High-power multi-floating aging temperature control testing device

Abstract

The invention relates to the technical field of chip packaging testing, in particular to a high-power multi-floating aging temperature control testing device, and aims to solve the problem that actual temperature conduction cannot meet requirements due to the fact that an existing packaging testing framework is affected by uneven contact caused by warping of a chip. A plurality of radiators are arranged in the shell in parallel, floating type pressure heads are arranged on the radiators, and each floating type pressure head independently floats after being laminated with a chip; the shell is provided with a plurality of axial fans, and the axial fans are matched with the radiator to realize regional temperature control; the shell is provided with a floating upper plate, the floating upper plate is provided with a through hole matched with the floating type pressure head, the floating type pressure head can float up and down in the through hole relative to the floating upper plate, and after the floating upper plate and the chip are laminated, the outer wall of the chip provides a reverse acting force for floating leveling. The packaging test device has the effect of improving the fitting degree of the packaging test device and the chip so as to improve the temperature control.

Description

Technical Field

[0001] This application relates to the field of chip packaging and testing technology, and in particular to a high-power multi-floating aging temperature control test device. Background Technology

[0002] In the semiconductor industry, chip packaging is a crucial step in protecting the core circuitry of a chip, enabling electrical connections and thermal management. Its reliability directly determines the lifespan and operational stability of end products (such as consumer electronics, automotive electronics, and industrial control equipment). As chip manufacturing processes evolve towards 7nm and below, packaging structures are becoming increasingly complex (such as SiP system-in-package and CoWoS chipplet packaging). Increased integration leads to a surge in heat generation per unit area. At the same time, end-application scenarios (such as automotive engine compartments and high-temperature industrial environments) are placing increasingly stringent requirements on the temperature resistance of chips.

[0003] Against this backdrop, chip packaging aging and temperature control testing has become a core process for verifying packaging reliability and screening for early failures. The principle of aging and temperature control testing is to simulate the high temperature and temperature cycling stress environment that chips experience during long-term operation, thereby accelerating the exposure of potential defects such as interlayer delamination, solder joint cracking, and thermal interface material failure. The aim is to ensure that chips operate stably throughout their life cycle.

[0004] In existing technologies, high-power packaging test architectures are basically finned heat sinks plus high-power fans. Under high power heat flux density, flexible chip bonding is particularly critical. Even if a single heat sink can meet the required temperature control indicators, after the overall structure is assembled, the uneven contact caused by the chip warping due to the assembly precision of the structure will lead to the actual temperature conduction not meeting the test requirements, so it needs to be improved. Summary of the Invention

[0005] In order to improve the fit between the packaging and testing device and the chip and thus improve the temperature control effect, this application provides a high-power multi-floating aging temperature control testing device.

[0006] The high-power multi-floating aging temperature control testing device provided in this application adopts the following technical solution: A high-power multi-floating aging temperature control test device includes a housing, within which multiple heat sinks are arranged in parallel. Each heat sink is equipped with a floating pressure head, which floats independently after being pressed against a chip. Multiple axial fans are mounted on the housing, and these fans cooperate with the heat sinks to achieve zoned temperature control. A floating upper plate is provided on the housing, with through holes that match the floating pressure heads. The floating pressure heads can float up and down relative to the floating upper plate within these through holes. After the floating upper plate is pressed against the chip, a counterforce is provided by the outer wall of the chip to achieve floating leveling.

[0007] Optionally, the outer shell includes a top opening and closing plate, and side baffles and stainless steel baffles are respectively provided on both sides of the top opening and closing plate; the stainless steel baffles are screwed onto the side baffles to press and open the outer shell; the top opening and closing plate is connected to the side baffles to achieve opening, closing and flipping.

[0008] Optionally, the housing also includes a fan baffle, which is positioned and installed by a positioning pin on the top opening plate; the side baffle is connected to the fan baffle to create an air inlet and outlet duct; the axial fan is fixed to the fan baffle by a threaded locking method.

[0009] Optionally, each of the heat sinks is equipped with two axial fans, one for inlet and one for outlet, to achieve series boosting; each group of axial fans uses a parallel air intake method for zoned temperature control.

[0010] Optionally, the housing further includes a radiator mounting plate, which is installed by being positioned with the side baffle by pins; a floating base plate is provided on the radiator mounting plate, and the floating base plate and the radiator mounting plate are connected by being positioned with pins and fastened by threads; the floating base plate is provided with through holes that match the floating pressure head; the floating upper plate is positioned by its shape and connected to the floating base plate.

[0011] Optionally, the floating bottom plate and the floating top plate are elastically connected by a spring, and the spring is positioned by the shape of the floating bottom plate for assembly.

[0012] Optionally, the radiator is connected to the floating base plate via spring screws.

[0013] In summary, this application includes at least one of the following beneficial technical effects: The multi-floating assembly heat dissipation structure aims to improve the fit of the heat sink within the whole machine, ensuring that it fits more evenly and the pressure is more uniform in a limited area, thereby making the heat dissipation ability smoother and reducing or avoiding poor temperature control caused by chip bonding. The multi-floating heat dissipation architecture avoids poor adhesion caused by uneven installation force through a dual-floating design. It blocks temperature interference between different DIEs of the chip by using independent temperature control in different zones and avoids abnormal temperature control. Multiple heat sinks are set up to improve heat dissipation stability and reduce the temperature uniformity difference of DIEs. At the same time, flexible springs provide a reverse force to accurately apply pre-pressure and limit the maximum bearing pressure. It optimizes the chip heat dissipation and temperature control performance from multiple dimensions such as adhesion reliability, temperature control accuracy, heat dissipation stability and pressure adaptability. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of a high-power multi-floating aging temperature control test device according to an embodiment of this application.

[0015] Figure 2 This is a three-dimensional schematic diagram of the multi-floating aging temperature control test device according to an embodiment of this application.

[0016] Figure 3 This is a bottom view of the multi-floating aging temperature control test device according to an embodiment of this application.

[0017] Figure 4 yes Figure 2 The diagram shows a top view of the multi-floating aging temperature control test device, AA section.

[0018] Figure 5 yes Figure 2 The DD cross-sectional view of the multi-floating aging temperature control test device shown is a bottom view.

[0019] Figure 6 yes Figure 2 The BB cross-section of the top view of the multi-floating aging temperature control test device is shown.

[0020] Figure 7 yes Figure 2 The top view of the multi-floating aging temperature control test device is shown as a CC cross-section.

[0021] Figure 8 This is a structural schematic diagram of the side baffle, stainless steel baffle, and fan baffle in an embodiment of this application.

[0022] Figure 9 This is a schematic diagram of the structure of the fan baffle in an embodiment of this application.

[0023] Figure 10 This is a schematic diagram of the structure of the heat sink mounting plate and the top hinged plate in an embodiment of this application.

[0024] Figure 11 This is a schematic diagram of the structure of the heat sink according to an embodiment of this application.

[0025] Figure 12 This is a structural schematic diagram of the floating upper plate and floating bottom plate in an embodiment of this application.

[0026] Figure 13 This is a schematic diagram of the floating base plate and spring screw in an embodiment of this application.

[0027] Figure 14 This is a schematic diagram of the floating base plate from another perspective in an embodiment of this application.

[0028] Figure 15 This is a schematic diagram of the floating pressure head and heat sink according to an embodiment of this application.

[0029] Figure 16 This is a schematic diagram of the structure of the heat sink and spring screw in an embodiment of this application.

[0030] Figure 17 yes Figure 16 The image shows a bottom view of the radiator and floating pressure head.

[0031] Figure 18 yes Figure 16 The diagram shows the AA section of the bottom view.

[0032] Figure 19 yes Figure 16 The BB section view shown is a bottom view.

[0033] Figure 20 yes Figure 16 The CC section view shown is a bottom view.

[0034] Explanation of reference numerals in the attached diagram: 1. Top hinged plate; 2. Side baffle; 3. Stainless steel baffle; 4. Fan baffle; 5. Axial fan; 6. Radiator; 7. Floating pressure head; 8. Radiator mounting plate; 9. Floating top plate; 10. Floating bottom plate; 11. Spring; 12. Spring screw. Detailed Implementation

[0035] The following is in conjunction with the appendix Figure 1 -Appendix Figure 20 This application will be described in further detail.

[0036] This application discloses a high-power multi-floating aging temperature control testing device. (Refer to...) Figures 1-20 A high-power multi-floating aging temperature control test device includes a housing, inside which multiple heat sinks 6 are arranged in parallel. Floating pressure heads 7 are mounted on the heat sinks 6, and each floating pressure head 7 floats independently after being pressed against the chip. In this embodiment, a dual-floating structure is used. Multiple axial fans 5 are installed on the outer casing, and the axial fans 5 work with the heat sink 6 to achieve zoned temperature control. The outer casing is provided with a floating upper plate 9, which has through holes that match the floating pressure head 7. The floating pressure head 7 can float up and down relative to the floating upper plate 9 within the through holes. After the floating upper plate 9 is pressed with the chip, the outer wall of the chip provides a reverse force to achieve floating leveling.

[0037] The outer casing includes a radiator mounting plate 8, side baffles 2, stainless steel baffles 3, and fan baffles 4. The radiator mounting plate 8 is located at the bottom, and the side baffles 2, stainless steel baffles 3, and fan baffles 4 surround the radiator mounting plate 8. The outer shell includes a top opening and closing plate 1, and side baffles 2 and stainless steel baffles 3 are respectively provided on both sides of the top opening and closing plate 1; the stainless steel baffles 3 are screwed to the side baffles 2 to press and open the outer shell; the top opening and closing plate 1 is connected to the side baffles 2 to achieve opening, closing and flipping.

[0038] The housing also includes a fan baffle 4, which is positioned and installed by a positioning pin on the top opening plate 1; the side baffle 2 is connected to the fan baffle 4 to create an air inlet and outlet duct; the axial fan 5 is fixed to the fan baffle 4 by a threaded locking method.

[0039] Each radiator 6 is equipped with two axial fans 5, one for intake and one for exhaust, to achieve series boosting; each set of axial fans 5 uses a parallel air intake method for zoned temperature control.

[0040] The heat sink 6 is divided into two parts, with parallel air intake for heat dissipation, which improves the temperature uniformity between areas. By using a two-intake and two-output fan configuration, the fans in each area can operate independently without interfering with the heat dissipation of the chips in each area, while effectively increasing the fan speed and pressure. This achieves a parallel current boost and series pressure boost architecture, making the heat exchange between the heat sink 6 areas smoother and the temperature control between areas more uniform.

[0041] The outer casing also includes a radiator mounting plate 8, which is installed by being positioned with the side baffle 2 by pins; a floating base plate 10 is provided on the radiator mounting plate 8, and the floating base plate 10 and the radiator mounting plate 8 are connected by being positioned with pins and fastened by threads; the floating base plate 10 is provided with through holes that match the floating pressure head 7; the floating upper plate 9 is positioned by its shape and connected to the floating base plate 10 for installation.

[0042] The floating base plate 10 and the floating top plate 9 are elastically connected by a spring 11. The spring 11 is positioned by the shape of the floating base plate 10 and is then assembled and placed.

[0043] The radiator 6 is connected to the floating base plate 10 by spring screws 12.

[0044] The implementation principle of a high-power multi-floating aging temperature control test device according to an embodiment of this application is as follows: The dual floating assembly heat dissipation structure is designed to improve the fit of the heat sink 6 within the whole machine, so as to ensure that it fits more flatly and the pressure is more uniform in a limited area, thereby making the heat dissipation ability smoother and reducing or avoiding poor temperature control caused by chip bonding.

[0045] The heatsink is divided into 6 sections, with each section independently pressing the chip surface. The two are used together with a spring and a screw. The wire diameter, free length, effective number of turns of the spring, and compression amount of the spring are calculated to achieve the pressure required after the screw is tightened.

[0046] This invention employs a multi-floating structure in different regions to ensure that the chip is subjected to uniform and flat force. Through the special sandwich structure inside the pressure head below the heat sink 6, the number, size and position of the flexible springs 11 to be placed are calculated with the chip as the center. The downward pressure applied by the heat sink 6 and the reverse action provided by the chip after being subjected to force achieve relative floating between regions, thereby making the force more balanced and the pressure distribution more uniform.

[0047] The heat sink 6 adopts a 3DVC architecture, and with the special welding method of the diamond composite metal substrate, it reduces the longitudinal material heat transfer resistance and increases its heat diffusion and temperature conduction efficiency.

[0048] The dual-floating heat dissipation architecture of this invention avoids poor adhesion caused by uneven installation force through a dual-floating design. It blocks temperature interference between different DIEs of the chip by using independent temperature control in different zones, and avoids abnormal temperature control. It divides the heat sink 6 into two parts to improve heat dissipation stability and reduce the temperature uniformity difference of DIEs. At the same time, it uses a flexible spring 11 to provide a reverse force, accurately apply pre-pressure and limit the maximum bearing pressure. It optimizes the chip heat dissipation and temperature control performance from multiple dimensions such as adhesion reliability, temperature control accuracy, heat dissipation stability and pressure adaptability.

[0049] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A high-power multi-floating aging temperature control testing device, characterized in that: The device includes an outer casing, in which multiple heat sinks (6) are arranged in parallel. Each heat sink (6) is equipped with a floating pressure head (7), and each floating pressure head (7) floats independently after being pressed with the chip. Multiple axial fans (5) are installed on the outer casing, and the axial fans (5) cooperate with the heat sinks (6) to achieve zoned temperature control. A floating upper plate (9) is provided on the outer casing, and the floating upper plate (9) has through holes that match the floating pressure heads (7). The floating pressure heads (7) can float up and down relative to the floating upper plate (9) within the through holes. After the floating upper plate (9) is pressed with the chip, the outer wall of the chip provides a reverse force to achieve floating leveling.

2. The high-power multi-floating aging temperature control test device according to claim 1, characterized in that: The outer shell includes a top opening and closing plate (1), and side baffles (2) and stainless steel baffles (3) are respectively provided on both sides of the top opening and closing plate (1); the stainless steel baffles (3) are screwed to the side baffles (2) to press and open the outer shell; the top opening and closing plate (1) is connected to the side baffles (2) to achieve opening, closing and flipping.

3. The high-power multi-floating aging temperature control test device according to claim 2, characterized in that: The housing also includes a fan baffle (4), which is positioned and installed by a positioning pin on the top opening plate (1); the side baffle (2) is connected to the fan baffle (4) to create an air inlet and outlet duct; the axial fan (5) is fixed to the fan baffle (4) by a threaded locking method.

4. The high-power multi-floating aging temperature control test device according to claim 3, characterized in that: Each heat sink (6) is equipped with two axial fans (5) with one inlet and one outlet to achieve series boosting; each group of axial fans (5) is temperature controlled in different zones by parallel air intake.

5. The high-power multi-floating aging temperature control test device according to claim 2, characterized in that: The outer casing also includes a radiator mounting plate (8), which is installed by being positioned with the side baffle (2) by pins; a floating base plate (10) is provided on the radiator mounting plate (8), and the floating base plate (10) and the radiator mounting plate (8) are connected by being positioned with pins and fastened by threads; the floating base plate (10) is provided with a through hole that matches the floating pressure head (7); the floating upper plate (9) is positioned by its shape and connected to the floating base plate (10) for installation.

6. The high-power multi-floating aging temperature control test device according to claim 5, characterized in that: The floating bottom plate (10) and the floating top plate (9) are elastically connected by a spring (11), which is positioned by the shape of the floating bottom plate (10) and then assembled.

7. The high-power multi-floating aging temperature control test device according to claim 6, characterized in that: The radiator (6) is connected to the floating base plate (10) by spring screws (12).

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