Mainboard compatible with multiple voltage interfaces and robot

Abstract

The invention relates to the technical field of robots, and provides a mainboard compatible with multiple voltage interfaces and a robot. A wide-voltage self-adaptive input module, a multi-voltage-domain intelligent output module, a core main control module, a multifunctional expansion interface module and a modularized expansion interface are integrated on the surface of the mainboard. The structure is reasonable, the adaptability and deployment flexibility of the robot in different power supply environments are greatly improved through the highly integrated wide voltage input and multi-voltage output design, the long-term operation reliability of the mainboard in a complex and severe environment is guaranteed through an active heat dissipation and dehumidification dustproof system, and the service life of the mainboard is prolonged. The safety of the mainboard in the moving and operating process is effectively protected through the damping design, the maintenance frequency is reduced through the automatic dust collection function, the mainboard serves as a core control unit of the robot, a stable, reliable and flexible power and signal distribution basis is provided for the robot, the overall performance is remarkably improved, and the service life is remarkably prolonged.

Description

Technical Field

[0001] This invention relates to the field of robotics, specifically to a motherboard and robot compatible with multiple voltage interfaces. Background Technology

[0002] With the rapid development of robotics technology, its application scenarios are becoming increasingly complex and diverse. The robot body usually integrates a large number of heterogeneous components, such as computing units, servo motors, sensors (LiDAR, cameras, IMU, etc.), actuators, and communication modules. These different components usually require different operating voltages (such as 3.3V, 5V, 12V, 24V, and even 48V) and power.

[0003] Most motherboards are designed with a single voltage input (such as 12V or 24V), which cannot flexibly adapt to power standards of different countries and occasions (such as 12V for vehicles and 24V for industrial sites), which greatly limits the deployment flexibility of robots. Therefore, a motherboard and robot compatible with multiple voltage interfaces is proposed. Summary of the Invention

[0004] This invention proposes a motherboard and robot compatible with multiple voltage interfaces, which solves the problem in related technologies that make it inconvenient to quickly install, disassemble and repair hanging decorative components, thereby reducing the work efficiency of hanging connections and wasting the installation and disassembly time of decorative components.

[0005] The technical solution of the present invention is as follows: a motherboard and robot compatible with multiple voltage interfaces, comprising: a motherboard;

[0006] The motherboard integrates a wide voltage adaptive input module, a multi-voltage domain intelligent output module, a core main control module, a multi-functional expansion interface module, and a modular expansion interface on its surface.

[0007] The motherboard has shock-absorbing components at its four corners and a cooling shell on its back. One end of the cooling shell has multiple air inlets, and an air intake fan is fixedly connected to the inner wall of the air inlet. The other end of the cooling shell has multiple exhaust outlets, and an exhaust fan is fixedly connected to the inner wall of the exhaust outlet.

[0008] The surface of the cooling shell is provided with a dehumidifying component, and a driving component is provided at the edge of the back of the motherboard. The surface of the driving component is provided with a dust-collecting component.

[0009] Optionally, the wide-voltage adaptive input module includes an input protection unit and a main buck converter unit;

[0010] The multi-voltage domain intelligent output module includes multiple secondary voltage conversion units and a software-configurable power distribution unit.

[0011] Optionally, the shock-absorbing component includes a shock absorber, a mounting block fixedly connected to the corner of the motherboard, a threaded hole on one side of the mounting block, a mounting plate fixedly connected to the bottom of the shock absorber, and a gasket fixedly connected to one side of the mounting plate.

[0012] Optionally, the shock absorber includes a housing, a damper fixedly connected inside the housing, a groove formed on the inner wall of the housing, a substrate fixedly connected to the inner surface of the housing, a buffer spring fixedly connected to the surface of the substrate, a slider fixedly connected to one end of the buffer spring, and a connecting rod fixedly connected to the output end of the damper.

[0013] One end of the connecting rod surface is provided with an external thread that fits into a threaded hole.

[0014] Optionally, the surface of the cooling shell is provided with a cooling port, the inner wall of the cooling port is fixedly connected with a semiconductor cooling chip, the heating surface of the semiconductor cooling chip is provided with heat dissipation fins, and the surface of the cooling shell is provided with multiple sets of heat dissipation components that cooperate with the heat dissipation fins.

[0015] Optionally, the heat sink includes a heat sink frame, a plurality of heat sink openings on the surface of the heat sink frame, and a heat sink fan fixedly connected to the inner wall of the heat sink openings.

[0016] Optionally, the dehumidification component includes a dehumidification shell, a dustproof net 1 fixedly connected to the inlet of the dehumidification shell, a dustproof net 2 fixedly connected to the outlet of the dehumidification shell, a mounting bracket 1 fixedly connected to the inner wall of the dehumidification shell, a dehumidifying fan 1 fixedly connected to the inner wall of the mounting bracket 1, a mounting bracket 2 fixedly connected to the inner surface of the dehumidification shell, a dehumidifying fan 2 fixedly connected to the inner wall of the mounting bracket 2, a guide shell fixedly connected to the center of the inner wall of the dehumidification shell, a retaining port opened on the outer surface of the dehumidification shell, a dehumidification frame snapped into the inner wall of the retaining port, and multiple sets of moisture-absorbing components fixedly connected to the inner surface of the dehumidification frame;

[0017] The moisture-absorbing component includes two filters and bamboo charcoal particles disposed between the two filters, and the surface of the moisture-absorbing shell is provided with a temperature and humidity sensor.

[0018] Optionally, the driving component includes an electric slide, a U-shaped frame disposed at the moving part of the electric slide, and a fixed bracket fixedly connected to the surface of the U-shaped frame;

[0019] The surface of the U-shaped frame is provided with moisture absorption ports.

[0020] Optionally, the vacuuming component includes a vacuuming component, a sealing cap disposed at the output end of the vacuuming component, a vacuuming hose fixedly connected to one side of the sealing cap, a vacuuming shell fixedly connected to the inner wall of the moisture suction port, and a vacuuming nozzle fixedly connected to one side of the vacuuming shell.

[0021] The vacuuming component includes a vacuum tube, a fixed frame fixedly connected to the inner wall of the vacuum tube, a vacuum pump fixedly connected to the inner wall of the fixed frame, an insulating sheet fixedly connected to the inner surface of the vacuum tube, a filter cotton disposed on one side of the insulating sheet, and a filter screen disposed on the other side of the filter cotton.

[0022] The upper part of the inner wall of the vacuum tube is provided with multiple retaining grooves that fit the sealing cap. One side of the sealing cap is provided with a sealing ring that fits the vacuum tube. The surface of the insulating sheet is provided with a vacuum port.

[0023] A robot comprising a central processing unit, a CAN bus, and a robot body.

[0024] The working principle and beneficial effects of this invention are as follows:

[0025] I. This application has a reasonable structure. Through a highly integrated wide-voltage input and multi-voltage output design, it greatly improves the robot's adaptability and deployment flexibility in different power environments. The active heat dissipation and dehumidification dust prevention system ensures the long-term operational reliability of the motherboard in complex and harsh environments. The shock absorption design effectively protects the safety of the motherboard during movement and operation. The automatic dust collection function reduces the maintenance frequency. As the core control unit of the robot, this motherboard provides a stable, reliable, and flexible power and signal distribution foundation, significantly improving overall performance and lifespan.

[0026] Second, the structure of this application is reasonable. The temperature and humidity sensor monitors the ambient humidity in real time. When the humidity is too high, dehumidifying fan one and dehumidifying fan two are started, drawing in humid air from dustproof net one, guiding it through the air guide shell, and flowing through the moisture-absorbing component in the dehumidification frame. The bamboo charcoal particles in the moisture-absorbing component efficiently absorb the moisture in the air. The dried air is then discharged after being filtered by dustproof net two, preventing the main board from short-circuiting or corroding due to condensation or a humid environment.

[0027] Third, this application has a reasonable structure. The motherboard's temperature is detected by an automatic temperature control module. When the preset temperature is reached, the intake fan draws external cold air into the cooling shell and flows through the back of the motherboard for air cooling. The cooling surface of the semiconductor cooling chip can actively and effectively cool local high-temperature areas. The heat generated is dissipated through the heat dissipation fins of the heating surface. The cooling fan works to enhance the forced convection cooling of the heat dissipation fins. Finally, the hot air is discharged by the exhaust fan, forming a highly efficient circulating cooling system. Attached Figure Description

[0028] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0029] Figure 1 This is a schematic diagram of the three-dimensional structure of the motherboard of the present invention. Figure 1 ;

[0030] Figure 2This is a schematic diagram of the three-dimensional structure of the motherboard of the present invention. Figure 2 ;

[0031] Figure 3 This is a schematic diagram of the three-dimensional structure of the motherboard of the present invention. Figure 3 ;

[0032] Figure 4 This is a circuit diagram of the wide voltage adaptive input module, multi-voltage domain intelligent output module, core main control module, multi-functional expansion interface module and modular expansion interface in this invention;

[0033] Figure 5 This is a partial cross-sectional view of the shock absorber in this invention.

[0034] Figure 6 This is a partial cross-sectional view of the dust collection component in this invention;

[0035] Figure 7 This is a partial cross-sectional view of the dehumidification component in this invention;

[0036] In the diagram: 1. Motherboard;

[0037] 2. Shock absorber; 201. Housing; 202. Damper; 203. Base plate; 204. Buffer spring; 205. Slide groove; 206. Slider; 207. Connecting rod;

[0038] 3. Mounting plate; 4. U-shaped frame; 5. Fixing bracket;

[0039] 6. Vacuuming components; 601. Vacuum hose; 602. Vacuum pump; 603. Insulating plate; 604. Fixing frame; 605. Filter cotton; 606. Filter screen; 607. Vacuum inlet; 608. Holding slot;

[0040] 7. Vacuum hose; 8. Vacuum housing; 9. Vacuum nozzle; 10. Sealing cap; 11. Gasket; 12. Electric slide; 13. Cooling housing; 14. Intake fan; 15. Semiconductor cooling chip; 16. Heat sink fins; 17. Heat dissipation frame; 18. Heat dissipation fan; 19. Dehumidifying housing; 20. Dehumidifying frame; 21. Temperature and humidity sensor; 22. Dustproof net one; 23. Mounting block; 24. Exhaust fan; 25. Dustproof net two; 26. Mounting bracket one; 27. Dehumidifying fan one; 28. Mounting bracket two; 29. ​​Dehumidifying fan two; 30. Filter screen; 31. Bamboo charcoal granules; 32. Airflow guide shell. Detailed Implementation

[0041] The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0042] Example

[0043] Please see Figure 1 - Figure 7 The present invention provides a motherboard compatible with multiple voltage interfaces, comprising: motherboard 1;

[0044] The motherboard 1 integrates a wide voltage adaptive input module, a multi-voltage domain intelligent output module, a core main control module, a multi-functional expansion interface module, and a modular expansion interface on its surface;

[0045] Wide voltage adaptive input module: used to receive external power input, which includes the following sequentially connected components:

[0046] Input protection unit: complex reverse connection protection circuit (such as using PMOS transistor), overvoltage protection circuit (using TVS transistor and OVP IC), overcurrent protection circuit (using self-resetting fuse or eFuse IC) and π-type filter circuit.

[0047] Main buck converter unit: Employs a high-voltage input, high-current switching buck DC-DC controller to convert a wide range of input voltages (e.g., 12V-36V) into a stable intermediate bus voltage (e.g., 12V).

[0048] Multi-voltage domain intelligent output module: connected to the wide-voltage adaptive input module, used to generate and distribute multiple voltages, including:

[0049] Multiple secondary voltage conversion units: including but not limited to:

[0050] A second Buck converter (for servos and USB interfaces) converts the intermediate bus voltage to 5V.

[0051] A low-dropout linear regulator (LDO) that converts 5V or intermediate bus voltage to 3.3V (for MCUs and digital logic circuits);

[0052] Optional flyback or boost converters are available to meet specific device requirements that exceed the input voltage.

[0053] Software-configurable power distribution unit: The main control MCU is connected to multiple electronic fuses (eFuse) or load switches via I2C / SPI bus. Each eFuse independently controls the on / off state of an external power supply interface and can monitor the current and voltage of that circuit in real time. The threshold values ​​for overcurrent, short circuit and overheat protection can be configured by software.

[0054] Core control module: Employs a high-performance microprocessor unit (MCU, such as an ARM Cortex-M7 core), which runs a real-time operating system (RTOS) for:

[0055] The system power consumption is monitored by collecting voltage and current information from each power supply circuit using an ADC.

[0056] The eFuse is configured and managed through digital communication interfaces (such as I2C and SPI) to achieve intelligent power distribution and fault management.

[0057] Execute user-controlled logic.

[0058] A multi-functional expansion interface module includes multiple standardized physical interfaces, characterized in that the power supply pin of each interface is connected to a different eFuse control output terminal in the multi-voltage domain intelligent output module. These interfaces include at least:

[0059] High-power interface (distributed directly via eFuse from input voltage or intermediate bus voltage, for motors and high-power actuators);

[0060] Medium power interface (5V / 12V output distributed via eFuse, for use with cameras, light strips, and fans);

[0061] Low-power sensor interface (distributed via eFuse from 3.3V / 5V output for digital sensors);

[0062] Standard communication interfaces include: CAN FD interface (for distributed motors / drives), Gigabit Ethernet interface (for high-speed data communication), multiple UART interfaces, and USB interface.

[0063] Modular expansion interface: Using standardized high-speed connectors (such as ST Morpho and Arduino Uno), most of the GPIO pins of the main MCU are brought out, allowing users to plug in dedicated function daughter boards (such as motor driver boards and sensor fusion boards), thereby realizing vertical expansion of functions.

[0064] Shock-absorbing components are provided at the four corners of the motherboard 1. A cooling shell 13 is provided on the back of the motherboard 1. Multiple air inlets are provided at one end of the cooling shell 13. An air intake fan 14 is fixedly connected to the inner wall of the air inlet. Multiple exhaust ports are provided at the other end of the cooling shell 13. An exhaust fan 24 is fixedly connected to the inner wall of the exhaust port.

[0065] The surface of the cooling shell 13 is provided with a dehumidifying component, and the edge of the back of the motherboard 1 is provided with a driving component, the surface of which is provided with a dust-collecting component.

[0066] Furthermore, the wide-voltage adaptive input module includes an input protection unit and a main buck converter unit;

[0067] The multi-voltage domain intelligent output module includes multiple secondary voltage conversion units and software-configurable power distribution units.

[0068] Specifically, the wide-voltage adaptive input module can accept a wide range of DC voltage inputs (e.g., 12V to 48V), the input protection unit is used to prevent surges, reverse connections and overvoltage, the main buck converter unit performs preliminary conversion of the input voltage, the multi-voltage domain intelligent output module generates various voltages required by the system (e.g., 3.3V, 5V, 12V, 24V) through multiple independent secondary voltage conversion units, and the software-configurable power distribution unit allows dynamic adjustment of the output power of each channel according to the external load.

[0069] Furthermore, the shock-absorbing components include a shock absorber 2, a mounting block 23 fixedly connected to the corner of the main board 1, a threaded hole on one side of the mounting block 23, a mounting plate 3 fixedly connected to the bottom of the shock absorber 2, and a gasket 11 fixedly connected to one side of the mounting plate 3.

[0070] Furthermore, the shock absorber 2 includes a housing 201, a damper 202 fixedly connected inside the housing 201, a groove 205 formed on the inner wall of the housing 201, a substrate 203 fixedly connected to the inner surface of the housing 201, a buffer spring 204 fixedly connected to the surface of the substrate 203, a slider 206 fixedly connected to one end of the buffer spring 204, and a connecting rod 207 fixedly connected to the output end of the damper 202.

[0071] One end of the surface of the connecting rod 207 has an external thread that fits into a threaded hole.

[0072] Specifically, during installation, the mounting plate 3 at the bottom of the shock absorber 2 is attached to the mounting surface inside the robot chassis via the shim 11 and fixed with screws. The connecting rod 207 at the top of the shock absorber 2 is screwed into the threaded hole of the mounting block 23 at the corner of the main board 1 and tightened, thereby suspending and fixing the main board 1 inside the chassis. When subjected to impact, the connecting rod 207 drives the slider 206 to compress the buffer spring 204 and slide in the groove 205. At the same time, the damper 202 absorbs kinetic energy, achieving bidirectional buffering and reducing vibration transmission.

[0073] This structure can effectively buffer the vibration and impact generated during robot movement or operation, and protect the reliability of the solder joints of precision components on the main board 1.

[0074] Furthermore, a cooling port is provided on the surface of the cooling shell 13, and a semiconductor cooling chip 15 is fixedly connected to the inner wall of the cooling port. The heating surface of the semiconductor cooling chip 15 is provided with heat dissipation fins 16. The surface of the cooling shell 13 is provided with multiple sets of heat dissipation components that cooperate with the heat dissipation fins 16. The heat dissipation components include a heat dissipation frame 17, multiple heat dissipation ports opened on the surface of the heat dissipation frame 17, and a heat dissipation fan 18 fixedly connected to the inner wall of the heat dissipation port.

[0075] Specifically, the temperature of the motherboard 1 is detected by the automatic temperature control module of the motherboard 1. When the preset temperature is reached, the intake fan 14 draws external cold air into the cooling shell 13 and flows through the back of the motherboard 1 for air cooling. The cooling surface of the semiconductor cooling chip 15 can actively and effectively cool the local high temperature area. The heat generated is dissipated through the heat dissipation fins 16 of the heating surface. The cooling fan 18 works to enhance the forced convection cooling of the heat dissipation fins 16. Finally, the hot air is discharged by the exhaust fan 24, forming a high-efficiency circulating cooling system.

[0076] Furthermore, the dehumidification components include a dehumidification shell 19, a dustproof net 22 fixedly connected to the inlet of the dehumidification shell 19, a dustproof net 25 fixedly connected to the outlet of the dehumidification shell 19, a mounting bracket 26 fixedly connected to the inner wall of the dehumidification shell 19, a dehumidifying fan 27 fixedly connected to the inner wall of the mounting bracket 26, a mounting bracket 28 fixedly connected to the inner surface of the dehumidification shell 19, a dehumidifying fan 29 fixedly connected to the inner wall of the mounting bracket 28, a guide shell 32 fixedly connected to the center of the inner wall of the dehumidification shell 19, a retaining port opened on the outer surface of the dehumidification shell 19, a dehumidification frame 20 snapped into the inner wall of the retaining port, and multiple sets of moisture-absorbing components fixedly connected to the inner surface of the dehumidification frame 20.

[0077] The moisture-absorbing component includes two filters 30 and bamboo charcoal particles 31 disposed between the two filters 30. The surface of the dehumidifying shell 19 is provided with a temperature and humidity sensor 21.

[0078] Specifically, the temperature and humidity sensor 21 monitors the ambient humidity in real time. When the humidity is too high, the dehumidifying fan 1 27 and the dehumidifying fan 29 are activated, drawing in humid air from the dustproof net 1 22, guiding it through the guide shell 32, and flowing through the moisture-absorbing component in the dehumidifying frame 20.

[0079] Bamboo charcoal granules 31 efficiently adsorb moisture in the air. The dried air is filtered through dustproof net 25 and then discharged to prevent the main board 1 from short-circuiting or corroding due to condensation or humid environment. Dustproof net 1 22 and dustproof net 25 prevent dust from entering. The desiccant frame 20 can be pulled out for regular replacement of the moisture-absorbing material. The desiccant frame 20 is glued to the surface of the desiccant shell 19 with glue or double-sided tape.

[0080] Furthermore, the driving component includes an electric slide 12, a U-shaped frame 4 located at the moving part of the electric slide 12, and a fixed bracket 5 fixedly connected to the surface of the U-shaped frame 4;

[0081] The surface of the U-shaped frame 4 has moisture absorption ports.

[0082] Specifically, the electric slide 12 can drive the U-shaped frame 4 and the vacuuming components fixed thereon to move back and forth along the edge of the main board 1, expanding the cleaning range.

[0083] Furthermore, the vacuuming component includes a vacuuming component 6, a sealing cover 10 disposed at the output end of the vacuuming component 6, a vacuuming hose 7 fixedly connected to one side of the sealing cover 10, a vacuuming shell 8 fixedly connected to the inner wall of the moisture suction port, and a vacuuming nozzle 9 fixedly connected to one side of the vacuuming shell 8.

[0084] The vacuuming component 6 includes a vacuuming pipe 601, a fixing frame 604 fixedly connected to the inner wall of the vacuuming pipe 601, a vacuuming pump 602 fixedly connected to the inner wall of the fixing frame 604, an insulating sheet 603 fixedly connected to the inner surface of the vacuuming pipe 601, a filter cotton 605 disposed on one side of the insulating sheet 603, and a filter screen 606 disposed on one side of the filter cotton 605.

[0085] The upper part of the inner wall of the suction pipe 601 is provided with multiple retaining grooves 608 that cooperate with the sealing cover 10. One side of the sealing cover 10 is provided with a sealing ring that cooperates with the suction pipe 601. The surface of the insulating sheet 603 is provided with a suction port 607.

[0086] Specifically, when the vacuum pump 602 starts, it generates negative pressure. Dust floating on the main board surface is sucked into the vacuum tube 601 through the vacuum nozzle 9, vacuum housing 8, and vacuum hose 7. The sucked-in air and dust first pass through two stages of filtration: the filter screen 606 and the filter cotton 605. Larger particles separate and fall due to inertia. Then, the airflow enters the vacuum pump 602 through the vacuum port 607 and is finally discharged through the exhaust end of the vacuum pump 602. The dust is collected in the middle of the vacuum tube 601. The sealing cover 10 is sealed by the sealing ring and the retaining groove 608. It can be opened to clean the dust accumulated on the surface of the filter screen 606 and the filter cotton 605.

[0087] A robot comprising a central processing unit, a CAN bus, and a robot body.

[0088] The motherboard 1 can flexibly connect to different power supplies of the robot body through its wide voltage adaptive input module, and provide various working voltages required by the robot's various sensors, actuators and drive units through the multi-voltage domain intelligent output module. The core main control module is responsible for the overall calculation and control scheduling.

[0089] Working principle of the invention:

[0090] The wide-voltage adaptive input module can accept a wide range of DC voltage inputs (e.g., 12V to 48V). The input protection unit is used to prevent surges, reverse connections, and overvoltage. The main buck converter unit performs preliminary conversion of the input voltage. The multi-voltage domain intelligent output module generates various voltages required by the system (e.g., 3.3V, 5V, 12V, 24V) through multiple independent secondary voltage conversion units. The software-configurable power distribution unit allows dynamic adjustment of the output power of each channel according to the external load.

[0091] During installation, the mounting plate 3 at the bottom of the shock absorber 2 is attached to the mounting surface inside the robot chassis through the shim 11 and fixed with screws. The connecting rod 207 at the top of the shock absorber 2 is screwed into the threaded hole of the mounting block 23 at the corner of the main board 1 and tightened, thereby suspending and fixing the main board 1 inside the chassis. When subjected to impact, the connecting rod 207 drives the slider 206 to compress the buffer spring 204 and slide in the slide groove 205. At the same time, the damper 202 absorbs kinetic energy, realizing bidirectional buffering and reducing vibration transmission. This structure can effectively buffer the vibration and impact generated when the robot moves or operates, and protect the reliability of the solder joints of precision components on the main board 1.

[0092] The motherboard 1's temperature is detected by the automatic temperature control module. When the preset temperature is reached, the intake fan 14 draws external cold air into the cooling shell 13 and flows through the back of the motherboard 1 for air cooling. The cooling surface of the semiconductor cooling chip 15 can actively and effectively cool the local high temperature area. The heat generated is dissipated through the heat dissipation fins 16 of the heating surface. The cooling fan 18 works to enhance the forced convection cooling of the heat dissipation fins 16. Finally, the hot air is discharged by the exhaust fan 24, forming a high-efficiency circulating cooling system.

[0093] Temperature and humidity sensor 21 monitors ambient humidity in real time. When the humidity is too high, dehumidifying fan 1 27 and dehumidifying fan 29 are activated to draw in humid air from dustproof net 1 22. The air is guided by guide shell 32 and flows through the moisture-absorbing element in dehumidification frame 20. The bamboo charcoal particles 31 in the moisture-absorbing element efficiently absorb the moisture in the air. The dried air is filtered by dustproof net 25 and then discharged to prevent the main board 1 from short-circuiting or corroding due to condensation or humid environment. Dustproof net 1 22 and dustproof net 25 prevent dust from entering. The dehumidification frame 20 can be pulled out for regular replacement of the moisture-absorbing material. The dehumidification frame 20 is glued to the surface of dehumidification shell 19 with glue or double-sided tape.

[0094] The electric slide 12 can drive the U-shaped frame 4 and the vacuuming components fixed on it to move back and forth along the edge of the main board 1, expanding the cleaning range. At the same time, the vacuum pump 602 starts to generate negative pressure. The dust floating on the surface of the main board is sucked into the vacuum pipe 601 through the vacuum nozzle 9, vacuum shell 8 and vacuum hose 7. The sucked air and dust first pass through two stages of filtration: filter screen 606 and filter cotton 605. Larger particles separate and fall due to inertia. Then the airflow enters the vacuum pump 602 through the vacuum port 607 and is finally discharged through the exhaust end of the vacuum pump 602. The dust is collected in the middle of the vacuum pipe 601. The sealing cover 10 is sealed by the sealing ring and the retaining groove 608. It can be opened to clean the dust accumulated on the surface of the filter screen 606 and filter cotton 605.

[0095] With its highly integrated wide-voltage input and multi-voltage output design, the robot's adaptability and deployment flexibility under different power environments are greatly improved. The active heat dissipation and dehumidification dustproof system ensures the long-term operational reliability of the motherboard in complex and harsh environments. The shock absorption design effectively protects the motherboard's safety during movement and operation. The automatic dust extraction function reduces maintenance frequency. As the robot's core control unit, this motherboard provides a stable, reliable, and flexible power and signal distribution foundation, significantly improving overall performance and lifespan.

[0096] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A motherboard compatible with multiple voltage interfaces, characterized in that, include: Motherboard (1); The motherboard (1) has a wide voltage adaptive input module, a multi-voltage domain intelligent output module, a core main control module, a multi-functional expansion interface module and a modular expansion interface integrated on its surface. The motherboard (1) has shock-absorbing components at its four corners. The back of the motherboard (1) has a cooling shell (13). One end of the cooling shell (13) has multiple air inlets. An air intake fan (14) is fixedly connected to the inner wall of the air inlet. The other end of the cooling shell (13) has multiple exhaust ports. An exhaust fan (24) is fixedly connected to the inner wall of the exhaust port. The surface of the cooling shell (13) is provided with a dehumidifying component, and the edge of the back of the motherboard (1) is provided with a driving component, and the surface of the driving component is provided with a dust-collecting component.

2. The motherboard compatible with multiple voltage interfaces according to claim 1, characterized in that: The wide-voltage adaptive input module includes an input protection unit and a main buck converter unit; The multi-voltage domain intelligent output module includes multiple secondary voltage conversion units and a software-configurable power distribution unit.

3. A motherboard compatible with multiple voltage interfaces according to claim 1, characterized in that: The shock-absorbing component includes a shock absorber (2), a mounting block (23) fixedly connected to the corner of the main board (1), a threaded hole on one side of the mounting block (23), a mounting plate (3) fixedly connected to the bottom of the shock absorber (2), and a gasket (11) fixedly connected to one side of the mounting plate (3).

4. A motherboard compatible with multiple voltage interfaces according to claim 3, characterized in that: The shock absorber (2) includes a housing (201), a damper (202) fixedly connected inside the housing (201), a groove (205) opened on the inner wall of the housing (201), a substrate (203) fixedly connected to the inner surface of the housing (201), a buffer spring (204) fixedly connected to the surface of the substrate (203), a slider (206) fixedly connected to one end of the buffer spring (204), and a connecting rod (207) fixedly connected to the output end of the damper (202); One end of the surface of the connecting rod (207) is provided with an external thread that fits into a threaded hole.

5. A motherboard compatible with multiple voltage interfaces according to claim 1, characterized in that: The surface of the cooling shell (13) is provided with a cooling port, and a semiconductor cooling chip (15) is fixedly connected to the inner wall of the cooling port. The heating surface of the semiconductor cooling chip (15) is provided with heat dissipation fins (16), and the surface of the cooling shell (13) is provided with multiple sets of heat dissipation components that cooperate with the heat dissipation fins (16).

6. A motherboard compatible with multiple voltage interfaces according to claim 5, characterized in that: The heat sink includes a heat sink frame (17), multiple heat sink openings on the surface of the heat sink frame (17), and a heat sink fan (18) fixedly connected to the inner wall of the heat sink opening.

7. A motherboard compatible with multiple voltage interfaces according to claim 1, characterized in that: The dehumidification components include a dehumidification shell (19), a dustproof net one (22) fixedly connected to the inlet of the dehumidification shell (19), a dustproof net two (25) fixedly connected to the outlet of the dehumidification shell (19), a mounting bracket one (26) fixedly connected to the inner wall of the dehumidification shell (19), a dehumidifying fan one (27) fixedly connected to the inner wall of the mounting bracket one (26), a mounting bracket two (28) fixedly connected to the inner surface of the dehumidification shell (19), a dehumidifying fan two (29) fixedly connected to the inner wall of the mounting bracket two (28), a guide shell (32) fixedly connected to the center of the inner wall of the dehumidification shell (19), a retaining port opened on the outer surface of the dehumidification shell (19), a dehumidification frame (20) snapped into the inner wall of the retaining port, and multiple sets of moisture-absorbing components fixedly connected to the inner surface of the dehumidification frame (20). The moisture-absorbing element includes two filters (30) and bamboo charcoal particles (31) disposed between the two filters (30), and the surface of the dehumidifying shell (19) is provided with a temperature and humidity sensor (21).

8. A motherboard compatible with multiple voltage interfaces according to claim 1, characterized in that: The driving component includes an electric slide (12), a U-shaped frame (4) located at the moving part of the electric slide (12), and a fixed bracket (5) fixedly connected to the surface of the U-shaped frame (4); The surface of the U-shaped frame (4) is provided with moisture absorption ports.

9. A motherboard compatible with multiple voltage interfaces according to claim 8, characterized in that: The vacuuming component includes a vacuuming component (6), a sealing cap (10) located at the output end of the vacuuming component (6), a vacuuming hose (7) fixedly connected to one side of the sealing cap (10), a vacuuming shell (8) fixedly connected to the inner wall of the moisture suction port, and a vacuuming nozzle (9) fixedly connected to one side of the vacuuming shell (8). The vacuuming component (6) includes a vacuum pipe (601), a fixed frame (604) fixedly connected to the inner wall of the vacuum pipe (601), a vacuum pump (602) fixedly connected to the inner wall of the fixed frame (604), an insulating sheet (603) fixedly connected to the inner surface of the vacuum pipe (601), a filter cotton (605) provided on one side of the insulating sheet (603), and a filter screen (606) provided on one side of the filter cotton (605). The upper part of the inner wall of the suction pipe (601) is provided with multiple retaining grooves (608) that cooperate with the sealing cover (10). One side of the sealing cover (10) is provided with a sealing ring that cooperates with the suction pipe (601). The surface of the insulating sheet (603) is provided with a suction port (607).

10. A robot, characterized in that: The robot includes a central processing unit, a CAN bus, and the robot body.

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