Insulator state detector

Abstract

The invention is applied to the technical field of power monitoring, and discloses an insulator state detector, which comprises an acquisition module used for acquiring leakage current by using a Rogowski coil interface, generating a voltage signal, performing analog-to-digital conversion on the voltage signal, and obtaining an initial digital signal corresponding to the leakage current; the initial digital signal is sent to the main control module; the main control module is used for receiving the initial digital signal, performing ADC sampling on the initial digital signal, and then filtering the sampled initial digital signal by using an ADC interface circuit to obtain a target digital signal; acquiring a detection result corresponding to the leakage current according to the target digital signal; the ADC interface circuit is used for filtering the sampled initial digital signal to obtain a target digital signal; and the communication module is used for sending the detection result to a preset background device. Therefore, data export and checking of a detection result can be facilitated through background equipment, and automatic detection of the state of the insulator is realized while the safety is improved.

Description

Technical Field

[0001] This invention relates to the field of power monitoring technology, and specifically to an insulator condition detector. Background Technology

[0002] Insulators, as key components of high-voltage power equipment, perform the dual functions of electrical insulation and mechanical support, and their performance directly affects the safety and stability of the power grid. In transmission lines, substations, and new energy power generation systems, insulators are exposed to complex environments such as high voltage, strong electric fields, pollution, humidity, and temperature fluctuations for extended periods. This makes them prone to problems such as surface contamination accumulation, internal crack propagation, and material aging, leading to decreased insulation resistance, increased partial discharge, and even flashover faults. Statistics show that insulator faults account for 15%-20% of power system accidents, with a significantly higher failure rate, especially in areas with severe pollution such as smog, acid rain, and salt spray, directly threatening the safe operation of the power grid and the reliability of power supply. Therefore, monitoring the condition of insulators has become a key aspect of maintaining power grid safety.

[0003] In existing technologies, the inspection of insulator condition mainly relies on manual inspection or traditional testing equipment. Insulators are mostly installed on high-voltage power line towers, and manual close-range inspection requires climbing the towers, posing a risk of falling from heights. Furthermore, direct contact or close-range operation in a high-voltage environment is susceptible to electromagnetic interference and electric shock. Meanwhile, when using traditional testing equipment to inspect insulator condition, the equipment only reads data on-site and cannot automatically process the data, relying on manual experience to judge insulator defects, resulting in low efficiency.

[0004] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0005] The technical problem to be solved by the present invention is how to realize the automatic detection of insulator condition, and the purpose is to provide an insulator condition detector that can realize the automatic detection of insulator condition.

[0006] This invention is achieved through the following technical solution:

[0007] In a first aspect, an insulator condition detector includes: a signal acquisition module, a main control module, an ADC interface circuit, and a communication module; the main control module is electrically connected to the signal acquisition module, the ADC interface circuit, and the communication module respectively; the signal acquisition module is equipped with a Rogowski coil; the Rogowski coil is fitted onto the ground wire of the utility pole to be tested; the Rogowski coil is used to sense the leakage current of the ground wire of the utility pole; the signal acquisition module is used to acquire the leakage current using the Rogowski coil interface, generate a voltage signal, and perform analog-to-digital conversion on the voltage signal to obtain an initial digital signal corresponding to the leakage current; and send the initial digital signal to the main control module; the main control module is used to receive the initial digital signal, perform ADC sampling on the initial digital signal, and then use the ADC interface circuit to filter the sampled initial digital signal to obtain a target digital signal; and then obtain the detection result corresponding to the leakage current based on the target digital signal; the ADC interface circuit is used to filter the sampled initial digital signal to obtain the target digital signal; and the communication module is used to send the detection result to a preset background device.

[0008] In some embodiments, the signal acquisition module includes: a Rogowski coil, an amplification unit, a filtering network, and an RMS conversion unit; wherein the Rogowski coil is electrically connected to the amplification unit; the amplification unit is used to differentially amplify the voltage signal; the filtering network is used to filter the differentially amplified voltage signal; and the RMS conversion unit is used to convert the filtered voltage signal to RMS value to obtain the initial digital signal.

[0009] In some embodiments, the insulator condition detector further includes a GPS module; the GPS module is used to collect positioning information to mark the detection location corresponding to the detection result.

[0010] In some embodiments, the insulator condition detector further includes a power supply module; the power supply module is used to supply power to the insulator condition detector.

[0011] In some embodiments, the power module includes a charging interface and a lithium battery; the lithium battery is charged through the charging interface.

[0012] In some embodiments, the insulator condition detector further includes a display module; the display module is electrically connected to the main control module via a preset RGB interface; the display module is used to display data.

[0013] In some embodiments, the insulator condition detector further includes a button control module; the button control module includes a first control button and a second control button; the first control button is the power control button of the insulator condition detector; the second control button is a preset detection start button.

[0014] In some embodiments, the signal acquisition module, the main control module, the ADC interface circuit, and the communication module are all integrated into a preset PCB board.

[0015] In some embodiments, the PCB board has a four-layer structure; the top layer is used to place components; the bottom layer is a ground plane and digital signal lines; the two middle layers are signal layers used for routing traces. In some embodiments, the PCB board is provided with an insulating layer coated with paint.

[0016] Compared with existing technologies, this invention uses a signal acquisition module to collect leakage current through a Rogowski coil interface, generates a voltage signal, and performs analog-to-digital conversion on the voltage signal to obtain an initial digital signal corresponding to the leakage current. Then, the main control module performs ADC sampling on the initial digital signal, and the ADC interface circuit filters the sampled initial digital signal to obtain a target digital signal. Based on the target digital signal, the detection result corresponding to the leakage current is obtained, and the communication module sends the detection result to the backend equipment. In this way, after the insulator condition detector is installed, it can automatically detect leakage current and transmit the results, facilitating data export and viewing through the backend equipment. This eliminates the need for manual climbing, improving safety while achieving automatic detection of the insulator condition. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the exemplary embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of the present invention and should not be considered as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort. In the drawings:

[0018] Figure 1 This is a schematic diagram of an insulator condition detector provided in an embodiment of this disclosure;

[0019] Figure 2 This is a circuit diagram of a signal acquisition module provided in an embodiment of this disclosure;

[0020] Figure 3 This is a partial circuit diagram of a main control module provided in an embodiment of this disclosure;

[0021] Figure 4 This is a schematic diagram of an ADC interface circuit and an SPI flash memory circuit provided in an embodiment of this disclosure;

[0022] Figure 5 This is a schematic diagram of a communication module, a navigation module, and their corresponding decoupling filter circuits provided in an embodiment of this disclosure;

[0023] Figure 6 This is a partial circuit diagram of a power module provided in an embodiment of this disclosure;

[0024] Figure 7 This is a circuit diagram of a display module provided in an embodiment of this disclosure;

[0025] Figure 8 This is a front view of a PCB board provided in an embodiment of this disclosure;

[0026] Figure 9 This is a reverse side view of a PCB board provided in an embodiment of this disclosure. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the embodiments and accompanying drawings. The illustrative embodiments and descriptions of the present invention are only used to explain the present invention and are not intended to limit the present invention.

[0028] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0029] The block diagrams shown in the accompanying drawings are merely functional entities and do not necessarily correspond to physically independent entities. That is, these functional entities can be implemented in software, in one or more hardware modules or integrated circuits, or in different network and / or processor devices and / or microcontroller devices.

[0030] The flowcharts shown in the accompanying drawings are merely illustrative and do not necessarily include all content and operations / steps, nor do they necessarily have to be performed in the described order. For example, some operations / steps can be broken down, while others can be combined or partially combined; therefore, the actual execution order may change depending on the specific circumstances.

[0031] In this application, "multiple" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. The character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0032] Please see Figure 1 , Figure 1 This is a schematic diagram of an insulator condition detector shown in an exemplary embodiment of this application.

[0033] Combination Figure 1 As shown, this embodiment of the present disclosure provides an insulator condition detector 100, including: a signal acquisition module 101, a main control module 102, an ADC (Analog-to-Digital Converter) interface circuit 103, and a communication module 104.

[0034] The main control module 102 is electrically connected to the signal acquisition module 101, the ADC interface circuit 103, and the communication module 104, respectively. The signal acquisition module 101 is equipped with a Rogowski coil. The Rogowski coil is fitted onto the ground wire of the utility pole to be tested. The Rogowski coil is used to sense the leakage current of the ground wire of the utility pole.

[0035] The signal acquisition module 101 is used to acquire leakage current using the Rogowski coil interface, generate a voltage signal, perform analog-to-digital conversion on the voltage signal to obtain the initial digital signal corresponding to the leakage current, and send the initial digital signal to the main control module.

[0036] The main control module 102 is used to receive the initial digital signal, perform ADC sampling on the initial digital signal, and then use the ADC interface circuit to filter the sampled initial digital signal to obtain the target digital signal; and then obtain the detection result corresponding to the leakage current based on the target digital signal.

[0037] The ADC interface circuit 103 is used to filter the sampled initial digital signal to obtain the target digital signal;

[0038] The communication module 104 is used to send the detection results to a preset backend device.

[0039] The insulator condition detector provided in this embodiment uses a signal acquisition module to collect leakage current through a Rogowski coil interface, generating a voltage signal. The voltage signal is then converted from analog to digital to obtain an initial digital signal corresponding to the leakage current. The main control module then performs ADC sampling on the initial digital signal and filters it using the ADC interface circuit to obtain a target digital signal. The detection result corresponding to the leakage current is then obtained based on the target digital signal, and the communication module sends the detection result to the backend equipment. In this way, after the insulator condition detector is installed, it can automatically detect leakage current and transmit the results, allowing for data export and viewing through the backend equipment. This eliminates the need for manual climbing, improving safety while achieving automatic insulator condition detection.

[0040] Furthermore, the signal acquisition module includes: a Rogowski coil, an amplification unit, a filtering network, and an RMS conversion unit. The Rogowski coil is electrically connected to the amplification unit. The amplification unit differentially amplifies the voltage signal. The filtering network filters the differentially amplified voltage signal. The RMS conversion unit converts the filtered voltage signal to its RMS value to obtain the initial digital signal. In this way, non-invasive measurement is achieved through the Rogowski coil, improving detection safety. The amplification unit and filtering network of the signal acquisition module process the weak voltage signal induced by the Rogowski coil, effectively suppressing electromagnetic noise. Finally, the RMS conversion unit converts the filtered voltage signal to its RMS value to obtain the initial digital signal, achieving interference-resistant signal acquisition and reducing signal errors.

[0041] It should be noted that the signal error is less than or equal to 2%.

[0042] It should be noted that Rogowski coils are used to sense alternating magnetic fields around a conductor, thereby inducing voltage signals in the ground wire of a utility pole.

[0043] Furthermore, the insulator condition detector also includes a GPS (Global Positioning System) module; the GPS module is used to collect positioning information to mark the detection location corresponding to the detection result. This enables precise positioning, facilitating the location of the detection result for staff.

[0044] Furthermore, the insulator condition detector also includes a power module; the power module is used to supply power to the insulator condition detector. This increases the battery life of the insulator condition detector and reduces the on-site operation time for personnel.

[0045] Furthermore, the power module includes a charging interface and a lithium battery; the lithium battery is charged through the charging interface. This allows the lithium battery to be charged via the charging interface, making it suitable for extended outdoor operations.

[0046] It should be noted that the lithium battery has a battery life of 8 hours.

[0047] Furthermore, the insulator condition detector also includes a display module; the display module is electrically connected to the main control module via a preset RGB interface; the display module is used to display data. This allows for direct viewing of data through the display module, achieving accurate, intuitive, and real-time presentation of the detection data, significantly improving the efficiency and reliability of insulator condition monitoring.

[0048] Furthermore, the insulator condition detector also includes a button control module; the button control module includes a first control button and a second control button; the first control button is the power control button for the insulator condition detector; the second control button is a preset detection start button. This independent design of the first and second control buttons ensures that the operator triggers the detection only when the device is ready, avoiding invalid data collection due to equipment malfunction and reducing power consumption.

[0049] In some embodiments, please refer to Figures 2 to 7 , Figure 2 A circuit diagram of a signal acquisition module shown in an exemplary embodiment of this application; Figure 3 Partial circuit diagram of the main control module; Figure 4 This is a schematic diagram of the ADC interface circuit and the SPI flash memory circuit. Figure 5 This is a schematic diagram of the communication module, the navigation module, and their corresponding decoupling filter circuits; Figure 6 This is a partial circuit diagram of the power module; Figure 7 This is a circuit diagram of the display module.

[0050] Combination Figures 2 to 7 As shown, it should be noted that the Rogowski coil is connected to interface unit J3, so that the voltage signal induced by the Rogowski coil is input to the signal acquisition module via interface unit J3. Interface unit J3 is connected to the amplification unit through a signal conditioning network; the amplification unit is also connected to a filter network and an RMS conversion unit.

[0051] Specifically, the amplification unit is U5, which is an ADE7753 chip.

[0052] It should be noted that the voltage signal is conditioned by a signal conditioning network consisting of capacitors C22, C21, C20, and C23 and resistors R1, R3, R4, and R5. After current limiting, it is connected to the amplification unit via the VIP and V1N interfaces. The voltage signal acquired by the Rogowski coil is a differential signal, which is differentially amplified by the amplification unit.

[0053] The DVDD interface of the amplifier unit is connected to a filter network. This filter network is an RC low-pass filter network, including capacitors C41, C37, and C24, and resistor R34. This filter network is used to filter the differentially amplified voltage signal and remove high-frequency electromagnetic interference.

[0054] The effective value conversion unit is U1, which is an RS0104 chip.

[0055] The amplification unit is electrically connected to the RMS conversion unit to perform RMS conversion on the filtered voltage signal to obtain the initial digital signal.

[0056] Specifically, the ADE7753 amplification unit chip is connected to the A1 interface of the RS0104 RMS conversion unit chip via a DIN interface; the ADE7753 amplification unit chip is connected to the A1 interface of the RS0104 RMS conversion unit chip via a DIN interface; the ADE7753 amplification unit chip is connected to the A2 interface of the RS0104 RMS conversion unit chip via a DOUT interface; the ADE7753 amplification unit chip is connected to the A3 interface of the RS0104 RMS conversion unit chip via an SCLK interface; the ADE7753 amplification unit chip is connected to the A2 interface of the RS0104 RMS conversion unit chip via a DOUT interface; the ADE7753 amplification unit chip is connected to the A3 interface of the RS0104 RMS conversion unit chip via a DCLK interface; the ADE7753 amplification unit chip is connected to the A3 interface of the RS0104 RMS conversion unit chip via a DCLK interface; the ADE7753 amplification unit chip is connected to the A2 ...3 interface The interface is connected to the A4 interface of the RS0104 chip, which is a valid value conversion unit.

[0057] It should be noted that the RMS conversion unit RS0104 chip is electrically connected to the main control module through the SPI interface, namely the SPI3_MOSI interface, SPI3_MISO interface, SPI3_CLK interface and SPI3_CS interface.

[0058] The main controller module includes a main controller, a TF (TransFlash) card interface, a debugging circuit, a clock circuit, a decoupling filter circuit, a serial Flash memory, and a programming circuit.

[0059] The main controller U16 is a D133CXS chip. The main controller U16 is electrically connected to the communication module via a UART (Universal Asynchronous Receiver / Transmitter) interface.

[0060] Specifically, the main controller U16 is electrically connected to the communication module through the BLE_DIS interface, BLE_STA interface, BLE_SLEEP interface, BLE_RX interface and BLE_TX interface.

[0061] It should be noted that the main controller U16 is mainly responsible for data processing, logic control and instruction execution. For example, it receives the initial digital signal, performs ADC sampling on the initial digital signal, and then uses the ADC interface circuit to filter the sampled initial digital signal to obtain the target digital signal; and then obtains the detection result corresponding to the leakage current based on the target digital signal.

[0062] In some embodiments, obtaining the detection result corresponding to the leakage current based on the target digital signal includes: extracting features from the target digital signal to obtain the effective value and peak value of the target digital signal; comparing the effective value and peak value of the target digital signal with a preset safety range; and determining the detection result as safe if the effective value and peak value are within the safety range. And / or, determining the detection result as unsafe if the effective value and peak value are within the safety range.

[0063] The main controller has built-in analysis algorithms that can automatically extract data features and compare thresholds, providing raw data input for artificial intelligence prediction models.

[0064] The main controller U16 can also control the communication module to communicate, and control the LCD screen to record and display data.

[0065] The TF card interface J10 is an interface for external storage and input, used to insert a TF card for easy data storage.

[0066] The main controller U16 is electrically connected to the TF card interface J10 through the SDC1_D1, SDC1_DO, SDC1_CLK, SDC1_CMD, SDC1_D3, SDC1_D2 and SDC1_DET interfaces.

[0067] It should be noted that the insulator condition detector is also equipped with SPI (Serial Peripheral Interface) flash memory. The SPI flash memory circuit and the TF card interface together form a storage chip storage unit, which is used to store data.

[0068] The debugging circuit is equipped with a debugging interface, namely J7, DEBUG interface. The debugging circuit is convenient for users to connect and debug programs.

[0069] It should be noted that the debugging circuit is connected to the main controller U16 through the DEBUG_TXD and DEBUG_RXD interfaces.

[0070] The clock circuit includes capacitors C36 and C35 and crystal oscillator Y1 to provide the system with a high-precision and highly stable clock signal to ensure time synchronization.

[0071] Crystal oscillator Y1, based on the piezoelectric effect of quartz crystal, generates mechanical resonance under electric field excitation, outputting a stable square wave signal with a frequency of 24MHz. This signal serves as the system clock source, providing a reference frequency for the main controller, ADC, communication module, and other components in the insulator condition detector, ensuring the synchronization of functions such as instruction execution, data transmission, and timers.

[0072] Capacitors C36 and C35 are connected in parallel across the crystal oscillator, forming an LC resonant circuit with the crystal's equivalent inductance. They also act as filters, absorbing high-frequency noise and suppressing waveform distortion.

[0073] The decoupling filter circuit includes capacitors C1, C2, C3, C4, C26, C27, C28, C5, C39, and C40.

[0074] C1, C2, C3, C4, C26, C27, and C28 are used to provide a more stable power input to the main controller U16. Specifically, C1, C2, and C3 are connected in parallel between the 1.1V power supply and GND to provide a more stable 1.1V power supply to the main controller U16. C4, C26, C27, and C28 are connected in parallel between the 3.3V power supply and GND to provide a more stable 3.3V power supply to the main controller U16.

[0075] C5, C39, and C40 provide stable power input to the communication module and GPS module.

[0076] The serial Flash memory U6 ​​is a W25Q64 chip used to store cached data. The serial Flash memory U6 ​​is electrically connected to the main controller U16 via an SPI interface.

[0077] Specifically, the serial Flash memory U6 ​​is electrically connected to the main controller U16 through the SPI0_WP interface, SPI0_MISO interface, SPI0_CS interface, SPI0_HOLD interface, SPI0_CLK interface and SPI0_MOSI interface.

[0078] The programming circuit is connected to the main controller U16 and the debugging circuit via DEBUG_TXD.

[0079] The programming circuit is equipped with a BOOT button. By pressing the BOOT button, the insulator status detector can be triggered to enter the boot mode during image programming, enabling firmware programming, fault recovery, debugging, and safe startup.

[0080] It should be noted that the main controller U16, the ADC interface circuit, and the storage chip storage unit constitute the data processing module of the insulator condition detector.

[0081] The ADC interface circuit is connected to the main controller U16 via the VBAR_ADC interface.

[0082] The capacitor C25, resistor R22, and resistor R23 in the ADC interface circuit form an RC low-pass filter, which is used to filter out ADC sampling noise.

[0083] The SPI flash memory circuit includes flash memory chips U8 and AP3128. Flash memory chip U8 stores detection data via the SPI bus.

[0084] The communication module includes the BLE communication chip U2, ECB02C, which is used to realize wireless communication.

[0085] The communication module is electrically connected to the main controller U16 via the BLE_DIS, BLE_STA, BLE_SLEEP, BLE_RX, and BLE_TX interfaces. It also receives data, such as detection results and positioning information, from the main controller U16 via the BLE_RX and BLE_TX interfaces.

[0086] The BLE_RX and BLE_TX interfaces are UART interfaces, and the communication distance in open environments can reach 500 meters.

[0087] The GPS module includes a GPS chip U3 and an antenna interface J4.

[0088] GPS chip U3 connects to antenna interface J4 via GND and RF interfaces. Antenna interface J4 is used for an external omnidirectional antenna to ensure stable transmission efficiency.

[0089] The GPS chip U3 is connected to the GPS_TX interface of the main controller via the TX0 pin, the GPS_RX interface of the main controller via the RX0 pin, and the GPS_PPS interface of the main controller via the PPS pin, so as to feed back the positioning information to the main controller.

[0090] The power module includes a charging management chip U7, a first DC-DC converter U11, a second DC-DC converter U15, a lithium battery interface J6, a lithium battery, a charging interface, a switch control module, a power switch latching module, and corresponding protection circuits for each component.

[0091] The lithium battery interface J6 is used to connect the lithium battery; the charging interface is J5. Both interfaces are Type-C. The lithium battery is charged via the charging interface.

[0092] Specifically, the DM pin of the charging interface is connected to the USB_DM interface of the main controller via resistor R11. The DP pin of the charging interface is connected to the USB_DP interface of the main controller via resistor R10.

[0093] The VBUS pin of the charging interface is connected to the VIN pin of the charging management chip U7. The SW pin of the charging management chip U7 is connected to VBAT and pin 1 of the lithium battery interface J6 through inductor L1 to charge the lithium battery connected to the lithium battery interface J6. It also supplies power to other components through VBAT.

[0094] Inductor L1 is also connected to capacitors C11 and C12. Capacitors C11 and C12, along with inductor L1, form a complete system. A filter circuit is used to suppress noise and match impedance to ensure stable power output.

[0095] The charging management chip U7 has a charging indicator light connected to pin D18 via pin D18 to indicate whether charging is in progress.

[0096] The D2 pin of the charging management chip U7 is connected to a full charge indicator light via D25, which is used to indicate whether the lithium battery is fully charged.

[0097] The first DC-DC converter U11 includes the SY8088 chip. It is a synchronous buck DC-DC converter, mainly used to convert electrical energy within a wide input voltage range into a stable output voltage (2.5V-5.5V). It reduces conduction losses and improves efficiency through synchronous rectification technology.

[0098] The second DC-DC converter U15 includes the SX1308 chip, which is a current-mode boost converter chip, mainly used to convert low-voltage DC to high-voltage DC.

[0099] The second DC-DC converter U15 has its pin SW connected to a 5V voltage via diode D3. Diode D3's low forward voltage drop (around 0.5V) and fast switching characteristics reduce power consumption and improve system efficiency.

[0100] The switch control module includes a switch control chip U10. The switch control chip U10 is a SAM8108 chip, which is an ON / OFF switch control chip. Its SW pin is connected to the power switch latch module via the KET1 interface. The KET1 interface is used to connect the first control button. Its OUT pin supplies power to other components and modules via VBAT, VCC, and VBAT_ADC.

[0101] The power supply can be switched on and off via the first control button. It supports single-button operation: pressing the first control button lowers the OUT pin, turning on the insulator condition detector; pressing the first control button again raises the OUT pin, turning off the insulator condition detector.

[0102] It should be noted that the power switch latch module also has a KET2 interface for connecting to the main controller U16. The KET2 interface is used to connect a second control button.

[0103] In some embodiments, when the insulator condition detector is turned on by the first control button, pressing the second control button can control the main controller U16 to start working and perform leakage current detection, that is, to receive the initial digital signal, sample the initial digital signal by ADC, and then use the ADC interface circuit to filter the sampled initial digital signal to obtain the target digital signal; and then obtain the detection result corresponding to the leakage current based on the target digital signal.

[0104] In the power module, the Type-C interface J5 charges the lithium battery via U7, with an LED display showing the charging status. After the 3.7V lithium battery voltage is connected, it is boosted to 5V via a second DC-DC converter to power the Rogowski coil, and simultaneously dropped to 3.3V via a first DC-DC converter to power the main control module, communication module, etc., meeting the power supply requirements of high-voltage environments. It consists of inductor L1 and capacitors C11 and C12. The filter circuit suppresses noise and matches the impedance to ensure stable power output.

[0105] The display module includes: LCD (Liquid Crystal Display), backlight driving circuit, capacitive touch chip, and touch control circuit.

[0106] It should be noted that the LCD screen J1 is 4.3 inches in size, and it can be a capacitive touch screen or a resistive touch screen with a resolution of 800x480.

[0107] LCD screen J1 is connected to the main controller U16 via RGB interfaces, namely LCD_R3, LCD_R4, LCD_R5, LCD_R6, LCD_R7, LCD_G2, LCD_G3, LCD_G4, LCD_G5, LCD_G6, LCD_G7, LCD_B3, LCD_B4, LCD_B5, LCD_B6, and LCD_B7, so that the main controller U16 can control LCD screen J1 to display system data such as power parameters, location information, and detection results.

[0108] Meanwhile, LCD screen J1 is also connected to the main controller U16 through the LCD_CLK interface, LCD_HSYNC interface, LCD_VSYNC interface and LCD_DE interface, so that the main controller U16 and LCD screen J1 can synchronize their clocks and control the display timing of LCD screen J1.

[0109] The parallel capacitors C29, C20, and C31 form a decoupling filter circuit to provide a stable power input to the LCD screen J1.

[0110] LCD screen J1 is connected to resistor R31 and capacitor C19 via the DISP interface. R31 and C19 are connected in series for filtering to eliminate the impact of noise on the signal transmission of the DISP interface.

[0111] The backlight driving circuit includes a capacitive touch chip U8, which is an AP3128 chip. It connects to the LEDA interface via pins VOUT and SW; and to the LEDK interface via pin FB, thus connecting the backlight driving circuit to the LCD screen J1. The backlight driving circuit is used to drive the backlight of the LCD screen J1 through the capacitive touch chip U8.

[0112] The touch control circuit is connected to the main controller U16 via the CT_SCL, CT_SDA, CT_RST, and CT_INT interfaces. The CT_SCL and CT_SDA interfaces are I2C interfaces used to enable communication between the touch control circuit and the main controller U16, facilitating human-computer interaction. It should be noted that the response time of the touch control circuit is ≤10ms.

[0113] The CT_SCL, CT_SDA, CT_RST, and CT_INT interfaces are also connected to pull-up resistors R51, R52, R53, and R50 respectively to perform current limiting, thereby enhancing the current pull-up capability of the LCD screen J1's I / O ports.

[0114] It should be noted that you should refer to [link / reference]. Figures 8 to 9 . Figure 8 This is a front view of the PCB board; Figure 9 This is a schematic diagram of the reverse side of the PCB board.

[0115] Combination Figure 8 and Figure 9 The signal acquisition module, main control module, ADC interface circuit, communication module, navigation module, and power supply module are all integrated into a pre-designed PCB board.

[0116] It should be noted that the PCB board has a 4-layer structure; the top layer is used to place components; the bottom layer is the ground plane and digital signal lines; the two middle layers are signal layers used for routing. This achieves high-density integration, low-noise signal transmission, and strong anti-interference capabilities.

[0117] It should be noted that critical signal lines, such as ADC input lines and wireless communication lines, should be routed in straight lines to avoid detours.

[0118] It should be noted that on the PCB board, analog ground AGND1 and digital ground GND are connected at a single point via a 0-ohm resistor. High-frequency components, such as the BLE communication chip U2 and crystal oscillator Y1, are surrounded by grounding vias spaced 5mm apart to form an electromagnetic shielding ring. For connectors such as J3 and J6, 0.1uF filter capacitors are connected in parallel next to the pins to suppress external interference. Both sides of the PCB are copper-plated with a thickness of 2oz to increase anti-interference capability and reduce the PCB area occupied by traces (GND), thereby improving anti-interference performance.

[0119] Furthermore, the PCB board is coated with an insulating layer. This improves insulation performance and enhances safety.

[0120] In the PCB board, the bottom of the charging management chip U7 and the capacitive touch chip U8 are copper-plated and have windows for heat dissipation to improve heat dissipation capabilities.

[0121] The PCB board is 1.6mm thick; it has 4 mounting holes on the edge for accommodating M3 copper pillars / studs.

[0122] In this embodiment, the working principle of the insulator condition detector is as follows:

[0123] 1. Installation and Fixing: Hold the instrument and place the Rogowski coil on the ground wire of the utility pole. Press the first control button and the second control button in sequence to start the leakage current measurement. The LCD screen will display the measurement value.

[0124] 2. Leakage Current Detection: The leakage current of the ground wire is induced into a weak voltage signal by the Rogowski coil. After processing by the signal conditioning network, amplification unit, and filtering network of the signal acquisition module, a standard analog signal is obtained, which is within the range of 0 to 3.3V. Then, the RMS value is converted by the RMS conversion unit to obtain the initial digital signal. The main controller U16 then performs ADC sampling, and the ADC interface circuit filters the sampled initial digital signal to obtain the target digital signal. Finally, the main controller U16 obtains the detection result corresponding to the leakage current based on the target digital signal.

[0125] The test results are stored on the TF card.

[0126] 3. Wireless Transmission: Detection results are sent to a pre-set backend device via the communication module for data storage and traceability. Simultaneously, the GPS module collects location information, enabling precise location of the measured utility pole for later processing. This achieves remote data transmission and allows for backend data retrieval.

[0127] 4. Status Judgment: The system will issue an alarm based on the detection results to remind staff that there is a fault in the insulator.

[0128] In this embodiment, a Rogowski coil non-contact measurement method is used to avoid close-range, high-altitude contact with high-voltage equipment. The PCB is coated with an insulating layer for effective moisture protection, anti-magnetic properties, and internal insulation. The instrument's outer casing is insulated, and the internal TVS protection circuit adapts to high-voltage electromagnetic environments, improving the safety of leakage current detection. Simultaneously, the Rogowski coil mounting structure adapted to power pole grounding wires and the instrument's fixing method ensure measurement stability in complex outdoor environments. The weak voltage signal induced by the Rogowski coil is processed through the signal conditioning network, amplification unit, and filtering network of the signal acquisition module, effectively suppressing electromagnetic noise. High-precision sampling via an ADC ensures that weak leakage current signals are captured. The hardware integration of the main controller and communication module supports real-time transmission and local storage of detection data, providing a hardware foundation for intelligent analysis.

[0129] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. An insulator condition detector, characterized in that, include: The system comprises a signal acquisition module, a main control module, an ADC interface circuit, and a communication module. The main control module is electrically connected to the signal acquisition module, the ADC interface circuit, and the communication module. The signal acquisition module is equipped with a Rogowski coil. The Rogowski coil is fitted onto the ground wire of the utility pole to be tested. The Rogowski coil is used to sense the leakage current of the ground wire of the utility pole. The signal acquisition module is used to acquire the leakage current using the Rogowski coil interface, generate a voltage signal, perform analog-to-digital conversion on the voltage signal to obtain an initial digital signal corresponding to the leakage current, and send the initial digital signal to the main control module. The main control module is used to receive the initial digital signal, perform ADC sampling on the initial digital signal, and then use the ADC interface circuit to filter the sampled initial digital signal to obtain the target digital signal; and then obtain the detection result corresponding to the leakage current based on the target digital signal. An ADC interface circuit is used to filter the sampled initial digital signal to obtain the target digital signal. The communication module is used to send the detection results to a preset backend device.

2. The method according to claim 1, characterized in that, The signal acquisition module includes: a Rogowski coil, an amplification unit, a filtering network, and an RMS conversion unit; The Rogowski coil is electrically connected to the amplification unit; the amplification unit is used to differentially amplify the voltage signal. The filtering network is used to filter the differentially amplified voltage signal; The RMS conversion unit is used to convert the filtered voltage signal to RMS value to obtain the initial digital signal.

3. The method according to claim 1, characterized in that, The insulator condition detector also includes a GPS module; the GPS module is used to collect positioning information to mark the detection location corresponding to the detection result.

4. The method according to claim 1, characterized in that, The insulator condition detector also includes a power supply module; the power supply module is used to supply power to the insulator condition detector.

5. The method according to claim 4, characterized in that, The power module includes a charging interface and a lithium battery; the lithium battery is charged through the charging interface.

6. The method according to claim 1, characterized in that, The insulator condition detector also includes a display module; the display module is electrically connected to the main control module through a preset RGB interface; the display module is used to display data.

7. The method according to claim 1, characterized in that, The insulator condition detector also includes a button control module; the button control module includes a first control button and a second control button; the first control button is the power control button of the insulator condition detector; the second control button is a preset detection start button.

8. The method according to claim 1, characterized in that, The signal acquisition module, the main control module, the ADC interface circuit, and the communication module are all integrated into a pre-designed PCB board.

9. The method according to claim 8, characterized in that, The PCB board has a 4-layer structure; the top layer is used to place components; the bottom layer is the ground plane and digital signal lines; the two middle layers are signal layers used for routing.

10. The method according to claim 7, characterized in that, The PCB board is coated with an insulating layer.

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