example 1, Example 1 shows smaller differences in surface roughness at different grinding locations, thus stabilizing the quality of the sealing surface.

[0067] Example 2

[0068] The circular grinding surfaces 703a, 703e, and 703j, and the non-circular grinding surfaces 705a to 705c, which are the same grinding objects used in Example 1 above, are ground using a grinding process that is substantially the same as in Example 1. However, unlike Example 1 above, in the second stage using the second grinding tool A or the second grinding tool B, the second stage described in Example 1 above is considered as one cycle, and the sponge abrasive is replaced after each cycle. Three cycles are performed respectively.

[0069] Table 3 below shows the waviness and surface roughness of the circular polished surfaces (703a, 703e, 703j) after the polishing process of Example 2, and Table 4 shows the waviness and surface roughness of the non-circular polished surfaces (705a to 705c) after the polishing process of Example 2. Furthermore, the cutoff value for separating waviness and surface roughness is set to 200 μm.

[0070] Table 3 Grinding surface Wavyness (Wa[μm]) Standard deviation of waviness (Wq[μm]) Surface roughness (arithmetic mean roughness) (Sa [μm]) Standard deviation of surface roughness (Sq[μm]) 703a 0.062 0.079 0.193 0.262 703e 0.061 0.074 0.155 0.208 703j 0.071 0.083 0.115 0.150 average value 0.066 0.079 0.155 0.207 Table 4 Grinding surface Wavelength (Wa[μm]) Standard deviation of waviness (Wq[μm]) Surface roughness (arithmetic mean roughness) (Sa [μm]) Standard deviation of surface roughness (Sq[μm]) 705a 0.068 0.084 0.135 0.170 705b 0.149 0.182 0.112 0.156 705c 0.107 0.130 0.153 0.195 average value 0.108 0.132 0.133 0.173 As shown in Tables 3 and 4, when the grinding process is performed using the grinding apparatus described in this embodiment, the waviness of both the circular and non-circular grinding surfaces is 0.2 μm or less, and the standard deviation of the waviness is 0.2 μm or less. Furthermore, the surface roughness of both the circular and non-circular grinding surfaces is 0.2 μm or less, and the standard deviation of the surface roughness is 0.3 μm or less. In particular, the surface roughness of both the circular and non-circular grinding surfaces is 0.2 μm or less. Further, the waviness of the circular grinding surface can be controlled to be 0.1 μm or less.

[0071] Comparative Example 2 As a comparative example 2, the circular grinding surfaces 703a, 703e, and 703j, and the non-circular grinding surfaces 705a to 705c, of the same grinding object used in Example 1 above, were manually ground by an operator. The grinding was performed according to the following steps.

[0072] First, a mask seal is attached to the sealing surface (701) of the object being ground, exposing the circular grinding surfaces 703a, 703e, 703j and the non-circular grinding surfaces 705a to 705c. A protective film for reinforcement is then attached to the mask seal. Next, polishing paste (manufactured by Kyodo Yushi Co., Ltd.) is applied to each of the grinding surfaces 703a, 703e, 703j, 705a to 705c, and then manually polished for 1.5 hours using a sponge polishing compound (fine) manufactured by 3M. Next, each of the grinding surfaces 703a, 703e, 703j, 705a to 705c is manually polished for 1.5 hours using a sponge polishing compound (super fine) manufactured by 3M. Afterwards, each of the grinding surfaces 703a, 703e, 703j, 705a to 705c is wiped with a cleaning cloth soaked in NEIX cleaning solution 2, and the mask seal is peeled off from the grinding surface (701).

[0073] Table 5 below shows the waviness and surface roughness of the circular polished surfaces (703a, 703e, 703j) after the above manual polishing process, and Table 6 shows the waviness and surface roughness of the non-circular polished surfaces (705a to 705c) after the above manual polishing process. Furthermore, the cutoff value for separating waviness and surface roughness is set to 200 μm.

[0074] Table 5 Grinding surface Wavelength (Wa[μm]) Standard deviation of waviness (Wq[μm]) Surface roughness (arithmetic mean roughness) (Sa [μm]) Standard deviation of surface roughness (Sq[μm]) 703a 0.310 0.365 0.109 0.143 703e 0.100 0.124 0.224 0.288 703j 0.198 0.243 0.100 0.130 average value 0.203 0.244 0.145 0.187 Table 6 Grinding surface Wavelength (Wa[μm]) Standard deviation of waviness (Wq[μm]) Surface roughness (arithmetic mean roughness) (Sa [μm]) Standard deviation of surface roughness (Sq[μm]) 705a 0.146 0.186 0.182 0.255 705b 0.100 0.122 0.126 0.175 705c 0.100 0.124 0.247 0.385 average value 0.116 0.144 0.185 0.272 As shown in Tables 5 and 6, the waviness of both the circular and non-circular polished surfaces after manual grinding is greater than that of Example 2. Furthermore, the surface roughness and standard deviation of the non-circular polished surfaces after manual grinding are both greater than those of Example 2. Although the surface roughness and standard deviation of the circular polished surfaces after manual grinding are slightly smaller than those of Example 2, the differences in surface roughness and standard deviation at different grinding locations are greater than the differences at different grinding locations of the circular polished surfaces in Example 2.

[0075] As can be seen from the comparison between Example 2 and Comparative Example 2 above, grinding performed by the grinding apparatus involved in this embodiment can achieve better or approximately the same results than manual grinding.

[0076] The embodiments and variations described above as examples of this invention can be appropriately combined and implemented without contradicting each other. Furthermore, based on the configuration shown in the embodiments, any implementation methods obtained by those skilled in the art through appropriate additions or deletions of constituent elements, design changes, or additions or omissions of processes or changes in conditions, as long as they possess the spirit of this invention, are included within the scope of this invention.

Claims

1. A grinding and polishing apparatus for processing metal structural parts, comprising a first grinding component used in a first grinding step, wherein the first grinding step grinds a grinding surface of a hard anodized film with a first pressing intensity; and a second grinding component used in a second grinding step, wherein the second grinding step is performed after the first grinding step and grinds the grinding surface with a second pressing intensity greater than the first pressing intensity, characterized in that, A shaft-shaped fixture for the first or second grinding component, the fixture comprising a receiving component, a helical spring received in the receiving component, and a grinding component holding component inserted into the receiving component to compress the helical spring and detachably holding the first or second grinding component, wherein in the first grinding step, the helical spring is a first spring having a first spring coefficient, and in the second grinding step, the helical spring is a second spring having a second spring coefficient greater than the first spring coefficient.

2. The grinding and polishing device for processing metal structural parts according to claim 2, characterized in that, The first spring coefficient is greater than 1 N / mm and less than 5 N / mm, and the second spring coefficient is greater than 1 N / mm and less than 10 N / mm.

3. A grinding and polishing apparatus for processing metal structural parts according to any one of claims 1 to 2, characterized in that, The first grinding component is a grinding brush, and the second grinding component is a sponge abrasive.

4. A grinding method for a grinding and polishing apparatus used in the processing of metal structural parts, for grinding a grinding surface on a hard anodized film, characterized in that, include: In the first grinding process, the grinding surface is ground by a first grinding component with a first pressing intensity; The second grinding step, after the first grinding step, involves grinding the grinding surface with a second grinding component, which is different from the first grinding component, using a second pressing intensity. The second pressing intensity is greater than the first pressing intensity.

5. The grinding method of the grinding and polishing device for processing metal structural parts according to claim 4, characterized in that, The first or second grinding component is held by a shaft-shaped fixture, and the first and second pressing intensities are controlled by the spring coefficient of the fixture.

6. The grinding method of the grinding and polishing device for processing metal structural parts according to claim 4, characterized in that, In the first grinding process, the spring coefficient is above 1N / mm and below 5N / mm, and in the second grinding process, the spring coefficient is greater than 1N / mm and below 10N / mm.

7. A grinding method for a grinding and polishing apparatus for processing metal structural parts according to claim 6 or 7, characterized in that, The second grinding process includes: pressing the second grinding component onto the grinding surface, causing the second grinding component to move relative to the grinding surface; and rotating the second grinding component around the axis of the fixture during the movement from start to finish, so that one end of the second grinding component is always at the foremost point in the direction of movement.

8. The grinding method of the grinding and polishing device for processing metal structural parts according to claim 4, characterized in that, The first grinding component is a grinding brush, and the second grinding component is a sponge abrasive.

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