Semiconductor chip thickness detection equipment

Abstract

The invention relates to the technical field of chip thickness detection, in particular to semiconductor chip thickness detection equipment which comprises a chip thickness detection body, a laser thickness detector is arranged above the chip thickness detection body, and a base is fixedly connected to the lower portion of the inner wall of the chip thickness detection body. The inner wall of the base is rotatably connected with a rotary table, the outer wall of the top of the rotary table is provided with a first sliding groove, the interior of the first sliding groove is slidably connected with a first sliding rod, the outer wall of the top of the first sliding rod is fixedly connected with a chip placing disc, and the chip thickness detection body is provided with a position adjusting mechanism. The first sliding rods and the position adjusting mechanisms are connected together through the inserting rods, the situation that one position adjusting mechanism needs to be installed at the position of each first sliding rod is avoided, installation of equipment is correspondingly reduced, the cost is reduced, then the inserting rods can be automatically inserted into the inserting holes, and the work needing manual operation of operators is reduced.

Description

Technical Field

[0001] This invention belongs to the field of chip thickness detection technology, and specifically relates to a semiconductor chip thickness detection device. Background Technology

[0002] Semiconductor chip thickness measurement equipment is a high-precision instrument used to accurately measure critical dimensions of chip materials. It typically employs non-contact measurement principles such as optical interferometry, spectral analysis, or laser ranging to rapidly and non-destructively acquire thickness data of the chip and its thin film layers at the nanometer scale. This equipment is crucial in the semiconductor manufacturing process, enabling real-time monitoring of process quality and ensuring the uniformity and reliability of the chip structure. It is widely used in wafer fabrication, packaging and testing, and the research and development stages of advanced processes, and is one of the key links in ensuring chip performance and yield.

[0003] However, traditional devices still have the following problems when in use: Patent application publication number CN223216848U discloses a chip thickness detection device. This device features a laser thickness detector. When chip thickness detection is performed, multiple adsorption sleeves are tightly pressed onto the tops of multiple chips. At this time, positioning tubes are lifted and the control host is activated, so that the multiple positioning tubes can move multiple chips to the front of the laser thickness detector. This allows the control host to control multiple laser thickness detectors to detect multiple chips simultaneously, thereby avoiding the problem of slow efficiency when detecting a single chip and improving the chip thickness detection efficiency.

[0004] In existing technologies, chips are typically placed on a turntable with multiple chip placement disks to achieve batch processing. Each chip placement disk needs to be equipped with an independent drive component to drive the chip for positioning and transfer. However, this multi-drive configuration not only increases system power consumption and hardware costs, but also leads to complex mechanical structures, higher failure rates, and affects detection efficiency and overall equipment reliability.

[0005] Therefore, we need a semiconductor chip thickness detection device to solve the problem that each chip placement tray needs to be equipped with an independent driving component to drive the chip for positioning and transfer, so that one driving component can drive multiple chip placement trays. Summary of the Invention

[0006] To address the shortcomings of existing technologies, the present invention aims to provide a semiconductor chip thickness detection device that has the advantage of having a single driving component to drive multiple chip placement disks.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor chip thickness detection device, comprising a chip thickness detection body, a laser thickness detector disposed above the chip thickness detection body, a base fixedly connected to the lower part of the inner wall of the chip thickness detection body, a turntable rotatably connected to the inner wall of the base, a sliding groove formed on the outer wall of the top of the turntable, a sliding rod slidably connected inside the sliding groove, a chip placement tray fixedly connected to the outer wall of the top of the sliding rod, a position adjustment mechanism disposed on the chip thickness detection body, the position adjustment mechanism being used to adjust the position of the chip when it is detected below the laser thickness detector, an angle adjustment mechanism disposed above the position adjustment mechanism, the position adjustment mechanism comprising a mounting frame and an L-shaped bracket, the outer wall of the bottom of the L-shaped bracket being fixedly connected to the outer wall of the top of the chip thickness detection body, the outer walls of the two L-shaped brackets on opposite sides being fixedly connected to the outer wall of the mounting frame, and the angle adjustment mechanism comprising a fixing plate, the outer wall of the fixing plate being fixedly connected to the inner wall of the mounting frame.

[0008] Preferably, a motor is fixedly connected to the lower part of the chip thickness detection body, a gear is fixedly connected to the output end of the motor, a gear is fixedly connected to the outer wall of the turntable, and the outer wall of the gear is meshed with the outer wall of the gear.

[0009] Preferably, a fixed column is fixedly connected to the outer wall of the top of the base inside the turntable. An installation groove is opened on the outer wall of the top of the fixed column. An air pump is fixedly connected inside the installation groove. A flow divider is rotatably connected to the output end of the air pump. An electric pressure relief valve is fixedly connected to the outer wall of the top of the flow divider. A force-bearing pipe is fixedly connected through the outer wall of the top of the flow divider. A telescopic pipe is fixedly connected to the outer wall of one end of the force-bearing pipe. A rigid pipe is fixedly connected to the outer wall of one end of the telescopic pipe.

[0010] Preferably, a second slide groove is provided below the inner wall of the first slide groove. The interior of the second slide groove is slidably connected to the outer wall of the telescopic tube, and the interior of the second slide groove is slidably connected to the outer wall of the rigid tube. The outer wall of the force-bearing tube passes through the inner wall of the turntable and is fixedly connected to the second slide groove. The outer wall of the top of the rigid tube is fixedly connected through the outer wall of the bottom of the chip placement tray.

[0011] Preferably, a second motor is fixedly connected to the lower part of the inner wall of the mounting frame, a second rotating rod is fixedly connected to the output end of the second motor, a third gear is fixedly connected to the outer wall of the second rotating rod, a track frame is fixedly connected to the lower part of the inner wall of the mounting frame, and a rack is slidably connected inside the track frame.

[0012] Preferably, a U-shaped frame is fixedly connected to the outer wall of one end of the rack, the interior of the U-shaped frame is movably inserted into the outer wall of the slide rod, a second return spring is fixedly connected to the outer wall of one side of the slide rod, the outer wall of one end of the second return spring is fixedly connected to the inner wall of the slide groove, and an insertion hole is provided on the outer wall of the top of the slide rod.

[0013] Preferably, a return spring is fixedly connected to the top of the U-shaped frame, a plug rod is movably inserted into the inside of the return spring, a magnetic block is embedded in the outer wall of the top of the plug rod, a cavity is opened on the outer wall of the mounting frame, and a magnetic block is fixedly connected to the upper part of the inner wall of the cavity.

[0014] Preferably, a magnetic block three is fixedly connected to the lower part of the socket, a magnetic block four is fixedly connected to the outer wall of the bottom of the plug rod, the outer wall of the bottom of the magnetic block four and the outer wall of the top of the magnetic block three are attracted to each other by opposite poles, and the outer wall of the top of the magnetic block one and the outer wall of the bottom of the magnetic block two are attracted to each other by opposite poles.

[0015] Preferably, the outer wall of the top of the rotating rod is threaded, a moving block is threadedly connected to the outer wall of the thread, a limit rod is fixedly connected to the outer wall of one side of the moving block, and a rope is fixedly connected to the outer wall of one side of the moving block.

[0016] Preferably, a rotating rod is rotatably connected to one side of each of the two fixed plates, and a laser positioner is fixedly connected to one end of each of the two rotating rods. An arc-shaped frame is fixedly connected to the inner wall of one side of the fixed plate, and the outer wall of the arc-shaped frame is slidably connected to a rope. A guide rod is fixedly connected to the outer wall of one side of the laser positioner, and the outer wall of the guide rod is fixedly connected to one end of the rope. A guide groove is provided on the inner wall of one side of the fixed plate, and the inside of the guide groove is slidably connected to the guide rod. A sliding groove is provided on the inner wall of the mounting frame, and the inner wall of the sliding groove is slidably connected to the outer wall of the limiting rod. The inside of the arc-shaped frame is rotatably connected to the outer wall of the rotating rod.

[0017] Compared with the prior art, the beneficial effects of the present invention are: By connecting the slide bar to the position adjustment mechanism via the insertion rod, it is not necessary to install a position adjustment mechanism at each position of the slide bar, which reduces the installation of the equipment and lowers the cost. Furthermore, the insertion rod can automatically insert into the socket, reducing the manual operation required by the operator. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of the present invention.

[0019] Figure 2 This is a schematic diagram of the mounting bracket structure of the present invention.

[0020] Figure 3These are schematic cross-sectional views of the present invention, A1 to A2.

[0021] Figure 4 This is a schematic diagram of the motor structure of the present invention.

[0022] Figure 5 This is a schematic diagram of the internal structure of the turntable of the present invention.

[0023] Figure 6 for Figure 5 Enlarged structural diagram at point A in the middle.

[0024] Figure 7 This is a schematic diagram of the insertion rod structure of the present invention.

[0025] Figure 8 This is a schematic diagram of the internal structure of the mounting bracket of the present invention.

[0026] Figure 9 for Figure 8 Enlarged structural diagram at point C.

[0027] Figure 10 This is a schematic diagram of the fixing plate structure of the present invention.

[0028] Figure 11 This is a schematic diagram of the rack structure of the present invention.

[0029] Figure 12 This is a schematic diagram of the arc-shaped frame structure of the present invention.

[0030] Figure 13 This is a schematic diagram of the slide structure of the present invention.

[0031] Figure 14 for Figure 11 Enlarged structural diagram at point B.

[0032] In the diagram: 1. Chip thickness detection body; 11. Laser thickness detector; 2. Mounting bracket; 21. L-shaped bracket; 3. Slide groove one; 31. Slide rod one; 32. Insert rod; 33. Cavity one; 34. Magnetic block one; 35. U-shaped frame; 36. Magnetic block two; 37. Return spring one; 38. Insertion hole; 39. Magnetic block three; 310. Return spring two; 4. Chip placement tray; 5. Base; 51. Motor one; 52. Gear one; 53. Fixing column; 54. Gear two; 55. Turntable 6. Fixed plate; 61. Laser positioner; 62. Rotating rod one; 63. Guide rod; 64. Guide groove; 7. Air pump; 71. Diverter shell; 72. Force-bearing pipe; 73. Telescopic pipe; 74. Rigid pipe; 75. Slide groove two; 76. Electric pressure relief valve; 8. Motor two; 81. Rotating rod two; 82. Gear three; 83. Track frame; 84. Rack; 10. Thread; 101. Slide groove three; 102. Moving block; 103. Limiting rod; 104. Rope; 105. Arc frame. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of the present invention clear and complete, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only some, not all, embodiments of the present invention, and are merely illustrative of the embodiments of the present invention. They are not intended to limit the embodiments of the present invention. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] Example 1, please refer to Figures 1 to 14 This invention provides a technical solution for a semiconductor chip thickness detection device: It includes a chip thickness detection body 1, a laser thickness detector 11 mounted on top of the chip thickness detection body 1, a base 5 fixedly connected to the lower inner wall of the chip thickness detection body 1, a turntable 55 rotatably connected to the inner wall of the base 5, a groove 3 formed on the outer top wall of the turntable 55, a sliding rod 31 slidably connected inside the groove 3, a chip placement tray 4 fixedly connected to the outer top wall of the sliding rod 31, and a position adjustment mechanism on the chip thickness detection body 1. The position adjustment mechanism is used to adjust the position of the chip when it is being detected below the laser thickness detector 11. An angle adjustment mechanism is provided above the joint mechanism. The position adjustment mechanism includes a mounting frame 2 and an L-shaped bracket 21. The outer wall of the bottom of the L-shaped bracket 21 is fixedly connected to the outer wall of the top of the chip thickness detection body 1. The outer walls of the two L-shaped brackets 21 on opposite sides are fixedly connected to the outer wall of the mounting frame 2. A motor 2 8 is fixedly connected to the lower part of the inner wall of the mounting frame 2. A rotating rod 2 81 is fixedly connected to the output end of the motor 2 8. A gear 3 82 is fixedly connected to the outer wall of the rotating rod 2 81. A track frame 83 is fixedly connected to the lower part of the inner wall of the mounting frame 2. A rack 84 is slidably connected inside the track frame 83. The outer wall of the rack 84 meshes with the outer wall of the gear 3 82.

[0035] The U-shaped frame 35 pushes the slide bar 31 to move the chip placement disk 4 forward inside the slide groove 3, thereby adjusting the position of the chip below the laser thickness detector 11. This allows the laser thickness detector 11 to detect the chip more comprehensively, avoiding the chip remaining in a fixed position on the chip thickness detection body 1, which would prevent the laser thickness detector 11 from detecting the chip more comprehensively and thus increasing the accuracy of the chip detection results.

[0036] Example 2, based on Example 1, please refer to... Figure 5 , Figure 8-10 , Figure 12The angle adjustment mechanism includes a fixed plate 6, the outer wall of which is fixedly connected to the inner wall of the mounting bracket 2. A thread 10 is formed on the outer wall of the top of the rotating rod 81. A moving block 102 is threaded onto the outer wall of the thread 10. A limit rod 103 is fixedly connected to the outer wall of one side of the moving block 102. A rope 104 is fixedly connected to the outer wall of one side of the moving block 102. A rotating rod 62 is rotatably connected to the opposite side of the two fixed plates 6. A laser positioner 61 is fixedly connected to the opposite end of the two rotating rods 62. The inner wall of one side of the fixed plate 6 is fixedly connected to the inner wall of the mounting bracket 2. An arc-shaped frame 105 is fixedly connected, and the outer wall of the arc-shaped frame 105 is slidably connected to the rope 104. A guide rod 63 is fixedly connected to the outer wall of one side of the laser positioner 61, and the outer wall of the guide rod 63 is fixedly connected to one end of the rope 104. A guide groove 64 is opened on the inner wall of one side of the fixing plate 6, and the interior of the guide groove 64 is slidably connected to the guide rod 63. A sliding groove 3 101 is opened on the inner wall of the mounting frame 2, and the inner wall of the sliding groove 3 101 is slidably connected to the outer wall of the limiting rod 103. The interior of the arc-shaped frame 105 is rotatably connected to the outer wall of the rotating rod 1 62.

[0037] The guide rod 63 is rotated by the rope 104. Since the guide rod 63 is fixedly connected to the laser positioner 61, when the guide rod 63 rotates inside the guide groove 64, it drives the laser positioner 61 to adjust its angle accordingly. This ensures that the laser beam of the laser positioner 61 is always focused on the chip detection point. No matter how the chip moves, the laser positioner 61 can follow it in time by adjusting its angle, avoiding positioning deviations caused by chip movement, thereby ensuring the accuracy of thickness detection.

[0038] Example 3, based on Example 1, please refer to... Figure 3 , Figure 5 , Figure 6 A motor 51 is fixedly connected to the lower part of the chip thickness detection body 1. A gear 52 is fixedly connected to the output end of the motor 51. A gear 54 is fixedly connected to the outer wall of the turntable 55. The outer wall of the gear 54 meshes with the outer wall of the gear 52. A fixing post 53 is fixedly connected to the outer wall of the top of the base 5 inside the turntable 55. A mounting groove is opened on the outer wall of the top of the fixing post 53. An air pump 7 is fixedly connected inside the mounting groove. A flow divider 71 is rotatably connected to the output end of the air pump 7. An electric pressure relief valve is fixedly connected to the outer wall of the top of the flow divider 71. 76. A force-bearing tube 72 is fixedly connected to the outer wall of the top of the splitter shell 71. A telescopic tube 73 is fixedly connected to the outer wall of one end of the force-bearing tube 72. A rigid tube 74 is fixedly connected to the outer wall of one end of the telescopic tube 73. A second slide groove 75 is opened below the inner wall of the first slide groove 3. The interior of the second slide groove 75 is slidably connected to the outer wall of the telescopic tube 73. The interior of the second slide groove 75 is slidably connected to the outer wall of the rigid tube 74. The outer wall of the force-bearing tube 72 is fixedly connected to the inner wall of the turntable 55. The outer wall of the top of the rigid tube 74 is fixedly connected to the outer wall of the bottom of the chip placement disk 4.

[0039] The rotation of gear 2 54 drives the turntable 55 to rotate, thereby moving the chip to the area below the laser thickness detector 11 for thickness detection. By controlling the movement and stopping of motor 1 51, the position of the chip on the turntable 55 can be changed. The chip that has been detected is moved away from the area below the laser thickness detector 11, and the undetected chip is moved to the area below the laser thickness detector 11 for detection. After the chip detection is completed, there is no need for the operator to manually replace the chip, thereby improving the efficiency of chip detection.

[0040] It should be noted that the base 5 and the fixing column 53 have slots inside, and an external power cord is introduced into the slots to connect to the air pump 7.

[0041] Example 4, based on Example 1, please refer to... Figure 11 , Figure 14 A U-shaped frame 35 is fixedly connected to the outer wall of one end of the rack 84. The interior of the U-shaped frame 35 is movably inserted into the outer wall of the slide rod 31. A return spring 310 is fixedly connected to the outer wall of one side of the slide rod 31. The outer wall of one end of the return spring 310 is fixedly connected to the inner wall of the slide groove 3. An insertion hole 38 is opened on the outer wall of the top of the slide rod 31. A return spring 37 is fixedly connected to the top of the U-shaped frame 35. An insertion rod 32 is movably inserted into the interior of the return spring 37. A magnetic block 34 is embedded in the outer wall of the top of the insertion rod 32. A cavity 33 is opened on the outer wall of the mounting bracket 2. A magnetic block 36 is fixedly connected to the upper part of the inner wall of the cavity 33. A magnetic block 39 is fixedly connected to the lower part of the insertion hole 38. A magnetic block 4 is fixedly connected to the outer wall of the bottom of the insertion rod 32. The outer wall of the bottom of the magnetic block 4 and the outer wall of the top of the magnetic block 39 are attracted to each other by opposite poles. The outer wall of the top of the magnetic block 34 and the outer wall of the bottom of the magnetic block 36 are attracted to each other by opposite poles.

[0042] By connecting the slide bar 31 to the position adjustment mechanism via the insertion rod 32, it is avoided that a position adjustment mechanism needs to be installed at each position of the slide bar 31, thereby reducing the installation of the equipment and lowering the cost. Furthermore, the insertion rod 32 can be automatically inserted into the socket 38, reducing the manual operation required by the operator.

[0043] The working principle and usage process of this invention are as follows: First, the chip to be measured for thickness is placed inside the chip placement tray 4. After placement, the air pump 7 is activated. The air pump 7 then uses the rigid tube 74 to adsorb and fix the chip inside the chip placement tray 4. The air pump 7 is a commercially available device and will not be described in detail here. By fixing the chip, the movement of the chip inside the chip placement tray 4 when the turntable 55 rotates is avoided, preventing collisions and damage to the chip. This increases the stability of the chip inside the chip placement tray 4, laying a stable foundation for subsequent chip measurement and preventing chip movement during the detection process, further improving the stability of chip thickness measurement.

[0044] After the chip is fixed, the present invention starts the motor 51. The movement of the motor 51 causes the gear 52 to drive the gear 54 to rotate. Since the gear 54 is fixedly connected to the turntable 55 and the turntable 55 is rotatably connected to the base 5, the rotation of the gear 54 can drive the turntable 55 to rotate, thereby moving the chip to the bottom of the laser thickness detector 11 for thickness detection. By controlling the movement and stopping of the motor 51, the position of the chip on the turntable 55 can be changed. The chip that has been detected is moved away from the bottom of the laser thickness detector 11, and the undetected chip is moved to the bottom of the laser thickness detector 11 for detection. This operation does not require the operator to manually replace the chip after the chip detection is completed, thereby improving the efficiency of chip detection.

[0045] It should be noted that there are two laser thickness gauges 11, located above and below the chip respectively.

[0046] It should be noted that the motor 51 has an encoder inside, which feeds back the precise rotation angle of the motor shaft to the driver in real time. This allows for more accurate control of the angle at which the turntable 55 drives the chip to rotate. The combination of this encoder and the motor 51 is a common device on the market and will not be described in detail here.

[0047] It should be noted that: since the force-bearing pipe 72 is fixedly connected to the flow divider shell 71 and the turntable 55, when the turntable 55 rotates, the force-bearing pipe 72 drives the flow divider shell 71 to rotate accordingly. The flow divider shell 71 is connected to the air pump 7 through a rotary joint. The rotary joint is a common device on the market and will not be described in detail here.

[0048] When the turntable 55 drives the chip placement disk 4 to rotate, after the slide bar 31 is inserted into the U-shaped frame 35, when the insertion hole 38 and the insertion bar 32 are aligned, the magnetic blocks 39 and 4 inside the insertion hole 38 enter the magnetic field. Utilizing the attraction between their opposite poles, the insertion bar 32 is pulled downwards, causing it to press against the reset spring 37 and insert into the insertion hole 38. This connects the slide bar 31 to the position adjustment mechanism. The attraction between the magnetic blocks 39 and 4 is greater than the force of the reset spring 37 itself. The reset spring 37 is positioned so that when the insert rod 32 does not need to be inserted into the socket 38, it drives the insert rod 32 to the top of the U-shaped frame 35, so that the slide rod 31 can continue to rotate through the position of the U-shaped frame 35. The insert rod 32 connects the slide rod 31 to the position adjustment mechanism, avoiding the need to install a position adjustment mechanism at each position of the slide rod 31, thereby reducing the installation of the equipment and lowering the cost. Furthermore, the insert rod 32 can automatically insert into the socket 38, reducing the manual operation required by the operator.

[0049] This invention utilizes a second motor 8, which, through its rotation, causes a second rotating rod 81 to drive a third gear 82 to rotate. The meshing connection between the third gear 82 and a rack 84 allows the rack 84 to slide within the track frame 83 as it rotates. Due to the fixed connection between the rack 84 and the U-shaped frame 35, the rack 84 moves towards the outer wall of the track frame 83, pushing the U-shaped frame 35 forward. This causes the U-shaped frame 35 to push a sliding rod 31, which in turn drives the chip placement disk 4 to slide forward within the sliding groove 3. This allows the chip to adjust its position below the laser thickness detector 11, enabling the laser thickness detector 11 to perform more comprehensive chip detection. This avoids the chip remaining in a fixed position on the chip thickness detection body 1, which prevents the laser thickness detector 11 from performing a more complete detection, thus increasing the accuracy of the chip detection results.

[0050] It should be noted that motor 28 can rotate in both directions.

[0051] It should be noted that: while sliding rod 31 moves, it drives rigid tube 74 to move inside sliding groove 75. Through the movement of rigid tube 74, telescopic tube 73 is stretched accordingly.

[0052] When the second motor 8 rotates in the opposite direction, it drives the rack 84 into the interior of the track frame 83. At this time, the U-shaped frame 35 pulls the slide bar 31 to slide in the reverse direction inside the slide groove 3. When the slide bar 31 returns to its original position and continues to move, it can squeeze the second reset spring 310, aligning the first magnetic block 34 with the second magnetic block 36. Using the attraction between them, the first magnetic block 34 drives the insertion rod 32 to move upward, thus leaving the interior of the insertion hole 38. After the insertion rod 32 completely leaves the interior of the insertion hole 38, the second reset spring 310 pushes the slide bar 31 back to its original position. The magnetic force between the second magnetic block 36 and the first magnetic block 34 is greater than the magnetic force between the third magnetic block 39 and the fourth magnetic block, thereby changing the position of the chip placement disk 4.

[0053] In this invention, when the rotating rod 81 rotates, the threaded connection between the thread 10 on the rotating rod 81 and the moving block 102, and the sliding connection between the limiting rod 103 and the sliding groove 101, limits the movement direction of the moving block 102. When the moving block 102 moves downward on the rotating rod 81 along with the thread 10, the rope 104 pulls the guide rod 63 to rotate accordingly. Since the guide rod 63 is fixedly connected to the laser positioner 61, when the guide rod 63 rotates inside the guide groove 64, it drives the laser positioner 61 to adjust its angle accordingly, so that the laser beam of the laser positioner 61 is always focused on the chip detection point. No matter how the chip moves, the laser positioner 61 can follow in time through its own angle adjustment, avoiding positioning deviation caused by chip movement, thereby ensuring the accuracy of thickness detection.

[0054] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip thickness detection device, comprising a chip thickness detection body (1), characterized in that: A laser thickness detector (11) is provided above the chip thickness detection body (1). A base (5) is fixedly connected to the lower part of the inner wall of the chip thickness detection body (1). A turntable (55) is rotatably connected to the inner wall of the base (5). A sliding groove (3) is provided on the outer wall of the top of the turntable (55). A sliding rod (31) is slidably connected inside the sliding groove (3). A chip placement disk (4) is fixedly connected to the outer wall of the top of the sliding rod (31). A position adjustment mechanism is provided on the chip thickness detection body (1). The position adjustment mechanism is used to adjust the position of the chip when it is detected below the laser thickness detector (11). An angle adjustment mechanism is provided above the position adjustment mechanism. The position adjustment mechanism includes a mounting frame (2) and an L-shaped bracket (21). The outer wall of the bottom of the L-shaped bracket (21) is fixedly connected to the outer wall of the top of the chip thickness detection body (1), and the outer wall of the opposite side of the two L-shaped brackets (21) is fixedly connected to the outer wall of the mounting frame (2). The angle adjustment mechanism includes a fixing plate (6), the outer wall of which is fixedly connected to the inner wall of the mounting bracket (2).

2. The semiconductor chip thickness detection device according to claim 1, characterized in that: A motor (51) is fixedly connected to the lower part of the chip thickness detection body (1). A gear (52) is fixedly connected to the output end of the motor (51). A gear (54) is fixedly connected to the outer wall of the turntable (55). The outer wall of the gear (54) meshes with the outer wall of the gear (52).

3. The semiconductor chip thickness detection device according to claim 2, characterized in that: The outer wall of the top of the base (5) is fixedly connected to a fixed column (53) inside the turntable (55). The outer wall of the top of the fixed column (53) is provided with an installation groove. An air pump (7) is fixedly connected inside the installation groove. A flow divider shell (71) is rotatably connected to the output end of the air pump (7). An electric pressure relief valve (76) is fixedly connected to the outer wall of the top of the flow divider shell (71). A force-bearing pipe (72) is fixedly connected through the outer wall of the top of the flow divider shell (71). A telescopic pipe (73) is fixedly connected to the outer wall of one end of the force-bearing pipe (72). A rigid pipe (74) is fixedly connected to the outer wall of one end of the telescopic pipe (73).

4. The semiconductor chip thickness detection device according to claim 3, characterized in that: A second slide (75) is provided below the inner wall of the first slide (3). The interior of the second slide (75) is slidably connected to the outer wall of the telescopic tube (73). The interior of the second slide (75) is slidably connected to the outer wall of the rigid tube (74). The outer wall of the force-bearing tube (72) passes through the inner wall of the turntable (55) and is fixedly connected to the second slide (75). The outer wall of the top of the rigid tube (74) is fixedly connected to the outer wall of the bottom of the chip placement tray (4).

5. The semiconductor chip thickness detection device according to claim 1, characterized in that: A motor 2 (8) is fixedly connected to the lower part of the inner wall of the mounting bracket (2). A rotating rod 2 (81) is fixedly connected to the output end of the motor 2 (8). A gear 3 (82) is fixedly connected to the outer wall of the rotating rod 2 (81). A track frame (83) is fixedly connected to the lower part of the inner wall of the mounting bracket (2). A rack (84) is slidably connected inside the track frame (83). The outer wall of the rack (84) meshes with the outer wall of the gear 3 (82).

6. The semiconductor chip thickness detection device according to claim 5, characterized in that: A U-shaped frame (35) is fixedly connected to the outer wall of one end of the rack (84). The interior of the U-shaped frame (35) is movably inserted into the outer wall of the slide rod (31). A return spring (310) is fixedly connected to the outer wall of one side of the slide rod (31). The outer wall of one end of the return spring (310) is fixedly connected to the inner wall of the slide groove (3). An insertion hole (38) is opened on the outer wall of the top of the slide rod (31).

7. A semiconductor chip thickness detection device according to claim 6, characterized in that: A reset spring (37) is fixedly connected to the top of the U-shaped frame (35). A rod (32) is movably inserted into the inside of the reset spring (37). A magnetic block (34) is embedded in the outer wall of the top of the rod (32). A cavity (33) is opened on the outer wall of the mounting frame (2). A magnetic block (36) is fixedly connected to the upper part of the inner wall of the cavity (33).

8. The semiconductor chip thickness detection device according to claim 7, characterized in that: A magnetic block three (39) is fixedly connected to the lower part of the insertion hole (38), and a magnetic block four is fixedly connected to the outer wall of the bottom of the insertion rod (32). The outer wall of the bottom of the magnetic block four and the outer wall of the top of the magnetic block three (39) are attracted to each other by opposite poles. The outer wall of the top of the magnetic block one (34) and the outer wall of the bottom of the magnetic block two (36) are attracted to each other by opposite poles.

9. A semiconductor chip thickness detection device according to claim 5, characterized in that: The outer wall of the top of the rotating rod (81) is provided with a thread (10), and a moving block (102) is threadedly connected to the outer wall of the thread (10). A limit rod (103) is fixedly connected to the outer wall of one side of the moving block (102), and a rope (104) is fixedly connected to the outer wall of one side of the moving block (102).

10. A semiconductor chip thickness detection device according to claim 1, characterized in that: Two fixed plates (6) are rotatably connected to opposite sides of a rotating rod (62), and a laser locator (61) is fixedly connected to opposite ends of the two rotating rods (62). An arc frame (105) is fixedly connected to the inner wall of one side of the fixed plate (6), and the outer wall of the arc frame (105) is slidably connected to a rope (104). A guide rod (63) is fixedly connected to the outer wall of one side of the laser locator (61), and the outer wall of the guide rod (63) is fixedly connected to one end of the rope (104). A guide groove (64) is provided on the inner wall of one side of the fixed plate (6), and the interior of the guide groove (64) is slidably connected to the guide rod (63). A sliding groove (101) is provided on the inner wall of the mounting frame (2), and the inner wall of the sliding groove (101) is slidably connected to the outer wall of the limiting rod (103). The interior of the arc frame (105) is rotatably connected to the outer wall of the rotating rod (62).

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