Circuit board production tracking management method, device, equipment and storage medium

Abstract

The present application relates to the technical field of circuit board production, and discloses a circuit board production tracking management method, device, equipment and storage medium, which obtains circuit board identity information and fault detection information of a target circuit board corresponding to a current detection station, performs equipment shutdown processing based on the fault detection information, constructs a candidate re-inspection option set, performs comprehensive cost evaluation based on real-time running data and equipment shutdown maintenance information of each candidate station to determine an optimal target re-inspection option, and then drives the target detection station to perform re-inspection on the target circuit board according to the circuit board identity information, and updates the real-time running data of each detection station. Therefore, the present application introduces a fusion mechanism in which candidate station queue prediction, comprehensive cost evaluation and re-inspection and maintenance information jointly participate in equipment restart triggering, improves the foresight of re-inspection decision, can avoid local congestion from expanding into whole-line beat reduction, and improves production line recovery efficiency and timeliness of quality control.

Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing technology, and in particular to a method, apparatus, equipment and storage medium for tracking and managing circuit board production. Background Technology

[0002] In actual production processes, circuit boards (PCBs / PCBAs) typically undergo printing, mounting, reflow, component insertion, testing, and various quality inspection stations (such as SPI, AOI, ICT / FCT, manual re-inspection / repair, etc.). Inspection stations output conclusions regarding the quality status of the circuit boards, often accompanied by defect location information, to facilitate rework, verification, or quality interception. Due to limited production line cycle time and inspection resources, processing inspection conclusions requires not only "timely defect detection" but also rapid cross-process joint control after a defect occurs: determining whether a defect necessitates downtime maintenance, conducting re-inspection and confirmation at appropriate subsequent stations, and ultimately deciding whether the equipment can be restarted for recovery.

[0003] However, in real production sites, faults and re-inspections are often affected by the following factors: First, the expression of defect types and defect location information varies among different testing equipment. Without a unified mapping, it is easy to cause unstable fault attribution. Second, downtime maintenance will directly change the upstream material arrival rhythm, causing fluctuations in the queue length of downstream testing stations. It is difficult to judge the congestion trend in the future based solely on the current queue length. Third, re-inspection stations are not unique. If fixed stations or static rules are still used for re-inspection assignment, problems such as excessively long re-inspection waiting time, delayed re-inspection conclusions, and failure to close the loop on critical faults in a timely manner are likely to occur.

[0004] Therefore, there is a need for a circuit board production tracking and management method and system that, after a fault is detected, combines defect location, fault level, expected downtime maintenance, real-time operating data of candidate sites, and future queue predictions to perform a comprehensive cost assessment of the re-inspection site and output the optimal re-inspection decision, thereby making the re-inspection closed loop and downtime recovery more forward-looking and adaptive. Summary of the Invention

[0005] This invention provides a circuit board production tracking management method, apparatus, equipment, and storage medium to at least solve the problems in existing production tracking scenarios where the selection of re-inspection sites relies on static rules and it is difficult to make forward-looking re-inspection decisions by combining changes in incoming materials and queue fluctuations caused by downtime maintenance, thereby leading to delayed re-inspection conclusions and reduced efficiency.

[0006] To achieve the above objectives, the present invention provides a circuit board production tracking and management method, comprising the following steps:

[0007] Obtain the scanning information and detection output information of the target circuit board at the current testing site, and generate the circuit board identification information and fault detection results;

[0008] Based on the fault detection results, analyze the process equipment to which the fault belongs and the cause of the fault, and determine whether to trigger a shutdown. If so, send a shutdown command to the process equipment and equipment management terminal, generate a range of candidate re-inspection sites where the fault can be detected later, and construct a set of candidate re-inspection options.

[0009] For each candidate site in the candidate re-inspection option set, real-time operating data of each candidate site is obtained; wherein, the real-time operating data includes: information on the quantity to be inspected, inspection speed information, and the original increase rate of the number of circuit boards to be inspected, which is determined by the material inflow speed of multiple material inflow processes;

[0010] Based on the original rate of increase in the number of circuit boards to be tested and equipment downtime and maintenance information, combined with the information on the quantity to be tested and the testing speed information, the predicted queue information for each candidate site is generated.

[0011] Based on the predicted queue information of candidate sites, a comprehensive cost evaluation is performed on the set of candidate re-inspection options to determine the optimal target re-inspection option and generate re-inspection decision information;

[0012] Based on the re-inspection decision information, re-inspection task information is generated, which drives the target inspection station corresponding to the optimal target re-inspection option to perform re-inspection on the target circuit board according to the circuit board identity information. Based on the re-inspection results or maintenance information fed back by the equipment management terminal, a device restart command is generated.

[0013] Optionally, the steps of acquiring the scanning information and detection output information of the target circuit board at the current testing station, and generating circuit board identification information and fault detection results, specifically include:

[0014] Collect the scanning information of the target circuit board, extract the circuit board identifier of the target circuit board, and generate the circuit board identity information associated with the target circuit board;

[0015] Receive the detection output information of the current detection site, parse out the detection conclusion information and defect location information in the detection output information, and map the detection conclusion information into unified fault type information and fault level information to generate fault detection results;

[0016] The circuit board identity information, defect location information, and fault detection results containing fault type information and fault level information are associated and stored.

[0017] Optionally, based on the fault detection results, the process equipment to which the fault belongs and the cause of the fault are analyzed to determine whether to trigger a shutdown. If so, a shutdown command is sent to the equipment to which the fault belongs and the equipment management terminal, generating a range of candidate re-inspection sites where the fault can be subsequently detected, and constructing a set of candidate re-inspection options. Specifically, this includes:

[0018] Based on the defect location information and the fault type information in the fault detection results, query the fault attribution rules to determine the process equipment to which the fault belongs and the fault cause information.

[0019] Based on the fault level information in the fault detection results and the preset shutdown trigger conditions, determine whether to trigger shutdown processing; if so, output a shutdown command to the equipment in the process to which the fault belongs, and synchronously output the shutdown event information corresponding to the shutdown command to the equipment management terminal.

[0020] Based on the fault cause information query maintenance handling time rules, the estimated handling time is determined, and equipment shutdown maintenance information including shutdown effective time information and estimated maintenance end time information is generated;

[0021] Based on the fault type information in the fault detection results, query the mapping relationship between faults and re-inspection capabilities, determine the range of candidate re-inspection sites where the fault can be subsequently detected, and construct a set of candidate re-inspection options.

[0022] Optionally, for each candidate site in the candidate re-examination option set, the steps to obtain the real-time operational data of each candidate site specifically include:

[0023] For each candidate site in the candidate re-inspection option set, the current number of circuit boards to be inspected and the number of boards inspected per unit time at the candidate site are collected as the quantity to be inspected information and the inspection speed information.

[0024] Obtain the production line process routing relationship to determine the material delivery direction relationship between multiple incoming processes and each candidate station, and collect the output quantity and duration of each incoming process within the statistical window to determine the material delivery speed of each incoming process;

[0025] For each candidate site, the incoming speeds of multiple incoming processes pointing to that candidate site are aggregated to obtain the original rate of increase of the number of circuit boards to be inspected at that candidate site.

[0026] The original increase rate is associated with the information on the quantity to be detected and the detection speed information to form real-time operating data of candidate sites.

[0027] Optionally, the step of generating test queue prediction information for each candidate site, based on the original rate of increase in the number of circuit boards to be tested and equipment downtime and maintenance information, combined with the test quantity information and testing speed information, specifically includes:

[0028] The original growth rate of each candidate site is expanded into a series of material growth rates corresponding to the discrete prediction time series of the preset prediction period;

[0029] Based on the material inbound direction relationship between the expected maintenance end time information and the equipment of the process to which the fault belongs, the material inbound reduction rate sequence of each candidate station on the discrete prediction time series is determined, and the material inbound reduction rate sequence is used to characterize the material inbound weakening process caused by downtime;

[0030] Based on the incoming material increase rate sequence and the incoming material decrease rate sequence, the net incoming material rate sequence for each candidate site is obtained;

[0031] Based on the current number of circuit boards to be inspected at each candidate site, the net incoming material speed sequence, and the inspection speed information, the predicted queue information for each candidate site is recursively generated.

[0032] Optionally, the step of performing a comprehensive cost evaluation on the candidate re-inspection option set based on the candidate site's detection queue prediction information, determining the optimal target re-inspection option, and generating re-inspection decision information specifically includes:

[0033] For each candidate re-inspection option, determine the arrival time from the current detection station to the target station corresponding to the candidate re-inspection option, and read the predicted queue length corresponding to the arrival time from the prediction information of the queue to be detected;

[0034] The waiting time is determined based on the predicted queue length and detection speed information, and the completion time for obtaining the re-inspection conclusion is determined in combination with the preset re-inspection processing time rule;

[0035] Based on the completion time, equipment downtime and maintenance information, fault level information, and candidate site operation status information of each candidate re-inspection option, the comprehensive cost value of each candidate re-inspection option is calculated, and the candidate re-inspection option with the smallest comprehensive cost value is selected as the optimal target re-inspection option.

[0036] Based on the optimal target re-inspection option, re-inspection decision information containing target site information and expected completion time information is generated.

[0037] Optionally, based on the re-inspection decision information, re-inspection task information is generated, driving the target inspection station corresponding to the optimal target re-inspection option to perform re-inspection on the target circuit board according to the circuit board identity information. Based on the re-inspection results or maintenance information fed back by the equipment management terminal, a device restart instruction step is generated, specifically including:

[0038] Based on the re-inspection decision information, re-inspection task information is generated, and the circuit board identity information and fault detection results are written into the task distribution payload and output to the target detection station corresponding to the optimal target re-inspection option.

[0039] Obtain the re-inspection results returned by the target detection site, generate re-inspection handling result information based on the re-inspection results, obtain the maintenance information fed back by the equipment management terminal, and update the maintenance completion status in the equipment shutdown maintenance information based on the maintenance information;

[0040] If the re-inspection result information indicates that the re-inspection is normal or the maintenance information indicates that the fault handling is completed, a device restart command is generated and output to the equipment in the process to which the fault belongs;

[0041] Record the restart effective time information corresponding to the restart command, and update the maintenance end time information in the equipment shutdown maintenance information based on the restart effective time information;

[0042] For each testing station, the material infeed speed sequence of each material infeed process is updated so that the material infeed speed sequence of the corresponding time period during downtime is zero, so as to redetermine the original increase rate of the number of circuit boards to be tested at each testing station.

[0043] Furthermore, to achieve the above objectives, the present invention also provides a circuit board production tracking and management device, comprising:

[0044] The generation module is used to obtain the scanning information and detection output information of the target circuit board at the current detection site, and generate the circuit board identity information and fault detection results;

[0045] The judgment module is used to analyze the process equipment to which the fault belongs and the cause of the fault based on the fault detection results, and to determine whether to trigger a shutdown. If so, it sends a shutdown command to the process equipment and the equipment management terminal, generates a range of candidate re-inspection sites where the fault can be detected later, and constructs a set of candidate re-inspection options.

[0046] The acquisition module is used to acquire real-time operating data for each candidate station in the candidate re-inspection option set; wherein, the real-time operating data includes: information on the quantity to be inspected, inspection speed information, and the original increase rate of the number of circuit boards to be inspected, which is determined by the material inflow speed of multiple material inflow processes.

[0047] The combined module is used to generate the predicted queue information for each candidate site based on the original increase rate of the number of circuit boards to be tested and the equipment downtime and maintenance information, combined with the information on the quantity to be tested and the testing speed information.

[0048] The determination module is used to perform a comprehensive cost evaluation on the set of candidate re-inspection options based on the prediction information of the candidate site's queue to be detected, determine the optimal target re-inspection option, and generate re-inspection decision information;

[0049] The execution module is used to generate re-inspection task information based on the re-inspection decision information, drive the target inspection station corresponding to the optimal target re-inspection option to perform re-inspection on the target circuit board according to the circuit board identity information, and generate equipment restart instructions based on the re-inspection results or maintenance information fed back by the equipment management terminal.

[0050] In addition, to achieve the above objectives, the present invention also provides a circuit board production tracking management device, the circuit board production tracking management device comprising: a memory, a processor, and a circuit board production tracking management program stored in the memory and executable on the processor, wherein the circuit board production tracking management program, when executed by the processor, implements the steps of the circuit board production tracking management method as described above.

[0051] In addition, to achieve the above objectives, the present invention also provides a storage medium storing a circuit board production tracking management program, which, when executed by a processor, implements the steps of the circuit board production tracking management method described above.

[0052] The beneficial effects of this invention are as follows: It proposes a method, device, equipment, and storage medium for tracking and managing circuit board production. On the detection output side, standardized fault detection results are formed through unified mapping, ensuring a consistent data foundation for subsequent fault attribution and downtime judgment, reducing uncertainty caused by differences in cross-device expression. Simultaneously, when downtime maintenance disrupts the incoming material rhythm, a candidate site queue prediction mechanism is introduced, shifting the selection of re-inspection sites from judging the current state to judging future queue trends, improving the foresight of re-inspection decisions. Through comprehensive cost evaluation, the optimal target re-inspection option is selected among multiple candidate re-inspection sites, making the time for obtaining re-inspection conclusions more controllable and preventing local congestion from escalating into a decrease in overall production line speed. A mechanism is constructed where re-inspection and maintenance information jointly participate in triggering equipment restarts, enabling rapid response and feedback from downtime to re-inspection and then to recovery, improving production line recovery efficiency and the timeliness of quality control. Attached Figure Description

[0053] Figure 1 This is a schematic diagram of the device structure of the hardware operating environment involved in the embodiments of the present invention;

[0054] Figure 2 This is a flowchart illustrating an embodiment of the circuit board production tracking management method of the present invention;

[0055] Figure 3 This is a structural block diagram of a circuit board production tracking and management device according to an embodiment of the present invention. Detailed Implementation

[0056] It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0057] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0058] like Figure 1 As shown, Figure 1 This is a schematic diagram of the device structure of the hardware operating environment involved in the embodiments of the present invention.

[0059] like Figure 1 As shown, the device may include: a processor 1001, such as a CPU; a communication bus 1002; a user interface 1003; a network interface 1004; and a memory 1005. The communication bus 1002 is used to enable communication between these components. The user interface 1003 may include a display screen or an input unit such as a keyboard; optionally, the user interface 1003 may also include a standard wired interface or a wireless interface. The network interface 1004 may optionally include a standard wired interface or a wireless interface (such as a Wi-Fi interface). The memory 1005 may be high-speed RAM or non-volatile memory, such as a disk drive. Optionally, the memory 1005 may also be a storage device independent of the aforementioned processor 1001.

[0060] Those skilled in the art will understand that Figure 1 The structure of the device shown does not constitute a limitation on the device and may include more or fewer components than shown, or combine certain components, or have different component arrangements.

[0061] like Figure 1 As shown, the memory 1005, which serves as a computer storage medium, may include an operating system, a network communication module, a user interface module, and a circuit board production tracking and management program.

[0062] exist Figure 1 In the terminal shown, network interface 1004 is mainly used to connect to the backend server and communicate data with it; user interface 1003 is mainly used to connect to the client (user terminal) and communicate data with it; while processor 1001 can be used to call the circuit board production tracking management program stored in memory 1005 and perform the following operations:

[0063] Obtain the scanning information and detection output information of the target circuit board at the current testing site, and generate the circuit board identification information and fault detection results;

[0064] Based on the fault detection results, analyze the process equipment to which the fault belongs and the cause of the fault, and determine whether to trigger a shutdown. If so, send a shutdown command to the process equipment and equipment management terminal, generate a range of candidate re-inspection sites where the fault can be detected later, and construct a set of candidate re-inspection options.

[0065] For each candidate site in the candidate re-inspection option set, real-time operating data of each candidate site is obtained; wherein, the real-time operating data includes: information on the quantity to be inspected, inspection speed information, and the original increase rate of the number of circuit boards to be inspected, which is determined by the material inflow speed of multiple material inflow processes;

[0066] Based on the original rate of increase in the number of circuit boards to be tested and equipment downtime and maintenance information, combined with the information on the quantity to be tested and the testing speed information, the predicted queue information for each candidate site is generated.

[0067] Based on the predicted queue information of candidate sites, a comprehensive cost evaluation is performed on the set of candidate re-inspection options to determine the optimal target re-inspection option and generate re-inspection decision information;

[0068] Based on the re-inspection decision information, re-inspection task information is generated, which drives the target inspection station corresponding to the optimal target re-inspection option to perform re-inspection on the target circuit board according to the circuit board identity information. Based on the re-inspection results or maintenance information fed back by the equipment management terminal, a device restart command is generated.

[0069] The specific embodiments of the present invention applied to the device are basically the same as the embodiments of the circuit board production tracking management method described below, and will not be repeated here.

[0070] This invention provides a method for tracking and managing circuit board production, referring to... Figure 2 , Figure 2 This is a flowchart illustrating an embodiment of the circuit board production tracking and management method of the present invention.

[0071] In this embodiment, a circuit board production tracking and management method includes:

[0072] Step S100: Obtain the scanning information and detection output information of the target circuit board at the current detection station, and generate the circuit board identity information and fault detection results.

[0073] Specifically, the scanning information of the target circuit board is collected, the circuit board identifier of the target circuit board is extracted, and the circuit board identity information associated with the target circuit board is generated; the detection output information of the current detection station is received, the detection conclusion information and defect location information are parsed, and the detection conclusion information is mapped into unified fault type information and fault level information to generate fault detection results; the circuit board identity information, defect location information and fault detection results containing fault type information and fault level information are associated and stored.

[0074] In this embodiment of the invention, the core of step S1 is not merely reading a barcode and recording a result, but rather organizing the heterogeneous outputs from different testing devices and different process stages into a unified data object that can be directly used later. Specifically, the scanned information usually appears in the form of a label code, QR code, or UID read by the device. This identifier is unique within the production line and can serve as the primary key for cross-site tracking. By binding the circuit board identifier with information such as work order number, batch number, and product model, circuit board identity information can be formed, which can be used to accurately locate the same board when subsequent re-inspection tasks are issued.

[0075] In practical applications, the detection conclusions in the output information often vary depending on the device: for example, different AOI vendors may encode the same defect differently, and even the same device may change the defect category naming under different algorithm versions. Therefore, this invention introduces a unified mapping process between fault type information and fault level information. The mapping can be implemented through a preset mapping table or by converting the original device conclusions into a platform-level fault enumeration using a rule engine. The fault level is used to express the importance of the fault to shutdown and re-inspection decisions; for example, it can be classified as "fatal / critical / general / indicative." It should be understood that the names and number of level classifications are not limited, as long as they can be used for subsequent shutdown trigger judgments.

[0076] In this embodiment of the invention, defect location information is crucial in the re-inspection scenario. Defect location can be a tag number (component number such as R / C / U), coordinates, pad number, or image ROI index. After associating and storing the defect location with identification information and fault detection results, subsequent re-inspection stations can perform "fixed-point verification" or "extended verification" based on the location information. For example, in one example, when the defect location is a tag number + coordinates, the re-inspection station can prioritize performing high-resolution re-scanning and interpretation of the coordinate area, thereby reducing the full-board scanning time.

[0077] Step S200: Based on the fault detection results, analyze the process equipment to which the fault belongs and the cause of the fault, and determine whether to trigger a shutdown process; if so, send a shutdown command to the process equipment and equipment management terminal, generate a range of candidate re-inspection sites, and construct a set of candidate re-inspection options.

[0078] Specifically, based on the defect location information and the fault type information in the fault detection results, the fault attribution rules are queried to determine the process equipment to which the fault belongs and the fault cause information; based on the fault level information in the fault detection results and the preset shutdown trigger conditions, it is determined whether to trigger shutdown processing; if so, a shutdown command is output to the process equipment to which the fault belongs, and the shutdown event information is synchronously output to the equipment management terminal; based on the fault cause information, the maintenance handling time rules are queried to determine the estimated handling time, and equipment shutdown maintenance information including the shutdown effective time information and the estimated maintenance end time information is generated; based on the fault type information, the mapping relationship between fault and re-inspection capability is queried to determine the range of candidate re-inspection sites where the fault can be subsequently detected, and a set of candidate re-inspection options is constructed.

[0079] In this embodiment of the invention, step S2 addresses the issue of how to quickly transform a quality problem into a production line control action after a fault occurs. It should be noted that the fault attribution rule is used to map detected defects to possible responsible processes / equipment and possible causes. This rule can be derived from a process knowledge base, historical defect analysis records, or equipment maintenance experience. For example, if the defect location is concentrated in the coordinate zone corresponding to a certain placement head, and the fault type is "offset / tombstone," it can be attributed to a placement machine nozzle or calibration abnormality; if the fault type is "cold solder joint / tin bridging" and the distribution shows a temperature zone correlation, it can be attributed to reflow oven temperature zone control or abnormal oven airflow. It should be noted that the attribution rule does not require a unique answer at once; it can also output the most likely equipment set + confidence level, and then use the shutdown trigger conditions combined with the level and threshold to make the final decision.

[0080] Regarding the determination of shutdown triggers, shutdown trigger conditions are used to convert fault levels into equipment control actions. Preset shutdown trigger conditions can be static thresholds (e.g., direct shutdown for severe faults) or statistical thresholds (e.g., shutdown triggered when a certain type of fatal defect occurs N times consecutively within a statistical window). The length of this statistical window and the value of N can be set according to production line cycle time and quality risk, and do not constitute a limitation of this invention. After the shutdown command is output to the equipment in the process to which the fault belongs, to ensure event traceability, the system simultaneously synchronizes shutdown event information to the equipment management terminal. Event information may include equipment number, fault type, trigger time, trigger rule source, etc.

[0081] In this embodiment of the invention, maintenance handling duration rules are used to generate equipment downtime maintenance information. The maintenance handling duration is not a simple fixed value, but rather related to the cause of the fault. For example, "replacing the nozzle" and "replacing the motherboard / recalibrating" correspond to different estimated durations. After obtaining the estimated handling duration by querying the maintenance handling duration rules, an estimated maintenance end time can be generated. This estimated end time will be used for subsequent queue prediction, reflecting how long the downtime will reduce incoming materials. It should be understood that the estimated end time is a predicted value and can be corrected later by feedback from maintenance information.

[0082] It's important to note that constructing the candidate re-inspection option set relies on the mapping relationship between faults and re-inspection capabilities. This is significant because not all subsequent sites possess the capability to detect the same type of fault. For example, some visual defects can be re-inspected by AOI, but functional defects are more suitable for ICT / FCT; some solder joint issues can be re-inspected by X-ray or high-magnification microscopy. The candidate re-inspection site range can include multiple sites, or different re-inspection strategies for the same site (e.g., 100% inspection / sampling / only re-inspection of location points). In one example, candidate re-inspection options can be represented as {Site A - Fixed-point re-inspection, Site A - 100% inspection, Site B - Fixed-point re-inspection, Site C - Functional re-test}, so that subsequent comprehensive cost evaluation can simultaneously consider differences in site capabilities and processing time.

[0083] Step S300: For each candidate site in the candidate re-examination option set, obtain the real-time operation data of each candidate site.

[0084] Specifically, for each candidate site in the candidate re-inspection option set, the current number of circuit boards to be inspected and the number of boards inspected per unit time are collected as the quantity to be inspected information and the inspection speed information; the production line process routing relationship is obtained to determine the material delivery direction relationship between multiple incoming material processes and each candidate site, and the output quantity and duration of each incoming material process within the statistical window are collected to determine the material delivery speed of each incoming material process; for each candidate site, the material delivery speeds of multiple incoming material processes pointing to that candidate site are summarized to obtain the original increase rate of the number of circuit boards to be inspected at that candidate site; the original increase rate is correlated with the quantity to be inspected information and the inspection speed information to form the real-time operating data of the candidate site.

[0085] In this embodiment of the invention, the key to step S3 is to expand the current queuing status of the site into a trend of queuing growth. Knowing only the current quantity to be inspected cannot characterize future queuing changes, because queuing changes are also affected by the upstream material inflow rate and the inspection rate itself.

[0086] First, the quantity to be inspected information describes the current queue length at the site and can be obtained through methods such as site buffering, conveyor belt counting, and the MES uninspected list. The inspection speed information describes the site's processing capacity and can be obtained by statistically analyzing the number of inspections completed per unit time, or by estimating it using equipment cycle time parameters and utilization rate. It should be noted that the inspection speed may fluctuate in the short term; for example, equipment line changes, program switching, and manual confirmation can reduce the effective speed. Therefore, in some implementations, the inspection speed can be smoothed using a short window or an approximate steady-state value can be used.

[0087] Secondly, the increase rate was originally used to describe the natural growth rate of the number of items awaiting inspection at a site if no downtime occurs. This quantity is obtained by summing the incoming material rates of multiple incoming material processes. Here, "incoming material process" is not limited to a single process; it may be multiple parallel branches converging into the same inspection site, such as two patch lines merging into the same AOI. After determining the incoming material direction through process routing relationships, the incoming material rate is obtained by calculating the ratio of the output quantity of each incoming material process within the statistical window to the statistical window duration. The statistical window can be set to minutes or hours. A shorter window results in a faster response but higher noise, while a longer window provides a smoother response but more noticeable lag. Those skilled in the art can choose according to the site requirements.

[0088] Finally, the quantity to be tested, the testing speed, and the original increase rate are combined to form the real-time operational data of candidate sites. This data provides three foundations for subsequent queue prediction: initial queue length, service capacity, and external input trends.

[0089] Step S400: Based on the original increase speed and equipment downtime maintenance information, combined with the quantity to be detected and the detection speed information, generate the detection queue prediction information for each candidate site.

[0090] Specifically, the original increase rate of each candidate site is expanded into a material increase rate sequence corresponding to the discrete prediction time series of the preset prediction period; based on the material direction relationship between the expected maintenance end time information and the equipment to which the fault belongs, the material decrease rate sequence of each candidate site in the discrete prediction time series is determined, and the material decrease rate sequence is used to characterize the material weakening process caused by downtime; the net material inflow rate sequence is obtained based on the material increase rate sequence and the material decrease rate sequence; based on the current number of circuit boards to be inspected, the net material inflow rate sequence, and the inspection speed information of each candidate site, the inspection queue prediction information of each candidate site is recursively generated.

[0091] In this embodiment of the invention, step S4 analyzes how the queue of candidate re-inspection stations will change after the upstream equipment is shut down for maintenance. If this process is judged solely based on experience, the time delay and recovery process caused by the shutdown can easily be overlooked. Therefore, this invention explicitly adds the original increase in speed to the material reduction caused by the shutdown to form the net material inflow speed, and recursively predicts the future queue length based on this.

[0092] Specifically, the expansion of the incoming material increase rate sequence is used to transform a rate value into a sequence aligned with time slices. For example, if the predicted period is T minutes in the future and the time slice interval is Δt, a discrete time series can be formed, and the original increase rate can be set for each time slice. This process facilitates the subsequent mapping of downtime effects onto the same time axis. It should be noted that the discrete time slice interval can be adjusted according to the system's computing power and is not limited to a fixed value.

[0093] Following this, the incoming material reduction rate sequence is used to characterize the weakening process of incoming materials at each candidate site due to the shutdown. Since the shutdown occurs on a specific process equipment, and the output of that equipment may correspond to multiple downstream sites, it is necessary to combine the "process equipment to which the failure occurred - incoming material direction relationship" to determine which candidate sites will be reduced, and the magnitude of the reduction. In one example, if the shutdown equipment is a pick-and-place machine, whose output flows directly to the post-reflow AOI and ICT, the incoming material reduction rate of the relevant sites can be approximated by the output rate of that equipment under normal conditions; if the shutdown equipment is a reflow oven, its impact may be delayed and manifested as "reduction of incoming materials at the post-reflow AOI," and this delay time can be estimated through routing relationships and cache capacity. It should be understood that the construction of the incoming material reduction rate sequence can be step-type (constant reduction during shutdown) or gradual type (considering cache exhaustion and recovery ramp-up), and is not limited to a single form.

[0094] In addition, the net incoming material rate sequence is the difference between the incoming material increase rate sequence and the incoming material decrease rate sequence, used to express the actual net input trend of the site under shutdown disturbances. When the net incoming material rate is positive, the queue tends to increase; when the net incoming material rate is negative, the queue tends to decrease.

[0095] It should be noted that the prediction information for the queue to be detected in this embodiment of the invention is generated recursively. For ease of explanation, an exemplary recursive formula can be given:

[0096] ;

[0097] in, This represents the prediction queue length for the i-th candidate site in the k-th time slice; This represents the net inbound rate of the station in the k-th time slice; Δt represents the detection speed at this station; Δt represents the time slice length. In this relationship, the queue is updated in each time slice by the previous queue size plus the net incoming material quantity minus the completed detection quantity, and a max constraint is used to avoid negative queues.

[0098] In this embodiment of the invention, the queue prediction result can be represented as a mapping table between arrival time and predicted queue length, which can be directly read for subsequent comprehensive cost evaluation. Furthermore, in another possible implementation, a confidence interval or fluctuation band can be attached to the prediction result to reflect the uncertainty caused by fluctuations in detection speed or statistical errors in incoming materials; this extension also does not depart from the technical concept of this invention.

[0099] Step S500: Based on the prediction information of the candidate site's queue to be detected, perform a comprehensive cost evaluation on the candidate re-inspection option set, determine the optimal target re-inspection option, and generate re-inspection decision information.

[0100] Specifically, for each candidate re-inspection option, the arrival time from the current detection station to the target station corresponding to that candidate re-inspection option is determined, and the predicted queue length corresponding to the arrival time is read from the predicted queue information to be detected; the waiting time is determined based on the predicted queue length and detection speed information, and the completion time for obtaining the re-inspection conclusion is determined in combination with the preset re-inspection processing time rules; the comprehensive cost value is calculated based on the completion time of each candidate re-inspection option, equipment shutdown and maintenance information, fault level information, and candidate station operating status information, and the candidate re-inspection option with the smallest comprehensive cost value is selected as the optimal target re-inspection option; and re-inspection decision information containing target station information and expected completion time information is generated based on the optimal target re-inspection option.

[0101] In this embodiment of the invention, the core of step S5 is to transform the selection of the target site for the re-inspection into a calculable and comparable evaluation process. Since the candidate re-inspection option set may include multiple sites and different re-inspection strategies, selecting only based on the current queue length may ignore the time-sensitivity requirements of arrival time difference, queue growth trends, and fault levels. Therefore, this invention introduces an evaluation chain that reads the arrival time to predict the queue length, derives the completion time, and calculates the overall cost.

[0102] It should be noted that the arrival time describes the transportation / transfer time required for the target circuit board to move from the current inspection station to the candidate station. This time can be derived from logistics system estimates, production line conveyor belt cycle times, manual handling experience values, or historical statistics. In some implementations, the arrival time may also consider waiting transfer windows, for example, some stations only receive re-inspection boards in batches at fixed cycle times. Once the arrival time is determined, the predicted queue length at that time can be read from the queue prediction information, thereby incorporating future queue congestion into the assessment.

[0103] Based on this, the waiting time and re-inspection processing time are used to deduce the re-inspection completion time. The waiting time can be obtained from the ratio of the predicted queue length to the detection speed; the re-inspection processing time can be determined by preset rules, such as "fixed-point verification" corresponding to a shorter time, "full-point verification" corresponding to a longer time, and "functional retest" may require multiple power-ups and test program switching. It should be noted that the re-inspection processing time rules can be related to the fault type, fault level, and site type, and are not limited to a fixed constant.

[0104] As is easily understood, the comprehensive cost is used to uniformly compare different candidate options. For clarity, an exemplary construction of the comprehensive cost can be provided:

[0105] ;

[0106] in, This represents the comprehensive cost of the j-th candidate re-examination option; This indicates the time it takes for the option to obtain a re-examination result; This indicates the risk penalty introduced by the fault level (e.g., the higher the level, the greater the penalty weight). This indicates the penalty items for the candidate site's operating status (e.g., increased penalty when the site is slow / abnormal / paused); This indicates the penalty for overlap between the re-inspection completion time and the shutdown maintenance window (e.g., if the re-inspection conclusion is later than the expected maintenance completion time, the restart decision will be delayed); w1-w4 are weighting coefficients.

[0107] In one example, when the fault level is high and the downtime maintenance is expected to end soon, the system can increase w2 or Due to the impact of [unspecified factors], the re-inspection conclusions should be completed as early as possible before the maintenance is finished; when the site status is abnormal... This will significantly increase the chances of the station being selected as the optimal choice even if the current queue is not long. By selecting the candidate re-examination option with the lowest overall cost, this invention can output the optimal target re-examination option. Subsequently, the re-examination decision information will clearly specify the target station and the estimated completion time, facilitating task assignment and on-site execution.

[0108] It should be understood that the comprehensive cost construction formula is merely an illustrative method of cost construction. Those skilled in the art can replace the cost terms with equivalent expressions, such as replacing the completion time with the completion duration, or replacing the penalty term with a piecewise function or normalized score. As long as the candidate options are still comprehensively compared based on queue prediction information and the optimal option is output, it falls within the scope of the present invention.

[0109] Step S600: Based on the re-inspection decision information, generate re-inspection task information, drive the target inspection station to perform re-inspection on the target circuit board according to the circuit board identity information, and generate a device restart command based on the re-inspection results or maintenance information fed back by the equipment management terminal.

[0110] Specifically, based on the re-inspection decision information, re-inspection task information is generated, and the circuit board identity information and fault detection results are written into the task distribution payload and output to the target inspection station corresponding to the optimal target re-inspection option; the re-inspection results returned by the target inspection station are obtained, and re-inspection handling result information is generated based on the re-inspection results; the maintenance information fed back by the equipment management terminal is obtained, and the maintenance completion status in the equipment shutdown maintenance information is updated based on the maintenance information; if the re-inspection handling result information indicates that the re-inspection is normal or the maintenance information indicates that the fault handling is completed, an equipment restart command is generated and output to the equipment of the process to which the fault belongs; the restart effective time information corresponding to the restart command is recorded, and the maintenance completion time information in the equipment shutdown maintenance information is updated based on the restart effective time information; for the multiple incoming material processes corresponding to each inspection station, the incoming material speed sequence of each incoming material process is updated so that the incoming material speed sequence of the corresponding time period during the shutdown is zero, so as to redetermine the original increase rate of the number of circuit boards to be inspected at each inspection station.

[0111] In this embodiment of the invention, step S600 is used to translate the decision result into an executable task and incorporate the feedback from re-inspection and maintenance into closed-loop control. Specifically, the re-inspection task payload needs to contain sufficient information to support the target site in quickly locating the re-inspection object and target. Circuit board identity information is used to identify the specific circuit board; fault detection results and defect location information are used to indicate the focus of the re-inspection. The task information can be distributed via MES task queue, site dashboard instructions, device interface messages, or mobile terminal work order push. It should be noted that the distribution channel is not limited to a specific type, as long as it can drive the target site to perform the re-inspection.

[0112] It should be noted that the feedback of re-inspection results is used to form the re-inspection handling result information. The re-inspection result can be in a status such as re-inspection passed / re-inspection failed / re-inspection uncertain (requiring manual confirmation), and can also be accompanied by new location information or photographic evidence. In one example, if the re-inspection result shows that the defect does not exist, it may indicate that the initial inspection was misjudged; if the re-inspection result confirms the existence of the defect and is consistent with the attribution, it can further support the rationality of the downtime maintenance. At the same time, the maintenance information fed back by the equipment management terminal is used to update the maintenance completion status of the equipment downtime maintenance information, such as the maintenance personnel submitting information that the parts have been replaced / calibrated / verified to be restored, or the equipment itself reporting a recovery ready status.

[0113] Subsequently, the generation of the device restart command adopts a dual-condition triggering approach: when the re-inspection result indicates that the re-inspection is normal, or the maintenance information indicates that the fault handling is completed, a restart command can be output. If the re-inspection shows a false alarm and no further shutdown is required, recovery can be accelerated; if the re-inspection is still abnormal but maintenance has been completed, the system can use the completion of maintenance as the basis for recovery (or in some implementations, both conditions must be met simultaneously before restarting, as a more conservative strategy). It should be understood that the triggering logic can be adjusted according to the quality risk preference and is not limited to using a unique combination of conditions.

[0114] Furthermore, updating the incoming material rate sequence is crucial to maintaining consistency between the prediction model and actual conditions. During downtime, the actual supply from upstream processes to downstream processes is zero or significantly reduced. Therefore, setting the incoming material rate sequence to zero for the corresponding time period during downtime helps avoid using the original increased rate before downtime during subsequent rolling forecasts. Simultaneously, recording the restart effective time and updating the maintenance end time information ensures that the expected end is replaced by the actual end, thereby improving the accuracy of subsequent forecasts and decisions.

[0115] In another possible implementation, when the maintenance completion time is significantly earlier or later, or when the target site's operating status changes abruptly, the system can also cancel or reassign unfinished re-inspection tasks to ensure that the re-inspection tasks remain consistent with the latest queue trends. This extension does not change the overall technical concept of this invention, which is based on queue prediction and comprehensive cost assessment.

[0116] Reference Figure 3 , Figure 3 This is a structural block diagram of an embodiment of the circuit board production tracking and management device of the present invention.

[0117] like Figure 3 As shown, the circuit board production tracking and management device proposed in this embodiment of the invention includes:

[0118] The generation module 10 is used to acquire the scanning information and detection output information of the target circuit board at the current detection site, and generate the circuit board identity information and fault detection results.

[0119] The judgment module 20 is used to analyze the process equipment to which the fault belongs and the cause of the fault based on the fault detection results, and to determine whether to trigger a shutdown process; if so, it sends a shutdown command to the process equipment and the equipment management terminal, generates a range of candidate re-inspection sites where the fault can be detected later, and constructs a set of candidate re-inspection options.

[0120] The acquisition module 30 is used to acquire real-time operating data for each candidate station in the candidate re-inspection option set; wherein, the real-time operating data includes: information on the quantity to be inspected, inspection speed information, and the original increase rate of the number of circuit boards to be inspected, which is determined by the material inflow speed of multiple material inflow processes.

[0121] Combined with module 40, it is used to generate the test queue prediction information for each candidate site based on the original increase rate of the number of circuit boards to be tested and the equipment downtime maintenance information, combined with the test quantity information and the test speed information.

[0122] The determination module 50 is used to perform a comprehensive cost evaluation on the candidate re-inspection option set based on the candidate site's detection queue prediction information, determine the optimal target re-inspection option, and generate re-inspection decision information;

[0123] The execution module 60 is used to generate re-inspection task information based on the re-inspection decision information, drive the target inspection station corresponding to the optimal target re-inspection option to perform re-inspection on the target circuit board according to the circuit board identity information, and generate a device restart command based on the re-inspection results or maintenance information fed back by the device management terminal.

[0124] Other embodiments or specific implementations of the circuit board production tracking and management device of the present invention can be referred to the above-described method embodiments, and will not be repeated here.

[0125] Furthermore, the present invention also proposes a circuit board production tracking management device, which includes: a memory, a processor, and a circuit board production tracking management program stored in the memory and executable on the processor. When the circuit board production tracking management program is executed by the processor, it implements the steps of the circuit board production tracking management method as described above.

[0126] The specific implementation of the circuit board production tracking management device of this application is basically the same as the embodiments of the circuit board production tracking management method described above, and will not be repeated here.

[0127] Furthermore, this invention also proposes a readable storage medium, which includes a computer-readable storage medium storing a circuit board production tracking management program thereon. The readable storage medium may be... Figure 1 The memory 1005 in the terminal can also be at least one of ROM (Read-Only Memory) / RAM (Random Access Memory), magnetic disk, optical disk, etc. The readable storage medium includes several instructions to cause a circuit board production tracking management device with a processor to execute the circuit board production tracking management method described in various embodiments of the present invention.

[0128] The specific implementation in the readable storage medium of this application is basically the same as the embodiments of the circuit board production tracking management method described above, and will not be repeated here.

[0129] It is understood that in the description of this specification, references to terms such as "one embodiment," "another embodiment," "other embodiments," or "first embodiment to Nth embodiment," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0130] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or system. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or system that includes that element.

[0131] The sequence numbers of the above embodiments of the present invention are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0132] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) as described above, and includes several instructions to cause a terminal device (which may be a mobile phone, computer, server, or network device, etc.) to execute the methods described in the various embodiments of the present invention.

[0133] The above are merely preferred embodiments of the present invention and do not limit the scope of the patent. Any equivalent structural or procedural transformations made based on the description and drawings of the present invention, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of the present invention.

Claims

1. A method for tracking and managing circuit board production, characterized in that, Includes the following steps: Obtain the scanning information and detection output information of the target circuit board at the current testing site, and generate the circuit board identification information and fault detection results; Based on the fault detection results, analyze the process equipment to which the fault belongs and the cause of the fault, and determine whether to trigger a shutdown. If so, send a shutdown command to the equipment and equipment management terminal of the relevant process, generate a range of candidate re-inspection sites where the fault can be subsequently detected, and construct a set of candidate re-inspection options; For each candidate site in the candidate re-inspection option set, real-time operating data of each candidate site is obtained; wherein, the real-time operating data includes: information on the quantity to be inspected, inspection speed information, and the original increase rate of the number of circuit boards to be inspected, which is determined by the material inflow speed of multiple material inflow processes; Based on the original rate of increase in the number of circuit boards to be tested and equipment downtime and maintenance information, combined with the information on the quantity to be tested and the testing speed information, the predicted queue information for each candidate site is generated. Based on the predicted queue information of candidate sites, a comprehensive cost evaluation is performed on the set of candidate re-inspection options to determine the optimal target re-inspection option and generate re-inspection decision information; Based on the re-inspection decision information, re-inspection task information is generated, which drives the target inspection station corresponding to the optimal target re-inspection option to perform re-inspection on the target circuit board according to the circuit board identity information. Based on the re-inspection results or maintenance information fed back by the equipment management terminal, a device restart command is generated.

2. The circuit board production tracking management method as described in claim 1, characterized in that, The steps for acquiring the scanning and detection output information of the target circuit board at the current testing site, and generating the circuit board identification information and fault detection results, specifically include: Collect the scanning information of the target circuit board, extract the circuit board identifier of the target circuit board, and generate the circuit board identity information associated with the target circuit board; Receive the detection output information of the current detection site, parse out the detection conclusion information and defect location information in the detection output information, and map the detection conclusion information into unified fault type information and fault level information to generate fault detection results; The circuit board identity information, defect location information, and fault detection results containing fault type information and fault level information are associated and stored.

3. The circuit board production tracking management method as described in claim 1, characterized in that, Based on the fault detection results, analyze the process equipment to which the fault belongs and the cause of the fault, and determine whether to trigger a shutdown. If so, the steps include sending a stop command to the relevant process equipment and equipment management terminal, generating a range of candidate re-inspection sites where the fault can be subsequently detected, and constructing a set of candidate re-inspection options. Based on the defect location information and the fault type information in the fault detection results, query the fault attribution rules to determine the process equipment to which the fault belongs and the fault cause information. Based on the fault level information in the fault detection results and the preset shutdown trigger conditions, determine whether to trigger shutdown processing; if so, output a shutdown command to the equipment in the process to which the fault belongs, and synchronously output the shutdown event information corresponding to the shutdown command to the equipment management terminal. Based on the fault cause information query maintenance handling time rules, the estimated handling time is determined, and equipment shutdown maintenance information including shutdown effective time information and estimated maintenance end time information is generated; Based on the fault type information in the fault detection results, query the mapping relationship between faults and re-inspection capabilities, determine the range of candidate re-inspection sites where the fault can be subsequently detected, and construct a set of candidate re-inspection options.

4. The circuit board production tracking management method as described in claim 1, characterized in that, For each candidate site in the candidate re-examination option set, the steps to obtain the real-time operational data for each candidate site specifically include: For each candidate site in the candidate re-inspection option set, the current number of circuit boards to be inspected and the number of boards inspected per unit time at the candidate site are collected as the quantity to be inspected information and the inspection speed information. Obtain the production line process routing relationship to determine the material delivery direction relationship between multiple incoming processes and each candidate station, and collect the output quantity and duration of each incoming process within the statistical window to determine the material delivery speed of each incoming process; For each candidate site, the incoming speeds of multiple incoming processes pointing to that candidate site are aggregated to obtain the original rate of increase of the number of circuit boards to be inspected at that candidate site. The original increase rate is associated with the information on the quantity to be detected and the detection speed information to form real-time operating data of candidate sites.

5. The circuit board production tracking management method as described in claim 3, characterized in that, Based on the original rate of increase in the number of circuit boards to be inspected and equipment downtime and maintenance information, combined with the information on the quantity to be inspected and the inspection speed, the steps for generating the predicted queue information for each candidate site include: The original growth rate of each candidate site is expanded into a series of material growth rates corresponding to the discrete prediction time series of the preset prediction period; Based on the material inbound direction relationship between the expected maintenance end time information and the equipment of the process to which the fault belongs, the material inbound reduction rate sequence of each candidate station on the discrete prediction time series is determined, and the material inbound reduction rate sequence is used to characterize the material inbound weakening process caused by downtime; Based on the incoming material increase rate sequence and the incoming material decrease rate sequence, the net incoming material rate sequence for each candidate site is obtained; Based on the current number of circuit boards to be inspected at each candidate site, the net incoming material speed sequence, and the inspection speed information, the predicted queue information for each candidate site is recursively generated.

6. The circuit board production tracking management method as described in claim 1, characterized in that, Based on the predicted queue information of candidate sites, the steps of performing a comprehensive cost evaluation on the candidate re-inspection option set, determining the optimal target re-inspection option, and generating re-inspection decision information specifically include: For each candidate re-inspection option, the arrival time from the current detection station to the target station corresponding to the candidate re-inspection option is determined, and the predicted queue length corresponding to the arrival time is read from the prediction information of the queue to be detected. The waiting time is determined based on the predicted queue length and detection speed information, and the completion time for obtaining the re-inspection conclusion is determined in combination with the preset re-inspection processing time rule; Based on the completion time, equipment downtime and maintenance information, fault level information, and candidate site operation status information of each candidate re-inspection option, the comprehensive cost value of each candidate re-inspection option is calculated, and the candidate re-inspection option with the smallest comprehensive cost value is selected as the optimal target re-inspection option. Based on the optimal target re-inspection option, re-inspection decision information containing target site information and expected completion time information is generated.

7. The circuit board production tracking management method as described in claim 5, characterized in that, Based on the re-inspection decision information, re-inspection task information is generated, driving the target inspection station corresponding to the optimal target re-inspection option to perform re-inspection on the target circuit board according to the circuit board identity information. Based on the re-inspection results or maintenance information fed back from the equipment management terminal, a device restart instruction step is generated, specifically including: Based on the re-inspection decision information, re-inspection task information is generated, and the circuit board identity information and fault detection results are written into the task distribution payload and output to the target detection station corresponding to the optimal target re-inspection option. Obtain the re-inspection results returned by the target detection site, generate re-inspection handling result information based on the re-inspection results, obtain the maintenance information fed back by the equipment management terminal, and update the maintenance completion status in the equipment shutdown maintenance information based on the maintenance information; If the re-inspection result information indicates that the re-inspection is normal or the maintenance information indicates that the fault handling is completed, a device restart command is generated and output to the equipment in the process to which the fault belongs; Record the restart effective time information corresponding to the restart command, and update the maintenance end time information in the equipment shutdown maintenance information based on the restart effective time information; For each testing station, the material infeed speed sequence of each material infeed process is updated so that the material infeed speed sequence of the corresponding time period during downtime is zero, in order to redetermine the original increase rate of the number of circuit boards to be tested at each testing station.

8. A circuit board production tracking and management device, characterized in that, include: The generation module is used to obtain the scanning information and detection output information of the target circuit board at the current detection site, and generate the circuit board identity information and fault detection results; The judgment module is used to analyze the process equipment to which the fault belongs and the cause of the fault based on the fault detection results, and to determine whether to trigger a shutdown process. If so, send a shutdown command to the equipment and equipment management terminal of the relevant process, generate a range of candidate re-inspection sites where the fault can be subsequently detected, and construct a set of candidate re-inspection options; The acquisition module is used to acquire real-time operating data for each candidate station in the candidate re-inspection option set; wherein, the real-time operating data includes: information on the quantity to be inspected, inspection speed information, and the original increase rate of the number of circuit boards to be inspected, which is determined by the material inflow speed of multiple material inflow processes. The combined module is used to generate the predicted queue information for each candidate site based on the original increase rate of the number of circuit boards to be tested and the equipment downtime and maintenance information, combined with the information on the quantity to be tested and the testing speed information. The determination module is used to perform a comprehensive cost evaluation on the set of candidate re-inspection options based on the prediction information of the candidate site's queue to be detected, determine the optimal target re-inspection option, and generate re-inspection decision information; The execution module is used to generate re-inspection task information based on the re-inspection decision information, drive the target inspection station corresponding to the optimal target re-inspection option to perform re-inspection on the target circuit board according to the circuit board identity information, and generate equipment restart instructions based on the re-inspection results or maintenance information fed back by the equipment management terminal.

9. A circuit board production tracking and management device, characterized in that, The circuit board production tracking management device includes: a memory, a processor, and a circuit board production tracking management program stored in the memory and executable on the processor. When the circuit board production tracking management program is executed by the processor, it implements the steps of the circuit board production tracking management method as described in any one of claims 1 to 7.

10. A storage medium, characterized in that, The storage medium stores a circuit board production tracking management program, which, when executed by a processor, implements the steps of the circuit board production tracking management method as described in any one of claims 1 to 7.

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