Packaging and testing integrated device for photoelectric coaxial packaging

Abstract

The invention discloses a packaging and testing integrated device for photoelectric coaxial packaging. The packaging and testing integrated device comprises a pasting and testing integrated mechanism and a lead bonding mechanism. The pasting and testing integrated mechanism comprises an integrated workbench, a first working area, a second working area and an integrated carrying arm; the bottom of the integrated workbench is provided with a sliding guide structure, and the sliding guide structure is used for guiding the integrated workbench to the lead bonding mechanism. A chip material box is arranged on the first working area; the second working area is provided with a sealing and testing integrated tray, the sealing and testing integrated tray is provided with a plurality of sealing and testing integrated grooves, and the sealing and testing integrated grooves are used for placing to-be-packaged tube shells; the integrated carrying arm is arranged between the first working area and the second working area, and a chip grabbing suction cup and a test light source and photoelectric detector module are arranged on the integrated carrying arm. According to the packaging and testing integrated device, packaging and testing integration is realized, and the coaxial packaging efficiency in the photoelectric field is further improved.

Description

Technical Field

[0001] This invention relates to optoelectronic device packaging technology, and more specifically to an integrated packaging and testing device for optoelectronic coaxial packaging. Background Technology

[0002] Optoelectronic devices have a wide range of applications in communication, sensing, and industrial processing. Among them, lasers and photodetectors, as core active devices for laser generation and reception, require proper packaging before use to facilitate subsequent applications. With the increasing number of applications and demands, the requirements for the packaging quality and efficiency of lasers and photodetectors are becoming increasingly stringent.

[0003] Coaxial packaging is a common packaging method for lasers and photodetectors, but packaging involves many process steps. Under normal production conditions, each process step requires corresponding packaging equipment to operate, and the equipment must be transferred between different devices, which reduces packaging efficiency to some extent.

[0004] Chip mounting, wire bonding, and optical coupling are common packaging processes in optoelectronic coaxial packaging and testing. Their core objective is to fix the laser or photodetector chip, after wafer dicing, onto the packaging substrate, and to connect the chip to external circuits through electrical interconnection. Chip mounting is the process of precisely fixing the bare die onto the packaging substrate or lead frame to meet the requirements of chip mechanical fixation and thermal conductivity. Its quality directly affects the chip's heat dissipation performance and long-term reliability, and this operation is mainly performed using a pick-and-place machine. Wire bonding is achieved using a wire bonding machine to provide a stable electrical connection for the chip, facilitating signal transmission. Optical coupling, based on the previous two packaging processes, involves adjusting the output optical path of the laser and the incident optical path of the photodetector, incorporating optical components such as lenses and optical fibers to improve laser transmission efficiency. In the coaxial packaging process, the above steps usually require multiple discrete devices to operate, which is inconvenient to implement. Furthermore, the sockets used for coaxial packaging generally have long leads. If material transfer is performed in two consecutive packaging processes, it will cause lead breakage. Traditional packaging steps will cause repeated installation of the socket during the transfer process, increasing the redundancy time in the packaging process. The repeated installation process is very likely to damage the chip and also cause unnecessary cost increases. Summary of the Invention

[0005] The purpose of this invention is to overcome the above-mentioned problems and provide an integrated packaging and testing device for optoelectronic coaxial packaging. This integrated packaging and testing device realizes the integration of packaging and testing, and further improves the efficiency of coaxial packaging in the optoelectronic field.

[0006] The objective of this invention is achieved through the following technical solution: An integrated packaging and testing device for optoelectronic coaxial packaging includes an integrated bonding and testing mechanism and a wire bonding mechanism. The integrated bonding and testing mechanism includes an integrated worktable and a first working area, a second working area, and an integrated transport arm disposed on the integrated worktable. The bottom of the integrated worktable is provided with a sliding guide structure, which is used to guide the integrated worktable to the wire bonding mechanism. The first working area is provided with a chip cassette for placing the chip to be packaged and tested. The second working area is provided with an integrated packaging and testing tray, which is provided with multiple integrated packaging and testing slots for placing the casing to be packaged. The integrated packaging and testing tray is provided with positive and negative power transmission structures for contacting the pins of the casing and transmitting current. The integrated transport arm is disposed between the first and second working areas. The integrated transport arm is provided with a vertically extending rotation center. With the rotation center as the boundary, the horizontal ends of the integrated transport arm are respectively provided with chip gripping suction cups and test light source and photodetector modules.

[0007] In a preferred embodiment of the present invention, the integrated packaging and testing tank is provided with at least two different sizes to accommodate packaging and testing of different sized packages and chips.

[0008] In a preferred embodiment of the present invention, the sliding guide structure includes a sliding seat and a sliding rail, wherein the sliding seat is provided with a V-shaped groove. This structure ensures that the integrated worktable maintains stable and precise alignment during its movement to the wire bonding mechanism. The V-shaped groove design enhances the stability and anti-displacement capability of the guide, which helps maintain the relative position of the casing and the chip during station changes, thereby ensuring the accuracy and consistency of subsequent wire bonding.

[0009] In a preferred embodiment of the present invention, the integrated worktable is provided with a negative pressure chamber. The top of the negative pressure chamber is connected to the integrated packaging and testing slot of the integrated packaging and testing tray to fix the casing within the integrated packaging and testing slot. The bottom of the negative pressure chamber is connected to a negative pressure machine via a negative pressure pipe. Fixing the casing by negative pressure adsorption not only avoids pin damage or casing deformation that may occur with mechanical clamping, but also provides continuous and stable fixing force during mounting, handling, and testing. This is particularly suitable for thin or precision-structured casings, enhancing the reliability and safety of the entire packaging process.

[0010] In a preferred embodiment of the present invention, the integrated packaging and testing tray is provided with a clamping device, which has a plurality of clamping clearance holes. The clamping device is locked onto the integrated packaging and testing tray by a threaded structure and is used to press against the casing. The clamping clearance holes are located directly above the casing. The diameter of the clamping clearance holes is smaller than the maximum diameter of the corresponding casing, but larger than the minimum diameter of the casing boss. The above structure is a fixing method under conditions where vacuum adsorption is not available, improving the adaptability of the packaging fixture. Specifically, the clamping device can apply uniform pressure from above without obstructing the central area of ​​the casing, preventing the casing from shifting or tilting during movement or testing. It is particularly suitable for casings with boss structures, achieving stable positioning without affecting the normal chip mounting and optical testing.

[0011] In a preferred embodiment of the present invention, the integrated packaging and testing tray is fixedly connected to an integrated workbench via a threaded structure. The threaded connection facilitates the quick installation and replacement of integrated packaging and testing trays of different specifications, adapting to the production needs of multiple varieties and small batches. At the same time, it has good rigidity transmission and shock resistance performance, which helps to maintain the stability of the tray during high-speed handling and testing.

[0012] In a preferred embodiment of the present invention, the positive and negative power transmission structure is a positive and negative spring sheet. Using positive and negative spring sheets as the power transmission structure allows for adaptive and reliable elastic contact with different housing pins by utilizing the spring's own elastic deformation capability, ensuring the stability and continuity of current transmission during testing. This contact method avoids poor contact or pin damage that may occur with rigid contact, and is particularly suitable for applications requiring repeated testing or pin surface protection. Simultaneously, the spring sheet structure is simple, easy to install and maintain, and possesses good durability and conductivity, contributing to a long-term stable power supply circuit for testing, thereby improving the accuracy of test results and the maintainability of the device.

[0013] In a preferred embodiment of the present invention, the integrated handling arm has vertical lifting and horizontal telescopic functions, which enables the integrated handling arm to have greater flexibility and accuracy when picking up and placing chips, performing mounting and testing positioning, adapting to the operation requirements of different heights and positions, reducing adjustment time caused by mechanical limitations, and further improving the overall operation smoothness and efficiency.

[0014] In a preferred embodiment of the present invention, the test light source and photodetector module are detachable. The optical focal length is adjusted via a robotic arm, and the module has internal storage to record test data and a network connection to a computer for real-time data exchange. This structure allows for easy replacement of the corresponding optical module according to the testing requirements of different chips, improving equipment applicability and testing accuracy. The adjustable focal length ensures optimal optical coupling, enhancing test signal quality. Internal storage and network communication enable real-time recording, uploading, and analysis of test data, supporting process traceability and quality control, and providing a foundation for intelligent manufacturing and data analysis.

[0015] Compared with the prior art, the present invention has the following advantages: 1. The integrated packaging and testing device of the present invention integrates chip mounting and electrical testing functions into a single integrated mounting and testing mechanism, and connects with a wire bonding mechanism, thereby consolidating the process that originally required transfer between multiple discrete devices, significantly reducing the transfer and waiting time between process steps, and improving the overall packaging efficiency.

[0016] 2. The use of an integrated workbench that can move between workstations and a fixed integrated packaging and testing tray to support the package allows the package to be moved to the next workstation for wire bonding without being removed after chip mounting, completely avoiding chip damage and long pin breakage caused by repeated installation and removal of the package in the traditional process.

[0017] 3. The integrated handling arm combines chip picking and placement with test probe functions. It can continuously complete chip picking, placement and testing actions by rotating, replacing the actions that originally required multiple dedicated machines to complete separately. The process is compact and reduces redundant time such as operation steps and alignment and positioning between devices.

[0018] 4. Integrating the core functions of multiple process steps into one device reduces reliance on independent placement machines, testing machines, and other equipment, which helps save on equipment investment costs, maintenance costs, and production floor space. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural schematic diagram of the integrated packaging and testing device for optoelectronic coaxial packaging according to the present invention, where a is the chip, b is the small-sized casing, and c is the large-sized casing.

[0020] Figure 2 This is an exploded three-dimensional structural diagram of the integrated packaging and testing device for optoelectronic coaxial packaging according to the present invention.

[0021] Figure 3 This is a three-dimensional structural schematic diagram of the integrated packaging and testing device for optoelectronic coaxial packaging according to the present invention.

[0022] Figure 4 This is a three-dimensional structural diagram of the integrated packaging and testing tray and clamping device of the present invention. Detailed Implementation

[0023] To enable those skilled in the art to fully understand the technical solutions of the present invention, the present invention will be further described below in conjunction with embodiments and accompanying drawings, but the embodiments of the present invention are not limited thereto.

[0024] Combination Figures 1-4 This embodiment of the integrated packaging and testing device for optoelectronic coaxial packaging includes an integrated bonding and testing mechanism and a wire bonding mechanism. The integrated bonding and testing mechanism includes an integrated worktable 1 and a first working area, a second working area, and an integrated transport arm 2 disposed on the integrated worktable 1. The bottom of the integrated worktable 1 is provided with a sliding guide structure, which is used to guide the integrated worktable 1 to the wire bonding mechanism (not shown in the figure, but can be referred to in the prior art). The first working area is provided with a chip cassette 3 for placing the chip to be packaged and tested. The second working area is provided with an integrated packaging and testing tray 4, which is provided with multiple integrated packaging and testing slots 4-1. The integrated packaging and testing slots 4-1 are used to place the casing to be packaged. The integrated packaging and testing tray 4 is provided with positive and negative power transmission structures for contacting the pins of the casing and transmitting current. The integrated transport arm 2 is disposed between the first working area and the second working area. The integrated transport arm 2 is provided with a vertically extending rotation center. With the rotation center as the boundary, the horizontal ends of the integrated transport arm 2 are respectively provided with chip gripping suction cups 5 and test light source and photodetector module 6.

[0025] Combination Figures 1-4 The integrated packaging and testing tank 4-1 is provided with at least two different sizes to accommodate packaging and testing of different sized packages and chips.

[0026] Combination Figures 1-4 The sliding guide structure includes a sliding seat 7 and a sliding rail (not shown in the figure, but can be referenced from existing technology). The sliding seat 7 is provided with a V-shaped groove. Through the above structure, it is possible to ensure that the integrated worktable 1 maintains stable and accurate alignment during the movement to the wire bonding mechanism. The V-shaped groove design enhances the stability and anti-displacement capability of the guide, which is beneficial to maintaining the relative position of the shell and the chip during station changes, thereby ensuring the accuracy and consistency of subsequent wire bonding.

[0027] Combination Figures 1-4The integrated workbench 1 is equipped with a negative pressure chamber 1-1. The top of the negative pressure chamber 1-1 is connected to the integrated packaging and testing slot 4-1 of the integrated packaging and testing tray 4 to fix the casing within the integrated packaging and testing slot 4-1. The bottom of the negative pressure chamber 1-1 is connected to a negative pressure machine through a negative pressure pipe. Fixing the casing by negative pressure adsorption not only avoids pin damage or casing deformation that may be caused by mechanical clamping, but also provides continuous and stable fixing force during mounting, handling, and testing. It is especially suitable for thin or precision-structured casings, enhancing the reliability and safety of the entire packaging process.

[0028] Combination Figures 1-4 The integrated packaging and testing tray 4 is equipped with a clamping member 8, which has several clamping clearance holes 8-1 (specifically, in this embodiment, there is one clamping member 8 for a large-sized casing and two clamping members 8 for a small-sized casing). The clamping member 8 is locked onto the integrated packaging and testing tray 4 by a threaded structure and is used to press against the casing. The clamping clearance holes 8-1 are located directly above the casing. The diameter of the clamping clearance holes 8-1 is smaller than the maximum diameter of the corresponding casing, but larger than the minimum diameter of the casing boss. The above structure is a fixing method under conditions where vacuum adsorption is not available, improving the adaptability of the packaging fixture. Specifically, the clamping member 8 can apply uniform pressure from above without obstructing the central area of ​​the casing, preventing the casing from shifting or tilting during movement or testing. It is especially suitable for casings with boss structures, achieving stable positioning without affecting the normal chip mounting and optical testing.

[0029] Combination Figures 1-4 The integrated packaging and testing tray 4 is fixedly connected to the integrated workbench 1 by a threaded structure. The threaded connection method facilitates the quick installation and replacement of different specifications of the integrated packaging and testing tray 4, adapting to the production needs of multiple varieties and small batches. At the same time, it has good rigidity transmission and shock resistance performance, which helps to maintain the stability of the tray during high-speed handling and testing.

[0030] Specifically, the positive and negative power transmission structure in this embodiment is a positive and negative spring sheet (not shown in the figure, but can be found in existing technology). Using positive and negative spring sheets as the power transmission structure allows for adaptive and reliable elastic contact with different housing pins, utilizing the spring's own elastic deformation capability to ensure the stability and continuity of current transmission during testing. This contact method avoids poor contact or pin damage that may occur with rigid contact, making it particularly suitable for applications requiring repeated testing or pin surface protection. Furthermore, the spring sheet structure is simple, easy to install and maintain, and possesses good durability and conductivity, contributing to a long-term stable power supply circuit for testing, thereby improving the accuracy of test results and the maintainability of the device.

[0031] Specifically, the integrated handling arm 2 has vertical lifting and horizontal extension functions (not shown in the figure, but can be referred to in the prior art). This allows the integrated handling arm 2 to have greater flexibility and accuracy when picking up and placing chips, performing mounting and testing positioning, adapting to the operation requirements of different heights and positions, reducing adjustment time caused by mechanical limitations, and further improving the overall operation smoothness and efficiency.

[0032] Specifically, the test light source and photodetector module 6 are detachable. The optical focal length is adjusted via a robotic arm, and the module has internal storage to record test data. It also has a network connection to a computer for real-time data exchange. This structure allows for easy replacement of the optical module to meet the testing requirements of different chips, improving equipment applicability and testing accuracy. The adjustable focal length ensures optimal optical coupling, enhancing test signal quality. Internal storage and network communication enable real-time recording, uploading, and analysis of test data, supporting process traceability and quality control, and providing a foundation for intelligent manufacturing and data analysis.

[0033] Combination Figures 1-4 The working principle of the above-mentioned integrated packaging and testing device for optoelectronic coaxial packaging is as follows: In the initial state, the chip to be packaged and tested is placed in the chip cassette 3 of the first working area, and the casing to be packaged is placed in the integrated packaging and testing slot 4-1 of the integrated packaging and testing tray 4 in the second working area. The casing leads naturally contact the positive and negative spring contacts in the integrated packaging and testing tray 4, establishing a power supply circuit for subsequent electrical performance testing. The integrated transport arm 2 rotates around its vertical rotation center, picking up the chip to be packaged and tested from the chip cassette 3 through the chip gripping suction cup 5, and then rotates to the second working area to accurately mount the chip onto the casing in the integrated packaging and testing slot 4-1. After mounting, the integrated worktable 1 moves to the wire bonding mechanism via the sliding guide structure at the bottom (driven by an electric mechanism), where the wire bonding mechanism performs wire bonding operations on the casing and the chip, completing the electrical interconnection process between the chip and the casing. After bonding is completed, the integrated worktable 1 resets, and the integrated transport arm 2 drives the test light source and photodetector module 6 to move above the bonded chip, and then drives the test light source and photodetector module 6 downward until they contact the chip, so that the test light source and photodetector module 6 form an electrical connection with the chip on the package. At this time, the positive and negative spring plates supply current to the lead pins of the package, and the electrical performance of the chip is detected by the test light source and photodetector module 6, quickly screening out unqualified chips. Thus, chip mounting, wire bonding and testing are completed continuously in the same device, reducing material transfer and repeated clamping, and improving packaging efficiency and reliability.

[0034] The above are preferred embodiments of the present invention, but the embodiments of the present invention are not limited to the above content. Any changes, modifications, substitutions, combinations, or simplifications made without departing from the spirit and principle of the present invention shall be considered equivalent substitutions and shall be included within the protection scope of the present invention.

Claims

1. An integrated packaging and testing device for optoelectronic coaxial packaging, characterized in that, This includes an integrated bonding and testing mechanism and a wire bonding mechanism; The integrated bonding and testing mechanism includes an integrated worktable and a first working area, a second working area, and an integrated transport arm disposed on the integrated worktable. The bottom of the integrated worktable is provided with a sliding guide structure, which is used to guide the integrated worktable to the wire bonding mechanism. The first working area is provided with a chip cassette for placing the chip to be packaged and tested. The second working area is provided with an integrated packaging and testing tray, which is provided with multiple integrated packaging and testing slots for placing the casing to be packaged. The integrated packaging and testing tray is provided with positive and negative power transmission structures for contacting the pins of the casing and transmitting current. The integrated transport arm is disposed between the first and second working areas. The integrated transport arm is provided with a vertically extending rotation center. With the rotation center as the boundary, the horizontal ends of the integrated transport arm are respectively provided with chip gripping suction cups and test light source and photodetector modules.

2. The integrated packaging and testing device for optoelectronic coaxial packaging according to claim 1, characterized in that, The integrated packaging and testing bay is available in at least two different sizes to accommodate packaging and testing of different sized packages and chips.

3. The integrated packaging and testing device for optoelectronic coaxial packaging according to claim 1, characterized in that, The sliding guide structure includes a sliding seat and a sliding rail, and the sliding seat is provided with a V-shaped groove.

4. The integrated packaging and testing device for optoelectronic coaxial packaging according to claim 1, characterized in that, The integrated workbench is provided with a negative pressure chamber. The top of the negative pressure chamber is connected to the integrated sealing and testing slot of the integrated sealing and testing tray to fix the tube shell in the integrated sealing and testing slot. The bottom of the negative pressure chamber is connected to the negative pressure machine through a negative pressure pipe.

5. The integrated packaging and testing device for optoelectronic coaxial packaging according to claim 1, characterized in that, The integrated packaging and testing tray is provided with a clamping member, which has a plurality of clamping clearance holes. The clamping member is locked onto the integrated packaging and testing tray by a threaded structure and is used to press against the casing. The clamping clearance holes are located directly above the casing. The diameter of the clamping clearance holes is smaller than the maximum diameter of the corresponding casing, but larger than the minimum diameter of the casing boss.

6. The integrated packaging and testing device for optoelectronic coaxial packaging according to claim 1, characterized in that, The integrated packaging and testing tray is fixedly connected to the integrated workbench via a threaded structure.

7. The integrated packaging and testing device for optoelectronic coaxial packaging according to claim 1, characterized in that, The positive and negative power transmission structure consists of positive and negative pole spring plates.

8. The integrated packaging and testing device for optoelectronic coaxial packaging according to claim 1, characterized in that, The integrated handling arm has the functions of vertical lifting and horizontal extension.

9. The integrated packaging and testing device for optoelectronic coaxial packaging according to claim 1, characterized in that, The test light source and photodetector module are detachable. The optical focal length can be adjusted by a robotic arm. It also has an internal storage device to record test conditions and a network device to connect to a computer for real-time interaction of test data.

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