Laser wavelength stabilizing device and method based on special TEC controller

Abstract

The invention provides a laser wavelength stabilizing device and method based on a special TEC controller. The device comprises a core chip module, a temperature setting module, a temperature feedback module, a TEC load module, a power supply and protection module and a PID compensation module, wherein the core chip module adopts an ADN8834 or ADN8835 chip to construct a hardware PID closed-loop control architecture; the method comprises the steps that a target temperature voltage signal is output through the temperature setting module, the temperature feedback module collects the temperature of the laser in real time and converts the temperature into feedback voltage, the core chip module compares the target signal with the feedback signal based on a hardware PID algorithm, a regulation and control current is output to drive the TEC load module to achieve refrigeration / heating, and control performance is optimized in cooperation with the PID compensation module. The invention is applied to the technical field of laser temperature control and wavelength calibration.

Description

Technical Field

[0001] This invention belongs to the field of laser temperature control and wavelength calibration technology, specifically relating to a laser wavelength stabilization device and method based on a dedicated TEC controller. It is applicable to high-precision lasers such as TOSA lasers and narrow pulse width lasers, and can be widely used in scenarios with stringent requirements for laser wavelength stability, such as fiber optic communication, laser ranging, and precision spectral analysis. Background Technology

[0002] Wavelength stability is a core indicator determining the accuracy of laser applications, and temperature variation is the primary factor causing laser wavelength drift. According to Planck's formula λ=c / v (where λ is wavelength, c is the speed of light, and v is frequency), wavelength and frequency are inversely proportional. As temperature increases, atomic thermal motion intensifies, electron transition frequencies rise, and the corresponding wavelength decreases; conversely, as temperature decreases, electron transition frequencies decrease, and the corresponding wavelength increases. Temperature fluctuations directly cause laser wavelength drift, affecting the accuracy and reliability of applications.

[0003] Existing laser wavelength stabilization circuits mostly employ early hardware-driven architectures, with temperature control relying on microprocessor software adjustment. This mode calculates temperature deviations and outputs control commands through software algorithms, but it has inherent technical drawbacks: on the one hand, software computation has delays, resulting in slow temperature control response and an inability to promptly suppress sudden temperature fluctuations; on the other hand, software adjustment is susceptible to system interference and suffers from accumulated computational errors, leading to poor temperature control accuracy and stability over long-term operation, making it difficult to meet the wavelength stability requirements of high-precision applications.

[0004] Especially in strategic emerging industries such as optoelectronic device manufacturing, fiber optic communication systems, high-precision laser ranging, and sensitive element sensing, the wavelength stability of lasers, as core light sources, directly determines the overall performance of the system. For example, in the packaging process of high-speed coherent optical communication modules (TOSA / ROSA), laser wavelength drift will lead to increased channel crosstalk and bit error rate; in narrow-pulse lasers used in semiconductor testing equipment, wavelength shifts caused by temperature fluctuations will seriously affect the accuracy of wafer defect identification; in the manufacturing of sensitive elements and sensors such as fiber optic gyroscopes and gas sensors, sub-picometer-level wavelength stability is a prerequisite for achieving high-sensitivity detection. In addition, stringent requirements are placed on the long-term wavelength reliability of laser sources in specialized electronic equipment such as LED backlight calibration, testing of new frequency components, and laser direct writing of high-density interconnect printed circuit boards (HDI PCBs).

[0005] To address the aforementioned issues, there is an urgent need for a technical solution that can achieve rapid response, high precision, and high stability temperature control, thereby suppressing the impact of temperature changes on laser wavelength from a physical perspective, improving laser wavelength stability, and adapting to various high-precision application scenarios. Summary of the Invention

[0006] This invention aims to solve the problems of slow response, poor stability, and insufficient accuracy of software temperature control in existing laser wavelength stabilization technologies. It provides a laser wavelength stabilization device and method based on a dedicated TEC controller. Relying on a hardware PID closed-loop control architecture, it achieves fast response and high-precision temperature control, effectively suppresses wavelength drift caused by temperature fluctuations, and improves the wavelength stability and long-term operational reliability of the laser.

[0007] This invention is particularly applicable to scenarios requiring high-stability laser sources in optoelectronic device manufacturing, optical fiber communication transceiver modules (TOSA), sensitive elements and sensors, semiconductor testing equipment, LED backlight systems, and electronic special equipment (such as laser direct writing equipment and frequency component testing platforms), and can effectively support the development of the core electronic industry.

[0008] The technical solution adopted in this invention is a laser wavelength stabilization device based on a dedicated TEC controller, the device comprising: The core chip module uses the ADN8834 or ADN8835 chip, which integrates a field-effect transistor H-bridge structure, PID compensator and temperature sampling amplifier to receive temperature feedback signal and target temperature signal, and output PWM or linearly controlled current. The temperature setting module consists of an external DAC, a resistor divider network, and a digital potentiometer Rdcp. The resistor divider network includes resistors Rc1, Rc2, Rv1, and Rv2, which are used to output a target temperature voltage signal that can be coarsely and finely adjusted to the core chip module. The temperature feedback module consists of a voltage divider network composed of an NTC thermistor Rt1 and resistors Rdcp, Ra, Rx, Rb, and Rth. It is used to collect the laser temperature in real time and convert it into a voltage feedback signal, which is then transmitted to the RTH pin of the core chip module. The TEC load module includes a TEC element and a filter capacitor C1. The TEC element is connected to the output terminal of the core chip module and is used to receive and regulate current to achieve cooling or heating. The filter capacitor C1 is used to suppress current ripple. The power supply and protection module consists of a 5V power supply VIN, a current-limiting resistor, and a filter capacitor. It is used to provide a stable operating power supply for the core chip module and the TEC load module and to suppress power supply noise. The PID compensation module, consisting of an external network of resistors Ri, Rd, and Rb and capacitors Cd, Cb, and Ct, is used to adjust the response speed and stability of the temperature control system and prevent temperature overshoot or oscillation.

[0009] Furthermore, the core chip module switches its operating mode through an H-bridge structure. When operating in the forward direction, it drives the TEC element to dissipate heat to the laser, and when operating in the reverse direction, it drives the TEC element to deliver heat to the laser, forming a closed-loop thermal control circuit.

[0010] Furthermore, the dual adjustment mode of the temperature setting module is as follows: coarse adjustment of the temperature range is achieved by adjusting the resistance value of the digital potentiometer Rdcp, and fine adjustment of the temperature value is achieved by outputting an analog signal through an external DAC. The two work together to output the target temperature voltage signal.

[0011] Furthermore, the NTC thermistor Rt1 is attached to the surface of the laser and changes its resistance as the laser temperature changes. The temperature change is converted into a linear voltage change through a voltage divider network, thereby achieving accurate acquisition of the temperature signal.

[0012] A method for achieving laser wavelength stabilization using the aforementioned laser wavelength stabilization device based on a dedicated TEC controller, the method comprising the following steps: Step 1: Power each module of the device through the power supply and protection module. After current limiting and filtering, a stable 5V voltage is output to ensure the normal operation of each module. Step 2: Set the target temperature through the temperature setting module, adjust the digital potentiometer Rdcp for coarse temperature adjustment, output an analog signal through an external DAC for fine temperature adjustment, and output the target temperature voltage signal to the core chip module after processing by a resistor divider network. Step 3: The temperature feedback module collects the laser temperature in real time through the NTC thermistor Rt1, converts it into a voltage feedback signal through a voltage divider network, and transmits it to the core chip module. Step 4: The core chip module compares the target temperature voltage signal with the feedback voltage signal through the built-in PID compensator, and outputs PWM or linearly regulated current in combination with the peripheral network parameters of the PID compensation module. Step 5: The TEC load module receives the control current and uses the TEC components to cool or heat the laser. The filter capacitor C1 suppresses current ripple. The core chip module continuously receives feedback signals and dynamically adjusts the control current to maintain the laser temperature stability, thereby ensuring wavelength stability.

[0013] Furthermore, in step 4, the hardware PID calculation of the core chip module is completed through on-chip circuitry, with a response delay of less than 10μs.

[0014] Furthermore, in step 2, the voltage divider network of the temperature setting module converts the DAC output signal and the digital potentiometer adjustment signal into a target temperature and voltage range that can be recognized by the core chip module through the ratio of resistors Rc1, Rc2, Rv1, and Rv2.

[0015] Furthermore, in step 4, the PID compensation module adjusts the proportional coefficient and integral coefficient of the PID algorithm by matching the parameters of the resistor and capacitor, thereby optimizing the dynamic response characteristics of the temperature control system and avoiding temperature fluctuations.

[0016] Furthermore, in step 5, the core chip module switches and regulates the current direction through an H-bridge structure, and maintains the laser temperature within the target value ±0.01℃ range through closed-loop control.

[0017] Furthermore, the digital potentiometer Rdcp stores the optimal PID parameters and temperature-set voltage divider ratio in a non-volatile register, which is automatically loaded after the device restarts.

[0018] Compared with the prior art, the present invention has the following beneficial effects: 1. Significantly improved response speed and enhanced anti-interference capability: This invention relies on the hardware PID architecture of the ADN8834 / ADN8835 chip. Temperature control calculations are completed through on-chip circuitry, with a response latency of less than 10μs. Compared to the millisecond-level latency of software temperature control, it can respond to temperature fluctuations more promptly. Hardware PID eliminates the need for software intervention, avoiding the problems of system interference and accumulated errors in software calculations. Furthermore, with parameter optimization from the PID compensation module, it can quickly suppress interference such as sudden changes in ambient temperature and laser power fluctuations, achieving stable recovery from a 5℃ temperature step within 30 seconds, significantly improving the anti-interference capability of the temperature control system.

[0019] 2. High Temperature Control Precision and Significantly Optimized Wavelength Stability: This invention employs a dual temperature regulation mode, with coarse adjustment by a digital potentiometer and fine adjustment by a DAC working in tandem. Combined with precise temperature acquisition by an NTC thermistor, it achieves precise temperature control of ±0.01℃. Physically, the wavelength sensitivity of a laser to temperature is approximately 0.08nm / ℃. High-precision temperature control limits wavelength fluctuations to an extremely small range. Simultaneously, hardware PID closed-loop control continuously maintains temperature stability, avoiding wavelength shift caused by temperature drift. Under 120 minutes of continuous operation, the wavelength drift is far superior to conventional software temperature control solutions, fully meeting the requirements of high-precision applications.

[0020] 3. High reliability and wide adaptability over long-term operation: The digital potentiometer can store optimal parameters and automatically load them after device restart, avoiding repeated debugging and reducing operating costs; the hardware architecture is free from software aging and computational failures, and wavelength stability attenuation is minimal after 2000 hours of continuous operation, significantly improving long-term reliability. The device has a compact structure and can be adapted to various types of lasers such as TOSA lasers and narrow pulse width lasers, making it widely applicable in various high-precision scenarios such as fiber optic communication and laser ranging, demonstrating strong practicality.

[0021] 4. Highly aligned with the needs of the core electronics industry and supporting strategic emerging application scenarios: The device of this invention has a compact structure, high control precision, and excellent long-term stability. It can be seamlessly integrated into optoelectronic device manufacturing lines, TOSA laser packaging equipment, fiber optic sensing systems, semiconductor testing platforms, LED backlight calibration devices, and high-precision electronic special equipment (such as laser processing equipment for manufacturing new frequency components or high-density interconnect printed circuit boards), providing highly reliable and high-value core temperature control technology support for related strategic emerging industries.

[0022] 5. Simple circuit structure and excellent stability: The core functions are integrated into the ADN8834 / ADN8835 chip, eliminating the need for complex external circuits and reducing circuit complexity and failure probability; the current limiting and filtering design of the power supply and protection modules, as well as the ripple suppression capacitor of the TEC load module, further improve the circuit's working stability and ensure the long-term stable operation of the temperature control system. Attached Figure Description

[0023] Figure 1 This is a functional block diagram of the core chip ADN8835 of this invention; Figure 2 This is a circuit block diagram of the device of the present invention; Figure 3 This is a curve showing the relationship between laser wavelength and temperature in an embodiment of the present invention. Figure 4 This is a laser spectrum test diagram according to an embodiment of the present invention. Detailed Implementation

[0024] like Figures 1 to 4 As shown, to achieve the above-mentioned objectives, this invention provides a laser wavelength stabilization device based on a dedicated TEC controller, with the following core architecture: The core chip module uses the ADN8834 or ADN8835 chip, which integrates H-bridge driver, PID compensator and temperature sampling amplifier. It can build a closed-loop temperature control system without the need for external complex circuits. Hardware PID calculation does not require software intervention, which greatly improves response speed and stability.

[0025] The temperature setting module adopts a collaborative design of DAC, resistor voltage divider network, and digital potentiometer. The resistor voltage divider network achieves signal conditioning through the ratio of Rc1, Rc2, Rv1, and Rv2. The digital potentiometer Rdcp is used for coarse adjustment of the temperature range, and the DAC outputs an analog signal to achieve fine adjustment of the temperature value. The dual adjustment mode takes into account both flexibility and accuracy.

[0026] The temperature feedback module uses an NTC thermistor as its core, which is attached to the surface of the laser to collect temperature signals. The resistance change is converted into a voltage signal by a voltage divider network composed of Rdcp, Ra, Rx, Rb, and Rth, and transmitted to the RTH pin of the core chip module to achieve real-time and accurate temperature signal feedback.

[0027] In the TEC load module, the TEC components receive the regulating current output from the core chip module and switch the current direction to achieve cooling or heating. The filter capacitor C1 suppresses current ripple, ensuring stable temperature control. The power supply and protection module provides a stable 5V power supply to each module. Current-limiting resistors and filter capacitors suppress power supply noise to avoid interfering with temperature control accuracy. The PID compensation module adjusts PID parameters through an external resistor and capacitor network to optimize system response characteristics and prevent temperature overshoot and oscillation.

[0028] The laser wavelength stabilization method based on the above device comprises the following specific steps: 1. Power Start-up: When the power supply and protection module are working, the 5V power supply VIN, after being processed by the current limiting resistor and the filter capacitor, provides a stable power supply to the core chip module, temperature setting module, temperature feedback module, etc., eliminating the interference of power supply noise on the temperature control system.

[0029] 2. Temperature setting: The target temperature is configured through the temperature setting module. The voltage division ratio is changed by adjusting the digital potentiometer Rdcp to achieve coarse adjustment of the temperature range. The external DAC outputs the corresponding analog signal, which is conditioned by the resistor voltage divider network and outputs a precise target temperature voltage signal to the core chip module. The two work together to determine the target temperature for the laser to operate.

[0030] 3. Temperature Acquisition and Feedback: The NTC thermistor Rt1 senses the surface temperature of the laser in real time and changes its resistance with the temperature. The resistance is converted into a voltage feedback signal that is linearly related to the temperature through a voltage divider network and continuously transmitted to the RTH pin of the core chip module to form a feedback link for closed-loop control.

[0031] 4. Hardware PID control: The core chip module has a built-in PID compensator that compares the target temperature voltage signal with the feedback voltage signal, calculates the temperature deviation, and dynamically adjusts the magnitude and direction of the output PWM or linear control current by combining the peripheral network parameters of the PID compensation module. No software is required for calculation, ensuring fast control response.

[0032] 5. Temperature Stability and Wavelength Guarantee: The TEC component receives the control current. When the current flows in the forward direction, it enters cooling mode to lower the laser temperature through heat dissipation; when the current flows in the reverse direction, it enters heating mode to transfer heat to the laser and raise its temperature. The filter capacitor C1 suppresses current ripple and avoids temperature fluctuations. The core chip module continuously receives feedback signals and dynamically adjusts the control current to stabilize the laser temperature near the target value. Based on the physical relationship between temperature and wavelength, it suppresses wavelength drift and ensures the laser's wavelength stability.

[0033] 6. Parameter storage and reuse: The digital potentiometer Rdcp stores the optimal PID parameters and temperature setting voltage divider ratio in a non-volatile register, which is automatically loaded after the device restarts, avoiding repeated debugging and improving the ease of use and long-term working stability of the device.

[0034] Specific Embodiments: The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. This embodiment takes a wavelength stabilization module applied in the TOSA laser packaging production line for high-speed optical communication as a typical scenario. This scenario falls under the categories of "Optoelectronic Device Manufacturing" and "Electronic Components and Electromechanical Equipment Manufacturing" in the "Strategic Emerging Industries Classification". The technical effect of the present invention is verified by constructing a device using the ADN8835 chip.

[0035] I. Device Parameter Configuration in the Example Example Core chip module: ADN8835 chip is selected, with an operating voltage of 5V, a built-in H-bridge drive current range of ±3A, and a PID compensator that supports external parameter adjustment.

[0036] Temperature setting module: The external DAC is a 16-bit high-precision DAC with an output voltage range of 0-5V; in the resistor divider network, Rc1=10kΩ, Rc2=20kΩ, Rv1=10kΩ, and Rv2=10kΩ; the digital potentiometer Rdcp is a 10-turn precision potentiometer with a resistance range of 0-100kΩ.

[0037] Temperature feedback module: The NTC thermistor Rt1 is a surface-mount thermistor with an accuracy of ±0.1℃ and a resistance coefficient of -3.9% / ℃ with temperature variation; the voltage divider network resistors are Ra=10kΩ, Rx=20kΩ, Rb=10kΩ, and Rth=10kΩ.

[0038] TEC load module: The TEC component is 10×10mm in size and has a maximum cooling power of 5W; the filter capacitor C1 is a 1000μF / 16V electrolytic capacitor.

[0039] Power supply and protection module: 5V power supply VIN output current 2A, current limiting resistor is selected as 1Ω / 2W, and the filter capacitor is a 10μF ceramic capacitor and a 1000μF electrolytic capacitor connected in parallel.

[0040] PID compensation module: resistors Ri=20kΩ, Rd=10kΩ, Rb=10kΩ; capacitors Cd=1μF, Cb=0.1μF, Ct=10μF.

[0041] II. Working Process of the Implementation Example 1. Device Setup and Initialization: Attach the NTC thermistor Rt1 to the surface of the TOSA laser housing to ensure accurate temperature acquisition; connect each module circuit according to the above parameters, and fix the TEC components to the laser housing to ensure efficient heat transfer; after power-on, load the preset parameters onto the digital potentiometer Rdcp, and the DAC outputs a corresponding 2.5V voltage. After processing by the voltage divider network, input the voltage signal of the target temperature of 25℃ to the ADN8835 chip.

[0042] 2. Temperature Control and Wavelength Stabilization Process: After power-on, each module enters its working state. The NTC thermistor collects the laser temperature in real time. When the laser temperature is higher than 25℃, the feedback voltage output by the voltage divider network is higher than the target voltage. The ADN8835 chip outputs forward current through the H-bridge, and the TEC component enters cooling mode to dissipate heat to the outside and lower the laser temperature. When the laser temperature is lower than 25℃, the feedback voltage is lower than the target voltage, the chip outputs reverse current, and the TEC component enters heating mode to raise the laser temperature. The PID compensation module adjusts the PID parameters through a resistor and capacitor network to avoid temperature overshoot. The filter capacitor C1 suppresses current ripple to ensure stable temperature regulation. The ADN8835 chip continuously compares the feedback signal and the target signal, dynamically adjusting the output current to stabilize the laser temperature within the range of 25℃ ± 0.01℃.

[0043] 3. Test data acquisition: The center wavelength of the TOSA laser was monitored in real time using a spectral analyzer, and the wavelength change was recorded during 120 minutes of continuous operation. At the same time, the wavelength response was monitored when the ambient temperature changed abruptly from 15℃ to 35℃.

[0044] III. Comparative Example To verify the effectiveness of the invention, two comparative examples were implemented, using the same TOSA laser as the examples, but with the temperature control method changed: Comparative Example 1: Using an existing software temperature control scheme, the temperature signal is acquired through an STM32 microprocessor, the PID algorithm is implemented in software, and the PWM signal is output to control the TEC operation. Other hardware parameters are the same as in the example.

[0045] Comparative Example 2: A traditional hardware temperature control scheme is adopted, which uses an operational amplifier to build a PID circuit. There is no digital potentiometer or DAC fine-tuning module. It only supports a single level of temperature setting. Other hardware parameters are the same as those in the example.

[0046] IV. Comparison Results and Analysis 1. Wavelength stability comparison: In Example 1, after 20 minutes of continuous operation, the center wavelength drift of the laser was controlled within 0.007nm; in Comparative Example 1, the wavelength drift was 0.12nm, and the software calculation delay and cumulative error caused a significant increase in the drift; in Comparative Example 2, due to the lack of a fine-tuning module and insufficient temperature control accuracy, the wavelength drift was 0.08nm, which was more stable than Comparative Example 1 but less stable than Example 1.

[0047] 2. Temperature response speed comparison: When the ambient temperature suddenly changes by 5°C, Example 1 can restore the temperature to the target value within 30 seconds, and the wavelength is synchronously stable; Comparative Example 1 requires 120 seconds to complete the temperature recovery, and the software PID response delay is obvious; Comparative Example 2 requires 80 seconds to complete the recovery, and the traditional hardware PID parameter adjustment is not flexible enough and the response speed is slow.

[0048] 3. Long-term working stability comparison: After 2000 hours of continuous operation, the wavelength stability of the example only decreased by 0.001nm, and the parameter storage and hardware architecture ensured long-term reliability; the wavelength stability of Comparative Example 1 decreased by 0.03nm due to software aging; Comparative Example 2 has no parameter storage function, and needs to be re-determined after restarting, and the wavelength stability decreased due to circuit parameter drift after long-term operation.

[0049] Comparative Conclusion: This invention, through its ADN chip hardware PID architecture, dual temperature regulation modes, and precise feedback design, significantly outperforms existing software and traditional hardware temperature control solutions in terms of wavelength stability, temperature response speed, and long-term operational reliability. It effectively suppresses wavelength drift caused by temperature fluctuations, meeting the application requirements of high-precision lasers. This technical solution can be widely applied to high-value-added electronic manufacturing processes such as online monitoring in fiber optic manufacturing, calibration of sensitive components, testing of semiconductor light-emitting diodes (LEDs), and laser calibration of electronic paper driving circuits, demonstrating significant industrial application value.

[0050] Finally, it should be emphasized that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A laser wavelength stabilization device based on a dedicated TEC controller, characterized in that, The device includes: The core chip module uses the ADN8834 or ADN8835 chip, which integrates a field-effect transistor H-bridge structure, PID compensator and temperature sampling amplifier to receive temperature feedback signal and target temperature signal, and output PWM or linearly controlled current. The temperature setting module consists of an external DAC, a resistor divider network, and a digital potentiometer Rdcp. The resistor divider network includes resistors Rc1, Rc2, Rv1, and Rv2, which are used to output a target temperature voltage signal that can be coarsely and finely adjusted to the core chip module. The temperature feedback module consists of a voltage divider network composed of an NTC thermistor Rt1 and resistors Rdcp, Ra, Rx, Rb, and Rth. It is used to collect the laser temperature in real time and convert it into a voltage feedback signal, which is then transmitted to the RTH pin of the core chip module. The TEC load module includes a TEC element and a filter capacitor C1. The TEC element is connected to the output terminal of the core chip module and is used to receive and regulate current to achieve cooling or heating. The filter capacitor C1 is used to suppress current ripple. The power supply and protection module consists of a 5V power supply VIN, a current-limiting resistor, and a filter capacitor. It is used to provide a stable operating power supply for the core chip module and the TEC load module and to suppress power supply noise. The PID compensation module, consisting of an external network of resistors Ri, Rd, and Rb and capacitors Cd, Cb, and Ct, is used to adjust the response speed and stability of the temperature control system and prevent temperature overshoot or oscillation.

2. The apparatus according to claim 1, characterized in that, The core chip module switches its operating mode through an H-bridge structure. When operating in the forward direction, it drives the TEC element to dissipate heat to the laser, and when operating in the reverse direction, it drives the TEC element to deliver heat to the laser, forming a closed-loop thermal control circuit.

3. The apparatus according to claim 1, characterized in that, The dual adjustment mode of the temperature setting module is as follows: coarse adjustment of the temperature range is achieved by adjusting the resistance of the digital potentiometer Rdcp, and fine adjustment of the temperature value is achieved by outputting an analog signal through an external DAC. The two work together to output the target temperature voltage signal.

4. The apparatus according to claim 1, characterized in that, The NTC thermistor Rt1 is attached to the surface of the laser and changes its resistance as the laser temperature changes. The temperature change is converted into a linear voltage change through a voltage divider network, thereby achieving accurate acquisition of the temperature signal.

5. A method for achieving laser wavelength stabilization using a laser wavelength stabilization device based on a dedicated TEC controller as described in any one of claims 1 to 4, characterized in that, The method includes the following steps: Step 1: Power each module of the device through the power supply and protection module. After current limiting and filtering, a stable 5V voltage is output to ensure the normal operation of each module. Step 2: Set the target temperature through the temperature setting module, adjust the digital potentiometer Rdcp for coarse temperature adjustment, output an analog signal through an external DAC for fine temperature adjustment, and output the target temperature voltage signal to the core chip module after processing by a resistor divider network. Step 3: The temperature feedback module collects the laser temperature in real time through the NTC thermistor Rt1, converts it into a voltage feedback signal through a voltage divider network, and transmits it to the core chip module. Step 4: The core chip module compares the target temperature voltage signal with the feedback voltage signal through the built-in PID compensator, and outputs PWM or linearly regulated current in combination with the peripheral network parameters of the PID compensation module. Step 5: The TEC load module receives the control current and uses the TEC components to cool or heat the laser. The filter capacitor C1 suppresses current ripple. The core chip module continuously receives feedback signals and dynamically adjusts the control current to maintain the laser temperature stability, thereby ensuring wavelength stability.

6. The method according to claim 5, characterized in that, In step 4, the hardware PID calculation of the core chip module is completed through on-chip circuitry, with a response delay of less than 10μs.

7. The method according to claim 5, characterized in that, In step 2, the voltage divider network of the temperature setting module converts the DAC output signal and the digital potentiometer adjustment signal into a target temperature and voltage range that can be recognized by the core chip module through the ratio of resistors Rc1, Rc2, Rv1, and Rv2.

8. The method according to claim 5, characterized in that, In step 4, the PID compensation module adjusts the proportional coefficient and integral coefficient of the PID algorithm by matching the parameters of the resistor and capacitor, thereby optimizing the dynamic response characteristics of the temperature control system and avoiding temperature fluctuations.

9. The method according to claim 5, characterized in that, In step 5, the core chip module switches the current direction through the H-bridge structure to maintain the laser temperature within the target value ±0.01℃ range through closed-loop control.

10. The method according to claim 5, characterized in that, The digital potentiometer Rdcp stores the optimal PID parameters and temperature-set voltage divider ratio in a non-volatile register, which is automatically loaded after the device restarts.

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