Grinding dresser and manufacturing method thereof

Abstract

The present invention provides an abrasive dresser comprising: a substrate having a plurality of bosses on one side thereof, the plurality of bosses being spaced apart from each other by a plurality of recesses; the plurality of grinding particles are respectively fixed on the plurality of bosses in a one-to-one correspondence manner through a bonding agent layer; wherein the cement layer extends into the plurality of recesses. In addition, the invention also discloses a manufacturing method of the grinding dresser.

Description

Technical Field

[0001] This invention relates to a grinding and dressing device and its manufacturing method, particularly a grinding and dressing device for a chemical mechanical polishing pad used in the manufacturing process of semiconductor devices and its manufacturing method. Background Technology

[0002] Chemical mechanical polishing (CMP) is now a crucial part of semiconductor device manufacturing processes. In this process, CMP pads are typically used with polishing slurries to polish the substrate and remove excess material. However, after a certain period of use, the polishing efficiency of CMP pads is affected by the accumulation of removed material debris, thus requiring periodic conditioning with a dresser to maintain polishing efficiency.

[0003] When using a dresser to condition a chemical mechanical polishing (CMP) pad, the abrasive particles must be able to restore the surface roughness of the CMP pad without detaching and causing subsequent damage to the CMP pad and / or semiconductor device. Furthermore, they must maintain good cutting force over long-term use to reduce production and maintenance costs. Many technologies have been developed, such as the CMP pad dresser disclosed in patent publication number TW 562719, which uses individual abrasive particles welded to the top surface of a metal rod, and then positions and fixes the metal rod in a metal disk to create a high-precision dresser.

[0004] However, traditional dressers, when addressing these needs, often compromise on some aspects, improving some problems while sacrificing others or creating new ones. For example, patent publication number TW I306048 discloses fixing abrasive particles on the substrate of the dresser. When the abrasive particles wear down to the same height as the bonding layer between them during use, the effective working area of ​​the abrasive particles is greatly reduced, leading to a decline in grinding performance. Using large abrasive particles to provide good cutting ability for long-term use results in increased costs and a wide range of abrasive particle size distribution. For the grinding dresser of the chemical mechanical polishing pad disclosed in patent publication number TW 562719, the manufacturing process requires additional steps such as drilling holes in the metal disc, welding abrasive particles to metal rods, inserting the metal rods into the holes in the metal disc, and positioning and fixing the metal rods. This not only increases costs but also makes it difficult to control the tip height of the abrasive particles.

[0005] Therefore, there is an urgent need for a grinding dresser that can maintain good cutting force, maintain good production and maintenance costs, and at the same time increase the effective working area and / or facilitate the control of the tip height of the abrasive particles. Summary of the Invention

[0006] This invention provides a grinding and dressing tool and its manufacturing method.

[0007] According to one embodiment, an abrasive dressing tool includes: a substrate having a plurality of bosses on one side, the plurality of bosses being spaced apart from each other by a plurality of recesses; and a plurality of abrasive particles, respectively fixed to the plurality of bosses in a one-to-one correspondence by an adhesive layer; wherein the adhesive layer extends into the plurality of recesses.

[0008] According to one embodiment, a method for manufacturing an abrasive dressing tool includes: forming a plurality of bosses and a plurality of recesses on a first side of a substrate, wherein the plurality of bosses are spaced apart from each other by the plurality of recesses; forming an adhesive layer on the first side of the substrate such that the adhesive layer completely covers the plurality of bosses and the plurality of recesses; positioning a plurality of abrasive particles in a one-to-one correspondence with the plurality of bosses on the substrate; and fixing the plurality of abrasive particles to the tops of the plurality of bosses on the substrate respectively by means of the adhesive layer. Attached Figure Description

[0009] Figure 1 A side view of a grinding and dressing apparatus provided in an embodiment of the present invention is shown.

[0010] Figure 2 A flowchart illustrating the method for manufacturing a grinding and dressing tool is provided.

[0011] Figures 3A-3G Draw a schematic diagram of the state in the manufacturing process.

[0012] Figure 4 A schematic diagram illustrating an example of a positioning plate used in the manufacturing process.

[0013] List of reference numerals

[0014] 100: Grinding and Dressing Tool

[0015] 102: Substrate

[0016] 102A: First side

[0017] 102B: Second side

[0018] 104: Grinding particles

[0019] 106: Bonding layer

[0020] 108: convex platform

[0021] 110: Depression

[0022] 112: Bottom surface

[0023] 114: Boss sidewall

[0024] H: Height of the boss

[0025] W: Bottom width

[0026] P: Spacing between bosses

[0027] 202, 204, 206, 208, 210: Methods and Steps

[0028] 300, 320: Positioning plate

[0029] 302: Groove

[0030] 322: Hole. Detailed Implementation

[0031] Figure 1 A side view of a grinding conditioner 100 according to an embodiment of the present invention is shown. The grinding conditioner 100 is, for example, suitable for chemical mechanical polishing processes to condition chemical mechanical polishing pads. See also... Figure 1 The grinding and dressing device 100 includes a substrate 102, a plurality of abrasive particles 104 and a bonding layer 106. The abrasive particles 104 are fixed to one side of the substrate 102 by the bonding layer 106 covering the substrate 102.

[0032] According to one embodiment, the substrate 102 may be circular, for example, a 4-inch circle. However, the invention is not limited thereto, and the substrate 102 may be of other suitable shapes and / or sizes. The substrate 102 may be composed of materials with certain mechanical strength and chemical resistance, including metal alloys. In this embodiment, the substrate 102 is, for example, stainless steel, but is not limited thereto. The substrate 102 has opposing first sides 102A and second sides 102B, and the abrasive particles 104 are fixed to the first side 102A of the substrate 102 by an adhesive layer 106. More specifically, the substrate 102 has a plurality of bosses 108 formed on the first side 102A, the bosses 108 being spaced apart from each other by a plurality of recesses 110, and the abrasive particles 104 are fixed to the bosses 108 outside the recesses 110 by the adhesive layer 106. In particular, the abrasive particles 104 may be fixed to the bosses 108 in a one-to-one correspondence, such that only a single abrasive particle 104 is fixed to each boss 108. The substrate 102 and the boss 108 are both made of the same material. The boss 108 can be formed on the substrate 102 by any suitable method, including, but not limited to, dry etching, wet etching, laser cutting, etc. Abrasive particles 104 fixed by the adhesive layer 106 are exposed on the boss 108. The adhesive layer 106 exposed on the first side 102A of the substrate 102 can cover the boss 108 and extend into the recesses 110. According to one embodiment, the adhesive layer 106 can completely cover the boss 108 and the recesses 110 on the substrate 102.

[0033] The bosses 108 can be distributed in a predetermined pattern on the first side 102A of the substrate 102 according to the arrangement requirements of the abrasive particles 104. According to one embodiment, the bosses 108 can be arranged as at least one or more concentric circles, but the present invention is not limited to this, and can also be varied as at least one or more arrays, polygons, radial, spiral or similar shapes, and the various parts therein are not limited to whether they are equidistant, and can be varied according to actual needs.

[0034] See Figure 1 Any two adjacent bosses 108 may be separated by a recess 110, wherein each of the two adjacent bosses 108 has a boss sidewall 114 protruding from the bottom surface 112 of the recess 110, and the adhesive layer 106 covers the bottom surface 112 and the boss sidewall 114 in the recess 110. According to one embodiment, the boss sidewall 114 may be substantially perpendicular to the bottom surface 112. However, the invention is not limited thereto, and the boss sidewall 114 may also be inclined relative to the bottom surface 112, for example, forming an obtuse angle or an acute angle between the boss sidewall 114 and the bottom surface 112. The adhesive layer 106 may extend continuously in the recess 110, substantially conforming to the contours of the bottom surface 112 and the boss sidewall 114. The adhesive layer 106 is exposed between two adjacent protrusions 108, and the height of the top of each protrusion 108 relative to the bottom surface 112 is different from the height of the adhesive layer 106 in the recess 110, which covers the bottom of the adhesive layer 106 on the bottom surface 112. Therefore, the recess 110 on the substrate 102 located between the abrasive particles 104 can form a larger gap, which helps to remove material debris and / or abrasive slurry during grinding. The adhesive layer 106 extending into the recess 110 has a larger bonding area with the substrate 102, which also helps to improve the bonding force.

[0035] The bonding agent layer 106 may be a metal solder, such as a nickel-chromium alloy, or a foil formed by mixing and rolling a metal powder with an organic binder. However, the invention is not limited to this; in other embodiments, the bonding agent layer 106 may also be a metal powder, a polymeric binder, a metal plating layer, or other binders capable of providing sufficient bonding strength between the abrasive particles 104 and the substrate 102. According to one embodiment, the thickness of the bonding agent layer 106 is approximately 35–200 μm.

[0036] Abrasive particles 104 located on the boss 108 protrude from the adhesive layer 106, and a portion of the abrasive particles 104 is embedded in the adhesive layer 106. According to one embodiment, the thickness of the abrasive particles 104 embedded in the adhesive layer 106 may be equal to or greater than approximately half the average particle size of the abrasive particles 104, thereby stably fixing the abrasive particles 104. The abrasive particles 104 are composed of a material with high hardness, such as diamond, cubic boron nitride, alumina, silicon carbide, etc.

[0037] Abrasive particles typically have a nominal size and a corresponding range of variation, with the larger the size of the abrasive particles used, the greater the range of variation. According to one embodiment, the particle size range of abrasive particles 104 is approximately 70 to 400 μm. For example, abrasive particles 104 arranged on substrate 102 may all have a particle size of approximately 70 μm, approximately 100 μm, approximately 170 μm, approximately 200 μm, or approximately 400 μm. According to tests, when using abrasive particles with a diameter of approximately 100 μm, the height difference caused by the variation in particle size is approximately 6 μm; when using abrasive particles with a diameter of approximately 170 μm, the height difference caused by the variation in particle size is approximately 8 μm; and when using abrasive particles with a diameter of approximately 200 μm, the height difference caused by the variation in particle size is approximately 10 μm. Therefore, using relatively small-sized abrasive particles 104 helps to reduce the height difference between the abrasive particles 104 arranged on the substrate 102 and can increase the number of abrasive particles 104 arranged.

[0038] The parameters such as the height H of the protrusion 108 protruding from the bottom surface 112, the bottom surface width W of the protrusion 108 (i.e., the width adjacent to the bottom surface 112), and the protrusion spacing P between adjacent protrusions 108 (i.e., the distance between the protrusion sidewalls 114 of two adjacent protrusions 108 in the recess 110) can be determined according to the size and number of abrasive particles 104 and the size of the arrangement pattern. According to one embodiment, the protrusion height H can be about 0.5 to 1.5 times the particle diameter of the abrasive particles 104, and the bottom surface width W can be about 2 to 3 times the particle diameter of the abrasive particles 104. Taking the particle diameter of the abrasive particles 104 as an example, the height H of the protrusion 108 can be between about 35 and 600 μm, and the bottom surface width W of the protrusion 108 can be between about 140 and 1200 μm. For example, when the particle size of the abrasive particles 104 arranged on the substrate 102 is approximately 70 μm, the height H of the boss 108 can be approximately 35–105 μm, and the bottom width W of the boss 108 can be approximately 140–210 μm; when the particle size of the abrasive particles 104 arranged on the substrate 102 is approximately 100 μm, the height H of the boss 108 can be approximately 50–150 μm, and the bottom width W of the boss 108 can be approximately 200–300 μm; when the particle size of the abrasive particles 104 arranged on the substrate 102 is approximately 170 μm, the height H of the boss 108 can be approximately 35–105 μm, and the bottom width W of the boss 108 can be approximately 140–210 μm; The height H of the boss 108 can be approximately 85–255 μm, and the bottom width W of the boss 108 can be approximately 340–510 μm. When the particle size of the abrasive particles 104 arranged on the substrate 102 is approximately 200 μm, the height H of the boss 108 can be approximately 100–300 μm, and the bottom width W of the boss 108 can be approximately 400–600 μm. When the particle size of the abrasive particles 104 arranged on the substrate 102 is approximately 400 μm, the height H of the boss 108 can be approximately 200–600 μm, and the bottom width W of the boss 108 can be approximately 800–1200 μm.

[0039] The boss spacing P corresponds to the distance between the boss sidewalls 114 of two adjacent bosses 108 distributed in the same pattern within the recess 110. With the abrasive particles 104 having a predetermined size, decreasing the boss spacing P increases the number of abrasive particles 104 arranged in the pattern, while increasing the boss spacing P decreases the number of abrasive particles 104 arranged in the pattern. According to one embodiment, the boss spacing P can be approximately 1.5 to 20 times the particle size of the abrasive particles 104. Taking an abrasive particle size of 104 between approximately 70 and 400 μm as an example, the boss spacing P can be between approximately 105 and 8000 μm. For example, when the particle size of the abrasive particles 104 arranged on the substrate 102 is approximately 70 μm, the boss spacing P can be approximately 105 to 1400 μm; when the particle size of the abrasive particles 104 arranged on the substrate 102 is approximately 100 μm, the boss spacing P can be approximately 150 to 2000 μm; when the particle size of the abrasive particles 104 arranged on the substrate 102 is approximately 170 μm, the boss spacing P can be approximately 255 to 3400 μm; when the particle size of the abrasive particles 104 arranged on the substrate 102 is approximately 200 μm, the boss spacing P can be approximately 300 to 4000 μm; when the particle size of the abrasive particles 104 arranged on the substrate 102 is approximately 400 μm, the boss spacing P can be approximately 600 to 8000 μm.

[0040] By using the raised structure of the abrasive particles 104 on the protrusions 108 of the substrate 102, multiple benefits are provided, including: (1) less contamination by the bonding agent layer 106 during conditioning; (2) the formation of larger gaps between the abrasive particles 104, which helps to discharge material debris and / or abrasive slurry during conditioning; and (3) the improvement of the problem of abrasive particle aggregation or drift, and the more stable fixation of the abrasive particles, making them less likely to fall off.

[0041] Furthermore, the recesses 110 between the abrasive particles 104 in the grinding dresser can increase the distance between the bonding agent layer 106 and the abrasive particles 104, thus significantly increasing the effective working area of ​​the grinding dresser 100, which is the contact area between the grinding dresser 100 and the conditioned chemical mechanical polishing pad. Secondly, the grinding dresser directly fixes the abrasive particles 104 onto the bosses 108 of the substrate 102. The bosses 108 are integrally formed with the substrate 102, which can solve the problem of difficulty in controlling the height of the abrasive particles 104 to be consistent due to complex process steps.

[0042] In addition, the abrasive particles 104 in the grinding dresser 100 can be selected with a particle size of, for example, abrasive particles with a particle size between about 100 and 200 μm, such as abrasive particles with a particle size of about 100 μm, about 170 μm, or about 200 μm. In addition to the aforementioned advantages, it can also reduce the height difference between abrasive particles, slow down the decay of cutting ability, increase the effective working hours of abrasive particles, and reduce production costs.

[0043] The exemplary experimental data in Table 1 below are the pad wear rate (PWR) and cut rate decline rate (CR) obtained from grinding tests on grinding dressers with abrasive particles of approximately 100 μm (Test Examples 3 and 4) and grinding dressers with abrasive particles of relatively small and relatively large diameters (Test Examples 1 and 2). The difference between Test Examples 3 and 4 is the arrangement and number of abrasive particles. The PWR and CR decline rates are data obtained after grinding 150 wafers. More specifically, the PWR and CR decline rate tests were conducted using a single chemical mechanical polishing pad and a single grinding dresser on 150 wafers. The single grinding dresser used was one of Test Examples 1 to 4. After completing the grinding test on 150 wafers, another test example was used, and the grinding test on 150 wafers was repeated to obtain the decline rate data for each test example.

[0044] Table 1:

[0045]

[0046] According to the experimental data in Table 1, compared with abrasive particles with a diameter of approximately 75 μm and 400 μm, using abrasive particles with a diameter of approximately 100 μm can substantially reduce the PWR decay rate and CR decay rate of the abrasive dresser. The PWR decay rate and CR decay rate can both be less than approximately 30%, which means that the wear rate of the abrasive pad after the abrasive dresser has been abraded by the abrasive pad is less than approximately 30%.

[0047] Cooperate Figure 1 The following will refer to Figure 2 , Figures 3A-3G and Figure 4 The method for manufacturing the grinding and dressing tool 100 is described, wherein Figure 2 A flowchart illustrating the method for manufacturing the grinding and dressing device 100 is provided. Figures 3A-3G Draw a schematic diagram of the states in the manufacturing process. Figure 4 A schematic diagram illustrating an example of a positioning plate used in the manufacturing process. (See also...) Figure 2 , 3A In step 202, a substrate 102 is first provided, wherein both its opposing first side 102A and second side 102B are generally flat surfaces. The substrate 102 can be any suitable material, such as stainless steel.

[0048] See Figure 2 , 3BIn step 204, a plurality of bosses 108 and a plurality of recesses 110 are formed on the first side 102A of the substrate 102, wherein adjacent bosses 108 are spaced apart from each other by recesses 110. According to one embodiment, step 204 includes, for example, performing processes such as dry etching, wet etching, laser cutting, etc. on the substrate 102.

[0049] See Figure 2 , 3C In step 206, an adhesive layer 106 is formed on the first side 102A of the substrate 102, such that the adhesive layer 106 completely covers the bottom surface 112 of the boss 108 and the recess 110. According to one embodiment, step 206 includes, for example, placing the adhesive layer 106, which is a foil-shaped metal solder, on the substrate 102, and then pressing and rolling it to substantially uniformly adhere to the top of the boss 108, the sidewall 114 of the boss, and the bottom surface 112 of the recess 110 on the substrate 102.

[0050] See Figure 2 , 3D In step 208, the abrasive particles 104 are positioned in a one-to-one correspondence with the bosses 108 on the substrate 102. Step 206 includes, for example, using... Figure 4 The positioning plate 300 shown has multiple grooves 302 on one surface, and abrasive particles 104 are respectively placed into the grooves 302. The grooves 302 restrict the position and orientation of the abrasive particles 104, such as... Figure 3D As shown. The shape and size of the groove 302 can be set to match the size of the abrasive particle 104, so that each groove 302 can only accommodate a single abrasive particle 104. Next, as Figure 3E As shown, the substrate 102 with the adhesive layer 106 is aligned and overlapped with the positioning plate 300 with its first side 102A facing the abrasive particles 104, so that the abrasive particles 104 and the top of the boss 108 are positioned in a one-to-one correspondence.

[0051] See Figure 2 , 3F In step 210, the abrasive particles 104 are fixed to the bosses 108 of the substrate 102 using the adhesive layer 106. Step 210 includes, for example, applying force to the positioning plate 300 and / or the substrate 102 to partially embed the abrasive particles 104 into the adhesive layer 106, and heating for a predetermined time. Preferably, a high-temperature vacuum furnace hard soldering method can be used to melt the adhesive layer 106 and weld the abrasive particles 104 to the substrate 102. After the adhesive layer 106 cools and hardens, the abrasive particles 104 are fixed to the top of the bosses 108. Then, the substrate 102 with the abrasive particles 104 fixed is separated from the positioning plate 300 to complete the manufacturing of the abrasive dressing device.

[0052] Figures 3D-3FThe illustrated embodiment uses template 300 to perform steps 208 and 210; however, the present invention is not limited thereto. Figure 3G A schematic diagram illustrating another embodiment of the present invention shows the use of a positioning plate 320 with multiple holes 322 to perform steps 208 and 210. (See also...) Figure 3G In step 208, the positioning plate 320 is positioned on the adhesive layer 106 adjacent to the substrate 102, wherein the holes 322 of the positioning plate 320 correspond to the positions of the bosses 108, and the abrasive particles 104 are placed and dispersed in the holes 322 of the baffle plate 320, so that the abrasive particles 104 and the bosses 108 are positioned in a one-to-one correspondence, wherein the abrasive particles 104 can contact the adhesive layer 106 on the substrate 102 through the holes 322. In step 210, after placing a top plate 330 above the surface of the positioning plate 320 and applying pressure, the abrasive particles 104 are pressed down by the top plate 330 into the adhesive 106 on the bosses 108, and heated for a predetermined time, thereby fixing the abrasive particles 104 to the top of the bosses 108.

[0053] The above description is based on several different embodiments of the present invention, wherein each feature may be implemented individually or in different combinations. Therefore, the disclosure of embodiments of the present invention is a specific example illustrating the principles of the present invention and should not be construed as limiting the present invention to the disclosed embodiments. Furthermore, the foregoing description and accompanying drawings are merely illustrative of the present invention and are not intended to limit it. Variations or combinations of other elements are possible and do not depart from the spirit and scope of the present invention. In addition, the numerical ranges within the maximum and minimum values ​​of the parameters disclosed in the various embodiments of the present invention can be implemented accordingly.

Claims

1. A grinding and dressing tool, characterized in that, include: A substrate having a plurality of protrusions on one side, the plurality of protrusions being spaced apart from each other by a plurality of recesses; as well as Multiple abrasive particles are fixed to the multiple protrusions in a one-to-one correspondence through an adhesive layer; The adhesive layer extends into the plurality of recesses.

2. The grinding and dressing tool according to claim 1, characterized in that, The adhesive layer completely covers the plurality of bosses and the plurality of recesses on the substrate.

3. The grinding and dressing tool according to claim 1, characterized in that, The plurality of recesses includes a first recess, and the plurality of protrusions includes a first protrusion and a second protrusion that are adjacent to each other and spaced apart by the first recess. The first protrusion and the second protrusion have a first protrusion sidewall and a second protrusion sidewall that protrude from the bottom surface of the first recess, respectively. The adhesive layer covers the bottom surface of the first recess, the first protrusion sidewall and the second protrusion sidewall.

4. The grinding and dressing tool according to claim 3, characterized in that, The adhesive layer extends continuously within the first recess, conforming to the contours of the bottom surface, the first boss sidewall, and the second boss sidewall.

5. The grinding and dressing tool according to claim 3, characterized in that, The adhesive layer is exposed between the first boss and the second boss, and the height of the top of the first boss and the top of the second boss relative to the bottom surface is different from the height of the adhesive layer at the bottom of the adhesive layer covering the bottom surface in the first recess.

6. The grinding and dressing tool according to claim 3, characterized in that, The first boss sidewall and the second boss sidewall are substantially perpendicular to the bottom surface.

7. The grinding and dressing tool according to claim 1, characterized in that, The plurality of abrasive particles protrude from the bonding agent layer on the plurality of protrusions, and each of the plurality of abrasive particles is embedded in the bonding agent layer with a thickness equal to or greater than approximately one-half of the average particle size of the plurality of abrasive particles.

8. The grinding and dressing tool according to claim 1, characterized in that, The thickness of the adhesive layer is approximately 35–200 μm.

9. The grinding and dressing tool according to claim 1, characterized in that, The particle size range of the plurality of abrasive particles is approximately 70–400 μm; and The height of the plurality of bosses is approximately 0.5 to 1.5 times the particle size of the plurality of abrasive particles, and / or the spacing between the plurality of bosses is approximately 1.5 to 20 times the particle size of the plurality of abrasive particles.

10. The grinding and dressing tool according to claim 1, characterized in that, The plurality of abrasive particles are all approximately 70 μm in diameter, approximately 100 μm in diameter, approximately 170 μm in diameter, approximately 200 μm in diameter, or approximately 400 μm in diameter.

11. The grinding and dressing apparatus according to any one of claims 1 to 10, characterized in that, The particle size of each of the plurality of abrasive particles is approximately 70 μm, and the spacing between the plurality of bosses is approximately 105–1400 μm; or The particle size of each of the plurality of abrasive particles is approximately 100 μm, and the spacing between the plurality of bosses is approximately 150–2000 μm; or The particle size of each of the plurality of abrasive particles is approximately 170 μm, while the spacing between the bosses is approximately 255–3400 μm; or The particle size of each of the plurality of abrasive particles is approximately 200 μm, while the spacing between the bosses is approximately 300–4000 μm; or The particle size of each of the plurality of abrasive particles is approximately 400 μm, and the spacing between the bosses is approximately 600–8000 μm.

12. The grinding and dressing apparatus according to any one of claims 1 to 10, characterized in that, The plurality of protrusions may be arranged in one or more of the following configurations: concentric circles, arrays, polygons, radial shapes, and spirals.

13. A method for manufacturing a grinding and dressing tool, characterized in that, include: A plurality of protrusions and a plurality of recesses are formed on a first side of the substrate, wherein the plurality of protrusions are spaced apart from each other by the plurality of recesses; An adhesive layer is formed on the first side of the substrate, such that the adhesive layer completely covers the plurality of bosses and the plurality of recesses; Positioning multiple abrasive particles in a one-to-one correspondence with the multiple protrusions on the substrate; and The plurality of abrasive particles are respectively fixed to the top of the plurality of bosses on the substrate by the bonding agent layer.

14. The manufacturing method according to claim 13, characterized in that, The step of forming the plurality of bosses and the plurality of recesses on the first side of the substrate includes etching or laser cutting the substrate.

15. The manufacturing method according to claim 13, characterized in that, The step of positioning the plurality of abrasive particles in a one-to-one correspondence with the plurality of bosses on the substrate includes: Using a positioning plate with multiple grooves or holes, the multiple abrasive particles and the multiple bosses are positioned in a one-to-one correspondence through the multiple grooves or holes.

16. The manufacturing method according to claim 13, characterized in that, The step of forming the plurality of bosses and the plurality of recesses on the first side of the substrate includes forming a first recess and a first boss and a second boss that are adjacent to each other and spaced apart by the first recess, the first boss and the second boss having a first boss sidewall and a second boss sidewall protruding from the bottom surface of the first recess, and the adhesive layer extending continuously in the first recess in accordance with the contours of the bottom surface, the first boss sidewall and the second boss sidewall.

17. The manufacturing method according to claim 13, characterized in that, The plurality of abrasive particles protrude from the bonding agent layer on the plurality of protrusions, and each of the plurality of abrasive particles is embedded in the bonding agent layer with a thickness equal to or greater than approximately one-half of the average particle size of the plurality of abrasive particles.

18. The manufacturing method according to claim 13, characterized in that, The thickness of the adhesive layer is approximately 35–200 μm.

19. The manufacturing method according to claim 13, characterized in that, The particle size range of the plurality of abrasive particles is approximately 70–400 μm; and The height of the plurality of bosses is approximately 0.5 to 1.5 times the particle size of the plurality of abrasive particles, and / or the spacing between the plurality of bosses is approximately 1.5 to 20 times the particle size of the plurality of abrasive particles.

20. The manufacturing method according to claim 13, characterized in that, The plurality of abrasive particles are all approximately 70 μm in diameter, approximately 100 μm in diameter, approximately 170 μm in diameter, approximately 200 μm in diameter, or approximately 400 μm in diameter.

Images